Wiring board laminate and method for manufacturing a wiring board laminate

Abstract

The present invention provides a wiring board laminate with which a wiring board can be easily configured to have a laminated structure and the wiring board can be prevented from becoming expensive.　The wiring board laminate 10 comprises a wiring board WB having an opening 19a, an embedding member 14 embedded in the opening 19a of the wiring board WB, a curing material 17 which has a thermosetting resin, which is arranged between the embedding member 14 and an inner peripheral surface of the opening 19a, and which is bonded to the wiring board WB, and a wiring layer 23 formed on surfaces of the wiring board WB, the embedding member 14, and the curing material 17, and is characterized in that the embedding member 14 has a ceramic body 13 and has metal films 15 formed on both surfaces of the ceramic body 13.

Description

[Technical Field]

[0001] The present invention relates to a wiring board laminate and a method for manufacturing a wiring board laminate. [Background Art]

[0002] In order to suitably cool heat-generating components such as electronic components including LEDs and QFNs (Quad Flat Non-Lead Packages) mounted on a wiring board, wiring board laminates that dissipate heat from the back surface of the wiring board are known.

[0003] In recent years, ceramic circuit boards using ceramics with high thermal conductivity such as aluminum nitride (AlN) as a substrate material for wiring boards have been known (see, for example, Patent Document 1). High heat dissipation and heat resistance can be achieved by using ceramics with high thermal conductivity as the substrate material. [Prior Art Documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent No. 3690944 [Summary of the Invention] [Problem to be Solved by the Invention]

[0005] However, in the ceramic circuit board (wiring board laminate) described in Patent Document 1, since ceramic is used for the entire substrate, there is a problem that it is difficult to laminate the substrate. In addition, since relatively expensive ceramic is used for the entire substrate, there is a problem that the resulting substrate becomes expensive.

[0006] Therefore, the present invention has been made to solve these problems, and aims to provide a wiring board laminate that is easy to laminate and prevents the substrates from becoming expensive. Furthermore, it aims to provide a method for manufacturing such a wiring board laminate. [Means for solving the problem]

[0007] [1] The wiring board laminate of the present invention comprises a wiring board having an opening, an embedded member embedded in the opening of the wiring board, a curing material comprising a thermosetting resin, disposed between the embedded member and the inner circumferential surface of the opening and bonded to the wiring board, and a wiring layer formed on the surfaces of the wiring board, the embedded member and the thermosetting resin, wherein the embedded member comprises a ceramic body and a metal film formed on both surfaces of the ceramic body.

[0008] The wiring board laminate of the present invention comprises a wiring board having an opening and an embedded member embedded in the opening of the wiring board. Since the embedded member has a ceramic body, high heat dissipation and heat resistance can be achieved by using ceramics with high thermal conductivity as the substrate material. Furthermore, because a wiring board is used, it is possible to laminate within the wiring board region while achieving high heat dissipation and heat resistance by using ceramics as the substrate material. Moreover, the cost can be reduced compared to the case of a ceramic circuit board in which the entire substrate is made of ceramics.

[0009] Furthermore, the wiring board laminate of the present invention comprises a wiring board having an opening and an embedded member embedded in the opening of the wiring board. Since the embedded member has a ceramic body, instead of using a single ceramic board, individual ceramic bodies are used, and the other areas are used as the wiring board. This reduces the possibility of cracking compared to when a single ceramic board is used.

[0010] [2] In the wiring substrate laminate of the present invention, it is preferable that at least one surface of the outer edge of the embedded member has a metal film non-formation region where the metal film is not formed, and that the curing material is also disposed between the ceramic body and the wiring layer in the metal film non-formation region.

[0011] According to the wiring substrate laminate of the present invention, at least one surface of the outer edge of the embedded member has a metal film non-formation region where no metal film is formed, and the hardening material is also placed between the ceramic body and the wiring layer in the metal film non-formation region, thereby improving the adhesion between the ceramic and the wiring layer, which are relatively difficult to adhere to.

[0012] Incidentally, if no region without a metal film is formed and a metal film is formed to cover the entire ceramic body, there is a risk of cracks forming at the corners of the ceramic body due to the difference in thermal expansion coefficients between the metal film and the ceramic body. However, according to the wiring substrate laminate of the present invention, the outer edge of the embedded member has a region without a metal film where no metal film is formed, and the hardening agent is also placed between the ceramic body and the wiring layer in the region without a metal film. Therefore, there is no metal film at the outer edge of the embedded member, and it is possible to prevent cracks from forming at the corners of the ceramic body due to the difference in thermal expansion coefficients between the metal film and the ceramic body.

[0013] [3] In the wiring substrate laminate of the present invention, it is preferable that the outer edge of the ceramic body has areas on both surfaces where no metal film is formed, and that the hardening material is also placed between the ceramic body and the wiring layer in both areas where no metal film is formed on the ceramic body.

[0014] According to the wiring substrate laminate of the present invention, both surfaces of the ceramic body have areas where no metal film is formed, and the hardening agent is also placed between the ceramic body and the wiring layer in the areas where no metal film is formed. Therefore, the adhesion between the ceramic body and the wiring layer, which are relatively difficult to adhere to on both surfaces of the ceramic body, can be improved, and cracks in the corners of the ceramic body can be prevented more reliably.

[0015] [4] In the wiring substrate laminate of the present invention, it is preferable that the area where the metal film is not formed is formed over the entire outer edge so as to surround the metal film when viewed in plan.

[0016] According to the wiring substrate laminate of the present invention, since the area where the metal film is not formed is formed over the entire outer edge surrounding the metal film, localized cracks are less likely to occur in a part of the outer edge of the ceramic body, making the ceramic body even less prone to cracking.

[0017] [5] In the wiring board laminate of the present invention, it is preferable that the metal film is formed on the surface of the ceramic body by direct plating.

[0018] According to the wiring board laminate of the present invention, since the metal film is formed on the surface of the ceramic body by direct plating, the ceramic body and the metal film can be bonded with high adhesion. Furthermore, since it is not necessary to place a bonding material between the ceramic body and the metal film to enhance adhesion, it is possible to prevent the reduction in heat dissipation caused by such a bonding material.

[0019] [6] In the wiring substrate laminate of the present invention, a metal layer is provided on the surface of the wiring substrate, and it is preferable that the circuit wiring is constructed with the wiring layer, the metal layer and the metal film.

[0020] According to the wiring substrate laminate of the present invention, a metal layer is arranged on the surface of the wiring substrate, and since the circuit wiring is composed of the wiring layer, the metal layer, and the metal film, a variety of wiring structures can be configured even in the vertical direction.

[0021] [7] In the wiring substrate laminate of the present invention, the metal layer is preferably a metal plating film formed on the surface of the wiring substrate by plating.

[0022] According to the wiring board laminate of the present invention, since the metal layer is a metal plating film formed on the surface of the wiring board by plating, it has high adhesiveness to the wiring layer of the wiring board, and facilitates the formation of a laminated substrate with a complicated structure.

[0023] [8] In the wiring board laminate of the present invention, the embedded member is preferably rectangular when viewed in plan.

[0024] According to the wiring board laminate of the present invention, since the embedded member is rectangular when viewed in plan, it can be easily processed, and alignment with the opening is facilitated. In addition, when an electronic element is arranged on the embedded member via a wiring layer, heat can be uniformly dissipated from the electronic element which often has a rectangular shape, so that an increase in local thermal stress can be prevented, and cracks are even less likely to occur.

[0025] [9] A method for producing a wiring board laminate according to any one of the above [1] to [3], comprising: a step of obtaining a laminate which comprises a wiring board or a wiring board material having an opening, an embedded member positioned inside the opening, and a cured product of a filling sheet or a coating layer that is integrated with the wiring board or the wiring board material and contains a thermosetting resin, wherein the thermosetting resin is filled between the inner surface of the opening of the wiring board or the wiring board material and the embedded member; and a step of grinding the cured product of the filling sheet or the coating layer so that the thickness of the ground laminate becomes constant, and removing the cured product.

[0026] According to the method for manufacturing a wiring board laminate of the present invention, a laminate having a structure in which an embedding member is arranged in an opening of a wiring board or a wiring board material and a thermosetting resin is filled into the opening by heating and pressing is used, so that no complicated process is required when arranging the embedding member, and the method can also accommodate embedding members of various shapes. In addition, since a cured product such as a filling sheet is ground so that the thickness of the laminate after grinding becomes constant to remove the cured product, the thermosetting resin filled inside the opening does not form a structure integrated with the cured product such as the filling sheet, and fracture, chipping or the like of the filled thermosetting resin is less likely to occur when the cured product is peeled off or otherwise processed. Therefore, the reliability of the filling structure of the embedding member and the surface smoothness can be improved.

[0027]

[10] The method for manufacturing a wiring board laminate of the present invention preferably includes: a step of preparing a laminated material including the wiring board or the wiring board material, the embedding member, and the filling sheet; a step of integrating the laminated material by heating and pressing to obtain the laminate; and a step of grinding the cured product of the filling sheet so that the thickness of the laminate after grinding becomes constant, and removing the cured product of the filling sheet.

[0028] According to the method for manufacturing a wiring board laminate of the present invention, an embedding member is arranged in an opening of a wiring board or a wiring board material, and the thermosetting resin contained in the filling sheet can be filled into the opening by heating and pressing, so that the laminate can be obtained by a dry process. At that time, no complicated process is required when arranging the embedding member, and the method can also accommodate embedding members of various shapes. In addition, since the cured product of the filling sheet is ground so that the thickness of the laminate after grinding becomes constant to remove the cured product of the filling sheet, the thermosetting resin filled inside the opening does not form a structure integrated with the cured product of the filling sheet, and fracture, chipping or the like of the filled thermosetting resin is less likely to occur. Therefore, the reliability of the filling structure of the embedding member and the surface smoothness can be improved.

[0029]

[11] The present invention provides a method for manufacturing a wiring board laminate, wherein the laminate is a laminate in which a resin film having openings at positions corresponding to the openings of the wiring board or the wiring board material is attached to the wiring board or the wiring board material, and the method preferably includes the steps of removing the cured product of the filling sheet or the coating layer, the thickness of the laminate after grinding being such that a portion of the resin film is removed, and further peeling the remaining portion of the resin film from the laminate, and removing the cured product of the thermosetting resin covering the embedded member of the laminate.

[0030] According to the method for manufacturing a wiring board laminate of the present invention, by attaching a resin film to the wiring board or the wiring board material, thermosetting resin is less likely to adhere to the surface of the wiring board or the like during filling. Furthermore, since the resin film is interposed between the cured material such as the filling sheet and the wiring board or the like, and the cured material is ground down to a thickness where a portion of the resin film is removed, the cured material can be removed more reliably. Moreover, when the remaining portion of the resin film is peeled off from the laminate, the height of the thermosetting resin located at the opening of the resin film is reduced, making it easier to remove the convex thermosetting resin. [Brief explanation of the drawing]

[0031] [Figure 1] This is a cross-sectional view showing a wiring board laminate 10 according to Embodiment 1. [Figure 2] This figure illustrates the embedded member 14 in Embodiment 1. [Figure 3] This is a cross-sectional view illustrating the manufacturing method of the wiring board laminate according to Embodiment 1. [Figure 4] This is a cross-sectional view illustrating the manufacturing method of the wiring board laminate according to Embodiment 1. [Figure 5] This is a cross-sectional view illustrating the manufacturing method of the wiring board laminate according to Embodiment 1. [Figure 6] This is a cross-sectional view illustrating the manufacturing method of the wiring board laminate according to Embodiment 2. [Figure 7]This is a cross-sectional view illustrating the manufacturing method of the wiring board laminate according to Embodiment 3. [Figure 8] This is a cross-sectional view illustrating the manufacturing method of the wiring board laminate according to Embodiment 3. [Figure 9] This is a cross-sectional view illustrating the manufacturing method of the wiring board laminate according to Embodiment 3. [Figure 10] This is a cross-sectional view shown to illustrate the manufacturing method of a wiring board laminate according to Modification Example 1. [Figure 11] This is a cross-sectional view shown to illustrate the manufacturing method of the wiring board laminate according to the modified example 2. [Modes for carrying out the invention]

[0032] Hereinafter, a wiring board laminate and a method for manufacturing the wiring board laminate according to an embodiment of the present invention will be described with reference to the drawings. Note that the drawings described below are schematic diagrams that do not strictly reflect the actual structure, dimensions, length and width scales, etc.

[0033] [Embodiment 1] 1. Configuration of the wiring board laminate 10 according to Embodiment 1 Figure 1 is a cross-sectional view showing a wiring board laminate 10 according to Embodiment 1. Figure 2 is a diagram illustrating the embedded member 14 in Embodiment 1. Figure 2(a) is a cross-sectional view showing the embedded member 14, Figure 2(b) is a perspective view showing the embedded member 14, and Figure 2(c) is a diagram showing the ceramic wafer 100 forming the embedded member 14.

[0034] As shown in Figure 1, the wiring board laminate 10 according to Embodiment 1 comprises a wiring board WB, an embedded member 14, a hardening material 17, and a wiring layer 23. The wiring layer 23 is formed on both sides of the wiring board laminate 10. Pattern wiring is formed on the upper wiring layer 23, and the lower wiring layer 23 is formed over the entire surface and can be connected to a heat sink (not shown).

[0035] Therefore, in the wiring board laminate 10, if electrical elements (semiconductor chips, LEDs, reactors, etc.) are placed on the wiring layer 23 on the embedded member 14, the heat generated from the electrical elements is transferred to a heat sink (not shown) via the embedded member and the wiring layer 23 on the lower side, and the heat can be dissipated to the outside from the heat sink.

[0036] The wiring board WB is a double-sided metal-clad laminate in which metal layers 20 are arranged on both sides of an insulating layer 19. For example, a glass epoxy substrate can be used as the wiring board WB, but a substrate made of an appropriate material as described later may also be used. In the wiring board WB, a patterned metal layer is formed on one side of the insulating layer 19 (the upper surface in Figure 1), but an unpatterned metal layer may also be used. Furthermore, in Embodiment 1, a single-layer wiring board is used for the sake of simplicity of explanation, but a laminated wiring board can also be used.

[0037] The insulating layer 19 is preferably made of a material containing a thermosetting resin, and more preferably a prepreg containing a thermosetting resin and reinforcing fibers. Any thermosetting resin can be used as long as it hardens upon heating and has the heat resistance required for a wiring board. Specific examples of thermosetting resins include epoxy resins, phenolic resins, polyimide resins, and other types of thermosetting resins.

[0038] The prepreg can be any material containing a thermosetting resin, which hardens upon heating and possesses the heat resistance required for a wiring board. Specifically, examples include composites of various thermosetting resins such as epoxy resin, phenolic resin, and polyimide resin with reinforcing fibers such as glass fiber, ceramic fiber, aramid fiber, and paper.

[0039] Any metal can be used for the metal layer 20, such as copper, copper alloys, aluminum, stainless steel, nickel, iron, or other alloys. Among these, copper and aluminum are preferred from the viewpoint of thermal and electrical conductivity.

[0040] The wiring board WB has openings 18 in the portion corresponding to the position where the embedded member 14 is placed. The wiring board WB usually has multiple openings 18. The openings 18 can be formed using a drill, punch, router, etc. It is preferable that the size of the openings 18 be slightly larger than the ceramic body 13 of the embedded member 14.

[0041] The opening 18 is rectangular in shape, but it can also be circular, elliptical, square, or a shape corresponding to the outer shape of the embedded member 14. Even in the case of square or complex shapes, it is possible to form the opening 18 with complex shapes by using a router or the like.

[0042] The embedded member 14 is embedded in the opening 18 of the wiring board WB. The ceramic body 13 has a roughly rectangular shape, and the embedded member 14 has a rectangular shape (roughly rectangular shape) when viewed in plan (see Figures 2(a) and 2(b)), but it can be an appropriate shape corresponding to the opening 18, such as a circle, ellipse, square, or other shape. The lateral size of the embedded member 14 is preferably 0.1 to 20 mm at its widest point, as if it is too large, it will easily fall out after filling, and if it is too small, it will be difficult to position.

[0043] The embedded member 14 has a ceramic body 13 and a metal film 15 formed on both surfaces of the ceramic body 13 (see Figures 2(a) and 2(b)). The thickness of the metal film 15 of the embedded member 14 is the same as the thickness of the metal layer 20 of the wiring board WB.

[0044] Both surfaces of the outer edge of the embedded member 14 have areas E where the metal film 15 is not formed. That is, the ceramic body 13 is exposed around the entire circumference of the outer edge on both sides of the embedded member 14.

[0045] The embedded member 14 can be formed by forming a metal film on both sides of a flat ceramic substrate by direct plating, etching the metal film along the dicing lines to form individual pieces to create a region E where the metal film is not formed, and then cutting along the dicing lines to form individual pieces (see Figure 2(c) for the ceramic substrate before cutting).

[0046] Aluminum nitride (AlN) is used as the material for the ceramic body 13, but alumina (Al2O3) or other ceramic materials can be used.

[0047] The metal film 15 is formed on the surface of the ceramic body 13 by direct plating. Any metal can be used for the metal film 15, such as copper, copper alloys, aluminum, stainless steel, nickel, iron, and other alloys. Among these, copper and aluminum are preferred from the viewpoint of thermal and electrical conductivity.

[0048] The curing agent 17 contains a thermosetting resin and is placed between the embedding member 14 and the inner circumferential surface of the opening 18, and is bonded to the wiring board WB. The curing agent 17 is also placed between the ceramic body 13 and the wiring layer 23 in the metal film non-formation region E.

[0049] The resin constituting the curing agent 17 is preferably one that has excellent adhesion to the embedded member 14 and does not impair voltage resistance characteristics, etc. It is also preferably one that deforms when heated and pressurized and hardens upon heating, and has the heat resistance required for a wiring board. As such a resin, epoxy resins, phenolic resins, polyimide resins, and various engineering plastics can be used individually or in mixtures of two or more, but epoxy resins are preferred because they have excellent bonding strength between metals. In particular, among epoxy resins, bisphenol A type epoxy resins, bisphenol F type epoxy resins, hydrogenated bisphenol A type epoxy resins, hydrogenated bisphenol F type epoxy resins, triblock polymers having bisphenol A type epoxy resin structures at both ends, and triblock polymers having bisphenol F type epoxy resin structures at both ends are even more preferred resins because they have high fluidity and excellent miscibility with metal oxides and metal nitrides.

[0050] The wiring layer 23 is formed on both sides of the wiring board laminate 10 and is formed on the surfaces of the wiring board WB, the embedded member 14, and the hardening material 17. The wiring layer 23 is a metal plating layer formed by metal plating on the surfaces of the wiring board WB, the embedded member 14, and the hardening material 17. The wiring layer 23 forms a wiring pattern with the metal film 15 of the embedded member 14 and also forms a wiring pattern with the metal layer 20 of the wiring board WB.

[0051] By arranging electronic elements on the pattern wiring (especially on the pattern wiring on the embedded member 14), heat generated from the electronic elements can be dissipated to the back side via the upper wiring layer 23, the embedded member 14, and the lower wiring layer 23, and can be dissipated to the outside via heat dissipation fins (not shown) connected to the surface of the back wiring layer 23.

[0052] 2. Method for manufacturing a wiring board laminate according to Embodiment 1 Next, we will explain the method for manufacturing the wiring board laminate 10. Figures 3 to 5 are cross-sectional views illustrating the method for manufacturing the wiring board laminate according to Embodiment 1. Figures 3(a) to 3(e), 4(a) to 4(d), and 5(a) to 5(e) are step diagrams.

[0053] In this embodiment, first, as shown in Figures 3(a) and 3(b), a double-sided metal-clad laminate is used as the wiring board material WB', and a resin film 21 (filling sheet) is laminated onto the wiring board material WB'.

[0054] The double-sided metal-clad laminate, which is the wiring board material WB', has a hardened insulating layer 19' bonded to metal layers 20' on both sides. However, a laminate with a semi-hardened insulating layer 19' may be used and hardened at any stage. It is also possible to use two single-sided metal-clad laminates, each with a semi-hardened insulating layer 19' bonded to a metal layer 20', laminated with the insulating layers 19' facing each other. Furthermore, two metal plates (metal layers 20') may be laminated on both sides of the semi-hardened insulating layer 19'. Alternatively, the wiring board WB may have a patterned metal layer 20 on the surface of the insulating layer 19. The material for the semi-hardened insulating layer 19' is preferably a thermosetting resin, and preferably a prepreg containing a thermosetting resin and reinforcing fibers.

[0055] As shown in Figure 3(b), the resin film 21 may simply be placed on the wiring board material WB', but it is preferable to attach it to the wiring board WB or the wiring board material WB' from the viewpoint of preventing misalignment and preventing the curing agent 17 from adhering to the surface of the wiring board WB or the wiring board material WB'.

[0056] The resin film 21 is preferably a resin film, and any of the following can be used: polyester such as polyethylene terephthalate, polyolefins such as polyethylene and polypropylene, and polyamides. However, from the viewpoint of heat resistance, polyester such as polyethylene terephthalate is preferred. Furthermore, when attaching the resin film 21, it is preferable to provide an adhesive layer on the resin film 21. As the adhesive, rubber-based adhesives, acrylic-based adhesives, silicone-based adhesives, etc., can be used. Instead of providing an adhesive layer on the resin film 21, it is also possible to form it by separately applying an adhesive layer to the wiring board WB or wiring board material WB'.

[0057] Next, as shown in Figure 3(c), an opening 18 is formed in the portion of the wiring board material WB' corresponding to the embedded member 14. The wiring board material WB' usually has multiple openings 18. The openings 18 can be formed using a drill, punch, router, etc. It is preferable that the size of the opening 18 be slightly larger than the upper surface of the embedded member 14.

[0058] Next, as shown in Figure 3(d), a support film 22 is attached to the lower surface of the wiring board material WB'. The support film 22 can be the same as the resin film 21, and it is preferable that it has a similar adhesive layer.

[0059] Next, as shown in Figure 3(e), the wiring board material WB' is placed on the support base 1.

[0060] Next, as shown in Figure 4(a), the embedding member 14 is placed inside the opening 18 of the wiring board material WB'. In this embodiment, the embedding member 14 has the same thickness as the wiring board material WB'. Any embedding member that can be placed inside the opening 18 of the wiring board material WB' is acceptable. If the embedding member 14 has a thickness less than the wiring board material WB', the upper surface of the embedding member 14 can be exposed by removing the hardening agent 17 covering the upper surface of the embedding member 14 as necessary.

[0061] As for the method of positioning the embedded member 14, it is possible to use a mounting device for surface mounting micro-components onto a wiring board, or, as will be described later, to use embedded members 14 that have been pre-formed at the opening positions on a support by etching or the like, and then stack and position them on the wiring board WB or wiring board material WB'. However, a method of positioning the embedded member 14 inside the opening by applying vibration is preferred. As such a device, a commercially available ratchet device used for surface mounting micro-components onto a wiring board can be used.

[0062] One method for applying vibration is to continuously position the embedded members 14 inside the opening while applying vibration to the wiring board material WB' and transporting them on its surface, similar to the transport of fine components using a vibration feeder. Alternatively, a batch method may be used, where a large number of embedded members 14 are supplied to the upper surface of the wiring board material WB', and after applying vibration to the wiring board material WB' and / or the embedded members 14, the embedded members 14 existing outside the opening may be removed.

[0063] The frequency and amplitude of the vibration can be appropriately set according to the size of the embedded member 14, but for example, a frequency of 100 to 10000 Hz and an amplitude of 10 μm to 1000 μm are preferred. Such a minute vibration generator can be made up of, for example, an electromagnet and iron piece vibrator, or an electroacoustic transducer such as a piezoelectric transducer or ferrite vibrator.

[0064] As shown in Figure 4(a), while it is preferable to use a mounting device or the like to arrange the embedded members 14 evenly (preferably in the central position) inside the opening 18, the vibration application method can also be used to arrange the embedded members 14 evenly inside the opening by placing a jig with a smaller opening that opens at or near the central position of the opening on the upper side of the wiring board WB or wiring board material WB'.

[0065] Next, as shown in Figure 4(b), a filling sheet 16' containing a hardening agent 17 is laminated and placed on the support base 1 between the wiring board material WB' and the embedding member 14 to form a laminated material LM containing these materials.

[0066] The filling sheet 16' may contain a curing agent 17, and may be a sheet made of thermosetting resin, but it is preferable that it be a prepreg containing a curing agent 17 and reinforcing fibers. The resin constituting the filling sheet 16' is preferably one that has excellent adhesion to the embedded member 14 and does not impair voltage resistance characteristics, etc. As such a resin, epoxy resin, phenolic resin, polyimide resin, and various engineering plastics can be used individually or in mixtures of two or more, but epoxy resin is preferred because it has excellent bonding strength between metals. Furthermore, the filling sheet 16' is preferably made of a material with high thermal conductivity, for example, a resin containing a thermally conductive filler is an example.

[0067] The curing agent 17 can be any material that deforms when heated and pressurized, hardens upon heating, and possesses the heat resistance required for a wiring board. Specifically, examples of curing agents 17 include various thermosetting resins such as epoxy resins, phenolic resins, and polyimide resins.

[0068] Any material can be used as the prepreg, as long as it deforms when heated and pressurized, solidifies upon heating, and possesses the heat resistance required for a wiring board. Specifically, examples include composites of various thermosetting resins such as epoxy resin, phenolic resin, and polyimide resin, and reinforcing fibers such as glass fiber, ceramic fiber, aramid fiber, and paper.

[0069] Next, as shown in Figure 4(c), an example is presented which includes a step of integrating the laminated material LM by heating and pressurizing to obtain a laminated body LB in which a hardening agent 17 is filled between the inner surface of the opening in the wiring board material WB' and the embedding member 14. In the illustrated example, this makes it possible to form a laminated body LB in which the height of the embedding member 14 is the same as the surface of the wiring board WB or the wiring board material WB'.

[0070] Furthermore, as shown in Figures 4(c) and 4(d), heating and pressurizing causes the filling sheet 16' to become a thinner cured material 16, filling the space between the inner surface of the opening 18 of the wiring board WB or wiring board material WB' and the embedding member 14 with the curing material 17 of the filling sheet 16', and covering the upper surface of the embedding member 14. It is also placed between the ceramic body 13 and the wiring layer 23 in the non-metal film region E where no metal film is formed.

[0071] Heating and pressing can be performed by placing the laminated material LM on the support base 1 and heating and pressing it with a press plate 2 or the like. The heating and pressing can be performed using a heating and pressing device (thermal laminator, heating press, etc.), and in order to avoid the inclusion of air, the atmosphere may be set to a vacuum (vacuum laminator, etc.). In particular, when attaching the support film 22 to the bottom surface, it is preferable to perform heating and pressing under a reduced pressure atmosphere because there is no escape route for the air inside the opening. The heating temperature, pressure, and other conditions can be appropriately set according to the material and thickness of the filling sheet 16', but a pressure of 0.5 to 30 MPa is preferred.

[0072] Next, as shown in Figure 5(a), the cured coating layer 16 is removed by grinding it so that the thickness of the laminate LB after grinding is constant. In this embodiment, when removing the cured coating 16, an example is shown where the thickness of the laminate LB after grinding is such that a portion of the resin film 21 is removed. As a result, the entire cured coating 16 is removed, as well as a portion of the resin film 21. Of course, it is also possible to remove only the entire cured coating 16, or to remove both the cured coating 16 and the resin film 21.

[0073] A commercially available table-movable belt sander can be used as a device to grind the laminate LB to a uniform thickness. In Figure 5(a), the grinding belt supported on the surface of the rotating roll is shown by dashed lines, but in reality, it has a larger radius of curvature with respect to the workpiece to be ground, and the grinding belt moving with the roll maintains a constant distance from the moving table 3. By passing the laminate LB through this distance, the laminate LB can be ground to a uniform thickness.

[0074] Next, as shown in Figure 5(b), the process involves peeling the remaining portion 21b of the resin film 21 from the laminate LB. This leaves the curing agent 17 covering the embedded member 14, and forms a protrusion A made of the curing agent 17.

[0075] Next, as shown in Figure 5(c), the process includes removing the protrusions A of the hardening material 17 that covers the embedded member 14 of the laminate LB. This makes it possible to flatten the upper surface of the laminate LB. In Embodiment 1, the resin film 21 is removed prior to the removal of the protrusions A, but the resin film 21 can also be removed at the same time as the removal of the protrusions A.

[0076] Methods for removing the protrusion A include grinding or polishing, and include using a grinding device having a hard rotary blade in which multiple hard blades, such as diamond blades, are arranged radially on a rotating plate, or using a sander, belt sander, grinder, surface grinder, hard abrasive molded product, etc.

[0077] Next, a step is performed to peel off at least the support film 22 (lower side) from the laminate LB. When peeling off the support film 22, it is preferable to set the adhesive force between the embedding member 14 and the support film 22 to be less than the adhesive force between the embedding member 14 and the curing agent 17. With such an adhesive force, the support film 22 can be easily peeled off.

[0078] Next, as shown in Figure 5(d), the exposed embedded member 14 and the metal layer 20' are metal-plated to form a metal-plated layer 23' (on both sides). Preferred metals for the metal plating include, for example, copper, silver, and Ni. Methods for forming the metal-plated layer 23' include, for example, a combination of electroless plating and electrolytic plating.

[0079] Next, as shown in Figure 5(e), the metal plating layer 23' and the metal layer 20' are patterned to form the wiring layer 23. Patterning can be achieved, for example, by etching the metal plating layer 23' and the metal layer 20' in a predetermined pattern using an etching resist. The metal film 15 may also be etched.

[0080] In this way, the wiring board laminate 10 can be manufactured.

[0081] 3. Effects of the wiring board laminate 10 and the manufacturing method of the wiring board laminate according to Embodiment 1 According to the wiring board laminate 10 of Embodiment 1, the laminate comprises a wiring board WB having an opening 18 and an embedded member 14 embedded in the opening 18 of the wiring board WB. Since the embedded member 14 has a ceramic body 13, high heat dissipation and heat resistance can be achieved by using ceramics with high thermal conductivity as the substrate material. Furthermore, because a wiring board WB is used, lamination can be performed in the area of ​​the wiring board WB while achieving high heat dissipation and heat resistance by using ceramics as the substrate material. Moreover, the cost can be reduced compared to the case of a ceramic circuit board in which the entire substrate is made of ceramics.

[0082] Furthermore, according to the wiring board laminate 10 of Embodiment 1, the laminate includes a wiring board WB having an opening 18 and an embedded member 14 embedded in the opening 18 of the wiring board WB. Since the embedded member 14 has a ceramic body 13, instead of using a single ceramic substrate, individual pieces of the ceramic body 13 are used, and the other areas are used as a wiring board. This reduces the possibility of cracking compared to the case where a single ceramic substrate is used.

[0083] According to the wiring board laminate 10 of Embodiment 1, the outer edge of the embedded member 14 has a metal film non-formation region E where the metal film 15 is not formed, and the hardening material 17 is also placed between the ceramic body 13 and the wiring layer 23 in the metal film non-formation region E. Therefore, the adhesion between the ceramic body 13, which is made of ceramics that are relatively difficult to adhere to, and the wiring layer 23, which is made of metal, can be improved.

[0084] According to the wiring substrate laminate 10 of Embodiment 1, both surfaces of the ceramic body 13 have areas E where the metal film is not formed, and the hardening agent 17 is also placed between the ceramic body 13 and the wiring layer 23 in the areas where the metal film is not formed E. Therefore, the adhesion between the ceramic body 13 and the wiring layer 23, which are relatively difficult to adhere to on both sides of the ceramic body 13, can be improved, and cracks in the corners of the ceramic body 13 can be prevented more reliably.

[0085] According to the wiring board laminate 10 of Embodiment 1, the metal film non-formed region E is formed over the entire outer edge surrounding the metal film 15, making it less likely for cracks to occur locally in a part of the outer edge of the ceramic body 13, and further reducing the likelihood of cracks occurring in the ceramic body 13.

[0086] According to the wiring board laminate 10 of Embodiment 1, since the metal film 15 is formed on the surface of the ceramic body 13 by direct plating, the ceramic body 13 and the metal film 15 can be joined with high adhesion. Furthermore, since it is not necessary to place a bonding material to enhance adhesion between the ceramic body 13 and the metal film 15, it is possible to prevent the reduction in heat dissipation caused by such a bonding material.

[0087] According to the wiring board laminate 10 of Embodiment 1, a wiring layer 23 is arranged on the surface of the wiring board WB, and since the wiring layer 23, metal layer 20 and metal film 15 constitute the circuit wiring, it is possible to construct a wiring pattern with a complex configuration.

[0088] According to the wiring substrate laminate 10 of Embodiment 1, since the wiring layer 23 is a metal plating film formed on the surface of the wiring substrate WB by plating, the adhesion between the wiring substrate WB and the wiring layer 23 is high, making it easier to construct a laminate substrate with a complex structure.

[0089] According to the wiring board laminate 10 of Embodiment 1, the embedded member 14 is rectangular in shape when viewed in plan, making it easy to process and align with the opening. Furthermore, when electronic elements are placed on the embedded member 14 via the wiring layer 23, heat can be dissipated evenly from the electronic elements, which are mostly rectangular in shape, thus preventing localized thermal stress and making it even less prone to cracking.

[0090] According to the manufacturing method of the wiring board laminate according to Embodiment 1, since a laminate is used in which an embedded member 14 is placed in an opening of the wiring board WB or wiring board material WB' and a thermosetting resin is filled into the opening by heating and pressurizing, a complicated process is not required when placing the embedded member 14, and it is possible to accommodate embedded members of various shapes. Furthermore, since the hardened material such as the filling sheet 16' is ground down so that the thickness of the laminate after grinding is uniform and the hardened material is removed, the thermosetting resin filled into the opening 18 does not become integrated with the hardened material such as the filling sheet, and it is less likely that the filled thermosetting resin will break or fall out when peeling off the hardened material. As a result, the reliability of the filling structure of the embedded member and the smoothness of the surface can be improved.

[0091] According to the manufacturing method for a wiring board laminate of Embodiment 1, an embedded member 14 is placed in an opening 18 of the wiring board WB or wiring board material WB', and the thermosetting resin contained in the filling sheet 16' can be filled into the opening (by heating and pressurizing), thus enabling the laminate to be obtained by a dry process. In this case, a complicated process is not required when placing the embedded member, and it is possible to accommodate embedded members of various shapes. Furthermore, since the hardened material of the filling sheet is removed by grinding so that the thickness of the laminate after grinding is uniform, the thermosetting resin filled into the opening does not become integrated with the hardened material of the filling sheet, making it less likely for the filled thermosetting resin to break or fall out. Therefore, the reliability of the filling structure of the embedded member and the smoothness of the surface can be improved.

[0092] According to the manufacturing method of the wiring board laminate of Embodiment 1, by attaching a resin film to the wiring board WB or wiring board material WB', it becomes difficult for the thermosetting resin to adhere to the surface of the wiring board during filling. Furthermore, since the resin film is interposed between the cured material such as the filling sheet and the wiring board, and the cured material is ground down to a thickness in which a portion of the resin film is removed, the cured material can be removed more reliably. Moreover, when the remaining portion of the resin film is peeled off from the laminate, the height of the thermosetting resin located at the opening of the resin film is reduced, making it easier to remove the convex thermosetting resin.

[0093] [Embodiment 2] Figure 6 is a cross-sectional view illustrating the manufacturing method of the wiring board laminate according to Embodiment 2. Figures 6(a) to 6(c) are step diagrams. The manufacturing method of the wiring board laminate according to Embodiment 2 basically has the same steps as the manufacturing method of the wiring board laminate according to Embodiment 1, but differs from the manufacturing method of the wiring board laminate according to Embodiment 1 in that it does not use a support film 22.

[0094] In Embodiment 2, as shown in Figure 6(a), the wiring board material WB' is placed on a support base 1 such as a mirror plate, and the embedded member 14 is placed inside the opening of the wiring board material WB' (see Figure 6(b)).

[0095] Next, a filling sheet containing the hardening agent 17 is placed on top and heated and pressurized (see Figure 6(c)). This integrates the materials, and a laminate LB is obtained in which the hardening agent 17 is filled between the inner surface of the opening 18 of the wiring board WB or wiring board material WB' and the embedding member 14. At this time, the hardening agent 17 may adhere to the area around the opening on the lower surface of the wiring board WB or wiring board material WB', but the adhered hardening agent 17 can be removed by polishing or chemical treatment.

[0096] The subsequent steps are the same as those for the manufacturing method of the wiring board laminate according to Embodiment 1, except for the step of removing the support film, so their explanation will be omitted.

[0097] Thus, the method for manufacturing a wiring board laminate according to Embodiment 2 differs from the method for manufacturing a wiring board laminate according to Embodiment 1 in that it does not use a support film 22. However, similar to the method for manufacturing a wiring board laminate according to Embodiment 1, it uses a laminate with a structure in which an embedded member is placed in an opening of a wiring board or wiring board material and a thermosetting resin is filled into the opening by heating and pressurizing. Therefore, a complicated process is not required when placing the embedded member, and it can accommodate embedded members of various shapes. Furthermore, since the hardened material such as the filling sheet is ground down so that the thickness of the laminate after grinding is uniform and the hardened material is removed, the thermosetting resin filled into the opening does not become integrated with the hardened material such as the filling sheet, and it is less likely that the filled thermosetting resin will break or fall out when peeling off the hardened material. Therefore, the reliability of the filling structure of the embedded member and the smoothness of the surface can be improved.

[0098] Furthermore, the method for manufacturing a wiring board laminate according to Embodiment 2 has the same steps as the method for manufacturing a wiring board laminate according to Embodiment 1, except that it does not use a support film 22, and therefore possesses the applicable effects of the method for manufacturing a wiring board laminate according to Embodiment 1.

[0099] [Embodiment 3] Figure 7 is a cross-sectional view illustrating the manufacturing method of the wiring board laminate according to Embodiment 3. Figures 7(a) to 7(e) are step diagrams. The manufacturing method of the wiring board laminate according to Embodiment 3 basically has the same steps as the manufacturing method of the wiring board laminate according to Embodiment 1, but differs from the manufacturing method of the wiring board laminate according to Embodiment 1 in that it does not use the resin film 21.

[0100] In Embodiment 3, a laminated material LM is prepared, which includes a wiring board material WB' having an opening 18 and not having a resin film 21 attached to it (see Figure 7(a)), an embedded member 14 located inside the opening, and a filling sheet 16' laminated on the wiring board material WB' and containing a curing agent 17 (see Figure 7(b)). In this embodiment, a support film 22 is attached to the lower surface of the wiring board material WB'.

[0101] Next, in the same manner as in the previous embodiment, the laminated material LM is integrated by heating and pressurizing to obtain a laminated body LB in which the curing agent 17 is filled between the inner surface of the opening 18 of the wiring board material WB' and the embedding member 14. This makes it possible to form a laminated body LB in which the height of the embedding member 14 is the same as the height of the surface of the wiring board material WB'.

[0102] Next, as shown in Figure 7(d), the hardened material 16 of the filling sheet 16' is removed by grinding so that the thickness of the laminated body LB after grinding becomes uniform. In this embodiment, when removing the hardened material 16 of the filling sheet 16', the thickness of the laminated body LB after grinding is set to a thickness that removes all or almost all of the hardened material 16. As a result, all or almost all of the hardened material 16 is removed.

[0103] Next, the support film 22 is removed. The subsequent steps are the same as those for manufacturing the wiring board laminate according to Embodiment 1, so their description is omitted. In this way, the wiring board laminate 10 according to Embodiment 3 can be manufactured (see Figure 7(e)).

[0104] Thus, the method for manufacturing a wiring board laminate according to Embodiment 3 differs from the method for manufacturing a wiring board laminate according to Embodiment 1 in that it does not use a resin film 21. However, similar to the method for manufacturing a wiring board laminate according to Embodiment 1, it uses a laminate with a structure in which an embedded member is placed in an opening in the wiring board or wiring board material, and a thermosetting resin is filled into the opening by heating and pressurizing. Therefore, a complicated process is not required when placing the embedded member, and it can accommodate embedded members of various shapes. Furthermore, since the hardened material such as the filling sheet is ground down so that the thickness of the laminate after grinding is uniform and the hardened material is removed, the thermosetting resin filled into the opening does not become integrated with the hardened material such as the filling sheet, and it is less likely that the filled thermosetting resin will break or fall out when peeling off the hardened material. Therefore, the reliability of the filling structure of the embedded member and the smoothness of the surface can be improved.

[0105] Furthermore, the method for manufacturing a wiring board laminate according to Embodiment 3 has the same steps as the method for manufacturing a wiring board laminate according to Embodiment 1, except that it does not use a resin film 21, and therefore possesses the applicable effects of the method for manufacturing a wiring board laminate according to Embodiment 1.

[0106] [Embodiment 4] Figure 8 is a cross-sectional view illustrating the manufacturing method of the wiring board laminate according to Embodiment 4. Figures 8(a) and 8(b) are step diagrams. The manufacturing method of the wiring board laminate according to Embodiment 4 basically has the same steps as the manufacturing method of the wiring board laminate according to Embodiment 1, but differs from the manufacturing method of the wiring board laminate according to Embodiment 1 in that the embedding member 14 is placed on the support film 22 before the wiring board material WB is placed.

[0107] In Embodiment 4, as shown in Figure 8(a), the embedding member 14 is placed on the support film 22 before the wiring board material WB' is placed, and then the wiring board material WB is placed on the support film 22 while aligning it with the embedding member 14, and the filling sheet 16' is placed on the wiring board material WB and the embedding member 14.

[0108] The subsequent steps are the same as those for the manufacturing method of the wiring board laminate according to Embodiment 1, so their explanation will be omitted.

[0109] Thus, the method for manufacturing a wiring board laminate according to Embodiment 4 differs from the method for manufacturing a wiring board laminate according to Embodiment 1 in that the embedding member 14 is placed on the support film 22 before the wiring board material WB is placed. However, similar to the method for manufacturing a wiring board laminate according to Embodiment 1, a laminate is used in which the embedding member is placed in the opening of the wiring board or wiring board material and the thermosetting resin is filled into the opening by heating and pressurizing. Therefore, a complicated process is not required when placing the embedding member, and it can accommodate embedding members of various shapes. Furthermore, since the hardened material such as the filling sheet is ground down so that the thickness of the laminate after grinding is uniform and the hardened material is removed, the thermosetting resin filled into the opening does not become integrated with the hardened material such as the filling sheet, and it is less likely that the filled thermosetting resin will break or fall out when peeling off the hardened material. Therefore, the reliability of the filling structure of the embedding member and the smoothness of the surface can be improved.

[0110] Furthermore, the method for manufacturing a wiring board laminate according to Embodiment 4 has the same steps as the method for manufacturing a wiring board laminate according to Embodiment 1, except that the embedded member 14 is placed on the support film 22 before the wiring board material WB is placed. Therefore, it has the applicable effects of the method for manufacturing a wiring board laminate according to Embodiment 1.

[0111] [Embodiment 5] Figure 9 is a cross-sectional view illustrating the manufacturing method of a wiring board laminate according to Embodiment 5. Figures 9(a) to 9(e) are step diagrams. The manufacturing method of a wiring board laminate according to Embodiment 5 basically has the same steps as the manufacturing method of a wiring board laminate according to Embodiment 1, but differs from the manufacturing method of a wiring board laminate according to Embodiment 1 in that it uses a wiring board WB having a wiring pattern 20 as a metal layer and an insulating layer 19 instead of a wiring board material WB.

[0112] As shown in Figure 9(a), a laminated material LM is formed by laminating a support film 22 on which an embedded member 14 is formed, a wiring board WB having a plurality of openings 18 in the portion corresponding to the embedded member 14, and a filling sheet 16' containing a hardening agent 17, such that the embedded member 14 is positioned inside each of the openings 18. At this time, it is preferable that the upper surface of the wiring board WB is covered with a resin film 21, and it is even more preferable that the resin film 21 has a plurality of openings 21a in the portion corresponding to the embedded member 14.

[0113] Next, as shown in Figure 9(b), the laminated material LM is integrated by heating and pressurizing to obtain a laminated body LB in which a hardening agent 17 is filled between the inner surface of the opening 18 of the wiring board WB and the embedding member 14. This makes it possible to form a laminated body LB in which the height of the embedding member 14 is the same as or slightly lower than the top surface of the wiring board WB. Such a process can be carried out in the same manner as in the previous embodiment.

[0114] Subsequently, as shown in Figure 9(c), the cured material 16 of the filling sheet 16' is removed by grinding it so that the thickness of the laminated body LB after grinding becomes uniform, in the same manner as in the previous embodiment. In this embodiment, when removing the cured material 16 of the filling sheet 16', an example is shown where the thickness of the laminated body LB after grinding is set to a thickness that removes a portion of the resin film 21. As a result, the entire cured material 16 is removed, as well as a portion of the resin film 21. Of course, it is also possible to remove only the entire cured material 16.

[0115] Next, as shown in Figures 9(d) and 9(e), the resin film 21 on the upper surface is peeled off, and the thermosetting resin (protrusion A) covering the upper surface of the embedded member 14 is removed. If the upper surface of the embedded member 14 is higher than the upper surface of the wiring board WB, the embedded member 14 can be removed by that amount if necessary.

[0116] This makes it possible to obtain a wiring board having an insulating layer 19, an embedded member 14 embedded in the insulating layer 19, and a wiring layer (wiring pattern 20), wherein the insulating layer 19 contains a cured product 16 of the filling sheet 16', and the area around the embedded member 14 is bonded to the insulating layer 19 by a curing agent 17 that is different from the resin component of the insulating layer 19.

[0117] As shown in the illustrated example, when using a double-sided wiring board, it is preferable to have interlayer connection structures such as plated through-holes, metal bumps, filled vias, and plated vias.

[0118] Thus, the method for manufacturing a wiring board laminate according to Embodiment 5 differs from the method for manufacturing a wiring board laminate according to Embodiment 1 in that it uses a wiring board WB having a wiring pattern 20 and an insulating layer 19 instead of a wiring board material WB. However, similar to the method for manufacturing a wiring board laminate according to Embodiment 1, it uses a laminate with a structure in which an embedded member is placed in an opening in the wiring board or wiring board material and a thermosetting resin is filled into the opening by heating and pressurizing. Therefore, a complicated process is not required when placing the embedded member, and it can accommodate embedded members of various shapes. Furthermore, since the hardened material such as the filling sheet is ground down so that the thickness of the laminate after grinding is uniform and the hardened material is removed, the thermosetting resin filled into the opening does not become integrated with the hardened material such as the filling sheet, and it is less likely that the filled thermosetting resin will break or fall out when peeling off the hardened material. For this reason, the reliability of the filling structure of the embedded member and the smoothness of the surface can be improved.

[0119] Furthermore, the method for manufacturing a wiring board laminate according to Embodiment 5 has the same steps as the method for manufacturing a wiring board laminate according to Embodiment 1, except that it uses a wiring board WB having a wiring pattern 20 and an insulating layer 19 instead of a wiring board material WB. Therefore, it has the applicable effects of the method for manufacturing a wiring board laminate according to Embodiment 1.

[0120] Although the present invention has been described above based on the embodiments described above, the present invention is not limited to the embodiments described above. It can be implemented in various forms without departing from the spirit of the invention, and for example, the following modifications are also possible.

[0121] (1) The number, material, shape, position, size, etc. of the components described in each of the above embodiments are illustrative examples and can be changed within the scope that does not impair the effects of the present invention.

[0122] (2) In each of the above embodiments (including the above or below modifications; the same applies hereinafter), a wiring board laminate in which the front surface and the back surface are insulated is used, but the present invention is not limited thereto. A wiring board laminate in which the front surface and the back surface are electrically connected is also possible. In this case, a wiring board laminate in which the front surface and the back surface are electrically connected can be made by forming through holes in the openings of the wiring board material WB and plating the inner surface of the through holes to make plated through holes (wiring board laminate in general according to Modification 1. See Figures 10(a) to 10(c)).

[0123] (3) In each of the above embodiments, the metal layer 20 is a single-layer structure, but the present invention is not limited thereto. A multilayer wiring board may have two or more metal layers.

[0124] (4) In each of the above embodiments, an example was shown in which a laminate LB is formed using a filling sheet 16' containing a curing agent 17, but the present invention is not limited thereto. As shown in Figure 11(a), a coating material containing a curing agent 17 is used to form a laminate LB in which a cured coating layer 16 having a recess 17a above the embedded member 14 is integrated with a wiring board material WB' (see Figure 11(a)). When performing the step of removing the cured coating layer 16 by grinding it so that the thickness of the laminate LB after grinding is uniform, the peripheral portion 17b of the cured coating layer 16 and a part of the thickness of the resin film 21 are removed (see Figure 11(b)), the remaining portion 21b of the resin film 21 is peeled off from the laminate LB (see Figure 11(c)), and the cured coating layer 16 on the upper surface of the embedded member 14 is removed by polishing such as buffing or sandblasting (see Figure 11(d)).

[0125] (5) In each of the above embodiments, the wiring board laminate was manufactured using a wiring board material WB' in which a metal layer is formed on both surfaces of the ceramic body 13, but the present invention is not limited thereto. The wiring board laminate may also be manufactured using a wiring board material in which a metal layer is formed on one surface of the ceramic body 13.

[0126] (6) In each of the above embodiments, the ceramic body has areas on both sides of its outer edge where no metal film is formed, but the present invention is not limited thereto. The ceramic body may have areas on only one side of its outer edge where no metal film is formed, and this area may be filled with a hardening agent, or the ceramic body may have areas on only a part of its outer edge where no metal film is formed, and this area may be filled with a hardening agent.

[0127] (7) In each of the above embodiments, the thickness of the metal film 15 of the embedded member 14 was set to the same thickness as the metal layer 20 of the wiring board WB, but the present invention is not limited thereto. The thickness of the metal film 15 of the embedded member 14 may be different from the thickness of the metal layer 20 of the wiring board WB. If the thickness of the metal film 15 of the embedded member 14 is made thinner than the thickness of the metal layer 20 of the wiring board WB, the thermal resistance when heat generated from the electronic element is transferred to the back side via the embedded member 14 is reduced, which has the effect of making it easier to transfer heat generated from the electronic element to the outside. Also, if the thickness of the metal film 15 of the embedded member 14 is made thicker than the thickness of the metal layer 20 of the wiring board WB, the stress of the ceramic body 13 and the stress of the metal film 15 can be adjusted. [Explanation of Symbols]

[0128] 10... Laminated wiring board, 13... Ceramic body, 14... Embedding member, 15... Metal film, 17... Hardening material, 19... Insulating layer, 20... Metal layer, 19a... Opening, 23... Wiring layer, E... Area without metal film formation, WB... Wiring board

Claims

1. A wiring board having an opening, An embedded member embedded in the opening of the wiring board, A curing material containing a thermosetting resin, which is placed between the embedded member and the inner circumferential surface of the opening and is bonded to the wiring board, The wiring board, the embedded member, and the wiring layer formed on the surface of the thermosetting resin are provided. The embedded member comprises a ceramic body and a metal film formed on both surfaces of the ceramic body, and has a metal film-free region on the outer edge of at least one of the front and back surfaces of the embedded member where the metal film is not formed. The curing material is also placed between the ceramic body and the wiring layer in the region where the metal film is not formed. The wiring substrate laminate is characterized in that the metal film is directly bonded to the wiring layer.

2. The outer edge of the embedded member has a region where the metal film is not formed on both surfaces, The wiring substrate laminate according to claim 1, characterized in that the curing material is also disposed between the ceramic body and the wiring layer in both of the metal film non-formed regions of the ceramic body.

3. The wiring substrate laminate according to claim 1 or 2, characterized in that, when viewed in plan, the region where the metal film is not formed is formed over the entire outer edge so as to surround the metal film.

4. The wiring substrate laminate according to claim 1 or 2, characterized in that the metal film is formed on the surface of the ceramic body by direct plating.

5. A metal layer is provided on the surface of the aforementioned wiring board. The wiring substrate laminate according to claim 1 or 2, characterized in that the wiring layer, the metal layer, and the metal film constitute the circuit wiring.

6. The wiring substrate laminate according to claim 5, characterized in that the metal layer is a metal plating film formed on the surface of the wiring substrate by plating.

7. The opening is rectangular in shape, The wiring board laminate according to claim 1 or 2, characterized in that the embedded member is rectangular when viewed in plan.

8. The wiring board laminate according to claim 1 or 2, characterized in that the ceramic body is composed solely of ceramics.

9. A method for manufacturing a wiring board laminate according to claim 1 or 2, A step to obtain a laminate comprising: a wiring board or wiring board material having an opening; an embedded member located inside the opening and having a ceramic body and a metal film formed on both surfaces of the ceramic body, with a metal film non-formed region on the outer edge of at least one of the front or back surfaces where the metal film is not formed; and a filling sheet or cured coating layer integrated with the wiring board or wiring board material containing a thermosetting resin, wherein the thermosetting resin is filled between the inner surface of the opening in the wiring board or wiring board material and the embedded member, and the metal film non-formed region is also positioned on the surface of the ceramic body; The process involves grinding the hardened material of the filling sheet or coating layer so that the thickness of the laminate after grinding becomes uniform, and removing the hardened material. The process includes the step of forming a wiring layer on the surface of the embedded member from which the hardened material has been removed, and the wiring board or the wiring board material, A method for manufacturing a wiring substrate laminate, characterized in that, in the step of forming the wiring layer, the curing agent is also placed between the ceramic body and the wiring layer in the area where the metal film is not formed, and the wiring layer is formed such that the metal film is directly bonded to the wiring layer.

10. A step of preparing a laminated material including the wiring board or wiring board material, the embedding member, and the filling sheet, A step of obtaining the laminate by integrating the laminated materials by heating and pressurizing, The method for manufacturing a wiring board laminate according to claim 9, comprising the step of grinding the hardened material of the filling sheet so that the thickness of the laminate after grinding becomes uniform, thereby removing the hardened material of the filling sheet.

11. The laminate is a laminate in which a resin film having an opening at a position corresponding to the opening in the wiring board or the wiring board material is attached to the wiring board or the wiring board material. When removing the hardened material of the filling sheet or the coating layer, the thickness of the laminate after grinding is set to a thickness to which a portion of the resin film is removed, and further, the remaining portion of the resin film is peeled off from the laminate. A method for manufacturing a wiring board laminate according to claim 9, comprising the step of removing a cured product of a thermosetting resin covering the embedded member of the laminate.

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