Electronic component mounting system

Abstract

To provide an electronic component mounting system with which it is possible to improve accuracy of mounting positions when mounting electronic components to a board.SOLUTION: An electronic component mounting system comprises: component mounting means 2 for mounting electronic components to prescribed mounting points on a board on the basis of production data; mounting control means for controlling said mounting operation; positional deviation amount acquisition means 3 for acquiring, for each mounting point, a positional deviation amount of an electronic component mounted to the board from a regular mounting point; correction value calculation means for calculating, for each mounting point, a feedback correction value on the basis of said positional deviation value; and storage means for storing said feedback correction value in association with production data. When a feedback correction value associated with production data corresponding to the production item to be produced is stored in the storage means, the mounting control means corrects mounting operation by the component mounting means 2 using said feedback correction value; when not stored, the mounting control means corrects the mounting operation on a first board by the component mounting means 2 in accordance with a prescribed procedure.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an electronic component mounting system for mounting electronic components on a substrate. In the present specification, "electronic components" are also simply referred to as "components". [Background Art]

[0002] In recent years, along with the miniaturization of electronic components and the increase in mounting density, requirements for mounting position accuracy when mounting components on a substrate have also become more stringent. Therefore, conventionally, in order to improve the mounting position accuracy when mounting components on a substrate, an inspection device or the like is used to inspect the mounting position deviation from the normal position of components mounted on the substrate, and the mounting operation of the component mounting apparatus is corrected using a feedback correction value calculated based on the mounting position deviation amount (see, for example, Patent Document 1).

[0003] That is, in the component mounting system of Patent Document 1, an inspection device arranged downstream of the component mounting apparatus detects the mounting position deviation amount for each component mounted on the substrate, and corrects the mounting operation in the component mounting apparatus using a feedback correction value calculated for each component. Further, in the component mounting system of Patent Document 1, the mounting position is corrected in consideration of a temporal change correction value calculated based on temporal change information of the component mounting mechanism. [Prior Art Documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Unexamined Patent Application Publication No. 2016-58603 [Summary of the Invention] [Problem to be Solved by the Invention]

[0005] In the conventional techniques including Patent Document 1, although mounting position deviation is fed back for each component mounted on a substrate, and the temporal change of the component mounting mechanism is also taken into consideration, there is still room for further improvement in order to improve mounting position accuracy. Furthermore, in the prior art, including Patent Document 1, when producing substrates for new production items, there is no feedback correction value. Therefore, it is not possible to correct the mounting operation of the component mounting device using the feedback correction value for at least the first substrate. From this point of view, there was room for further improvement in order to improve the mounting position accuracy.

[0006] The problem that this invention aims to solve is to provide an electronic component mounting system that can improve the mounting position accuracy when mounting electronic components on a substrate. [Means for solving the problem]

[0007] The inventors conducted a detailed investigation into the factors causing mounting position misalignment in electronic component mounting systems, that is, factors that reduce mounting position accuracy. As a result, they found that the mounting path leading to the component's mounting point significantly affects the mounting position accuracy of that component. In other words, different mounting paths cause variations in the amount of misalignment of the component mounting means in the electronic component mounting system. Therefore, simply feeding back the mounting position misalignment for each component, as in the conventional technology, has limitations in improving mounting position accuracy. Based on this idea that improving the mounting position accuracy of components requires associating the mounting point where the component is mounted with the mounting path leading to that point, the inventors decided to reconsider the configuration of the electronic component mounting system. They focused on the fact that the mounting path for each mounting point is defined in the production data created for each production item indicating the type of substrate to be produced, and came up with a method to manage the feedback correction value for each mounting point for each production data, or in other words, a method to manage the feedback correction value for each mounting point in association with the production data. Furthermore, the inventors conceived the idea of ​​using production data from the production item most similar to the production data of the newly produced product, so that the mounting operation can be corrected from the first board when producing substrates for new product items. They then came up with the idea of ​​applying corrections as necessary to improve the mounting position accuracy when using this data, and thus completed the present invention.

[0008] In other words, according to one aspect of the present invention, the following electronic component mounting system is provided. A component mounting means that sequentially mounts multiple electronic components in a predetermined order at predetermined mounting points on a circuit board, based on production data created for each production item that indicates the type of circuit board to be produced, Mounting control means for controlling the mounting operation of mounting electronic components onto a substrate by the component mounting means, A positional deviation amount acquisition means for acquiring the positional deviation amount of each electronic component mounted on the substrate by the component mounting means from the regular mounting point, A correction value calculation means calculates a feedback correction value for each mounting point to correct the mounting operation of the component mounting means based on the positional deviation amount obtained by the positional deviation amount acquisition means, The system includes a storage means for storing the feedback correction value calculated by the correction value calculation means in association with the production data, The aforementioned implementation control means searches whether a feedback correction value associated with production data corresponding to the product to be produced is stored in the storage means at the start of production. If stored, the feedback correction value is used to correct the mounting operation by the component mounting means. An electronic component mounting system that, if not stored in memory, corrects the mounting operation on the first circuit board by the component mounting means in the following procedure. (1) From the production data of production items stored in the storage means, select the production data of the production item that is most similar to the production data of the production item to be produced. (2) The mountable area of ​​the component mounting means is divided into rectangles of a certain size, and an index is assigned to each division to form a mounting index area. (3) Based on the XY position information of each mounting point included in the production data selected in (1) above (hereinafter referred to as "reference production data"), the mounting information including the XY position information of each mounting point is classified for each mounting index area. (4) Based on the XY position information of each mounting point included in the production data of the product to be produced (hereinafter referred to as "new production data"), the mounting information including the XY position information of each mounting point is classified for each mounting index area. (5) For each implementation index area, compare the implementation information of each implementation point included in the reference production data (hereinafter referred to as "reference implementation information") with the implementation information of each implementation point included in the new production data (hereinafter referred to as "new implementation information"). (6-1) In the mounting index area where the reference mounting information and the new mounting information match as a result of the comparison in (5) above, the mounting operation by the component mounting means is corrected using the feedback correction value of each mounting point associated with the reference production data. (6-2) In the implementation index area where the reference implementation information and the new implementation information do not match as a result of the comparison in (5) above, The average value of the feedback correction value for each implementation point associated with the reference implementation information within the implementation index area. The mounting operation by the component mounting means is corrected using this method. [Effects of the Invention]

[0009] According to the electronic component mounting system of the present invention, the mounting position accuracy when mounting electronic components on a substrate can be improved. [Brief explanation of the drawing]

[0010] [Figure 1] A block diagram showing the configuration of an electronic component mounting system, which is one embodiment of the present invention. [Figure 2] A perspective view showing an example of a mounting head. [Figure 3] A conceptual diagram showing an example of the data structure of feedback correction values ​​stored by a memory device. [Figure 4] A conceptual diagram showing an example of the data structure for production data (production data D) of a new production item, a circuit board (circuit board D). [Figure 5] Conceptual diagram of the implementation index area. [Figure 6A]A conceptual diagram showing an example of classifying mounting information of each mounting point included in reference production data (production data A) for each mounting index area. [Figure 6B] A conceptual diagram showing an example of classifying mounting information of each mounting point included in new production data (production data D) for each mounting index area. [Figure 7] A conceptual diagram showing an example of the data structure of feedback correction values when producing the first board of a new production item.

Mode for Carrying Out the Invention

[0011] FIG. 1 is a block diagram showing the configuration of an electronic component mounting system which is an embodiment of the present invention. The electronic component mounting system 1 shown in FIG. 1 comprises two component mounting apparatuses 2A and 2B serving as component mounting means, and a component position inspection apparatus 3 serving as positional deviation amount acquisition means. These apparatuses are connected to a management computer 5 via a communication network 4. The number of component mounting apparatuses 2A and 2B provided in the electronic component mounting system 1 is not limited to two, and may be one or three or more. In the present embodiment, the two component mounting apparatuses 2A and 2B have substantially the same configuration. Therefore, in the following description, they are simply referred to as "component mounting apparatus 2" without distinguishing between them.

[0012] The component mounting apparatus 2 includes a mounting head having a plurality of component suction tools. As such a mounting head, for example, a rotary head type mounting head disclosed in Japanese Patent Laid-Open No. 2016-86095 can be used. FIG. 2 shows the mounting head 10 disclosed in Japanese Patent Laid-Open No. 2016-86095. The mounting head 10 shown in this figure is a rotary head type mounting head, in which a rotary head 30 is rotatably attached to a fixedly arranged head main body 20 in the R direction around a vertical axis. A plurality of spindles 31 are arranged on the rotary head 30 at equal intervals along the circumferential direction thereof, and a nozzle 32 is attached to the lower end of each spindle 31 as a component suction tool that suction-holds components. The rotary head 30 is rotated in the R direction by driving of an R servomotor 21 installed on the head main body 20. Each spindle 31 is rotated in the T direction about its axis by driving of a T servomotor 22 installed on the head main body 20. Furthermore, a Z servomotor 23 is disposed on the head main body 20 as a first lifting / lowering means for lifting and lowering the spindle 31a (nozzle 32) at a specific position in the Z direction along the axial direction. This mounting head 10 is movable in the X and Y directions by an unillustrated XY moving mechanism.

[0013] The component mounting apparatus 2 sequentially mounts a plurality of electronic components onto predetermined mounting points on a substrate in a predetermined order based on production data created for each production item indicating the type of substrate to be produced. A mounting control means included in a management computer 5 controls mounting operations for mounting electronic components onto a substrate performed by the component mounting apparatus 2. That is, production data corresponding to each production item is stored in the mounting control means, and the mounting control means sequentially mounts a plurality of electronic components onto predetermined mounting points on a substrate in a predetermined order based on the production data corresponding to the production item to be produced. Each piece of production data includes information such as the substrate size, the XY coordinate positions (X position, Y position) of each mounting point on the substrate, the type and size of the component to be mounted at each mounting point, the mounting order, the mounting height and the mounting direction (angle) of the component during mounting, and the like.

[0014] A component position inspection device 3 is installed downstream of the component mounting device 2. The component position inspection device 3 detects the position of components mounted on the substrate and calculates and acquires the amount of positional deviation from the correct mounting point for each component. Specifically, as disclosed in Patent Document 1 above, for example, the substrate is imaged by a camera and image recognition is performed to detect the XY coordinate position (X position, Y position) on the substrate plane for each component, and the amount of positional deviation from the correct mounting point for each component is calculated and acquired. In this embodiment, in addition to the XY coordinate position (X position, Y position), the Z position representing the mounting height of the component during mounting and the angle θ representing the mounting direction of the component are also detected, and the amount of positional deviation from the correct Z position and angle θ for each component is also calculated and acquired for each mounting point. Information regarding the correct mounting point of the component (X position, Y position, Z position, angle θ) is obtained from production data stored in the mounting control means described above. The calculation and acquisition of the positional deviation amount for each mounting point described above may be performed in cooperation with the management computer 5. In this case, the part position inspection device 3 and the management computer 5 constitute the means for acquiring the amount of positional deviation, but in this embodiment, the part position inspection device 3 alone constitutes the means for acquiring the amount of positional deviation.

[0015] The management computer 5 includes a correction value calculation means, which calculates a feedback correction value for each mounting point to correct the mounting operation of the component mounting device 2, which is a component mounting means, based on the amount of misalignment acquired by the component position inspection device 3, which is a position misalignment acquisition means.

[0016] Furthermore, the management computer 5 includes a storage means, which stores the feedback correction values ​​calculated by the correction value calculation means described above, in association with production data. Figure 3 conceptually shows an example of the data structure of the feedback correction values ​​stored by the storage means. As shown in the figure, in this embodiment, the feedback correction value consists of four correction values: X position correction value, Y position correction value, Z position correction value, and angle correction value. These four correction values ​​are then stored for each mounting point in association with production data. In other words, in this embodiment, the feedback correction value for each mounting point is managed for each piece of production data.

[0017] The mounting control means then searches the storage means to see if a feedback correction value associated with production data corresponding to the product to be produced is stored in the storage means when production starts. If it is stored, it uses that feedback correction value to correct the mounting operation by the component mounting means 2. For example, if the product to be produced is substrate A, the mounting control means retrieves a feedback correction value associated with production data A corresponding to substrate A from the storage means and uses that feedback correction value to correct the mounting operation by the component mounting device 2. Furthermore, the feedback correction values ​​stored in the memory can be updated inline using new feedback correction values ​​obtained sequentially during substrate production. Here, the update can be performed not only by simple substitution of feedback correction values, but also by methods such as moving averages.

[0018] On the other hand, if the feedback correction value associated with the production data corresponding to the product to be produced is not stored in the storage means, the mounting control means corrects the mounting operation on the first board by the component mounting means 2 in the following procedure. Below, as an example, we will describe the case in which a board D is produced based on the production data D shown in Figure 4.

[0019] (1) From the production data of production items (substrates A to C in Figure 3) stored in the memory means, select the production data of the production item that is most similar to the production data of the production item to be produced (substrate D). In this embodiment, the production data of the product with the most similar substrate size is selected. This is because, generally, the higher the similarity of substrate sizes, the higher the similarity of the mounting paths. Therefore, in this embodiment, the production data of substrate A, which is most similar in size to substrate D, is selected. Note that the criteria for determining the similarity of production data of product items are not limited to substrate size alone; the number of mounting points, the distribution of XY positions, or the distribution of component sizes can also be used as criteria, either individually or in combination.

[0020] (2) The mountable area of ​​the component mounting means 2 is divided into rectangles of a certain size, and an index is assigned to each division to form a mounting index area. Figure 5 conceptually illustrates the mounting index area. As shown in the figure, the mounting index area is a division of the mountable area of ​​the component mounting means 2 into rectangles of a certain size (e.g., 25 mm square), with each division assigned an index. For example, area I in Figure 5 is indicated by index (2,3), and area II is indicated by index (2,4).

[0021] (3) Based on the XY position information of each mounting point included in the reference production data (production data A in this embodiment), which is the production data selected in (1) above, the mounting information including the XY position information of each mounting point is classified for each mounting index area. Figure 6A conceptually illustrates an example of this classification. Implementing points 1 and 2, included in production data A shown in Figure 3, are classified into area I shown in Figure 5, while implementing points 3 and 4 are classified into area II shown in Figure 5.

[0022] (4) Based on the XY position information of each mounting point included in the new production data (production data D in this embodiment), which is the production data of the product to be produced, the mounting information including the XY position information of each mounting point is classified into mounting index areas. Figure 6B conceptually illustrates an example of this classification. Implementing points 1 and 2, included in production data D shown in Figure 4, are classified into area I shown in Figure 5, while implementing points 3 and 4 are classified into area II shown in Figure 5.

[0023] (5) For each implementation index area, compare the reference implementation information, which is the implementation information for each implementation point included in the reference production data, with the new implementation information, which is the implementation information for each implementation point included in the new production data. In this embodiment, the reference production data is production data A, and the reference implementation information is as shown in Figure 3. In addition, in this embodiment, the new production data is production data D, and the new implementation information is as shown in Figure 4. That is, in this embodiment, the implementation information of production data A shown in Figure 3 and the implementation information of production data D shown in Figure 4 are compared for each implementation index area.

[0024] (6-1) In the implementation index area where the reference implementation information (implementation information of production data A) and the new implementation information (implementation information of production data D) match as a result of the comparison in (5) above, the implementation operation by the component implementation means 2 is corrected using the feedback correction value of each implementation point associated with the reference production data. (6-2) In the implementation index area where the reference implementation information (implementation information of production data A) and the new implementation information (implementation information of production data D) do not match as a result of the comparison in (5) above, The average value of the feedback correction value for each implementation point associated with the reference implementation information within the implementation index area. The mounting operation by component mounting means 2 is corrected using this method. In this embodiment, in area I shown in Figure 5, the implementation information of production data A (implementation information of implementation points 1 and 2) and the implementation information of production data D (implementation information of implementation points 1 and 2), which are classified in area I, match, as can be seen by referring to Figures 3 and 4. Therefore, in area I, the implementation control means corrects the implementation operation by the component implementation means 2 using the feedback correction values ​​of implementation points 1 and 2 associated with production data A. On the other hand, in Area II shown in Figure 5, the implementation information of production data A (implementation information of implementation points 3 and 4) and the implementation information of production data D (implementation information of implementation points 3 and 4), which are classified as Area II, do not match, as can be seen by referring to Figures 3 and 4. That is, although the implementation information of implementation point 3 in production data A and the implementation information of implementation point 3 in production data D match, the implementation information of implementation point 4 in production data A and the implementation information of implementation point 4 in production data D do not match because their X and Y positions are different. Therefore, in Area II, the implementation control means corrects the implementation operation by the component implementation means 2 using the average value of the feedback correction values ​​of implementation points 3 and 4 associated with production data A. Here, if the number of feedback correction values ​​to average, i.e., the number of implementation points, is 1, then that feedback correction value is used as the average value.

[0025] To summarize, the feedback correction values ​​for the first production run of the new product, circuit board D, are as shown in Figure 7, and the component mounting means uses these feedback correction values ​​to correct the mounting operation on the first circuit board D by the component mounting means 2. Furthermore, if the implementation information for production data A is not present in the implementation index area where the implementation information for production data D is classified, the implementation control means will either not use a feedback correction value in that implementation index area at the start of the first production run, or will use a separately set provisional feedback correction value to correct the implementation operation by the component implementation means 2.

[0026] Once the production of the first substrate D is complete, a feedback correction value calculated by the correction value calculation means is obtained. This feedback correction value is highly accurate because it is obtained from the actual production of substrate D. Therefore, in this embodiment, once the feedback correction value is obtained from the production of the first substrate D, the feedback correction value used during the production of the first substrate D, which is stored in the storage means, is replaced with the feedback correction value obtained from the production of the first substrate D and stored in the storage means. Subsequently, the feedback correction value stored in the storage means can be updated inline using new feedback correction values ​​obtained sequentially as the production of substrate D progresses. Here, the update can be performed not only by simple replacement of the feedback correction value, but also by methods such as moving averages.

[0027] As described above, in this embodiment, the feedback correction value for each mounting point is managed for each production data, or in other words, the feedback correction value for each mounting point is managed in association with the production data. Therefore, the influence of the aforementioned mounting path on the mounting position accuracy of the component can be eliminated or reduced, and the mounting position accuracy can be improved. Furthermore, in this embodiment, when producing substrates for a new product, the mounting operation is corrected from the first board. Specifically, the production data of the product that is most similar to the production data of the new product is selected, and then the correction of the feedback correction value is considered for each mounting index area. The reason for this is that if the mounting index areas are the same, the similarity of the mounting paths described above will be high. Thus, according to this embodiment, when producing substrates for a new product, the mounting operation can be corrected with high accuracy from the first board, and from this point of view as well, the mounting position accuracy can be improved.

[0028] Although embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and it will be obvious to those skilled in the art that various modifications and changes are possible without departing from the technical spirit of the present invention. For example, in this embodiment, the feedback correction value consists of four correction values: an X position correction value, a Y position correction value, a Z position correction value, and an angle correction value, but at least two correction values, the X position correction value and the Y position correction value, are sufficient.

[0029] Furthermore, the type of mounting head is not limited to a rotary head type; for example, a mounting head that does not rotate in the R direction, such as the one disclosed in Patent Document 1, may also be used. However, according to tests conducted by the inventors, the influence of the above-mentioned mounting path on the mounting position accuracy of the components becomes greater with a rotary head type mounting head that rotates in the R direction. Therefore, the electronic component mounting system of the present invention is particularly effective when it includes a rotary head type mounting head. [Explanation of symbols]

[0030] 1. Electronic component mounting system 2,2A,2B Component mounting device (component mounting means) 3. Parts position inspection device 4. Communication Network 5. Management Computer 10 Mounting Head 20 Head Body 21 R servo motor 22 T servo motor 23 Z servo motor (first lifting / lowering means) 30 Rotary Heads 31,31a Spindle 32 Nozzles (parts suction devices)

Claims

1. A component mounting means that sequentially mounts multiple electronic components in a predetermined order at predetermined mounting points on a circuit board, based on production data created for each production item that indicates the type of circuit board to be produced, Mounting control means for controlling the mounting operation of mounting electronic components onto a substrate by the component mounting means, A positional deviation amount acquisition means for acquiring the positional deviation amount of each electronic component mounted on the substrate by the component mounting means from the regular mounting point, A correction value calculation means calculates a feedback correction value for each mounting point to correct the mounting operation of the component mounting means based on the positional deviation amount obtained by the positional deviation amount acquisition means, The system includes a storage means for storing the feedback correction value calculated by the correction value calculation means in association with the production data, The aforementioned implementation control means searches whether a feedback correction value associated with production data corresponding to the product to be produced is stored in the storage means at the start of production. If stored, the feedback correction value is used to correct the mounting operation by the component mounting means. An electronic component mounting system that, if not stored in memory, corrects the mounting operation on the first circuit board by the component mounting means in the following procedure. (1) From the production data of production items stored in the storage means, select the production data of the production item that is most similar to the production data of the production item to be produced. (2) The mountable area of ​​the component mounting means is divided into rectangles of a certain size, and an index is assigned to each division to form a mounting index area. (3) The production data selected in (1) above (hereinafter referred to as "reference production data"). Based on the XY position information of each implementation point included in the above, the implementation information including the XY position information of each implementation point is classified for each implementation index area. (4) Based on the XY position information of each mounting point included in the production data of the product to be produced (hereinafter referred to as "new production data"), the mounting information including the XY position information of each mounting point is classified for each mounting index area. (5) For each of the implementation index areas, compare the implementation information for each implementation point included in the reference production data (hereinafter referred to as "reference implementation information") with the implementation information for each implementation point included in the new production data (hereinafter referred to as "new implementation information"). (6-1) In the mounting index area where the reference mounting information and the new mounting information match as a result of the comparison in (5) above, the mounting operation by the component mounting means is corrected using the feedback correction value of each mounting point associated with the reference production data. (6-2) In the case of an implementation index area where the reference implementation information and the new implementation information do not match as a result of the comparison in (5) above, the implementation operation by the component implementation means is corrected using the average value of the feedback correction values ​​of each implementation point associated with the reference implementation information within that implementation index area.

2. The electronic component mounting system according to claim 1, wherein the mounting control means selects production data for the production item with the most similar substrate size in (1).

3. The electronic component mounting system according to claim 1 or 2, wherein the component mounting means includes a rotary head type mounting head.

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