Resin compositions, pellets, and molded articles

Abstract

To provide a resin composition that has superior flame retardancy and a high load deflection temperature, a pellet using the resin composition, and a molded article.SOLUTION: A resin composition contains (c) 15-20 pts.mass of a flame retardant and (d) 0.4-3.0 pts.mass of an NOR hindered amine photostabilizer based on 100 pts.mass of the sum total of (a) 85-100 mass% of a polyphenylene ether resin and (b) 0-15 mass% of a styrenic resin.SELECTED DRAWING: None

Description

[Technical Field]

[0001] This invention relates to resin compositions, pellets, and molded articles. In particular, it relates to resin compositions having polyphenylene ether resin as a main component. [Background technology]

[0002] Resin compositions based on polyphenylene ether resin (hereinafter sometimes referred to as "polyphenylene ether resin compositions") possess characteristics such as heat resistance, electrical properties, dimensional stability, impact resistance, and low specific gravity. Furthermore, because polyphenylene ether resin compositions can achieve flame retardancy without using halogen compounds or antimony compounds, which have a significant environmental impact, they are widely used in various applications such as electrical and electronic components, office equipment parts, automotive parts, building materials, and various other exterior materials and industrial products.

[0003] An example of a polyphenylene ether resin composition is described in Patent Document 1, for example. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2022-074542 [Overview of the Initiative] [Problems that the invention aims to solve]

[0005] Generally, adding flame retardants to polyphenylene ether resins improves their flame retardancy. However, there are cases where even greater flame retardancy is required. Furthermore, when inorganic fillers are incorporated, the flame retardancy may not be fully realized even with the addition of flame retardants. Furthermore, depending on the application of the polyphenylene ether resin composition, the temperature of deflection under load may be required. The present invention aims to solve these problems and to provide a resin composition that is excellent in flame retardancy and has a high temperature of deflection under load, as well as pellets and molded articles using the resin composition. [Means for solving the problem]

[0006] Based on the above-mentioned problems, the inventors conducted research and found that the above-mentioned problems can be solved by combining a flame retardant with a NOR-type hindered amine antioxidant in a polyphenylene ether resin. Specifically, the above problem was solved by the following means. <1> A resin composition comprising (a) 85 to 100% by mass of polyphenylene ether resin and (b) 0 to 15% by mass of styrene resin, totaling 100 parts by mass, (c) 15 to 20 parts by mass of flame retardant, and (d) 0.4 to 3.0 parts by mass of NOR-type hindered amine light stabilizer. <2> The (d) NOR-type hindered amine-based light stabilizer comprises a structure represented by formula (HALS), <1> The resin composition described above. [ka] (In formula (HALS), R is an organic group. x (where m is an alkyl group with 1 to 5 carbon atoms, m is an integer from 0 to 4, and * indicates the bonding position with other sites.) <3> The styrene-based resin includes high-impact polystyrene. <1> or <2> The resin composition described above. <4> Furthermore, the mixture contains 10 to 60 parts by mass of (e) an inorganic filler, with a total of 100 parts by mass of (a) 85 to 100% by mass of polyphenylene ether resin and (b) 0 to 15% by mass of styrene resin. <1> ~ <3> A resin composition as described in any one of the following. <5> The aforementioned (c) flame retardant includes a phosphorus-based flame retardant. <1> ~ <4> A resin composition as described in any one of the following. <6> The mass ratio (d) / (c) of the aforementioned (c) flame retardant and (d) NOR-type hindered amine light stabilizer is 0.02 to 0.2. <1> ~ <5> A resin composition as described in any one of the following. <7>said (d) NOR-type hindered amine light stabilizer comprises a structure represented by formula (HALS), said styrenic resin comprises high-impact polystyrene, the resin composition further comprises 10 to 60 parts by mass of (e) an inorganic filler based on 100 parts by mass of the total of (a) 85 to 100% by mass of the polyphenylene ether resin and (b) 0 to 15% by mass of the styrenic resin, said (c) flame retardant comprises a phosphorus-based flame retardant, the resin composition according to <1>, wherein a mass ratio (d) / (c) of said (c) flame retardant to said (d) NOR-type hindered amine light stabilizer is 0.02 to 0.2.

Chemical Formula

Effects of the Invention

[0007] According to the present invention, it has become possible to provide a resin composition excellent in flame retardancy and having a high deflection temperature under load, as well as a pellet and a molded article using the resin composition.

Mode for Carrying Out the Invention

[0008] Hereinafter, a mode for carrying out the present invention (hereinafter simply referred to as "the present embodiment") will be described in detail. The following present embodiment is an example for describing the present invention, and the present invention is not limited to only the present embodiment. In this specification, "~" is used to mean that the numbers before and after it are included as the lower and upper limits, respectively. In this specification, all physical properties and characteristic values ​​shall be those at 23°C unless otherwise specified. If the measurement methods, etc., described in the standards shown herein differ from year to year, unless otherwise specified, the standards as of January 1, 2022 shall apply.

[0009] The resin composition of this embodiment is characterized by containing (a) 85 to 100% by mass of polyphenylene ether resin and (b) 0 to 15% by mass of styrene resin, totaling 100 parts by mass, (c) 15 to 20 parts by mass of flame retardant and (d) 0.4 to 3.0 parts by mass of NOR-type hindered amine light stabilizer. By using this configuration, a resin composition with excellent flame retardancy and a high deflection temperature can be obtained. This is presumed to be because the NOR-type hindered amine light stabilizer traps hydroxyl radicals generated during the combustion of the resin and inhibits the progress of the combustion cycle by acting on multiple radical species generated during thermal decomposition, thereby improving flame retardancy. In contrast, even with the same hindered amine light stabilizer, the NH type is presumed to be less likely to contribute to improving flame retardancy because it cannot trap hydroxyl radicals unless it is oxidized itself to become a nitroxol radical and then captures alkyl radicals. Furthermore, by using the NOR-type hindered amine light stabilizer and the flame retardant in combination, the flame retardant effects of each are exhibited more effectively. Therefore, it becomes possible to minimize the amount of flame retardant added, which causes a decrease in the load deflection temperature of the resin composition, and as a result, a resin composition that possesses both high levels of flame retardancy and load deflection temperature can be obtained. The details of the present invention will be described below.

[0010] (a) Polyphenylene ether resin As the (a) polyphenylene ether resin used in the resin composition of the present embodiment, a known polyphenylene ether resin can be used, and for example, a polymer having a constitutional unit represented by the following formula in the main chain is exemplified. (a) The polyphenylene ether resin may be either a homopolymer or a copolymer.

[0011]

Chemical Formula

[0012] R a and R b are each independently preferably a hydrogen atom, a primary or secondary alkyl group, or an aryl group. Preferable examples of primary alkyl groups include a methyl group, an ethyl group, an n-propyl group, an n-butyl group, an n-amyl group, an isoamyl group, a 2-methylbutyl group, a 2,3-dimethylbutyl group, a 2-, 3- or 4-methylpentyl group, and a heptyl group. Preferable examples of secondary alkyl groups include an isopropyl group, a sec-butyl group, and a 1-ethylpropyl group. In particular, R a is preferably a primary or secondary alkyl group having 1 to 4 carbon atoms or a phenyl group. R b is preferably a hydrogen atom.

[0013] Suitable homopolymers of (a) polyphenylene ether resins include, for example, polymers of 2,6-dialkylphenylene ethers such as poly(2,6-dimethyl-1,4-phenylene ether), poly(2,6-diethyl-1,4-phenylene ether), poly(2,6-dipropyl-1,4-phenylene ether), poly(2-ethyl-6-methyl-1,4-phenylene ether), and poly(2-methyl-6-propyl-1,4-phenylene ether). Examples of copolymers include 2,6-dimethylphenol / 2,3,6-trimethylphenol copolymers, 2,6-dimethylphenol / 2,3,6-triethylphenol copolymers, 2,6-diethylphenol / 2,3,6-trimethylphenol copolymers, 2,6-dipropylphenol / 2,3,6-trimethylphenol copolymers, and other 2,6-dialkylphenol / 2,3,6-trialkylphenol copolymers; graft copolymers obtained by graft polymerization of styrene onto poly(2,6-dimethyl-1,4-phenylene ether); and graft copolymers obtained by graft polymerization of styrene onto 2,6-dimethylphenol / 2,3,6-trimethylphenol copolymers.

[0014] In this embodiment, (a) the polyphenylene ether resin is particularly preferably poly(2,6-dimethyl-1,4-phenylene ether) and 2,6-dimethylphenol / 2,3,6-trimethylphenol random copolymer. In addition, polyphenylene ether resins with specified terminal group numbers and copper content, as described in Japanese Patent Application Publication No. 2005-344065, can also be suitably used.

[0015] (a) The polyphenylene ether resin preferably has an intrinsic viscosity of 0.2 to 0.8 dL / g, and more preferably 0.3 to 0.6 dL / g, measured in chloroform at 30°C. Increasing the intrinsic viscosity to 0.2 dL / g or higher tends to improve the mechanical strength of the resin composition, while decreasing it to 0.8 dL / g or lower tends to improve fluidity and make molding easier. Alternatively, two or more (a) polyphenylene ether resins with different intrinsic viscosities may be used in combination to achieve this range of intrinsic viscosity.

[0016] The method for producing the polyphenylene ether resin (a) used in this embodiment is not particularly limited, and a known method can be employed, for example, by oxidative polymerization of a monomer such as 2,6-dimethylphenol in the presence of an amine copper catalyst. In this case, the intrinsic viscosity can be controlled to a desired range by selecting the reaction conditions. Control of the intrinsic viscosity can be achieved by selecting conditions such as polymerization temperature, polymerization time, and catalyst amount.

[0017] The content of (a) polyphenylene ether resin in the resin composition of this embodiment is preferably 30% by mass, more preferably 35% by mass or more, even more preferably 40% by mass or more, even more preferably 45% by mass or more, and even more preferably 50% by mass or more. Setting it above the lower limit effectively brings out the excellent properties inherent in polyphenylene ether resin, such as heat resistance, flame retardancy, and dimensional stability, and tends to further improve the various properties of the resin composition. Furthermore, the content of (a) polyphenylene ether resin in the resin composition of this embodiment is preferably 70% by mass or less, more preferably 65% ​​by mass or less, and even more preferably 60% by mass or less. Setting it below the upper limit improves the fluidity of the resin composition and tends to improve moldability during injection molding. The resin composition of this embodiment may contain only one type of polyphenylene ether resin, or it may contain two or more types. When it contains two or more types, it is preferable that the total amount is within the above range.

[0018] (b) Styrene resin The resin composition of this embodiment may contain a styrene-based resin. Including a styrene-based resin tends to improve the fluidity and impact resistance of the resin composition. Examples of styrene-based resins include polymers of styrene monomers, copolymers of styrene monomers with other copolymerizable monomers, and styrene-based graft copolymers.

[0019] Examples of styrene-based resins used in this embodiment include polystyrene resin (PS), high-impact polystyrene (also known as rubber-modified styrene resin, high-impact polystyrene, or HIPS), acrylonitrile-styrene copolymer (AS resin), acrylonitrile-butadiene-styrene copolymer (ABS resin), methyl methacrylate-acrylonitrile-butadiene-styrene copolymer (MABS resin), acrylonitrile-acrylic rubber-styrene copolymer (AAS resin), acrylonitrile-ethylene propylene-rubber-styrene copolymer (AES resin), styrene-IPN (Inter Penetration Network) type rubber copolymer, or mixtures thereof. The styrene-based resin used in this embodiment more preferably contains high-impact polystyrene. The high-impact polystyrene used in this embodiment is obtained, for example, by polymerizing at least a styrene monomer in the presence of rubber. In high-impact polystyrene, fine rubber-like particles are blended or graft-polymerized into a matrix of styrene-based polymers. Examples of rubbers include polybutadiene, styrene-butadiene copolymer, polyisoprene, and ethylene-propylene copolymer. Examples of styrene-based polymers include polystyrene and copolymers of styrene with other copolymerizable monomers, with polystyrene being preferred. Examples of styrene-based polymers include polymers consisting of repeating units represented by the following formula, and copolymers of styrene with other copolymerizable monomers containing 50% by mass or more of the repeating units represented by the following formula.

[0020] [ka] (In the formula, R represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, Z represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a halogen atom, and n is an integer from 1 to 5.) Examples of monomers other than styrene include vinyl monomers such as acrylonitrile and methyl methacrylate.

[0021] The content of the rubbery polymer component in high-impact polystyrene is preferably 1% by mass or more, more preferably 3% by mass or more, and more preferably 40% by mass or less, and even more preferably 30% by mass or less. Furthermore, if monomer components other than styrene monomers are included, the sum of the content of the rubbery polymer component and the styrene monomer component in high-impact polystyrene is preferably 90% by mass or more, and more preferably 95% by mass or more.

[0022] The melt flow rate (MFR), which reflects the molecular weight of high-impact polystyrene, is preferably in the range of 0.5 to 15 g / 10 min, and more preferably in the range of 1.0 to 10 g / 10 min, when measured under conditions of a temperature of 200°C and a load of 5 kg. The weight-average molecular weight of high-impact polystyrene is preferably 50,000 or more, more preferably 100,000 or more, preferably 500,000 or less, and more preferably 300,000 or less. An example of a commercially available high-impact polystyrene product is HT478, manufactured by PS Japan. Furthermore, the resin composition of this embodiment may contain only one type of (b) styrene-based resin, or it may contain two or more types.

[0023] <(a) Blend form of polyphenylene ether resin and (b) styrene-based resin> The resin composition of this embodiment contains (a) polyphenylene ether resin and (b) styrene resin in a ratio of 85 to 100% by mass of (a) polyphenylene ether resin and 0 to 15% by mass of (b) styrene resin. Preferably, the ratio of (a) polyphenylene ether resin to 100% by mass of the total of (a) polyphenylene ether resin and (b) styrene resin is 88% by mass or more, more preferably 92% by mass or more, even more preferably 94% by mass or more, even more preferably 96% by mass or more, and even more preferably 98% by mass or more. Setting it above the lower limit tends to result in a higher load deflection temperature. Preferably, the upper limit of the ratio of (a) polyphenylene ether resin to 100% by mass of the total of (a) polyphenylene ether resin and (b) styrene resin is 100% by mass or less.

[0024] In the resin composition of this embodiment, the total amount of (a) polyphenylene ether resin and (b) styrene resin is preferably 35% by mass or more, more preferably 40% by mass or more, even more preferably 45% by mass or more, even more preferably 50% by mass or more, and even more preferably 55% by mass or more. Furthermore, the total amount of (a) polyphenylene ether resin and (b) styrene resin is preferably 90% by mass or less, more preferably 80% by mass or less, even more preferably 75% by mass or less, even more preferably 70% by mass or less, and even more preferably 65% ​​by mass or less.

[0025] <(c) Flame retardant> The resin composition of this embodiment contains a flame retardant. By including a flame retardant, a resin composition with excellent flame retardancy can be obtained. The type of flame retardant (c) used in this embodiment is not particularly specified, and phosphorus-based flame retardants, halogen-based flame retardants, organometallic flame retardants, etc., can be used, with phosphorus-based flame retardants being preferred and condensed phosphoric acid-based flame retardants being more preferred.

[0026] Examples of phosphorus-based flame retardants include ethyl phosphinate metal salts, diethyl phosphinate metal salts, polyphosphate melamine, condensed phosphate esters, and phosphazene compounds. Among these, condensed phosphate esters or phosphazene are preferred, and condensed phosphate esters are more preferred. The molecular weight of the phosphorus-based flame retardant is preferably 300 or more, more preferably 500 or more, preferably 1500 or less, more preferably 1200 or less, and even more preferably 1000 or less.

[0027] The condensed phosphate ester is preferably a compound represented by the following formula (1). Formula (1) [ka] (In formula (1), R1, R2, R3, and R4 each independently represent a hydrogen atom or an organic group, except when R1, R2, R3, and R4 are all hydrogen atoms. X represents a divalent organic group, and r represents an integer from 1 to 3.)

[0028] In formula (1) above, the organic group is, for example, an alkyl group (e.g., an alkyl group having 1 to 5 carbon atoms), a cycloalkyl group (e.g., a cycloalkyl group having 6 to 12 carbon atoms), or an aryl group (e.g., an aryl group having 6 to 12 carbon atoms), with or without substituents, and an aryl group is preferred. Examples of substituents include alkyl groups, alkoxy groups, alkylthio groups, aryl groups, aryloxy groups, arylthio groups, halogen atoms, aryl halides, etc., and alkyl groups are preferred. Groups are also possible combinations of these substituents, or groups obtained by bonding these substituents with oxygen atoms, sulfur atoms, nitrogen atoms, etc. A divalent organic group is a group with two or more valents that can be obtained by removing one hydrogen atom from the above organic group. Examples include alkylene groups (e.g., alkylene groups having 1 to 5 carbon atoms), phenylene groups, substituted phenylene groups (e.g., phenylene groups which may be substituted with alkyl groups having 1 to 5 carbon atoms), and polynuclear phenylene groups derived from bisphenols. In this embodiment, in formula (1), R1, R2, R3, and R4 are preferably phenyl groups which may each be independently substituted with an alkyl group having 1 to 5 carbon atoms (preferably a methyl group). In formula (1), X is preferably a phenylene group or a group consisting of a phenylene group and an alkylene group. In formula (1), r is preferably 1 or 2, and more preferably 1. The compound represented by formula (1) may be a mixture of compounds in which r is 1 to 3.

[0029] Specific examples of condensed phosphate esters represented by formula (1) above include, for example, trimethyl phosphate, triethyl phosphate, tributyl phosphate, trioctyl phosphate, triphenyl phosphate, tricresyl phosphate, tricresylphenyl phosphate, octyldiphenyl phosphate, diisopropylphenyl phosphate, tris(chloroethyl) phosphate, tris(dichloropropyl) phosphate, tris(chloropropyl) phosphate, and bi Examples include various types such as s(2,3-dibromopropyl)phosphate, bis(2,3-dibromopropyl)-2,3-dichlorophosphate, bis(chloropropyl)monoctylphosphate, bisphenol A tetraphenyl phosphate, bisphenol A tetracresyl diphosphate, bisphenol A tetraxylyl diphosphate, hydroquinone tetraphenyl diphosphate, hydroquinone tetracresyl phosphate, and hydroquinone tetraxylyl diphosphate. Furthermore, commercially available condensed phosphate esters are readily available, for example, sold under product names such as "CR733S" (resorcinol bis(diphenyl phosphate)), "CR741" (bisphenol A bis(diphenyl phosphate)), and "PX-200" (resorcinol bis(dixylenyl phosphate)) by Daihachi Chemical Industry Co., Ltd., and "ADEKA Stab FP-900L" (phosphate ester of 1,1'-biphenyl)-4,4'-diol and phenol) by ADEKA Corporation.

[0030] A phosphazene compound is an organic compound having a -P=N- bond in its molecule, and is preferably at least one compound selected from the group consisting of a cyclic phosphazene compound represented by formula (2), a linear phosphazene compound represented by formula (3), and a crosslinked phosphazene compound obtained by crosslinking at least one phosphazene compound selected from the group consisting of formulas (2) and (3) with a crosslinking group.

[0031] Formula (2) [ka] In equation (2), a is an integer between 3 and 25, and R 1 and R 2 These may be the same or different groups and represent an alkyl group, cycloalkyl group, alkenyl group, alkynyl group, aryloxy group, amino group, hydroxy group, aryl group, or alkylaryl group.

[0032] Formula (3) [ka] In equation (3), b is an integer between 3 and 10000, and R 3 and R 4 These may be the same or different groups and represent an alkyl group, cycloalkyl group, alkenyl group, alkynyl group, aryloxy group, amino group, hydroxy group, aryl group, or alkylaryl group. R 5 -N=P(OR 3 )3 units, -N=P(OR 4 )3 units, -N=P(O)OR 3 Base, -N=P(O)OR 4 It shows at least one selected from the elements, R 6 -P(OR 3 ) 4 units, -P(OR 4 ) 4 units, -P(O)(OR 3 )2 units, -P(O)(OR 4 ) Indicates at least one type selected from the two units.

[0033] In formulas (2) and (3) above, examples of alkyl groups include methyl, ethyl, propyl, isopropyl, butyl, t-butyl, pentyl, hexyl, octyl, decyl, and dodecyl groups. C1-C6 alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, t-butyl, pentyl, and hexyl groups are preferred, and C1-C4 alkyl groups such as methyl, ethyl, and propyl groups are particularly preferred.

[0034] Examples of cycloalkyl groups include cyclopentyl groups and cyclohexyl groups, which have 5 to 14 carbon atoms, with cycloalkyl groups having 5 to 8 carbon atoms being preferred.

[0035] Examples of alkenyl groups include C2-C8 alkenyl groups such as vinyl groups and allyl groups. Examples of cycloalkenyl groups include C5-C12 cycloalkenyl groups such as cyclopentyl groups and cyclohexyl groups.

[0036] Examples of alkynyl groups include alkynyl groups with 2 to 8 carbon atoms, such as ethynyl and propynyl groups, and alkynyl groups having aryl groups as substituents, such as ethynylbenzene groups.

[0037] Examples of aryl groups include aryl groups having 6 to 20 carbon atoms, such as phenyl group, methylphenyl (i.e., tolyl) group, dimethylphenyl (i.e., xylyl) group, trimethylphenyl group, and naphthyl group. Among these, aryl groups having 6 to 10 carbon atoms are preferred, and phenyl groups are particularly preferred.

[0038] Examples of alkylaryl groups include aralkyl groups having 6 to 20 carbon atoms, such as benzyl, phenethyl, and phenylpropyl groups, but aralkyl groups having 7 to 10 carbon atoms are preferred, and benzyl groups are particularly preferred.

[0039] In particular, R in equation (2) 1 and R 2, R in equation (3) 3 and R 4 However, those that are aryl groups or arylalkyl groups are preferred. By using such aromatic phosphazenes, the thermal stability of the thermoplastic resin composition can be effectively enhanced. From this viewpoint, the above R 1 , R 2 , R 3 and R 4 It is more preferably an aryl group, and particularly preferably a phenyl group.

[0040] Examples of cyclic and / or linear phosphazene compounds represented by formulas (2) and (3) include (poly)tolyloxyphosphazene such as phenoxyphosphazene, o-tolyloxyphosphazene, m-tolyloxyphosphazene, and p-tolyloxyphosphazene, (poly)xyloxyphosphazene such as o,m-xylyloxyphosphazene, o,p-xylyloxyphosphazene, and m,p-xylyloxyphosphazene, o,m,p-trimethylphenyloxyphosphazene, and phenoxyo-tolyloxyphosphazene. Examples include (poly)phenoxytolyloxyphosphazenes such as phazene, phenoxy m-tolyloxyphosphazene, and phenoxy p-tolyloxyphosphazene, (poly)phenoxytolyloxyxyloxyphosphazenes such as phenoxy o,m-xylyloxyphosphazene, phenoxy o,p-xylyloxyphosphazene, and phenoxy m,p-xylyloxyphosphazene, and phenoxy o,m,p-trimethylphenyloxyphosphazene, preferably cyclic and / or linear phenoxyphosphazenes.

[0041] As a cyclic phosphazene compound represented by formula (2), R 1 and R 2Cyclic phenoxyphosphazenes in which a is a phenyl group are particularly preferred. Examples of such cyclic phenoxyphosphazene compounds include phenoxycyclotriphosphazene, octaphenoxycyclotetraphosphazene, and decaffenoxycyclopentaphosphazene, which are obtained by reacting ammonium chloride and phosphorus pentachloride at a temperature of 120 to 130°C to obtain a mixture of cyclic and linear chlorophosphazene, from which cyclic chlorophosphazene such as hexachlorocyclotriphosphazene, octachlorocyclotetraphosphazene, and decachlorocyclopentaphosphazene are isolated and then substituted with a phenoxy group. Furthermore, the cyclic phenoxyphosphazene compound is preferably a compound in which a in formula (2) is an integer from 3 to 8, and may be a mixture of compounds with different values ​​of a.

[0042] The average of a above is preferably 3 to 5, and more preferably 3 to 4. In particular, a mixture of compounds in which a=3 accounts for 50% by mass or more, a=4 accounts for 10 to 40% by mass, and a=5 or higher accounts for a total of 30% by mass or less is preferred.

[0043] As a chain-like phosphazene compound represented by formula (3), R 3 and R 4 A linear phenoxyphosphazene in which is a phenyl group is particularly preferred. Examples of such linear phenoxyphosphazene compounds include compounds obtained by oxidative polymerization of hexachlorocyclotriphosphazene obtained by the above method at a temperature of 220 to 250°C, and substituting the resulting linear dichlorophosphazene with a degree of polymerization of 3 to 10000 with a phenoxy group. In the linear phenoxyphosphazene compound, b in formula (3) is preferably 3 to 1000, more preferably 3 to 100, and even more preferably 3 to 25.

[0044] Examples of crosslinked phosphazene compounds include compounds having a 4,4'-diphenylene group crosslinking structure, such as compounds having a 4,4'-sulfonyldiphenylene (i.e., bisphenol S residue) crosslinking structure, compounds having a 2,2-(4,4'-diphenylene)isopropylidene group crosslinking structure, compounds having a 4,4'-oxydiphenylene group crosslinking structure, and compounds having a 4,4'-thiodiphenylene group crosslinking structure, as well as compounds having a 4,4'-diphenylene group crosslinking structure.

[0045] Furthermore, as a crosslinked phosphazene compound, R in formula (2) 1 , R 2 A crosslinked phenoxyphosphazene compound obtained by crosslinking a cyclic phenoxyphosphazene compound in which is a phenyl group with the above crosslinking group, or in formula (3) above, R 3 , R 4 A crosslinked phenoxyphosphazene compound, in which a linear phenoxyphosphazene compound having a phenyl group is crosslinked by the above crosslinking group, is preferred from the viewpoint of flame retardancy, and a crosslinked phenoxyphosphazene compound, in which a cyclic phenoxyphosphazene compound is crosslinked by the above crosslinking group, is more preferred. Furthermore, the phenylene group content in the crosslinked phenoxyphosphazene compound is typically 50 to 99.9%, preferably 70 to 90%, based on the total number of phenyl and phenylene groups in the cyclic phosphazene compound represented by formula (2) and / or the linear phenoxyphosphazene compound represented by formula (3). It is also particularly preferable that the crosslinked phenoxyphosphazene compound does not have free hydroxyl groups within its molecule.

[0046] In this embodiment, it is preferable from the viewpoint of flame retardancy and mechanical properties of the thermoplastic resin composition that the phosphazene compound is selected from the group consisting of a cyclic phenoxyphosphazene compound represented by formula (2) and a crosslinked phenoxyphosphazene compound obtained by crosslinking a cyclic phenoxyphosphazene compound represented by formula (3) with a crosslinking group. Examples of commercially available phosphazene compounds include FP-110, manufactured by Fushimi Pharmaceutical Co., Ltd.

[0047] The content of (c) flame retardant in the resin composition of this embodiment is 15 parts by mass or more, preferably 16 parts by mass or more, per 100 parts by mass of the total of (a) polyphenylene ether resin and (b) styrene resin. Setting it above the lower limit tends to further improve flame retardancy. Furthermore, the content of (c) flame retardant is 20 parts by mass or less, preferably 19 parts by mass or less, and more preferably 18 parts by mass or less, per 100 parts by mass of the total of (a) polyphenylene ether resin and (b) styrene resin. Setting it below the upper limit tends to further improve heat resistance. The resin composition of this embodiment may contain only one type of flame retardant, or it may contain two or more types. If it contains two or more types, it is preferable that the total amount is within the above range.

[0048] <(d) NOR-type hindered amine light stabilizers> The resin composition of this embodiment contains (d) a NOR-type hindered amine light stabilizer. By including (d) a NOR-type hindered amine light stabilizer, a resin composition with excellent flame retardancy and a high deflection temperature under load can be obtained. (d) A NOR-type hindered amine light stabilizer is a hindered amine compound in which an OR (where R is an organic group) is bonded to the nitrogen atom of the hindered amine. In this embodiment, (d) the NOR-type hindered amine-based light stabilizer preferably includes a structure represented by formula (HALS). [ka] (In formula (HALS), R is an organic group. x (where m is an alkyl group with 1 to 11 carbon atoms, m is an integer from 0 to 4, and * indicates the bonding position with other sites.) In formula (HALS), R is preferably an alkyl group having 3 to 12 carbon atoms, more preferably a cycloalkyl group having 3 to 10 carbon atoms, and even more preferably a cyclohexyl group. R xIt is preferable that it be a methyl group. m is preferably 0. Formula (HALS) is preferably bonded to a group having a triazine ring or forms an ester bond, and more preferably bonded to a group having a triazine ring.

[0049] In this embodiment, the (d) NOR-type hindered amine-based light stabilizer preferably contains two or more structures represented by formula (HALS) in one molecule, more preferably three or more, even more preferably four or more, and preferably 10 or fewer, more preferably 8 or fewer, and even more preferably 7 or fewer. In this embodiment, the (d) NOR-type hindered amine-based light stabilizer is more preferably represented as follows. [ka] In the above formula, n1 and n2 are each independent integers between 1 and 3, and 1 is preferred. In this embodiment, (d) the molecular weight of the NOR-type hindered amine-based light stabilizer is preferably 600 or more and 5000 or less.

[0050] In this embodiment, the content of (d) NOR-type hindered amine light stabilizer is 0.4 parts by mass or more, preferably 0.5 parts by mass or more, more preferably 0.6 parts by mass or more, even more preferably 0.7 parts by mass or more, and even more preferably 0.8 parts by mass or more, based on 100 parts by mass of the total of (a) polyphenylene ether resin and (b) styrene resin. Setting the content above the lower limit tends to further improve mechanical strength. Furthermore, the upper limit of the content of (d) NOR-type hindered amine light stabilizer is 3.0 parts by mass or less, preferably 2.5 parts by mass or less, even more preferably 2.0 parts by mass or less, even more preferably 1.5 parts by mass or less, and even more preferably 1.0 part by mass or less, based on 100 parts by mass of the total of (a) polyphenylene ether resin and (b) styrene resin. Setting the content below the upper limit tends to further improve mechanical strength and load deflection temperature. The resin composition of this embodiment may contain only one (d)NOR-type hindered amine light stabilizer, or it may contain two or more. When two or more are included, it is preferable that the total amount is within the above range.

[0051] In the resin composition of this embodiment, the mass ratio (d) / (c) of (c) flame retardant to (d) NOR-type hindered amine light stabilizer is preferably 0.02 or higher, more preferably 0.03 or higher, even more preferably 0.04 or higher, and preferably 0.2 or lower, and more preferably 0.1 or lower. By setting it within this range, the effects of this embodiment tend to be exhibited more effectively.

[0052] <(e) Inorganic filler> The resin composition of this embodiment preferably further contains 10 to 60 parts by mass of (e) inorganic filler per 100 parts by mass of the total of (a) polyphenylene ether resin and (b) styrene resin. The inclusion of (e) inorganic filler can increase the mechanical strength of the resulting molded product. Furthermore, when the resin composition contains (e) inorganic filler, in particular fibrous inorganic filler, it is presumed that flammable decomposition gases derived from the resin can easily pass through the gaps between the fibrous inorganic filler and the resin in the molded product. In this embodiment, by incorporating (d) NOR-type hindered amine-based light stabilizer, the combustion reaction in the gas phase can be inhibited, and the generation of gases derived from the decomposition of the resin can be effectively suppressed, thereby effectively increasing the flame retardancy of the resin composition containing inorganic filler, in particular fibrous inorganic filler.

[0053] The (e) inorganic filler that may be included in the resin composition of this embodiment is one that has the effect of improving the mechanical properties of the resin composition obtained by blending it with the resin, and ordinary inorganic fillers for plastics can be used. Preferably, fibrous inorganic fillers such as glass fibers, carbon fibers, basalt fibers, wollastonite, and potassium titanate fibers can be used. In addition, granular or amorphous fillers such as calcium carbonate, titanium oxide, feldspar minerals, clay, organic clay, and glass beads; plate-like fillers such as talc; and flaky inorganic fillers such as glass flakes, mica, and graphite can also be used. Among these, fibrous fillers, especially glass fibers, are preferred from the viewpoint of mechanical strength and heat resistance. As for glass fibers, either a round cross-sectional shape or an irregular cross-sectional shape can be used. (e) It is more preferable to use inorganic fillers that have been surface-treated with a surface treatment agent such as a coupling agent to improve adhesion with the resin. Glass fibers to which a surface treatment agent has been applied tend to have excellent durability, resistance to humid heat, resistance to hydrolysis, and resistance to thermal shock.

[0054] Any conventionally known surface treatment agent can be used. Specifically, various coupling agents such as aminosilanes, epoxysilanes, allylsilanes, vinylsilanes, and titanates are preferred. Among these, aminosilanes, epoxysilanes, and vinylsilanes are preferred. Specifically, preferred examples include γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, and γ-(2-aminoethyl)aminopropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, vinyltrichlorosilane, vinyltriethoxysilane, and γ-methacryloxypropyltrimethoxysilane. The silane compounds may be used individually or in combination. Furthermore, if necessary, surfaces treated with fatty acid amide compounds, lubricants such as silicone oil, antistatic agents such as quaternary ammonium salts, resins with film-forming ability such as epoxy resins and urethane resins, or mixtures of resins with film-forming ability with heat stabilizers and flame retardants can also be used.

[0055] In this embodiment, glass fibers refer to fibrous inorganic materials, and more specifically, chopped glass fibers are preferred, which are formed by bundling 1,000 to 10,000 glass fibers together and cutting them to a predetermined length. In this embodiment, the glass fibers have a number-average fiber length (length) of 0.5 to 10 mm, and more preferably 1 to 5 mm. By using glass fibers with such a number-average fiber length, the mechanical strength can be further improved. The number-average fiber length is calculated by randomly selecting glass fibers to be measured from an image obtained by observation with an optical microscope, measuring their longest side, and then calculating the number-average fiber length from the obtained measurement values. The observation magnification is set to 20x, and the number of measurements is 1,000 or more. The number-average fiber length generally corresponds to the cut length. Furthermore, the cross-section of the glass fiber may be circular, elliptical, oblong, rectangular, a rectangle with semicircles attached to both short sides, or cocoon-shaped, but a circular shape is preferred. Here, "circular" includes not only a circular shape in the geometric sense, but also what is commonly referred to as circular in the technical field of this embodiment. The number-average fiber diameter (diameter) of glass fibers is preferably 4.0 μm or more at the lower limit, more preferably 4.5 μm or more, and even more preferably 5.0 μm or more. The upper limit of the number-average fiber diameter of glass fibers is preferably 15.0 μm or less, and more preferably 14.0 μm or less. Using glass fibers having a number-average fiber diameter within this range tends to yield molded products with superior mechanical strength. The number-average fiber diameter of glass fibers is calculated by randomly selecting glass fibers to be measured from an image obtained by observing with an electron microscope, measuring the fiber diameter near the center, and obtaining the measured values. The observation magnification is 1,000x, and the number of measurements is 1,000 or more. For glass fibers with a cross-section other than circular, the number-average fiber diameter is calculated as the number-average fiber diameter when converted to a circle with the same area as the cross-sectional area.

[0056] Glass fibers are generally obtained by melt-spinning supplied glass such as E glass (Electrical glass), C glass (Chemical glass), A glass (Alkali glass), S glass (High strength glass), D glass, and alkali-resistant glass, but any material that can be made into glass fibers can be used and is not particularly limited. In this embodiment, it is preferable to include E glass.

[0057] Glass fibers are available commercially. Examples of commercially available products include T-286H, T-756H, T-127, T-289H, T-852H from Nippon Electric Glass Co., Ltd., DEFT2A from Owens Corning, HP3540 from PPG, and CSG3PA820 from Nitto Boseki Co., Ltd.

[0058] If the resin composition of this embodiment contains (e) an inorganic filler, its content is 10 parts by mass or more, preferably 20 parts by mass or more, more preferably 30 parts by mass or more, even more preferably 35 parts by mass or more, even more preferably 40 parts by mass or more, and even more preferably 45 parts by mass or more, based on 100 parts by mass of the total of (a) polyphenylene ether resin and (b) styrene resin. Setting the content above the lower limit tends to further improve the mechanical strength of the resulting molded product. Furthermore, the upper limit of the inorganic filler content is 60 parts by mass or less, preferably 55 parts by mass or less, based on 100 parts by mass of the total of (a) polyphenylene ether resin (90-100% by mass) and (b) styrene resin (0-10% by mass). Setting the content below the upper limit allows the effects of adding an inorganic filler to be exerted while maintaining moldability without impairing the fluidity of the resin. Furthermore, the content of (e) inorganic filler in the resin composition is preferably 25% by mass or more, more preferably 37% by mass or less, and even more preferably 35% by mass or less. The resin composition of this embodiment may contain (e) only one type of inorganic filler, or it may contain two or more types. If it contains two or more types, it is preferable that the total amount is within the above range.

[0059] <(f) Other stabilizers> The resin composition of this embodiment may contain (f) other stabilizers such as heat stabilizers and antioxidants (hereinafter sometimes simply referred to as "(f) stabilizers"). However, in this invention, (d) NOR-type hindered amine light stabilizers are not included in (f) stabilizers. (f) Examples of stabilizers include phenolic stabilizers, amine stabilizers, phosphorus stabilizers, thioether stabilizers, and inorganic thermal stabilizers such as zinc oxide. In this embodiment, phenolic stabilizers and zinc oxide are preferred. (f) For information on stabilizers, refer to paragraph 0036 of International Publication No. 2019 / 026689 and paragraphs 0044-0046 of Japanese Patent Publication No. 2022-001624, the contents of which are incorporated herein by reference.

[0060] As a phenolic stabilizer, a hindered phenolic stabilizer is preferably used. Specific examples of hindered phenol stabilizers include pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, thiodiethylenebis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], N,N'-hexane-1,6-diylbis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionamide], 2,4-dimethyl-6-(1-methylpentadecyl)phenol, diethyl[[3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]phosphate, and 3,3',3'',5,5',5''-hexa-tert-butyl-a,a',a''-(methylpentadecyl) (2,4,6-triyl)tri-p-cresol, 4,6-bis(octylthiomethyl)-o-cresol, ethylenebis(oxyethylene)bis[3-(5-tert-butyl-4-hydroxy-m-tolyl)propionate], hexamethylenebis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], 1,3,5-tris(3,5-di-tert-butyl) Examples include -4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 2,6-di-tert-butyl-4-(4,6-bis(octylthio)-1,3,5-triazine-2-ylamino)phenol, and 2-[1-(2-hydroxy-3,5-di-tert-pentylphenyl)ethyl]-4,6-di-tert-pentylphenyl acrylate.

[0061] Among these, pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate] and octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate are preferred. Specific examples of such hindered phenol-based stabilizers include, for example, BASF's "Irganox (registered trademark; hereinafter the same) 1010" and "Irganox 1076," and ADEKA's "ADEKA Stab AO-50" and "ADEKA Stab AO-60."

[0062] The content of (f) stabilizer in the resin composition of this embodiment is preferably 0.001 parts by mass or more, more preferably 0.005 parts by mass or more, even more preferably 0.01 parts by mass or more, and even more preferably 0.1 parts by mass or more, per 100 parts by mass of the resin composition, and also preferably 3 parts by mass or less, more preferably 2 parts by mass or less, and even more preferably 1 part by mass or less. By setting the content of (f) stabilizer within the above range, the effect of adding (f) stabilizer is more effectively exerted. The resin composition of this embodiment may contain (f) only one stabilizer or two or more stabilizers. If two or more stabilizers are included, it is preferable that the total amount is within the above range.

[0063] <(g) Coloring agent> The resin composition of this embodiment may contain (g) a coloring agent. By including (g) a coloring agent, the resulting molded product can be given color, which tends to improve its aesthetic appeal. (g) The coloring agent may be a pigment or a dye, but a pigment is preferred. Examples of pigments include inorganic pigments (black pigments such as carbon black, red pigments such as iron oxide red, orange pigments such as molybdate orange, and white pigments such as titanium dioxide) and organic pigments (yellow pigments, orange pigments, red pigments, blue pigments, green pigments, etc.). Inorganic pigments are preferred, black pigments are more preferred, and carbon black is even more preferred. (g) When a coloring agent is incorporated into the resin composition of this embodiment, it may be incorporated in the form of a masterbatch. If the resin composition in this embodiment contains (g) a coloring agent, its content is preferably 0.01 parts by mass or more, more preferably 0.1 parts by mass or more, and even more preferably 0.5 parts by mass or more, per 100 parts by mass of the resin composition. Furthermore, the content of (g) the coloring agent is preferably 10.0 parts by mass or less, more preferably 5.0 parts by mass or less, and even more preferably 3.0 parts by mass or less, per 100 parts by mass of the resin composition. The resin composition of this embodiment may contain only one type of colorant, or it may contain two or more types. If it contains two or more types, it is preferable that the total amount is within the above range.

[0064] <Other ingredients> The resin composition of this embodiment may contain other components besides those mentioned above. Specifically, examples include thermoplastic resins such as polyamide resin, polyester resin, polyphenylene sulfide resin, liquid crystal polyester resin, polycarbonate resin, polyacetal resin, polyacrylonitrile resin, acrylic resin, and polyethylene resin, as well as thermosetting resins such as epoxy resin, melamine resin, and silicone resin. Two or more of these thermoplastic and thermosetting resins can also be used in combination. Furthermore, the resin composition of this embodiment may contain resin additives. Specifically, it may contain internal lubricants (fatty acid metal salts, polyethylene wax, etc.), mold release agents (silicone oil, fatty acids, fatty acid esters, etc.), weather resistance modifiers, nucleating agents, impact resistance modifiers, plasticizers, flowability modifiers, etc. When these components are included, their total content is preferably in the range of 0.01 to 5% by mass of the resin composition.

[0065] The resin composition of this embodiment is prepared so that the total of (a) polyphenylene ether resin, (b) styrene resin, (c) flame retardant, (d) NOR-type hindered amine light stabilizer, and (e) inorganic filler, as well as other components added as needed, amounts to 100% by mass. Furthermore, the resin composition of this embodiment preferably has a total of (a) polyphenylene ether resin, (b) styrene resin, (c) flame retardant, (d) NOR-type hindered amine light stabilizer, and (e) inorganic filler, (f) stabilizer, and (g) pigment accounting for 95% by mass or more, more preferably 97% by mass or more, and even more preferably 99% by mass or more.

[0066] <Method for producing resin compositions> Any method can be used to manufacture the resin composition of this embodiment. For example, one method involves mixing each component, such as (a) polyphenylene ether resin, (b) styrene resin, (c) flame retardant, and (d) NOR-type hindered amine light stabilizer, using a mixing means such as a V-type blender to prepare a single blended product, which is then melt-kneaded in a vented extruder to form pellets. Alternatively, as a two-stage mixing method, some components are first thoroughly mixed, then melt-kneaded in a vented extruder to produce pellets, and then these pellets are mixed with the other components and melt-kneaded in a vented extruder. (e) When inorganic fillers are included, side feeding is permitted.

[0067] <Properties of resin compositions> The resin composition of this embodiment can satisfy the following characteristics in particular. The resin composition of this embodiment preferably has a dead-load deflection temperature (DTUL) of 137°C or higher, more preferably 139°C or higher, even more preferably 140°C or higher, even more preferably 142°C or higher, and even more preferably 144°C or higher, in accordance with ISO-75-1 when molded into an ISO3167:93A type test specimen. The upper limit of the dead-load deflection temperature is not particularly defined, but 170°C or lower is practical, and it may also be 160°C or lower. Such a dead-load deflection temperature is achieved by blending (c) a flame retardant and (d) a NOR-type hindered amine light stabilizer, and by precisely adjusting the blending amounts of (a), (b), (c) the flame retardant and (d) the NOR-type hindered amine light stabilizer, respectively. The resin composition of this embodiment preferably satisfies V-0 in flame retardancy based on a vertical flammability test (UL94V test: 1.5 mmt) using a set of five tubes in accordance with the UL94 standard. Such excellent flame retardancy is achieved by (c) blending a flame retardant and (d) a NOR-type hindered amine light stabilizer, and by precisely adjusting the amounts of each.

[0068] <Uses of resin compositions> One form of the resin composition of this embodiment is a pellet. The molded article of this embodiment is formed from the resin composition or pellets of this embodiment.

[0069] The method for manufacturing the molded product in this embodiment is not particularly limited, and any molding method commonly used for resin compositions can be arbitrarily employed. Examples include injection molding, ultra-high-speed injection molding, injection compression molding, two-color molding, hollow molding methods such as gas-assisted molding, molding using a heat-insulating mold, molding using a rapidly heated mold, foam molding (including supercritical fluid), insert molding, IMC (in-mold coating) molding, extrusion molding, sheet molding, thermoforming, rotational molding, lamination molding, press molding, and blow molding. Molding methods using a hot runner system can also be used.

[0070] The resin composition of this embodiment is widely used in applications where polyphenylene ether resins, particularly blends of polyphenylene ether resins and styrene-based resins, are commonly used. Examples include automotive exterior and body panels, automotive interior parts, and automotive underbody parts. Specifically, it is suitable for exterior and body panels such as bumpers, fenders, door panels, moldings, emblems, engine hoods, wheel covers, roofs, spoilers, and engine covers, as well as underbody parts and interior parts such as instrument panels and console box trims. Furthermore, it can be used as a cabinet or chassis for various computers and their peripherals, other office automation equipment, televisions, video players, various disc players, refrigerators, air conditioners, LCD projectors, etc. Furthermore, it can be used as fuel cases for solid methanol batteries, secondary battery cells, fuel cell water distribution pipes, water cooling tanks, boiler casings, ink peripheral parts and components and chassis for inkjet printers, and molded products such as water pipes and fittings.

[0071] In this embodiment, the thinnest part of the molded product is preferably 0.5 mm or more, more preferably 0.8 mm or more, and more preferably 1.5 mm or more. Furthermore, in this embodiment, the thickness of the thinnest part is preferably 3 mm or less. [Examples]

[0072] The present invention will be described in more detail below with reference to examples. The materials, amounts used, proportions, processing content, and processing procedures shown in the following examples can be modified as appropriate, as long as they do not depart from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. If the measuring instruments used in the examples are difficult to obtain due to discontinuation or other reasons, measurements can be taken using other instruments with equivalent performance.

[0073] 1.Raw materials The following raw materials were used in this example. [Table 1]

[0074] The structure of component (d) above is as follows. [ka]

[0075] 2. Examples 1-7, Comparative Examples 1-4 The components were mixed in the proportions (based on parts by mass) shown in Tables 2 and 3 below. A resin composition (pellets) was obtained by melt-kneading using a twin-screw extruder (Shibaura Machine Co., Ltd.: TEM18SS) at a cylinder temperature of 290°C, a die head temperature of 300°C, and a screw rotation speed of 300 rpm. The following evaluations were performed using the obtained resin composition (pellets). The results are shown in Tables 2 and 3.

[0076] <Flame-retardant> After drying the pellets obtained by the above manufacturing method at 120°C for 2 hours, test pieces for flammability testing with dimensions of length × width × thickness = 125 mm × 13 mm × 1.5 mm were molded using an injection molding machine (Shibaura Machine Co., Ltd., "EC75SX") under conditions of cylinder temperature 300°C and mold temperature 100°C. The obtained flammability test specimens were subjected to two vertical flammability tests (UL94V test: 1.5mmt) in sets of five specimens, in accordance with the UL94 standard. The grades are classified as V-0, V-1, and V-2, from best to worst. Each set was graded based on the vertical flammability test and is shown in Tables 2 and 3. In the event of differing test results, the result for the low flame retardancy grade was adopted.

[0077] <Temperature of deflection under load (DTUL) (°C)> After drying the pellets obtained by the above manufacturing method at 120°C for 2 hours, ISO3167:93A type test specimens (hereinafter referred to as "ISO test specimens") were injection molded in accordance with ISO-15103 under conditions of cylinder temperature 300°C and mold temperature 100°C using an injection molding machine (Shibaura Machine Co., Ltd., "EC75SX"). In accordance with ISO-75-2, the load deflection temperature (in °C) at a load of 1.80 MPa was measured using a strip-shaped test specimen measuring 80 mm × 10 mm × 4 mmt, which was prepared by machining the parallel section of the above ISO test specimen.

[0078] <Charpy impact strength with notch> The ISO test specimens obtained above were machined in accordance with ISO-179-1 and ISO-179-2 to remove the gripping portions at both ends and to create a notch in the center, thereby forming a notched Charpy impact test specimen. The impact resistance of the obtained notched Charpy impact test specimens was evaluated in accordance with ISO-179-1 and ISO-179-2, measuring the notched Charpy impact strength (unit: kJ / m) at 23°C. 2 ) was measured.

[0079] <Tensile strength (MPa)> In accordance with ISO-527, the tensile strength was measured using the ISO test specimens obtained above.

[0080] <Bending strength (MPa) and bending modulus (MPa)> Using a strip-shaped test specimen measuring 80 mm × 10 mm × 4 mm thick, prepared by machining the parallel section of the above-mentioned ISO test specimen, the bending strength (unit: MPa) and bending modulus (unit: MPa) were measured in accordance with ISO-178 under conditions of 23°C and 50% humidity.

[0081] [Table 2]

[0082] [Table 3]

[0083] As is clear from the above results, the resin composition of the present invention exhibits excellent flame retardancy and a high load deflection temperature (Examples 1-7). In contrast, when (d) the NOR-type hindered amine light stabilizer was not included (Comparative Example 1), or when the amount included was small (Comparative Example 2), the flame retardancy was poor. In particular, Comparative Example 1 also had a low deflection temperature under load. On the other hand, when the content of (d) the NOR-type hindered amine light stabilizer was high (Comparative Example 3), the flame retardancy was excellent, but the deflection temperature under load was low. Furthermore, the mechanical strength tended to be poor. Also, when the content of styrene resin was too high (Comparative Example 4), the flame retardancy was poor, and the deflection temperature under load was also low.

Claims

1. A resin composition comprising (a) 85 to 100% by mass of polyphenylene ether resin and (b) 0 to 15% by mass of styrene resin, totaling 100 parts by mass, (c) 15 to 20 parts by mass of flame retardant, (d) 0.4 to 3.0 parts by mass of NOR-type hindered amine-based light stabilizer, and (e) 10 to 60 parts by mass of inorganic filler, wherein the inorganic filler is a fibrous inorganic filler.

2. The resin composition according to claim 1, wherein the (d) NOR-type hindered amine-based light stabilizer comprises a structure represented by formula (HALS). 【Chemistry 1】 (In formula (HALS), R is an organic group. ｘ (where m is an alkyl group having 1 to 5 carbon atoms, m is an integer from 0 to 4, and * indicates the bonding position with other sites.)

3. The resin composition according to claim 1 or 2, wherein the styrene-based resin includes high-impact polystyrene.

4. The resin composition according to claim 1 or 2, wherein the inorganic filler (e) is glass fiber.

5. The resin composition according to claim 1 or 2, wherein the flame retardant (c) comprises a phosphorus-based flame retardant.

6. The resin composition according to claim 1 or 2, wherein the mass ratio of (d) / (c), which is the mass ratio of (c) flame retardant to (d) NOR-type hindered amine light stabilizer, is 0.02 to 0.

2.

7. The (d) NOR-type hindered amine-based light stabilizer comprises a structure represented by formula (HALS), The styrene-based resin includes high-impact polystyrene, The (e) inorganic filler is glass fiber, The aforementioned (c) flame retardant includes a phosphorus-based flame retardant, The resin composition according to claim 1, wherein the mass ratio of (d) / (c) of (c) the flame retardant and (d) the NOR-type hindered amine light stabilizer is 0.02 to 0.

2. 【Chemistry 2】 (In formula (HALS), R is an organic group. ｘ (where m is an alkyl group having 1 to 5 carbon atoms, m is an integer from 0 to 4, and * indicates the bonding position with other sites.)

8. Pellets of the resin composition according to any one of claims 1, 2, and 7.

9. A molded article formed from the resin composition according to any one of claims 1, 2, and 7.

10. A molded article formed from the pellets described in claim 8.

11. The molded article according to claim 9, wherein the thinnest wall portion is 0.5 mm or more.

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