Display panel, method for manufacturing a display panel, and electronic device

Abstract

SOLUTION: A display panel includes an array substrate, a partition structure, light emitting elements, a first packaging layer, and a second packaging layer, the partition structure is located on one side of the array substrate, forms an enclosed, isolated opening, with at least a portion of the light emitting elements positioned within the partition opening, the first packaging layer is located on the side away from the array substrate of the light emitting element, and includes a packaging unit, a gap exists between the packaging unit located on the side away from the array substrate of the partition structure and the side away from the array substrate of the partition structure, and the second packaging layer is located on the side away from the array substrate of the first packaging layer, with at least a portion of the second packaging layer extending into the gap.EFFECT: It improves the stability of a packaging unit located on the side away from an array substrate of a partition structure, makes the packaging unit more resistant to breakage and enhances the stability of a display panel.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present application claims the priority of the Chinese patent application filed on March 21, 2024 with the application number 202410337713.0 and the invention title "Display Panel, Method for Manufacturing Display Panel, and Electronic Device", the entire content of which is incorporated herein by reference.

[0002] The present application relates to the field of display technology, and specifically to a display panel, a method for manufacturing a display panel, and an electronic device. Background Art

[0003] Flat panel display devices based on technologies such as Organic Light Emitting Diode (OLED) and Light Emitting Diode (LED) have the advantages of high image quality, power saving, thin profile and wide application range, so they are widely used in various consumer electronic products such as mobile phones, televisions, notebook computers and desktop computers, and have become the mainstream of display panels.

[0004] However, there are still problems to be solved in display panels. Summary of Invention

[0005] In order to solve the technical problems described in the above background art, embodiments of the present application provide an array substrate, a partition structure located on one side of the array substrate and forming an enclosed Partition opening partition opening, a light emitting element at least partially located within the partition opening, A first packaging layer having a gap between the packaging unit located on the side of the light-emitting element away from the array substrate, the packaging unit extending from the side of the partition structure to the side of the partition structure away from the array substrate, the side of the partition structure being the surface facing the partition opening of the partition structure, and the packaging unit located on the side of the partition structure away from the array substrate, A display panel is provided, comprising a second packaging layer located on the side of the first packaging layer away from the array substrate, and at least a portion of which extends into the gap.

[0006] In some possible embodiments, the present application further states Array substrate and Located on one side of the array substrate and surrounded Partition opening A partition structure that forms, A light-emitting element, at least a portion of which is located within the partition opening, A first packaging layer comprising a packaging unit located on the side of the light-emitting element away from the array substrate, the packaging unit extending from the side of the partition structure to the side of the partition structure away from the array substrate, the side of the partition structure being the surface facing the partition opening of the partition structure, and a gap between the packaging unit located on the side of the partition structure away from the array substrate and the side of the partition structure away from the array substrate, wherein the heights of the gaps corresponding to the light-emitting elements of different colors are not equal. The present invention provides another display panel, comprising a second packaging layer located on the side of the first packaging layer away from the array substrate, and at least a portion of which extends into the gap.

[0007] In some possible embodiments, the present application further states The steps include providing an array substrate and On one side of the array substrate, surrounded Partition opening The steps include forming a partition structure that forms a partition structure, The steps include forming at least a portion of the light-emitting element within the partition opening, A step of forming a first packaging layer on the side of the light-emitting element away from the array substrate, wherein the first packaging layer includes a packaging unit, the packaging unit extends from the side of the partition structure to the side of the partition structure away from the array substrate, the side of the partition structure is the surface facing the partition opening of the partition structure, and there is a gap between a part of the packaging unit located on the side of the partition structure away from the array substrate and the side of the partition structure away from the array substrate, A method for manufacturing a display panel is provided, comprising the step of forming a second packaging layer on the side of the first packaging layer away from the array substrate, wherein at least a portion of the second packaging layer is extended into the gap.

[0008] In some possible embodiments, the present application further provides electronic equipment including a display panel as described herein, or a display panel manufactured by a method for manufacturing a display panel as described herein. [Effects of the Invention]

[0009] Compared to existing technologies, this invention has the following beneficial effects.

[0010] The display panel, method for manufacturing the display panel, and electronic device according to the present application are such that at least a portion of the second packaging layer extends into the gap, allowing the second packaging layer to support a suspended packaging unit, improving the stability of the packaging unit located on the side away from the array substrate of the partition structure, making the packaging unit less likely to break, and thereby improving the stability of the display panel. [Brief explanation of the drawing]

[0011] [Figure 1] This is a schematic cross-sectional view of a display panel in the related technology provided by the embodiment of the present application. [Figure 2] This is a schematic cross-sectional view of a display panel provided by an embodiment of the present application. [Figure 3] This is a schematic cross-sectional view of a display panel provided by an embodiment of the present application, including a third packaging layer. [Figure 4] This is a schematic cross-sectional view of a partition structure provided by an embodiment of the present application, which includes a three-layer structure. [Figure 5] This is a schematic flowchart of the method for manufacturing a display panel provided by the embodiment of the present application. [Figure 6] This is a schematic cross-sectional view showing the formation of a first electrode layer on one side of the array substrate provided by the embodiment of the present application. [Figure 7] This is a schematic cross-sectional view showing the formation of a pixel-defining material layer on the side of the first electrode layer provided by the embodiment of the present application that is away from the array substrate. [Figure 8] This is a schematic cross-sectional view showing the formation of a partition structure material layer on the side of the pixel definition material layer provided by the embodiment of the present application that is away from the array substrate. [Figure 9] This is a schematic cross-sectional view of a partition structural material layer provided by the embodiment of the present application after dry etching treatment. [Figure 10] This is a schematic cross-sectional view of a partition structural material layer provided by an embodiment of the present invention after patterning treatment has been applied. [Figure 11] This is a schematic cross-sectional view of a pixel-defining material layer provided by an embodiment of the present application after patterning has been performed. [Figure 12] This is a schematic cross-sectional view showing the formation of the light-emitting functional layer of the first color light-emitting element on the side away from the array substrate of the partition structure provided by the embodiment of the present application. [Figure 13] This is a schematic cross-sectional view showing the formation of a second electrode layer on the side of the first color light-emitting element provided by the embodiment of the present application that is away from the array substrate of the light-emitting functional layer. [Figure 14] This is a first schematic cross-sectional view showing the formation of the first packaging layer on the side of the second electrode layer provided by the embodiment of the present application that is away from the array substrate. [Figure 15]It is a schematic cross-sectional view of forming a first etching protection layer in the partition opening corresponding to the first color light-emitting element provided by an embodiment of the present application. [Figure 16] It is a schematic cross-sectional view of removing the first packaging layer, the light-emitting functional layer and the second electrode layer that are not covered by the first etching protection layer and removing the first etching protection layer provided by an embodiment of the present application. [Figure 17] It is a schematic cross-sectional view of forming the light-emitting functional layer of the second color light-emitting element on the side of the partition structure away from the array substrate provided by an embodiment of the present application. [Figure 18] It is a schematic cross-sectional view of forming the second electrode layer on the side of the light-emitting functional layer of the second color light-emitting element away from the array substrate provided by an embodiment of the present application. [Figure 19] It is a second schematic cross-sectional view of forming the first packaging layer on the side of the second electrode layer away from the array substrate provided by an embodiment of the present application. [Figure 20] It is a schematic cross-sectional view of forming a second etching protection layer in the partition opening corresponding to the second color light-emitting element provided by an embodiment of the present application. [Figure 21] It is a schematic cross-sectional view of sequentially removing the first packaging layer, the light-emitting functional layer and the second electrode layer of the second color light-emitting element that are not covered by the second etching protection layer and removing the second etching protection layer provided by an embodiment of the present application. DESCRIPTION OF EMBODIMENTS

[0012] As shown in FIG. 1, a display panel in the related art comprises an array substrate 1, a partition structure 7 located on one side of the array substrate 1, a light-emitting element 10 at least partially located in a partition opening 9 formed by the partition structure 7, and a first packaging layer 6 located on a side of the partition structure 7 away from the array substrate 1, wherein the first packaging layer 6 comprises a packaging unit 61, and the packaging unit 61 extends from a side surface of the partition structure 7 to the side of the partition structure 7 away from the array substrate 1.

[0013] When manufacturing a display panel in the related technology, the vapor-deposited material above the partition structure 7 is removed during the wet etching process. As a result, there is a gap 8 between the part of the packaging unit 61 located away from the array substrate 1 of the partition structure 7 and the part of the partition structure 7 that is away from the array substrate 1. Therefore, the packaging unit 61 located away from the array substrate 1 of the partition structure 7 is in a suspended state, making it easy to break the suspended packaging unit 61 during subsequent manufacturing processes. This reduces the stability of the display panel, and ultimately affects the display quality of the display panel.

[0014] In light of this, this embodiment provides a technical configuration that can improve the stability of the display panel, and the technical configuration according to this embodiment will be described in detail below.

[0015] As shown in Figure 2, this embodiment provides a display panel which includes an array substrate 1, a partition structure 7, a light-emitting element 10, a first packaging layer 6, and a second packaging layer 11.

[0016] The array substrate 1 may include a substrate and a plurality of drive units located on one side of the substrate, and each drive unit may include one or more semiconductor switching elements. The semiconductor switching elements may be formed by the cooperation of a plurality of film layers of the array substrate 1, for example, the semiconductor switching elements may be thin-film transistors formed by the cooperation of a plurality of film layers.

[0017] The partition structure 7 is located on one side of the array substrate 1, and the partition structure 7 defines a partition opening 9, in which at least a portion of the light-emitting element 10 is located within the partition opening 9.

[0018] The light-emitting element 10 includes a red light-emitting element, a blue light-emitting element, and a green light-emitting element.

[0019] The composition, manufacturing, and other details of partition structure 7 are further described for reference in the following patents: PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, 202311346196.5, and 202310692671.8.

[0020] The first packaging layer 6 is located on the side of the light-emitting element 10 away from the array substrate 1, and the first packaging layer 6 includes a packaging unit 61, which extends from the side of the partition structure 7 to the side of the partition structure 7 away from the array substrate 1, and the side of the partition structure 7 is the surface facing the partition opening 9 of the partition structure 7, and there is a gap 8 between the packaging unit 61 located on the side of the partition structure 7 away from the array substrate 1 and the side of the partition structure 7 away from the array substrate 1. The second packaging layer 11 is located on the side of the first packaging layer 6 away from the array substrate 1, and at least a portion of the second packaging layer 11 extends into the gap 8.

[0021] During the patterning process of the light-emitting element, the first packaging layer 6 forms a packaging unit 61, and ultimately forms a plurality of packaging units 61 that are spaced apart, and the packaging units 61 can independently package the light-emitting element 10, thereby improving the display characteristics of the display panel.

[0022] Two adjacent packaging units 61 are spaced apart on the side of the partition structure 7 away from the array substrate 1, and the orthographic projection of the packaging unit 61 on the array substrate 1 covers the orthographic projection of the partition opening 9 on the array substrate 1, and also covers the orthographic projection of a portion of the partition structure 7 on the array substrate 1. When forming the second packaging layer 11, the material of the second packaging layer 11 flows into and fills the gap 8, and the second packaging layer 11 located within the gap 8 can support the packaging unit 61 located on the side of the partition structure 7 away from the array substrate 1, making the packaging unit 61 less likely to break during the subsequent manufacturing process, thereby improving the stability and yield of the display panel.

[0023] With the above design, in this embodiment, at least a portion of the second packaging layer 11 extends into the gap 8, so that the second packaging layer 11 can support the suspended packaging unit 61, thereby improving the stability of the packaging unit 61 located on the side of the partition structure 7 away from the array substrate 1, making the packaging unit 61 less likely to break and improving the stability of the display panel.

[0024] In some possible embodiments, as again shown in Figure 2, the light-emitting element 10 includes a first electrode layer, a light-emitting functional layer, and a second electrode layer, which are stacked in order along the direction away from the array substrate 1, with the first packaging layer 6 located on the side of the second electrode layer away from the array substrate 1. The first electrode layer includes a first electrode 2, the light-emitting functional layer includes a light-emitting portion 4, and the second electrode layer includes a second electrode 5. The orthographic projection of the partition opening 9 on the array substrate 1 and the orthographic projection of the first electrode 2 on the array substrate 1 overlap at least partially, the light-emitting portion 4 is located within the partition opening 9, and the second electrode 5 is electrically connected to the partition structure 7.

[0025] The display panel further includes a pixel definition layer 3 located away from the array substrate 1 of the first electrode layer, and the partition structure 7 is located away from the array substrate 1 of the pixel definition layer 3. The pixel definition layer 3 includes a pixel aperture 31 that exposes at least a portion of the first electrode 2, and the orthographic projection of the partition structure 7 on the array substrate 1 is located between the orthographic projections of two adjacent pixel apertures 31 on the array substrate 1. The orthographic projection of the pixel aperture 31 on the array substrate 1 is located within the orthographic projection of the partition aperture 9 on the array substrate 1.

[0026] When forming the light-emitting functional layer, the light-emitting functional layer forms a plurality of light-emitting parts 4 separated by a partition structure 7 and installed at intervals. When forming the second electrode layer, the second electrode layer forms a plurality of second electrodes 5 separated by a partition structure 7 and installed at intervals. The partition structure 7 contains a conductive material, and the second electrodes 5 are electrically connected to the partition structure 7. One light-emitting element 10 is formed by one first electrode 2, one light-emitting part 4, and one second electrode 5. The first electrode 2 is the anode, and the second electrode 5 is the cathode.

[0027] In some possible embodiments, along the direction perpendicular to the array substrate 1, the gap height h is greater than the thickness of the light-emitting functional layer, along the direction perpendicular to the array substrate 1, the gap height h is less than the distance from the side of the second electrode 5 away from the array substrate 1 to the side of the first electrode 2 close to the array substrate 1, and the gap heights h corresponding to different colored light-emitting elements 10 are not equal.

[0028] Preferably, as shown again in Figure 2, the height h of the gap 8 is equal to the distance H from the side of the first electrode 2 of the light-emitting element away from the array substrate 1 to the side of the packaging unit 61 closer to the array substrate 1, along the direction perpendicular to the array substrate 1.

[0029] In the manufacturing process of the display panel, a light-emitting functional layer and a second electrode layer are located between the portion of the partition structure 7 of the packaging unit 61 that is away from the array substrate 1 and the portion of the partition structure 7 that is away from the array substrate 1. After the manufacturing of the display panel is completed, the light-emitting functional layer and the second electrode layer are removed between the portion of the partition structure 7 of the packaging unit 61 that is away from the array substrate 1 and the portion of the partition structure 7 that is away from the array substrate 1. Therefore, along the direction perpendicular to the array substrate 1, the height h of the gap 8 is equal to the sum of the thicknesses of the light-emitting functional layer and the second electrode layer of the light-emitting element. In this way, when forming the second packaging layer 11, the material of the second packaging layer 11 can easily fill the gap 8, thereby further improving the stability of the display panel.

[0030] TIFF0007927108000001.tif30170

[0031] In some possible embodiments, as again shown in Figure 2, the minimum distance D between the orthographic projection of the edge of the packaging unit 61 on the array substrate 1 and the orthographic projection of the edge of the partition structure 7 on the array substrate 1 is 1 μm to 2 μm, for example, the minimum distance D may be 1 μm, 1.2 μm, 1.5 μm, 1.8 μm, or 2 μm. The minimum distance D is the horizontal length of the suspension portion of the packaging unit 61 located on the side of the partition structure 7 away from the array substrate 1, and by rationally optimizing the minimum distance D, the second packaging layer 11 can more easily completely fill the gap 8, thereby further improving the stability of the display panel.

[0032] Preferably, as shown in Figure 3, the display panel further includes a third packaging layer 12 located on the side of the second packaging layer 11 away from the array substrate 1, and the side of the second packaging layer 11 away from the array substrate 1 is installed flat. The materials of the first packaging layer 6 and the third packaging layer 12 both include inorganic materials, while the material of the second packaging layer 11 includes organic materials.

[0033] The third packaging layer 12 can further improve the packaging effect on the display panel. The side of the second packaging layer 11 away from the array substrate 1 is installed flat, which can further improve the display quality of the display panel.

[0034] In some possible embodiments, as again shown in Figure 3, the partition structure 7 includes a first partition 71 and a second partition 72 that are stacked in order along the direction away from the array substrate 1, such that the orthographic projection of the first partition 71 on the array substrate 1 away from the array substrate 1 lies within the orthographic projection of the second partition 72 on the array substrate 1.

[0035] The second partition portion 72 is located on the side of the first partition portion 71 away from the array substrate 1, and the width of the second partition portion 72 is greater than the width of the first partition portion 71 on the side away from the array substrate 1. Therefore, the second partition portion 72 cuts the light-emitting functional layer and the second electrode layer at the partition structure 7. In this way, the partition structure 7 formed by the first partition portion 71 and the second partition portion 72 makes it easy to package each light-emitting element 10 independently.

[0036] In some possible embodiments, as again shown in Figure 3, the second electrode 5 of the light-emitting element 10 is electrically connected to the first partition 71. As shown in Figure 4, and / or, the partition structure 7 further includes a third partition 73 located on the side of the first partition 71 facing the array substrate 1, and the second electrode 5 of the light-emitting element 10 is electrically connected to the third partition 73. The material of the third partition 73 includes molybdenum metal. and / or, the material of the first partition 71 includes aluminum metal. and / or, the material of the second partition 72 includes titanium metal. In this way, when the partition structure 7 partitions the second electrode layer as the second electrode 5, the second electrode 5 is easily electrically connected to the first partition 71 and / or the third partition 73.

[0037] As described above, in this invention, by extending at least a portion of the second packaging layer 11 into the gap 8, the second packaging layer 11 can support the suspended packaging unit 61, thereby improving the stability of the packaging unit 61 located on the side of the partition structure 7 away from the array substrate 1, making the packaging unit 61 less likely to break and improving the stability of the display panel.

[0038] In some possible embodiments, as shown in Figure 5, the present application further provides a method for manufacturing a display panel. The method includes the following steps:

[0039] S10: Provide the array substrate 1.

[0040] The array substrate 1 may include a substrate and a plurality of drive units located on one side of the substrate, and each drive unit may include one or more semiconductor switching elements. The semiconductor switching elements may be formed by the cooperation of a plurality of film layers of the array substrate 1, for example, the semiconductor switching elements may be thin-film transistors formed by the cooperation of a plurality of film layers.

[0041] S11: A partition structure 7 is formed on one side of the array substrate 1, defining a partition opening 9.

[0042] As shown in Figure 6, a first electrode layer is formed on one side of the array substrate 1, and the first electrode layer includes a plurality of first electrodes 2 that are spaced apart from each other.

[0043] As shown in Figure 7, a pixel-defining material layer 13 is formed on the side of the first electrode layer that is away from the array substrate 1.

[0044] As shown in Figure 8, a partition structure material layer 14 is formed on the side of the pixel definition material layer 13 that is away from the array substrate 1.

[0045] As shown in Figure 9, the partition structure material layer 14 is subjected to dry etching.

[0046] As shown in Figure 10, a patterning process is performed on the partition structure material layer 14 to form the partition structure 7.

[0047] As shown in Figure 11, a patterning process is performed on the pixel-defining material layer 13 to form a pixel-defining layer 3. The pixel-defining layer 3 includes a pixel aperture 31 that exposes at least a portion of the first electrode 2, and the orthographic projection of the pixel aperture 31 on the array substrate 1 is located within the orthographic projection of the partition aperture 9 on the array substrate 1.

[0048] S12: At least a portion of the light-emitting element 10 is formed within the partition opening 9.

[0049] As shown in Figure 12, the light-emitting functional layer of the first color light-emitting element is formed on the side of the partition structure 7 that is away from the array substrate 1.

[0050] The light-emitting functional layer is broken at the partition structure 7, so that at least a portion of the light-emitting functional layer is located inside the partition opening 9 to form the light-emitting portion 4. By controlling the deposition angle, it is possible to prevent the light-emitting portion 4 from coming into contact with the partition structure 7.

[0051] As shown in Figure 13, the second electrode layer is formed on the side of the first color light-emitting element that is away from the array substrate 1 of the light-emitting functional layer.

[0052] The second electrode layer is broken at the partition structure 7, thereby positioning at least a portion of the second electrode layer within the partition opening 9 to form the second electrode 5. By controlling the deposition angle, the second electrode 5 can be extended from within the partition opening 9 until it electrically contacts the partition structure 7, thereby connecting adjacent second electrodes 5 or connecting the second electrodes 5 to other circuits. In this way, the difficulty of manufacturing the display panel can be reduced.

[0053] S13: A first packaging layer 6 is formed on the side of the light-emitting element 10 away from the array substrate 1, the first packaging layer 6 includes a packaging unit 61, the packaging unit 61 extends from the side of the partition structure 7 to the side of the partition structure 7 away from the array substrate 1, the side of the partition structure 7 is the surface facing the partition opening 9 of the partition structure 7, and there is a gap 8 between the packaging unit 61 located on the side of the partition structure 7 away from the array substrate 1 and the side of the partition structure 7 away from the array substrate 1.

[0054] As shown in Figure 14, the first packaging layer 6 is formed on the side of the second electrode layer away from the array substrate 1, and the first packaging layer 6 covers both the second electrode layer located on the side of the partition structure 7 away from the array substrate 1 and the second electrode layer located within the partition opening 9.

[0055] As shown in Figure 15, a first etching protective layer 15 is formed within the partition opening 9 corresponding to the first color light-emitting element.

[0056] The light-emitting element 10 may include a first-color light-emitting element, a second-color light-emitting element, and a third-color light-emitting element, where the first-color light-emitting element may be red, the second-color light-emitting element may be green, and the third-color light-emitting element may be blue. The first etching protective layer 15 can protect the corresponding light-emitting functional layer of the first-color light-emitting element, the second electrode layer, and the first packaging layer 6.

[0057] As shown in Figure 16, the first packaging layer 6, the light-emitting functional layer, and the second electrode layer that are not covered by the first etching protective layer 15 are removed, and the first etching protective layer 15 is also removed, thereby forming the light-emitting part 4, the second electrode 5, and the packaging unit 61 within the pixel aperture 31 corresponding to the first color light-emitting element. Along the direction perpendicular to the array substrate 1, the height h1 of the gap 8 is equal to the distance H1 from the side of the first electrode 2 corresponding to the first color light-emitting element that is away from the array substrate 1 to the side of the packaging unit 61 that is close to the array substrate 1.

[0058] When the first packaging layer 6, the light-emitting functional layer, and the second electrode layer, which are not covered by the first etching protective layer 15, are removed, the light-emitting functional layer and the second electrode layer between the packaging unit 61 located on the side of the partition structure 7 away from the array substrate 1 and the partition structure 7 are also removed. Thus, along the direction perpendicular to the array substrate 1, the height h1 of the gap 8 is equal to the sum of the thicknesses of the light-emitting portion 4 and the second electrode 5 corresponding to the first color light-emitting element. In this way, the light-emitting functional layer and the second electrode layer are completely covered by the packaging unit 61, and the light-emitting functional layer and the second electrode layer between the portion of the packaging unit 61 located on the side of the partition structure 7 away from the array substrate 1 and the side of the partition structure 7 away from the array substrate 1 are removed, reducing the risk of the deposition material entering the deposition apparatus when exposed to air, causing contamination of the apparatus or rupture of the film layer.

[0059] In this way, a precise photomask is not required, and the light-emitting section 4, the second electrode 5, and the packaging unit 61 can be formed only in the pixel aperture 31 corresponding to the first color light-emitting element, and the second electrode 5 can be electrically connected to the partition structure 7. As a result, the first color light-emitting element can be formed in the pixel aperture 31 corresponding to the first color light-emitting element at a lower cost.

[0060] As shown in Figure 17, the light-emitting functional layer of the second color light-emitting element is formed on the side of the partition structure 7 that is away from the array substrate 1, and the light-emitting functional layer of the second color light-emitting element covers the side of the packaging unit 61 corresponding to the first color light-emitting element that is away from the array substrate 1.

[0061] After forming the first color light-emitting element, a light-emitting functional layer for the second color light-emitting element is formed. The light-emitting functional layer for the second color light-emitting element covers the packaging unit 61 corresponding to the first color light-emitting element, and a light-emitting portion 4 of the second color light-emitting element is formed within the pixel aperture 31 corresponding to the second color light-emitting element.

[0062] As shown in Figure 18, a second electrode layer is formed on the side of the second color light-emitting element that is away from the array substrate 1 of the light-emitting functional layer, and a second electrode 5 of the second color light-emitting element is formed within the pixel aperture 31 corresponding to the second color light-emitting element. The second electrode 5 of the second color light-emitting element is connected to the electrode of the partition structure 7.

[0063] As shown in Figure 19, the first packaging layer 6 is formed on the side of the second electrode layer that is away from the array substrate 1.

[0064] As shown in Figure 20, a second etching protective layer 16 is formed within the partition opening 9 corresponding to the second color light-emitting element. The second etching protective layer 16 can protect the corresponding light-emitting functional layer, second electrode layer, and first packaging layer 6 of the second color light-emitting element.

[0065] As shown in Figure 21, the first packaging layer 6, light-emitting functional layer, and second electrode layer of the second color light-emitting element that are not covered by the second etching protective layer 16 are removed, and the second etching protective layer 16 is also removed, thereby forming the light-emitting part 4, the second electrode 5, and the packaging unit 61 within the pixel aperture 31 corresponding to the second color light-emitting element. Along the direction perpendicular to the array substrate 1, the height h2 of the gap 8 is equal to the distance H2 from the side of the first electrode 2 corresponding to the second color light-emitting element that is away from the array substrate 1 to the side of the packaging unit 61 that is close to the array substrate 1.

[0066] When the first packaging layer 6, the light-emitting functional layer, and the second electrode layer that are not covered by the second etching protective layer 16 are removed, the light-emitting functional layer and the second electrode layer between the portion of the partition structure 7 of the packaging unit 61 located away from the array substrate 1 and the partition structure 7 are also removed. Therefore, along the direction perpendicular to the array substrate 1, the height h2 of the gap 8 is equal to the sum of the thicknesses of the light-emitting portion 4 and the second electrode 5 corresponding to the second color light-emitting element.

[0067] In this way, a precise photomask is not required, and the light-emitting section 4, the second electrode 5, and the packaging unit 61 can be formed only in the pixel aperture 31 corresponding to the second color light-emitting element, and the second electrode 5 can be electrically connected to the partition structure 7. In this way, the second color light-emitting element can be formed in the pixel aperture 31 corresponding to the second color light-emitting element at a lower cost.

[0068] In this way, by employing the above steps, the light-emitting portion 4, the second electrode 5, and the packaging unit 61 can be formed within the pixel aperture 31 corresponding to the third color or more other colors of light-emitting elements 10. Since the multiple light-emitting elements 10 formed through the above steps are each individually packaged, the light-emitting elements 10 are independent of each other, and the optical characteristics of the display panel can be optimized.

[0069] S14: A second packaging layer 11 is formed on the side of the first packaging layer 6 that is away from the array substrate 1, and at least a portion of the second packaging layer 11 is extended into the gap 8.

[0070] As shown again in Figure 2, after forming light-emitting elements 10 of various colors by the method described above, if a second packaging layer 11 is formed on the side of the first packaging layer 6 away from the array substrate 1, the material of the second packaging layer 11 flows into and fills the gap 8, and the second packaging layer 11 located within the gap 8 can support the packaging unit 61 located on the side of the partition structure 7 away from the array substrate 1, making it difficult for the packaging unit 61 to break during the subsequent manufacturing process, thereby improving the stability and yield of the display panel.

[0071] In some possible embodiments, the present application further provides electronic equipment comprising a display panel according to the present application or a display panel manufactured by a method for manufacturing a display panel according to the present application. The electronic equipment may include, for example, a device with image processing capabilities such as a server, a personal computer, or a laptop. Because the electronic equipment comprises a display panel according to the present application, it has better stability and yield. [Explanation of Symbols]

[0072] 1 Array substrate 2 1st electrode 3 pixels define layer 31-pixel aperture 4. Light-emitting part 5 Second electrode 6. First Packaging Layer 61 Packaging Units 7. Partition structure 71 First partition section 72 Second partition section 73 Third partition section 8 gaps 9 partition opening 10 light-emitting elements 11. Second Packaging Layer 12. Third Packaging Layer 13 Pixel-Defined Material Layers 14 Partition Structural Material Layer 15. First etching protective layer 16. Second etching protective layer

Claims

1. It is a display panel, Array substrate and A partition structure located on one side of the array substrate, surrounded and forming a partition opening, A light-emitting element, at least a portion of which is located within the partition opening, A first packaging layer having a gap between the packaging unit located on the side of the light-emitting element away from the array substrate, the packaging unit extending from the side of the partition structure to the side of the partition structure away from the array substrate, the side of the partition structure being the surface facing the partition opening of the partition structure, and the packaging unit located on the side of the partition structure away from the array substrate, The first packaging layer includes a second packaging layer located on the side away from the array substrate, and at least a portion of which extends into the gap, The minimum distance between the orthographic projection of the edge of the packaging unit on the array substrate and the orthographic projection of the edge of the partition structure on the array substrate is 1 μm to 2 μm. The partition structure includes a first partition and a second partition that are stacked in order along the direction away from the array substrate, and the second packaging layer and the second partition overlap in at least a portion of their orthographic projection on the array substrate. A display panel characterized by the following features.

2. The light-emitting element includes a first electrode layer, a light-emitting functional layer, and a second electrode layer, which are stacked in order along the direction away from the array substrate, and the first packaging layer is located on the side of the second electrode layer away from the array substrate. The first electrode layer includes a first electrode, the light-emitting functional layer includes a light-emitting portion, the second electrode layer includes a second electrode, the orthographic projection of the partition opening on the array substrate and the orthographic projection of the first electrode on the array substrate overlap in at least a portion, the light-emitting portion is located within the partition opening, and the second electrode is electrically connected to the partition structure. The display panel according to feature 1.

3.

4. The two adjacent packaging units are spaced apart on the side of the partition structure away from the array substrate, The orthographic projection on the array substrate of the packaging unit covers the orthographic projection on the array substrate of the partition opening, and also covers the orthographic projection on the array substrate of a part of the partition structure. The display panel according to feature 1.

5. The second packaging layer completely fills the gap, The side of the second packaging layer away from the array substrate is installed flat. The display panel further includes a third packaging layer located on the side of the second packaging layer away from the array substrate, The materials of the first packaging layer and the third packaging layer both include inorganic materials. The material of the second packaging layer includes an organic material. The display panel according to feature 1.

6. The display panel further includes a pixel definition layer located on the side of the first electrode layer away from the array substrate, the partition structure is located on the side of the pixel definition layer away from the array substrate, the pixel definition layer includes a pixel aperture that exposes at least a portion of the first electrode, and the orthographic projection of the partition structure on the array substrate is located between the orthographic projections of two adjacent pixel apertures on the array substrate. The orthographic projection of the pixel aperture on the array substrate is located within the orthographic projection of the partition aperture on the array substrate. The display panel according to feature 2.

7. The orthographic projection of the array substrate on the side of the first partition that is away from the array substrate is located within the orthographic projection of the array substrate of the second partition, The display panel according to feature 1.

8. The second electrode of the light-emitting element is electrically connected to the first partition, and the partition structure further includes a third partition located on the side of the first partition facing the array substrate, and the second electrode of the light-emitting element is electrically connected to the third partition. The material of the third partition includes molybdenum metal, the material of the first partition includes aluminum metal, and the material of the second partition includes titanium metal. The display panel according to feature 7.

9. It is a display panel, Array substrate and A partition structure located on one side of the array substrate, surrounded and forming a partition opening, A light-emitting element, at least a portion of which is located within the partition opening, A first packaging layer located on the side of the light-emitting element away from the array substrate, comprising a packaging unit, the packaging unit extending from the side of the partition structure to the side of the partition structure away from the array substrate, the side of the partition structure being the surface facing the partition opening of the partition structure, and having a gap between the packaging unit located on the side of the partition structure away from the array substrate and the side of the partition structure away from the array substrate, wherein the heights of the gaps corresponding to the light-emitting elements of different colors are not equal. The first packaging layer includes a second packaging layer located on the side away from the array substrate, and at least a portion of which extends into the gap, The minimum distance between the orthographic projection of the edge of the packaging unit on the array substrate and the orthographic projection of the edge of the partition structure on the array substrate is 1 μm to 2 μm. The partition structure includes a first partition and a second partition that are stacked in order along the direction away from the array substrate, and the second packaging layer and the second partition overlap in at least a portion of their orthographic projection on the array substrate. A display panel characterized by the following features.

10. The light-emitting element includes a first electrode layer, a light-emitting functional layer, and a second electrode layer, which are stacked in order along the direction away from the array substrate, and the first packaging layer is located on the side of the second electrode layer away from the array substrate. The display panel according to feature 9.

11. The first electrode layer includes a first electrode, the light-emitting functional layer includes a light-emitting portion, the second electrode layer includes a second electrode, the orthographic projection of the partition opening on the array substrate and the orthographic projection of the first electrode on the array substrate overlap in at least a portion, the light-emitting portion is located within the partition opening, and the second electrode is electrically connected to the partition structure. The display panel according to feature 10.

12. Along the direction perpendicular to the array substrate, the height of the gap is greater than the thickness of the corresponding light-emitting functional layer. The display panel according to feature 10.

13. Along the direction perpendicular to the array substrate, the height of the gap is less than the distance from the side of the corresponding second electrode away from the array substrate to the side of the corresponding first electrode closer to the array substrate. The display panel according to feature 11.

14.

15. A method for manufacturing a display panel, The steps include providing an array substrate and The steps include forming a partition structure on one side of the array substrate that is surrounded and forms a partition opening, The steps include forming at least a portion of the light-emitting element within the partition opening, A step of forming a first packaging layer on the side of the light-emitting element away from the array substrate, wherein the first packaging layer includes a packaging unit, the packaging unit extends from the side of the partition structure to the side of the partition structure away from the array substrate, the side of the partition structure is the surface facing the partition opening of the partition structure, and there is a gap between the packaging unit located on the side of the partition structure away from the array substrate and the side of the partition structure away from the array substrate, The step of forming a second packaging layer on the side of the first packaging layer away from the array substrate, the step of extending at least a portion of the second packaging layer into the gap, The minimum distance between the orthographic projection of the edge of the packaging unit on the array substrate and the orthographic projection of the edge of the partition structure on the array substrate is 1 μm to 2 μm. The partition structure includes a first partition and a second partition that are stacked in order along the direction away from the array substrate, and the second packaging layer and the second partition overlap in at least a portion of their orthographic projection on the array substrate. A method for manufacturing a display panel, characterized by the following:

16. The step of forming a partition structure on one side of the array substrate is: The steps include forming a first electrode layer on one side of the array substrate, which includes a plurality of first electrodes that are spaced apart from each other, The steps include forming a pixel-defining material layer on the side of the first electrode layer away from the array substrate, The steps include forming a partition structure material layer on the side of the pixel definition material layer away from the array substrate, The steps include: performing a patterning process on the partition structure material layer to form a partition structure; A step of performing a patterning process on the pixel-defining material layer to form a pixel-defining layer, wherein the pixel-defining layer includes a pixel opening that exposes at least a portion of the first electrode, and the orthogonal projection of the pixel opening on the array substrate is located within the orthogonal projection of the partition opening on the array substrate. A method for manufacturing a display panel according to claim 15, characterized in that it is a method for manufacturing a display panel.

17. The step of forming at least a portion of the light-emitting element within the partition opening is, The steps include forming a light-emitting functional layer of the first color light-emitting element on the side of the partition structure away from the array substrate, The process includes the step of forming a second electrode layer on the side of the light-emitting functional layer of the first color light-emitting element that is away from the array substrate, A method for manufacturing a display panel according to claim 16, characterized by the above.

18. The step of forming the first packaging layer on the side of the light-emitting element away from the array substrate is, The steps include forming a first packaging layer on the side of the second electrode layer away from the array substrate, The steps include forming a first etching protective layer within a partition opening corresponding to the first color light-emitting element, A step of removing the first packaging layer, the light-emitting functional layer, and the second electrode layer that are not covered by the first etching protective layer, and removing the first etching protective layer, thereby forming a light-emitting portion, a second electrode, and a packaging unit in a pixel aperture corresponding to the first color light-emitting element, the step of, along a direction perpendicular to the array substrate, the height of the gap and the distance from the side of the first electrode corresponding to the first color light-emitting element away from the array substrate to the side of the packaging unit close to the array substrate, A method for manufacturing a display panel according to claim 17, characterized in that it is a method for manufacturing a display panel.

19. After removing the first packaging layer, the light-emitting functional layer, and the second electrode layer that are not covered by the first etching protective layer, and after removing the first etching protective layer, The steps include forming a light-emitting functional layer for a second color light-emitting element on the side of the partition structure away from the array substrate, which covers the side of the packaging unit corresponding to the first color light-emitting element away from the array substrate, The steps include forming a second electrode layer on the side of the light-emitting functional layer of the second color light-emitting element that is away from the array substrate, The steps include forming a first packaging layer on the side of the second electrode layer away from the array substrate, The steps include forming a second etching protective layer within a partition opening corresponding to the second color light-emitting element, A step of removing the first packaging layer, the light-emitting functional layer, and the second electrode layer of the second color light-emitting element that are not covered by the second etching protective layer, and removing the second etching protective layer, thereby forming a light-emitting portion, a second electrode, and a packaging unit in the pixel aperture corresponding to the second color light-emitting element, the step of, along a direction perpendicular to the array substrate, the height of the gap and the distance from the side of the first electrode corresponding to the second color light-emitting element away from the array substrate to the side of the packaging unit close to the array substrate, The method for manufacturing a display panel according to claim 18.

20. It is an electronic device, Includes a display panel according to any one of claims 1 to 6, An electronic device characterized by the following features.

Images