High-pressure annealing device with particle scattering prevention function

Abstract

To provide a high-pressure annealing apparatus capable of preventing contamination caused by particles from a parting module.SOLUTION: The high pressure annealing apparatus includes an inner chamber 100 which provides an inner space 105 for performing a heat treatment on a substrate and has an opened lower portion, an outer chamber 200 which accommodates the inner chamber 100 and has an opened lower portion, a heating module 300 which heats the inner chamber 100 in an outer space 205 provided between the inner chamber 105 and the outer chamber 200, a chamber door which opens or closes at least one of the lower portion of the inner chamber 100 and the lower portion of the outer chamber 200 by an elevating operation, a substrate holder which is provided on the chamber door and enters or exits the inner space 105 by the elevating operation of the chamber door, and a shielding element which seals the lower portion of the outer space 205 between the inner chamber 100 and the outer chamber 200.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] Embodiments of the present invention relate to an apparatus used for performing an annealing process or the like on a substrate. Background Art

[0002] During an ion implantation process performed for manufacturing a semiconductor device or the like, damage may be caused to a substrate such as a semiconductor wafer, and an annealing process may be performed for the purpose of recovering such damage.

[0003] Generally, an annealing apparatus used for performing such an annealing process may comprise a chamber that provides a substrate processing space for heat treatment of a substrate, and a heating module that raises the temperature of the substrate processing space in the chamber to a temperature within a range required for the process by a heating action. The chamber is configured to have an open lower portion, and the open lower portion may be opened and closed by a door. The heating module comprises a heater and may be provided so as to surround the chamber. When the door is opened, the substrate may be carried (loaded) into the substrate processing space or carried (unloaded) out of the substrate processing space through the open lower portion of the chamber.

[0004] In the annealing apparatus configured as described above, since the heating module provides high heat during the process, the surface of the heating module or the like may peel or fall off due to thermal damage. In addition, friction may occur between components of the heating module due to thermal expansion of the heating module. A large amount of particles may be generated due to such peeling, falling off, friction and the like. The generated particles may diffuse by scattering and contaminate the surrounding area.

[0005] In particular, during the process of loading or unloading substrates into or from the substrate processing space, particles can adhere to the surface of the substrate, potentially contaminating it. This can lead to a decrease in yield. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Korean Patent Application Publication No. 10-2006-0042705 Specification [Patent Document 2] Korean Patent Application Publication No. 10-2014-0039987 Specification [Patent Document 3] Korean Patent Application Publication No. 10-2015-0086831 Specification [Overview of the Initiative] [Problems that the invention aims to solve]

[0007] The embodiment of the present invention aims to provide a high-pressure annealing apparatus that can prevent contamination caused by particles from the heating module.

[0008] The embodiment of the present invention aims to provide a high-pressure annealing apparatus that can simultaneously prevent contamination problems caused by particles and provide stable support for the chamber.

[0009] The problems we aim to solve are not limited to these, and any other issues not mentioned should be clearly understood by any typical engineer from the following description. [Means for solving the problem]

[0010] According to an embodiment of the present invention, a high-pressure annealing apparatus can be provided, comprising: an internal chamber configured to provide an internal space for performing heat treatment on a substrate (such as a semiconductor wafer) and having an open lower section; an external chamber configured to house the internal chamber and having an open lower section; a heating module for heating the internal chamber in an external space between the internal chamber and the external chamber, which are spaced apart from each other; a chamber door that opens and closes at least one of the open lower section of the internal chamber and the open lower section of the opposing external chamber by a vertical movement, moving to a closed position when moving upward and to an open position when moving downward; a substrate support unit (substrate holder) mounted on the upper part of the chamber door, which enters and exits (feeds in and discharges) the internal space through the open lower section of the internal chamber by the vertical movement of the chamber door; and a shielding element (shielding cover) that blocks the open lower section of the external space between the internal chamber and the external chamber.

[0011] In the high-pressure annealing apparatus according to an embodiment of the present invention, a first gas, which is a reaction gas, is supplied to the internal space at a first pressure (higher than atmospheric pressure), and a second gas, which is a protective gas, is supplied to the external space at a second pressure predetermined in relation to the first pressure (the same pressure as the first pressure, or a pressure slightly higher or lower than the first pressure).

[0012] The internal chamber may be made of a non-metallic material, such as quartz. The external chamber may be made of a metallic material. The shielding element is configured to support the lower end portion of the internal chamber, which is made of quartz, in a contact manner, while being coupled to the lower end portion of the external chamber, which is made of metallic material, thereby allowing the internal chamber to be stably positioned within the internal space of the external chamber.

[0013] Specifically, the shielding element may include: an upper cover module with a ring-shaped structure that seals the lower part of the external space with its peripheral portion coupled to the lower end portion of the external chamber and its central portion supporting the lower end portion of the internal chamber; a spacer with a ring-shaped structure for supporting the upper cover module below; and a lower cover module with a ring-shaped structure positioned below the upper cover module, with its peripheral portion coupled to the lower end portion of the external chamber and its central portion supporting the spacer, thereby sealing the lower part of the external space.

[0014] The internal chamber may be provided with a flange at its lower end. The upper cover module can support the flange of the internal chamber.

[0015] The upper cover module may include an upper cover having a peripheral ring portion coupled to the lower end portion of the outer chamber and a central ring portion having a supporting upper surface for supporting the flange of the inner chamber below, and a pressurizing ring coupled to the upper cover above the upper cover and having a pressurizing lower surface for pressurizing the flange of the inner chamber.

[0016] The heating module may have a flange provided at its lower end portion that is coupled to the lower end portion of the external chamber. The upper cover may have a peripheral ring portion that is coupled to the lower end portion of the heating module, and the upper cover may be coupled to the lower end portion of the external chamber via the heating module.

[0017] The heating module may be configured to have a ring jaw positioned above the pressure ring. The upper cover module may further include an elastic member. The elastic member may be interposed between the ring jaw and the pressure ring in a vertically compressed state.

[0018] The upper cover module may further include a buffer pad interposed between the pressurized lower surface of the pressurizing ring and the flange of the internal chamber.

[0019] According to embodiments of the present invention, a high-pressure annealing apparatus may be provided, comprising: an internal chamber having an open bottom and providing an internal space for performing a heat treatment on a substrate; an external chamber having an open bottom and housing the internal chamber; a heating module for heating the internal chamber in an external space provided between the internal chamber and the external chamber; a chamber door for opening or closing at least one of the lower part of the internal chamber and the lower part of the external chamber by a vertical movement; a substrate holder provided on the chamber door and moving in and out of the internal space by the vertical movement of the chamber door; and a shielding element for sealing the lower part of the external space between the internal chamber and the external chamber, wherein the shielding element includes an upper cover and a lower cover disposed below the upper cover, and is configured to double-seal the lower part of the external space with the upper cover and the lower cover.

[0020] The means of solving the problem will become more specific and clear through the embodiments, drawings, etc., described below. In addition, various other solutions besides those mentioned may be presented below. [Effects of the Invention]

[0021] According to embodiments of the present invention, since a shielding element is included to seal the lower part of the external space, it is possible to prevent particles that may be generated from the heating module from being discharged from the external space between the internal chamber and the external chamber, thereby actively suppressing the occurrence of substrate contamination problems caused by particles and the resulting decrease in yield.

[0022] According to an embodiment of the present invention, since the shielding element is configured to support the inner chamber in a contact manner in a state where the shielding element is coupled to the outer chamber, the position of the brittle inner chamber can be stably fixed without a separate support structure.

[0023] The effects of the present invention are not limited thereto, and other effects not mentioned herein can be clearly understood by those skilled in the art from the present specification and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] [Figure 1] It is a cross-sectional view showing a high-pressure annealing apparatus according to an embodiment of the present invention. [Figure 2] It is a view showing the configuration, coupling relationship, and the like of a shielding element applied to a high-pressure annealing apparatus according to an embodiment of the present invention. [Figure 3] It is a view showing the configuration, coupling relationship, and the like of a shielding element applied to a high-pressure annealing apparatus according to an embodiment of the present invention. [Figure 4] It is a view showing the configuration, coupling relationship, and the like of a shielding element applied to a high-pressure annealing apparatus according to an embodiment of the present invention. [Figure 5] It is a view showing the configuration, coupling relationship, and the like of a shielding element applied to a high-pressure annealing apparatus according to an embodiment of the present invention. [Figure 6] It is a view showing the configuration, coupling relationship, and the like of a shielding element applied to a high-pressure annealing apparatus according to an embodiment of the present invention. [Figure 7] It is a view showing the configuration, coupling relationship, and the like of a shielding element applied to a high-pressure annealing apparatus according to an embodiment of the present invention. [Figure 8] It is a view showing the configuration, coupling relationship, and the like of a shielding element applied to a high-pressure annealing apparatus according to an embodiment of the present invention. [Figure 9] It is a view showing the configuration, coupling relationship, and the like of a shielding element applied to a high-pressure annealing apparatus according to an embodiment of the present invention. DESCRIPTION OF EMBODIMENTS FOR CARRYING OUT THE INVENTION

[0025] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings so that those with ordinary skill in the art to which the present invention pertains can easily implement them. However, the present invention can be embodied in various other forms and is not limited to the embodiments described herein.

[0026] When describing embodiments of the present invention, if it is determined that a specific description of related known functions or configurations may obscure the gist of the present invention, such specific description will be omitted, and parts having similar functions and operations will be denoted by the same reference numerals throughout the drawings.

[0027] At least some of the terms used in this specification are defined in consideration of the function of the present invention, and therefore may change depending on the intent and conventions of the user and operator. For this reason, the terms must be interpreted based on the content of the entire specification. Furthermore, when the specification states that a component is included, this does not mean that other components are excluded, but rather that other components may be included, unless otherwise stated. And when one part is said to be connected (or combined) with another part, this includes not only cases where they are directly connected (or combined), but also cases where they are indirectly connected (or combined) with other parts in between.

[0028] On the other hand, the size, shape, and line thickness of elements in drawings may be slightly exaggerated for the sake of clarity.

[0029] Embodiments of the present invention relate to a high-pressure annealing apparatus that can perform annealing processes on substrates such as semiconductor wafers under high-pressure conditions for the manufacture of semiconductor devices, prevent contamination of the substrate by particles from a heating module, and allow the internal chamber to be easily and safely fixed in place.

[0030] Figure 1 shows a high-pressure annealing apparatus according to an embodiment of the present invention. Figure 1 is a schematic cross-sectional view showing the main parts of the high-pressure annealing apparatus according to an embodiment of the present invention.

[0031] As shown in Figure 1, a high-pressure annealing apparatus according to an embodiment of the present invention may include an internal chamber 100 that provides an internal space (substrate processing space) 105 that can be isolated from the outside for heating a substrate, an external chamber 200 that houses the internal chamber 100, and a heating module 300 that is positioned in an external space (protective space) 205 between the internal chamber 100 and the external chamber 200, which are spaced apart from each other.

[0032] Although not shown in the figures, the high-pressure annealing apparatus according to the embodiment of the present invention may further include a first gas supply and exhaust unit and a second gas supply and exhaust unit. The first gas supply and exhaust unit can supply a first gas to an internal space 105 and discharge the supplied first gas from the internal space 105. The first gas may be a reaction gas. The second gas supply and exhaust unit can supply a second gas to an external space 205 and discharge the supplied second gas from the external space 205. The second gas may be a protective gas.

[0033] Furthermore, the high-pressure annealing apparatus according to an embodiment of the present invention may further include at least one temperature sensor assembly 50 for detecting the temperature of the heating module 300, a pressure measuring instrument (not shown) for detecting the pressure in the internal space 105 and the pressure in the external space 205, and a control unit (not shown) for controlling the heating module 300 based on the detected temperature input from the temperature sensor assembly 50 and controlling the first gas supply and exhaust unit and the second gas supply and exhaust unit based on the detected pressure input from the pressure measuring instrument.

[0034] In the high-pressure annealing apparatus according to the embodiment of the present invention configured as described above, when performing the annealing process, the substrate is housed in the internal space 105, the internal chamber 100 is heated by the heating module 300, the internal space 105 is created as a high-temperature atmosphere for heating the substrate, and the temperature of the internal space 105 can be maintained at the set temperature required for the process by the control action of the control unit on the heating module 300.

[0035] Furthermore, in the high-pressure annealing apparatus according to the embodiment of the present invention, when performing the annealing process, a first gas (reaction gas) can be supplied to the internal space 105 by a first gas supply and exhaust unit, and a second gas (protection gas) can be supplied to the external space 205 by a second gas supply and exhaust unit. The first gas (reaction gas) supplied to the internal space 105 can be raised to a reaction temperature by the heating action of the heating module 300, which can improve, for example, the interface properties of the substrate. During the process, the pressure in the internal space 105 can be adjusted to a first pressure within the range required for the process by the control unit's control of the first gas supply and exhaust unit, and the pressure in the external space 205 can be adjusted to a second pressure within the range corresponding to the first pressure by the control unit's control of the second gas supply and exhaust unit. The first pressure (pressure in the internal space 105) can be a pressure higher than atmospheric pressure. For example, the first pressure can be several atmospheres to several hundred atmospheres. The second pressure (pressure in the external space 205) provided by the second gas (protection gas) can be the same pressure as the first pressure. Alternatively, the second pressure may be slightly higher or slightly lower than the first pressure. Adjusting the pressure in this way prevents the internal chamber 100, etc., from being damaged or destroyed by the pressure difference between the internal space 105 and the external space 205.

[0036] The internal chamber 100 may be made of a nonmetallic material. Using a nonmetallic material for the internal chamber 100 prevents metal contamination of the substrate that may occur in high-temperature and high-pressure environments. The material of the internal chamber 100 may be quartz. The substrate may be loaded into or unloaded from the internal space 105 while supported by the substrate holder 60. The substrate holder 60, which is a substrate support unit, may be configured to support multiple substrates. For example, the substrate holder 60 may be a wafer boat that supports multiple substrates stacked vertically.

[0037] The first gas supplied to the internal space 105 at a first pressure can be selected from a variety of reaction gases for heat treatment, such as hydrogen, deuterium, oxygen, ammonia, and chlorine.

[0038] The external chamber 200 may be provided outside the internal chamber 100, house the internal chamber 100, and be configured to provide an external space 205 between the internal chamber 100 and the external chamber. The external chamber 200 may be provided to have superior strength compared to the internal chamber 100. Such an external chamber 200 may be made of metal and can safely protect the brittle internal chamber 100 from external elements.

[0039] The second gas (protective gas) supplied to the external space 205 at a second pressure can be selected from inert gases such as argon or nitrogen.

[0040] Both the internal chamber 100 and the external chamber 200 may be formed to have a substantially circular cross-section. Both the internal chamber 100 and the external chamber 200 may have an open lower section. With the internal and external chambers 100 and 200 having open lower sections, the lower end of the internal chamber 100 may be provided with an internal lower end opening (the open lower section of the internal chamber 100) 106 that communicates with the internal space 105 (see Figure 5). Similarly, the lower end of the external chamber 200 may be provided with an external lower end opening (the open lower section of the external chamber 200) 206 that communicates with the external space 205 (see Figure 4). The height of the lower end (see 206) of the external chamber 200 may be lower than that of the lower end (see 106) of the internal chamber 100. Therefore, the external lower end opening 206 of the external chamber 200 may be positioned below the internal lower end opening 106 of the internal chamber 100 and facing the internal lower end opening 106. The substrate holder 60 can be inserted into the internal space 105 or discharged from the internal space 105 via the mutually opposing internal lower end opening 106 and external lower end opening 206.

[0041] In Figure 1, reference numerals 150 and 250 indicate an internal door and an external door, respectively. The internal chamber 100 has an internal lower opening 106 which can be opened and closed by the internal door 150, and the external chamber 200 has an external lower opening 206 which can be opened and closed by the external door 250. The internal chamber 100 and the external chamber 200 can constitute a chamber. The internal door 150 and the external door 250 can constitute a chamber door. Furthermore, the chambers 100 and 200 and the chamber doors 150 and 250 can constitute a chamber unit.

[0042] The exterior door 250 can open and close the exterior lower end opening 206 by a vertical movement relative to the exterior lower end opening 206, and when the exterior lower end opening 206 is closed, it can be sealed using a ring-shaped sealing member (see S11 in Figure 4). The sealing member S11 may be interposed between the exterior chamber 200 and the exterior door 250. As an example, the sealing member S11 may be provided on the exterior lower end opening 206 side so as to be interposed between the exterior chamber 200 and the exterior door 250.

[0043] The external door 250 can be precisely raised and lowered by a lifting drive unit (not shown), such as a lifter. The internal door 150 is provided on the external door 250 and can move up and down together with the external door 250 when the external door 250 is raised and lowered by power from the lifting drive unit. When the chamber doors 150, 250 move to the closed position due to the upward movement of the external door 250 and the external door 250 closes the external lower end opening 206, the internal door 150 can close the internal lower end opening 106 while moving away from the internal lower end opening 106. Also, when the chamber doors 150, 250 move from the closed position to the open position due to the downward movement of the external door 250 and the external door 250 opens the external lower end opening 206, the internal door 150 can open the internal lower end opening 106 while moving away from the internal lower end opening 106.

[0044] The substrate holder 60 is provided on the internal door 150 and can enter and exit the internal space 105 by the raising and lowering movement of the external door 250. Specifically, when the chamber doors 150 and 250 move to the closed position by the raising movement of the external door 250, the substrate holder 60 can be loaded into the internal space 105, passing sequentially through the external lower end opening 206 and the internal lower end opening 106. Subsequently, when the chamber doors 150 and 250 move from the closed position to the open position by the lowering movement of the external door 250, the substrate holder 60 can be discharged from the internal space 105 to the outside of the chambers 100 and 200 through the internal lower end opening 106 and the external lower end opening 206. When the substrate holder 60 is discharged, the substrate can be loaded or unloaded from the substrate holder 60.

[0045] The heating module 300 may be formed to have a shape that surrounds the walls and ceiling (i.e., top) of the internal chamber 100. The heating module 300 may be provided as part of the external chamber 200, or it may be provided separately from the external chamber 200. The heating module 300 may include a heater, the heater being provided by a heating element, and may further include a heater support member that supports the heater (heating element) on the outside. As an example, the heater support member may be provided by an insulating material.

[0046] The heating module 300 may have multiple heating zones arranged vertically. The heaters of the heating module 300 may be divided into multiple sections, with at least one heater in each of the multiple heating zones. The temperature in each of the multiple heating zones may be independently controlled. Multiple temperature sensor assemblies 50 are provided, positioned at each height corresponding to the multiple heating zones, and can detect the temperature of the heating module 300 for each heating zone. The control unit can control the heating module 300 for each heating zone based on the detected temperatures input from these temperature sensor assemblies 50.

[0047] Since the heating module 300 is maintained at a high temperature when performing the heating action, the surfaces of the heater (heating wire), heater support member, etc., may peel or fall off due to thermal damage, generating particles. Particles may also be generated by friction between the heater and the heat-insulating heater support member due to thermal expansion. Particles generated from the heating module 300 in the external space 205 may fall to the external door 250 below the heating module 300, contaminating the external door 250, etc. Furthermore, they may become trapped between the external chamber 200 and the external door 250, causing a seal failure. In particular, the generated particles may be scattered and diffused into the surrounding area during the process of the substrate holder 60 being introduced into or discharged from the internal space 105, adhering to each substrate loaded into the substrate holder 60, and contaminating each substrate.

[0048] To address the various problems caused by particles from the heating module 300, the high-pressure annealing apparatus according to an embodiment of the present invention may further include a shielding element CE that seals the lower part of the external space 205 above the external door 250, thereby preventing particles generated from the heating module 300 from being discharged from the external space 205.

[0049] The configuration and coupling relationships of the shielding element CE are shown in Figures 2 to 9. Figure 2 is a perspective view showing the shielding element CE together with the internal chamber 100. Figure 3 is a cross-sectional view specifically showing a part of the shielding element CE. Figures 4 and 5 are cross-sectional views showing the shielding element CE and other components in a disassembled state.

[0050] Referring to Figure 1, the shielding element CE may be provided having a cover structure that seals the lower part of the external space 205 between the internal chamber 100 and the external chamber 200. Referring to Figure 3, the shielding element CE may be configured to be coupled to the lower end portion of the strong external chamber 200 and to support the lower end portion of the brittle internal chamber 100 in a contact manner, thereby more precisely fixing the internal chamber 100 in place. The shielding element CE may also include an upper cover 510 and further include a lower cover 430 positioned below the upper cover 510, and may be configured to more reliably seal the lower part of the external space 205 with a double seal by the upper cover 510 and the lower cover 430. Such a shielding element CE is described as follows.

[0051] Referring to Figures 2 to 4, the shielding element CE may include an upper cover module 500 with a ring-shaped structure that seals the lower part of the external space 205, with its peripheral portion connected to the lower end portion of the external chamber 200 and its central portion supporting the lower end portion of the internal chamber 100; a spacer 600 with a ring-shaped structure for supporting the upper cover module 500 from below; and a lower cover module 400 with a ring-shaped structure that is positioned below the upper cover module 500, with its peripheral portion connected to the lower end portion of the external chamber 200 and its central portion supporting the spacer 600, thereby sealing the lower part of the external space 205.

[0052] Figure 6 is a perspective view showing the lower cover module 400 and spacer 600 assembled (joined). Figures 7 and 8 show the disassembled state of the lower cover module 400 and spacer 600, and these are perspective views from different angles. Figure 9 is an exploded perspective view showing the upper cover module 500 together with the internal chamber 100.

[0053] Referring to Figures 3, 5, and 9, the internal chamber 100 may have a flange 110 that protrudes outward at its lower end, along the circumference of the lower end. The upper cover module 500 may be provided to support such flange 110 of the internal chamber 100 in a contact manner.

[0054] As shown in Figures 2 to 5 and Figure 9, the upper cover module 500 may include an upper cover 510 having a circular ring structure and a pressure ring 520 having a circular structure. The upper cover 510 may be configured to have a peripheral ring portion 512 that is firmly coupled to the lower end portion of the outer chamber 200, and a central ring portion 514 with a supporting upper surface 513 that supports the flange 110 of the inner chamber 100 from below. The pressure ring 520 may be located above the upper cover 510, coupled to the upper cover 510, and have a pressure lower surface 523 that pressurizes the flange 110 of the inner chamber 100.

[0055] The central ring portion 514 of the upper cover 510 may be formed with a central opening 518 that is sized and shaped to correspond to the internal lower end opening 106 of the internal chamber 100 (see Figure 5). The upper cover 510 and the pressure ring 520 may be joined to each other by bolts M52. The central ring portion 514 of the upper cover 510 has female thread grooves F52 that are spaced apart along the circumferential direction, and the pressure ring 520 has through holes H52 that are arranged to correspond to each female thread groove F52 of the central ring portion 514, and each bolt M52 for joining the upper cover 510 and the pressure ring 520 may be screwed to each female thread groove F52 of the central ring portion 514 via each through hole H52 of the pressure ring 520 (see Figures 3 and 5). As shown in Figure 5, one or more sealing members S52, such as O-rings, may be interposed between the lower surface of the flange 110 constituting the internal chamber 100 and the support upper surface 513 of the central ring portion 514 constituting the upper cover 510 to maintain airtightness. Such sealing members S52 interposed between the flange 110 of the internal chamber 100 and the central ring portion 514 of the upper cover 510 are provided on the support upper surface 513 of the central ring portion 514 along the circumferential direction and may be in the shape of a circular ring.

[0056] Referring to Figures 3 to 5, the heating module 300 may have a circular structural flange 310 provided at its lower end, which is coupled to the lower end portion of the outer chamber 200. The flange 310 of the heating module 300 may protrude outward and be provided around the lower end of the heating module 300. The outer chamber 200 may have a ring-shaped step 210 at the lower end portion of the inner wall of the outer chamber 200, which provides a lower surface opposite to the upper surface of the flange 310 of the heating module 300. The outer chamber 200 and the heating module 300 may be coupled to each other by bolts M31. The flange 310 of the heating module 300 is provided with through holes H31 arranged at intervals along the circumferential direction, and the step 210 of the outer chamber 200 is provided with female thread grooves F21 corresponding to each of the through holes H31 of the heating module 300, and each bolt M31 for joining the outer chamber 200 and the heating module 300 can be screwed to each female thread groove F21 of the step 210 via each of the through holes H31 of the heating module 300. A sealing member S31 may be interposed between the step 210 of the outer chamber 200 and the flange 310 of the heating module 300 to maintain airtightness. The sealing member S31 interposed between the step 210 of the outer chamber 200 and the flange 310 of the heating module 300 may be provided along the circumferential direction on the flange 310 of the heating module 300. The sealing member S31 between the step 210 of the external chamber 200 and the flange 310 of the heating module 300 may be ring-shaped.

[0057] The upper cover 510 can be connected to the lower end of the external chamber 200 via the heating module 300, with the peripheral ring portion 512 being connected to the lower end of the heating module 300. Referring to Figure 5, the heating module 300 and the upper cover 510 can be connected to each other by bolts M51. The peripheral ring portion 512 of the upper cover 510 has through holes H51 arranged at intervals along the circumferential direction, and the heating module 300 has female thread grooves F31 corresponding to each through hole H51 of the peripheral ring portion 512, and each bolt M51 for connecting the heating module 300 and the upper cover 510 can be screwed to each female thread groove F31 of the heating module 300 via each through hole H51 of the peripheral ring portion 512. The space between the heating module 300 and the upper cover 510 can be kept airtight by a sealing member S51. A sealing member S51 for maintaining airtightness between the heating module 300 and the upper cover 510 may be interposed between the lower end portion of the heating module 300 and the peripheral ring portion 512 of the upper cover 510. The sealing member S51 between the heating module 300 and the upper cover 510 may be provided along the circumferential direction of the peripheral ring portion 512. The sealing member S51 between the heating module 300 and the upper cover 510 may be ring-shaped.

[0058] The heating module 300 may have a ring jaw 320 positioned above the pressure ring 520. The upper cover module 500 may further include an elastic member (elastic ring) 530 provided to have a circular ring structure. The elastic member 530 may be interposed in a vertically compressed state between the lower surface of the ring jaw 320 and the upper surface of the pressure ring 520. When the elastic member 530 is interposed between the lower surface of the ring jaw 320 and the upper surface of the pressure ring 520 and the upper cover 510 is coupled to the heating module 300 by bolts M51, the elastic member 530 may be compressed vertically by the upper ring jaw 320 and the lower pressure ring 520. The elastic member 530 may be deformed by such vertical compression into a shape in which its inner circumference is in close contact with the outer surface of the internal chamber 100 while becoming relatively flat. With such an elastic member 530, it is possible to stably maintain the pressurized state of the pressure ring 520 against the flange 110 of the internal chamber 100, and to naturally support the lower part of the internal chamber 100 around it.

[0059] Referring to Figures 3 and 9, the upper cover module 500 may further include a ring-shaped pad 540 interposed between the pressurized lower surface 523 of the pressurized ring 520 (see Figure 5) and the upper surface of the flange 110 of the internal chamber 100. The pad 540 is a cushioning pad having an impact mitigation function, and the cushioning pad 540 may be configured to have a predetermined elasticity. For example, the cushioning pad 540 may be made of an elastic material such as rubber and may have a sealing function in addition to an impact mitigation function. The cushioning pad 540 configured in this way can absorb stress, impacts, etc. that may be applied to the flange 110 of the internal chamber 100 when the flange 110 of the internal chamber 100 is pressurized using the pressurized ring 520. Therefore, the cushioning pad 540 can prevent the problem of the brittle flange 110 of the internal chamber 100 being damaged. Although not shown in the diagram, a pad substantially identical or similar to the cushioning pad 540 may also be interposed between the support upper surface 513 of the central ring portion 514 of the upper cover 510 (see Figure 5) and the lower surface of the flange 110 of the internal chamber 100.

[0060] Referring to Figures 1, 4, and 6, the spacer 600 may be provided as a manifold. The ring-shaped body 610 of the manifold 600 can support a nozzle assembly 70 for distributing the first gas into the internal space 105. The first gas supply and exhaust unit is connected to the nozzle assembly 70 and can supply the first gas into the internal space 105 via the nozzle assembly 70.

[0061] Referring to Figures 3, 6 to 8, etc., the lower cover module 400 may include an inward-facing flange member 410, a central coupling member 420, and a lower cover 430 between the flange member 410 and the coupling member 420.

[0062] The flange member 410 may be provided on the lower end portion of the outer chamber 200. The flange member 410 may project inward and be provided along the inner circumference of the lower end portion of the outer chamber 200. For example, the flange member 410 may be integral with the outer chamber 200 or may be welded to the outer chamber 200.

[0063] The coupling member 420 may be formed to have a ring structure. The coupling member 420 may be formed to have an opening corresponding to the internal lower end opening 106 of the internal chamber 100. The coupling member 420 may be provided to include a central coupling portion 424 having an opening corresponding to the internal lower end opening 106 of the internal chamber 100, and a peripheral coupling portion 422 formed around the central coupling portion 424.

[0064] The central connecting portion 424 of the connecting member 420 may have a jaw 426 that connects to the ring-shaped lower end projection 630 of the manifold 600, which is a spacer (see Figures 3 and 4). The manifold 600 has a ring-shaped upper end projection 620, and the central ring portion 514 of the upper cover 510 may have a jaw 516 that connects to the upper end projection 620 of the manifold 600 (see Figures 3 and 5). Although not shown, sealing members may be interposed between the upper cover 510 and the manifold 600, and between the connecting member 420 and the manifold 600. The position of the manifold 600 can be fixed by the jaws 426 and 516.

[0065] The lower cover 430 may be formed to have a ring structure. The upper surface of the peripheral portion of the lower cover 430 may be joined to the lower surface of the flange member 410 by bolts M41. Referring to Figures 3, 4, 6 to 8, etc., the lower cover 430 may have through holes H41 that penetrate vertically through the peripheral portion, arranged at intervals along the circumferential direction. The flange member 410 may have female thread grooves F41 corresponding to each through hole H41 in the peripheral portion of the lower cover 430. Each bolt M41 for joining the flange member 410 and the lower cover 430 may be screwed into each female thread groove F41 of the flange member 410 via each through hole H41 in the peripheral portion of the lower cover 430. The flange member 410 and the lower cover 430 may be kept airtight by a sealing member S41. A sealing member S41 for maintaining airtightness between the flange member 410 and the lower cover 430 may be interposed between the lower surface of the flange member 410 and the upper surface of the peripheral portion of the lower cover 430. The sealing member S41 between the flange member 410 and the lower cover 430 may be provided circumferentially along the peripheral portion of the lower cover 430. The sealing member S41 between the flange member 410 and the lower cover 430 may be ring-shaped.

[0066] The lower cover 430 of the ring structure can be connected to the lower surface of the peripheral connecting portion 422 of the connecting member 420 by bolts M42 at the upper surface of the central portion. Referring to Figures 3, 4, 6 to 8, etc., the lower cover 430 may have through holes H42 that penetrate vertically through the central portion, arranged at intervals along the circumferential direction. The peripheral connecting portion 422 of the connecting member 420 may have female thread grooves F42 corresponding to each through hole H42 in the central portion of the lower cover 430. Each bolt M42 for connecting the connecting member 420 and the lower cover 430 can be screwed into each female thread groove F42 of the peripheral connecting portion 422 of the connecting member 420 via each through hole H42 in the central portion of the lower cover 430. The space between the connecting member 420 and the lower cover 430 can be kept airtight by a sealing member S42. A sealing member S42 for maintaining airtightness between the connecting member 420 and the lower cover 430 may be interposed between the lower surface of the peripheral connecting portion 422 of the connecting member 420 and the upper surface of the central portion of the lower cover 430. The sealing member S42 between the connecting member 420 and the lower cover 430 may be provided circumferentially along the central portion of the lower cover 430. The sealing member S42 between the connecting member 420 and the lower cover 430 may be ring-shaped.

[0067] On the other hand, as shown in Figure 1, the internal door 150 may be configured to contact the coupling member 420 (or lower cover 430) of the lower cover module 400, which is not the lower end of the internal chamber 100, when the internal lower end opening 106 is closed. This prevents the internal door 150 from directly contacting the lower end of the internal chamber 100 when the internal lower end opening 106 is closed, thus preventing a relatively large impact from being applied to the brittle internal chamber 100. Although not shown, when the internal lower end opening 106 is closed, a sealing member such as an O-ring may be interposed between the internal door 150 and the coupling member 420 to maintain airtightness. The elastic member 530 can absorb any impact that may be applied to the internal chamber 100 during the closing process of the internal lower end opening 106.

[0068] As described above, with the shielding element CE configured as described, the lower part of the external space 205 provided between the internal chamber 100 and the external chamber 200 is sealed in the high-pressure annealing apparatus according to the embodiment of the present invention. This prevents particles that may be generated from the heating module 300 from being discharged from the external space 205 between the internal chamber 100 and the external chamber 200, thereby actively suppressing the occurrence of substrate contamination problems caused by particles and the resulting decrease in yield. Furthermore, in the high-pressure annealing apparatus according to the embodiment of the present invention, the brittle internal chamber 100 is supported in a contact manner while the shielding element CE is coupled to the external chamber 200, which has relatively superior strength. Therefore, the position of the brittle internal chamber 100 can be stably fixed without a separate support structure.

[0069] Although the present invention has been described above, the present invention is not limited to the disclosed embodiments and accompanying drawings, and can be modified in various ways by a person of ordinary skill without departing from the technical spirit of the present invention. Furthermore, the technical ideas described in the embodiments of the present invention may be implemented independently, or two or more may be implemented in combination with each other. [Explanation of Symbols]

[0070] 100 internal chambers 105 Internal space (substrate processing space) 150 Interior Doors 200 External Chamber 205 External space (protected space) 250 Exterior Doors 300 Heating Modules 400 Lower cover module 410 Flange member 420 Connecting member 430 Lower cover 500 Upper cover module 510 Top cover 520 Pressure Ring 530 Elastic member 540 cushioning pads 600 Spacer CE shielding element

Claims

1. An internal chamber is provided, which has an open bottom, and which provides an internal space for performing heat treatment on the substrate. An external chamber, which houses the aforementioned internal chamber and has an open bottom, A heating module that heats the internal chamber in the external space provided between the internal chamber and the external chamber, A chamber door that opens or closes at least one of the lower part of the internal chamber and the lower part of the external chamber by a lifting motion, A substrate holder provided on the chamber door, which moves in and out of the internal space by the raising and lowering motion of the chamber door, The inner chamber and the outer chamber include a shielding element that seals the lower part of the outer space, The shielding element is, Including an upper cover module and a lower cover module positioned below the upper cover module, The lower part of the external space is configured to be double-sealed by the upper cover module and the lower cover module. High-pressure annealing device.

2. The first gas is supplied to the internal space at a first pressure. The high-pressure annealing apparatus according to claim 1, characterized in that a second gas is supplied to the external space at a second pressure predetermined in relation to the first pressure.

3. The high-pressure annealing apparatus according to claim 1 or claim 2, characterized in that the internal chamber is made of quartz material.

4. The shielding element is, The upper cover module has a ring-shaped structure that seals the lower part of the external space, with its peripheral portion connected to the lower end portion of the external chamber and its central portion supporting the lower end portion of the internal chamber. A ring-shaped spacer for supporting the upper cover module from below, The high-pressure annealing apparatus according to claim 1 or 2, further comprising a lower cover module having a ring-shaped structure, which is positioned below the upper cover module, with its peripheral portion coupled to the lower end portion of the external chamber, and its central portion supporting the spacer, thereby sealing the lower part of the external space.

5. The internal chamber is provided with a flange at the lower end portion of the internal chamber. The high-pressure annealing apparatus according to claim 4, characterized in that the upper cover module supports the flange of the internal chamber.

6. The aforementioned upper cover module is An upper cover having a peripheral ring portion that is coupled to the lower end portion of the outer chamber, and a central ring portion that has a support upper surface that supports the flange of the inner chamber from below, The high-pressure annealing according to claim 5, characterized in that it includes a pressure ring which is coupled to the upper cover above the upper cover and has a pressurizing lower surface for pressurizing the flange. A device.

7. The heating module has a flange that is coupled to the lower end portion of the external chamber, and the flange is provided at the lower end portion of the heating module. The high-pressure annealing apparatus according to claim 6, characterized in that the upper cover is connected to the lower end portion of the heating module by the peripheral ring portion and to the lower end portion of the external chamber via the heating module.

8. The heating module has a ring jaw positioned above the pressurizing ring, The upper cover module further includes an elastic member, The high-pressure annealing apparatus according to claim 6, characterized in that the elastic member is interposed between the ring jaw and the pressure ring in a compressed state.

9. The aforementioned upper cover module is The high-pressure annealing apparatus according to claim 6, further comprising a buffer pad interposed between the pressurized lower surface of the pressurizing ring and the flange of the internal chamber.

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