Conveyor and end effector

Abstract

To reduce footprint of the whole system including a transport device.SOLUTION: A transport device for simultaneously or individually transporting a wafer and a circular consumable component comprises an end effector, an arm, and a controller. The consumable component can be disposed in a wafer processing module and an external diameter of the consumable component is larger than an external diameter of the wafer. The end effector is configured to simultaneously or individually mount the wafer and the consumable component. The arm is configured to move the end effector. When transporting the consumable component, the controller controls the arm so that the consumable component is mounted on the end effector so that the center of gravity of the consumable component agrees with a first position. When transporting the wafer, the controller controls the arm so that the wafer is mounted on the end effector so that the center of gravity of the wafer agrees with a second position between the first position and a tip of the end effector.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] Various aspects and embodiments of the present disclosure relate to a conveying apparatus Place and an end effector. Background Art

[0002] For example, Patent Document 1 below discloses a conveying apparatus that conveys not only wafers but also consumable parts in a processing apparatus. This enables replacement of consumable parts without venting the chamber of the processing apparatus to atmosphere, thereby shortening the downtime of a processing apparatus that performs processing under low pressure. Prior Art Documents Patent Documents

[0003] Patent Document 1 Japanese Unexamined Patent Publication No. 2020-96149 Summary of the Invention Problem to be Solved by the Invention

[0004] The present disclosure provides a conveying apparatus Place and an end effector that can reduce the footprint of the entire system including the conveying apparatus. Means for Solving the Problem

[0005] One aspect of this disclosure is a transport device for transporting a wafer and a consumable part having a circular outline, either simultaneously or separately, comprising an end effector, an arm, and a control device. The consumable part can be placed within a wafer processing module, and the outer diameter of the consumable part is greater than the outer diameter of the wafer. The end effector is configured to place the wafer and the consumable part simultaneously or separately. The arm is configured to move the end effector. When transporting a consumable part, the control device controls the arm so that the consumable part is placed on the end effector so that its center of gravity coincides with a first position. When transporting a wafer, the control device controls the arm so that the wafer is placed on the end effector so that its center of gravity coincides with a second position between the first position and the tip of the end effector. [Effects of the Invention]

[0006] According to various aspects and embodiments of this disclosure, the footprint of the entire system, including the conveying device, can be reduced. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is a plan view showing an example of a processing system in one embodiment. [Figure 2] Figure 2 is a schematic cross-sectional view showing an example of a processing module. [Figure 3] Figure 3 shows an example of an ashing module. [Figure 4] Figure 4 is a plan view showing an example of an end effector in the first embodiment. [Figure 5] Figure 5 is a side view showing an example of an end effector in the first embodiment. [Figure 6] Figure 6 is a plan view showing an example of the positional relationship between the wafer and the edge ring when it is placed on the end effector within the vacuum transport module. [Figure 7] Figure 7 is a plan view showing an example of an end effector used when transporting a wafer in the first embodiment. [Figure 8] Figure 8 is a side view showing an example of an end effector used when transporting a wafer in the first embodiment. [Figure 9] Figure 9 shows an example of the positional relationship between the end effector and the ashing module when a wafer is loaded into the ashing module in a comparative example. [Figure 10] Figure 10 shows an example of the positional relationship between the end effector and the ashing module when a wafer is loaded into the ashing module in this embodiment. [Figure 11] Figure 11 is a plan view showing an example of an end effector used when transporting an edge ring in the first embodiment. [Figure 12] Figure 12 is a side view showing an example of an end effector used when transporting an edge ring in the first embodiment. [Figure 13] Figure 13 is a flowchart showing an example of a transport method in the first embodiment. [Figure 14] Figure 14 is a plan view showing an example of the positional relationship between the wafer and the edge ring when it is placed on the end effector within the atmospheric transport module. [Figure 15] Figure 15 is a side view showing another example of the end effector in the second embodiment. [Figure 16] Figure 16 is a side view showing an example of an end effector in a second embodiment where a wafer and an edge ring are transported simultaneously. [Figure 17] Figure 17 is a plan view showing an example of the positional relationship between the wafer and the edge ring when the wafer and edge ring are transported simultaneously in the second embodiment. [Modes for carrying out the invention]

[0008] Below, Place Embodiments of the end effector will be described in detail with reference to the drawings. The conveying equipment disclosed in the following embodiments will be described in detail with reference to the drawings. Placeand the end effector are not limited.

[0009] By the way, when wafers and consumable parts are conveyed, the wafers and consumable parts are placed on the end effector provided at the tip of a robot arm such that their center of gravity is located at a predetermined position on the end effector. When the consumable part is a ring-shaped part larger than a wafer, such as an edge ring, if the position where the consumable part is placed is too close to the tip side of the end effector, the consumable part may fall off the end effector as the end effector moves. Therefore, it is necessary to prevent the position where the consumable part is placed from being too close to the tip side of the end effector. Accordingly, the consumable part is placed on the end effector such that the center of gravity of the consumable part is located at a position away from the tip of the end effector.

[0010] On the other hand, when conveying a wafer having an outer shape smaller than a consumable part, if the wafer is placed on the end effector such that the center of gravity of the consumable part when conveying the consumable part coincides with the center of gravity of the wafer, the tip of the end effector will protrude from the area below the wafer. If the portion of the end effector protruding from the area below the wafer is large, the end effector will become an obstacle when conveying the wafer into an apparatus that does not have a space reserved for accommodating consumable parts, making it difficult to carry the wafer to a predetermined position in the apparatus.

[0011] In order to carry the wafer to a predetermined position in the apparatus without the end effector becoming an obstacle, it is also conceivable to expand the space inside the apparatus that does not have a reserved space for accommodating consumable parts. However, in this case, the footprint of such an apparatus increases, which leads to an increase in the footprint of the entire system.

[0012] Accordingly, the present disclosure provides a technology capable of reducing the footprint of the entire system including a conveyance device.

[0013] (First Embodiment) [Configuration of Processing System 1] Figure 1 is a plan view showing an example of the configuration of a processing system 1 in one embodiment. In Figure 1, some of the internal components of the device are shown transparently for convenience. The processing system 1 comprises a device body 10 and a control device 100 that controls the device body 10.

[0014] The apparatus body 10 comprises a vacuum transport module 11, a plurality of processing modules 12, a plurality of ashing modules 13, a plurality of load lock modules 14, and an atmospheric transport module 15. The plurality of processing modules 12 are connected to the side wall of the vacuum transport module 11 via a gate valve G1. The processing module 12 is an example of a processing unit. In the example in Figure 1, eight processing modules 12 are connected to the vacuum transport module 11, but the number of processing modules 12 connected to the vacuum transport module 11 may be seven or fewer, or nine or more. Each processing module 12 is an example of a first wafer processing module.

[0015] Each processing module 12 performs processes such as etching and film deposition on the wafer W to be processed. Figure 2 is a schematic cross-sectional view showing an example of a processing module 12. The processing module 12 includes a chamber 120, an RF (Radio Frequency) power supply unit 123, a gas supply unit 124, and an exhaust system 125.

[0016] An opening is formed in the side wall of the chamber 120, which is opened and closed by a gate valve G1. The chamber 120 has a support portion 121 and an upper shower head assembly 122. The support portion 121 is located in the lower region of the processing space 120S within the chamber 120. The upper shower head assembly 122 is located above the support portion 121 and may function as part of the top plate of the chamber 120.

[0017] The support portion 121 is configured to support the wafer W in the processing space 120S. In this embodiment, the support portion 121 includes an edge ring ER, an electrostatic chuck 121a, and a lower electrode 121b. The electrostatic chuck 121a is positioned on the lower electrode 121b and is configured to support the wafer W with its upper surface. In this embodiment, the outer shape of the electrostatic chuck 121a is circular. The electrostatic chuck 121a is an example of a consumable part. The edge ring ER is formed in an annular shape and is provided on the upper surface of the peripheral edge of the lower electrode 121b. The edge ring ER is positioned on the upper surface of the peripheral edge of the lower electrode 121b so as to surround the electrostatic chuck 121a and the wafer W. In this embodiment, the outer shape of the edge ring ER is circular. The edge ring ER is an example of a consumable part and an example of an annular part.

[0018] The upper shower head assembly 122 is configured to supply one or more types of gas from the gas supply unit 124 into the processing space 120S. A cover member 122d is detachably provided on the lower surface of the upper shower head assembly 122. In this embodiment, the outer shape of the cover member 122d is circular. The cover member 122d is an example of a consumable part. In this embodiment, the upper shower head assembly 122 has a gas inlet 122a and a gas diffusion chamber 122b. The upper shower head assembly 122 has a plurality of gas outlets 122c formed therein, and the gas diffusion chamber 122b and the processing space 120S are in fluid communication via the plurality of gas outlets 122c. In this embodiment, the upper shower head assembly 122 is configured to supply one or more types of gas from the gas inlet 122a into the processing space 120S via the gas diffusion chamber 122b and the plurality of gas outlets 122c.

[0019] The gas supply unit 124 includes a gas source 124a and a flow controller 124b. The gas source 124a is a source for supplying processing gases such as etching gas and film deposition gas. The flow controller 124b may include, for example, a mass flow controller or a pressure-controlled flow controller. The gas supply unit 124 may also include one or more flow modulation devices that modulate or pulse the flow rates of one or more processing gases.

[0020] The RF power supply unit 123 is configured to supply, for example, 1 or more RF power to one or more electrodes, such as the lower electrode 121b, the upper showerhead assembly 122, or both the lower electrode 121b and the upper showerhead assembly 122. In this embodiment, the RF power supply unit 123 includes two RF generation units 123a, 123b, and two matching units 123c, 123d. In this embodiment, the RF power supply unit 123 is configured to supply a first RF power from the RF generation unit 123a to the lower electrode 121b via the matching unit 123c. The RF spectrum encompasses a portion of the electromagnetic spectrum in the range of 3 Hz to 3000 GHz. With respect to electronic material processes such as semiconductor processes, the frequency of the RF spectrum used for plasma generation is preferably in the range of 100 kHz to 3 GHz, more preferably in the range of 200 kHz to 150 MHz. For example, the frequency of the first RF power may be within the range of 27 MHz to 100 MHz.

[0021] Furthermore, in this embodiment, the RF power supply unit 123 is configured to supply the second RF power from the RF generation unit 123b to the lower electrode 121b via the matching unit 123d. For example, the frequency of the second RF power may be within the range of 400 [kHz] to 13.56 [MHz]. Alternatively, the RF power supply unit 123 may have a DC (Direct Current) pulse generation unit instead of the RF generation unit 123b.

[0022] Furthermore, although not shown in the figures, other embodiments are considered. For example, in the RF power supply unit 123 of an alternative embodiment, an RF generation unit may be configured to supply a first RF power to the lower electrode 121b, and another RF generation unit may be configured to supply a second RF power to the lower electrode 121b. Further, another RF generation unit may be configured to supply a third RF power to the upper shower head assembly 122. In addition, in other alternative embodiments, a DC voltage may be applied to the upper shower head assembly 122. Moreover, in various embodiments, the amplitude of one or more RF powers (i.e., a first RF power, a second RF power, etc.) may be pulsed or modulated. Amplitude modulation may include pulsing the amplitude of the RF power between an on state and an off state, or between a plurality of different on states. Phase matching of the RF powers may also be controlled, and the phase matching of the amplitude modulation of multiple RF powers may be synchronous or asynchronous.

[0023] The exhaust system 125 is connected to an exhaust port 120e, for example, located at the bottom of the chamber 120. The exhaust system 125 may include a vacuum pump such as a pressure valve, a turbomolecular pump, a roughing pump, or a combination thereof.

[0024] Returning to Figure 1, let's continue the explanation. Multiple ashing modules 13 are connected to the other side wall of the vacuum transport module 11 via gate valves G2. Each ashing module 13 is an example of a second wafer processing module. The ashing modules 13 remove the mask remaining on the wafer W after processing by the processing module 12 by ashing. Inside the ashing module 13, there is a stage 130 on which the wafer W is placed, as shown in Figure 3, for example. The center of gravity of the stage 130 is at position P0. When the wafer W is loaded into the ashing module 13, the wafer W is placed on the stage 130 so that the center of gravity of the wafer W is positioned at position P0 on the stage 130. In the example in Figure 1, two ashing modules 13 are connected to the vacuum transport module 11, but the number of ashing modules 13 connected to the vacuum transport module 11 may be one or three or more.

[0025] Multiple load lock modules 14 are connected to the other side walls of the vacuum transport module 11 via gate valves G3. In the example shown in Figure 1, two load lock modules 14 are connected to the vacuum transport module 11, but the number of load lock modules 14 connected to the vacuum transport module 11 may be one or three or more. At least one of the two load lock modules 14 is capable of accommodating the wafer W and the edge ring ER.

[0026] A transport robot 20a is positioned inside the vacuum transport module 11. The transport robot 20a has an end effector 21a and an arm 22a. A wafer W and an edge ring ER are placed on the end effector 21a. The arm 22a moves the end effector 21a. The transport robot 20a moves within the vacuum transport module 11 along a guide rail 110 provided inside the vacuum transport module 11, transporting the wafer W between the processing module 12, the ashing module 13, and the load lock module 14. The transport robot 20a may be fixed in a predetermined position within the vacuum transport module 11 and may not move within the vacuum transport module 11. The transport robot 20a is an example of a transport device and a vacuum transport robot. The inside of the vacuum transport module 11 is maintained at a pressure atmosphere lower than atmospheric pressure.

[0027] A vacuum transport module 11 is connected to one side wall of each load lock module 14 via a gate valve G3, and an atmospheric transport module 15 is connected to the other side wall via a gate valve G4. When a wafer W is loaded into the load lock module 14 from the atmospheric transport module 15 via the gate valve G4, the gate valve G4 is closed, and the pressure inside the load lock module 14 is reduced from atmospheric pressure to a predetermined pressure. Then, the gate valve G3 is opened, and the wafer W inside the load lock module 14 is transported into the vacuum transport module 11 by the transport robot 20a.

[0028] Furthermore, while the pressure inside the load lock module 14 is lower than atmospheric pressure, the transport robot 20a loads the wafer W from the vacuum transport module 11 into the load lock module 14 via the gate valve G3, and the gate valve G3 is closed. Then, the pressure inside the load lock module 14 is raised to atmospheric pressure. Finally, the gate valve G4 is opened, and the wafer W inside the load lock module 14 is transported into the atmospheric transport module 15. The loading and unloading of the edge ring ER is done in the same manner.

[0029] Multiple load ports 16 are provided on the side wall of the atmospheric transport module 15 opposite to the side wall of the atmospheric transport module 15 where the gate valve G4 is installed. Each load port 16 is connected to a container such as a FOUP (Front Opening Unified Pod) capable of accommodating multiple wafers W. The atmospheric transport module 15 may also be equipped with an aligner module or the like to change the orientation of the wafers W. In addition, a container capable of accommodating an edge ring ER is connected to one of the multiple load ports 16.

[0030] A transport robot 20b is provided inside the atmospheric transport module 15, and the transport robot 20b has an end effector 21b and an arm 22b. The transport robot 20b is an example of an atmospheric transport robot, and the end effector 21b on the transport robot 20b is an example of an additional end effector. The pressure inside the atmospheric transport module 15 is atmospheric pressure. The transport robot 20b inside the atmospheric transport module 15 moves along the guide rail 150 and transports wafers W and edge rings ER between the load lock module 14 and the container connected to the load port 16. The transport robot 20b may also be fixed in a predetermined position inside the atmospheric transport module 15 and may not move inside the atmospheric transport module 15. An FFU (Fan Filter Unit), etc., is provided at the top of the atmospheric transport module 15, and air from which particles, etc. have been removed is supplied to the atmospheric transport module 15 from above, creating a downflow inside the atmospheric transport module 15. In this embodiment, the atmosphere inside the atmospheric transport module 15 is atmospheric pressure, but in other configurations, the pressure inside the atmospheric transport module 15 may be controlled to be positive pressure. This can suppress the intrusion of particles and other contaminants from the outside into the atmospheric transport module 15.

[0031] The control device 100 has memory, a processor, and an input / output interface. The memory stores data such as recipes and programs. The memory is, for example, RAM (Random Access Memory), ROM (Read Only Memory), HDD (Hard Disk Drive), or SSD (Solid State Drive). The processor controls each part of the device body 10 via the input / output interface based on the data such as recipes stored in the memory by executing programs read from the memory. The processor is a CPU (Central Processing Unit) or a DSP (Digital Signal Processor).

[0032] [Details of End Effector 21a] Figure 4 is a plan view showing an example of an end effector 21a in the first embodiment. Although Figure 4 illustrates an end effector 21a on a transport robot 20a, the configuration is similar for an end effector 21b on a transport robot 20b. The end effector 21a has a main body 210 having an upper surface, a plurality of first holding parts 211a to 211c arranged on the upper surface of the main body 210, and a plurality of second holding parts 212a to 212c arranged on the upper surface of the main body 210. Each of the first holding parts 211a to 211c is formed of an elastic material such as rubber and holds an edge ring ER. Each of the second holding parts 212a to 212c is formed of an elastic material such as rubber and holds a wafer W. Each of the plurality of first holding parts 211a to 211c is an example of a consumable part support pad. Each of the multiple second holding portions 212a to 212c is an example of a wafer support pad.

[0033] The main body 210 has regions R1, R2, and R3. Regions R1 and R2 overlap with each other when viewed from direction D shown in Figure 4. The first retaining portion 211a and the second retaining portion 212a are located in region R1, the first retaining portion 211b and the second retaining portion 212b are located in region R2, and the first retaining portion 211c and the second retaining portion 212c are located in region R3. Region R1 is an example of a first tip region, region R2 is an example of a second tip region, and region R3 is an example of a rear end region. Distance d is an example of a first direction. The first retaining portion 211a is an example of a first consumable part support pad, the first retaining portion 211b is an example of a second consumable part support pad, and the first retaining portion 211c is an example of a third consumable part support pad. Furthermore, the second holding portion 212a is an example of the first wafer support pad, the second holding portion 212b is an example of the second wafer support pad, and the second holding portion 212c is an example of the third wafer support pad.

[0034] In addition, in the transport robot 20b provided within the atmospheric transport module 15, the first holding parts 211a to 211c and the second holding parts 212a to 212c may each be vacuum pads that hold and adsorb members by sucking in air.

[0035] Figure 5 is a side view showing an example of an end effector 21a in the first embodiment. Although Figure 5 illustrates an end effector 21a on a transport robot 20a, the end effector 21b on a transport robot 20b has a similar configuration. The height of the first holding parts 211a to 211c from the top surface of the main body 210 is h2, and the height of the second holding parts 212a to 212c from the top surface of the main body 210 is h1. In this embodiment, h1 is higher than h2. h1 is an example of the first height, and h2 is an example of the second height.

[0036] When the edge ring ER is transported, reaction by-products (so-called deposits) may be attached to the transported edge ring ER. Therefore, when an edge ring ER with deposits attached is transported, the deposits attached to the edge ring ER may fall as particles onto the first holding parts 211a to 211c and the end effector 21a, etc.

[0037] If particles adhere to the first holding parts 211a to 211c, etc., and the wafer W is held in the first holding parts 211a to 211c, the wafer W may be contaminated by particles that fall onto the first holding part 211. In contrast, in this embodiment, the wafer W is not held in the first holding parts 211a to 211c where the edge ring ER is held, so contamination of the wafer W can be suppressed.

[0038] Furthermore, if the height h1 of the second holding parts 212a to 212c is equal to or lower than the height h2 of the first holding parts 211a to 211c, particles that have fallen from the edge ring ER onto the first holding parts 211a to 211c or the end effector 21a may reattach to the wafer W when the wafer W is transported. In contrast, in this embodiment, the height h1 of the second holding parts 212a to 212c, which hold the wafer W, is higher than the height h2 of the first holding parts 211a to 211c, which hold the edge ring ER. Therefore, it is possible to suppress the reattachment of particles on the first holding parts 211a to 211c or the end effector 21a to the wafer W.

[0039] Figure 6 is a plan view showing an example of the positional relationship between the wafer W and the edge ring ER when placed on the end effector 21a in the vacuum transport module 11. When the edge ring ER is placed on the end effector 21a, the position of the outer shape of the edge ring ER is, for example, as shown by circle C1 in Figure 6. The centroid of circle C1 is position P1. That is, when the edge ring ER is placed on the end effector 21a, the edge ring ER is placed on the end effector 21a such that the centroid of the edge ring ER is at position P1. Position P1 is an example of a first position.

[0040] When the wafer W is placed on the end effector 21a, the position of the outer shape of the wafer W is, for example, as shown by circle C2 in Figure 6. The centroid of circle C2 is position P2. That is, when the wafer W is placed on the end effector 21a, the wafer W is placed on the end effector 21a such that the centroid of the wafer W is at position P2. Position P2 is an example of a second position. Also, as illustrated in Figure 6, the dimension by which a part of the wafer W protrudes from the tip of the end effector 21a is the same as the dimension by which a part of the edge ring ER protrudes from the tip of the end effector 21a.

[0041] In this embodiment, the distance d1 from the tip of the end effector 21a to position P1 is longer than the distance d2 from the tip of the end effector 21a to position P2. That is, when the edge ring ER is transported, the edge ring ER is placed on the end effector 21a such that its center of gravity coincides with position P1. Also, when the wafer W is transported, the wafer W is placed on the end effector 21a such that its center of gravity coincides with position P2, which is between position P1 and the tip of the end effector 21a.

[0042] Furthermore, when the wafer W is being transported, the wafer W is placed on the end effector 21a, as shown in Figures 7 and 8, for example. Figure 7 is a plan view showing an example of the end effector 21a when transporting the wafer W in the first embodiment, and Figure 8 is a side view showing an example of the end effector 21a when transporting the wafer W in the first embodiment. For example, as shown in Figure 7, the width of the end effector 21a is smaller than the outer shape of the wafer W. Furthermore, when the wafer W is being transported, the wafer W is placed on the end effector 21a such that the edge of the wafer W in the width direction of the end effector 21a is located outside the area of ​​the end effector 21. In the example of Figure 6, the edge of the wafer W is placed on the end effector 21a such that it protrudes by a distance d3 from the area of ​​the end effector 21a in the width direction of the end effector 21a.

[0043] Furthermore, when the wafer W is transported, the wafer W is placed on the end effector 21a such that the edge of the wafer W in a direction intersecting the width direction of the end effector 21a is located outside the area of ​​the end effector 21a. That is, the wafer W is placed on the end effector 21a such that a portion of the wafer W protrudes from the tip of the end effector 21a. In the example of Figure 7, the wafer W is placed on the end effector 21a such that the edge of the wafer W is at a distance d4 from the tip of the end effector 21a in a direction intersecting the width direction of the end effector 21a (for example, the vertical direction in Figure 7).

[0044] Here, we consider as a comparative example the case in which the wafer W is placed on the end effector 21a such that the center of gravity of the wafer W coincides with the same position P1 as the center of gravity of the edge ring ER when the edge ring ER is placed on the end effector 21a. In this case, as shown in Figure 9 for example, the tip 210e of the end effector 21a hits the side wall of the ashing module 13, making it difficult to load the wafer W into the ashing module 13 so that its center of gravity aligns with the center position P0 of the stage 130. In addition to the ashing module 13, even in containers such as the load lock module 14 that contain only the wafer W, the tip 210e of the end effector 21a gets in the way, making it difficult to load the wafer W to a predetermined position inside the container. Furthermore, even when the wafer W is loaded into the FOUP by the end effector 21b of the transport robot 20b, the tip 210e of the end effector 21b gets in the way, making it difficult to load the wafer W to a predetermined position inside the FOUP.

[0045] In contrast, in this embodiment, the wafer W is placed on the end effector 21a such that the position of the center of gravity of the wafer W is at position P2, which is between position P1 and the tip of the end effector 21a, rather than at position P1, which is the position of the center of gravity of the edge ring ER when the edge ring ER is being transported. This allows the wafer W to be loaded into the ashing module 13 so that its center of gravity aligns with the center position P0 of the stage 130, as shown in Figure 10, for example. In addition to the ashing module 13, the wafer W can also be loaded to a predetermined position within a container such as a load lock module 14 that contains only the wafer W. Furthermore, in this embodiment, even when the wafer W is loaded into the FOUP by the end effector 21b of the transport robot 20b, the wafer W can be loaded to a predetermined position within the FOUP.

[0046] When the edge ring ER is transported, it is placed on the end effector 21a, for example, as shown in Figures 11 and 12. Figure 11 is a plan view showing an example of the end effector 21a when transporting the edge ring ER in the first embodiment. Figure 12 is a side view showing an example of the end effector 21a when transporting the edge ring ER in the first embodiment. Figures 11 and 12 illustrate the end effector 21a of the transport robot 20a, but the same applies to the end effector 21b of the transport robot 20b. For example, as shown in Figures 11 and 12, when the edge ring ER is placed on the end effector 21a, a part of the edge ring ER protrudes from the tip of the end effector 21a. In this embodiment, since the edge ring ER is an annular member, it is difficult to place it on the tip side of the processing module 12. Therefore, in this embodiment, the edge ring ER is placed on the end effector 21a such that the position of the center of gravity of the edge ring ER is at position P1, which is further from the tip of the end effector 21a than position P2, which is the position of the center of gravity of the wafer W when the wafer W is being transported. As a result, the end effector 21a can transport the edge ring ER stably.

[0047] [Transportation Method] Figure 13 is a flowchart showing an example of a transport method in the first embodiment. The process illustrated in the flowchart of Figure 13 is realized, for example, by the control device 100 controlling each part of the main body 10 of the device. The operation of the transport robot 20a in the vacuum transport module 11 will be described below as an example, but the operation of the transport robot 20b in the atmospheric transport module 15 is similar.

[0048] First, the control device 100 determines whether or not to transport the edge ring ER (S10). If the edge ring ER is to be transported (S10: Yes), the control device 100 places the edge ring ER on the end effector 21a so that its center of gravity coincides with position P1 (S11). For example, the control device 100 controls the arm 22a of the transport robot 20a so that the edge ring ER is placed on the end effector 21a so that its center of gravity coincides with position P1. Step S11 is an example of process a). Then, the control device 100 executes the process shown in step S14.

[0049] On the other hand, if the edge ring ER is not transported (S10: No), the control device 100 determines whether or not to transport the wafer W (S12). If the wafer W is not transported (S12: No), the control device 100 executes the process shown in step S14.

[0050] On the other hand, when transporting the wafer W (S12: Yes), the control device 100 places the wafer W on the end effector 21a so that the center of gravity of the wafer W coincides with position P2 (S13). For example, the control device 100 controls the arm 22a of the transport robot 20a so that the wafer W is placed on the end effector 21a so that the center of gravity of the wafer W coincides with position P2. Step S13 is an example of process b).

[0051] The control device 100 then determines whether the processing of a predetermined number of wafers W has been completed (S14). If the processing of a predetermined number of wafers W has not been completed (S14: No), the process shown in step S10 is executed again. On the other hand, if the processing of a predetermined number of wafers W has been completed (S14: Yes), the transport method shown in this flowchart is terminated.

[0052] In the embodiments described above, the case in which the wafer W and edge ring ER are placed on the end effector 21a has been mainly explained, but the disclosed technology is not limited to this, and the wafer W and edge ring ER can also be placed on the end effector 21b. Figure 14 is a plan view showing an example of the positional relationship between the wafer W and the edge ring ER when placed on the end effector 21b in the atmospheric transport module 15. When the edge ring ER is placed on the end effector 21b, the position of the outer shape of the edge ring ER is, for example, as shown by circle C3 in Figure 14. The centroid of circle C3 is position P3. That is, when the edge ring ER is placed on the end effector 21b, the edge ring ER is placed on the end effector 21b such that the centroid of the edge ring ER is at position P3. Position P3 is an example of a third position.

[0053] When wafer W is placed on the end effector 21b, the position of the outer shape of wafer W will be, for example, as shown by circle C4 in Figure 14. The center of gravity of circle C4 is position P4. That is, when wafer W is placed on the end effector 21b, wafer W is placed on the end effector 21b such that the center of gravity of wafer W is at position P4. Position P4 is an example of a fourth position.

[0054] Furthermore, the distance d5 from the tip of the end effector 21b to position P3 is longer than the distance d6 from the tip of the end effector 21b to position P4. That is, when the edge ring ER is transported, it is placed on the end effector 21b such that the center of gravity of the edge ring ER coincides with position P3. Also, when the wafer W is transported, it is placed on the end effector 21b such that the center of gravity of the wafer W coincides with position P4, which is between position P3 and the tip of the end effector 21b.

[0055] The embodiments have been described above. As described above, the transport robot 20 in this embodiment transports a wafer W and an edge ring ER, which is an example of a consumable part having a circular outer shape. The transport robot 20 comprises an end effector 21, an arm 22, and a control device 100. The edge ring ER can be placed in the processing module 12, and the outer diameter of the edge ring ER is larger than the outer diameter of the wafer W. The end effector 21 is configured to hold the wafer W and the edge ring ER. The arm 22 is configured to move the end effector 21. When transporting the edge ring ER, the control device 100 controls the arm 22 so that the edge ring ER is placed on the end effector 21 so that its center of gravity coincides with position P1. When transporting the wafer W, the control device 100 controls the arm 22 so that the wafer W is placed on the end effector 21 so that its center of gravity coincides with position P2, which is between position P1 and the tip of the end effector 21. This allows wafers W to be loaded into ashing modules 13, etc., which do not have space to accommodate edge rings ER, and enables miniaturization of the ashing modules 13, etc. This reduces the overall footprint of the processing system 1.

[0056] Furthermore, in the above-described embodiment, the width of the end effector 21 is smaller than the outer dimensions of the wafer W. Also, when transporting the wafer W, the wafer W is placed on the end effector 21 such that a portion of the wafer W protrudes from the tip of the end effector 21. This allows the end effector 21 to transport the wafer W into an ashing module 13 or the like that does not have space to accommodate the edge ring ER.

[0057] Furthermore, in the above-described embodiment, when transporting the edge ring ER, the edge ring ER is placed on the end effector 21 such that a portion of the edge ring ER protrudes from the tip of the end effector 21. This reduces the depth of the processing module 12 into which the edge ring ER is transported.

[0058] Furthermore, in the embodiment described above, the dimension by which a portion of the wafer W protrudes from the tip of the end effector 21 is the same as the dimension by which a portion of the edge ring ER protrudes from the tip of the end effector 21.

[0059] Furthermore, in the embodiment described above, the edge ring ER, which is an example of a consumable part, is an annular member. The end effector 21 includes a main body 210 having an upper surface, and a plurality of first retaining parts 211a to 211c and second retaining parts 212a to 212c arranged on the upper surface of the main body 210. The height h1 of the second retaining parts 212a to 212c from the upper surface of the main body 210 is higher than the height h2 of the first retaining parts 211a to 211c from the upper surface of the main body 210. This makes it possible to suppress particles adhering to the first retaining parts 211a to 211c or the end effector 21 from re-adhering to the wafer W.

[0060] Furthermore, the processing system 1 in the above-described embodiment comprises a vacuum transport module 11, at least one processing module 12, at least one ashing module 13, and a transport robot 20a. The processing module 12 and the ashing module 13 are connected to the vacuum transport module 11. The transport robot 20a is located inside the vacuum transport module 11 and transports wafers W and edge rings ER, which are examples of consumable parts having a circular outer shape, under a vacuum atmosphere. The edge rings ER can be located inside at least one processing module 12. The outer diameter of the edge rings ER is larger than the outer diameter of the wafers W. The transport robot 20a includes an end effector 21a configured to support the wafers W and the edge rings ER. The end effector 21a is configured to support the edge rings ER such that their center of gravity coincides with position P1. Furthermore, the end effector 21a is configured to place the wafer W on the end effector 21a such that the center of gravity of the wafer W coincides with position P2 between position P1 and the tip 210e of the end effector 21a. This allows the wafer W to be loaded into an ashing module 13, etc., which does not have space to accommodate the edge ring ER, and enables the ashing module 13, etc., to be miniaturized. This reduces the footprint of the entire processing system 1.

[0061] Furthermore, in the embodiment described above, the edge ring ER is an annular component. The end effector 21a includes a main body 210 and a plurality of first retaining parts 211a to 211c and second retaining parts 212a to 212c. The main body 210 has an upper surface having regions R1, R2, and R3. Regions R1 and R2 overlap with respect to a distance d. The second retaining part 212a is located in region R1, the second retaining part 212b is located in region R2, and the second retaining part 212c is located in region R3. The height of the second retaining parts 212a to 212c is h1. The first retaining portion 211a is positioned within region R1 between the second retaining portion 212a and the tip 210e of the end effector 21a, the first retaining portion 211b is positioned within region R2 between the second retaining portion 212b and the tip 210e of the end effector 21a, and the first retaining portion 211c is positioned within region R3 between the second retaining portion 212c and the rear end of the end effector 21a. The height of the first retaining portions 211a to 211c is h2, which is lower than h1. This makes it possible to suppress particles adhering to the first retaining portions 211a to 211c and the end effector 21a from re-adhering to the wafer W.

[0062] Furthermore, the processing system 1 in the above-described embodiment further comprises at least one load lock module 14, an atmospheric transport module 15, and a transport robot 20b. The load lock module 14 is connected to the vacuum transport module 11, and the atmospheric transport module 15 is connected to the load lock module 14. The transport robot 20b is located inside the atmospheric transport module 15 and transports wafers W and edge rings ER, which are an example of consumable parts, under atmospheric pressure. The transport robot 20b includes an end effector 21b configured to place the wafers W and edge rings ER on it. The end effector 21b is configured to place the edge rings ER on the end effector 21b such that the center of gravity of the edge rings ER coincides with position P3. The end effector 21b is also configured to place the wafers W on the end effector 21b such that the center of gravity of the wafers W coincides with position P4 between position P3 and the tip of the end effector 21b. This allows wafers W to be loaded into containers such as FOUPs that do not have space to accommodate edge rings ER.

[0063] Furthermore, the end effector 21a in the above-described embodiment places a wafer W and an edge ring ER, which is an example of a consumable part having a circular outer shape. The outer diameter of the edge ring ER is larger than the outer diameter of the wafer W. The end effector 21a includes a main body 210 and a plurality of first holding parts 211a to 211c and second holding parts 212a to 212c. The main body 210 has an upper surface having regions R1, R2, and R3. Regions R1 and R2 overlap with respect to a distance d. The second holding part 212a is located in region R1, the second holding part 212b is located in region R2, and the second holding part 212c is located in region R3. The height of the second holding parts 212a to 212c is h1. The first holding portion 211a is positioned within region R1 between the second holding portion 212a and the tip 210e of the end effector 21a, the first holding portion 211b is positioned within region R2 between the second holding portion 212b and the tip 210e of the end effector 21a, and the first holding portion 211c is positioned within region R3 between the second holding portion 212c and the rear end of the end effector 21a. The heights h1 of the second holding portions 212a to 212c and h2 of the first holding portions 211a to 211c are different. When transporting the edge ring ER, the end effector 21a is configured to place the edge ring ER on the end effector 21a such that the center of gravity of the edge ring ER coincides with position P1. Furthermore, when transporting the wafer W, the wafer W is placed on the end effector 21a such that its center of gravity coincides with position P2, which is between position P1 and the tip 210e of the end effector 21a. This suppresses the reattachment of particles that have adhered to the first holding parts 211a to 211c or the end effector 21a to the wafer W.

[0064] Furthermore, in the embodiment described above, the edge ring ER is an annular component, and the height h1 of the second holding portion 212a to 212c is higher than the height h2 of the first holding portion 211a to 211c. This makes it possible to suppress particles adhering to the first holding portion 211a to 211c and the end effector 21a from re-adhering to the wafer W.

[0065] (Second embodiment) In the first embodiment, the transport robots 20a and 20b transport the wafer W and the edge ring ER, which is an example of a consumable part, separately. In contrast, the transport robots 20a and 20b of this embodiment can transport the wafer W and the edge ring ER simultaneously. The following description will focus on the differences from the first embodiment.

[0066] Figure 15 is a side view showing another example of the end effector 21a in the second embodiment. Although Figure 15 illustrates the end effector 21a on the transport robot 20a, the configuration is similar for the end effector 21b on the transport robot 20b. In this embodiment, the height h1 of the second holding parts 212a to 212c from the top surface of the main body 210 is lower than the height h2 of the first holding parts 211a to 211c from the top surface of the main body 210, as shown in Figure 15, for example. This allows non-annular (non-hollow) consumable parts such as the cover member 122d of the chamber 120 and the electrostatic chuck 121a, and the wafer W, to be placed on the end effector 21a simultaneously without interfering with each other, as shown in Figure 16, for example. In this embodiment, the end effector 21a can also transport annular consumable parts such as the edge ring ER and the wafer W simultaneously.

[0067] In this embodiment, the end effector 21a, as shown in Figure 17, for example, is positioned outside the circle C2 that indicates the position of the outer shape of the wafer W. This allows the end effector 21a to simultaneously support the wafer W and the consumable parts without interference between the first holding parts 211a and 211b and the wafer W.

[0068] [others] Furthermore, the technology disclosed in this application is not limited to the embodiments described above, and numerous modifications are possible within the scope of its essence.

[0069] For example, in each of the embodiments described above, the outer shape of the consumable part is circular, but the disclosed technology is not limited to this, and the outer shape of the consumable part may be rectangular, polygonal, partially arc-shaped, or any other shape other than circular.

[0070] It should be noted that the embodiments disclosed herein are illustrative and not restrictive in all respects. Indeed, the embodiments described above can be embodied in a variety of forms. Furthermore, the embodiments described above may be omitted, replaced, or modified in various ways without departing from the scope and spirit of the appended claims. [Explanation of Symbols]

[0071] ER Edge Ring W wafer 1. Processing System 100 Control device 11 Vacuum transport module 12 Processing Modules 120 Chambers 121 Support part 121a Electrostatic Chuck 121b Lower electrode 122 Upper shower head assembly 123 RF power supply section 124 Gas Supply Department 125 Exhaust System 13 Ashing Module 130 stages 14 Load Lock Module 15. Atmospheric transport module 16 Load Ports 20 Transport robots 21 End Effectors 211 First retaining part 212 Second retaining part 22 Arms

Claims

1. A transport device for transporting a wafer and a circular or annular chamber component simultaneously or separately, wherein the outer diameter of the chamber component is larger than the outer diameter of the wafer, and the transport device is An end effector configured to mount the wafer and the chamber component simultaneously or separately, An arm configured to move the end effector, A control device configured to control the arm Equipped with, The control device is When transporting the wafer, the arm is configured to control the arm so that the wafer is placed on the end effector such that a portion of the wafer protrudes from the tip of the end effector. When transporting the chamber component, the arm is controlled so that the chamber component is placed on the end effector such that a portion of the chamber component protrudes from the tip of the end effector. A transport device in which the dimension by which a portion of the wafer protrudes from the tip of the end effector is the same as the dimension by which a portion of the chamber component protrudes from the tip of the end effector.

2. The transport apparatus according to claim 1, wherein the width of the end effector is smaller than the outer diameter of the wafer.

3. The conveying device according to claim 1 or claim 2, wherein the chamber component is annular.

4. The end effector is A main body having an upper surface, A plurality of wafer support pads are arranged on the upper surface of the main body, Multiple chamber component support pads are arranged on the upper surface of the main body. Includes, The transport device according to claim 3, wherein the height of the wafer support pad from the upper surface of the main body is greater than the height of the chamber component support pad from the upper surface of the main body.

5. A transport device for transporting a wafer and a circular chamber component simultaneously or separately, wherein the outer diameter of the chamber component is larger than the outer diameter of the wafer, and the transport device is An end effector configured to mount the wafer and the chamber component simultaneously or separately, An arm configured to move the end effector, A control device configured to control the arm Equipped with, The aforementioned end effector is, A main body having an upper surface, A plurality of wafer support pads are arranged on the upper surface of the main body, Multiple chamber component support pads are arranged on the upper surface of the main body. Includes, A transport device in which the height of the wafer support pad from the top surface of the main body is lower than the height of the chamber component support pad from the top surface of the main body.

6. The transport apparatus according to claim 5, wherein the width of the end effector is smaller than the outer diameter of the wafer.

7. The conveying apparatus according to claim 5 or 6, wherein when conveying the wafer, the wafer is placed on the end effector such that a portion of the wafer protrudes from the tip of the end effector.

8. The conveying device according to claim 7, wherein when conveying the chamber component, the chamber component is placed on the end effector such that a part of the chamber component protrudes from the tip of the end effector.

9. The transport apparatus according to claim 8, wherein the dimension by which a portion of the wafer protrudes from the tip of the end effector is the same as the dimension by which a portion of the chamber component protrudes from the tip of the end effector.

10. An end effector for mounting a wafer and a circular chamber component simultaneously or separately, wherein the outer diameter of the chamber component is larger than the outer diameter of the wafer, and the end effector is A body having an upper surface having a first tip region, a second tip region, and a rear end region, wherein the first tip region and the second tip region overlap each other when viewed from a first direction, and the body... A first wafer support pad having a first height and positioned within the first tip region, A second wafer support pad, which is located within the second tip region and has the first height, A third wafer support pad, which is disposed within the rear end region and has the first height, A first chamber component support pad is disposed between the first wafer support pad and the tip of the end effector within the first tip region and has a second height different from the first height, Displaced between the second wafer support pad and the tip of the end effector within the second tip region, the second chamber component support pad having the second height, Displaced within the rear end region between the third wafer support pad and the rear end of the end effector, and having the second height, is the third chamber component support pad. Includes, An end effector in which the first height is lower than the second height.

11. An end effector for simultaneously or separately mounting a wafer and a circular or annular chamber component, wherein the outer diameter of the chamber component is larger than the outer diameter of the wafer, and the end effector is A body having an upper surface having a first tip region, a second tip region, and a rear end region, wherein the first tip region and the second tip region overlap each other when viewed from a first direction, and the body... A first wafer support pad having a first height and positioned within the first tip region, A second wafer support pad, which is located within the second tip region and has the first height, A third wafer support pad, which is disposed within the rear end region and has the first height, A first chamber component support pad is disposed between the first wafer support pad and the tip of the end effector within the first tip region and has a second height different from the first height, Displaced between the second wafer support pad and the tip of the end effector within the second tip region, the second chamber component support pad having the second height, Displaced within the rear end region between the third wafer support pad and the rear end of the end effector, and having the second height, is the third chamber component support pad. Includes, When transporting the wafer, the wafer is placed on the end effector such that a portion of the wafer protrudes from the tip of the end effector. When transporting the chamber component, the chamber component is placed on the end effector such that a portion of the chamber component protrudes from the tip of the end effector. An end effector in which the dimension by which a portion of the wafer protrudes from the tip of the end effector is the same as the dimension by which a portion of the chamber component protrudes from the tip of the end effector.

12. The end effector according to claim 11, wherein the chamber component is annular.

13. The end effector according to claim 12, wherein the first height is greater than the second height.

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