Apparatus and method for forming sealing resin used in compression molding

Abstract

To provide a compression molding device that can prevent the occurrence of molding failure, and a forming device that can form sealing resin allowing achievement of a compression molding method and can prevent the occurrence of protrusion of base resin from a storage part of a conveying jig and formation failure caused by the protrusion.SOLUTION: A sealing resin formation device 100 according to the present invention is a formation device that performs compression of base resin Rm to form sealing resin R used for compression molding of a workpiece W. The sealing resin formation device comprises: a formation mold 102 that stores the base resin Rm, and performs compression to form the sealing resin R having a predetermined shape corresponding to a shape of the workpiece W; and a resin guard 400 that holds the base resin Rm and conveys the base resin to the formation mold 102. The resin guard 400 is formed with a through hole 404 penetrating in a vertical direction, and has a storage part 402 that, with a release film F adsorbed thereto to block the through hole 404 from a lower surface side, holds the base resin Rm placed on the release film F inside the through hole 404.SELECTED DRAWING: Figure 9

Description

[Technical Field]

[0001] The present invention relates to an apparatus and a method for forming a sealing resin used in compression molding. [Background Art]

[0002] As examples of a resin sealing apparatus and a resin sealing method for sealing a workpiece, in which an electronic component is mounted on a base material, with a sealing resin and processing the workpiece into a molded product, those employing a compression molding method are known.

[0003] The compression molding method is a technology for resin sealing in which a predetermined amount of sealing resin is supplied to a sealing region (cavity) provided in a sealing mold configured to include an upper mold and a lower mold, a workpiece is placed in the sealing region, and clamping is performed by the upper mold and the lower mold. For example, in a case where a sealing mold having a cavity provided in the upper mold is used, a technology of collectively supplying the sealing resin to a central position on the workpiece to perform molding is known. On the other hand, in a case where a sealing mold having a cavity provided in the lower mold is used, a technology of supplying a release film (hereinafter sometimes simply referred to as "film") that covers a mold surface including the cavity and the sealing resin to perform molding is known (see Patent Document 1: Japanese Unexamined Patent Publication No. 2019-145550). [Prior Art Documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Unexamined Patent Publication No. 2019-145550 [Summary of the Invention] [Problem to be Solved by the Invention]

[0005] For example, when resin encapsulating strip-type wire-connected electronic components (semiconductor chips) as a workpiece, a compression molding method in which a cavity is provided in the upper mold presents a problem: the wire portion of the workpiece held in the lower mold comes into contact with the encapsulating resin supplied to the cavity beforehand or to the workpiece, causing deformation and making resin encapsulation difficult. Therefore, a compression molding method has generally been adopted in which the workpiece is held in the upper mold, a cavity is provided in the lower mold, and the encapsulating resin (for example, granular resin) is supplied into the cavity.

[0006] However, in a configuration where the workpiece is held in the upper mold and a cavity is provided in the lower mold, there was a problem that when the workpiece was thin or large, it was difficult to hold it in the upper mold and it was prone to falling. Also, although the sealing resin is usually supplied into the cavity of the lower mold via a film, when trying to form a molded product that is thicker than about 1 mm (in this case, the thickness of the resin part after molding), the molding stroke becomes large, and there was a problem that molding defects such as the film getting caught in the molded product were likely to occur. Furthermore, when granular resin is used as the sealing resin, the aforementioned film getting caught is more likely to occur, and in addition to the problems of dust generation during molding and difficulty in handling, there was a problem that it was difficult to supply (spread) the sealing resin evenly to the entire area of ​​the cavity provided in the lower mold, which was prone to uneven spreading. In addition, there was a problem that molding defects were likely to occur when air contained in the gaps between the particles during the spreading of the sealing resin and gaseous components due to degassing from the sealing resin during melting were not removed and remained in the molded product. In particular, in the case of workpieces in which electronic components are mounted by wire connections, there was a risk of wire flow (deformation or breakage of the wires) occurring due to the flow of resin within the cavity during resin encapsulation.

[0007] Furthermore, when forming the sealing resin used in compression molding, particularly from a base resin such as powder resin, a new challenge arises: preventing the base resin from overflowing from the storage compartment of the transport device and preventing formation defects caused by such overflow. [Means for solving the problem]

[0008] The present invention has been made in view of the above circumstances, and aims to provide a forming apparatus and forming method for forming a sealing resin that is easy to handle, solves the problems of a configuration in which a cavity is provided in the upper mold and a configuration in which a cavity is provided in the lower mold, prevents the occurrence of molding defects caused by resin flow, uneven dispensing, residual gas, and dust generation during molding, and enables the formation of molded products with a large thickness dimension. In addition, the present invention aims to prevent the overflow of the base resin from the storage part of the conveying device and the occurrence of molding defects caused by such overflow, especially when forming a sealing resin from a base resin such as a powder resin.

[0009] The present invention solves the above problem by a solution described below as one embodiment.

[0010] An apparatus for forming a sealing resin according to one embodiment is an apparatus for forming a sealing resin used for compression molding of a workpiece by compressing a base resin into tablets, comprising: a forming die that contains the base resin and compresses it into tablets to form the sealing resin having a predetermined shape corresponding to the shape of the workpiece; and a resin guard that holds the base resin and transports it to the forming die, wherein the resin guard has through holes that penetrate in the vertical direction, and has a receiving section that holds the base resin on the release film inside the through holes with a release film adsorbed so as to close the through holes from the lower side. The housing portion has an adsorption groove drilled in a continuous annular pattern on the lower surface of the periphery of the through hole, surrounding the through hole, for adsorbing and holding the release film, and the housing portion has adsorption holes intermittently arranged on the lower surface of the periphery of the through hole, outside the adsorption groove, surrounding the through hole, for adsorbing and holding the release film, and comprises a first adsorption circuit that generates an adsorption force in the adsorption groove, a second adsorption circuit that generates an adsorption force in the adsorption holes, and a control unit that controls the operation of the first adsorption circuit and the second adsorption circuit, and when adsorbing the release film to the lower surface of the periphery of the through hole, the control unit operates the second adsorption circuit in advance to generate an adsorption force in the adsorption holes, and after a predetermined time has elapsed, operates the first adsorption circuit to generate an adsorption force in the adsorption groove. This is a requirement. For example, powder resin is used as the base resin.

[0013] Furthermore, it is preferable that the forming mold be heated to a temperature that does not easily cause the base resin to harden, so that the formed sealing resin can harden when it is used for compression molding of the workpiece.

[0014] Furthermore, the method for forming a sealing resin according to one embodiment is: Using a forming apparatus comprising a resin guard for conveying the base resin and a forming die for compressing the base resin into tablets, the base resin is compressed into tablets.A forming method for forming a sealing resin used in the compression molding of a workpiece, The aforementioned The release film is adsorbed to seal the through-holes in the resin guard from the bottom side. By doing so, a housing section is formed for placing and holding the base resin. Adsorption step, and after the adsorption step, on the release film in the through hole The aforementioned A placement step in which the base resin is placed, and after the placement step, the release film and the base resin are transported by the resin guard. The aforementioned The process comprises a setting step of setting the forming mold in a predetermined position, and a forming step of closing the forming mold after the setting step to form the sealing resin. 、 The aforementioned The forming apparatus is provided with an adsorption groove drilled in a continuous annular pattern on the lower surface of the peripheral edge of the through hole of the resin guard, surrounding the through hole, for adsorbing and holding the release film; adsorption holes intermittently arranged outside the adsorption groove, surrounding the through hole, for adsorbing and holding the release film; a first adsorption circuit that generates an adsorption force in the adsorption groove; and a second adsorption circuit that generates an adsorption force in the adsorption holes. The adsorption process comprises a first adsorption step in which the second adsorption circuit is activated in advance to generate an adsorption force in the adsorption holes when adsorbing the release film to the lower surface of the peripheral edge of the through hole; and a second adsorption step in which the first adsorption circuit is activated after a predetermined time has elapsed following the first adsorption step to generate an adsorption force in the adsorption groove. This is a requirement. [Effects of the Invention]

[0016] The forming apparatus and forming method according to the present invention enable the formation of a sealing resin that can be used in a compression molding apparatus and compression molding method that achieve the following effects. Specifically, the problems associated with a compression molding apparatus and compression molding method in which a cavity is provided in the upper mold and the problems associated with a configuration in which a cavity is provided in the lower mold can be solved. Furthermore, it is possible to prevent molding defects caused by resin flow, uneven dispensing, residual gas, and dust generation during molding. In addition, it is possible to form molded products with a large thickness dimension, as well as molded products with a small thickness dimension (thin). Furthermore, compared to granular resins, handling is particularly easy during supply and setting.

[0017] Furthermore, the above-described forming apparatus and forming method make it possible to prevent the base resin from overflowing from the storage section of the conveying device and the occurrence of forming defects caused by such overflow, especially when forming a sealing resin from a base resin such as powder resin. [Brief explanation of the drawing]

[0018] [Figure 1] This is a plan view showing an example of a compression molding apparatus that uses a sealing resin formed by an embodiment of the present invention. [Figure 2]It is an explanatory diagram illustrating an example of a compression molding method using a sealing resin formed by a forming apparatus and a forming method according to an embodiment of the present invention. [Figure 3] FIG. 3A is an enlarged view of section III in FIG. 2. FIG. 3B is an explanatory diagram following FIG. 3A. [Figure 4] It is an explanatory diagram following FIG. 3B. [Figure 5] It is an explanatory diagram following FIG. 4. [Figure 6] It is an explanatory diagram illustrating another example of a compression molding method using a sealing resin formed by a forming apparatus and a forming method according to an embodiment of the present invention. [Figure 7] It is an explanatory diagram following FIG. 6. [Figure 8] It is an explanatory diagram following FIG. 7. [Figure 9] It is a plan view showing an example of an apparatus for forming a sealing resin according to an embodiment of the present invention. [Figure 10] It is a plan view showing an example of a resin guard of the forming apparatus shown in FIG. 9. [Figure 11] It is a cross-sectional view taken along line XI-XI in FIG. 10. [Figure 12] It is an explanatory diagram illustrating the usage state of the resin guard shown in FIG. 10. [Figure 13] It is a plan view showing an example of a resin guard according to a comparative example. [Figure 14] It is a cross-sectional view taken along line XIV-XIV in FIG. 13. [Figure 15] It is an explanatory diagram illustrating the usage state of the resin guard shown in FIG. 13. [Figure 16] It is an enlarged view of section XVI in FIG. 15. [Figure 17] It is a side view showing an example of a press device of the forming apparatus shown in FIG. 9. [Figure 18] It is a front cross-sectional view showing an example of a forming mold of the forming apparatus shown in FIG. 9. [Figure 19] It is an explanatory diagram of a method for forming a sealing resin according to an embodiment of the present invention. [Figure 20] It is an explanatory diagram following FIG. 19. [Figure 21]This is an explanatory diagram following Figure 20. [Figure 22] A perspective view showing an example of a sealing resin formed by the forming apparatus and forming method according to an embodiment of the present invention. [Figure 23] A perspective view showing another example of a encapsulating resin formed by the forming apparatus and forming method according to an embodiment of the present invention. [Figure 24] A perspective view showing another example of a encapsulating resin formed by the forming apparatus and forming method according to an embodiment of the present invention. [Figure 25] A perspective view showing another example of a encapsulating resin formed by the forming apparatus and forming method according to an embodiment of the present invention. [Figure 26] This is an explanatory diagram of a conventional compression molding method. [Figure 27] This is an explanatory diagram of a conventional compression molding method. [Modes for carrying out the invention]

[0019] (Compression molding apparatus and compression molding method) The sealing resin forming apparatus 100 and forming method according to an embodiment of the present invention are an apparatus and method for forming a sealing resin R used for compression molding of a workpiece W. First, an outline of the compression molding apparatus 1 and compression molding method that perform resin sealing (compression molding) of a workpiece W using the sealing resin R will be described. Here, Figure 1 is a plan view (schematic diagram) showing an example of the compression molding apparatus 1. For the sake of explanation, arrows may be used in the figure to indicate the left-right direction (X direction), front-back direction (Y direction), and up-down direction (Z direction). In addition, in all figures used to explain each embodiment, the same reference numerals are used for members having the same function, and repeated explanations may be omitted.

[0020] The workpiece W to be sealed has a configuration in which electronic components Wb are mounted on a substrate Wa. More specifically, examples of substrate Wa include plate-shaped members such as resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, and wafers. Examples of electronic components Wb include semiconductor chips, MEMS chips, passive elements, heat sinks, conductive members, and spacers. The shape of the substrate Wa can be rectangular (strip-shaped), square, circular, etc. The number of electronic components Wb mounted on a single substrate Wa can be one or multiple (for example, in a matrix).

[0021] Examples of methods for mounting electronic components Wb onto a substrate Wa include wire bonding and flip-chip mounting. Alternatively, in configurations where the substrate (glass or metal carrier plate) Wa is peeled off the molded product Wp after resin encapsulation, the electronic components Wb can be attached using heat-release adhesive tape or UV-curable resin that hardens upon UV irradiation.

[0022] Furthermore, suitable examples of film F include film materials with excellent heat resistance, ease of peeling, flexibility, and stretchability, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, fluorine-impregnated glass cloth, polypropylene, and polyvinylidine chloride. Film F is also used when forming the sealing resin R in the forming apparatus 100 described later.

[0023] As shown in Figure 1, the compression molding apparatus 1 mainly comprises a supply unit 10A for supplying workpieces W, a press unit 10B for processing workpieces W into molded products Wp by resin encapsulation, and a storage unit 10C for storing the molded products Wp. As an example, the supply unit 10A, press unit 10B, and storage unit 10C are arranged in that order along the X direction in Figure 1. However, the configuration is not limited to the above, and the equipment configuration within the units, the number of units (especially the number of press units), and the arrangement order of the units can be changed. It is also possible to have a configuration with units other than those shown above (none of which are shown).

[0024] Furthermore, the compression molding apparatus 1 has a guide rail 20 provided in a straight line spanning between each unit, and a transport device (first loader) 22 for transporting the workpiece W and the sealing resin R, and a transport device (second loader) 24 for transporting the molded product Wp (which may also be used for transporting the sealing resin R) are provided to move along the guide rail 20 between predetermined units. However, the configuration is not limited to the above, and a configuration with a common (single) transport device (loader) for transporting the workpiece W, the sealing resin R, and the molded product Wp is also possible (not shown). In addition, the transport device may be configured to include a robot hand or the like instead of a loader.

[0025] Furthermore, the compression molding apparatus 1 has a control unit 30 located in the supply unit 10A that controls the operation of each mechanism in each unit (it may also be configured to have the control unit 30 located in another unit).

[0026] The press unit 10B includes a pair of sealing dies that are opened and closed by the press device 250. The sealing dies may, for example, be configured such that a cavity is provided in the upper die (sealing die 202), or, as another example, a cavity may be provided in the lower die (sealing die 302).

[0027] As an example, the steps of a compression molding method performed using a compression molding apparatus 1 equipped with a sealing die 202 will be described with reference to Figures 2 to 5. In this case, the press apparatus 250 is provided with a film supply unit 211 that supplies a film F to cover the mold surface 204a (a predetermined area) including the inner surface of the cavity 208 in the upper mold 204. For example, the film F is in the form of a roll, but it may also be in the form of strips.

[0028] First, a preparation process (sealing preparation process) is carried out. Specifically, the upper mold 204 and the lower mold 206 are heated to a predetermined temperature (for example, 100°C to 300°C). In addition, the film supply unit 211 is activated to supply a new film F, which is then adsorbed to cover a predetermined area of ​​the mold surface 204a, including the inner surface of the cavity 208 in the upper mold 204.

[0029] After the preparation process, a workpiece holding process is performed in which the workpiece W is held in the workpiece holding section 205 of the lower mold 206. Specifically, the workpiece W supplied from the supply magazine 12 is held by the first loader 22 and transported into the sealing mold 202, where it is held in the workpiece holding section 205 of the lower plate 242 (mold surface 206a).

[0030] After the workpiece holding process, a resin placement process is performed in which the sealing resin R is placed on top of the workpiece W held in the workpiece holding section 205 (see Figure 2). Specifically, the sealing resin R formed in the sealing resin forming apparatus (sometimes simply referred to as the "forming apparatus") 100, which will be described later, is held by the first loader 22 (other conveying devices may also be used) and transported into the sealing mold 202, where it is placed on top of the workpiece W held in the workpiece holding section 205.

[0031] Alternatively, as another example of the resin placement process, it may be performed as a step in which the sealing resin R formed in the forming apparatus 100 is placed on the workpiece W before the workpiece holding process described above. In that case, the workpiece holding process becomes a process of holding the workpiece W with the sealing resin R placed on it in the workpiece holding section 205. That is, the first loader 22 holds the workpiece W with the sealing resin R placed on it and transports it into the sealing mold 202, where it is held in the workpiece holding section 205. This has the advantage of performing the process of placing the workpiece W and sealing resin R into the sealing mold 202 in one step, rather than separately.

[0032] Next, a resin sealing process is performed in which the workpiece W is sealed with sealing resin R to form a molded product Wp. Specifically, the sealing mold 202 is closed, and the cavity piece 226 is lowered relative to the cavity 208 surrounded by clamper 228, thereby performing a mold closing process in which the sealing resin R is heated and pressurized against the workpiece W. Note that Figure 3A is an enlarged view of part III in Figure 2, and during the mold closing process, the softening and melting of the sealing resin R progresses from the state in Figure 3A to the state in Figure 3B.

[0033] As a result, the sealing resin R heat-cures, completing the resin sealing (compression molding) process (see Figure 4).

[0034] The subsequent steps following the mold closing process described above are the same as those in conventional compression molding methods. In general, a mold opening process is performed in which the sealing mold 202 is opened to separate the molded product Wp from the used film F and allow the molded product Wp to be removed (see Figure 5). Next, a molded product removal process is performed in which the second loader 24 unloads the molded product Wp from inside the sealing mold 202 and transports it to the storage unit 10C. As an example, the transported molded product Wp is stored in the storage magazine 14. After the molded product removal process, or in parallel with it, a film supply unit 211 is activated to send the used film F out of the sealing mold 202 and feed a new film F into the sealing mold 202 and set it in place.

[0035] The above outlines the main steps of the compression molding method performed using the compression molding apparatus 1 equipped with a sealing mold 202. However, the above order of steps is merely an example, and the order can be changed or the steps performed in parallel as long as there are no obstacles.

[0036] As another example, the steps of a compression molding method performed using a compression molding apparatus 1 equipped with a sealing die 302 will be described with reference to Figures 6 to 8. In this case, the press apparatus 250 is provided with a film supply unit 311 that supplies a film F to cover the mold surface 306a (a predetermined area) including the inner surface of the cavity 308 in the lower mold 306. For example, the film F is in the form of a roll, but it may also be in the form of strips.

[0037] First, a preparation process (sealing preparation process) is carried out. Specifically, the upper mold 304 and the lower mold 306 are heated to a predetermined temperature (for example, 100°C to 300°C). In addition, the film supply unit 311 is activated to supply a new film F, which is then adsorbed to cover a predetermined area of ​​the mold surface 306a, including the inner surface of the cavity 308 in the lower mold 306.

[0038] After the preparation process, a workpiece holding process is performed in which the workpiece W is held in the workpiece holding section 305 of the upper mold 304. Specifically, the workpiece W supplied from the supply magazine 12 is held by the first loader 22 and transported into the sealing mold 302, where it is held in the workpiece holding section 305 of the upper plate 342 (mold surface 304a).

[0039] The resin holding process is performed after the workpiece holding process (however, it may be performed before or in parallel with the workpiece holding process). The resin holding process has the following steps: The sealing resin R is held in the cavity 308 of the lower mold 306 (see Figure 6). Specifically, the sealing resin R formed in the forming apparatus 100 is held by the first loader 22 (other conveying devices may also be used) and transported into the sealing mold 302 and housed in the cavity 308 (specifically, it is placed on the upper surface of the cavity piece 326).

[0040] Next, a resin sealing process is carried out to seal the workpiece W with a sealing resin R to process it into a molded product Wp. Specifically, the sealing mold 302 is closed, and the cavity piece 326 is raised relative to the workpiece W within the cavity 308 surrounded by the clamper 328, thereby performing a mold closing process in which the sealing resin R is heated and pressurized. As a result, the sealing resin R is heat-cured and the resin sealing (compression molding) is completed (see Figure 7).

[0041] The subsequent steps following the mold closing process described above are the same as those in conventional compression molding methods. In general, a mold opening process is performed in which the sealing mold 302 is opened to separate the molded product Wp from the used film F and allow the molded product Wp to be removed (see Figure 8). Next, a molded product removal process is performed in which the second loader 24 unloads the molded product Wp from inside the sealing mold 302 and transports it to the storage unit 10C. As an example, the transported molded product Wp is stored in the storage magazine 14. After the molded product removal process, or in parallel with it, a film supply unit 311 is activated to send the used film F out of the sealing mold 302 and feed a new film F into the sealing mold 302 and set it in place.

[0042] The above outlines the main steps of the compression molding method performed using the compression molding apparatus 1 equipped with a sealing die 302. However, the above order of steps is merely an example, and the order can be changed or the steps performed in parallel as long as there are no obstacles.

[0043] (Sealing resin forming apparatus) Next, the forming apparatus 100 for forming the sealing resin R used in the above-described compression molding apparatus 1 and compression molding method will be explained with reference to Figures 9 to 18. The forming apparatus 100 processes the base resin Rm to form the sealing resin R. Here, Figure 9 is a plan view (schematic diagram) showing an example of the forming apparatus 100. The forming apparatus 100 may be installed either inside or outside the compression molding apparatus 1.

[0044] In this embodiment, a thermosetting resin (for example, an epoxy resin containing a filler, but not limited to this) is used as the base resin Rm and the sealing resin R formed from the base resin Rm. The sealing resin R is formed as a solid or semi-solid resin having a predetermined shape (details described later) whose overall shape corresponds to the shape of the workpiece W. Normally, one piece constitutes the "whole" amount required for sealing (one batch per workpiece W), but it may also be configured so that several pieces (for example, two or three pieces) constitute the "whole" amount required for sealing. Furthermore, the above "semi-solid" refers not to a completely solid state but to a state that has melted to the so-called B stage. In addition, a powder resin (form) which is a thermosetting resin (properties) is preferably used as the base resin Rm. However, it is not limited to this, and a granular resin, crushed resin, solid resin, liquid resin, or a resin which is a combination of several of these may be used.

[0045] As shown in Figure 9, the forming apparatus 100 mainly comprises a supply unit 100A for supplying base resin Rm, a forming unit 100B for forming encapsulating resin R from base resin Rm, a storage unit 100C for peeling and storing the formed encapsulating resin R, a transport unit 100D for transporting base resin Rm and encapsulating resin R, and a control unit 100E for controlling the operation of each mechanism.

[0046] Next, the supply unit 100A includes, for example, a film supply unit 164 for supplying film F (strip-shaped film). It also includes a dispenser 166 for supplying (discharging) base resin Rm. In this embodiment, a resin guard (conveyor) 400 is used to hold the film F (strip-shaped film) and the base resin Rm, and they are conveyed by a loader 168 or the like. Multiple resin guards 400 are provided as needed and are configured to be used in a circulating manner.

[0047] The film supply unit 164 is configured, for example, with a setting unit for setting a long film roll and a cutter for cutting strips of film F of a predetermined length from the set film roll (neither of which are shown in the diagram). However, it is not limited to this configuration.

[0048] Furthermore, the dispenser 166 may be configured, for example, to include a hopper for storing base resin Rm, a weighing scale for weighing the resin to be dispensed, a trough from which the weighed base resin Rm is fed by a vibrating feeder, and a nozzle for determining the dispensing position of the base resin Rm dispensed from the trough (none of which are shown). However, the configuration is not limited to this.

[0049] Furthermore, a supply table 165 is provided below the dispenser 166, on which the resin guard 400 is placed and which is configured to be movable in the X and Y directions.

[0050] Next, the resin guard 400 will be described. Figure 10 is a plan view of the resin guard 400 according to this embodiment, and Figure 11 is a cross-sectional view taken along line XI-XI in Figure 10. The resin guard 400 is generally flat in shape, formed on a plane where the top and bottom surfaces are parallel, and has a through hole 404 that penetrates vertically in the central part when viewed from above. A housing section 402 is provided for placing and holding the base resin Rm on the film F (strip-shaped film) inside the through hole 404, with the film F adsorbed to close the through hole 404 from the bottom side. The position and shape of the through hole 404 are formed to correspond to the shape of the cavity 108 of the forming mold 102 (lower mold 106) which will be described later (i.e., so that the base resin Rm is appropriately housed in the cavity 108).

[0051] The housing section 402 has an adsorption groove 410 drilled in a continuous annular pattern on the lower surface 406a of the peripheral edge 406 of the through hole 404, surrounding the through hole 404, to adsorb and hold the film F (strip-shaped film). It also has communication holes (circular holes in plan view) 412 that are intermittently (at multiple spaced positions) surrounding the through hole 404 and communicate with the adsorption groove 410, applying an adsorption force to the adsorption groove 410. The upper end of the communication holes 412 opens onto the upper surface of the peripheral edge 406.

[0052] Furthermore, the housing section 402 has adsorption holes (circular holes in plan view) 408 that are intermittently (at multiple spaced positions) surrounding the through hole 404, located on the lower surface 406a of the peripheral edge 406 of the through hole 404, at positions that are outward in plan view from the adsorption groove 410, and that adsorb and hold the film F (strip-shaped film). The upper end of the adsorption holes 408 opens onto the upper surface of the peripheral edge 406.

[0053] For example, the width dimension of the adsorption groove 410 is set to approximately 1 to 2 times the inner diameter of the adsorption hole 408, but it is not limited to this.

[0054] The communication hole 412 and the adsorption groove 410 communicating therewith in the housing section 402, as well as the adsorption hole 408, are connected via (communicated with) suction holes (not shown) provided in the pickup (not shown) of the supply section 100A that transports the resin guard 400 and the loader 168 (described later) of the transport section 100D, to which suction force generated in a suction device (not shown) such as a vacuum generator is transmitted. This configuration generates suction force in the adsorption hole 408 and the adsorption groove 410 that open on the lower surface 406a of the peripheral section 406, allowing a strip-shaped film F to be adsorbed and held in place so as to block the through hole 404 from the lower side (and with the base resin Rm placed on the film F), and the resin guard 400 can be transported in that state.

[0055] In this embodiment, a first suction circuit (not shown) that transmits the suction force from the suction device to the communication hole 412 and the suction groove 410 (i.e., generates suction force), and a second suction circuit (not shown) that transmits the suction force to the suction hole 408 (i.e., generates suction force) are provided as separate systems, and each suction circuit is configured to be individually (independently) controlled (operated and stopped) by the control unit 100E. Details of the operation method (control method) will be described later.

[0056] Here, we will describe a comparative example of the resin guard 500 that the present inventors investigated during the research process. Figure 13 is a plan view of the resin guard 500 according to the comparative example, and Figure 14 is a cross-sectional view taken along line XIV-XIV in Figure 13. The resin guard 500 is generally flat in shape, formed on a plane where the top and bottom surfaces are parallel, and has a through hole 504 that penetrates vertically in the central part when viewed from above. A housing section 502 is provided for placing and holding a base resin Rm on the film F inside the through hole 504, with the film F (strip-shaped film) adsorbed to close the through hole 504 from the bottom side.

[0057] The housing section 502 has adsorption holes (circular holes in plan view) 508 that are intermittently (at multiple spaced positions) arranged around the through hole 504 on the lower surface 506a of the peripheral edge 506 of the through hole 504, adsorbing and holding the film F (strip-shaped film). The upper end of the adsorption holes 508 opens onto the upper surface of the peripheral edge 506.

[0058] According to this resin guard 500, when a film F (strip-shaped film) is adsorbed to the through hole 504 by the adsorption holes 508 so as to block the through hole 504 from the bottom side, and the base resin Rm is placed on the film F inside the through hole 504, the following problems occur. Specifically, as shown in Figures 15 and 16 (enlarged view of part XVI in Figure 15), the weight of the base resin Rm placed on the film F causes a gap G to be created between the bottom surface 506a of the peripheral portion 506 and the film F, and the base resin Rm (especially in powder form, etc.) may get into the gap G. In that case, when the base resin Rm is transferred to the molding die 102, the base resin Rm will be transferred in a state where it has protruded outside the cavity 108. As a result, when closing the mold of the molding die 102, a problem occurs in which the base resin Rm that has protruded outside the cavity 108 is pressed (so-called "stomping"), which causes molding defects such as burrs to form on the sealing resin R.

[0059] To solve these problems, the inventors have devised the resin guard 400 according to this embodiment. Specifically, with this resin guard 400, as shown in Figure 12, the film F (strip-shaped film) can be adsorbed by the adsorption holes 408 so as to block the through holes 404 from the bottom side. Furthermore, from that state, the film F (strip-shaped film) can be adsorbed by the annular adsorption groove 410 that surrounds the through holes 404 at a position inward (closer to the through holes 404) in a plan view from the adsorption holes 408, thereby stretching and holding the film F as it is pulled into the adsorption groove 410. As a result, compared to the case where the film F (strip-shaped film) is adsorbed and held by the adsorption holes 408 alone (corresponding to the comparative examples shown in Figures 13 to 16 above), the film F can be adsorbed and held to the resin guard 400 (lower surface 406a of the peripheral portion 406) under extremely high tension.

[0060] This prevents gaps from forming between the lower surface 406a of the peripheral portion 406 and the film F when the base resin Rm is transported by the resin guard 400, due to the weight of the base resin Rm placed on the film F. Therefore, it is possible to prevent the base resin Rm from getting trapped between the lower surface 406a of the peripheral portion 406 and the film F, which would cause molding defects.

[0061] In particular, when adsorbing a film F (strip-shaped film) onto the lower surface 406a of the peripheral edge 406 of the through hole 404, it is even more effective in enhancing the above effect if the control unit 100E operates the second adsorption circuit in advance to generate an adsorption force in the adsorption hole 408, and then operates the first adsorption circuit after a predetermined time (for example, about 1 to 2 seconds) to generate an adsorption force in the adsorption groove 410.

[0062] Furthermore, since there is no need to provide a separate component such as a pressing jig to prevent gap formation between the lower surface 406a of the peripheral portion 406 and the film F, the forming apparatus 100 can be simplified.

[0063] Next, the transport unit 100D includes, as an example, a guide rail 167 laid between the supply unit 100A and the storage unit 100C, a first transport device (loader) 168 that moves along the guide rail 167 to transport the resin guard 400 (with and without holding the film F and base resin Rm), and a second transport device (loader) 169 that transports the sealing resin R. However, the configuration is not limited to the above, and a configuration with a common (single) transport device (loader) is also possible. Furthermore, although the transport devices (loaders) 168 and 169 are configured to move in the X and Y directions, a configuration with separate transport devices that move in the X direction and transport devices that move in the Y direction is also possible. In addition, the transport device may be configured to include a robot hand or the like instead of a loader (neither of which is shown).

[0064] Here, the first transport device (loader) 168 is provided with a holding mechanism for holding the resin guard 400 (for example, a configuration that grips it with holding claws, or a configuration that adsorbs it by having suction holes that communicate with a suction device, etc.). Furthermore, as described above, suction holes (not shown) are provided to transmit the suction force generated in the suction device (not shown) to the communication holes 412, adsorption grooves 410, and adsorption holes 408 of the resin guard 400. With this, the film F (with the base resin Rm placed on it) can be adsorbed and held on the lower surface of the resin guard 400 (specifically, the lower surface 406a of the peripheral edge 406) and transported to a predetermined position (inside the molding mold 102 described later).

[0065] On the other hand, the second transport device (loader) 169 is provided with a holding mechanism for holding the sealing resin R formed by the forming mold 102 (for example, a configuration that has holding claws to grip it, or a configuration that has suction holes communicating with a suction device to adsorb it, etc.).

[0066] Next, the forming section 100B includes, as an example, a forming die 102 having a pair of dies (for example, a set of multiple die blocks, die plates, die pillars, and other components made of alloy tool steel assembled together) that are opened and closed by a press device 150. A side view (schematic diagram) of the press device 150 is shown in Figure 17. A front cross-sectional view (schematic diagram) of the forming die 102 is shown in Figure 18.

[0067] As shown in Figure 17, the press device 150 is configured to include a pair of platens 154 and 156, a plurality of tie bars 152 on which the pair of platens 154 and 156 are mounted, and a drive device for moving (raising and lowering) the platen 156. Specifically, the drive device is configured to include a drive source (e.g., an electric motor) 160 and a drive transmission mechanism (e.g., a ball screw or a toggle link mechanism) 162 (however, it is not limited to this). In this embodiment, the upper platen 154 in the vertical direction is set as a fixed platen (a platen fixed to the tie bar 152), and the lower platen 156 is set as a movable platen (a platen that is slidably held by the tie bar 152 and moves up and down). However, it is not limited to this, and the top and bottom may be reversed, that is, the upper side may be set as a movable platen and the lower side as a fixed platen, or both the upper and lower sides may be set as movable platens (none of which are shown).

[0068] On the other hand, as shown in Figure 17, the forming die 102 is a pair of dies arranged between the pair of platens 154 and 156 in the press device 150, and comprises an upper die 104 on the upper side in the vertical direction and a lower die 106 on the lower side. The upper die 104 is assembled to the upper platen (fixed platen 154 in this embodiment), and the lower die 106 is assembled to the lower platen (movable platen 156 in this embodiment). The mold is closed and opened by the upper die 104 and the lower die 106 moving closer to and further apart from each other (the vertical direction (up and down direction) is the mold opening and closing direction). In this embodiment, powder resin is preferably used as the base resin Rm, and the forming die 102 is configured as a "tablet mold" that forms a sealing resin R by tableting the base resin Rm (powder resin) in the mold closing process. Specifically, the upper die 104 constitutes a so-called "punch mold," and the lower die 106 constitutes a so-called "die mold."

[0069] Next, the lower mold 106 of the forming mold 102 will be described in detail. As shown in Figure 18, the lower mold 106 comprises a lower mold chase 110 and a cavity piece 126, clamper 128, etc., held by it. The lower mold chase 110 is fixed to the upper surface of the support plate 114 via a support pillar 112. A cavity 108 is provided on the upper surface of the lower mold 106 (the surface on the upper mold 104 side). A predetermined amount of base resin Rm is contained within this cavity 108.

[0070] The clamper 128 is configured in an annular shape to surround the cavity die 126 and is assembled to move vertically while floating away from the upper surface of the support plate 114 via a push pin 122 and a clamper spring 124 (for example, a biasing member exemplified by a coil spring) (however, it is not limited to this assembly structure). The cavity die 126 constitutes the back (bottom) of the cavity 108, and the clamper 128 constitutes the side of the cavity 108. The shape and number of cavities 108 provided in one lower die 106 are set as appropriate (one or more).

[0071] Furthermore, the lower mold 106 is provided with suction passages (holes, grooves, etc.) that communicate with a suction device on the upper surface of the clamper 128 and at the boundary between the clamper 128 and the cavity piece 126 (not shown). This allows the film F (strip-shaped film), which is fed in with the base resin Rm placed on it by the resin guard 400 described later, to be adsorbed and held on the mold surface 106a, including the inner surface of the cavity 108.

[0072] Furthermore, in this embodiment, a lower mold heating mechanism (not shown) is provided to heat the lower mold 106 to a predetermined temperature. This lower mold heating mechanism includes a heater (e.g., an electric heating wire heater), a temperature sensor, a power supply, etc., and the heating is controlled by the control unit 100E. As an example, the heater is built into the lower mold chase 110 and is configured to apply heat to the entire lower mold 106 and the base resin Rm contained in the cavity 108. At this time, the lower mold 106 is heated to a predetermined temperature (e.g., 50°C to 80°C) such that the thermal curing (main curing) of the base resin Rm does not proceed easily.

[0073] In addition, the lower mold 106 described above has a structure with a movable clamper (clamper 128) as an example, but it may also have a structure without a movable clamper as an example (not shown).

[0074] Next, the upper mold 104 of the forming die 102 will be described in detail. As shown in Figure 18, the upper mold 104 is equipped with a tableting plate 142 that presses a predetermined amount of base resin Rm contained in the cavity 108 of the lower mold 106 to form (tablet) a sealing resin R having a predetermined shape corresponding to the shape of the workpiece W (details of the forming method will be described later). The tableting plate 142 is held (fixed) in the upper mold chase 140. As an example, a leg forming groove (including a recess) 143 for forming the leg portion Rb of the sealing resin R is provided on the lower surface (the surface on the lower mold 106 side) of the tableting plate 142. Although the leg forming groove 143 is provided on the tableting plate 142, it may also be provided on the cavity die 126, or on both.

[0075] Here, the press device 150 is provided with an upper die film supply unit 113 that supplies a film F to cover the die surface 104a (a predetermined area) of the upper die 104. For example, the film F is in the form of a roll, but it may also be in the form of strips.

[0076] Furthermore, the upper mold 104 is provided with a suction passage (hole or groove, etc.) in the tablet pressing plate 142, etc., which communicates with a suction device (not shown). This allows the film F supplied from the upper mold film supply unit 113 to be adsorbed onto the mold surface 104a and held in place.

[0077] Furthermore, in this embodiment, an upper mold heating mechanism (not shown) is provided to heat the upper mold 104 to a predetermined temperature. This upper mold heating mechanism includes a heater (e.g., an electric heating wire heater), a temperature sensor, a power supply, etc., and the heating is controlled by the control unit 100E. As an example, the heater is built into the upper mold chase 140 and is configured to apply heat to the entire upper mold 104. At this time, the upper mold 104 is heated to a predetermined temperature (e.g., 50°C to 80°C) such that the thermal curing (main curing) of the base resin Rm held (housed) in the lower mold 106 is slow to proceed.

[0078] Next, the storage section 100C includes, for example, a film peeling mechanism 170 for peeling the film F from the sealing resin R formed by tableting a base resin Rm (such as powder resin). It also includes a storage magazine 192 for storing the sealing resin R after the film F has been peeled off. A known stack magazine or the like can be used for the storage magazine 192. It also includes an inversion mechanism 194 for inverting the sealing resin R so that its upper and lower surfaces are reversed. Depending on the configuration of the forming mold 102 and the configuration of the sealing resin R that is formed, the inversion mechanism 194 may be omitted if inversion is not necessary (not shown).

[0079] As an example, the film peeling mechanism 170 includes an adsorption stage that adsorbs the surface of the sealing resin R to be adsorbed (the surface not covered by the strip-shaped film F), and a gripping part that peels off the film F by gripping and moving one end of the film F from the sealing resin R while it is adsorbed and held on the adsorption stage (neither of which are shown). However, the mechanism is not limited to this configuration.

[0080] (Method for forming encapsulating resin) Next, the steps of the method for forming the sealing resin according to this embodiment, which is carried out using the forming apparatus 100 described above, will be explained. Here, Figures 19 to 21 are explanatory diagrams of each step, and are shown as front cross-sectional views in the same direction as Figure 18.

[0081] First, a preparation process (tablet preparation process) is carried out. The preparation process consists of the following steps: A lower mold heating process is carried out in which the lower mold 106 is heated to a predetermined temperature (a temperature at which the base resin Rm and sealing resin R do not fully harden, for example, 50°C to 80°C) using a lower mold heating mechanism. An upper mold heating process is carried out in which the upper mold 104 is heated to a predetermined temperature (a temperature at which the base resin Rm and sealing resin R do not fully harden, for example, 50°C to 80°C) using an upper mold heating mechanism. An upper mold film supply process is carried out in which a new film F is supplied by operating the upper mold film supply unit 113 and adsorbed to cover a predetermined area of ​​the mold surface 104a of the upper mold 104.

[0082] After the preparation step, an adsorption step is performed in which the film F is adsorbed so as to block the through holes 404 provided in the resin guard 400 from the lower side. Specifically, first, the film supply unit 164 is activated to supply the strip-shaped film F. Next, an adsorption force is generated in the adsorption holes 408 and adsorption grooves 410 through the suction holes of the pickup (not shown) that holds the resin guard 400, thereby adsorbing and holding the film F to the resin guard 400 (lower surface 406a of the peripheral edge 406).

[0083] Here, the adsorption process includes a first adsorption step in which the film F (strip-shaped film) is first adsorbed by adsorption holes 408 that are arranged to surround the through hole 404 at a position relatively far from the through hole 404 (in this embodiment, they are provided intermittently at intervals), and a second adsorption step in which, after a predetermined time (for example, about 1 to 2 seconds) following the first adsorption step, the film F (strip-shaped film) is adsorbed by adsorption grooves 410 that are arranged to surround the through hole 404 at a position relatively close to the through hole 404 (in this embodiment, they are provided in a continuous annular shape).

[0084] In other words, when performing the above adsorption process, the control unit 100E operates the second adsorption circuit in advance to generate an adsorption force in the adsorption holes 408, and then operates the first adsorption circuit after a predetermined time (for example, about 1 to 2 seconds) to generate an adsorption force in the adsorption grooves 410.

[0085] According to the above adsorption process, the film F (strip-shaped film) can first be adsorbed and held by the adsorption holes 408 so as to block the through holes 404 from the bottom side. Furthermore, from that state, the film F (strip-shaped film) can be adsorbed by the annular adsorption groove 410 which is positioned closer to the through holes 404 than the adsorption holes 408, thereby holding the film F by drawing it into the adsorption groove 410. As a result, compared to the case where the film F (strip-shaped film) is adsorbed and held by the adsorption holes 408 alone (corresponding to the comparative examples shown in Figures 13 to 16 above), the film F can be adsorbed and held to the resin guard 400 (lower surface 406a of the peripheral portion 406) under extremely high tension. This prevents the formation of a gap between the lower surface 406a of the peripheral portion 406 and the film F due to the weight of the base resin Rm placed on the film F when the base resin Rm is transported by the resin guard 400 (see Figure 12). Therefore, it is possible to prevent the base resin Rm from getting trapped between the lower surface 406a of the peripheral portion 406 and the film F, which would cause a molding defect.

[0086] After the adsorption process, a placement process is performed in which the base resin Rm is supplied by the dispenser 166 and placed on the film F in the through-hole 404. Specifically, suction force is generated in the adsorption holes 408 and adsorption grooves 410 through the suction holes of the pickup (not shown) to adsorb and hold the film F to the resin guard 400 (lower surface 406a of the peripheral portion 406), and the resin guard 400 is transported and placed on the supply table 165. In this state, the base resin Rm is supplied (discharged) onto the film F from the dispenser 166. At this time, by moving the supply table 165 in the X and Y directions in a predetermined pattern, the base resin Rm can be spread evenly on the film F with a predetermined thickness. Alternatively, the dispenser 166 may be moved instead of the supply table 165.

[0087] After the placement process, the resin guard 400 (holding the film F and base resin Rm) on the supply table 165 is held and transported by the loader 168, and a setting process is performed in which the film F and base resin Rm are set in a predetermined position in the forming mold 102 (in this case, inside the cavity 108 of the lower mold 106) (see Figure 19). Specifically, suction force is generated in the suction holes 408 and suction grooves 410 via the suction holes (not shown) of the loader 168, and the film F on which the base resin Rm is placed is held by suction to the resin guard 400 (lower surface 406a of the peripheral edge 406), and the resin guard 400 is transported and brought into the forming mold 102. Next, the suction force in the suction holes 408 and suction grooves 410 is released (stopped), and the film F and base resin Rm are housed in the cavity 108 of the lower mold 106.

[0088] Furthermore, after setting the film F and base resin Rm, the resin guard 400 is returned to the supply unit 100A by the loader 168.

[0089] After the setting process, a forming process is carried out in the forming die 102, where the base resin Rm is heated and pressurized with the film F interposed between them to form a sealing resin R of a predetermined shape. The forming process according to this embodiment includes a tableting process in which the base resin Rm is tableted to form a solid or semi-solid resin as the sealing resin R having a "predetermined shape" (details described later) whose overall shape corresponds to the shape of the workpiece W. Specifically, the press device 150 is operated to perform a process (mold closing process) in which the forming die 102, which has been heated to the predetermined temperature, is closed (see Figure 20). At this time, the cavity piece 126 rises relatively within the cavity 108, and the base resin Rm is tableted (pressurized by being sandwiched) between the cavity piece 126 and the tableting plate 142. As a result, a solid or semi-solid sealing resin R having a predetermined shape and in a state that has not yet undergone heat curing (full curing) is formed. At this time, the base resin Rm that enters the leg-forming groove 143 of the tablet plate 142 via the film F becomes the leg Rb of the sealing resin R, and the remaining base resin Rm becomes the main body Ra of the sealing resin R (the detailed configuration of the sealing resin R will be described later). As a variation of the tableting process, a part of the base resin Rm may be held (welded, gripped, etc.) by the upper die 104 (not shown).

[0090] Furthermore, it is important that the above tableting process is carried out at a temperature at which the base resin Rm does not easily undergo thermal curing (main curing) so that the formed sealing resin R can be thermally cured (main curing) in the resin sealing process (one step of the compression molding method) later carried out in the compression molding apparatus 1 (by heating the lower mold 106 and upper mold 104 to a temperature at which thermal curing (main curing) does not easily occur). As mentioned above, the "temperature at which thermal curing does not easily occur" depends on the material of the base resin Rm, but as a specific example, it is about 50°C to 80°C (in this embodiment, it is about 70°C).

[0091] Here, the "predetermined shape" of the sealing resin R will be explained. As an example, in the case of a sealing resin R used in a compression molding apparatus 1 equipped with a sealing mold 202, the "predetermined shape" is a shape that does not come into contact with the electronic component Wb (including the wire if the electronic component Wb has a wire) when placed on the base material Wa of the workpiece W. As an example, as shown in Figure 2, a sealing resin R with a plate-shaped or block-shaped main body Ra and legs Rb intermittently (or continuously) erected on one surface of the main body Ra (the surface of the workpiece W facing the electronic component Wb) is preferred (however, it is not limited to this shape). The main body Ra is sized to fit inside the cavity 208 in a plan view, and considering resin flow, it is preferable that it be slightly smaller than the shape of the cavity 208 (especially the cavity block 226). In addition, the legs Rb need to have a height H (see Figure 3A) that does not come into contact with the electronic component Wb, but this does not exclude contact to the extent that the wire does not undergo plastic deformation. Furthermore, the legs Rb are positioned so as not to contact the electronic components Wb in a plan view of the main body Ra, and so as not to tilt the main body Ra when placed on the base material Wa of the workpiece W. In addition, it is preferable that the legs Rb be positioned between or around the electronic components Wb to minimize damage to the wiring (especially the wires) of the workpiece W during molding. The total amount of resin for the plate-shaped or block-shaped main body Ra and the legs Rb may be an amount that is neither too much nor too little, or a large amount of resin, so as not to be insufficient for a single compression molding. Specific examples of the configuration of the sealing resin R (Figures 22 to 25) will be described later.

[0092] As another example, in the case of a sealing resin R used in a compression molding apparatus 1 equipped with a sealing mold 302, the "predetermined shape" is such that, when closing the sealing mold 302, the upper mold 304 is gradually brought closer to the lower mold 306, and the tip (upper end) of the leg portion Rb of the sealing resin R housed in the cavity 308 comes into contact with the base material Wa of the workpiece W held by the workpiece holding portion 305, the main body portion Ra of the sealing resin R does not come into contact with the electronic component Wb of the workpiece W (including the wire if the electronic component Wb has a wire). The specific shape of the sealing resin R is the same as in the case of a sealing resin R used in a compression molding apparatus 1 equipped with a sealing mold 202 (see Figures 22 to 25), so repeated explanations are omitted. However, the sealing resin R is not limited to the configuration shown in Figures 22 to 25, and may have a configuration in which the upper surface is formed in a flat shape without providing the leg portion Rb on the upper surface (not shown).

[0093] Next, the resin quantity setting process for setting the "determined amount" of the base resin Rm described above will be explained. As an example of the resin quantity setting process, for each workpiece W to be sealed, the number of electronic components Wb mounted on a single substrate Wa (the number mounted or missing, and may also include measuring the height of the electronic components Wb) is measured by a measuring mechanism (not shown), and the control unit 100E calculates the amount of resin (in grams) required for resin sealing (compression molding) by subtracting the total volume of electronic components Wb from the volume of the cavities 208 and 308 of the sealing molds 202 and 302, thereby setting the "determined amount". Alternatively, as another example of the resin quantity setting process, multiple standard quantities corresponding to the type of workpiece W to be sealed are prepared, and the control unit 100E or the operator selects the optimal one from these standard quantities according to the type of workpiece W to set the "determined amount". In the case of standard quantities, it is important that there is no shortage of resin during resin sealing (compression molding). In either setting, an appropriate amount of base resin Rm can be supplied to the workpiece W. Therefore, it is possible to prevent molding defects caused by insufficient resin during resin encapsulation. Furthermore, it is possible to prevent waste caused by supplying more resin than necessary.

[0094] Furthermore, it is preferable to use powdered resin as the base resin Rm. This allows for extremely precise adjustment and supply of the resin in the specified amount compared to cases where granular resin or crushed resin is used. However, it is not limited to powdered resin.

[0095] After the tableting process, the mold 102 is opened to separate the sealing resin R from the used film F (the roll-shaped film F attached to the first surface of the sealing resin R) and to allow the sealing resin R to be removed (see Figure 21). For the sake of explanation, the surface of the sealing resin R that is pressurized and formed by the upper mold 104 is referred to as the "first surface," and the surface that is pressurized and formed by the lower mold 106 is referred to as the "second surface."

[0096] After the mold opening process, or concurrently thereafter, the upper mold film supply unit 113 is activated to feed out the used film F (roll-shaped film) for the upper mold 104 from inside the forming mold 102, and a new film F is fed into the forming mold 102 and set on the upper mold 104 (mold surface 104a) in an upper mold film supply process.

[0097] Furthermore, after the mold opening process, a loading process is performed in which the sealing resin R is unloaded from the forming mold 102 by the loader 169 and transported to the storage section 100C. In this embodiment, the used film F (strip-shaped film) for the lower mold 106 is attached to the second surface of the sealing resin R when it is transported to the film peeling mechanism 170 in the storage section 100C.

[0098] After the unloading process, a peeling process is performed to peel the film F (the roll-shaped film F attached to the second surface of the sealing resin R) from the sealing resin R. In this embodiment, first, an inversion process is performed in which the sealing resin R is inverted vertically using the inversion mechanism 194. This makes it possible to have the second surface of the sealing resin R to which the strip-shaped film F is attached facing upwards, and the first surface to which the strip-shaped film F is not attached facing downwards. If inversion is not necessary, the above inversion process can be omitted.

[0099] After the inversion process, the sealing resin R (with the first surface facing downwards) is adsorbed and held on an adsorption stage (not shown) (the first surface becomes the surface to be adsorbed). Next, the gripping part (not shown) grips (clamps) one end of the film F and moves toward the other end, thereby allowing the film F (strip-shaped film) to be peeled off from the sealing resin R (second surface).

[0100] After the peeling process, the peeled film F (strip-shaped film) is disposed of in a disposer (not shown). The sealing resin R is then stored in the storage magazine 192.

[0101] The above outlines the main steps of the method for forming the sealing resin R using the forming apparatus 100. However, the above order of steps is just one example, and the order can be changed or the steps performed in parallel as long as there are no obstacles.

[0102] (Sealing resin) Next, Figures 22 to 25 show specific examples of the configuration of the sealing resin R formed by the above-described forming apparatus 100 and forming method, and their respective characteristics will be explained.

[0103] First, as a configuration common to each example shown in Figures 22 to 25, the main body Ra is formed in a plate shape (however, other shapes such as a block shape with recesses or protrusions may also be used). The legs Rb are erected on the main body Ra so as not to come into contact with the electronic components Wb of the workpiece W when the sealing resin R is placed on the base material Wa of the workpiece W, and are formed to a height H (see Figure 3A, etc.) that ensures a distance that prevents the main body Ra from coming into contact with the electronic components Wb. As described above, in the tableting process, the base resin Rm that enters the leg-forming groove 143 of the tableting plate 142 via the film F becomes the legs Rb of the sealing resin R, and the remaining base resin Rm becomes the main body Ra of the sealing resin R.

[0104] In the example of the sealing resin R shown in FIG. 22, all (or alternatively a part of) the leg portions Rb are formed as convex bodies Rb1 arranged in a dotted pattern. As an example, the convex bodies Rb1 are disposed at a plurality of positions, and are formed into a shape in which the ratio t of the length L1 to the width W1 in a plan view satisfies 0.5≦t≦2 by way of example. According to this configuration, since the leg portions Rb are columnar bodies arranged in a dotted pattern, the flow of the sealing resin R placed on the workpiece W during compression molding can be suppressed. Therefore, wire flow and the like can be prevented, and molding quality can be improved.

[0105] In the example of the sealing resin R shown in FIG. 23, a part (or alternatively all) of the leg portions Rb is formed as a convex body Rb2 arranged linearly. As an example, the convex body Rb2 is disposed at one position (or alternatively a plurality of positions), and is formed into a shape in which the ratio t of the length L2 to the width W2 in a plan view satisfies t<0.5 or 2<t by way of example. According to this configuration, resin flow is intentionally generated from the leg portion Rb (in this case, the convex body Rb2) having a bank-shaped configuration of a predetermined length, thereby promoting filling of the sealing resin R into a narrow gap of the workpiece W (for example, the gap between a flip-chip bonded substrate Wa and an electronic component Wb). Therefore, residual gas in the molded product Wp can be prevented, and molding quality can be improved.

[0106] In the example of the sealing resin R shown in Figure 24, the leg portion Rb is formed as a convex body Rb3 that is arranged intermittently (or continuously) to surround the entire outer circumference (referring to the outer edge region) of the main body portion Ra. As an example of the convex body Rb3, convex bodies with the same configuration as Rb2 described above are formed in a series that form a circumference with gaps L3 at predetermined intervals. Generally, the outer circumference of the sealing resin R in the molded product Wp is the position that is cut by a dicer or the like when it is made into individual pieces, and since there are no electronic components Wb there, it requires a larger amount of resin to seal compared to the central position. Therefore, by providing leg portions Rb (in this case, convex body Rb3) that are arranged to surround the entire outer circumference as in this configuration, it is possible to supply a large amount of resin to the outer circumference while suppressing resin flow during compression molding. Furthermore, the provision of gaps L3 promotes the discharge of gaseous components such as air from the inside (central part) to the outside.

[0107] On the other hand, the example of the sealing resin R shown in Figure 25 is a configuration example relating to the other surface of the main body Ra (the surface on which the leg portion Rb is not provided, i.e., the surface on which the workpiece W does not face the electronic component Wb). Specifically, on the other surface of the main body Ra, linear groove portions Rg are formed at the positions where dicing for individual piece formation is performed. This reduces wear on the dicing blade and reduces dust generated during dicing. As an example, the groove portions Rg are provided in a grid pattern that coincides with the dicing positions, but this is not the only option. In order to form the groove portions Rg, the tableting process can be carried out using a cavity die 126 on which a correspondingly shaped projection (not shown) is provided on the upper surface.

[0108] As described above, the forming apparatus 100 and forming method according to the present invention make it possible to prevent the base resin Rm from overflowing from the storage section 402 of the conveying device 400 and the occurrence of forming defects caused by such overflow, especially when forming a sealing resin R from a base resin Rm such as a powder resin.

[0109] Furthermore, by using the sealing resin R formed by the forming apparatus 100 and forming method, a compression molding apparatus 1 and compression molding method can be realized that provide the following effects. Specifically, the compression molding apparatus 1 and compression molding method can prevent molding defects caused by resin flow, uneven distribution, residual gas, and dust generation during molding. In addition, it is possible to form not only thin molded products Wp (thickness dimension less than 1 mm) but also thick molded products Wp (thickness dimension 1 mm or more). The upper limit of the thickness dimension depends on various setting conditions, but it is considered that it is possible to form up to about 10 mm. In addition, handling during supply and setup becomes easier.

[0110] Furthermore, the compression molding apparatus 1 and compression molding method can solve the problems that arise when a cavity is provided in the upper mold. Specifically, in conventional compression molding apparatuses where a cavity is provided in the upper mold, for example, when performing a mold closing process on a workpiece W on which a strip-type wire-connected electronic component (semiconductor chip) Wb is mounted, the wire portion of the workpiece held in the lower mold comes into contact with the sealing resin supplied to the cavity beforehand or the sealing resin supplied onto the workpiece, causing deformation and cutting, which makes resin sealing difficult. This problem can be solved by adopting a configuration in which the sealing resin R formed by the apparatus and method according to this embodiment is a solid or semi-solid resin formed into a predetermined shape corresponding to the shape of the workpiece W.

[0111] Specifically, during the mold closing process, the sealing resin R softens and melts due to heating, as shown in Figure 3A to Figure 3B. At this time, the resin (specifically, the main body Ra) comes into uniform contact with all the wires (see Figure 3B). Therefore, deformation and breakage of the wires can be prevented.

[0112] Furthermore, when the inventor actually conducted experiments using the above-described compression molding apparatus 1 with the sealing resin R formed by the apparatus and method according to this embodiment, it was confirmed that, compared to a conventional compression molding apparatus having a configuration in which the workpiece W is held in the upper mold, a cavity is provided in the lower mold, and sealing resin (specifically, granular resin) is supplied to the cavity, deformation and breakage of the wire were prevented and the molding quality was improved.

[0113] On the other hand, the compression molding apparatus 1 and compression molding method can also solve the problems that arise when a cavity is provided in the lower mold. In other words, in conventional compression molding apparatuses where a cavity is provided in the lower mold, especially when granular resin is used as the sealing resin, the particle size and height (layer thickness) of the sealing resin (granular resin) contained in the cavity are not uniform. For example, depending on the type and melting state of the granular resin, it may not be completely liquid (low viscosity), and when performing the mold closing process on a workpiece W on which a strip-type wire-connected electronic component (semiconductor chip) Wb is mounted, as shown in Figure 26, depending on the position, the wire portion of the workpiece held in the upper mold may come into strong (large) contact with the sealing resin (granular resin), causing deformation and cutting. Furthermore, as shown in Figure 27, there was a problem that a large amount of resin flow occurred in the cavity, causing deformation and cutting of the wire portion. This problem can be solved by adopting a configuration that uses a sealing resin R formed by the apparatus and method according to this embodiment, that is, a solid or semi-solid resin formed into a predetermined shape corresponding to the shape of the workpiece W.

[0114] Specifically, the reason is the same as explained in Figures 3A and 3B above: during the mold closing process, the sealing resin R softens and melts due to heating, resulting in uniform contact between all the wires and the resin (specifically, the main body Ra). From this perspective, the sealing resin R is not limited to the configurations shown in Figures 22 to 25, and may also be configured (not shown) with a flat top surface without the legs Rb. Even with this configuration, it is possible to solve the problems caused by the non-uniformity of particle size and height (layer thickness) compared to conventional technology using granular resin.

[0115] Furthermore, by making the forming device 100 a separate device from the compression molding device 1, the compression molding device 1 can be made unaffected by dust generated when the powder resin inside the forming device 100 is compressed into tablets, and the compression molding device 1 can be easily placed inside a clean room. However, the configuration is not limited to this, and the forming device 100 may also be installed integrally within the compression molding device 1.

[0116] Furthermore, the present invention is not limited to the embodiments described above, and can be modified in various ways without departing from the scope of the invention. [Explanation of Symbols]

[0117] 1. Compression molding apparatus 100 Apparatus for forming sealing resin 102 Forming mold 202, 302 Sealing mold 400 Resin Guard (Conveyor) F Release Film Rm base resin R Sealing resin Double job

Claims

1. A forming apparatus for compressing a base resin into tablets to form a sealing resin used for compression molding of a workpiece, A forming die that contains the base resin and is formed by pressing to create a sealing resin having a predetermined shape corresponding to the shape of the workpiece, The system includes a resin guard that holds the base resin and transports it to the molding die, The resin guard has through holes that penetrate in the vertical direction, and has a receiving section that holds the base resin on the release film inside the through holes while the release film is adsorbed to close the through holes from the lower side. The receiving portion has an adsorption groove drilled in a continuous annular pattern on the lower surface of the peripheral edge of the through hole, surrounding the through hole, for adsorbing and holding the release film, and the receiving portion has adsorption holes intermittently arranged on the lower surface of the peripheral edge of the through hole, outside the adsorption groove, surrounding the through hole, for adsorbing and holding the release film. A first adsorption circuit that generates an adsorption force in the adsorption groove, A second adsorption circuit that generates an adsorption force in the adsorption pore, The system comprises a control unit that controls the operation of the first adsorption circuit and the second adsorption circuit, The control unit performs the following control when adsorbing the release film onto the lower surface of the peripheral edge of the through hole: first, activate the second adsorption circuit to generate an adsorption force in the adsorption hole, and then, after a predetermined time has elapsed, activate the first adsorption circuit to generate an adsorption force in the adsorption groove. A sealing resin forming apparatus characterized by the following.

2. A powder resin is used as the base resin. The apparatus for forming a sealing resin according to claim 1, characterized by the above.

3. The forming mold is set to a heating temperature that does not easily cause the base resin to harden, so that the formed sealing resin can harden when it is used for compression molding of the workpiece. An apparatus for forming a sealing resin according to claim 1 or claim 2, characterized by the above.

4. A forming method for forming a sealing resin used for compression molding of a workpiece by compressing the base resin into tablets using a forming apparatus comprising a resin guard for conveying a base resin and a forming die for compressing the base resin, The suction step involves adsorbing a release film so as to block the through-holes provided in the resin guard from the lower side, thereby forming a housing portion for placing and holding the base resin. Following the adsorption step, a placement step is performed in which the base resin is placed on the release film in the through hole, Following the placement step, a setting step is performed in which the release film and the base resin are transported by the resin guard and set in a predetermined position in the molding die. The process includes, after the setting step, a forming step of closing the mold of the forming die to form the sealing resin, The forming apparatus includes, On the lower surface of the peripheral edge of the through hole of the resin guard, there are adsorption grooves drilled in a continuous annular pattern surrounding the through hole to adsorb and hold the release film, and adsorption holes intermittently arranged outside the adsorption grooves surrounding the through hole to adsorb and hold the release film, A first adsorption circuit that generates an adsorption force in the adsorption groove, A second adsorption circuit is provided in the adsorption pores to generate an adsorption force, The adsorption step is, The method for adsorbing the release film onto the lower surface of the peripheral edge of the through hole includes a first adsorption step in which the second adsorption circuit is activated in advance to generate an adsorption force in the adsorption hole, and a second adsorption step in which the first adsorption circuit is activated after a predetermined time has elapsed since the first adsorption step to generate an adsorption force in the adsorption groove. A method for forming a sealing resin characterized by the above.

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