Resin composition, molded article
Patent Information
- Application Number
- JP2021113850
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2021-07-08
- Publication Date
- 2026-10-01
- Estimated Expiration
- 2041-07-08
AI Technical Summary
【0009】 本発明の樹脂組成物は、機械的強度、耐熱性、及び流動性と、低誘電性との両方に優れた樹脂成形品を得ることができる。
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Abstract
Description
Technical Field
[0001] The present invention relates to a resin composition containing a thermoplastic polyester resin, and a molded article containing the resin composition. Background Art
[0002] As a crystalline thermoplastic resin, thermoplastic polyester resins are excellent in mechanical strength, electrical properties, injection moldability and various other physical properties, and thus are used in a wide range of fields including automobiles, electrical and electronic devices, and the like. In recent years, application of thermoplastic polyester resins to high-frequency compatible members such as next-generation high-speed communication antennas and in-vehicle radars compatible with autonomous driving has been expected, and low dielectric properties capable of suppressing dielectric loss (lower relative permittivity and lower dielectric loss tangent) are required as electrical properties compatible with higher frequencies.
[0003] However, in response to such problems, thermoplastic polyester resins have limitations in achieving low dielectric properties because dielectric loss in high frequency bands occurs due to polar groups in the molecular structure. Therefore, studies on achieving low dielectric properties have been advanced by blending other thermoplastic resins excellent in low dielectric properties or blending glass fibers excellent in low dielectric properties (see, for example, Patent Document 1). Prior Art Literature Patent Literature
[0004] Patent Document 1 International Publication No. 2020 / 059651 Disclosure of the Invention Problem to be Solved by the Invention
[0005] However, even in Patent Document 1, there were further problems in achieving both mechanical properties, heat resistance, fluidity, and low dielectric properties.
[0006] The object of the present invention is to provide a resin composition and a molded article thereof that can be obtained in which both mechanical properties, heat resistance, and fluidity are excellent, as well as low dielectric properties. [Means for solving the problem]
[0007] As a result of diligent research to solve the above problems, we found that the above problems can be solved by (A) blending a thermoplastic polyester resin with (B) a polyphenylene ether resin and (C) a compatibilizer having a specific reactive functional group, and further blending it with (D) glass fibers with a low dielectric constant, which led to the present invention.
[0008] In other words, the present invention is as follows. [1] (A) Thermoplastic polyester resin, (B) Polyphenylene ether resin, in a total of 100 parts by mass, The mixture comprises 50 to 90 parts by mass of component (A), 10 to 50 parts by mass of component (B), 0.5 to 5.0 parts by mass of a styrene copolymer having a glycidyl group (C), and (D) glass fibers. The relative permittivity of component (D) measured at a frequency of 1 GHz is less than 6.0. Resin composition. [2] The resin composition according to [1], comprising 70 to 80 parts by mass of component (A) and 20 to 30 parts by mass of component (B) with respect to a total of 100 parts by mass of component (A) and component (B). [3] The phase containing component (A) forms a matrix, and the phase containing component (B) forms a dispersed phase within the matrix. The average particle size of the dispersed phase is 0.1 to 5.0 μm. The resin composition described in [1] or [2]. [4] The resin composition according to any one of [1] to [3], wherein component (A) is at least one selected from the group consisting of polyethylene terephthalate, polytrimethylene terephthalate, and polybutylene terephthalate. [5] The resin composition according to [4], wherein the component (A) comprises polybutylene terephthalate. [6] The resin composition according to any one of [1] to [5], wherein the relative permittivity of the (D) component measured at a frequency of 1 GHz is less than 5.0. [7] A molded article comprising the resin composition described in any of [1] to [6]. [Effects of the Invention]
[0009] The resin composition of the present invention can produce resin molded articles that are excellent in both mechanical strength, heat resistance, and fluidity, as well as low dielectric properties. [Modes for carrying out the invention]
[0010] The resin composition of the present invention will be described in detail below. Hereinafter, embodiments of the present invention will also be referred to as "this embodiment."
[0011] [Resin composition] The resin composition of this embodiment is a resin composition comprising (A) thermoplastic polyester resin and (B) polyphenylene ether resin in a total of 100 parts by mass, with (A) thermoplastic polyester resin being 50 to 90 parts by mass, (B) polyphenylene ether resin being 10 to 50 parts by mass, (C) styrene copolymer having glycidyl groups being 0.5 to 5.0 parts by mass, and (D) glass fibers, wherein the dielectric constant of component (D) when measured at a frequency of 1 GHz is less than 6.0.
[0012] By adopting the above configuration, the resin composition of this embodiment can produce a resin molded product that maintains mechanical strength and heat resistance while exhibiting excellent fluidity and low dielectric properties.
[0013] [(A) Thermoplastic polyester resin] In this embodiment, the thermoplastic polyester resin (A) (hereinafter sometimes simply referred to as "component (A)") is not particularly limited, but it is preferably a polyester of an aromatic dicarboxylic acid and an alkylene glycol. Specifically, examples include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, poly-1,4-cyclohexylenemethylene terephthalate, poly(1,4-butylene terephthalate-co-isophthalate), and poly(ethylene-co-1,4-cyclohexylenemethylene terephthalate). Component (A) may be a single polyester resin or a combination of two or more. From the viewpoint of improving injection moldability, mechanical strength, and heat resistance, component (A) is preferably at least one selected from polyethylene terephthalate, polytrimethylene terephthalate, and polybutylene terephthalate, and more preferably contains polybutylene terephthalate (PBT).
[0014] [(B) Polyphenylene ether resin] Specific examples of the (B) polyphenylene ether resin (hereinafter sometimes simply referred to as "component (B)") in this embodiment include, for example, poly(2,6-dimethyl-1,4-phenylene ether), poly(2-methyl-6-ethyl-1,4-phenylene ether), poly(2-methyl-6-phenyl-1,4-phenylene ether), poly(2,6-dichloro-1,4-phenylene ether), and polyphenylene ether copolymers such as copolymers of 2,6-dimethylphenol with other phenols (for example, copolymers with 2,3,6-trimethylphenol or copolymers with 2-methyl-6-butylphenol as described in Japanese Patent Publication No. 52-17880). Among these, particularly preferred polyphenylene ethers are poly(2,6-dimethyl-1,4-phenylene ether), copolymers of 2,6-dimethylphenol and 2,3,6-trimethylphenol, or mixtures thereof.
[0015] The method for producing component (B) is not particularly limited as long as it can be obtained by a known method. Examples include the method described in U.S. Patent No. 3,306,874, which is produced by oxidative polymerization of, for example, 2,6-xylenol using a complex of a cuprous salt and an amine as a catalyst, as well as the production methods described in U.S. Patent No. 3,306,875, U.S. Patent No. 3,257,357, U.S. Patent No. 3,257,358, Japanese Patent Application Laid-open No. 50-51197, Japanese Patent Publication No. 52-17880, and Japanese Patent Publication No. 63-152628, among others.
[0016] The preferred range of the reduced viscosity of component (B) in the present embodiment (measured with an Ubbelohde viscometer in a 0.5 g / dL chloroform solution at 30°C) is 0.30 to 0.80 dL / g, more preferably 0.35 to 0.75 dL / g, and still more preferably 0.38 to 0.55 dL / g. When the reduced viscosity of component (B) falls within this range, excellent properties such as impact resistance and heat resistance are obtained, which is preferable.
[0017] In component (B) of the present embodiment, even a blend of two or more polyphenylene ethers having different reduced viscosities can be preferably used.
[0018] In addition, various known stabilizers can be suitably used to stabilize component (B). Examples of stabilizers include metallic stabilizers such as zinc oxide and zinc sulfide, and organic stabilizers such as hindered phenol stabilizers, phosphorus-based stabilizers, and hindered amine stabilizers. The preferred blending amount thereof is less than 5 parts by mass relative to 100 parts by mass of component (B).
[0019] Furthermore, known additives and the like that can be added to component (B) may also be added in an amount of less than 10 parts by mass relative to 100 parts by mass of component (B).
[0020] [(A) Quantitative ratio of thermoplastic polyester resin to (B) polyphenylene ether resin] In this embodiment, the content of (A) thermoplastic polyester resin and (B) polyphenylene ether resin is in the range of 50 to 90 parts by mass of component (A) and 10 to 50 parts by mass of component (B), when the total amount of both is 100 parts by mass. Preferably, it is in the range of 65 to 85 parts by mass of component (A) and 15 to 35 parts by mass of component (B), and more preferably, it is in the range of 70 to 80 parts by mass of component (A) and 20 to 30 parts by mass of component (B). When the content ratio of component (A) to component (B) is within this range, it is preferable because it has an excellent balance of heat resistance, fluidity and mechanical strength.
[0021] In this embodiment, the total content of component (A) and component (B) is preferably 50 to 90% by mass, and more preferably 70 to 80% by mass, when the entire resin composition is considered to be 100% by mass.
[0022] [(A) Dispersion form of thermoplastic polyester resin and (B) polyphenylene ether resin] In the resin composition of this embodiment, it is preferable that the phase containing component (A) forms a matrix (continuous phase). On the other hand, the phase containing component (B) may form a dispersed phase within the matrix. It is preferable that the dispersed phase is particulate in appearance. Furthermore, the average particle size of the dispersed phase is preferably 0.1 to 5.0 μm, more preferably 0.2 to 4.0 μm, and particularly preferably 0.5 to 2.0 μm.
[0023] The average particle size of the dispersed phase can be measured by the following procedure. Specifically, the resin composition is stained using a method that stains thermoplastic polyester resin, and a morphological image is obtained by observing and capturing it with a scanning electron microscope (Hitachi High-Technologies SU8220) at an acceleration voltage of 4kV and a magnification of 5000x. The obtained morphological image is binarized by image processing to identify the matrix (continuous phase) and the dispersed phase. The short and long axes of the identified dispersed phase are measured, and their average value is calculated as the particle size. The average particle size of the dispersed phase is then calculated by determining the average particle size for any 4000 dispersed phases in the image. More specifically, it can be measured by the method described in the examples.
[0024] [(C) Styrene copolymer having a glycidyl group] This embodiment includes a styrene copolymer having a glycidyl group (hereinafter sometimes simply referred to as "component (C)"). Component (C) interacts with component (A), component (B), or both, and acts as a compatibilizer between component (A) and component (B). As a result, the resulting polyester-polyphenylene ether mixture exhibits improved compatibility.
[0025] In particular, by using component (C) as a compatibilizer, it acts as an emulsifying dispersant when mixing component (A) and component (B), providing an excellent balance between the heat resistance, toughness (impact strength), and mechanical strength of the resin composition of this embodiment.
[0026] Component (C) preferably contains 65% by weight or more of styrene monomer units, and more preferably 75-95% by weight, from the viewpoint of improving miscibility with component (B).
[0027] In this embodiment, the preferred content of component (C) is 0.1 to 5.0 parts by mass, more preferably 0.5 to 3.0 parts by mass, and particularly preferably 0.8 to 1.5 parts by mass, when the total amount of components (A) and (B) is 100 parts by mass.
[0028] [(D) Glass fiber] This embodiment includes (D) glass fibers (hereinafter sometimes simply referred to as "component (D)"). Component (D) has a relative permittivity of less than 6.0 when measured at a frequency of 1 GHz, preferably less than 5.0, and more preferably less than 4.9.
[0029] (D) The component is not limited as long as the relative permittivity measured at a frequency of 1 GHz is less than 6.0, but a low ratio of alkaline earth components (CaO, MgO) and a high ratio of boric acid (B2O3) are preferable for achieving a low relative permittivity. This tends to enable the realization of low dielectric constant and low dielectric loss tangent while having properties equivalent to general-purpose glass fibers. Furthermore, glass fibers that have been surface-treated using a known method with a surface treatment agent may be used.
[0030] The relative permittivity of glass fibers can be measured using a network analyzer and the cavity resonance method, and more specifically, it can be measured by the method described in the examples.
[0031] The content of component (D) is preferably 10 to 40% by mass, more preferably 15 to 35% by mass, and particularly preferably 20 to 30% by mass, when the entire resin composition is considered to be 100% by mass.
[0032] [Coloring agent] In this embodiment, there are no particular restrictions on the method of coloring the resin composition, and one or more colorants selected from known organic dyes and pigments and inorganic pigments can be used.
[0033] Examples of organic dyes and pigments include azo pigments such as azo lake pigments, benzimidazolone pigments, diarylide pigments, and condensed azo pigments; phthalocyanine pigments such as phthalocyanine blue and phthalocyanine green; isoindolinone pigments, quinophthalone pigments, quinacridone pigments, perylene pigments, anthraquinone pigments, perinone pigments; condensed polycyclic pigments such as dioxazine violet; azine pigments; and carbon black.
[0034] Of these, the carbon black has a dibutyl phthalate (DBP) absorption rate of less than 250 mL / 100 g, preferably less than 150 mL / 100 g, and a nitrogen adsorption specific surface area of 900 m². 2 Less than / g, more preferably 400m 2It is preferable that the values are less than / g. When these are within this range, a composition with particularly excellent colorability, mechanical strength, and flame retardancy can be obtained.
[0035] The DBP absorption amount and nitrogen adsorption specific surface area referred to herein are values measured by the methods specified in ASTM D2414 and JIS K6217, respectively.
[0036] Examples of azine-based dyes include Solvent Black 5 (CI50415, CAS No. 11099-03-9), Solvent Black 7 (CI50415:1, CAS No. 8005-20-5 / 101357-15-7), and Acid Black 2 (CI50420, CAS No. 8005-03-6 / 68510-98-5) in the Color Index. Examples of inorganic pigments include metal oxides other than iron oxides, such as titanium dioxide, zinc oxide, and chromium oxide, as well as composite metal oxides such as titanium yellow, cobalt blue, and ultramarine.
[0037] The preferred amounts of the above-mentioned colorants are 2% by mass or less for carbon black, 2% by mass or less for azine-based dyes, and 8% by mass or less for inorganic pigments, when the entire resin composition is considered to be 100% by mass. More preferred amounts are 1% by mass or less for carbon black, 1% by mass or less for azine-based dyes, and 5% by mass or less for inorganic pigments. Adding the material in the above amounts allows for a good balance between impact resistance and mechanical properties. Furthermore, for applications requiring flame retardancy, the above amounts are preferable from a flame retardancy standpoint.
[0038] [Other additives] In this embodiment, in addition to the components described above, other additive components may be added at any stage as needed, as long as they do not impair the effects of this embodiment.
[0039] Other examples of additive components include other thermoplastic resins such as polyamides and polyolefins, plasticizers (low molecular weight polyolefins, polyethylene glycol, fatty acid esters, etc.), and antistatic agents, nucleating agents, flow improvers, anti-dripping agents, reinforcing agents, various peroxides, spreading agents, copper-based heat stabilizers, organic heat stabilizers such as hindered phenol-based antioxidants, antioxidants, ultraviolet absorbers, and light stabilizers.
[0040] The specific preferred amounts of other additive components are 15% by mass or less, more preferably 13% by mass or less, and even more preferably 10% by mass or less, when the entire resin composition is considered to be 100% by mass. Furthermore, the total amount of other additive components is preferably 30% by mass or less, more preferably 25% by mass or less, and even more preferably 20% by mass or less, when the entire resin composition is considered to be 100% by mass.
[0041] (Method for manufacturing resin compositions) There are no particular limitations on the specific processing machinery used to obtain the resin composition of this embodiment. Examples include single-screw extruders, twin-screw extruders, rolls, kneaders, Brabender plastographs, Banbury mixers, etc. Among these, twin-screw extruders are preferred, and most preferably, twin-screw extruders equipped with an upstream feed port and one or more downstream feed ports.
[0042] The melting and mixing temperature is preferably in the range of 250 to 320°C.
[0043] The melt-kneading process for obtaining the resin composition of this embodiment is not particularly limited, but for example, it is preferable to melt-knead component (B) and component (C) first, and then add component (A) and component (D) and melt-knead them together. Specifically, it is preferable to use a twin-screw extruder equipped with a total of three supply ports, one each in the upstream, middle, and downstream sections in the direction of raw material flow, and to supply component (B) and component (C) from the upstream supply port, component (A) from the middle supply port, and component (D) from the downstream supply port.
[0044] (Molded articles and methods for manufacturing the same) By molding the resin composition of this embodiment using general molding methods for resin compositions, such as injection molding, extrusion molding, press molding, blow molding, calendering, and casting, molded articles having various shapes can be manufactured.
[0045] In other words, the molded article of this embodiment contains the resin composition of this embodiment.
[0046] For example, a molded product of a predetermined shape can be manufactured by melting a resin composition in the cylinder of an injection molding machine, where the cylinder temperature is adjusted to be within the range of above the melting point of component (A) and 350°C or less, and injecting it into a mold of a predetermined shape.
[0047] Furthermore, fibrous molded products can be manufactured by melting the resin composition in an extruder with the cylinder temperature adjusted within the above range and extruding it from a die nozzle.
[0048] Furthermore, by melting the resin composition in an extruder with the cylinder temperature adjusted within the above range and extruding it from a T-die, film-like or sheet-like molded products can be manufactured.
[0049] Furthermore, molded products manufactured using this method can also be used in a form in which a coating layer consisting of paint, metal, or other types of polymers is formed on the surface.
[0050] The resin composition of this embodiment can be suitably used as a molding material for various parts, including those for automobiles, electrical and electronic applications, industrial materials, and daily and household goods. [Examples]
[0051] The present invention will be described in more detail below with reference to examples and comparative examples, but the present invention is not limited to these examples. The raw materials and evaluation methods used in the examples and comparative examples are shown below.
[0052] [raw materials] (A) Thermoplastic polyester resin Polybutylene terephthalate (manufactured by Polyplastics Co., Ltd., "Duranex® 500FP")
[0053] (B) Polyphenylene ether resin Polyphenylene ether resin (PPE) obtained by oxidative polymerization of 2,6-xylenol (reduced viscosity 0.40 dL / g (0.5 g / dL, chloroform solution, measured at 30°C)).
[0054] (C-1) Styrene-based glycidyl methacrylate (manufactured by NOF Corporation, "Marproof G-1005S (registered trademark)", styrene monomer unit content) 95 weight %, epoxy equivalent 3300g / eq, Tg96℃, weight average molecular weight 100,000) (C-2) Ethylene-based glycidyl methacrylate (Sumitomo Chemical Co., Ltd., "Bond First BF-2C", glycidyl methacrylate content 6%, specific gravity 0.93)
[0055] (D) Inorganic fillers (D-1) Glass fiber (manufactured by Nitto Boseki Co., Ltd., NE Glass CN 3J-256), relative permittivity (measured using a bulk glass test piece of the same composition, approximately 50 mm in length and 1.5 mm in width, with a network analyzer (N5230A, manufactured by Agilent Technologies) and a cavity resonator (Cavity Resornator CP series, manufactured by Kanto Electronics Applied Development Co., Ltd.), under conditions of 23±2℃ and 50±5% relative humidity) approx. 4.8) (D-2) Glass fiber (manufactured by Nippon Electric Glass Co., Ltd., ECS03T-187, cross-sectional diameter 13 μm, fiber length 3 mm, relative permittivity (measured using a bulk glass test piece of the same composition, approximately 50 mm in length and 1.5 mm in width, with a network analyzer (N5230A, manufactured by Agilent Technologies) and a cavity resonator (Cavity Resornator CP series, manufactured by Kanto Electronics Applied Development Co., Ltd.) at an environment of 23 ± 2 °C and relative humidity 50 ± 5%) approximately 6.6, epoxy-based stimulant treated product)
[0056] [Evaluation Method] The evaluation tests conducted in the examples and comparative examples were carried out as follows.
[0057] (1) Melt Volume Flow Rate (MVR) The obtained resin composition pellets were evaluated for MVR (cc / 10min) at 250°C and a load of 5.00 kg in accordance with ISO 1133. A higher value indicates better liquidity.
[0058] (2) Load deflection temperature (DTUL) The obtained resin composition pellets were supplied to a small injection molding machine (product name: IS-100GN, manufactured by Toshiba Machine Co., Ltd.) with the cylinder temperature set to 270-290°C, and an evaluation ISO dumbbell was fabricated under the conditions of a mold temperature of 90°C, injection pressure of 70 MPa, injection time of 20 seconds, and cooling time of 15 seconds. In addition, the ISO dumbbell was cut to create a test piece for DTUL measurement. DTUL (ISO 75: 1.80 MPa load) was measured using the above-mentioned test piece for load deflection temperature measurement. A higher value indicated superior heat resistance.
[0059] (3) Bending strength (FS), flexural modulus (FM) Using test pieces created by the molding process described above, FS (MPa) and FM (MPa) were measured in accordance with ISO 178. Higher values indicated superior mechanical strength.
[0060] (4) Dielectric properties A test piece was created by cutting the ISO dumbbell produced by the molding process described above. Using the above test piece, the dielectric constant (Dk) and dielectric loss tangent (Df) at 10 GHz were measured using the cavity resonance method. The measurement equipment used was a network analyzer: 10MHz to 43.5GHz PNA network analyzer N5224B, and a 10GHz resonator: 10GHz Split Post Dielectric Resonator N1501AE10.
[0061] (5) Average particle size of the particulate dispersed phase For the staining method of the resin composition to obtain morphological images, an ISO dumbbell was polished to obtain a cross-section perpendicular to the resin flow direction, and an observation cross-section was prepared. The prepared sample was placed in a sealed container with ruthenium tetroxide at room temperature for 5 minutes to perform electron staining of the PPE phase. After attaching the electron-stained sample cross-section to the SEM sample stage, a thin film of osmium was deposited on the sample using an osmium coater to perform conductive treatment. The above-stained and treated sample cross-section was observed and photographed using a scanning electron microscope (Hitachi High-Technologies SU8220) at an acceleration voltage of 4kV and a magnification of 5000x. For the image processing method to obtain a binarized morphological image, the acquired backscattered electron image was analyzed using image analysis software (National Research Institutes of Health / imageJ) following the procedure below. 1) Binarize the backscattered electron image using Otsu's method. 2) From the binarized image, the matrix (continuous phase) and the dispersed phase were identified. The short and long axes of the identified dispersed phase were measured, and their average values were calculated as the particle diameter. The average particle diameter of the dispersed phase was then calculated by determining the average particle diameter for any 4000 dispersed phases in the image.
[0062] [Examples 1, 2, Comparative Examples 1-4] A twin-screw extruder ZSK-25 (manufactured by Coperion) was used as the manufacturing apparatus for the resin composition. In this twin-screw extruder, a total of two supply ports were provided: one upstream and one midstream in the direction of raw material flow. Vacuum vents were provided in the cylinder block immediately before the midstream supply port and in the cylinder block immediately before the die. Furthermore, the raw material was supplied to the midstream supply port using a forced side feeder from the side opening of the extruder.
[0063] Components (A) to (D) were supplied to the twin-screw extruder configured as described above, in the compositions shown in Table 1. The mixture was melt-kneaded under the conditions of an extrusion temperature of 280-320°C, a screw rotation speed of 400 rpm, and a discharge rate of 20 kg / hour to obtain pellets of the resin composition.
[0064] The evaluation results of the resin composition are shown in Table 1.
[0065] [Table 1] [Industrial applicability]
[0066] The resin composition of the present invention can produce resin molded articles that are excellent in both mechanical strength, heat resistance, and fluidity, as well as low dielectric properties.
Claims
1. (A) Thermoplastic polyester resin, (B) Polyphenylene ether resin, in a total of 100 parts by mass, The material comprises 50 to 90 parts by mass of component (A), 10 to 50 parts by mass of component (B), 0.5 to 5.0 parts by mass of a styrene copolymer having a glycidyl group (C), and (D) glass fibers. The aforementioned component (A) includes polybutylene terephthalate, The aforementioned component (C) contains 65% by weight or more of styrene monomer units, The relative permittivity of component (D) measured at a frequency of 1 GHz is less than 6.
0. Resin composition.
2. The resin composition according to claim 1, comprising 70 to 80 parts by mass of component (A) and 20 to 30 parts by mass of component (B) with respect to a total of 100 parts by mass of component (A) and component (B).
3. The phase containing component (A) forms a matrix, and the phase containing component (B) forms a dispersed phase within the matrix. The average particle size of the dispersed phase is 0.1 to 5.0 μm. The resin composition according to claim 1 or 2.
4. The resin composition according to any one of claims 1 to 3, wherein the relative permittivity of the (D) component measured at a frequency of 1 GHz is less than 5.
0.
5. The resin composition according to any one of claims 1 to 4, wherein the content of additive components relative to 100% by mass of the entire resin composition is 10% by mass or less.
6. A molded article comprising the resin composition according to any one of claims 1 to 5.
Citation Information
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