Substrate stage, substrate transport method, exposure apparatus, and method for manufacturing articles

JP7927539B2Active Publication Date: 2026-10-01CANON KK
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Patent Information

Application Number
JP2022157706
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-09-30
Publication Date
2026-10-01
Estimated Expiration
2042-09-30

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Benefits of technology

【0008】 本発明によれば、簡易な構成にするうえで有利な基板ステージを提供することができる。

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Abstract

To provide a substrate stage with a simple structure.SOLUTION: A substrate stage has a transport mechanism for transporting a substrate. The transport mechanism includes: a holding part that holds the substrate; a driving part that drives the holding part by driving it in a linear direction; a first cam follower that slides on a sliding surface of either a first guide or a second guide that guides the holding part in the linear direction and a direction different from the linear direction as the holding part is driven by the driving part; and a second cam follower that slides on a sliding surface of a third guide that guides the holding part in a direction different from the linear direction so that the first cam follower moves from the sliding surface of the first guide to the sliding surface of the second guide.SELECTED DRAWING: Figure 2
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Description

[Technical Field]

[0001] The present invention relates to a substrate stage, a substrate transport method, an exposure apparatus, and a method for manufacturing articles. [Background technology]

[0002] In the lithography process for manufacturing liquid crystal panels, organic EL displays, and semiconductor devices, an exposure device is used to transfer the pattern from a master plate onto a substrate coated with a photosensitive material. In the lithography process, an exposure device that can efficiently transport the substrate is required to avoid reducing productivity.

[0003] Patent Document 1 discloses a method for quickly changing substrates by performing the transport operation of an exposed substrate and the loading operation of the next substrate to be exposed in parallel. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2015-146045 [Overview of the Initiative] [Problems that the invention aims to solve]

[0005] However, transporting the substrate requires a mechanism to move the substrate stage horizontally and another mechanism to move the substrate stage vertically, and each mechanism requires a movable mounting section such as electrical cables and tubes. Arranging numerous cables in a limited space presents a high design difficulty, and also increases the risk of dust generation due to contact between cables, which may adversely affect exposure performance.

[0006] Therefore, the present invention aims to provide a substrate stage that is advantageous in terms of its simple configuration. [Means for solving the problem]

[0007] To achieve the above objective, a substrate stage as one aspect of the present invention is a substrate stage having a transport mechanism for transporting a substrate, wherein the transport mechanism includes a holding part for holding the substrate, A parallel to the contact surface of the substrate where the substrate and the holding portion come into contact. A drive unit that drives in a linear direction and drives the holding part, and a drive unit that drives the holding part in the linear direction and in the linear direction as the drive unit drives the holding part Diagonal to A first cam follower that slides on the sliding surface of either the first guide or the second guide that guides in the direction, and the holding part that moves the first cam follower from the sliding surface of the first guide to the sliding surface of the second guide in the linear direction Diagonal to It is characterized by having a second cam follower that slides on the sliding surface of a third guide that guides in a direction. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a substrate stage that is advantageous in terms of its simple configuration. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic diagram showing the configuration of the exposure apparatus. [Figure 2] This is a schematic diagram of the substrate stage 6 in the first embodiment. [Figure 3] This is a detailed view of the cam follower in the first embodiment. [Figure 4] This is a diagram illustrating the substrate transport mechanism in the first embodiment. [Figure 5] This is a diagram illustrating the substrate transport mechanism in the second embodiment. [Figure 6] This is a detailed diagram of the cam follower in the second embodiment. [Figure 7] This is a diagram to explain wire drive. [Figure 8] This is a diagram illustrating the substrate transport mechanism in the third embodiment. [Figure 9]It is a top view of the substrate stage in the third embodiment. [Figure 10] It is a detailed view of the cam follower in the third embodiment. [Figure 11] It is a top view when transferring a substrate to a buffer table. [Figure 12] It is a top view of the substrate transfer mechanism and the ωZ stopper. [Figure 13] It is a diagram showing the optimal shape of the base. [Figure 14] It is a flowchart from the completion of exposure on a substrate to the start of exposure on the next substrate. [Figure 15] It is a flowchart of the method for manufacturing an article. Description of Embodiments

[0010] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In each drawing, the same reference numerals are assigned to the same members, and duplicate descriptions are omitted.

[0011] <First Embodiment> The configuration of the exposure apparatus according to the present embodiment will be described. The exposure apparatus according to the present embodiment is an apparatus used in a lithography process when manufacturing devices such as semiconductor devices and flat panel displays (FPDs). The exposure apparatus forms a latent image pattern in a pattern region of a substrate by transferring a pattern of an original (mask) onto the substrate coated with a resist. The exposure apparatus according to the present embodiment is a so-called step-and-scan scanning exposure apparatus that transfers the pattern of the original to a plurality of pattern regions on the substrate via a projection optical system.

[0012] Figure 1 is a schematic diagram showing the configuration of the exposure apparatus EX in this embodiment. In this embodiment, the surface on which the substrate P is placed is defined as the XY plane, and the direction perpendicular to the XY plane is defined as the Z direction to define the coordinate system. The exposure apparatus EX may include an illumination optical system 1, an alignment measurement unit 2a, off-axis measurement units 2b and 2c, a master plate stage 3, a control unit 4, a projection optical system 5, and a substrate stage 6.

[0013] Light emitted from a light source (not shown) illuminates the master plate M through the optical system in the illumination optical system 1. The illumination optical system 1 has a component that defines the area to be illuminated on the master plate M, and for example, a band-shaped or arc-shaped beam of light illuminates the master plate M.

[0014] The master plate M and the substrate P (e.g., a glass substrate, a wafer) are held by the master plate stage 3 and the substrate stage 6, respectively, and are positioned optically nearly conjugate (object plane and image plane of the projection optical system 5) via the projection optical system 5.

[0015] The projection optical system 5 is, for example, a mirror projection type projection optical system composed of multiple mirrors, and has a predetermined projection magnification (e.g., 1x, 1 / 2x, 2x, etc.), and projects the pattern formed on the original plate M onto the substrate P.

[0016] The original stage 3 and the substrate stage 6 are scanned in a direction perpendicular to the optical axis direction (Z direction) of the projection optical system 5 (Y direction in this embodiment) at a speed ratio corresponding to the projection magnification of the projection optical system 5, while synchronizing with each other.

[0017] The exposure apparatus EX can complete the exposure process on a single substrate P by sequentially repeating the process for each of the multiple pattern regions on the substrate P while moving the substrate stage 6 in steps. When transferring the pattern of the master plate M to each pattern region on the substrate P in this manner, alignment between the pattern region and the master plate M may be necessary.

[0018] The exposure apparatus EX has an alignment measurement unit 2a between the illumination optical system 1 and the master plate M, and the alignment measurement unit 2a includes at least one alignment scope. In this embodiment, the alignment measurement unit 2a has two alignment scopes spaced apart by a predetermined distance in the X direction. Furthermore, each alignment scope is configured in the exposure apparatus EX to be driveable in the XY plane. Thus, the alignment measurement unit 2a can observe each of the alignment marks formed in the pattern area on the substrate P and each of the alignment marks formed on the master plate M via the projection optical system 5.

[0019] Furthermore, the projection optical system 5 and the substrate P are provided with off-axis measurement units 2b and 2c, each containing at least one off-axis scope. Each of the off-axis measurement units 2b and 2c in this embodiment has two off-axis scopes spaced apart by a predetermined distance in the X direction. Each off-axis scope is configured in the exposure apparatus EX to be driven in the XY plane. Therefore, the off-axis measurement units 2b and 2c can observe each of the alignment marks formed in the pattern area on the substrate P. The control unit 4 controls each part of the exposure apparatus EX.

[0020] Figure 2 is a cross-sectional view of the substrate stage 6 in this embodiment. The substrate stage 6 includes a mounting base 20, an X drive unit 30, air bearings 30a and 50a, a Y drive unit 50, a Y guide 60, a drive control unit 80, an X bar mirror 90, and support columns 201 and 202. The substrate stage 6 also includes a Y guide 401, a Y drive unit 402 (drive unit), a Z guide 403, a base 404, a first guide 410a, a second guide 410b, cam followers 420a, 420b, and 420c, and holding units 430a and 430b. In this embodiment, the Y guide 401, Y drive unit 402 (drive unit), Z guide 403, base 404, first guide 410a, second guide 410b, cam followers 420a, 420b, and holding units 430a, 430b are collectively referred to as the substrate transport mechanism (transport mechanism). The substrate transport mechanism transports the substrate to the buffer table 70 (transport destination). The buffer table 70 is composed of a base plate and pins, and is configured to receive the substrate P by the pins. The buffer table 70 has a third guide 410c. The substrate transport mechanism is a mechanism provided for transporting the substrate P after exposure. The first guide 410a, second guide 410b, third guide 410c, and cam followers 420a, 420b, 420c are also collectively referred to as the guide mechanism. Furthermore, cam follower 420a or 420b is also called the first cam follower, and cam follower 420c is also called the second cam follower.

[0021] The mounting platform 20 mounts a substrate P (for example, a rectangular glass substrate). The X drive unit 30 is driven in the X direction on the Y drive unit 50 via an air bearing 30a using a linear motor or the like (not shown). The mounting platform 20 is fixed on the X drive unit 30 via support columns 201 and 202. The Y drive unit 50 is driven in the Y direction on the Y guide 60 via an air bearing 50a using a linear motor or the like (not shown). The substrate transport mechanism may be configured on the X drive unit 30. The substrate stage 6 is driven and controlled by the drive control unit 80. The X bar mirror 90 reflects light from an interferometer (not shown) and may be used for positioning the substrate P in the X coordinate. In addition, although not shown in Figure 1, a Y bar mirror may be positioned for positioning the substrate P in the Y coordinate.

[0022] The Y-guide 401 is a guide in the Y-direction of the substrate transport mechanism and is configured to be positioned on the upper surface of the X-drive unit 30. The Y-drive unit 402 drives along the Y-guide 401 in the Y-direction. The Y-drive unit 402 may be a linear guide or the like. The Z-guide 403 is a guide in the Z-direction of the substrate transport mechanism and is connected to the Y-drive unit 402. The Z-drive unit 405 is connected to the base 404 and drives the base 404 in the Z-direction by driving along the Z-guide 403 in the Z-direction. The cam followers 420a and 420b are cylindrical bearings with shafts provided on the base 404 and are spaced apart from each other in the Y-direction. The first guide 410a and the second guide 410b are rails having a sliding surface and are spaced apart from each other in the Z-direction. The cam followers 420a and 420b are driven along the sliding surface of the first guide 410a or the second guide 410b provided on the substrate transport mechanism.

[0023] The first guide 410a is the guide rail for the outward journey, and the second guide 410b is the guide rail for the return journey. The running surface of the second guide 410b is set lower than the running surface of the first guide 410a. The base 404 and the Z drive unit 405 are constantly subjected to a force in the direction of -Z direction along the Z guide 403 due to their own weight. The cam followers 420a and 420b support the weight of the base 404 and the Z drive unit 405 by contacting the running surface of the first guide 410a or the second guide 410b.

[0024] The holding parts 430a and 430b hold the substrate P and are located on the upper surface of the base 404. Since the substrate transport mechanism is driven with high acceleration in the horizontal direction, it is preferable that the holding parts 430a and 430b have high frictional force to prevent the substrate P from slipping.

[0025] Here, in order for the cam followers 420a and 420b to transition from a state in which they are in contact with the first guide 410a to a state in which they are in contact with the second guide 410b, the base 404 must be dropped by its own weight. At this time, the impact caused by the drop may lead to deterioration or failure of the components constituting the substrate stage 6, as well as the generation of dust into the surrounding area.

[0026] Therefore, in this embodiment, a cam follower 420c is configured on the substrate stage 6, and the cam follower 420c slides on the sliding surface of the third guide 410c provided on the buffer stand 70. As a result, when the cam followers 420a and 420b transition from the first guide 410a to the second guide 410b, the third guide 410c guides the cam follower 420c, thereby mitigating the above-mentioned impact. In other words, in this embodiment, the above-mentioned impact can be mitigated by driving the holding parts 430a and 430b so that at least one of the multiple cam followers is always in contact with the guide.

[0027] Figure 3 is a diagram illustrating the detailed configuration of cam followers 420a, 420b, and 420c provided on the base 404. As shown in Figure 3(a), the base 404 may also be equipped with a deflection Z guide 421, a deflection Z drive unit 422, a deflection spring 423, and a mechanical stopper 424. These components may be arranged to drive the cam follower 420b in the Z direction. Below, we will describe a configuration in which only the cam follower 420b is driveable in the Z direction and the cam follower 420a is fixed, but this is not the only configuration. For example, depending on the shape of the first guide 410a and the second guide 410b, the configuration may be such that only the cam follower 420a is driveable in the Z direction, or both the cam follower 420a and the cam follower 420b are driveable in the Z direction. Furthermore, the configuration may be such that the cam follower is driveable in a direction offset from the Z direction. In other words, at least one of the cam follower 420a and the cam follower 420b may be configured to be able to move up and down.

[0028] The deflection Z guide 421 is fixed to the base 404, and the deflection Z drive unit 422 is driven in the Z direction along the deflection Z guide 421. In this embodiment, a cam follower 420b is connected to the deflection Z drive unit 422, and a cam follower 420a is connected to the base 404. The deflection spring 423 is connected to the deflection Z drive unit 422 and the base 404. The mechanical stopper 424 is connected to the base 404 and is positioned so that a portion of the upper surface of the deflection Z drive unit 422 and a portion of the lower surface of the mechanical stopper 424 are in contact. The mechanical stopper 424 is positioned to generate tension in the deflection spring 423 so that the mechanical stopper 424 and the deflection Z drive unit 422 are always in contact. The deflection spring 423 may be a spring with a spring constant such that the tension is greater than the gravitational force of the cam follower 420b and the deflection Z drive unit 422.

[0029] When an external force exceeding a predetermined value in the -Z direction is applied to the cam follower 420b, the deflection spring 423 extends as shown in Figure 3(b), and the cam follower 420b and the deflection Z drive unit 422 are driven in the -Z direction along the deflection Z guide 421. When the external force falls below the predetermined value, the deflection spring 423 drives the cam follower 420b and the deflection Z drive unit 422 in the +Z direction. Then, as shown in Figure 3(a), the cam follower 420b and the deflection Z drive unit 422 come to rest in a position where the mechanical stopper 424 and the deflection Z drive unit 422 are in contact. In this way, the Z-direction position of the cam follower 420b and the deflection Z drive unit 422 always returns to the same position even when subjected to an external force. Furthermore, the contact surface of the mechanical stopper 424 that contacts the plane of the deflection Z drive unit 422 is preferably spherical in order to improve reproducibility. Alternatively, the contact surface of the deflection Z drive unit 422 may be spherical and the contact surface of the mechanical stopper 424 may be flat. In addition, in order to reduce the load on the deflection Z guide 421, it is preferable that the center of the cam follower 420b and the Y coordinate position of the deflection Z guide 421 coincide.

[0030] Furthermore, Figure 3(c) shows the cam follower 420c in a state where no external force is applied, and Figure 3(d) shows the cam follower 420c in a state where an external force is applied in the +Z direction. Like the cam followers 420a and 420b, the cam follower 420c is configured to be driven up and down by the extension and contraction of the deflection spring 423. The amount of drive can also be restricted by the mechanical stoppers 424a and 424b.

[0031] Next, with reference to Figure 4, the substrate transport operation of the substrate transport mechanism will be explained. The substrate transport operation is the operation of transporting the substrate P, which has finished exposure processing, from the substrate stage 6 to the buffer table 70 located outside the exposure apparatus EX.

[0032] The substrate transport operation can be divided into forward and return operations. First, the forward operation will be explained with reference to Figures 4(a) to 4(g). Here, the forward operation is the operation in which the substrate transport mechanism transfers the substrate P from the origin position to the buffer stand 70.

[0033] Figure 4(a) shows the substrate transport mechanism in its home position. At this time, the standby position of the substrate transport mechanism is located below the upper surface of the mounting platform 20, the mounting platform 20 is holding the substrate P, and the holding parts 430a and 430b are not holding the substrate P.

[0034] When the substrate transport operation starts, the Y drive unit 402 is driven in the -Y direction along the Y guide 401, and in conjunction with this drive, the Z guide 403, Z drive unit 405, base 404, and cam followers 420a and 420b, which are connected to the Y drive unit 402, are also driven in the -Y direction. The cam followers 420a and 420b are driven along the sliding surface of the first guide 410a.

[0035] As shown in Figure 4(b), when the Y drive unit 402 is further driven in the -Y direction, the cam follower 420b is also driven in the +Z direction along the first guide 410a, and the base 404 and Z drive unit 405 connected to the cam follower 420b are driven along the Z guide 403. The amount of drive in the Z direction in the above drive depends on the shape of the first guide 410a, so that the upper surfaces of the holding parts 430a and 430b are higher than the upper surface of the mounting base 20. Furthermore, when the substrate transport mechanism transports the substrate P, the shape of the first guide 410a can be designed so that the substrate P and the mounting base 20 do not come into contact due to the deflection of the substrate P in the Z direction. As the above drive occurs, the upper surfaces of the holding parts 430a and 430b come into contact with the lower surface of the substrate P, so that the substrate P is held by the holding parts 430a and 430b, and the substrate P is lifted in the +Z direction according to the amount of drive of the first guide 410a in the Z direction.

[0036] In other words, the Y drive unit 402 is driven in a predetermined linear direction, but the first guide 410a can guide the holding parts 430a and 430b in a direction different from the linear direction (diagonal direction). The linear direction is the direction parallel to the contact surface of the substrate P where the substrate P and the holding parts 430a and 430b come into contact. The first guide 410a is configured to raise the holding parts 430a and 430b in conjunction with the drive of the Y drive unit 402. Specifically, the first guide 410a or the second guide 410b has a shape that includes a guide extending in the linear direction (first direction) and a guide extending in a direction different from the linear direction (diagonal direction).

[0037] As shown in Figure 4(c), when the Y drive unit 402 is further driven in the -Y direction, the cam followers 420a and 420b are driven along the sliding surface of the first guide 410a. The base 404, the holding parts 430a and 430b, and the substrate P are then driven in the -Y direction while maintaining the height (Z coordinate position) shown in Figure 4(b). At this time, it is sufficient that at least one of the cam followers 420a and 420b is in contact with the first guide 410a. In order to prevent the substrate P from shifting horizontally during the above drive, the acceleration of the Y drive unit 402 can be set such that the frictional force at the contact surface between the substrate P and the holding parts 430a and 430b is greater than the inertial force associated with the drive.

[0038] As shown in Figure 4(d), when the Y drive unit 402 is further driven in the -Y direction, the cam follower 420a is driven along the sliding surface of the first guide 410a, and the cam follower 420b derails from the sliding surface of the first guide 410a. In other words, only the cam follower 420a is in contact with the sliding surface of the first guide 410a.

[0039] As shown in Figure 4(e), when the Y drive unit 402 is further driven in the -Y direction, the cam follower 420a is driven along the sliding surface of the first guide 410a, and the base 404 and Z drive unit 405 are driven in the -Z direction along the Z guide 403. At this time, if the amount of drive in the -Z direction is set so that the upper surfaces of the holding units 430a and 430b are lower than the upper surfaces of the pins on the buffer stand 70, the substrate P will separate from the substrate transport mechanism and be transferred to the buffer stand 70. While the holding units 430a and 430b are holding the substrate P during the drive, the substrate P, the base 404, and the Z drive unit 405 are driven with acceleration in the -Z direction, so the normal force of the substrate P decreases and the frictional force also decreases. At this time, the acceleration of the Y drive unit 402 can be set so that the substrate P does not move horizontally on the holding units 430a and 430b.

[0040] In other words, the first guide 410a is configured to allow the holding parts 430a and 430b to be lowered in conjunction with the driving of the Y drive unit 402.

[0041] At this time, the cam follower 420c comes into contact with the third guide 410c, and as the Y drive unit 402 is driven, the cam follower 420c slides along the sliding surface of the third guide 410c.

[0042] As shown in Figure 4(f), when the Y drive unit 402 is further driven in the -Y direction, the cam follower 420a also derails from the sliding surface of the first guide 410a, similar to the cam follower 420b. At this time, only the cam follower 420c is in contact with the third guide 410c. The cam follower 420c slides along the third guide 410c.

[0043] As shown in Figure 4(g), when the Y drive unit 402 is further driven in the -Y direction, the cam follower 420c reaches the lowest surface of the third guide 410c. At this time, the cam followers 420a and 420b come into contact with the second guide 410b.

[0044] The above is an explanation of the forward movement. Next, the return movement will be explained with reference to Figures 4(h) to 4(k). The return movement is the movement in which the substrate transport mechanism, which has transferred the substrate to the buffer stand 70, returns to its origin position.

[0045] As shown in Figure 4(h), when the Y drive unit 402 is driven in the +Y direction, the cam followers 420a and 420b are driven along the sliding surface of the second guide 410b, and the base 404 and Z drive unit 405 are driven in the +Y direction while maintaining the height shown in Figure 4(g). At this time, the cam follower 420c moves away from the third guide 410c.

[0046] As shown in Figure 4(i), when the Y drive unit 402 is further driven in the +Y direction, the cam follower 420a is driven along the sliding surface of the second guide 410b, and the base 404 and Z drive unit 405 are driven in the +Z direction along the Z guide 403. At this time, the cam follower 420b is in contact with the lower surface of the first guide 410a, and the cam follower 420b is subjected to an external force in the -Z direction, so as shown in Figure 3(b), the cam follower 420b and the deflection Z drive unit 422 are driven in the -Z direction along the deflection Z guide 421. Due to the aforementioned driving of the cam follower 420b and the deflection Z drive unit 422, even if the cam follower 420b is in contact with the lower surface of the first guide 410a, the base 404 and Z drive unit 405 can be driven in the +Z direction.

[0047] As shown in Figure 4(j), when the Y drive unit 402 is further driven in the +Y direction, the cam follower 420a is driven along the sliding surface of the second guide 410b, and the base 404 and Z drive unit 405 are driven in the +Z direction along the Z guide 403. At this time, the cam follower 420b separates from the lower surface of the first guide 410a, and the deflection spring 423 drives the cam follower 420a and the deflection Z drive unit 422 along the deflection Z guide 421 in the +Z direction. Then, by contacting the mechanical stopper 424, the cam follower 420b returns to its original position as shown in Figure 3(a).

[0048] As shown in Figure 4(k), when the Y drive unit 402 is driven in the -Y direction, the cam follower 420a is driven along the sliding surface of the second guide 410b. The amount of drive in the -Y direction at this time can be determined by designing the shapes of the first guide 410a and the second guide 410b so that the cam follower 420b is driven until it contacts the sliding surface of the first guide 410a. By driving further in the -Y direction beyond the above drive, the substrate transport mechanism can be returned to the origin position shown in Figure 4(a).

[0049] Figure 5 shows the relationship in the X direction between the cam followers 420a, 420b, 420c and the first guide 410a, second guide 410b, and third guide 410c. Figure 5 shows the substrate transport mechanism viewed from the +Z direction, and as shown in Figure 5, the cam followers 420a, 420b, and 420c are spaced apart in the X direction. In this embodiment, the cam followers 420a and 420b are positioned at the same location, while the cam follower 420c is positioned further away in the -X direction than the cam followers 420a and 420b. On the other hand, the first guide 410a and the second guide 410b are positioned so as to contact only the cam followers 420a and 420b, and the third guide 410c is positioned so as to contact only the cam follower 420c.

[0050] Figure 4(b) is also called the holding process, in which the substrate P is held by the holding parts 430a and 430b. Figures 4(c) to 4(e) are also called the driving process, in which the holding parts 430a and 430b are driven by driving the Y drive unit 402 in the linear direction (-Y direction). In this embodiment, after driving the Y drive unit in a predetermined direction (-Y direction), the substrate is transported by the base 404 in the opposite direction (+Y direction) and then returned to the origin. A method including these processes is also called a substrate moving method.

[0051] In this embodiment, three cam followers are arranged so as not to interfere with the driving of the cam followers 420a, 420b, and 420c when the substrate transport mechanism performs a substrate transport operation, and so as to allow the substrate transport mechanism to return to its home position. Cam follower 420a has the role of driving the base 404 in the +Z direction, as shown in Figures 4(g) to (j), and cam follower 420b has the role of maintaining the position of the base 404 in the Z direction, as shown in Figure 4(k). Cam follower 420b also has the role of reducing the impact on the base 404. Note that the number of cam followers is not limited to three, and more than three may be arranged as long as the above operations are possible. The arrangement and shape of the first guide 410a and the second guide 410b are not limited to Figure 2, and other arrangements and shapes are possible as long as the above operations can be achieved.

[0052] In this embodiment, the Y drive unit 402 is controlled by the drive control unit 80, enabling not only horizontal but also vertical drive. That is, there is no need to provide a separate Z drive unit, and the moving mounting section of the substrate stage can be made simpler. Consequently, the design difficulty and the risk of dust generation can be reduced. Furthermore, in this embodiment, the above-mentioned impact can be mitigated by driving the substrate transport mechanism so that at least one of the multiple cam followers is always in contact with the guide.

[0053] <Second Embodiment> In the first embodiment, a configuration was described in which the substrate transport mechanism can return to its origin position by the cam follower 420b contacting the lower surface of the first guide 410a during substrate transport operation. In this embodiment, an example different from the first embodiment will be described. Matters not mentioned in this embodiment will follow those of the first embodiment.

[0054] Next, the substrate transport operation of this embodiment will be described with reference to Figure 6. Figures 6(a) to 6(l) show the substrate transport operation. In the first embodiment, the base 404 was always subjected to a force in the -Z direction due to its own weight, but in this embodiment, the base 404 is always subjected to a force in the opposite direction to gravity (+Z direction) by the compression coil spring 460. That is, the cam followers 420a and 420b are driven along the lower surface of the first guide 450a and the second guide 450b, rather than the upper surface, in conjunction with the Y drive unit 402's drive in the Y direction. Also, this embodiment differs from the first embodiment in that there are two cam followers and two guides.

[0055] The compression coil spring 460 is connected to the upper surface of the Y drive unit 402 and the lower surface of the base 404. In this configuration, the base 404 and the Z drive unit 405 are always subjected to a force in the +Z direction by the compression coil spring 460 along the Z guide 403. The first guide 450a and the second guide 450b are guide rails having sliding surfaces for the cam followers 420a and 420b, and are subjected to the force of the compression coil spring 460 at the contact surfaces between the cam followers 420a and 420b and the first guide 450a and the second guide 450b. The compression coil spring 460 is one of the guide mechanisms.

[0056] Next, the operation of the substrate mechanism in this embodiment will be described based on Figure 6. Figures 6(a) to 6(l) show the operation in this embodiment. Similar to the first embodiment, the cam followers 420a and 420b are positioned at separate locations in the Y direction. The purpose of having two cam followers is to enable the substrate transport unit 40 to perform the desired substrate transport operation and to mitigate the impact on the substrate transport mechanism.

[0057] In the first embodiment, two cam followers were required when the substrate transport unit 40 returned to its home position. Furthermore, a third cam follower 420 was required to mitigate the impact associated with unguided Z-axis movement when the substrate transport unit 40 moved in the -Z direction after transporting the substrate 10. In contrast, in this embodiment, two cam followers 420a and 420b are sufficient for the following reasons.

[0058] Figures 6(d) to 6(f) show the movement of the substrate transport unit 40 in the -Z direction to place the transported substrate 10 onto the pins of the buffer stand 70. In this movement, the cam follower 420b drives the substrate transport unit 40 in the -Z direction. Furthermore, as shown in Figure 6(j), while the cam follower 420a is not in contact with the first guide 450a, it is in contact with the second guide 450b and thus receives the force in the +Z direction from the compression coil spring 460. As shown in Figures 6(f) to 6(g), the cam follower 420a maintains the height in the Z direction of the substrate transport mechanism that has moved in the -Z direction.

[0059] Figures 6(j) to 6(l) illustrate the operation of the substrate transport unit 40 to return to its home position. In this operation, the cam follower 420b plays a role in preventing +Z movement without guidance from the substrate transport mechanism.

[0060] Figure 7 shows the details of the configuration of the cam followers 420a and 420b in this embodiment. The difference from the first embodiment is that the cam followers 420a and 420b are connected to the deflection Z drive units 422a and 422b, and a deflection compression spring 425 is connected to the cam follower 420a. In addition, a deflection tension spring 423 is connected to the cam follower 420b, and mechanical stoppers 424b and 424c are installed so as to sandwich the deflection Z drive unit 422b.

[0061] The deflection compression spring 425 of the cam follower 420a is connected to the deflection Z drive unit 422a and the base 404, and a force in the -Z direction is always applied to the Z drive unit 422a. The upper surface of the mechanical stopper 424a is positioned to be in contact with the lower surface of the deflection Z drive unit 422a. In order to ensure that the mechanical stopper 424a and the deflection Z drive unit 422a are always in contact, the mechanical stopper 424a is positioned to compress the deflection compression spring 425.

[0062] With the above configuration, when an external force in the +Z direction is applied to the cam follower 420a, the deflection compression spring 425 is compressed as shown in Figure 7(b), and the cam follower 420a and the deflection Z drive unit 422a move in the +Z direction. When the external force is removed, the compressed deflection compression spring 425 and gravity cause the cam follower 420a and the deflection Z drive unit 422a to move in the -Z direction, and they come to rest at a position where the deflection Z drive unit 422a and the mechanical stopper 424a come into contact. Thus, with the configuration shown in Figure 7, the Z-direction positions of the cam follower 420a and the deflection Z drive unit 422a remain at the same position when no external force is applied and when the external force is removed.

[0063] On the other hand, the deflection tension spring 423 of the cam follower 420b is connected to the deflection Z drive unit 422b and the base 404, and a force in the +Z direction is always applied to the Z drive unit 422b. The lower surface of the mechanical stopper 424c is positioned to be in contact with the upper surface of the deflection Z drive unit 422b.

[0064] With the above configuration, when an external force in the -Z direction is applied to the cam follower 420b, the deflection tension spring 423 is pulled as shown in Figure 7(b), causing the cam follower 420b and the deflection Z drive unit 422b to slide in the -Z direction until they contact the mechanical stopper 424b. When the external force is removed, the pulled deflection tension spring 423 causes the cam follower 420b and the deflection Z drive unit 422b to move in the +Z direction, and they come to rest at the position where the deflection Z drive unit 422b and the mechanical stopper 424c come into contact. Thus, with the configuration shown in Figure 7, when no external force is applied, and when the external force is removed, the Z-direction position of the cam follower 420a and the deflection Z drive unit 422b always remains at the same position. Furthermore, as shown in Figure 6(d), the Z-axis deflection drive unit 422b and the mechanical stopper 424b come into contact, allowing the mechanical stopper 424b to receive the +Z force of the compression coil spring 460.

[0065] Next, the positional relationship in the X direction of the first guide 450a, the second guide 450b, the fourth guide 450c, and the cam followers 420a and 420b will be explained based on Figure 8. Figure 8 shows the substrate transport mechanism of Figure 6 viewed from the +Z direction. The cam followers 420a and 420b are located at separate positions in the X direction, and the first guide 450a is installed so as to make contact with both cam followers 420a and 420b. On the other hand, the second guide 450b is installed so as to make contact only with cam follower 420a, and the fourth guide 450c is installed so as to make contact only with cam follower 420b.

[0066] The method and position of movement of the substrate transport mechanism in this embodiment will be described based on Figure 6. As shown in Figure 6(a), the standby position of the substrate transport mechanism is located lower than the upper surfaces of the holding parts 430a and 430b.

[0067] The substrate transport operation shown in Figure 6(a) is the same as the operation in Figure 2(a) of the first embodiment, and can be understood by simply replacing the first guide 410a in Figure 2(a) with 450a, so the explanation is omitted.

[0068] As shown in Figure 6(b), when the Y drive unit 402 is further driven in the -Y direction, the cam follower 420a receives the force of the compression coil spring 460 and moves in the +Z direction along the first guide 450a. Then, the base 404 connected to the cam follower 420a and the Z drive unit 405 connected to the base 404 move in the +Z direction along the Z guide 403. The amount of movement in the Z direction in the above movement depends on the shape of the first guide 450a. Similar to the first embodiment, when the substrate transport mechanism transports a substrate, the shape of the first guide 450a is designed so that the substrate P and the substrate holding unit 20 do not come into contact due to the deflection in the Z direction caused by the weight of the substrate P.

[0069] The substrate transport operation shown in Figure 6(c) is the same as the operation in Figure 2(c) of the first embodiment, and can be understood by simply replacing the first guide 410a in Figure 2(c) with 450a, so the explanation is omitted.

[0070] As shown in Figure 6(d), when the Y drive unit 402 is further driven in the -Y direction, the cam follower 420b moves along the sliding surface of the first guide 450a, and the base 404 and Z drive unit 405 move in the -Z direction along the Z guide 403. At this time, if the amount of movement in the -Z direction is set so that the upper surfaces of the holding units 430a and 430b are lower than the upper surface of the buffer stand 70, the substrate P separates from the substrate transport mechanism and is transferred to the buffer stand 70. Similar to the first embodiment, the force received by the substrate P on the holding units 430a and 430b decreases, and therefore the frictional force decreases, so the acceleration of the Y drive unit 402 is set so that the substrate P does not move horizontally.

[0071] During the aforementioned movement, the cam follower 420a and the upper surface of the second guide 450b come into contact, and the cam follower 420a receives an external force in the +Z direction. As a result, as shown in Figure 7(b), the cam follower 420a and the Z drive unit 422 for the cam follower move in the +Z direction along the Z guide 421 for the cam follower. Due to the aforementioned movement of the cam follower 420a and the Z drive unit 422 for the cam follower, even if the cam follower 420a comes into contact with the upper surface of the second guide 450b, the base 404 and the Z drive unit 405 can move in the -Z direction.

[0072] As shown in Figure 6(e), when the Y drive unit 402 moves further in the -Y direction, the cam follower 420b is driven along the sliding surface of the first guide 450a, and the base 404 and Z drive unit 405 move further in the -Z direction along the Z guide 403. At this time, the cam follower 420a separates from the upper surface of the second guide 450b, and the cam follower 420a and the Z drive unit 422 for the cam follower move in the -Z direction along the Z guide 421 due to the deflection compression spring 425 and gravity. Then, as shown in Figure 7(a), the cam follower 420a returns to its original position as it comes into contact with the mechanical stopper 424.

[0073] As shown in Figure 6(f), when the Y drive unit 402 moves in the +Y direction, the cam follower 420b moves along the sliding surface of the first guide 450a, and the base 404 and Z drive unit 405 move in the +Y direction. At this time, even when the cam follower 420a contacts the sliding surface of the second guide 450b and the cam follower 420b moves away from the sliding surface of the first guide 450a, the base 404 and Z drive unit 405 can move in the +Y direction while maintaining the height shown in Figure 6(e). In order to enable this movement, the distance between the first guide 450a and the second guide 450b in the Y direction is set to be greater than the diameter of the cam followers 420a and 420b, and smaller than the distance between the cam followers 420a and 420b in the Y direction. By setting the Z-direction position of the sliding surface of the second guide 450b to the same position as the lowest surface of the sliding surface of the first guide 450a, or to a position lower than the aforementioned position, the substrate transport mechanism can move without the upper surfaces of the holding parts 430a and 430b coming into contact with the lower surface of the substrate P.

[0074] As shown in Figure 6(g), when the Y drive unit 402 moves further in the +Y direction, the cam follower 420a moves along the sliding surface of the second guide 450b. At this time, the cam follower 420b moves away from the sliding surface of the first guide 450a, and the external force in the -Z direction disappears, so the cam follower 420b moves in the +Z direction as shown in Figure 7(a).

[0075] As shown in Figures 6(h) and (i), when the Y drive unit 402 is further driven in the +Y direction, the cam follower 420b and the fourth guide 450c come into contact, and the cam follower 420b moves in the -Z direction. If the shape of the fourth guide 450c is designed to come into contact with the mechanical stopper 422b at this time, the force of the compression coil spring 460 can be received at the contact surface between the cam follower 420b and the fourth guide 450c.

[0076] As shown in Figure 6(j), when the Y drive unit 402 is moved further in the +Y direction, the cam follower 420b moves in the +Y direction along the sliding surface of the fourth guide 450c. If the first guide 450a is positioned so that the cam follower 420a contacts the first guide 450a before the cam follower 420b leaves the sliding surface of the fourth guide 450c, the substrate transport mechanism can move in the +Y direction while maintaining its height in the Z direction.

[0077] As shown in Figure 6(k), when the Y drive unit 402 is further driven in the +Y direction, the cam follower 420b moves away from the sliding surface of the fourth guide 450c, and since the external force in the -Z direction is eliminated, the cam follower 420b moves in the +Z direction.

[0078] As shown in Figure 6(l), when the Y drive unit 402 is further driven in the +Y direction, the cam follower 420a moves along the sliding surface of the first guide 450a, and the substrate transport mechanism moves in the +Z direction. This movement allows the substrate transport mechanism to return to its origin position. By configuring the cam follower 420b as shown in Figure 7, there is no Z-direction movement of the substrate transport mechanism without guidance, thus reducing the impact on the substrate transport unit 40.

[0079] The Y drive unit 402 can be, for example, a linear motor, a ball screw, or a wire drive. Figure 9 shows an example of a wire drive. A wire 82 is connected to the Y drive unit 402 and is configured to drive the Y drive unit 402 by the rotation of the drum 83. The Y drive unit 402 constitutes a motor 81 for rotating the drum 83 and controls the motor 81 by a drive control unit 80.

[0080] In this embodiment as well, by controlling the Y drive unit 402 with the drive control unit 80, not only horizontal drive but also vertical drive is possible. In other words, there is no need to provide a separate Z drive unit, and the moving mounting section of the substrate stage can be made into a simpler configuration. Accordingly, the design difficulty and the risk of dust generation can be reduced. In addition, in this embodiment as well, by driving the substrate transport mechanism so that at least one of the multiple cam followers is always in contact with the guide, impact can be mitigated.

[0081] <Third Embodiment> This embodiment describes a substrate transport mechanism with a configuration different from that of the first and second embodiments. Matters not mentioned in this embodiment will be described according to the second embodiment.

[0082] The substrate transport device of the third embodiment will be described based on Figure 10. Figures 10(a) to (j) show the substrate transport operation in the substrate transport mechanism of the third embodiment.

[0083] The rotating guide unit 470 in Figure 10(a) is composed of a Z drive unit 405 and a base 404. It is mounted so that the X axis is the axis of rotation. With this configuration, the base 404 can rotate in the pitching direction (with the X axis as the axis of rotation) relative to the Z drive unit 405. The portion of the base 404 that is away from the rotating guide unit 470 and the compression spring 460 in the -Y direction (specifically, the portion where the cam followers 420c and 420d are installed in Figure 10) receives a force due to its own weight in the -Z direction with the rotating guide unit 470 as the center of rotation. Its weight is then supported by the contact surfaces of the cam follower 420c and guides 481 and 483, or by the contact surfaces of the cam follower 420d and guides 481, 482, and 484. Guides 481 and 483 are installed on the X drive unit 30, and guides 482 and 484 are installed on the buffer base 70.

[0084] In the first and second embodiments, the base 404 is supported in a cantilevered manner, which can lead to problems such as vibrations in the Z direction of the base 404 during substrate transport. In contrast, in this embodiment, the base 404 is supported at both ends by any two of the cam followers 420a to 420d, thus reducing the vibrations.

[0085] Figure 11 shows the relationship of the cam followers 420c, 420d and guides 481, 482, 483, and 484 in the X direction. Figure 11 is a view of the substrate transport section 40 of Figure 10 from the +Z direction, and as shown in Figure 11, the cam followers 420c and 420d are positioned at separate locations in the X direction. In this embodiment, the cam follower 420c is positioned in the -X direction and the cam follower 420d is positioned in the +X direction. Guide 481 has a wide sliding surface in the X direction so as to contact both the cam followers 420c and 420d. Guides 482 and 484 have sliding surfaces so as to contact only the cam follower 420d, and guide 483 has a sliding surface so as to contact only the cam follower 420c.

[0086] Cam follower 420c supports the weight of the substrate transport mechanism when it is on the stage side, and 420d supports the weight of the substrate transport mechanism when it is on the stage side and on the buffer stand 70. They are also positioned to allow for return to the origin when performing substrate transport operations as shown in Figures 10(g) to (i). As shown in Figures 10(h) to (i), the cam follower 420d is configured to avoid the guide 481 as shown in Figure 12. Note that the configuration in Figure 12 is the same as that of cam followers 420a and 420b in the first embodiment, so a description is omitted.

[0087] The method and position of movement of the substrate transport mechanism in this embodiment will be described based on Figure 10.

[0088] The substrate transport operation shown in Figure 10(a) is almost identical to the operation shown in Figure 6(a) of the second embodiment, except that the cam follower 420d moves in the -Y direction along the sliding surface of the guide 481.

[0089] The substrate transport operation shown in Figure 10(b) is almost identical to the operation shown in Figure 6(b) of the second embodiment, except that the cam follower 420d moves in the +Z direction along the sliding surface of the guide 481.

[0090] As shown in Figure 10(c), when the Y drive unit 402 is further driven in the -Y direction, the cam follower 420d moves along the sliding surface of the guide 481. Because the sliding surfaces of guides 481 and 482 are discontinuous, there is a moment when the cam follower 420d separates from the sliding surface of guide 481 as the Y drive unit 402 moves in the -Y direction. However, since the cam follower 420c is also in contact with guide 481, the contact surface can support the weight of the base 404 and the substrate 10. The Y-direction spacing between guides 481 and 482, or the spacing between cam followers 420c and 420d, can be adjusted in the design so that the cam follower 420c is in contact with guide 481, and the cam follower 420d is in contact with guide 482 installed on the buffer base 70. As a result, the base 404, the retaining parts 430a and 430b, and the substrate P move in the -Y direction while maintaining the height in the Z direction as shown in Figure 10(b).

[0091] As shown in Figure 10(c), when the Y drive unit 402 is further driven in the -Y direction, the cam follower 420d moves along the sliding surface of the guide 482.

[0092] The substrate transport operation shown in Figure 10(d) is almost identical to the operation shown in Figure 6(d) of the second embodiment, except that the cam follower 420d moves in the -Z direction along the sliding surface of the guide 482. By supporting the weight of the base at the contact surface between the cam follower 420d and the guide 482 until the substrate P is transferred to the buffer stand 70, the orientation of the substrate P can be kept horizontal, preventing significant changes in the placement position of the substrate P and preventing damage to the substrate P. However, in order not to hinder the movement of the cam follower 420d in the +Y direction in Figure 10(f), the clearance between the lowest surface of the guide 482 and the sliding surface of the guide 484 is set to be greater than the outermost diameter of the cam follower 420d.

[0093] The substrate transport operation shown in Figure 10(e) is almost the same as the operation shown in Figure 4(e) of the second embodiment, but the difference is that the cam follower 420d leaves the sliding surface of the guide 482, falls due to its own weight, and comes into contact with the guide 484.

[0094] As shown in Figure 10(f), when the Y drive unit 402 is further driven in the -Y direction, the cam follower 420d moves along the sliding surface of the guide 484. As the Y drive unit 402 moves in the +Y direction, the cam follower 420d moves away from the sliding surface of the guide 484. However, at this time, the distance in the Y direction between guides 483 and 484, or the distance in the Y direction between cam followers 420c and 420d is adjusted so that the cam follower 420c contacts the sliding surface of guide 483.

[0095] The substrate transport operation shown in Figure 10(g) is almost identical to the operation shown in Figure 6(g) of the second embodiment, except that the cam follower 420c moves along the sliding surface of the guide 483.

[0096] The substrate transport operation shown in Figure 10(h) is almost identical to the operation shown in Figure 6(j) of the second embodiment, the only difference being that the cam follower 420c moves along the sliding surface of the guide 483.

[0097] As shown in Figure 10(i), when the Y drive unit 402 is further driven in the -Y direction, the cam follower 420c moves along the guide 483, and therefore the cam follower 420c moves in the +Z direction. However, since the cam follower 420a is in contact with the guide 450a, the base 404 tilts around the rotating guide unit 470. At this time, the cam follower 420d comes into contact with the lower surface of the guide 481, but as shown in Figure 12, it can avoid the guide 481 without hindering the movement of the substrate transport mechanism, similar to the cam follower 420b in the first embodiment.

[0098] As shown in Figure 10(j), when the Y drive unit 402 is further driven in the -Y direction, the cam follower 420a moves along the sliding surface of the guide 450a, and the cam follower 420c moves along the sliding surface of the guide 483. At this time, the cam follower 420c moves away from the sliding surface of the guide 483, but the guide 481 may be designed to be positioned so that the cam follower 420d and the guide 481 are in contact. This allows the base 404 to support its own weight at the contact surface between the cam follower 420c and the guide 481, and to return to the origin position in Figure 10(a).

[0099] In this embodiment, the Y-drive unit 402 is controlled by the drive control unit 80, enabling not only horizontal but also vertical drive. That is, there is no need to provide a separate Z-direction drive unit, and the moving mounting section of the substrate stage can be made simpler. Consequently, the design difficulty and the risk of dust generation can be reduced.

[0100] Furthermore, in this embodiment, the base 404 can be driven stably, so the orientation of the substrate P can be kept horizontal, preventing significant displacement of the substrate P's mounting position and preventing damage to the substrate P. Also in this embodiment, by driving the substrate transport mechanism so that at least one of the multiple cam followers is always in contact with the guide, impact can be mitigated.

[0101] Here, Figure 11 shows a top view of the substrate transport mechanism and the entire stage when the substrate P is placed on the buffer stand 70. In the first to third embodiments, as shown in Figure 11, the mounting stand 20 is divided in the X direction, and the substrate transport mechanism is arranged so that it can be driven in the +Z direction from the gap between the divided mounting stand 20. When the substrate P is transported by the substrate transport mechanism, the amount of deformation of the substrate P in the Z direction is determined by the number of bases 404 and their positions in the X and Y directions, and the number of holding parts 430a and 430b, their contact area with the substrate P, and their positions in the X and Y directions. In addition, the amount of drive in the +Z direction of the bases 404 and the Z drive unit 405 may be greater than the amount of deformation of the substrate P.

[0102] In the first to third embodiments, as shown in Figure 11, the X-direction position of the X-drive unit 30 is set to the position where it is driven most in the +X direction, and an X-mechanism stopper may be installed to prevent the X-drive unit 30 from driving in the +X direction. By performing the substrate transport operation of the base 404 at the aforementioned standby position, even if the stage malfunctions due to an error, the substrate P and the X-bar mirror 90 will not interfere with each other, so the Y-direction transfer position of the substrate P may be set to a position that coincides with the Y-direction position of the X-bar mirror 90. By setting the transfer position as described above, the Y-direction drive stroke of the base 404 can be reduced, and an increase in the Y-direction external size of the X-drive unit 30 can be avoided.

[0103] In the first to third embodiments, the base 404 and the Z drive unit 405 are fixed only to the Z guide 403, so ω Z The rigidity in the direction (rotational direction around the Z axis) is low. Therefore, when driving by high-speed transport, the base 404 and Z drive unit 405 are affected by the acceleration and disturbances ω zIt rotates, causing the base 404 and the substrate holding portion 20 to collide, which entails risks of component damage and particle generation. To prevent such collision, as shown in Fig. 12, ω Z Any number of stoppers 100 may be provided on the stage side and the buffer table 70. ω Z The clearance between the stopper 100 and the end face of the base 404 is made smaller than the clearance between the end face of the base 404 and the end face of the substrate holding portion 20. Accordingly, even if the base 404 and the Z drive unit 405 rotate θ due to an external force, they do not collide with the substrate holding portion 20, ω Z and collide with the stopper 100. ω Z The stopper 100 is a rotating body such as a roller, and it is preferable that the contact surface thereof is made of a low particle generation material such as ultra-high molecular weight polyethylene. Even in the above configuration, when the base 404 ω Z collides with the stopper 100, the collision occurs at the corner of the base 404, so the impact force is large, which may affect the substrate transfer unit 40 and ω Z cause damage to the stopper or apply an external force to the stage. To mitigate the impact force, it is preferable that the shape of the tip end of the base 404 in the -Y direction is a tapered shape as shown in Fig. 13.

[0104] In the first to third embodiments, when the cam followers 420a, 420b and the respective guides are arranged only on one side with respect to the Y central axis of the base 404, the base 404 ω Y tilts in the direction. As a result, the edges of the cam followers 420a, 420b come into contact with the sliding surfaces of the guides, and a force in the ω Y direction is applied to the Z guide 403. Therefore, by symmetrically arranging the cam followers 420a, 420b and the respective guides, the tilting of the base 404 can be suppressed. The cam followers 420c, 420d and the respective guides in the third embodiment may be arranged on one side or symmetrically on both sides with respect to the Y axis center of the base 404. In addition, since a heavy weight of the base 404 becomes a cause of damage, carbon fiber reinforced plastic (CFRP) or aluminum having high specific rigidity is preferable as the material of the base 404.

[0105] Figure 14 is a flowchart showing the substrate transport operation and the processes before and after it in the first to third embodiments. Each process is executed by the drive control unit 80 controlling each part of the substrate stage 6. Figure 14 is a flowchart showing the flow from the completion of the exposure process of one substrate to the start of the exposure process of the next substrate.

[0106] In step S1, the substrate stage 6 moves to the substrate transport position. In step S2, the substrate transport mechanism transports the substrate to the outside of the exposure apparatus (e.g., buffer stage) (transportation step). Instead of the buffer stage, it may be transported directly to the manufacturing equipment for the next step (e.g., developing apparatus). In step S3, the substrate transport mechanism is stored inside the substrate stage 6. In step S4, the next substrate is placed on the mounting stage 20. In step S5, the substrate stage 6 moves to the exposure start position.

[0107] <Embodiment for manufacturing an article> The method for manufacturing articles according to embodiments of the present invention is suitable for manufacturing articles such as flat panel displays (FPDs), semiconductor devices, sensors, and optical elements. Figure 15 is a flowchart showing the steps of the method for manufacturing articles. The method for manufacturing articles according to this embodiment includes a step of forming a latent image pattern on a photosensitive material coated on a substrate by exposure using the above-mentioned exposure apparatus EX to obtain an exposure substrate (exposure step, step S11). It also includes a step of transporting the exposure substrate on which the latent image pattern has been formed in this step (transportation step, step S12). It also includes a step of developing the substrate transported in this step to obtain a developed substrate (development step, step S13). Furthermore, this manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.) (processing step, step S14). The method for manufacturing articles according to this embodiment is advantageous compared to conventional methods in at least one of the performance, quality, productivity, and production cost of the articles.

[0108] Although preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of its gist. The scope to which the present invention is applicable may be, for example, the substrate stage of a substrate processing apparatus such as a semiconductor manufacturing apparatus (film deposition apparatus, sputtering apparatus, annealing apparatus, inspection apparatus, etc.), an organic EL deposition apparatus, or a nanoimprint apparatus.

[0109] The disclosures herein include at least the following: a substrate stage, a substrate transport method, an exposure apparatus, and a method for manufacturing articles.

[0110] (Item 1) A substrate stage having a transport mechanism for transporting substrates, The aforementioned transport mechanism is A holding portion for holding the substrate, A drive unit that drives in a linear direction and drives the holding part, As the holding portion is driven by the drive unit, a first cam follower slides on the sliding surface of either the first guide or the second guide that guides the holding portion in the linear direction and in a direction different from the linear direction, A second cam follower that slides on the sliding surface of a third guide that guides the holding portion in a direction different from the linear direction, so that the first cam follower moves from the sliding surface of the first guide to the sliding surface of the second guide, A substrate stage characterized by having the following features.

[0111] (Item 2) The substrate stage according to item 1, characterized in that the linear direction is parallel to the contact surface of the substrate in which the substrate and the holding portion come into contact.

[0112] (Item 3) The substrate stage according to item 1 or 2, characterized in that the first guide is configured to raise the holding portion in conjunction with the driving of the drive unit.

[0113] (Item 4) The substrate stage according to any one of items 1 to 3, characterized in that the first guide is configured to lower the holding portion in conjunction with the driving of the drive unit.

[0114] (Item 5) The substrate stage according to any one of items 1 to 4, characterized in that the first guide and the second guide have a shape that includes a guide extending in a first direction and a guide extending in a direction different from the first direction.

[0115] (Item 6) The first guide guides the holding part to be driven while the holding part is holding the substrate, The second guide guides the holding part to be driven when the holding part is not holding the substrate. A substrate stage according to any one of items 1 to 5, characterized in that it is a substrate stage.

[0116] (Item 7) The substrate stage according to any one of items 1 to 6, characterized in that the first guide is positioned closer to the holding portion than the second guide.

[0117] (Item 8) The substrate stage according to any one of items 1 to 7, characterized in that at least one of the first cam follower and the second cam follower is configured to be driveable vertically.

[0118] (Item 9) A substrate stage according to any one of items 1 to 8, characterized in that the first cam follower slides on the upper surface of the first guide or the second guide due to the weight of the holding part.

[0119] (Item 10) The first guide and the second guide include a coil spring connected to the retaining portion. A substrate stage according to any one of items 1 to 8, characterized in that the coil spring applies a force to the holding portion in the direction opposite to the direction of gravity, causing the first cam follower to slide along the lower surfaces of the first guide and the second guide due to the force.

[0120] (Item 11) A holding step in which the substrate is held by the holding part, The process includes a driving step of driving the holding part by driving the drive part in a linear direction, The aforementioned drive process is, As the drive unit drives the holding unit, the sliding surface of either the first guide or the second guide, which guides the holding unit in the linear direction and in a direction different from the linear direction, is made to slide on the first cam follower. The sliding surface of the third guide, which guides the retaining portion in a direction different from the linear direction, is made to slide on the second cam follower so that the first cam follower moves from the sliding surface of the first guide to the sliding surface of the second guide. A substrate moving method characterized by the following:

[0121] (Item 12) A substrate processing apparatus having a substrate stage described in any one of items 1 to 10, The transport mechanism is characterized by transporting the substrate to the outside of the substrate processing apparatus.

[0122] (Item 13) An exposure apparatus having a substrate stage described in any one of items 1 to 10, It further comprises a projection optical system for exposing the pattern of the original plate onto the substrate, The exposure apparatus is characterized in that the transport mechanism transports the substrate exposed by the projection optical system to the outside of the exposure apparatus.

[0123] (Item 14) An exposure step in which a substrate is exposed using the exposure apparatus described in item 13 to obtain an exposed substrate, The transport mechanism provides a transport process for transporting the exposure substrate, The process includes developing the aforementioned photopolymer substrate to obtain a developed substrate, A method for manufacturing an article, characterized by manufacturing an article from the aforementioned developing substrate. [Explanation of Symbols]

[0124] 6. PCB Stage 402 Y Drive Unit (Drive Unit) 410a Guide 1 410b Guide 2 410c Guide 3 420a, 420b First cam follower 420c Second cam follower 430a, 430b holding part P board

Claims

1. A substrate stage having a transport mechanism for transporting substrates, The aforementioned transport mechanism is A holding portion for holding the substrate, A drive unit that drives the substrate and the holding portion in a linear direction parallel to the contact surface of the substrate where the substrate and the holding portion come into contact, As the drive unit drives the holding unit, a first cam follower slides on the sliding surface of either the first guide or the second guide that guides the holding unit in the linear direction and in a direction oblique to the linear direction, A second cam follower slides on the sliding surface of a third guide that guides the holding portion in a direction oblique to the linear direction, such that the first cam follower moves from the sliding surface of the first guide to the sliding surface of the second guide, A substrate stage characterized by having the following features.

2. The substrate stage according to claim 1, characterized in that the first guide is configured to raise the holding portion in conjunction with the driving of the drive unit.

3. The substrate stage according to claim 1, characterized in that the first guide is configured to lower the holding portion in conjunction with the driving of the drive unit.

4. The substrate stage according to claim 1, characterized in that the first guide and the second guide have a shape that includes a guide extending in the linear direction and a guide extending in a direction oblique to the linear direction.

5. The first guide guides the holding portion to be driven while the holding portion is holding the substrate, The second guide guides the holding part to be driven when the holding part is not holding the substrate. The substrate stage according to feature 1.

6. The substrate stage according to claim 1, characterized in that the first guide is positioned closer to the holding portion than the second guide.

7. The substrate stage according to claim 1, characterized in that at least one of the first cam follower and the second cam follower is configured to be driveable vertically.

8. The substrate stage according to claim 1, characterized in that the first cam follower slides on the upper surface of the first guide or the second guide due to the weight of the holding part.

9. The first guide and the second guide include a coil spring connected to the retaining portion. The substrate stage according to claim 1, characterized in that the coil spring applies a force to the holding portion in the direction opposite to the direction of gravity, and the first cam follower slides along the lower surfaces of the first guide and the second guide due to the force.

10. A holding step in which the substrate is held by the holding part, The driving step includes driving the drive unit in a linear direction parallel to the contact surface of the substrate where the substrate and the holding part come into contact, The aforementioned drive process is, As the drive unit drives the holding unit, the sliding surface of either the first guide or the second guide, which guides the holding unit in the linear direction and in a direction oblique to the linear direction, slides on the first cam follower. The sliding surface of the third guide, which guides the holding portion in a direction oblique to the linear direction, is made to slide on the second cam follower so that the first cam follower moves from the sliding surface of the first guide to the sliding surface of the second guide. A substrate moving method characterized by the following:

11. A substrate processing apparatus having a substrate stage according to any one of claims 1 to 9, The transport mechanism is characterized by transporting the substrate to the outside of the substrate processing apparatus.

12. An exposure apparatus having a substrate stage according to any one of claims 1 to 9, It further comprises a projection optical system for exposing the pattern of the original plate onto the substrate, The exposure apparatus is characterized in that the transport mechanism transports the substrate exposed by the projection optical system to the outside of the exposure apparatus.

13. An exposure step of exposing a substrate using the exposure apparatus described in claim 12 to obtain an exposed substrate, The transport mechanism provides a transport process for transporting the exposure substrate, The process includes developing the aforementioned photopolymer substrate to obtain a developed substrate, A method for manufacturing an article, characterized by manufacturing an article from the aforementioned developing substrate.

Citation Information

Patent Citations

  • Opening and closing mechanism for lid of portable closed container

    JP1995014906A

  • Carrying method and carrier

    JP1996119434A

  • Substrate stage device and semiconductor exposure device using the same

    JP2001168008A

  • Substrate conveying device

    JP2009043846A

  • Mobile object device, exposure apparatus, and method for controlling mobile object

    JP2010266760A