Substrate transport apparatus and substrate transport method

Abstract

To prevent damage to a substrate due to contact even when the state of the substrate has changed.SOLUTION: A substrate transport device according to an embodiment transports substrates in and out of a cassette that accommodates the substrates in multiple stages in an up-down direction, and includes a hand that transports the substrates, an operation mechanism that operates the hand, a controller that controls the operation mechanism, and a first detection unit that can detect the substrate. The controller includes an offset amount change unit that changes the offset amount to cause the hand to operate in the up-down direction from the substrate supporting height of the cassette when the hand transports the substrate in and out with respect to the cassette in accordance with the thickness or the amount of deflection of the substrate detected by the first detection unit.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The disclosed embodiments relate to a substrate transport apparatus and a substrate transport method. [Background technology]

[0002] Conventionally, substrate transport devices are known that use robots equipped with hands to transport substrates such as wafers and panels, and to load and unload substrates between the robot and a cassette containing the substrates.

[0003] For example, a technique has been proposed to detect whether there is a possibility of contact between the robot and the wafers already contained in the cassette, using sensors on the wafer transport arm and the cassette (see, for example, Patent Document 1). [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2007-234936 [Overview of the Initiative] [Problems that the invention aims to solve]

[0005] However, with the conventional technology described above, if the state of the circuit boards already contained in the cassette changes due to various substrate processing processes such as lamination or bending, there is a possibility that the contained circuit boards may come into contact with the robot or newly introduced circuit boards.

[0006] One embodiment aims to provide a substrate transport device and a substrate transport method that can prevent damage to the substrate due to contact, even when the state of the substrate changes. [Means for solving the problem]

[0007] A substrate transport device according to one embodiment is a substrate transport device for loading and unloading substrates into and from a cassette that houses substrates in multiple stages in the vertical direction, and comprises a hand for transporting the substrates, an operating mechanism for operating the hand, a controller for controlling the operating mechanism, and a first detection unit capable of detecting the substrates. The controller is For each type of substrate, substrate information is pre-stored that defines at least the relationship between the thickness of the substrate and the amount of deflection of the substrate. The thickness of the substrate detected by the first detection unit The larger of the estimated deflection amount of the substrate estimated based on the substrate information and the actual deflection amount of the substrate using the first detection unit. Accordingly, the system includes an offset amount changing unit that changes the amount of offset by which the hand moves up and down from the height of the cassette's substrate support when the hand loads the substrate into and out of the cassette. [Effects of the Invention]

[0008] According to one embodiment, a substrate transport device and a substrate transport method can be provided that can prevent damage to the substrate due to contact, even when the state of the substrate changes. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a schematic top view showing an overview of the substrate transport device. [Figure 2] Figure 2 is an explanatory diagram of the offset amount during delivery. [Figure 3] Figure 3 is an explanatory diagram of the offset amount during removal. [Figure 4] Figure 4 shows an example of a robot configuration. [Figure 5] Figure 5 is a schematic front view of the cassette. [Figure 6] Figure 6 is a schematic diagram of the top view of the cassette. [Figure 7] Figure 7 is an explanatory diagram of the mapping operation in the vertical direction. [Figure 8] Figure 8 is an explanatory diagram of the mapping operation in the left-right direction. [Figure 9] Figure 9 is a block diagram of the substrate transport device. [Figure 10] Figure 10 is an explanatory diagram of the circuit board information. [Figure 11]Figure 11 is an explanatory diagram (part 1) of the offset change process. [Figure 12] Figure 12 is an explanatory diagram (part 2) of the offset change process. [Figure 13] Figure 13 is a flowchart showing the processing procedure for incoming goods. [Figure 14] Figure 14 is a flowchart showing the processing steps for the removal process. [Modes for carrying out the invention]

[0010] The substrate transport apparatus and substrate transport method disclosed herein will be described in detail below with reference to the attached drawings. However, this invention is not limited to the embodiments shown below.

[0011] Furthermore, in the embodiments described below, expressions such as "vertical," "front," "parallel," and "intermediate" may be used, but it is not necessary to strictly satisfy these conditions. In other words, each of the above expressions should allow for deviations in manufacturing accuracy, installation accuracy, processing accuracy, detection accuracy, etc.

[0012] (Overview of substrate transport device 1) First, an overview of the substrate transport device 1 according to this embodiment will be described using Figure 1. Figure 1 is a schematic top view showing an overview of the substrate transport device 1. For the sake of clarity, Figure 1 shows a three-dimensional Cartesian coordinate system consisting of a Z-axis with the vertically upward direction as the positive direction, an X-axis parallel to the left-right direction along the front of the cassette 200 on which the substrate 500 is placed, and a Y-axis parallel to the depth direction of the cassette 200. This Cartesian coordinate system may also be shown in other drawings used in the following description.

[0013] Here, the front of the cassette 200 refers to the side of the cassette 200 that has an opening into which the hand 13 for transporting the circuit board 500 can be inserted. The depth direction of the cassette 200 refers to the direction in which the hand 13 enters or retracts from the front of the cassette 200 for loading and unloading the circuit board 500.

[0014] The cassette 200 includes a plurality of support portions extending in the insertion direction (Y-axis direction) of the hand 13 (see the broken line shown in the cassette 200). A configuration example of the cassette 200 will be described later with reference to FIGS. 5 and 6.

[0015] Further, in FIG. 1, a target substrate 500 to be carried into the cassette 200 n is shown when being carried into a slot having a substrate support height h n as a schematic front view viewed from the front side (negative Y-axis side) of the cassette 200 (see step St1).

[0016] Hereinafter, as shown in this schematic front view, a substrate 500 to be carried in / out is appropriately referred to as "target substrate 500 n n" where n is a natural number of 2 or more. The target substrate 500 n n is to be supported on the slot of substrate support height h n n in the cassette 200. Accordingly, in the cassette 200, a substrate 500 accommodated in the slot immediately above the target substrate 500 n n, that is, the slot of substrate support height h n+1 n+1 is appropriately referred to as "immediately-above substrate 500 n+1 n+1". Similarly, a substrate 500 accommodated in the slot immediately below the target substrate 500 n n, that is, the slot of substrate support height h n-1 n-1 is appropriately referred to as "immediately-below substrate 500 n-1 n-1". When there is no need to distinguish these, they are simply referred to as "substrate 500".

[0017] This schematic front view schematically shows a state where the substrate 500 is deflected by depicting the substrate 500 in a wavy manner. Note that, in other drawings than FIG. 1 described later, the substrate 500 may be similarly illustrated. Further, the black circles in the drawings correspond to the aforementioned support portions that support the substrate 500 from below.

[0018] Furthermore, in this embodiment, a cassette 200 that houses multiple substrates 500 is given as the main example of a place to place the substrate 500, but the place to place the substrate 500 may also be an aligner that adjusts the orientation of the substrate 500, or various processing devices that perform various substrate processing on the substrate 500. Also, in this embodiment, the substrate 500 is shown as a panel such as a resin substrate like glass epoxy or a glass substrate with a rectangular outer shape, but the substrate 500 may also be a wafer with a circular outer shape, or a thin plate of any shape or material.

[0019] As shown in Figure 1, the substrate transport device 1 comprises a robot 10 and a controller 20 that controls the operation of the robot 10. The robot 10 comprises a hand 13 that transports the substrate 500 and an operating mechanism that operates the hand 13.

[0020] The hand 13 also includes sensors S (sensors S1 and S2) for detecting objects such as the cassette 200 and the substrate 500 inside the cassette 200. Sensor S is, for example, a reflective laser sensor. Sensor S irradiates scan lines o1 and o2 in front of the cassette 200 (in the Y-axis direction) at a predetermined detectable distance D from the front of the cassette 200 as shown in Figure 1. Sensor S also detects the presence and position of objects by detecting the reflected lines that come back when these scan lines o1 and o2 are reflected from the cassette 200 and the substrate 500 inside the cassette 200.

[0021] Figure 1 shows a case where a sensor S is provided at each branch of the hand 13, which has two branches at its tip (i.e., there are two sensors S). However, the number of sensors S may be just one. Also, if the tip of the hand 13 branches into three or more parts, a sensor S may be provided at each branch. In other words, the hand 13 may be provided with the same number of sensors S as the number of branches.

[0022] The controller 20 stores teaching information including the substrate support height (Z coordinate) at the mounting position (XY coordinate) of the substrate 500. The controller 20 also performs mapping processing to determine whether the hand 13 can enter or retract into the cassette 200 without the hand 13 or the substrate 500 held by the hand 13 coming into contact with the substrate 500 inside the cassette 200 when loading or unloading the substrate 500 at the substrate support height.

[0023] In the mapping process, the controller 20 causes the robot 10 to perform predetermined mapping operations, and the sensor S detects the presence or absence of the circuit board 500 in each slot within the cassette 200, as well as its actual thickness and actual deflection. Specific examples of the mapping operations will be described later using Figures 7 and 8.

[0024] Then, the controller 20 changes the offset amount from the substrate support height (h) according to the thickness or deflection amount of the substrate 500 obtained by the mapping process (step St1).

[0025] Specifically, as shown in the schematic front view of step St1, the target substrate 500 n The substrate support height (h n When transporting to the facility, the controller 20 first connects to the target board 500. n The hand 13 holding the substrate is supported at a height (h n+1 ) and substrate support height (h n The controller 20 moves the hand 13 into clearance CL1 with respect to the substrate support height (h). At this time, the controller 20 moves the hand 13 into place at, for example, the planned entry height z1. The planned entry height z1 is the substrate support height (h n It is calculated from the upward offset amount UO from ).

[0026] The controller 20 pre-stores substrate information that defines at least the relationship between the thickness of the substrate 500 and the amount of deflection of the substrate 500 for each type of substrate 500 to be transported, and the specified value of the upward offset amount UO is calculated, for example, based on this substrate information.

[0027] Furthermore, after entering the clearance CL1, the controller 20 lowers the hand 13 and places the target substrate 500n on the hand 13 to a substrate support height (h n The board is placed in the slot at ). After placement, the controller 20 moves the hand 13 to the board support height (h n ) and substrate support height (h n-1 Lower the clearance to CL2.

[0028] At this time, the controller 20 lowers the hand 13 to, for example, the planned retraction height z2. The planned retraction height z2 is the substrate support height (h n It is calculated from the downward offset amount DO from the upper offset amount UO. The specified value of the downward offset amount DO is calculated, for example, based on the board information described above, similar to the upward offset amount UO. Then, the controller 20 lowers the hand 13 to the planned retraction height z2 and then retracts the hand 13 from the cassette 200.

[0029] However, if the upward offset amount UO and the downward offset amount DO remain fixed, there is a risk that the hand 13 may not be able to enter at the planned entry height z1 or descend to the planned retraction height z2 if the thickness t of the circuit board 500 housed in the cassette 200 has changed or the deflection amount d has increased due to various circuit board processing.

[0030] Therefore, in the substrate transport method according to the embodiment, the controller 20 changes the offset amount from the substrate support height (h) according to the thickness or deflection amount of the substrate 500 obtained by the mapping process.

[0031] Figure 2 is an explanatory diagram of the offset amount during loading. Figure 3 is an explanatory diagram of the offset amount during unloading.

[0032] To summarize the offset amount, first, as shown in Figure 2, the target substrate 500 on the cassette 200 n During delivery, the offset amount is the substrate support height (h nThe upward offset amount UO (see arrow a2 in the figure), which is the amount the hand 13 descends to, and the substrate support height (h n This is the downward offset amount DO (see arrow a3 in the figure), which is the amount of descent of hand 13 from ).

[0033] During this delivery, the controller 20 adjusts the substrate support height (h) according to the thickness or deflection of the substrate 500. n The upward offset amount UO or downward offset amount DO from ) is changed, and the planned entry height z1 at clearance CL1 is determined by the changed upward offset amount UO. Also, the planned retreat height z2 at clearance CL2 is determined by the changed downward offset amount DO.

[0034] Furthermore, as shown in Figure 3, the target circuit board 500 from the cassette 200 n During the removal of the substrate, the offset amount is the substrate support height (h n The downward offset amount DO (see arrow a4 in the figure), which is the amount the hand 13 rises to, and the substrate support height (h n This is the upward offset amount UO (see arrow a5 in the figure), which is the amount of rise in hand 13 from ).

[0035] During this removal process, the controller 20 adjusts the substrate support height (h) according to the thickness or deflection of the substrate 500. n The downward offset amount DO or upward offset amount UO from ) is changed, and the planned entry height z1 in clearance CL2 is determined by the changed downward offset amount DO. Also, the planned retreat height z2 in clearance CL1 is determined by the changed upward offset amount UO.

[0036] Furthermore, the controller 20 can change the offset amount not only by considering the actual thickness or deflection of the substrate 500 obtained through the mapping process, but also by taking into account, for example, the thickness or deflection of each type of substrate 500 that has been set in advance, the thickness of the hand 13, the deflection of the hand 13, the vibration amplitude of the hand 13, and the thickness of the support part mentioned above. This point will be explained later using Figures 11 and 12.

[0037] As described above, the substrate transport device 1 according to this embodiment changes the offset amount by which the hand 13 moves up and down from the substrate support height (h) of the cassette 200 when the hand 13 is loading or unloading the substrate 500 into or out of the cassette 200, according to the thickness or deflection amount of the substrate 500 detected by the sensor S.

[0038] Therefore, according to the substrate transport device 1 of this embodiment, even if the state of the substrate 500 changes, damage to the substrate 500 due to contact can be prevented.

[0039] (Example configuration of robot 10) Next, an example of the configuration of the robot 10 shown in Figure 1 will be explained using Figure 4. Figure 4 is a diagram showing an example of the configuration of the robot 10. Note that Figure 4 corresponds to a schematic oblique view of the robot 10 as seen from diagonally above.

[0040] As shown in Figure 4, the robot 10 is, for example, a horizontal articulated robot having a horizontal articulated SCARA arm and a lifting mechanism. The robot 10 comprises a main body 10a, a lifting unit 10b, a first arm 11, a second arm 12, and a hand 13. The main body 10a is fixed, for example, to the floor of a transport chamber for substrates 500 and incorporates a lifting mechanism for raising and lowering the lifting unit 10b.

[0041] The lifting section 10b moves up and down along the lifting axis A0 and supports the base end of the first arm 11 so as to be rotatable around the first axis A1. Alternatively, the lifting section 10b itself may be rotated around the first axis A1. Furthermore, the first axis A1 may be positioned towards the negative Y-axis direction on the upper surface of the lifting section 10b. By positioning the first axis A1 towards the negative Y-axis direction in the figure, the first arm 11 can be lengthened.

[0042] The first arm 11 supports the base end of the second arm 12 at its tip so that it can rotate around the second axis A2. The second arm 12 supports the base end of the hand 13 at its tip so that it can rotate around the third axis A3.

[0043] Thus, the robot 10 is a horizontal articulated robot that includes three links: a first arm 11, a second arm 12, and a hand 13. This allows the robot 10 to freely transport the substrate 500 in the horizontal direction.

[0044] Furthermore, as described above, the robot 10 has a lifting unit 10b and a main body 10a that raises and lowers the lifting unit 10b. This allows access to each of the circuit boards 500 housed in multiple stages in the cassette 200, and to obtain the presence or absence and deflection amount of each circuit board 500 housed in the cassette 200 by lowering the hand 13. The main body 10a, lifting unit 10b, first arm 11, and second arm 12 are examples of an "operation mechanism" that moves the hand 13 in the horizontal and vertical directions.

[0045] The hand 13 comprises a first fork portion 13a, a second fork portion 13b, and a base portion 13c. The first fork portion 13a and the second fork portion 13b branch off from the base portion 13c and extend opposite each other at a distance from each other.

[0046] The first fork section 13a and the second fork section 13b support the substrate 500 from below when transporting the substrate 500. The first fork section 13a and the second fork section 13b have a holding mechanism (not shown) such as a contact suction method, a non-contact suction method, or a gripping method, and the substrate 500 is held and supported by this holding mechanism.

[0047] Furthermore, as shown in Figure 4, sensors S1 and S2 are provided on the tip side of the upper surface of the first fork portion 13a and the second fork portion 13b, respectively.

[0048] (Example configuration for Cassette 200) Next, an example of the configuration of the cassette 200 shown in Figure 1 will be explained using Figures 5 and 6. Figure 5 is a schematic front view of the cassette 200. Figure 6 is a schematic top view of the cassette 200. In Figure 6, the hand 13 at the transfer position of the circuit board 500 in the cassette 200 is indicated by a dashed line.

[0049] As shown in Figure 5, the front of the cassette 200 is open, and between the top surface 201 and the bottom surface 202 inside the cassette 200, there are max number of slots capable of accommodating the circuit board 500. max is a natural number greater than or equal to 2. Each slot is provided with a first support portion 211, a second support portion 212, and a third support portion 213, which extend in the direction along the depth of the cassette 200 (Y-axis direction).

[0050] Here, each slot supports the circuit board 500 at a circuit board support height (h). In the first stage, counting from the bottom surface 202 side, the circuit board 500 is supported at a circuit board support height (h1). In the second stage, the circuit board 500 is supported at a circuit board support height (h2). In the max-1 stage, the circuit board 500 is supported at a circuit board support height (h max-1 ) is supported. At the max stage, the substrate 500 is supported at the substrate support height (h max It is supported by ). Also, the pitch (P) between slots is assumed to be equal.

[0051] The first support portion 211 and the second support portion 212 are provided on the side surface 205 inside the cassette 200. The third support portion 213 is provided at an intermediate position between the first support portion 211 and the second support portion 212 in the left-right direction (X-axis direction) of the cassette 200. In other words, the cassette 200 supports the substrate 500 at three points when viewed from the front. Although Figure 5 shows the case where there is one third support portion 213, for example, two or more third support portions 213 may be provided so that the distance between each support portion is equal.

[0052] Here, as shown in Figure 6, the third support portion 213 is a rod-shaped (bar-shaped) member that extends from the back surface 203 to the front surface 204 of the cassette 200, and its foremost end is closer to the back surface 203 of the cassette 200 than the foremost ends of the first support portion 211 and the second support portion 212. In other words, the extension length of the third support portion 213 in the depth direction (Y-axis direction) is shorter than the extension lengths of the first support portion 211 and the second support portion 212.

[0053] Thus, if the foremost end of the third support portion 213 is short, the front side of the substrate 500 supported by the third support portion 213 may droop forward. However, the sensor S detects the amount of deflection of the substrate 500, including this drooping.

[0054] Furthermore, as shown in Figure 6, the hand 13 includes a first fork portion 13a that can be inserted between the first support portion 211 and the third support portion 213 of the cassette 200, and a second fork portion 13b that can be inserted between the second support portion 212 and the third support portion 213. As described above, if two or more third support portions 213 are provided, the hand 13 may be provided with a number of extension portions that can be inserted between each support portion.

[0055] Thus, the cassette 200 includes a first support portion 211 and a second support portion 212 that support both ends of the circuit board 500 when viewed from the front 204 of the cassette 200. The cassette 200 also includes a third support portion 213 that supports the circuit board 500 at an intermediate position between the first support portion 211 and the second support portion 212.

[0056] Furthermore, the hand 13 includes at least a first fork portion 13a that can be inserted between the first support portion 211 and the third support portion 213 of the cassette 200, and a second fork portion 13b that can be inserted between the second support portion 212 and the third support portion 213. The sensors S (sensor S1 and sensor S2) are provided on the tip sides of the first fork portion 13a and the second fork portion 13b of the hand 13, respectively.

[0057] (Explanation of vertical mapping operation) Next, the vertical mapping operation, which is part of the mapping operation for detecting the thickness and deflection of the substrate 500, will be explained using Figure 7. Figure 7 is an explanatory diagram of the vertical mapping operation.

[0058] In the vertical mapping operation, the controller 20 (see Figure 1) brings the hand 13 closer to the cassette 200 to the detectable distance D of the sensor S, as shown in Figure 7, and positions the hand 13 above the front surface 204 of the cassette 200.

[0059] The controller 20 then lowers the hand 13. At this time, the controller 20 moves the hand 13 along the Z-axis (see arrow a6 in the figure), causing the sensor S to perform a vertical scan along the trajectory VS. The controller 20 also moves the hand 13 until the scanning range of the sensor S due to this vertical scan reaches, for example, the bottom surface 202 of the cassette 200. However, it is not always necessary to move the hand 13 until it reaches the bottom surface 202. For example, by combining it with the left-right mapping operation described later, it may be unnecessary to move the hand 13 until it reaches the bottom surface 202.

[0060] The controller 20 then detects and records the presence or absence of the circuit board 500 in each slot of the cassette 200 based on the scanning results of the sensor S.

[0061] Furthermore, the controller 20 detects and records the thickness of each substrate 500 in each slot where a substrate 500 is present, based on the scanning results of the sensor S.

[0062] Furthermore, the controller 20 detects and records the amount of deflection of each board 500 in each slot where a board 500 is located, based on the scanning results of the sensor S. The amount of deflection can be detected as the difference between the support height (h) of each board and the lowest position of each board 500. If the amount of deflection differs between trajectory VS1 and trajectory VS2, the larger value is detected as the amount of deflection of the corresponding board 500.

[0063] In Figure 7, an example is shown in which the hand 13 is lowered from above the front surface 204 of the cassette 200. However, the hand 13 may also be raised from below the front surface 204 to cause the sensor S to perform a vertical scan along the trajectory VS.

[0064] (Explanation of left-right mapping operation) Next, the left-right mapping operation, which is part of the mapping operation for detecting the thickness and deflection of the substrate 500, will be explained using Figure 8. Figure 8 is an explanatory diagram of the left-right mapping operation.

[0065] In the left-right mapping operation, as shown in Figure 8, the controller 20 brings the hand 13 closer to the cassette 200 to the detectable distance D of the sensor S, and for each slot, adjusts the hand 13 to, for example, the substrate support height (h) of each slot.

[0066] The controller 20 then moves the hand 13 horizontally (see arrow a7 in the figure) and causes the sensor S to perform a horizontal scan along the trajectory HS. At this time, the controller 20 moves the hand 13 horizontally while appropriately lowering it so that this horizontal scan is repeated for each slot, for example, from the substrate support height (h) of each slot for a predetermined scanning range (see the filled area in the figure) (trajectory HS in the figure). m ~Kiseki HS m+2 (See (where m is a natural number greater than or equal to 1)).

[0067] Furthermore, the controller 20 moves the hand 13 until the scanning range of the sensor S, obtained by this horizontal scanning, reaches, for example, the bottom surface 202 of the cassette 200. However, it is not always necessary to move the hand 13 until the scanning range of the sensor S, obtained by this horizontal scanning, reaches the bottom surface 202. For example, the deflection detection is complete when the sensor S no longer detects the substrate 500. The clearance can be determined, for example, from information about the external shape of the cassette 200 stored in the memory unit 21, which will be described later.

[0068] The controller 20 then detects and records the presence or absence of the circuit board 500 in each slot of the cassette 200 based on the scanning results of the sensor S.

[0069] Furthermore, the controller 20 detects and records the thickness of each substrate 500 in each slot where a substrate 500 is present, based on the scanning results of the sensor S.

[0070] Furthermore, the controller 20 detects and records the amount of deflection of each substrate 500 in each slot where a substrate 500 is located, based on the scanning results of the sensor S. The amount of deflection can be detected in the same way as in the case of vertical mapping operation.

[0071] The mapping operation may be performed only in the vertical direction as shown in Figure 7, only in the horizontal direction as shown in Figure 8, or a combination of both.

[0072] (Example configuration of controller 20) Next, the configuration of the substrate transport device 1 shown in Figure 1 will be explained using Figure 9. Figure 9 is a block diagram of the substrate transport device 1. As described above, the substrate transport device 1 includes a robot 10 and a controller 20 that controls the operation of the robot 10. Since an example of the configuration of the robot 10 has already been explained using Figure 4, this section will mainly explain an example of the configuration of the controller 20.

[0073] As shown in Figure 9, the controller 20 comprises a storage unit 21 and a control unit 22. The storage unit 21 corresponds to, for example, RAM (Random Access Memory) or HDD (Hard Disk Drive). The storage unit 21 stores teaching information 21a and board information 21b.

[0074] The teaching information 21a is generated during the teaching phase in which the robot 10 is taught movements, and includes information that defines the movements of the robot 10, including the movement trajectory of the hand 13, as part of a "job". Alternatively, teaching information 21a generated by another computer connected via a wired or wireless network may be stored in the storage unit 21.

[0075] Furthermore, the teaching information 21a may include information that identifies the type of substrate 500 to be transported, information regarding the external shape of the cassette 200, and information regarding the teaching position in the cassette 200 (for example, the substrate support height (Z coordinate) at the mounting position (XY coordinate) of each substrate 500).

[0076] The substrate information 21b, as already described, defines the relationship between the thickness of the substrate 500 and the amount of deflection of the substrate 500 for each type of substrate 500. Figure 10 is an explanatory diagram of the substrate information 21b.

[0077] As shown in Figure 10, the substrate information 21b is a table that defines the relationship between at least the "thickness" and "deflection amount" of the substrate 500 for each "type" of the substrate 500. The "deflection amount" can define various deflection amounts, for example, when the substrate 500 is supported by a "cassette" or by a "hand".

[0078] "Thickness" is defined based on, for example, the catalog value for the thickness of substrate 500. "Deflection" is defined based on, for example, the catalog value for the deflection of substrate 500, or measured values ​​obtained through experiments, etc.

[0079] Returning to the explanation of Figure 9, the control unit 22 comprises an motion control unit 22a, an offset amount changing unit 22b, a detection unit 22c, and a transport speed changing unit 22d. The controller 20 is connected to the robot 10.

[0080] Here, the controller 20 includes, for example, a computer and various circuits having a CPU (Central Processing Unit), ROM (Read Only Memory), RAM, HDD, input / output ports, etc.

[0081] The computer's CPU functions as the operation control unit 22a, offset amount changing unit 22b, detection unit 22c, and transport speed changing unit 22d of the control unit 22, for example, by reading and executing a program stored in ROM. Alternatively, at least one or all of the operation control unit 22a, offset amount changing unit 22b, detection unit 22c, and transport speed changing unit 22d of the control unit 22 can be configured using hardware such as an ASIC (Application Specific Integrated Circuit) or FPGA (Field Programmable Gate Array).

[0082] The controller 20 may also acquire the aforementioned programs and various information via other computers or portable recording media connected by wired or wireless networks.

[0083] The motion control unit 22a controls the operation of the robot 10 based on the teaching information 21a, the offset amount changed by the offset amount changing unit 22b, the transport speed changed by the transport speed changing unit 22d, and the like.

[0084] Specifically, the motion control unit 22a instructs the actuators corresponding to each axis of the robot 10 based on the teaching information 21a stored in the memory unit 21, causing the robot 10 to perform mapping operations or transport operations for the substrate 500. In addition, the motion control unit 22a improves the accuracy of the robot 10's movements by performing feedback control using encoder values ​​in the actuators.

[0085] Furthermore, the motion control unit 22a moves the hand 13 into the cassette 200 or retracts it from the cassette 200 based on the offset amount changed by the offset amount changing unit 22b. The motion control unit 22a also operates the hand 13 at the transport speed changed by the transport speed changing unit 22d.

[0086] The offset amount changing unit 22b changes the offset amount based on the substrate information 21b, the detection results from the detection unit 22c, etc. Before the mapping operation is performed, the offset amount changing unit 22b calculates a predetermined value for the offset amount based on the substrate information 21b, for example.

[0087] Furthermore, the offset amount changing unit 22b changes the offset amount based on the actual thickness t and actual deflection amount d of each substrate 500 detected by the detection unit 22c.

[0088] For example, the offset amount changing unit 22b, through a mapping operation, estimates the amount of deflection of the substrate 500 from the actual thickness t of the substrate 500 detected by the sensor S, and changes the offset amount based on this estimated amount of deflection.

[0089] Furthermore, for example, the offset amount changing unit 22b compares the actual thickness t of the substrate 500 detected by the detection unit 22c with the substrate information 21b and estimates the corresponding deflection amount as the estimated deflection amount.

[0090] Furthermore, for example, when the mapping operation is performed and the sensor S detects the actual deflection amount d of the substrate 500, the offset amount change unit 22b changes the offset amount based on the larger of the actual deflection amount d and the estimated deflection amount.

[0091] Furthermore, for example, the offset amount changing unit 22b detects the directly above substrate 500 when the mapping operation is performed. n+1 The actual amount of deflection, or the substrate directly below 500 n-1 The offset amount is changed based on at least one of the actual deflection amounts.

[0092] Furthermore, for example, the offset amount changing unit 22b changes the offset amount based on a hand characteristic value that includes at least one of the deflection amount or vibration amplitude of the hand 13 when the hand 13 is raised or lowered.

[0093] The detection unit 22c detects the actual thickness t and actual deflection amount d of each substrate 500 in the cassette 200 based on the scanning results of the sensor S when the robot 10 performs a mapping operation.

[0094] The offset change process will be explained in detail using Figures 11 and 12. Figures 11 and 12 are explanatory diagrams (part 1) and (part 2) of the offset change process. Figure 11 shows the entry phase during loading or the relocation phase during unloading. On the other hand, Figure 12 shows the relocation phase during loading or the entry phase during unloading.

[0095] Figure 11 illustrates the case of delivery. Target substrate 500 n The board support height (h) of the cassette 200 n When transporting to ), as shown in Figure 11, the target substrate 500 n It is assumed that the hand 13 will support the object as it enters clearance CL1.

[0096] In this case, the offset amount changing unit 22b is used when the directly above substrate 500 detected by the detection unit 22c n+1 Deflection amount d n+1 Then, the upward offset amount UO is calculated based on the thickness ht of the hand 13 and the hand characteristic value av. The hand characteristic value includes at least one of the deflection amount or vibration amplitude of the hand 13.

[0097] Here, the target substrate 500 is supported by hand 13 n Let the amount of deflection be denoted as deflection amount hd. Deflection amount hd is obtained, for example, from substrate information 21b. At this time, the planned height z1 for entering clearance CL1 is given by equation (substrate support height (h) nIt is derived from () + upward offset amount UO + deflection amount hd).

[0098] Furthermore, the thickness of each support part, the first support part 211, the second support part 212, and the third support part 213, is assumed to be thickness st. Then, (the substrate directly above 500 n+1 The actual amount of deflection d n+1 >When the thickness of the support part (st), the condition ((substrate support height (h) n+1 )-(deflection amount d) n+1 )) - Substrate support height (h n The possibility of the hand 13 entering the clearance CL1 can be determined by whether the following conditions are met: - the thickness t of the substrate 500 - the upward offset amount UO - the hand characteristic value av > 0.

[0099] Also, (directly above substrate 500 n+1 Deflection amount d n+1 When the thickness of the support part (st) is less than the condition (substrate support height (h)), n+1 )-Substrate support height (h n The possibility of the hand 13 entering the clearance CL1 can be determined by whether the following conditions are met: - thickness st of the support part - thickness t of the substrate 500 - upward offset amount UO - hand characteristic value av > 0.

[0100] Also, the conditions (upward offset amount UO - target substrate 500) n Whether or not the deflection amount hd (hand characteristic value av > 0) is satisfied can be used to determine whether or not the hand 13 can enter the clearance CL1.

[0101] Thus, the offset amount changing unit 22b is controlled by the hand 13 to the target substrate 500 n This target substrate 500 n Substrate support height (h n When transporting the target circuit boards to the facility, 500 units n Substrate support height (h n ) and the substrate directly above it 500 n+1 Substrate support height (h n+1 The clearance CL1 between the above substrate 500 allows the hand 13 to enter. n+1 The actual amount of deflection d n+1Then, the upward offset amount UO is changed based on the thickness ht of hand 13 and the hand characteristic value av.

[0102] To put this in terms of the removal process, the offset amount changing unit 22b is moved by the hand 13 to the target substrate 500 n This target substrate 500 n Substrate support height (h n When removing the target substrate 500 n Substrate support height (h n ) and the substrate directly above it 500 n+1 Substrate support height (h n+1 The clearance CL1 between the above substrate 500 allows the hand 13 to be retracted. n+1 The actual amount of deflection d n+1 This means that the upward offset amount UO will be changed based on the thickness ht of hand 13 and the hand characteristic value av.

[0103] Next, Figure 12 illustrates this removal case as an example. Target substrate 500 n The board support height (h) of the cassette 200 n When removing the substrate from the enclosure, as shown in Figure 12, it is assumed that the hand 13 will enter the clearance CL2 without supporting the substrate 500.

[0104] In this case, the offset amount changing unit 22b controls the target substrate 500 detected by the detection unit 22c. n Deflection amount d n Then, the downward offset amount DO is calculated based on the thickness ht of hand 13 and the hand characteristic value av.

[0105] Based on this, the planned height z1 for entering clearance CL2 is given by the formula (substrate support height (h n )-Downward offset amount DO-Target substrate 500 n The actual amount of deflection d n It is derived by ).

[0106] Then, the condition ((substrate support height (h n )-Deflection amount d n)-(substrate support height h n-1 ) - thickness t of substrate 500) - thickness ht of hand 13 - hand characteristic value av > 0), whether the hand 13 can enter the clearance CL2 can be determined.

[0107] As described above, the offset amount changing unit 22b is configured such that the hand 13 processes the target substrate 500 n when unloading the target substrate 500 n from the substrate support height h n ), the target substrate 500 n has a substrate support height h n ) and the immediately underlying substrate 500 n-1 has a substrate support height h n-1 ), the downward offset amount DO is changed so that the hand 13 can enter the clearance CL2 between the substrate support height of the target substrate 500 n and the actual deflection amount d of the target substrate 500 n based on the actual deflection d, the thickness ht of the hand 13, and the hand characteristic value av.

[0108] Note that, rephrasing this for the case of carrying in, the offset amount changing unit 22b is configured such that when the hand 13 carries the target substrate 500 n into the substrate support height h n of the target substrate 500 n ), the target substrate 500 n has a substrate support height h n ) and the immediately underlying substrate 500 n-1 has a substrate support height h n-1 ), the downward offset amount DO is changed so that the hand 13 can retreat from the clearance CL2 between the substrate support height of the target substrate 500 n and the actual deflection amount d of the target substrate 500 n based on the actual deflection d, the thickness ht of the hand 13, and the hand characteristic value av.

[0109] In FIG. 12, for convenience of explanation, the substrate support height h n ) and the clearance CL2 between the slot at substrate support height h n-1 ) is taken as an example, but when changing the downward offset amount DO, the substrate support height h n) does not necessarily require a board support height (h n-1 The slots of the substrate support height (h) are not necessarily the ones that should be considered. n-1 ) There is no board 500 in the slot, and the board support height (h) one level below it n-2 If board 500 exists in the slot of ), that should be the one to consider. In other words, in the case of a downward offset amount DO, the board support height (h n ) refers to the slot directly below the slot where board 500 is located, i.e., the board support height (h n-p The slots targeted are those where p is a natural number greater than or equal to 1, and the "directly below board" is the directly below board 500 n-p It can be expressed as follows. Also, the clearance CL2 is the substrate support height (h n ) slot and board support height (h n-p This will be the clearance with the slot.

[0110] Returning to the explanation of Figure 9, the transport speed change unit 22d changes the transport speed by the hand 13 based on the thickness t and deflection amount d of each substrate 500 detected by the detection unit 22c. For example, if the thickness of the substrate 500 is less than a predetermined threshold, the transport speed change unit 22d will slow down the transport speed. Also, for example, if the deflection amount of the substrate 500 is greater than a predetermined threshold, the transport speed change unit 22d will slow down the transport speed.

[0111] (Processing procedure) Next, the loading and unloading procedures performed by the substrate transport device 1 will be explained using Figures 13 and 14.

[0112] Let's start with the loading process. Figure 13 is a flowchart showing the loading process procedure. Note that Figure 13 shows the target circuit board 500 being placed in the nth slot of the cassette 200. n This shows the processing procedure when bringing in the item.

[0113] As shown in Figure 13, first the robot 10 performs a mapping operation based on the control of the motion control unit 22a of the controller 20 (step St101). Then, the motion control unit 22a instructs the robot 10 to transfer the target substrate 500 from the aligner, etc., to the nth stage. n To obtain (Step St102).

[0114] Then, the offset amount changing unit 22b of the controller 20 adjusts the n+1th stage directly above the substrate 500 based on the result of the mapping operation in step St101. n+1 The upward offset amount UO is changed based on the thickness or deflection amount, etc. (Step St103).

[0115] At this time, the offset amount changing unit 22b determines whether or not the hand 13 can enter the clearance CL1 between the (n+1)th stage and the nth stage by changing the upward offset amount UO (step St104).

[0116] If it is determined that hand 13 can enter clearance CL1 (step St104, Yes), then the offset amount changing unit 22b then moves the target substrate 500 n The downward offset amount DO is changed based on the thickness or deflection amount, etc. (Step St105).

[0117] At this time, the offset amount changing unit 22b determines whether or not the hand 13 can be retracted from the clearance CL2 between the nth stage and the (n-1)th stage by changing the downward offset amount DO (step St106).

[0118] If it is determined that the hand 13 can be retracted from the clearance CL2 (step St106, Yes), the operation control unit 22a determines that the hand 13 will enter the cassette 200 based on the upward offset amount UO changed in step St103, and the target substrate 500 n The robot 10 is controlled to move the item to the nth stage (step St107).

[0119] Furthermore, the motion control unit 22a controls the robot 10 so that the hand 13 retracts from the cassette 200 based on the downward offset amount DO changed in step St105 (step St108). Then, the process ends.

[0120] Furthermore, if it is determined in step St104 that hand 13 cannot enter clearance CL1 (step St104, No), or if it is determined in step St106 that hand 13 cannot be retracted from clearance CL2 (step St106, No), the operation control unit 22a will control the target substrate 500 n It is determined that loading into the nth stage is not possible (step St109). Then, the operation control unit 22a determines that the target board 500 n The delivery is stopped (Step St110), and the process is terminated.

[0121] Next, we will explain the unloading process. Figure 14 is a flowchart showing the processing steps for the unloading process. Note that Figure 14 shows the target circuit board 500 being unloaded from the nth slot of the cassette 200. n This shows the processing procedure for transporting the item.

[0122] As shown in Figure 14, first the robot 10 performs a mapping operation based on the control of the motion control unit 22a of the controller 20 (step St201). Then, the motion control unit 22a controls the robot 10 to bring the hand 13 closer to the nth slot (step St202).

[0123] Then, the offset amount changing unit 22b of the controller 20 adjusts the target substrate 500 of the nth stage based on the result of the mapping operation in step St201. n The downward offset amount DO is changed based on the thickness or deflection amount, etc. (Step St203).

[0124] At this time, the offset amount changing unit 22b determines whether or not the hand 13 can enter the clearance CL2 between the nth stage and the (n-1)th stage by changing the downward offset amount DO (step St204).

[0125] If it is determined that hand 13 can enter clearance CL2 (step St204, Yes), then the offset amount changing unit 22b then moves the n+1th stage directly above substrate 500 n+1 The upward offset amount UO is changed based on the thickness or deflection amount, etc. (Step St205).

[0126] At this time, the offset amount changing unit 22b determines whether or not the hand 13 can be retracted from the clearance CL1 between the (n+1)th stage and the nth stage by changing the upward offset amount UO (step St206).

[0127] If it is determined that the hand 13 can be retracted from the clearance CL1 (step St206, Yes), the operation control unit 22a determines that the hand 13 will enter the cassette 200 based on the downward offset amount DO changed in step St203, and the target substrate 500 n The robot 10 is controlled to acquire the nth row (step St207).

[0128] Furthermore, the motion control unit 22a controls the robot 10 so that the hand 13 retracts from the cassette 200 based on the upward offset amount UO changed in step St105 (step St208). Then, the process ends.

[0129] Furthermore, if it is determined in step St204 that hand 13 cannot enter clearance CL2 (step St204, No), or if it is determined in step St206 that hand 13 cannot be retracted from clearance CL1 (step St206, No), the operation control unit 22a will control the target substrate 500 n It is determined that removal from the nth stage is not possible (step St209). Then, the operation control unit 22a determines that the target board 500 n The removal of the material is stopped (step St210), and the process is terminated.

[0130] Note that while Figures 13 and 14 show an example where the mapping operation is performed immediately before accessing each slot, as shown in steps St101 and St201, the mapping operation does not necessarily need to be performed immediately before each access. For example, it is possible to perform the operation once at the beginning and then access each slot based on the results of that single operation.

[0131] (summary) As described above, the substrate transport device 1 according to one embodiment is a substrate transport device that transports substrates 500 into and out of a cassette 200 that houses substrates 500 in multiple stages in the vertical direction, and comprises a hand 13 for transporting the substrates 500, an operating mechanism for operating the hand 13, a controller 20 for controlling the operating mechanism, and a sensor S (corresponding to an example of the "first detection unit") capable of detecting the substrates 500. The controller 20 includes an offset amount changing unit 22b that changes the offset amount by which the hand 13 moves up and down from the substrate support height (h) of the cassette 200 when the hand 13 transports the substrates 500 into and out of the cassette 200, according to the thickness or deflection amount of the substrates 500 detected by the sensor S.

[0132] This allows the offset amount to be changed according to the detected thickness or deflection of the substrate 500, thereby preventing damage to the substrate 500 due to contact, even if the condition of the substrate 500 changes.

[0133] Furthermore, the above offset amounts are a downward offset amount DO, which is the amount the hand 13 rises to the board support height (h), and an upward offset amount UO, which is the amount the hand 13 rises from the board support height (h), when the board 500 is unloaded from the cassette 200. Furthermore, the above offset amounts are a downward offset amount UO, which is the amount the hand 13 descends to the board support height (h), and a downward offset amount DO, which is the amount the hand 13 descends from the board support height (h), when the board 500 is loaded into the cassette 200.

[0134] This allows you to change the offset amount for both the downward and upward offset cases.

[0135] Furthermore, the sensor S is a reflective sensor provided on the hand 13, and the offset amount changing unit 22b changes the offset amount based on the actual amount of deflection of the substrate 500 detected by the reflective sensor when the hand 13 is moved in at least one of the vertical and horizontal directions by the above operating mechanism.

[0136] This makes it possible to prevent damage to the substrate 500 due to contact, depending on the actual amount of deflection detected from the vertical and / or horizontal directions.

[0137] Furthermore, the offset amount changing unit 22b changes the offset amount based on the estimated deflection amount of the substrate 500, which is estimated from the thickness of the substrate 500 detected by the sensor S.

[0138] This makes it possible to prevent damage to the substrate 500 due to contact, based on the estimated amount of deflection estimated from the actual thickness.

[0139] Furthermore, the controller 20 pre-stores substrate information 21b that defines at least the relationship between the thickness of the substrate 500 and the amount of deflection of the substrate 500 for each type of substrate 500, and the offset amount changing unit 22b estimates the estimated amount of deflection based on the substrate information 21b.

[0140] This makes it possible to prevent damage to the substrate 500 due to contact, based on the estimated amount of deflection estimated from table data derived from experiments, etc.

[0141] Furthermore, the offset amount changing unit 22b changes the offset amount based on the larger of the actual deflection amount of the substrate 500 using the sensor S and the estimated deflection amount.

[0142] This allows for safer transport of the substrate 500 by adopting the larger value based on a comparison between table data derived from experiments and actual measured values.

[0143] Furthermore, the offset amount changing section 22b is used for the target substrate 500 that the hand 13 moves in and out. n The board directly above it is 500. n+1 Deflection amount d n+1 , or target substrate 500 n Directly below it is the substrate 500 n-1 Deflection amount d n-1 The above offset amount is modified based on at least one of the following.

[0144] This allows for safer transport of the substrate 500 by adjusting the offset amount while taking into account the state of the upper and lower stages of the processing stage.

[0145] Furthermore, the offset amount changing unit 22b changes the offset amount based on a hand characteristic value av, which includes at least one of the deflection amount hd or vibration amplitude of the hand 13 when the hand 13 is raised or lowered.

[0146] This allows for safer transport of the substrate 500 by changing the offset amount while taking into account the characteristics of the hand 13 itself when raising or lowering the hand 13.

[0147] Furthermore, the offset amount changing unit 22b is controlled by the hand 13 to the target substrate 500 n This target substrate 500 n Substrate support height (h n When transporting the target circuit boards to the facility, 500 units n Substrate support height (h n ) and the substrate directly above it 500 n+1 Substrate support height (h n+1 The clearance CL1 between the above substrate 500 allows the hand 13 to enter. n+1 The actual amount of deflection d n+1 Then, the upward offset amount UO is changed based on the thickness ht of hand 13 and the hand characteristic value av.

[0148] As a result, the upward offset amount UO is set to the clearance CL1 between the stage being processed and the stage directly above it, and the directly above substrate 500n+1 The actual amount of deflection d n+1 By modifying the hand 13 to allow entry, taking into account the thickness ht and characteristic value av of the hand 13, it becomes possible to transport the substrate 500 more safely.

[0149] Furthermore, the offset amount changing unit 22b is controlled by the hand 13 to the target substrate 500 n This target substrate 500 n Substrate support height (h n When removing the target substrate 500 n Substrate support height (h n ) and the substrate directly below 500 n-1 Substrate support height (h n-1 The target substrate 500 is positioned such that the hand 13 can enter the clearance CL2 between it and the other part. n The actual amount of deflection d n Then, the downward offset amount DO is changed based on the thickness ht of hand 13 and the hand characteristic value av.

[0150] As a result, the downward offset amount DO is set to the clearance CL2 between the processing stage and the stage directly below it, relative to the target substrate 500. n The actual amount of deflection d n By modifying the hand 13 to allow entry, taking into account the thickness ht and characteristic value av of the hand 13, it becomes possible to transport the substrate 500 more safely.

[0151] Furthermore, the cassette 200 has multiple support parts for each stage, which support the circuit board 500 at multiple locations when viewed from the front 204 of the cassette 200, and the offset amount changing part 22b is directly above the circuit board 500 n+1 The actual amount of deflection d n+1 The board directly above is 500 n+1 If the thickness st of the support portion supporting the above is smaller than the directly above substrate 500 n+1 The actual amount of deflection d n+1 Instead, the upward offset amount UO is changed based on the thickness st of the support part mentioned above.

[0152] As a result, the upward offset amount UO can be further modified to allow the hand 13 to enter, taking into account the thickness st of the support section in the step directly above, thereby enabling safer transport of the substrate 500.

[0153] Furthermore, the controller 20 includes a transport speed changing unit 22d that changes the transport speed of the substrate 500 by the hand 13 according to the thickness of the substrate 500.

[0154] This allows for safer transport of the substrate 500 by changing not only the offset amount but also the transport speed according to the thickness of the substrate 500.

[0155] Further effects and modifications can be readily derived by those skilled in the art. Therefore, broader aspects of the present invention are not limited to the specific details and representative embodiments expressed and described above. Accordingly, various modifications are possible without departing from the spirit or scope of the overall concept of the invention as defined by the appended claims and their equivalents. [Explanation of Symbols]

[0156] 1. Substrate transport device 10 Robots 10a Main body 10b Lifting section 11. First Arm 12. Second Arm 13 Hand 13a First fork section 13b Second Fork Section 13c base 20 controllers 21 Memory section 21a Instructional Information 21b Circuit board information 22 Control Unit 22a Operation Control Unit 22b Offset amount change section 22c Detection Unit 22d Conveyor speed change unit 200 cassettes 201 Top surface 202 Bottom 203 Back 204 Front 205 Side view 211 1st support part 212 Second support part 213 Third support part 500 circuit boards S sensor

Claims

1. A substrate transport device for loading and unloading substrates into a cassette that houses substrates in multiple stages in the vertical direction, A hand for transporting the aforementioned substrate, An operating mechanism for operating the aforementioned hand, A controller that controls the aforementioned operating mechanism, A first detection unit capable of detecting the substrate, Equipped with, The aforementioned controller, For each type of substrate, substrate information is pre-stored that defines at least the relationship between the thickness of the substrate and the amount of deflection of the substrate. The device includes an offset amount changing unit that changes the offset amount by which the hand moves up and down from the substrate support height of the cassette when the hand loads the substrate into and out of the cassette, according to the larger of the estimated deflection amount of the substrate estimated based on the substrate information from the thickness of the substrate detected by the first detection unit and the actual deflection amount of the substrate using the first detection unit. PCB transport device.

2. The aforementioned offset amount is When the substrate is removed from the cassette, the downward offset amount is the amount the hand rises to the substrate support height, and the upward offset amount is the amount the hand rises from the substrate support height. When loading the circuit board into the cassette, the upward offset amount is the amount the hand descends to the circuit board support height, and the downward offset amount is the amount the hand descends from the circuit board support height. The substrate transport apparatus according to claim 1.

3. The first detection unit is a reflective sensor provided on the hand, The offset amount changing unit is, The offset amount is changed based on the actual amount of deflection of the substrate detected by the reflective sensor when the hand is moved in at least one of the vertical and horizontal directions by the operating mechanism. The substrate transport apparatus according to claim 1.

4. The offset amount changing unit is, The offset amount is changed based on at least one of the deflection amount of the substrate directly above the substrate being moved in or out by the hand, or the deflection amount of the substrate being moved in or out. The substrate transport apparatus according to claim 2.

5. The offset amount changing unit is, The offset amount is changed based on a hand characteristic value that includes at least one of the amount of deflection or vibration amplitude of the hand when the hand is raised or lowered. The substrate transport apparatus according to claim 2.

6. The offset amount changing unit is, The offset amount is changed based on a hand characteristic value that includes at least one of the amount of deflection or vibration amplitude of the hand when the hand is raised or lowered. The substrate transport apparatus according to claim 4.

7. The offset amount changing unit is, When the hand moves the target substrate to the substrate support height of the target substrate, the upward offset amount is changed based on the actual amount of deflection of the substrate directly above, the thickness of the hand, and the characteristic value of the hand, so that the hand can enter the clearance between the substrate support height of the target substrate and the substrate support height of the substrate directly above. The substrate transport apparatus according to claim 6.

8. The offset amount changing unit is, When the hand removes the target substrate from the substrate support height of the target substrate, the downward offset amount is changed based on the actual amount of deflection of the target substrate, the thickness of the hand, and the characteristic value of the hand, so that the hand can enter the clearance between the substrate support height of the target substrate and the substrate support height of the substrate directly below the target substrate. The substrate transport apparatus according to claim 6.

9. The aforementioned cassette is Each stage is provided with multiple support parts that support the circuit board at multiple locations when viewed from the front of the cassette. The offset amount changing unit is, If the actual amount of deflection of the substrate directly above is less than the thickness of the support portion that supports the substrate directly above, the amount of upward offset is changed based on the thickness of the support portion instead of the actual amount of deflection of the substrate directly above. The substrate transport apparatus according to claim 7.

10. The aforementioned controller, The system includes a transport speed changing unit that changes the transport speed of the substrate by the hand according to the thickness of the substrate. A substrate transport device according to any one of claims 1 to 9.

11. A substrate transport method is performed by a substrate transport device that transports substrates into and out of a cassette that houses the substrates in multiple stages in the vertical direction, comprising: a hand for transporting substrates; an operating mechanism for operating the hand; a controller for controlling the operating mechanism; and a first detection unit capable of detecting the substrates. For each type of substrate, substrate information is pre-stored that defines at least the relationship between the thickness of the substrate and the amount of deflection of the substrate. The amount of offset by which the hand moves up and down from the cassette's substrate support height when the hand loads the substrate into and out of the cassette is changed, according to the larger of the estimated amount of deflection of the substrate estimated based on the substrate information from the thickness of the substrate detected by the first detection unit and the actual amount of deflection of the substrate using the first detection unit. A substrate transport method, including the above.

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