Systems and methods for three-dimensional printing, and products manufactured therefrom.

JP7927746B2Active Publication Date: 2026-10-01LUNG BIOTECH PBC
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Patent Information

Application Number
JP2023553323
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2021-03-04
Filing Date
2022-03-03
Publication Date
2026-10-01
Estimated Expiration
2042-03-03

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Abstract

The additive manufacturing apparatus includes an output device and a controller. The output device is configured to receive at least one material for generating a component. The controller includes one or more processors configured to receive a model including a plurality of pixels representing the component, identify at least one pixel of the plurality of pixels that corresponds to a first surface of the component, modify the model to adjust an exposure corresponding to the at least one pixel based on a target exposure, and control operation of the output device to cause the output device to generate the component based on the modified model.
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Description

[Technical Field]

[0001] Cross-Reference to Related Applications The present application claims priority from U.S. Provisional Application No. 63 / 156,555, filed on March 4, 2021, the entire contents of which are incorporated herein by reference. [Background Art]

[0002] The present application relates generally to the field of component manufacturing, and more specifically to systems and methods for three-dimensional (3D) printing, and articles manufactured thereby.

[0003] 3D printing can be used to produce a variety of components based on computer models of the components. [Summary of the Invention]

[0004] At least one aspect relates to an additive manufacturing device. The additive manufacturing device may comprise an output device and a controller. The output device may be configured to receive at least one material to produce a component. The controller comprises one or more processors configured to: receive a model comprising a plurality of pixels representing the component; identify at least one pixel among the plurality of pixels corresponding to a first surface of the component; modify the model to adjust an exposure amount corresponding to the at least one pixel based on a target exposure amount; and control operation of the output device to cause the output device to produce the component based on the modified model.

[0005] At least one aspect relates to a system. The system may include one or more processors configured to receive a model including a plurality of pixels representing a component, identify at least one of the plurality of pixels corresponding to a first surface of the component, modify the model to adjust the exposure corresponding to at least one pixel based on a target exposure, and control the operation of an output device to generate a component based on the modified model.

[0006] At least one aspect relates to a method. The method may include one or more processors receiving a model including a plurality of pixels representing a component; one or more processors identifying at least one pixel of the plurality of pixels corresponding to a first surface of the component; one or more processors modifying the model to adjust the exposure corresponding to the at least one pixel based on a target exposure; and one or more processors controlling an output device to produce a component based on the modified model.

[0007] Those skilled in the art will understand that this abstract is illustrative and not intended to limit in any sense. Other aspects of the apparatus and / or process described herein, features of the invention, and advantages, defined solely by the claims, will become apparent in the detailed description described herein and referenced together with the accompanying drawings. [Brief explanation of the drawing]

[0008] Details of one or more embodiments of the subject matter described herein are given in the accompanying drawings and the following description. Other features, aspects, and advantages of the subject matter will become apparent from the specification, drawings, and claims. [Figure 1] Figure 1 shows an exemplary component produced using a 3D printer according to one embodiment. [Figure 2] Figure 2 shows a 3D printing system according to one embodiment. [Figure 3] Figure 3 shows a component produced using a 3D printer according to one embodiment. [Figure 4] Figure 4 shows a vertical cross-section of the pixel approximation of the component in Figure 3 according to one embodiment. [Figure 5] Figure 5 shows various Z-compensation methods applied to the component model of Figure 3 according to one embodiment. [Figure 6] Figure 6 shows Z compensation and adaptive Z compensation applied to the component model of Figure 3 according to one embodiment. [Figure 7] Figure 7 shows a method for manufacturing a component using 3D printing with Z-compensation, according to one embodiment. [Figure 8] Figure 8 shows a 3D printing system according to one embodiment. [Figure 9] Figure 9 shows a side view of the 3D printing system of Figure 8 according to one embodiment. Similar reference numbers and designations in various drawings refer to similar elements. [Modes for carrying out the invention]

[0009] Additive manufacturing processes such as three-dimensional (3D) printing can be used to produce various components (e.g., parts). For example, 3D printing can be used to produce components for artificial organs, such as tissue or scaffolds for lungs or other organs, and this includes, but is not limited to, autologous tissue components. Printed components can be used as scaffolds for various types of biological materials, such as cells.

[0010] 3D printed components can have downfacing surfaces, such as holes or other features of the component. The 3D printing process allows components to have print-through downfacing surfaces. For example, as shown in Figure 1, a component 100 can be produced having a target (e.g., desired) shape portion 104 and one or more print-through portions 108. The print-through portions 108 can correspond to material along one or more respective downfacing surfaces 112 that extend further than the target dimensions or sizing of the target shape portion 104, as shown by the model used to produce component 100.

[0011] A process (e.g., Z compensation) can be performed to correct the print-through portion 108. For example, the thickness 116 of component 100 can be measured vertically (e.g., the Z thickness in the z direction in the xyz coordinate system). The distance for Z compensation can be determined by subtracting the target thickness, which can be indicated by the model used to generate component 100, from the measured thickness 116. Some 3D printers can determine the number of layers from the distance (e.g., by dividing the distance by the thickness of each layer) and apply Z compensation based on the number of layers.

[0012] However, for various components, such as component 100 as described with reference to Figure 1, print-through may not be constant (for example, print-through may vary in the x or y direction relative to the downward-facing surface where the print-through occurs). For instance, print-through may vary in one or more layers depending on the neighboring features of the component. Such variations in print-through may become apparent when printing components with features of a size close to the 3D printer's printing resolution.

[0013] The systems and methods described herein can adaptively perform Z-correction by applying different amounts of correction to different parts of a component. In this way, the print-through can be corrected more accurately, such as when the number of layers in the print-through is close to the resolution of the 3D printer. For example, the correction can be performed based on the exposure amount corresponding to a downward-facing surface (or a feature adjacent to a downward-facing surface, such as a hole), and the correction can be adapted as a function of position. By determining how to perform Z-correction using characteristics such as exposure amount, such systems and methods can reduce the time and material costs for accurately producing components, as they do not need to rely on measuring the component to determine the distances related to the print-through (e.g., to continue printing one or more additional components).

[0014] Figure 2 shows System 200. System 200 can be used to generate components by 3D printing and can perform adaptive Z correction to reduce print-through of components generated by the 3D printer (for example, reducing print-through as described with reference to Figure 1). System 200 can generate biological tissue components such as artificial lung tissue, or scaffold materials corresponding to biological structures such as the extracellular matrix portion of the lung. As further described herein, various features of System 200 can be implemented using digital light projection (DLP) systems such as inverted DLP 3D printers or volumetric 3D printers. For example, various features of System 200 can be implemented using the ProJet1200 from 3D Systems. System 200 can materialize CAD virtual 3D models by slicing computer-aided design (CAD) models and photopolymerizing the objects layer by layer. System 200 can perform stereolithography (SL) techniques as a platform in which UV laser rasterizing exposure is performed in a top-down manner. System 200 eliminates laser rasterizing using DLP and enables the photopolymerization of UV-curable polymers in a bottom-up manner in a single exposure. Various features of System 200 can be implemented using the 3D printing system 800, as described with reference to Figures 8 and 9.

[0015] The system 200 may include at least one platform 204. The platform 204 can provide a surface on which components are formed. For example, the platform 204 may be a surface configured to be parallel to the ground during the operation of the system 200.

[0016] The system 200 may include at least one material storage section 208. The material storage section 208 can store materials used to produce components. For example, the material storage section 208 can store ink or powder. The material storage section 208 can store polymer materials. The material storage section 208 can store metallic materials. The material storage section 208 can store photosensitive liquids. The material storage section 208 can store resin materials. The material storage section 208 can store materials of various densities, melting temperatures, refractive indices, or other properties. The material (e.g., ink material) may have a penetration depth. The penetration depth may be 10 μm or more and 500 μm or less. The penetration depth may be 50 μm or more and 200 μm or less. The penetration depth may be 100 μm.

[0017] The system 200 may include at least one output device 212. The output device 212 may receive material from the material storage unit 208 (for example, based on the operation of one or more pumps through one or more tubes or pipes not shown) and output the material to form components. The output device 212 may include, or be coupled with, at least one actuator 216 that controls the position of the output device 212 in response to a control signal. For example, the actuator 216 may control the position of the output device 212 in a coordinate system corresponding to the space around the platform 204, such as an orthogonal (e.g., xyz) coordinate system. The actuator 216 may include one or more motors or linear actuators for controlling the position of the output device 212 in response to a control signal. The output device 212 may output material in layers that may have layer sizes (e.g., layer height, layer thickness). For example, the layer size may be 1 μm or more and 100 μm or less. The layer size may be 5 μm or more and 50 μm or less. The layer size may be 20 μm. The size of the layer can be less than or equal to the penetration depth of the material.

[0018] The system 200 may include at least one controller 220. The controller 220 may include at least one processor 224 and memory 228. The processor 224 may be a general-purpose or application-specific processor, an application-specific integrated circuit (ASIC), one or more field-programmable gate arrays (FPGAs), a set of processing components, or other suitable processing components. The processor 224 may be configured to execute one or more of the processes described herein by executing computer code or instructions stored in memory 228 (e.g., fuzzy logic) or received from other computer-readable media (e.g., CD-ROM, network storage, remote server). The memory 228 may include one or more data storage devices (e.g., memory devices, computer-readable storage media) configured to store data, computer code, executable instructions, or other forms of computer-readable information. The memory 228 may include random access memory (RAM), read-only memory (ROM), hard drive storage, temporary storage, non-volatile memory, flash memory, optical memory, or any other suitable memory for storing software objects and / or computer instructions. Memory 228 may include database components, object code components, script components, or any other type of information structure to support the various activities and information structures described herein. Memory 228 may be communicably connected to processor 224 via controller 220 and may include computer code to perform one or more of the processes described herein (e.g., by processor 224). Memory 228 may include various modules (e.g., circuits, engines) to complete the processes described herein.

[0019] The controller 220 can control the operation of the output device 212 by, for example, generating a control signal for operating the output device 212 or the actuator 216 and transmitting the control signal to the output device 212 or the actuator 216. The controller 212 can generate a control signal for moving the output device 212 to a target position. The controller 212 can cause material to be supplied from the material storage unit 208 to the output device 212 (for example, by activating one or more pumps).

[0020] The memory 228 can include at least one model 232. The model 232 can be stored in a database of the memory 228. The model 232 or a part thereof may be received from a remote device, generated by an application executed by the controller 220, or generated by various combinations thereof.

[0021] The model 232 can represent a component generated using the system 200. The model 232 can represent the shape of the component, and can have component characteristics assigned to positions (for example, coordinates) in the shape of the component. The model 232 can have a coordinate system in which a specific coordinate is assigned to each element of the model. For example, the model 232 can include a plurality of pixels corresponding to specific coordinates. The model 232 can have a Cartesian coordinate system or various other coordinate systems (for example, cylindrical, spherical). The coordinate system can be three-dimensional such that each pixel corresponds to a volumetric element (for example, a voxel).

[0022] For example, model 232 can include a data structure in which each data element of the data structure corresponds to a specific pixel and is assigned one or more properties of a component generated for the specific pixel. For example, each data element can be assigned a specific coordinate (e.g., x-y-z coordinates) and a component material to be used at the specific coordinate. One or more pixels of model 232 may not be assigned a material (or may be assigned a flag or other indicator indicating that no material is used), so that no material is provided to the portion of the component corresponding to the one or more pixels.

[0023] Controller 220 can cause output device 212 to output material for generating a component using model 232. For example, controller 220 can identify, from the data elements of model 232, material that is to be output (or not output) at various positions corresponding to the pixels of the data elements. For example, for a specific pixel of model 232, controller 220 can move output device 212 to a position corresponding to the specific pixel, and cause the material assigned to the specific pixel to be output.

[0024] The controller 220 can be used to correct the print-through of the component, for example, by performing a Z-correction process. From the model 232, the controller 220 can identify pixels (e.g., at least one pixel) corresponding to the first surface of the component. The controller 220 can identify at least one pixel by acquiring one or more adjacent pixels (e.g., a second pixel within a threshold distance of at least one pixel, e.g., a second pixel within a threshold number of layers, such as less than 3 layers) and determining that no material is printed for one or more adjacent pixels. The first surface can be a downward-facing surface. For example, the controller 220 can determine that the first surface is a downward-facing surface based on the fact that one or more adjacent pixels that do not produce material have smaller z values ​​in the xyz coordinate system used by the model 232 (or similarly, by determining that the adjacent pixels are lower than at least one pixel in various coordinate systems). The number of at least one pixel on which Z correction is performed can correspond to the cumulative exposure, as further described herein (for example, Z correction is performed for each of the at least one identified pixel whose cumulative exposure, as determined from Model 232, does not meet the target exposure, and Z correction is not performed for pixels whose cumulative exposure, as determined from Model 232, already meets the target exposure).

[0025] The controller 220 can modify the model 232 to adjust the exposure corresponding to at least one pixel. The controller 220 can modify the model 232 by removing material assigned to various pixels of the model, or by generating a new model (e.g., a copy of the model 232) and modifying the new model. The controller 220 can modify the model 232 by evaluating one or more layers of the model 232 before the output device 212 outputs material to generate components (or before the components are irradiated), or while the output device 212 is in use, and deciding whether to adjust the exposure of one or more layers (or pixels adjacent to one or more layers) as described herein.

[0026] The exposure can be adjusted to account for the attenuation of light (for example, based on Lambert-Beer's law), as in the case of System 200 operating with DLP. For example, the attenuation of light can decrease exponentially with distance. The exposure can be proportional to a relationship based on penetration depth and layer size, as defined in Equation 1.

number

[0027] Based on Equation 1, the change in exposure of at least one pixel can be determined for a specific amount of Z correction compared to no Z correction, as defined by Equation 2.

number

[0028] The controller 220 can modify the model 232 based on the target exposure. For example, the target exposure may be proportional to the exposure without Z correction (e.g., the exposure when n=zero), as determined using Equation 2. The target exposure may be between 0.1 and 0.5. The target exposure may be between 0.2 and 0.4. The target exposure may be 0.25. For example, the controller 220 can determine the exposure (e.g., cumulative exposure) of at least one pixel (e.g., cumulative exposure) for one or more candidate values ​​of n (e.g., by iteratively evaluating Equation 2 with increasing values ​​of n) (using Equation 2), compare the exposure to the target exposure, and select a value of n (e.g., number of layers for Z correction) such that the exposure is less than or equal to the target exposure. The selected value may be the minimum value of n such that the exposure is less than or equal to the target exposure. The controller 220 can iteratively modify Model 232 by increasing the magnitude of Z correction (e.g., the number of layers of pixels to be Z-corrected, the distance of pixels away from at least one pixel to be Z-corrected) until the exposure is below the target exposure. The controller 220 can also perform Z correction on a pixel-by-pixel basis, such as applying Z correction to multiple pixels until the exposure of a particular pixel is below the target exposure.

[0029] The controller 220 can modify the model 232 using a selected value of n to generate components by removing the corresponding material (e.g., erosion of the layer, non-output of material at the corresponding location). For example, the controller 220 can identify pixels in the model 232 corresponding to layers with a selected value of n and modify those pixels so that they are not assigned to output material. In this way, the controller 220 can adaptively perform Z correction by determining the amount of Z correction to be performed on any of the pixels on the downward-facing surface based on the exposure to those pixels.

[0030] Figure 3 shows components 300 and 350, which can be generated using system 200, in the xyz coordinate system. Component 300 defines a first hole 304, and component 350 defines two second holes 354. Holes 304 and 354 are susceptible to print-through effects on downward-facing surfaces (e.g., surfaces that become downward-facing during the generation of components 300 and 350).

[0031] Figure 4 shows a cross-section of component 300 (Figure 400) and a cross-section of component 350 (Figure 450). Figures 400 and 450 may correspond to models of components 300 and 350 (e.g., model 232 as described with reference to Figure 2). Figure 400 shows a base (e.g., platform) 404 and multiple layers 408 of component 300 formed to produce component 300, as well as a display 412 depicting pixels corresponding to the first hole 304. Figure 450 shows a base 454 and multiple layers 458 of component 350 formed to produce component 350, as well as a display 462 depicting pixels corresponding to the second hole 354. Figure 400 includes a first pixel 416 of component 300, which may correspond to a downward-facing surface. Figure 450 includes a second pixel 466 of component 350, which may correspond to a downward-facing surface.

[0032] Figure 5 shows a component 300 in which Z correction is performed by not assigning material to multiple layers 504 adjacent to the first pixel 416 (for example, three layers 504 as shown, i.e., n=3), compared to Figure 400. Based on Equation 2, where n=3, h=20μm, and Dp=100μm, the total exposure of the first pixel 416 is approximately 0.251.

[0033] Figure 6 shows Figure 600 of component 350 in which Z correction is performed by not assigning material to multiple layers 604 adjacent to the second pixel 466 (for example, three layers 604 as shown, i.e., n=3), compared to Figure 450. Based on Equation 2, where n=3, h=20μm, and Dp=100μm, the second hole 354 spaced apart from the second pixel 466 contributes to reducing the total exposure of the second pixel 466, so the total exposure of the second pixel 466 is approximately 0.097.

[0034] In an example where the target exposure is 0.25, the system 200 can adjust the number of layers 604 (for example, by assigning or not assigning material to output for specific pixels or layers of pixels in the model 232 of component 350) so that the total exposure of the second pixel 466 is less than the target exposure. For example, in the case of component 350, by modifying the model so that the total exposure is approximately 0.854 for n=0, approximately 0.476 for n=1, and 0.243 for n=2, n=2 can be selected as the number of layers for Z correction so that the total exposure is less than or equal to the target exposure.

[0035] For example, Figure 6 shows a component 350 in which Z correction is adapted (e.g., further adapted) to adjust the total exposure of the second pixel 466 to be less than or equal to the target exposure, by not assigning material to multiple layers 654 adjacent to the second pixel 466 (e.g., two layers as shown, i.e., n=2), compared with Figures 450 and 600. As described above, based on Equation 2, for n=2, h=20μm, and Dp=100μm, the total exposure of the second pixel 466 is approximately 0.243.

[0036] Figure 7 illustrates Method 700 for generating components using adaptive corrections for 3D printing, including, but not limited to, components corresponding to biological tissues such as artificial lung tissue. Method 700 can be performed using various systems and apparatus described herein, such as System 200 and 3D printing system 900. Various aspects of Method 700, such as modifying the model of the component to be produced by 3D printing, can be performed before or during the operation of the 3D printing apparatus. Various aspects of Method 700 can be performed in response to user input or in response to measuring the characteristics of the component to detect print-through.

[0037] In step 705, a model of the component is received. The model can be a computational model in which the component is represented by multiple pixels. Each pixel can correspond to the spatial location of the component (e.g., its position in a 3D coordinate system). Each pixel can be assigned various properties of the component in relation to its spatial location, such as the material to be output to the spatial location in order to form the component.

[0038] In 710, at least one pixel among a plurality of pixels corresponding to the first surface of the component is identified. The at least one pixel may be identified by determining that at least one pixel is adjacent to a region of the model to which one or more pixels in the region have not been assigned material. For example, the first surface may be the surface of a hole in the component. The first surface may be a downward-facing surface (for example, the first surface may be above the region in a model orientation corresponding to how the material is output to form the component).

[0039] In 715, the model is modified. The model can be modified to compensate for print-through of material from a downward-facing surface. For example, the model may be modified to adjust the exposure corresponding to at least one identified pixel. The model can be modified by adjusting the magnitude of the correction (e.g., the number of pixels or layers of pixels adjacent to at least one pixel that are modified so that no material is printed to the pixel or layer of pixels) based on the target exposure. The target exposure can be the maximum exposure threshold. The model can be modified until the total exposure (e.g., cumulative exposure) of at least one identified pixel is less than or equal to the target exposure. The total exposure can be determined not only based on at least one pixel (e.g., a first pixel) but also on at least one second pixel located within a threshold distance from the first pixel (e.g., if another hole is located within a threshold distance from the first pixel).

[0040] In 720, the output device is controlled to generate components based on the modified model. For example, the output device may skip or otherwise avoid outputting material in pixels or layers of pixels that have been adjusted for the modified model, in order to keep the total exposure of at least one pixel below the target exposure.

[0041] Figures 8 and 9 show a 3D printing system 800 that can be used to implement various systems and devices described herein, such as system 200. The 3D printing system may include a platform 802 (e.g., a printing platform) on which components such as three-dimensional objects are formed. Components may include artificial organs (e.g., artificial lungs, artificial hearts, artificial kidneys, artificial livers). The 3D printing system 800 may include an oxygen-soluble liquid 804 (e.g., an oxygen carrier liquid) having a build surface.

[0042] The build surface and platform 802 may define a build area 804 (e.g., a build window) between them. The 3D printing system 800 may include a controller configured to move the platform 802 forward away from the build surface. For example, the controller may lower or raise the platform 802. The controller may be configured to maintain the thickness of the oxygen-inhibiting layer at least 20 μm. For example, the controller may maintain the thickness of the oxygen-inhibiting layer at 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, or 50 μm.

[0043] The system 800 may include a radiation source 806 (e.g., a DLP projector, a projector, a light source, etc.) configured to irradiate the build area 804. The radiation source 806 may be configured to irradiate the build area 804 through an optically transparent material and an oxygen-soluble liquid 804 to form a solid polymer from a photosensitive liquid (e.g., a photosensitive resin, an ink, etc.). The 3D printing system 800 may include at least one pump 808, such as a peristaltic pump, to recirculate the oxygen-soluble liquid 804. The pump 808 may include a positive displacement pump used to pump the oxygen-soluble liquid 804.

[0044] As shown in Figure 9, the platform 502 may include transparent glass 902 (e.g., optically transparent glass, optically transparent material). For example, the transparent glass 902 can support an oxygen-soluble liquid 804. The oxygen-soluble liquid 804 may be placed on the transparent glass 902. The thickness of the transparent glass 902 can be substantially thinner than the thickness of the oxygen-soluble liquid 804.

[0045] Platform 802 may include a high-density oxygen carrier liquid (e.g., an incompressible oxygen carrier liquid) on the transparent glass 802. Platform 802 may include ink 908 (e.g., a photosensitive ink, a photosensitive liquid). The photosensitive liquid may be placed on top of the oxygen-soluble liquid 804. The oxygen-soluble liquid 804 may be placed beneath the ink 908. The density of the oxygen-soluble liquid 804 may be greater than the density of the photosensitive liquid. Platform 802 may include an interface 906 between the oxygen carrier liquid and the photosensitive ink (e.g., an interface between the ink and the PFD). The thickness of the ink 908 may be greater than the thickness of the oxygen-soluble liquid 604. The thickness of the ink 908 may be substantially greater than the thickness of the transparent glass 902.

[0046] Any singular reference in this specification to an implementation or element or operation of a system or method may include implementations containing multiple such elements, and any plural reference in this specification to an implementation or element or operation may include implementations containing only a single element. Singular or plural references are not intended to limit the currently disclosed systems or methods, their components, operations, or elements to one or more configurations. Any reference to an operation or element based on any information, operation, or element may include implementations of that operation or element that are at least partially based on any information, operation, or element.

[0047] As used herein, the terms “substantially” and “about” are used to describe and explain small variations. When used with events or situations, these terms can refer not only to cases where the event or situation occurs exactly, but also to cases where it occurs approximately. When used in combination with numerical values, these terms may refer to a range of variation of that value of ±10% or less, for example, ±5%, ±4%, ±3%, ±2%, ±1%, ±0.5%, ±0.1%, or ±0.05%. When referring to a first numerical value being “substantially” or “approximately” the same as a second numerical value, these terms may refer to a range of variation of the second numerical value of ±10% or less. For example, ±5%, ±4%, ±3%, ±2%, ±1%, ±0.5%, ±0.1%, or ±0.05%.

[0048] It should be noted that the term “exemplary” and its variations used in this specification to describe various embodiments are intended to indicate that such embodiments are possible examples, representations, or illustrations (and such term is not intended to mean that such embodiments are necessarily special or superlative examples).

[0049] As used herein, the term “joining” and its variations mean that two members are joined to each other directly or indirectly. Such joining may be static (e.g., permanent or fixed) or movable (e.g., removable or detachable). Such joining may be achieved by directly joining the two members, by joining the two members with a separate intervening member and any additional intermediate member joined to each other, or by joining the two members with an intervening member formed integrally with one of the two members. If “joining” or its variations are modified by an additional term (e.g., direct joining), the general definition of “joining” provided above is modified by the plain meaning of the additional term (e.g., “direct joining” means that two members are joined without a separate intervening member), resulting in a narrower definition than the general definition of “joining” provided above. Such joining may be mechanical, electrical, or fluid.

[0050] Any embodiment disclosed herein can be combined with any other embodiment, and references to “a certain embodiment,” “several embodiments,” “alternative embodiments,” “various embodiments,” “one embodiment,” etc., are not necessarily mutually exclusive and are intended to indicate that certain features, structures, or characteristics described in relation to an embodiment may be included in at least one embodiment. Not all such terms used herein necessarily refer to the same embodiment. Any embodiment can be combined with any other embodiment, comprehensively or exclusively, in any way consistent with the aspects and embodiments disclosed herein.

[0051] A reference to "or" can be interpreted as comprehensive, so that a term described using "or" can refer to a single term, multiple terms, or all of the terms. A reference to at least one of the connectable term lists can be interpreted as comprehensive "or" referring to one or more, or all of the listed terms. For example, a reference to "at least one of 'A' and 'B'" can include "A" only, "B" only, or both "A" and "B". It can also include elements other than "A" and "B".

[0052] References to the position of elements in this specification (e.g., “top,” “bottom,” “top,” “bottom”) are used simply to describe the orientation of the various elements in the figures. It should be noted that the orientation of the various elements may differ according to other exemplary embodiments, and such variations are intended to be covered by this disclosure.

[0053] While figures and descriptions may illustrate a specific order of method steps, the order of such steps may differ from that illustrated and described unless otherwise specified above. Furthermore, two or more steps may be performed simultaneously or partially simultaneously unless otherwise specified above. Such variations may depend, for example, on the selected software and hardware systems and the designer's choices. All such variations are within the scope of this disclosure. Similarly, software implementations of the described methods can be achieved using standard programming techniques with rule-based logic and other logic to accomplish various connection, processing, comparison, and decision steps.

[0054] The systems and methods described herein can be implemented in other specific forms without departing from their features. The embodiments described above are illustrative and not limiting.

[0055] When reference numerals follow drawings, detailed descriptions, or technical features of claims, these reference numerals are included to enhance the understanding of the drawings, detailed descriptions, and claims. Therefore, neither the reference numerals nor their absence limit the scope of the elements of the claims.

[0056] The systems and methods described herein can be implemented in other specific forms without departing from their features. The embodiments described above are illustrative and not limiting. Accordingly, the scope of the systems and methods described herein is indicated by the appended claims rather than by the foregoing description, and any modifications that fall within the meaning and equivalence of the claims are included therein.

Claims

1. An output device configured to receive at least one material to produce a component, A controller including one or more processors, A model is received that includes multiple pixels representing the aforementioned component. at least one of the plurality of pixels corresponding to the first surface of the component Identify the pixels, The model is modified to adjust the exposure corresponding to at least one pixel by selecting the amount of Z correction for at least one pixel such that the exposure is less than or equal to the target exposure, based on the target exposure. Controlling the operation of the output device so that it generates the component based on the modified model. A controller configured as follows, Additive manufacturing equipment, including [specific component].

2. The additive manufacturing apparatus according to claim 1, wherein the controller is configured to modify the model by applying the amount of Z correction to adjust the exposure amount.

3. The additive manufacturing apparatus according to claim 1, wherein the at least one pixel includes a first pixel, the controller is configured to determine the exposure amount as a cumulative exposure amount based on a plurality of second pixels among the plurality of pixels, and the plurality of second pixels are arranged in a plurality of layers relative to the first pixel.

4. The additive manufacturing apparatus according to claim 1, wherein the at least one pixel is at least one first pixel, and the controller is configured to determine the exposure amount based on at least one second pixel that is within a threshold distance from the at least one first pixel.

5. The additive manufacturing apparatus according to claim 1, wherein the controller is configured to adjust the exposure amount so that the exposure amount is less than or equal to the target exposure amount.

6. The additive manufacturing apparatus according to claim 1, wherein the controller is configured to iteratively modify the model by increasing the amount of Z correction until the exposure amount is less than or equal to the target exposure amount.

7. The additive manufacturing apparatus according to claim 1, wherein the first surface is a downward-facing surface.

8. The additive manufacturing apparatus according to claim 1, wherein the output device is configured to produce the component as a biological tissue component using resin as the material.

9. The additive manufacturing apparatus according to claim 1, wherein the plurality of pixels include a plurality of volume elements (voxels) in a three-dimensional coordinate space.

10. The additive manufacturing apparatus according to claim 1, wherein the at least one pixel includes a first pixel, and the controller is configured to apply Z-correction to a plurality of second pixels among the plurality of pixels until the exposure amount for the first pixel is less than or equal to the target exposure amount.

11. It receives a model containing multiple pixels representing components, Identify at least one pixel among the plurality of pixels corresponding to the first surface of the component, The model is modified to adjust the exposure corresponding to at least one pixel by selecting the amount of Z correction for at least one pixel such that the exposure is less than or equal to the target exposure, based on the target exposure. Control the operation of the output device to generate the component based on the modified model. A system comprising one or more processors configured in such a way.

12. The system according to claim 11, wherein one or more processors are configured to modify the model by applying an amount of Z-correction to adjust the exposure.

13. The system according to claim 11, wherein one or more processors are configured to cause the output device to produce the component using resin.

14. The system according to claim 11, wherein one or more processors are configured to cause the output device to generate the component as a biological tissue component.

15. One or more processors receive a model containing multiple pixels representing components, The one or more processors identify at least one pixel among the plurality of pixels corresponding to the first surface of the component, The model is modified by one or more processors to adjust the exposure amount corresponding to the at least one pixel by selecting an amount of Z correction for the at least one pixel based on the target exposure amount such that the exposure amount is less than or equal to the target exposure amount. The one or more processors control the output device to generate the components based on the modified model. A method that includes the act of doing so.

16. The method according to claim 15, wherein modifying the model includes applying an amount of Z-correction to adjust the exposure.

17. The method according to claim 15, wherein the at least one pixel is at least one first pixel, and the method further comprises the one or more processors determining the exposure amount based on at least one second pixel which is within a threshold distance from the at least one first pixel.

18. The method according to claim 15, further comprising the one or more processors adjusting the exposure amount so that the exposure amount is less than or equal to the target exposure amount.

19. The additive manufacturing apparatus according to claim 1, wherein the target exposure amount is 0.1 or more and 0.5 or less.

20. The additive manufacturing apparatus according to claim 1, wherein the target exposure amount includes a threshold value for the exposure amount of at least one pixel.

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