Thermoelectric device

Abstract

A thermoelectric device according to one embodiment of the present invention includes a fluid-flow section including one side and another side spaced apart from the first side in a first direction, a first thermoelectric element disposed on the one side of the fluid-flow section, and a second thermoelectric element disposed on the other side of the fluid-flow section, the fluid-flow section having a first through hole penetrating from the one side to the other side, and an electric wire electrically connected to the first thermoelectric element passing through the first through hole and electrically connected to the second thermoelectric element.

Description

[Technical Field]

[0001] The present invention relates to a thermoelectric device, and more particularly to a thermoelectric device that utilizes a temperature difference between a low-temperature portion and a high-temperature portion of a thermoelectric element. [Background Art]

[0002] The thermoelectric effect is a phenomenon generated by the movement of electrons and holes inside a material, and refers to direct energy conversion between heat and electricity.

[0003] A thermoelectric element is a general term for elements that utilize the thermoelectric effect, and has a structure in which a P-type thermoelectric material and an N-type thermoelectric material are joined between metal electrodes to form a PN junction pair.

[0004] Thermoelectric elements can be classified into elements that utilize temperature changes in electrical resistance, elements that utilize the Seebeck effect which is a phenomenon in which an electromotive force is generated by a temperature difference, and elements that utilize the Peltier effect which is a phenomenon in which heat absorption or heat generation occurs due to an electric current.

[0005] Thermoelectric elements are widely applied to home appliances, electronic components, communication components and the like. For example, thermoelectric elements can be applied to cooling devices, heating devices, power generation devices and the like. Accordingly, demands for the thermoelectric performance of thermoelectric elements are increasing.

[0006] Recently, there is a need to generate electricity by using high-temperature waste heat generated from engines of automobiles, ships and the like in combination with thermoelectric elements. In this case, a fluid flow section through which a first fluid passes is arranged on the low-temperature portion side of the thermoelectric element, a heatsink is arranged on the high-temperature portion side of the thermoelectric element, and a second fluid having a higher temperature than the first fluid can pass through the heatsink. Accordingly, electricity can be generated by the temperature difference between the low-temperature portion and the high-temperature portion of the thermoelectric element. [Summary of the Invention] [Problem to be Solved by the Invention]

[0007] The technical problem that this invention aims to solve is to provide a thermoelectric device that utilizes the temperature difference between the low-temperature and high-temperature parts of a thermoelectric element. [Means for solving the problem]

[0008] A thermoelectric device according to one embodiment of the present invention includes a fluid flow section including one surface and another surface separated from the first surface in a first direction, a first thermoelectric element disposed on one surface of the fluid flow section, and a second thermoelectric element disposed on the other surface of the fluid flow section, wherein a first through-hole is provided in the fluid flow section that penetrates from the first surface to the other surface, and an electric wire electrically connected to the first thermoelectric element passes through the first through-hole and is electrically connected to the second thermoelectric element.

[0009] The present invention further includes a first guide member disposed on one side of the first thermoelectric element on one side of the fluid flow portion, and a second guide member disposed on the side of the second thermoelectric element on the other side of the fluid flow portion, wherein the first guide member may have a first through hole and a second through hole overlapping in the first direction.

[0010] The area of ​​the second through-hole may be larger than the area of ​​the first through-hole.

[0011] A wire connected to at least one of the first thermoelectric element and the second thermoelectric element may be guided by at least one of the first guide member and the second guide member.

[0012] The fluid-flow section has a plurality of holes that penetrate from one surface to the other and do not overlap with the first thermoelectric element and the second thermoelectric element in the first direction; the first guide member has at least one first coupling hole; the second guide member has at least one second coupling hole; the first guide member and the fluid-flow section are fixed by coupling members located in the at least one first coupling hole and some of the plurality of holes; and the second guide member and the fluid-flow section can be fixed by coupling members located in the at least one second coupling hole and some of the other of the plurality of holes.

[0013] The at least one first bonding hole and the at least one second bonding hole may be arranged so as not to overlap each other in the first direction.

[0014] A fluid inlet for the fluid flow section is located on one side between the aforementioned surface and the other surface, and a fluid outlet for the fluid flow section is located on the other side between the aforementioned surface and the other surface that is opposite to the aforementioned surface. The fluid flow section includes a flow path extending in a second direction from the aforementioned surface to the other surface, and a plurality of heat insulating members spaced apart from each other along the second direction may be arranged on the upper surface between the aforementioned surface and the other surface.

[0015] The upper surface includes a plurality of holes arranged between the plurality of heat insulating members, a shield member is placed on the plurality of heat insulating members, and the shield member and the upper surface can be fixed by connecting members arranged in the shield member and the plurality of holes.

[0016] The aforementioned surface further includes a plurality of holes arranged to be spaced apart along the second direction between the first thermoelectric element and the upper surface, and the plurality of holes included in the upper surface and the plurality of holes included in the aforementioned surface may be arranged to be offset from each other along the second direction.

[0017] The first thermoelectric element includes a first substrate disposed on one surface of the fluid flow section, a first electrode disposed on a first region of the first substrate, a semiconductor structure disposed on the first electrode, a second electrode disposed on the semiconductor structure, and a second substrate disposed on the second electrode. The thermoelectric device further includes a connector portion disposed on a second region adjacent to the first region of the first substrate and electrically connected to the first electrode, and a support member disposed adjacent to the connector portion on the second region, wherein the height of the support member may be greater than the height of the connector portion with respect to the first substrate.

[0018] The wire connected to the connector can be extended through the support member along the second direction to the first guide member.

[0019] The support member includes a first protruding surface that protrudes perpendicular to the first substrate and extends along the second direction, and a second protruding surface that is spaced apart from the first protruding surface in a direction away from the connector portion, protrudes perpendicular to the first substrate, and extends along the second direction, and at least one of the first protruding surface and the second protruding surface may include a bending region that is bent in a direction parallel to the first substrate.

[0020] The shortest distance between the first protruding surface and the second protruding surface may be smaller than the diameter of the electric wire. [Effects of the Invention]

[0021] According to embodiments of the present invention, a thermoelectric device can be obtained that has a simple structure and is easy to assemble, while still being able to accommodate the maximum number of thermoelectric elements within a given space.

[0022] According to embodiments of the present invention, a thermoelectric device with high thermoelectric performance can be obtained by increasing the temperature difference between the high-temperature and low-temperature sections.

[0023] The thermoelectric device according to an embodiment of the present invention can be applied to a power generation device that generates electricity by utilizing the temperature difference between a high-temperature section and a low-temperature section.

[0024] A thermoelectric device according to an embodiment of the present invention can be applied to a Peltier device that cools or heats a specific target such as a fluid. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] [Figure 1] FIG. 1 is a perspective view of a thermoelectric device according to an embodiment of the present invention.

[0026] [Figure 2] FIG. 2 is an exploded perspective view of a thermoelectric device according to an embodiment of the present invention.

[0027] [Figure 3] FIG. 3 is a cross-sectional view of a thermoelectric element according to an embodiment of the present invention.

[0028] [Figure 4] FIG. 4 is a perspective view of a thermoelectric element according to an embodiment of the present invention.

[0029] [Figure 5] FIG. 5 is a perspective view of one surface of a fluid flow portion included in a thermoelectric device according to an embodiment of the present invention.

[0030] [Figure 6] FIG. 6 is a top view showing a plurality of thermoelectric modules and a guide member arranged on one surface of a fluid flow portion included in a thermoelectric device according to an embodiment of the present invention.

[0031] [Figure 7] FIG. 7 is a top view showing a plurality of thermoelectric modules, a guide member and a plurality of support members arranged on one surface of a fluid flow portion included in a thermoelectric device according to an embodiment of the present invention.

[0032] [Figure 8] FIG. 8 is a top view showing a plurality of thermoelectric modules, a guide member, a plurality of support members and a shield member arranged on one surface of a fluid flow portion included in a thermoelectric device according to an embodiment of the present invention.

[0033] [Figure 9] This is a perspective view of a thermoelectric module included in a thermoelectric device according to one embodiment of the present invention.

[0034] [Figure 10] This is a top view of the first substrate of a thermoelectric module included in a thermoelectric device according to one embodiment of the present invention.

[0035] [Figure 11] This is a perspective view of a guide member according to one embodiment of the present invention.

[0036] [Figure 12] This is a perspective view of a support member according to one embodiment of the present invention.

[0037] [Figure 13] This is a cross-sectional view illustrating the arrangement relationship between a support member and a connector in a thermoelectric device according to one embodiment of the present invention.

[0038] [Figure 14] This is a perspective view of a thermoelectric device according to one embodiment of the present invention, with the third shielding member removed. [Modes for carrying out the invention]

[0039] Preferred embodiments of the present invention will be described in detail below with reference to the attached drawings.

[0040] However, the technical concept of the present invention is not limited to the embodiments described, but can be embodied in a variety of different forms, and within the scope of the technical concept of the present invention, one or more of its components can be selectively combined or replaced between embodiments.

[0041] Furthermore, unless explicitly defined, terms used in the embodiments of the present invention (including technical and scientific terms) may be interpreted in a way that is generally understood by a person skilled in the art to which the present invention pertains, and commonly used terms, such as those defined in dictionaries, may be interpreted considering their meaning in the context of the relevant art.

[0042] Furthermore, the terminology used in the embodiments of the present invention is for illustrative purposes only and is not intended to limit the present invention.

[0043] In this specification, singular types may also include plural types unless otherwise specified in the text, and when it says "A and / or at least one of B and C," it may include one or more of all possible combinations of A, B, and C.

[0044] Furthermore, when describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc., may be used.

[0045] Such terminology is merely used to distinguish one component from another, and is not limited by the nature, order, or sequence of the component in question.

[0046] Furthermore, when it is stated that one component is “connected,” “joined,” or “connected” to another component, this may include not only cases where the component is directly connected, joined, or connected to the other component, but also cases where it is “connected,” “joined,” or “connected” by yet another component between that component and the other component.

[0047] Furthermore, when it is stated that something is formed or positioned "above or below" each component, "above or below" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or positioned between the two components. Also, when expressed as "above or below," it can include not only the upward direction but also the downward direction relative to one component.

[0048] Figure 1 is a perspective view of a thermoelectric device according to one embodiment of the present invention, and Figure 2 is an exploded perspective view of a thermoelectric device according to one embodiment of the present invention.

[0049] Referring to Figures 1 and 2, the thermoelectric device 1000 includes a fluid flow section 1100 and a thermoelectric module 1200 positioned on the surface of the fluid flow section 1100.

[0050] A thermoelectric device 1000 according to an embodiment of the present invention can produce electricity by utilizing the temperature difference between a first fluid flowing through the inside of a fluid flow section 1100 and a second fluid passing outside the fluid flow section 1100. Multiple thermoelectric devices 1000 may be arranged in parallel at predetermined intervals to form a power generation system.

[0051] The first fluid flowing into the fluid-flow section 1100 may be water, but is not limited to water; it may be any type of fluid with cooling properties. The temperature of the first fluid flowing into the fluid-flow section 1100 may be less than 100°C, preferably less than 50°C, and more preferably less than 40°C, but is not limited to water; it may be any fluid with a lower temperature than the second fluid. The temperature of the first fluid discharged after passing through the fluid-flow section 1100 may be higher than the temperature of the first fluid flowing into the fluid-flow section 1100.

[0052] According to an embodiment of the present invention, a plurality of thermoelectric modules 1200 may be arranged on the first surface 1110 and the second surface 1120 facing the first surface 1110 of the fluid flow section 1100. A first fluid may flow from one side between the first surface 1110 and the second surface 1120 toward the other side facing that side between the first surface 1110 and the second surface 1120. For this purpose, a fluid inlet may be arranged on one side and a fluid outlet on the other side. A second fluid may flow from the third surface 1130, which is the upper surface between the first surface 1110 and the second surface 1120, toward the fourth surface 1140, which is the lower surface between the first surface 1110 and the second surface 1120. For the sake of explanation, in this specification, the direction from the first surface 1110 to the second surface 1120 may be referred to as the first direction, the direction through which the first fluid passes may be referred to as the second direction, and the direction through which the second fluid passes may be referred to as the third direction, but this specification is not limited thereto.

[0053] To facilitate the inflow and outflow of the first fluid and to support the fluid flow section 1100, a first connecting member 1800-1 and a second connecting member 1800-2 may be arranged on the fluid inlet side and the fluid outlet side of the fluid flow section 1100, respectively. In this specification, the first connecting member 1800-1 and the second connecting member 1800-2 may be mixed with a first expanding member 1800-1 and a second expanding member 1800-2, respectively. Alternatively, in this specification, the first connecting member 1800-1 and the second connecting member 1800-2 may be mixed with a first expanding block 1800-1 and a second expanding block 1800-2, respectively.

[0054] Meanwhile, the second fluid passes outside the fluid flow section 1100, for example, through the heat sink of a thermoelectric module 1200 located outside the fluid flow section 1100. The second fluid may, but is not limited to, waste heat generated from an engine of an automobile, ship, etc. For example, the temperature of the second fluid may be 100°C or higher, preferably 200°C or higher, and more preferably 220°C to 250°C, but is not limited to this, and may be a fluid with a higher temperature than the temperature of the first fluid.

[0055] In this specification, the temperature of the first fluid flowing through the fluid-flow section 1100 is described as being lower than the temperature of the second fluid passing through the heat sink of the thermoelectric module 1200 located outside the fluid-flow section 1100. Accordingly, in this specification, the fluid-flow section 1100 may be referred to as a duct or cooling section. However, embodiments of the present invention are not limited thereto, and the temperature of the first fluid flowing through the fluid-flow section 1100 may be higher than the temperature of the second fluid passing through the heat sink of the thermoelectric module 1200 located outside the fluid-flow section 1100.

[0056] According to embodiments of the present invention, the thermoelectric module 1200 includes a thermoelectric element and a heat sink disposed on the thermoelectric element. The thermoelectric element according to embodiments of the present invention may have the structure of the thermoelectric element 100 illustrated in Figures 3-4.

[0057] Referring to Figures 3 and 4, the thermoelectric element 100 includes a first substrate 110, a first electrode 120, a P-type thermoelectric leg 130, an N-type thermoelectric leg 140, a second electrode 150, and a second substrate 160.

[0058] The first electrode 120 is positioned between the first substrate 110 and the lower bottom surfaces of the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140, and the second electrode 150 is positioned between the second substrate 160 and the upper bottom surfaces of the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140. Accordingly, multiple P-type thermoelectric legs 130 and multiple N-type thermoelectric legs 140 are electrically connected by the first electrode 120 and the second electrode 150. A pair of P-type thermoelectric legs 130 and N-type thermoelectric legs 140 positioned between the first electrode 120 and the second electrode 150 and electrically connected can form a unit cell.

[0059] For example, when a voltage is applied to the first electrode 120 and the second electrode 150 through lead wires 181 and 182, the substrate through which current flows from the P-type thermoelectric leg 130 to the N-type thermoelectric leg 140 due to the Peltier effect absorbs heat and acts as a cooling element, while the substrate through which current flows from the N-type thermoelectric leg 140 to the P-type thermoelectric leg 130 heats up and acts as a heating element. Alternatively, when a temperature difference is applied between the first electrode 120 and the second electrode 150, the charge within the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 moves due to the Seebeck effect, and electricity may be generated.

[0060] Here, the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 may be bismuth telluride (Bi-Te) thermoelectric legs containing vizmus (Bi) and tellurium (Te) as the main raw materials. The P-type thermoelectric leg 130 may be a bismuth telluride (Bi-Te) thermoelectric leg containing at least one of antimony (Sb), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), tellurium (Te), vizmus (Bi), and indium (In). For example, a P-type thermoelectric leg 130 contains 99 to 99.999 wt% of the main raw material Bi-Sb-Te per 100 wt% of total weight, and can contain at least one of nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), and indium (In) in amounts of 0.001 to 1 wt%. An N-type thermoelectric leg 140 may be a bismuth telluride (Bi-Te) thermoelectric leg containing at least one of selenium (Se), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), tellurium (Te), vizmus (Bi), and indium (In). For example, the N-type thermoelectric leg 140 contains 99 to 99.999 wt% of Bi-Se-Te, the main raw material, per 100 wt% of total weight, and can contain at least one of nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), and indium (In) in amounts of 0.001 to 1 wt%.

[0061] P-type thermoelectric legs 130 and N-type thermoelectric legs 140 can be formed in bulk or laminated form. Generally, bulk-type P-type thermoelectric legs 130 or bulk-type N-type thermoelectric legs 140 can be obtained through a process in which thermoelectric material is heat-treated to produce an ingot, the ingot is crushed and sieved to obtain powder for thermoelectric legs, this is sintered, and the sintered body is cut. In this case, the P-type thermoelectric legs 130 and N-type thermoelectric legs 140 may be polycrystalline thermoelectric legs. Thus, if the P-type thermoelectric legs 130 and N-type thermoelectric legs 140 are polycrystalline thermoelectric legs, their strength may be increased. The laminated P-type thermoelectric leg 130 or the laminated N-type thermoelectric leg 140 can be obtained through a process in which a paste containing thermoelectric material is applied to a sheet-like substrate to form unit members, and then the unit members are laminated and cut.

[0062] In this case, the pair of P-type thermoelectric legs 130 and N-type thermoelectric legs 140 may have the same shape and volume, or they may have different shapes and volumes. For example, because the electrical conductivity characteristics of the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 are different, the height or cross-sectional area of ​​the N-type thermoelectric leg 140 may be formed to be different from that of the P-type thermoelectric leg 130.

[0063] In this case, the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140 can have a cylindrical shape, a polygonal prism shape, an elliptical prism shape, or the like.

[0064] In this specification, thermoelectric legs may be referred to as thermoelectric structures, semiconductor elements, semiconductor structures, etc.

[0065] The performance of a thermoelectric element according to one embodiment of the present invention can be expressed by the figure of merit (ZT). The figure of merit (ZT) can be shown as shown in mathematical formula 1.

[0066]

number

[0067] Here, α is the Seebeck coefficient [V / K] and σ is the electrical conductivity [S / m], and α 2 σ is the power factor (W / mK). 2 ]) where T is the temperature and k is the thermal conductivity [W / mK]. k can be expressed as a·cp·ρ, where a is the thermal diffusivity [cm 2 [J / gK] is the density [g / cm³], cp is the specific heat [J / gK], and ρ is the density [g / cm³]. 3 ]

[0068] To obtain the thermoelectric performance index of a thermoelectric element, a Z-meter can be used to measure the Z value (V / K), and the measured Z value can be used to calculate the thermoelectric performance index (ZT).

[0069] Here, the first electrode 120, positioned between the first substrate 110 and the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140, and the second electrode 150, positioned between the second substrate 160 and the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140, each contain at least one of copper (Cu), silver (Ag), aluminum (Al), and nickel (Ni), and can have a thickness of 0.01 mm to 0.3 mm. If the thickness of the first electrode 120 or the second electrode 150 is less than 0.01 mm, its function as an electrode will be reduced, potentially resulting in lower electrical conductivity. If it exceeds 0.3 mm, the increased resistance may lead to lower conductivity.

[0070] The first substrate 110 and the second substrate 160, which face each other, may be metal substrates, and their thickness may be between 0.1 mm and 1.5 mm. If the thickness of the metal substrate is less than 0.1 mm or exceeds 1.5 mm, the heat dissipation characteristics or thermal conductivity may become excessively high, which may reduce the reliability of the thermoelectric element. Furthermore, if the first substrate 110 and the second substrate 160 are metal substrates, an insulating layer 170 may be further formed between the first substrate 110 and the first electrode 120, and between the second substrate 160 and the second electrode 150, respectively. The insulating layer 170 may include a material having a thermal conductivity of 1 to 20 W / mK. In this case, the insulating layer 170 may be a resin composition containing at least one of epoxy resin and silicon resin and an inorganic substance, a layer made of a silicon composite containing silicon and an inorganic substance, or an aluminum oxide layer. Here, the inorganic substance may be at least one of oxides, nitrides, and carbides of aluminum, boron, silicon, etc.

[0071] In this case, the first substrate 110 and the second substrate 160 may be formed to be of different sizes. That is, the volume, thickness, or area of ​​one of the first substrate 110 and the second substrate 160 may be formed to be larger than the volume, thickness, or area of ​​the other. Here, the thickness may be the thickness in the direction from the first substrate 110 toward the second substrate 160, and the area may be the area in the direction perpendicular to the direction from the first substrate 110 toward the second substrate 160. Accordingly, the heat absorption or heat dissipation performance of the thermoelectric element can be improved. Preferably, the volume, thickness, or area of ​​the first substrate 110 may be formed to be larger than at least one of the volume, thickness, or area of ​​the second substrate 160. In this case, if the first substrate 110 is placed in a high-temperature region for the Seebeck effect, applied to a heat-generating region for the Peltier effect, or if a sealing member for protection of the thermoelectric element from the external environment described later is placed on the first substrate 110, the volume, thickness, or area of ​​the first substrate 110 may be made even larger than that of the second substrate 160. In this case, the area of ​​the first substrate 110 can be formed in a range of 1.2 to 5 times the area of ​​the second substrate 160. If the area of ​​the first substrate 110 is formed to be less than 1.2 times that of the second substrate 160, the effect on improving the heat transfer efficiency is not significant, and if it exceeds 5 times, the heat transfer efficiency will decrease significantly, and it may become difficult to maintain the basic shape of the thermoelectric module.

[0072] Furthermore, a heat dissipation pattern, such as a textured pattern, may be formed on at least one of the surfaces of the first substrate 110 and the second substrate 160. This can improve the heat dissipation performance of the thermoelectric element. If the textured pattern is formed on the surface that contacts the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140, the bonding characteristics between the thermoelectric leg and the substrate may also be improved.

[0073] Although not shown in the diagram, a sealing member may be further placed between the first substrate 110 and the second substrate 160. The sealing member may be placed on the sides of the first electrode 120, the P-type thermoelectric leg 130, the N-type thermoelectric leg 140, and the second electrode 150 between the first substrate 110 and the second substrate 160. Accordingly, the first electrode 120, the P-type thermoelectric leg 130, the N-type thermoelectric leg 140, and the second electrode 150 can be sealed from external moisture, heat, contamination, etc.

[0074] Referring again to Figures 1 and 2, multiple thermoelectric modules 1200 can be arranged on the first surface 1110 and the second surface 1120 of the fluid flow section 1100.

[0075] As described above, each thermoelectric element includes a first substrate 110 positioned in contact with the fluid flow section 1100, a plurality of first electrodes 120 positioned on the first substrate 110, a plurality of thermoelectric legs 130, 140 positioned on the plurality of first electrodes 120, a plurality of second electrodes 150 positioned on the plurality of thermoelectric legs 130, 140, and a second substrate 160 positioned on the plurality of second electrodes 150, with a heat sink positioned on the second substrate 160. In this case, the first substrate of the thermoelectric element positioned on the fluid flow section 1100 may be a metal substrate, and the metal substrate may be bonded to the surface of the fluid flow section 1100 by a thermal interface material (TIM, not shown). Because metal substrates have excellent heat transfer performance, heat transfer between the thermoelectric element and the fluid flow section 1100 is facilitated. Furthermore, if the metal substrate and the fluid-flow section 1100 are bonded together by a thermal interface material (TIM), heat transfer between the metal substrate and the fluid-flow section 1100 may not be hindered. Here, the metal substrate may be, but is not limited to, a copper substrate, an aluminum substrate, or a copper-aluminum substrate.

[0076] Each of the multiple thermoelectric modules 1200 may include a connector for extracting the generated electricity to the outside or for applying electricity to use it as a Peltier. According to an embodiment of the present invention, the support member 1400 can be positioned around the connector to maintain a uniform bonding force between the thermoelectric module 1200 and the fluid flow section 1100, and to protect the wires connected to the connector.

[0077] Furthermore, according to embodiments of the present invention, a shield member 1500 may be further arranged to prevent moisture or contaminants from penetrating into the multiple thermoelectric modules 1200. The shield member 1500 may include a first shield member 1510 arranged on the first surface 1110 of the fluid flow section 1100 and a second shield member 1520 arranged on the second surface 1120 of the fluid flow section 1100. The first shield member 1510 and the second shield member 1520 may each be arranged on the second substrate of the thermoelectric element. In this case, through holes 1512 and 1522 are formed in the first shield member 1510 and the second shield member 1520, respectively, so that the second fluid can pass through the heat sink, and the edges of the through holes 1512 and 1522 are arranged on the second substrate of the thermoelectric element so that the heat sink can be exposed through the through holes 1512 and 1522. According to this, the inside of the thermoelectric element can be protected from external contaminants, moisture, and the second fluid, while the second fluid can pass directly through the heat sink, thus enabling efficient heat exchange between the second fluid and the heat sink. According to one embodiment of the present invention, the shield member 1500 may further include a third shield member 1530 positioned on the third surface 1130 of the fluid flow section 1100 and a fourth shield member 1540 positioned on the fourth surface 1140 of the fluid flow section 1100. Since the second fluid can flow from the third surface 1130 to the fourth surface 1140 of the fluid flow section 1100, insulating members may further be positioned between the third surface 1130 and the third shield member 1530 and between the fourth surface 1140 and the fourth shield member 1540, respectively. According to this, the first fluid flowing inside the fluid flow section 1100 and the second fluid flowing outside the fluid flow section 1100 are insulated from each other, thereby improving the thermoelectric performance of the thermoelectric element.

[0078] On the other hand, according to an embodiment of the present invention, guide members 1700 may be further arranged on the first surface 1110 and the second surface 1120 of the fluid flow section 1100. The guide members 1700 can serve to guide the wires connected to the thermoelectric module 1200 to the outside. The guide members 1700 may be arranged on the sides of the thermoelectric module 1200 on the first surface 1110 and the second surface 1120 of the fluid flow section 1100, respectively.

[0079] Figure 5 is a top view of one side of the fluid flow section included in one embodiment of the present invention; Figure 6 is a top view of one side of the fluid flow section included in one embodiment of the present invention with multiple thermoelectric modules and guide members arranged thereon; Figure 7 is a top view of one side of the fluid flow section included in one embodiment of the present invention with multiple thermoelectric modules, guide members and multiple support members arranged thereon; and Figure 8 is a top view of one side of the fluid flow section included in one embodiment of the present invention with multiple thermoelectric modules, guide members, multiple support members and shield members arranged thereon. Figure 10 is a top view showing the arrangement of the components, Figure 11 is a perspective view of the guide member according to one embodiment of the present invention, Figure 12 is a perspective view of the support member according to one embodiment of the present invention, Figure 13 is a cross-sectional view illustrating the arrangement relationship between the support member and the connector in the thermoelectric device according to one embodiment of the present invention, and Figure 14 is a perspective view of the thermoelectric device according to one embodiment of the present invention with the third shield member removed.

[0080] Referring to Figures 5 to 10, the thermoelectric module 1200 and the guide member 1700-1 are arranged on the first surface 1100 of the fluid flow section 1100. In the following, for the sake of explanation, only the thermoelectric module 1200 and the guide member 1700-1 arranged on the first surface 1110 of the fluid flow section 1100 are described, but the explanation is not limited to this, and the same structure can be applied to the second surface 1120, which is the opposite surface of the first surface 1110. Regarding the fluid flow section 1100 and the thermoelectric module 1200, redundant explanations will be omitted for content that is the same as what was explained with reference to Figures 1 to 4.

[0081] According to an embodiment of the present invention, the first substrate 1212 of the thermoelectric module 1200 is placed on the first surface 1110 of the fluid flow section 1100. At this time, the first substrate 1212 may be placed in direct contact with the first surface 1110 of the fluid flow section 1100, or indirectly in contact through a heat transfer material (thermal interface material, TIM) or the like. The first substrate 1212 may be the first substrate 110 described with reference to Figures 1 to 4. Accordingly, with regard to the first substrate 1212, redundant explanations will be omitted for content that is the same as that described with reference to Figures 1 to 4 for the first substrate 110.

[0082] As shown in Figures 9 to 10, the first substrate 1212 of the thermoelectric module 1200 may include a first region A1 and a second region A2. In this case, the first region A1 may contain a plurality of first electrodes, a plurality of thermoelectric legs, a plurality of second electrodes, a second substrate, and a heat sink 1220, while the second region A2, which is one side of the first region A1, may contain connector portions 210 and 220 connected to the first electrodes. Here, the plurality of first electrodes, a plurality of thermoelectric legs, a plurality of second electrodes, and a second substrate may be the plurality of first electrodes 120, a plurality of thermoelectric legs 130 and 140, a plurality of second electrodes 150, and a second substrate 160 as described with reference to Figures 1 to 4. Figure 9 shows an example in which the second substrate and heat sink 1220 are divided into four sections, but the design is not limited to this. One second substrate and heat sink 1220 may be arranged on one first substrate, or the second substrate and heat sink may be divided into two or more sections on one first substrate.

[0083] According to an embodiment of the present invention, as shown in Figures 6 to 8, the fluid flow section 1100 and the thermoelectric module 1200 can be connected by a coupling member 1300. For this purpose, a first groove S11 can be formed on the first surface 1110 of the fluid flow section 1100 so as to overlap with the first substrate 1212 of the thermoelectric module 1200 in a first direction, i.e., from the first surface 1110 toward the second surface 1120 (see Figure 5), and a through hole S12 corresponding to the first groove S11 can be formed in the first region A1 of the first substrate 1212 of the thermoelectric module 1200. In addition, a second substrate (not shown) of the thermoelectric module 1200 and a through hole S13 corresponding to the first groove S11 and the through hole S12 can also be formed in the heat sink 1220. According to this, as shown in Figures 6 to 8, the first coupling member 1310 is coupled to the first groove S11, the through hole S12, and the through hole S13, and as a result, the fluid flow section 1100 and the thermoelectric module 1200 can be coupled.

[0084] On the other hand, according to an embodiment of the present invention, a second groove S21 may be further formed on the first surface 1110 of the fluid flow section 1100 (see Figure 5), and a through hole S22 corresponding to the second groove S21 may be further formed in the second region A2 of the first substrate 1212 of the thermoelectric module 1200. In addition, a support member 1400 is further placed in the second region A2 of the first substrate 1212, and as shown in Figure 7, the support member 1400 is connected to the second groove S21 and the through hole S22 through a second connecting member 1320, thereby fixing the fluid flow section 1100, the thermoelectric module 1200, and the support member 1400.

[0085] According to this, not only the first region A1 but also the second region A2 of the first substrate 1212 of the thermoelectric module 1200 can be coupled to the fluid flow section 1100, so that the entire first substrate 1212 of the thermoelectric module 1200 can have a uniform bonding force with the fluid flow section 1100, and heat can be uniformly distributed over the entire first substrate 1212. In particular, as shown in Figure 7, when the first substrate 1212 of the thermoelectric module 1200 and the fluid flow section 1100 are coupled using the support member 1400, the fastening torque of the second coupling member 1320 can be increased by applying the support member 1400. As a result, the possibility of the second coupling member 1320 loosening is low even under vibration conditions, so that the thermoelectric module 1200 can be attached to the fluid flow section 1100 even more firmly.

[0086] On the other hand, referring to Figure 5, the fluid flow section 1100 may have a fluid inlet 1152 located on one side 1150 between the first surface 1110 and the second surface 1120, and a fluid outlet located on the other side between the first surface 1110 and the second surface 1120.

[0087] Referring to Figures 5 to 8, according to an embodiment of the present invention, holes S31 and S41 can be formed on the first surface 1110 of the fluid flow section 1100 so as not to overlap with the thermoelectric module 1200. The holes S31 and S41 can be formed to penetrate from the first surface 1110 to the second surface 1120 of the fluid flow section 1100. For example, hole S31 may be a hole for fastening a guide member 1700-1, and hole S41 may be a hole for fastening a shield member 1500. According to an embodiment of the present invention, a heat transfer material TIM can be placed between the fluid flow section 1100 and the thermoelectric module 1200 to maximize the heat transfer performance between the fluid flow section 1100 and the thermoelectric module 1200. Conversely, the guide member 1700-1 or the shield member 1500 can be placed on the fluid flow section 1100 without the heat transfer material TIM and then fastened using a coupling member. Accordingly, the holes S31 and S41 for fastening the guide member 1700-1 or the shield member 1500 may be formed to penetrate the first surface 1110 and the second surface 1120 of the fluid flow section 1100.

[0088] According to an embodiment of the present invention, a hole S51 may be further formed on the first surface 1110 of the fluid flow section 1100 so as not to overlap with the thermoelectric module 1200. The hole S51 may be formed to penetrate from the first surface 1110 to the second surface 1120 of the fluid flow section 1100 and may be a hole for wires connected to the thermoelectric module 1200 to pass through. For this purpose, the hole S51 may have a larger area than the other holes S31 and S41, and the hole S51 may be positioned within a horizontal range with respect to the second region A2 of the second substrate 1212 of the thermoelectric module 1200. Accordingly, wires connected to the connector sections 210 and 220 and supported by the support member 1400 may be positioned to extend to the hole S51, and wires electrically connected to the thermoelectric module 1200 on the first surface 1110 may pass through the hole S51 and be electrically connected to the thermoelectric module 1200 on the second surface 1120.

[0089] According to embodiments of the present invention, the holes S51 can be arranged symmetrically on one side 1150 and the other side of the fluid flow section 1100, and the electric wire W can pass through the hole S51 on the one side 1150 or the hole S51 on the other side.

[0090] On the other hand, referring to Figures 1, 2, and 6-9, the thermoelectric device 1000 includes a fluid flow section 1100 and thermoelectric modules 1200 disposed on the surface of the fluid flow section 1100. The thermoelectric modules 1200 may include a thermoelectric element 1210 and a heat sink 1220 disposed on the thermoelectric element 1210. According to embodiments of the present invention, guide members 1700 may be disposed on the sides of the multiple thermoelectric modules 1200. When the direction in which the multiple thermoelectric modules 1200 are arranged is designated as the second direction, the guide members 1700 may be arranged in the second direction relative to the multiple thermoelectric modules 1200.

[0091] For example, a pair of guide members 1700-1 and 1700-2 may be arranged on one side of the first surface 1110 and the second surface 1120 of the fluid flow section 1100 so as to face each other. Furthermore, a pair of guide members 1700-1 and 1700-2 may also be arranged on the other side of the first surface 1110 and the second surface 1120 of the fluid flow section 1100 so as to face each other.

[0092] For example, the first fluid may flow into one side of the first surface 1110 and the second surface 1120 of the fluid-flow section 1100, and the first fluid may be discharged from the other side of the first surface 1110 and the second surface 1120 of the fluid-flow section 1100.

[0093] When the first guide member 1700-1 is positioned on one side of the first surface 1110 of the fluid-flow section 1100 and on the side of the thermoelectric module 1200, the second guide member 1700-2 may be positioned on one side of the second surface 1120 of the fluid-flow section 1100 and on the side of the thermoelectric module 1200, facing the first guide member 1700-1 with the fluid-flow section 1100 in between. Similarly, when the second guide member 1700-2 is positioned on the other side of the first surface 1110 of the fluid-flow section 1100 and on the side of the thermoelectric module 1200, the first guide member 1700-1 may be positioned on the other side of the second surface 1120 of the fluid-flow section 1100 and on the side of the thermoelectric module 1200, facing the second guide member 1700-2 with the fluid-flow section 1100 in between.

[0094] Figure 11(a) shows the first surface of the first guide member, Figure 13(b) shows the second surface of the first guide member, Figure 13(c) shows the first surface of the second guide member, and Figure 13(d) shows the second surface of the second guide member. Here, the second surfaces 1700-1B and 1700-2B of the first guide member 1700-1 and the second guide member 1700-2 are surfaces positioned to face the fluid flow section 1100, respectively, and the first surfaces 1700-1A and 1700-2A of the first guide member 1700-1 and the second guide member 1700-2 are the opposite surfaces of the second surfaces 1700-1B and 1700-2B of the first guide member 1700-1 and the second guide member 1700-2, respectively.

[0095] According to an embodiment of the present invention, a guide member 1700 is placed on the side of the thermoelectric module 1200 to reduce the empty space and guide the electric wire connected to the thermoelectric module 1200. Here, the guide member 1700 may mean a structure that does not function as a thermoelectric element. Accordingly, in this specification, the guide member may be referred to as a dummy module, dummy member, or guide module. As a result, the empty space on the side of the thermoelectric module 1200 on the fluid flow section 1100 can be minimized, thereby reducing the possibility of moisture or a second fluid penetrating into the empty space.

[0096] According to embodiments of the present invention, grooves 1710 can be formed on the second surfaces 1700-1B and 1700-2B of each guide member 1700-1 and 1700-2, and electric wires connected to connector portions 210 and 220 can be guided along the grooves 1710. For this purpose, the grooves 1710 include a first groove 1712 extending in a second direction so as to be horizontal with respect to the connector portions 210 and 220, and a second groove 1714 extending in a third direction, and electric wires can be led out along the first groove 1712 and the second groove 1714. In this way, when grooves 1710 are formed on the second surfaces 1700-1B and 1700-2B of each guide member 1700-1 and 1700-2, exposure of the electric wires to high temperatures can be minimized, and the possibility of the electric wires detaching from the guide member 1700 in a frequently vibrating environment can be minimized.

[0097] On the other hand, the wire connected to the thermoelectric module 1200 may extend in a second direction along the first groove 1712 and in a third direction along the second groove 1714. Accordingly, the wire connected to the thermoelectric module 1200 may be bent between the first groove 1712 and the second groove 1714. To accommodate the bending area of ​​the wire, through holes 1720 may be formed between the first groove 1712 and the second groove 1714 of each guide member 1700-1, 1700-2.

[0098] According to an embodiment of the present invention, as shown in Figure 5, a hole S51 may be formed in the fluid flow section 1100, penetrating from the first surface 1110 to the second surface 1120 of the fluid flow section 1100. The hole S51 does not overlap with the thermoelectric module 1200 and can be a hole through which an electric wire connected to the thermoelectric module 1200 passes. Through the hole S51, the thermoelectric module 1200 located on the first surface 1110 of the fluid flow section 1100 and the thermoelectric module 1200 located on the second surface 1120 of the fluid flow section 1100 can be electrically connected.

[0099] In this case, the hole S51 of the fluid flow section 1100 may be formed to overlap in the first direction with the through-hole 1720 of each guide member 1700-1, 1700-2, and the area of ​​the through-hole 1720 of each guide member 1700-1, 1700-2 may be larger than the area of ​​the hole S51 of the fluid flow section 1100. This reduces spatial constraints when the electric wire is bent in the through-hole 1720 of each guide member 1700-1, 1700-2 or when it passes through the hole S51. In one embodiment, the electric wire W can pass through the hole S51 on one side of the fluid flow section 1100 and be pulled out to the outside through the guide member on the other side. Alternatively, the electric wire W can pass through the hole S51 on the other side of the fluid flow section 1100 and be pulled out to the outside through the guide member on one side. If the holes S51 in the fluid flow section 1100 are formed to overlap in the first direction with the through-holes 1720 of the guide members 1700-1 and 1700-2, the design freedom for the connection and exit direction of the electric wire W can be increased, and since two types of guide members are arranged in four areas, the manufacturing of the guide members can be made easier.

[0100] On the other hand, according to an embodiment of the present invention, each guide member 1700-1, 1700-2 can be fixed to the fluid flow section 1100 using a third connecting member. For this purpose, a plurality of holes S31 are formed in the fluid flow section 1100 so as to penetrate from the first surface 1110 to the second surface 1120 of the fluid flow section 1100, and a hole S32-1 corresponding to a part S31-1 of the plurality of holes S31 is formed in the first guide member 1700-1, so that the third connecting member can pass through the holes S32-1 and S31 to connect the first guide member 1700-1 and the fluid flow section 1100. Similarly, a hole S31 is formed in the fluid-flow section 1100 so as to penetrate from the first surface 1110 to the second surface 1120 of the fluid-flow section 1100, and a hole S32-2 corresponding to the remaining part S31-2 of the hole S31 is formed in the second guide member 1700-2, so that the third coupling member can pass through the holes S32-2 and S31-2 to connect the second guide member 1700-2 and the fluid-flow section 1100. Because the first guide member 1700-1 and the second guide member 1700-2 are connected on both sides of the fluid-flow section 1100, the part S31-1 and the remaining part S31-2 of the hole formed in the fluid-flow section 1100 may not overlap with each other in the first direction. Furthermore, since the hole S32-1 of the first guide member 1700-1 must correspond to a part S31-1 of the hole in the fluid flow section 1100, and the hole S32-2 of the second guide member 1700-2 must correspond to the remaining part S31-2 of the hole in the fluid flow section 1100, the hole S32-1 of the first guide member 1700-1 and the hole S32-2 of the second guide member 1700-2 can be formed at different positions from each other.

[0101] On the other hand, referring to Figure 7, a support member 1400 is positioned on the first substrate 1212 of the thermoelectric module 1200 so as to be adjacent to the connector portions 210 and 220, and the electric wires W connected to the connector portions 210 and 220 can be extended through the support member 1400 along the second direction to the guide member 1700-1. In this configuration, the support member 1400 can maintain a uniform bonding force between the thermoelectric module 1200 and the fluid flow portion 1100 and protect the conductors connected to the connector portions 210 and 220.

[0102] On the other hand, Figure 12(a) shows the first surface 1400A of the support member 1400 according to one embodiment of the present invention, and Figure 12(b) shows the second surface 1400B of the support member 1400 according to one embodiment of the present invention. The second surface 1400B of the support member 1400 is the surface facing the first substrate 1212 of the thermoelectric module 1200, and the first surface 1400A of the support member 1400 may be the surface opposite to the second surface 1400B of the support member 1400.

[0103] Referring to Figures 6, 9, 10, 12(a), and 12(b), the multiple through-holes S23 are formed on both sides of the support member 1400, and the second connecting member 1320 can be connected to the multiple through-holes S23, the through-holes S22 in the first substrate 1212 formed to correspond to the multiple through-holes S23, and the grooves S12 formed in the fluid flow section 1100 to correspond to the multiple through-holes S23. As a result, both sides of the second region A2 of the first substrate 1212 can be supported uniformly and in a balanced manner, and thermal deformation of the first substrate 1212 can be prevented.

[0104] Here, the support member 1400 can include an insulating material, such as a plastic material. This allows the support member 1400 to insulate the first substrate 1212, which contains metal, from the second coupling member 1320, thereby improving the voltage withstand performance of the thermoelectric module 1200.

[0105] Furthermore, if the support member 1400 includes a plastic material, the support member 1400 can be easily molded into a variety of sizes and shapes. More specifically, the support member 1400 may be made of a plastic material that can be used at high temperatures, such as PPS (polyphenylene sulfide). This prevents the problem of the support member 1400 being deformed by the high temperature of the second fluid.

[0106] On the other hand, the support member 1400 includes a first side surface 1410 that is closest to one side of the thermoelectric element 1210 and a second side surface 1420 that faces the first side surface 1410. The second side surface 1420 of the support member 1400 may be positioned along the edge of the first substrate 1212. Here, the edge of the first substrate 1212 may be positioned in the second region A2 of the four edges of the first substrate 1212, and may be an edge in a direction parallel to the direction in which the multiple connector portions 210, 220 are positioned. In this way, when the second side surface 1420 of the support member 1400 is positioned along the edge of the first substrate 1212, the support member 1400 pressurizes the edge of the first substrate 1212, thereby preventing the edge of the thermoelectric module 1200 from floating away from the fluid flow portion 1100. At this time, a groove 1422 recessed toward the first side surface 1410 may be formed on the second side surface 1420 of the support member 1400. According to this, thermal stress is applied evenly to both sides of the support member 1400, thus preventing distortion of the support member 1400 due to an imbalance in thermal stress.

[0107] More specifically, referring to Figures 12(a) to 12(b) and Figure 13, the support member 1400 may include a first protruding surface 1401 that protrudes in a first direction and extends along a second direction, and a second protruding surface 1402 that is spaced away from the first protruding surface 1401 in a direction away from the connector portions 210 and 220, protrudes in a first direction, and extends along a second direction. According to an embodiment of the present invention, the wires connected to the connector portions 210 and 220 may be extended through the space between the first protruding surface 1401 and the second protruding surface 1402 toward the guide member 1700-1.

[0108] In this case, at least one of the first protruding surface 1401 and the second protruding surface 1402 may include a bending region 1403 that is bent in a direction parallel to the first substrate 1212. Accordingly, the shortest distance L3 between the first protruding surface 1401 and the second protruding surface 1403 may be smaller than the diameter of the electric wire. This minimizes the possibility of the electric wire (00) detaching from the support member 1400, even in environments with a lot of vibration, as long as no physical external force is applied.

[0109] According to an embodiment of the present invention, as shown in Figure 12(b), a plurality of grooves 1400G can be arranged in the region of the second surface 1400B of the support member 1400 that corresponds to the second protruding surface 1402. This allows for uniform pressure to be applied to the region of the first substrate 1212 corresponding to the second protruding surface 1402, while reducing the overall material and weight of the support member 1400.

[0110] As described above, multiple thermoelectric modules 1200 are arranged on the fluid flow section 1100, and support members 1400 are placed on the sides of the connector sections 210 and 220. The multiple thermoelectric modules 1200, support members 1400, and fluid flow section 1100 are connected using coupling members, while the multiple thermoelectric modules 1200 are connected to the electric wire. Subsequently, shield members 1500 may be further arranged to prevent moisture or contaminants from penetrating into the multiple thermoelectric modules 1200. As described above, the shield members 1500 include a first shield member 1510 arranged on the first surface 1110 of the fluid flow section 1100, a second shield member 1520 arranged on the second surface 1120 of the fluid flow section 1100, a third shield member 1530 arranged on the third surface 1130 of the fluid flow section 1100, and a fourth shield member 1540 arranged on the fourth surface 1140 of the fluid flow section 1100.

[0111] Referring to Figure 13, the connector portions 210, 220 and the support member 1400 are arranged adjacent to each other on the first substrate 1212 of the thermoelectric module 1200, and the first shield member 1510 may be arranged to cover the connector portion (00) and the support member 1400. In this case, the height of the support member 1400 may be higher than the height of the connector portions 210, 220 with respect to the first substrate 1212 of the thermoelectric module 1200. With this arrangement, the first shield member 1510 made of metal can contact the upper surface of the support member 1400, but can be separated from the connector portions 210, 220, thereby improving the voltage withstand characteristics of the thermoelectric element 1210 and preventing heat generated in the connector portions 210, 220 from being conducted through the first shield member 1510.

[0112] On the other hand, according to an embodiment of the present invention, a heat insulating member can be placed on the surface of the fluid flow section 1100. Referring to Figure 14, since the second fluid can flow from the third surface 1130 to the fourth surface 1140 of the fluid flow section 1100, a heat insulating member 2000 can be further placed between the third surface 1130 of the fluid flow section 1100 and the third shield member 1530. According to an embodiment of the present invention, a plurality of heat insulating members 2000 can be placed spaced apart from each other between the third surface 1130 of the fluid flow section 1100 and the third shield member 1530. Furthermore, the third surface 1130 of the fluid flow section 1100 has a plurality of holes S61, and the plurality of holes S61 can be placed between the plurality of heat insulating members 2000.

[0113] According to this, the third shield member 1530 and the third surface 1130 of the fluid flow section 1100 can be fixed by connecting members arranged in the third shield member 1530 and the multiple holes S61 with multiple heat insulating members 2000 in between. This makes it possible to minimize the number of third shield members 1530 while simultaneously ensuring fastening force and heat insulation between the third shield member 1530 and the fluid flow section 1100.

[0114] On the other hand, according to an embodiment of the present invention, the plurality of holes S61 arranged on the third surface 1130 of the fluid flow section 1100 can be arranged to be offset from each other along the second direction from the plurality of holes S41 arranged on the first surface 1110 of the fluid flow section 1100 to connect the first shield member 1510. In this case, the connecting members passing through the holes S41 to connect the first shield member 1510 and the first surface of the fluid flow section 1100 and the connecting members passing through the holes S61 to connect the third shield member 1530 and the third surface of the fluid flow section 1100 do not overlap with each other, thus making fastening easier.

[0115] Throughout this specification, thermoelectric elements 100 and 1210 are described as including a first substrate 110, a first electrode 120, a P-type thermoelectric leg 130, an N-type thermoelectric leg 140, a second electrode 150, and a second substrate 160. However, the definition of thermoelectric elements 100 and 1210 is not limited thereto, and may also mean a thermoelectric element including a first electrode 120, a P-type thermoelectric leg 130, an N-type thermoelectric leg 140, a second electrode 150, and a second substrate 160, which is arranged on the first substrate 110.

[0116] The power generation system can generate electricity using heat sources such as ships, automobiles, power plants, and geothermal energy, and multiple power generation devices can be arranged to efficiently concentrate the heat sources. In this case, each power generation device can improve the bonding force between the thermoelectric module and the fluid flow section, thereby improving the cooling performance of the low-temperature part of the thermoelectric element. Consequently, the efficiency and reliability of the power generation device can be improved, and the fuel efficiency of transportation equipment such as ships and vehicles can be improved. Therefore, in the shipping and transportation industries, transportation costs can be reduced and an environmentally friendly industrial environment can be created, and when applied to manufacturing industries such as steel mills, material costs can be reduced.

[0117] While preferred embodiments of the present invention have been described above with reference to those skilled in the art, a person skilled in the art will understand that the present invention can be modified and altered in various ways without departing from the spirit and scope of the invention as set forth in the following claims.

Claims

1. A fluid flow section including one surface and another surface separated from the aforementioned surface in a first direction, A first thermoelectric element is arranged on one surface of the fluid flow section. A second thermoelectric element is positioned on the other side of the fluid flow section. A first guide member is positioned on one side of the fluid flow section, and on the side of the first thermoelectric element, and The fluid flow portion includes a second guide member positioned on the side surface of the second thermoelectric element, The fluid flow section is provided with a first through-hole that penetrates from one surface to the other surface. The wire electrically connected to the first thermoelectric element passes through the first through-hole and is electrically connected to the second thermoelectric element. A thermoelectric device in which grooves for guiding the electric wire are provided on both sides of the first guide member, the side facing the fluid flow section, and on both sides of the second guide member, the side facing the fluid flow section.

2. The thermoelectric device according to claim 1, wherein the first guide member is provided with the first through hole and a second through hole that overlaps in the first direction.

3. The thermoelectric device according to claim 2, wherein the area of ​​the second through-hole is larger than the area of ​​the first through-hole.

4. The fluid flow section has a plurality of holes that penetrate from one surface to the other and do not overlap with the first thermoelectric element and the second thermoelectric element in the first direction. The first guide member is provided with at least one first coupling hole, The second guide member is provided with at least one second coupling hole, The first guide member and the fluid flow section are fixed by coupling members arranged in at least one first coupling hole and some of the plurality of holes. The thermoelectric device according to claim 2, wherein the second guide member and the fluid flow section are fixed by coupling members disposed in at least one second coupling hole and other parts of the plurality of holes.

5. The thermoelectric device according to claim 4, wherein the at least one first bonding hole and the at least one second bonding hole are arranged so as not to overlap each other in the first direction.

6. A fluid inlet for the fluid flow section is located on one side between the aforementioned surface and the other surface, and a fluid outlet for the fluid flow section is located on the other side between the aforementioned surface and the other surface, opposite to the aforementioned surface. The fluid flow section includes a flow path extending in a second direction from one side toward the other side. The thermoelectric device according to claim 1, wherein a plurality of heat insulating members are arranged on the upper surface between the one surface and the other surface, spaced apart from each other along the second direction.

7. The upper surface includes a plurality of holes arranged between the plurality of heat insulating members, A shielding member is placed on the plurality of heat insulating members. The thermoelectric device according to claim 6, wherein the shield member and the upper surface are fixed by coupling members arranged in the shield member and the plurality of holes.

8. The aforementioned surface further includes a plurality of holes arranged to be spaced apart along a second direction between the first thermoelectric element and the upper surface, The thermoelectric device according to claim 7, wherein the plurality of holes included in the upper surface and the plurality of holes included in the one surface are arranged to be offset from each other along the second direction.

9. The first thermoelectric element includes a first substrate disposed on one surface of the fluid flow section, a first electrode disposed on a first region of the first substrate, a semiconductor structure disposed on the first electrode, a second electrode disposed on the semiconductor structure, and a second substrate disposed on the second electrode. The thermoelectric device is arranged on a second region adjacent to the first region of the first substrate and further includes a connector portion electrically connected to the first electrode, and a support member arranged adjacent to the connector portion on the second region. The electric wire connected to the connector extends through the support member along the second direction to the first guide member. The thermoelectric device according to claim 2, wherein the height of the support member is higher than the height of the connector portion, with respect to the first substrate.

10. The thermoelectric device according to claim 9, wherein the support member includes a first protruding surface that protrudes perpendicular to the first substrate and is arranged to extend along the second direction, and a second protruding surface that is spaced apart from the first protruding surface in a direction away from the connector portion, protrudes perpendicular to the first substrate, and is arranged to extend along the second direction, and at least one of the first protruding surface and the second protruding surface includes a bending region that is bent in a direction parallel to the first substrate.

11. The support member includes a first protruding surface that protrudes in a direction perpendicular to the first substrate and extends along the second direction, and a second protruding surface that is spaced apart from the first protruding surface in a direction away from the connector portion, protrudes in a direction perpendicular to the first substrate, and extends along the second direction. The thermoelectric device according to claim 9, wherein the shortest distance between the first protruding surface and the second protruding surface is smaller than the diameter of the electric wire.

12. The thermoelectric device according to claim 1, wherein the groove portion includes a first groove extending along a second direction perpendicular to the first direction and a second groove extending along a third direction perpendicular to both the first and second directions.

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