Mask assembly and method for manufacturing the same, apparatus for manufacturing a display device, and method for manufacturing a display device.

Abstract

To provide a mask assembly, a method of manufacturing the mask assembly, an apparatus for manufacturing a display device, and a method of manufacturing the display device.SOLUTION: A mask assembly of the present disclosure includes a mask sheet. The mask sheet includes: a first region including at least one or more first pattern holes; a second region including at least one or more second pattern holes; and a projection disposed on the inner surfaces of the first pattern holes or the second pattern holes and projecting into one of the inner surfaces of the first pattern holes and the second pattern holes. The inner surfaces of the first pattern holes are different from the inner surfaces of the second pattern holes.SELECTED DRAWING: Figure 11B

Description

[Technical Field]

[0001] The present invention relates to a mask assembly, a method for manufacturing the same, a manufacturing apparatus for a display device, and a method for manufacturing a display device. [Background technology]

[0002] Mobile electronic devices are widely used. In addition to small electronic devices like mobile phones, tablet PCs (personal computers) have become widely used as portable electronic devices in recent years. Such mobile electronic devices include display devices to provide users with visual information, such as images or videos, in order to support a variety of functions.

[0003] In recent years, as other components for driving display devices have become smaller, the proportion of display devices in electronic devices has been steadily increasing, and structures that can be bent to have a predetermined angle while remaining flat have also been developed. Such a display device may have pixels arranged in various locations, each having a different resolution. In this case, the performance of the display device depends on the form of the mask assembly used to deposit organic material onto such pixels. Generally, to manufacture a display device that includes display areas with different resolutions, a separate mask assembly corresponding to each display area is fabricated and used.

[0004] However, when mask assemblies are manufactured separately in this way, not only are manufacturing costs high, but the alignment of each mask assembly with the substrate is not precise, making it difficult to manufacture a display device of the desired quality. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2007-141847 [Overview of the Initiative] [Problems that the invention aims to solve]

[0006] The present invention has been made in view of the problems of the above-mentioned conventional display devices, and the object of the present invention is to provide a mask assembly capable of manufacturing a display device having a precise pattern via a single mask assembly, a method for manufacturing the mask assembly, a device for manufacturing the display device, and a method for manufacturing the display device. [Means for solving the problem]

[0007] A display device according to one embodiment includes a substrate including a first display area including a transparent area and a second display area arranged to surround at least a part of the first display area; a first pixel arranged in the first display area and including a first pixel electrode, a first intermediate layer, and a first counter electrode; and a second pixel arranged in the second display area and including a second pixel electrode, a second intermediate layer, and a second counter electrode, wherein each of the first intermediate layer and the second intermediate layer includes a portion with a constant thickness and a section with a variable thickness, and the first length of the section with a variable thickness in the first intermediate layer is different from the second length of the section with a variable thickness in the second intermediate layer.

[0008] It is preferable that the first length is shorter than the second length, or that the second length is shorter than the first length. Preferably, the resolution of the image provided in the first display area is different from the resolution of the image provided in the second display area. Preferably, the substrate further includes a component that is arranged on one surface of the substrate so as to correspond to the first display area and includes an electronic element that emits or receives light. It is preferable that the light transmittance of the first display area and the light transmittance of the second display area are different from each other. Preferably, the size of the planar shape of the first intermediate layer is greater than or equal to the size of the planar shape of the second intermediate layer.

[0009] A mask assembly according to one aspect of the present invention, which is made to achieve the above object, is a mask assembly including a mask sheet, wherein the mask sheet comprises: a first region including at least one or more first pattern holes; a second region including at least one or more second pattern holes; and a protruding portion disposed on an inner surface of the first pattern hole or the second pattern hole and protruding into an interior of one of the first pattern hole or the second pattern hole, wherein the inner surface of the first pattern hole and the inner surface of the second pattern hole are different from each other.

[0010] Preferably, the protruding portion includes a first protruding portion that protrudes from an inner surface of the first pattern hole into an interior of the first pattern hole. Preferably, a thickness of the first region and a thickness of the second region are the same as each other or different from each other. Preferably, a planar size of the second pattern hole formed on one surface of the second region is equal to or larger than a planar size of the first pattern hole formed on one surface of the first region extended from the one surface of the second region. Preferably, in the mask sheet, a plurality of reference holes are disposed at an edge of the second region. Preferably, a shape of the first pattern hole and a shape of the second pattern hole on a plane parallel to one surface of the mask sheet are different from each other.

[0011] A method for manufacturing a mask assembly according to one aspect of the present invention, which is made to achieve the above object, is characterized by comprising the steps of: disposing a first photoresist such that a first opening is provided on a first surface of a base material; disposing a second photoresist such that a second opening and a third opening are provided on a second surface of the base material; injecting an etchant into the interior of the first opening to etch a part of the first surface of the base material; and injecting an etchant into the interiors of the first opening and the second opening to etch a part of the second surface of the base material, thereby forming a first pattern hole and a second pattern hole penetrating the base material.

[0012] Preferably, a width of the second opening is larger than a width of the first opening. Preferably, a protruding portion that protrudes from an inner surface of the second pattern hole into an interior of the second pattern hole is disposed inside the first pattern hole. Preferably, a distance from the first surface to the protruding portion and a distance from the second surface to the protruding portion are different from each other. Preferably, the method further comprises a step of removing the first photoresist. Preferably, the method further comprises a step of removing the second photoresist.

[0013] A method for manufacturing a mask assembly according to another aspect of the present invention, which is made to achieve the above object, comprises the steps of: disposing a first photoresist having a first opening located in a first region of a base material on a first surface of the base material; disposing a second photoresist having a second opening corresponding to the first opening on a second surface of the base material; spraying an etching solution into the first opening to etch a portion of the first surface of the base material; spraying an etching solution into the second opening to form a first pattern hole penetrating through the base material; and irradiating a laser beam to a second region adjacent to the first region on the second surface of the base material to form a second pattern hole penetrating through the base material.

[0014] Preferably, a shape of the first pattern hole and a shape of the second pattern hole on a plane parallel to the first surface or the second surface are different from each other. Preferably, an area of the first pattern hole and an area of the second pattern hole on a plane parallel to the first surface or the second surface are different from each other. Preferably, the number of the first pattern holes per the same area and the number of the second pattern holes per the same area are different from each other. Preferably, the method further comprises a step of removing the first photoresist. Preferably, the method further comprises a step of removing the second photoresist. The step of forming the second pattern hole preferably includes a step of forming the second pattern hole such that the width of the second pattern hole in the direction perpendicular to the thickness direction of the base material increases from the first surface to the second surface. Preferably, the second photoresist further includes a third opening formed to correspond to the entire second region, and the process further includes the step of spraying an etching solution into the third opening to etch a portion of the second surface of the base material. Preferably, the method further includes the step of irradiating an etching surface formed on the second surface of the base material corresponding to the third opening with a laser beam to form a second pattern hole that penetrates the base material. Preferably, the second photoresist further includes a plurality of fourth openings arranged in the second region and spaced apart from each other, and further comprises the step of spraying an etching solution into the interior of the fourth openings to etch a portion of the second surface of the base material. The step of forming the second pattern hole preferably includes the step of irradiating an etching surface formed on the second surface of the base material corresponding to the fourth opening with a laser beam to form a second pattern hole that penetrates the base material. Preferably, the second photoresist further includes a plurality of fifth openings located at the edge of the second region, and further comprises the step of forming at least two or more reference holes by spraying an etching solution into the interior of the fifth openings to etch a portion of the second surface of the base material. It is preferable to further include a step of aligning the base material using the reference hole before irradiating it with a laser beam.

[0015] A device for manufacturing a display device according to one aspect of the present invention, made to achieve the above objective, comprises a chamber, a mask assembly disposed inside the chamber, and a deposition source disposed opposite the mask assembly and supplying a deposition material to a display substrate, wherein the mask assembly includes a mask sheet through which the deposition material supplied from the deposition source passes, and the mask sheet includes a first region including at least one first pattern hole, a second region including at least one second pattern hole, and a projection disposed on the inner surface of one of the first pattern holes or the second pattern hole and projecting into the interior of one of the first pattern hole or the second pattern hole, wherein the inner surfaces of the first pattern hole and the second pattern hole are different from each other.

[0016] Preferably, the protruding portion includes a first protruding portion that protrudes from the inner surface of the first pattern hole into the interior of the first pattern hole. It is preferable that the thickness of the first region and the thickness of the second region are the same or different from each other. Preferably, the planar size of the entrance portion of the first pattern hole formed on one surface of the first region is greater than or equal to the planar size of the entrance portion of the second pattern hole formed on one surface of the second region which extends from one surface of the first region. The mask sheet preferably includes a plurality of reference holes located at the edge of the first region or the edge of the second region. Preferably, the thickness of the mask sheet in the second region, specifically the thickness in the region surrounding the second pattern hole, is thinner than the thickness in the first region, and the thickness in the region between adjacent second pattern holes is the same as the thickness in the first region. Preferably, the width of the second pattern hole, which is perpendicular to the thickness direction of the mask sheet, is formed to increase from one side of the mask sheet to the other. Preferably, the shapes of the first pattern holes and the second pattern holes on a plane parallel to one surface of the mask sheet are different from each other. Preferably, the areas of the first pattern holes and the areas of the second pattern holes on a plane parallel to one surface of the mask sheet are different from each other. It is preferable that the number of the first pattern holes and the second pattern holes per unit area are different from each other. Preferably, the mask sheet has a plurality of reference holes arranged at the edge of the second region.

[0017] A method for manufacturing a display device according to one aspect of the present invention, made to achieve the above objective, comprises the steps of: arranging and aligning a display substrate and a mask assembly inside a chamber; and supplying a deposition material from a deposition source to the display substrate by passing the mask assembly through it, wherein the mask assembly includes a mask sheet through which the deposition material supplied from the deposition source passes, and the mask sheet includes a first region including at least one first pattern hole, a second region including at least one second pattern hole, and a projection disposed on the inner surface of one of the first pattern hole or the second pattern hole and projecting into the interior of one of the first pattern hole or the second pattern hole, wherein the inner surfaces of the first pattern hole and the second pattern hole are different from each other.

[0018] Preferably, the protruding portion includes a first protruding portion that protrudes from the inner surface of the first pattern hole into the interior of the first pattern hole. It is preferable that the thickness of the first region and the thickness of the second region are the same or different from each other. Preferably, the planar size of the second pattern hole formed on one surface of the second region is greater than or equal to the planar size of the entrance portion of the first pattern hole formed on one surface of the first region that extends from the surface of the second region. Preferably, the mask sheet has a plurality of reference holes arranged at the edge of the second region.

[0019] A method for manufacturing a display device according to one embodiment comprises the steps of forming a first intermediate layer on a first display area of ​​a display substrate and forming a second intermediate layer on a second display area of ​​the display substrate, wherein each of the first intermediate layer and the second intermediate layer includes a portion with a constant thickness and a section with a variable thickness, and the first length of the section with a variable thickness of the first intermediate layer is different from the second length of the section with a variable thickness of the second intermediate layer.

[0020] It is preferable that the first length is shorter than the second length, or that the second length is shorter than the first length. Preferably, the resolution of the image provided in the first display area is different from the resolution of the image provided in the second display area. Preferably, the process further includes the step of arranging a component that includes an electronic element that emits or receives light, which is placed on one surface of the display substrate so as to correspond to the first display area. It is preferable that the light transmittance of the first display area and the light transmittance of the second display area are different from each other. Preferably, the size of the planar shape of the first intermediate layer is greater than or equal to the size of the planar shape of the second intermediate layer. It is preferable that the thickness of the section in the first intermediate layer where the thickness is constant and the thickness of the section in the second intermediate layer where the thickness is constant are the same. [Effects of the Invention]

[0021] The display device according to the present invention makes it possible to realize a precise image. According to the mask assembly, its manufacturing method, the apparatus for manufacturing a display device, and the method for manufacturing a display device according to the present invention, it is possible to deposit a vapor-deposited material onto a substrate in a precise pattern. Furthermore, according to the mask assembly, its manufacturing method, the apparatus for manufacturing a display device, and the method for manufacturing a display device according to the present invention, it is possible to manufacture a display device that includes display areas with different resolutions. Furthermore, according to the method for manufacturing a mask assembly according to the present invention, it is possible to form pattern holes having different sizes and shapes on a single mask sheet. Moreover, even when forming pattern holes having different sizes and shapes on a single mask sheet, deformation of the mask sheet can be minimized, and the shape of each pattern hole can be precisely manufactured. [Brief explanation of the drawing]

[0022] [Figure 1] This is a schematic perspective view of a display device according to one embodiment of the present invention. [Figure 2] This is a cross-sectional view showing the schematic configuration of a display device according to one embodiment of the present invention. [Figure 3] This is a schematic plan view showing the configuration of a display panel according to one embodiment of the present invention. [Figure 4] This is an equivalent circuit diagram of the pixels of a display panel according to one embodiment of the present invention. [Figure 5] This is an equivalent circuit diagram of the pixels of a display panel according to one embodiment of the present invention. [Figure 6] This is a schematic arrangement diagram showing the pixel circuit of a pixel according to one embodiment of the present invention. [Figure 7] This is a cross-sectional view taken along lines I-I' and II-II' in Figure 6. [Figure 8] This is a cross-sectional view showing the schematic configuration of a manufacturing apparatus for a display device according to one embodiment of the present invention. [Figure 9] Figure 8 is a perspective view showing the mask assembly. [Figure 10A] This is a schematic plan view showing a partial configuration of the mask sheet and support frame of a mask assembly according to one embodiment of the present invention. [Figure 10B] This is a schematic plan view showing a partial configuration of the mask sheet and support frame of a mask assembly according to one embodiment of the present invention. [Figure 11A] This is a plan view showing the pixel arrangement of a display device according to one embodiment of the present invention. [Figure 11B]This is a plan view showing a portion of the first mask sheet used during the manufacturing of the first main pixel and the first auxiliary pixel shown in Figure 11A. [Figure 11C] This is a plan view showing a portion of the second mask sheet used during the manufacturing of the second main pixel and the second auxiliary pixel shown in Figure 11A. [Figure 11D] Figure 11A is a plan view showing a portion of the third mask sheet used during the manufacturing of the third main pixel and the third auxiliary pixel. [Figure 12] This is a plan view showing the pixel arrangement of a display device according to another embodiment of the present invention. [Figure 13] This is a plan view showing the pixel arrangement of a display device according to yet another embodiment of the present invention. [Figure 14] This is a plan view showing the pixel arrangement of a display device according to yet another embodiment of the present invention. [Figure 15A] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to one embodiment of the present invention. [Figure 15B] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to one embodiment of the present invention. [Figure 15C] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to one embodiment of the present invention. [Figure 15D] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to one embodiment of the present invention. [Figure 15E] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to one embodiment of the present invention. [Figure 15F] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to one embodiment of the present invention. [Figure 16A] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to another embodiment of the present invention. [Figure 16B] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to another embodiment of the present invention. [Figure 16C] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to another embodiment of the present invention. [Figure 16D] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to another embodiment of the present invention. [Figure 16E] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to another embodiment of the present invention. [Figure 16F] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to another embodiment of the present invention. [Figure 17A] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to yet another embodiment of the present invention. [Figure 17B] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to yet another embodiment of the present invention. [Figure 17C] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to yet another embodiment of the present invention. [Figure 17D] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to yet another embodiment of the present invention. [Figure 17E] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to yet another embodiment of the present invention. [Figure 17F] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to yet another embodiment of the present invention. [Figure 17G] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to yet another embodiment of the present invention. [Figure 18A] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to yet another embodiment of the present invention. [Figure 18B] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to yet another embodiment of the present invention. [Figure 18C] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to yet another embodiment of the present invention. [Figure 18D] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to yet another embodiment of the present invention. [Figure 18E]This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to yet another embodiment of the present invention. [Figure 18F] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to yet another embodiment of the present invention. [Figure 19] This figure shows a schematic configuration of a laser processing apparatus according to one embodiment of the present invention. [Figure 20A] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to yet another embodiment of the present invention. [Figure 20B] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to yet another embodiment of the present invention. [Figure 20C] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to yet another embodiment of the present invention. [Figure 20D] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to yet another embodiment of the present invention. [Figure 20E] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to yet another embodiment of the present invention. [Figure 20F] This is a schematic cross-sectional view illustrating the manufacturing sequence of a mask sheet according to yet another embodiment of the present invention. [Figure 21] This is a schematic perspective view showing a display device according to another embodiment of the present invention. [Modes for carrying out the invention]

[0023] Next, specific examples of embodiments for carrying out the display device, mask assembly, method for manufacturing the same, and apparatus for manufacturing the display device, as well as the method for manufacturing the display device, will be described with reference to the drawings.

[0024] The present invention can be subjected to various transformations and may have a variety of embodiments, but specific embodiments are illustrated in the drawings and described in detail in the detailed description. The effects, features, and methods for achieving them of the present invention will become clearer with reference to the embodiments described in detail below, along with the drawings. However, the present invention is not limited to the embodiments disclosed below and can be embodied in a variety of forms.

[0025] The embodiments of the present invention will be described in detail below with reference to the attached drawings. When describing with reference to the drawings, identical or corresponding components will be denoted by the same reference numerals, and redundant explanations related thereto will be omitted. In the following embodiments, terms such as "first" and "second" are used not in an restrictive sense, but for the purpose of distinguishing one component from another. In the following embodiments, a singular expression includes plural expressions unless the context clearly indicates otherwise. In the following embodiments, terms such as “includes” or “having” mean that the features or components described in the specification are present, and do not preclude the possibility that one or more other features or components may be added. In the following embodiments, when a part such as a membrane, region, or component is located on or above another part, this includes not only cases where it is directly above the other part, but also cases where another membrane, region, component, etc., is interposed between them. In the drawings, the size of the components may be exaggerated or reduced for the sake of explanation. For example, the size and thickness of each component shown in the drawings are arbitrarily shown for the sake of explanation, so the present invention is not necessarily limited to what is shown in the drawings. In the following embodiments, the x, y, and z axes are not limited to the three axes on a Cartesian coordinate system, but are interpreted in a broader sense that includes them. For example, the x, y, and z axes may be orthogonal to each other, or they may not be orthogonal to each other and point in different directions. If a particular embodiment can be manifested in a different way, a specific sequence of steps may also be performed in a different order than that described. For example, two steps described consecutively may be performed substantially simultaneously, or they may proceed in the reverse order of the description.

[0026] Figure 1 is a schematic perspective view of a display device according to one embodiment of the present invention. Referring to Figure 1, the display device DD includes a display area DA that embodies the image and a peripheral area PA that does not embody the image.

[0027] The display area DA includes a first display area DA1 and a second display area DA2, which have different resolutions and are arranged adjacent to each other. For example, the resolution of the first display area DA1 is lower than the resolution of the second display area DA2. In another embodiment, the resolution of the first display area DA1 is higher than the resolution of the second display area DA2. In this case, the resolution of each display area is also determined by the spacing between the centers of adjacent pixels located in each display area, the size of the pixels, the total area of ​​pixels per unit area of ​​each display area, and / or the number of pixels per unit area of ​​each display area. In other words, in each display area, a display area with a lower resolution has a longer distance between the centers of adjacent pixels, or fewer pixels per unit area (or the same area), compared to a display area with an even higher resolution.

[0028] Alternatively, the total area of ​​pixels arranged per unit area (or the same area) is smaller in the display area with lower resolution than in other display areas. In the following, for the sake of clarity, we will focus on explaining in detail the case where the resolution of the first display area DA1 is lower than the resolution of the second display area DA2. The light transmittance of the first display area DA1 is different from that of the second display area DA2. For example, the light transmittance of one of the first display area DA1 or the second display area DA2 will be higher than the light transmittance of the other one of the first display area DA1 or the second display area DA2. In the following, for the sake of clarity, we will focus on explaining in detail the case where the light transmittance of the first display area DA1 is higher than that of the second display area DA2.

[0029] The first display area DA1 and the second display area DA2, as described above, can be arranged in a variety of configurations. For example, a portion of the frame of the first display area DA1 is located inside the second display area DA2, while another portion of the frame of the first display area DA1 meets with the surrounding area PA. In another embodiment, the first display area DA1 is located inside the second display area DA2, and the frame of the first display area DA1 is surrounded by the second display area DA2. In the following explanation, for the sake of clarity, the first display area DA1 will be described in detail, focusing primarily on the case where it is located within the second display area DA2.

[0030] The first display area DA1 and / or the second display area DA2 are also areas where components such as sensors that utilize infrared light, visible light, or sound are placed below them, as will be described later with reference to Figure 2. In the following, for the sake of clarity, the component will be described in detail, focusing primarily on the case where it is placed in the first display area DA1. The second display area DA2 is arranged with multiple main pixels PXm, which emit light, and through such light, provide the main image. The first display area DA1 includes a transparent area TA through which light and / or sound that is output from the component to the outside or traveling from the outside towards the component can pass. In one embodiment of the present invention, when infrared light is transmitted through the first display area DA1, the light transmittance may be about 10% or more, and more preferably 20% or more, 25% or more, 50% or more, 85% or more, or 90% or more.

[0031] In this embodiment, a plurality of auxiliary pixels PXa are arranged in the first display area DA1, and a predetermined image is provided by utilizing the light emitted from the plurality of auxiliary pixels PXa. The image provided in the first display area DA1 is an auxiliary image and may have a lower resolution than the image provided in the second display area DA2. In other words, the first display area DA1 includes a transparent area TA through which light and / or sound can pass, but the number of auxiliary pixels PXa that can be arranged per unit area may be less than the number of main pixels PXm arranged per unit area in the second display area DA2.

[0032] In another embodiment, the total area of ​​auxiliary pixels PXa arranged in a unit area of ​​the first display area DA1 is smaller than the total area of ​​main pixels PXm arranged in a unit area of ​​the second display area DA2. In yet another embodiment, the distance between the centers of adjacent auxiliary pixels PXa located in the first display area DA1 is greater than the distance between the centers of adjacent main pixels PXm located in the second display area DA2. In such cases, the auxiliary pixel PXa and the main pixel PXm, whose resolutions are being compared to each other, emit light of the same color.

[0033] In the following description, an organic light-emitting display device will be used as an example of a display device DD according to one embodiment of the present invention, but the display device of the present invention is not limited thereto. Other embodiments may utilize a variety of display devices, such as inorganic electroluminescence displays and quantum dot light-emitting displays.

[0034] In Figure 1, the first display area DA1 is shown to be positioned on one side (upper right side) of the rectangular second display area DA2, but the present invention is not limited thereto. It goes without saying that the shape of the second display area DA2 can be circular, elliptical, or polygonal, such as a triangle or pentagon, and the position and number of the first display areas DA1 can also be varied.

[0035] Figure 2 is a cross-sectional view showing a schematic configuration of a display device according to one embodiment of the present invention. Figure 2 corresponds to a cross-section obtained by cutting along the line A-A' in Figure 1. Referring to Figure 2, the display device DD includes a display panel 2 containing display elements, and a component 3 located below the display panel 2 and corresponding to the first display area DA1. The display panel 2 includes a substrate 100, a display element layer 200 arranged on the substrate 100, and a thin film sealing layer 300 as a sealing member for sealing the display element layer 200. Furthermore, the display panel 2 may further include a lower protective film 175 positioned at the bottom of the substrate 100.

[0036] The substrate 100 may contain glass or polymer resin. The polymer resin may include polymer resins such as polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate (PET), polyphenylene sulfide, polyarylate, polyimide (PI), polycarbonate, or cellulose acetate propionate. The substrate 100 containing the polymer resin may have flexible, rollable, or bendable properties. The substrate 100 may have a multilayer structure including a layer containing the aforementioned polymer resin and an inorganic layer (not shown).

[0037] The display element layer 200 includes a circuit layer containing a thin-film transistor (TFT), an organic light-emitting diode (OLED) as a display element, and an insulating layer (IL) between them. The second display area DA2 is arranged with a main pixel PXm, which includes a thin-film transistor TFT and an organic light-emitting diode OLED connected thereto. The first display area DA1 is arranged with an auxiliary pixel PXa, which includes a thin-film transistor TFT and an organic light-emitting diode OLED connected thereto, and wiring (not shown) electrically connected to the main pixel PXm and the auxiliary pixel PXa is arranged thereto. Furthermore, the first display area DA1 is configured to include thin-film transistor TFTs and a transparent area TA where no pixels are located. The transmission region TA can be understood as the region through which light / signals emitted from component 3 or incident on component 3 are transmitted.

[0038] Component 3 is located in the first display area DA1. Component 3 is an electronic element that utilizes light and sound. For example, component 3 could be a sensor that receives and utilizes light, such as an infrared sensor; a sensor that emits light or sound to sense and measure distance or recognize fingerprints; a small lamp that emits light; or a speaker that emits sound. It goes without saying that electronic elements that utilize light can use light in a variety of wavelength ranges, such as visible light, infrared light, and ultraviolet light. The number of components 3 placed in the first display area DA1 may be multiple. For example, as component 3, a light-emitting element and a light-receiving element may be provided together in a single first display area DA1. Alternatively, a single component 3 may simultaneously include both a light-emitting unit and a light-receiving unit.

[0039] The thin film encapsulation layer 300 includes at least one inorganic encapsulation layer and at least one organic encapsulation layer. In relation to this, Figure 2 shows the first inorganic sealing layer 310 and the second inorganic sealing layer 330, and the organic sealing layer 320 between them. The first inorganic sealing layer 310 and the second inorganic sealing layer 330 may contain one or more inorganic insulators selected from aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. The organic encapsulation layer 320 may contain polymer-based materials. Polymer-based materials may include polyethylene terephthalate (PET), polyethylene naphthalate, polycarbonate, polyimide (PI), polyethylene sulfonate, polyoxymethylene, polyarylate, hexamethyldisiloxane, acrylic resins (e.g., polymethyl methacrylate, polyacrylic acid, etc.), or any combination thereof.

[0040] The lower protective film 175 is attached to the bottom of the substrate 100 and serves to support and protect the substrate 100. The lower protective film 175 is provided with an opening 175OP corresponding to the first display area DA1. By providing an opening 175OP in the lower protective film 175, the light transmittance of the first display area DA1 can be improved. The lower protective film 175 may comprise polyethylene terephthalate (PET) or polyimide (PI).

[0041] The area of ​​the first display area DA1 can be larger than the area where component 3 is placed. In Figure 2, the areas of the first display area DA1 and the opening 175OP are shown to be the same; however, the area of ​​the opening 175OP provided in the lower protective film 175 may be the same as the area of ​​the first display area DA1. For example, the area of ​​the opening 175OP may be smaller than the area of ​​the first display area DA1.

[0042] Although not shown in the diagram, the display panel 2 may further contain components such as an input sensing member for sensing touch input, a polarizer and retarder, or an anti-reflective member including a color filter and black matrix, and a transparent window. Furthermore, although this embodiment shows a thin film sealing layer 300 being used as a sealing member for sealing the display element layer 200, the present invention is not limited thereto. For example, a sealed substrate can be used as a component to seal the display element layer 200, which is bonded to the substrate 100 with a sealant or frit.

[0043] Figure 3 is a schematic plan view showing the configuration of a display panel according to one embodiment of the present invention. Referring to Figure 3, the various components that make up the display panel 2 are arranged on the substrate 100. The substrate 100 includes a display area DA (Figure 1) and a peripheral area PA surrounding the display area.

[0044] The display area DA includes a second display area DA2 on which the main image is displayed, and a first display area DA1 which has a transparent area TA inside and on which an auxiliary image is displayed. The second display area DA2 has multiple main pixels PXm arranged within it. Each main pixel PXm contains a display element such as an organic light-emitting diode (OLED). Each main pixel PXm emits light, for example, red, green, blue, or white, through an organic light-emitting element (OLED). In this specification, a main pixel PXm can be understood as a pixel that emits light of one of the following hues: red, green, blue, or white, as described above. The second display area DA2 is covered by the sealing member described earlier with reference to Figure 2, and is protected from outside air or moisture.

[0045] The first display area DA1 is located inside the second display area DA2, and multiple auxiliary pixels PXa are arranged in the first display area DA1. Each auxiliary pixel PXa contains a display element such as an organic light-emitting diode. Each auxiliary pixel PXa emits, for example, red, green, blue, or white light through an organic light-emitting diode. In this specification, an auxiliary pixel PXa can be understood as a pixel that emits light of one of the following hues: red, green, blue, or white, as described above. On the other hand, the first display area DA1 is provided with a transparent area TA that is positioned between the auxiliary pixels PXa.

[0046] The first display area DA1 includes a transparent area TA, but the resolution of the first display area DA1 is lower than that of the second display area DA2. For example, the resolution of the first display area DA1 is approximately half that of the second display area DA2. In some embodiments, the resolution of the second display area DA2 is 400 ppi or higher, and the resolution of the first display area DA1 may be approximately 200 ppi. Each pixel (main pixel PXm, auxiliary pixel PXa) can be electrically connected to an outer circuit located in the peripheral region PA. The peripheral area PA includes a first scan drive circuit 110, a second scan drive circuit 120, a terminal 140, a data drive circuit 150, a first power supply wiring 160, and a second power supply wiring 170. The first scan drive circuit 110 provides a scan signal to each pixel (main pixel PXm, auxiliary pixel PXa) via the scan line SL. The first scan drive circuit 110 provides light emission control signals to each pixel (main pixel PXm, auxiliary pixel PXa) via the light emission control line EL. The second scan drive circuit 120 is arranged parallel to the first scan drive circuit 110, with the display area DA in between. Some of the pixels (main pixels PXm, auxiliary pixels PXa) arranged in the display area DA are electrically connected to the first scan drive circuit 110, and the rest are connected to the second scan drive circuit 120. In other embodiments, the second scan drive circuit 120 may be omitted. Terminal 140 is located on one side of the circuit board 100. Terminal 140 is exposed and not covered by an insulating layer, and is electrically connected to the printed circuit board (PCB). Terminal PCB-P on the printed circuit board (PCB) is electrically connected to terminal 140 on display panel 2. The printed circuit board (PCB) transmits signals or power from the control unit (not shown) to the display panel 2. The control signals generated by the control unit are transmitted to the first scan drive circuit 110 and the second scan drive circuit 120, respectively, via the printed circuit board (PCB). The control unit provides the first power supply voltage ELVDD and the second power supply voltage ELVSS (Figures 4 and 5) to the first power supply wiring 160 and the second power supply wiring 170, respectively, via the first connecting wiring 161 and the second connecting wiring 171. The first power supply voltage ELVDD is supplied to each pixel (main pixel PXm, auxiliary pixel PXa) via the drive voltage line PL connected to the first power supply wiring 160, and the second power supply voltage ELVSS is supplied to the counter electrode of each pixel (main pixel PXm, auxiliary pixel PXa) connected to the second power supply wiring 170. The data drive circuit 150 is electrically connected to the data line DL. The data signals from the data drive circuit 150 are provided to each pixel (main pixel PXm, auxiliary pixel PXa) via the connecting wiring 151 connected to terminal 140, and the data line DL connected to the connecting wiring 151. Figure 3 shows the data driving circuit 150 arranged on a printed circuit board (PCB), but in other embodiments, the data driving circuit 150 may also be arranged on a substrate 100. For example, the data drive circuit 150 is positioned between terminal 140 and the first power supply wiring 160. The first power supply wiring 160 is located between the second display area DA2 and terminal 140 and includes a first sub-wiring 162 and a second sub-wiring 163 that are aligned and extended along the x-direction. The second power supply wiring 170 partially surrounds the display area DA in a loop shape with one end open.

[0047] Figures 4 and 5 are equivalent circuit diagrams of pixels in a display panel according to one embodiment of the present invention. Referring to Figures 4 and 5, each pixel (PXm, PXa) includes a pixel circuit PC connected to the scan line SL and the data line DL, and an organic light-emitting element OLED connected to the pixel circuit PC. The pixel circuit PC includes a drive thin-film transistor T1, a switching thin-film transistor T2, and a storage capacitor Cst.

[0048] The switching thin-film transistor T2 is connected to the scan line SL and the data line DL, and transmits the data signal Dm input via the data line DL to the driving thin-film transistor T1 via the scan signal Sn input via the scan line SL. The storage capacitor Cst is connected to the switching thin-film transistor T2 and the drive voltage line PL, and stores a voltage corresponding to the difference between the voltage transmitted from the switching thin-film transistor T2 and the drive voltage (or power supply voltage) ELVDD supplied to the drive voltage line PL. The drive thin-film transistor T1 is connected to the drive voltage line PL and the storage capacitor Cst, and controls the drive current flowing from the drive voltage line PL to the organic light-emitting element OLED, corresponding to the voltage value stored in the storage capacitor Cst. Organic light-emitting diodes (OLEDs) emit light with a predetermined brightness based on the driving current.

[0049] Figure 4 illustrates a case where the pixel circuit PC includes two thin-film transistors and one storage capacitor, but the present invention is not limited thereto. As shown in Figure 5, the pixel circuit PC may include seven thin-film transistors and one storage capacitor. Although Figure 5 shows the pixel circuit PC including one storage capacitor, it may include two or more storage capacitors.

[0050] Referring to Figure 5, each pixel (PXm, PXa) includes a pixel circuit PC and an organic light-emitting diode (OLED) connected to the pixel circuit PC. The pixel circuit PC includes multiple thin-film transistors and storage capacitors. Thin-film transistors and storage capacitors are connected to signal lines (SL, SL-1, EL, DL), initialization voltage line VL, and drive voltage line PL. In Figure 5, pixels (PXm, PXa) are shown connected to signal lines (SL, SL-1, EL, DL), initialization voltage line VL, and drive voltage line PL, but the present invention is not limited thereto. In another embodiment, at least one of the signal lines (SL, SL-1, EL, DL), the initialization voltage line VL, the drive voltage line PL, etc., are shared even among adjacent pixels.

[0051] The signal lines include a scan line SL that transmits a scan signal Sn, a previous scan line (SL-1) that transmits a previous scan signal (Sn-1) to the first and second initial thin-film transistors T4 and T7, a light emission control line EL that transmits a light emission control signal En to the operation control thin-film transistor T5 and the light emission control thin-film transistor T6, and a data line DL that crosses the scan line SL and transmits a data signal Dm. The drive voltage line PL transmits the drive voltage ELVDD to the drive thin-film transistor T1, and the initialization voltage line VL transmits the initialization voltage Vint to initialize the drive thin-film transistor T1 and the pixel electrodes.

[0052] The drive gate electrode G1 of the drive thin-film transistor T1 is connected to the lower electrode CE1 of the storage capacitor Cst, the drive source electrode S1 of the drive thin-film transistor T1 is connected to the drive voltage line PL via the operation control thin-film transistor T5, and the drive drain electrode D1 of the drive thin-film transistor T1 is electrically connected to the pixel electrode of the organic light-emitting element OLED via the light emission control thin-film transistor T6. The driving thin-film transistor T1 receives a data signal Dm through the switching operation of the switching thin-film transistor T2, and drives a driving current I to the organic light-emitting element OLED. OLED To supply.

[0053] The switching gate electrode G2 of the switching thin-film transistor T2 is connected to the scan line SL, the switching source electrode S2 of the switching thin-film transistor T2 is connected to the data line DL, and the switching drain electrode D2 of the switching thin-film transistor T2 is connected to the drive source electrode S1 of the drive thin-film transistor T1, and is connected to the drive voltage line PL via the operation control thin-film transistor T5. The switching thin-film transistor T2 is turned on by the scan signal Sn transmitted via the scan line SL and performs a switching operation to transmit the data signal Dm transmitted to the data line DL to the drive source electrode S1 of the drive thin-film transistor T1.

[0054] The compensating gate electrode G3 of the compensating thin film transistor T3 is connected to the scan line SL, the compensating source electrode S3 of the compensating thin film transistor T3 is connected to the drive drain electrode D1 of the drive thin film transistor T1, and is connected to the pixel electrode of the organic light-emitting element OLED via the light-emitting control thin film transistor T6, the compensating drain electrode D3 of the compensating thin film transistor T3 is connected to the lower electrode CE1 of the storage capacitor Cst, the first initialization drain electrode D4 of the first initialization thin film transistor T4, and the drive gate electrode G1 of the drive thin film transistor T1. The compensating thin-film transistor T3 is turned on by the scan signal Sn transmitted via the scan line SL, electrically connecting the drive gate electrode G1 and the drive drain electrode D1 of the drive thin-film transistor T1, thereby creating a diode connection for the drive thin-film transistor T1.

[0055] The first initialization gate electrode G4 of the first initialization thin film transistor T4 is previously connected to the scan line (SL-1), the first initialization source electrode S4 of the first initialization thin film transistor T4 is connected to the second initialization drain electrode D7 of the second initialization thin film transistor T7 and to the initialization voltage line VL, and the first initialization drain electrode D4 of the first initialization thin film transistor T4 is connected to the lower electrode CE1 of the storage capacitor Cst, the compensation drain electrode D3 of the compensation thin film transistor T3, and the drive gate electrode G1 of the drive thin film transistor T1. The first initial thin-film transistor T4 is turned on by a previous scan signal (Sn-1) transmitted via a previous scan line (SL-1), and performs an initialization operation that transmits an initialization voltage Vint to the drive gate electrode G1 of the drive thin-film transistor T1, thereby initializing the voltage of the drive gate electrode G1 of the drive thin-film transistor T1.

[0056] The control gate electrode G5 of the control thin film transistor T5 is connected to the light emission control line EL, the control source electrode S5 of the control thin film transistor T5 is connected to the drive voltage line PL, and the control drain electrode D5 of the control thin film transistor T5 is connected to the drive source electrode S1 of the drive thin film transistor T1 and the switching drain electrode D2 of the switching thin film transistor T2. The light emission control gate electrode G6 of the light emission control thin film transistor T6 is connected to the light emission control line EL, the light emission control source electrode S6 of the light emission control thin film transistor T6 is connected to the drive drain electrode D1 of the drive thin film transistor T1 and the compensation source electrode S3 of the compensation thin film transistor T3, and the light emission control drain electrode D6 of the light emission control thin film transistor T6 is electrically connected to the second initialization source electrode S7 of the second initialization thin film transistor T7 and the pixel electrode of the organic light-emitting element OLED. The operation control thin-film transistor T5 and the light emission control thin-film transistor T6 are simultaneously turned on by the light emission control signal En transmitted via the light emission control line EL, the drive voltage ELVDD is transmitted to the organic light-emitting element OLED, and the drive current I OLED Make it flow.

[0057] The second initialization gate electrode G7 of the second initialization thin film transistor T7 is previously connected to the scan line (SL-1), the second initialization source electrode S7 of the second initialization thin film transistor T7 is connected to the light emission control drain electrode D6 of the light emission control thin film transistor T6 and the pixel electrode of the organic light-emitting element OLED, and the second initialization drain electrode D7 of the second initialization thin film transistor T7 is connected to the first initialization source electrode S4 of the first initialization thin film transistor T4 and the initialization voltage line VL. The second initialization thin-film transistor T7 is turned on by the previous scan signal (Sn-1) transmitted via the previous scan line (SL-1), initializing the pixel electrodes of the organic light-emitting element (OLED).

[0058] Figure 5 illustrates the case where the first initialization thin-film transistor T4 and the second initialization thin-film transistor T7 are connected to the previous scan line (SL-1), but the present invention is not limited thereto. In another embodiment, the first initial thin-film transistor T4 is connected to a previous scan line (SL-1) and driven by a previous scan signal (Sn-1), and the second initial thin-film transistor T7 is connected to a separate signal line (e.g., a subsequent scan line) and driven by a signal transmitted to the signal line.

[0059] The upper electrode CE2 of the storage capacitor Cst is connected to the drive voltage line PL, and the counter electrode of the organic light-emitting element OLED is connected to the common voltage ELVSS. As a result, the organic light-emitting diode (OLED) receives a drive current I from the drive thin-film transistor T1. OLED By transmitting signals and emitting light, an image can be displayed. In Figure 5, the compensating thin-film transistor T3 and the first initializing thin-film transistor T4 are shown to have dual gate electrodes, but the compensating thin-film transistor T3 and the first initializing thin-film transistor T4 can have a single gate electrode.

[0060] Figure 6 is a schematic arrangement diagram showing the pixel circuit of a pixel according to one embodiment of the present invention, and Figure 7 is a cross-sectional view taken along lines I-I' and II-II' in Figure 6. Referring to Figures 6 and 7, the driving thin-film transistor T1, the switching thin-film transistor T2, the compensation thin-film transistor T3, the first initialization thin-film transistor T4, the operation control thin-film transistor T5, the light emission control thin-film transistor T6, and the second initialization thin-film transistor T7 are arranged along the semiconductor layer 1130.

[0061] The semiconductor layer 1130 is placed on a substrate on which a buffer layer, which is an inorganic insulating material, is formed. In this embodiment, the semiconductor layer 1130 may include low-temperature polysilicon (LTPS). Polysilicon materials have high electron mobility (100cm²). 3 Because it has low energy consumption (above / Vs) and excellent reliability, it is used as the semiconductor layer of thin-film transistors in display devices. However, the present invention is not limited thereto, and in other embodiments, the semiconductor layer 1130 may be formed of amorphous silicon (a-Si) and / or an oxide semiconductor, some semiconductor layers of the plurality of thin-film transistors may be formed of low-temperature polysilicon (LTPS), and other semiconductor layers may be formed of amorphous silicon (a-Si) and / or an oxide semiconductor.

[0062] A portion of the semiconductor layer 1130 corresponds to the semiconductor layers of the driving thin-film transistor T1, the switching thin-film transistor T2, the compensation thin-film transistor T3, the first initialization thin-film transistor T4, the operation control thin-film transistor T5, the light emission control thin-film transistor T6, and the second initialization thin-film transistor T7. In other words, the semiconductor layers of the driving thin-film transistor T1, the switching thin-film transistor T2, the compensation thin-film transistor T3, the first initialization thin-film transistor T4, the operation control thin-film transistor T5, the light emission control thin-film transistor T6, and the second initialization thin-film transistor T7 can be understood as being connected to each other and bent in various shapes.

[0063] The semiconductor layer 1130 includes a channel region, as well as source and drain regions on both sides of the channel region, which can also be understood as the source and drain electrodes of the corresponding thin-film transistor. In the following, for convenience, the source region and drain region will be referred to as the source electrode and drain electrode, respectively.

[0064] The driving thin-film transistor T1 includes a driving gate electrode G1 superimposed on the driving channel region, as well as driving source electrodes S1 and driving drain electrodes D1 on both sides of the driving channel region. The drive channel region superimposed on the drive gate electrode G1 has a bent shape, similar to the Greek letter omega, which allows for the formation of a long channel length within a narrow space. When the length of the drive channel region is long, the driving range of the gate voltage is widened, allowing for more precise control of the gradation of light emitted from the organic light-emitting diode (OLED), thereby improving display quality.

[0065] The switching thin-film transistor T2 includes a switching gate electrode G2 superimposed on the switching channel region, as well as switching source electrodes S2 and switching drain electrodes D2 on both sides of the switching channel region. The switching drain electrode D2 is connected to the drive source electrode S1. The compensating thin-film transistor T3 is a dual thin-film transistor comprising a compensating gate electrode G3 superimposed on two compensating channel regions, and includes compensating source electrodes S3 and compensating drain electrodes D3 located on both sides. The compensating thin-film transistor T3 is connected to the drive gate electrode G1 of the drive thin-film transistor T1 via the node connection line 1174, which will be described later.

[0066] The first initial thin-film transistor T4 is a dual thin-film transistor comprising a first initial gate electrode G4 superimposed on two first initial channel regions, and includes a first initial source electrode S4 and a first initial drain electrode D4 located on either side. The motion control thin-film transistor T5 includes a motion control gate electrode G5 superimposed on the motion control channel region, as well as motion control source electrodes S4 and motion control drain electrodes D5 located on both sides. The operation control drain electrode D5 is connected to the drive source electrode S1.

[0067] The light emission control thin-film transistor T6 includes a light emission control gate electrode G6 superimposed on the light emission control channel region, as well as light emission control source electrodes S6 and light emission control drain electrodes D6 located on either side. The light emission control source electrode S6 is connected to the drive drain electrode D1. The second initial thin-film transistor T7 includes a second initial gate electrode G7 superimposed on the second initial channel region, as well as a second initial source electrode S7 and a second initial drain electrode D7 located on either side. The aforementioned thin-film transistors are connected to signal lines (SL, SL-1, EL, DL), initialization voltage line VL, and drive voltage line PL.

[0068] On the aforementioned semiconductor layer 1130, with an insulating layer in between, are the scan line SL, the previous scan line (SL-1), the light emission control line EL, and the drive gate electrode G1. The scanline SL extends along the first direction DR1. One region of scanline SL corresponds to the switching gate electrode G2 and the compensating gate electrode G3. For example, in scanline SL, the regions that overlap with the channel regions of switching thin-film transistor T2 and compensation thin-film transistor T3 are also the switching gate electrode G2 and compensation gate electrode G3, respectively.

[0069] Previously, the scan line (SL-1) was extended along the first direction DR1, and parts of it corresponded to the first initialization gate electrode G4 and the second initialization gate electrode G7, respectively. For example, in the previous scanline (SL-1), the regions that overlap with the channel regions of the first initialization drive thin-film transistor T4 and the second initialization drive thin-film transistor T7 may be the first initialization gate electrode G4 and the second initialization gate electrode G7, respectively. The light emission control line EL extends along the first direction DR1. One region of the light emission control line EL corresponds to the operation control gate electrode G5 and the light emission control gate electrode G6, respectively. For example, in the light emission control line EL, the regions that overlap with the channel regions of the operation control drive thin-film transistor T6 and the light emission control drive thin-film transistor T7 are also the operation control gate electrode G5 and the light emission control gate electrode G6, respectively. The drive gate electrode G1 is a floating electrode and is connected to the compensating thin-film transistor T3 via the aforementioned node connection line 1174.

[0070] Above the aforementioned scan line SL, the previous scan line (SL-1), the light emission control line EL, and the drive gate electrode G1, an electrode voltage line HL is positioned with an insulating layer in between. The electrode voltage line HL is extended along the first direction DR1 so as to intersect with the data line DL and the drive voltage line PL. A portion of the electrode voltage line HL covers at least a portion of the drive gate electrode G1, and together with the drive gate electrode G1, forms the storage capacitor Cst. For example, the drive gate electrode G1 becomes the lower electrode CE1 of the storage capacitor Cst, and a portion of the electrode voltage line HL becomes the upper electrode CE2 of the storage capacitor Cst.

[0071] The upper electrode CE2 of the storage capacitor Cst is electrically connected to the drive voltage line PL. Related to this, the electrode voltage line HL is connected to the drive voltage line PL, which is located on the electrode voltage line HL, via a contact hole CNT. Therefore, the electrode voltage line HL has the same voltage level (constant voltage) as the drive voltage line PL. For example, the electrode voltage line HL may have a constant voltage of +5V. The electrode voltage line HL can be understood as the lateral drive voltage line.

[0072] The drive voltage line PL extends along the second direction DR2, and the electrode voltage line HL, which is electrically connected to the drive voltage line PL, extends along the first direction DR1, which intersects the second direction DR2. Therefore, in the display area DA (Figure 1), the multiple drive voltage lines PL and electrode voltage lines HL form a mesh structure. On the electrode voltage line HL, separated by an insulating layer, are the data line DL, the drive voltage line PL, the initialization connection line 1173, and the node connection line 1174. The data line DL is extended in the second direction DR2 and connected to the switching source electrode S2 of the switching thin-film transistor T2 via the contact hole 1154. A portion of the data line DL can also be understood as a switching source electrode.

[0073] The drive voltage line PL is extended in the second direction DR2 and connected to the electrode voltage line HL via the contact hole CNT, as described above. Furthermore, it is connected to the operation control thin-film transistor T5 via the contact hole 1155. The drive voltage line PL is connected to the operation control drain electrode D5 via the contact hole 1155. One end of the initialization connection line 1173 is connected to the first initialization thin-film transistor T4 and the second initialization thin-film transistor T7 via the contact hole 1152, and the other end is connected to the initialization voltage line VL, which will be described later, via the contact hole 1151. One end of the node connection line 1174 is connected to the compensating drain electrode D3 via the contact hole 1156, and the other end is connected to the drive gate electrode G1 via the contact hole 1157.

[0074] An initialization voltage line VL is positioned above the data line DL, the drive voltage line PL, the initialization connection line 1173, and the node connection line 1174, with an insulating layer in between. The initialization voltage line VL is extended in the first direction DR1. The initialization voltage line VL is connected to the first initialization drive thin-film transistor T4 and the second initialization drive thin-film transistor T7 via the initialization connection line 1173. The initialization voltage line VL may have a constant voltage (e.g., -2V). The initialization voltage line VL is located on the same layer as the pixel electrode 210 of the organic light-emitting diode (OLED) (Figure 7) and may contain the same material.

[0075] The pixel electrode 210 is connected to the light emission control thin-film transistor T6. The pixel electrode 210 is connected to the connecting metal 1175 via the contact hole 1163, and the connecting metal 1175 is connected to the light emission control drain electrode D6 via the contact hole 1153. In Figure 6, the initialization voltage line VL is described as being located on the same layer as the pixel electrode 210. However, in other embodiments, the initialization voltage line VL may also be located on the same layer as the electrode voltage line HL.

[0076] The stacked structure of the components included in a display panel according to one embodiment of the present invention will be described below with reference to Figure 7. The substrate 100 may contain glass or polymer resin. The polymer resin may include polymer resins such as polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate (PET), polyphenylene sulfide, polyarylate, polyimide (PI), polycarbonate, or cellulose acetate propionate. The substrate 100 containing the polymer resin can have flexible, rollable, or bendable properties.

[0077] The substrate 100 may have a multilayer structure including a layer containing the aforementioned polymer resin and an inorganic layer (not shown). The buffer layer 111 is located on the substrate 100 and can reduce or block the penetration of foreign matter, moisture, or outside air from below the substrate 100, and provides a flat surface on the substrate 100. The buffer layer 111 may contain inorganic materials such as oxides or nitrides, or organic materials, or organic / inorganic composites, and may also be a single-layer or multi-layer structure of inorganic and organic materials. A barrier layer (not shown) that blocks the penetration of outside air may be further included between the substrate 100 and the buffer layer 111.

[0078] On the semiconductor layers (A1, A6), gate electrodes (G1, G6) are arranged with a first gate insulating layer 112 in between. The gate electrodes (G1, G6) contain materials such as molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti), and can be single-layer or multi-layer. For example, the gate electrodes (G1, G6) are monolayers of Mo. The scan line SL (Figure 6), the previous scan line (SL-1) (Figure 6), and the light emission control line EL (Figure 6) are formed on the same layer as the gate electrodes (G1, G6). Specifically, the gate electrodes (G1, G6), scan line SL (Figure 6), previous scan line (SL-1) (Figure 6), and light emission control line EL (Figure 6) are arranged on the first gate insulating layer 112.

[0079] The first gate insulating layer 112 is made of silicon oxide (SiO2) and silicon nitride (SiN x ), may include silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO2). A second gate insulating layer 113 is provided so as to cover the gate electrodes (G1, G6). The second gate insulating layer 113 is made of silicon oxide (SiO2) and silicon nitride (SiN x ), may include silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO2).

[0080] The lower electrode CE1 of the storage capacitor Cst is formed integrally with the drive gate electrode G1 of the drive thin-film transistor T1. For example, the drive gate electrode G1 of the drive thin-film transistor T1 performs the function of the lower electrode CE1 of the storage capacitor Cst. The upper electrode CE2 of the storage capacitor Cst is superimposed on the lower electrode CE1, with the second gate insulating layer 113 in between. In this case, the second gate insulating layer 113 functions as the dielectric layer of the storage capacitor Cst. The upper electrode CE2 may contain conductive materials such as molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti), and can be formed as a multilayer or monolayer containing the aforementioned materials. For example, the upper electrode CE2 is either a single layer of Mo or a multilayer of Mo / Al / Mo.

[0081] In Figure 7, the storage capacitor Cst is shown superimposed on the driving thin-film transistor T1, but the present invention is not limited thereto. The storage capacitor Cst can be positioned in various ways, such as not overlapping with the driving thin-film transistor T1. The upper electrode CE2 functions as the electrode voltage line HL. For example, a portion of the electrode voltage line HL could become the upper electrode CE2 of the storage capacitor Cst.

[0082] An interlayer insulating layer 115 is provided so as to cover the upper electrode CE2. The interlayer insulating layer 115 is made of silicon oxide (SiO2) and silicon nitride (SiN x ), may include silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO2). In Figure 7, the interlayer insulating layer 115 is shown as a single layer; however, in one embodiment, the interlayer insulating layer 115 can also be formed as a multilayer structure.

[0083] Data lines DL, drive voltage lines PL, and connecting metals 1175 are arranged on the interlayer insulating layer 115. The data line DL, drive voltage line PL, and connecting metal 1175 may contain conductive materials such as molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti), and may be formed in multilayer or monolayer configurations containing the aforementioned materials. For example, the data line DL, the drive voltage line PL, and the connecting metal 1175 are made of a Ti / Al / Ti multilayer structure. The upper electrode CE2 of the storage capacitor Cst is also connected to the drive voltage line PL and via a contact hole CNT defined in the interlayer insulating layer 115. This means that the electrode voltage line HL is connected to the drive voltage line PL via the contact hole CNT. Therefore, the electrode voltage line HL has the same voltage level (constant voltage) as the drive voltage line PL.

[0084] The connecting metal 1175 is connected to the semiconductor layer A6 of the light-emitting control thin-film transistor T6 via a contact hole 1153 that penetrates the interlayer insulating layer 115, the second gate insulating layer 113, and the first gate insulating layer 112. The light-emitting control thin-film transistor T6 is electrically connected to the pixel electrode 210 of the organic light-emitting diode (OLED) via the connecting metal 1175. A planarization layer 117 is located above the data line DL, the drive voltage line PL, and the connecting metal 1175, and an organic light-emitting diode (OLED) is located on the planarization layer 117.

[0085] The planarization layer 117 has a flat upper surface so that the pixel electrodes 210 are formed flat. The planarization layer 117 is formed by a single or multilayer film made of an organic material. Such a planarized layer 117 may include general-purpose polymers such as benzocyclobutene (BCB), polyimide (PI), hexamethyldisiloxane (HMDSO), polymethyl methacrylate (PXMMA), and polystyrene (PS), polymer derivatives having phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorine polymers, p-xylene polymers, vinyl alcohol polymers, and mixtures thereof.

[0086] The planarization layer 117 may contain an inorganic substance. Such a planarization layer 117 is made of silicon oxide (SiO2), silicon nitride (SiN x ), may include silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO2). If the planarization layer 117 is provided by an inorganic material, a chemical planarization polishing step may be performed. On the other hand, the planarization layer 117 may contain both organic and inorganic substances.

[0087] The pixel electrode 210 is a (semi)transparent electrode or a reflective electrode. In some embodiments, the pixel electrode 210 comprises a reflective film formed from Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, and compounds thereof, and a transparent electrode layer or a translucent electrode layer formed on the reflective film. The transparent or translucent electrode layer comprises at least one selected from the group including indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), and aluminum zinc oxide (AZO). In some embodiments, the pixel electrode 210 is provided with a structure made of stacked ITO / Ag / ITO.

[0088] A pixel definition film 119 is placed on the planarization layer 117, and the pixel definition film 119 has an opening 119OP that exposes the central part of the pixel electrode 210 (Figure 2), thereby defining the light-emitting region of the pixel. Furthermore, the pixel definition film 119 increases the distance between the edge of the pixel electrode 210 and the counter electrode 230 above the pixel electrode 210, thereby preventing the generation of arcs and the like at the edge of the pixel electrode 210. The pixel definition film 119 is an organic insulating material such as polyimide (PI), polyamide, acrylic resin, benzocyclobutene, hexamethyldisiloxane (HMDSO), and phenolic resin, and is formed by methods such as spin coating.

[0089] The intermediate layer 220 of the organic light-emitting diode (OLED) includes an organic light-emitting layer. The organic light-emitting layer may contain organic materials including fluorescent or phosphorescent substances that emit red, green, blue, or white light. The organic light-emitting layer is a low-molecular-weight or high-molecular-weight organic material, and functional layers such as a hole transport layer (HTL), hole injection layer (HIL), electron transport layer (ETL), and electron injection layer (EIL) are selectively arranged above and below the organic light-emitting layer. The intermediate layer 220 is arranged to correspond to each of the multiple pixel electrodes 210. However, it is not limited to that. The intermediate layer 220 can undergo various modifications, such as including a layer that is integrated across multiple pixel electrodes 210.

[0090] The sizes of the intermediate layers 220, which emit light of the same hue, are different in the first display area DA1 and the second display area DA2. For example, the planar area of ​​at least one of the intermediate layers 220 of the main pixel PXm is different from the planar area of ​​at least one of the intermediate layers 220 of the auxiliary pixel PXa. In particular, the planar area of ​​at least one of the intermediate layers 220 of the main pixel PXm is smaller than the planar area of ​​at least one of the intermediate layers 220 of the auxiliary pixel PXa. For example, in the intermediate layer 220 of the main pixel PXm, the planar area of ​​the hole injection layer is smaller than the planar area of ​​the hole injection layer in the intermediate layer 220 of the auxiliary pixel PXa. In another embodiment, in the intermediate layer 220 of the main pixel PXm, the planar area of ​​the organic light-emitting layer is smaller than the planar area of ​​the organic light-emitting layer in the intermediate layer 220 of the auxiliary pixel PXa. In yet another embodiment, in the intermediate layer 220 of the main pixel PXm, the planar area of ​​the hole injection layer and the organic light-emitting layer is smaller than the planar area of ​​the hole injection layer and the organic light-emitting layer in the intermediate layer 220 of the auxiliary pixel PXa. In this case, the aforementioned relationship is not limited to what has been stated above, but can also be applied to pixel electrodes, hole transport layers, electron transport layers, electron injection layers, and so on.

[0091] Furthermore, the thickness of the intermediate layer 220 of the main pixel PXm and the intermediate layer 220 of the auxiliary pixel PXa each have both uniform and variable sections. For example, the thickness of the intermediate layer 220 placed on the pixel electrode 210 of each pixel is constant, while the thickness of the intermediate layer 220 placed on the inner surface of the opening 119OP of the pixel definition film 119 is not constant. In such cases, the thickness of the intermediate layer 220, which is positioned on the inner surface of the aperture 119OP of the pixel definition film 119, becomes thinner as it moves further away from the pixel electrode 210. In another embodiment, the thickness of the intermediate layer 220, which is placed on a portion of the pixel electrodes 210 of each pixel, is constant, and the thickness of the intermediate layer 220 decreases as you move from the end (or frame) of the portion where the thickness of the intermediate layer 220 is constant towards the end of the intermediate layer 220. At this time, the thickness of the intermediate layer 220 is measured perpendicularly from the surface of the pixel electrode 210 or the surface of the pixel definition film 119 that the intermediate layer 220 directly contacts, to the surface of the intermediate layer 220 that contacts the counter electrode 230. In the following, for the sake of clarity, we will focus on the case where the section in which the thickness of the intermediate layer 220 is variable is located only on the inner surface of the aperture of the pixel definition film 119, and will explain it in detail.

[0092] In the case as described above, in the intermediate layer 220 of the main pixel PXm, the thickness of the portion of the intermediate layer 220 where the thickness is constant and the thickness of the portion of the intermediate layer 220 where the thickness is constant in the auxiliary pixel PXa are the same as each other. Further, a first length LX of a section where the thickness of the intermediate layer 220 of the main pixel PXm varies m is different from a second length LX of a section where the thickness of the intermediate layer 220 of the auxiliary pixel PXa varies a . For example, one of the first length LX m or the second length LX a is longer than the other of the first length LX m or the second length LX a . Specifically, the first length LX m is longer than the second length LX a , or the second length LX a is longer than the first length LX m . In this case, when the resolution of the second display area DA2 is higher than the resolution of the first display area DA1, the first length LX m is longer than the second length LX a . As another embodiment, when the resolution of the second display area DA2 is lower than the resolution of the first display area DA1, the first length LX m is shorter than the second length LX a .

[0093] In such a case, by shortening the section where the thickness of the intermediate layer 220 of each pixel varies, at least one of the first display area DA1 and the second display area DA2 can implement a sharp image. In particular, when the second length LX a is shorter than the first length LX m , the transmission area TA can be secured to the maximum extent, so that malfunctions and degradation in operation performance can be prevented when a component (not shown) disposed in the first display area DA1 operates. In the following, for convenience of description, a detailed description will be given focusing on the case where the second length LX a is shorter than the first length LX m .

[0094] The counter electrode 230 is either a light-transmitting electrode or a reflective electrode. In some embodiments, the counter electrode 230 is a transparent or translucent electrode and is formed from a thin metal film with a low work function, containing Li, Ca, LiF / Ca, LiF / Al, Al, Ag, Mg, and their compounds. Furthermore, a TCO (transparent conductive oxide) film such as ITO, IZO, ZnO, or In2O3 may be further arranged on the metal thin film.

[0095] When the pixel electrode 210 is provided as a reflective electrode and the counter electrode 230 is provided as a light-transmitting electrode, the light emitted from the intermediate layer 220 is emitted towards the counter electrode 230, and the display device becomes a front-emitting type. When the pixel electrode 210 is composed of a transparent or semi-transparent electrode and the counter electrode 230 is composed of a reflective electrode, the light emitted from the intermediate layer 220 is emitted towards the substrate 100, and the display device becomes a back-emitting type. However, these embodiments are not limited to them. The display device of this embodiment may also be a double-sided light-emitting type that emits light in both the front and back directions.

[0096] In this embodiment, the counter electrode 230 is arranged across the entire second display area DA2, with a portion of its edge located in the peripheral area PA. The counter electrode 230 is integrally formed in the main pixel PXm located on the second display area DA2, i.e., in multiple organic light-emitting diodes (OLEDs), and corresponds to multiple pixel electrodes 210. On the other hand, the counter electrode 230 is provided in the auxiliary pixel PXa located on the first display area DA1. However, the first display area DA1 includes a transmission area TA located between auxiliary pixels PXa, but a portion of the counter electrode 230 is not present in the portion corresponding to the transmission area TA. In the case of a front-emitting display device, light is emitted towards the opposing electrode 230, but it goes without saying that the light transmittance is partially reduced by the opposing electrode 230. Therefore, by omitting the counter electrode 230 in the region corresponding to the transmission region TA, the transmittance of the transmission region TA can be improved.

[0097] At this time, the opposing electrodes 230 arranged in the first display area DA1, which are spaced apart from each other, are connected by a separate bridge, or at least a portion of adjacent opposing electrodes 230 are superimposed on each other. The main pixel PXm and auxiliary pixel PXa, as described above, each include the pixel electrode 210, the intermediate layer 220, and the counter electrode 230, respectively. In this case, although not shown in the figure, the auxiliary pixel PXa includes a first pixel electrode (not shown), a first intermediate layer (not shown), and a first counter electrode (not shown), and the main pixel PXm may include a second pixel electrode (not shown), a second intermediate layer (not shown), and a second counter electrode (not shown).

[0098] Figure 8 is a cross-sectional view showing a schematic configuration of a manufacturing apparatus for a display device according to one embodiment of the present invention, and Figure 9 is a perspective view showing the mask assembly shown in Figure 8. Referring to Figures 8 and 9, the display device DD is manufactured by the display device manufacturing apparatus 1. The display device manufacturing apparatus 1 includes a chamber 10, a mask assembly 20, a first support section 30, a second support section 40, a deposition source 50, a magnetic field generation section 60, a vision section 70, and a pressure adjustment section 80.

[0099] Chamber 10 has a space formed inside, and a part of chamber 10 is formed to be open. At this time, a gate valve 11 is positioned in the open portion of the chamber 10 so that it can be opened and closed. The mask assembly 20 is selectively placed inside the chamber 10. In this case, the mask assembly 20 may include a mask frame 21 and a mask sheet 22. The mask sheet 22 is fixed in a state where it is pulled taut by the mask frame 21. The mask sheet 22 includes at least one first pattern hole PH1 and at least one second pattern hole PH2. The first pattern hole PH1 and the second pattern hole PH2 are through-holes formed to allow the deposited material to pass through the mask sheet 22.

[0100] The mask assembly 20 includes a mask frame 21 and a mask sheet 22. The mask frame 21 is formed by connecting multiple frames to each other and includes an opening inside. In this case, the mask frame 21 may include one opening or multiple openings that are separated from each other. In such cases, the mask frame 21 is formed in a grid pattern, like a window frame.

[0101] The mask sheet 22 is fixed in a state where it is pulled taut by the mask frame 21. One or more mask sheets 22 may be provided. If only one mask sheet 22 is provided, the mask sheet 22 is placed on the mask frame 21 and shields the opening of the mask frame 21. In other embodiments, if multiple mask sheets 22 are provided, the multiple mask sheets 22 can be arranged adjacent to each other along one side of the mask frame 21 (for example, in the X or Y direction) to shield the opening of the mask frame 21. In the following, for the sake of clarity, we will focus on the case where multiple mask sheets 22 are provided and explain in detail.

[0102] The mask assembly 20 further comprises a support frame 23 that supports the mask sheet 22. The mask sheet 22 is placed on the support frame 23. The support frames 23 are positioned in the openings of the mask frame 21 and are provided in multiple units. The support frames 23 are arranged so as to be spaced apart from each other in a direction parallel or perpendicular to the longitudinal direction (e.g., the Y direction) of the mask sheet 22. The substrate 100 is placed on the first support portion 30. At this time, the first support part 30 can adjust the position of the substrate 100. For example, the first support section 30 may include a UVW stage.

[0103] The mask assembly 20 is placed on the second support section 40. In this case, the second support part 40 can adjust the position of the mask assembly 20, similar to the first support part 30. At least one of the first support portion 30 and the second support portion 40 is raised and lowered inside the chamber 10. In such cases, at least one of the first support portion 30 and the second support portion 40 can adjust the distance between the substrate 100 and the mask frame 21.

[0104] The deposition source 50, after containing the deposition material, vaporizes or sublimes the deposition material and supplies it to the chamber 10. In this case, the deposition source 50 may include a heater inside, and by operating the heater, the deposition material inside the deposition source 50 can be heated, thereby melting or sublimating the deposition material. In the aforementioned case, the deposition source 50 is positioned in the center or corner of the chamber 10. The magnetic field generating unit 60 is positioned in the chamber 10 and brings the substrate 100 and the mask assembly 20 into close contact. In this case, the magnetic force generating unit 60 may include an electromagnet or permanent magnet that generates magnetic force.

[0105] The vision unit 70 is positioned in the chamber 10 and captures images of the positions of the mask assembly 20 and the substrate 100. At this time, the vision unit 70 photographs at least one alignment mark or the like on the mask assembly 20 and the substrate 100. The pressure regulating unit 80 is connected to the chamber 10 and regulates the pressure inside the chamber 10. In this case, the pressure regulating unit 80 includes a connecting pipe 81 connected to the chamber 10, and a pump 82 positioned in the connecting pipe 81.

[0106] Regarding the operation of the manufacturing apparatus 1 for the display device described above, the pressure adjustment unit 80 opens the gate valve 11 while maintaining the air pressure inside the chamber 10 to be the same as or similar to atmospheric pressure, and inserts the substrate 100 and the mask assembly 20 into the chamber 10. At this time, at least one of the substrate 100 and the mask assembly 20 is moved via a separate robotic arm located outside the chamber 10 or via a shuttle that inserts into or pulls out of the chamber 10. At this time, the substrate 100 is in a state in which each layer, the pixel definition film 119, and the pixel electrode 210 are formed, for example, as shown in Figure 7, which are located below the pixel definition film 119. After placing the mask frame 21 and the substrate 100 on the second support section 40 and the first support section 30, respectively, the positions of the mask frame 21 and the substrate 100 are sensed and aligned by the vision section 70.

[0107] After that, the substrate 100 and the mask frame 21 are brought close together, and then the magnetic force generating unit 60 brings the mask frame 21 and the substrate 100 into close contact with each other. When the deposition material is released from the deposition source 50, the deposition material is deposited onto the substrate 100 through the first pattern hole PH1 and the second pattern hole PH2 of the mask sheet 22, forming a pattern. At this time, the vapor-deposited material is deposited onto the substrate 100 to form, for example, an intermediate layer 220 (Figure 7), or at least one layer within the intermediate layer 220 (Figure 7) (for example, at least one of an organic light-emitting layer and a functional layer). Once the above process is complete, the substrate 100 is either removed from the chamber 10 or moved to another location within the chamber 10, and another layer is formed on the substrate 100.

[0108] The tasks described above are performed individually at various levels. For example, pixel electrodes are formed via the mask assembly 20 described above, the substrate 100 is transferred to another display device manufacturing apparatus, and at least one of the functional layers, a hole transport layer and a hole injection layer, is formed on the pixel electrodes. In a manufacturing apparatus for another display device, the substrate 100 is transferred and an organic light-emitting layer is formed on the functional layer, and the substrate 100 is transferred to another manufacturing apparatus for another display device and a hole transport layer and an electron injection layer are formed on the organic light-emitting layer, which are part of the functional layer. In this case, the organic light-emitting layers, each embodying a different color, are formed on the substrate 100 using different mask assemblies in a separate manufacturing apparatus for the display device. Once the above process is complete, the counter electrode and thin film sealing layer are sequentially formed on the functional layer using other manufacturing equipment for display devices. In the above-described case, at least one of the pixel electrodes, functional layer, and organic light-emitting layer is formed on the substrate 100 in a manufacturing apparatus for a display device that is identical to or similar to the manufacturing apparatus for a display device shown in Figure 8.

[0109] Figures 10A and 10B are schematic plan views showing a partial configuration of the mask sheet and support frame of a mask assembly according to one embodiment of the present invention. First, referring to Figure 10A, a portion of the mask sheet 22 is superimposed on the support frame 23. In the pattern holes of the mask sheet 22, the support frame 23 shields the pattern holes located in the region where it overlaps with the support frame 23.

[0110] In other words, the vapor-deposited material cannot pass through the pattern holes located in the region where the support frame 23 and the mask sheet 22 overlap. Therefore, the region between the support frames 23 that are separated from each other is defined as the deposition region A. Depending on the shape and arrangement of the support frame 23, the deposition region A can have shapes such as rectangles and squares, as well as polygons like triangles, ellipses, circles, and so on. The deposition region A includes a first region A1 and a second region A2 that is surrounded on at least one side by the first region A1 on a plane. Figure 10A shows that there is only one second region A2, but it is not limited to this and may include two or more second regions A2.

[0111] The mask sheet 22 is provided with a first pattern hole PH1 and a second pattern hole PH2 to allow the vapor-deposited material to pass through. The first pattern hole PH1 and the second pattern hole PH2 are holes that penetrate the mask sheet 22 in the thickness direction. The first pattern hole PH1 is located in the first region A1 within the deposition region A, and the second pattern hole PH2 is located in the second region A2 within the deposition region A. The shapes of the first pattern hole PH1 and the second pattern hole PH2 are rectangular or square, and can be various shapes such as polygons like triangles, circles, or ellipses.

[0112] Here, the shapes of the first pattern hole PH1 and the second pattern hole PH2 are, for example, the shapes on a plane parallel to one side of the mask sheet 22 facing the deposition source 50. In Figure 10A, both the first pattern hole PH1 and the second pattern hole PH2 have a rectangular shape, but are not limited to this. The shapes of the first pattern hole PH1 and the second pattern hole PH2 may be different from each other. Furthermore, the areas of the first pattern hole PH1 and the second pattern hole PH2 may be different from each other. Here, the area of ​​the first pattern hole PH1 and the second pattern hole PH2 is the shape size of the first pattern hole PH1 and the second pattern hole PH2 on a plane. For example, the shape size of the first pattern hole PH1 is smaller than the planar shape size of the second pattern hole PH2. Figure 10A shows the first pattern hole PH1 and the second pattern hole PH2 as having the same shape and size, but they are not limited to this.

[0113] The number of first pattern holes PH1 and second pattern holes PH2 per unit area (i.e., density) may be different from each other. In one embodiment, the number of first pattern holes PH1 per unit area is greater than the number of second pattern holes PH2 per unit area. Through this, the first region A1 and the second region A2 of the mask sheet 22 correspond to the first region DD of the display device DD, respectively. 2 Display area DA 2 and the 1 Display area DA 1 A display device DD can be manufactured so that it has different resolutions from the other. Figure 10A shows four second pattern holes PH2 arranged in the second region A2, but this is illustrative and not limiting.

[0114] On the other hand, the thicknesses of the first region A1 and the second region A2 of the mask sheet 22 may be different from each other. For example, the thickness in the second region A2 is thinner than the thickness in the first region A1, and the thickness in the second region A2 may be 50% or less, 40% or less, 30% or less, or 20% or less of the thickness in the first region A1. Related matters will be discussed in detail later, with reference to Figure 16F.

[0115] Referring to Figure 10B, a reference hole RH is added and placed in the second region A2 of the mask sheet 22. The reference hole RH is a through hole. Reference holes RH are arranged in at least two locations at the edge of the second region A2. For example, if the second region A2 has a rectangular shape, two reference holes RH are placed adjacent to two corners of the second region A2 that are located on opposite diagonals from each other, or, as shown in Figure 10B, four reference holes RH are placed adjacent to all four corners of the second region A2. In addition to the above, if the second region A2 has a circular shape, at least two or more reference holes RH may be placed along its edge along the circumference. The reference hole RH is also used to align the material (base material) of the mask sheet 22 during the laser beam processing stage, as will be explained in detail with reference to Figure 19. Through this, a laser beam can be irradiated onto the material of the mask sheet 22 at precise locations, forming intricate patterned holes.

[0116] Figure 11A is a plan view showing the pixel arrangement of a display device according to one embodiment of the present invention. Referring to Figure 11A, the auxiliary pixels PXa located in the first display area DA1 include the first auxiliary pixel PXa1, the second auxiliary pixel PXa2, and the third auxiliary pixel PXa3. At this time, the first auxiliary pixel PXa1, the second auxiliary pixel PXa2, and the third auxiliary pixel PXa3 each emit light of a different color from one another. Furthermore, the first auxiliary pixel PXa1, the second auxiliary pixel PXa2, and the third auxiliary pixel PXa3 are formed such that their shape and area on the plane are either identical or different from each other.

[0117] The main pixels PXm located in the second display area DA2 include the first main pixel PXm1, the second main pixel PXm2, and the third main pixel PXm3. In this case, the first main pixel PXm1, the second main pixel PXm2, and the third main pixel PXm3 may each emit different colors from each other, and their respective shapes and areas on a plane may be the same or different from each other. The first main pixel PXm1, the second main pixel PXm2, and the third main pixel PXm3 emit light of the same color as the first auxiliary pixel PXa1, the second auxiliary pixel PXa2, and the third auxiliary pixel PXa3, respectively.

[0118] As mentioned above, the auxiliary pixels PXa and main pixels PXm can take on various forms. For example, the main pixels PXm are arranged in an S-stripe type. In this case, the S-stripe type has one of the first main pixel PXm1, second main pixel PXm2, and third main pixel PXm3 being rectangular, while the remaining two of the first main pixel PXm1, second main pixel PXm2, and third main pixel PXm3 are square. In such a case, the remaining two of the first main pixel PXm1, second main pixel PXm2, and third main pixel PXm3 shown in Figure 11A are arranged to correspond to one of the first main pixel PXm1, second main pixel PXm2, and third main pixel PXm3.

[0119] The auxiliary pixels PXa are arranged in a diamond-structured pentile type. In such cases, the first auxiliary pixel PXa1, the second auxiliary pixel PXa2, and the third auxiliary pixel PXa3 are arranged radially, with one of the three auxiliary pixels PXa1, PXa2, and PXa3 as the reference. In the case described above, the resolution of the first display area DA1 will be lower than the resolution of the second display area DA2. For example, in one embodiment, the area on the plane of auxiliary pixels PXa that emit the same color and the area on the plane of main pixels PXm are different from each other. For example, the area of ​​two auxiliary pixels PXa that emit the same color on a plane is less than the area of ​​the main pixel PXm on a plane.

[0120] In another embodiment, the distance between the centers of adjacent main pixels PXm, while emitting the same color, is shorter than the distance between the centers of adjacent auxiliary pixels PXa, while emitting the same color. In yet another embodiment, the unit area of ​​the first display area DA1 (for example, 1 cm² of the first display area DA1) 2 The number of auxiliary pixels PXa located in the second display area DA2 is equal to the unit area of ​​the second display area DA2 (for example, 1 cm² of the second display area DA2). 2 This is less than the number of main pixels (PXm) located in the ). Alternatively, the number of auxiliary pixels PXa arranged in the same area in the first display area DA1 and the second display area DA2 is less than the number of main pixels PXm. In such cases, the number of pixels is equal to the number of pixels that emit the same color light.

[0121] Figure 11B is a plan view showing a portion of the first mask sheet used during the manufacturing of the first main pixel and the first auxiliary pixel shown in Figure 11A. Referring to Figures 11A and 11B, the pixels of the display device DD manufactured using the first pattern hole PH1 of the mask sheet 22 are arranged in an S-stripe type, and the pixels of the display device DD manufactured using the second pattern hole PH2 are arranged in a diamond-structured pentile type.

[0122] Each pattern hole corresponds to one pixel on the display device DD. For example, a deposited material that passes through one pattern hole and is deposited onto the substrate forms an intermediate layer 220 (Figure 7) of one pixel of the display device DD. Each pixel represents a light-emitting region that emits a different color from the others; each pixel is, for example, one of the following: a red (R) pixel, a green (G) pixel, and a blue (B) pixel. When forming the first auxiliary pixel PXa1 and the first main pixel PXm1 via the manufacturing apparatus 1 of the display device shown in Figure 8, a first mask sheet (22-1) is used. At this time, a (1-1)-th pattern hole (PH1-1) and a (2-1)-th pattern hole (PH2-1) are formed in the first mask sheet (22-1). The vapor deposition material that has passed through such the (1-1)-th pattern hole (PH1-1) and the (2-1)-th pattern hole (PH2-1) is deposited on the substrate 100, and forms a layer having a predetermined pattern, such as a part of a source electrode, an organic light emitting layer and a functional layer, in the first main pixel PXm1 and the first auxiliary pixel PXa1 respectively.

[0123] The (1-1)-th pattern hole (PH1-1) and the (2-1)-th pattern hole (PH2-1) as described above are respectively First main pixel PXm1 and first auxiliary pixel PXa1 formed to correspond to the size and shape of . In such a case, the (1-1)-th pattern hole (PH1-1) and the (2-1)-th pattern hole (PH2-1) are respectively First main pixel PXm1 and first auxiliary pixel PXa1 arranged on the first mask sheet (22-1) so as to correspond to the position of . In such a case, the relationship between the (1-1)-th pattern hole (PH1-1) and the (2-1)-th pattern hole (PH2-1) is First main pixel PXm1 and first auxiliary pixel PXa1 identical or similar to the relationship with .

[0124] For example, the number of the (1-1)-th pattern holes (PH1-1) per the same area in the first area A1 of the first mask sheet (22-1) is larger than the number of the (2-1)-th pattern holes (PH2-1) per the same area in the second area A2 of the first mask sheet (22-1). For example, the areas of the first area A1 and the second area A2 shown in FIG. 11B are the same, 24 (1-1)-th pattern holes (PH1-1) are arranged in the first area A1 of the same area, and 4 (2-1)-th pattern holes (PH2-1) are arranged in the second area A2 of the same area. Through this, a display device DD having display areas with different resolutions from each other can be manufactured.

[0125] Depending on the designed resolution, the number of the (1-1)th pattern holes (PH1-1) and the number of the (2-1)th pattern holes (PH2-1) per unit area may be different from each other. Meanwhile, in the second region A2, the region where the (2-1)th pattern holes (PH2-1) are not disposed corresponds to the transmissive region TA of the display device DD. In the above case, a first interval W1 between adjacent (1-1)th pattern holes (PH1-1) is different from a second interval W2 between adjacent (2-1)th pattern holes (PH2-1). In this case, the interval between pattern holes is also defined as the distance between the centers of adjacent pattern holes, or the distance between frames disposed at the same position among frames of pattern holes arranged adjacent to each other, etc.

[0126] However, in the following description, the interval between pattern holes will be detailed on the premise that it means the distance between the centers of adjacent pattern holes. In the above case, the first interval W1 is narrower than the second interval W2. Through this arrangement, the interval between adjacent first main pixels PXm1 formed in the display device DD is narrower than the interval between adjacent first auxiliary pixels PXa1. In the above case, the first auxiliary pixel PXa1 and the first main pixel PXm1 emit one of red, green, or blue light. In the following description, for convenience of explanation, the details will be mainly given based on the case where the first auxiliary pixel PXa1 and the first main pixel PXm1 emit red light.

[0127] FIG. 11C is a plan view showing a part of a second mask sheet used in manufacturing the second main pixel and the second auxiliary pixel illustrated in FIG. 11A. Referring to FIGS. 11A and 11C, when the second auxiliary pixel PXa2 and the second main pixel PXm2 are formed via the manufacturing apparatus 1 for a display device illustrated in FIG. 8, a second mask sheet (22-2) is used.

[0128] At this time, the second mask sheet (22-2) has (1-2) pattern holes (PH1-2) and (2-2) pattern holes (PH2-2). The deposited material that has passed through the (1st-2nd) pattern holes (PH1-2) and the (2nd-2nd) pattern holes (PH2-2) is deposited on the substrate 100, forming layers with a certain pattern on the second main pixel PXm2 and the second auxiliary pixel PXa2, respectively, such as a source electrode, an organic light-emitting layer, and a part of a functional layer. The aforementioned (1-2) pattern holes (PH1-2) and (2-2) pattern holes (PH2-2) are, respectively Second main pixel PXm2 and second auxiliary pixel PXa2 It is formed to correspond to the size and shape.

[0129] In such cases, the (1-2) pattern holes (PH1-2) and the (2-2) pattern holes (PH2-2) are positioned on the second mask sheet (22-2) so as to correspond to the positions of the second main pixel PXm2 and the second auxiliary pixel PXa2, respectively. In such cases, the relationship between the (1-2) pattern hole (PH1-2) and the (2-2) pattern hole (PH2-2) is the same as, or similar to, the relationship between the (1-1) pattern hole (PH1-1) and the (2-1) pattern hole (PH2-1) shown in Figure 11B. Furthermore, the relationship between the second auxiliary pixel PXa2 and the second main pixel PXm2 is the same as, or similar to, the relationship between the first auxiliary pixel PXa1 and the first main pixel PXm1 described above. In the aforementioned case, the second auxiliary pixel PXa2 and the second main pixel PXm2 emit light in one of the following colors: red, green, or blue. In the following, for the sake of clarity, the second auxiliary pixel PXa2 and the second main pixel PXm2 will be described in detail, focusing primarily on the case where they emit green light.

[0130] Figure 11D is a plan view showing a portion of the third mask sheet used during the manufacturing of the third main pixel and third auxiliary pixel shown in Figure 11A. Referring to Figures 11A and 11D, when forming the third auxiliary pixel PXa3 and the third main pixel PXm3 via the manufacturing apparatus 1 of the display device shown in Figure 8, a third mask sheet (22-3) is used. At this time, the (1st-3rd) pattern holes (PH1-3) and the (2nd-3rd) pattern holes (PH2-3) are formed in the third mask sheet (22-3). The deposited material that has passed through the (1st-3rd) pattern holes (PH1-3) and the (2nd-3rd) pattern holes (PH2-3) is deposited on the substrate 100, forming layers with a certain pattern at the corresponding positions of the third main pixel PXm3 and the third auxiliary pixel PXa3, respectively, such as a source electrode, an organic light-emitting layer, and a functional layer.

[0131] The aforementioned (1-3) pattern holes (PH1-3) and (2-3) pattern holes (PH2-3) are formed to correspond to the size and shape of the third main pixel PXm3 and the third auxiliary pixel PXa3, respectively. At this time, the (1-3) pattern holes (PH1-3) and the (2-3) pattern holes (PH2-3) are arranged on the third mask sheet (22-3) so as to correspond to the positions of the third main pixel PXm3 and the third auxiliary pixel PXa3, respectively. In such cases, the (1st-3rd) pattern holes (PH1-3) and the (2nd-3rd) pattern holes (PH2-3) have different shapes from each other. In such cases, the size of the (1st-3rd) pattern holes (PH1-3) is smaller than the size of the (2nd-3rd) pattern holes (PH2-3).

[0132] However, the number of (2-3) pattern holes (PH2-3) per unit area, and the distance between adjacent (2-3) pattern holes (PH2-3), are greater than the number of (1-3) pattern holes (PH1-3) per unit area, and the distance between adjacent (1-3) pattern holes (PH1-3). In this case, the relationship between the third auxiliary pixel PXa3 and the third main pixel PXm3 is the same as, or similar to, the relationship between the (2nd-3rd) pattern holes (PH2-3) and the (1st-3rd) pattern holes (PH1-3) described above. In the aforementioned case, the third auxiliary pixel PXa3 and the third main pixel PXm3 emit light in one of the following colors: red, green, or blue. In the following, for the sake of clarity, the third auxiliary pixel PXa3 and the third main pixel PXm3 will be described in detail, focusing primarily on the case where they emit blue light.

[0133] On the other hand, in cases other than those mentioned above, when forming pixel electrodes or forming a layer in a patterned form that is common to all pixels in a functional layer, the mask sheets shown in Figures 11B to 11D can be used, or, although not shown in the figures, a single mask sheet can also be used. When forming a layer common to all pixels using a single mask sheet, a mask sheet is used in which first and second pattern holes are formed to correspond to all pixels, as shown in Figure 11A. In such cases, the pattern holes shown in Figures 11B to 11D are arranged on a single mask sheet so that they do not overlap with each other.

[0134] Figure 12 is a plan view showing the pixel arrangement of a display device according to another embodiment of the present invention. Referring to Figure 12, the main pixel PXm has a hexagon structure, and the auxiliary pixel PXa has an S-stripe structure. In this case, the hexagonal structure consists of the first main pixel PXm1, the second main pixel PXm2, and the third main pixel PXm3, which are arranged at regular intervals from each other, although their planar shape is hexagonal.

[0135] Furthermore, the first auxiliary pixel PXa1, the second auxiliary pixel PXa2, and the third auxiliary pixel PXa3 are arranged in the same configuration as the first main pixel PXm1, the second main pixel PXm2, and the third main pixel PXm3 shown in Figure 11A. However, in such a case, the distance between adjacent first auxiliary pixels PXa1, the distance between adjacent second auxiliary pixels PXa2, and the distance between adjacent third auxiliary pixels PXa3 are respectively different from the distance between adjacent first main pixels PXm1, the distance between adjacent second main pixels PXm2, and the distance between adjacent third main pixels PXm3 shown in FIG. 11A.

[0136] The aforementioned auxiliary pixels PXa and main pixels PXm are each manufactured through a mask sheet having a shape similar to that shown in FIGS. 11B to 11D. That is, each pattern hole shown in FIGS. 11B to 11D is formed so as to respectively correspond to the auxiliary pixels PXa and the main pixels PXm shown in FIG. 12. In such a case, the first auxiliary pixels PXa1 and the first main pixels PXm1 are formed on a substrate at the same time, and the second auxiliary pixels PXa2 and the second main pixels PXm2 are also formed on the substrate at the same time. Furthermore, the third auxiliary pixels PXa3 and the third main pixels PXm3 are also formed on the substrate at the same time.

[0137] FIG. 13 is a plan view showing a pixel arrangement of a display device according to still another embodiment of the present invention. Referring to FIG. 13, the auxiliary pixels PXa are arranged in a stripe shape, and the main pixels PXm have a circular planar shape and are arranged in a PenTile structure. At this time, the planar shapes of the first auxiliary pixel PXa1, the second auxiliary pixel PXa2, and the third auxiliary pixel PXa3 are formed in a line shape. Furthermore, the planar shapes of the first main pixel PXm1, the second main pixel PXm2, and the third main pixel PXm3 are circular.

[0138] In the aforementioned case, within the same area or unit area, the area of the first auxiliary pixels PXa1 disposed in the first display area DA1 is smaller than the area of the first main pixels PXm1 disposed in the second display area DA2. In the same area or per unit area, the area of ​​the second auxiliary pixel PXa2 located in the first display area DA1 is smaller than the area of ​​the second main pixel PXm2 located in the second display area DA2. In the same area or per unit area, the area of ​​the third auxiliary pixel PXa3 located in the first display area DA1 is smaller than the area of ​​the third main pixel PXm3 located in the second display area DA2.

[0139] The auxiliary pixel PXa and main pixel PXm, as described above, are manufactured via mask sheets similar in form to those shown in Figures 11B to 11D. In other words, each pattern hole shown in Figures 11B to 11D is formed to correspond to the auxiliary pixel PXa and the main pixel PXm shown in Figure 12, respectively. In such cases, the first auxiliary pixel PXa1 and the first main pixel PXm1 are formed on the substrate simultaneously, and the second auxiliary pixel PXa2 and the second main pixel PXm2 are also formed on the substrate simultaneously. Furthermore, the third auxiliary pixel PXa3 and the third main pixel PXm3 are also formed on the substrate simultaneously.

[0140] Figure 14 is a plan view showing the pixel arrangement of a display device according to yet another embodiment of the present invention. Referring to Figure 14, the auxiliary pixel PXa and the main pixel PXm are each formed in a rhombus shape and arranged in a pentile structure. In such cases, the area of ​​the auxiliary pixel PXa, which emits the same color light, and the area of ​​the main pixel PXm on the plane are different. For example, the area on a plane of two main pixels PXm that emit the same color is smaller than the area on a plane of two auxiliary pixels PXa.

[0141] Specifically, the area of ​​the first main pixel PXm1 on the plane is smaller than the area of ​​the first auxiliary pixel PXa1 on the plane, the area of ​​the second main pixel PXm2 on the plane is smaller than the area of ​​the second auxiliary pixel PXa2 on the plane, and the area of ​​the third main pixel PXm3 on the plane is smaller than the area of ​​the third auxiliary pixel PXa3 on the plane. In the case described above, the same color is emitted, and the number of main pixels PXm per unit area is greater than the number of auxiliary pixels PXa per unit area. In another embodiment, the total area of ​​main pixels PXm included in a unit area emitting the same color is larger than the total area of ​​auxiliary pixels PXa included in that unit area. Alternatively, while emitting the same color, the distance between adjacent auxiliary pixels PXa is longer than the distance between adjacent main pixels PXm while emitting the same color. In such cases, the resolution of the first display area DA1 will be lower than the resolution of the second display area DA2. The relationship between the main pixel PXm and the auxiliary pixel PXa described above is reversed when the resolution of the first display area DA1 is higher than the resolution of the second display area DA2.

[0142] The auxiliary pixels PXa and main pixels PXm, as described above, are manufactured via mask sheets similar in form to those shown in Figures 11B to 11D. In other words, each pattern hole shown in Figures 11B to 11D is formed to correspond to the auxiliary pixel PXa and the main pixel PXm shown in Figure 12, respectively. In such cases, the first auxiliary pixel PXa1 and the first main pixel PXm1 are formed on the substrate simultaneously, and the second auxiliary pixel PXa2 and the second main pixel PXm2 are also formed on the substrate simultaneously. Furthermore, the third auxiliary pixel PXa3 and the third main pixel PXm3 are also formed on the substrate simultaneously.

[0143] The form and arrangement of the main pixels PXm and the auxiliary pixels PXa, as described above, are not limited to those described above. For example, each pixel may have an S-stripe configuration, but also a configuration in which rectangular pixels are arranged in the X direction. In another embodiment, each pixel can be formed in a stripe pattern. In the aforementioned case, the form and arrangement of the main pixel PXm and auxiliary pixel PXa are not limited to those described above, and may include all forms and arrangements such that the resolution of the first display area DA1 and the resolution of the second display area DA2 are different from each other.

[0144] Figures 15A to 15F are schematic cross-sectional views illustrating the manufacturing sequence of a mask sheet according to one embodiment of the present invention. Referring to Figure 15A, the base material M is prepared in order to manufacture the mask sheet 22. Such a base material M is in a state where foreign matter adsorbed on each surface has been removed through processes such as polishing and cleaning. The base material M is a thin sheet and may include stainless steel, invar, nickel (Ni), cobalt (Co), nickel alloys, nickel-cobalt alloys, etc.

[0145] Once the base material M is prepared, the first photoresist PR1 and the second photoresist PR2 are placed on the first surface M1 and the second surface M2 of the base material M, respectively. In this case, the first photoresist PR1 and the second photoresist PR2 can be placed sequentially on the base material M, or they can be placed on the base material M simultaneously. Subsequently, the first photoresist PR1 in the first region A1 is exposed and treated with a developer to form the first aperture OP1, and the second photoresist PR2 in the first region A1 is exposed and developed to form the second aperture OP2. The position of the second opening OP2 corresponds to the position of the first opening OP1. At this time, the method of exposing the photoresist and forming photoresist apertures differs depending on whether the photoresist has a negative or positive property.

[0146] In other words, if a photoresist is exposed and then treated with a developer solution, if the photoresist is a negative type, the unexposed photoresist areas will be removed, but if the photoresist is a positive type, the exposed photoresist areas will be removed. Through the aforementioned process, a first photoresist PR1 having a first opening OP1 located in a first region A1 of the base material M is formed on the first surface M1 of the base material M, and a second photoresist PR2 having a second opening OP2 corresponding to the first opening OP1 is formed on the second surface M2 of the base material M. On the other hand, as shown in Figure 9, when the mask assembly 20 including the mask sheet 22 is placed inside the chamber 10, the first surface M1 corresponds to one side of the mask sheet 22 facing the substrate 100, and the second surface M2 corresponds to the other side of the mask sheet 22 facing the deposition source 50.

[0147] Referring to Figure 15B, after the above-mentioned steps are completed, the etching solution is sprayed into the first opening OP1. At this time, the first surface M1 of the base material M on which the first photoresist PR1 is placed is positioned facing downwards, and the etching solution is sprayed from the bottom of the first photoresist PR1 toward the first surface M1. When etching solution is sprayed onto the first opening OP1, a portion of the first surface M1 of the base material M is etched at the position corresponding to the first opening OP1. Through this, a groove corresponding to the first opening OP1 is formed on the first surface M1. Since the first opening OP1 is located only in the first region A1, no groove is formed in the second region A2 by the etching solution.

[0148] Referring to Figure 15C, the first photoresist PR1 is removed from the first surface M1 of the base material M. As another example, the first photoresist PR1 is removed along with the second photoresist PR2 when the second photoresist PR2 is removed, as will be described later.

[0149] Referring to Figure 15D, etching solution is sprayed into the second opening OP2. At this time, the etching solution is sprayed from the top of the second photoresist PR2 toward the second surface M2 of the base material M. When etching solution is sprayed into the second opening OP2, the second surface M2 of the base material M is etched at the position corresponding to the second opening OP2, and therefore, a first pattern hole PH1 penetrating the base material M is formed. Since the second opening OP2 is located only in the first region A1, no hole is formed in the second region A2.

[0150] Referring to Figure 15E, the second photoresist PR2 is removed from the second surface M2 of the base material M. Referring to Figure 15F, after the process described above is completed, a laser beam is irradiated onto the second surface M2 of the base material M at a predetermined position within the second region A2 of the base material M using a laser processing device to form the second pattern hole PH2. At this time, the second pattern hole PH2 is formed such that the width of the inner surface of the second pattern hole PH2 gradually widens from the first surface M1 to the second surface M2. In this case, the width is the distance between the inner surfaces of the second pattern holes PH2, which are aligned perpendicular to the thickness direction of the base material M. As another example, the second photoresist PR2 is removed after a laser beam is irradiated onto the base material M to form the second pattern hole PH2.

[0151] In one embodiment, the process of forming a second pattern hole PH2 via a laser beam is carried out by repeating the process multiple times while varying the laser processing conditions, such as the focal depth of the laser beam and the processing area. By irradiating the second surface M2 of the base material M with a laser beam, the base material M is removed from the second surface M2 along the thickness direction of the base material M. At this time, the profile of the inner surface of the second pattern hole PH2 is formed while changing the focal depth of the laser beam in the thickness direction of the base material M. To improve the processing accuracy via laser beams, a scanner or AOD (acousto-optic deflector) can be used to control the number of laser beams, depth of field, incident angle, shape, and position. The laser processing apparatus will be described in detail below, referring to Figure 19.

[0152] The display device DD has multiple display areas, and differences are required between these display areas in terms of characteristics such as the shape, arrangement, size, and resolution of the pixels placed in each display area. In order to manufacture such a display device DD, the mask sheet 22 also needs to have differences in characteristics such as the shape, arrangement, size, and density of pattern holes between the regions corresponding to multiple display areas. According to one embodiment of the present invention, when two or more pattern holes having different characteristics are formed on a single mask sheet 22 as described above, a mask sheet 22 of improved quality can be manufactured.

[0153] As a comparative example, if etching is performed using the same processing conditions even though the first pattern hole PH1 in the first region A1 and the second pattern hole PH2 in the second region A2 of the mask sheet 22 have different characteristics, the processing deviation between the pattern holes will increase, resulting in a decrease in the processing quality of the mask sheet 22. For example, the usable thickness of the base material M varies depending on the size (area) of the pattern hole to be formed, but in the comparative example, this cannot be taken into account, resulting in a decrease in the processing quality of the pattern hole. However, according to one embodiment of the present invention, in the case of a first pattern hole PH1 located in a first region A1 of the mask sheet 22, etching is performed under processing conditions determined considering the characteristics of the first pattern hole PH1, such as its shape, arrangement, size, and density, to obtain consistent quality. In the case of a second pattern hole PH2 in a second region A2, where relatively precise processing is required, processing accuracy can be improved by forming it separately via a laser beam. This allows us to obtain a mask sheet 22 with improved overall quality.

[0154] Furthermore, in the case of the second pattern hole PH2, a laser beam is used to form the second pattern hole PH2 such that the width of the inner surface of the second pattern hole PH2 gradually widens from the first surface M1 to the second surface M2. In such cases, no protrusion is formed in the middle of the inner surface of the second pattern hole PH2. By utilizing such a second pattern hole PH2 during deposition, the shadow phenomenon can be minimized, thereby improving the manufacturing quality of the display device DD. Furthermore, in the case of the second pattern hole PH2, since processing is performed using a laser beam, precise processing is possible without any constraints on the diverse shapes of the second pattern hole PH2.

[0155] Figures 16A to 16F are schematic cross-sectional views illustrating the manufacturing sequence of a mask sheet according to another embodiment of the present invention. First, we will omit the details that are the same as those explained with reference to Figures 15A to 15F, and instead focus on explaining the differences.

[0156] Referring to Figure 16A, the first photoresist PR1 and the second photoresist PR2 are placed on the first surface M1 and the second surface M2 of the base material M, respectively. Subsequently, the first photoresist PR1 is exposed and treated with a developing solution to form the first opening OP1 located in the first region A1. The second photoresist PR2 is exposed and developed to form the second aperture OP2 located in the first region A1 and the third aperture OP3 located in the second region A2. The second opening OP2 corresponds to the first opening OP1, and the third opening OP3 is formed to correspond to the entire second region A2. Through the aforementioned process, a first photoresist PR1 having a first opening OP1 located in a first region A1 of the base material M is formed on the first surface M1 of the base material M, and a second photoresist PR2 having a second opening OP2 corresponding to the first opening OP1 and a third opening OP3 formed to correspond to the entire second region A2 of the base material M is formed on the second surface M2 of the base material M.

[0157] Referring to Figure 16B, after the above-mentioned process is completed, etching solution is sprayed into the first opening OP1, and a portion of the first surface M1 of the base material M is etched at the position corresponding to the first opening OP1. As a result, a groove corresponding to the first opening OP1 is formed on the first surface M1. Referring to Figure 16C, the first photoresist PR1 is removed from the first surface M1 of the base material M.

[0158] Referring to Figure 16D, etching solution is sprayed into the second opening OP2 and the third opening OP3. When etching solution is sprayed into the second opening OP2, the second surface M2 of the base material M is etched at the position corresponding to the second opening OP2, and therefore, a first pattern hole PH1 penetrating the base material M is formed. When etching solution is sprayed into the third opening OP3, a portion of the second surface M2 of the base material M is etched at the position corresponding to the third opening OP3, and therefore a wide etched surface is formed in the second region A2 of the base material M. In this case, the etching depth may be 50% or more, 60% or more, 70% or more, or 80% or more of the original thickness of the base material M.

[0159] Referring to Figure 16E, the second photoresist PR2 is removed from the second surface M2 of the base material M. Referring to Figure 16F, after the process described above is completed, a laser beam is irradiated by a laser processing device onto an etched surface formed on the second surface M2 of the base material M, corresponding to the third opening OP3, at a predetermined position within the second region A2 of the base material M, thereby forming the second pattern hole PH2. This is used to manufacture the mask sheet 22.

[0160] In this case, the thicknesses of the first region A1 and the second region A2 of the mask sheet 22 may be different from each other. For example, the thickness T1 in the first region A1 of the mask sheet 22 is thinner than the thickness T2 in the second region A2. The thickness in the second region A2 may be 50% or less, 40% or less, 30% or less, or 20% or less of the thickness in the first region A1. According to the embodiment of the present invention described above, since the second surface M2 of the second region A2 is partially etched in advance before forming the second pattern hole PH2, the amount of laser beam processing can be reduced. This improves the processability of the laser beam and minimizes the amount of dust that may be generated during laser processing.

[0161] Figures 17A to 17G are schematic cross-sectional views illustrating the manufacturing sequence of a mask sheet according to yet another embodiment of the present invention. First, we will omit the parts that are the same as those explained with reference to Figures 15A to 15F, and instead focus on explaining the differences.

[0162] Referring to Figure 17A, the first photoresist PR1 and the second photoresist PR2 are placed on the first surface M1 and the second surface M2 of the base material M, respectively. Subsequently, the first photoresist PR1 is exposed and treated with a developing solution to form the first opening OP1 located in the first region A1. The second photoresist PR2 is exposed and developed to form a second aperture OP2 located in the first region A1, and a plurality of fourth apertures OP4 located in the second region A2 and spaced apart from each other. The second opening OP2 corresponds to the first opening OP1, and the fourth opening OP4 corresponds to a predetermined position where the second pattern hole PH2 is formed. Therefore, the number of fourth openings OP4 is the same as the number of second pattern holes PH2 that are formed. Through the aforementioned process, a first photoresist PR1 having a first opening OP1 located in a first region A1 of the base material M is formed on the first surface M1 of the base material M, and a second photoresist PR2 having a second opening OP2 corresponding to the first opening OP1, and a plurality of fourth openings OP4 arranged in a second region A2 of the base material M and spaced apart from each other is formed on the second surface M2 of the base material M.

[0163] Referring to Figure 17B, after the above-mentioned process is completed, etching solution is sprayed into the first opening OP1, and a portion of the first surface M1 of the base material M is etched at the position corresponding to the first opening OP1. As a result, a groove corresponding to the first opening OP1 is formed on the first surface M1. Referring to Figure 17C, the first photoresist PR1 is removed from the first surface M1 of the base material M.

[0164] Referring to Figure 17D, etching solution is sprayed into the second opening OP2 and the fourth opening OP4. When etching solution is sprayed into the second opening OP2, the second surface M2 of the base material M is etched at the position corresponding to the second opening OP2, and therefore, a first pattern hole PH1 penetrating the base material M is formed. When etching solution is sprayed into the fourth opening OP4, a portion of the second surface M2 of the base material M is etched at the position corresponding to the fourth opening OP4. In this case, the etching depth may be 50% or more, 60% or more, 70% or more, or 80% or more of the original thickness of the base material M. The size (area) of the hole formed at the position corresponding to the fourth opening OP4 is smaller than the size of the second pattern hole PH2.

[0165] Referring to Figure 17E, the second photoresist PR2 is removed from the second surface M2 of the base material M. Referring to Figure 17F, after the process described above is completed, in the second region A2 of the base material M, a laser beam is irradiated by a laser processing device onto the etching surface formed on the second surface M2 of the base material M corresponding to the fourth aperture OP4, thereby forming the second pattern hole PH2. This is used to manufacture the mask sheet 22.

[0166] According to the embodiment of the present invention described above, before forming the second pattern hole PH2, a portion of the second surface M2 of the base material M is etched in advance at the position where the second pattern hole PH2 will be formed. This not only reduces the amount of laser processing, but also makes it easy to identify the position where the second pattern hole PH2 will be formed, and therefore allows for manual laser processing when necessary.

[0167] Referring to Figure 17G, in some embodiments, a portion of the base material M remains etched by the etching solution around the second pattern hole PH2. Such a structure is formed when the width of the fourth opening OP4 is wider than the width of the second pattern hole PH2. In that case, in the second region A2 of the mask sheet 22, the thickness t2 in the surrounding region adjacent to the second pattern hole PH2 (t2-1) is thinner than the thickness t1 in the first region A1, and the thickness (t2-2) in the region between adjacent second pattern holes PH2 is substantially the same as the thickness t1 in the first region A1. Before forming the second pattern hole PH2, a portion of the second surface M2 of the base material M can be sufficiently etched in advance at the location where the second pattern hole PH2 will be formed, thereby reducing the amount of laser processing and making it easy to identify the location where the second pattern hole PH2 will be formed.

[0168] Figures 18A to 18F are schematic cross-sectional views illustrating the manufacturing sequence of a mask sheet according to yet another embodiment of the present invention. Referring to Figure 18A, the first photoresist PR1 and the second photoresist PR2 are placed on the first surface M1 and the second surface M2 of the base material M, respectively. Subsequently, the first photoresist PR1 is exposed and treated with a developing solution to form the first opening OP1 located in the first region A1. The second photoresist PR2 is exposed and developed to form a second aperture OP2 located in the first region A1, and a plurality of fifth apertures OP5 located at the edge of the second region A2. The second opening OP2 corresponds to the first opening OP1.

[0169] The fifth opening OP5 is located at least two times on the edge of the second region A2. For example, if the second region A2 has a rectangular shape, the fifth opening OP5 may be positioned adjacent to the corners that are diagonally opposite each other among the four corners. Alternatively, four fifth openings OP5 may be arranged adjacent to the four corners. In addition to the above, if the second region A2 has a circular shape, at least two or more fifth openings OP5 may be arranged along its edge and circumference. Through the aforementioned process, a first photoresist PR1 having a first opening OP1 located in a first region A1 of the base material M is formed on the first surface M1 of the base material M, and a second photoresist PR2 having a second opening OP2 corresponding to the first opening OP1 and a plurality of fifth openings OP5 located at the edge of the second region A2 of the base material M is formed on the second surface M2 of the base material M.

[0170] Referring to Figure 18B, after the above-mentioned process is completed, an etching solution is sprayed into the first opening OP1, and a portion of the first surface M1 of the base material M is etched at the position corresponding to the first opening OP1. As a result, a groove corresponding to the first opening OP1 is formed on the first surface M1. Referring to Figure 18C, the first photoresist PR1 is removed from the first surface M1 of the base material M.

[0171] Referring to Figure 18D, etching solution is sprayed into the second opening OP2 and the fifth opening OP5. When etching solution is sprayed into the second opening OP2, the second surface M2 of the base material M is etched at the position corresponding to the second opening OP2, and therefore, a first pattern hole PH1 penetrating the base material M is formed. When etching solution is sprayed onto the fifth opening OP5, a portion of the second surface M2 of the base material M is etched at the position corresponding to the fifth opening OP5. In this case, the etching depth may be 10% or more, 20% or more, 30% or more, 40% or more, or 50% or more of the original thickness of the base material M. This creates at least two reference holes RH at positions corresponding to the fifth opening OP5. The reference hole RH is also used to align the base material M during the laser beam-assisted processing stage, as will be explained in detail with reference to Figure 19.

[0172] Referring to Figure 18E, the second photoresist PR2 is removed from the second surface M2 of the base material M. Referring to Figure 18F, after the process described above is completed, a laser beam is irradiated onto the second surface M2 of the base material M in the second region A2 of the base material M using a laser processing device to form the second pattern hole PH2. This is used to manufacture the mask sheet 22.

[0173] Figure 19 shows a schematic configuration of a laser processing apparatus according to one embodiment of the present invention. Referring to Figure 19, the laser processing apparatus 90 includes a laser oscillation unit 91, an optical system 92, a scanning unit 93, a stage 94, and an inspection unit 95.

[0174] The laser oscillator 91 emits a pulsed laser beam that forms pattern holes in the base material M. The laser oscillator 91 may include UV (ultraviolet) lasers, CO2 lasers, and the like. The optical system 92 receives the laser beam emitted from the laser oscillator 91 and adjusts it to achieve optimal conditions for pattern hole formation. For example, the laser beam intensity, spot size, irradiation angle, and number of irradiations are finely adjusted. For example, the spot size of the laser beam is 20 μm or less, but it is not limited to that, and the spot size of the laser beam can also be changed by modifying the design of the mask sheet 22 according to the resolution of the display device DD. Furthermore, as an example, by using an ultrashort pulse laser with pulses ranging from tens of femtoseconds to hundreds of picoseconds, the generation of burrs on the surface of the mask sheet 22 can be suppressed.

[0175] The scanning unit 93 determines the position of the laser beam emitted from the laser oscillating unit 91, for example, on the second surface M2 of the base material M which is the workpiece. The scanning unit 93 may include a scanner that changes the path of the laser beam and irradiates the laser beam onto the second surface M2 of the base material M. Stage 94 supports the base material M, which is the workpiece. The base material M is placed on the stage 94 and secured by an electrostatic chuck or the like. Furthermore, the stage 94 can be precisely moved on a plane by a drive unit (not shown) to process the base material M at a desired position.

[0176] The inspection unit 95 may include a three-dimensional (3D) imaging module that can confirm the processing area of ​​the base material M and inspect whether the processing is successful or not. Furthermore, the inspection unit 95 may include an alignment camera that photographs a predetermined point on the base material M. The video data acquired from the alignment camera is compared with pre-set data to determine the degree of alignment of the base material M. This is then reflected in the process, and the stage 94 is moved via a drive unit (not shown). This aligns the base material M so that its processing position coincides with the position of the scanning unit 93 irradiated by the laser beam.

[0177] According to one embodiment of the present invention, a reference hole RH can also be used to align the base material M. The alignment camera photographs the second region A2 of the base material M, which will be processed by the laser beam, and acquires positional information of the reference hole RH located in the second region A2. Based on this information, the degree of alignment of the base material M is determined, and the stage 94 is moved to align the base material M based on the pre-set position information of the second pattern hole PH2. This allows the laser beam to be irradiated to a precise location on the second surface M2 of the base material M, thereby forming the second pattern hole PH2.

[0178] Figures 20A to 20F are schematic cross-sectional views illustrating the manufacturing sequence of a mask sheet according to yet another embodiment of the present invention. Referring to Figure 20A, the base material M is prepared in order to manufacture the mask sheet 22. Such a base material M is in a state where foreign matter adsorbed on each surface has been removed through processes such as polishing and cleaning.

[0179] Referring to Figure 20B, once the base material M is prepared, the first photoresist PR1 and the second photoresist PR2 are placed on the first surface M1 and the second surface M2 of the base material M, respectively. At this time, the first photoresist PR1 and the second photoresist PR2 are placed sequentially on the base material M, or placed on the base material M simultaneously. Subsequently, the first photoresist PR1 is exposed and developed to form the first aperture OP1, and the second photoresist PR2 is exposed and developed to form the second aperture OP2 and the third aperture OP3. At this time, the method of exposing the photoresist and forming photoresist apertures differs depending on whether the photoresist has a negative or positive property. In other words, if a photoresist is exposed and then treated with a developer solution, the unexposed areas of the photoresist will be removed if the photoresist is a negative type, but the exposed areas of the photoresist will be removed if the photoresist is a positive type.

[0180] Referring to Figure 20C, as mentioned above, when the first photoresist PR1 and the second photoresist PR2 are arranged on the base material M, the sizes of the second opening OP2 and the third opening OP3 on the plane may be different from each other. For example, if the shape of the second opening OP2 and the shape of the third opening OP3 are the same, the area of ​​the second opening OP2 will be smaller than the area of ​​the third opening OP3 on a plane. In this case, the number of second openings OP2 arranged in a unit area or the same area is greater than the number of third openings OP3. In the case described above, the second opening OP2 corresponds to the first pattern hole PH1, and the third opening OP3 corresponds to the second pattern hole PH2.

[0181] After the process described later is completed, once the first pattern hole PH1 and the second pattern hole PH2 are formed, the relationship between the first pattern hole PH1 and the second pattern hole PH2 is similar to the relationship between the second opening OP2 and the third opening OP3. In other words, the planar size of the second pattern hole PH2 located on one side of the mask sheet 22 is greater than or equal to the planar size of the first pattern hole PH1 located on the same side of the mask sheet 22. However, the number of first pattern holes PH1 arranged in the same area will be greater than the number of second pattern holes PH2. The relationships described above apply to all embodiments of the present invention. Furthermore, the aforementioned relationship can also be applied equally to the relationship between the second intermediate layer formed by the first pattern hole PH1 and placed in the first display area, and the first intermediate layer formed by the second pattern hole PH2 and placed in the second display area.

[0182] Referring to Figure 20D, after the above-mentioned steps are completed, etching solution is sprayed into the first opening OP1. At this time, the first surface M1 of the base material M on which the first photoresist PR1 is placed is positioned facing downwards, and the etching solution is sprayed from the bottom to the top of the first photoresist PR1. As described above, when etching solution is sprayed into the first opening OP1, a first groove (M1-1) is formed in the base material M so as to correspond to the first opening OP1. Subsequently, the first photoresist PR1 is removed from the first surface M1 of the base material M.

[0183] Referring to Figure 20E, after the above-mentioned steps are completed, etching solution is sprayed into the second opening OP2 and the third opening OP3. At this time, the etching solution is sprayed from the upper surface of the base material M towards the second surface M2 of the base material M. Once the process described above is complete, the etching solution passes through the second opening OP2 and the third opening OP3, removing a portion of the base material M. At this time, the etching solution that has passed through the second opening OP2 removes the base material M from the second surface M2 of the base material M in the thickness direction of the base material M up to the first surface M1 of the base material M, connects with the first groove (M1-1) on the first surface M1 which is formed to correspond to the first opening OP1, and forms the first pattern hole PH1.

[0184] Furthermore, the etching solution that passes through the third opening OP3 removes the base material M from the second surface M2 to the first surface M1, thereby forming the second pattern hole PH2. In the case described above, the degree of etching of the base material M by the etching solution is adjusted by the difference between the width (or area on the plane) of the second opening OP2 and the width (or area on the plane) of the first opening OP1. Specifically, by forming the second opening OP2 with a width (or area on a plane) wider than the first opening OP1, it is possible to adjust the distance etched in the thickness direction of the base material M when the same etching solution is sprayed at the same time (see Figure 20C). In other words, in such a case, the thickness to which the base material M is etched by the etching solution that passes through the second opening OP2 is greater than the thickness to which the base material M is etched by the etching solution that passes through the first opening OP1.

[0185] In the case described above, the second protrusion (PH2-a) is not located inside the second pattern hole PH2, while the first protrusion (PH1-a) is located inside the first pattern hole PH1. In other words, the second projection (PH2-a) is positioned at the end of the second pattern hole PH2, and the first projection PH1 protrudes into the interior of the first pattern hole PH1. In the case described above, the first distance L1 from the first surface M1 to the first protrusion (PH1-a) is different from the second distance L2 from the second surface M2 to the first protrusion (PH1-a). Specifically, the first distance L1 from the first surface M1 to the first protrusion (PH1-a) is shorter than the second distance L2 from the second surface M2 to the first protrusion (PH1-a). In this case, the first surface M1 is the surface that faces the substrate 100 when the mask sheet 22 is placed in the manufacturing apparatus 1 of the display device shown in Figure 11.

[0186] Therefore, the method for manufacturing a display device according to the present invention makes it possible not to form a second protrusion in the second pattern hole PH2 portion used when forming the intermediate layer (not shown) of the first display area (not shown). Furthermore, the method for manufacturing a display device according to the present invention makes it possible to form an intermediate layer having a precise pattern during the manufacturing of the display panel, and by making the section in which the thickness of the intermediate layer is variable short, it is possible to deposit the intermediate layer so that it has an area of ​​the intermediate layer that is almost the same as the design value.

[0187] Figure 21 is a schematic perspective view showing a display device according to another embodiment of the present invention. Referring to Figure 21, the display device DD is similar to the one shown in Figure 1. In this case, the display device DD includes a first display area DA1, a second display area DA2, and a peripheral area PA. The first display area DA1 is a fixed area of ​​the display device DD, as shown in Figure 1. In this case, the first display area DA1 is similar in shape to the second display area DA2. For example, the first display area DA1 is formed to be elongated in the X-axis direction. Such a first display area DA1 has a higher light transmittance than the second display area DA2, and the resolution of the first display area DA1 is lower than the resolution of the second display area DA2. As described above, auxiliary pixels PXa are arranged in the first display area DA1, and main pixels PXm are arranged in the second display area DA2. Furthermore, the first display area DA1 may include a transparent area TA in which no auxiliary pixels PXa are located.

[0188] As mentioned above, components are placed in various positions within the first display area DA1. In this case, at least one component may be placed in the first display area DA1. As described above, the first display area DA1 may contain auxiliary pixels PXa and a transparent area TA. In this case, at least one auxiliary pixel PXa is provided, forming a pixel region, and such pixel regions are arranged in the first display region DA1 so as to be separated from each other. In such cases, the transparent region TA is placed between elementary regions that are separated from each other. For example, the pixel regions may be arranged in a grid pattern, with transparent regions TA positioned between such pixel regions. Unlike the first display area DA1, the second display area DA2 does not have a separate transparent area. At this time, multiple main pixels PXm are arranged in the second display area DA2.

[0189] The specific aspects of the present invention described above can be implemented using a system, method, computer program, or any combination of systems, methods, or computer programs.

[0190] Furthermore, the present invention is not limited to the embodiments described above. It can be modified and implemented in various ways without departing from the technical scope of the present invention. [Explanation of Symbols]

[0191] 1 Manufacturing equipment 2 Display Panel 3 components 10 Chambers 11 Gate valve 20 Mask Assembly 21 Mask Frames 22 Mask Sheets 22-1~22-3 Mask Sheets 1~3 23 Support frame 30, 40 1st, 2nd support part 50 Evaporation Sources 60 Magnetic field generation section 70 Vision Department 80 Pressure regulating section 81 Connecting pipes 82 pumps 90 Laser processing equipment 91 Laser Oscillator 92 Optical system 93 Scanning section 94 stages 95 Inspection Department 100 circuit boards 110, 120 First and second scan drive circuits 111 Buffer Layer 112, 113 First and second gate insulating layers 115 Interlayer insulating layer 117 Planarization layer 119 Pixel Definition Film 119OP opening 140 terminals 150 Data-Driven Circuits 151 Connecting Wiring 160, 170 1st and 2nd power supply wiring 161, 171 1st and 2nd connection wiring 162, 163 First and second sub-wiring 175 Bottom protective film 175OP opening 200 display element layer 210 pixel electrodes 220 Middle layer 230 Counter electrode 300 Thin film sealing layer 320 Organic sealing layer 310, 330 First and second inorganic sealing layers 1130 Semiconductor layer 1151-1157, 1163 Contact Holes 1173 Initialization connection line 1174 node connection lines 1175 Connecting Metal A Vapor deposition area A1, A2 1st, 2nd area A1, A6 semiconductor layer CE1, CE2 lower and upper electrodes CNT Contact Hole Cst Storage Capacitor D1 Drive Drain Electrode D2 Switching Drain Electrode D3 Compensation drain electrode D4, D7 First and second initial drain electrodes D5 Operation control drain electrode D6 Light emission controlled drain electrode DA display area DA1, DA2 1st, 2nd display area DD display device DL Dataline DM data signal EL light control wire ELVDD First power supply voltage (drive voltage) ELVSS Second Power Supply Voltage En Light Control Signal G1 drive gate electrode G2 Switching Grid Socket G3 Compensation Gate G4, G7 First and Second Initialization Gates G5 Operation Control Token G6 Light Control Terminal HL electrode voltage line IL insulating layer I OLED Drive current LX a 2nd length LX m 1st length M Base material M1, M2 1st, 2nd side M1-1 First groove OLED (Organic Light-Emitting Diode) OP1~OP5 1st~5th opening PA surrounding area PC Pixel Circuit PCB (Printed Circuit Board) PCB-P terminal PH1, PH2: First and second pattern holes PL drive voltage line (drive voltage line) PR1, PR2 (First and Second Photoresists) PXa auxiliary pixel (second pixel) PXa1~PXa2: 1st to 3rd auxiliary pixels PXm Main Pixel (1st Pixel) PXm1~PXm3 1st~3rd Main Pixels RH Reference Hole S1 Drive source electrode S2 Switching Source Electrode S3 Compensation source electrode S4, S7 First and second initialization source electrodes S5 Operation control source electrode S6 Light emission control source electrode SL, SL-1 scanline Sn, Sn-1 scan signals T1 drive thin-film transistor T2 Switching Thin-Film Transistor T3 Compensated Thin-Film Transistor T4, T7 First and second initialization thin-film transistors T5 Operation Control Thin Film Transistor T6 Light Emission Control Thin Film Transistor TFT Thin-Film Transistor Vint Initialization Voltage VL Initialization Voltage Line

Claims

1. A mask assembly comprising a mask sheet, The aforementioned mask sheet is A first region containing at least one first pattern hole, A second region containing at least one second pattern hole, It includes a projection that is positioned on the inner surface of the first pattern hole and protrudes from the inner surface of the first pattern hole into the interior of the first pattern hole, The protruding portion protrudes inward from the inner surface of the first pattern hole, beyond the plane of the first pattern hole on one side of the mask sheet and beyond the plane of the first pattern hole on the other side of the mask sheet facing the one side. A mask assembly characterized in that no protrusions are formed on the inner surface of the second pattern hole.

2. The mask assembly according to claim 1, characterized in that the thickness of the first region and the thickness of the second region are the same or different from each other.

3. The mask assembly according to claim 1, characterized in that the planar size of the second pattern hole formed on one surface of the second region is greater than or equal to the planar size of the first pattern hole formed on one surface of the first region extended from one surface of the second region.

4. The mask assembly according to claim 1, characterized in that the mask sheet has a plurality of reference holes arranged at the edge of the second region.

5. The mask assembly according to claim 1, characterized in that the shapes of the first pattern holes and the second pattern holes on a plane parallel to one surface of the mask sheet are different from each other.

6. A method for manufacturing a mask assembly comprising a mask sheet, The steps include: arranging a first photoresist on the first surface of a base material for forming the mask sheet, having a first opening; The steps include: arranging a second photoresist on a second surface facing the first surface of the base material such that it has a second opening and a third opening; The steps include: spraying an etching solution into the interior of the first opening to etch a portion of the first surface of the base material; The process includes the step of spraying an etching solution into the interior of the second and third openings to etch a portion of the second surface of the base material, thereby forming a first pattern hole and a second pattern hole that penetrate the base material, A protrusion is formed inside the first pattern hole, which is positioned on the inner surface of the first pattern hole and protrudes from the inner surface of the first pattern hole into the interior of the first pattern hole. The protruding portion protrudes inward from the inner surface of the first pattern hole, beyond the plane of the first pattern hole on the first surface of the base material and beyond the plane of the first pattern hole on the second surface of the base material. A method for manufacturing a mask assembly, characterized in that no protrusions are formed on the inner surface of the second pattern hole.

7. The method for manufacturing a mask assembly according to claim 6, characterized in that the width of the second opening is greater than the width of the first opening.

8. The method for manufacturing a mask assembly according to claim 6, characterized in that the distance from the first surface to the protrusion and the distance from the second surface to the protrusion are different from each other.

9. The method for manufacturing a mask assembly according to claim 6, further comprising the step of removing the first photoresist.

10. The method for manufacturing a mask assembly according to claim 6, further comprising the step of removing the second photoresist.

11. A method for manufacturing a mask assembly comprising a mask sheet, The steps include: placing a first photoresist having a first opening located in a first region of the base material for forming the mask sheet on the first surface of the base material; The steps include: placing a second photoresist having a second opening corresponding to the first opening on a second surface facing the first surface of the base material; The steps include: spraying an etching solution into the interior of the first opening to etch a portion of the first surface of the base material; The steps include: spraying an etching solution into the interior of the second opening to form a first pattern hole that penetrates the base material; The step includes irradiating a second region adjacent to the first region on the second surface of the base material with a laser beam to form a second pattern hole penetrating the base material, A protrusion is formed inside the first pattern hole, which is positioned on the inner surface of the first pattern hole and protrudes from the inner surface of the first pattern hole into the interior of the first pattern hole. The protruding portion protrudes inward from the inner surface of the first pattern hole, beyond the plane of the first pattern hole on the first surface of the base material and beyond the plane of the first pattern hole on the second surface of the base material. A method for manufacturing a mask assembly, characterized in that no protrusions are formed on the inner surface of the second pattern hole.

12. The method for manufacturing a mask assembly according to claim 11, characterized in that the shape of the first pattern hole and the shape of the second pattern hole on a plane parallel to the first surface or the second surface of the base material are different from each other.

13. The method for manufacturing a mask assembly according to claim 11, characterized in that the area of ​​the first pattern hole and the area of ​​the second pattern hole on a plane parallel to the first surface or the second surface of the base material are different from each other.

14. The method for manufacturing a mask assembly according to claim 11, characterized in that the number of the first pattern holes and the second pattern holes per unit area are different from each other.

15. The method for manufacturing a mask assembly according to claim 11, further comprising the step of removing the first photoresist.

16. The method for manufacturing a mask assembly according to claim 11, further comprising the step of removing the second photoresist.

17. The method for manufacturing a mask assembly according to claim 11, characterized in that the step of forming the second pattern hole includes a step of forming the second pattern hole such that the width of the second pattern hole in a direction perpendicular to the thickness direction of the base material increases from the first surface to the second surface.

18. The second photoresist further includes a third opening formed to correspond to the entirety of the second region, The method for manufacturing a mask assembly according to claim 11, further comprising the step of spraying an etching solution into the interior of the third opening to etch a part of the second surface of the base material.

19. The method for manufacturing a mask assembly according to claim 18, further comprising the step of irradiating an etching surface formed on the second surface of the base material corresponding to the third opening with a laser beam to form a second pattern hole penetrating the base material.

20. The second photoresist further includes a plurality of fourth openings arranged in the second region and spaced apart from each other. The method for manufacturing a mask assembly according to claim 11, further comprising the step of spraying an etching solution into the interior of the fourth opening to etch a part of the second surface of the base material.

21. The method for manufacturing a mask assembly according to claim 20, characterized in that the step of forming the second pattern hole includes the step of irradiating an etching surface formed on the second surface of the base material corresponding to the fourth opening with a laser beam to form a second pattern hole that penetrates the base material.

22. The second photoresist further includes a plurality of fifth openings located at the edge of the second region, The method for manufacturing a mask assembly according to claim 11, further comprising the step of forming at least two or more reference holes by spraying an etching solution into the interior of the fifth opening and etching a part of the second surface of the base material.

23. The method for manufacturing a mask assembly according to claim 22, further comprising the step of aligning the base material using the reference holes before irradiating it with a laser beam.

24. Chamber and, A mask assembly is placed inside the chamber, The mask assembly has a deposition source that is positioned opposite to it and supplies a deposition material to the display substrate, The mask assembly includes a mask sheet through which the vapor deposition material supplied from the vapor deposition source passes, The aforementioned mask sheet is A first region containing at least one first pattern hole, A second region containing at least one second pattern hole, It includes a projection that is positioned on the inner surface of the first pattern hole and protrudes from the inner surface of the first pattern hole into the interior of the first pattern hole, The protruding portion protrudes inward from the inner surface of the first pattern hole, beyond the plane of the first pattern hole on one side of the mask sheet and beyond the plane of the first pattern hole on the other side of the mask sheet facing the one side. A manufacturing apparatus for a display device, characterized in that no protrusions are formed on the inner surface of the second pattern hole.

25. The manufacturing apparatus for a display device according to claim 24, characterized in that the thickness of the first region and the thickness of the second region are the same or different from each other.

26. The manufacturing apparatus for a display device according to claim 24, characterized in that the planar size of the second pattern hole formed on one surface of the second region is greater than or equal to the planar size of the first pattern hole formed on one surface of the first region extended from one surface of the second region.

27. The manufacturing apparatus for the display device according to claim 24, characterized in that the mask sheet includes a plurality of reference holes arranged at the edge of the second region.

28. The thickness of the mask sheet in the second region, specifically the thickness in the region surrounding the second pattern hole, is thinner than the thickness in the first region. The manufacturing apparatus for a display device according to claim 24, characterized in that the thickness in the region between the adjacent second pattern holes is the same as the thickness in the first region.

29. The manufacturing apparatus for a display device according to claim 24, characterized in that the width of the second pattern hole, which is perpendicular to the thickness direction of the mask sheet, is formed to increase from one side of the mask sheet to the other side.

30. The manufacturing apparatus for a display device according to claim 24, characterized in that the shape of the first pattern hole and the shape of the second pattern hole on a plane parallel to one surface of the mask sheet are different from each other.

31. The manufacturing apparatus for a display device according to claim 24, characterized in that the area of ​​the first pattern hole and the area of ​​the second pattern hole on a plane parallel to one surface of the mask sheet are different from each other.

32. The manufacturing apparatus for a display device according to claim 24, characterized in that the number of the first pattern holes and the second pattern holes per unit area are different from each other.

33. The manufacturing apparatus for the display device according to claim 24, characterized in that the mask sheet has a plurality of reference holes arranged at the edge of the second region.

34. The steps include: arranging and aligning the display substrate and the mask assembly inside the chamber; The process includes the step of supplying a deposition material from a deposition source to the display substrate by passing it through the mask assembly, The mask assembly includes a mask sheet through which the vapor deposition material supplied from the vapor deposition source passes, The aforementioned mask sheet is A first region containing at least one first pattern hole, A second region containing at least one second pattern hole, It includes a projection that is positioned on the inner surface of the first pattern hole and protrudes from the inner surface of the first pattern hole into the interior of the first pattern hole, The protruding portion protrudes inward from the inner surface of the first pattern hole, beyond the plane of the first pattern hole on one side of the mask sheet and beyond the plane of the first pattern hole on the other side of the mask sheet facing the one side. A method for manufacturing a display device, characterized in that no protrusions are formed on the inner surface of the second pattern hole.

35. The method for manufacturing a display device according to 34, characterized in that the thickness of the first region and the thickness of the second region are the same or different from each other.

36. The method for manufacturing a display device according to claim 34, characterized in that the planar size of the second pattern hole formed on one surface of the second region is greater than or equal to the planar size of the first pattern hole formed on one surface of the first region extended from one surface of the second region.

37. The method for manufacturing a display device according to 34, characterized in that the mask sheet has a plurality of reference holes arranged at the edge of the second region.

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