Method for manufacturing articles, method for determining identity, and manufacturing system

Abstract

An article manufacturing method comprising an ink marking process in which an identity determination mark to be used to determine the identity of an article is formed on a marking surface using an ink, wherein the determination of the identity of an article involves comparing information obtained from an image of the identity determination mark on a genuine article with information obtained from an image of an identity determination mark on an article to be assessed, and the image of the identity determination mark has individuality resulting from the wet spreading of ink droplets.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing an article, an identity determination method, and a manufacturing system. Background Art

[0002] The circulation of counterfeit goods is a problem in various fields of goods. Therefore, there is a need for a technology that can identify whether a product to be determined is a genuine product.

[0003] In order to determine whether the product to be determined is identical to the genuine product, it is conceivable to previously provide a unique mark (hereinafter referred to as an identity determination mark) to the article.

[0004] In relation to the above, Patent Document 1 (Japanese Unexamined Patent Publication No. 2023-086065) discloses "a printing system, comprising: control means for changing the landing position and / or the number of landed droplets so as to enhance the individuality of an image representing the individuality of an object on which ejected droplets have landed; imaging means capable of capturing the image; storage means for storing a reference image representing the image captured by the imaging means; and transmission means for transmitting information related to use of the image in response to reception of an instruction to use the image", which is characterized as described above. Summary of Invention

[0005] It is preferable that identity determination is performed with high accuracy. Accordingly, an object of the present invention is to provide a technology that can perform identity determination with high accuracy.

[0006] In one aspect, the present invention relates to a method for manufacturing an article. This manufacturing method comprises an ink marking step of supplying ink to a marking surface so as to spread after supply, thereby applying an identity mark used for determining the identity of an article. Determining the identity of an article involves comparing information obtained from an image of the identity mark of a genuine article with information obtained from an image of the identity mark of the article to be determined. The images of the identity mark have individuality due to the spreading of the ink droplets.

[0007] In another aspect, the present invention relates to a method for determining the identity of an article. This identity determination method comprises the steps of: manufacturing a genuine article using the above manufacturing method; capturing an identity determination mark during or after the manufacturing of the genuine article and generating genuine article data showing the identity determination mark of the genuine article; capturing an identity determination mark of an article to be determined and generating data for an item to be determined showing the identity determination mark of the item to be determined; and determining whether or not an item to be determined is identical to a genuine article based on the genuine article data and the item to be determined data. It is equipped with.

[0008] In yet another aspect, the present invention relates to a manufacturing system for articles. This manufacturing system comprises an ink marking device configured to supply ink onto a marking surface so as to spread after supply, thereby imparting identity marks used for determining the identity of articles. Determining the identity of articles involves comparing information obtained from an image of an identity mark on a genuine article with information obtained from an image of an identity mark on an article to be determined. The images of the identity marks have individuality due to the spreading of ink droplets.

[0009] According to the present invention, a technology is provided that can determine identity with high accuracy. [Brief explanation of the drawing]

[0010] [Figure 1]Figure 1 is a schematic diagram showing the ink impact points. [Figure 2] Figure 2 is a magnified view of an example of a mark used for identity determination. [Figure 3] Figure 3 is a schematic diagram showing a semiconductor device according to an embodiment. [Figure 4] Figure 4 is a flowchart illustrating a schematic method for manufacturing a semiconductor device according to an embodiment. [Figure 5] Figure 5 is a schematic diagram illustrating a specific example of a semiconductor device manufacturing method. [Figure 6] Figure 6 is a diagram showing an example of a semiconductor device manufacturing system. [Modes for carrying out the invention]

[0011] Embodiments of the present invention will be described below.

[0012] (1) Overview The method for manufacturing an article according to this embodiment includes an ink marking step of supplying ink to a marking surface so that it spreads after supply, thereby applying an identity determination mark. The identity determination mark is a mark used to determine the identity of an article. That is, when determining identity, information obtained from the image of the identity determination mark of a genuine product and information obtained from the image of the identity determination mark of the product to be determined are compared, and it is determined whether or not the two are identical. Here, the image of the identity determination mark has individuality due to the wetting and spreading of the ink droplets.

[0013] The above method allows for the determination of the identity of an item with high accuracy. Specifically, when ink droplets are supplied onto a marking surface and the ink spreads after supply, the way the ink spreads is random. In other words, when ink spreads, even if the ink is supplied under the same conditions, the shape of the identity determination mark is likely to differ each time. Furthermore, the shape formed by the spreading ink tends to be complex, making it difficult to counterfeit. Therefore, when ink spreads, an identity determination mark with randomness (individuality) due to the spreading of the ink is obtained. This individuality can be used as information to identify an item. That is, an image of the identity determination mark is obtained at the time of manufacture of the item relating to the genuine product (it is fine if it is before distribution, or during or after manufacturing). When determining whether an item (the item to be determined) is identical to a genuine product after distribution, an image of the identity determination mark of the item to be determined is obtained. Furthermore, by comparing the information obtained from the image of the authenticity mark of a genuine product with that of the product being tested, it is possible to accurately determine whether or not the product being tested is genuine.

[0014] The "marking surface" to which the identity determination mark is applied can be any surface attached to an article that can be to which the identity determination mark can be applied. The marking surface may be, for example, the surface of the article itself. Alternatively, a base layer may be formed on the article, and the identity determination mark may be applied to this base layer. In other words, the marking surface may be the surface of the base layer. The ease with which the ink wets and spreads depends on the properties of the marking surface. Therefore, by providing a base layer, the ease with which the ink wets and spreads can be controlled from the viewpoint of obtaining the desired individuality. As a result, it becomes possible to determine identity with greater accuracy.

[0015] As mentioned above, the way the ink spreads depends on the properties of the underlying marking surface and the material of the ink. Therefore, by appropriately designing the materials of the marking surface and the ink, it is possible to obtain a mark for identity determination with a desirable wetting pattern from the perspective of individuality.

[0016] Preferably, the contact angle of the ink with respect to the marking surface is 5 to 25°. When the contact angle is within this range, the ink spreads and wets in a way that provides high individuality. As a result, an identity-granting mark with a shape that is difficult to counterfeit is obtained, and identity can be determined with greater accuracy. Preferably, the contact angle is 5 to 20°. The contact angle of the ink can be determined, for example, by the method described in the examples below.

[0017] In addition to the autonomous wetting and spreading of ink through the design of the materials of the marking surface and the ink, wetting and spreading can also be promoted by treatments that promote the flow of the ink, such as heating the ink to reduce its viscosity, or by changing the ink concentration to reduce its viscosity. Furthermore, if the ink is curable, wetting and spreading can be promoted by increasing the time between the ink landing on the marking surface and the ink curing and losing its fluidity.

[0018] The method of supplying the ink is not particularly limited. The ink only needs to be supplied onto the marking surface in droplet form. Examples of ink supply methods include inkjet printing and gravure coating.

[0019] Figure 1 is a schematic diagram showing a preferred example of ink placement when using the inkjet method. Figure 2 is a diagram showing an example of the final identity determination mark 4. As shown in Figure 1, preferably, the ink is supplied onto the marking surface so that multiple ink droplets 6 land at positions spaced apart from each other. As described above, the landed ink spreads randomly. As a result, at least one of the supplied ink droplets connects with an adjacent droplet after landing. That is, even if the shape at the time of landing is an ordered shape with ink dots spaced apart from each other, as shown in Figure 1, the final identity determination mark 4 having a random shape as shown in Figure 2 is obtained.

[0020] Preferably, the ink marking step is performed such that, assuming the number of supplied ink droplets is 100%, the number of ink continua (shapes independent of other inks) included in the identity determination mark 4 is 0.5 to 50%, and more preferably 1 to 10%.

[0021] Note that when all of the supplied ink droplets are continuous, it may conversely become difficult to obtain randomness. Therefore, it is preferable that the number of ink continua in the identity determination mark 4 is at least two or more.

[0022] The "article" for which identity is to be determined in the present embodiment is not particularly limited. For example, the article may be a semiconductor device. In recent years, the presence of counterfeit semiconductors has become a problem in the field of semiconductor devices. If an identity determination mark is provided on a semiconductor device by the method according to the present embodiment, it is possible to accurately determine whether a semiconductor device distributed in the market is a genuine product.

[0023] Hereinafter, the present embodiment will be described in more detail by taking as an example the case where the article is a semiconductor device.

[0024] (2) Semiconductor device FIG. 3 is a schematic diagram showing the semiconductor device 1 (article) according to the present embodiment. The semiconductor device includes a semiconductor base material 2 and a base layer 3 provided on the semiconductor base material 2. The base layer 3 contains a cured resin product. The identity determination mark 4 is provided on the base layer 3.

[0025] As previously mentioned, Figure 2 shows an enlarged example of the identity determination mark 4. The identity determination mark 4 is a mark made with ink and is used to determine whether the semiconductor device 1 is identical to a genuine product. Marks made with ink have a random shape, at least when observed under magnification. When ink is supplied onto a substrate, the supplied ink spreads to some extent on the substrate. This spreading is random. Therefore, even if the marks appear to have the same shape to the naked eye, when observed under magnification, the shape of each mark is different.

[0026] The randomness of this identity determination mark 4 is used to determine identity. For example, during the manufacturing of the semiconductor device 1, an enlarged image of the identity determination mark 4 is acquired in advance and saved. When it is desired to verify whether a semiconductor device 1 distributed on the market is identical to a genuine product, an enlarged image of the identity determination mark 4 of the distributed product is acquired. The image of the distributed product is then used as the product to be determined and compared with the genuine product data that has been saved in advance to determine whether the distributed product is identical to a genuine product. The genuine product data and the product to be determined data may be the image data itself, but they do not necessarily have to be the image data itself. For example, the genuine product data and the product to be determined data may be data representing feature quantities extracted from the image data.

[0027] The size of the identity determination mark 4 is not particularly limited. For example, the dimensions (maximum length) of the identity determination mark are 0.3 to 5 mm, preferably 0.5 to 2.0 mm.

[0028] Furthermore, the identity determination mark 4 may or may not have any meaning when observed visually, such as possessing some information like a lot number. In other words, identity determination using the identity determination mark 4 is not made by the identification symbols that the mark constitutes, but by comparing the information obtained from the unique image of the mark on the genuine product with the information obtained from the image of the mark on the product being judged.

[0029] (3) Method for manufacturing semiconductor device (article) and method for determining identity Next, the method for manufacturing the semiconductor device and the method for determining identity according to this embodiment will be described. Figure 4 is a flowchart illustrating the manufacturing method of the semiconductor device 1 according to this embodiment.

[0030] As shown in Figure 4, the manufacturing method of this semiconductor device 1 includes a base layer formation step (step S1), a curing step (step S2), an ink marking step (step S3), and an annealing step (step S4). These are performed in this order. In the base layer formation step (S1), a base layer 3 made of a curable resin composition is formed on the semiconductor substrate 2. In the curing step (S2), the base layer 3 is cured. In the ink marking step (S3), an identity determination mark is applied to the cured base layer 3 with ink. In the annealing step (S4), the identity determination mark is heated.

[0031] With this method, since the identity determination marks are applied with ink after the base layer 3 has hardened, the randomness of the identity determination marks 4 can be increased.

[0032] Specifically, according to the inventors' findings, the contact angle of the ink with respect to the substrate layer 3 before curing is greater than the contact angle of the ink with respect to the substrate layer 3 after curing. In other words, if ink is supplied onto the substrate layer 3 before curing, the ink does not easily adhere to the surface of the substrate layer 3. That is, the ink does not easily spread on the substrate layer 3. In contrast, according to this embodiment, since the ink is supplied after the substrate layer 3 has cured, the ink easily adheres to the surface of the substrate layer 3 and spreads easily on the substrate layer 3. The way the ink spreads is random. Therefore, by performing ink marking after the substrate layer 3 has cured, it is possible to obtain a mark for identity determination with high randomness, as shown in Figure 2.

[0033] On the other hand, when ink is applied to the hardened base layer 3, the adhesion of the identity determination mark 4 tends to decrease. Therefore, in this embodiment, an annealing process (S4) is performed. By performing the annealing process (S4), the adhesion of the identity determination mark 4 can be improved. As a result, an identity determination mark 4 with high randomness and high adhesion can be obtained.

[0034] Next, we will explain the details of each process, referring to more specific examples. Figure 5 is a schematic diagram showing a specific example of a method for manufacturing a semiconductor device 1.

[0035] (Step S1) Formation of the sublayer First, as shown in Figure 5(a), the semiconductor substrate 2 is prepared. The semiconductor substrate 2 is, for example, a semiconductor wafer after backside grinding has been completed.

[0036] Next, as shown in Figure 5(b), a base layer 3 is formed on the semiconductor substrate 2. The base layer 3 can be any layer that can serve as the base for the identity determination mark 4. In this embodiment, the base layer 3 is a resin layer (backside resin layer) provided on the back surface (the surface opposite to the circuit formation surface) of the semiconductor substrate 2.

[0037] The base layer 3 is formed from a curable resin composition. For example, a base layer forming film (film for the back surface resin layer) containing a curable resin composition is laminated to the back surface of the semiconductor substrate 2. This allows the base layer 3 to be formed.

[0038] The curing type of the curable resin composition that forms the base layer 3 may be thermosetting, energy ray curing (e.g., UV curing), or both. In the case of a base layer forming film formed from an energy ray curing type curable resin composition, it may be necessary to achieve a balance between energy ray transmittance and the optical properties required for the base layer; therefore, the curable resin composition is preferably thermosetting.

[0039] The detailed composition of sublayer 3 will be described later with an example.

[0040] (Step S2) Hardening of the sublayer After the formation of the base layer 3, the base layer 3 is cured as shown in Figure 5(c). The base layer 3 is cured by a method corresponding to the curing type of the curable resin composition. That is, if the curing type of the base layer 3 is thermosetting, a thermosetting process is carried out. If the curing type of the base layer 3 is energy ray curing, a curing process by energy ray irradiation is carried out.

[0041] If the curing type of the base layer 3 is thermosetting, the heating temperature in this step is, for example, 80 to 200°C, preferably 100 to 160°C. The heating time is, for example, 30 minutes to 5 hours, preferably 1 to 3 hours.

[0042] (Step S3) Ink Marking Next, as shown in Figure 5(d), identity determination marks 4 are applied to the base layer 3. As previously described, identity determination marks 4 are formed with ink. That is, identity determination marks 4 are formed by applying ink to the base layer 3.

[0043] The method for applying the identity determination mark 4 is not particularly limited. For example, inkjet printing and gravure coating methods can be used as application methods.

[0044] However, among these methods, the inkjet method is preferred, as previously mentioned. When the inkjet method is used, multiple ink droplets 6 are sprayed onto the substrate layer 3, as shown in Figure 5(d).

[0045] As previously described, Figure 1 shows a preferred example of ink placement when using the inkjet method. Preferably, as shown in Figure 1, the ink is supplied onto the substrate layer 3 so that multiple ink droplets 6 land at positions spaced apart from each other. As previously described, the landed ink spreads randomly. As a result, at least one of the supplied ink droplets connects with an adjacent droplet after landing. That is, even if the shape at the time of landing is such that the ink dots are spaced apart from each other, as shown in Figure 1, ultimately a mark 4 for identity determination having a random shape as shown in Figure 2 is obtained. In this embodiment, the ink placement is orderly and lacks randomness, so there is a high need to obtain randomness caused by the spreading of ink droplets.

[0046] Preferably, a curable ink is used. The ink may be thermosetting or energy ray curing. Preferably, an energy ray curing ink is used. More preferably, a UV curing ink is used.

[0047] When a curing type ink is used, preferably, the identity determination mark 4 is cured after the ink is applied.

[0048] In a more preferred embodiment, the curable resin composition constituting the base layer 3 is a thermosetting resin composition. On the other hand, the ink is an energy ray curing composition. Energy ray curing ink can be cured immediately by energy rays after impact. When energy ray curing ink is used and the ink is cured immediately after impact, the time required for the ink to wet and spread on the base layer 3 after impact is short. However, according to this embodiment, since the ink is supplied after the base layer 3 has hardened, the ink easily adheres to the surface of the base layer 3 and can easily wet and spread on the base layer 3 even in a short time.

[0049] (Step S4) Annealing Next, as shown in Figure 5(e), the identity determination mark 4 is heated. The heating conditions should be such that the adhesion of the identity determination mark 4 is improved compared to when no heating is performed. For example, the heating temperature and heating time may be, for example, 100-150°C for 30 minutes to 3 hours, or above 150°C and below 230°C for 0.5 to 30 minutes. Annealing can be performed, for example, by placing the semiconductor substrate 2 in an oven.

[0050] (photography) Next, as shown in Figure 5(f), the identity determination mark 4 is imaged. The identity determination mark 4 is imaged via the imaging device 7 equipped with a microscope. That is, a magnified image is captured. The size of the area to be imaged is not particularly limited. For example, the size of the area to be imaged may include an area with sides of 10 to 1000 μm.

[0051] The microscope used for imaging is typically an optical microscope. The magnification used for imaging with an optical microscope is, for example, 20 to 500 times.

[0052] The image of the identity determination mark 4 obtained by imaging is stored as authenticity data indicating the identity determination mark of a genuine product, for example, on a server (not shown). As previously described, the authenticity data may be the feature quantities extracted from the image, rather than the image itself.

[0053] (Dicing, etc.) Subsequently, necessary processing is performed to obtain the semiconductor device 1. In the example shown in Figure 5, a dicing process is carried out as shown in Figure 5(g). In the dicing process, the semiconductor substrate 2 is placed on the dicing sheet 10. The semiconductor substrate 2 is attached to the dicing sheet 10, for example, so that the underlayer 3 faces the dicing sheet 10. That is, it is attached to the dicing sheet 10 so that the identity determination mark 4 is in contact with the dicing sheet 10. Then, the semiconductor substrate 2 is diced using a blade 9. This forms a plurality of semiconductor chips 11.

[0054] After dicing, as shown in Figure 5(h), each semiconductor chip 11 (i.e., semiconductor device) is picked up from the dicing sheet 10. If the adhesion of the identity determination marks 4 is low, the identity determination marks 4 may adhere to the dicing sheet 10 during pickup, and a portion of the identity determination marks 4 may peel off from the underlying layer 3. However, according to this embodiment, the identity determination marks 4 have high adhesion. Therefore, even if the semiconductor substrate 2 is attached to the dicing sheet 10 so that the identity determination marks 4 are in contact with the dicing sheet 10, the identity determination marks 4 are unlikely to peel off.

[0055] After pickup, reliability tests and other assessments are performed as needed. After undergoing these tests, the semiconductor chip 11 is released to the market as a semiconductor device.

[0056] If it is necessary to verify whether a semiconductor device distributed to the market is genuine after it has been released, the identity verification mark on the distributed product (the product to be verified) is imaged. The identity verification mark on the distributed product is imaged via a microscope, just like on a genuine product. Then, based on data showing an enlarged image of the identity verification mark on the distributed product (the product to be verified data) and pre-generated genuine product data, it is determined whether the distributed product is identical to a genuine product.

[0057] The above describes the method for manufacturing a semiconductor device and the method for determining identity according to this embodiment. According to this embodiment, since identity determination marks 4 are formed on the cured underlayer 3 with ink, the randomness of the identity determination marks 4 can be increased. In addition, since an annealing process (S4) is performed, the fixation of the identity determination marks 4 can be improved.

[0058] (4) Manufacturing systems for semiconductor devices (articles) The above-described method for manufacturing a semiconductor device can be realized, for example, by a semiconductor device manufacturing system. Figure 6 is a configuration diagram showing an example of a semiconductor device manufacturing system 20. This semiconductor device manufacturing system 20 includes a base layer forming apparatus 21, a curing apparatus 22, an ink marking apparatus 23, an annealing apparatus 24, and an imaging apparatus 25.

[0059] The base layer forming apparatus 21 is configured to form a base layer 3 on a semiconductor substrate 2. The base layer forming apparatus 21 is, for example, a laminating apparatus configured to laminate a base layer forming film (film for the back surface resin layer) onto the back surface of the semiconductor substrate 2.

[0060] The curing device 22 is configured to cure the substrate layer 3. If the curing type of the substrate layer 3 is thermosetting, the curing device 22 is a heating device. If the curing type of the substrate layer 3 is energy ray curing (e.g., UV curing), the curing device 22 is an energy ray irradiation device (e.g., a UV irradiation device).

[0061] The ink marking device 23 is configured to apply an identity determination mark to the hardened base layer 3 using ink. The ink marking device 23 is, for example, an inkjet printer.

[0062] The annealing device 24 is configured to heat the identity determination marks. The annealing device 24 is, for example, an oven-type heating device.

[0063] The imaging device 25 is equipped with a microscope and is configured to image a fine area of ​​the identity determination mark 4 through the microscope. The imaging device 25 is, for example, a digital imaging device with an optical microscope.

[0064] Furthermore, the semiconductor device manufacturing system of this embodiment may include a feature calculation device (not shown) that calculates predetermined feature quantities from images captured by the imaging device 25. Examples of feature quantities calculated by the feature calculation device include coordinates indicating the contour of the shape of the identity determination mark 4 magnified by a microscope. Such feature quantities are used as feature quantities extracted from the image of the genuine product described above.

[0065] All or some of the devices included in the manufacturing system 20 described above may be provided as an integrated unit. For example, the ink marking device 23 and the annealing device 24 may be integrated. With such a configuration, it becomes possible to perform the process from the base layer formation process to the annealing process in-line, thereby improving productivity. Alternatively, the ink marking device 23, the annealing device 24, and the imaging device 25 may be provided as an integrated unit, or the ink marking device 23, the annealing device 24, the imaging device 25, and the feature calculation device may be provided as an integrated unit.

[0066] (5) Others In this embodiment, the case in which the imaging of the identity determination mark for genuine products (see Figure 5(f)) is performed after the annealing process (see Figure 5(e)) has been described. However, the timing of imaging the identity determination mark 4 is not necessarily limited to this timing. For example, imaging of the identity determination mark 4 may be performed between the ink marking process (Figure 5(d)) and the annealing process (Figure 5(e)).

[0067] Furthermore, in this embodiment, the case in which the base layer 3 is a back surface resin layer formed on the back surface of the semiconductor substrate 2 has been described. However, the base layer 3 is not limited to a back surface resin layer. For example, the base layer 3 may be a sealing resin layer used as a so-called sealing resin.

[0068] On the other hand, preferably, the base layer 3 is a back resin layer, as described in the above embodiment. More preferably, the back resin layer is a resin layer formed by laminating a base layer forming film (back resin layer film). In the following, the back resin layer will be described in detail when the base layer 3 is a back resin layer formed from a base layer forming film.

[0069] (6) Substrate layer (resin layer on the back) The thickness of the resin layer on the back surface is not particularly limited, but is, for example, 1 to 100 μm, preferably 5 to 50 μm.

[0070] As previously described, the curing type of the back resin layer may be thermosetting or energy ray curing, preferably thermosetting. Below, an example of the composition of the back resin layer when it is thermosetting will be described. In this case, the back resin layer is formed from a thermosetting curable resin composition.

[0071] If the curable resin composition is thermosetting, the curable resin composition includes, for example, a polymer component (A), a thermosetting component (B), a curing accelerator (C), a silane coupling agent (D), and a coloring agent (E).

[0072] (A) Polymer components Examples of polymer components (A) include acrylic resins (for example, resins obtained by addition polymerization of monomers containing at least acrylic acid ester monomers), polyesters, urethane resins (for example, resins having urethane bonds), acrylic urethane resins, silicone resins (for example, resins having siloxane bonds), rubber resins (for example, resins having a rubber structure), and phenoxy resins, with acrylic resins being preferred.

[0073] The content of polymer component (A) is, for example, 5 to 50% by mass, preferably 10 to 40% by mass, and more preferably 15 to 35% by mass, based on the total mass of the curable resin composition excluding the solvent.

[0074] (B) Thermosetting component Examples of the thermosetting component (B) include epoxy-based thermosetting resins, thermosetting polyimides, thermosetting polyurethanes, unsaturated polyesters, and silicone rubbers. Preferably, it is an epoxy-based thermosetting resin.

[0075] As an epoxy-based thermosetting resin, for example, one consisting of an epoxy resin (B1) and a thermosetting agent (B2) can be used.

[0076] Examples of epoxy resins (B1) include polyfunctional epoxy resins, biphenyl compounds, bisphenol A diglycidyl ether and its hydrogenated products, orthocresol novolac epoxy resins, dicyclopentadiene type epoxy resins, biphenyl type epoxy resins, bisphenol A type epoxy resins, bisphenol F type epoxy resins, phenylene skeleton type epoxy resins, and other bifunctional or more epoxy compounds. Among these, it is preferable that a bisphenol A type epoxy resin is included.

[0077] The thermosetting agent (B2) is a substance that functions as a curing agent for epoxy resins. Examples of thermosetting agents include compounds having at least two functional groups that can react with epoxy groups in one molecule. Examples of such functional groups include phenolic hydroxyl groups, alcoholic hydroxyl groups, amino groups, carboxyl groups, and groups in which an acid group has been anhydride. Preferably, the thermosetting agent includes an amino-based curing agent having an amino group. Examples of amino-based curing agents include dicyandiamide.

[0078] The content of the thermosetting component (B) (for example, the content of epoxy resin (B1) and thermosetting agent (B2)) is, for example, 5 to 30% by mass, preferably 15 to 20% by mass, based on the total mass of the curable resin composition excluding the solvent.

[0079] (C) Curing accelerator Examples of the curing accelerator (C) include tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol; imidazoles such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, and 2-phenyl-4-methyl-5-hydroxymethylimidazole (imidazoles in which at least one hydrogen atom is substituted with a group other than a hydrogen atom); organophosphines such as tributylphosphine, diphenylphosphine, and triphenylphosphine (phosphines in which at least one hydrogen atom is substituted with an organic group); and tetraphenylboron salts such as tetraphenylphosphonium tetraphenylborate and triphenylphosphine tetraphenylborate. Preferably, the curing accelerator (C) contains 2-phenyl-4,5-dihydroxymethylimidazole.

[0080] The content of the curing accelerator (C) is, for example, 0.1 to 1% by mass of the total mass of the curable resin composition excluding the solvent.

[0081] (D) Silane coupling agent Examples of silane coupling agents (D) include 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropylmethyldiethoxysilane, 3-glycidyloxypropyltriethoxysilane, 3-glycidyloxymethyldiethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-methacryloyloxypropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-(2-aminoethylamino)propyltrimethoxysilane, and 3-(2-amino Examples include ethylamino)propylmethyldiethoxysilane, 3-(phenylamino)propyltrimethoxysilane, 3-anilinopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, bis(3-triethoxysilylpropyl)tetrasulfan, methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, and imidazolesilane. Preferably, the silane coupling agent (D) contains 3-glycidoxypropyltrimethoxysilane.

[0082] The content of the silane coupling agent (D) is, for example, 0.1 to 1% by mass of the total mass of the curable resin composition excluding the solvent.

[0083] (E) Colorants As the coloring agent (E), inorganic pigments, organic pigments, and organic dyes can be used. Among these, inorganic pigments are preferred because they do not fade easily. Examples of inorganic pigments include carbon black, cobalt-based dyes, iron-based dyes, chromium-based dyes, titanium-based dyes, vanadium-based dyes, zirconium-based dyes, molybdenum-based dyes, ruthenium-based dyes, platinum-based dyes, ITO (indium tin oxide)-based dyes, and ATO (antimony tin oxide)-based dyes. Preferably, the coloring agent (E) contains carbon black.

[0084] The content of the colorant (E) is, for example, 0.1 to 10% by mass, preferably 0.5 to 5% by mass, based on the total mass of the curable resin composition excluding the solvent.

[0085] The contact angle of the ink before the curing of the back resin layer is typically 30 to 70°. The contact angle of the ink after the curing of the back resin layer is typically 5 to 25°. Specifically, the contact angles of the ink before and after curing of the back resin layer are measured by the method described in the examples below. [Examples]

[0086] The present invention will now be described in more detail by illustrating examples implemented by the inventors. However, the present invention should not be construed as being limited to the following examples.

[0087] (Example 1) <Manufacturing of film for forming a resin layer on the back surface> (Preparation of composition for forming the resin layer on the back surface) A resin film-forming composition was prepared by mixing the following raw materials with a methyl ethyl ketone solvent and stirring at 23°C for 60 minutes, with an active ingredient (components other than the solvent) content of 52% by mass. In the following description, the amounts of each component refer to the amount of the active ingredient. (1) Acrylic polymer (20 parts by mass): Acrylic polymer obtained by copolymerizing 15 parts by mass of n-butyl acrylate, 10 parts by mass of methyl methacrylate, 60 parts by mass of methyl acrylate, and 15 parts by mass of 2-hydroxyethyl acrylate (weight-average molecular weight: 600,000) (2) Bisphenol A type liquid epoxy resin (15 parts by mass): Nippon Shokubai Co., Ltd. "BPA328" (3) Bisphenol A type epoxy resin (1.8 parts by mass): "jER1055" manufactured by Mitsubishi Chemical Corporation (4) Dicyandiamide (0.45 parts by mass): Thermally activated latent epoxy resin curing agent, ADEKA "ADEKA Hardener EH-3636AS" (5) 2-Phenyl-4,5-dihydroxymethylimidazole (0.45 parts by mass): "Curesol 2PHZ" manufactured by Shikoku Chemicals Co., Ltd. (6) Spherical silica filler (60 parts by mass): Admatex Co., Ltd. "SC105G-MMQ: Spherical Silica" (average particle size 0.3 μm) (7) Silane coupling agent: 3-Glycidoxypropyltrimethoxysilane (3-Glycidyloxypropyltrimethoxysilane) (0.4 parts by mass), Shin-Etsu Chemical Co., Ltd. "KBM403" (8) Coloring agent: Carbon black (1.9 parts by mass), Mitsubishi Chemical Corporation "MA600B" (average particle size 28 nm)

[0088] (Formation of film for forming the resin layer on the back surface) A release film having a release surface was prepared. The backside resin layer forming composition prepared above was then coated onto the release surface using a knife coater. After coating, it was dried at 110°C for 2 minutes. The thickness of the backside resin layer forming composition after drying was 25 μm. Furthermore, the release surface of another release film was laminated onto this backside resin layer forming composition to create a backside resin layer forming film sandwiched between two release films.

[0089] (Manufacturing of silicon chips with a protective backing layer) A 6-inch silicon wafer (350 μm thick) with a #2000 polished surface was prepared as a semiconductor substrate. One release film was peeled off from the film for forming the backside resin layer, and the exposed backside resin layer forming composition was applied to the silicon wafer. The application was performed by thermal lamination at a roll temperature of 70°C and a roll speed of 0.3 m / min. The other release film remaining on the backside resin layer forming film was peeled off and removed. This formed an uncured backside resin layer as the base layer.

[0090] (hardening process) Next, the silicon wafer was heat-treated at 130°C for 2 hours to harden the resin layer on the back surface.

[0091] (Ink marking process) An identity verification mark was printed on the cured backside resin layer using an inkjet method with ink (Agfa DIPAMAT LEGEND INK Wh04). As shown in Figure 2, the letter "A" was used as the identity verification mark. The vertical length of the identity verification mark was 1 mm. The ink was supplied onto the backside resin layer in the form of a collection of 202 ink dots, which was the number designed for the mark. In other words, 202 ink droplets were supplied onto the backside resin layer. The ink was cured by UV irradiation immediately after impact.

[0092] (Annealing process) After the ink marking process, the silicon wafer was placed in a 130°C, humidity-free oven and removed after 120 minutes. This yielded the sample described in Example 1.

[0093] (Example 2) A sample for Example 2 was obtained in the same manner as in Example 1, except that the annealing process was not performed.

[0094] (Example 3) The order of the curing process and the ink marking process was reversed. Other aspects were the same as in Example 1, and a sample relating to the comparative example was obtained.

[0095] [Evaluation of the randomness of the mark shape] For each of Examples 1 to 3, a 150x magnified photograph of the identity determination mark was taken using a microscope. The total number of ink continuums (the sum of the number of independent ink dots and the number of connected ink dots) contained in the identity determination mark was then examined. A smaller total number of ink continuums indicates a larger number of connected ink dots, signifying improved randomness in the shape of the identity determination mark. The same test was performed three times for each sample, and the average value was used as the result.

[0096] [Evaluation of ink contact angle] The contact angle of the ink during ink marking was measured. Specifically, for Examples 1 and 2, silicon wafers with a cured backside resin layer were used as samples. For Example 3, silicon wafers with a pre-cured backside resin layer were used as samples. The ink used in the ink marking process was then dropped onto the backside resin layer under conditions of 23°C and 50% relative humidity. The amount of ink dropped was 2 μl, and 10 tests were performed. The contact angle was then measured using a KRUSS DSA100S automatic contact angle meter, and the average value was used as the result.

[0097] [Evaluation of retention] For each sample, the shape of the identity determination mark (hereinafter simply referred to as "the mark") was photographed with a 20x microscope to obtain an initial image. Next, dicing tape (Lintec Corporation, D-485H) was laminated to the side opposite to the side on which the mark was formed. Then, using a dicer (Disco Corporation, DFD6362), 1 mm wide cuts were made in the area where the mark was printed, in a grid pattern (10 rows vertically and 10 columns horizontally, 100 squares) in the silicon wafer, starting from the opposite side of the dicing tape (the side on which the mark was formed). In other words, the silicon wafer was half-cut. After half-cutting, dicing tape (Lintec Corporation, D-686H) was attached to the side on which the mark was formed. Next, the semiconductor wafer was left to stand for 10 minutes. After standing, in order to make the dicing tape removable, UV irradiation was performed on the side of the dicing tape opposite to the semiconductor wafer on the side on which the mark was formed. After UV irradiation, the dicing tape was peeled off the semiconductor wafer from the side where the mark was formed, ensuring the peeling angle was vertical. After peeling off the dicing tape, images of the marks were acquired using a microscope and compared with the initial images to observe whether or not there was any ink chipping. A "○" was used if no ink chipping was observed, and a "×" was used if ink chipping was observed.

[0098] [Results and Discussion] The results are shown in Table 1. [Table 1]

[0099] Examples 1 through 3 all exhibited randomness (individuality) in the mark shape. That is, the number of ink continuums was less than the designed number of 202. This means that the ink droplets spread after supply, and some became continuum with adjacent ink droplets, meaning that the identity determination marks possess individuality due to the spreading of ink. Since it is thought that which parts of the ink droplets become continuum with adjacent inks is random, it is considered that the obtained identity determination marks can be used to determine whether a genuine product and the product being tested are identical.

[0100] On the other hand, in both Examples 1 and 2, the number of ink continuums was clearly smaller compared to Example 3. In other words, the randomness of the mark shape was higher in Examples 1 and 2. Specifically, the number of ink continuums in the mark, using the number of supplied ink droplets (202) as 100%, was approximately 1.8% (=3.67 / 202×100) in Example 1 and approximately 2.0% (=4 / 202×100) in Example 2, while it was approximately 47% (=94 / 202×100) in Example 3. In addition, the ink contact angle was smaller in Examples 1 and 2 than in Example 3. From this, it can be understood that in Examples 1 and 2, where ink marking was performed after curing, the ink spread more easily during marking, resulting in ink dots connecting more easily and thus increasing randomness.

[0101] Furthermore, the test results showed that the randomness of the mark shape changed depending on the selection of the marking surface (undercoat before / after curing). It is thought that the degree of randomness of the mark shape can be controlled by selecting the ink and marking surface, thereby obtaining stable randomness.

[0102] Furthermore, when comparing the ink adhesion between Example 1 and Example 2, Example 1 exhibited better adhesion. From this, it can be understood that the fixation of the identity determination mark can be improved by performing the annealing process.

[0103] [Note] The following is a summary of representative embodiments included in the present invention.

[0104] [Note A] (Note A1) A method for manufacturing a semiconductor device, comprising: a base layer formation step (S1) of forming a base layer 3 made of a curable resin composition on a semiconductor substrate 2; a curing step (S2) of curing the base layer; and an ink marking step (S3) after the curing step of applying an identity determination mark to the base layer using ink, which is used to determine the identity of a semiconductor device.

[0105] (Appendix A2) A method for manufacturing a semiconductor device as described in Appendix A1, wherein the identity of the semiconductor device is determined by comparing information obtained from the unique image of the identity determination mark of a genuine product with information obtained from the image of the identity determination mark of the product to be determined.

[0106] (Note A3) A method for manufacturing a semiconductor device as described in Appendix A1 or A2, further comprising an annealing step (S4) of heating an identity determination mark after an ink marking step (S3).

[0107] (Note A4) A method for manufacturing a semiconductor device as described in any of Appendix A1 to A3, wherein an energy-ray curable ink is used in the ink marking step (S3).

[0108] (Note A5) A method for manufacturing a semiconductor device as described in any of Appendix A1 to A4, wherein the base layer formation step (S1) includes a step of forming a base layer 3 by laminating a base layer forming film containing a curable resin composition onto the back surface of a semiconductor substrate 2.

[0109] (Note A6) A method for manufacturing a semiconductor device as described in any of Appendix A1 to A5, wherein the ink marking step (S3) includes a step of supplying ink onto a substrate layer such that a plurality of ink droplets 6 land at positions spaced apart from each other.

[0110] (Note A7) A method for manufacturing a semiconductor device as described in Appendix A6, wherein the ink marking step (S3) includes a step of supplying ink such that at least one of a plurality of ink droplets 6 connects with an adjacent droplet after impact.

[0111] (Note A8) A method for determining the identity of a semiconductor device, comprising: a step of manufacturing a genuine semiconductor device using a manufacturing method described in any of the appendices A1 to A7; a step of imaging an identity determination mark during or after the manufacturing of the genuine device and generating genuine device data showing the identity determination mark of the genuine device; a step of imaging an identity determination mark of a semiconductor device to be determined and generating data for a device to be determined showing the identity determination mark of the device to be determined; and a step of determining whether or not a device to be determined is identical to a genuine device based on the genuine device data and the device to be determined data.

[0112] (Note A9) A semiconductor device manufacturing system comprising a marking device 13 configured to apply an identity determination mark with ink to a cured base layer provided on a semiconductor device, and an annealing device 24 for heating the identity determination mark.

[0113] (Note A10) A semiconductor device manufacturing system as described in Appendix A9, further comprising a base layer forming apparatus 21 for forming a base layer on a semiconductor device.

[0114] (Note A11) A semiconductor device manufacturing system as described in Appendix A9, further comprising an imaging device 25 for imaging a mark for identity determination.

[0115] (Note A12) A semiconductor device manufacturing system as described in Appendix A11, further comprising a feature calculation device that calculates feature quantities from images captured by an imaging device.

[0116] [Note B] (Note B1) The process includes an ink marking step of supplying ink to a marking surface so that it spreads after supply, thereby applying an identity determination mark used to determine the identity of an article, wherein determining the identity of the article involves comparing information obtained from an image of the identity determination mark on a genuine article with information obtained from an image of the identity determination mark on an article under determination, and the image of the identity determination mark has individuality due to the spreading of ink droplets. A method for manufacturing articles.

[0117] (Note B2) A method for manufacturing an article as described in Appendix B1, wherein the article is a semiconductor device.

[0118] (Note B3) A method for manufacturing an article as described in Appendix B2, further comprising a base layer forming step of forming a base layer made of a curable resin composition, wherein the marking surface is the surface of the base layer, and in the ink marking step, the identity determination mark is applied to the base layer.

[0119] (Note B4) A method for manufacturing an article as described in Appendix B3, further comprising a curing step for hardening the base layer, wherein the ink marking step is performed after the curing step.

[0120] (Note B5) A method for manufacturing an article as described in Appendix B4, further comprising an annealing step of heating the identity determination mark after the ink marking step.

[0121] (Note B6) A method for manufacturing an article as described in any of Appendix B3 to B5, wherein the base layer formation step includes a step of forming the base layer by laminating a base layer forming film containing the curable resin composition onto the back surface of a semiconductor substrate.

[0122] (Note B7) A method for manufacturing an article as described in any of Appendix B1 to B6, wherein the ink is an energy ray curing type ink.

[0123] (Note B8) A method for manufacturing an article as described in any of Appendix B1 to B7, wherein the ink marking step includes a step of supplying ink onto the marking surface such that a plurality of ink droplets land at positions spaced apart from each other.

[0124] (Note B9) A method for manufacturing an article as described in Appendix B8, wherein the ink marking step includes a step of supplying ink such that the number of ink continuum units included in the identity determination mark is 0.5 to 50%, with the number of supplied ink droplets being 100%.

[0125] (Note B10) A method for manufacturing an article as described in any of Appendix B1 to B9, wherein the contact angle of the ink with respect to the marking surface is 5 to 25° or less.

[0126] (Note B11) The method comprises: a step of manufacturing a genuine article using a manufacturing method described in any of the appendices B1 to B10; a step of imaging the identity determination mark during or after the manufacturing of the genuine article and generating genuine article data showing the identity determination mark of the genuine article; a step of imaging the identity determination mark of an article to be judged and generating data for an item to be judged showing the identity determination mark of the item to be judged; and a step of determining whether the item to be judged is identical to the genuine article based on the genuine article data and the item to be judged data. A method for determining the identity of an item.

[0127] (Note B12) An article manufacturing system comprising an ink marking device configured to supply ink onto a marking surface so as to spread after supply, thereby affixing an identity mark used for determining the identity of an article, wherein determining the identity of the article involves comparing information obtained from an image of the identity mark on a genuine article with information obtained from an image of the identity mark on an article under determination, and the image of the identity mark has individuality due to the spreading of ink droplets.

[0128] (Note B13) A manufacturing system for articles as described in Appendix B12, further comprising a base layer forming device for forming a base layer made of a curable resin composition, wherein the marking surface is the surface of the base layer, and the ink marking device is configured to apply the identity determination mark onto the base layer.

[0129] (Note B14) A manufacturing system for articles as described in Appendix B12 or B13, further comprising an imaging device for imaging the identity determination mark.

[0130] (Note B15) A manufacturing system for articles as described in Appendix B14, further comprising a feature quantity calculation device that calculates feature quantities from images captured by the imaging device.

[0131] (Incorporated by reference) This application claims priority based on Japanese Patent Application No. 2024-170699, filed September 30, 2024 and Japanese Patent Application No. 2025-73813, filed April 28, 2025, the disclosures of these applications are incorporated herein by reference. [Explanation of Symbols]

[0132] 1. Semiconductor device, 2. Semiconductor substrate, 3. Underlayer, 4. Identity determination mark, 5. Ink dot assembly, 7. Imaging device with microscope, 10. Semiconductor device manufacturing system, 11. Semiconductor chip, 21. Underlayer formation device, 22. Curing device, 23. Ink marking device, 24. Annealing device, 25. Imaging device

Claims

1. An ink marking process involves supplying ink onto a marking surface so that it spreads after supply, thereby applying an identity mark used to determine the identity of an article. Equipped with, Determining the identity of the aforementioned article involves comparing information obtained from the image of the identity determination mark of a genuine product with information obtained from the image of the identity determination mark of the product to be determined. The image of the identity determination mark has individuality due to the wetting and spreading of ink droplets. The aforementioned article is a semiconductor device, Furthermore, The process includes a base layer formation step, which involves forming a base layer made of a curable resin composition, The marking surface is the surface of the underlying layer, In the ink marking step, the identity determination mark is applied to the base layer. A method for manufacturing an article, comprising the step of forming the base layer by laminating a base layer forming film containing the curable resin composition onto the back surface of a semiconductor substrate.

2. A method for manufacturing an article according to claim 1, Furthermore, A hardening step for hardening the aforementioned base layer, Equipped with, The ink marking step is performed after the curing step. A method for manufacturing articles.

3. A method for manufacturing an article according to claim 2, Furthermore, After the ink marking step, an annealing step is performed in which the identity determination mark is heated. Equipped with, A method for manufacturing articles.

4. A method for manufacturing an article according to claim 1 or 2, The aforementioned ink is an energy ray curing type ink. A method for manufacturing articles.

5. A method for manufacturing an article according to claim 1 or 2, The ink marking step includes supplying ink onto the marking surface such that multiple ink droplets land at positions spaced apart from each other. A method for manufacturing articles.

6. A method for manufacturing an article according to claim 5, The ink marking process includes a step of supplying ink such that, with the number of supplied ink droplets being 100%, the number of ink continuum units included in the identity determination mark is 0.5 to 50%. A method for manufacturing articles.

7. A method for manufacturing an article according to claim 1 or 2, The contact angle of the ink with respect to the marking surface is 5 to 25° or less. A method for manufacturing articles.

8. A step of manufacturing a genuine article using the manufacturing method described in claim 1 or 2, A step of capturing the identity determination mark during or after the manufacture of the genuine product, and generating genuine product data indicating the identity determination mark of the genuine product, A step of capturing an image of the identity determination mark of the item to be judged, and generating data of the item to be judged that shows the identity determination mark of the item to be judged, A step of determining whether the item to be determined is identical to the genuine item based on the genuine item data and the item to be determined data, Equipped with, A method for determining the identity of an item.

9. An ink marking device configured to supply ink onto a marking surface so that it spreads after supply, thereby imparting an identity mark used to determine the identity of an article. Equipped with, Determining the identity of the aforementioned article involves comparing information obtained from the image of the identity determination mark of a genuine product with information obtained from the image of the identity determination mark of the product to be determined. The image of the identity determination mark has individuality due to the wetting and spreading of ink droplets. The aforementioned article is a semiconductor device, Furthermore, The apparatus comprises a base layer forming device that forms a base layer made of a curable resin composition, The marking surface is the surface of the underlying layer, The ink marking device is configured to apply the identity determination mark to the underlying layer, The substrate forming apparatus is configured to form the substrate by laminating a substrate forming film containing the curable resin composition onto the back surface of a semiconductor substrate, thereby forming the substrate.

10. A manufacturing system for an article according to claim 9, Furthermore, The system includes an imaging device for capturing the aforementioned identity determination mark. A manufacturing system for goods.

11. A manufacturing system for an article according to claim 10, Furthermore, The system includes a feature calculation device that calculates feature quantities from images captured by the aforementioned imaging device. A manufacturing system for goods.

Images