Resin encapsulation method, resin encapsulated product, and resin encapsulation apparatus

Abstract

To provide a technique related to resin sealing which simplifies a process and is excellent in positioning accuracy.SOLUTION: A resin sealing method includes: preparing a first mold 34, a second mold 35, and a film 500 arranged between the first mold 34 and the second mold 35 (step S1); arranging a substrate 200 on the first mold 34 so that a tip 330 of a terminal 300 erected on the surface of a substrate 200 faces the film 500 (step S2); closing the molds 34 and 35, and storing a tip 330 in an internal space 39 of the second mold 35 through a through hole 510 of the film 500 (step S4); further closing the molds 34 and 35, and closing the through hole 510 by an intermediate part 320 of the terminal 300 larger than the tip 330, in a width direction X of the terminal (step S5); and filling between the first mold 34 and the film 500 with a resin 400 and resin-sealing a base end 310 to the substrate 200 (step S6).SELECTED DRAWING: Figure 8

Description

Technical Field

[0001] The present invention relates to a resin sealing method, a resin sealed product, and a resin sealing apparatus.

Background Art

[0002] Resin sealed products are provided with a draft for mold release. A press-fit terminal, which has a spring-elastic tip portion press-fitted into a through hole for electrical and mechanical connection, has an elastically deformable tip portion formed larger than the base end portion. Since there is a shape called an undercut having a taper opposite to the draft, it is difficult to resin-seal the terminal on a substrate. Therefore, when fixing a press-fit terminal to a substrate, for example, as disclosed in Patent Document 1, a cylindrical sleeve (pin holder) is first mounted on the substrate, and then the base end portion is inserted into the sleeve.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present invention has been made in view of such problems, and an object thereof is to provide a technique related to resin sealing that can simplify processes and has excellent positional accuracy.

Means for Solving the Problems

[0005] A resin sealing method according to one aspect of the present invention comprises preparing a first mold, a second mold facing the first mold, and a film disposed between the first mold and the second mold, The process includes: placing the substrate in the first mold such that the tips of terminals erected on the surface of the substrate face the film; closing the mold and housing the tips in the internal space of the second mold through the through-holes in the film; further closing the mold and closing the through-holes with the intermediate portion of the terminal, which is larger than the tip, in the width direction of the terminal perpendicular to the longitudinal direction from the base end to the tip; and filling the space between the first mold and the film with resin to resin-seal the base end to the substrate.

[0006] A resin-encapsulated product according to one aspect of the present invention comprises a substrate, a terminal having a base end, a tip end opposite to the base end, and an intermediate portion provided between the base end and the tip end, and a resin that resin-encapsulates at least the base end on the substrate, wherein in the width direction of the terminal, the base end is smaller than the tip end, the intermediate portion is larger than the tip end, the base end is embedded in the resin, and at least a part of the intermediate portion protrudes from the resin and is exposed.

[0007] A resin encapsulation apparatus according to one aspect of the present invention is an apparatus for resin encapsulating a substrate having terminals, comprising: a first mold on which the substrate is arranged; a second mold facing the first mold and having a housing portion for housing terminals; a film supply mechanism for supplying film between the first mold and the second mold; and a resin supply portion for supplying resin between the first mold and the film. The terminal has a base end supported by the substrate, a tip end opposite to the base end, and an intermediate portion provided between the base end and the tip end. In the width direction of the terminal perpendicular to the longitudinal direction from the base end to the tip end, the base end is smaller than the tip end and the intermediate portion is larger than the tip end. When the second mold houses the tip end in the housing portion through a through-hole in the film, the through-hole is closed by the intermediate portion, and the resin supply portion fills the space between the first mold and the film with resin to resin encapsulate at least the base end on the substrate. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a resin encapsulation technology that simplifies the process and offers excellent positional accuracy. [Brief explanation of the drawing]

[0009] [Figure 1] This is a plan view showing an example of a resin encapsulation apparatus according to one embodiment of the present invention. [Figure 2] This figure shows an example of a press-fit terminal according to one embodiment of the present invention, where (a) is a view from the thickness direction and (b) is a view from the width direction. [Figure 3] This is a cross-sectional view showing an example of a resin-encapsulated product according to one embodiment of the present invention. [Figure 4] Figure 3 is a cross-sectional view showing a modified example of the resin-encapsulated product. [Figure 5] This is a flowchart illustrating an example of a resin encapsulation method according to one embodiment of the present invention. [Figure 6] This is a cross-sectional view illustrating steps S1 and S2 shown in Figure 5. [Figure 7] This is a cross-sectional view illustrating steps S3 to S5 shown in Figure 5. [Figure 8] This is a cross-sectional view illustrating steps S6 and S7 shown in Figure 5.

[0010] A preferred embodiment of the present invention will be described with reference to the attached drawings. In each drawing, components with the same reference numerals have the same or similar configuration. Each drawing is conveniently accompanied by a Cartesian coordinate system consisting of the X, Y, and Z axes to clarify the relationships between the drawings and to help understand the positional relationships of each component. The horizontal plane containing the X and Y axes is referred to as the "XY plane," and the direction of the Z-axis arrow is described as vertically upward, while the direction opposite to the Z-axis arrow is described as vertically downward. When viewed from the front side of the resin encapsulation apparatus 1, the X-axis direction is, for example, the left-right direction, and the Y-axis direction is, for example, the front-back direction. The present invention will be described in detail below with reference to the drawings.

[0011] Figure 1 is a plan view showing an example of a resin encapsulation apparatus 1 according to one embodiment of the present invention. In the illustrated example, the resin encapsulation apparatus 1 is configured as a transfer molding machine and includes an in-module 2, a press module 3, an out-module 4, a loader mechanism 10, etc. The resin encapsulation apparatus 1 is not limited to a transfer molding machine, but may be a compression molding machine or any other type of molding machine. The loader mechanism 10 includes a rail 11 that extends across the in-module 2, the press module 3, and the out-module 4, a loader 12 and an unloader 13 that move along the rail 11, etc.

[0012] The in-module 2 includes a workpiece supply device 21 that supplies a substrate 200 supporting the terminals 300, a resin supply device 22 that supplies resin material such as a resin tablet, and the like. The press module 3 clamps the supplied workpiece between molds 32 and applies pressure to perform resin encapsulation (mold molding). The resin encapsulation device 1 may include multiple press modules 3. In the illustrated example, the resin encapsulation device 1 includes two press modules 3.

[0013] Each press module 3 is equipped with a press mechanism 31, a die 32, a film loader 33, etc. The out module 4 recovers the resin-encapsulated product 100 from the unloader 13. The out module 4 is equipped with a digger 41, a storage magazine 42, etc. The digger 41 separates unwanted resin from the resin-encapsulated product 100. The film loader 33 is an example of a film supply mechanism that supplies film 500 between the first die 34 and the second die 35, which will be described later. The first die 34 and the second die 35 will be described in detail later with reference to Figures 6 to 8.

[0014] Figure 2 shows an example of a terminal 300 according to one embodiment of the present invention, where (a) is a view from the plate thickness direction T and (b) is a view from the width direction W. In the illustrated example, the terminal 300 is configured as a press-fit terminal. The press-fit terminal can be electrically and mechanically connected by press-fitting the spring-elastic tip portion 330 into a through-hole.

[0015] One of the features of the resin sealing apparatus 1 according to the present embodiment is that resin sealing can be performed even for a terminal 300 such as a press-fit terminal (shown in FIG. 2) in which the distal end portion 330 is larger than the proximal end portion 310. The terminal 300 has a proximal end portion 310, a distal end portion 330 on the side opposite to the proximal end portion 310, and an intermediate portion 320 provided between the proximal end portion 310 and the distal end portion 330.

[0016] The proximal end portion 310 includes the proximal end 310E of the terminal 300 and a portion in the vicinity thereof. The distal end portion 330 includes the distal end 330E of the terminal 300 and a portion in the vicinity thereof. The direction from the proximal end portion 310 toward the distal end portion 330 is referred to as the longitudinal direction L of the terminal 300. More specifically, the direction passing through the proximal end 310E and the distal end 330E is the longitudinal direction L of the terminal 300.

[0017] The distal end portion 330 has a press-fit portion 331 configured to be elastically deformed in the width direction W of the terminal 300 and brought into conduction with a through hole. In the width direction W, the maximum width of the proximal end portion 310 is smaller than the maximum width of the distal end portion 330, and the maximum width of the intermediate portion 320 is larger than the maximum width of the distal end portion 330.

[0018] In the illustrated example, in the plate thickness direction T of the terminal 300 orthogonal to both the aforementioned longitudinal direction L and width direction W, the plate thickness T2 of the intermediate portion 320 is larger than the plate thickness T3 of the distal end portion 330. Further, the plate thickness T2 of the intermediate portion 320 is larger than the plate thickness T1 of the proximal end portion 310. Note that all of the plate thicknesses T1 to T3 may be uniform.

[0019] FIG. 3 is a cross-sectional view showing an example of a resin sealed product 100 according to an embodiment of the present invention. As shown in FIG. 3, the resin sealed product 100 includes a substrate 200, a terminal 300 having a proximal end portion 310, a distal end portion 330 on the side opposite to the proximal end portion 310, and an intermediate portion 320 provided between the proximal end portion 310 and the distal end portion 330, and a resin 400 that fixes the terminal 300 to the substrate 200.

[0020] The base end portion 310 of the terminal 300 is resin-sealed on the substrate 200. The type of the substrate 200 is not particularly limited, and various substrates such as a resin substrate, a ceramic substrate, a metal substrate, a carrier plate, a lead frame, and a wafer can be selected. The substrate 200 is formed in a flat plate shape and has a front surface 200A and a back surface 200B. The terminal 300 is erected on the front surface 200A of the substrate 200. In other words, the terminal 300 is provided on the substrate 200 such that the longitudinal direction L of the terminal 300 is substantially perpendicular to the front surface 200A.

[0021] One of the features of the resin-sealed product 100 is that the base end portion 310 is embedded in the resin 400, and at least a part of the intermediate portion 320 protrudes from the resin 400 and is exposed. Specifically, the inclined portion 321 of the intermediate portion 320 protrudes from the main surface 400A of the resin 400, and a fillet is formed between the inclined portion 321 and the main surface 400A.

[0022] In addition, by inspecting that at least a part of the intermediate portion 320 of the terminal 300 in the resin-sealed product 100 protrudes from the resin 400 and is exposed by visual inspection, an image inspection device or the like, information such as whether the molding has been performed without resin leakage or the like can be determined, so that operations such as quality control can be streamlined.

[0023] FIG. 4 is a cross-sectional view showing a modified example of the resin-sealed product 100 shown in FIG. 3. In the illustrated example, spot facing is provided around the terminal 300. Even in this modified example, at least a part of the intermediate portion 320 protrudes from the spot facing surface 410A and is exposed. A fillet is formed between the inclined portion 321 and the spot facing surface 410A.

[0024] FIG. 5 is a flowchart illustrating an example of a resin sealing method according to an embodiment of the present invention. FIGS. 6 to 8 are cross-sectional views illustrating steps S1 to S7 shown in FIG. 5. The mold 32 includes a first mold 34 and a second mold 35. In the illustrated example, the first mold 34 on which the substrate 200 is disposed is a lower mold, and the second mold 35 facing the first mold 34 is an upper mold. The configuration may be such that the second mold 35 serves as the lower mold and the first mold 34 serves as the upper mold.

[0025] A film (release film) 500 supplied from the film loader 33 shown in Figure 1 is placed between the first mold 34 and the second mold 35. The film 500 may have through holes 510 formed in it beforehand, or the through holes 510 may be formed in the film 500 by a rod-shaped projection 332 provided at the tip 330 of the terminal 300. The projection 332 may also be called the perforating part 332 that drills through holes 510 in the film.

[0026] The second mold 35 is partitioned into an internal space 39 that accommodates the terminals 300 when the mold is closed. A cylindrical sleeve 36 is fitted inside the internal space 39. The gap between the internal space 39 and the sleeve 36 functions as a suction port 38 that can suck up the film 500. The suction force of the suction port 38 allows the film 500 to be attached to the second mold 35. The resin supply unit 40 supplies resin 400 between the first mold 34 and the film 500. The resin supply unit 40 is, for example, a transfer mechanism and includes a pot for heating and melting resin tablets, a plunger for pushing the molten resin into the molds 34 and 35, etc.

[0027] An ejector pin 37 is provided at the back of the internal space 39. The ejector pin 37 presses the tip 330E of the terminal 300 when releasing the resin-sealed product 100. The tip 330E is formed flat so that the pressing force of the ejector pin 37 does not easily escape.

[0028] As shown in Figures 5 and 6, in step S1, a first mold 34, a second mold 35 facing the first mold 34, and a film 500 placed between the first mold 34 and the second mold 35 are prepared. In step S2, the substrate 200 is placed in the first mold such that the base end 310 of the terminal 300 is supported by the substrate 200 and the tip 330 of the terminal 300 faces the film 500.

[0029] As shown in Figure 7, in step S3, the molds 34 and 35 are closed, and the protruding portion 332 pierces the film 500 to form a through hole 510. Step S3 may be omitted if the through hole 510 is formed in the film 500 in advance. In step S4, the molds 34 and 35 are closed further, and the tip portion 330 is housed in the internal space 39 of the second mold 35 through the through hole 510 in the film 500.

[0030] In step S5, the molds 34 and 35 are further closed, and the through hole 510 is closed by the intermediate portion 320 of the terminal 300, which is larger than the tip portion 330, in the width direction W of the terminal 300 that is perpendicular to the longitudinal direction L of the terminal 300 extending from the base portion 310 to the tip portion 330. As shown in Figure 8, in step S6, the resin supply unit 400 fills the space between the first mold 34 and the film 500 to resin-seal the base portion 310 to the substrate 200. The step may optionally further include step S7 in which the tip 330E of the flatly formed protrusion 332 is pressed by an ejector pin 37 provided in the second mold 35.

[0031] As described above, the present invention provides a resin encapsulation technology in which the terminal 300 can be fixed without a sleeve, thereby reducing the number of parts. The subsequent step of attaching the terminal 300 to a sleeve can be omitted, shortening the cycle time. Since the terminal 300 can be fixed directly without a sleeve, positional accuracy is excellent. Therefore, the present invention provides a resin encapsulation technology that simplifies the process and offers excellent positional accuracy.

[0032] The embodiments described above are provided to facilitate understanding of the present invention and are not intended to limit its interpretation. The elements, arrangement, materials, conditions, shapes, and sizes of the embodiments are not limited to those exemplified and can be modified as appropriate. Furthermore, it is possible to partially substitute or combine the configurations shown in different embodiments.

[0033] [Note 1] The resin encapsulation method involves preparing a first mold 34, a second mold 35 facing the first mold 34, and a film 500 placed between the first mold 34 and the second mold 35 (step S1); placing the substrate 200 in the first mold 34 such that the tips 330 of the terminals 300 erected on the surface of the substrate 200 face the film 500 (step S2); closing the molds 34 and 35, and allowing the film 500 to enter the internal space 39 of the second mold 35 through the through-holes 510 in the film 500. The process includes: housing the tip portion 330 (step S3); further closing the molds 34 and 35, and closing the through hole 510 with the intermediate portion 320 of the terminal 300, which is larger than the tip portion 330, in the width direction W of the terminal 300 that is perpendicular to the longitudinal direction L from the base portion 310 to the tip portion 330 (step S6); and filling the space between the first mold 34 and the film 500 with resin 400 to resin-seal the base portion 310 to the substrate 200 (step S5).

[0034] According to Appendix 1, the number of parts can be reduced because the undercut terminal 300 can be fixed without a sleeve. The cycle time can be shortened because the subsequent process of attaching the terminal 300 to a sleeve can be omitted. Positional accuracy is excellent because the terminal 300 can be fixed directly without a sleeve.

[0035] [Note 2] In Note 1, the intermediate portion 320 may be inclined such that it increases in the width direction W of the terminal 300 as it moves from the tip portion 330 towards the base portion 310.

[0036] According to Appendix 2, the terminal 300 is guided by the inclined intermediate portion 320 and aligned with the second mold 35. This allows for the provision of a resin sealing device 1 with superior positional accuracy.

[0037] [Note 3] In appendix 1 or 2, the tip portion 330 may further include an elastically deformable press-fit portion 331 and a protruding portion 332 that protrudes from the press-fit portion 331 toward the second mold 35, wherein the protruding portion 332 pierces the film 500 to form a through hole 510 (step S3).

[0038] According to Appendix 3, since the film 500 can be perforated by the die-closing operation, there is no need to prepare through-holes 510 in the film 500 in advance.

[0039] [Note 4] In any one of the appendices 1 to 3, the tip 330E of the projection 332 may be formed flat, and the ejector pin 37 provided on the second mold 35 may further include pressing the tip 330E of the projection 332 (step S7).

[0040] According to Appendix 4, because the tip 330E of terminal 300 is flat, the pressing force of the ejector pin 37 is less likely to escape. This allows for more reliable release of the resin-sealed product 100.

[0041] [Note 5] In any one of the appendices 1 to 4, the resin 400 may be a thermosetting resin.

[0042] Thermosetting resins have higher fluidity during molding compared to thermoplastic resins, making them prone to leakage even through small gaps. According to the present invention, the intermediate portion 320 can seal the gaps to prevent the resin 400 from leaking through the through-holes 510 of the film 500, making it particularly suitable for resin sealing using highly fluid thermosetting resins.

[0043] [Note 6] The resin-encapsulated product 100 comprises a substrate 200, a terminal 300 having a base end 310, a tip end 330 opposite to the base end 310, and an intermediate portion 320 provided between the base end 310 and the tip end 330, and a resin 400 that fixes the terminal 300 to the substrate 200. In the width direction W of the terminal 300, the base end 310 is smaller than the tip end 330, the intermediate portion 320 is larger than the tip end 330, the base end 310 is embedded in the resin 400, and at least a part of the intermediate portion 320 protrudes from the resin 400 and is exposed.

[0044] [Note 7] The resin encapsulation apparatus 1 is a device for resin encapsulating a substrate 200 having terminals 300, and comprises a first mold 34 on which the substrate 200 is placed, a second mold 35 facing the first mold 34, a film supply mechanism for supplying a film 500 between the first mold 34 and the second mold 35, and a resin supply unit for supplying resin between the first mold 34 and the film 500. The terminals 300 have a base end 310 supported by the substrate 200, a tip end 330 opposite to the base end 310, and an intermediate portion 32 provided between the base end 310 and the tip end 330. The terminal 300 has a base portion 310 and a middle portion 320, and in the width direction W of the terminal 300 perpendicular to the longitudinal direction L from the base portion 310 to the tip portion 330, the base portion 310 is smaller than the tip portion 330 and the middle portion 320 is larger than the tip portion. When the second mold 35 accommodates the tip portion 330 in the internal space 39 of the second mold 35 through the through hole 510 of the film 500, the through hole 510 is closed by the middle portion 320, and the resin supply unit fills the space between the first mold 34 and the film 500 with resin to resin-seal at least the base portion 310 on the substrate 200.

[0045] According to Appendix 6 or 7, similar to Appendix 1, the number of parts can be reduced because the undercut terminal can be fixed without a sleeve. The cycle time can be shortened because the subsequent process of attaching the terminal 300 to a sleeve can be omitted. Excellent positional accuracy is achieved because the terminal 300 can be fixed directly without a sleeve. [Explanation of Symbols]

[0046] 1... Resin sealing device, 2... In-module, 3... Multiple press modules, 4... Out-module, 10... Loader mechanism, 11... Rail, 12... Loader, 13... Unloader, 21... Workpiece supply device, 22... Resin supply device, 31... Press mechanism, 32... Mold, 33... Film loader (example of film supply mechanism), 34... First mold, 35... Second mold, 36... Sleeve, 37... Ejector pin, 38... Air intake, 39... Internal space, 40... Resin supply section, 41... Degator, 42... Storage magazine, 1 00...Resin-encapsulated product, 200...Substrate, 200A...Front surface, 200B...Back surface, 300...Terminal, 310...Base end, 310E...Base end, 320...Intermediate part, 321...Inclined part, 322...Retaining part, 330...Tip, 330E...Tip, 331...Press-fit part, 332...Protruding part, 400...Resin, 400A...Main surface of resin, 410A...Counterbored surface, 500...Film, 510...Through hole, L...Longer direction, T...Thickness direction, T1~T3...Thickness, W...Width direction, X...First axial direction, Y...Second axial direction, Z...Third axial direction.

Claims

1. To prepare a first mold, a second mold facing the first mold, and a film placed between the first mold and the second mold, The substrate is placed in the first mold such that the tips of the terminals erected on the surface of the substrate face the film. The film is held by suction to a sleeve attached to the second mold. The mold is closed, and the tip portion is housed in the sleeve through the through-hole in the film. The mold is further closed, and the through hole is sealed by pressing the intermediate portion of the terminal, which is larger than the tip portion, against the sleeve via the film in the width direction of the terminal perpendicular to the longitudinal direction from the base end to the tip portion, and, This includes filling the space between the first mold and the film with resin to resin-seal the base end to the substrate, Resin encapsulation method.

2. The gap between the sleeve and the second mold has a suction port capable of sucking up the film, The resin encapsulation method according to claim 1.

3. The intermediate portion is inclined such that it increases in the width direction of the terminal as it moves from the tip to the base end. The resin encapsulation method according to claim 1.

4. The aforementioned tip portion has an elastically deformable press-fit portion and a protruding portion that extends from the press-fit portion toward the second mold, The protrusion further includes piercing the film to form the through-hole, The resin encapsulation method according to claim 1.

5. The tip of the aforementioned protrusion is formed flat, The ejector pin provided in the second mold presses against the tip of the protrusion to release the resin-sealed product from the mold, The resin encapsulation method according to claim 4.

6. The aforementioned resin is a thermosetting resin. The resin encapsulation method according to any one of claims 1 to 5.

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