Substrates, methods for manufacturing laminated substrates, and products

Abstract

To provide a manufacturing method of a laminated substrate that can be laminated by a simple method and that can reduce the risk of foreign matter entering between a conductor layer and an insulating layer.SOLUTION: A manufacturing method of a laminated substrate includes the steps of preparing a first metal layer-attached resin layer 100 in which a first metal layer 20 and a first resin layer 10 are integrated, and adhering the first resin layer 10 of the resin layer 100 with the first metal layer to a target substrate.SELECTED DRAWING: Figure 1

Description

TECHNICAL FIELD

[0001] The present invention relates to a substrate, a method for manufacturing a laminated substrate, and a product.

BACKGROUND ART

[0002] As printed wiring boards, in addition to single-sided boards and double-sided boards as finished products, multi-layer boards with many stacked layers are provided. For example, Patent Document 1 discloses that a resin layer with openings is laid up on a second support having components mounted on a conductor layer, a first support is laid up on the topmost prepreg in the laid-up structure, and after lamination, the first carrier and the second carrier are peeled off from the laminate to obtain the laminate (see

[0041] ).

[0003] As shown in this Patent Document 1, conventionally, for example, for a 4-layer board, a lamination method has been used in which a double-sided board circuit is formed at the center, a conductor layer and a resin layer are separately prepared, these are superposed in a lay-up step, and then heated to be cured. This is because if a conductor layer such as a copper foil and an insulating layer are brought into close contact in advance and then bonded to the inner layer circuit, the material of the insulating layer is mainly composed of a thermosetting resin (mainly epoxy), so once it is hardened, it has the property of not softening even after the second thermocompression bonding during lamination, making lamination itself impossible.

PRIOR ART DOCUMENTS

PATENT DOCUMENTS

[0004]

PATENT DOCUMENT 1

SUMMARY OF THE INVENTION

PROBLEMS TO BE SOLVED BY THE INVENTION

[0005] Traditionally, laminated substrates were manufactured by preparing the conductive layer and insulating layer separately. However, this method carried the risk of scratches, cracks, or wrinkles on the copper foil of the conductive layer, or the presence of foreign matter (dust or debris) between the insulating layer and the foil. This required extremely delicate manual adjustments or a similarly complex process. Consequently, the manufacturing method was not only cumbersome but also posed numerous risks, inevitably resulting in defects such as dents and scratches on the surface of the conductive layer and air pockets (voids) within the insulating layer.

[0006] This invention takes into consideration improvements in these areas and provides a substrate and a method for manufacturing a laminated substrate (including shielding) that can improve productivity by manufacturing laminates using a simpler method and reduce the various defects mentioned above. [Means for solving the problem]

[0007] A method for manufacturing a laminated substrate according to one aspect of the present invention is: A step of preparing a resin layer with a first metal layer, in which the first metal layer and the first resin layer are integrated, A step of bonding the first resin layer of the resin layer with the first metal layer to the target substrate, It may be provided. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a substrate for manufacturing a laminated substrate (including shielding) that can improve productivity by laminating in a simple method and reduce the various defects mentioned above. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a cross-sectional view illustrating an embodiment of the manufacturing method according to the present invention, in which a resin layer with a first metal layer is provided on both sides of the second resin layer. [Figure 2] Figure 2 is a cross-sectional view showing a four-layer laminated substrate produced using the embodiment shown in Figure 1. [Figure 3]Figure 3 is a cross-sectional view illustrating an embodiment of the manufacturing method according to the present invention, in which a resin layer with a first metal layer is provided on one side of the second resin layer. [Figure 4] Figure 4 is a cross-sectional view showing a laminated substrate produced using the embodiment shown in Figure 3. [Figure 5] Figure 5 is a cross-sectional view illustrating the process of manufacturing a metal-layered resin layer having a metal layer on one side, according to an embodiment of the present invention. [Figure 6] Figure 6 is a cross-sectional view illustrating the process for manufacturing a metal-layered resin layer having metal layers on both sides, according to an embodiment of the present invention. [Figure 7] Figure 7 is a cross-sectional view of a laminated substrate according to an embodiment of the present invention, in which an adhesive layer is provided between the first metal layer and the first resin layer, and an adhesive layer is provided between the second resin layer and the second metal layer. [Modes for carrying out the invention]

[0010] As an example, as shown in Figures 1 and 3, a resin layer 100 with a first metal layer is used, in which the first metal layer 20 and the first resin layer 10 are integrated. The first resin layer 10 of this resin layer with a first metal layer may be a layer in which the main component of the insulating material is crosslinked in a range of 10% to 90% of the total. The first metal layer 20 is a metal foil, etc., and as an example, the resin layer 100 with a first metal layer is a metal-clad laminate in which a metal layer made of a metal foil, etc. is attached to an insulating layer in which the main component of the insulating material is crosslinked (crystallized, glass transition) in a range of 10% to 90% of the total. This metal-clad laminate may be a metal foil-clad laminate (shield) with an inner layer circuit in a printed circuit board, or it may be a laminated substrate with a circuit formed on the surface. In the first resin layer 10, the main component of the insulating material may be 30% or more of the total, or 70% or less. The thickness of the first metal layer 20 may be, for example, 10 mm or less, or 9 mm or less.

[0011] As an example of a target substrate, a resin layer with a second metal layer 200 is used, which has a second resin layer 30 and a second metal layer 40 provided on the second resin layer 30. The second resin layer 30 of this resin layer with a second metal layer 200 may be a layer in which the main component of the insulating material has been crosslinked in a range of 10% to 90% of the total. The second metal layer 40 is a metal foil or the like, and as an example, the resin layer with a second metal layer 200 is a metal-clad laminate in which a metal layer made of a metal foil or the like is attached to an insulating layer in which the main component of the insulating material has been crosslinked (crystallized, glass transitioned) in a range of 10% to 90% of the total.

[0012] In this embodiment, the description will be based on a configuration in which the second resin layer 30 is the core layer and the second metal layer 40 is the circuit layer, but the embodiment is not limited to this configuration. The resin layer 100 with the first metal layer is typically a metal-layered prepreg. The second resin layer 30 and the first resin layer 10 may be made of the same material or different materials. Both the second resin layer 30 and the first resin layer 10 may be made of insulating materials.

[0013] In this embodiment, as an example, a laminated substrate is manufactured by bonding the second metal layer-attached resin layer 200 and the first metal layer-attached resin layer 100 such that the second metal layer 40 constituting the circuit of the second metal layer-attached resin layer 200 is embedded within the first resin layer 10 of the first metal layer-attached resin layer 100 (see Figures 1 to 4). During this bonding, a fixing plate 500 may be used to press the first metal layer-attached resin layer 100 onto the second metal layer-attached resin layer 200.

[0014] The first resin layer 10 of the first metal layer-attached resin layer 100 may be in a semi-cured state. In this semi-cured state, the circuit-formed second metal layer 40 can be easily embedded in the first resin layer 10 simply by pressing the first metal layer-attached resin layer 100 onto the second metal layer-attached resin layer 200.

[0015] In this embodiment, "semi-cured state" means a state in which, unlike a liquid, it has a certain shape but is not completely solidified and can be deformed, for example, by pressing. The first resin layer 10 may not be in a semi-cured state but may be in a fully cured state. In this case, when the second metal layer 40 consists of a circuit, a recess may be created by cutting out a part of the first resin layer 10, and the second metal layer 40 may be fitted into the recess. Electronic elements (not shown) such as semiconductor elements, resistors, and capacitors may be provided on the second metal layer 40 via a conductive adhesive (not shown) such as solder.

[0016] In conventional designs, the metal layer, such as metal foil, and the resin layer were manufactured separately because they were from different manufacturers. The metal layer and the resin layer were then bonded together using a process known as layup. In contrast, the group of companies managed by the present inventor had both a company that manufactured the resin layer and a company that manufactured the metal layer, such as metal foil. Therefore, instead of manufacturing the metal layer, such as metal foil, and the resin layer separately, they decided to manufacture a first resin layer with metal foil attached in a series of processes. As a result, it is no longer necessary to bond the metal layer, such as metal foil, and the resin layer using a layup process as in the conventional method. This significantly improves the efficiency of the lamination process. Furthermore, while there is a risk of foreign matter contamination between the metal layer and the resin layer during the layup process, this risk can be reduced by preparing a resin layer with a metal layer attached, in which the metal layer and the resin layer are integrated.

[0017] As shown in Figure 1 and Figure 2, the second metal layer 40 may be provided on both one surface (front surface; the upper surface in Figure 1) and the other surface (back surface; the lower surface in Figure 1) of the second resin layer 30. In this case, for example, a pair of first resin layers with metal layer 100 are prepared. Then, the resin layer with second metal layer 200 and one of the first resin layers with metal layer 100 are bonded such that the second metal layer 40 provided on one surface of the second resin layer 30 is embedded in the first resin layer 10 of the one first resin layer with metal layer 100, and the resin layer with second metal layer 200 and the other first resin layer with metal layer 100 may be bonded such that the second metal layer 40 provided on the other surface of the second resin layer 30 is embedded in the first resin layer 10 of the other first resin layer with metal layer 100.

[0018] Further, the second metal layer 40 may be provided only on one surface or the other surface of the second resin layer 30 (see Figure 3 and Figure 4). In this case, for example, one first resin layer with metal layer 100 is prepared. Then, the resin layer with second metal layer 200 and the first resin layer with metal layer 100 may be bonded such that the second metal layer 40 provided on the second resin layer 30 is embedded in the first resin layer 10 of the first resin layer with metal layer 100.

[0019] Each of the first metal layer 20 and the second metal layer 40 may be made of, for example, a metal foil such as copper foil. When the first resin layer 10 has adhesiveness, the first metal layer 20 and the first resin layer 10 may be directly bonded. Similarly, when the second resin layer 30 has adhesiveness, the second resin layer 30 and the second metal layer 40 may be directly bonded. However, the present invention is not limited to this, and as shown in Figure 7, an adhesive layer 70 may be provided between the first metal layer 20 and the first resin layer 10. Similarly, an adhesive layer 70 may be provided between the second resin layer 30 and the second metal layer 40.

[0020] For the materials of the first resin layer 10 and the second resin layer 30, for example, epoxy resin, unsaturated polyester resin, vinyl ester resin, bismaleimide resin, benzoxazine resin, triazine resin, phenolic resin, urea resin, melamine resin, polyimide resin, polyolefin resin, aliphatic polyamide resin, semi-aromatic polyamide resin, aromatic polyester resin, polycarbonate resin, polystyrene resin, etc. may be used.

[0021] As an example, as shown in Figure 5, a resin layer 100 with a first metal layer can be manufactured by transporting a semi-cured first resin layer 10 by a conveying unit 310 such as a belt conveyor, while a first metal layer 20 made of copper foil or the like is applied to the first resin layer 10 by a supply unit 320 such as a supply roller.

[0022] When providing the first metal layer 20 on both sides, as shown in Figure 5, the first metal layer 20 may be provided on one side of the first resin layer 10, and then the first resin layer 10 with the first metal layer 20 on one side may be inverted to provide the first metal layer 20 again (see Figure 6).

[0023] The configuration may also be reversed; the first metal layer-attached resin layer 100 may be manufactured by conveying the metal layer using a conveying unit 310 such as a belt conveyor, while applying resin to the metal layer using a supply unit 320 such as a supply roller (see Figures 5 and 6).

[0024] When forming a circuit on the first metal layer 20, it is formed by patterning the first metal layer 20 of the resin layer 100 with the first metal layer formed in this manner.

[0025] The resin layer 200 with the second metal layer may be manufactured in the same manner as the resin layer 100 with the first metal layer. In this case, the resin layer 200 with the second metal layer, in which the second metal layer 40 and the second resin layer 30 are integrated, will be provided. In this case as well, the circuit may be formed by patterning the second metal layer 40, which is manufactured in the manner shown in Figures 5 and 6.

[0026] The substrates and laminated substrates of this embodiment may be incorporated into any mounting device such as automobiles, airplanes, ships, helicopters, personal computers, and home appliances. Furthermore, insulating printed circuit boards, houses, etc., using substrates and laminated substrates as in this embodiment may also be provided. The products of this embodiment may include a wide range of items such as electronic components, devices, electrical products, communication equipment, and automobiles.

[0027] The above-described embodiments, modifications, and disclosure of drawings are merely examples for illustrating the invention described in the claims, and the above-described embodiments or disclosure of drawings do not limit the invention described in the claims. [Explanation of Symbols]

[0028] 10 First resin layer 20 First metal layer 30 Second resin layer 40 Second metal layer 100 First metal layer with resin layer 200 Resin layer with second metal layer

Claims

[Claim 1] A process to prepare a resin layer with a first metal layer having a semi-cured first resin layer, by conveying a semi-cured resin in which the main component of the insulating material has been cross-linked in a range of 10% to 90% of the total, using a conveying unit, and then applying a first metal layer to the resin using a supply unit, A process to prepare a resin layer with a second metal layer having a semi-cured second resin layer, by conveying a semi-cured resin in which the main component of the insulating material has been cross-linked in a range of 10% to 90% of the total, using a conveying unit, and then applying a second metal layer to the resin using a supply unit, The process of patterning the second metal layer of the resin layer with the second metal layer to form a circuit layer, A step of bonding the second metal layer-attached resin layer and the first metal layer-attached resin layer so that the circuit layer of the second metal layer-attached resin layer is embedded in the first resin layer, Equipped with, A method for manufacturing a laminated substrate in which a layup process is not performed in the step of preparing the resin layer with the first metal layer.

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