Liquid discharge head and liquid discharge device

Abstract

To provide a liquid discharge head that can suppress deterioration in image performance without increasing a chip size, and to provide a liquid discharge device.SOLUTION: A liquid discharge head has a configuration where a fine communication part 20 is provided in a flow passage partition wall 16 between a common supply flow passage 13a and a common recovery flow passage 13b without installing an adhesion layer 19 to a liquid supply substrate 203.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a liquid ejection head that ejects circulating liquid, and a liquid ejection apparatus on which the liquid ejection head can be mounted.

Background Art

[0002] In a liquid ejection head that ejects liquid, there is a problem of so-called crosstalk, in which pressure fluctuations generated when droplets are ejected from ejection ports through pressure chambers propagate to other pressure chambers through liquid flow paths and change ejection characteristics.

[0003] In recent years, liquid ejection heads are required to eject liquid while circulating the liquid in the pressure chambers, in addition to further higher image quality and higher resolution.

[0004] Patent Document 1 discloses a configuration that suppresses crosstalk by alternately arranging a common supply flow path and a common recovery flow path, and providing a damper on part of the wall surface forming the common supply flow path and the common recovery flow path. Patent Document 1 has a configuration in which a damper member serving as a damper is joined to the upper part of the flow path partition wall between the common supply flow path and the common recovery flow path.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] In a configuration like that described in Patent Document 1, it is necessary to secure a sufficient bonding area above the flow channel partition wall. However, in this case, the damper area and fluid area may become smaller, raising concerns about increased crosstalk due to the reduction in the damper area and increased pressure loss due to the reduction in the fluid area. As a result, there is a risk of degrading image performance. On the other hand, if the bonding area is reduced, there is a concern that the adhesive layer may protrude at the bonding area, potentially causing blockage of the flow channel, which may also degrade image performance. Furthermore, increasing the chip size in order to secure the damper area, fluid area, and bonding area is undesirable.

[0007] Therefore, the present invention provides a liquid dispensing head and a liquid dispensing device that can suppress a decrease in image performance without increasing the chip size. [Means for solving the problem]

[0008] Therefore, the liquid discharge head of the present invention comprises a discharge port for discharging liquid, a pressure chamber communicating with the discharge port, a pressure generating element provided in the pressure chamber capable of discharging liquid from the discharge port by the action of pressure, an individual supply channel communicating with the pressure chamber and capable of supplying liquid to the pressure chamber, an individual recovery channel communicating with the pressure chamber and capable of recovering liquid from the pressure chamber, a common supply channel communicating with the individual supply channels, a common recovery channel communicating with the individual recovery channels, and a channel partition provided between the common supply channel and the common recovery channel, wherein there are multiple discharge ports and pressure chambers, the common supply channel and the common recovery channel are each communicating with the multiple individual supply channels and the multiple individual recovery channels, respectively, and a communication portion is provided in the region corresponding to the channel partition between a first substrate on which the channel partition is formed and a second substrate laminated on the first substrate, connecting the common supply channel and the common recovery channel. The viscous resistance in the communication section is 100 times or more than the viscous resistance in the flow path from the individual supply flow path through the pressure chamber to the individual recovery flow path. It is characterized by the following: [Effects of the Invention]

[0009] According to the present invention, it is possible to provide a liquid dispensing head and a liquid dispensing device that can suppress the degradation of image performance without increasing the chip size. [Brief explanation of the drawing]

[0010] [Figure 1] This is a schematic perspective view showing a liquid dispensing device capable of being equipped with a liquid dispensing head. [Figure 2] This is an external perspective view showing the liquid dispensing head. [Figure 3] This is a diagram showing a liquid dispensing substrate. [Figure 4] This is a diagram showing a liquid dispensing substrate. [Figure 5] This is a cross-sectional view of IVb-IVb in Figure 4(a). [Figure 6] This is a cross-sectional view showing a liquid dispensing substrate as a comparative example. [Figure 7] This graph shows the relationship between the height of the minute connecting section and the viscous resistance ratio. [Figure 8] This is a diagram showing a liquid dispensing substrate. [Figure 9] This is a diagram showing a liquid dispensing substrate. [Figure 10] This figure shows a modified example of a liquid discharge substrate. [Modes for carrying out the invention]

[0011] (First embodiment) The liquid ejection head and liquid ejection device in this embodiment are applicable to devices such as printers, copiers, facsimile machines with communication systems, word processors with printer units, and industrial recording devices that are combined with various processing devices.

[0012] A first embodiment of the present invention will be described below with reference to the drawings.

[0013] FIG. 1 is a schematic perspective view illustrating a liquid discharge apparatus 101 that can be equipped with a liquid discharge head 1 to which the present embodiment can be applied. The liquid discharge apparatus 101 forms an image on a recording medium 111 by discharging liquid (hereinafter also referred to as ink) from the liquid discharge head 1 while moving the recording medium 111 at a position facing the liquid discharge surface of the liquid discharge head 1. The liquid discharge head 1 mounted on the liquid discharge apparatus 101 includes liquid discharge heads 1Ca and 1Cb corresponding to cyan (C) ink, and liquid discharge heads 1Ma and 1Mb corresponding to magenta (M) ink. Further, the liquid discharge head 1 includes liquid discharge heads 1Ya and 1Yb corresponding to yellow ink, and liquid discharge heads 1Ka and 1Kb corresponding to black (K) ink.

[0014] The liquid discharge head 1 is provided with a plurality of discharge ports along the X direction corresponding to the width of the recording medium 111. The recording medium 111 is conveyed in the direction A by a conveying unit 110, and recording is performed by the liquid discharge head 1.

[0015] FIG. 2 is an external perspective view illustrating the liquid discharge head 1. In the liquid discharge head 1 according to the present embodiment, four liquid discharge substrates 2 are arranged on a head main body 4. The liquid discharge substrates 2 are arranged such that the end portions of the discharge ports 3 arranged in the X direction overlap in the Y direction. By arranging the liquid discharge substrates 2 in this manner, recording using a long discharge port array can be realized. The ink discharged by the liquid discharge head 1 is supplied to the liquid discharge substrates 2 from a liquid tank (not illustrated) through a common supply port (not illustrated) of the main body 3.

[0016] FIG. 3(a) is a diagram showing the liquid discharge substrate 2 viewed from the discharge port surface side where the discharge ports 3 are formed, and FIG. 3(b) is a diagram showing the liquid discharge substrate 2 viewed from the surface opposite to the discharge port surface. A plurality of the discharge ports 3 formed in the discharge port substrate 201 are arranged along the longitudinal direction of the discharge port substrate 201, forming a plurality of discharge port arrays. A plurality of connection flow paths 15 are formed in the flow path forming substrate 204, ink is supplied from the connection flow paths 15 to the liquid discharge substrate 2, and the ink is discharged from the discharge ports 3 through the internal flow paths to be applied to the recording medium 111. Further, the head main body 4 is provided with an unillustrated electric substrate for supplying electric power and signals required to discharge liquid, and is connected to the terminals 10 of each liquid discharge substrate 2 via unillustrated wiring. The liquid discharge head 1 can be implemented in any form including the example of FIG. 2, and other forms are not limited thereto.

[0017] FIG. 3(c) is a cross-sectional view taken along line IIIc-IIIc of the liquid discharge substrate 2 in FIG. 3(a). The liquid discharge substrate 2 includes a discharge port substrate 201, an actuator substrate 202, a liquid supply substrate 203, and a flow path forming substrate 204. Further, the liquid discharge substrate 2 includes a damper substrate 302 provided with a damper member 300 between the flow path forming substrate 204 and the liquid supply substrate 203. As described above, the liquid discharge substrate 2 includes five bonded substrates.

[0018] Figure 3(d) is an enlarged view of section α in Figure 3(c). The liquid discharge substrate 2 is provided with a plurality of pressure chambers 11, each pressure chamber 11 being connected to a discharge port 3. An actuator substrate 202, which forms part of the wall surface of the pressure chamber 11, is provided with a piezoelectric element 18 facing the discharge port 3. Liquid can be discharged from the discharge port 3 by the action of the piezoelectric element 18. The piezoelectric element 18 deforms when a voltage is applied, pressurizing the liquid in the pressure chamber 11 and causing the liquid to be discharged as droplets from the discharge port 3. Individual supply channels 12a and individual recovery channels 12b are also formed in communication with the pressure chamber 11. The individual supply channel 12a is connected to a common supply channel 13a, and the individual recovery channel 12b is connected to a common recovery channel 13b. The individual supply channel 12a is capable of supplying liquid to the pressure chamber 11, and the individual recovery channel 12b is configured to recover liquid from the pressure chamber 11.

[0019] The wall surface of the common supply channel 13a facing the individual supply channel 12a is formed by a damper member 300, and the wall surface of the common supply channel 13b facing the individual supply channel 12b is also formed by a damper member 300. The surface of the damper member 300 opposite to the surface facing the individual supply channel 12b forms part of the damper region 301. The common supply channel 13a is connected to the connecting channel 15a, and liquid is supplied to the common supply channel 13a from the outside via the connecting channel 15a. The common recovery channel 13b is connected to the connecting channel 15b, and liquid is recovered from the common recovery channel 13b to the outside via the connecting channel 15b.

[0020] The discharge port forming substrate 201, the actuator substrate 202, the liquid supply substrate 203, and the flow path forming substrate 204 can each be formed from a silicon substrate or the like. Furthermore, they are not limited to being separate substrates.

[0021] The damper member 300 is made of an elastic material, and a resin material such as polyimide or polyamide can be used. The damper substrate 302 is made by attaching the damper member 300 to one side of a silicon substrate and creating an opening in the damper member 300 by etching or other means to match the flow channel shape of the flow channel forming substrate 204. Then, it is attached to the flow channel forming substrate 204 and the common supply channel 13a and common recovery channel 13b are formed by etching the side opposite to the damper member 300. The means for forming the opening in the damper member 300 can be dry etching, or, if the damper member 300 is made of a photosensitive resin, patterning by exposure.

[0022] In this embodiment, a configuration in which liquid is discharged from the discharge port 3 by the action of a piezoelectric element 18 has been described as an example, but the invention is not limited to this, and a configuration in which liquid is discharged from the discharge port by the action of a pressure generating element such as a heating element is also possible.

[0023] Figure 4(a) is a plan perspective view showing an enlarged portion of the liquid discharge substrate 2, and Figure 4(b) is a cross-section of IVb-IVb in Figure 4(a). The liquid discharge substrate 2 is arranged with a plurality of discharge ports 3 and pressure chambers 11 that communicate with and correspond to the discharge ports 3. Furthermore, multiple rows of discharge ports are formed in the Y direction on the liquid discharge substrate 2 by arranging the discharge ports 3 in the X direction, and individual supply channels 12a and individual recovery channels 12b are formed for each pressure chamber 11. The common supply channel 13a and common recovery channel 13b are formed extending in the X direction, which is the longitudinal direction of the substrate. In addition, a damper region 301 is arranged so as to overlap with the positions of the individual supply channels 12a and individual recovery channels 12b. Furthermore, the individual supply channel 12a is connected to the supply connection channel 15a via the common supply channel 13a, and the individual recovery channel 12b is connected to the recovery connection channel 15b via the common recovery channel 13b.

[0024] Each pressure chamber 11 corresponding to each discharge port is adjacent to the pressure chamber 11 in the X direction, which is the shorter direction of the pressure chamber 11. This adjacent arrangement allows the discharge ports communicating with the pressure chambers 11 to form a discharge port row, enabling high density. For example, in this embodiment, the length of the pressure chamber 11 in the shorter direction (X direction) is 110 μm, and the pressure chambers 5 and discharge ports 3 are arranged at intervals of 150 dpi. Furthermore, the multiple discharge port rows are arranged with a staggered arrangement relative to the Y direction. This arrangement achieves a high-density discharge port density of 600 dpi on the recording medium. While this embodiment achieves 600 dpi by arranging four discharge port rows, a configuration achieving 1200 dpi by arranging eight discharge port rows is also possible.

[0025] As mentioned above, the piezoelectric element 18 pressurizes the liquid in the pressure chamber 11 by deforming when a voltage is applied, causing the liquid to be discharged as droplets from the discharge port 3. At this time, pressure fluctuations occur in the pressure chamber 11. The increased density of the discharge port 3 brings not only the pressure chambers 11 closer together, but also the common supply channel 13a and the common recovery channel 13b closer together. As a result, so-called crosstalk occurs, where the pressure fluctuations generated when droplets are discharged from the discharge port are transmitted to other pressure chambers via the pressure chamber 11, the common supply channel 13a, and the common recovery channel 13b. The pressure generated in the pressure chamber 11 during discharge is transmitted from the pressure chamber 11 through the individual supply channels 12a and individual recovery channels 12b to the common supply channel 13a and the common recovery channel 13b. Then, the pressure propagates to other pressure chambers via the common supply channel 13a and the common recovery channel 13b.

[0026] The damper substrate 302 forms part of the common supply channel 13a and the common recovery channel 13b, and a channel partition wall 16 is provided between the common supply channel 13a and the common recovery channel 13b. In this embodiment, by making the thickness of the channel partition wall 16 thin, the distance between the common supply channel 13a and the common recovery channel 13b is shortened without narrowing the width of the common supply channel 13a and the common recovery channel 13b in the Y direction. In addition, by arranging the damper region 301 to extend along the longitudinal direction of the liquid discharge substrate 2 in the X direction, the damper region 301 is increased without increasing the size of the liquid discharge substrate 2.

[0027] The damper region 301 is located opposite the individual supply channel 12a and the individual recovery channel 12b. The damper region 301 is configured to receive the pressure propagated through the individual supply channel 12a and the individual recovery channel 12b with a damper member 300, and to absorb pressure fluctuations by deforming the damper member 300. The channel forming substrate 204 has damper regions 301 that allow deformation of the damper member 300 and supply connection channels 15a or recovery connection channels 15b formed alternately.

[0028] Figure 5 is a cross-sectional view of IVb-IVb in Figure 4(a), but it shows a cross-section viewed from the opposite direction to that of Figure 4(b). Figure 6 is a cross-sectional view of a liquid discharge substrate as a comparative example.

[0029] In this embodiment, the liquid discharge substrate 2 is formed by laminating a liquid supply substrate 203 and a damper substrate 302 equipped with a damper member 300 using an adhesive layer 19, thereby creating a common supply channel 13a and a common recovery channel 13b. The adhesive layer 19 is provided with an adhesive region and a non-adhesive region without adhesive. When the liquid supply substrate 203 and the damper substrate 302 are attached, the area between the channel partition wall 16 between the common supply channel 13a and the common recovery channel 13b and the liquid supply substrate 203 is a non-adhesive region, and no adhesive layer 19 is provided there. The area between the channel partition wall 16 and the liquid supply substrate 203 is also not provided with an adhesive layer 19, and a minute communication portion 20 is provided there. The portion of the damper substrate 302 where the common supply channel 13a, the common recovery channel 13b, and the channel partition wall 16 are not provided is an adhesive region, and an adhesive layer 19 is provided there.

[0030] In the case of typical substrate attachment using an adhesive layer, the configuration includes an adhesive layer 19 on the channel partition wall 16, as shown in Figure 6. However, when the thickness of the channel partition wall is reduced as in this embodiment, it may not be possible to provide a sufficient area for the adhesive layer on the channel partition wall, and there is a risk that the adhesive layer may spill out into the common supply channel or common recovery channel. If the adhesive layer spills out into the common supply channel or common recovery channel, there is a concern that the common supply channel or common recovery channel may become blocked, or that the pressure loss may increase due to the reduction in the channel area.

[0031] As in this embodiment, by not providing an adhesive layer 19 in the channel partition wall 16 between the common supply channel 13a and the common recovery channel 13b, the areas of the common supply channel 13a and the common recovery channel 13b can be sufficiently secured, and pressure loss can be reduced. In addition, the provision of a minute connecting section 20 creates flow in the stagnant area at the top of the common supply channel 13a and the common recovery channel 13b (the part downward in the direction of gravity during use), thereby reducing stagnation. As a result, foam and other substances can flow more easily through the circulation flow in the common supply channel 13a and the common recovery channel 13b.

[0032] On the other hand, if the dimensions of the micro-communication section 20 are large, the flow of circulating fluid that flows in the order of individual supply channel 12a, pressure chamber 11, and individual recovery channel 12b will decrease. Therefore, it is preferable that the dimensions of the micro-communication section 20 be small, and that the flow resistance of the micro-communication section 20 be large.

[0033] Figure 7 is a graph in which the horizontal axis represents the height of the micro-communication section 20, and the vertical axis represents the ratio of the viscous resistance of the micro-communication section 20 to the viscous resistance of the discharge channel (corresponding to the channel from the individual supply channel 12a through the pressure chamber 11 to the individual recovery channel 12b). The viscous resistance of the channel in the micro-communication section 20 is preferably 100 times or more, more preferably 1000 times or more, than the viscous resistance of the discharge channel, and the height of the micro-communication section 20 is preferably 7 μm or less, more preferably 3 μm or less.

[0034] Thus, the channel partition wall 16 between the common supply channel 13a and the common recovery channel 13b is configured to have a micro-communication section 20 without providing an adhesive layer 19 between it and the liquid supply substrate 203. This makes it possible to provide a liquid discharge head and liquid discharge device that can suppress the degradation of image performance without increasing the chip size.

[0035] (Second embodiment) A second embodiment of the present invention will be described below with reference to the drawings. Since the basic configuration of this embodiment is the same as that of the first embodiment, only the characteristic configurations will be described below.

[0036] Figure 8(a) is a partial cross-sectional view of the liquid discharge substrate 2 in this embodiment, and Figure 8(b) is a cross-sectional view of the liquid discharge substrate 2. In this embodiment, the liquid discharge substrate 2 has individual supply channels 12a, individual recovery channels 12b, a common supply channel 13a, and a common recovery channel 13b arranged on the liquid supply substrate 203. This configuration eliminates the need for the damper substrate 302 in the first embodiment, resulting in cost reduction by reducing the number of substrates.

[0037] In this embodiment, a damper member 300 is provided between the liquid supply substrate 203 and the flow path forming substrate 204, and an adhesive layer 19 is provided between the damper member 300 and the liquid supply substrate 203. In addition, a flow path partition wall 16 is provided on the liquid supply substrate 203, and no adhesive layer 19 is provided between the flow path partition wall 16 and the damper member 300, but a minute communication portion 20 is provided.

[0038] In this way, by not providing an adhesive layer 19 in the channel partition wall 16 between the common supply channel 13a and the common recovery channel 13b, the areas of the common supply channel 13a and the common recovery channel 13b can be sufficiently secured, and pressure loss can be reduced. In addition, the provision of the minute connecting section 20 generates a circulating flow in the damper region 301, which reduces stagnation, and makes it easier for foam and other substances to flow through the circulating flow in the common supply channel 13a and the common recovery channel 13b.

[0039] (Third embodiment) A third embodiment of the present invention will be described below with reference to the drawings. Since the basic configuration of this embodiment is the same as that of the first embodiment, only the characteristic configurations will be described below.

[0040] Figure 9(a) is a partial cross-sectional view of the liquid discharge substrate 2 in this embodiment, and Figure 9(b) is a cross-sectional view of the liquid discharge substrate 2. In this embodiment, the liquid discharge substrate 2 has a damper region 301 positioned opposite the individual recovery channel 12b, but no damper region 301 is provided opposite the individual supply channel 12a. In the case of a configuration in which the liquid circulates within the pressure chamber 11, the pressure in the individual recovery channel 12b is made lower than the pressure in the individual supply channel 12a in order to generate a circulating flow. Therefore, pressure fluctuations generated in the pressure chamber 11 due to discharge are transmitted more significantly to the individual recovery channel 12b. Thus, even if a damper region 301 is not provided opposite the supply channel 12a, the effect can be obtained by providing a damper region 301 opposite the individual recovery channel 12b.

[0041] Furthermore, since there is no damper region 301 at the position opposite the individual supply channel 12a, the damper region 301 at the position opposite the individual recovery channel 12b can be expanded.

[0042] Generally, damper performance depends on the thickness, area, and Young's modulus of the damper member 300. While a thinner damper member 300 and a lower Young's modulus result in greater crosstalk suppression, concerns arise regarding the mechanical strength of the damper member 300. Therefore, increasing the area of ​​the damper member 300 is also effective from the standpoint of ensuring mechanical strength reliability.

[0043] Figure 10 is a partial cross-sectional view showing a modified example of the liquid discharge substrate 2 in this embodiment, and Figure 10(b) is a cross-sectional view of the liquid discharge substrate 2. As shown in Figure 10, the configuration of this embodiment may also be applied to a configuration in which the liquid supply substrate 203 and the damper substrate 302 are formed integrally, as in the second embodiment.

[0044] In this embodiment, the damper region 301 is positioned opposite the individual recovery channel 12b, and no damper region 301 is provided opposite the individual supply channel 12a. However, the embodiment is not limited to this configuration. In other words, the damper region 301 may be provided either opposite the individual recovery channel 12b or opposite the individual supply channel 12a. [Explanation of Symbols]

[0045] 1. Liquid dispensing head 2 Liquid discharge board 11 Pressure chamber 19 Adhesive layer 20 Micro communication part 101 Liquid discharge device 300 Damper component 301 Damper area 302 Damper board

Claims

1. A nozzle for dispensing liquid, A pressure chamber communicating with the aforementioned discharge port, A pressure generating element provided in the pressure chamber, capable of discharging liquid from the discharge port by the action of pressure, A separate supply channel that communicates with the pressure chamber and is capable of supplying liquid to the pressure chamber, A separate recovery channel that communicates with the pressure chamber and is capable of recovering liquid from the pressure chamber, A common supply channel that communicates with the individual supply channels, A common recovery channel that communicates with the individual recovery channels, A flow channel partition wall is provided between the common supply channel and the common recovery channel, Equipped with, Multiple discharge ports and pressure chambers are provided, and the common supply channel and the common recovery channel are in communication with the multiple individual supply channels and the multiple individual recovery channels, respectively. In the region between the first substrate on which the channel partition is formed and the second substrate laminated on the first substrate, a communication section is provided that connects the common supply channel and the common recovery channel. A liquid discharge head characterized in that the viscous resistance in the communication section is 100 times or more than the viscous resistance in the flow path from the individual supply flow path through the pressure chamber to the individual recovery flow path.

2. A nozzle for dispensing liquid, A pressure chamber communicating with the aforementioned discharge port, A pressure generating element provided in the pressure chamber, capable of discharging liquid from the discharge port by the action of pressure, A separate supply channel that communicates with the pressure chamber and is capable of supplying liquid to the pressure chamber, A separate recovery channel that communicates with the pressure chamber and is capable of recovering liquid from the pressure chamber, A common supply channel that communicates with the individual supply channels, A common recovery channel that communicates with the individual recovery channels, A flow channel partition wall is provided between the common supply channel and the common recovery channel, Equipped with, Multiple discharge ports and pressure chambers are provided, and the common supply channel and the common recovery channel are in communication with the multiple individual supply channels and the multiple individual recovery channels, respectively. In the region between the first substrate on which the channel partition is formed and the second substrate laminated on the first substrate, a communication section is provided that connects the common supply channel and the common recovery channel. A liquid discharge head characterized in that the individual supply channels, the individual recovery channels, the common supply channel, and the common recovery channel are formed on the first substrate.

3. The liquid discharge head according to claim 1 or 2, characterized in that a circulating flow flows in the order of the common supply channel, the individual supply channel, the pressure chamber, the individual recovery channel, and the common recovery channel.

4. The first substrate and the second substrate are further provided with an adhesive layer, The adhesive layer comprises an adhesive region where adhesive material is provided and a non-adhesive region where adhesive material is not provided. The liquid dispensing head according to any one of claims 1 to 3, characterized in that the flow channel partition is provided at a position corresponding to the non-adhesive region in the adhesive layer.

5. The liquid discharge head according to any one of claims 1 to 4, characterized in that the viscous resistance in the communication section is 1,000 times or more than the viscous resistance in the flow path from the individual supply flow path through the pressure chamber to the individual recovery flow path.

6. The liquid dispensing head according to any one of claims 1 to 5, characterized in that the height of the communication portion is 7 μm or less.

7. The liquid dispensing head according to any one of claims 1 to 5, characterized in that the height of the communication portion is 3 μm or less.

8. The liquid discharge head according to any one of claims 1 to 7, characterized in that the pressure generating element is a piezoelectric element.

9. The liquid discharge head according to any one of claims 1 to 8, characterized in that at least one of the common supply channel and the common recovery channel is provided with a damper member capable of absorbing pressure fluctuations generated in the pressure chamber.

10. The liquid discharge head according to any one of claims 1 to 8, characterized in that the common recovery channel is provided with a damper member capable of absorbing pressure fluctuations generated in the pressure chamber.

11. Multiple discharge ports are arranged in a row. The liquid discharge head according to claim 9 or 10, characterized in that the damper member is provided extending along the row formed by the discharge ports.

12. A liquid dispensing device configured to be able to mount the liquid dispensing head described in any one of claims 1 to 11.

Images