Resist coating device

Abstract

To provide a resist application device which can prevent a filamentous resist from re-adhering to a substrate surface.SOLUTION: A resist application device comprises: a holding part 11 which rotatably holds a substrate 10; a rotation drive mechanism 12 which rotates the substrate; a nozzle 14 which is arranged on the upper side of the substrate held by the holding part and supplies the resist solution to the surface of the substrate; a first ring 15 which covers the outer side of the outer periphery of the substrate held by the holding part; and a second ring 16 which is arranged on the upper side with respect to the surface of the substrate held by the holding part, has the inner diameter larger than the outer periphery of the substrate and has the outer diameter smaller than the inner diameter of the first ring.SELECTED DRAWING: Figure 1

Description

TECHNICAL FIELD

[0001] The present invention relates to a resist coating apparatus. BACKGROUND ART

[0002] A conventional resist coating apparatus supplies a resist liquid to a central position or the like on a wafer that is a substrate and rotates the wafer, thereby spreading the resist liquid over the entire surface of the wafer to form a coating film. At that time, the spread resist liquid is caused to fly outward from the outer peripheral end of the wafer by centrifugal force, and the unnecessary resist liquid that has flown off is received by a cup body. The cup body was disposed on the outer periphery of the wafer (for example, see Patent Document 1).

[0003] Incidentally, when the wafer rotation speed at the time of supplying the resist liquid exceeds 3000 rpm, the xylene component of the flown-off resist volatilizes, so that the resist floats on the wafer like a spider's thread, and the thread-like resist may reattach to the wafer surface. PRIOR ART DOCUMENTS PATENT DOCUMENTS

[0004] PATENT DOCUMENT 1 Japanese Patent No. 6841188 SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION

[0005] Various aspects of the present invention aim to provide a resist coating apparatus capable of preventing thread-like resist from reattaching to the substrate surface. MEANS FOR SOLVING THE PROBLEMS

[0006] Various aspects of the present invention will be described below.

[0007] [1] A holding unit that rotatably holds a substrate, A rotational drive mechanism for rotating the substrate, A nozzle is positioned above the substrate held in the holding portion and supplies resist liquid to the surface of the substrate, A first ring covering the outer periphery of the substrate held in the holding portion, A second ring is positioned above the surface of the substrate held by the holding portion, has an inner diameter larger than the outer circumference of the substrate, and an outer diameter smaller than the inner diameter of the first ring, A resist coating apparatus characterized by having the following features.

[0008] [2] In the above [1], The resist coating apparatus is characterized in that the first ring is a cylindrical and mesh-like ring whose upper end is located above the surface of the substrate and whose lower end is located below the back surface of the substrate.

[0009] [3] In the above [1] or [2], The resist coating apparatus is characterized in that the shape of the second ring is cylindrical and mesh-like.

[0010] [4] In any one of the above items [1] to [3], A resist coating apparatus characterized by having a mesh-like and skirt-shaped resist adhesion prevention member that covers the back surface of the substrate held in the holding portion.

[0011] [5] In the above [1], The first ring is a cylindrical ring whose upper end is located above the surface of the substrate and whose lower end is located below the back surface of the substrate. The resist coating apparatus is characterized in that the shape of the aforementioned second ring is a cylindrical ring.

[0012] [6] In the above [5], The cylindrical ring of the first ring has a plurality of openings, The resist coating apparatus is characterized in that the cylindrical ring of the second ring has a plurality of openings.

[0013] [7] The resist coating apparatus according to the above [2], wherein the first ring has a plurality of mesh-shaped openings, and the inner diameter of the plurality of openings is 3 mm or more and 20 mm or less.

[0014] [8] The resist coating apparatus according to the above [3], wherein the second ring has a plurality of mesh-shaped openings, and the inner diameter of the plurality of openings is 1 mm or more and 10 mm or less.

[0015] [9] The resist coating apparatus according to the above [4], wherein the resist adhesion preventing member has a plurality of mesh-shaped openings, and the inner diameter of the plurality of openings is 1 mm or more and 10 mm or less.

[0016]

[10] The resist coating apparatus according to any one of the above [1] to [3], comprising a skirt-shaped resist adhesion preventing member that covers the back surface of the substrate 10 held by the holding unit 11, wherein the resist adhesion preventing member has a plurality of openings.

[0017]

[11] The resist coating apparatus according to any one of the above [4], [9] and

[10] , wherein the resist adhesion preventing member is a SUS wire mesh coated with Teflon (registered trademark).

[0018]

[12] The resist coating apparatus according to any one of the above [1] to

[11] , wherein the first ring is made of SUS coated with Teflon (registered trademark), and the second ring is made of SUS coated with Teflon (registered trademark).

[0019]

[13] The resist coating apparatus according to any one of the above [1] to

[12] , wherein the resist liquid contains xylene.

[14] The device according to any one of the above [1] to

[13] , wherein the first ring is made of Al subjected to an alumite treatment, and the second ring is made of Al subjected to an alumite treatment, the resist coating apparatus being characterized by that.

[15] A resist coating apparatus comprising: a holding unit configured to rotatably hold a substrate; a rotation drive mechanism configured to rotate the substrate; a nozzle disposed above the substrate held by the holding unit and configured to supply a resist liquid to a surface of the substrate; and either one of a first ring and a second ring, , wherein the first ring is located outside an outer periphery of the substrate held by the holding unit, and the second ring has an inner diameter larger than the outer periphery of the substrate and an outer diameter smaller than the inner diameter of the first ring, the resist coating apparatus being characterized by that.

[16] The resist coating apparatus according to the above

[15] , wherein the first ring covers the outside of the outer periphery of the substrate held by the holding unit, and the second ring is disposed above the surface of the substrate held by the holding unit, the resist coating apparatus being characterized by that.

[17] The resist coating apparatus according to the above

[15] , wherein the first ring is disposed above the surface of the substrate held by the holding unit, and the second ring covers the outside of the outer periphery of the substrate held by the holding unit, the resist coating apparatus being characterized by that.

[18] The resist coating apparatus according to any one of the above

[15] to

[17] , wherein in a plan view, one or more third rings are provided between the first ring and the second ring, the resist coating apparatus being characterized by that. [Advantageous Effects of Invention]

[0020] According to the resist coating apparatus of the present invention [1] above, a first ring is arranged to cover the outside of the outer circumference of the substrate, and a second ring is arranged above the surface of the substrate and has an inner diameter larger than the outer circumference of the substrate. With this double inner ring system, even if the rotation speed of the substrate increases and the components of the resist that are blown off volatilize, causing spiderweb-like floating resist to form, this floating resist is captured between the inner surfaces of the second ring and between the first ring and the second ring. As a result, it is possible to prevent the floating resist from reattaching to the surface of the substrate.

[0021] According to the resist coating apparatus of the present invention [2] above, the first ring is a cylindrical and mesh-like ring whose upper end is located above the surface of the substrate and whose lower end is located below the back surface of the substrate. As a result, the resist liquid supplied to the rotating substrate is ejected to the outside of the substrate by the centrifugal force caused by the rotation of the substrate, and the ejected resist liquid is caught by the cylindrical first ring, preventing the resist liquid from re-adhering to the substrate and preventing thread-like resist from re-adhering to the substrate surface.

[0022] According to the resist coating apparatus of the present invention [3] above, the shape of the second ring is cylindrical and mesh-like. As a result, even if the rotation speed of the substrate increases and spiderweb-like floating resist is generated as described above, this floating resist is more easily captured between the inner surfaces of the second ring and between the first ring and the second ring. As a result, it is possible to prevent the floating resist from reattaching to the surface of the substrate.

[0023] The resist coating apparatus of the present invention [4] has a mesh-like and skirt-shaped resist adhesion prevention member that covers the back surface of the substrate held in the holding part. This prevents the resist flying off from the first ring from re-adhering to the back surface of the substrate.

[0024] Furthermore, according to various aspects of the present invention, a resist coating apparatus can be provided that can prevent filamentous resist from re-adhering to the substrate surface. [Brief explanation of the drawing]

[0025] [Figure 1] This is a perspective view showing the internal structure of a resist coating apparatus according to one aspect of the present invention. [Modes for carrying out the invention]

[0026] Embodiments of the present invention will be described in detail below with reference to the drawings. However, it will be readily apparent to those skilled in the art that the present invention is not limited to the following description, and that its form and details can be modified in various ways without departing from the spirit and scope of the present invention. Accordingly, the present invention shall not be interpreted as being limited to the descriptions of the embodiments shown below.

[0027] Figure 1 is a perspective view showing the internal structure of a resist coating apparatus according to one aspect of the present invention.

[0028] The resist coating apparatus 100 shown in Figure 1 includes a holding unit 11 that rotatably holds a substrate 10, a rotation drive mechanism 12 that rotates the substrate 10, a nozzle 14 that supplies resist liquid to the surface of the substrate 10, a first ring 15 that covers the outside of the outer circumference of the substrate 10 held by the holding unit 11, and a second ring 16 having an outer diameter smaller than the inner diameter of the first ring 15. The nozzle 14 described above is positioned above the substrate 10 held by the holding part 11. The second ring 16 is positioned above the surface of the substrate 10 held by the holding part 11. The second ring 16 has an inner diameter larger than the outer circumference of the substrate 10. Although Figure 1 shows circular rings for the first ring 15 and the second ring 16, they are not limited to circular shapes and may have other shapes to match the shape of the substrate 10. For example, if the substrate is rectangular, a rectangular ring may be used.

[0029] The details are explained below. This resist coating apparatus 100 has a holding unit 11 that rotatably holds the substrate 10. The substrate 10 is, for example, a semiconductor wafer. The substrate 10 is held horizontally by the holding unit 11.

[0030] Furthermore, the resist coating apparatus has a rotational drive mechanism 12 for rotating the substrate (wafer) 10. This rotational drive mechanism 12 may be composed of a drive unit such as a motor that rotates a rotating shaft 13 connected to the holding unit 11.

[0031] The wafer 10 is held in the holding unit 11. A nozzle 14 is positioned above the wafer 10, and the nozzle 14 supplies resist liquid to the surface of the wafer 10 as indicated by the arrow. The nozzle 14 is also connected to a resist supply mechanism (not shown), which supplies resist to the nozzle 14, and the resist is then supplied from the nozzle 14 to the surface of the wafer 10.

[0032] Furthermore, the resist coating apparatus 100 has a first ring (outer inner ring) 15. Resist liquid is supplied from the nozzle 14 to the rotating substrate (wafer) 10 as indicated by the arrow, and the supplied resist liquid is spread and coated over the entire surface of the wafer 10 by the centrifugal force caused by the rotation of the wafer 10. At that time, excess resist liquid is blown to the outside of the wafer 10 as indicated by the centrifugal force, and this blown-off resist liquid is caught by the outer inner ring 15, preventing the resist liquid from re-adhering to the wafer 10. Such an outer inner ring 15 covers the outside of the outer circumference of the wafer 10 held in the holding part 11. Note that the outer inner ring 15 has a cylindrical and mesh-like structure, but it does not have to be cylindrical and mesh-like as long as it is ring-shaped, and may simply be ring-shaped. In other words, the outer inner ring 15 also includes those that have a simple ring shape.

[0033] Furthermore, the resist coating apparatus has a second ring (inner ring) 16. The inner ring 16 is positioned slightly above the surface of the substrate (wafer) 10 held by the holding part 11. The inner ring 16 has an inner diameter larger than the outer circumference of the wafer 10. The inner ring 16 has an outer diameter smaller than the inner diameter of the first ring (outer ring) 15. The inner ring 16 has a cylindrical and mesh-like structure, but it does not have to be cylindrical and mesh-like as long as it is ring-shaped; it may simply be a ring shape. In other words, the inner ring 16 may also have a simple ring shape. The resist coating apparatus 100 also includes a cup body 20 that surrounds the outside of the wafer 10 held in the holding section 11, the inner ring 16, and the outer inner ring 15. The cup body 20 has the function of receiving the resist liquid supplied to the rotating wafer 10 from the nozzle 14, and the waste liquid that is scattered outwards or spilled due to the centrifugal force caused by the rotation of the wafer 10, and discharging the waste liquid outside the resist coating apparatus.

[0034] According to this embodiment, an outer inner ring 15 is placed over the outer edge of the wafer 10, and an inner inner ring 16 is placed slightly above the surface of the wafer 10 and has an inner diameter slightly larger than the outer edge of the wafer 10. With this double inner ring system, even if the rotation speed of the wafer 10 exceeds 3000 rpm and the xylene component of the ejected resist volatilizes, generating spiderweb-like floating resist, this floating resist is captured between the inner surfaces of the inner inner ring 16 and between the outer inner ring 15 and the inner inner ring 16. As a result, it is possible to prevent the floating resist from reattaching to the surface of the wafer 10.

[0035] Furthermore, by preventing re-adhesion as described above, the amount of resist used can be significantly reduced compared to conventional resist coating equipment. The reason for this is as follows: Conventional resist coating equipment did not have an effective means to prevent the spiderweb-like floating resist described above from re-adhering to the wafer surface. Even with such conventional resist coating equipment, it is necessary to suppress the re-adhesion of spiderweb-like floating matter to the wafer, so the following measures (1) and (2) can be considered.

[0036] (1) By sealing the space in which the substrate (wafer) rotates and preventing the generation of airflow, the volatilization of xylene is suppressed. (2) The amount of resist supplied from the nozzle in a conventional resist coating apparatus is increased to about 1.5 to 2.0 times the amount of resist supplied from nozzle 14 in the resist coating apparatus shown in Figure 1, thereby increasing the amount of resist ejected to the outside of the wafer. By increasing the amount of resist supplied in this way, the xylene concentration in the space where the wafer rotates increases, suppressing volatilization.

[0037] However, the countermeasures used in the conventional resist coating equipment described above required increasing the supply of resist.

[0038] In contrast, the resist coating apparatus 100 shown in Figure 1 is equipped with an effective means to prevent the spiderweb-like floating resist described above from reattaching to the surface of the wafer 10, thereby making it possible to significantly reduce the amount of resist supplied.

[0039] Furthermore, in the resist coating apparatus 100 shown in Figure 1, the first ring 15 is preferably a cylindrical and mesh-like ring whose upper end is located above the surface of the substrate 10 and whose lower end is located below the back surface of the substrate 10.

[0040] In detail, the resist coating apparatus 100 of this embodiment has a cylindrical and mesh-like first ring (outer inner ring) 15, as described above. The resist liquid supplied to the rotating wafer 10 is ejected to the outside of the wafer 10 by the centrifugal force caused by the rotation of the wafer 10, as shown by the arrow. The ejected resist liquid is then caught by the cylindrical outer inner ring 15, preventing the resist liquid from re-adhering to the wafer 10. The outer inner ring (first ring) 15 is preferably a cylindrical and mesh-like ring that covers the outside of the outer circumference of the wafer 10 held by the holding part 11, and has its upper end positioned above the surface of the wafer 10 and its lower end positioned below the back surface of the wafer 10.

[0041] Furthermore, in the resist coating apparatus 100 shown in Figure 1, the shape of the second ring 16 is preferably cylindrical and mesh-like.

[0042] In detail, the shape of the second ring (inner ring) 16 is cylindrical and mesh-like, so even if the rotation speed of the wafer 10 exceeds 3000 rpm and the xylene component of the ejected resist volatilizes, generating spiderweb-like floating resist, this floating resist is easily captured between the inner surfaces of the inner ring 16 and between the outer inner ring 15 and the inner inner ring 16. As a result, it is possible to prevent the floating resist from reattaching to the surface of the wafer 10.

[0043] Furthermore, the resist coating apparatus 100 shown in Figure 1 may have a mesh-like and skirt-shaped resist adhesion prevention member 17 that covers the back surface of the substrate 10 held by the holding part 11.

[0044] In detail, the resist coating apparatus has a mesh-like and skirt-shaped resist adhesion prevention member that covers the back surface of the substrate (wafer) 10 held in the holding section 11. This prevents the resist liquid flying from the first ring (outer inner ring) 15 from re-adhering to the back surface of the wafer 10, as shown by the arrow in Figure 1. Therefore, it is possible to prevent the resist from re-adhering to both sides of the wafer 10.

[0045] Furthermore, in the resist coating apparatus 100 shown in Figure 1, the first ring 15 is a cylindrical ring whose upper end is located above the surface of the substrate 10 and whose lower end is located below the back surface of the substrate 10, and the shape of the second ring 16 may also be a cylindrical ring.

[0046] In detail, the resist coating apparatus 100 of this embodiment may have a first ring (outer inner ring) 15 that is cylindrical, and does not have to be the mesh-like structure shown in Figure 1 (not shown). The resist liquid supplied to the rotating substrate (wafer) 10 is ejected to the outside of the wafer 10 by the centrifugal force caused by the rotation of the wafer 10, as shown by the arrow. The ejected resist liquid is then caught by the cylindrical outer inner ring 15, preventing the resist liquid from re-adhering to the wafer 10. Such an outer inner ring (first ring) 15 may be a cylindrical ring that covers the outside of the outer circumference of the wafer 10 held by the holding part 11, and has its upper end above the surface of the substrate (wafer) 10 and its lower end below the back surface of the wafer 10.

[0047] Furthermore, the shape of the second ring (inner ring) 16 may be a cylindrical ring, or a wall-like ring without holes (not shown). This makes it easier for this floating resist to be captured between the inner surfaces of the inner ring 16 and between the outer inner ring 15 and the inner inner ring 16, even if the wafer 10 rotation speed exceeds 3000 rpm and the xylene component of the ejected resist volatilizes.

[0048] Furthermore, the cylindrical ring of the first ring 15 may have multiple openings, and the cylindrical ring of the second ring 16 may also have multiple openings.

[0049] I will explain in detail. The cylindrical ring of the first ring (outer inner ring) 15 may have multiple openings. These multiple openings may be formed, for example, by punching out a metal plate (not shown), and the inner diameter of these multiple openings is preferably 3 mm or more and 20 mm or less.

[0050] Furthermore, the cylindrical ring of the second ring (inner ring) 16 may have multiple openings. These multiple openings may be formed, for example, by punching out a metal plate (not shown), and the inner diameter of these multiple openings is preferably between 1 mm and 10 mm. In this context, "inner diameter" refers to the inner diameter of the longest part of the opening.

[0051] According to the resist coating apparatus equipped with the first ring 15 and the second ring 16 described above, the efficiency of trapping the resist liquid ejected outward by the centrifugal force caused by the rotation of the wafer 10 by the multiple openings of the outer inner ring 15 can be improved, and as a result, re-adhesion of the resist liquid to the wafer 10 can be prevented more effectively. Furthermore, since both the outer inner ring 15 and the inner inner ring 16 have multiple openings, even if spiderweb-like floating resist is generated due to the volatilization of the xylene component of the resist, the efficiency of trapping this floating resist between the inner surfaces of the inner inner ring 16 and between the outer inner ring 15 and the inner inner ring 16 can be improved, and as a result, re-adhesion of the floating resist to the surface of the wafer 10 can be prevented more effectively.

[0052] Furthermore, the first ring 15 of the resist coating apparatus according to this embodiment has a mesh-like structure with multiple openings, and the inner diameter of the multiple openings is preferably 3 mm or more and 20 mm or less.

[0053] I will explain in detail. As shown in Figure 1, the first ring (outer inner ring) 15 has a mesh-like structure with multiple openings. The inner diameter of these multiple openings is preferably 3 mm to 20 mm. The mesh-like structure of the multiple openings may be, for example, a grid of SUS (Stainless Used Steel) wires with a diameter of 0.8 mm and a pitch of 6.35 mm. Note that the inner diameter refers to the inner diameter of the longest part of the opening, so in the case of a grid-like opening, the inner diameter refers to the length of the diagonal. Having such an inner diameter improves the efficiency of trapping the resist liquid that is ejected to the outside by the centrifugal force caused by the rotation of the wafer 10 by the mesh-like outer inner ring 15, and as a result, the re-adhesion of the resist liquid to the wafer 10 can be prevented more effectively.

[0054] Furthermore, the second ring 16 of the resist coating apparatus according to this embodiment has a mesh-like structure with multiple openings, and the inner diameter of the multiple openings is preferably 1 mm or more and 10 mm or less.

[0055] I will explain in detail. As shown in Figure 1, the second ring (inner ring) 16 has multiple openings in a mesh-like structure. The inner diameter of these multiple openings is preferably 1 mm or more and 10 mm or less. The multiple openings in a mesh-like structure may, for example, have a grid shape with SUS wires with a wire diameter of 0.43 mm and a pitch of 2.54 mm. Note that the inner diameter refers to the inner diameter of the longest part of the opening, so in the case of a grid shape, the inner diameter refers to the length of the diagonal. By having such an inner diameter, even if spiderweb-like floating resist is generated due to the volatilization of the xylene component of the resist, the efficiency of trapping this floating resist between the inner sides of the inner ring 16 and between the outer inner ring 15 and the inner inner ring 16 can be improved, and as a result, the re-adhesion of the floating resist to the surface of the wafer 10 can be more effectively prevented.

[0056] Furthermore, the resist adhesion prevention member 17 of the resist coating apparatus according to this embodiment has a mesh-like structure with multiple openings, and the inner diameter of the multiple openings is preferably 1 mm or more and 10 mm or less.

[0057] I will explain in detail. As shown in Figure 1, the resist adhesion prevention member 17 has a plurality of mesh-like openings. The inner diameter of these multiple openings is preferably 1 mm or more and 10 mm or less. The plurality of mesh-like openings may, for example, have a grid shape with SUS wires with a wire diameter of 0.43 mm and a pitch of 2.54 mm. The inner diameter refers to the inner diameter of the longest part of the opening. This makes it possible to more effectively prevent resist flying from the first ring (outer inner ring) 15 from re-adhering to the back surface of the wafer 10.

[0058] Furthermore, in this embodiment, the resist adhesion prevention member 17 has multiple openings in a mesh-like structure, but it does not have to be mesh-like as long as it has multiple openings.

[0059] I will explain in detail. The resist coating apparatus 100 has a skirt-shaped resist adhesion prevention member 17 that covers the back surface of the substrate (wafer) 10 held in the holding section 11, and the resist adhesion prevention member 17 has a plurality of openings. These plurality of openings may be formed, for example, by punching out a metal plate (not shown), and the inner diameter of these plurality of openings is preferably 1 mm or more and 10 mm or less.

[0060] The resist adhesion prevention member 17 described above may be made of SUS wire mesh coated with Teflon®.

[0061] In detail, the material of the resist adhesion prevention member 17 is a SUS wire mesh coated with Teflon®, which makes it possible to clean the resist that adheres to the resist adhesion prevention member 17, allowing the resist adhesion prevention member 17 to be reused. Furthermore, by using such a material, it is possible to effectively prevent the resist from re-adhering to the back surface of the wafer 10.

[0062] The first ring (outer inner ring) 15 described above may be made of SUS coated with Teflon®. This prevents the resist liquid from re-adhering to the wafer 10. The second ring (inner ring) 16 may also be made of SUS coated with Teflon®. This prevents the aforementioned floating resist from re-adhering to the surface of the wafer 10. In this embodiment, the first ring 15 and the second ring 16 are made of SUS coated with Teflon®, but the invention is not limited to this, and the first ring and the second ring may be made of Al that has been anodized.

[0063] The resist solution mentioned above may also contain xylene.

[0064] In this embodiment, the resist solution supplied to the surface of the wafer 10 from the nozzle 14 contains xylene. This resist coating apparatus prevents the resist from reattaching to the wafer 10 by causing the xylene component of the resist solution to volatilize, causing the resist to float on the wafer 10 like a spider's web. However, the above resist coating apparatus is effective even if similar floating resist occurs due to the presence of components other than xylene in the resist solution.

[0065] In this embodiment, the resist coating apparatus described above has been explained, but it is also possible to implement it with the following modifications. The resist coating apparatus of the modified example 1 includes a holding unit 11 that rotatably holds the substrate 10, a rotation drive mechanism 12 that rotates the substrate 10, a nozzle 14 positioned above the substrate 10 held by the holding unit 11 and supplying resist liquid to the surface of the substrate 10, and either a first ring 15 or a second ring 16. The first ring 15 described above is located outside the outer circumference of the substrate 10 held by the holding portion 11. The second ring 16 described above has an inner diameter larger than the outer circumference of the substrate 10 and an outer diameter smaller than the inner diameter of the first ring 15. According to the above modified example 1, a first ring 15 is arranged to cover the outside of the outer circumference of the substrate 10, and a second ring 16 has an inner diameter slightly larger than the outer circumference of the substrate 10. With this double inner ring system, even if the rotation speed of the substrate 10 exceeds 3000 rpm and the xylene component of the blown resist volatilizes, generating spiderweb-like floating resist, this floating resist is captured between the inner surfaces of the second ring 16 and between the first ring 15 and the second ring 16. As a result, it is possible to prevent the floating resist from reattaching to the surface of the substrate 10. Furthermore, the first ring 15 may cover the outer circumference of the substrate 10 held by the holding part 11. Also, the second ring 16 may be positioned above the surface of the substrate 10 held by the holding part 11. Furthermore, the first ring 15 may be positioned above the surface of the substrate 10 held by the holding portion 11. The second ring 16 may cover the outer periphery of the substrate 10 held by the holding portion 11. Furthermore, in a plan view, there may be one or more third rings (not shown) between the first ring 15 and the second ring 16. This makes it possible to finer the spaces for capturing the filamentous resist and increase the number of spaces, thereby preventing the floating resist from reattaching to the surface of the substrate 10. [Explanation of Symbols]

[0066] 10 Substrates (wafers) 11 Holding part 12 Rotary drive mechanism 14 nozzles 15. First Ring 16. Second Ring 17. Resist adhesion prevention member

Claims

1. A holding part that holds the substrate so that it can rotate, A rotational drive mechanism for rotating the substrate, A nozzle is positioned above the substrate held in the holding portion and supplies resist liquid to the surface of the substrate, A first ring covering the outer periphery of the substrate held in the holding part, A second ring is positioned above the surface of the substrate held by the holding portion, has an inner diameter larger than the outer circumference of the substrate, and an outer diameter smaller than the inner diameter of the first ring, It has, A resist coating apparatus characterized in that, in a plan view, it has one or more third rings between the first ring and the second ring.

2. In claim 1, The resist coating apparatus is characterized in that the first ring is a cylindrical and mesh-like ring whose upper end is located above the surface of the substrate and whose lower end is located below the back surface of the substrate.

3. In claim 1 or 2, The resist coating apparatus is characterized in that the shape of the second ring is cylindrical and mesh-like.

4. In claim 1 or 2, A resist coating apparatus characterized by having a mesh-like and skirt-shaped resist adhesion prevention member that covers the back surface of the substrate held in the holding portion.

5. In claim 1, The first ring is a cylindrical ring whose upper end is located above the surface of the substrate and whose lower end is located below the back surface of the substrate. The resist coating apparatus is characterized in that the shape of the second ring is a cylindrical ring.

6. In claim 5, The cylindrical ring of the first ring has a plurality of openings, The resist coating apparatus is characterized in that the cylindrical ring of the second ring has a plurality of openings.

7. In claim 2, The resist coating apparatus is characterized in that the first ring has a plurality of openings arranged in a mesh pattern, and the inner diameter of the plurality of openings is 3 mm or more and 20 mm or less.

8. In claim 3, The resist coating apparatus is characterized in that the second ring has a plurality of openings arranged in a mesh pattern, and the inner diameter of the plurality of openings is 1 mm or more and 10 mm or less.

9. In claim 4, The resist coating apparatus is characterized in that the resist adhesion prevention member has a plurality of mesh-like openings, and the inner diameter of the plurality of openings is 1 mm or more and 10 mm or less.

10. In claim 1 or 2, The holding portion has a skirt-shaped resist adhesion prevention member that covers the back surface of the substrate held by the holding portion, The resist coating apparatus is characterized in that the resist adhesion prevention member has a plurality of openings.

11. In claim 4, The resist coating apparatus is characterized in that the resist adhesion prevention member is made of a stainless steel wire mesh coated with Teflon®.

12. In claim 1 or 2, The first ring is made of SUS coated with Teflon®, The resist coating apparatus is characterized in that the second ring is made of SUS coated with Teflon®.

13. In claim 1 or 2, A resist coating apparatus characterized in that the resist solution contains xylene.

14. In claim 1 or 2, The first ring is made of aluminum that has been anodized. The resist coating apparatus is characterized in that the second ring is made of Al and has been anodized.

15. A holding part that holds the substrate so that it can rotate, A rotational drive mechanism for rotating the substrate, A nozzle is positioned above the substrate held in the holding portion and supplies resist liquid to the surface of the substrate, The first ring and the second ring, It has, The first ring is located outside the outer circumference of the substrate held by the holding portion, The second ring has an inner diameter larger than the outer circumference of the substrate and an outer diameter smaller than the inner diameter of the first ring. A resist coating apparatus characterized in that, in a plan view, it has one or more third rings between the first ring and the second ring.

16. In claim 15, The first ring covers the outer periphery of the substrate held in the holding portion, The resist coating apparatus is characterized in that the second ring is positioned above the surface of the substrate held by the holding portion.

17. In claim 15, The first ring is positioned above the surface of the substrate held by the holding portion, The resist coating apparatus is characterized in that the second ring covers the outer periphery of the substrate held in the holding portion.

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