Expanding method

Abstract

To satisfactorily implement breakage of an adhesive film and prevent fragments of the adhesive film from being scattered.SOLUTION: An expanding method for expanding an expand sheet of a workpiece unit (1) which is formed by adhering a workpiece (11), in which a division start point is formed along a predetermined dividing line (13) through an adhesive film (21) to an expand sheet (23) and breaking the adhesive film along the predetermined dividing line includes: a cover member positioning step of positioning a cover member (250) while oppositely disposing it at an upper side of an exposed region (14) of the adhesive film protruding from an outer periphery of the workpiece; an expansion step of expanding the expand sheet and breaking the adhesive film after the execution of the cover member positioning step; and a pressing step of pressing the exposed region with the cover member after the execution of the expansion step and pressing fragments (211) of the adhesive film, which is broken in the expansion step, in a direction of the expand sheet.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to an expanding method for breaking an adhesive film by expanding an expand sheet of a workpiece unit.

Background Art

[0002] For example, in a semiconductor device manufacturing process, dividing scheduled lines are formed in a grid pattern on the surface of a substantially disk-shaped wafer, and devices such as ICs and LSIs are formed in each region partitioned by the dividing scheduled lines. On the back surface of such a wafer, an adhesive film for die bonding called a Die Attach Film (DAF) is attached. The adhesive film is divided for each device along the dividing scheduled lines together with the wafer. The wafer is supported by an annular frame via an expand tape, and is divided into individual devices by expansion of the expand tape.

[0003] On the other hand, a method of expanding the expand sheet in a state where a cover member is positioned over the exposed region has been proposed in order to prevent the exposed region of the sheet-shaped adhesive film protruding from the outer periphery of the workpiece from breaking and scattering when the expand sheet is expanded (see, for example, Patent Document 1 and Patent Document 2).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problem to be Solved by the Invention

[0005] Incidentally, there was a problem where, if the cover component was exposed to the adhesive film, the thermal shrinkage of the expandable sheet was hindered by the adhesive film, preventing expansion. In other words, the adhesive film has an outer diameter larger than the outer diameter of the wafer to account for misalignment, etc. When this adhesive film is attached to the back surface of the wafer, an exposed area is formed where the adhesive film extends beyond the outer edge of the wafer. When the expandable sheet is expanded and the adhesive film is broken, the protruding exposed area breaks, and fragments of the adhesive film scatter into the surroundings and adhere to the device, causing chip defects.

[0006] The present invention has been made in view of the above, and one of its objectives is to provide an expanding method that can effectively break the adhesive film and prevent fragments of the adhesive film from scattering. [Means for solving the problem]

[0007] An expanding method according to one aspect of the present invention is an expanding method for a workpiece unit formed by attaching a workpiece, which has a division starting point formed along a division line, to an expandable sheet via an adhesive film larger than the workpiece, and expanding the expandable sheet of the workpiece unit, and rupturing the adhesive film along the division line, characterized in that it comprises: a cover member positioning step of positioning a cover member opposite to the exposed area of ​​the adhesive film that protrudes from the outer circumference of the workpiece; an expansion step of expanding the expandable sheet and rupturing the adhesive film after the cover member positioning step has been performed; and a pressing step of pressing the exposed area with the cover member and pressing the fragments of the adhesive film ruptured in the expansion step toward the expandable sheet after the expansion step has been performed.

[0008] With this configuration, the cover member is positioned so as not to come into contact with the adhesive film, allowing for smooth expansion without hindering expansion by the expandable sheet. This enables effective rupture of the adhesive film. Furthermore, the cover member presses down any fragments that remain between the cover member and the expandable sheet or that scatter and become embedded in the expandable sheet during the rupture of the adhesive film. By crushing these fragments, scattering in subsequent processes can be suppressed. As a result, scattering of fragments is reduced, preventing chip defects and other problems caused by fragments adhering to the device.

[0009] In an expanding method according to one aspect of the present invention, the cover member has a region in contact with the adhesive film of the workpiece outer perimeter from center It is characterized by having an inclined surface that descends toward a certain direction.

[0010] According to this configuration, when the exposed area of ​​the adhesive film breaks during the expansion step, the resulting fragments, even if scattered, will hit the inclined surface. center The direction in which fragments scatter can be controlled. As a result, the scattering of fragments can be suppressed, preventing problems such as chip failure caused by fragments adhering to devices. [Effects of the Invention]

[0011] According to the present invention, the adhesive film can be ruptured effectively, and the scattering of fragments of the adhesive film can be prevented. [Brief explanation of the drawing]

[0012] [Figure 1] This is a schematic perspective view showing a workpiece unit including a workpiece that is divided by the expansion method of this embodiment. [Figure 2]This figure shows an example of an expansion unit for implementing the expansion method of this embodiment. [Figure 3] This figure shows an example of an expansion unit for implementing the expansion method of this embodiment. [Figure 4] This figure shows an example of an expansion unit for implementing the expansion method of this embodiment. [Figure 5] This is a partially enlarged view showing the relationship between the cover member after the extension step has been performed and the adhesive film. [Figure 6] This is a partially enlarged view showing the relationship between the cover member on which the pressing step has been performed and the adhesive film. [Figure 7] This figure shows an example of an expansion unit for performing the heat shrinking step in the expansion method of this embodiment. [Figure 8] This is a diagram showing a modified example of this embodiment. [Modes for carrying out the invention]

[0013] The expansion method of this embodiment will now be described with reference to the attached drawings. Figure 1 is a schematic perspective view showing a workpiece unit including a workpiece to be divided by the expansion method of this embodiment.

[0014] The workpiece unit 1 shown in Figure 1 comprises a workpiece 11 having a disc shape. The workpiece 11 is, for example, a wafer made of a semiconductor material such as silicon (Si). The surface 111 side of the workpiece 11 is divided into multiple regions by a plurality of intersecting division lines 13, and a device 15 such as an IC is formed in each region.

[0015] In the present embodiment, a disk-shaped wafer made of a semiconductor material such as silicon is applied as the workpiece 11, but there are no restrictions on the material, shape, structure, size, etc. of the workpiece 11. For example, a substrate made of other materials such as semiconductors, ceramics, resins, and metals can also be used as the workpiece 11. Similarly, there are no restrictions on the type, quantity, shape, structure, size, arrangement, etc. of the devices 15. Further, the devices 15 do not have to be formed on the workpiece 11.

[0016] Further, a modified layer 17 is formed inside the workpiece 11 as a division starting point along the planned division lines 13. That is, division starting points which are division grooves or the modified layers 17 formed inside are formed along the planned division lines 13. The planned division lines 13 are formed in a grid pattern on the front surface of the wafer, and the devices 15 are formed in each of the regions partitioned by the plurality of planned division lines 13. The modified layer 17 is formed, for example, by irradiating the workpiece 11 along the planned division lines 13 with a laser beam that has a wavelength transmitting through the workpiece 11 and whose focal point is positioned inside the workpiece 11.

[0017] An expandable sheet 23 is adhered to the back surface 112 of the workpiece 11 via an adhesive film 21. The adhesive film 21 is typically a film-shaped adhesive called a die attach film (DAF) or the like, and generally has a disk shape with a larger diameter than the workpiece 11. The adhesive film 21 is formed using, for example, a resin that cures by heat or light, and has a function of fixing chips obtained by dividing the workpiece 11 to an arbitrary target (for example, another chip or a substrate).

[0018] The expand sheet 23 adhered to the back surface 112 of the workpiece 11 via the adhesive film 21 is a resin film that stretches when a force is applied, and has, for example, a disk shape with a larger diameter than the adhesive film 21. Further, the outer peripheral portion of the expand sheet 23 is adhered to an annular frame 25 having an inner diameter larger than the diameters of the workpiece 11 and the adhesive film 21. The adhesive film 21 is divided together with the wafer along the planned dividing lines 13 for each device 15. The wafer is supported by the annular frame 25 via the expand sheet 23, and is divided into individual devices 15 by the expansion of the expand sheet 23.

[0019] As described above, in the expanding method of the present embodiment, the adhesive film 21 having an outer diameter larger than the outer diameter of the workpiece 11 is adhered to the back surface 112 of the workpiece 11, and the adhesive film 21 side is adhered to the expand sheet 23 exposed from the center of the frame 25. Further, the surface protective tape (not shown) is peeled off from the front surface 111 of the workpiece 11, so that the front surface 111 faces upward. In this manner, in a state where the exposed region 14 on the peripheral edge side of the adhesive film 21 protrudes (is exposed) from the outer periphery of the workpiece 11, the workpiece 11 is adhered to the expand sheet 23 via the adhesive film 21.

[0020] Figures 2, 3, and 4 show an example of an expansion unit 200 for implementing the expansion method of this embodiment. Figure 2 shows a cross-sectional view of the expansion unit 200 before expansion, Figure 3 shows a cross-sectional view of the expansion unit 200 during expansion, and Figure 4 shows a cross-sectional view of the expansion unit 200 after expansion. The expansion unit 200 expands the expandable sheet 23. The expansion unit 200 comprises a base 210, a frame fixing part 220, a frame support part 221, an expansion drum 230, a holding table 232 installed inside the expansion drum 230 and having a holding surface 233 at approximately the same height as the upper surface of the expansion drum 230, a lifting unit 240 for raising and lowering the expansion drum 230 and the holding table 232, and a cover member 250. The base 210 is formed in a cylindrical shape and supports the expansion drum 230 and the lifting unit 240. The holding table 232 is formed in a disc shape and is positioned inside the expansion drum 230. The holding table 232 supports wafers via the expand sheet 23 and the holding surface 233.

[0021] The frame fixing portion 220 contacts and holds the annular frame 25, restricting the upward movement of the frame 25. The frame fixing portion 220 is formed from a metal material such as SUS. The frame fixing portion 220 has a circular opening 2201 corresponding to the circular opening 2212 of the frame support portion 221. The frame support portion 221 is moved by a lifting unit (not shown) between a fixed position in which the frame is clamped between the upper surface (support surface) 2211 of the frame support portion 221 and the lower surface of the frame fixing portion 220, thereby holding down the frame 25 of the workpiece unit 1, and a retracted position lowered from the fixed position.

[0022] The frame support portion 221 has a circular opening 2212 on its upper surface 2211. The expansion drum 230 is positioned within this circular opening 2212 of the frame support portion 221 so as to be able to move up and down. Multiple rollers 231 are attached to the outer circumference of the upper end of the expansion drum 230. The frame support portion 221 is formed from a metal material such as SUS.

[0023] The expansion drum 230 is mounted on the base 210 and is cylindrical in shape. The expansion drum 230 is positioned inside the frame fixing portion 220 and coaxial with the frame fixing portion 220. The inner and outer diameters of the expansion drum 230 are smaller than the inner diameters of the frame 25 and the frame fixing portion 220, and larger than the outer diameter of the workpiece 11.

[0024] The lifting unit 240 moves the frame support 221 and the expansion drum 230 relative to each other along the vertical direction. In this embodiment, the lifting unit (not shown) raises and lowers the expansion drum 230 between a position where the upper surface 2211 of the frame support 221 is on the same plane as the upper end of the expansion drum 230 and a position where the upper surface 2211 of the frame support 221 is above the upper end of the expansion drum 230. In this embodiment, the lifting unit 240 is an air cylinder attached to the base 210, which is extendable and retractable and has the expansion drum 230 attached to its upper end. In this embodiment, the lifting unit 240 is located approximately in the center of the base 210. The lifting unit 240 may be composed of a motor and a ball screw (not shown) and may be formed to be extendable and retractable in the vertical direction.

[0025] The cover member 250 is formed in a cylindrical shape and extends downward from its outer circumference. The cover member 250 is positioned opposite to the exposed area 14 of the adhesive film 21 that extends beyond the outer circumference of the workpiece 11. The cover member 250 is positioned above the exposed area 14 at a predetermined distance so as not to interfere with expansion and not to come into contact with the adhesive film 21. The predetermined distance is such that the cover member 250 does not come into contact with the adhesive film 21, and the cover member 250 can cover the adhesive film 21 after expansion so that any torn pieces of the adhesive film 21 do not scatter.

[0026] Next, the expansion method according to this embodiment will be described. The expansion method according to this embodiment is a method of expanding the expanded sheet 23 of a workpiece unit 1 formed by attaching a workpiece 11, which has a division starting point formed along the division line 13, to an expanded sheet 23 via an adhesive film 21 larger than the workpiece 11, and then rupturing the adhesive film 21 along the division line 13. The expansion method according to this embodiment is carried out by a control device (not shown) of the expansion unit 200 controlling each component of the expansion unit 200, and comprises a cover member positioning step, an expansion step, and a pressing step. Prior to the cover member positioning step, the workpiece 11 is brought into the circular opening 2212 of the frame support part 221, and the frame 25 is placed on the upper surface 2211 of the frame support part 221.

[0027] (Cover member positioning step) The cover member positioning step involves positioning the cover member 250 opposite to the exposed area 14 of the workpiece 11 that extends beyond the outer circumference of the adhesive film 21. In the cover member positioning step, as shown in Figure 2, the lower end surface 2501 of the cover member 250 is positioned so that it does not come into contact with the exposed area 14 of the workpiece 11 before being lowered by the lifting unit 240.

[0028] (Extension step) The expansion step involves expanding the expandable sheet 23 and rupturing the adhesive film 21 after the cover member positioning step. In the expansion step, as shown in Figure 3, even when the workpiece 11 approaches the cover member 250 relatively as the expansion drum 230 rises due to the drive of the lifting unit 240, the lower end surface 2501 of the cover member 250 is positioned so as not to contact the exposed area 14 of the workpiece 11. That is, in the expansion step, even when the lifting unit 240 rises, the cover member 250 is positioned opposite the exposed area 14 at a predetermined distance so as not to contact the adhesive film 21, so as not to hinder the expansion of the expandable sheet 23. In this embodiment, since the cover member 250 is positioned so as not to contact the adhesive film 21, the expansion work can be performed smoothly without hindering the expansion by the expandable sheet 23. This allows for effective rupture of the adhesive film 21.

[0029] As the lifting unit 240 rises, the expandable sheet 23 is expanded, and the adhesive film 21 is ruptured. During the expansion step, a cold air supply means (not shown) is activated to supply cold air and cool the adhesive film 21. Cooling reduces the ductility of the adhesive film 21, so the adhesive film 21 can be easily ruptured simply by expanding the expandable sheet 23. During the expansion step, fragments 211 generated when the exposed area 14 of the adhesive film 21 is ruptured may scatter into the surroundings.

[0030] Figure 5 is a partially enlarged view showing the relationship between the cover member 250, which has undergone the expansion step, and the adhesive film 21. In Figure 5, the area around Area A, which shows the relationship between the cover member 250 and the adhesive film 21, is enlarged, and for the sake of explanation, only the components related to the cover member 250 and the adhesive film 21 are shown. In Figure 5, the -X direction along the X axis indicates the direction toward the outer periphery, the +X direction indicates the direction toward the center, and the -Z direction indicates information in the downward direction along the Z axis.

[0031] In this embodiment, since the cover member 250 is positioned so as not to come into contact with the adhesive film 21, fragments 211 generated when the exposed area 14 of the adhesive film 21 breaks during the expansion step may scatter into the surrounding area. As shown in Figure 5, the fragments 211 generated by the break may remain in place between the cover member 250 and the expanded sheet 23, or they may scatter to the outer periphery (X-axis side) or the center (Y-axis side) and become embedded in the expanded sheet 23.

[0032] Therefore, in this embodiment, the area 2503 of the cover member 250 that comes into contact with the adhesive film 21 is the workpiece 11 Outer circumference side (-X direction) from Center side (+X direction) It has an inclined surface 2502 that descends toward (in the -Z direction along the Z axis). As a result, as shown in Figure 5, the angle of the inclined surface 2502 on the lower end surface 2501 of the cover member 250 is formed at an arbitrary angle θ with respect to the expanded sheet 23. In Figure 5, the inclined surface 2502 is formed as a flat surface, but this is not limited to this, and it may be formed in a curved shape. In this embodiment, the workpiece 11 Outer circumference side (-X direction) from Center side (+X direction) As a result of having an inclined surface 2502 that descends toward the east, the thickness ta on the outer circumference side (-X direction) of the cover member 250 is formed to be thinner than the thickness tb on the central side (+X direction). Therefore, when the exposed area 14 of the adhesive film 21 that occurred during the expansion step breaks, the fragments 211 generated will hit the inclined surface 2502 even if they are scattered. center The direction in which the fragments scatter outwards (+X direction) can be controlled. As a result, the scattering of the fragments 211 (especially towards the center (+X direction)) can be suppressed, and causes of chip defects and other problems due to adhesion to the device 15 can be prevented.

[0033] (Pressing step) The pressing step, after the expansion step has been performed, involves pressing the exposed area 14 with the cover member 250, and pressing the fragments 211 of the adhesive film 21 that were broken in the expansion step toward the expanded sheet 23.

[0034] Figure 6 is a partially enlarged view showing the relationship between the cover member 250, on which the pressing step has been performed, and the adhesive film 21. In Figure 6, the area around Area B, which shows the relationship between the cover member 250 and the adhesive film 21, is enlarged, and for the sake of explanation, only the components related to the cover member 250 and the adhesive film 21 are shown. In Figure 6, the -X direction along the X axis indicates the direction toward the outer periphery, the +X direction indicates the direction toward the center, and the -Z direction indicates information in the downward direction along the Z axis.

[0035] In this embodiment, the cover member 250 is positioned so as not to come into contact with the adhesive film 21. Therefore, in the expansion step, when the exposed area 14 of the adhesive film 21 is torn, the resulting fragments 211 scatter into the surrounding area. As a result, as shown in Figure 5, the fragments 211 generated by the tear remain in place between the cover member 250 and the expanded sheet 23, or scatter towards the outer periphery (-X direction) or the center (+X direction) and become embedded in the expanded sheet 23 or the adhesive film 21. Therefore, in the pressing step, as shown in Figure 6, Cover member 250 and Remains between the expanded sheet 23 Fragments 211 and The fragments 211 that scattered towards the outer periphery (-X direction) or the center (+X direction) and became embedded in the expanded sheet 23 、 The cover member 250 presses the adhesive film 21 or the expanded sheet 23 against at least one of them. and Remaining between the Kispand sheet 23 Fragments 211 and , fragments 211 that had pierced the expanded sheet 23 , by the cover member 250 By crushing the fragments and adhering them to at least one of the expanded sheet 23 or the adhesive film 21, scattering in subsequent processes can be suppressed. As a result, scattering of the fragments 211 can be suppressed, preventing chip defects and other problems caused by them adhering to the device 15.

[0036] Next, the subsequent step following the pressing step, the heat shrinking step, which is carried out by a control device (not shown) of the expansion unit 200 controlling each component, will be described. Figure 7 shows an example of an expansion unit 200 for carrying out the heat shrinking step in the expansion method of this embodiment. In carrying out the heat shrinking step, the expansion drum 230 is lowered. Before lowering the expansion drum 230, the workpiece 11 is held by suction using the holding table 232 so that the chip spacing can be maintained even when the expansion drum 230 is lowered.

[0037] (Heat shrinkage step) The heat shrinking step involves heating and shrinking the expanded sheet 23 that was expanded in the expansion step. In particular, the slack portions of the expanded sheet 23 that have formed around the workpiece 11 and the adhesive film 21 are heated and shrunk. When the heat shrinking step is performed, the expansion unit 200 is further equipped with a heating device 260. In the heat shrinking step, for example, the workpiece 11 placed on the expanded sheet 23 is transported to the heating device 20. The heating device 20 is equipped with a heater (not shown) as a heat source, for example, and the heater can heat the upper surface of the expanded sheet 23. When the expanded sheet 23 is heated by the heater 22, the temperature of the expanded sheet 23 rises.

[0038] In the heating device 20 shown in Figure 7, heat is applied to the expanded sheet 23 from above by a heater, but the heating method is not limited to this, and other heating methods may be used. For example, heat may be applied to the expanded sheet 23 from below by a heater. Alternatively, the expanded sheet 23 may be heated by infrared irradiation or hot air, for example. When using infrared irradiation or hot air, the expanded sheet 23 can be supported so that it is exposed facing upwards, and infrared irradiation or hot air blowing can be applied to the expanded sheet 23 from above.

[0039] In the embodiment described above, a heat shrinkage step is performed as a subsequent step, but this is not limited to this, and other steps may be performed. For example, the heat shrinkage step may be performed simultaneously with the support member formation step as a subsequent step.

[0040] (modified version) In the above-described embodiment, the workpiece unit 1 comprises an annular frame 25, and the frame 25 is held by a frame fixing part 220, but this is not limited to this. For example, the present invention is also applicable to an expansion method carried out by an expansion unit 200 that clamps the four sides of the expanded sheet 23 around the workpiece 11 with clamping members such as rollers and adjusts the amount of expansion in four directions. In this case, the frame 25 is not necessary to expand the expanded sheet 23, and the workpiece unit is configured without including the frame 25.

[0041] Figure 8 shows a modified version of this embodiment to enable such continuous processing. Figure 8 shows a modified configuration of the expansion unit 200 described above, with the same reference numerals used for identical components.

[0042] In this modified example, the expanded sheet 23 is transported horizontally in the first direction (left in Figure 8) and placed on the upper surface 2211 of the frame support section 221. The first and second clamping members 4041, 4042 and the first and second moving means 4051, 4052, which were located on the first direction side, are moved out of the transport path of the expanded sheet 23, enabling the transport of the expanded sheet 23 onto the frame support section 221.

[0043] Each movable base 441, equipped with a lower clamping mechanism 442 and an upper clamping mechanism 443 for the first and second clamping members 4041 and 4042, is arranged to move along a first direction to the side of the sheet transport path and is moved in the first direction by first and second moving means 4051 and 4052, respectively. The arm portions 421 and 431 of the lower clamping mechanism 442 and the upper clamping mechanism 443 (only the upper clamping mechanism 443 is shown in Figure 8) are formed in an L-shape symmetrically in the figure and extend toward the sheet transport path, clamping the expanded sheet 23 from above and below. The lower clamping portion 422 and the upper clamping portion 432 are fixed to the tips of these arm portions 421 and 431, respectively. The lower clamping portions 422 and upper clamping portions 432 of the first and second clamping members 4041 and 4042, each equipped with rollers, face each other and are positioned to clamp the first-direction side of the expanded sheet 23 and expand in the first direction.

[0044] As described above, according to the expanding method for rupturing the adhesive film 21 of this embodiment, the cover member 250 is positioned so as not to come into contact with the adhesive film 21, allowing for smooth expansion without hindering the expansion by the expand sheet 23. This enables successful rupture of the adhesive film. Furthermore, the cover member 250 presses down on any fragments 211 that remain between the ruptured cover member 250 and the expand sheet 23, or that scatter towards the outer periphery (-X direction) or center (+X direction) and become embedded in the expand sheet 23. By crushing the fragments 211 that remain between the cover member 250 and the expand sheet 23 or become embedded in the expand sheet 23, scattering in subsequent processes can be suppressed. As a result, scattering of fragments 211 is suppressed, preventing chip defects and other problems caused by fragments adhering to the device 15.

[0045] Furthermore, according to the expanding method for rupturing the adhesive film 21 of this embodiment, the fragments generated when the exposed area of ​​the adhesive film ruptures during the expansion step, even if scattered, will not hit the inclined surface. centerThe direction in which fragments scatter can be controlled. As a result, the scattering of fragments can be suppressed, preventing problems such as chip failure caused by fragments adhering to devices.

[0046] Furthermore, in this embodiment, various workpieces such as semiconductor substrates, inorganic material substrates, and package substrates may be used as wafers. Various substrates such as silicon, gallium arsenide, gallium nitride, and silicon carbide may be used as semiconductor substrates. Various substrates such as sapphire, ceramics, and glass may be used as inorganic material substrates. Devices may or may not be formed on the semiconductor substrates and inorganic material substrates. Various substrates for CSP (Chip Size Package), WLCSP (Wafer Level Chip Size Package), EMI (Electro Magnetic Interference), SIP (System In Package), and FOWLP (Fan Out Wafer Level Package) may be used as package substrates. In addition, lithium tantalate, lithium niobate, raw ceramics, and piezoelectric elements may be used as wafers after or before device formation.

[0047] Furthermore, although this embodiment and its variations have been described, other embodiments of the present invention may be combinations of the above embodiments and their variations, either entirely or partially.

[0048] Furthermore, the embodiments and modifications of the present invention are not limited to those described above, and may be modified, substituted, or altered in various ways without departing from the spirit of the technical idea of ​​the present invention. Moreover, if the technical idea of ​​the present invention can be realized in a different way by advances in the art or by other derived arts, it may be implemented by that method. Accordingly, the claims cover all embodiments that may fall within the scope of the technical idea of ​​the present invention.

[0049] Furthermore, although this embodiment describes a configuration in which the present invention is applied to the rupture of an adhesive film for die bonding, it is also possible to apply it to the rupture of other adhesive films. [Industrial applicability]

[0050] As described above, the present invention has the effect of effectively breaking the adhesive film and preventing fragments of the adhesive film from scattering, and is particularly effective in an expanding method for breaking the adhesive film along a planned dividing line. [Explanation of symbols]

[0051] 1: Workpiece Unit 10: Expansion Drum 11: Workpiece 13: Planned division line 14:Exposed area 15: Device 17: Modified layer 20: Heating device 21: Adhesive film 211: Fragments 22: Heater 23: Expandable Sheet 25: Frame 200: Expansion Unit 210: Base 220: Frame fixing part 2201: Circular opening 221: Frame support section 2211:Top surface 2212: Circular opening 230: Expansion Drum 231: Roller 232: Holding Table 233: Holding surface 240: Lifting Unit 250: Cover component 2501: Bottom end surface 2502: Inclined surface 2503 :Area 260: Heating device 4041: First clamping member 4042:Second clamping member 4051 :First means of transportation 4052 :Second transportation means 421: Arm section 422: Lower clamping part 431: Arm section 432: Upper clamping part 441: Movable base 442:Lower clamping mechanism 443: Upper clamping mechanism A: Area B: Area

Claims

[Claim 1] The workpiece unit, formed by attaching a workpiece with a division starting point along the planned division line to an expanded sheet via an adhesive film larger than the workpiece, is then expanded. An expanding method for rupturing the adhesive film along the planned division line, A cover member positioning step involves positioning the cover member opposite to the exposed area of ​​the adhesive film that extends beyond the outer circumference of the workpiece, After the cover member positioning step is performed, the expansion step is performed to expand the expandable sheet and break the adhesive film, After the expansion step is performed, the cover member is pressed against the exposed area, and the fragments of the adhesive film that were broken in the expansion step are pressed in the direction of the expanded sheet in a pressing step, Equipped with, The cover member is, In the area in contact with the adhesive film An expanding method characterized by having an inclined surface that descends from the outer circumference toward the center of the workpiece.

Images