Electronic tester

Abstract

To provide a tester used for testing microelectronic circuits.SOLUTION: A tester apparatus is described. Various components contribute to the functionality of the tester apparatus, the components including an insertion and removal apparatus, thermal posts, independent gimbaling, the inclusion of a photodetector, a combination of thermal control methods, a detection circuitry in a socket lid, through-posts with stand-offs, and voltage retargeting.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] [Cross-reference to related applications]

[0001] This application claims priority to U.S. Provisional Patent Application No. 62 / 466,462 filed on 3 March 2017 and U.S. Provisional Patent Application No. 62 / 526,089 filed on 28 June 2017, which are incorporated in their entirety by reference.

[0002] 1) Field of invention

[0002] The present invention relates to a tester used for testing ultra-miniature electronic circuits.

[0003] 2) Consideration of related technologies

[0003] Microelectronic circuits are typically assembled inside and on the top surface of a semiconductor wafer. Such wafers are then “assembled” or “diced” into individual dies. Such dies are generally mounted on a support plate to give the support plate rigidity and to electronically communicate with the die’s integrated circuit or microelectronic circuits. Final packaging may include encapsulation of the die, and the resulting package can then be shipped to the customer.

[0004]

[0004] The die or package must be tested before being shipped to the customer. Ideally, the die should be tested in the early stages to identify defects that occur during the initial stages of manufacturing. Wafer-level testing is performed for this purpose, by providing contacts in a processor and contactor, and then using the processor to move the wafer so that the contacts on the wafer make contact with the contactor. Power signals and electronic signals are then exchanged between the wafer and the microelectronic circuits formed on the wafer, via the contactor.

[0005]

[0005] According to various embodiments, a wafer includes a substrate such as a silicon substrate or a printed circuit board, and one or more devices assembled within the substrate or mounted on the substrate.

[0006]

[0006] Alternatively, the wafer can be placed in a portable cartridge equipped with an electrical interface and a thermal chuck. Power and signals can be exchanged with the wafer through the electrical interface, while the wafer's temperature is thermally controlled by heating or cooling the thermal chuck.

[0007]

[0007] After the wafers are separated, it may be necessary to test the individual dies again, or the dies may be necessary to test them again after they are mounted on the support plate. [Overview of the project]

[0008]

[0008] The invention provides a test apparatus comprising a frame, a slot assembly on the frame, a slot assembly connection portion on the slot assembly, a holding structure for mounting a cartridge for holding a plurality of microelectronic devices, a horizontal transfer device operable to move the cartridge into the slot assembly from a first position to a second position horizontally, a vertical transfer device operable to move the cartridge and the slot assembly relative to each other in a first vertical direction and to engage the slot assembly connection portion with a cartridge connection portion on the cartridge, and a tester connected via the first slot assembly connection portion and the cartridge connection portion to supply at least power to each microelectronic device and to measure the performance of the microelectronic devices, wherein the vertical transfer device is operable to move the cartridge and the slot assembly relative to each other in a second vertical direction, the second vertical direction being opposite to the first vertical direction and disengaging the slot assembly connection portion from the cartridge connection portion, and the horizontal transfer device is operable to move the cartridge out of the slot assembly from a second position to a first position horizontally.

[0009]

[0009] The invention also provides a method for testing electronic equipment, the method comprising: holding a cartridge holding a plurality of microelectronic devices in a first position on a frame at least partially outside a slot assembly; moving the cartridge horizontally from the first position to a second position inside the slot assembly; moving the cartridge and the slot assembly relative to each other in a first vertical direction, engaging a slot assembly connector on the slot assembly with a cartridge connector on the cartridge; testing the microelectronic devices through the first slot assembly connector and cartridge connector, the test being performed by supplying at least power to each microelectronic device and measuring the performance of the microelectronic devices; moving the cartridge and the slot assembly relative to each other in a second vertical direction, the second vertical direction being opposite to the first vertical direction, and disengaging the slot assembly connector from the cartridge connector; and moving the cartridge horizontally from the second position to the first position outside the slot assembly.

[0010]

[0010] The invention further provides a cartridge, the cartridge comprising: a socket made of an insulating material and having an upper and a lower, the upper having a first configuration for releasably holding a first electronic device and having a first socket thermal opening formed through the socket from the lower to the upper; a connecting portion connected to the socket and connecting the first device to an electrical tester; a chuck made of a thermally conductive material; and a first thermal support attached to the chuck, inserted into the first socket thermal opening, the end of which the first thermal support is thermally connected to the first device, and as a result heat is transferred mainly through the first thermal support, in contrast to the insulating material of the socket between the chuck and the first electronic device.

[0011]

[0011] The invention also provides a test specimen comprising a socket made of an insulating material and having an upper and a lower, wherein the upper has a first configuration for releasably holding a first electronic device, the socket having a first socket thermal opening formed through it from the lower to the upper, and a first thermally conductive support being insertable into the first socket thermal opening from the lower, a first tweezers held in the socket and elastically pressable to connect the first device to a circuit board, and a lid movable relative to the socket and pressing down the first tweezers to bring the first electronic device into contact with the end of the first thermal support.

[0012]

[0012] The invention further provides a test specimen comprising a chuck made of a thermally conductive material, and a first heat support attached to the chuck, the end of which is insertable into a first socket heat opening with the end of which is thermally connected to a first device, so that heat is transmitted mainly through the first heat support, as opposed to the insulating material of the socket between the chuck and the first electronic device.

[0013]

[0013] The invention also provides a method for testing one or more electronic devices, the method comprising: holding a first device in a releasable manner in an upper first configuration of a socket made of insulating material; connecting the first device to an electrical tester via a connecting portion connected to the socket; inserting a first heat support, attached to a chuck made of thermally conductive material, through the socket into a first socket heat opening formed from the lower to the upper side, so that the end of the first heat support is thermally connected to the first device; and conducting heat between the chuck and the first electronic device, the heat being conducted mainly through the first heat support, as opposed to the insulating material of the socket.

[0014]

[0014] The invention further provides a cartridge, the cartridge including a socket made of an insulating material and having an upper and a lower, having a first configuration on the upper side for holding a first electronic device and a second configuration on the upper side for holding a second electronic device; a lid; a first press plate rotatably mounted on the lid; a second press plate rotatably mounted on the lid, the lid being positionable across the socket and movable toward the socket; the rotatably mounted first press plate allowing the first electronic device to rotate the first press plate relative to the lid; the rotatably mounted second press plate allowing the second electronic device to rotate the second press plate independently of the first press plate relative to the lid; a first contact set held in the socket and connected to the first electronic device; a first terminal set connected to the first contact set; a second contact set held in the socket and connected to the second electronic device; and a second terminal set connected to the second contact set.

[0015]

[0015] The invention also provides a method for testing one or more electronic devices, the method comprising: holding a first electronic device in a first configuration releasably on the upper side of a socket made of insulating material; holding a second electronic device in a second configuration releasably on the upper side of the socket; positioning a lid across the socket, the lid having a first press plate rotatably attached to the lid and a second press plate rotatably attached to the lid; moving the lid toward the socket, wherein the rotatable attachment of the first press plate allows the first electronic device to rotate the first press plate relative to the lid, and the rotatable attachment of the second press plate allows the second electronic device to rotate the second press plate relative to the lid independently of the first press plate; and connecting the first and second electronic devices to an electrical tester via a connecting portion connected to the socket.

[0016]

[0016] The invention further provides a cartridge which includes an electronic device holder having a structure for removably holding an electronic device having input contacts and a light-emitting element; an input contact located on the electronic device holder and connected to input contacts on the electronic device, which supplies input power to the input contacts of the electronic device via the input contacts of the electronic device holder, and the light-emitting element transmits light due to the input power; a photodetector attached to the electronic device holder for detecting light and generating output power according to the magnitude of the light; and an output contact connected to the photodetector for measuring output power.

[0017]

[0017] The invention also provides a method for testing one or more electronic devices, the method comprising: inserting an electronic device having input contacts and a light-emitting element into an electronic device holder; connecting the input contacts on the electronic device holder to the input contacts on the electronic device; supplying input power to the input contacts on the electronic device via the input contacts on the electronic device holder so that the light-emitting element transmits light due to the input power; detecting the light; converting the detected light into output power; measuring the output power via the output contacts; and removing the electronic device from the electronic device holder.

[0018]

[0018] The invention further provides a test apparatus comprising: a socket having a configuration for detachably holding an electronic device having input terminals and a light-emitting element; an input contact on the socket, which is connected to an input terminal on the electronic device and supplies input power to the input terminal on the electronic device via the input contact on the socket, and the light-emitting element transmits light due to the input power; a temperature correction device located on the first side of the socket, which changes its temperature when in operation to create a temperature difference between the temperature correction device and the electronic device, and heat conduction between the temperature correction device and the electronic device, thereby correcting the temperature of the electronic device; a heat sink located on the side of the socket opposite to the temperature correction device, which has a surface for absorbing light and generates heat inside by absorbing light; and a heat dissipation device which is thermally connected to the heat sink and removes heat from the heat sink.

[0019]

[0019] The invention also provides a method for testing one or more electronic devices, the method comprising: inserting an electronic device having input contacts and a light-emitting element into a socket; connecting the input contacts on the socket to input terminals on the electronic device; supplying input power to the input terminals on the electronic device via the input contacts on the socket so that the light-emitting element transmits light due to the input power; changing the temperature of a temperature correction device on a first side of the socket to create a temperature difference between the temperature correction device and the electronic device, and heat conduction between the temperature correction device and the electronic device, thereby correcting the temperature of the electronic device; absorbing light on the surface of a heat sink on the opposite side of the socket from the temperature correction device so that the heat sink generates heat due to the absorption of light; removing heat from the heat sink using a heat dissipation device thermally connected to the heat sink; and removing the electronic device from the socket.

[0020]

[0020] The invention further provides a cartridge, which is made of an insulating material and has an upper and lower section, and an upper upper section, and includes a socket for holding an electronic device, a set of contacts held in the socket and connected to the electronic device, a set of terminals connected to the set of contacts held by the socket, a circuit board, the terminal set connected to the set of contacts connected to the set of contacts on the circuit board, a lid, a detector mounted on the lid, the lid being movable and positioned across the socket together with the detector located in a predetermined position when power is supplied to the electronic device via at least one of the set of terminals held by the socket, and the detector for detecting the function of the electronic device, and a measuring channel connecting the detector to a connection on the circuit board.

[0021]

[0021] The invention further provides a method for testing one or more electronic devices, the method comprising: releasably retaining an electronic device in a socket, wherein the socket is made of an insulating material and has an upper side, a lower side, and a feature on the upper side for retaining the electronic device; connecting a set of contacts retained in the socket to the electronic device; connecting a set of terminals connected to the set of contacts to a set of contacts on a circuit board; moving a lid fitted with a detector across the socket; connecting the detector to a connection portion on the circuit board via a measurement channel; supplying power to the electronic device via at least one of the contacts retained by the socket; detecting a function of the electronic device when power is supplied to the electronic device via at least one of the contacts retained by the socket; and measuring the function via the connection portion.

[0022]

[0022] The invention further provides a cartridge, the cartridge comprising: a support plate having a strut opening therethrough; a backing structure on a first side of the support plate, comprising at least a circuit board having contacts; a conductor, the conductor having a contact that contacts a terminal on an electronic device positioned on a second side of the support plate opposite the first side, a portion retained by the support plate, and a terminal connected to a contact on the circuit board; a spring; a force generating device on a side of the electronic device opposite the support plate, wherein the force generating device and the support plate are movable relative to each other, and the force generating device deforms the spring to move the electronic device toward the support plate; and a strut, comprising a standoff on a surface in a plane spaced from the plane of the surface of the support plate for preventing the electronic device from moving toward the support plate, a force transmission portion extending from the standoff at least partially through the strut opening, and a force transfer portion extending from the force transmission portion, wherein the force transfer portion is retained by the backing structure.

[0023]

[0023] The present invention further provides a cartridge, and the cartridge comprises the steps of: arranging a backing structure including at least a circuit board with contacts on a first side of a support plate; connecting a contact of a conductor to a terminal on an electronic apparatus located on the first side opposite to a second side of the support plate, wherein the conductor has a portion held by the support plate and a terminal connected to the contact on the circuit board; positioning a force generating apparatus on a side of the electronic apparatus opposite to the support plate; moving the force generating apparatus and the support plate relative to each other to bring the electronic apparatus close to the support plate, so as to deform a spring against its spring force; preventing the movement of the electronic apparatus approaching the support plate by a support post provided with a standoff having a surface in a plane spaced apart from the plane of the surface of the support plate; receiving the force from the electronic apparatus at the standoff of the support post; conducting the force from the standoff at a force transmission portion of the support post at least partially through an opening, wherein the support post extends from the standoff through a support post opening formed at least partially through the support plate; receiving the force at a force transfer portion extending from the force transmission portion of the support post, wherein the force transfer portion is held by the backing structure; and transferring the force to the backing structure.

[0024]

[0024] The invention further provides a test apparatus, the test apparatus comprising: a voltage target system; a holder for holding a plurality of electronic devices in at least first and second clusters; at least one voltage source connectable to the electronic devices of the first cluster, which simultaneously supplies a first test voltage to the electronic devices of the first cluster; a voltage source connectable to the electronic devices of the second cluster, which simultaneously supplies a first test voltage to the electronic devices of the second cluster; and at least one current detector, connectable to the electronic devices of the first cluster, which measures a first test current from the electronic devices of the first cluster, which is the total current simultaneously supplied to the electronic devices of the first cluster; and a current detector, connectable to the electronic devices of the second cluster, which measures a first test current from the electronic devices of the second cluster, which is the total current simultaneously supplied to the electronic devices of the first cluster. The voltage target system includes a current detector which is the total current simultaneously supplied to the equipment of the second cluster, and a voltage target system which performs a first comparison by comparing a first test current measured from the equipment of the first cluster with a target current, and a first voltage regulator which adjusts a first test voltage to a second test voltage for the first cluster in response to the first comparison, so that as a result the first test current from the equipment of the first cluster is adjusted to be closer to a second test current which is closer to the target current, and the voltage target system which performs a second comparison by comparing a first test current measured from the equipment of the second cluster with a target current, and a second voltage regulator which adjusts a first test voltage to a second test voltage for the second cluster in response to the second comparison, so that as a result the first test current from the equipment of the second cluster is adjusted to be closer to a second test current which is closer to the target current.

[0025]

[0025] The invention also provides a method for testing a plurality of electronic devices, the method comprising the steps of: holding the plurality of electronic devices in at least a first and a second cluster; connecting at least one voltage source to the electronic devices in the first cluster to simultaneously supply a first test voltage to the electronic devices in the first cluster, and also being connectable to the electronic devices in the second cluster to simultaneously supply a first test voltage to the electronic devices in the second cluster; and connecting at least one voltage source to the electronic devices in the second cluster to simultaneously supply a first test voltage to the electronic devices in the second cluster. The first step is to measure a first test current from the equipment of the second cluster using at least one current detector, wherein the first test current measured by the current detector from the equipment of the second cluster is the total current supplied to the equipment of the second cluster simultaneously, and to perform a first comparison using a voltage target system, wherein the comparison is performed by comparing the measured first test current from the equipment of the first cluster with a target current, and a first voltage adjustment The process includes: using a regulator to adjust a first test voltage to a second test voltage for the first cluster in accordance with a first comparison, so that as a result, the first test current from the equipment of the second cluster is adjusted to a second test current that is closer to the target current; performing a second comparison using a voltage target system, the comparison being performed by comparing the measured first test current from the equipment of the second cluster with the target current; and using a second voltage regulator to adjust the first test voltage to a second test voltage for the second cluster in accordance with a second comparison, so that as a result, the first test current from the equipment of the second cluster is adjusted to be closer to a second test current that is closer to the target current.

[0026]

[0026] The present invention will be further described by reference to the accompanying drawings. [Brief explanation of the drawing]

[0027] [Figure 1]This is a cross-sectional side view of a testing apparatus having a slotted assembly according to one embodiment of the present invention. [Figure 2] This is a cross-sectional side view of the testing apparatus in Figure 1, along line 2-2. [Figure 3] This is a cross-sectional side view of the testing apparatus along line 3-3 in Figure 1. [Figure 4] Figures 2 and 3 are cross-sectional side views of the testing apparatus along line 4-4. [Figure 5A] This is a perspective view of the testing apparatus, showing how the portable cartridge is inserted into and removed from the oven, which is determined by the frame. [Figure 5B] This is a perspective view of the testing apparatus, showing how the portable cartridge is inserted into and removed from the oven, which is determined by the frame. [Figure 5C] This is a perspective view of the testing apparatus, showing how the portable cartridge is inserted into and removed from the oven, which is determined by the frame. [Figure 6] This is a time chart showing how one cartridge is inserted into the wafer's electronics and used for testing, followed by the insertion of another cartridge. [Figure 7] This is a perspective view of a test apparatus showing the insertion or removal of a single-slot assembly. [Figure 8A] Figures 1 to 7 are cross-sectional side views showing the use of standoffs in the cartridge configuration described above. [Figure 8B] Figures 1 to 7 are cross-sectional side views showing the use of standoffs in the cartridge configuration described above. [Figure 9A] This is a side view showing a device used for inserting and removing portable cartridges from an oven. [Figure 9B] This is a side view showing a device used for inserting and removing portable cartridges from an oven. [Figure 10] This is a side view showing a device used for inserting and removing portable cartridges from an oven. [Figure 11] This is a perspective view showing a cartridge according to another embodiment of the present invention. [Figure 12] Figure 11 is a side cross-sectional view of a portion of the cartridge. [Figure 13] This is a side cross-sectional view showing some details of Figure 12. [Figure 14A] Figures 11 to 13 are cross-sectional side views showing the use of standoffs in the configuration. [Figure 14B] Figures 11 to 13 are cross-sectional side views showing the use of standoffs in the configuration. [Figure 15] This diagram shows the components of a test device used to control the voltage to individual electronic devices. [Figure 16] This is a flowchart showing the operation of the components in Figure 15. [Figure 17] This graph illustrates the voltage target change following the process shown in Figure 16. [Figure 18A] Figure 16 is a histogram showing the static filters to be executed. [Figure 18B] Figure 16 is a histogram showing the static filters to be executed. [Figure 19A] Figure 16 shows a histogram illustrating the outlier filter to be implemented. [Figure 19B] Figure 16 shows a histogram illustrating the outlier filter to be implemented. [Figure 20A] Figure 16 is a histogram showing the sample size filter to be executed. [Figure 20B] Figure 16 is a histogram showing the sample size filter to be executed. [Modes for carrying out the invention]

[0028]

[0046] Figure 1 of the attached drawings shows a test apparatus 10 according to an embodiment of the present invention, the test apparatus 10 including a test apparatus 12, a frame 14, a power bus 16, first and second slot assemblies 18A and 18B, a test apparatus cable 20, a power cable 22, a chilled liquid supply line 24A, a chilled liquid return line 24B, a control liquid supply line 24C, a control liquid return line 24D, a vacuum line 24E, first and second cartridges 28A and 28B, and first and second wafers 30A and 30B.

[0029]

[0047] The slot assembly 18A includes a slot assembly body 32, a thermal chuck 34, a temperature sensor 36, a heating resistor 38, a temperature correction device in the form of a first slot assembly connection 40, and a plurality of second slot assembly connection 40, the second slot assembly connection 40 including a control connection 44, a power connection 46, and a coolant supply connection 48A, a coolant return connection 48B, a control fluid supply connection 48C, a control fluid return connection 48D, and a vacuum connection 48E.

[0030]

[0048] The first slot assembly connection portion 40 is located inside the slot assembly body 32 and is attached to the slot assembly body 32. The control connection portion 44, the power connection portion 46, and the second connection portions in the form of connection portions 48A to 48E are attached to the left wall of the slot assembly body 32.

[0031]

[0049] The slot assembly 18A can be inserted into the frame 14 from left to right and removed from the frame 14 from right to left. The tester cable 20, power cable 22, and lines 24A to 24E are manually connected to the control connection section 44, power connection section 46, and connection sections 48A to 48E, respectively. Before removing the slot assembly 18A from the frame 14, the tester cable 20, power cable 22, and lines 24A to 24E are first manually disconnected from the control connection section 44, power connection section 46, and connection sections 48A to 48E, respectively.

[0032]

[0050] The slot assembly 18A includes a motherboard 60 having test electronics, a plurality of channel module boards 62 having test electronics, a flexible connector 64, and a connection board 66. The control connection section 44 and the power connection section 46 are connected to the motherboard 60, and the thermal controller 50 is mounted on the motherboard 60. The channel module boards 62 are electrically connected to the motherboard 60. The flexible connector 64 connects the channel module boards 62 to the connection board 66. Control functions are provided via a conductor connecting the control connection section 44 to the motherboard 60. Power is supplied to the motherboard 60 via the power connection section 46. Both power and control are supplied from the motherboard 60 to the channel module boards 62 via conductors. The flexible connector 64 provides a conductor connecting the channel module boards 62 to the connection board 66. The connection board 66 includes a conductor connecting the flexible connector 64 to the first slot assembly connection section 40. The first slot assembly connection section 40 is connected to the control connection section 44 and the power connection section 46 via various conductors so that power and control can be supplied to the first slot assembly connection section 40 via the control connection section 44 and the power connection section 46.

[0033]

[0051] The second slot assembly 18B contains the same components as the first slot assembly 18A, and the same reference numbers indicate the same components. The second slot assembly 18B is inserted into the frame 14, and the control connection section 44, power connection section 46, and connection sections 48A-48E of the second slot assembly 18B are each manually connected to a set of separate connection components, including a separate tester cable 20, a separate power cable 22, and separate lines 24A-24E.

[0034]

[0052] Cartridge 28A includes a cartridge body formed by a thin chuck 72 and a back plate 74. Multiple microelectronic devices are formed on a wafer 30A. The wafer 30A is inserted into the cartridge body between the thin chuck 72 and the back plate 74. Multiple cartridge contacts 76 contact each of the contacts (not shown) on the wafer 30A. Cartridge 28A further includes a cartridge connection portion 78 on the back plate 74. Conductors within the back plate 74 connect the cartridge connection portion 78 to the cartridge contacts 76.

[0035]

[0053] The cartridge 28A has a seal 77 connected between the back plate 74 and the thin chuck 72. Vacuum is applied to the area defined by the seal 77, the back plate 74 and the thin chuck 72. The vacuum compresses the cartridge 28A and ensures proper contact between the cartridge contact 76 and the contact on the wafer 30A.

[0036]

[0054] The temperature detector 36 is positioned within the thermal chuck 34 and is therefore close enough to the wafer 30A to detect its temperature, or within 5 degrees Celsius, preferably 2 degrees Celsius, of the wafer 30A.

[0037]

[0055] The slot assembly 18A further has a door 82 connected to the slot assembly body 32 by a hinge 84. When the door 82 rotates to the open position, the cartridge 28A can be inserted into the slot assembly body 32 through the door opening 86. The cartridge 28A is then lowered onto the thermal chuck 34 and the door 82 is closed. The thermal chuck 34 is attached to the slot assembly body 32. The thermal chuck 34 then forms a holder having essentially a test station for wafers.

[0038]

[0056] The slot assembly 18A further has a seal 88 located between the thermal chuck 34 and the thin chuck 72. Vacuum is applied to the region defined by the seal 88, the thermal chuck 34, and the thin chuck 72 via the vacuum connection portion 48E and the vacuum line 90. This provides a good thermal connection between the thermal chuck 34 and the thin chuck 72. When heat is generated by the heating resistor 38, the heat is conducted through the thermal chuck 34 and the thin chuck 72 to the wafer 30A. When the temperature of the thermal chuck 34 is lower than that of the wafer 30A, the heat is conducted in the opposite direction.

[0039]

[0057] The cartridge connection portion 78 engages with the first slot assembly connection portion 40. Power and signals are supplied to the wafer 30A via the first slot assembly connection portion 40, the cartridge connection portion 78, and the cartridge contact 76. The performance of the equipment within the wafer 30A is measured via the cartridge contact 76, the cartridge connection portion 78, and the first slot assembly connection portion 40.

[0040]

[0058] The door 82 of slot assembly 18B is shown in the closed position. A front seal 100 is attached to the upper surface of slot assembly 18A and seals the lower surface of slot assembly 18B. A front seal 102 is attached to the upper surface of slot assembly 18B and seals the lower surface of frame 14. The doors 82 and front seals 100 and 102 of slot assemblies 18A and 18B provide a continuous and sealed front wall 104.

[0041]

[0059] The slot assembly 18A further includes a thermal controller 50. A temperature sensor 36 is connected to the thermal controller 50 via a temperature feedback line 52. Power is supplied to the heating resistor 38 via a power connection section 46 and a power line 54 so that the heating resistor 38 is heated. The heating resistor 38 then heats the thermal chuck 34 and the wafer 30A on the thermal chuck 34. The heating resistor 38 is controlled by the thermal controller 50 based on the temperature detected by the temperature sensor 36.

[0042]

[0060] A thermal fluid passage 224 is formed in the thermal chuck 34. The thermal fluid passage 224 contains a thermal fluid. The thermal fluid is preferably a liquid rather than a gas because liquids are incompressible and heat convects more quickly with them. Different thermal fluids are used depending on the application, with oil being used for applications with the highest temperatures.

[0043]

[0061] The control fluid supply and return lines 226 and 228 connect the opposite ends of the thermal fluid passage 224 to the coolant supply and return connection sections 48C and 48D, respectively. The heating resistor 38 serves as a stationary heater that heats the thermal chuck 34, which heats the thermal fluid. By recirculating the thermal fluid through the thermal fluid passage 224, a more uniform heat distribution is applied to the thermal chuck 34 and ultimately to the wafer 30A by the thermal chuck 222. The fluid temperature can also be controlled to heat the thermal chuck 222 and cool the thermal chuck 34.

[0044]

[0062] The test apparatus 10 further includes a cooling system 240, a temperature control system 242, and a vacuum pump 244. Two chiller supply lines 24A connected to the first and second slot assemblies 18A and 18B are also connected to the cooling system 240 via a manifold (not shown). Additional manifolds connect chiller return line 24B to the cooling system 240, control fluid supply line 24C to the temperature control system 242, control fluid return line 24D to the temperature control system 242, and vacuum line 24E to the vacuum pump 244. Each slot assembly 18A or 18B has its own cooling plate 246 with its respective fluid passage 248. The cooling system 240 cools the cooling plates 246 by circulating fluid through the fluid passage 248. The cooling plates 246 then keep the channel module board 62 in a cooled state. The temperature control system 242 circulates fluid through the thermal fluid passage 224 to control the temperature of the thermal chuck 34 and to exchange heat with the wafers 30A and 30B. The vacuum pump 244 supplies air at vacuum pressure to the vacuum line 90.

[0045]

[0063] Slot assembly 18A includes a separator seal 108 attached to the upper surface of the slot assembly body 32 above its inner wall 106. The separator seal 108 seals the lower surface of slot assembly 18B. Slot assembly 18B has a separator seal 110 attached to the upper surface of its slot assembly body 32. The separator seal 108 seals the lower surface of the frame 14. The inner walls 106 of slot assemblies 18A and 18B and the separator seals 108 and 110 provide a continuously sealed separator wall 112.

[0046]

[0064] Figure 2 shows the test apparatus 10 of Figure 1 along section 2-2. The frame 14 defines the first closed-loop air path 120. The air inlet and outlet openings (not shown) can be opened to change the first closed-loop air path 120 into an open air path through which room temperature air passes through the frame 14 without recirculation. The closed-loop path is particularly useful in a cleanroom environment because less particulate matter is released into the air in a cleanroom environment.

[0047]

[0065] The test apparatus 10 further includes temperature correction equipment in the form of a first fan 122, a first fan motor 124, and a water cooler 126.

[0048]

[0066] The first fan 122 and the first fan motor 124 are mounted at the top of the first closed-loop air path 120. The water cooler 126 is mounted on the frame 14 within the top of the first closed-loop air path 120.

[0049]

[0067] Cartridges 28A and 28B are positioned together with slot assemblies 18A and 18B within the lower half of the first closed-loop air passage 120.

[0050]

[0068] During use, current is supplied to the first fan motor 124. The first fan motor 124 rotates the first fan 122. The first fan 122 recirculates the air clockwise through the first closed-loop air path 120.

[0051]

[0069] The water cooler 126 then cools the air in the closed-loop air path 120. The air then flows over the cartridge 28A or 28B through the slot assemblies 18A and 18B. The cartridge 28A or 28B is then cooled by the convection air.

[0052]

[0070] Figure 3 shows the test apparatus 10 of Figure 1 along line 3-3. The frame 14 defines the second closed-loop air path 150. The test apparatus 10 further includes temperature correction equipment in the form of a second fan 152, a second fan motor 154, and a water cooler 156. There are no electric heaters or dampers as shown in Figure 2. The air inlet and outlet openings (not shown) can be opened to change the first closed-loop air path 150 into an open air path through which room temperature air passes through the frame 14 without recirculation.

[0053]

[0071] The closed-loop path is particularly useful in a cleanroom environment because less particulate matter is released into the air in a cleanroom environment. The second fan 152 and the second fan motor 154 are positioned at the top of the second closed-loop air path 150. The water cooler 156 is located slightly downstream from the second fan 152 within the second closed-loop air path 150. The motherboard 60 and channel module board 62, which form part of the slot assemblies 18A and 18B, are located within the lower half of the second closed-loop air path 150.

[0054]

[0072] During use, current is supplied to the second fan motor 154, causing the second fan 152 to rotate. The second fan 152 then recirculates the air clockwise through the second closed-loop air path 150. The air is cooled by the water cooler 156. The cooled air then passes over the motherboard 60 and channel module board 62, and as a result, heat is conducted from the motherboard 60 and channel module board 62 to the air by convection.

[0055]

[0073] The air recirculating through the first closed-loop air path 120 in Figure 2 is separated from the air in the second closed-loop air path 150 in Figure 3 by a continuous sealed separation wall 112 shown in Figure 1. The continuous sealed front wall 104 shown in Figure 1 prevents air from escaping from the first closed-loop air path 120.

[0056]

[0074] As shown in Figures 2 and 3, the same cooling system 240 used in Figure 1 is also used to cool the water cooler 126. As shown in Figure 4, the plenum 160 separates the first closed-loop air path 120 from the second closed-loop air path 150 in all areas except those provided by the continuous sealed separator wall 112. The frame 14 has left wall 162 and right wall 164 that further define the closed-loop air paths 120 and 150.

[0057]

[0075] Figures 5A, 5B, and 5C illustrate how cartridges 30C, 30D, and 30E can be inserted or removed at any time, while all other cartridges are used to test equipment on a wafer and are under various temperature gradient conditions. Figure 6 shows details of this concept. At time T1, the first cartridge is inserted into the frame 14, while the second cartridge is outside the frame 14. At T1, heating of the first cartridge begins. Between T1 and T2, the temperature of the first cartridge rises from room temperature, i.e., approximately 22°C, to the test temperature at T2, which is 50°C to 150°C higher than room temperature. At T2, power is supplied to the first cartridge and the equipment inside the first cartridge is tested. At T3, the second cartridge is inserted into the frame 14 and heating of the second cartridge begins. At T4, testing of the first cartridge is completed. Cooling of the first cartridge also begins at T4. At T5, the second cartridge reaches the test temperature, power is supplied to the second cartridge, and the wafer inside the second cartridge is tested. At T6, the second cartridge reaches a temperature close to room temperature and is removed from the frame 14. The third cartridge can then be inserted in place of the first cartridge. At T7, the testing of the second cartridge is complete and its cooling begins. At T8, the second cartridge has cooled to room temperature or close to room temperature and is removed from the frame 14.

[0058]

[0076] Various tests can be conducted at various temperatures. For example, a cartridge can be inserted and the test can continue at room temperature. Another test can be conducted while the temperature rises. The test can continue further due to the increased temperature. Further tests can be conducted while the temperature falls. Two of these tests are single tests that progress from one temperature stage to the next.

[0059]

[0077] As shown in Figure 7, one slot assembly 18A is removable from or insertable into the frame 14. While slot assembly 18A is removable, other slot assemblies within the frame 14 can be used to test the equipment on the wafer, as described with reference to Figure 6.

[0060]

[0078] As shown in Figure 8A, the back plate 74 includes a circuit board 500, contactors 502, a number of pins 504, a fixing ring 506, fasteners 508, and support columns 510.

[0061]

[0079] The circuit board 500 is mainly made of insulating material, and a circuit (not shown) is formed inside it. A contact 512 is formed on the lower side 514 of the circuit board 500. A screw opening 516 is formed on the lower side 514.

[0062]

[0080] The contactor 502 has a plurality of pin openings 518, a support opening 520, and a fastener opening 522 formed through from the upper side 524 to the lower side 526. Each of the pin openings 518 has a first area 528 and a second area 530. The first and second areas 528 and 530 are both circular when viewed in a plan view. The diameter of the first area 528 is larger than that of the second area 530. Because the diameter of the first area 528 is larger than that of the second area 530, the first area 528 is wider than the second area 530 when viewed in the cross-sectional side view of Figure 8A.

[0063]

[0081] The column opening 520 has a first area 534 and a second area 536. Both the first area 534 and the second area 536 are circular when viewed in plan. The diameter of the first area 534 is larger than the diameter of the second area 536. Because the diameter of the first area 534 is larger than the diameter of the second area 536, the first area 534 is wider than the second area 536 when viewed in the cross-sectional side view of Figure 8A. The first and second areas 534 and 536 have vertical side walls. A horizontal landing 538 connects to the vertical side walls of the first and second areas 534 and 536.

[0064]

[0082] Each pin 504 includes a conductive retaining portion 542, a coil spring 544, and first and second end pieces 546 and 548. The first end piece 546 has a first inner portion 550 and a first tip 552. The second end piece 548 has a second inner portion 554 and a second tip 556. With the coil spring 544 positioned between the first and second inner portions 550 and 554, the coil spring 544 and the first and second inner portions 550 and 554 are held by the retaining portion 542. The first and second tips 552 and 556 protrude from the upper and lower ends of the retaining portion 542, respectively.

[0065]

[0083] The upper surface of the first tip 552 forms a terminal 560. The lower end of the second tip 556 forms a contact 562. The coil spring 544 and the first and second end pieces 546 and 548 are made of metal, and therefore conductive material. The coil spring 544 and the first and second end pieces 546 and 548 form a conductor that can conduct current between the terminal 560 and the contact 562.

[0066]

[0084] Each pin is inserted through the upper surface 524 into its respective pin opening 518. The second tip 556 is slightly smaller than the second section 530 and is designed to pass through the second section 530 and protrude from the lower side 526. The retaining portion 542 is slightly narrower than the first section 528 but wider than the second section 530 to prevent the pin 504 from slipping out from the lower side 526. Before the pin 504 is fully inserted into the pin opening 518 and the contactor 502 is mounted on the circuit board 500, the first tip 552 still protrudes above the upper surface 524 of the contactor 502.

[0067]

[0085] The support column 510 has a standoff 564, a force transmission section 566, and a force transfer section 568. The support column 510 is made from a single piece of metal or other material selected for its strength compared to the strength and brittleness of the ceramic material of the contactor 502.

[0068]

[0086] The support column 510 is inserted into the support column opening 520 through the upper part 524. The standoff 564 and force transmission section 566 are slightly narrower than the second section 536. The force transfer section 568 is slightly narrower than the first section 534 but wider than the second section 536. The lower surface 570 of the force transfer section 568 abuts against the landing 538. This prevents the support column 510 from coming out of the lower part 526.

[0069]

[0087] The support column 510 has a surface 572, which is in a plane parallel to and below the surface of the lower 526 when the support column 510 is fully inserted, as shown in Figure 8A. When the support column 510 is fully inserted, the force transfer portion 568 has a surface 574 that is in the same plane as the upper surface 524.

[0070]

[0088] The circuit board 500 is positioned on top of the contactor 502. Each of the contacts 512 contacts each of the terminals 560. Since the terminals 560 are in a plane above the plane of the upper part 524, the lower part 514 is initially spaced apart from the upper part 524.

[0071]

[0089] The fastener 508 has a threaded shaft 578 and a head 580. The ring 506 has a ring opening 582. The ring 506 is positioned on the underside 584 of the contactor 502. The threaded shaft 578 is inserted from the bottom through the ring opening 582 and then through the fastener opening 522. The head 580 comes into contact with the underside of the ring 506. The head 580 is rotated, and then the threads of the threaded shaft 578 are screwed into the threads of the threaded opening 516. The screwing motion brings the circuit board 500 closer to the contactor 502 and the ring 506. The lower side 514 eventually comes into contact with the upper side 524. The contact 512 moves its first end piece 546 downward into the pin opening 518 until the terminal 560 is flush with the upper surface 524. The coil spring 544 compresses and therefore deforms slightly, allowing the first end piece 546 to move relative to the second end piece 548.

[0072]

[0090] The lower part 514 has a region that is stationary with respect to the surface 574 which forms part of the support column 510. Since the support column 510 is in contact with the circuit board 500, the support column 510 is positioned to transmit force to the circuit board 500 through the surface 572.

[0073]

[0091] Multiple electronic devices are formed on the first wafer 32A. Each electronic device has multiple terminals 588 on the top surface 590 of the first wafer 32A. When the back plate 74 and the first wafer 32A are placed together, the first wafer 32A, in alignment with the back plate 74, ensures that one of each terminal 588 contacts one of the contacts 562.

[0074]

[0092] Vacuum pressure is generated in the region between the upper surface 590 and the lower side 526, while the pressure below the lower surface 592 of the thin chuck 72 and the upper surface 594 of the circuit board 500 remain at atmospheric pressure. Due to the pressure difference, opposing forces F1 and F2 of equal magnitude are generated on the circuit board 500 and the thin chuck 72.

[0075]

[0093] As shown in Figure 8B, forces F1 and F2 cause the back plate 74 to move relative to the wafer 32A and the thin chuck 72. The coil spring 544 compresses further, allowing the second end piece 548 to move into the pin opening 518. Each coil spring 544 deforms against its spring force, e.g., F3. However, the force F1 still exceeds the sum of all F3 added together. The top surface 590 eventually rests on the surface 572 of the standoff 564. The standoff 564 prevents the top surface 590 from approaching and contacting the underside 526 of the contactor 502 because the support column 510 abuts against the circuit board 500. The first wafer 32A transmits a force F4 to the standoff 564. The force transmitting portion 566 transmits the force F4 through the second area 536 of the support column opening 520. The force transfer section 568 receives the force F4 from the force transmission section 566 and transfers the force F4 to the circuit board 500 via the surface 574.

[0076]

[0094] Therefore, it is found that the force F4 is not transmitted by the contactor 502, thereby preventing stress that could cause damage to the brittle ceramic material of the contactor 502. Instead, the force F4 is transmitted directly from the electronic device in the form of the first wafer 32A through the support 510 to the circuit board 500.

[0077]

[0095] In the embodiments shown in Figures 8A and 8B, the contactor 502 serves as a support plate having a through-pillar opening 520. The circuit board 500 serves as a backing structure on the first side of the support plate and includes at least one circuit board having contacts 512. The pin 504 serves as a conductor having contacts 562 for contacting terminals 588 on the electronic device, which is positioned on the second side of the support plate opposite the first side of the support plate. The retainer 542 serves as part of the conductor held by the support plate. The conductor further has terminals 560 connected to contacts 512 on the circuit board 500. A spring in the form of a coil spring 544 is provided. The thin chuck 72 serves as a force generator on the opposite side of the support plate of the electronic device in the form of a first wafer 32A. The force generator and the support plate are movable relative to each other to move the electronic device closer to the support plate and deform the spring. The support column 510 has a standoff 564 having a surface 572 that is spaced apart from the plane of the surface of the support plate in order to prevent the electronic equipment from moving close to the support plate, a force transmission portion 566 extending from the standoff 564 and at least partially through the support column opening 520, and extending from the force transmission portion 566 to a force transfer portion 568, which is held in place by a backing structure.

[0078]

[0096] Figure 9A shows a portion of the test apparatus 10 used for inserting and removing cartridges into each slot assembly, for example, into slot assembly 18A. The components of the test apparatus 10 shown in Figure 9A include a frame 300, a portion of the first slot assembly 18A, a first slot assembly connection portion 40, a holding structure 302, a horizontal transfer device 304, a vertical transfer device 306, a beam spring 308, and a locking mechanism 310.

[0079]

[0097] The frame 300 includes first and second mounts 312 and 314 spaced apart from each other. The horizontal transfer device 304 is a slide mounted between the first and second mounts 312 and 314. The retaining structure 302 is mounted to slide along the horizontal transfer device 304. The opposite ends of the beam spring 308 are attached to the first and second mounts 312 and 314, respectively.

[0080]

[0098] The locking mechanism 310 includes a connecting lever 316, a control lever 318, and a pressure lever 320. The control lever 318 is attached to the first mount 312 at a pivot connection 322. The vertical transfer device 306 is a rigid beam. A connection 324 connects the center points of the vertical transfer device 306 and the beam spring 308 to each other. The pressure lever 320 has a first link 326 rotatably connected to the control lever 318 and a second link 328 rotatably connected to the end of the vertical transfer device 306. In the unlocked configuration shown in Figure 9A, line 330 connects the pivot connection 322 to the second link 328, and the first link 326 is on the left side of line 330.

[0081]

[0099] During use, the first cartridge 28A is placed on the retaining structure 302. The first cartridge 28A then moves from left to right into the first slot assembly 18A together with the retaining structure 302. The placement and movement of the first cartridge 28A can be performed manually or by a robot.

[0082]

[0100] The retaining structure 302 slides along the horizontal transfer device 304. The connecting lever 316 connects the end of the control lever 318 to the retaining structure 302. As the retaining structure 302 moves horizontally along the horizontal transfer device 304, the connecting lever 316 rotates the control lever 318 counterclockwise around the pivot connection 322.

[0083]

[0101] The first link 326 rotates counterclockwise together with the control lever 318. The pressure lever 320 converts the movement of the first link 326 into the downward movement of the second link 328. Initially, the downward movement is minimal, but once the first cartridge 28A is fully inserted into the first slot assembly 18A, the vertical movement becomes more pronounced, and the vertical transfer device 306 engages the first cartridge 28A with the first slot assembly 18A. The horizontal transfer device 304 is thus operable to move the first cartridge 28A horizontally from a first position to a second position, into the first slot assembly 18A, and the vertical transfer device 306 is operable to move the first cartridge 28A and the first slot assembly 18A in a first vertical direction relative to each other, thereby engaging the slot assembly connection portion 40 with the cartridge connection portion on the first cartridge 28A.

[0084]

[0102] In Figure 9A, the control lever 318 is shown in the unlocked position, with the first link 326 on the first side of line 330 connecting the pivot connection 322 and the second link 328. The control lever 318 rotates from the unlocked position shown in Figure 9A through the compressed position, in which the beam spring 308 is deformed by the vertical transfer device 306 through the connection 324 by bending the beam spring 308 against its spring force, and the first link 326 coincides with the pivot connection 322 and the second link 328. As shown in Figures 9B and 10, the control lever 318 continues to rotate from the compressed position to the locked position. In the locked position, the first link 326 is on the right side of line 330, and therefore on the second side opposite the first side of line 330. As the first link 326 passes through the line 330 and the beam spring 308 deforms against its spring force, the first cartridge 28A is locked in place relative to the slot assembly connection portion 40.

[0085]

[0103] The system can be unlocked by moving the retaining structure 302 from right to left. The control lever 318 rotates clockwise, and the first link 326 moves from right to left through line 330. The vertical transfer device 306 moves upward, i.e., in the second vertical direction opposite to the first vertical direction, to release the first cartridge 28A from the slot assembly connection portion 40. As the retaining structure 302 moves further along the horizontal transfer device 304, the first cartridge 28A is removed from the first slot assembly 18A.

[0086]

[0104] Figure 11 shows a cartridge 340 according to a further embodiment of the present invention, which includes a thermal subassembly 342, a board and socket subassembly 344, and a plurality of lids 346.

[0087]

[0105] Figure 12 shows a portion of the thermal subassembly 342, a portion of the board and socket subassembly 344, and one of the covers 346.

[0088]

[0106] Figure 13 shows detail A of Figure 12, including part of the thermal subassembly 342, part of the board and socket subassembly 344, and part of the cover 346. Figure 13 further shows the first electronic device 348.

[0089]

[0107] The thermal component assembly 342 includes a thin chuck 350, a first thermal fastener 352, and a first thermal support 354. The thin chuck 350 has an upper surface 356 with an opening 358 formed therein. The first thermal fastener 352 and the first thermal support 354 are machined from a single piece of metal. Both the first thermal fastener 352 and the first thermal support 354 have a circular cross-section in their respective planes parallel to the axis of the first thermal support 354 when viewed in plan. The cross-section of the first thermal fastener 352 is larger than that of the first thermal support 354.

[0090]

[0108] The first heat retainer 352 is inserted into the opening 358 through the top surface 356. The first heat support 354 extends upward from the first heat retainer 352. The majority of the first heat support 354 is positioned above the top surface 356. The first heat retainer 352 has an upper end with a first heat surface 360. The first heat retainer 352 is pressed into the opening 358 to a desired depth, with the first heat surface 360 ​​at a desired distance from the top surface 356.

[0091]

[0109] The first heat support column 354, the first heat fastener 352, and the thin chuck 350 are all made of metal and therefore are good heat conductors. Compared to the cross-section of the first heat support column 354, the cross-section of the first heat fastener 352 conducts more heat from the first heat fastener 352 to the thin chuck 350.

[0092]

[0110] The board and socket subassembly 344 includes a circuit board 362, a socket 364, a first set of pins 366 for electronic equipment, and a first set of pins 368 for a detector. Pins 366 and 368 are pogo pins with springs that can be compressed against the spring force.

[0093]

[0111] Socket 364 includes a lower section 370 and an upper section 372. One pin each of pins 366 and 368 is held within the socket 364 between the lower section 370 and the upper section 372. The upper section 372 is provided with a first recessed configuration 376 for holding the first electronic device 348. One pin each of pins 366 has a corresponding contact 378 extending above the surface of the first recessed configuration 376. One pin each of pins 368 has a corresponding contact 380 extending above the upper surface 382 of the upper section 372.

[0094]

[0112] All contacts 380 of pin 368 are on the same plane. All contacts 378 of pin 366 are on the same plane. The plane of contact 380 is parallel and lies on the plane of contact 378. All terminals 392 of pin 368 are on the same plane as terminals 392 of pin 366.

[0095]

[0113] A circuit (not shown) is formed on the circuit board 362. A contact 388 is formed on the upper surface 390 of the circuit board 362.

[0096]

[0114] The socket 364 is positioned on the circuit board 362, which is thus positioned between the thin chuck 350 and the socket 364. One of each of the pins 366 and 368 initially has a terminal 392 that extends below the lower surface 394 of the lower part 370. One of each terminal 392 is in contact with one of the contacts 388. The pins 366 and 368 compress against their spring force until the lower surface 394 contacts the upper surface 390. The terminals 392 of the pins 366 and 368 move into the socket 364 until they are flush with the lower surface 394. The socket 364 is then permanently attached to the circuit board 362.

[0097]

[0115] The socket 364 has a first socket thermal opening 398 formed through from bottom to top. The circuit board 362 has a first circuit board thermal opening 400 formed through from bottom to top. The first socket thermal opening 398 is aligned with the first circuit board thermal opening 400. As shown in Figure 11, the thermal subassembly 342 and the board and socket subassembly 344 are initially separated from each other. The board and socket subassembly 344 is then positioned above the thermal subassembly 342. The first circuit board thermal opening 400 is positioned above the upper end of the first thermal support 354. The board and socket subassembly 344 then descends further until the first thermal support 354 passes through the first socket thermal opening 398. The lower surface 402 of the circuit board 362 rests on the upper surface 356 of the thin chuck 350. The first thermal support 354 is loosely fitted into the first socket thermal opening 398 and the first circuit board thermal opening 400. The first thermal support 354 extends above the upper surface 356 because it is slightly longer than the combined length of the first socket thermal opening 398 and the first circuit board thermal opening 400. The first thermal surface 360 ​​is therefore positioned slightly above the upper surface of the first recess configuration 376. The contact 378 is positioned in a plane above the plane of the first thermal surface 360 ​​at this stage.

[0098]

[0116] The socket 364 is made of an electrically and thermally insulating material. Pins 366 and 368 provide conductors through the socket 364. The circuit board 362 is also made of an electrically and thermally insulating material. Contacts 388 form part of the electrical circuit within the insulating material of the circuit board 362. The first heat support 354 provides a heat conduction path between the first recess configuration 376 and the first heat retainer 352 connected to the thin chuck 350. The first heat support 354 is electrically and thermally insulated from the conductors in the socket 364 and the circuit board 362. Heat is conducted primarily through the first heat support 354, in contrast to the insulating material of the socket 364 and the insulating material of the circuit board 362.

[0099]

[0117] The cover 346 includes a circuit board 406 and a heat sink 408. The cartridge 340 further includes a first photodetector 410, a first adjustable component 412 and a first coil spring 414.

[0100]

[0118] The circuit board 406 is made of an electrically and thermally insulating material. Conductive terminals 416 are formed on the lower surface 418 of the circuit board 406. The terminals 416 form part of a circuit (not shown) formed within the circuit board 406.

[0101]

[0119] The first photodetector 410 is mounted on the top surface 420 of the circuit board 406. The first photodetector 410 is connected to terminals 416 via a circuit within the circuit board 406. One of terminals 416 can, for example, supply power to the first photodetector 410. When light strikes the first photodetector 410, the first photodetector 410 converts the light energy into power. The other terminal 416 can serve as an output contact connected to the first photodetector 410 to measure the output power.

[0102]

[0120] The first adjustable component 412 has a press plate 422, a side wall 424 extending upward from the press plate 422, and a rim 426 extending outward from the side wall 424. A first opening 428 is formed in the circuit board 406. The first adjustable component 412 is inserted into the first opening 428. The press plate 422 then extends downward from the bottom surface 418. The rim 426 rests on the top surface 420. The first opening 428 is slightly larger than the width between the side walls 424. Due to the difference in width, the first adjustable component 412 is rotatable only a few degrees around the first axis 432 relative to the circuit board 406. Due to the difference in width, the first adjustable component 412 is also rotatable clockwise and counterclockwise relative to the circuit board 406 about a second axis 434 that intersects the plane of the paper and is perpendicular to the first axis 432. Such orthogonal rotations allow the first adjustable component 412 to perform a small amount of gimbal motion relative to the circuit board 406.

[0103]

[0121] The heatsink 408 has a first recess 436. A first coil spring 414 is inserted between the side walls 424. The lower end of the first coil spring 414 rests on the upper surface 438 of the press plate 422. The upper end of the first coil spring 414 extends above the rim 426. The heatsink 408 is positioned above the circuit board 406 with the upper end of the first coil spring 414 positioned within the first recess 436. The lower surface 440 of the heatsink 408 is initially separated from the upper surface 420. As the heatsink 408 moves toward the circuit board 406, the first coil spring 414 compresses and deforms against its spring force. The lower surface 440 comes into contact with the upper surface 420. The heatsink 408 is then secured to the circuit board 406 with fasteners (not shown). The small force generated by the first coil spring 414 then biases the first adjustable component 412 toward exiting the lower surface 418.

[0104]

[0122] The press plate 422 has a first opening 442 inside it. The heat sink 408 has a first cavity 444. A light-absorbing coating is formed on the surface of the first cavity 444.

[0105]

[0123] During use, the first electronic device 348 is inserted into the first recess configuration 376. The lower terminals 446 of the first electronic device 348 make contact with the contacts 378. At this stage, the lower surface 448 of the first electronic device 348 is separated from the first thermal surface 360.

[0106]

[0124] The cover 346 is positioned above the board and socket subassembly 344. The cover 346 then moves toward the board and socket subassembly 344. One of each of the terminals 416 makes contact with one of each of the contacts 380. The lower surface 450 of the press plate 422 makes contact with the upper surface 452 of the first electronic device 348. The lower surface 448 of the first electronic device 348 remains separated from the first thermal surface 360.

[0107]

[0125] The operator manually pushes the cover 346, thereby moving the cover 346 further toward the board and socket subassembly 344. One of each of the pins 366 and 368 compresses against its spring force, thus elastically pushing down the contacts 378 and 380 against the spring force of the springs in the pins 366 and 368. The lower surface 448 of the first electronic device 348 comes into contact with the first thermal surface 360.

[0108]

[0126] If there is an angular misalignment between the first thermal surface 360 ​​and the underside 448 of the first electronic device 348, the first electronic device 348 is rotated by the first thermal surface 360 ​​until its underside 448 is flush with the first thermal surface 360. By rotating the first adjustable component 412 relative to the lid 346, the underside 448 of the first electronic device 348 can rest on the first thermal surface 360. Good thermal contact between the first thermal surface 360 ​​and the underside 448 is thus ensured. The first coil spring 414 compresses to adjust the height of the first electronic device 348. Furthermore, the first adjustable component 412 is rotatably mounted on the lid 346, and as a result, the first electronic device 348 can rotate the first adjustable component 412 relative to the first thermal surface 360. The lid 346 is then secured to the board and socket subassembly 344.

[0109]

[0127] The socket 364 and cover 346 together form an electronics holder that holds the first electronic device 348. A cartridge connection portion (not shown) on the circuit board 362 exchanges power and communication with contact 388. Pins 366 supply power and communication to the first electronic device 348 via terminal 446.

[0110]

[0128] The first electronic device 348 may include, for example, a laser or other light transmitter. The first electronic device 348 may have, for example, a laser transmitter on its upper surface 452. When power and communication are supplied to one of the contacts 378 which serve as an input contact and one of the terminals 446 which serve as an input terminal, the laser transmitter of the first electronic device 348 transmits laser light through the first opening 442 and through the first coil spring 414 and the side wall 424 into the first cavity 444.

[0111]

[0129] Most of the light is absorbed by the light-absorbing material on the surface of the first cavity 444 and converted into heat. The heat is conducted through the heat sink 408.

[0112]

[0130] A small percentage of the light is reflected off the surface of the first cavity 444 and detected by the first photodetector 410. The first photodetector 410 is powered through a conductor formed by one of the contacts 388, one of the pins 368, and one of the terminals 416, and through a circuit formed in the circuit board 406. When the first photodetector 410 detects light, it converts the light into electricity. The magnitude of the electricity is related to the magnitude of the light detected by the photodetector 410. The first photodetector 410 then supplies power to the circuit board 362 via a conductor, which is formed by a circuit in the circuit board 406, one of the terminals 416, one of the pins 368, and one of the contacts 388, and the power is ultimately supplied to the cartridge connection portion on the circuit board 362.

[0113]

[0131] Circuit board 406 and pin 368 provide a measurement channel that connects the first photodetector 410 to circuit board 362, even if the first photodetector 410 is located on the opposite side of the first electronic device 348 rather than on circuit board 362. In a similar manner, other types of detectors other than photodetectors can be used to detect functions of the electronic device other than light emitted by the electronic device. For example, it is possible to detect the current at a terminal on the top surface of the electronic device and generate a similar measurement channel via pins located in a socket that extends to the circuit board above the electronic device and the circuit board below the electronic device. In such a configuration, pins such as pin 368 can serve as detector measurement pins that are held by the socket and form part of the measurement channel.

[0114]

[0132] The temperature of the first electronic device 348 is controlled by conducting heat through the first heat support 354. The first electronic device 348 can be heated or cooled, for example, via the first heat support 354. The first electronic device 348 can be cooled, for example, by conducting heat from the first electronic device 348 to the thin chuck 350 through the first heat support 354 and the first heat fastener 352. The first electronic device 348 can be heated by conducting heat from the thin chuck 350 to the first electronic device 348 through the first heat fastener 352 and the first heat support 354.

[0115]

[0133] The thin chuck 350 is located on the first side of the electronic device 348 opposite to the heat sink 408. Thus, it can be seen that the temperature of the first electronic device 348 can be controlled independently of the heat dissipation by the heat sink 408 thanks to the laser light transmitted by the first electronic device 348.

[0116]

[0134] Referring again to Figure 12, multiple electronic devices can be tested using one socket 364 and one cover 346. The socket 364 includes, for example, a second thermal fastener 352A, a second thermal support 354A, a second thermal surface 360A, a second tweezers 366A for a second electronic device, a second tweezers 368A, a second recess configuration 376A for a second electronic device (not shown), a second socket thermal opening 398A, a second circuit board thermal opening 400A, a second photodetector 410A, a second adjustable component 412A, a second coil spring 414A, a second opening 428A, a second recess 436A, a second opening 442A, and a second cavity 444A. Similar reference numbers indicate similar components and functions.

[0117]

[0135] Light transmitted by the first and second electronic devices can be independently detected by the first and second photodetectors 410 and 410A. The heat resulting from the light emitted by the first and second electronic devices is dissipated through the same heatsink 408. Multiple fins 454 are connected to and extend from the heatsink 408. Heat is conducted through the fins 454 and then convected from the fins 454 into the surrounding air. The fins 454 thus serve as heat dissipation devices, thermally connected to the heatsink 408 and removing heat from the heatsink 408.

[0118]

[0136] The temperatures of the first and second electronic devices are controlled together through the same thin chuck 350. When the electronic devices are being cooled, for example, heat is transferred through the first and second heat supports 354 and 354A to the first and second heat fasteners 352 and 352A, respectively, and then from the first and second heat fasteners 352 and 352A to the thin chuck 350.

[0119]

[0137] The first and second electronic components are independently rotatable so as to contact the first and second thermal surfaces 360 and 360A, respectively. The independent rotation of the first and second electronic components is permitted and controlled by the gimbal motion of the first and second adjustable components 412 and 412A relative to the lid 346.

[0120]

[0138] Referring again to Figure 11, sixteen sockets 364 are mounted on the circuit board 362. Each socket 364 has its own cover 346. Each cover 346 has its own fixing configuration 460, and each socket 364 has its own fixing configuration 462. The cover 346 moves toward the socket 364. As previously mentioned, the cover 346 is then pressed against the socket 364. The fixing configurations 460 and 462 then engage with each other to secure the cover 346 to the socket 364, maintaining thermal and electrical integrity.

[0121]

[0139] The thin chuck 350 has multiple thermal supports fixed to it in 16 groups of 16. Each group of thermal supports is inserted through one of the sockets 364. The electronic equipment held by all 16 sockets 364 is maintained at their temperature using a single thin chuck 350.

[0122]

[0140] The cartridge connection portion 464 is formed on the underside of the circuit board 362. The cartridge connection portion 464 is connected to the contact 388 shown in Figure 13 via a circuit (not shown). The cartridge connection portion 464 is used to connect the cartridge 340 to the electrical tester, as described above. The thin chuck 350 is thermally connected to the thermal chuck, as described above. The thermal chuck serves as a temperature compensator to control the heat exchanged between the thin chuck 350 and the thermal chuck.

[0123]

[0141] Following the testing of the electronic components, cartridge 340 is removed from the system, lid 346 is removed, and the electronic components are removed from socket 364.

[0124]

[0142] The thermal support 354 also serves as a force-transmitting support in a manner similar to that of the embodiments described in Figures 8A and 8B. The cover 346 serves as a force generator. Part of the force generated by the cover 346 is balanced by the force generated by the springs in pins 366 and 368. The remaining force not balanced by pins 366 and 368 is absorbed by the standoff of the support 354 having a surface 360, thereby supporting the electronic equipment 348 and preventing it from moving towards the base of the recessed configuration 376. The central portion of the support 354 serves as a force-transmitting portion extending from the standoff through the opening 398. The circuit board 362 and the thin chuck 350 together form a backing structure. The lower part of the support 354 generally transfers force to the backing structure. Specifically, the force is transmitted through the thermal fastener 352 to the thin chuck 350, which forms part of the backing structure. The press-fit between the heat fastener 352 and the thin chuck 350 is strong enough to maintain its position, and as a result, the force does not move the heat fastener 352 relative to the thin chuck 350.

[0125]

[0143] Figure 14A shows embodiments of Figures 11, 12, and 13, and further details thereof, including the fastener 600 and the support column 602.

[0126]

[0144] A support opening 604 and a fastener opening 606 are formed through the socket 364. The support opening 520 has a first area 608 and a second area 610. The second area 610 is wider than the first area 608. The first area 608 can be formed, for example, by passing through the upper part 372, and the second area 610 can be formed by passing through the lower part 370. A landing 612 connects the first area 608 to the second area 610.

[0127]

[0145] The support column 602 includes a standoff 614, a force transmission section 616, and a force transfer section 618. The support column 602 is inserted from the bottom into the support column opening 604 until the surface 620 of the force transfer section 618 contacts the landing 612. The threaded shaft 622 of the clamp 600 is inserted from the top through the clamp opening 606. The head 624 is rotated so that the threads on the threaded shaft 622 are screwed into the threads of the threaded opening 626 of the thin chuck 350. The thin chuck 350, being made of metal, provides excellent fastening for the clamp 600. As the clamp 600 rotates further, the head 624 moves closer to the circuit board 362. The spring of the pin 366 compresses slightly, and the lower side 630 of the support column 602 contacts the circuit board 362.

[0128]

[0146] As shown in Figure 14B, when the operator presses the cover 346 against the socket 364, the press plate 422 generates a force F1 equal in magnitude to and opposite in direction to the reaction force F2 generated in the thin chuck 350. The spring of the pin 366 compresses against the spring force F3 of the spring. The press plate 422 and the first electronic device 348 continue to move closer to the socket 364 until the lower surface 448 of the electronic device 348 contacts the surface 632 of the standoff 614. The surface 632 prevents the electronic device 348 from moving further toward the socket 364.

[0129]

[0147] The standoff 614 receives a force F4 from the electronic equipment 348. The force transmission section 566 transmits the force through the first section 608 of the column opening 604. The force transfer section 618 receives the force from the force transmission section 566 and transmits the force to the circuit board 362. The circuit board 362 transfers the force to the thin chuck 350.

[0130]

[0148] Therefore, it can be seen that the material of socket 364 is not subjected to force F4, thereby eliminating damage to socket 364.

[0131]

[0149] A socket 364 provides a support plate having a through-hole 604. A circuit board 362 provides a backing structure to the first side of the support plate and has a contact 388. A pin 366 forms a conductor with a contact 378, which contacts a terminal 446 on the electronic device 348 positioned on the opposite side of the first side of the support plate. The conductor has a portion held by the support plate and a terminal 392 connected to the contact 388 on the circuit board 362. A spring is provided within the pin 366. A push plate 422 forms a force generator on the side of the support plate opposite the electronic device 348. The force generator and the support plate are movable relative to each other, moving the electronic device 348 closer to the support plate and deforming the spring. The support column 602 has a standoff 614 with a surface 632 that is spaced apart from the plane of the support plate surface, thereby preventing the electronic device 348 from moving closer to the support plate. The force transmission section 616 extends at least partially from the standoff 614 through the column opening 604. The force transfer section 618 extends from the force transmission section 616. The force transfer section 618 is held in place by a backing structure.

[0132]

[0150] Figure 15 shows further components of the test apparatus 10 used to precisely control the voltage supplied to the electronic equipment 634 under test. The electronic equipment 634 can be, for example, placed across the entire surface of a wafer 636, or it can be individual devices held within a socket layout.

[0133]

[0151] Many semiconductor devices require a constant current source in addition to a constant voltage power supply. An example of this is burn-in testing (or aging) of vertical cavity surface-emitting laser (VCSEL) wafers. The following problems arise: • In VCSEL wafers, a very large number of instruments are located in a very small area. For example, consider a VCSEL wafer with 50,000 instruments within a 7.6 cm circle. The cost of 50,000 constant-current power supplies makes cost-effective burnout testing too expensive for the system. ・Routing 50,000 power lines within a 7.6 cm circle is extremely difficult, if not impossible.

[0134]

[0152] For further explanation, let us assume the following: Since VCSELs are diodes, there is almost no power that would short-circuit them to ground. • "Open" events may occur much more frequently, caused by the VSCELS being "open" or poor contact with the wafer. • The internal resistance of the VCSEL is high (approximately 100 ohms per 10mA VCSEL) and very consistent across the entire wafer (within 1%). • It is highly likely that you can build a very accurate (within 1%) voltage source. • It can measure the current of a voltage source with considerable accuracy. Most VCSEL wafers have a common cathode that limits the ability to place VCSELs in series. For the sake of explanation, we will assume the following: • VCSEL burnout testing requires approximately 2.5 volts and 10 mA. Assume a system with 1024 power channels, each with up to 5 volts and 200 mA. The system is assumed to be able to supply a constant current or constant voltage to each channel. • Assume the goal is to perform burn testing on a 1 / 4 wafer (12,500 VCSELs) in a single step.

[0135]

[0153] The following is a list of existing burnout test circuit options. (1) Individual constant current sources. This provides a precise and measurable current to every VCSEL, but the following problems arise: Only about 2% of the wafer can be tested for burn-in at each step (1024 channels vs. 50,000 instruments). • The "cost" per VCSEL is 1 channel. Even if additional channels can be added, the cost remains 1 channel per VCSEL. Even if the system can be expanded to 12,500 channels (the minimum number of channels required for burn testing on one-quarter of a wafer), routing 12,500 power channels within a 7.6 cm wafer area is impossible or prohibitively expensive. (2) Series wiring. This requires arranging approximately 13 VCSELs in series and driving them with a constant current source, but the following problems arise. Since all VCSELs share a common cathode, VCSEL wafers cannot be wired in series. This requires a current source of 10mA and 30 volts or more. Protecting such high voltages from overcurrent is extremely difficult. (3) Parallel wiring with the current source. Approximately 13 VCSELs will be driven in parallel with a constant current source. This requires a 2.5-volt, 130mA current source. This system has the following problems: For any VCSEL with an "open" or faulty probe contact, the excess current is distributed among the remaining VCSELs in the group. Thus, each VCSEL receives approximately 8% of the excess current for any faulty VCSEL in the group (130mA / 12 VCSELs). If the voltage does not shift significantly due to an open VCSEL, the other 12 VCSELs may not know that they received the wrong burnout test current, and the faulty device may escape detection. (4) Parallel wiring with a voltage source. Such a system drives 13 VCSELs in parallel with a constant voltage source. The voltage source is selected to provide the voltage required for all 13 VCSELs to receive a current of 10 mA. This system has the following problems: • If a VCSEL is open, the total current within the group will be slightly lower. For every open VCSEL, the group current will be 10mA lower (e.g., 140mA per group compared to 150mA). The remaining VCSELs in the group will still receive 10mA. • The current stability per VCSEL within the group is very good. In the worst case, this is due to the accuracy of the voltage supply (<1%) and the consistency of the internal resistance of the good VCSELs (<1% across the wafer). Therefore, the current flowing through each VCSEL is consistent within 2% across the wafer using a parallel voltage source. • If a VCSEL shorts out (very low), the power channel's overcurrent protection will shut down that power channel, while the other channels remain operational.

[0136]

[0154] Therefore, existing solutions can be summarized as follows: Circuit 1 is an ideal circuit, but it is excluded due to cost and technical issues. Circuit 2 is not possible with a common cathode VCSEL wafer. Circuit 3 yields very poor results in "open" devices, which is the most common failure mode. Circuit 4 yields very good results in almost all cases and is extremely cost-effective.

[0137]

[0155] Circuit 4 (parallel wiring with the voltage source) has the following problems: • The appropriate voltage must be selected so that the voltage source for the VCSEL receives the correct current. The appropriate voltage is a function of several factors. • Construction of a VCSEL. The design of the VCSEL determines the voltage at the desired current. The VCSEL assembly process differs from wafer to wafer. Due to process variations, the voltage at a given current may differ from wafer to wafer. • Variations in the VCSEL assembly process across the entire wafer. The voltage at a given current may differ between equipment near the wafer edge and equipment in the wafer center. The voltage at a given current fluctuates with temperature. Not only the heat applied for the burn test, but also internal heating of the equipment itself can change the voltage at a given current. As a VCSEL ages, its voltage / current relationship shifts. Therefore, even if the voltage is accurate at the start of a burnout test cycle, the correct voltage at the end may be lower.

[0138]

[0156] Figure 15 shows only the electronic devices 634 of the first group (Group 1), which consists of clusters (Clusters 1 to 4) located in the region near the periphery of the wafer 636. Please understand that there are 16 groups of clusters (Groups 1 to 4), each group has 64 clusters, and each cluster has 12 electronic devices 634.

[0139]

[0157] The electronic devices 634 of the first cluster (cluster 1) are connected in parallel to each other via conductors that form part of the wafer 636, or by external devices that form part of the test apparatus 10. Further clusters of electronic devices (not shown) (clusters 2 to 4) are located in further areas of the first group (group 1). Each cluster has its own set of 12 electronic devices connected in parallel to each other. The electronic devices forming one cluster are not electrically connected to any electronic devices that form part of another cluster.

[0140]

[0158] The test apparatus 10 includes a cluster selection switch 638, a current detector 640, a static filter 642, an outlier filter 644, a sample size filter 646, a voltage target system 648, a voltage source 650, and first and second voltage regulators 652 and 654.

[0141]

[0159] Each cluster supplies a separate current output to the cluster selection switch 638. The cluster selection switch 638 is adjustable to selectively connect one current detector 640 to each of the current outputs 660. The current from each current output 660 passes through the current detector 640 and reaches ground 662.

[0142]

[0160] The cluster selection switch 638 typically operates to connect one of each of the current outputs 660 to the current detector 640. The current detector 640 then detects current from one of each cluster.

[0143]

[0161] The current detector 640 supplies an output to the static filter 642. The static filter 642 is adapted to remove current readings for each cluster that are above or below a set limit. Generally, the static filter 642 processes data for all clusters simultaneously and removes data for clusters that have current readings above or below a set limit.

[0144]

[0162] The static filter 642 passes the data to the outlier filter 644. The outlier filter 644 removes current readings for each cluster that are far from or below the median for the group of clusters. The outlier filter 644 passes the data to the sample size filter 646. The sample size filter 646 stops calculating the average current readings for clusters containing a cluster if the number of channels (devices) for that cluster is too small.

[0145]

[0163] The voltage source 650 is connected to the input voltage terminals of the first group of electronic devices 634 via a voltage regulator 652. The voltage source 650 is further connected to the input terminals of the second group of electronic devices via a voltage regulator 654. Similarly, the voltage source 650 is connected to further groups of electronic devices of multiple groups via further voltage regulators (not shown).

[0146]

[0164] The voltage target system 648 receives data from the sample size filter 646 and adjusts the voltage regulators 652 and 654 based on that data.

[0147]

[0165] Figure 16 shows a method for testing multiple electronic devices 634 using the components of the test apparatus 10 shown in Figure 15.

[0148]

[0166] In step 700, the multiple electronic devices are held in a cluster as described above. In 702, the voltage source 650 is connected to the electronic devices 634 of the first cluster. As described above, the voltage source 650 is connected to the electronic devices 634 to supply voltage simultaneously to the multiple electronic devices 634 of the first cluster. In 704, the voltage source 650 is connected to the electronic devices of the second cluster via the voltage regulator 652 to supply voltage simultaneously to the multiple electronic devices of the second cluster. Similarly, in 706, the voltage source 650 is connected to the electronic devices of the third cluster via the voltage regulator 652 to supply voltage simultaneously to the multiple electronic devices of the third cluster. The voltage source 650 can similarly be connected to further clusters of electronic devices via the voltage regulator 652 to supply voltage simultaneously to the electronic devices of each cluster.

[0149]

[0167] Referring to Figure 17, the slope of the curve is calculated by first determining the voltage estimates "A" and "B". Steps 708 to 724 in Figure 16 correspond to the calculation of the slope.

[0150]

[0168] At 708, the first initial voltage estimation "V A The process is carried out, and the current detector 640 in Figure 15 is used to determine the resulting first initial current "I A The following is measured. The voltage source 650 in Figure 15 simultaneously estimates the first initial voltage for the electronic equipment 634 of the first cluster. The second, third, and subsequent clusters are processed in the same way as the first cluster. For example, the voltage source 650 simultaneously estimates the first initial voltage for the electronic equipment of the second cluster.

[0151]

[0169] The cluster selection switch 638 in Figure 15 is sequentially switched via the current outputs 660 from each cluster of the first group. When the cluster selection switch 638 is connected to the current output 660 of the first cluster, the current detector 640 measures a first initial current from the electronics 634 of the first cluster. The first initial current from the electronics 634 of the first cluster, as measured by the current detector 640, is the total current of the multiple electronics 634 to which the voltage of the first cluster is supplied simultaneously. When the cluster selection switch 638 is switched to the current output 660 of the second cluster, the second cluster is processed in the same way as the first cluster, as shown by the dashed line between steps 704 and 710 in Figure 16. Similarly, by continuing to switch the cluster selection switch 638 to subsequent current outputs 660, the current detector 640 measures a first initial current for the electronics for each respective cluster.

[0152]

[0170] The current detector 640 supplies current measurements to the static filter 642 in Figure 15. As is clearly visible in Figure 16, a multi-stage filter 710 is performed, including a static filter 712, an outlier filter 714, and a sample size filter 716. As shown in Figure 16, the static filter 642 in Figure 15 performs static filtering in 712.

[0153]

[0171] Figure 18 shows the details of the static filter. Individual currents from the first and second groups are displayed. The static filter removes current measurements that are above or below the set limits, for example, current measurements below 2 and above 6. The static filter can, for example, remove the first initial current readings for each cluster within each group that are above and below the set limits. Any given cluster may have an "open" VCSEL and therefore may not return the correct total current for all VCSELs. The current limits are used to determine whether any given reading appears to be accurate.

[0154]

[0172] Following static filtering, the data is processed at 714 in Figure 16, and outlier filtering is performed using outlier filter 644 in Figure 15. Figure 19 shows the outlier filter in detail. The outlier filter removes data that is extremely above or below the median of the data, for example, by + / - 20%. The outlier filter removes, for example, the first initial current measurement of each cluster that is extremely above or below the median of the group. Additional filtering can be used using statistical methods to determine whether the first current reading of a given channel is abnormal.

[0155]

[0173] Following the outlier filter, the data is processed at 714 in Figure 16, and a sample size filter is performed using the sample size filter 646 in Figure 15. The sample size filter is shown in Figure 20. The sample size filter stops calculating the average of the first current readings of a group if the number of remaining clusters is too small, for example, <10. If there are too few clusters remaining in any group for a proper calculation, the average calculation of the surrounding groups can be used. Two sample groups are included to show the progress of the filter. After the outlier filter, the second group has too few clusters remaining for a reliable calculation of the voltage. In that case, the average of the other group is used.

[0156]

[0174] In Figure 16, at 720, the second voltage estimation "V" B A second initial current "I" is created and applied, resulting in a second initial current "I" B The following is measured. The second initial voltage estimate is applied in the same way as the first initial voltage estimate in 708. The second initial voltage current is measured for each cluster.

[0157]

[0175] At 722, a multi-stage filter is applied to the data, including the second initial current from the cluster. The multi-stage filter applied at 722 is the same as the multi-stage filter applied at 710.

[0158]

[0176] FIG. 17 shows positions of the first and second initial currents after passing through the multi-stage filter at 710 and 722. Measured current values are displayed on the Y-axis, and time is displayed on the X-axis. The current gradient is given by the following equation. Gradient=(V B -V A ) / (I B -I A )

[0159]

[0177] The gradient is thus calculated by dividing the difference between the second and first initial voltages for the first group of electronic devices by the difference between the second and first initial currents for the first group of electronic devices.

[0160]

[0178] The steps 708, 712 and 724 described above are executed by the voltage target system 648 of FIG. 15. The voltage target system 648 controls the voltage regulator 652 to supply voltage to the electronic devices of each cluster. The voltage target system 648 then stores the calculated gradient in a memory.

[0161]

[0179] Following the gradient calculation and gradient storage at 724 in FIG. 17, the voltage target system 648 may use the gradient to set and target-change the test voltage applied to each cluster of the electronic devices 634. The test voltage setting and target change are shown in steps 726 to 736 of FIG. 16.

[0162]

[0180] At 726, an estimation is made for the first test voltage (V G ), and the resulting first test current (I G ) is measured. From the above description and FIG. 15, it should be understood that the voltage target system 648 configures the voltage regulator 652 to simultaneously apply the first test voltage to the plurality of electronic devices 634 in the first cluster. Further, it should be understood that the first test current from the electronic devices 634 of the first cluster, measured by the current detector 640, is the total current of the electronic devices 634 simultaneously applied to the first cluster.

[0163]

[0181] The second and third clusters of the first group are treated similarly. Each additional cluster has a first test voltage applied to the equipment of the cluster, and a first test current measured from the equipment.

[0164]

[0182] Following the measurement of the first test current from the cluster, the data from the first test current is again used to run the multistage filter 730. The multistage filter 730 is run with the first test current in the same manner as the multistage filter 710, which was run with the first initial current from the first group of clusters, and the multistage filter 722, which was run with the second initial current from the clusters.

[0165]

[0183] At 732, the first comparison is made between the first test current and the target current. Specifically, the measured first test current is subtracted from the target current. The difference is recorded as the amount of current error that needs to be corrected. Figure 17 shows the first initial estimate ("G") and the target current (I). T ) and current error (I T -I G The first initial current as a result of ) is shown.

[0166]

[0184] The target change is performed at 734 in Figure 16. The second test voltage is calculated, and the first test voltage is adjusted to the second test voltage. As shown in Figure 17, the second test voltage is calculated according to the formula. V G +( I T -I G ) * gradient

[0167]

[0185] The first comparison in 732 therefore forms the basis for the voltage adjustment in 734.

[0168]

[0186] In Figure 16, 736 indicates that the process starting at 726 can be repeated, and the repetition is performed by using the target change voltage as the first test voltage, and then measuring the test current to calculate the target change voltage.

[0169]

[0187] The dashed lines from 702 and 706 in Figure 16 indicate that the second and third cluster groups are treated similarly to the first cluster group. In a given example, the voltage source 650 supplies voltage to the second group of electronics via the voltage regulator 654. The voltages applied to the first and second groups of electronics can be controlled independently in the manner described above. In a similar manner, a separate voltage regulator supplies voltage to a separate group of electronics. Although only a single current detector 640 is shown, it should be understood that multiple current detectors can be included in the system to detect current from one or more clusters of one or more groups.

[0170]

[0188] As mentioned above, parallel wiring with a voltage source has clear economic advantages. Furthermore, the voltage target changing process ensures that the correct voltage is applied to the equipment connected using parallel wiring of the voltage source, as previously stated, and thus the equipment receives the correct current according to its specifications.

[0171]

[0189] Clusters can be selected to match wafer processing (or other) factors that may affect the voltage / current relationship. It is not uncommon for equipment near the edge of a wafer to have different characteristics than equipment near the center of the wafer. • Clusters can be selected so that peripheral devices are analyzed together with other peripheral devices, and central devices are analyzed together with other central devices.

[0172]

[0190] The goal change process is highly convergent and does not react to minor errors. For example, suppose the initial voltage / current calculation was insufficient, and the resulting gradient was off by 20%. Regarding the first target change step, assume that the calculated voltage was 50% wrong (i.e., the current was 50% wrong). • The first target change attempts to correct a 50% current error using a gradient with a 20% error. The net correction is then 10% (50%). * 20% is incorrect. The next step in changing the target is to correct this 10% error and then make another 20% calculation error. This correction is 2% (10%) * 20%) It's simply wrong. Thus, since there are only two target change steps with a starting error of 50% and a gradient error of 20%, the resulting current is now less than 2%. This demonstrates that this target-changing algorithm converges rapidly. More generally, the gradient is calculated to be within approximately 5%, and the initial current is within 20%. Then, only one step is needed to settle within 1% of the exact current.

[0173]

[0191] While specific exemplary embodiments have been described and illustrated in the accompanying drawings, those skilled in the art will likely conceive of modifications, so please understand that such embodiments are merely illustrative and not limiting to the present invention, and that the present invention is not limited to the specific structures and arrangements illustrated and described. [Explanation of Symbols]

[0174] 10 Test equipment 12 Testing equipment 14 frames 18A Slot Assembly 28A cartridge 40-slot assembly connection part 72 Chuck 302 Retention structure 304 Horizontal transfer device 306 Vertical transfer device 346 Lid 354 Thermal Strut 364 sockets 366A, 368A Tweezers

Claims

1. It is a cartridge, An electronic device holder having a structure for removably holding an electronic device having input contacts and a light-emitting element, An input contact located on the electronic device holder and connected to the input contact on the electronic device, which supplies input power to the input contact of the electronic device via the input contact of the electronic device holder, and the light-emitting element transmits light through the input power; A socket having the structure described above for holding the electronic device, A lid that is movable relative to the socket, wherein the socket and the lid together form the electronic device holder, A photodetector is attached to the lid and positioned to detect the light and generate output power according to the magnitude of the light, The aforementioned electronic device includes a circuit board located on the opposite side from the cover and having a connection portion including output contacts, A measurement channel for connecting the photodetector to the connection portion, comprising a detector measurement pin held by the socket, the detector measurement pin having a contact that engages with a terminal on the cover, The output contact is connected to the photodetector via the measurement channel, and the cartridge measures the output power.

2. The cartridge according to claim 1, wherein the electronic device holder defines a cavity through which the light is directed and through which the light passes from the light-emitting body to the photodetector.

3. The cartridge according to claim 2, further comprising a light-absorbing coating on the surface of the cavity.

4. The cartridge according to claim 1, further comprising a press plate mounted to move relative to the lid, the lid being configurable across the socket and movable toward the socket, the movable mounting of the press plate allowing the electronic device to move the press plate relative to the lid, and the press plate having an opening through which light is transmitted from the light emitter to the photodetector.

5. The cartridge according to claim 4, further comprising a spring connected between the lid and the press plate, wherein the press plate is linearly movable relative to the lid by the electronic device in order to deform the spring, and the spring is a coil spring through which light propagates.

6. The cartridge according to claim 1, further comprising a temperature correction device located on the first side of the electronic device holder, which changes its temperature during operation to correct the temperature of the electronic device by creating a temperature difference between the temperature correction device and the electronic device and heat conduction between the temperature correction device and the electronic device.

7. The electronic device holder is located on the opposite side of the temperature correction device and has a surface for absorbing light, and a heat sink that generates heat internally by absorbing light, The cartridge according to claim 6, further comprising a heat dissipation device that is thermally connected to the heat sink and removes heat from the heat sink.

8. The cartridge according to claim 7, wherein the heat dissipation device includes a plurality of fins, heat is conducted from the heat sink to the plurality of fins, and convection occurs from the plurality of fins to the surrounding air.

9. A method for testing one or more electronic devices, The steps include inserting an electronic device having input contacts and a light-emitting element into an electronic device holder including a socket and a cover, The steps include positioning the photodetector attached to the cover across the socket, The steps include connecting the photodetector to an output contact on a circuit board located on the opposite side of the cover of the electronic device via a measurement channel that includes a detector measurement pin having a contact that is held by the socket and engages with a terminal on the cover, The steps include connecting the input contact on the electronic device holder to the input contact on the electronic device, The steps include supplying input power to the input contact on the electronic device via the input contact on the electronic device holder, and the light-emitting element transmitting light by the input power, The steps include detecting the light with the photodetector, A step of converting the detected light into output power, A step of measuring the output power via the output contact, A method comprising the step of removing the electronic device from the electronic device holder.

Images