Calibration of the aligner station of the processing system

Abstract

To provide a method for calibrating an aligner station of an electronics processing system.SOLUTION: A method includes: retrieving, by a first robot arm of a transfer chamber, a calibration object from a processing chamber, the calibration object having a target orientation in the processing chamber; placing the calibration object in a load lock; retrieving the calibration object from the load lock by a second robot arm of a factory interface connected to the load lock; placing the calibration object at an aligner station connected to the factory interface; and determining a difference between a first orientation and an initial target orientation at the aligner station. The method also includes: determining a first characteristic error value associated with the processing chamber based on the difference between the first orientation and the initial target orientation; and recording the first characteristic error value in a storage medium. The aligner station uses the first characteristic error value for alignment of objects in the processing chamber.SELECTED DRAWING: Figure 6

Description

TECHNICAL FIELD

[0001]

[0001] Embodiments of the present disclosure generally relate to methods and systems for calibrating an aligner station of an electronic processing system.

BACKGROUND ART

[0002]

[0002] An electronic processing system may include one or more robotic arms for transporting substrates from a first station of the electronic processing system to a second station of the electronic processing system. In the electronic processing system, a substrate or object is moved from the first station and is intended to be placed at a target orientation at the second station. One or more system errors associated with the first station and / or the second station often prevent the robotic arm from placing the substrate or object at the target orientation at the second station. For example, the electronic processing system may include an aligner station and a processing chamber, and a substrate or object may be retrieved from the aligner station by the robotic arm for transfer to the processing chamber at a target orientation. The aligner station and / or the processing chamber may be associated with characteristic errors arising from various causes (e.g., the aligner station and / or the processing chamber were not properly installed during construction of the processing system, small errors in positioning and / or orientation of the robotic arm, etc.). Therefore, when the substrate or object is ultimately transferred from the aligner station to the processing chamber, the substrate or object may have small errors in orientation and / or positioning.

SUMMARY OF THE INVENTION

[0003]

[0003] Part of the embodiments described above relate to a method that includes removing an object to be calibrated from a processing chamber connected to a transfer chamber by a first robotic arm of the transfer chamber. The object to be calibrated has a target orientation in the processing chamber. The method further includes positioning the object to be calibrated in a load lock connected to the transfer chamber by the first robotic arm. The method further includes removing the object to be calibrated from the load lock by a second robotic arm of a factory interface connected to the load lock. The method further includes positioning the object to be calibrated in an aligner station housed in or connected to the factory interface by the second robotic arm. The object to be calibrated has a first orientation in the aligner station. The method further includes determining the difference between the first orientation in the aligner station and an initial target orientation in the aligner station. The initial target orientation in the aligner station is related to the target orientation in the processing chamber. The method further includes determining a characteristic error value related to the processing chamber based on the difference between the first orientation and the initial target orientation. The method further includes recording the characteristic error value in a storage medium. The aligner station uses characteristic error values ​​to align objects placed within the processing chamber.

[0004]

[0004] In some embodiments, the method includes placing an object to be calibrated in a processing chamber. The method further includes capturing a first image of the object to be calibrated showing a first orientation of the object to be calibrated in the processing chamber using a first camera in the processing chamber. The method further includes removing the object to be calibrated from the processing chamber using a first robotic arm in a transfer chamber connected to the processing chamber. The method further includes placing the object to be calibrated in a load lock connected to the transfer chamber using the first robotic arm. The method further includes removing the object to be calibrated from the load lock using a second robotic arm in a factory interface connected to the load lock. The method further includes placing the object to be calibrated in an aligner station housed in or connected to the factory interface using the second robotic arm. The object to be calibrated has a second orientation in the aligner station. The method further includes determining a characteristic error value related to the processing chamber based on the difference between the first orientation and the initial target orientation, based on the second orientation and the first orientation shown in the first image of the object to be calibrated. This method further includes recording characteristic error values ​​on a storage medium. The aligner uses the characteristic error values ​​to align the objects placed in the processing chamber.

[0005]

[0005] In some embodiments, the electronic processing system includes a transfer chamber including a first robotic arm, a set of one or more processing chambers connected to the transfer chamber, a load lock connected to the transfer chamber, a factory interface connected to the load lock including a second robotic arm and an aligner station, and a controller operably connected to the first robotic arm, the second robotic arm and the aligner station. The controller causes the second robotic arm to pick up a process kit ring from storage and place the process kit ring in the aligner station. The controller further determines that the process kit ring is placed in a first processing chamber of the set of processing chambers. The controller further causes the aligner station to align the process kit ring using a first characteristic error value associated with the first processing chamber. The aligner station aligns the process kit ring to a corrected target orientation based on an initial target orientation adjusted by the first characteristic error value. The controller further causes the second robotic arm to pick up the first process kit ring from the aligner and place the first process kit ring in the load lock. The controller further causes the first robot arm to pick up the first process kit ring from the load lock and place the first process kit ring inside the first processing chamber. Once placed inside the processing chamber, the first process kit ring has approximately the target orientation within the first processing chamber.

[0006]

[0006] The disclosure is shown, but not limited to, examples, in the drawings of the accompanying drawings, where similar references show similar elements. It should be noted that different references in the disclosure to “a certain” or “one” embodiment are not necessarily references to the same embodiment, and such references mean at least one. [Brief explanation of the drawing]

[0007] [Figure 1] This is a schematic top view of an example of an electronic processing system relating to the aspects of this disclosure. [Figure 2] Figures A and B show exemplary first orientations and exemplary target orientations of an object in a processing chamber according to embodiments of the present disclosure. [Figure 3] Figures A and B show exemplary first orientations and exemplary initial target orientations of an object in an aligner of an electronic processing system according to aspects of the present disclosure. [Figure 4] This figure shows the calibration of an aligner station in an exemplary electronic processing system according to an aspect of this disclosure. [Figure 5] This figure shows another calibration of an aligner station in an exemplary electronic processing system according to an aspect of this disclosure. [Figure 6] This invention relates to a method for calibrating an aligner station of an electronic processing system according to an embodiment of this disclosure. [Figure 7] Another method for calibrating an aligner station of an electronic processing system, according to embodiments of this disclosure. [Figure 8] Another method for calibrating an aligner station of an electronic processing system, according to embodiments of this disclosure. [Modes for carrying out the invention]

[0008]

[0015] Embodiments described herein relate to methods and systems for calibrating an aligner station of an electronic processing system. A calibration object, such as a calibration ring, process kit ring, or calibration wafer, is used to determine characteristic error values ​​related to the processing chamber of the electronic processing system. In some embodiments, the calibration object may be placed in the processing chamber in a target orientation. A first robotic arm of a first robot may pick up the calibration object and place it in the load lock of the electronic processing system. The calibration object may be picked up from the load lock by a second robotic arm of a second robot and placed in the aligner station of the electronic processing system in a first orientation. The difference between the first orientation and the initial target orientation may be determined.

[0009]

[0016] A characteristic error value related to the processing chamber can be determined based on the difference between the first orientation and the initial target orientation. The characteristic error value can be stored in a storage medium. After the characteristic error value is determined and stored in the storage medium, the object can be accepted into the aligner station for processing in the processing chamber. The characteristic error value related to the processing chamber is read from the storage medium, and the object can be aligned to the initial target orientation based on the characteristic error value.

[0010]

[0017] In some embodiments, a first camera in the processing chamber may capture a first image of the object to be calibrated while the object is placed in the processing chamber, prior to the object. Depending on when the object to be calibrated is placed in the aligner station, a second camera in the aligner station may capture a second image of the object to be calibrated. The first and second images of the object to be calibrated may be processed to determine characteristic errors associated with the process chamber. Characteristic errors may represent the difference between the target orientation in the process chamber and the actual orientation that the object would have if it were aligned to the initial target orientation in the aligner station.

[0011]

[0018] Calibrating the aligner station with the calibration object described in the embodiments herein before placing an object (e.g., a replaceable part or component of the process chamber, such as a process kit ring) into the processing chamber increases the likelihood that each object will be positioned in the target orientation within the processing chamber. This increased likelihood of each object being positioned in the target orientation reduces the number of alignment steps performed in the processing chamber, thereby shortening the overall system waiting time. Furthermore, the accuracy of the orientation (e.g., yaw) of the placed object is dramatically improved compared to conventional systems in the embodiments, with orientation accuracy reaching ±0.00001°. Similarly, reducing the number of alignment steps performed in the processing chamber reduces the likelihood of damage to the object or the robot arm that positions the object in the processing chamber as a result of incorrect X-axis, Y-axis, or yaw-axis movement. Additionally, in the embodiments, the time required to properly insert a new replaceable part (e.g., a process kit ring) into the processing chamber can be reduced by ensuring that the part is inserted in the correct orientation on the first attempt.

[0012]

[0019] Figure 1 is a schematic top view of an exemplary electronic processing system 100 according to one aspect of the present disclosure. The electronic processing system 100 can perform one or more processes on a substrate 102. The substrate 102 may be any suitable planar article of fixed dimensions with suitable rigidity, suitable for manufacturing electronic devices or circuit components thereon, such as a silicon-containing disk or wafer, a patterned wafer, or a glass plate.

[0013]

[0020] The electronic processing system 100 may include a process tool 104 and a factory interface 106 coupled to the process tool 104. The process tool 104 may include a housing 108 having a transfer chamber 110 therein. The transfer chamber 110 may include one or more processing chambers (also called process chambers) 114, 116, 118 arranged around the transfer chamber 110 and coupled to the transfer chamber 110. The processing chambers 114, 116, 118 may be coupled to the transfer chamber 110 via their respective ports, such as slit valves.

[0014]

[0021] The processing chambers 114, 116, and 118 can be adapted to perform any number of processes on the substrate 102. The same or different substrate processes can be performed in each of the processing chambers 114, 116, and 118. Substrate processes may include atomic layer deposition (ALD), physical vapor deposition (PVD), chemical vapor deposition (CVD), etching, annealing, curing, pre-cleaning, removal of metal or metal oxide, etc. For example, the PVD process can be performed in one or both of the process chambers 114, the etching process can be performed in one or both of the process chambers 116, and the annealing process can be performed in one or both of the process chambers 118. Other processes may also be performed on the substrate within them. Each of the processing chambers 114, 116, and 118 may include a substrate support assembly. The substrate support assembly may be configured to hold the substrate in place while the substrate processes are being performed.

[0015]

[0022] As described above, the etching process may be performed in one or more processing chambers 114, 116, 118. Therefore, some processing chambers 114, 116, 118 (etching chambers, etc.) may include edge rings (also called process kit rings) 136 positioned on the surface of the substrate support assembly. In some embodiments, the process kit rings may be replaced from time to time. While replacing process kit rings in conventional systems involves disassembling the processing chambers 114, 116, 118 by an operator to replace the process kit rings, the electronic processing system 100 may be configured to facilitate the replacement of process kit rings without disassembling the processing chambers 114, 116, 118 by an operator.

[0016]

[0023] In some embodiments, the processing chambers 114, 116, and 118 may include at least one of a heating element or a cooling element disposed within them. The heating element may be configured to raise the temperature inside the processing chamber. The cooling element may be configured to lower the temperature inside the processing chamber. In some embodiments, the heating element and the cooling element may be the same element.

[0017]

[0024] The transfer chamber 110 may also include a transfer chamber robot 112. The transfer chamber robot 112 may include one or more arms, each arm having one or more end effectors at the end of each arm. The end effectors may be configured to handle specific objects such as wafers. Alternatively or additionally, the end effectors may be configured to handle objects such as process kit rings. In some embodiments, the transfer chamber robot 112 may be a selective compliance assembly robot arm (SCARA) robot, such as a 2-link SCARA robot, a 3-link SCARA robot, or a 4-link SCARA robot.

[0018]

[0025] The load lock 120 may also be coupled to the housing 108 and the transfer chamber 110. The load lock 120 may be configured to bond and connect to the transfer chamber 110 on one side and to the factory interface 106 on the other. In some embodiments, the load lock 120 may have an environmentally controlled atmosphere that can be changed from a vacuum environment (where substrates can be transferred in and out of the transfer chamber 110) to an atmospheric pressure inert gas environment (where substrates can be transferred in and out of the factory interface 106) or a similar environment. In some embodiments, the load lock 120 may be a stacked load lock having a pair of upper internal chambers and a pair of lower internal chambers located at different vertical levels (e.g., upper and lower). In some embodiments, the pair of upper internal chambers may be configured to receive processed substrates from the transfer chamber 110 for removal from the process tool 104, and the pair of lower internal chambers may be configured to receive substrates from the factory interface 106 for processing within the process tool 104. In some embodiments, the load lock 120 may be configured to perform a substrate process (e.g., etching or pre-cleaning) on ​​one or more substrates 102 received therein.

[0019]

[0026] The factory interface 106 may be any suitable enclosure, such as an equipment front end module (EFEM). The factory interface 106 may be configured to receive substrates 102 from substrate carriers 122 (e.g., Front Opening Unified Pods (FOUPs)) docked at various load ports 124 of the factory interface 106. A factory interface robot 126 (shown in dotted lines) may be configured to transfer the substrates 102 between the substrate carriers (also referred to as containers) 122 and the load locks 120. The factory interface robot 126 may include one or more robot arms, and may be or may include a SCARA robot. In some embodiments, the factory interface robot 126 may have more links and / or more degrees of freedom than the transfer chamber robot 112. The factory interface robot 126 may include an end effector at the end of each robot arm. The end effector may be configured to pick up and handle a specific object such as a wafer. Alternatively or additionally, the end effector may be configured to handle an object such as a process kit ring.

[0020]

[0027] Any conventional robot may be used as the factory interface robot 126. The transfer may be performed in any order or direction. In some embodiments, the factory interface 106 may be maintained, for example, in a slightly positive pressure non-reactive gas environment (using, for example, nitrogen as the non-reactive gas).

[0021]

[0028] In some embodiments, the transfer chamber 110, the process chambers 114, 116, and 118, and the load lock 120 may be maintained at a vacuum level. The electronic processing system 100 may include one or more vacuum ports coupled to one or more stations of the electronic processing system 100. For example, the first vacuum port 130a may couple the factory interface 106 to the load lock 120. The second vacuum port 130b is coupled to the load lock 120 and may be disposed between the load lock 120 and the transfer chamber 110.

[0022]

[0029] The electronic processing system 100 may also include a system controller 132. The system controller 132 may be a computing device such as a personal computer, server computer, programmable logic controller (PLC), or microcontroller, and / or may include such devices. The system controller 132 may include one or more general-purpose processing units such as a microprocessor or central processing unit (CPU). More specifically, the processing units may be complex instruction set computing (CISC) microprocessors, reduced instruction set computing (RISC) microprocessors, very long instruction word (VLIW) microprocessors, or processors that implement other instruction sets or combinations of instruction sets. The processing units may also be one or more special-purpose processing units such as application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), or network processors. The system controller 132 may include data storage devices (e.g., one or more disk drives and / or solid-state drives), main memory, static memory, network interfaces, and / or other components. The system controller 132 may execute instructions to perform one or more of the methods and / or embodiments described herein. Instructions may be stored (during instruction execution) in a computer-readable storage medium which may include main memory, static memory, a secondary storage device and / or a processing device. The system controller 132 may also be configured to allow input and display of data, operation commands, etc., by a human operator.

[0023]

[0030] Figure 1 is a schematic diagram illustrating the transfer of an edge ring (or other process kit ring) 136 to processing chambers 114, 116, and 118. According to one aspect of this disclosure, the edge ring 136 is removed from the substrate carrier 122 (e.g., FOUP) via a factory interface robot 126 located at the factory interface 106, or is loaded directly into the factory interface 106. Although an edge ring is described herein, it should be understood that embodiments described with reference to an edge ring also apply to other process kit rings and other interchangeable parts or components of processing chambers other than process kit rings. In some embodiments, a system controller 132 may determine a transfer recipe for the edge ring 136. The transfer recipe may indicate the transfer path that the edge ring 136 should follow while being transported from the substrate carrier 122 to a specific processing chamber 114, 116, or 118. For example, the transfer recipe may indicate that the edge ring 136 is moved from the aligner station 128 to the processing chamber 116 via a specific load lock 120.

[0024]

[0031] The electronic processing system 100 may include an aligner station 128. The aligner station 128 may be housed in the factory interface 106, or it may be coupled to the factory interface 106. The aligner station 128 may be configured to align the edge ring 136 to achieve a target orientation of the edge ring 136 in the processing chambers 114, 116, or 118. The aligner station 128 may rotate the edge ring 136 in the positive or negative yaw axis direction (e.g., clockwise or counterclockwise) to achieve an initial target orientation of the edge ring 136 in the aligner station 128. In some embodiments, the aligner station 128 may translate the edge ring 136 in the positive or negative x axis direction and / or y axis direction to align the edge ring 136 in the aligner station 128.

[0025]

[0032] The initial target orientation of the edge ring 136 in the aligner station 128 may nominally correspond to the target orientation of the edge ring 136 in the processing chambers 114, 116, or 118. For example, the edge ring 136 may include a flat portion that is aligned with the corresponding flat portion of the substrate support assembly around which the edge ring 136 is placed. Failure to accurately position the edge ring 136 in the target orientation within the processing chamber may result in non-uniformity of the plasma generated during processing, non-uniform wear of the edge ring 136, and / or other problems. In an ideal configuration free from robot position and / or rotation errors, misalignment of the processing chamber relative to the transfer chamber, etc., an edge ring initially aligned to the target orientation in the aligner station should ultimately be oriented to have the target orientation within any given processing chamber once placed in that processing chamber. However, different robot errors may occur in the placement of the edge ring 136 within each processing chamber. Furthermore, one or more processing chambers may have slight misalignments or misalignments. The embodiments described herein provide calibration procedures for correcting any of the above-described robot errors, misalignments, and / or misadjustments, as will be explained in more detail below.

[0026]

[0033] In one embodiment, a factory interface robot 126 positions the edge ring 136 to a first orientation at an aligner station 128. A system controller 132 may determine an alignment recipe to be executed at the aligner station 128 to align the edge ring 136 to a corrected target orientation, based on the transport recipe for the edge ring 136. The corrected target orientation may correspond to an initial target orientation at the aligner station 128, adjusted by characteristic error values ​​(e.g., characteristic angular error) associated with the transport recipe. In one embodiment, the characteristic error values ​​are associated with a specific processing chamber. In another embodiment, the characteristic error values ​​are associated with a specific load lock chamber in addition to a specific processing chamber. The alignment recipe may include the characteristic error values. In some embodiments, the aligner station 128 may align the edge ring 136 according to an alignment recipe which may include moving the edge ring 136 in at least one of the positive or negative X-axis direction, the positive or negative Y-axis direction, or the positive or negative yaw-axis direction in order to properly orient the edge ring 136 in a corrected target orientation at the aligner station 128. The alignment recipe may be associated with a transfer recipe for the edge ring 136. Depending on the alignment of the edge ring 136 at the aligner station, the factory interface robot 126 may then retrieve the edge ring 136 from the aligner station 128, which has a corrected target orientation, and position the edge ring 136 in the corrected direction on the load lock 120 via the vacuum port 130a.

[0027]

[0034] The transfer chamber robot 112 can remove the edge ring 136 from the load lock 120 through the second vacuum port 130b. The transfer chamber robot 112 can move the edge ring 136 to the transfer chamber 110, and the edge ring 136 can be transferred to destination processing chambers 114, 116, and 118. The edge ring 136 placed in destination processing chambers 114, 115, and 118 may have a target orientation within the processing chamber. If the edge ring 136 had been oriented to an initial target orientation within the aligner station 128, the edge ring would have had a characteristic error when finally placed in the processing chamber. However, because the edge ring 136 was oriented to a corrected target orientation within the aligner station (which may include the initial target orientation minus an angular adjustment corresponding to the characteristic error value), the edge ring 136 placed in the processing chamber has a target orientation within the processing chamber.

[0028]

[0035] Although not shown in Figure 1 for clarity, the transfer of the edge ring 136 can be performed while the edge ring 136 is positioned on the carrier or adapter, and the robot's end effector can pick up and position the carrier or adapter holding the edge ring 136. This may allow an end effector configured for wafer handling to also be used for handling the edge ring 136.

[0029]

[0036] Figures 2A and 2B show exemplary first orientations 216 and exemplary target orientations 218 of an edge ring 210 in a processing chamber according to embodiments of the present disclosure. The processing chamber may correspond to at least one of the processing chambers 114, 116, or 118 of the electronic processing system 100 illustrated in Figure 1. In some embodiments, the processing chamber may include a substrate support assembly 212 configured to support a substrate during a substrate process. The edge ring 210 may be configured to be positioned around the substrate support assembly 212. As previously stated, the edge ring 210 may be positioned in the first orientation 216 in the substrate support assembly 212 by a transfer chamber robot (not shown). In some embodiments, the first orientation 216 may include an orientation error 220. The orientation error 220 may represent the difference between the angle of the flat portion 222 of the edge ring 210 and the angle of the flat portion 224 of the substrate support assembly 212. In embodiments, the flat portion 222 is configured to mate with the flat portion 224. The orientation error 220 may be caused by at least characteristic errors related to the processing chamber. Characteristic errors may be due to various causes (e.g., errors in robot angle and / or positioning, improper installation of the processing chamber during construction of the processing system, etc.) and may be represented by characteristic error values. In some embodiments, the transfer recipe may include a combination of characteristic error values, which may be summed to determine the total characteristic error related to the placement of the edge ring into the processing chamber. The characteristic error values ​​may, for example, describe a first characteristic error related to the processing chamber and a second characteristic error related to at least another station of the electronic processing system (i.e., load lock 120, load port 124, etc.).

[0030]

[0037] As described above, the orientation error 220 may be determined based on the angle formed between the flat portion 222 and the flat portion 224. In some embodiments, the target orientation 218 in the processing chamber may not include the orientation error 220 (i.e., there is no difference between the angle of the flat portion 222 and the angle of the flat portion 224).

[0031]

[0038] Figures 3A and 3B show exemplary initial target orientation 314 and exemplary corrected target orientation 316 of an edge ring 312 in an aligner station 310 of an electronic processing system according to an aspect of the present disclosure. As previously stated, the edge ring 312 can typically be aligned to an initial target orientation 314 by an aligner station. The edge ring 312 may initially have some angular error that may occur during the placement of the edge ring in a container (e.g., a FOUP), transport of the container, and / or mounting of the container to a factory interface. The aligner station can eliminate such error by aligning the edge ring 312 to an initial target orientation 314. In one example, the initial target orientation 314 may include a flat portion of the edge ring 312 aligned perpendicular to the longitudinal axis of an end effector that picks up the edge ring 312 from the aligner station.

[0032]

[0039] As described above, moving the edge ring from the aligner station to the destination processing chamber may introduce some characteristic error (e.g., angular error) into the edge ring 312. Therefore, the aligner station 310 may intentionally introduce the reciprocal of the characteristic error into the orientation of the edge ring 312 during the alignment process. The initial target orientation adjusted by the characteristic error may correspond to the corrected target orientation 316. Thus, by introducing the reciprocal of the characteristic error into the edge ring during alignment, the intentionally introduced error cancels out the characteristic error, so the edge ring finally placed in the processing chamber will have no characteristic error. In some embodiments, the aligner 310 may rotate the edge ring 312 along the yaw axis 318 to position the edge ring 312 to the corrected target orientation 316. In some embodiments, the aligner 310 may position the edge ring 312 to the corrected target orientation 316 based on an alignment recipe stored in a controller such as the system controller 132 described with respect to Figure 1.

[0033]

[0040] As described above, an orientation error is intentionally introduced into the edge rings using characteristic error values ​​stored during edge ring alignment. Each processing chamber may be associated with its own characteristic error value, which may differ from the characteristic error values ​​of other processing chambers. Furthermore, each load lock may be associated with its own characteristic error value. Therefore, an edge ring that has moved into the first processing chamber through the first load lock may have a combined characteristic error value that is different from an edge ring that has moved into the first processing chamber through the second load lock. Calibration procedures may be performed to determine the characteristic error values ​​associated with each processing chamber (and / or each load lock or other station).

[0034]

[0041] Figure 4 shows the calibration of an aligner station 128 of an exemplary electronic processing system 100 according to an aspect of the present disclosure. The object to be calibrated 410 may be positioned in a target orientation in the processing chambers 114, 116, and 118 of the electronic processing system 100. The target orientation in the processing chamber may be an orientation of the object (i.e., the object to be calibrated 410, substrate 102, etc.) in the processing chambers 114, 116, and 118 that satisfies or exceeds a threshold accuracy (i.e., includes an orientation error exceeding the threshold alignment error). For example, the target orientation may be an orientation of the object with an accuracy of 0.001° or less. In some embodiments, the target orientation in the processing chamber may be the same as the target orientation 218 described with respect to Figures 2A and 2B.

[0035]

[0042] In some embodiments, the object to be calibrated 410 may be at least one of a calibration ring, a calibration wafer, or a standard edge ring (process kit ring). The calibration ring may be a specially designed ring configured to fit around the substrate support assembly in the processing chambers 114, 116, 118 so that the calibration ring has a target orientation within a target accuracy (e.g., an accuracy of 0.0001°) in the substrate support assembly. Similarly, the calibration wafer may be a specially designed process wafer configured to fit within, above, above, or around the support assembly so that the calibration wafer has a target orientation within the substrate support assembly within a target accuracy, or so that the orientation of the wafer relative to a target orientation within a target accuracy can be determined. In some embodiments, at least one of the calibration ring, edge ring, or calibration wafer is positioned in the target orientation in the processing chambers 114, 116, 118 by an operator of the electronic processing system 100.

[0036]

[0043] In some embodiments, the substrate support assembly may include one or more coupling components, such as lift pins. The object to be calibrated 410 may include one or more coupling receivers configured to engage with one or more coupling components of the substrate support assembly. In some embodiments, one or more coupling receivers may be motion coupling receivers. In some embodiments, the object to be calibrated 410 may be placed in the substrate support assembly of the processing chambers 114, 116, and 118 by the transfer chamber robot 112. When placed in the substrate support assembly, the object to be calibrated 410 may have orientation errors, such as the orientation error 220 described with respect to Figures 2A and 2B. Depending on the placement of the object to be calibrated 410 in the substrate support assembly, each coupling component of the substrate support assembly may engage with the corresponding coupling receiver. By each coupling component engaging with the corresponding coupling receiver, the orientation errors associated with the object to be calibrated 410 can be eliminated, and the object to be calibrated 410 can be positioned in the target orientation. In some embodiments, the object to be calibrated 410 may be a calibration wafer.

[0037]

[0044] In some embodiments, the object to be calibrated 410 may be a calibration ring made of a material having a first coefficient of thermal expansion, and the substrate support assembly may have a second coefficient of thermal expansion. In some embodiments, the second coefficient of thermal expansion of the substrate support assembly may be lower than the first coefficient of thermal expansion of the object to be calibrated 410. In some embodiments, the object to be calibrated 410 may be placed in the substrate support assemblies of the processing chambers 114, 116, and 118 by a transfer chamber robot 112. When the calibration ring is placed in the substrate support assembly, it may have an orientation error, as illustrated in Figure 2A. Depending on the placement of the object to be calibrated 410 in the substrate support assembly, the inside of the processing chambers 114, 116, and 118 may be heated. As a result of the heating of the inside of the processing chambers 114, 116, and 118, the object to be calibrated 410 may expand more than the substrate support assembly, thereby changing the orientation of the object to be calibrated 410 and eliminating the orientation error. The inside of the processing chambers 114, 116, and 118 may be cooled, and the object to be calibrated 410 may have the target orientation after cooling.

[0038]

[0045] In some embodiments, the object to be calibrated 410 may be a process kit ring used during substrate processing in processing chambers 114, 116, and 118. The process kit ring can be placed in the substrate support assemblies of processing chambers 114, 116, and 118 by a transfer chamber robot 112. When placed in the substrate support assemblies, the process kit ring may have orientation errors, as described with respect to Figures 2A and 2B.

[0039]

[0046] After the object to be calibrated 410 is positioned in the target orientation in processing chambers 114, 116, and 118, the object to be calibrated 410 may be removed from the processing chambers 114, 116, and 118 by the transfer chamber robot 112 and placed on the load lock 120 connected to the transfer chamber 110. The factory interface robot 126 may remove the object to be calibrated 410 from the load lock 120 and place it in the aligner station 128. The object to be calibrated 410 may be positioned in the aligner station 128 in a first orientation. The first orientation may include characteristic errors associated with the processing chamber. For example, the first orientation may include the reciprocal of the characteristic error that would be introduced if the edge ring were aligned to the initial target orientation in the aligner station 128 and then moved to the processing chamber.

[0040]

[0047] Depending on the placement of the object to be calibrated 410 on the aligner station 128, the difference between the first orientation and the initial target orientation at the aligner station can be determined. The initial target orientation at the aligner may be the orientation of the object (i.e., the object to be calibrated 410, substrate 102) that should nominally be in the target orientation when the object is received in the processing chambers 114, 116, and 118, as the object is transferred from the aligner station 128 to the processing chambers 114, 116, and 118. However, due to characteristic errors, an object oriented to the initial target orientation at the aligner station may no longer have the target orientation in the processing chamber.

[0041]

[0048] The difference between the first orientation and the initial target orientation may represent a first characteristic error value associated with processing chambers 114, 116, and 118 (or the reciprocal of the characteristic error value associated with processing chambers 114, 116, and 118). The characteristic error value can quantify the characteristic orientation error associated with processing chambers 114, 116, and 118. The characteristic error value may be recorded in a storage medium (i.e., the data storage device of the system controller 132). In some embodiments, the characteristic error value may be read from the storage medium and used by the system controller 132 for the alignment of objects placed in processing chambers 114, 116, and 118 associated with the characteristic error value, as described above.

[0042]

[0049] In addition to determining characteristic error values ​​related to processing chambers 114, 116, and 118, characteristic errors related to one or more stations of the electronic processing system (i.e., load lock 120, load port 124, etc.) can be determined. For example, the object to be calibrated 410 may be aligned to a target orientation within the load lock, removed by the factory interface robot 126, and placed in a second orientation at the aligner station 128. The difference between the second orientation and the initial target orientation can be determined. This difference may indicate an orientation error caused by the characteristic error value of the load lock 120. The characteristic error value of the load lock can be recorded on a storage medium. In some embodiments, the characteristic error values ​​described above and the characteristic error value of the load lock can be read from the storage medium and used by the system controller 132 for aligning objects that are placed in the load lock 120 and then placed in processing chambers 114, 116, and 118. The same (and / or similar) process can be performed to determine the characteristic error value related to the load port 124. In some embodiments, a single load lock is used to transfer the edge ring to the processing chamber. Therefore, in such embodiments, the characteristic error values ​​associated with the processing chamber may include any characteristic error values ​​attributable to the single load lock.

[0043]

[0050] In some embodiments, the object may be an edge ring. An initial corrected target alignment may be determined depending on the calibration performed on the edge ring at the aligner station 128. One or more robot arms (e.g., a factory interface robot 126 and / or a transfer chamber robot 112) can transfer the edge ring to destination processing chambers 114, 116, and 118, where the edge ring can be positioned in the target orientation with high precision. In other or similar embodiments, the object may be a process kit ring. The process kit ring may be retrieved by the factory interface robot 126 from a storage location such as a substrate carrier 122 (e.g., a FOUP). The process kit ring may be positioned at the aligner station 128 by the factory interface robot 126. In some embodiments, it may be determined that the process kit ring is to be placed in a specific processing chamber 114, 116, or 118. For example, it may be determined that the process kit ring is to be placed in processing chamber 116. In an additional embodiment, it may be determined that a process kit ring is placed in a specific load lock 120 before being placed in the processing chamber 116. Depending on the determination that the process kit ring is placed in the processing chamber 116 and optionally in a specific load lock 120, a first characteristic error value associated with the processing chamber 116 and / or a second characteristic error value associated with the load lock 120 may be read from a storage medium. The process kit ring may be aligned to a corrected target orientation using at least the first and second characteristic error values. The corrected target orientation may be based on an initial target orientation adjusted by at least the first and / or second characteristic error values. Depending on the alignment of the process kit ring to the corrected target orientation, the process kit ring may be removed from the aligner station 128 and placed in the load lock 120 by the factory interface robot 126. The process kit ring may then be removed from the load lock 120 and placed in the processing chamber 116 by the transfer chamber robot 112.In some embodiments, the process kit ring may be positioned in the processing chamber 116 with an accuracy of about 0.1° to 0.0000001° in the target orientation. In some embodiments, the process kit ring may be positioned in the processing chamber 116 with an accuracy of about 0.001° to 0.00001° in the target orientation. In some embodiments, the process kit ring may be positioned in the processing chamber 115 with an accuracy of 0.00001° or less in the target orientation.

[0044]

[0051] In some embodiments, separate characteristic error values ​​can be determined for each processing chamber 114, 116, and 118 according to the embodiments described above. For example, a first characteristic error value may be associated with processing chamber 116. A third characteristic error value associated with processing chamber 114 may be determined similarly.

[0045]

[0052] Figure 5 shows another calibration of the aligner station 128 of an exemplary electronic processing system 100 according to an aspect of the present disclosure. Calibration objects 410 may be placed in the processing chambers 114, 116, and 118 of the electronic processing system 100. Calibration objects 410 may be process kit rings, process wafers, or process kit rings used in a substrate process. In some embodiments, calibration objects 410 may be placed in the substrate support assemblies of the processing chambers 114, 116, and 118 by an operator of the electronic processing system 100. In other embodiments, calibration objects 410 may be placed in the substrate support assemblies by a factory interface robot 126.

[0046]

[0053] In some embodiments, processing chambers 114, 116, and 118 may include a first camera 510. The first camera 510 may be configured to capture one or more images showing the orientation of the object to be calibrated, which is placed in the substrate support assembly of the processing chambers 114, 116, and 118. The first camera 510 may be a charge-coupled device (CCD) camera and / or a complementary metal-oxide-synthetic device (CMOS) camera. Alternatively, the first camera 510 may include an X-ray emitter (e.g., an X-ray laser) and an X-ray detector. In some embodiments, the first camera 510 may be a component of the object to be calibrated 410. For example, the object to be calibrated may be a camera wafer, and the first camera 510 may be a component of the camera wafer. In some embodiments, the aligner station 128 may include a second camera 520. The second camera 520 may be configured to capture one or more images showing the orientation of the object placed in the aligner station 128. The second camera 520 may be a charge-coupled device (CCD) camera and / or a complementary metal-oxide-synthetic device (CMOS) camera. Alternatively, the first camera 510 may include an X-ray emitter (e.g., an X-ray laser) and an X-ray detector. In some embodiments, at least one of the processing chambers 114, 116, 118 or the aligner 128 may be opened to install the first camera 510 or the second camera 520, respectively.

[0047]

[0054] The first camera 510 can capture a first image of the object to be calibrated. The first image of the object to be calibrated may show a first orientation of the object to be calibrated within the processing chambers 114, 116, and 118. In response to the capture of the first image of the object to be calibrated, the transfer chamber robot 112 may remove the object to be calibrated 410 from the processing chambers 114, 116, and 118 and place the object to be calibrated 410 on the load lock 120. In response to the placement of the object to be calibrated 410 on the load lock 120, the factory interface robot 126 removes the object to be calibrated 410 from the load lock 120 and places it on the aligner station 128 in a second orientation.

[0048]

[0055] Based on the second orientation of the object to be calibrated 410 at the aligner station 128 and the first orientation shown in the first object to be calibrated image, characteristic error values ​​related to the processing chambers 114, 116, and 118 can be determined. The first orientation of the object to be calibrated 410 can be determined by performing image processing on the first object to be calibrated image. For example, the object to be calibrated 410 may have a known shape and / or may include one or more registered features (e.g., flats, notches, fiducials, etc.). Image processing can be performed to determine the orientation of one or more registered features. In some embodiments, a Hough transform can be performed to determine the orientation of one or more registered features. The orientation of flats can be determined using the Hough transform and prior knowledge of the shape of the object (e.g., flats on the object). The orientation of the object can be determined using other standard image processing techniques such as edge detection, gradient calculation, voting algorithms, orientation FAST, and rotation BRIEF (ORB) image processing techniques.

[0049]

[0056] A first orientation error can be determined relating to the first orientation of the calibration object 410 shown in the first calibration object image. The first orientation error can be determined by comparing the orientation of the flat portion determined with respect to the first calibration object image with the orientation of the static components of the processing chambers 114, 116, and 118, according to the embodiments described with respect to Figures 2A and 2B.

[0050]

[0057] In some embodiments, a second camera 320 may capture a second calibration object image at the aligner station 128 showing a second orientation of the calibration object 410 at the aligner station 128. The second orientation of the calibration object 410 at the aligner station 128 may be determined by performing image processing on the second calibration object image according to the embodiments described above. A second orientation error related to the second orientation of the calibration object 410 shown in the second calibration object image may be determined according to the embodiments described above. The difference between the first orientation error and the second orientation error may be determined. The difference between the first orientation error and the second orientation error may represent a characteristic error value related to the processing chambers 114, 116, and 118. The characteristic error value may be recorded in a storage medium (i.e., a data storage device of the system controller 132 or the motion controller 134). In some embodiments, the system controller 132 may read characteristic error values ​​from a storage medium and use them to align objects placed in processing chambers 114, 116, and 118 associated with the characteristic error values.

[0051]

[0058] In some embodiments, a first boundary limit can be determined for sets of orientations and sets of positions within the processing chambers 114, 116, and 118. The first boundary limit may represent one or more sets of orientations of the object in the processing chambers 114, 116, and 118 that satisfy a target orientation threshold. The object to be calibrated 410 can be positioned at each of the orientations in the set of orientations and at each of the positions in the set of positions. Each orientation in the set of orientations may differ from the target orientation of the object to be calibrated 410 in the processing chambers 114, 116, and 118. For example, the object to be calibrated 410 may be positioned in the processing chambers 114, 116, and 118 in a first orientation where the difference between the first orientation and the target orientation is about 0.01°. The object to be calibrated 410 may also be positioned in a second orientation where the difference between the second orientation and the target orientation is about 0.1°. The first camera 510 can capture a set of calibration object images, wherein each calibration object image shows one orientation from a set of orientations and one position from a set of positions.

[0052]

[0059] In some embodiments, each calibration object image may be processed according to the embodiments described above. Based on each processed calibration object image, a set of orientation errors is determined, each orientation error may correspond to the orientation of the calibration object shown in the orientation object image. A first boundary limit may be determined based on the set of orientation errors. An orientation error threshold may be set using the first boundary limit. The orientation error threshold may indicate an orientation in which an object placed in that orientation within processing chambers 114, 116, and 118 will be incorrectly positioned.

[0053]

[0060] Depending on the determination of the first boundary limits for the sets of orientations and positions in the processing chambers 114, 116, and 118, a second boundary limit for the sets of orientations and positions in the aligner station 128 may be determined. The second boundary limit may represent a set of object orientations in the aligner station 128 that satisfy the initial target orientation threshold (for example, such that edge rings that fall within the second boundary limit when placed in the processing chamber also fall within the first boundary limit). The second boundary condition may be determined by recording the first orientation and / or position of the object to be calibrated in the processing chamber (where the orientation and / or position errors may be zero) using the first calibration object image, placing the object to be calibrated in the aligner station, and recording the second orientation and / or position of the object to be calibrated in the aligner station using the second calibration object image. Each orientation and / or position may include a corresponding orientation and / or position error. The first boundary condition for the first orientation and / or position may be known. Therefore, the second boundary condition can be mapped around the second orientation and / or position based on the known relationship between the first orientation and / or position and the first boundary condition.

[0054]

[0061] Once the used edge rings are removed from the processing chamber, they are placed in the aligner station 128, and their orientation and / or position on the aligner station can be determined. The orientation and / or position can then be compared to a second boundary condition associated with the processing chamber. If the orientation and / or position deviates from the second boundary condition, a decision may be made that the processing chamber should undergo maintenance, and / or an error may be generated.

[0055]

[0062] As described above, in some embodiments, the first camera 510 may be a component of the object to be calibrated 410. In the above embodiments, the first camera 510 may capture a first object to be calibrated image showing a first orientation of the object to be calibrated 410 in the processing chambers 114, 116, and 118, according to the embodiments described earlier. The first object to be calibrated image may be processed according to the embodiments described earlier. Based on the processed first object to be calibrated image, a first orientation error may be determined. The object to be calibrated may be moved to an aligner station, where a second object to be calibrated image may be captured by the first camera 510. Based on the processed second object to be calibrated image, a second orientation error may be determined. The difference between the first orientation error and the second orientation error may be determined. This difference may correspond to the characteristic error value of the processing chamber.

[0056]

[0063] Figures 6-8 are flowcharts of various embodiments of methods 600-800 for calibrating an aligner in an electronic processing system. The methods are performed by processing logic which may include hardware (circuits, dedicated logic, etc.), software (such as that which runs on a general-purpose computer system or a dedicated machine), firmware, or a combination of several of these. Some of methods 600-800 may be performed by computing devices such as the system controller 132 or motion controller 134 in Figure 1 that controls the robotic arm.

[0057]

[0064] For the sake of simplicity, the method is illustrated and described as a series of actions. However, the actions relating to this disclosure may be performed in various orders and / or simultaneously, and in conjunction with other actions not presented and described herein. Furthermore, not all illustrated actions may be performed in order to carry out the method relating to the subject matter of the disclosure. Moreover, those skilled in the art will understand and recognize that, alternatively, the method may be represented as a series of interrelated states via a state diagram or events.

[0058]

[0065] Figure 6 shows a method 600 for calibrating an aligner in an electronic processing system according to an embodiment of the present disclosure. In block 610, a first robotic arm of the transfer chamber may retrieve the object to be calibrated from a processing chamber connected to the transfer chamber. The object to be calibrated may have a target orientation within the processing chamber. In some embodiments, the object to be calibrated may be at least one of a calibration ring, a calibration wafer, or a process kit ring. The object to be calibrated may be placed in the processing chamber according to the embodiments described above. In block 620, the object to be calibrated may be placed in a load lock connected to the transfer chamber by the first robotic arm. In block 630, the object to be calibrated may be retrieved from the load lock by a second robotic arm of a factory interface connected to the load lock.

[0059]

[0066] In block 640, the object to be calibrated may be positioned in a first orientation in an aligner station housed in or connected to the factory interface by a second robotic arm. In block 650, the difference between the first orientation in the aligner station and the initial target orientation in the aligner station may be determined. In block 660, characteristic error values ​​related to the processing chamber may be determined. In block 670, characteristic error values ​​may be recorded in a storage medium. The characteristic error values ​​are received from the storage medium in response to the object being accepted into the aligner station for placement in the processing chamber. Based on the characteristic error values, the aligner station may move the object to position it in the target orientation.

[0060]

[0067] Figure 7 shows another method for calibrating an aligner station of a processing system according to an embodiment of the present disclosure. In block 710, an object to be calibrated may be placed in the processing chamber. The object to be calibrated may be at least one of a calibration ring, a calibration wafer, or a process kit ring. The object to be calibrated may be placed in the processing chamber according to the embodiments described above. In block 720, a first camera in the processing chamber may capture a first image of the object to be calibrated showing a first orientation of the object to be calibrated. In block 730, the object to be calibrated may be removed from the processing chamber by a first robotic arm in a transfer chamber connected to the processing chamber. In block 740, the object to be calibrated may be placed in a load lock connected to the transfer chamber by the first robotic arm. In block 750, the object to be calibrated may be removed from the load lock by a second robotic arm in a factory interface connected to the load lock.

[0061]

[0068] In block 760, the object to be calibrated may be positioned in a second orientation in an aligner station housed in or connected to the factory interface by a second robotic arm. In block 780, characteristic error values ​​related to the processing chamber may be determined. The characteristic error values ​​may be determined based on the second and first orientations shown in the first image of the object to be calibrated. In block 790, the characteristic error values ​​may be stored in a storage medium. The characteristic error values ​​may be received from the storage medium in response to the object being accepted into the aligner station for placement in the processing chamber. Based on the characteristic error values, the aligner station may move the object to position it in a target orientation.

[0062]

[0069] Figure 8 shows a method for aligning a process kit ring in a processing chamber to a target orientation based on a determined characteristic error value related to the processing chamber, according to an embodiment of the present disclosure. In block 810, a controller operably coupled to a first robotic arm, a second robotic arm, and an aligner station may cause the second robotic arm to pick up the first process kit ring from storage and position the first process kit ring in the aligner station. In block 820, it may be determined that the first process kit ring is positioned in a first processing chamber among a plurality of processing chambers.

[0063]

[0070] In block 830, the controller may align the first process kit at the aligner station using a first characteristic error value. The first characteristic error value may be associated with the first processing chamber according to the embodiments described earlier. The aligner station may align the first process kit ring to a corrected target orientation based on an initial target orientation adjusted by the first characteristic error value.

[0064]

[0071] In block 840, the controller may cause the second robot arm to pick up the first process kit ring from the aligner station and position the first process kit ring on the load lock. In block 850, the controller may cause the first robot arm to pick up the first process kit ring from the load lock and position the first process kit ring in the first processing chamber. The first process kit ring may be positioned in the first processing chamber in an orientation approximately to the target orientation within the first processing chamber.

[0065]

[0072] The preceding description includes numerous specific details, such as examples of particular systems, components, and methods, to enhance understanding of some embodiments of this disclosure. However, it will be apparent to those skilled in the art that at least some embodiments of this disclosure can be implemented without these specific details. In other examples, well-known components or methods are not described in detail or are presented in simple block diagram form, so as not to unnecessarily obscure this disclosure. Accordingly, the specific details described are merely illustrative. Specific implementations may differ from these exemplary details and will still be considered within the scope of this disclosure.

[0066]

[0073] Throughout this specification, any reference to “one embodiment” or “a particular embodiment” means that a specific feature, structure, or characteristic described in relation to an embodiment is included in at least one embodiment. Therefore, not all occurrences of phrases such as “in one embodiment” or “in a particular embodiment” throughout this specification necessarily refer to the same embodiment. Furthermore, the term “or” is intended to mean inclusive, rather than exclusive. Where the terms “about” or “approximately” are used in this specification, it is intended that the presented nominal values ​​have an accuracy of ±10%.

[0067]

[0074] Although the steps of the methods described herein have been shown and described in a specific order, the order of the steps of each method can be modified so that certain steps can be performed at least partially concurrently with other steps by being performed in reverse order. In another embodiment, the instructions for a separate step or sub-step may be in an intermittent and / or alternating form.

[0068]

[0075] It should be understood that the above description is illustrative and not limiting. Those skilled in the art will find many other embodiments apparent by reading and understanding the above description. Therefore, the scope of this disclosure should be determined by referring to the appended claims and together with the scope of the full equivalents to which those claims are entitled.

Claims

1. A method for calibrating a processing system, The detection of an object to be arranged in the processing chamber of the processing system according to a target processing chamber orientation at the aligner station of the processing system, wherein the object has a first orientation at the aligner station, Determining a characteristic error value related to the transfer path between the aligner station and the processing chamber, wherein the transfer path includes a sequence of multiple transfer operations between multiple stations of the processing system, and the characteristic error value reflects the characteristic orientation error introduced as the object is transferred along the transfer path between the aligner station and the processing chamber in accordance with the sequence of multiple transfer operations; Based on the determined characteristic error value, the aligner station is instructed to adjust the alignment of the object from the first orientation to the second orientation. The process involves one or more robot arms of the processing system transporting the object from the aligner station to the processing chamber along the transport path, wherein the object is transported such that it is substantially oriented towards the target processing chamber within the processing chamber. A method that includes this.

2. The method according to claim 1, wherein in the processing chamber, the object has a target processing chamber orientation with an accuracy of 0.00001° or less.

3. Determining the characteristic error value related to the transfer path between the aligner station and the processing chamber, The determination that the object should be placed inside the processing chamber, Determining the transfer path for transferring the object between the aligner station and the processing chamber, The characteristic error value related to the determined transport path is identified from the storage medium. The method according to claim 1 or 2, including the method according to claim 1 or 2.

4. Identifying the characteristic error value related to the determined transport path, Identifying an alignment recipe from the storage medium related to the transfer path for transferring an object between the aligner station and the processing chamber, Extracting the characteristic error value from the identified alignment recipe. The method according to claim 3, including the method described in claim 3.

5. The method according to claim 4, wherein the storage medium stores a plurality of alignment recipes, each of the plurality of alignment recipes is associated with a corresponding transport path related to transporting an object within the processing system, and the alignment recipe related to the transport path for transporting an object between the aligner station and the processing chamber is identified from the plurality of alignment recipes.

6. Based on the determined characteristic error value, the aligner station is instructed to adjust the alignment of the object from the first orientation to the second orientation. Moving the object in at least one of the positive x-axis direction or the negative x-axis direction, Moving the object in at least one of the positive y-axis direction or the negative y-axis direction, Moving the object in at least one of the positive yaw axis direction or the negative yaw axis direction. The method according to any one of claims 1 to 5, comprising having the aligner station perform at least one of the following.

7. The method according to any one of claims 1 to 6, wherein the object includes a process kit ring.

8. The one or more robot arms of the processing system are to move the object from the aligner station to the processing chamber along the transfer path. The first robot arm among the one or more robot arms is to retrieve the object from the aligner station, The first robot arm is to position the object within the load lock of the processing system, The second robot arm among the one or more robot arms is to remove the object from the load lock, The second robot arm is to position the object within the processing chamber in a manner substantially oriented towards the target processing chamber. The method according to any one of claims 1 to 7, including the method described in any one of claims 1 to 7.

9. The method according to any one of claims 1 to 8, further comprising calculating the characteristic error value related to the transfer path based on the orientation of an object to be calibrated being transferred between the processing chamber and the aligner station along the transfer path.

10. Calculating the aforementioned characteristic error value The method involves having one or more robot arms transport the object to be calibrated from the processing chamber to the aligner station, wherein the object to be calibrated has a target processing chamber orientation in the processing chamber and a third orientation in the aligner station. The determination of the difference between the third orientation in the aligner station and the target aligner orientation in the aligner station, wherein the target aligner orientation is associated with the target processing chamber orientation. Includes, The method according to claim 9, wherein the characteristic error value is calculated based on the determined difference.

11. The method according to claim 10, wherein the substrate support of the processing chamber includes one or more coupling components, the object to be calibrated includes one or more coupling receiving portions, and calculating the characteristic error value further includes causing one or more robot arms to position the object to be calibrated in the processing chamber, and in response to the object to be calibrated being positioned on the substrate support in the processing chamber, each coupling component engages with a coupling receiving portion so that the object to be calibrated is positioned in the target processing chamber orientation.

12. The object to be calibrated is made of a material having a first coefficient of thermal expansion, and the substrate support of the processing chamber has a second coefficient of thermal expansion different from the first coefficient of thermal expansion, and the characteristic error value is calculated as follows: The method involves having one or more robot arms place the object to be calibrated within the processing chamber, such that when the object to be calibrated is placed within the processing chamber, the object to be calibrated has an orientation error with respect to the orientation of the target processing chamber. Heating the inside of the processing chamber, wherein, in response to the heating, the object to be calibrated expands at a different expansion rate than the substrate support, causing a change in the orientation of the object to be calibrated and thereby eliminating the orientation error; The process involves cooling the inside of the processing chamber, wherein after the cooling, the object to be calibrated has the orientation of the target processing chamber. The method according to claim 10, further comprising:

13. Calculating the aforementioned characteristic error value In the processing chamber, one or more cameras are used to capture calibration images showing the orientation of the object to be calibrated in the processing chamber. The aligner station is configured to capture additional calibration images showing the third orientation in the aligner station using one or more cameras. It further includes, The method according to claim 10, wherein the difference between the third orientation and the target aligner orientation in the aligner station is determined based on the captured calibration image and the captured additional calibration image.

14. An electronic processing system, Processing chamber and Aligner station and One or more robotic arms, The one or more robot arms and the controller operably connected to the aligner station Equipped with, The aforementioned controller, The aligner station detects an object to be placed in the processing chamber according to a target processing chamber orientation, wherein the object has a first orientation in the aligner station. Determining a characteristic error value related to the transfer path between the aligner station and the processing chamber, wherein the transfer path includes a sequence of multiple transfer operations between multiple stations of the electronic processing system, and the characteristic error value reflects the characteristic orientation error introduced as the object is transferred along the transfer path between the aligner station and the processing chamber in accordance with the sequence of multiple transfer operations; Based on the determined characteristic error value, the aligner station is instructed to adjust the alignment of the object from the first orientation to the second orientation. The one or more robot arms are used to transport the object from the aligner station to the processing chamber along the transport path, wherein the object is transported such that it is substantially oriented towards the target processing chamber within the processing chamber. An electronic processing system that performs this task.

15. The electronic processing system according to claim 14, wherein the object in the processing chamber has a target processing chamber orientation with an accuracy of 0.00001° or less.

16. In order to determine the characteristic error value related to the transfer path between the aligner station and the processing chamber, the controller: The determination that the object should be placed inside the processing chamber, Determining the transfer path for transferring the object between the aligner station and the processing chamber, The characteristic error value related to the determined transport path is identified from the storage medium. The electronic processing system according to claim 14 or 15, which performs the following:

17. In order to identify the characteristic error value related to the determined transport path, the controller, Identifying an alignment recipe from the storage medium related to the transfer path for transferring an object between the aligner station and the processing chamber, Extracting the characteristic error value from the identified alignment recipe. The electronic processing system according to claim 16, which performs the following:

Images