RFID labels and instructions on how to use RFID labels

Abstract

To provide an RFID label formed by printing information on a body to be stuck, configured to allow the RFID label with updated information to be read while invalidating information before update.SOLUTION: An RFID label includes: a first substrate equipped with an RFID antenna and an IC chip connected to the RFID antenna; a second substrate stuck on one surface of the first substrate with a lamination adhesive layer; and an adhesive layer for a body to be stuck arranged on the other surface of the first substrate. The RFID label includes a non-adhesive section formed in at least a part of the adhesive layer for a body to be stuck, and a pair of cut lines formed from one side to the other side of the RFID label in positions overlapping the non-adhesive section. A part of the RFID antenna including the IC chip is located between the pair of cut lines.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to an RFID label and a method of using the RFID label.

Background Art

[0002] Conventionally, for a label on which information related to an adherend is pre-printed, when the information is updated or added, a method of using the label has been proposed in which a label printed with the updated information is overlaid and pasted on the label already attached to the adherend, thereby rendering the information printed on the label already attached to the adherend unusable (see Patent Document 1).

[0003] In Patent Document 1, a label printed with a barcode containing updated information is overlaid and pasted so as to cover the barcode printed on the already attached label, thereby making the barcode of the already attached label unreadable. This makes it possible to update the information related to the adherend.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In recent years, in fields such as product manufacturing, management, and distribution, so-called RFID media such as RFID tags and RFID labels that support RFID (Radio Frequency Identification) technology, which transmits and receives information via non-contact communication from an IC chip on which product-related information and identification information are written, have become widespread.

[0006] RFID labels are read using contactless communication. Therefore, when the label usage method described in Patent Document 1 is applied to an RFID label, multiple RFID labels may be present on the object to be attached, resulting in situations where none of the RFID labels can be read, or information from an undesirable RFID label is read.

[0007] Therefore, the present invention aims to enable the reading of an RFID label containing updated information by rendering the previous information unusable when the information on the RFID label printed with information about the object to be attached is updated. [Means for solving the problem]

[0008] According to one aspect of the present invention, a first substrate having an RFID antenna and an IC chip connected to the RFID antenna on one side, and a second substrate attached to one side of the first substrate via a laminating adhesive layer, are provided. It is attached to the substrate. An RFID label, wherein the RFID label comprises an adhesive portion consisting of an adhesive layer for adherends provided on the other side of the first substrate. and , the adhesive layer for the adherend The tackiness is lost by printing or coating a non-adhesive forming material on the surface opposite to the first substrate side. Non-adhesive part and ,before The RFID label has a pair of perforations formed from one side to the other side, The IC chip and at least a part of the non-adhesive portion An RFID label is provided, in which the label is located between a pair of the aforementioned cut lines. [Effects of the Invention]

[0009] According to the present invention, the RFID label is torn along a pair of perforations, progressing from one side to the other. This causes a portion of the RFID antenna, including the IC chip located between the pair of perforations, to be torn, and the non-adhesive portion to be cut off. Therefore, in the case of an RFID label printed with information about the object to be attached, if that information is updated, the information before the update can be rendered unusable. Furthermore, even if an RFID label containing the updated information is attached to an object, it can still be read. [Brief explanation of the drawing]

[0010] [Figure 1] This is a plan view from the surface side of a continuous RFID label assembly in which RFID labels according to this embodiment are temporarily attached in a continuous manner to a long, strip-shaped separator. [Figure 2] This is a plan view showing a magnified view of one of the RFID labels shown in Figure 1. [Figure 3] Figure 2 shows a cross-sectional view along the line III-III. [Figure 4] This is a plan view of the RFID label after it has been peeled off the separator, as seen from the side where it is attached to the substrate. [Figure 5] This is a schematic diagram illustrating the process of cutting off the detachable portion of the first RFID label attached to the test tube. [Figure 6] This is a schematic diagram illustrating the state after the detachable portion of the first RFID label attached to the test tube has been cut off. [Figure 7] This is a schematic diagram illustrating the process of attaching a second RFID label to a test tube that already has a first RFID label attached, from which the separation portion has been cut off. [Figure 8] This is a schematic diagram illustrating a state in which a second RFID label is superimposed on a first RFID label from which the separation portion has been cut off. [Figure 9] This is a schematic diagram illustrating an example of the application of an RFID label according to this embodiment. [Figure 10] This is a plan view of the RFID label relating to the first modified example, seen from the front side. [Figure 11] This is a plan view of the RFID label relating to the second modified example, seen from the front side. [Figure 12] This is a plan view of the RFID label relating to the third modified example, seen from the front side. [Figure 13] This is a plan view of the RFID label according to the fourth modified example, seen from the front side. [Figure 14] This is a plan view of the RFID label according to the fifth modified example, seen from the front side. [Figure 15]It is a plan view of the RFID label according to the sixth modified example viewed from the front surface side. [Figure 16] It is a cross-sectional view illustrating an RFID label according to another embodiment of the present invention. [Figure 17] It is a cross-sectional view illustrating a modified example of the RFID label shown in Fig. 16. [Modes for Carrying Out the Invention]

[0011] [RFID Label] The RFID label 1 according to the embodiment of the present invention will be described.

[0012] Fig. 1 is a plan view of an RFID label continuous body 10 in which the RFID labels 1 according to the present embodiment are continuously temporarily attached to a long strip-shaped separator S, viewed from the front surface side. Fig. 2 is an enlarged plan view showing one of the RFID labels 1. In Fig. 2, a part of the label base material 30 is shown cut away.

[0013] Fig. 3 is a cross-sectional view taken along line III-III shown in Fig. 2. Further, Fig. 4 is a plan view of the RFID label 1 in a state peeled off from the separator S, viewed from the attachment surface side to the adherend.

[0014] As shown in Fig. 1, the RFID label continuous body 10 is configured such that a plurality of RFID labels 1 are arranged on the long strip-shaped separator S. The plurality of RFID labels 1 are each arranged in the longitudinal direction of the separator S (the Y direction shown in Fig. 1).

[0015] The RFID label 1 comprises a first substrate having an RFID antenna and an IC chip connected to the RFID antenna, a second substrate attached to one side of the first substrate via a laminating adhesive layer, and an adhesive layer for the substrate provided on the other side of the first substrate. As shown in Figure 3, the RFID label 1 is formed by laminating an RFID inlay 20 as the first substrate and a label substrate 30 as the second substrate with a laminating adhesive layer A1. In the RFID label 1, the adhesive layer A2 for the substrate is provided on the side of the RFID inlay 20 opposite to the side to which the label substrate 30 is attached, and is temporarily attached to the separator S.

[0016] The RFID inlay 20 comprises an inlay substrate 21, an antenna pattern 22 which is an RFID antenna formed on the inlay substrate 21, and an IC chip 23 connected to the antenna pattern 22. In this embodiment, the antenna pattern 22 is formed of metal foil. The antenna pattern 22 may also be formed by printing. Figure 3 shows an example in which a label substrate 30 is placed on the surface of the inlay substrate 21 on which the antenna pattern 22 is formed. The antenna pattern 22 may also be placed on the surface opposite to the surface on which the label substrate 30 is placed.

[0017] As an example, the inlay substrate 21 can be a single resin film such as polyvinyl chloride, polyethylene terephthalate, polypropylene, polyethylene, or polyethylene naphthalate, or a multilayer film made by laminating multiple such resin films.

[0018] In this embodiment, in addition to the resin film substrate described above, a paper substrate such as high-quality paper, medium-quality paper, or coated paper formed using these can be used as the inlay substrate 21.

[0019] In this embodiment, the inlay substrate 21 can be one with a thickness of 10 μm to 200 μm.

[0020] As shown in Figures 1 and 2, the antenna pattern 22 includes a loop portion 210 on which the IC chip 23 is mounted, meanders 211 and 212 extending symmetrically (in the X direction) from the loop portion 210 in the width direction of the RFID label 1, and capacitor hats 213 and 214 connected to the ends of the meanders 211 and 212.

[0021] In this embodiment, the antenna pattern 22 is, for example, a UHF band RFID antenna designed to have an antenna length and antenna line width corresponding to the UHF band (300MHz to 3GHz, particularly 860MHz to 960MHz).

[0022] Furthermore, although not shown in the diagram, the antenna pattern 22 is bonded to the inlay substrate 21 by a laminating adhesive layer consisting of, for example, acrylic, urethane, silicone, or rubber-based adhesives.

[0023] The antenna pattern 22 is formed from metal foil. Examples of metals applicable to the antenna pattern 22 include copper and aluminum. In this embodiment, aluminum foil is used from the viewpoint of reducing manufacturing costs.

[0024] The thickness of the metal foil is preferably 3 μm to 50 μm, from the viewpoint of the overall thickness of the RFID inlay 20, the thickness of the RFID label 1, and manufacturing costs. In this embodiment, as an example, aluminum foil with a thickness of 20 μm is used.

[0025] The IC chip 23 is a semiconductor package that supports the UHF band and is designed to communicate with a reader (not shown), which is a device for reading the IC chip 23.

[0026] Furthermore, although not shown in the figures, the IC chip 23 is electrically and mechanically connected to a portion of the loop portion 210 of the antenna pattern 22 by an anisotropic conductive material such as an anisotropic conductive adhesive or an anisotropic conductive film.

[0027] As shown in Figures 2 and 3, in the RFID label 1, the label substrate 30 is attached to the surface of the inlay substrate 21 on the side of the antenna pattern 22 on which the IC chip 23 is mounted, using a laminating adhesive layer A1. The laminating adhesive layer A1 serves to laminate the label substrate 30 to the RFID inlay 20.

[0028] Furthermore, as shown in Figure 3, the side of the inlay substrate 21 opposite to the side on which the IC chip 23 is mounted is temporarily attached to the separator S by the adhesive layer A2. The RFID label 1 is peeled off from the separator S and attached to the substrate by the adhesive layer A2.

[0029] In this embodiment, the adhesive layer A2 for the adherend is a freezing adhesive that maintains its flexibility even in low-temperature environments, thereby maintaining its adhesive strength.

[0030] The RFID label 1 has a non-adhesive portion 44 formed in a part of the adhesive layer A2 for the adherend, and a cut line 41 formed from one side to the other side of the RFID label 1 at a position overlapping with the non-adhesive portion 44. The cut line 41 has a pair of cut lines 41a and 41b, and is formed so that a part of the RFID antenna (loop portion 210) including the IC chip 23 is located between the pair of cut lines 41a and 41b. In this embodiment, the cut line 41 also has a cut line 41c on the other side of the RFID label 1 that connects the ends of the cut lines 41a and 41b, and together with the cut lines 41a and 41b, it demarcates a part of the RFID label 1 (hereinafter referred to as the separated portion 40) including the entire loop portion 210.

[0031] In this embodiment, the perforation line 41 is a so-called perforation process having a cut portion (cut portion) of a predetermined length and an uncut portion (uncut portion). Figures 1 to 3 illustrate the perforation line 41 in an easy-to-understand manner and do not show all the details precisely, but the perforation line 41 is formed so that the cut portion does not overlap with the antenna pattern 22 so as not to impair the function of the antenna pattern 22. Also, as shown in Figure 3, the perforation line 41 is formed to penetrate the label substrate 30, the laminating adhesive layer A1, the inlay substrate 21, and the adhesive layer A2 for the adherend, but not to penetrate the separator S.

[0032] In this embodiment, the cut line 41 is formed in a U-shape that opens to one of a pair of opposing sides in the Y direction that intersects the width direction of the RFID label 1.

[0033] The straight portion of the cutting line 41 is formed to pass between the loop section 210 and the meander 211, and between the loop section 210 and the meander 212.

[0034] In the separated portion 40 demarcated by the cut line 41, the portion constituting the outer edge of the RFID label 1 has recesses 42 and 43 formed in the Y direction of the RFID label 1, which are recessed inward from the RFID label 1. The recesses 42 and 43 are formed by curves that bulge outward from the RFID label 1.

[0035] As shown in Figure 4, a non-adhesive portion 44 is formed in a part of the adhesive layer A2 for the adherend in the separated portion 40 demarcated by the cut line 41. In this embodiment, the non-adhesive portion 44 can be formed by printing or applying a medium, varnish, etc., to the surface of the adhesive layer A2 for the adherend. This causes the adhesiveness of the adhesive layer A2 to be lost.

[0036] In this embodiment, the adhesive layer A2 for the adherend is exposed in a portion of the separation portion 40 other than the area where the non-adhesive portion 44 is formed. As shown in Figure 4, by leaving an adhesive region 45 on the separation portion 40, the separation portion 40 separated from the RFID label 1 can be attached to another adherend.

[0037] <Effects> The RFID label 1 having the above configuration has a non-adhesive portion 44 in a part of the adhesive layer A2 for the adherend, and a separation portion 40 is formed in the non-adhesive portion 44, which is demarcated by a cut line 41 so as to include the entire loop portion 210. Therefore, after being attached to the adherend, the separation portion 40 can be easily separated from the RFID label 1.

[0038] Furthermore, since the separation portion 40, which includes the entire loop portion 210, is divided by the cutting line 41, when the separation portion 40 is separated, the IC chip 23 connected to the loop portion 210 is also separated along with the loop portion 210.

[0039] Therefore, when using RFID label 1 with information about the object to be attached printed on it, separating the separation portion 40 prevents information from being read from the RFID label 1 remaining on the object using contactless communication via RFID.

[0040] Furthermore, in the separation portion 40, recesses 42 and 43 are formed in the portion that constitutes the outer edge of the RFID label 1, inward from the RFID label 1. As a result, the separation portion 40 is easy for the user to grasp and can be easily cut off.

[0041] Furthermore, as in this embodiment, when a freezing adhesive is used as the adhesive layer on the substrate, it is difficult to peel off the RFID label, and the peeling process is cumbersome. In contrast, with the RFID label 1 according to this embodiment, a part of the separation portion 40 is not attached to the substrate, making it easy to peel off the separation portion 40 from the RFID label 1.

[0042] Furthermore, in this embodiment, an adhesive area 45 remains in the area of ​​the separation portion 40 other than the area where the non-adhesive portion 44 is formed. Therefore, the separation portion 40 separated from the RFID label 1 can be attached to another substrate for use. Since the separation portion 40 includes the entire loop portion 210 to which the IC chip 23 is connected, contactless communication using RFID is possible. For this reason, for example, the separation portion 40 separated from the RFID label 1 can be attached to management documents or ledgers separately from the substrate to which the RFID label 1 is attached for storage or use for management purposes.

[0043] [How to use RFID labels] Next, we will explain how to use RFID label 1 as described above.

[0044] Figures 5 to 8 illustrate how to use RFID label 1 when test tube P is used as the substrate.

[0045] Figure 5 is a schematic diagram illustrating the operation of cutting off the separation portion 40A of the first RFID label 1A attached to the test tube P, and Figure 6 is a schematic diagram illustrating the state after the separation portion 40A of the first RFID label 1A attached to the test tube P has been cut off.

[0046] Figure 7 is a schematic diagram illustrating the process of attaching a second RFID label 1B to a test tube P to which a first RFID label 1A has been attached, from which the separation portion 40A has been cut off. Figure 8 is a schematic diagram illustrating the state in which the second RFID label 1B has been superimposed on the first RFID label 1A, from which the separation portion 40A has been cut off.

[0047] Furthermore, both the first RFID label 1A and the second RFID label 1B are labels with the same structure as the RFID label 1 described above.

[0048] In the method of using the RFID label 1 according to this embodiment, as shown in Figures 5 and 6, the separation portion 40A of the first RFID label 1A attached to the test tube P is separated.

[0049] Next, as shown in Figure 7, the second RFID label 1B is attached to the test tube P to which the first RFID label 1A, from which the separation portion 40A has been separated, is attached. Here, the second RFID label 1B has, for example, updated information written on it based on the information recorded on the IC chip of the first RFID label 1A.

[0050] In this embodiment, as shown in Figure 8, when the second RFID label 1B is attached to the test tube P, it is attached so that the outer edge of the second RFID label 1B and the outer edge of the first RFID label 1A overlap.

[0051] In this embodiment, as described above, by overlapping the first RFID label 1A and the second RFID label 1B, visibility inside the test tube P is not impaired.

[0052] Furthermore, since the positions of the meanders 211, 212 and capacitor hats 213, 214 can be overlapped in the first RFID label 1A and the second RFID label 1B, a boost effect that amplifies the radio wave sensitivity of the second RFID label 1B may be obtained.

[0053] Alternatively, when attaching the second RFID label 1B to the test tube P, the second RFID label 1B and the first RFID label 1A may be attached with a longitudinal offset from each other. This may result in a boosting effect.

[0054] Furthermore, the second RFID label 1B and the first RFID label 1A may be attached to each other with a slight offset in the shorter direction. This may result in a boosting effect.

[0055] Figure 9 is a schematic diagram illustrating an example of the application of the RFID label 1 according to this embodiment. Figure 9 shows RFID labels 1A and 1B on which information for identifying the object to be attached is printed.

[0056] RFID label 1A has a barcode 100A, a two-dimensional code 101A, and corresponding character information 102A printed on it to identify it as RFID label 1A. In addition, character information 103A linked to character information 102A is printed on the separated portion 40A of RFID label 1A.

[0057] Furthermore, the RFID label 1B has a barcode 100B, a two-dimensional code 101B, and corresponding character information 102B printed on it to identify it as an RFID label 1B. In addition, the separated portion 40B of the RFID label 1B has character information 103B, which is linked to the character information 102B, printed on it.

[0058] As explained using Figures 5 to 8, RFID labels 1A and 1B can be used to first attach RFID label 1A to test tube P. If it becomes necessary to change the information contained in the IC chip 23 of RFID label 1A, the separation portion 40A is cut off to make the information recorded on the IC chip 23 before the update unreadable, and then a second RFID label 1B with the updated information recorded on it is attached to test tube P.

[0059] This prevents confusion with old information even if it becomes necessary to update the information used to identify test tube P. Furthermore, it prevents the IC chip 23 from becoming unreadable due to mutual interference caused by the attachment of multiple RFID labels 1A and 1B.

[0060] [Examples of RFID labels] Figure 10 is a plan view of the RFID label 2 according to the first modified example, as seen from the front side. In the RFID label 2, the end portion 61 that constitutes the outer edge of the separation portion 51 is formed in a triangular shape. This makes the separation portion 51 easy for the user to grasp, and thus easy to cut off.

[0061] Figure 11 is a plan view of the RFID label 3 according to the second modified example, as seen from the front side. In the RFID label 3, the end portion 62 that constitutes the outer edge of the separation portion 52 is formed in a trapezoidal shape. This makes it easier for the user to grasp the separation portion 52, and thus the separation portion 52 can be easily cut off.

[0062] Figure 12 is a plan view of the RFID label 4 according to the third modified example, as seen from the surface. In the RFID label 4, at the separation portion 53, the end portion 63 that constitutes the outer edge of the RFID label 4 is formed to protrude outward from the RFID label 4 beyond one side of the RFID label 4 adjacent to the separation portion 53. As a result, the separation portion 53 is easier for the user to grasp, and therefore can be easily cut off.

[0063] Figure 13 is a plan view of the RFID label 5 according to the fourth modified example, as seen from the surface. In the RFID label 5, a cut line 64 is formed that crosses the RFID label 5 in the Y direction. In the RFID label 5, the separation portion 54 can be easily cut off by such a cut line 64.

[0064] Figure 14 is a plan view of the RFID label 6 according to the fifth modified example, viewed from the front side. The RFID label 6 has a pair of cut lines 141 and 142 formed from one side where the recesses 42 and 43 of the RFID label 6 are formed to the other side. In this modified example, the endpoints of the pair of cut lines 141 and 142 are located beyond a portion of the antenna pattern 22 extending from the loop portion 210 to which the IC chip 23 is connected, and the loop portion 210 to which the IC chip 23 is connected is formed to be located between the pair of cut lines 141 and 142.

[0065] According to the fifth modified example of the RFID label 6, even if the separation portion 40 is not demarcated by a cut line, the user's action of cutting the separation portion 40 causes the RFID label 6 to break from the end of the pair of cut lines 141, 142 toward the other side, thereby allowing the separation portion 40 to be cut off.

[0066] Figure 15 is a plan view of the RFID label 7 according to the sixth modified example, viewed from the front side. The RFID label 7 has a pair of cut lines 241 and 242 formed from one side where the recesses 42 and 43 of the RFID label 7 are formed to the other side. In this modified example, the endpoints of the pair of cut lines 241 and 242 are located in front of a part of the antenna pattern 22 extending from the loop portion 210 to which the IC chip 23 is connected.

[0067] According to the sixth modified example of the RFID label 7, it is not necessary to take care to form the perforations so that the cut portion passing through the antenna pattern 22 does not overlap with the antenna pattern 22. With the RFID label 7, when a user cuts off the separation portion 40, the RFID label 7 breaks apart from the end of the pair of cut lines 241, 242 toward the other side, thereby separating the antenna pattern 22 and allowing the separation portion 40 to be cut off.

[0068] Figure 16 is a cross-sectional view illustrating an RFID label 8 according to another embodiment of the present invention.

[0069] The RFID label 8 shown in Figure 16 has a different layer structure from the RFID label 1. Specifically, in the RFID label 8, the inlay substrate 21 in the RFID inlay 20 also serves as the label substrate 30 in the RFID label 1. In the RFID label 8, the separator S is temporarily attached to the surface on which the antenna pattern 22 is formed via an adhesive layer A2 for the substrate.

[0070] Thus, the layer structure that makes up the RFID label can be modified as needed.

[0071] When the RFID label 8 is applied to a printer using a thermal head and a platen roller, for example, the structure is such that the IC chip 23 is oriented towards the platen roller, thus suppressing the impact on the IC chip 23 caused by the thermal head contacting the RFID label 8.

[0072] Furthermore, since the RFID label 8 has an adhesive layer A2 for adhesion to the surface on which the antenna pattern 22 is formed, when used in the way described in Figures 5 to 8, for example, the IC chip 23 portion of the second RFID label 1B fits within the thickness of the first RFID label 1A. Therefore, when the second RFID label 1B is applied on top of the first RFID label 1A, the protrusion of the second RFID label 1B can be suppressed.

[0073] [Other embodiments] Although embodiments of the present invention have been described above, these embodiments only represent a part of the application examples of the present invention, and are not intended to limit the technical scope of the present invention to the specific configurations of the above embodiments.

[0074] In this embodiment, the entire area of ​​the separation portion 40 may be a non-adhesive portion 44. The non-adhesive portion 44 can also be achieved by not applying the adhesive layer A2 for the adherend to the corresponding area on the back side of the inlay substrate 21, a so-called "adhesive-free processing."

[0075] In this embodiment, the first RFID label 1A and the second RFID label 1B are attached to the same position on the test tube P, overlapping each other. However, if visibility inside the test tube P is required, the two labels may be attached to offset positions from each other, as long as visibility is not impaired.

[0076] Furthermore, in this embodiment, if visibility inside the test tube P is not required, the two may be attached to the same test tube P in non-overlapping positions.

[0077] Furthermore, in this embodiment, the surfaces of RFID labels 1 to 8 may have marks printed on them to guide the placement of the RFID labels when they are stacked and attached together.

[0078] In this embodiment, the case where the antenna pattern 22 is an RFID antenna for a UHF band inlet has been described, but it may also be a microwave band RFID antenna.

[0079] In this embodiment, the case where the adherend is a test tube P has been described, but the adherend is not limited to a test tube P. Other adherends may include bags, boxes, etc.

[0080] The RFID label 1 may be a label without a backing paper, with a release agent layer provided on the surface of the label substrate 30. In this case, the separator S can be omitted.

[0081] The RFID label 9 shown in Figure 17 is a cross-sectional view illustrating a further modification of the RFID label 8 shown in Figure 16. In the modification shown in Figure 17, an adhesive paper consisting of a label substrate 70 as a second substrate and a laminating adhesive layer A3 is laminated to the side of the RFID label 8 shown in Figure 16 opposite to the side on which the antenna pattern 22 is formed. After the RFID label 9 is attached to the substrate, the separation portion 40 can be easily separated from the RFID label 9. [Explanation of Symbols]

[0082] 1,1A,1B,2,3,4,5,6,7,8,9 RFID labels 10 RFID Label Continuum 20 RFID Inlays 21 Inlay substrate 22 Antenna Patterns 23 IC chips 30,70 Label substrate 40,40A,40B separation part 41,41a,41b,41c Cutting line 42,43 recess 44 Non-adhesive part 45 Adhesive area 50 Separation part 51,52,53,54 Separated part 61, 62, 63 Ends 64 Cutting line 100A, 100B barcodes 101A, 101B 2D code 102A, 102B, 103A, 103B Text information 141,142 Cutting line 210 Loop section 211,212 Meanda 213,214 Capacitor Hat 241,242 Cutting line A1, A3 Laminating Adhesive Layer A2 Adhesive layer for adherend

Claims

1. An RFID label for attaching to an object comprises a first substrate having an RFID antenna and an IC chip connected to the RFID antenna on one side, and a second substrate attached to one side of the first substrate via a laminating adhesive layer, The RFID label is An adhesive portion consisting of an adhesive layer for the adherend provided on the other side of the first substrate, A non-adhesive portion is obtained by printing or applying a non-adhesive forming material to the surface of the adhesive layer for the adherend opposite to the first substrate side, thereby causing it to lose its tackiness. The RFID label has a pair of perforations formed from one side to the other side, The IC chip and at least a portion of the non-adhesive portion are located between the pair of cut lines. RFID label.

2. The RFID label according to claim 1, The non-adhesive forming material is a medium or varnish. RFID label.

3. An RFID label according to claim 1 or 2, The RFID antenna has a loop portion to which the IC chip is connected. The pair of cut lines, together with the cut lines connecting their respective ends on the other side, demarcate a portion of the RFID label, including the entire loop portion. RFID label.

4. An RFID label according to claim 1 or 2, The aforementioned cut line is a perforation having a cut portion of a predetermined length and a portion without a cut, and the cut portion is formed so as not to overlap with the RFID antenna. RFID label.

5. An RFID label according to any one of claims 1 to 4, The first substrate is laminated in the following order on the surface facing the RFID antenna: the adhesive layer for the substrate and the separator. RFID label.

6. The RFID label according to claim 3, The RFID antenna is The device comprises the aforementioned loop portion, a meander extending from the loop portion with one end connected to the loop portion, and capacitor hats connected to the meander, RFID label.

7. The RFID label according to claim 6, The aforementioned cutting line is formed between the loop portion and the meander. RFID label.

8. An RFID label according to any one of claims 1 to 7, A recess is formed at the position of the cut line on one of the aforementioned sides, inwardly inward of the RFID label. RFID label.

9. An RFID label according to any one of claims 1 to 8, The adhesive layer for the adherend is formed with a freezing adhesive suitable for low-temperature environments. RFID label.

10. An RFID label according to any one of claims 1 to 9, The RFID antenna is a UHF band RFID antenna. RFID label.

11. An RFID label comprising a first substrate having an RFID antenna and an IC chip connected to the RFID antenna, wherein the surface of the first substrate on the side facing the RFID antenna has an adhesive layer for adhesion, and is attached to an adherend, The RFID label is The adhesive portion consists of the aforementioned adhesive layer for the adherend, A non-adhesive portion is obtained by printing or applying a non-adhesive forming material to the surface of the adhesive layer for the adherend opposite to the first substrate side, thereby causing it to lose its tackiness. The RFID label has a pair of perforations formed from one side to the other side, The IC chip and at least a portion of the non-adhesive portion are located between the pair of cut lines. RFID label.

12. The RFID label according to claim 11, The non-adhesive forming material is a medium or varnish. RFID label.

13. An RFID label according to claim 11 or 12, The RFID antenna has a loop portion to which the IC chip is connected. The pair of cut lines, together with the cut lines connecting their respective ends on the other side, demarcate a portion of the RFID label, including the entire loop portion. RFID label.

14. An RFID label according to claim 11 or 12, The aforementioned cut line is a perforation having a cut portion of a predetermined length and a portion without a cut, and the cut portion is formed so as not to overlap with the RFID antenna. RFID label.

15. The RFID label according to claim 13, The RFID antenna is The device comprises the aforementioned loop portion, a meander extending from the loop portion with one end connected to the loop portion, and capacitor hats connected to the meander, RFID label.

16. The RFID label according to claim 15, The aforementioned cutting line is formed between the loop portion and the meander. RFID label.

17. An RFID label according to any one of claims 11 to 16, A recess is formed at the position of the cut line on one of the aforementioned sides, inwardly inward of the RFID label. RFID label.

18. An RFID label according to any one of claims 11 to 17, The adhesive layer for the adherend is formed with a freezing adhesive suitable for low-temperature environments. RFID label.

19. An RFID label according to any one of claims 11 to 18, The RFID antenna is a UHF band RFID antenna. RFID label.

20. A method for using RFID labels, The RFID label is An RFID label comprising: a first substrate having an RFID antenna and an IC chip connected to the RFID antenna; an adhesive layer for adherends provided on the first substrate, wherein a non-adhesive portion is obtained by printing or applying a non-adhesive forming material to the surface of the adhesive layer for adherends opposite to the first substrate side, thereby causing the non-adhesiveness to be lost; and a pair of cut lines formed from one side of the RFID label toward the other side, wherein the IC chip and at least a part of the non-adhesive portion are located between the pair of cut lines, The portion of the first RFID label that is cut off by a pair of perforations from the first RFID label attached to the substrate is separated, The second RFID label is then attached to the first RFID label, from which a portion has been separated. How to use RFID labels.

21. A method for using an RFID label according to claim 20, When the second RFID label is attached to the object, it is attached so that the outer edge of the second RFID label and the outer edge of the first RFID label overlap. How to use RFID labels.

22. An RFID label according to any one of claims 1 to 10, The system includes a separation portion demarcated by the pair of cutting lines and a cutting line connecting the ends of the pair of cutting lines, In the separation portion, the adhesive layer for the adherend is placed on a part of the cut line side that connects the ends of the pair of cut lines. RFID label.

23. The RFID label according to claim 22, The non-adhesive portion is formed to extend outside the pair of cut lines in the separation portion. RFID label.

24. An RFID label according to any one of claims 11 to 19, The system comprises a pair of cutting lines and a separation portion demarcated by cutting lines connecting the ends of the pair of cutting lines, In the separation portion, the adhesive layer for the adherend is placed on a part of the cut line side that connects the ends of the pair of cut lines. RFID label.

25. The RFID label according to claim 24, The non-adhesive portion is formed to extend outside the pair of cut lines in the separation portion. RFID label.

26. An RFID label for attaching to an object comprises a first substrate having an RFID antenna and an IC chip connected to the RFID antenna on one side, and a second substrate attached to one side of the first substrate via a laminating adhesive layer, The RFID label is An adhesive portion consisting of an adhesive layer for the adherend provided on the other side of the first substrate, A non-adhesive portion is provided on the other side of the first substrate and does not adhere to the adherend, The RFID label has a pair of perforations formed from one side to the other side, The IC chip and at least a portion of the non-adhesive portion are located between the pair of cut lines. RFID label.

27. An RFID label having an RFID antenna and an IC chip connected to the RFID antenna on one side, and an adhesive layer for adhesion on the surface of the first substrate facing the RFID antenna, which is attached to an adherend, The RFID label is The adhesive portion consists of the aforementioned adhesive layer for the adherend, The non-adhesive portion that does not adhere to the aforementioned substrate, The RFID label has a pair of perforations formed from one side to the other side, The IC chip and at least a portion of the non-adhesive portion are located between the pair of cut lines. RFID label.

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