PCB transport device

Abstract

The substrate transport device is positioned between a plurality of load ports arranged in a first direction and a processing device for processing substrates, and transports substrates between a container placed on the plurality of load ports and the processing device. The substrate transport device comprises a first transport means for loading and unloading substrates in a second direction intersecting the first direction relative to the container, and a second transport means for loading and unloading substrates relative to the processing device. The first transport means performs a transport operation to transport the substrate in the first direction. The second transport means is positioned above the transport trajectory of the substrate in the transport operation, at a height below the second transport means that allows the transport operation to be performed.

Description

Technical Field

[0001] The present invention relates to a substrate transport apparatus.

Background Art

[0002] An apparatus is known that transports a substrate such as a semiconductor wafer between a container that accommodates the substrate and a processing apparatus that performs processing on the substrate (for example, Patent Document 1).

Prior Art Literature

Patent Documents

[0003]

Patent Document 1

Summary of Invention

Problems to be Solved by the Invention

[0004] When the height difference between the substrate transport height relative to the container and the substrate transport height relative to the processing apparatus is large, it takes time to raise and lower the substrate. In a configuration in which a single transport robot transports the substrate, throughput may decrease. In a configuration in which a plurality of transport robots transport the substrate, the apparatus may be increased in size.

[0005] An object of the present invention is to provide a substrate transport apparatus that can cope with the height difference between the substrate transport height relative to a container and the substrate transport height relative to a processing apparatus, while suppressing an increase in size.

Means for Solving the Problems

[0006] According to the present invention, A substrate transport apparatus that is disposed between a plurality of load ports arranged in a first direction and a processing apparatus that processes a substrate, and transports the substrate between containers placed on the plurality of load ports and the processing apparatus, the substrate transport apparatus comprising: a first transport unit that carries the substrate out of and into the container in a second direction intersecting the first direction; The apparatus comprises a second transport means for loading and unloading substrates, The first transport means performs a transport operation to transport the substrate in the first direction. The second transport means is positioned above the transport trajectory of the substrate in the transport operation, at a height below the second transport means that allows the transport operation to be performed. A substrate transport device characterized by the above is provided. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a substrate transport device that can accommodate the height difference between the transport height of the substrate relative to the container and the transport height of the substrate relative to the processing device, while suppressing an increase in size. [Brief explanation of the drawing]

[0008] [Figure 1] External view of the circuit board processing system. [Figure 2] Front view of a substrate transport device according to one embodiment of the present invention. [Figure 3] Figure 2 shows a rear view of the substrate transport device. [Figure 4] Figure 2 is an explanatory diagram of the internal structure of the substrate transport device. [Figure 5] Cross-sectional view along line AA in Figure 4. [Figure 6] A magnified view of a portion of Figure 5. [Figure 7] Cross-sectional view of line BB in Figure 4. [Figure 8] Diagram illustrating the relay unit. [Figure 9] Sensor diagram. [Figure 10] Figure 2 is an explanatory diagram of the transport space within the substrate transport device and the airflow configuration. [Figure 11] Figure 2 is an explanatory diagram of the operation of the substrate transport device. [Figure 12] A diagram illustrating the loading port and the operation of unloading substrates from the container. [Figure 13] Figure 2 is an explanatory diagram of the operation of the substrate transport device. [Figure 14] Figure 2 is an explanatory diagram of the operation of the substrate transport device. [Figure 15] Operation explanatory diagram of the substrate transfer apparatus in FIG. 2. [Figure 16] Operation explanatory diagram of the substrate transfer apparatus in FIG. 2. [Figure 17] Explanatory diagram of the substrate loading operation into the processing apparatus. [Figure 18] Diagram showing another configuration example of the transfer unit. [Figure 19] Diagram showing another configuration example of the substrate processing system. [Description of Embodiments]

[0009] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. The following embodiments are not intended to limit the invention according to the claims, and not all combinations of features described in the embodiments are necessarily essential to the invention. Two or more of the plurality of features described in the embodiments may be arbitrarily combined. In addition, the same or similar components are denoted by the same reference numerals, and redundant descriptions are omitted.

[0010] <First Embodiment> (Substrate Processing System) FIG. 1 is an external view of a substrate processing system 1 using a substrate transfer apparatus 10 according to an embodiment of the present invention. In each drawing, arrows X and Y indicate horizontal directions orthogonal to each other, and arrow Z indicates the vertical direction. In the present embodiment, the X direction is the depth direction (front-rear direction) of the substrate transfer apparatus 10, and the Y direction is the width direction (left-right direction) of the substrate transfer apparatus 10.

[0011] The substrate processing system 1 includes a plurality of load ports 2A to 2D arranged in the Y direction, a processing apparatus 3, and a substrate transfer apparatus 10 disposed between the plurality of load ports 2A to 2D and the processing apparatus 3 in the X direction. Although four load ports 2A to 2D are provided in the present embodiment, the number of load ports may be 2, 3, or 5 or more.

[0012] Load ports 2A to 2D are devices for opening and closing containers such as FOUPs. Substrates W such as semiconductor wafers (see Figures 9 and 12, etc.) are contained in the containers. Processing device 3 is a device for processing the substrates W contained in the containers, for example, a polishing device. Substrate transport device 10 transports the substrates W between the containers and the processing device 3.

[0013] (Substrate transport device) Refer to Figures 2 to 4 in addition to Figure 1. Figure 2 is a front view of the substrate transport device 10 (viewed from the side of load ports 2A to 2D), and Figure 3 is a rear view of the substrate transport device 10 (viewed from the side of the processing unit 3). Figure 4 is an explanatory diagram of the internal structure of the substrate transport device 10.

[0014] The substrate transport device 10 includes a housing 100 that forms the outer wall of the substrate transport device 10. The housing 100 has a rectangular parallelepiped shape as a whole and includes a front wall portion 101, a rear wall portion 102 opposite the front wall portion 101, left and right side wall portions 103 and 104, and an upper wall portion 105.

[0015] Rectangular openings 101a to 101d corresponding to load ports 2A to 2D are formed in the front wall portion 101 (Figure 2). Load ports 2A to 2D are attached to the front wall portion 101 so as to close the corresponding openings 101a to 101d. Substrates W contained in containers on the load ports 2A to 2D are transported into the substrate transport device 10 through the corresponding openings 101a to 101d, and also transported from the substrate transport device 10 into containers.

[0016] An opening 102a corresponding to the processing apparatus 3 is formed in the rear wall portion 102 (Figure 3). The substrate W to be processed is transported from the substrate transport device 10 to the processing apparatus 3 through the opening 102a, and also transported from the processing apparatus 3 to the substrate transport device 10.

[0017] The position in the Z direction of the upper edges of the openings 101a to 101d is Z1, and the position in the Z direction of the lower edge of the opening 102a is Z2. In the case of the present embodiment, the relationship Z1<Z2 is satisfied, and the opening 102a is formed at a position higher than the openings 101a to 101d. In order to transfer the substrate W between the containers on the load ports 2A to 2D and the processing apparatus 3, it is necessary to raise and lower the substrate W in the Z direction.

[0018] In order to transfer the substrate W to the openings 101a to 101d and the opening 102a having different positions in the Z direction, a lower transfer unit 120 and an upper transfer unit 130 are provided in the housing 100. The transfer unit 120 carries the substrate W out of and into the containers on the load ports 2A to 2D, and the transfer unit 130 carries the substrate W out of and into the processing apparatus 3. Then, by transferring the substrate W between the transfer unit 120 and the transfer unit 130, the substrate W is transferred between the containers on the load ports 2A to 2D and the processing apparatus 3. This makes it possible to cope with the height difference between the transfer height of the substrate W for the containers and the transfer height of the substrate W for the processing apparatus 3, and to prevent a decrease in throughput related to the transfer of the substrate W.

[0019] The configuration of the transfer unit 120 will be described with reference to FIGS. 5 and 6 in addition to FIG. 4. FIG. 5 is a cross-sectional view taken along line A-A of FIG. 4. FIG. 6 is a view of FIG. 5 which is a partially enlarged view, and is an explanatory view of the transfer unit 120.

[0020] The transfer unit 120 includes a transfer robot 121 and a moving unit 124 that moves the transfer robot 121 in the Y direction. The transfer robot 121 is a SCARA robot including a horizontal multi-joint type arm 122. The transfer robot 121 of the present embodiment is a double-arm type robot, and includes two sets of independently driven arms 122. A hand unit for holding the substrate W is provided at the distal end of the arm 122, and the substrate W is horizontally transferred by the expansion and contraction of the arm 122. The transfer robot 121 includes a turning / elevating unit 123 constituting its main body. The turning / elevating unit 123 performs turning of the arm 122 around the Z axis and elevating and lowering of the arm 122.

[0021] The mobile unit 124 includes a rail 1241 extending in the Y direction from the bottom of the housing 100, and a plurality of sliders 1242 that engage with the rail 1241 and are movable in the Y direction guided by the rail 1241. Two sets of rail 1241 and plurality of sliders 1242 are provided spaced apart in the X direction. Brackets 1243 are fixed to the plurality of sliders 1242 in each set. The transport robot 121 is fixed to two brackets 1243 so as to be positioned between the two brackets 1243 spaced apart in the X direction. Therefore, the transport robot 121 is movable in the Y direction along the rail 1241.

[0022] The moving unit 124 is equipped with a ball screw mechanism. Specifically, the moving unit 124 includes a ball screw shaft 1244 extending in the Y direction parallel to the rail 1241, and a ball nut 1245 that screws onto the ball screw shaft 1244. The ball nut 1245 is rotatably supported about the Y axis by the drive transmission unit 1247. The drive transmission unit 1247 is equipped with a mechanism (e.g., a belt drive mechanism) that transmits the driving force of the motor 1246, which is the drive source, to the ball nut 1245. The drive transmission unit 1247 is fixed to one of the two brackets 1243.

[0023] When the motor 1246 is driven to rotate the ball nut 1245, the transport robot 121 moves in the Y direction. The transport robot 121 can be moved to a position in the Y direction that faces each load port 2A to 2D. The transport robot 121 can access the containers on the load ports 2A to 2D through the openings 101a to 101d by extending and retracting the arm 122. As the transport robot 121 moves in the Y direction within the housing 100, the substrate W supported by the arm 122 is transported within the housing 100 along the transport track 13 shown in Figure 4. In addition to Figure 4, the configuration of the transport unit 130 will be described with reference to Figure 7. Figure 7 is a cross-sectional view taken along line BB in Figure 4.

[0024] The transport unit 130 includes a transport robot 131. The transport robot 131 is a SCARA robot equipped with a horizontal articulated arm 132. The transport robot 131 in this embodiment is a single-arm robot and is equipped with one set of arms 132. The tip of the arm 132 is provided with a hand portion for holding the substrate W, and the substrate W is transported horizontally by extending and retracting the arm 132. The transport robot 131 includes a swivel / lifting unit 133 which constitutes its main body. The swivel / lifting unit 133 performs swivel of the arm 132 around the Z axis and lifts and lowers the arm 132.

[0025] The transport robot 131 is supported by a support base 106. The support base 106 includes a beam member 106a installed between the front wall portion 101 and the rear wall portion 102. In this embodiment, two beam members 106a are provided spaced apart in the Y direction. The support base 106 includes a support plate 106b fixed on the two beam members 106a. The swivel / lifting unit 133 of the transport robot 131 is fixed to the support plate 106b. Therefore, unlike the transport robot 121, the position of the transport robot 131 is fixed. This allows for simplification of the mechanism of the transport unit 130.

[0026] The transport robot 131 is positioned adjacent to the opening 102a. By raising and lowering and extending the arm 132, the transport robot 131 can access the processing unit 3 through the opening 102a.

[0027] The transport robot 131 is positioned above the transport track 13 at a height that allows the transport robot 121 to perform transport operations below the transport robot 131, and the position of the transport robot 131 in the X direction coincides with the position of the transport track 13 in the X direction. By adopting an arrangement in which the transport robots 121 and 131 overlap in the vertical direction, the size of the substrate transport device 10 can be suppressed, and a thin substrate transport device 10 in the X direction can be provided.

[0028] Refer to Figure 4. A stocker 170 is located inside the housing 100. The stocker 170 is a substrate housing having slots 171 capable of accommodating substrates W. Multiple rows of slots 171 are provided in the Z direction. The transport unit 120 can store substrates W in the stocker 170 in case of emergency.

[0029] The housing 100 also includes a relay unit 140 that relays the substrate W between the transport unit 120 and the transport unit 130. In this embodiment, the relay unit 140 functions as a buffer on which the substrate W being transferred between the transport unit 120 and the transport unit 130 is temporarily placed. This eliminates the need to synchronize the timing of the transfer of the substrate W between the transport unit 120 and the transport unit 130, further improving the throughput related to the transport of the substrate W.

[0030] Refer to Figures 7 and 8 in addition to Figure 4. Figure 8 is an explanatory diagram of the relay unit 140. The relay unit 140 comprises a mounting member 141 on which the substrate W is placed, and a lifting mechanism 143 for raising and lowering the mounting member 141. The mounting member 141 has slots 142 on which the substrate W is placed in a horizontal position. Multiple rows of slots 142 are provided in the Z direction. The center position of the slots 142 is located within the range that the arm 132 of the transport robot 131 can reach through its movement.

[0031] Depending on the state of the circuit board W, the slot 14 on which it will be mounted 2 This may be defined. For example, in the processing unit 3, unprocessed substrates W (substrates W transported from transport unit 120 to transport unit 130) are placed in the third slot 142 from the top. In this case, transport unit 120 always transports substrates W to the third slot 142 from the top, and transport unit 130 always receives substrates W from the third slot 142 from the top.

[0032] On the other hand, processed substrates W (substrates W transported from transport unit 130 to transport unit 120) are placed in the third slot 142 from the bottom. In this case, transport unit 130 always transports substrates W to the third slot 142 from the bottom, and transport unit 120 always receives substrates W from the third slot 142 from the bottom. By determining which slot 142 to place the substrates W in based on whether or not they have been processed, the transport of substrates W can be made smoother.

[0033] The lifting mechanism 143 is, for example, a linear motor. The lifting mechanism 143 moves the mounting member 141 up and down between a lower position shown by a solid line in Figure 8 (corresponding to the position of height Z5 shown in Figure 14) and an upper position shown by a dashed line in Figure 8 (corresponding to the position of height Z6 shown in Figure 15), which is above the lower position. The lower position is the height position in the Z direction of the mounting member 141 when the substrate W is transferred between the transport robot 121 and the mounting member 141. The upper position is the height position in the Z direction of the mounting member 141 when the substrate W is transferred between the transport robot 131 and the mounting member 141.

[0034] The lower position has at least one slot 142 in communication. mouth This position is at the same height as 113. The lower position is such that the predetermined slot 142 into which the transport robot 121 loads or unloads the substrate W is at the same height as the communication opening 113, which will be described later, and there may be some slight variation in height.

[0035] The upper position is the position between the minimum height at which the hand portion provided at the tip of the arm 132 of the transport robot 131 can access the predetermined slot 142, and the position of the upper edge of the opening 102a. The upper position is sufficient if it is at a height that allows the hand portion provided at the tip of the arm 132 of the transport robot 131 to access the predetermined slot 142 into which the transport robot 131 loads or unloads the substrate W, and there may be some degree of vertical movement. A sensor unit 144 is provided to confirm which slot 142 the substrate W is placed in. The sensor unit 144 is supported by a beam member 144a that is installed between the front wall 101 and the rear wall 102 (see Figures 4 and 7).

[0036] Figure 9 is an explanatory diagram of the sensor unit 144. The sensor unit 144 consists of light-emitting elements 144 spaced apart in the X direction. 1 and light-receiving element 144 2 It is an optical sensor equipped with a light-receiving element 144 2 is a light-emitting element 144 1 The sensor unit 144 detects the light emitted from the light source. When the mounting section 141 on which the substrate W is placed in the slot 142 is raised and lowered, the light source 144 1 and light-receiving element 144 2 The substrate W is positioned so as to traverse the optical axis between the two. The presence or absence of substrate W in each slot 142 can be determined by the raising and lowering position of the mounting member 141 by the lifting mechanism 143 and the detection result of the sensor unit 144. If the system stops due to a power outage or other reasons, or if it is stopped in an emergency for any reason, this determination can be made when the system is restored, allowing for a smoother resumption of substrate W transport.

[0037] (Demarcation of transport space) Referring to Figures 4, 5, and 10, the partitioning of the transport space for the substrate W within the housing 100 will be described. A partition section 110 is provided within the housing 100. The partition section 110 divides the transport space for the substrate W within the housing 100 into transport space 12A and transport space 12B.

[0038] The transport space 12A is a relatively large transport space and includes a region 12a in the Y direction and a region 12b extending upward from region 12a in the Z direction. The transport track 13 is included in region 12a. The transport space 12A is the transport space for the substrate W by the transport unit 120, which houses the transport unit 120, and is in communication with the openings 101a to 101d. The transport space 12B is a relatively small transport space. The transport space 12B is in communication with the opening 102a. The transport space 12B isThis is the transport space for the substrate W transported by the transport unit 130, which houses the transport unit 130. The transport space 12B is located above the transport track 13 and region 12a in the Z direction, and laterally to region 12b in the Y direction.

[0039] The partition section 110 is an L-shaped structure having a bottom section 111 that partitions the transport space 12A and the transport space 12B in the Z direction, and a side section 112 that partitions the transport space 12A and the transport space 12B in the Y direction. In this embodiment, the bottom section 111 is formed by a blower unit 163, which will be described later. The side section 112 is a vertical wall section formed by a plate-shaped member, and in this embodiment, it is located in the center of the space inside the housing 100 in the Y direction. By positioning the side section 112 in the center, it is possible to secure both the transport space 12B and the area 12b.

[0040] A communication opening 113 is formed in the side portion 112, penetrating the side portion 112 in the Y direction and connecting the transport space 12A and the transport space 12B. The communication opening 113 forms the transport path for the substrate W between the transport space 12A and the transport space 12B.

[0041] The relay unit 140 is located in the transport space 12B. The relay unit 140 is positioned between the communication opening 113 and the transport unit 130. Therefore, the arm 122 of the transport robot 121 accesses the mounting member 141 of the relay unit 140 through the communication opening 113. The arm 132 of the transport robot 131 accesses the mounting member 141 of the relay unit 140 without passing through the communication opening 113.

[0042] (Airflow and pressure adjustment in the transport space) A duct 150 is provided at the top of the enclosure 100. A fan 151 is located inside the duct 150, drawing gas from outside the circuit board transport device 10 into the enclosure 100. Blower units 161 to 163 are located inside the enclosure 100. Blower units 161 to 163 are fan filter units (FFUs) that remove impurities from the drawn-in gas before discharging it.

[0043] The blower unit 161 is positioned above the transport space 12A, particularly above area 12b, and external gas from the substrate transport device 10 is introduced via a duct 152 branched from the duct 150. The blower unit 161 uses a fan to draw in the introduced gas, filters it to remove impurities such as particles, and then discharges it downwards towards the transport space 12A.

[0044] The blower unit 162 is positioned above the transport space 12B, and external gas from the substrate transport device 10 is introduced via a duct 153 that branches off from the duct 150. The blower unit 162 draws in the introduced gas with a fan, filters it to remove impurities, and then discharges it downwards towards the transport space 12B.

[0045] The blower unit 163 is located below the transport space 12B and above the transport space 12A, particularly above area 12a, and is positioned between the transport space 12A and the transport space 12B. 3 The system uses a fan to draw in the gas in the transport space 12B, filters it to remove impurities such as particles, and then discharges it downwards towards the transport space 12A.

[0046] The airflow and air pressure in the transport spaces 12A and 12B can be adjusted by the blowing units 161 to 163. A transport unit 130 is located in the transport space 12B, which can be a source of particles. Since the transport space 12B is located above the area 12a of the transport space 12A, if particles flow from the transport space 12B into the transport space 12A, there is a risk that the particles will fall onto the substrate W being transported within area 12a.

[0047] By slightly lowering the air pressure in the transport space 12B compared to the transport space 12A, it is possible to prevent particles from flowing from the transport space 12B into the transport space 12A. Specifically, the air pressure difference between the transport space 12A and the transport space 12B allows for transport from area 12b of the transport space 12A through the communication port 113. spaceBecause an airflow is generated toward 12B, it is possible to prevent particles from flowing from the transport space 12B into the transport space 12A. To this end, the airflow of the blower unit 163 is controlled to be greater than that of the blower units 161 and 162. This makes it possible to slightly lower the air pressure in the transport space 12B than that of the transport space 12A. By narrowing the communication point between the transport space 12A and the transport space 12B to the communication port 113 using the partition 110, it is possible to easily create an air pressure difference between the transport space 12A and the transport space 12B, or to suppress the movement of particles from the transport space 12B to the transport space 12A. In addition, in this embodiment, since gas is discharged downwards toward the transport space 12B by the blower unit 162, it is also possible to suppress the inflow of particles, etc., from the side of region 12b into the transport space 12B via the communication port 113.

[0048] (Control unit) A control unit 11 is located inside the enclosure 100 (Figure 4, etc.). The control unit 11 is an electronic circuit that controls the board transport device 10. The control unit 11 includes a processor, such as a CPU, a storage device that stores the program executed by the processor, an input / output interface for sending and receiving signals with external devices, and a communication interface. The transport units 120 and 130, the relay unit 140, and the blower units 161 to 163 are controlled by the execution of the program by the processor.

[0049] (Example of transport operation) An example of the transport operation of the substrate W controlled by the control unit 11 will be explained with reference to Figures 11 to 17. Here, as an example, an example of transporting the substrate W from a container on the load port 2A to the processing device 3 will be described.

[0050] First, the transport robot 121 is moved to a position facing the load port 2A. Figure 11 shows the stage in which the transport robot 121 is being moved in the Y direction to a position facing the load port 2A by the moving unit 124. Once the transport robot 121 is in a position facing the load port 2A, the substrate W is unloaded.

[0051] Figure 12 shows the stage of unloading the substrate W from the container 200 on the load port 2A. The load port 2A will now be explained with reference to Figure 12. Note that load ports 2B to 2D have the same structure as load port 2A.

[0052] The container 200 has a box-shaped container body 201 with an opening 201a on its side for inserting and removing substrates W such as semiconductor wafers, and a door portion 202 that is detachably attached to the opening 201a and closes the opening 201a, and houses the substrates W. Figure 12 shows the state in which the door portion 202 has been removed from the container body 201 by the load port 2A and the door portion 202 has been lowered.

[0053] The load ports 2A to 2D include a mounting section 22 on which the container 200 is placed, a bolt plate 21, a port door 24, and a storage section 25 located below the mounting section 22. The bolt plate 21 is a plate-shaped wall extending in the Z direction. The bolt plate 21 closes the opening 101a formed in the front wall section 101 and, together with the front wall section 101, separates the external space on the side of the mounting section 22 from the area 12a of the substrate transport space 12A for transporting the substrate W within the substrate transport device 10.

[0054] The bolt plate 21 includes an opening 21a through which the removed door section 202 and the arm 122 of the transport robot 121 can pass in the X direction.

[0055] The port door 24 includes a holding portion 24a for holding the door portion 202 and a support portion 24b for supporting the holding portion 24a. The holding portion 24a is equipped with, for example, a suction mechanism, which allows it to hold the door portion 202 by suction. The holding portion 24a is also provided with an operating mechanism (latch key) for operating the opening and closing of the locking mechanism of the door portion 202, which allows the container body 201 and the door portion 202 to be detached and attached.

[0056] The mounting section 22 comprises a dock plate 23 on which the container 200 is placed, and an operating mechanism 22a located inside. The operating mechanism 22a includes a displacement mechanism for displacing the dock plate 23 in the X direction, a presence sensor for detecting the presence of the container 200, and a locking mechanism for locking the container 200 placed on the dock plate 23 to the dock plate 23. The dock plate 23 is provided with a plurality of positioning pins (kinematic pins) for positioning and supporting the container 200.

[0057] The storage section 25 is a hollow body in the shape of a rectangular parallelepiped. The storage section 25 is provided with a lifting mechanism 26 for raising and lowering the port door 24 relative to the opening 21a. The lifting mechanism 26 comprises a lifting section 27 stored in the storage section 25 and a ball screw mechanism for raising and lowering the lifting section 27. The ball screw mechanism includes a ball screw shaft 26b, a slider 26e, a guide member 26d, a motor 26a which is the drive source, and a belt transmission mechanism 26c.

[0058] The guide member 26d is a rail member that guides the vertical movement of the slider 26e and is fixed to the bolt plate 21. The slider 26e has an engaging portion that engages with the guide member 26d and is reciprocable in the Z direction guided by the guide member 26d. The slider 26e is provided with a ball nut that engages with the ball screw shaft 26b via a ball.

[0059] The ball screw shaft 26b is connected to a belt drive mechanism 26c at its lower end. The belt drive mechanism 26c includes a driven pulley connected to the ball screw shaft 26b, a drive pulley connected to the output shaft of the motor 26a, and an endless belt wound around them. The rotational force of the motor 26a is transmitted to the ball screw shaft 26b via the belt drive mechanism 26c, causing the ball screw shaft 26b to rotate. The rotation of the ball screw shaft 26b causes the slider 26e, which is equipped with a ball nut, to move up and down.

[0060] The lifting section 27 includes a pair of connecting members 27a. The connecting members 27a are plate-shaped members that extend in the X direction through a slit 31 formed in the bolt plate 21. Supports 24b of the port door 24 are fixed to the X-direction ends of the pair of connecting members 27a. The lifting section 27 also includes a reciprocating mechanism 27b that moves the pair of connecting members 27a back and forth in the X direction. The reciprocating mechanism 27b allows the port door 24 to move back and forth in the X direction, thereby opening and closing the container 200.

[0061] With the container 200 open via the load port 2A, the substrate W can be unloaded by inserting the arm 122 of the transport robot 121 into the container body 201 through the opening 201a, as shown by the dashed line in Figure 12. The same procedure applies when loading the substrate W into the container body 201. Let Z3 be the height of the arm 122 that unloads and loads the substrate W into and out of the container 200. The height Z3 may vary slightly depending on the storage position of the substrate W inside the container 200.

[0062] Once the substrate W is unloaded, the transport robot 121 is moved downwards in area 12b (Figure 10), as shown in Figure 13. The substrate W on the arm 122 is transported along the transport track 13 in the Y direction. In the example in Figure 13, two substrates W are transported by two sets of arms 122.

[0063] Next, as shown in Figure 14, the swivel / lifting unit 123 is driven to raise the arm 122 to area 12b (Figure 10). The substrate W and the arm 122 are positioned facing the communication opening 113. The mounting member 141 of the relay unit 140 is lowered to a position at a height Z5 below the transport unit 120 and the mounting member 141 for transporting the substrate W.

[0064] Next, as shown in Figure 14, the extension and raising / lowering of the arm 122 causes the substrate W and the arm 122 to pass through the communication opening 113, and the substrate W moves into the slot 14 of the mounting member 141 in the transport space 12B. 2 It is placed on. The same applies when removing the substrate W from the mounting member 141. Thus, the communication opening 1The height of the arm 122 that moves the substrate W between the transport space 12A and the transport space 12B via 13 is defined as Z4. The height Z4 varies slightly depending on the storage position of the substrate W within the mounting member 141. The relationship between height Z3 and height Z4 is as follows: <Z4である。

[0065] Next, as shown in Figure 15, the mounting member 141 of the relay unit 140 is raised by the lifting mechanism 143 to a position above height Z6 for transporting the substrate W between the transport unit 130 and the mounting member 141. The substrate W that was transported earlier by the transport robot 121 is placed on the mounting member 141. Subsequently, the transport robot 131 takes out the first substrate W from the mounting member 141 by extending and raising the arm 132. Meanwhile, the transport robot 121, arm Unit 122 is lowered by the swivel / lifting unit 123, and the process moves on to the unloading of another substrate W.

[0066] Next, as shown in Figure 16, the arm 132 of the transport robot 131 is rotated and raised by the swivel / lifting unit 133, and the arm 132 on which the substrate W is placed moves to a position facing the opening 102a. The transport robot 121 moves in the Y direction and proceeds with the unloading operation of another substrate W.

[0067] Next, as shown in Figure 17, the extension and raising / lowering of the arm 132 allows the substrate W and the arm 132 to pass through the opening 102a, and the substrate W is transported into the processing apparatus 3. The second substrate W is also transported to the processing apparatus 3 using the procedure shown in Figures 16 and 17. When transporting the substrate W from the processing apparatus 3 to the container 200, the procedure is generally the reverse of the above steps.

[0068] In this embodiment, the substrate W can be transported between the container 200 and the processing device 3 using two transport units 120 and 130 arranged vertically. Since the transport units 120 and 130 can transport the substrate W in parallel, the throughput for transporting the substrate W can be improved.

[0069] Furthermore, in this embodiment, the substrate W can be transported between the container 200 and the processing device 3 using two transport robots 121 and 131 arranged to overlap in the vertical direction. With this configuration, the substrate transport device 10 can be miniaturized in the X direction (depth direction), so the distance between the openings 101a to 101d and the opening 102a can be shortened. Therefore, the throughput for transporting the substrate W can be improved.

[0070] <Second Embodiment> In the first embodiment, the transport robot 121 of the transport unit 120 was moved in the Y direction by a moving unit 124 using a ball screw mechanism, but the configuration of the moving unit 124 is not limited to this. Figure 18 shows another example of the moving unit. The moving unit 124A is a self-propelled mobile unit that mounts the transport robot 121 and moves by the rolling of multiple wheels. The transport robot 121 may be moved by such a moving unit 124A. Furthermore, in the first embodiment and the example in Figure 18, an example was shown in which the transport robot 121 of the transport unit 120 can move in the Y direction by a moving unit, but the transport robot 121 (more specifically the part of the swivel / lifting unit 123) may be configured to have a fixed position in the Y direction. For example, even if the position of the transport robot 121 in the Y direction is fixed, the arm 122 may be configured in multiple stages so that the hand portion provided at the tip of the arm 122 can access each of the containers 200 placed on the load ports 2A to 2D, and the substrates W can be transported in the Y and X directions by only the extension and rotation movements of the arm 122.

[0071] <Third Embodiment> In the first embodiment, a layout in which the processing unit 3 is positioned behind the substrate transport device 10 was illustrated, but a layout in which the processing unit 3 is positioned to the side of the substrate transport device 10 is also possible. Figure 19 shows an example of this. In the example in Figure 19, the processing unit 3 is positioned on the side of the side wall portion 104 of the substrate transport device 10. In this case, an opening corresponding to the opening 102a in the first embodiment is formed in the side wall portion 104, and the substrate W is transported between the processing unit 3 and the substrate transport device 10 through this opening.

[0072] <Other Embodiments> In the first embodiment, the substrate W is transferred between the transport unit 120 and the transport unit 130 via the relay unit 140. However, a structure in which the substrate W is directly transferred between the transport unit 120 and the transport unit 130 is also possible.

[0073] Although embodiments of the invention have been described above, the invention is not limited to the above embodiments, and various modifications and changes are possible within the scope of the gist of the invention.

Claims

1. A substrate transport device is positioned between a plurality of load ports arranged in a first direction and a processing device for processing substrates, and transports substrates between a container placed on the plurality of load ports and the processing device, A first transport means for transporting substrates in and out of the container in a second direction intersecting the first direction, The apparatus comprises a second transport means for loading and unloading substrates, The first transport means performs a transport operation to transport the substrate in the first direction. The second transport means is positioned above the transport trajectory of the substrate in the transport operation, at a height below the second transport means that allows the transport operation to be performed. A substrate transport device characterized by the following features.

2. A substrate transport apparatus according to claim 1, A relay means for relaying substrates is provided between the first transport means and the second transport means. A substrate transport device characterized by the following features.

3. A substrate transport apparatus according to claim 2, The relay means is, A mounting means on which the substrate is placed, The mounting means is provided with a lifting mechanism that moves the mounting means up and down between a first position and a second position, At the first position, the substrate is transported between the first transport means and the placement means described above. At the second position, the substrate is transported between the second transport means and the placement means. A substrate transport device characterized by the following features.

4. A substrate transport apparatus according to claim 2, The relay means includes a mounting means on which a substrate is placed, The mounting means comprises a plurality of slots on which a substrate is mounted, The aforementioned multiple slots are, The first slot on which the substrate is placed by the first transport means, The second means includes a second slot on which the substrate is placed, A substrate transport device characterized by the following features.

5. A substrate transport apparatus according to claim 4, The substrate before processing by the processing apparatus is placed in the first slot. The substrate processed by the processing apparatus is placed in the second slot. The first transport means receives the substrate placed in the second slot, The second transport means receives the substrate placed in the first slot. A substrate transport device characterized by the following features.

6. A substrate transport apparatus according to claim 1, A housing that forms the outer wall of the substrate transport device, The housing is supported by a support base on which the second transport means is supported, The first conveying means is A horizontal multi-jointed first arm that supports the circuit board, A first lifting means for raising and lowering the first arm, The first arm and the first lifting means are mounted on a moving means that moves them in the first direction, The second conveying means is, A second horizontal articulated arm supports the circuit board, The system comprises a second lifting mechanism for raising and lowering the second arm, A substrate transport device characterized by the following features.

7. A substrate transport apparatus according to claim 1, A housing that forms the outer wall of the substrate transport device, The enclosure comprises a partition that divides the space within the enclosure into a first space which is a space for transporting substrates by the first transport means and a second space which houses the second transport means, The partitioned section has a communication opening that connects the first space and the second space and forms a transport path for the substrate. A substrate transport device characterized by the following features.

8. A substrate transport apparatus according to claim 7, The partitioned section is, A bottom portion that divides the first space and the second space in the vertical direction, It has a side portion that divides the first space and the second space in the first direction, The side portion is a wall portion having the communication opening, The first conveying means is A horizontal multi-jointed first arm that supports the circuit board, The system includes a lifting mechanism for raising and lowering the first arm between a first height, which is lower than the second space and is used for loading and unloading substrates into and out of the container, and a second height, which is used for loading and unloading substrates into and out of the second space through the communication opening. A substrate transport device characterized by the following features.

9. A substrate transport apparatus according to claim 8, The aforementioned side portion is Located in the center of the space within the housing in the first direction, A substrate transport device characterized by the following features.

10. A substrate transport apparatus according to claim 8, The second space is provided with a relay means for relaying substrates between the first transport means and the second transport means, The relay means is disposed between the second transport means and the communication opening. A substrate transport device characterized by the following features.

11. A substrate transport apparatus according to claim 7, The housing comprises a first wall portion and a second wall portion facing the first wall portion. The first wall portion has a first opening that allows the first transport means to access the container, The second wall portion has a second opening through which the second transport means can access the processing apparatus. The second opening is formed at a higher position than the first opening. The first opening communicates with the first space, The second opening communicates with the second space. A substrate transport device characterized by the following features.

12. A substrate transport apparatus according to claim 1, The substrate transport device includes a housing that forms the outer wall of the substrate transport device, The housing comprises a first wall portion and a second wall portion facing the first wall portion. The first wall portion has a first opening that allows the first transport means to access the container, The second wall portion has a second opening through which the second transport means can access the processing apparatus. The second opening is formed at a higher position than the first opening. A substrate transport device characterized by the following features.

13. A substrate transport apparatus according to claim 7, A first blower means for drawing gas from outside the housing, removing impurities, and discharging it downward toward the first space, A second blowing means for removing impurities from the gas drawn in from outside the housing and discharging it downward toward the second space, The system includes a third blowing means for removing impurities from the gas drawn in from the second space and discharging it downward toward the first space. A substrate transport device characterized by the following features.

14. A substrate transport apparatus according to claim 13, The airflow rate of the third blower is controlled to be greater than the airflow rate of the first blower and the airflow rate of the second blower. A substrate transport device characterized by the following features.

15. A substrate transport apparatus according to claim 13, The first blower, the second blower, and the third blower are controlled such that the air pressure in the first space is greater than the air pressure in the second space. A substrate transport device characterized by the following features.

16. A substrate transport apparatus according to claim 1, The substrate transport device includes a housing that forms the outer wall and the transport space through which the substrates are transported, The aforementioned transport space is The first transport means is provided, and the first transport means transports the substrate in a first transport space, The second transport means is provided, and the second transport space includes the transport means transporting the substrate, The substrate is transported between the first transport space and the second transport space. A substrate transport device characterized by the following features.

17. A substrate transport apparatus according to claim 16, The aforementioned enclosure is A plurality of first openings through which a substrate being transported passes between the plurality of load ports and the first transport space, The apparatus includes a second opening through which a substrate being transported between the apparatus and the second transport space passes, A substrate transport device characterized by the following features.

18. A substrate transport apparatus according to claim 16, The first transport space is, A first region including the transport track, Including the first region and the second transport space, A substrate transport device characterized by the following features.

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