Piezoelectric vibrator

Abstract

This piezoelectric vibrator includes: a piezoelectric vibration element that includes a piezoelectric layer, an excitation electrode provided on the main surface on both sides of the piezoelectric layer in a thickness direction thereof, and an extraction electrode that is electrically connected to the excitation electrode and drawn out to a peripheral-edge side of the main surfaces of the piezoelectric layer; a first substrate provided on one main surface side of the piezoelectric layer; a first adhesive layer provided between the first substrate and the piezoelectric layer; a second substrate provided on the other main surface side of the piezoelectric layer; and a second adhesive layer provided between the second substrate and the piezoelectric layer. The second substrate has an external electrode provided on a peripheral-edge section of a surface of the second substrate opposite to the piezoelectric layer, the external electrode being electrically connected to the extraction electrode. When the surface of the second substrate opposite to the piezoelectric layer is viewed in plan view, the second substrate has a cutout section that exposes an inclined section of the second adhesive layer extending toward the outside of the second substrate, and the drawn-out end of the extraction electrode, respectively. A connection electrode for electrically connecting the external electrode and the drawn-out end is provided on the inclined surface of the second adhesive layer and on the cutout section of the second substrate.

Description

Technical Field

[0001] The present invention relates to a piezoelectric vibrator.

Background Art

[0002] Piezoelectric vibrators such as crystal vibration elements whose main vibration is thickness shear vibration are widely used as signal sources for reference signals used in oscillation devices, bandpass filters and the like. Such piezoelectric vibrators are required to have improved vibration characteristics or electrical characteristics.

[0003] For example, Patent Document 1 discloses a method for manufacturing a piezoelectric device, which includes: a step of preparing a base wafer; a step of preparing a piezoelectric wafer including a plurality of piezoelectric frames; a bonding step of bonding the piezoelectric wafer and the base wafer via an adhesive; a step of removing the adhesive exposed through through holes so that lead electrodes formed on the piezoelectric frames are exposed; and a step of forming connection electrodes connected to the lead electrodes so as to cover the bottom surface of the base wafer opposite to the side bonded to the piezoelectric wafer, the side surfaces of the through holes, the side surfaces of the adhesive, and the lead electrodes.

[0004] Further, for example, Patent Document 2 discloses a method for manufacturing a piezoelectric vibration device, which includes: a step of preparing a piezoelectric wafer including a plurality of piezoelectric frames; a step of forming excitation electrodes, lead electrodes, and first side electrodes that are electrically connected to each other on each piezoelectric frame of the piezoelectric wafer; a step of preparing two flat plate wafers including a plurality of flat plates; a step of forming external electrodes and second side electrodes electrically connected to the external electrodes on each flat plate; a step of bonding each of the two flat plate wafers to each main surface of the piezoelectric wafer via a non-conductive sealing layer; and a step of forming connection electrodes for electrically connecting the first side electrodes and the second side electrodes after the bonding step.

[0005] Further, for example, Patent Document 3 discloses a piezoelectric vibrator comprising a substrate and a piezoelectric vibration plate bonded via a metal adhesive layer, and connection electrodes that connect external electrodes provided on the substrate and excitation electrodes provided on the piezoelectric vibration plate and are provided on the surface of the metal adhesive layer.

Prior Art Documents

[0006] [Patent Document 1] Japanese Patent Publication No. 2011-176787 [Patent Document 2] Japanese Patent Publication No. 2012-015824 [Patent Document 3] Japanese Patent Publication No. 2000-223997 [Overview of the Initiative] [Problems that the invention aims to solve]

[0007] However, neither Patent Documents 1 nor 2 consider the possibility that the resonance frequency characteristics of the quartz oscillator may decrease due to the influence of the formation state of the adhesive layer, such as whether the adhesive layer is recessed relative to the outer surface of the piezoelectric vibrator and the substrate, or whether the cross-section of the adhesive layer protrudes in a circular shape, on the thickness and formation range of the connecting electrodes formed on the surface of the adhesive layer. Furthermore, Patent Document 3 describes a metal adhesive layer that bonds the substrate and the piezoelectric diaphragm, and the stress from the substrate. of The risk of the piezoelectric vibrator's frequency characteristics becoming unstable due to transmission to the piezoelectric diaphragm has not been considered.

[0008] This invention was made in view of these circumstances, and the object of this invention is to provide a piezoelectric vibrator that can stabilize frequency characteristics using a simple configuration, suppress the occurrence of poor connections between electrodes due to poor formation of connecting electrodes, and improve the stability of the resonant frequency. [Means for solving the problem]

[0009] A piezoelectric vibrator according to one aspect of the present invention comprises a piezoelectric vibrator element having a piezoelectric layer, excitation electrodes provided on the main surfaces on both sides in the thickness direction of the piezoelectric layer, and lead electrodes electrically connected to the excitation electrodes and led out to the peripheral edge side of the main surface of the piezoelectric layer, a first substrate provided on one main surface side of the piezoelectric layer, a first adhesive layer provided between the first substrate and the piezoelectric layer, a second substrate provided on the other main surface side of the piezoelectric layer, and a second adhesive layer provided between the second substrate and the piezoelectric layer, wherein the second substrate has an external electrode provided on the peripheral edge of the surface opposite to the piezoelectric layer and electrically connected to the lead electrodes, and when the surface of the second substrate opposite to the piezoelectric layer is viewed in plan, the second substrate has a notch that exposes an inclined portion of the second adhesive layer that extends outward from the second substrate and the lead end of the lead electrode, respectively, and the inclination of the second adhesive layer The part and the second substrate A piezoelectric vibrator is provided with a connecting electrode in the notched portion that electrically connects the external electrode and the lead end. [Effects of the Invention]

[0010] According to the present invention, it is possible to provide a piezoelectric vibrator that uses a simple configuration to stabilize frequency characteristics, suppress the occurrence of poor connections between electrodes due to poor formation of connecting electrodes, and improve the stability of the resonant frequency. [Brief explanation of the drawing]

[0011] [Figure 1] This is an exploded perspective view showing the configuration of a quartz crystal oscillator according to the first embodiment. [Figure 2] This is a cross-sectional view taken along line II-II in Figure 1. [Figure 3] This is a diagram illustrating the connection relationships between the electrodes of a quartz crystal oscillator according to the first embodiment. [Figure 4] This is a diagram illustrating a method for manufacturing a quartz crystal oscillator according to the first embodiment. [Figure 5] This is a diagram illustrating the connection relationships between the electrodes of a quartz crystal oscillator according to the second embodiment. [Figure 6] This is a diagram illustrating the connection relationships between the electrodes of a quartz crystal oscillator according to the third embodiment. [Figure 7]This is a diagram for explaining a modification of the shield electrode arrangement of the first substrate of the crystal unit according to the third embodiment. [Figure 8] This is a diagram for explaining the connection relationship between the electrodes of the crystal unit according to the fourth embodiment. [Figure 9] This is a diagram for explaining a modification of the shield electrode arrangement of the first substrate of the crystal unit according to the fourth embodiment. [Figure 10] This is a diagram for explaining the connection relationship between the electrodes of the crystal unit according to the fifth embodiment. [Figure 11] This is a diagram for explaining the manufacturing method of the crystal unit according to the fifth embodiment. [Figure 12] This is a diagram for explaining the manufacturing method of the crystal unit according to the fifth embodiment. [Figure 13] This is a diagram for explaining the connection relationship between the electrodes of the crystal unit according to the sixth embodiment. [Figure 14] This is a diagram for explaining the connection relationship between the electrodes of the crystal unit according to the seventh embodiment. [Figure 15] This is a diagram for explaining the connection relationship between the electrodes of the crystal unit according to the seventh embodiment. [Modes for Carrying Out the Invention]

[0012] Embodiments of the present invention are described below. In the following description of the drawings, the same or similar constituent elements are denoted by the same or similar reference numerals. The drawings are illustrative, the dimensions and shapes of respective parts are schematic, and the technical scope of the present invention should not be construed as being limited to the aforementioned embodiments.

[0013] [First Embodiment] <Overview of Crystal Unit 1> First, the configuration of the Quartz Crystal Resonator Unit (QC) 1 according to the first embodiment will be described with reference to Figures 1 and 2. Figure 1 is an exploded perspective view showing the configuration of the QC 1. Figure 2 is a cross-sectional view taken along line II-II in Figure 1. Note that Figures 1 and 2 are schematic diagrams showing the connection relationships between the electrodes of the QC 1, and do not represent the actual shapes of each component of the QC 1.

[0014] The quartz crystal resonator 1 is an example of a piezoelectric resonator. As shown in Figures 1 and 2, the quartz crystal resonator 1 comprises a first substrate 10, a second substrate 20, a quartz crystal resonator 30, a first adhesive layer 40 provided between the first substrate 10 and the quartz crystal resonator 30, a second adhesive layer 50 provided between the second substrate 20 and the quartz crystal resonator 30, and a pair of connecting electrodes 60 provided on the outer circumferential surface of the quartz crystal resonator 1.

[0015] The first substrate 10, the second substrate 20, and the quartz oscillator 30 are each in the shape of a plate. The first adhesive layer 40 is in the shape of a frame corresponding to the outer shape of the first substrate 10, and the second adhesive layer 50 is in the shape of a frame corresponding to the outer shape of the frame of the second substrate 20. As shown in Figure 2, the first substrate 10 and the second substrate 20 are bonded to both main surfaces in the thickness direction of the plate shape of the quartz oscillator 30 (the first main surface 301 and the second main surface 302, which will be described later) via the first adhesive layer 40 and the second adhesive layer 50, respectively.

[0016] Furthermore, the crystal oscillator 1 is mounted on an external substrate (not shown) for supplying input and output signals to the crystal oscillator 1. Electrodes are provided on both the second substrate 20 and the crystal oscillator 30 for transmitting input and output signals supplied from the external substrate. A pair of connecting electrodes 60 are provided on the outer surface of the crystal oscillator 1 to electrically connect the aforementioned electrodes provided on the crystal oscillator 30 and the second substrate 20, respectively. When the crystal oscillator 1 is mounted on the external substrate, it is positioned so that the electrodes on the second substrate 20 are mounted on the external substrate.

[0017] In the following, the state in which the components of the quartz oscillator 1 are assembled and the quartz oscillator 1 is constructed may be referred to as the "assembled state." In the assembled state, both the thickness direction of the quartz oscillator 1 and the thickness direction of each component of the quartz oscillator 1 coincide with the Z' axis direction shown in Figure 1.

[0018] <Details of Quartz Oscillator 1> Next, the details of each component of the quartz oscillator 1 will be explained with reference to Figures 1 to 3. Figure 3 is a diagram illustrating the connection relationships between the electrodes of the quartz oscillator 1. Furthermore, the following explanation will proceed in the order of the quartz oscillator element 30, the first substrate 10, the second substrate 20, the second adhesive layer 50, the first adhesive layer 40, and the connecting electrodes 60.

[0019] (Crystal oscillator 30) The quartz oscillator 30 is an example of a piezoelectric oscillator. The quartz oscillator 30 comprises a crystalline lens 31 and an electrode pattern formed on the crystalline lens 31. The electrode pattern of the quartz oscillator 30 includes a pair of excitation electrodes 32 and a pair of extraction electrodes 33 electrically connected to the pair of excitation electrodes 32.

[0020] The crystalline lens 31 is an example of a piezoelectric layer. The crystalline lens 31 is, for example, an AT-cut quartz substrate. An AT-cut quartz substrate is cut from synthetic quartz crystal with the plane parallel to the plane specified by the X-axis and Y-axis (hereinafter referred to as the "XY-plane"; the same applies to planes specified by other axes) as the main plane, where the Y-axis and Z-axis are rotated 35 degrees 15 minutes ± 1 minute 30 seconds around the X-axis to obtain the Y'-axis and Z'-axis, respectively. The quartz oscillator 30 employing the AT-cut crystalline lens 31 uses the thickness shear vibration mode as its main vibration mode. The cut angle of the crystalline lens 31 is not limited, and for example, BT-cut, GT-cut, or SC-cut may be applied.

[0021] Furthermore, the crystalline lens 31 has a plate shape. The crystalline lens 31 has a first main surface 301 and a second main surface 302 located on both sides in the thickness direction of the plate shape, and an element outer peripheral surface 303 that constitutes the side surface of the plate shape. When viewing any of the main surfaces of the crystalline lens 31 from above, the crystalline lens 31 has a central portion 311, a peripheral portion 312 located around the central portion 311, and a through portion 313 provided between the central portion 311 and the peripheral portion 312.

[0022] The central portion 311 is primarily the vibrating part that performs thickness-slip vibration of the quartz crystal oscillator 30. The peripheral portion 312 is the part that supports the central portion 311. The through portion 313 is a slot that penetrates the quartz crystal 31 in the thickness direction. The through portion 313 allows the peripheral portion 312 to support the central portion 311 and reduces the restraining force that the peripheral portion 312 exerts on the vibration of the central portion 311, thereby improving the stability of the resonant frequency of the central portion 311.

[0023] The pair of excitation electrodes 32 are electrodes that cause the central portion 311 to vibrate in thickness when a voltage is applied. As shown in Figure 2, the pair of excitation electrodes 32 includes a first excitation electrode 321 provided in the central region on the first main surface 301 side of the central portion 311, and a second excitation electrode 322 provided in the central region on the second main surface 302 side of the central portion 311. In other words, the first excitation electrode 321 and the second excitation electrode 322 are provided at corresponding positions on the first main surface 301 and the second main surface 302, so as to sandwich the central portion 311. Furthermore, below, if the first excitation electrode 321 and the second excitation electrode 322 are not distinguished, they may be referred to as "excitation electrodes 32". The same applies to other configurations of the quartz oscillator 1.

[0024] Furthermore, the excitation electrode 32 is a metal film made of the same material. For example, the excitation electrode 32 may consist of a chromium (Cr) layer as a base layer and a gold (Au) layer on the surface of the chromium layer. Also, the other electrodes of the quartz oscillator 30 are made of the same material as the excitation electrode 32. However, each electrode of the quartz oscillator 1 may be made of different materials.

[0025] The pair of extraction electrodes 33 are electrically connected to the pair of excitation electrodes 32 and provided on the peripheral portion 312 of the crystalline lens 31, so as to extract the pair of excitation electrodes 32 to the peripheral portion 312 of the crystalline lens 31. Specifically, the pair of extraction electrodes 33 include a first extraction electrode 331 electrically connected to the first excitation electrode 321 and provided so as to straddle the first main surface 301, the element outer surface 303, and the second main surface 302 of the peripheral portion 312, and a second extraction electrode 332 electrically connected to the second excitation electrode 322 and provided on the second main surface 302 of the peripheral portion 312.

[0026] The portions provided on the second main surface 302 of the first lead electrode 331 and the second lead electrode 332 each have a first lead end 341 and a second lead end 342, which are provided at two corners on one diagonal of the second main surface 302 of the peripheral portion 312. Hereinafter, the first lead end 341 and the second lead end 342 may be collectively referred to as the "pair of lead ends 34".

[0027] (First substrate 10) The first substrate 10 comprises a first substrate body 11. The first substrate 10 may also be provided with electrodes such as shield electrodes formed on the first substrate body 11.

[0028] The first substrate body 11 has a plate shape. The first substrate body 11 has main surfaces 101 and 102 on both sides in the thickness direction of the plate shape, and a first outer peripheral surface 103 that constitutes the side surface of the plate shape. In the assembled state, the first substrate 10 is bonded to the first main surface 301 of the quartz crystal oscillator 30 via the first adhesive layer 40, such that the main surface 102 faces the first main surface 301 of the quartz crystal oscillator 30. When the main surface 101 is viewed from above, the plan view shape of the first outer peripheral surface 103 overlaps with the plan view shape of the outer peripheral surface 303 of the quartz crystal oscillator 30.

[0029] Furthermore, the first substrate body 11 is made of glass or quartz. The first substrate body 11 may also be made of other light-transmitting materials or semiconductor materials such as silicon. If the first substrate body 11 is made of a semiconductor material, an integrated circuit constituting an oscillation circuit can be formed on the semiconductor material.

[0030] (Second board 20) The second substrate 20 comprises a second substrate body 21 and an electrode pattern formed on the second substrate body 21. The electrode pattern of the second substrate body 21 includes a pair of external electrodes 22 for transmitting input / output signals from an external substrate to other electrodes of the crystal oscillator 1, and two external electrodes 23 that do not transmit input / output signals from an external substrate to other electrodes of the crystal oscillator 1.

[0031] The second substrate body 21 is in the shape of a plate. The second substrate body 21 has main surfaces 201 and 202 on both sides in the thickness direction of the plate shape, and a second outer peripheral surface 203 that constitutes the side surface of the plate shape. Main surface 202 is an example of the surface opposite to the crystal 31. In the assembled state, the second substrate 20 is bonded to the second main surface 302 of the crystal oscillating element 30 via the second adhesive layer 50 such that the main surface 201 faces the second main surface 302 of the crystal oscillating element 30.

[0032] The second outer peripheral surface 203 has two notches 204 provided at the corners corresponding to a pair of lead-out ends 34, and an outer peripheral surface portion 205 connected to each of the two notches 204. In the assembled state, when the main surface 202 of the second substrate body 21 is viewed from above, the notches 204 are formed to expose the portion of the second adhesive layer 50 corresponding to the notches 204 (the inclined portion 504 of the second adhesive layer 50, described later) and the lead-out ends 34 of the lead-out electrodes 33 of the second substrate 20, respectively. In other words, the lead-out ends 34 are located on the outer peripheral surface side of the crystal oscillator 1 than the edge L of the notches 204. On the other hand, the plan view shape of the outer peripheral surface portion 205 overlaps with the plan view shape of the element outer peripheral surface 303.

[0033] Furthermore, the second substrate body 21 is made of the same material as the first substrate body 11, namely glass or quartz. However, the second substrate body 21 may be made of a different material than the first substrate body 11, for example, another light-transmitting material or a semiconductor material such as silicon.

[0034] The pair of external electrodes 22 and the two external electrodes 23 are formed at the four corners on the periphery of the main surface 202 of the second substrate body 21. The pair of external electrodes 22 is an example of mounting electrodes to be mounted on the external substrate. The pair of external electrodes 22 is provided at the corners corresponding to each of the pair of lead-out ends 34 of the main surface 202 (i.e., the corners corresponding to the two notches 204). Specifically, the pair of external electrodes 22 has a first external electrode 221 corresponding to the first lead-out end 341 and a second external electrode 222 corresponding to the second lead-out end 342. The two external electrodes 23 are provided at the other corners of the main surface 202. Solder bumps (not shown) for mounting the crystal oscillator 1 to the external substrate may be provided on each of the pair of external electrodes 22 and the two external electrodes 23.

[0035] In the assembled state, the pair of external electrodes 22 are electrically connected to the pair of lead-out ends 34 of the quartz oscillator 30 by the pair of connecting electrodes 60. In this way, the pair of external electrodes 22 are electrically connected to the pair of excitation electrodes 32 via the pair of connecting electrodes 60 and the pair of lead-out ends 34. Furthermore, the pair of external electrodes 22 are also electrically connected to the electronic elements of the external substrate by solder.

[0036] The two external electrodes 23 do not receive input / output signals from electronic elements on the external substrate. Furthermore, at least one of the two external electrodes 23 may be a grounding electrode to which ground potential is supplied.

[0037] (2nd adhesive layer 50) The second adhesive layer 50 is an example of an adhesive material that has the function of an adhesive for bonding the second substrate 20 to the second main surface 302 of the crystal oscillator 30, and the function of a sealing frame for sealing the space between the second substrate 20 and the crystal oscillator 30. The second adhesive layer 50 has two inclined portions 504 corresponding to two notches 204 on the second outer peripheral surface 203 of the second substrate 20, and connecting portions 505 connected to each of the two inclined portions 504.

[0038] As shown in Figure 3, the inclined portion 504 has a surface that is inclined outward from the second adhesive layer 50 with respect to the edge L between the notch portion 204 of the second substrate 20 and the main surface 201. In the assembled state, when the main surface 202 of the second substrate body 21 is viewed from above, the inclined portion 504 is formed to spread outward from the second substrate 20 and be exposed from the notch portion 204. On the other hand, since the plan view shape of the outer peripheral surface portion 205 overlaps with the plan view shape of the outer peripheral surface 303 of the element, the connecting portion 505 is not formed in an inclined portion like the inclined portion 504, but is formed to have a rounded side surface that connects the outer peripheral surface portion 205 and the outer peripheral surface 303 of the element.

[0039] Furthermore, the second adhesive layer 50 is formed, for example, by heat curing a resin adhesive under pressure and heat. Therefore, the shape of the inclined portion 504 of the second adhesive layer 50 is determined by the bonding conditions, which include the amount of resin adhesive applied, the pressure applied when bonding the first substrate 10 to the quartz oscillator 30 (i.e., the pressure applied to the resin adhesive), and the shape of the first outer surface 103 of the first substrate 10 and the outer surface 303 of the quartz oscillator 30. The formation of the inclined portion 504 will be explained in the manufacturing method of the quartz oscillator 1.

[0040] (1st adhesive layer 40) The first adhesive layer 40 is an example of an adhesive material that has the function of an adhesive for bonding the first substrate 10 to the first main surface 301 of the quartz crystal oscillator 30, and the function of a sealing frame for sealing the space between the first substrate 10 and the quartz crystal oscillator 30. The first adhesive layer 40, like the second adhesive layer 50, is formed by heat curing a resin adhesive under pressure and heat.

[0041] (Connecting electrode 60) The pair of connecting electrodes 60 are used to electrically connect the pair of excitation electrodes 32 and the pair of external electrodes 22. the connection This is an example of a connecting electrode. As shown in Figure 3, the connecting electrode 60 is provided in the notch 204 and the inclined portion 504 to electrically connect the external electrode 22 and the lead end 34 of the lead electrode 33. With such a connecting electrode 60, the excitation electrode 32 is electrically connected to the pair of external electrodes 22 via the connecting electrode 60 and the lead electrode 33. The surface of the connecting electrode 60 may also be covered with a plating film, which is not shown.

[0042] <Method for manufacturing a quartz crystal oscillator 1> Next, an example of a method for manufacturing a quartz oscillator 1 will be described with reference to Figures 1 to 4. Note that the quartz oscillator 1 may be manufactured by other methods. Here, as shown in Figure 4, the quartz oscillator 1 is formed in the form of a wafer containing multiple quartz oscillators 1. Hereinafter, the wafers corresponding to the first substrate 10, the second substrate 20, and the quartz oscillator element 30 of the quartz oscillator 1 will be called the "first substrate wafer 100," the "second substrate wafer 200," and the "piezoelectric wafer 300," respectively. The adhesive body to which the "first substrate wafer 100," the "second substrate wafer 200," and the "piezoelectric wafer 300" are bonded will be called the "wafer adhesive body 400," and each quartz oscillator 1 of the wafer adhesive body 400 before some electrodes are formed will be called the "adhesive body 500."

[0043] First, the first substrate wafer 100, the second substrate wafer 200, and the piezoelectric wafer 300 are prepared. In the second substrate wafer 200, each of the multiple second substrates 20 has a notch 204 formed therein. In the piezoelectric wafer 300, each of the multiple quartz oscillators 30 has an excitation electrode 32 and an extraction electrode 33 formed therein.

[0044] Next, the first substrate wafer 100 and the piezoelectric wafer 300 are bonded together. Specifically, a resin adhesive is applied to the peripheral side of the first main surface 301 of each quartz oscillator 30 contained in the piezoelectric wafer 300, and then, under pressure, each first main surface 301 of the piezoelectric wafer 300 is bonded to the first substrate wafer 100 toward each main surface 102 of the first substrate wafer 100. When the resin adhesive is heat-cured, a first adhesive layer 40 is formed between each first substrate 10 of the first substrate wafer 100 and each quartz oscillator 30 of the piezoelectric wafer 300. This first adhesive layer 40 integrally bonds each first substrate 10 and each quartz oscillator 30.

[0045] Next, the piezoelectric wafer 300 and the second substrate wafer 200 are bonded together. Specifically, a predetermined amount of resin adhesive is applied to the peripheral edge of the main surface 201 of each second substrate 20 of the second substrate wafer 200 so as to form inclined portions 504 after the resin adhesive described above has been heat-cured. Then, under predetermined pressure, each main surface 201 of the second substrate wafer 200 is bonded to the piezoelectric wafer 300, facing each second main surface 302 of the piezoelectric wafer 300. When the resin adhesive is heat-cured, a second adhesive layer 50 having inclined portions 504 is formed between each second substrate 20 of the second substrate wafer 200 and each quartz oscillator 30 of the piezoelectric wafer 300. This second adhesive layer 50 integrally bonds each first substrate 10 and each quartz oscillator 30. A wafer bond 400 including multiple bonded bodies 500 is then formed.

[0046] Here, we will explain in detail the formation of the inclined portion 504 of the second adhesive layer 50. When a certain pressure is applied to the resin adhesive between the second substrate 20 and the quartz crystal oscillator 30, the distance between the second substrate 20 and the quartz crystal oscillator 30 decreases. As a result, a portion of the resin adhesive spreads toward the outer circumferential surfaces of the second substrate 20 and the quartz crystal oscillator 30, respectively. Also, as described above, since the lead end 34 is located on the outer circumferential surface side of the quartz crystal oscillator 1 than the edge L of the notch 204, when the portion of the resin adhesive that spreads along the main surface 201 of the second substrate 20 (hereinafter referred to as the "second portion of the resin adhesive") reaches the edge L of the notch 204, there is no longer any surface to stretch it. The spreading of the second portion of the resin adhesive then stops at the edge L of the notch 204. In contrast, even if the spread of the second portion of the resin adhesive stops at the edge L of the notch 204, if the portion of the resin adhesive that spreads along the second main surface 302 of the crystal oscillator 30 (hereinafter referred to as the "first portion of the resin adhesive") continues to be pressurized, it will continue to spread along the second main surface 302 of the crystal oscillator 30. When the first portion of the resin adhesive reaches the draw-out end 34, the pressurization of the resin adhesive stops. At that time, a portion of the resin adhesive forms a part having a surface that slopes outward from the second substrate 20 with respect to the edge L of the notch 204. Subsequently, when the resin adhesive is heated and heat-cured, the aforementioned sloped portion becomes a sloped portion 504. In this way, a second adhesive layer 50 having a sloped portion 504 is formed.

[0047] Furthermore, since the plan view shape of the outer peripheral surface portion 205 overlaps with the plan view shape of the element outer peripheral surface 303, when the resin adhesive corresponding to the outer peripheral surface portion 205 is pressurized, the portions on both sides that contact the main surface 201 portion of the second substrate 20 and the second main surface 302 of the crystal oscillator 30, respectively, can stretch uniformly along the main surface 201 portion and the second main surface 302, respectively. On the other hand, depending on the surface tension and other bonding conditions of the resin adhesive corresponding to the outer peripheral surface portion 205, the portion of the resin adhesive corresponding to the outer peripheral surface portion 205 between the main surface 201 portion of the second substrate 20 and the second main surface 302 of the crystal oscillator 30 protrudes or recesses in a rounded manner relative to the portions on both sides of the resin adhesive. As a result, the connecting portion 505 corresponding to the outer peripheral surface portion 205 is not formed as an inclined portion like the inclined portion 504, but is formed to have a rounded side surface that connects the outer peripheral surface portion 205 and the element outer peripheral surface 303.

[0048] Returning to the explanation of the manufacturing method for the quartz oscillator 1, after the wafer adhesive 400 is formed, external electrodes 22 and 23 are formed on each adhesive 500 of the wafer adhesive 400, and connecting electrodes 60 that are electrically connected to the external electrodes 22 are formed. Specifically, sputtering or vacuum deposition is performed toward the main surface 202 of each second substrate 20 of the wafer adhesive 400.

[0049] As described above, when the main surface 202 of the second substrate 20 is viewed from above, the notch 204 of the second substrate 20 is formed to expose the inclined portion 504 of the second adhesive layer 50 corresponding to the notch 204 of the second substrate 20, and the lead end 34 of the lead electrode 33 of the second substrate 20. Therefore, when sputtering or vacuum deposition is performed, the metal films constituting each electrode can be formed on the surfaces of the notch 204 of the second substrate 20, the inclined portion 504 of the second adhesive layer 50, and the lead end 34, respectively, corresponding to the formation positions of the external electrode 22. The connecting electrode 60 can then electrically connect the external electrode 22 and the lead end 34 of the lead electrode 33. As a result, the external electrode 22 of the second substrate 20 can be electrically connected to the excitation electrode 32 of the quartz oscillator 30 via the connecting electrode 60 and the lead electrode 33.

[0050] Subsequently, a plating film (not shown) is formed on the surfaces of the connecting electrode 60, the external electrode 22, the external electrode 23, and the lead-out end 34 that protrudes from the second adhesive layer 50, and the manufacturing of each of the multiple quartz oscillators 1 contained in the wafer is completed. Alternatively, the plating film may be formed only on a portion of the surface of the lead-out end 34 that protrudes from the second adhesive layer 50.

[0051] An exemplary first embodiment of the present invention has been described above. A crystal oscillator 1 according to one embodiment of the present invention comprises a crystal 31 which is an example of a piezoelectric layer, an excitation electrode 32 provided on the first main surface 301 and the second main surface 302 on both sides of the thickness direction of the crystal 31, and a lead electrode 33 which is electrically connected to the excitation electrode 32 and is drawn out to the peripheral edge side of the second main surface 302 of the crystal 31, a first substrate 10 provided on the first main surface 301 side of the crystal 31, and a first adhesive layer 4 provided between the first substrate 10 and the crystal 31. The lens 31 comprises a second substrate 20 provided on the second main surface 302 side of the lens 31, and a second adhesive layer 50 provided between the second substrate 20 and the lens 31. The second substrate 20 has external electrodes 22 provided at four corners on the peripheral edge of the main surface 202, which is the side opposite to the lens 31, and electrically connected to the lead-out electrode 33. When the main surface 202 is viewed from above, the second substrate 20 has notches that expose the inclined portion 504 of the second adhesive layer 50 that extends outward from the second substrate 20, and the lead-out end 34 of the lead-out electrode 33. 204 The second adhesive layer 50 is provided with connecting electrodes 60 that electrically connect the external electrode 22 and the lead end 34 in the inclined portion 504 and the notched portion 204.

[0052] Thus, with the simple configuration of the inclined portion 504 of the second adhesive layer 50, a connecting electrode 60 that can reliably electrically connect the external electrode 22 and the lead electrode 33 can be formed in the notched portion 204 and the inclined portion 504 by sputtering or vacuum deposition alone. The connecting electrode 60 formed in this way can suppress the occurrence of formation defects on the adhesive layer surface of conventional connecting electrodes 60, as well as reduce the manufacturing cost of the connecting electrode 60 and improve the connection stability of the electrodes of the quartz oscillator 1. As a result, with the above configuration, the frequency characteristics can be stabilized using a simple configuration, the risk of disconnection of the connecting electrode 60 due to formation defects in the connecting electrode 60 can be reduced, and the occurrence of connection defects between the external electrode 22 and the excitation electrode 32 can be suppressed, thereby improving the stability of the resonant frequency of the quartz oscillator 30.

[0053] Furthermore, in the quartz oscillator 1 described above, the surfaces of the pair of connecting electrodes 60 may be covered with a plating film.

[0054] The above-mentioned plating film further reduces the risk of disconnection of the connecting electrode 60 due to electrode peeling or the like.

[0055] [Second Embodiment] Next, the configuration of the crystal oscillator 2 according to the second embodiment will be described with reference to Figure 5. Figure 5 is a diagram illustrating the connection relationships between the electrodes of the crystal oscillator 2 according to the second embodiment. In the following description, the crystal oscillator 2 according to the second embodiment and the same configuration as the crystal oscillator 1 according to the first embodiment will be denoted by the same reference numerals as in the first embodiment, and detailed descriptions of their configurations will be omitted. The same applies to the third and fourth embodiments described later.

[0056] The difference between the quartz oscillator 2 according to the second embodiment and the quartz oscillator 1 according to the first embodiment is that the quartz oscillator 2 according to the second embodiment further includes a third substrate 70 between the quartz oscillator element 30 and the second substrate 20.

[0057] The third substrate 70 is, for example, a thermistor. The second substrate 20 and the third substrate 70 are examples of multiple substrates provided on the second main surface side of the crystalline lens 31. The third substrate 70 has a third substrate body 71. The third substrate body 71 is plate-shaped. The third substrate body 71 has main surfaces 701 and 702 on both sides in the thickness direction of the plate shape, and an outer peripheral surface 703 that constitutes the side surface of the plate shape. The outer peripheral surface 703 has two notches 704 provided at the corners corresponding to a pair of lead-out ends 34, and an outer peripheral surface portion connected to each of the two notches 704.

[0058] A third adhesive layer 80 is provided between the main surface 701 of the third substrate 70 and the second main surface 302 of the quartz crystal oscillator 30. A second adhesive layer 50 is provided between the main surface 702 of the third substrate 70 and the main surface 201 of the second substrate 20. The third substrate 70 is bonded to the quartz crystal oscillator 30 and the second substrate 20, respectively, by the third adhesive layer 80 and the second adhesive layer 50.

[0059] The third adhesive layer 80 has two inclined portions 804 corresponding to two notches 704 on the outer peripheral surface 703 of the third substrate 70, and two inclined portions 804 Each of them has a connecting portion connected to it. The inclined portion 804 is, as shown in Figure 5, the notch portion 704 of the third substrate 70 and the main surface 701 The configuration has a surface that is inclined outward with respect to the edge L2 of the third substrate 70. The method for forming the inclined portion 804 is the same as that for the inclined portion 504.

[0060] In the assembled state, when the main surface 702 of the third substrate 70 is viewed from above, the notch 704 of the third substrate 70 exposes the inclined portion 804 of the third adhesive layer 80 and the lead end 34 of the lead electrode 33, respectively. Also, when the main surface 202 of the second substrate 20 is viewed from above, the notch 204 of the second substrate 20 exposes the inclined portion 504 of the second adhesive layer 50, a part of the main surface 702 of the third substrate 70, the notch 704 of the third substrate 70, the inclined portion 804 of the third adhesive layer 80, and the lead end 34 of the lead electrode 33, respectively.

[0061] In this case, the connecting electrode 90 is provided in the notch 204 of the second substrate 20, the inclined portion 504 of the second adhesive layer 50, a part of the main surface 702 of the third substrate 70, the notch 704 of the third substrate 70, and the inclined portion 804 of the third adhesive layer 80, so as to be electrically connected to the external electrode 22 and the leading end 34 of the leading electrode 33. As a result, the external electrode 22 of the second substrate 20 is electrically connected to the excitation electrode 32 of the quartz oscillator 30 via the connecting electrode 90 and the leading electrode 33. The method for forming the connecting electrode 90 is the same as that for the connecting electrode 60.

[0062] According to the above-described configuration of the crystal oscillator 2 in the second embodiment, the effects of the first embodiment described above can be realized, and in the thermistor-integrated crystal oscillator 2, the frequency can be adjusted to a narrow tolerance by forming electrodes and adjusting the frequency after bonding components other than the first substrate 10.

[0063] [Third Embodiment] Next, the configuration of the crystal oscillator 3 according to the third embodiment will be described with reference to Figures 6 and 7. Figure 6 is a diagram illustrating the connection relationship between the electrodes of the crystal oscillator 3 according to the third embodiment. Figure 7 is a diagram illustrating a modified example of the shield electrode arrangement of the first substrate 10 of the crystal oscillator 3 according to the third embodiment.

[0064] The difference between the quartz oscillator 3 according to the third embodiment and the quartz oscillator 1 according to the first embodiment is that the shield electrode 110 is formed on the entire surface of the main surface 102 of the first substrate 10 according to the third embodiment (see Figure 6) and the configuration of the quartz oscillator element 130.

[0065] The quartz oscillator 130 has a crystalline lens 131. The crystalline lens 131 is plate-shaped. The crystalline lens 131 has main surfaces 1301 and 1302 on both sides in the thickness direction of the plate shape, and an outer peripheral surface 1303 that constitutes the side surface of the plate shape. The outer peripheral surface 1303 has two notches 1304 provided at the corners corresponding to a pair of lead-out ends 34, and outer peripheral surface portions connected to each of the two notches 1304.

[0066] A first adhesive layer 140 is provided between the main surface 1301 of the quartz crystal oscillator 130 and the main surface 102 of the first substrate 10. The quartz crystal oscillator 130 is bonded to the first substrate 10 by the first adhesive layer 140.

[0067] The first adhesive layer 140 has two inclined portions 1404 corresponding to two notches 1304 on the outer circumferential surface 1303 of the quartz crystal oscillator 130, and connecting portions connected to each of the two inclined portions 1404. As shown in Figure 6, the inclined portions 1404 have surfaces that are inclined outward from the crystalline lens 131 with respect to the edge L3 between the notch 1304 of the quartz crystal oscillator 130 and the main surface 1301. The method for forming the inclined portions 1404 is the same as that for the inclined portions 504.

[0068] In the assembled state, when the main surface 1302 of the crystalline lens 131 is viewed from above, the notch 1304 of the crystalline lens 131 exposes the inclined portion 1404 of the first adhesive layer 40 and a part of the shield electrode 110 of the first substrate 10. Also, when the main surface 202 of the second substrate 20 is viewed from above, the notch 204 of the second substrate 20 exposes the inclined portion 504 of the second adhesive layer 50, the lead end 34 of the lead electrode 33 of the quartz crystal oscillator 130, the notch 1304 of the quartz crystal oscillator 130, the inclined portion 1404 of the first adhesive layer 140, and a part of the shield electrode 110 of the first substrate 10.

[0069] In this case, the connecting electrode 150 electrically connects the external electrode 22, the extraction electrode 33, and the excitation electrode 32 to the shield electrode 110 through the notch 20 of the second substrate 20. 4、 The connecting electrodes are provided on the inclined portion 504 of the second adhesive layer 50, the lead end 34 of the lead electrode 33 of the quartz oscillator 130, the notch 1304 of the quartz oscillator 130, and the inclined portion 1404 of the first adhesive layer 140. As a result, the connecting electrodes 150 allow the external electrode 22, the lead electrode 33, and the excitation electrode 32 to be electrically connected to the shield electrode 110. Furthermore, the method for forming the connecting electrodes 150 is the same as that for the connecting electrodes 60.

[0070] According to the above-described configuration of the quartz oscillator 3 in the third embodiment, the effects of the first embodiment described above can be realized, and the shield electrode 110 cancels the effect of electromagnetic wave noise on the quartz oscillator 3, thereby enabling the quartz oscillator 3 to be applied to oscillators and the like.

[0071] Note that the shield electrode 110 may be formed on the main surface 101 of the first substrate 10, as shown in Figure 7, rather than on the main surface 102 of the first substrate 10. In this case, the connecting electrode 150 is provided on the notch 204 of the second substrate 20, the inclined portion 504 of the second adhesive layer 50, the lead end 34 of the lead electrode 33 of the quartz oscillator 130, the notch 1304 of the quartz oscillator 130, the inclined portion 1404 of the first adhesive layer 140, and a part of the outer circumferential surface of the first substrate 10, so as to electrically connect the external electrode 22, the lead electrode 33, and the excitation electrode 32 to the shield electrode 110.

[0072] [Fourth Embodiment] Next, the configuration of the quartz oscillator 4 according to the fourth embodiment will be described with reference to Figures 8 and 9. Figure 8 is a diagram illustrating the connection relationship between the electrodes of the quartz oscillator 4 according to the fourth embodiment. Figure 9 is a diagram illustrating a modified example of the shield electrode arrangement of the first substrate 160 of the quartz oscillator 4 according to the fourth embodiment.

[0073] The difference between the quartz oscillator 4 according to the fourth embodiment and the quartz oscillator 1 according to the first embodiment is the configuration of the first substrate 160 according to the fourth embodiment.

[0074] The first substrate 160 has a first substrate body 161. The first substrate body 161 is plate-shaped. The first substrate body 161 has main surfaces 1601 and 1602 on both sides in the thickness direction of the plate shape, and an outer peripheral surface 1603 that constitutes the side surface of the plate shape. In the example shown in Figure 8, a shield electrode 110 is formed on the entire surface of the main surface 1601. The outer peripheral surface 1603 has two notches 1604 provided at the corners corresponding to a pair of lead-out ends 34, and an outer peripheral surface portion connected to each of the two notches 1604.

[0075] A first adhesive layer 170 is provided between the main surface 1602 of the first substrate body 161 and the first main surface 301 of the quartz crystal oscillator 30. The first substrate 160 is bonded to the quartz crystal oscillator 30 by the first adhesive layer 170.

[0076] The first adhesive layer 170 has two inclined portions 1704 corresponding to two notches 1604 on the outer peripheral surface 1603 of the first substrate 160, and connecting portions connected to each of the two inclined portions 1704. As shown in Figure 8, the inclined portions 1704 have a surface that is inclined outward from the first substrate body 161 with respect to the edge L4 between the notch 1604 of the first substrate 160 and the main surface 1602. The method for forming the inclined portions 1704 is the same as that for the inclined portions 504.

[0077] In the assembled state, when the main surface 1601 of the first substrate 160 is viewed from above, the notch 1604 exposes the inclined portion 1704 of the first adhesive layer 170 and a portion of the peripheral edge 312 of the crystalline lens 31, respectively.

[0078] In this case, the connecting electrode 180 is provided in the notch 204 of the second substrate 20, the inclined portion 504 of the second adhesive layer 50, the lead end 34 of the lead electrode 33 of the quartz crystal oscillator 30, a part of the peripheral portion 312 of the crystalline lens 31, the inclined portion 1704 of the first adhesive layer 170, and the notch 1604 of the first substrate 160, so as to electrically connect the external electrode 22, the lead electrode 33, and the excitation electrode 32 to the shield electrode 110. As a result, the connecting electrode 180 allows the external electrode 22, the lead electrode 33, and the excitation electrode 32 to be electrically connected to the shield electrode 110. Furthermore, the method for partially forming the connecting electrode 180 between the second substrate 20 and the quartz crystal oscillator 30 is the same as that for the connecting electrode 60. The method for partially forming the connection electrode 180 between the first substrate 160 and the quartz oscillator 30 is to perform sputtering or vacuum deposition processing toward the main surface 1601 of the first substrate 160.

[0079] Crystal oscillator according to the fourth embodiment 3According to the above-described configuration, the effects of the first embodiment described above can be realized, and the shield electrode 110 cancels the effect of electromagnetic wave noise on the crystal oscillator 3, allowing the crystal oscillator 4 to be used in oscillators and the like.

[0080] The shield electrode 110 may be formed on the main surface 1602 of the first substrate 160, as shown in Figure 9, rather than on the main surface 1601 of the first substrate 160. In this case, the connecting electrode 180 is provided on the notch 204 of the second substrate 20, the inclined portion 504 of the second adhesive layer 50, the lead end 34 of the lead electrode 33 of the quartz oscillator 30, a part of the peripheral portion 312 of the crystalline lens 31, the inclined portion 1704 of the first adhesive layer 170, the notch 1604 of the first substrate 160, and a part of the outer circumferential surface of the first substrate 160, so as to electrically connect the external electrode 22, the lead electrode 33, and the excitation electrode 32 to the shield electrode 110.

[0081] [Fifth Embodiment] Next, the configuration and manufacturing method of the quartz crystal oscillator 5 according to the fifth embodiment will be described with reference to Figures 10 to 12. Figure 10 is a diagram illustrating the connection relationship between the electrodes of the quartz crystal oscillator 5 according to the fifth embodiment. Figures 11 and 12 are diagrams illustrating the manufacturing method of the quartz crystal oscillator according to the fifth embodiment 5. Figure 12 is a cross-sectional view of the wafer adhesive 400 shown in Figure 11 along the line XII-XII.

[0082] The difference between the quartz oscillator 5 according to the fifth embodiment and the quartz oscillator 1 according to the first embodiment lies in the configuration of the quartz oscillator element 530 according to the fifth embodiment.

[0083] As shown in Figure 10, the second extraction electrode 5332, including the second extraction end 5342 of the quartz oscillator 5, is separated from the outer circumferential surface 303 of the crystalline lens 31. Although not shown in the figure, the first extraction electrode, including the first extraction end of the quartz oscillator 5, is separated from the outer circumferential surface 303 of the crystalline lens 31. In other words, the pair of extraction electrodes 33 of the pair of extraction ends 34 are located on the second main surface 302 of the crystalline lens 31 and separated from the outer circumferential surface 303 of the crystalline lens 31.

[0084] The pair of connecting electrodes 560 are separated from the outer peripheral surface 303 of the crystalline lens 31. The pair of connecting electrodes 560 are provided in the notch 204 of the second substrate 20 and the inclined portion 504 of the second adhesive layer 50. As shown in Figure 10, of the pair of connecting electrodes 560, the connecting electrode electrically connected to the second external electrode 222 is also provided at the second lead end 5342 of the second lead electrode 5332. Although not shown, of the pair of connecting electrodes 560, the connecting electrode electrically connected to the first external electrode 221 is also provided at the first lead end of the first lead electrode. In other words, the pair of connecting electrodes 560 are provided at the pair of lead ends 34 of the pair of lead electrodes 33 of the quartz crystal oscillator 530. When the first main surface 301 and the second main surface 302 of the quartz crystal oscillator 530 are viewed from above, the end faces of the pair of lead ends 34 and the end faces of the pair of connecting electrodes 560 overlap, for example, but are not limited to this. In a plan view, the end faces of the pair of connecting electrodes 560 may be positioned closer to the outer circumferential surface 303 than the end faces of the pair of leading ends 34. In other words, the pair of connecting electrodes 560 may cover the end faces of the pair of leading ends 34 and may also be provided on the second main surface 302 of the lens 31. Furthermore, the end faces of the pair of connecting electrodes 560 may be positioned closer to the second adhesive layer 50 than the end faces of the pair of leading ends 34.

[0085] In summary, when the first main surface 301 and the second main surface 302 of the quartz oscillator 530 are viewed from above, the ends of the electrodes formed on the second substrate 20 and the surface of the quartz oscillator 530 are located inside the outer shape of the quartz oscillator 530.

[0086] As shown in Figures 11 and 12, the external electrodes 22 and 23 formed on the piezoelectric wafer 5300 of the wafer adhesive 5400 are separated from each other. The wafer adhesive 5400 is diced into individual quartz oscillators 5 by being cut along the cut line CL, but the pair of connecting electrodes 560 and the pair of extraction electrodes 33 formed on the wafer adhesive 5400 are separated from the cut line CL. In other words, adjacent quartz oscillators 5 on either side of the cut line CL are electrically insulated from each other.

[0087] In this embodiment, the configuration in which both of the pair of extraction electrodes are separated from the outer surface of the crystalline lens was described as an example, but it is sufficient if at least one of the pair of extraction electrodes is separated from the outer surface of the crystalline lens. Similarly, it is sufficient if at least one of the pair of connecting electrodes is separated from the outer surface of the crystalline lens.

[0088] [Sixth Embodiment] Next, the configuration of the quartz oscillator 6 according to the sixth embodiment will be described with reference to Figure 13. Figure 13 is a diagram illustrating the connection relationships between the electrodes of the quartz oscillator 6 according to the sixth embodiment.

[0089] The difference between the quartz oscillator 6 of the sixth embodiment and the quartz oscillator 1 of the first embodiment lies in the configuration of the quartz oscillator element 630 of the sixth embodiment.

[0090] The outer circumferential surface 6303 of the crystalline lens 631 of the quartz oscillator 630 has a notch 6304. The second lead electrode 6332, including the second lead end 6342 of the quartz oscillator 6, is separated from the outer circumferential surface 6303 of the crystalline lens 631. Although not shown in the figure, the first lead electrode, including the first lead end of the quartz oscillator 6, is similarly separated from the outer circumferential surface 6303 of the crystalline lens 631. In other words, the pair of lead ends 34 of the pair of lead electrodes 33 are located on the second main surface 302 of the crystalline lens 631 and separated from the outer circumferential surface 6303 of the crystalline lens 631.

[0091] The pair of connecting electrodes 660 are separated from the outer circumferential surface 6303 of the crystalline lens 631. The pair of connecting electrodes 660 are provided in the notch 204 of the second substrate 20 and in the inclined portion 504 of the second adhesive layer 50. As shown in Figure 13, of the pair of connecting electrodes 660, the connecting electrode electrically connected to the second external electrode 222 is also provided at the second lead end 6342 of the second lead electrode 6332. Although not shown, of the pair of connecting electrodes 660, the connecting electrode electrically connected to the first external electrode 221 is also provided at the first lead end of the first lead electrode. In other words, the pair of connecting electrodes 660 are provided at the pair of lead ends 34 of the pair of lead electrodes 33 of the quartz crystal oscillator 630. When the first main surface 301 and the second main surface 302 of the quartz oscillator 630 are viewed from above, the end faces of the pair of lead-out ends 34 and the end faces of the pair of connecting electrodes 660 overlap with, for example, the notch 6304, but are not limited to this. In a plan view, the end faces of the pair of connecting electrodes 660 may overlap with the end faces of the pair of lead-out ends 34 and be separated from the notch 6304. Alternatively, the end faces of the pair of connecting electrodes 660 may be separated from the end faces of the pair of lead-out ends 34 and also separated from the notch 6304. For example, the end faces of the pair of connecting electrodes 660 may be located closer to the notch 6304 than the end faces of the pair of lead-out ends 34, and may be located closer to the second adhesive layer 50 than the end faces of the pair of lead-out ends 34.

[0092] In summary, when the first main surface 301 and the second main surface 302 of the quartz oscillator 630 are viewed from above, the ends of the electrodes formed on the second substrate 20 and the surface of the quartz oscillator 630 are located inside the outer shape of the quartz oscillator 630.

[0093] According to the above-described configuration of the quartz oscillator 6 in the sixth embodiment, the effects of the fifth embodiment described above can be realized, and in the wafer bond, the extracted ends 34 of the extracted electrodes 33 of adjacent quartz oscillators 6 are physically separated by the notch 6304, so that the extracted electrodes 33 and connecting electrodes 660 of adjacent quartz oscillators 6 in the wafer bond can be prevented from being electrically connected across the cut line CL due to manufacturing errors.

[0094] [Seventh Embodiment] Next, the configuration and manufacturing method of the quartz crystal oscillator 7 according to the seventh embodiment will be described with reference to Figures 14 and 15. Figures 14 and 15 are diagrams illustrating the connection relationships between the electrodes of the quartz crystal oscillator 7 according to the seventh embodiment.

[0095] Crystal oscillator according to the 7th embodiment 7 The difference between this and the crystal oscillator 1 according to the first embodiment is the configuration of the crystal oscillator element 730 according to the seventh embodiment.

[0096] The outer peripheral surface 7303 of the crystalline lens 731 of the quartz oscillator element 730 has a notch 7304.

[0097] As shown in Figure 14, the second lead-out electrode 7332, including the second lead-out end 7342 of the quartz oscillator 7, is separated from the outer circumferential surface 7303 of the crystalline lens 731. The second lead-out end 7342 of the second lead-out electrode 7332 is located on the second main surface 302 of the crystalline lens 731 and separated from the outer circumferential surface 7303 of the crystalline lens 731. When the first main surface 301 and the second main surface 302 of the quartz oscillator element 730 are viewed from above, the end face of the second lead-out end 7342 overlaps with, for example, the notch 7304, but is not limited to this. The end face of the second lead-out end 7342 may be separated from the notch 7304, or it may be located on the notch 7304.

[0098] As shown in Figure 15, the first lead-out electrode 7331, including the first lead-out end 7341 of the quartz oscillator 7, is similarly separated from the outer circumferential surface 7303 of the quartz crystal 731. The first lead-out end 7341 of the first lead-out electrode 7331 is located on the first main surface 301 of the quartz crystal 731 and separated from the outer circumferential surface 7303 of the quartz crystal 731. When the first main surface 301 and the second main surface 302 of the quartz crystal oscillator 730 are viewed from above, the end face of the first lead-out end 7341 overlaps with, for example, the notch 7304, but is not limited to this. The end face of the first lead-out end 7341 may be separated from the notch 7304, or it may be located on the notch 7304.

[0099] The pair of connecting electrodes 760 are separated from the outer surface 7303 of the crystalline lens 731. As shown in Figure 14, the connecting electrode of the pair of connecting electrodes 760 that is electrically connected to the second external electrode 222 is connected to the notch 204 of the second substrate 20, the inclined portion 504 of the second adhesive layer 50, and the crystalline element. 730 The second lead end 7342 of the second lead electrode 7332, the notch 7304 of the quartz crystal oscillator 730, and the first main surface 301 of the quartz crystal oscillator 730 are provided. The end of the connecting electrode of the pair of connecting electrodes 760 that is electrically connected to the second external electrode 222 is provided on the first main surface 301 of the quartz crystal oscillator 730, for example, on the notch 7304 side of the first adhesive layer 40. As shown in Figure 15, the connecting electrode of the pair of connecting electrodes 760 that is electrically connected to the first external electrode 221 is provided across the notch 204 of the second substrate 20, the inclined portion 504 of the second adhesive layer 50, the second main surface 302 of the quartz crystal oscillator 730, the notch 7304 of the quartz crystal oscillator 730, and the first main surface 301 of the quartz crystal oscillator 730. The end of the connecting electrode 760 that is electrically connected to the first external electrode 221 is provided on the first main surface 301 of the quartz oscillator 730, for example, on the notch 7304 side of the first adhesive layer 40.

[0100] According to the above-described configuration of the quartz oscillator 7 in the seventh embodiment, the effects of the sixth embodiment described above can be realized, and the first lead-out electrode 7331 and the connecting electrode 760 can be electrically connected without having to route the first lead-out end 7341 of the first lead-out electrode 7331 from the first main surface 301 to the second main surface 302 of the quartz oscillator element 730.

[0101] Some or all embodiments of the present invention are described below. However, the present invention is not limited to the embodiments described below. <1> A piezoelectric vibrating element having a piezoelectric layer, excitation electrodes provided on both main surfaces in the thickness direction of the piezoelectric layer, and lead electrodes electrically connected to the excitation electrodes and drawn out to the peripheral edge side of the main surface of the piezoelectric layer, A first substrate provided on one main surface side of the piezoelectric layer, A first adhesive layer is provided between the first substrate and the piezoelectric layer, A second substrate provided on the other main surface side of the piezoelectric layer, A second adhesive layer is provided between the second substrate and the piezoelectric layer, Equipped with, The second substrate has an external electrode provided on the peripheral edge of the side opposite to the piezoelectric layer and electrically connected to the extraction electrode. When the second substrate is viewed in plan from the side opposite to the piezoelectric layer, the second substrate has notches that expose the inclined portion of the second adhesive layer that extends outward from the second substrate, and the lead-out end of the lead-out electrode. Gradient of the second adhesive layer Department The cutout portion of the second substrate is provided with a connecting electrode that electrically connects the external electrode and the lead end. Piezoelectric vibrator.

[0102] <2> The surface of the connecting electrode and the surface of the lead end that extends beyond the second adhesive layer are covered with a plating film. <1> The piezoelectric vibrator described above.

[0103] <3> A piezoelectric vibrating element comprising: a piezoelectric layer having opposing main surfaces; an excitation electrode provided on the main surface of the piezoelectric layer; and an extraction electrode electrically connected to the excitation electrode and drawn out to the peripheral edge side of the main surface of the piezoelectric layer, A first substrate provided on one main surface side of the piezoelectric layer, A first adhesive layer is provided between the first substrate and the piezoelectric layer, A plurality of substrates, including a second substrate and a third substrate, provided on the other main surface side of the piezoelectric layer, wherein the third substrate is located closer to the other main surface side of the piezoelectric layer than the second substrate, A third adhesive layer is provided between the third substrate and the piezoelectric layer, A second adhesive layer is provided between the second substrate and the third substrate, Equipped with, The second substrate has an external electrode provided on the peripheral edge of the side opposite to the piezoelectric layer and electrically connected to the extraction electrode. When the third substrate is viewed from the side opposite to the piezoelectric layer, the third substrate has notches that expose the inclined portion of the third adhesive layer that extends outward from the third substrate, and the lead-out end of the lead-out electrode. When the second substrate is viewed from the side opposite to the piezoelectric layer, the second substrate has notches that expose the inclined portion of the second adhesive layer that extends outward from the second substrate, the lead-out end of the lead-out electrode, the inclined portion of the third adhesive layer, and the notch portion of the third substrate. Notch in the second substrate, inclination of the second adhesive layer Department , the cutout portion of the third substrate, and the inclination of the third adhesive layer Department It is provided with a connecting electrode that electrically connects the external electrode and the lead end. Piezoelectric vibrator.

[0104] <4> The first substrate has a shield electrode provided on the entire surface of either the surface facing the piezoelectric layer or the surface opposite the piezoelectric layer. When the other main surface of the piezoelectric layer is viewed in plan, the piezoelectric layer has piezoelectric notches that expose the inclined portion of the first adhesive layer extending outward from the piezoelectric layer and the peripheral portion of the shield electrode, respectively. When the second substrate is viewed from the side opposite to the piezoelectric layer, the second substrate has notches that expose the inclined portion of the second adhesive layer that extends outward from the second substrate, the lead-out end of the lead-out electrode, the inclined portion of the first adhesive layer, and the peripheral edge of the shield electrode, respectively. The connecting electrodes are provided in the notches of the second substrate, the inclined portion of the second adhesive layer, the notches of the piezoelectric layer, and the inclined portion of the first substrate, so as to electrically connect the external electrodes and the lead-out ends to the shield electrodes, respectively. <1> from <3> A piezoelectric vibrator as described in any one of the items.

[0105] <5> The first substrate has a shield electrode provided on either the surface facing the piezoelectric layer or the surface opposite the piezoelectric layer. When the surface of the first substrate opposite to the piezoelectric layer is viewed in plan view, the first substrate has a first notch that exposes the inclined portion of the first adhesive layer that extends outward from the first substrate, and the peripheral portion of the piezoelectric layer that corresponds to the notch of the second substrate. The connecting electrodes are provided in the notches of the second substrate, the inclined portion of the second adhesive layer, the outer surface of the piezoelectric layer, the notches of the first substrate, and the inclined portion of the first adhesive layer, so as to electrically connect the external electrodes and the lead-out ends to the shield electrodes, respectively. <1> from <4> A piezoelectric vibrator as described in any one of the items.

[0106] The embodiments described above are provided to facilitate understanding of the present invention and are not intended to limit its interpretation. The present invention can be modified or improved without departing from its spirit, and equivalents thereof are also included. That is, any design modifications made to each embodiment by those skilled in the art are also included within the scope of the present invention, as long as they retain the features of the present invention. For example, the elements and their arrangement, materials, conditions, shapes, sizes, etc., of each embodiment are not limited to those exemplified and can be modified as appropriate. Furthermore, each embodiment is illustrative, and it goes without saying that partial substitution or combination of the configurations shown in different embodiments is possible, and these are also included within the scope of the present invention as long as they retain the features of the present invention. [Explanation of symbols]

[0107] 1,2,3,4,5,6,7...Crystal resonator 10…First circuit board 20…Second board 22...External electrode 30...Crystal oscillator 31...Crystalline lens 32...Excitation electrode 33...Extraction electrode 34…Drawer end 40…First adhesive layer 50…Second adhesive layer 60…Connecting electrodes 204... Notch 504…Slope part

Claims

1. A piezoelectric vibrating element comprising: a piezoelectric layer; excitation electrodes provided on both main surfaces in the thickness direction of the piezoelectric layer; and lead electrodes electrically connected to the excitation electrodes and drawn out to the peripheral edge side of the main surface of the piezoelectric layer, A first substrate provided on one main surface side of the piezoelectric layer, A first adhesive layer is provided between the first substrate and the piezoelectric layer, A second substrate provided on the other main surface side of the piezoelectric layer, A second adhesive layer is provided between the second substrate and the piezoelectric layer, Equipped with, The second substrate has an external electrode provided on the peripheral edge of the surface opposite to the piezoelectric layer and electrically connected to the extraction electrode. When the second substrate is viewed in plan from the side opposite to the piezoelectric layer, the second substrate has notches that expose the inclined portion of the second adhesive layer that extends outward from the second substrate and the lead-out end of the lead-out electrode, respectively. The other main surface of the piezoelectric layer has a flat surface. The inclined portion of the second adhesive layer extends inward beyond the outer edge of the flat surface, and the end of the inclined portion of the second adhesive layer opposite to the notch of the second substrate is in contact with the flat surface. The inclined portion of the second adhesive layer and the notched portion of the second substrate are provided with connecting electrodes that electrically connect the external electrode and the lead end. Piezoelectric vibrator.

2. The surface of the connecting electrode and the surface of the lead end that protrudes from the second adhesive layer are covered with a plating film. The piezoelectric vibrator according to claim 1.

3. A piezoelectric vibrating element comprising: a piezoelectric layer having opposing main surfaces; an excitation electrode provided on the main surface of the piezoelectric layer; and an extraction electrode electrically connected to the excitation electrode and drawn out on the peripheral edge side of the main surface of the piezoelectric layer, A first substrate provided on one main surface side of the piezoelectric layer, A first adhesive layer is provided between the first substrate and the piezoelectric layer, A plurality of substrates, including a second substrate and a third substrate provided on the other main surface side of the piezoelectric layer, wherein the third substrate is located closer to the other main surface side of the piezoelectric layer than the second substrate, A third adhesive layer is provided between the third substrate and the piezoelectric layer, A second adhesive layer is provided between the second substrate and the third substrate, Equipped with, The second substrate has an external electrode provided on the peripheral edge of the surface opposite to the piezoelectric layer and electrically connected to the extraction electrode. When the third substrate is viewed in plan from the side opposite to the piezoelectric layer, the third substrate has notches that expose the inclined portion of the third adhesive layer that extends outward from the third substrate and the lead-out end of the lead-out electrode, respectively. When the second substrate is viewed in plan from the side opposite to the piezoelectric layer, the second substrate has notches that expose the inclined portion of the second adhesive layer that extends outward from the second substrate, the lead end of the lead electrode, the inclined portion of the third adhesive layer, and the notch portion of the third substrate, respectively. The notch in the second substrate, the inclined portion of the second adhesive layer, the notch in the third substrate, and the inclined portion of the third adhesive layer are provided with connecting electrodes that electrically connect the external electrode and the lead end. Piezoelectric vibrator.

4. The first substrate has a shield electrode provided on the entire surface of either the surface facing the piezoelectric layer or the surface opposite to the piezoelectric layer. When the other main surface of the piezoelectric layer is viewed in plan, the piezoelectric layer has piezoelectric notches that expose the inclined portion of the first adhesive layer that extends outward from the piezoelectric layer and the peripheral edge of the shield electrode, respectively. When the second substrate is viewed in plan from the side opposite to the piezoelectric layer, the second substrate has notches that expose the inclined portion of the second adhesive layer that extends outward from the second substrate, the lead end of the lead electrode, the inclined portion of the first adhesive layer, and the peripheral edge of the shield electrode, respectively. The connecting electrodes are provided in the notches of the second substrate, the inclined portion of the second adhesive layer, the notches of the piezoelectric layer, and the inclined portion of the first adhesive layer, respectively, so as to electrically connect the external electrode and the lead-out end to the shield electrode. A piezoelectric vibrator according to any one of claims 1 to 3.

5. The first substrate has a shield electrode provided on either the surface facing the piezoelectric layer or the surface opposite to the piezoelectric layer. When the surface of the first substrate opposite to the piezoelectric layer is viewed in plan view, the first substrate has a first notch that exposes the inclined portion of the first adhesive layer that extends outward from the first substrate and the peripheral portion of the piezoelectric layer that corresponds to the notch of the second substrate, respectively. The connecting electrodes are provided in the notch of the second substrate, the inclined portion of the second adhesive layer, the outer surface of the piezoelectric layer, the first notch of the first substrate, and the inclined portion of the first adhesive layer, so as to electrically connect the external electrode and the lead-out end, respectively, to the shield electrode. A piezoelectric vibrator according to any one of claims 1 to 3.

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