Vapor deposition mask packaging and vapor deposition mask packaging method

Abstract

To provide a vapor deposition mask package capable of suppressing the plastic deformation of a vapor deposition mask, and a vapor deposition mask packing method.SOLUTION: A vapor deposition mask package according to the present disclosure includes: a reception part 31 including a first facing surface 37; a first buffer sheet 33 positioned on the first facing surface 37; a lid part 32; and a first fixed part 34. The lid part 32 including a second facing surface 38 facing the first facing surface 37 of the reception part 31 is made to overlap the reception part 31 through the first buffer sheet 33 and a vapor deposition mask 20; the first fixed part 34 fixes the first buffer sheet 33 to the first facing surface 37; and when viewed in the normal direction of the first facing surface 37, the first fixed part 34 is positioned on the outside of the vapor deposition mask 20.SELECTED DRAWING: Figure 3

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a vapor deposition mask package and a vapor deposition mask packaging method.

BACKGROUND ART

[0002] In electronic devices such as smartphones or tablet PCs, high-definition display devices are demanded by the market. The display device has a pixel density of, for example, 400 ppi or more, or 800 ppi or more.

[0003] As such a display device, an organic EL display device having excellent responsiveness and / or high contrast has attracted attention. As a method of forming pixels of an organic EL display device, a method is known in which a material constituting the pixels is vapor-deposited onto a substrate. In this case, first, a vapor deposition mask apparatus including a vapor deposition mask having through holes and a frame supporting the vapor deposition mask is prepared. Next, in a vapor deposition apparatus, a vapor deposition material such as an organic material or an inorganic material is vapor-deposited in a state where the vapor deposition mask is in close contact with the substrate. As a result, the vapor deposition material adheres to the substrate to form a vapor deposition layer. The vapor deposition layer constitutes a display region of the organic EL display device.

[0004] The vapor deposition mask is packaged during transportation. For example, a package including a receiving portion and a lid portion is known. The vapor deposition mask is sandwiched between the receiving portion and the lid portion. However, depending on the configuration of the package, the vapor deposition mask may be plastically deformed.

PRIOR ART DOCUMENTS

PATENT DOCUMENTS

[0005]

PATENT DOCUMENT 1

PATENT DOCUMENT 2

SUMMARY OF THE INVENTION

PROBLEMS TO BE SOLVED BY THE INVENTION

[0006] The embodiments of this disclosure aim to provide a vapor deposition mask packaging body and a vapor deposition mask packaging method that can suppress plastic deformation of the vapor deposition mask. [Means for solving the problem]

[0007] The vapor deposition mask packaging according to this disclosure is a packaging for packaging a vapor deposition mask having a plurality of through holes. The vapor deposition mask packaging comprises a receiving portion including a first opposing surface, a first cushioning sheet located on the first opposing surface, a lid portion, and a first fixing portion. The lid portion includes a second opposing surface facing the first opposing surface of the receiving portion and is superimposed on the receiving portion via the first cushioning sheet and the vapor deposition mask. The first fixing portion fixes the first cushioning sheet to the first opposing surface. When viewed in the direction normal to the first opposing surface, the first fixing portion is located on the outside of the vapor deposition mask.

[0008] The vapor deposition mask packaging method according to this disclosure is a method for packaging a vapor deposition mask having a plurality of through holes formed therein. The vapor deposition mask packaging method comprises a preparation step, a fixing step, a placement step, and a clamping step. In the preparation step, a receiving portion including a first opposing surface and a lid portion including a second opposing surface are prepared. In the fixing step, a first cushioning sheet is fixed to the first opposing surface with the first fixing portion. In the placement step, the vapor deposition mask is placed on the first cushioning sheet. In the clamping step, the lid portion is placed on the vapor deposition mask so that the second opposing surface faces the first opposing surface, and the vapor deposition mask is clamped between the receiving portion and the lid portion. When viewed in the direction normal to the first opposing surface, the first fixing portion is located on the outside of the vapor deposition mask. [Effects of the Invention]

[0009] According to this disclosure, plastic deformation of the vapor deposition mask can be suppressed. [Brief explanation of the drawing]

[0010] [Figure 1] Figure 1 shows a vapor deposition apparatus according to one embodiment of the present disclosure. [Figure 2] Figure 2 is a perspective view showing a vapor deposition mask packaging according to one embodiment of the present disclosure. [Figure 3] Figure 3 is an exploded perspective view of the vapor deposition mask packaging shown in Figure 2. [Figure 4] Figure 4 is a side view showing the packaging case shown in Figure 2. [Figure 5] Figure 5 is a cross-sectional view of the vapor deposition mask packaging shown in Figure 2, and is a partial cross-sectional view corresponding to the position shown by line AA in Figure 3. [Figure 6] Figure 6 is a cross-sectional view of the vapor deposition mask packaging shown in Figure 2, and corresponds to the position indicated by line BB in Figure 3. [Figure 7] Figure 7 is a plan view showing the buffer sheet, interposition sheet, and deposition mask placed on the first opposing surface shown in Figure 3. [Figure 8] Figure 8 is a cross-sectional view showing the preparation process for a vapor deposition mask packaging method according to one embodiment of the present disclosure. [Figure 9] Figure 9 is a cross-sectional view showing the fixing step of a vapor deposition mask packaging method according to one embodiment of the present disclosure. [Figure 10] Figure 10 is a cross-sectional view showing the fixing process following Figure 9. [Figure 11] Figure 11 is a cross-sectional view showing the placement step of a vapor deposition mask packaging method according to one embodiment of the present disclosure. [Figure 12] Figure 12 is a cross-sectional view showing the clamping step of a vapor deposition mask packaging method according to one embodiment of the present disclosure. [Figure 13] Figure 13 is a cross-sectional view showing the bundling process of a vapor deposition mask packaging method according to one embodiment of the present disclosure. [Figure 14] Figure 14 is a cross-sectional view showing a modified example of the vapor deposition mask laminate shown in Figure 6. [Modes for carrying out the invention]

[0011] In this specification and these drawings, unless otherwise specified, terms such as "substrate," "base material," "plate," "sheet," and "film," which refer to the material that forms the basis of a certain structure, are not distinguished from one another solely on the basis of differences in designation.

[0012] In the present specification and the accompanying drawings, unless otherwise specified, terms such as "parallel" and "orthogonal", and values of lengths, angles, etc. that specify shapes, geometric conditions, and degrees thereof shall not be bound by strict meanings, and shall be interpreted to include ranges in which equivalent functions can be expected.

[0013] In the present specification and the accompanying drawings, unless otherwise specified, when a configuration such as a certain member or a certain region is referred to as being "on", "over", "on the upper side", "on the lower side", "above" or "below" another configuration such as another member or another region, this includes the case where the certain configuration is in direct contact with the other configuration. Furthermore, this also includes the case where another configuration is interposed between the certain configuration and the other configuration, that is, the case where they are in indirect contact. Unless otherwise specified, the terms "upper", "on the upper side", "above", or "lower", "on the lower side", "below" may have their vertical directions reversed.

[0014] In the present specification and the accompanying drawings, unless otherwise specified, the same or similar reference numerals are assigned to the same portions or portions having similar functions, and repeated descriptions thereof may be omitted. In addition, the dimensional ratios in the drawings may differ from actual ratios for convenience of description, or a part of the configuration may be omitted from the drawings.

[0015] In the present specification and the accompanying drawings, unless otherwise specified, the configurations may be combined with other embodiments and modified examples within a range that does not cause inconsistency. Further, other embodiments may be combined with each other, and other embodiments and modified examples may also be combined within a range that does not cause inconsistency. Modified examples may also be combined with each other within a range that does not cause inconsistency.

[0016] In the present specification and the accompanying drawings, unless otherwise specified, when a plurality of steps are disclosed for a method such as a manufacturing method, other steps not disclosed may be performed between the disclosed steps. Further, the order of the disclosed steps is arbitrary within a range that does not cause inconsistency.

[0017] In this specification and these drawings, unless otherwise specified, a numerical range represented by the symbol "~" includes the numbers placed before and after the symbol "~". For example, the numerical range defined by the expression "34~38 mass%" is the same as the numerical range defined by the expression "34 mass% or more and 38 mass% or less".

[0018] One embodiment of this specification describes an example relating to a vapor deposition mask used to pattern organic materials onto a substrate in a desired pattern when manufacturing an organic EL display device, and a method for manufacturing the same. However, this embodiment is not limited to such applications and can be applied to vapor deposition masks used in various applications. For example, the mask of this embodiment may be used to manufacture a device for displaying or projecting images or videos to represent virtual reality (VR) or augmented reality (AR).

[0019] The first aspect of this disclosure is, A vapor deposition mask packaging body for packaging a vapor deposition mask having multiple through holes formed therein, A receiving portion including the first opposing surface, The first cushioning sheet located on the first opposing surface, The receiving portion includes a second opposing surface facing the first opposing surface, and the receiving portion includes a lid that is superimposed on the receiving portion via the first buffer sheet and the vapor deposition mask, The first cushioning sheet is fixed to the first opposing surface, and the first fixing part is provided, When viewed in the direction normal to the first opposing surface, the first fixing portion is located outside the vapor deposition mask packaging, That is the case.

[0020] A second aspect of this disclosure relates to the vapor deposition mask packaging according to the first aspect described above, The first buffer sheet is formed in a rectangular shape so as to align with the first direction and the second direction perpendicular to the first direction when viewed in the normal direction. The first fixing portion includes two first fixing division members located outward on both sides in the first direction relative to the deposition mask, You may do so.

[0021] A third aspect of this disclosure relates to a vapor deposition mask packaging according to the second aspect described above, The first fixing portion includes two second fixing division members located outward on both sides in the second direction relative to the deposition mask. You may do so.

[0022] A fourth aspect of this disclosure relates to a vapor deposition mask packaging according to each of the first to third aspects described above, The system includes an interlocking sheet located between the deposition mask and the first buffer sheet, The first fixing portion is located on the outside of the interlocking sheet when viewed in the normal direction, You may do so.

[0023] A fifth aspect of this disclosure relates to a vapor deposition mask packaging according to each of the first to fourth aspects described above, The receiving portion and the lid portion are connected via a hinge portion. You may do so.

[0024] A sixth aspect of this disclosure relates to a vapor-deposited mask packaging according to each of the first to fifth aspects described above, The second cushioning sheet is located on the second opposing surface, The lid portion is superimposed on the receiving portion via the first buffer sheet, the vapor deposition mask, and the second buffer sheet. You may do so.

[0025] A seventh aspect of this disclosure relates to a vapor deposition mask packaging according to the sixth aspect described above, The second cushioning sheet is provided with a second fixing part for fixing it to the second opposing surface, When viewed in the normal direction, the second fixing portion is located outside the deposition mask. You may do so.

[0026] An eighth aspect of this disclosure relates to a vapor deposition mask packaging according to each of the first to seventh aspects described above, The system includes a vapor deposition mask located between the receiving portion and the lid portion. You may do so.

[0027] The ninth aspect of this disclosure is, A method for packaging a vapor deposition mask in which multiple through holes are formed, A preparation step of preparing a receiving portion including a first opposing surface and a lid portion including a second opposing surface, The first step of fixing the first cushioning sheet to the first opposing surface with the first fixing part, A placement step of placing the vapor deposition mask on the first buffer sheet, The process includes a clamping step of placing the lid portion on the deposition mask so that the second opposing surface faces the first opposing surface, and clamping the deposition mask between the receiving portion and the lid portion, When viewed in the direction normal to the first opposing surface, the first fixing portion is located on the outside of the vapor deposition mask, vapor deposition mask packaging method, That is the case.

[0028] Hereinafter, one embodiment of the present disclosure will be described in detail with reference to the drawings. Note that the embodiment described below is merely one example of the embodiments of the present disclosure, and the present disclosure shall not be construed as being limited to these embodiments only.

[0029] As shown in Figure 1, the deposition apparatus 80 may include a deposition source (e.g., a crucible 81), a heater 83, and a deposition mask device 10. The deposition apparatus 80 may also include an exhaust means (not shown) for creating a vacuum atmosphere inside the deposition apparatus 80. The crucible 81 is located inside the deposition apparatus 80 and is configured to contain a deposition material 90, such as an organic light-emitting material. The heater 83 is configured to heat the crucible 81. By heating the crucible 81 in a vacuum atmosphere, the deposition material 90 evaporates.

[0030] The deposition mask apparatus 10 may include a frame 15 and a deposition mask 20 fixed to the frame 15. The frame 15 may include a frame opening 16. In a plan view, the frame opening 16 overlaps with the effective region 23 in the deposition mask 20 where the through-holes 25 (described later) are formed. The deposition mask 20 may be fixed and supported by the frame 15 in a tensile state. In this case, bending of the deposition mask 20 can be suppressed. Multiple deposition masks 20 may be fixed to the frame 15. "Plan view" is a term that means viewing the deposition mask 20 in the thickness direction, for example, in the vertical direction of Figure 1.

[0031] The deposition mask device 10 is located inside the deposition apparatus 80 so as to face the crucible 81. The deposition mask device 10 may also be located above the crucible 81. The substrate 91 may be located so as to face the deposition mask 20 of the deposition mask device 10. The substrate 91 is the object to which the deposition material 90 will be deposited. The substrate 91 may be located above the deposition mask 20. The substrate 91 may be held by an electrostatic chuck 84 that utilizes electrostatic force. In this case, the electrostatic chuck 84 may be located above the substrate 91.

[0032] As shown in Figure 1, the deposition apparatus 80 may include a magnet 85 positioned above the electrostatic chuck 84. By providing the magnet 85, the deposition mask 20 can be attracted in the direction of the magnet 85 by magnetic force, allowing the deposition mask 20 to adhere closely to the substrate 91. A cooling plate (not shown) may be interposed between the electrostatic chuck 84 and the magnet 85 to cool the substrate 91 during deposition.

[0033] When depositing the deposition material 90 onto the substrate 91, the deposition material flying from the crucible 81 adheres to the substrate 91 through the frame opening 16 and each through-hole 25. As a result, the deposition material 90 adheres to the substrate 91 in a pattern according to the pattern of the through-hole 25.

[0034] Next, the deposition mask 20 will be described. The deposition mask 20 may be manufactured by etching or plating.

[0035] As shown in Figures 2 and 3, the deposition mask 20 may be formed in a rectangular shape having a first direction D1 and a second direction D2 perpendicular to the first direction D1. The first direction may be the longitudinal direction of the deposition mask 20. The deposition mask 20 may include longitudinal ends 21 located at both ends in the first direction D1. The deposition mask 20 may include at least one effective region 23. The effective region 23 may be located between two longitudinal ends 21. As shown in Figure 3, the deposition mask 20 may include one effective region 23. However, the deposition mask 20 may include multiple effective regions 23. The multiple effective regions 23 may be aligned in the first direction D1 and the second direction D2. The multiple effective regions 23 may be aligned in the first direction D1 and the second direction D2.

[0036] One effective region 23 may correspond to one display area of ​​an organic EL display device. Alternatively, one effective region 23 may correspond to multiple display areas. The effective region 23 may have, for example, a substantially rectangular contour in plan view, but may also have a contour of a shape other than a rectangle.

[0037] As shown in Figure 1, the deposition mask 20 may include a first surface 20a, a second surface 20b located on the opposite side of the first surface 20a, and a plurality of through holes 25. The through holes 25 extend from the first surface 20a to the second surface 20b of the deposition mask and penetrate the deposition mask 20.

[0038] A group of through-holes 26, composed of multiple through-holes 25, may be located within the effective region 23. One effective region 23 may consist of one group of through-holes 26. The effective region 23 may be the region occupied by the group of through-holes 26. The group of through-holes 26 may overlap the frame opening 16 of the frame 15 in a plan view. The term "group of through-holes 26" is used to mean a collection of multiple regularly arranged through-holes 25. The outer edge through-holes 25 that constitute one group of through-holes 26 are the outermost through-holes 25 among multiple regularly arranged through-holes 25. Outside the outer edge through-holes 25 in one group of through-holes 26, there do not have to be any other regularly arranged through-holes 25 intended for the passage of the deposition material 90. As an example of a regular arrangement, for example, the through-holes 25 may be arranged in parallel. The group of through-holes 26, like the effective region 23, may have a substantially rectangular contour in a plan view.

[0039] The deposition mask 20 has a thickness T1 (see Figure 5) extending from the first surface 20a to the second surface 20b. The thickness T1 may be, for example, 2 μm or more, 5 μm or more, 10 μm or more, or 15 μm or more. By setting the thickness T1 to 2 μm or more, the mechanical strength of the deposition mask 20 can be ensured. Alternatively, the thickness T1 may be, for example, 20 μm or less, 30 μm or less, 40 μm or less, or 50 μm or less. By setting the thickness T1 to 50 μm or less, the occurrence of shadows can be suppressed. Shadows refer to the phenomenon in which the deposition material 90 adheres to the wall surface of the through hole 25, reducing the accuracy of the thickness of the deposition layer formed on the substrate 91. The range of thickness T1 may be defined by a first group consisting of 2 μm, 5 μm, 10 μm, and 15 μm, and / or a second group consisting of 20 μm, 30 μm, 40 μm, and 50 μm. The range of thickness T1 may be determined by any combination of one value from the first group described above and any one value from the second group described above. The range of thickness T1 may be determined by any combination of two values ​​from the first group described above. The range of thickness T1 may be determined by any combination of two values ​​from the second group described above.For example, it may be 2 μm or more and 50 μm or less, 2 μm or more and 40 μm or less, 2 μm or more and 30 μm or less, 2 μm or more and 20 μm or less, 2 μm or more and 15 μm or less, 2 μm or more and 10 μm or less, 2 μm or more and 5 μm or less, 5 μm or more and 50 μm or less, 5 μm or more and 40 μm or less, 5 μm or more and 30 μm or less, 5 μm or more and 20 μm or less, 5 μm or more and 15 μm or less, 5 μm or more and 10 μm or less, 10 μm or more and 50 μm or less, 10 μm or less It may be 40 μm or less, 10 μm to 30 μm, 10 μm to 20 μm, 10 μm to 15 μm, 15 μm to 50 μm, 15 μm to 40 μm, 15 μm to 30 μm, 15 μm to 20 μm, 20 μm to 50 μm, 20 μm to 40 μm, 20 μm to 30 μm, 30 μm to 50 μm, 30 μm to 40 μm, or 40 μm to 50 μm.

[0040] The vapor deposition mask 20 may be made of, for example, an iron alloy containing nickel. The iron alloy may further contain cobalt in addition to nickel. For example, as the material for the vapor deposition mask 20, an iron alloy can be used in which the total content of nickel and cobalt is 30% by mass or more and 54% by mass or less, and the cobalt content is 0% by mass or more and 6% by mass or less. Specific examples of iron alloys containing nickel include Invar material containing 34% by mass or more and 38% by mass or less of nickel, and low thermal expansion Fe-Ni plated alloys containing 38% by mass or more and 54% by mass or less of nickel. Specific examples of iron alloys containing nickel and cobalt include Super Invar material containing 30% by mass or more and 34% by mass or less of nickel, in addition to cobalt. By using such an iron alloy, the thermal expansion coefficient of the vapor deposition mask 20 can be lowered. For example, when a glass substrate is used as the substrate 91, the thermal expansion coefficient of the vapor deposition mask 20 can be made to a low value equivalent to that of the glass substrate. This makes it possible to suppress the decrease in shape accuracy and positional accuracy of the light-emitting layer formed on the substrate 91 during the deposition process, which is caused by the difference in thermal expansion coefficients between the deposition mask 20 and the substrate 91.

[0041] If the thermal expansion coefficient of the vapor deposition mask 20 does not need to be as low as that of the glass substrate, the material constituting the vapor deposition mask 20 may be, for example, made of elemental nickel or a nickel alloy containing cobalt, instead of the iron alloy mentioned above. When a nickel alloy containing cobalt is used, a nickel alloy with a cobalt content of 8% by mass or more and 10% by mass or less can be used as the material for the vapor deposition mask 20. When the vapor deposition mask 20 is manufactured by a plating process, using such nickel or a nickel alloy makes it possible to stabilize the plating solution that deposits the plating film forming the vapor deposition mask 20. This makes it easier to manage the plating process and improves handling. In addition, the components of the plating film can be made uniform, improving the quality of the vapor deposition mask 20.

[0042] Next, the vapor deposition mask packaging body 30 for packaging the vapor deposition mask 20 described above will be explained. The vapor deposition mask packaging body 30 is configured to package the vapor deposition mask 20 which has a group of through-holes 26 in which a plurality of through-holes 25 are formed.

[0043] As shown in Figures 2 and 3, the vapor deposition mask packaging 30 may include a receiving portion 31, a lid portion 32, a first cushioning sheet 33, a first fixing portion 34, a second cushioning sheet 35, a second fixing portion 36, and a vapor deposition mask laminate 50. The vapor deposition mask laminate 50 may be located between the receiving portion 31 and the lid portion 32. The vapor deposition mask laminate 50 may include the vapor deposition mask 20 described above. As shown in Figure 2, the lid portion 32 may be located above the receiving portion 31 when the vapor deposition mask 20 is packaged.

[0044] The receiving portion 31 and the lid portion 32 may be fastened together by an elastic belt 60. In the example shown in Figure 2, the receiving portion 31 and the lid portion 32 are fastened together by two elastic belts 60, but the number of elastic belts 60 is arbitrary as long as it prevents the receiving portion 31 and the lid portion 32 from shifting.

[0045] As shown in Figures 3 and 4, the receiving portion 31 may include a first opposing surface 37. The first opposing surface 37 may be formed in a flat shape. Alternatively, the first opposing surface 37 may have small irregularities, etc., as long as the first cushioning sheet 33, which will be described later, can be fixed in a flat shape, and it does not have to be formed in a flat shape. The first opposing surface 37 does not have to have recesses similar to the recess 39 of the lid portion 32, which will be described later.

[0046] As shown in Figures 5 and 6, the lid portion 32 is superimposed on the receiving portion 31 via the first buffer sheet 33, the vapor deposition mask laminate 50, and the second buffer sheet 35. The lid portion 32 may include a second opposing surface 38 and a recess 39. When the vapor deposition mask 20 is packaged, the second opposing surface 38 faces the first opposing surface 37 of the receiving portion 31. The recess 39 is located on the second opposing surface 38 and is formed to be recessed from the second opposing surface 38. The second opposing surface 38 may be formed flat in areas other than the recess 39. Alternatively, the second opposing surface 38 may have small irregularities in areas other than the recess 39, as long as the second buffer sheet 35, which will be described later, can be fixed flat. The longitudinal direction of the recess 39 may be aligned with the longitudinal direction of the vapor deposition mask 20 to be packaged. The longitudinal direction of the recess 39 may be aligned with the first direction D1. The normal direction N may be perpendicular to the first opposing surface 37 or perpendicular to the second opposing surface 38 when the vapor deposition mask 20 is packaged. The normal direction N may be aligned with the thickness direction of the vapor deposition mask 20.

[0047] As shown in Figure 7, in the first direction D1, the dimension L1 of the recess 39 may be smaller than the dimension L2 of the deposition mask 20. In other words, the deposition mask 20 may extend outward on both sides in the first direction D1 relative to the recess 39. The longitudinal end 21 of the deposition mask 20 may overlap the second opposing surface 38. When the deposition mask 20 is packaged, the longitudinal end 21 of the deposition mask 20 may be sandwiched between the first opposing surface 37 and the second opposing surface 38.

[0048] In the first direction D1, the dimension L1 of the recess 39 may be larger than the dimension L3 of the effective area 23. In the second direction D2, the dimension W1 of the recess 39 may be larger than the dimension W2 of the vapor deposition mask 20. The recess 39 may extend outward on both sides in the second direction D2 relative to the vapor deposition mask 20. In this way, the entire effective area 23 may overlap the recess 39. This allows the effective area 23 of the vapor deposition mask 20 to bend into the recess 39 if the vapor deposition mask packaging 30 is subjected to an upward force or impact during transport. This suppresses plastic deformation of the effective area 23.

[0049] As shown in Figures 3 and 4, the receiving portion 31 and the lid portion 32 may constitute a packaging case 40. The packaging case 40 may include a hinge portion 41 connecting the receiving portion 31 and the lid portion 32. In this case, the receiving portion 31 and the lid portion 32 are connected via the hinge portion 41, and the lid portion 32 may be rotatable relative to the receiving portion 31. The packaging case 40 may be foldable. The packaging case 40 may be unfoldable as shown in Figures 3 and 4, and may be foldable as shown in Figures 2 and 6.

[0050] As shown in Figure 4, the receiving portion 31, the lid portion 32, and the hinge portion 41 may be formed integrally. A receiving portion side groove 42 may be formed between the receiving portion 31 and the hinge portion 41. A lid portion side groove 43 may be formed between the hinge portion 41 and the lid portion 32. In this way, the receiving portion 31 and the lid portion 32 may be rotatable relative to each other, and the packaging case 40 may be foldable.

[0051] The packaging case 40 may be formed from one or more corrugated cardboard sheets 44. For example, the packaging case 40 may be formed by stacking two corrugated cardboard sheets 44. Each corrugated cardboard sheet 44 includes two liners and a core having a corrugated cross-section interposed between the liners. When stacking multiple corrugated cardboard sheets 44, they may be stacked so that the directions in which the corrugated ridges or valleys of the cores of adjacent corrugated cardboard sheets 44 extend are perpendicular to each other. In this case, the mechanical strength of the packaging case 40 can be improved. The corrugated cardboard sheets 44 may be made of plastic.

[0052] If the packaging case 40 is composed of two corrugated cardboard sheets 44, the recess 39 of the lid portion 32 may be composed of an opening 44a formed in one of the corrugated cardboard sheets 44. In this case, the opening 44a may penetrate this corrugated cardboard sheet 44. The opening 44a is formed in the corrugated cardboard sheet 44 that constitutes the second opposing surface 38. The other corrugated cardboard sheet 44 does not need to have an opening 44a formed therein.

[0053] As shown in Figures 5 and 6, the first cushioning sheet 33 may be located on the first opposing surface 37. The first cushioning sheet 33 may be a sheet that suppresses plastic deformation of the vapor deposition mask 20 when the vapor deposition mask packaging 30 is subjected to a downward force or impact during transport. The first cushioning sheet 33 may have a degree of flexibility that allows it to absorb forces or impacts applied to the vapor deposition mask 20 while it is packaged. The first cushioning sheet 33 may have a degree of mechanical strength that allows it to support the vapor deposition mask laminate 50.

[0054] As shown in Figure 7, the first buffer sheet 33 may be formed in a rectangular shape so as to be aligned with the first direction D1 and the second direction D2 when viewed in the normal direction N. The first buffer sheet 33 may have a longitudinal direction aligned with the first direction D1.

[0055] The material of the first buffer sheet 33 is arbitrary. For example, the first buffer sheet 33 may be made of PET (polyethylene terephthalate) film. PET film is relatively rigid and does not easily wrinkle. Therefore, it can effectively suppress plastic deformation of the vapor deposition mask 20.

[0056] The thickness T2 of the first cushioning sheet 33 shown in Figure 5 is arbitrary. For example, the thickness T2 may be 0.05 mm or more, 0.08 mm or more, or 0.10 mm or more. By setting the thickness T2 to 0.05 mm or more, force or impact can be absorbed and mechanical strength can be ensured. The thickness T2 may be 0.15 mm or less, 0.17 mm or less, or 0.20 mm or less. By setting the thickness T2 to 0.20 mm or less, the thickness of the vapor deposition mask laminate 50 can be suppressed. The range of thickness T2 may be defined by a first group consisting of 0.05 mm, 0.08 mm, and 0.10 mm, and / or a second group consisting of 0.15 mm, 0.17 mm, and 0.20 mm. The range of thickness T2 may be defined by a combination of any one value included in the first group and any one value included in the second group. The range of thickness T2 may be determined by any two combinations of values ​​included in the first group described above. The range of thickness T2 may also be determined by any two combinations of values ​​included in the second group described above. For example, it may be 0.05 mm or more and 0.20 mm or less, 0.05 mm or more and 0.17 mm or less, 0.05 mm or more and 0.15 mm or less, 0.05 mm or more and 0.10 mm or less, 0.05 mm or more and 0.08 mm or less, 0.08 mm or more and 0.20 mm or less, 0.08 mm or more and 0.17 mm or less, 0.08 mm or more and 0.15 mm or less, 0.08 mm or more and 0.10 mm or less, 0.10 mm or more and 0.20 mm or less, 0.10 mm or more and 0.17 mm or less, 0.10 mm or more and 0.15 mm or less, 0.15 mm or more and 0.20 mm or less, 0.15 mm or more and 0.17 mm or less, and 0.17 mm or more and 0.20 mm or less.

[0057] As shown in Figures 5 to 7, in the first direction D1, the dimension L4 of the first cushioning sheet 33 may be larger than the dimension L2 of the vapor deposition mask 20. The first cushioning sheet 33 may extend outward on both sides in the first direction D1 relative to the vapor deposition mask 20. In the second direction D2, the dimension W3 of the first cushioning sheet 33 may be larger than the dimension W2 of the vapor deposition mask 20. The first cushioning sheet 33 may extend outward on both sides in the second direction D2 relative to the vapor deposition mask 20. In this way, the entire vapor deposition mask 20 may overlap the first cushioning sheet 33. This prevents plastic deformation of the vapor deposition mask 20 when the vapor deposition mask packaging 30 is subjected to a downward force or impact during transport.

[0058] The first buffer sheet 33 may be coated with an antistatic coating to suppress the generation of static electricity. For example, an antistatic layer may be formed on both sides of the first buffer sheet 33. An example of an antistatic coated first buffer sheet 33 is the polyester synthetic paper K2323-188-690mm manufactured by Toyobo Co., Ltd., which is sold under the trade name Crisper (registered trademark).

[0059] As shown in Figures 5 and 6, the first fixing portion 34 may fix the first cushioning sheet 33 to the first opposing surface 37. The first fixing portion 34 may be interposed between the first opposing surface 37 and the first cushioning sheet 33.

[0060] As shown in Figure 7, the first fixing portion 34 may be located outside the deposition mask 20 when viewed in the normal direction N. The first fixing portion 34 may be located inside the outer edge of the first buffer sheet 33. The first fixing portion 34 may overlap the first buffer sheet 33, but may not overlap the deposition mask 20. The first fixing portion 34 may be located outside the recess 39 of the lid portion 32. The first fixing portion 34 may not overlap the recess 39.

[0061] More specifically, as shown in Figures 3 and 7, the first fixing portion 34 may include two first fixing dividing members 45 located outward on both sides relative to the deposition mask 20 in the first direction D1. The deposition mask 20 may be located between the two first fixing dividing members 45, and the first fixing dividing members 45 do not have to overlap the deposition mask 20. The first fixing dividing members 45 may extend elongatedly along the second direction D2. In this case, the first fixing dividing members 45 may be formed in a rectangular shape with the second direction D2 as the longitudinal direction in a plan view. The first fixing dividing members 45 may extend continuously or be formed intermittently. In this case, the first fixing dividing members 45 may be formed in a rectangular shape with the second direction D2 as the longitudinal direction in a plan view, or they may be formed in any shape such as a square, circular or elliptical shape.

[0062] The first fixing portion 34 may include two second fixing dividing members 46 located outward on both sides relative to the deposition mask 20 in the second direction D2. The deposition mask 20 may be located between the two second fixing dividing members 46, and the second fixing dividing members 46 do not have to overlap the deposition mask 20. The second fixing dividing members 46 may extend elongatedly along the first direction D1. In this case, the second fixing dividing members 46 may be formed in a rectangular shape with the first direction D1 as the longitudinal direction in a plan view. The second fixing dividing members 46 may extend continuously or be formed intermittently. In this case, the second fixing dividing members 46 may be formed in a rectangular shape with the first direction D1 as the longitudinal direction in a plan view, or they may be formed in any shape such as a square, circular or elliptical shape.

[0063] In the examples shown in Figures 3 and 7, the first fixed dividing member 45 is located on both sides of the second fixed dividing member 46 in the first direction D1, and the first fixed dividing member 45 extends to the outer edge of the second fixed dividing member 46, which will be described later, in the second direction D2. However, the second fixed dividing member 46 may be located on both sides of the first fixed dividing member 45 in the second direction D2, and the second fixed dividing member 46 may extend to the outer edge of the first fixed dividing member 45, which will be described later, in the first direction D1. Furthermore, there may be a gap between the first fixed dividing member 45 and the second fixed dividing member 46, or they may be connected without a gap.

[0064] The first fixed dividing member 45 and the second fixed dividing member 46 may be made of double-sided tape. The double-sided tape may include a base material and adhesive layers located on both sides of the base material. The base material may be made of any synthetic resin. The adhesive layers may be made of any synthetic resin as long as they are adhesive. An example of double-sided tape is 3M double-sided tape 665, which is sold under the trade name Scotch (registered trademark). However, the first cushioning sheet 33 may be fixed to the first opposing surface 37 with an adhesive. In this case, the first fixed dividing member 45 and the second fixed dividing member 46 may be formed by the curing of the adhesive.

[0065] The thickness T3 of the first fixed dividing member 45 and the second fixed dividing member 46 shown in Figure 5 is arbitrary. For example, the thickness T3 may be 0.04 mm or more, 0.06 mm or more, or 0.07 mm or more. By setting the thickness T3 to 0.04 mm or more, adhesive strength can be ensured. The thickness T3 may be 0.09 mm or less, 0.10 mm or less, or 1.20 mm or less. By setting the thickness T3 to 1.20 mm or less, deformation of the first cushioning sheet 33 can be suppressed, and the first fixed dividing member 45 and the second fixed dividing member 46 can be suppressed from cushioning each other. The range of thickness T3 may be defined by a first group consisting of 0.04 mm, 0.06 mm, and 0.07 mm, and / or a second group consisting of 0.09 mm, 0.10 mm, and 1.20 mm. The range of thickness T3 may be determined by any combination of one value from the first group described above and any one value from the second group described above. The range of thickness T3 may be determined by any combination of two values ​​from the first group described above. The range of thickness T3 may be determined by any combination of two values ​​from the second group described above. For example, it may be 0.04 mm or more and 1.20 mm or less, 0.04 mm or more and 0.10 mm or less, 0.04 mm or more and 0.09 mm or less, 0.04 mm or more and 0.07 mm or less, 0.04 mm or more and 0.06 mm or less, 0.06 mm or more and 1.20 mm or less, 0.06 mm or more and 0.10 mm or less, 0.06 mm or more and 0.09 mm or less, 0.06 mm or more and 0.07 mm or less, 0.07 mm or more and 1.20 mm or less, 0.07 mm or more and 0.10 mm or less, 0.07 mm or more and 0.09 mm or less, 0.09 mm or more and 1.20 mm or less, 0.09 mm or more and 0.10 mm or less, and 0.10 mm or more and 1.20 mm or less.

[0066] As shown in Figures 5 and 6, the second cushioning sheet 35 may be located on the second opposing surface 38. The second cushioning sheet 35 may be a sheet that suppresses plastic deformation of the vapor deposition mask 20 when the vapor deposition mask packaging 30 is subjected to an upward force or impact during transport. The thickness of the second cushioning sheet 35 may be the same as the thickness T2 of the first cushioning sheet 33. The second cushioning sheet 35 may be configured in the same way as the first cushioning sheet 33 described above. For this reason, a detailed explanation of the second cushioning sheet 35 is omitted. In the example shown in Figure 3, the second cushioning sheet 35 is omitted for clarity in the drawing.

[0067] As shown in Figures 5 and 6, the second fixing portion 36 may fix the second cushioning sheet 35 to the second opposing surface 38. The second fixing portion 36 may be interposed between the second opposing surface 38 and the second cushioning sheet 35.

[0068] As shown in Figure 7, the second fixing portion 36 may be located outside the deposition mask 20 when viewed in the normal direction N. The second fixing portion 36 may be located inside the outer edge of the second buffer sheet 35. The second fixing portion 36 may overlap the second buffer sheet 35, but may not overlap the deposition mask 20. The second fixing portion 36 may be located outside the recess 39 of the lid portion 32. The second fixing portion 36 may not overlap the recess 39.

[0069] More specifically, as shown in Figures 3 and 7, the second fixing portion 36 may include two third fixing dividing members 47 located outward on both sides relative to the deposition mask 20 in the first direction D1. The deposition mask 20 may be located between the two third fixing dividing members 47, and the third fixing dividing members 47 do not have to overlap the deposition mask 20. The third fixing dividing members 47 may extend elongatedly along the second direction D2. In this case, the third fixing dividing member 47 may be formed in a rectangular shape with the second direction D2 as its longitudinal direction in a plan view. The third fixing dividing member 47 may extend continuously or be formed intermittently. In this case, the third fixing dividing member 47 may be formed in a rectangular shape with the second direction D2 as its longitudinal direction in a plan view, or it may be formed in any shape such as a square, circular or elliptical shape. The third fixed dividing member 47 may overlap with the first fixed dividing member 45, or it may not overlap with the first fixed dividing member 45.

[0070] The second fixing portion 36 may include two fourth fixing dividing members 48 located outward on both sides relative to the deposition mask 20 in the second direction D2. The deposition mask 20 may be located between the two fourth fixing dividing members 48, and the fourth fixing dividing members 48 do not have to overlap the deposition mask 20. The fourth fixing dividing member 48 may extend elongatedly along the first direction D1. In this case, the fourth fixing dividing member 48 may be formed in a rectangular shape with the first direction D1 as its longitudinal direction in a plan view. The fourth fixing dividing member 48 may extend continuously or be formed intermittently. In this case, the fourth fixing dividing member 48 may be formed in a rectangular shape with the first direction D1 as its longitudinal direction in a plan view, or it may be formed in any shape such as a square, circular or elliptical shape. The fourth fixing dividing member 48 may or may not overlap with the second fixing dividing member 46.

[0071] In the examples shown in Figures 3 and 7, the third fixed dividing member 47 is located on both sides of the fourth fixed dividing member 48 in the first direction D1, and the third fixed dividing member 47 extends to the outer edge of the fourth fixed dividing member 48, which will be described later, in the second direction D2. However, the fourth fixed dividing member 48 may be located on both sides of the third fixed dividing member 47 in the second direction D2, and the fourth fixed dividing member 48 may extend to the outer edge of the third fixed dividing member 47, which will be described later, in the first direction D1. Furthermore, there may be a gap between the third fixed dividing member 47 and the fourth fixed dividing member 48, or they may be connected without a gap.

[0072] The third fixed dividing member 47 and the fourth fixed dividing member 48 may be configured in the same manner as the first fixed dividing member 45 and the second fixed dividing member 46. For example, the third fixed dividing member 47 and the fourth fixed dividing member 48 may be made of double-sided tape, similar to the first fixed dividing member 45 and the second fixed dividing member 46. The thickness of the third fixed dividing member 47 and the fourth fixed dividing member 48 may be the same as the thickness T3 of the first fixed dividing member 45 and the second fixed dividing member 46 described above. A detailed description of the third fixed dividing member 47 and the fourth fixed dividing member 48 is omitted.

[0073] As shown in Figures 5 and 6, the vapor deposition mask laminate 50 is located between the receiving portion 31 and the lid portion 32. More specifically, the vapor deposition mask laminate 50 is located between the first buffer sheet 33 and the second buffer sheet 35. When the vapor deposition mask 20 is packaged, the vapor deposition mask laminate 50 may be held between the receiving portion 31 and the lid portion 32.

[0074] The vapor deposition mask laminate 50 may include one vapor deposition mask 20 and a plurality of interlocking sheets 51. The interlocking sheets 51 may be positioned on the first surface 20a and the second surface 20b of the vapor deposition mask 20. The vapor deposition mask 20 may be positioned between two interlocking sheets 51, and the vapor deposition mask 20 may be sandwiched between the interlocking sheets 51. The first surface 20a of the vapor deposition mask 20 may face the first opposing surface 37 of the receiving portion 31. However, the first surface 20a may face the second opposing surface 38 of the lid portion 32.

[0075] The intervening sheet 51 may be located between the deposition mask 20 and the first buffer sheet 33. One or more intervening sheets 51 may be interposed between the deposition mask 20 and the first buffer sheet 33. In this embodiment, two intervening sheets 51 are interposed between the deposition mask 20 and the first buffer sheet 33. In Figure 3, the intervening sheet 51 located between the deposition mask 20 and the first buffer sheet 33 is omitted for clarity.

[0076] The intervening sheet 51 may be located between the deposition mask 20 and the second buffer sheet 35. One or more intervening sheets 51 may be interposed between the deposition mask 20 and the second buffer sheet 35. In this embodiment, two buffer sheets are interposed between the deposition mask 20 and the second buffer sheet 35.

[0077] The interlocking sheet 51 is a sheet that prevents plastic deformation of the deposition mask 20 by preventing the through-holes 25 of the deposition mask 20 from catching on each other with the first buffer sheet 33 or the second buffer sheet 35. For this reason, both sides of the interlocking sheet 51 may be formed flat. The interlocking sheet 51 does not need to have holes or irregularities. The interlocking sheet 51 in contact with the deposition mask 20 does not need to be fixed to the deposition mask 20. The interlocking sheet 51 in contact with the first buffer sheet 33 does not need to be fixed to the first buffer sheet 33. The interlocking sheet 51 in contact with the second buffer sheet 35 does not need to be fixed to the second buffer sheet 35.

[0078] As shown in Figure 7, the interlocking sheet 51 may be formed in a rectangular shape so as to align with the first direction D1 and the second direction D2 when viewed in the normal direction N. The interlocking sheet 51 may also have a longitudinal direction along the first direction D1.

[0079] The material of the interlocking sheet 51 is arbitrary. For example, the material of the interlocking sheet 51 may be a material having a coefficient of thermal expansion that is small in difference from the coefficient of thermal expansion of the deposition mask 20. For example, the interlocking sheet 51 may be made of 42 alloy. The 42 alloy may be an iron alloy containing 42% nickel. The interlocking sheet 51 may be made of a material containing fibers such as paper, as long as it can prevent it from getting caught in the through holes 25 of the deposition mask 20, for example, it may be made of acrylic-impregnated paper. The interlocking sheet 51 may be made of the same material as the deposition mask 20.

[0080] The thickness T4 of the interposition sheet 51 shown in Figure 5 is arbitrary. For example, the thickness T4 may be 20 μm or more, 70 μm or more, or 100 μm or more. By setting the thickness T4 to 20 μm or more, the mechanical strength of the interposition sheet 51 can be ensured, and the through-holes 25 of the deposition mask 20 can be prevented from getting caught on other members. The thickness T4 may be 200 μm or less, 250 μm or less, or 300 μm or less. By setting the thickness T4 to 300 μm or less, the deposition mask laminate 50 can be prevented from becoming thicker. The range of thickness T4 may be defined by a first group consisting of 20 μm, 70 μm and 100 μm, and / or a second group consisting of 200 μm, 250 μm and 300 μm. The range of thickness T4 may be determined by any combination of one value from the first group described above and any one value from the second group described above. The range of thickness T4 may be determined by any combination of two values ​​from the first group described above. The range of thickness T4 may be determined by any combination of two values ​​from the second group described above. For example, it may be 20 μm or more and 300 μm or less, 20 μm or more and 250 μm or less, 20 μm or more and 200 μm or less, 20 μm or more and 100 μm or less, 20 μm or more and 70 μm or less, 70 μm or more and 300 μm or less, 70 μm or more and 250 μm or less, 70 μm or more and 200 μm or less, 70 μm or more and 100 μm or less, 100 μm or more and 300 μm or less, 100 μm or more and 250 μm or less, 100 μm or more and 200 μm or less, 200 μm or more and 300 μm or less, 200 μm or more and 250 μm or more and 300 μm or less.

[0081] As shown in Figure 7, in the first direction D1, the dimension L5 of the interlocking sheet 51 may be larger than the dimension L2 of the deposition mask 20. The interlocking sheet 51 may extend outward on both sides in the first direction D1 relative to the deposition mask 20. In the second direction D2, the dimension W4 of the interlocking sheet 51 may be larger than the dimension W2 of the deposition mask 20. The interlocking sheet 51 may extend outward on both sides in the second direction D2 relative to the deposition mask 20. In this way, the entire deposition mask 20 may overlap the interlocking sheet 51. This prevents the deposition mask 20 from getting caught on other members and prevents plastic deformation.

[0082] In the first direction D1, the dimension L5 of the interlocking sheet 51 may be smaller than the dimension L4 of the first buffer sheet 33. In other words, the first buffer sheet 33 may extend outward on both sides in the first direction D1 relative to the interlocking sheet 51. In the second direction D2, the dimension W4 of the interlocking sheet 51 may be smaller than the dimension W3 of the first buffer sheet 33. In other words, the first buffer sheet 33 may extend outward on both sides in the second direction D2 relative to the interlocking sheet 51. In this way, the entire interlocking sheet 51 may overlap the first buffer sheet 33. Similarly, the entire interlocking sheet 51 may overlap the second buffer sheet 35.

[0083] As shown in Figure 7, when viewed in the normal direction N, the interlocking sheet 51 does not have to overlap the first fixing part 34. In other words, the first fixing part 34 may be located outside the interlocking sheet 51. The interlocking sheet 51 may be located between the two first fixing dividing members 45. The interlocking sheet 51 may be located between the two second fixing dividing members 46. The interlocking sheet 51 does not have to overlap the first fixing dividing member 45, nor does it have to overlap the second fixing dividing member 46.

[0084] More specifically, as shown in Figure 7, in the first direction D1, the dimension L6 between the two first fixed dividing members 45 may be greater than the dimension L5 of the interlocking sheet 51. Dimension L6 is also referred to as the inner dimension of the first fixing portion 34 in the first direction D1. Dimension L6 may also be the dimension between the inner edges of the two first fixed dividing members 45. The inner edges of the first fixed dividing members 45 may be the edges of the first fixed dividing members 45 that face the interlocking sheet 51 in a plan view.

[0085] In the first direction D1, the dimension L7 of the first fixing portion 34 may be smaller than the dimension L4 of the first cushioning sheet 33. Dimension L7 is also referred to as the outer dimension of the first fixing portion 34 in the first direction D1. Dimension L7 may also be the dimension between the outer edges of the two first fixing dividing members 45. The outer edge of the first fixing dividing member 45 may be the edge opposite to the interlocking sheet 51 of the first fixing dividing member 45 in a plan view.

[0086] In the second direction D2, the dimension W5 between the two second fixed dividing members 46 may be greater than the dimension W4 of the interlocking sheet 51. Dimension W5 is also referred to as the inner dimension of the first fixing portion 34 in the second direction D2. Dimension W5 may be greater than the dimension W1 of the recess 39. Dimension W4 may be the dimension between the inner edges of the two second fixed dividing members 46. The inner edges of the second fixed dividing members 46 may be the edges of the second fixed dividing members 46 that face the interlocking sheet 51 in a plan view.

[0087] In the second direction D2, the dimension W6 of the first fixing portion 34 may be smaller than the dimension W3 of the first cushioning sheet 33. Dimension W6 is also referred to as the outer dimension of the first fixing portion 34 in the second direction D2. Dimension W6 may also be the dimension between the outer edges of the two second fixing dividing members 46. The outer edge of the second fixing dividing member 46 may be the edge opposite to the interlocking sheet 51 of the second fixing dividing member 46 in a plan view.

[0088] The difference between the dimension L6 of the first fixing portion 34 and the dimension L1 of the recess 39 may be greater than the difference between the dimension W5 of the first fixing portion 34 and the dimension W1 of the recess 39. In this case, the distance in the first direction D1 between the first fixing dividing member 45 and the recess 39 can be made greater than the distance in the second direction D2 between the second fixing dividing member 46 and the recess 39, and the first fixing dividing member 45 can be moved away from the recess 39. In this case, it is possible to prevent the longitudinal end 21 of the deposition mask 20 from overlapping with the first fixing portion 34 and the second fixing portion 36, and to secure space for overlapping the longitudinal end 21 with the second opposing surface 38. The dimension W3 in the second direction D2 of the first cushioning sheet 33 and the second cushioning sheet 35 can be made smaller, and the dimension in the second direction D2 of the receiving portion 31 and the lid portion 32 can be made smaller.

[0089] As shown in Figure 7, when viewed in the normal direction N, the interlocking sheet 51 does not have to overlap the second fixing portion 36. In other words, the second fixing portion 36 may be located outside the interlocking sheet 51. More specifically, the interlocking sheet 51 may be located between the two third fixing dividing members 47. The interlocking sheet 51 may be located between the two fourth fixing dividing members 48. The interlocking sheet 51 does not have to overlap the third fixing dividing member 47, nor does it have to overlap the fourth fixing dividing member 48.

[0090] The second fixing portion 36 may have a planar shape similar to the first fixing portion 34 described above. The second fixing portion 36 may have an inner dimension similar to the inner dimension L6 of the first fixing portion 34 described above, or an outer dimension similar to the outer dimension L7 of the first fixing portion 34 described above. The third fixing division member 47 may overlap with the first fixing division member 45 in a plan view. However, the third fixing division member 47 may partially overlap with the first fixing division member 45 in a plan view, or may not overlap at all, as long as it does not overlap with the interlocking sheet 51 and the recess 39. The second fixing portion 36 may have an inner dimension similar to the inner dimension W5 of the first fixing portion 34 described above, or an outer dimension similar to the outer dimension W6 of the first fixing portion 34 described above. The fourth fixing division member 48 may overlap with the second fixing division member 46 in a plan view. However, the fourth fixed dividing member 48 may partially overlap with the second fixed dividing member 46 in a plan view, or it may not overlap at all, as long as it does not overlap with the interlocking sheet 51 and the recess 39.

[0091] The vapor deposition mask packaging 30 may be housed in an outer bag (not shown) and sealed. A desiccant may be placed inside the sealed bag. In this case, the air inside the outer bag is dried, and the vapor deposition mask 20 is prevented from being damaged by moisture.

[0092] Next, the vapor deposition mask packaging method according to this embodiment will be described with reference to Figures 8 to 13. The vapor deposition mask packaging method is a method for packaging the vapor deposition mask 20. The vapor deposition mask packaging method may include a preparation step, a fixing step, a placement step, a clamping step, and a bundling step. Figures 8 to 13 show a cross-section along the second direction D2.

[0093] As a preparation step, a packaging case 40 including a receiving portion 31, a lid portion 32, and a hinge portion 41 may be prepared, as shown in Figure 8.

[0094] After the preparation step, the first cushioning sheet 33 may be fixed to the first opposing surface 37 as a fixing step. The first cushioning sheet 33 may be fixed to the first opposing surface 37 by the first fixing part 34.

[0095] For example, as shown in Figure 9, the first fixing division member 45 (see Figures 3 and 5) constituting the first fixing portion 34 is fixed to a desired position on the first opposing surface 37. If the first fixing division member 45 is made of double-sided tape, the first fixing division member 45 is attached to the first opposing surface 37. Similarly, the second fixing division member 46 constituting the first fixing portion 34 is fixed to a desired position on the first opposing surface 37. The first fixing division member 45 and the second fixing division member 46 may be fixed so that, when viewed in the normal direction N, they are located outside the deposition mask 20 in the clamping process described later. The first fixing division member 45 and the second fixing division member 46 may be fixed so that they are located outside the interposition sheet 51 in the clamping process described later.

[0096] Subsequently, as shown in Figure 10, the first cushioning sheet 33 is placed at a desired position on the first opposing surface 37. This causes the first cushioning sheet 33 to be attached to the first fixed dividing member 45 and the second fixed dividing member 46, and the first cushioning sheet 33 to be fixed to the first opposing surface 37.

[0097] Similarly, as a fixing step, the second cushioning sheet 35 may be fixed to the second opposing surface 38. The second cushioning sheet 35 may be fixed to the second opposing surface 38 by the second fixing part 36.

[0098] For example, as shown in Figure 9, the third fixing division member 47 (see Figures 3 and 5) constituting the second fixing portion 36 is fixed to a desired position on the second opposing surface 38. If the third fixing division member 47 is made of double-sided tape, the third fixing division member 47 is attached to the second opposing surface 38. Similarly, the fourth fixing division member 48 constituting the second fixing portion 36 is fixed to a desired position on the second opposing surface 38. The third fixing division member 47 and the fourth fixing division member 48 may be fixed so that, when viewed in the normal direction N, they are located outside the deposition mask 20 in the clamping process described later. The third fixing division member 47 and the fourth fixing division member 48 may be fixed so that they are located outside the interposition sheet 51 in the clamping process described later.

[0099] Subsequently, as shown in Figure 10, the second cushioning sheet 35 is placed at a desired position on the second opposing surface 38. This causes the second cushioning sheet 35 to be attached to the third fixed dividing member 47 and the fourth fixed dividing member 48, and the second cushioning sheet 35 to be fixed to the second opposing surface 38.

[0100] After the fixing step, as a placement step, the vapor deposition mask laminate 50 including the vapor deposition mask 20 may be placed on the first buffer sheet 33, as shown in Figure 11.

[0101] For example, first, two interlocking sheets 51 are placed on the first buffer sheet 33. The interlocking sheets 51 are placed at desired positions on the first buffer sheet 33. The interlocking sheets 51 may be placed in positions that do not overlap with the first fixing portion 34 when viewed in the normal direction N. The interlocking sheets 51 may also be placed in positions that do not overlap with the second fixing portion 36 in the clamping process described later.

[0102] Next, the deposition mask 20 is placed on the interposition sheet 51. The deposition mask 20 is placed at a desired position on the interposition sheet 51. The deposition mask 20 is placed in a position that does not overlap with the first fixing part 34. In this case, when viewed in the normal direction N, the first fixing part 34 is located outside the deposition mask 20. The deposition mask 20 is placed in a position that does not overlap with the second fixing part 36 in the clamping process described later. In this case, when viewed in the normal direction N, the second fixing part 36 is located outside the deposition mask 20.

[0103] Next, two interposition sheets 51 are placed on the deposition mask 20. The interposition sheet 51 located above the deposition mask 20 may be placed in the same position as the interposition sheet 51 located below the deposition mask 20. In this way, the deposition mask laminate 50, including the deposition mask 20 and the interposition sheets 51, is placed on the first buffer sheet 33.

[0104] After the placement step, as a clamping step, the vapor deposition mask 20 may be clamped between the receiving portion 31 and the lid portion 32, as shown in Figure 12. By folding the packaging case 40 via the hinge portion 41, the lid portion 32 is placed on top of the vapor deposition mask laminate 50. In this case, the second opposing surface 38 of the lid portion 32 faces the first opposing surface 37 of the receiving portion 31. The second buffer sheet 35, fixed to the second opposing surface 38, is located between the vapor deposition mask laminate 50 and the lid portion 32 and is in contact with the interposition sheet 51 located at the uppermost position of the vapor deposition mask laminate 50. In this case, when viewed in the normal direction N, the second fixing portion 36 may be located outside the vapor deposition mask 20. As a result, the vapor deposition mask 20 does not have to overlap the second fixing portion 36. The recess 39 of the lid portion 32 may overlap the effective area 23 of the vapor deposition mask 20.

[0105] After the clamping process, as a binding process, the receiving portion 31 and the lid portion 32 are bound together with an elastic belt 60, as shown in Figure 13. In this way, the vapor deposition mask 20 is packaged, and the vapor deposition mask package 30 according to this embodiment is obtained. The vapor deposition mask package 30 may be housed in an outer bag (not shown).

[0106] The vapor deposition mask packaging 30 obtained as described above is transported to its destination. During transport, the vapor deposition mask 20 may be subjected to vertical force or impact. Since no recess 39 is formed on the first opposing surface 37 of the receiving portion 31, downward bending of the vapor deposition mask 20 can be suppressed. Therefore, plastic deformation of the vapor deposition mask 20 can be suppressed. On the other hand, since a recess 39 is formed on the second opposing surface 38 of the lid portion 32, the vapor deposition mask 20 can be elastically bent upward. Therefore, the impact applied to the vapor deposition mask 20 can be absorbed, and plastic deformation of the vapor deposition mask 20 can be suppressed.

[0107] The vapor deposition mask packaging 30, once it reaches its destination, may be unpacked by following the reverse procedure of the vapor deposition mask packaging method described above. This allows the vapor deposition mask 20 to be removed. In this embodiment, since the vapor deposition mask 20 is held between the interlocking sheets 51, it is possible to prevent the vapor deposition mask 20 from getting caught on other components when removing it. This prevents plastic deformation of the vapor deposition mask 20 and improves the efficiency of the unpacking process.

[0108] As described above, according to this embodiment, the first cushioning sheet 33 is positioned on the first opposing surface 37 of the receiving portion 31, and the lid portion 32 is superimposed on the receiving portion 31 via the first cushioning sheet 33 and the vapor deposition mask 20. As a result, when the vapor deposition mask 20 is subjected to a downward force or impact, the first cushioning sheet 33 can absorb the force or impact. This suppresses plastic deformation of the vapor deposition mask 20.

[0109] Furthermore, according to this embodiment, the first buffer sheet 33 is fixed to the first opposing surface 37 by the first fixing part 34. When viewed in the normal direction N, the first fixing part 34 is located outside the vapor deposition mask 20. This prevents the first fixing part 34 from overlapping with the vapor deposition mask 20. Therefore, even when the vapor deposition mask 20 is held between the receiving part 31 and the lid part 32, it is possible to prevent traces of the first fixing part 34 from remaining on the vapor deposition mask 20. As a result, plastic deformation of the vapor deposition mask 20 can be suppressed.

[0110] Furthermore, according to this embodiment, the first cushioning sheet 33 is formed in a rectangular shape so as to align with the first direction D1 and the second direction D2 which is perpendicular to the first direction D1 when viewed in the normal direction N. The first fixing portion 34 includes two first fixing dividing members 45 which are located outward on both sides relative to the vapor deposition mask 20 in the first direction D1. This prevents the first cushioning sheet 33 from shifting in the first direction D1 relative to the first opposing surface 37. Therefore, when the vapor deposition mask 20 is placed on the first cushioning sheet 33, the shifting of the first cushioning sheet 33 can be prevented, and the efficiency of packaging the vapor deposition mask 20 can be improved. For example, when the first direction D1 is along the longitudinal direction of the vapor deposition mask 20, the shifting of the first cushioning sheet 33 can be effectively prevented.

[0111] Furthermore, according to this embodiment, the first fixing portion 34 includes two second fixing dividing members 46 that are located outward on both sides relative to the vapor deposition mask 20 in the second direction D2. This prevents the first cushioning sheet 33 from shifting in the second direction D2 relative to the first opposing surface 37. Therefore, when the vapor deposition mask 20 is placed on the first cushioning sheet 33, the shifting of the first cushioning sheet 33 can be prevented, and the packaging efficiency of the vapor deposition mask 20 can be improved.

[0112] Furthermore, according to this embodiment, the first fixing portion 34 is located outside the interlocking sheet 51 when viewed in the normal direction N. This prevents the interlocking sheet 51 from deforming due to the thickness of the first fixing portion 34. Therefore, it is possible to prevent the vapor deposition mask 20 from undergoing plastic deformation due to the interlocking sheet 51.

[0113] Furthermore, according to this embodiment, the receiving portion 31 and the lid portion 32 are connected via a hinge portion 41. This allows the lid portion 32 to be easily rotated relative to the receiving portion 31. Therefore, after placing the vapor deposition mask 20 and the interposition sheet 51 on the first opposing surface 37 of the receiving portion 31, the lid portion 32 can be easily placed on top of the vapor deposition mask 20.

[0114] Furthermore, according to this embodiment, the second cushioning sheet 35 is positioned on the second opposing surface 38 of the lid portion 32, and the lid portion 32 is superimposed on the receiving portion 31 via the first cushioning sheet 33, the vapor deposition mask 20, and the second cushioning sheet 35. As a result, if the vapor deposition mask 20 is subjected to an upward force or impact, the second cushioning sheet 35 can absorb the force or impact. This suppresses plastic deformation of the vapor deposition mask 20.

[0115] Furthermore, according to this embodiment, the second buffer sheet 35 is fixed to the second opposing surface 38 by the second fixing portion 36. When viewed in the normal direction N, the second fixing portion 36 is located outside the vapor deposition mask 20. This prevents the second fixing portion 36 from overlapping with the vapor deposition mask 20. Therefore, even when the vapor deposition mask 20 is held between the receiving portion 31 and the lid portion 32, it is possible to prevent traces of the second fixing portion 36 from remaining on the vapor deposition mask 20. As a result, plastic deformation of the vapor deposition mask 20 can be suppressed.

[0116] Various modifications can be made to the embodiments described above. Hereinafter, modifications will be described with reference to the drawings as necessary. In the following description and the drawings used therein, parts that can be configured similarly to the embodiments described above will be given the same reference numerals as those used for the corresponding parts in the embodiments described above, and redundant explanations will be omitted. Furthermore, if it is clear that the effects and advantages obtained in the embodiments described above can also be obtained in the modifications, the explanation may be omitted.

[0117] In the embodiment described above, an example was described in which the receiving portion 31 and the lid portion 32 are connected via the hinge portion 41. However, the invention is not limited to this. For example, the receiving portion 31 and the lid portion 32 may be formed as separate parts. In this case as well, the receiving portion 31 and the lid portion 32 can be fastened together with the elastic belt 60, and the vapor deposition mask 20 can be held between the receiving portion 31 and the lid portion 32.

[0118] In the embodiment described above, an example was described in which the first fixing part 34 includes two first fixing dividing members 45 and two second fixing dividing members 46. However, it is not limited to this. For example, the first fixing part 34 may include a total of three fixing dividing members 45 and 46, as long as it can prevent the first cushioning sheet 33 from shifting. For example, the first fixing part 34 may include two first fixing dividing members 45 and one second fixing dividing member 46. Alternatively, the first fixing part 34 may include one first fixing dividing member 45 and two second fixing dividing members 46. For example, the first fixing part 34 may include a total of two fixing dividing members 45 and 46, as long as it can prevent the first cushioning sheet 33 from shifting. For example, the first fixing part 34 may include two first fixing dividing members 45. Alternatively, the first fixing part 34 may include two second fixing dividing members 46. Alternatively, the first fixing portion 34 may include one first fixing division member 45 and one second fixing division member 46. The same applies to the second fixing portion 36.

[0119] In the embodiment described above, an example was described in which the vapor deposition mask laminate 50 includes one vapor deposition mask 20. However, it is not limited to this. For example, as shown in Figure 14, the vapor deposition mask laminate 50 may include a plurality of vapor deposition masks 20. In this case, one or more intervening sheets 51 may be interposed between two adjacent vapor deposition masks 20. In the example shown in Figure 14, two intervening sheets 51 are interposed between two adjacent vapor deposition masks 20. By interposing intervening sheets 51 between two adjacent vapor deposition masks 20 in this way, it is possible to suppress the vapor deposition masks 20 from getting caught on each other. Therefore, it is possible to suppress plastic deformation of the vapor deposition masks 20. For example, when two intervening sheets 51 are interposed between two adjacent vapor deposition masks 20, it is possible to effectively suppress the vapor deposition masks 20 from getting caught on each other.

Claims

1. A vapor deposition mask packaging body for packaging a vapor deposition mask having multiple through holes formed therein, A receiving portion including the first opposing surface, The first cushioning sheet located on the first opposing surface, The receiving portion includes a second opposing surface facing the first opposing surface, and the receiving portion includes a lid that is superimposed on the first buffer sheet and the vapor deposition mask, A first fixing portion for fixing the first cushioning sheet to the first opposing surface, The system comprises an interlocking sheet located between the deposition mask and the first buffer sheet, When viewed in the direction normal to the first opposing surface, the first fixing portion is located outside the deposition mask. The first fixing portion is a vapor deposition mask packaging body located on the outside of the interlocking sheet when viewed in the normal direction.

2. The first buffer sheet is formed in a rectangular shape so as to align with the first direction and the second direction perpendicular to the first direction when viewed in the normal direction. The vapor deposition mask packaging according to claim 1, wherein the first fixing portion includes two first fixing dividing members located outward on both sides in the first direction relative to the vapor deposition mask.

3. The vapor deposition mask packaging according to claim 2, wherein the first fixing portion includes two second fixing dividing members located outward on both sides in the second direction relative to the vapor deposition mask.

4. The vapor deposition mask packaging according to any one of claims 1 to 3, wherein the receiving portion and the lid portion are connected via a hinge portion.

5. The second cushioning sheet is located on the second opposing surface, The vapor deposition mask packaging body according to any one of claims 1 to 3, wherein the lid portion is stacked on the receiving portion via the first cushioning sheet, the vapor deposition mask, and the second cushioning sheet.

6. The second cushioning sheet is provided with a second fixing part for fixing it to the second opposing surface, The vapor deposition mask packaging according to claim 5, wherein, when viewed in the normal direction, the second fixing portion is located outside the vapor deposition mask.

7. A vapor deposition mask packaging body according to any one of claims 1 to 3, comprising a vapor deposition mask positioned between the receiving portion and the lid portion.

8. A method for packaging a vapor deposition mask in which multiple through holes are formed, A preparation step of preparing a receiving portion including a first opposing surface and a lid portion including a second opposing surface, The first step of fixing the first cushioning sheet to the first opposing surface with the first fixing part, A placement step of placing the vapor deposition mask on the first buffer sheet, The process includes a clamping step of placing the lid portion on the deposition mask so that the second opposing surface faces the first opposing surface, and clamping the deposition mask between the receiving portion and the lid portion, When viewed in the direction normal to the first opposing surface, the first fixing portion is located outside the deposition mask. In the above-mentioned placement step, the interposition sheet is positioned between the vapor deposition mask and the first buffer sheet. A method for packaging a vapor deposition mask, wherein the first fixing portion is located outside the interlocking sheet when viewed in the normal direction.

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