Thermoplastic resin film
JP7936602B2Active Publication Date: 2026-10-16UNITIKA LTD
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Patent Information
- Application Number
- JP2023564931
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2021-12-02
- Filing Date
- 2022-11-25
- Publication Date
- 2026-10-16
- Estimated Expiration
- 2042-11-25
AI Technical Summary
Benefits of technology
【0008】 本発明の熱可塑性樹脂フィルムは、光学フィルムとして十分な透明性を有するとともに、支持基板として十分な曲げ剛性を有するため、フレキシブルLEDディスプレイのLED実装基板、有機EL等の光学基板、フレキシブルプリント配線板、フレキシブルフラットケーブルなどの電子基板材料、フレキシブルプリント配線用カバーレイフィルムなどとして、好適に使用することができる。
✦ Generated by Eureka AI based on patent content.
Abstract
A thermoplastic resin film having a haze of not more than 13%, said thermoplastic resin film being characterized by having a loop stiffness value, as measured by a loop stiffness tester, of not less than 140 mN / cm in at least one direction on a surface of the film.
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