Imaging device and electronic equipment

Abstract

Provided is an imaging device that reduces the influence of light-collection misalignment even when there are variations in the position or the like of an on-chip lens for pixels. An imaging device of the present disclosure comprises a plurality of pixels and an on-chip lens. The pixels of the imaging device perform photoelectric conversion of incident light from a subject to generate an image signal. The on-chip lens of the imaging device is disposed commonly for the plurality of pixels, has a non-light-collecting region in a central portion thereof, and collects, through a peripheral portion thereof, the incident light onto the plurality of pixels.

Description

Technical Field

[0001] The present disclosure relates to an imaging apparatus and an electronic device. Specifically, the present disclosure relates to an imaging apparatus and an electronic device equipped with the imaging apparatus.

Background Art

[0002] As an imaging apparatus for imaging a subject, an imaging apparatus configured by arranging pixels each including a photoelectric conversion element that performs photoelectric conversion of incident light in a two-dimensional matrix pattern is used. In order to improve the sensitivity of this imaging apparatus, on-chip lenses are arranged on the pixels. This on-chip lens is, for example, a lens configured in a hemispherical shape to condense incident light on the pixel onto the photoelectric conversion element. On the other hand, outside the imaging apparatus, an imaging lens that forms an image of the subject is arranged. Incident light transmitted through this imaging lens is applied to the imaging apparatus. At this time, light from the subject enters obliquely into the pixels arranged at the peripheral portion of the imaging apparatus. For this reason, in the pixels at the peripheral portion, the condensing position by the on-chip lens shifts from the photoelectric conversion element, and the sensitivity decreases. This phenomenon is referred to as shading.

[0003] Accordingly, an imaging apparatus (solid-state imaging apparatus) including an on-chip lens having a lens curved surface that corrects this shading has been proposed (see, for example, Patent Document 1). In this imaging apparatus, shading is reduced by arranging an on-chip lens having a lens curved surface in which an inclination component is superimposed on a spherical surface.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, the conventional technology described above has a problem in that it is difficult to correct the light-gathering position when the position of the on-chip lens varies. This is a particularly significant problem in the pixels that generate the phase difference signal to detect the image plane phase difference of the subject in order to perform autofocus. These pixels are the pixels that divide the pupil of the subject, and are composed of multiple pixels with on-chip lenses commonly placed on them. Light from the subject is illuminated in common by these common on-chip lenses, dividing the pupil, and a phase difference signal is generated by comparing the signals between the pixels. The focal position of the subject is detected using this phase difference signal. If a light-gathering misalignment occurs in such a phase difference pixel, an error will be included in the detected image plane phase difference, making it difficult to detect the focal position of the subject.

[0006] Therefore, this disclosure proposes an imaging device and electronic equipment that reduce the effects of light collection misalignment even when the position of the on-chip lens varies. [Means for solving the problem]

[0007] The imaging device according to this disclosure has a plurality of pixels and an on-chip lens. The pixels generate an image signal by performing photoelectric conversion of incident light from a subject. The on-chip lens is commonly arranged for the plurality of pixels and has a non-focusing region in the center and focuses the incident light onto the plurality of pixels in the peripheral portion. [Brief explanation of the drawing]

[0008] [Figure 1] This figure shows an example configuration of an imaging device according to the present disclosure. [Figure 2] This figure shows an example of the pixel configuration according to the first embodiment of this disclosure. [Figure 3] This is a cross-sectional view showing an example of the pixel configuration according to the first embodiment of this disclosure. [Figure 4A] This figure shows an example of incident light collection in a pixel according to the first embodiment of this disclosure. [Figure 4B] This figure shows another example of incident light collection in a pixel according to the first embodiment of this disclosure. [Figure 5] This is a plan view showing an example of incident light collection in a pixel according to the first embodiment of this disclosure. [Figure 6A] This figure shows an example of the arrangement of pixel blocks according to the first embodiment of this disclosure. [Figure 6B] This figure shows another example of pixel block arrangement according to the first embodiment of this disclosure. [Figure 7A] This figure shows an example of a method for manufacturing an on-chip lens according to an embodiment of this disclosure. [Figure 7B] This figure shows an example of a method for manufacturing an on-chip lens according to an embodiment of this disclosure. [Figure 7C] This figure shows an example of a method for manufacturing an on-chip lens according to an embodiment of this disclosure. [Figure 7D] This figure shows an example of a method for manufacturing an on-chip lens according to an embodiment of this disclosure. [Figure 8] This figure shows an example of the configuration of a resist used for forming an on-chip lens according to the embodiments of this disclosure. [Figure 9] This figure shows an example of the pixel configuration according to a first modification of the first embodiment of the present disclosure. [Figure 10] This figure shows an example of the pixel configuration according to a second modification of the first embodiment of the present disclosure. [Figure 11] This figure shows an example of the pixel configuration according to the second embodiment of this disclosure. [Figure 12] This figure shows an example of the pixel configuration according to the third embodiment of this disclosure. [Figure 13] This figure shows another example of a pixel configuration according to the third embodiment of this disclosure. [Figure 14A] This figure shows an example of the pixel configuration according to the fourth embodiment of this disclosure. [Figure 14B] This figure shows an example configuration of an on-chip lens according to the fourth embodiment of this disclosure. [Figure 14C] This figure shows an example configuration of an on-chip lens according to the fourth embodiment of this disclosure. [Figure 14D]This is a diagram showing a configuration example of an on-chip lens according to the fourth embodiment of the present disclosure. [Figure 15] This is a diagram showing an arrangement example of a pixel block according to the fourth embodiment of the present disclosure. [Figure 16] This is a diagram showing another arrangement example of a pixel block according to the fourth embodiment of the present disclosure. [Figure 17] This is a diagram showing another arrangement example of a pixel block according to the fourth embodiment of the present disclosure. [Figure 18] This is a diagram showing a configuration example of a pixel block according to the fifth embodiment of the present disclosure. [Figure 19A] This is a diagram showing another configuration example of a pixel block according to the fifth embodiment of the present disclosure. [Figure 19B] This is a diagram showing a configuration example of an on-chip lens according to the fifth embodiment of the present disclosure. [Figure 19C] This is a diagram showing a configuration example of an on-chip lens according to the fifth embodiment of the present disclosure. [Figure 20] This is a diagram showing an arrangement example of a pixel block according to the fifth embodiment of the present disclosure. [Figure 21] This is a diagram showing another arrangement example of a pixel block according to the fifth embodiment of the present disclosure. [Figure 22] This is a diagram showing a configuration example of a pixel unit according to the sixth embodiment of the present disclosure. [Figure 23] This is a diagram showing another configuration example of a pixel unit according to the sixth embodiment of the present disclosure. [Figure 24] This is a diagram showing another configuration example of a pixel unit according to the sixth embodiment of the present disclosure. [Figure 25] This is a diagram showing another configuration example of a pixel unit according to the sixth embodiment of the present disclosure. [Figure 26] This is a diagram showing a configuration example of a pixel block according to the seventh embodiment of the present disclosure. [Figure 27] This is a diagram showing another configuration example of a pixel block according to the seventh embodiment of the present disclosure. [Figure 28] This is a diagram showing a configuration example of a pixel unit according to the eighth embodiment of the present disclosure. [Figure 29] This figure shows an example of the pixel configuration according to the ninth embodiment of this disclosure. [Figure 30A] This figure shows an example of the pixel configuration according to the ninth embodiment of this disclosure. [Figure 30B] This figure shows an example of the pixel configuration according to the ninth embodiment of this disclosure. [Figure 31] This figure shows an example of the configuration of a pixel block according to the tenth embodiment of this disclosure. [Figure 32A] This figure shows an example configuration of an on-chip lens according to the tenth embodiment of this disclosure. [Figure 32B] This figure shows an example configuration of an on-chip lens according to the tenth embodiment of this disclosure. [Figure 32C] This figure shows an example configuration of an on-chip lens according to the tenth embodiment of this disclosure. [Figure 33] This figure shows another example of a pixel block configuration according to the tenth embodiment of this disclosure. [Figure 34] This figure shows another example of a pixel block configuration according to the tenth embodiment of this disclosure. [Figure 35] This figure shows another example of a pixel block configuration according to the tenth embodiment of this disclosure. [Figure 36A] This figure shows an example configuration of an on-chip lens according to the eleventh embodiment of this disclosure. [Figure 36B] This figure shows an example configuration of an on-chip lens according to the eleventh embodiment of this disclosure. [Figure 37] This is a block diagram showing an example configuration of an imaging device mounted on an electronic device. [Figure 38] This block diagram shows a schematic configuration example of a vehicle control system, which is an example of a mobile control system to which the technology disclosed herein may be applied. [Figure 39] This figure shows an example of the installation location of the imaging unit. [Figure 40] This figure shows an example of a schematic configuration of an endoscopic surgical system to which the technology disclosed herein (this technology) may be applied. [Figure 41]Figure 40 is a block diagram showing an example of the functional configuration of the camera head and CCU. [Modes for carrying out the invention]

[0009] Embodiments of this disclosure will be described in detail below with reference to the drawings. The description will be in the following order. In each of the following embodiments, the same parts will be denoted by the same reference numerals to avoid redundant descriptions. 1. First Embodiment 2. Second Embodiment 3. Third Embodiment 4. Fourth Embodiment 5. Fifth Embodiment 6. Sixth Embodiment 7. Seventh Embodiment 8. Eighth Embodiment 9. The ninth embodiment 10. Tenth Embodiment 11. Eleventh Embodiment 12. Example of imaging device configuration 13. Examples of applications to mobile devices 14. Examples of applications to endoscopic surgical systems

[0010] (1. First Embodiment) [Image sensor configuration] Figure 1 is a diagram showing an example configuration of an imaging device according to an embodiment of the present disclosure. As shown in Figure 1, the imaging device 1 of this example is configured to have a pixel region (so-called imaging region) 3 in which a plurality of pixels 100 containing a plurality of photoelectric conversion elements are regularly arranged in two dimensions on a semiconductor substrate 11, for example, a silicon substrate, and a peripheral circuit section. Each pixel 100 consists of, for example, a photodiode which is a photoelectric conversion element, and a plurality of pixel transistors (so-called MOS transistors). The plurality of pixel transistors can be composed of, for example, three transistors: a transfer transistor, a reset transistor, and an amplification transistor. Alternatively, a selection transistor can be added to make a total of four transistors. The pixel 100 can also be a shared pixel structure. This shared pixel structure consists of a plurality of photodiodes, a plurality of transfer transistors, one shared floating diffusion region, and one other shared pixel transistor.

[0011] The peripheral circuit section consists of a vertical drive circuit 4, a column signal processing circuit 5, a horizontal drive circuit 6, an output circuit 7, a control circuit 8, and the like.

[0012] The control circuit 8 receives the input clock and data that commands the operating mode, and outputs data such as internal information of the image sensor. In other words, the control circuit 8 generates clock signals and control signals that serve as the reference for the operation of the vertical drive circuit 4, column signal processing circuit 5, and horizontal drive circuit 6, etc., based on the vertical synchronization signal, horizontal synchronization signal, and master clock. These signals are then input to the vertical drive circuit 4, column signal processing circuit 5, and horizontal drive circuit 6, etc.

[0013] The vertical drive circuit 4 is composed of, for example, a shift register, selects the pixel drive wiring 13, supplies pulses to the selected pixel drive wiring to drive the pixels, and drives the pixels row by row. That is, the vertical drive circuit 4 sequentially selects and scans each pixel 100 of the pixel region 3 vertically row by row, and supplies a pixel signal based on the signal charge generated in accordance with the amount of light received in, for example, a photodiode which is a photoelectric conversion element of each pixel 100, to the column signal processing circuit 5 via the vertical signal line 9.

[0014] The column signal processing circuit 5 is arranged, for example, in each column of pixels 100, and performs signal processing such as noise reduction on the signals output from one row of pixels 100 for each pixel column. That is, the column signal processing circuit 5 performs signal processing such as CDS (Correlated Double Sampling) to remove fixed pattern noise specific to pixels 100, signal amplification, and AD conversion. A horizontal selection switch (not shown) is provided at the output stage of the column signal processing circuit 5, connected to the horizontal signal line 10. Note that the column signal processing circuit 5 is an example of a processing circuit described in the claims.

[0015] The horizontal drive circuit 6 is composed of, for example, a shift register, and sequentially outputs horizontal scanning pulses to select each of the column signal processing circuits 5 in order, causing each of the column signal processing circuits 5 to output a pixel signal to the horizontal signal line 10.

[0016] The output circuit 7 processes the signals sequentially supplied from each of the column signal processing circuits 5 through the horizontal signal line 10 and outputs them. For example, it may only perform buffering, or it may perform black level adjustment, column variation correction, and various digital signal processing. The input / output terminal 12 is used for exchanging signals with the outside.

[0017] [Image sensor configuration] Figure 2 is a diagram showing an example of the configuration of a pixel according to the first embodiment of this disclosure. This figure is a plan view showing an example of the configuration of a pixel 100. As described above, the pixels 100 are arranged in the pixel region 3. This figure shows an example in which the pixels 100 are arranged in a two-dimensional matrix. The "R", "G", and "B" attached to the pixels 100 in this figure represent the types of color filters 150, which will be described later. In this figure, "R", "G", and "B" represent the color filters 150 corresponding to red light, green light, and blue light, respectively.

[0018] Furthermore, an on-chip lens 170 is placed in each pixel 100. This on-chip lens 170 focuses incident light onto the photoelectric conversion element of the pixel 100 and is placed in common by multiple pixels 100. The figure shows an example where the on-chip lens 170 is placed in common by four pixels 100 arranged in a 2x2 grid (pixels 100a, 100b, 100c, and 100d in the figure). The figure also shows an example where the on-chip lens 170 is placed in common by four pixels 100 that have color filters 150 of the same color. The figure shows an example where pixel blocks 20 corresponding to red light, green light, and blue light are arranged in a Bayer array.

[0019] The on-chip lens 170 in the figure is shown as an example where it is configured in a circular shape in a plan view. The on-chip lens 170 can also be configured with a hemispherical cross-section having a non-focusing region 171 in the center. The non-focusing region 171 can be, for example, formed by a recessed surface. The on-chip lens 170 focuses incident light onto the photoelectric conversion element in the peripheral area other than the non-focusing region 171. Multiple pixels 100, where this on-chip lens 170 is commonly arranged... and This constitutes the pixel block 20.

[0020] [Cross-sectional configuration of the image sensor] Figure 3 is a cross-sectional view showing an example of the configuration of a pixel according to the first embodiment of the present disclosure. The figure is a cross-sectional view showing an example of the configuration of a pixel 100. The pixel 100 in the figure is a pixel 100 included in a pixel block 20 in which an on-chip lens 170 is commonly arranged. The pixel 100 comprises a semiconductor substrate 120, an insulating film 130, a wiring region 140, a separation portion 135, a protective film 136, and a color filter 150.

[0021] The semiconductor substrate 120 is a semiconductor substrate on which the diffusion layer of the semiconductor element of the pixel 100 is arranged. The semiconductor substrate 120 can be made of, for example, silicon (Si). The semiconductor elements are arranged in the well regions formed on the semiconductor substrate 120. For convenience, the semiconductor substrate 120 in the figure is assumed to be made up of p-type well regions. Semiconductor elements can be formed by arranging n-type or p-type semiconductor regions in these p-type well regions. In the figure, the semiconductor substrate 120 is shown with a photoelectric conversion element 101 as an example. This photoelectric conversion element 101 is made up of an n-type semiconductor region 121. Specifically, the photodiode consisting of a pn junction at the interface between the n-type semiconductor region 121 and the surrounding p-type well region corresponds to the photoelectric conversion element 101.

[0022] The insulating film 130 insulates the surface side of the semiconductor substrate 120. For example, a silicon oxide (SiO2) film can be applied to this insulating film 130.

[0023] The wiring region 140 is located on the surface side of the semiconductor substrate 120 and is the region where the wiring of the element is formed. This wiring region 140 comprises wiring 141, via plugs 142, and an insulating layer 143. The wiring 141 is a conductor that transmits signals to the element on the semiconductor substrate 120. This wiring 141 can be made of a metal such as copper (Cu) or tungsten (W). The via plugs 142 connect wiring 141 located on different layers. These via plugs 142 can be made of a columnar metal, for example. The insulating layer 143 insulates the wiring 141, etc. This insulating layer 143 can be made of SiO2, for example.

[0024] The separation portion 135 is positioned at the boundary of the pixels 100 on the semiconductor substrate 120 to electrically and optically separate the pixels 100. This separation portion 135 can be made of an insulator embedded in the semiconductor substrate 120. The separation portion 135 can be formed, for example, by placing an insulator such as SiO2 in a groove that penetrates the semiconductor substrate 120 and is formed at the boundary of the pixels 100. The separation portion 135 can also be configured to a depth that does not reach from the back surface to the front surface of the semiconductor substrate 120.

[0025] The protective film 136 is a film that protects the back side of the semiconductor substrate 120. This protective film 136 can be made of an insulating material such as SiO2. The protective film 136 shown in the figure can be formed simultaneously with the separation portion 135. Alternatively, the protective film 136 and the separation portion 135 can be formed individually.

[0026] The color filter 150 is an optical filter that transmits incident light of a predetermined wavelength. For example, a color filter that transmits red light, green light, and blue light can be used for this color filter 150. In this case, one color filter 150 corresponding to red light, green light, or blue light is placed in each pixel 100. This pixel 100 generates an image signal of incident light of the wavelength corresponding to the color filter 150. As mentioned above, multiple pixels 100 placed in the pixel block 20 are each placed with the same type of color filter 150. Also, the color filter 150 in the figure is placed on the back side of the semiconductor substrate 120.

[0027] In addition, a light-shielding film 159 is placed in the region of the color filter 150 at the boundary of the pixel block 20 for pixel 100 in the same figure. This light-shielding film 159 blocks incident light. By placing the light-shielding film 159, it is possible to block incident light that is incident at an angle from the adjacent pixel 100. Since the light-shielding film 159 blocks incident light that has passed through different types of color filters 150 of the adjacent pixel block 20's pixel 100, color mixing can be prevented, and a decrease in image quality can be prevented.

[0028] The on-chip lens 170 is a lens commonly placed on multiple pixels 100 that constitute the pixel block 20, as described above. The on-chip lens 170 in the figure has a non-focusing region 171 formed by a recess in the center. A typical on-chip lens is configured with a roughly hemispherical cross-section, as will be described later in Figure 4B, and focuses incident light to the center of the semiconductor substrate 120 in a plan view. In contrast, the on-chip lens 170 in the figure focuses incident light to the center of the semiconductor substrate 120 in a plan view at the periphery of the non-focusing region 171. On the other hand, the non-focusing region 171 transmits incident light without focusing it. Therefore, the incident light irradiates a relatively wide area of ​​the semiconductor substrate 120. The on-chip lens 170 can be made of organic materials such as acrylic resin or inorganic materials such as silicon nitride (SiN).

[0029] Pixel 100 of pixel block 20 can be used as a phase-difference pixel. (Figure) 37 As will be described later, light transmitted through the imaging lens 702 enters the pixel block 20. Phase difference pixels are pixels that generate phase difference signals for detecting the focal position of the imaging lens 702. These phase difference pixels are the pixels that divide the pupil of the subject, as described above. Due to this common on-chip lens 170, two adjacent phase difference pixels are illuminated in common by light from the subject transmitted through the imaging lens 702, causing pupil division. Light transmitted through the left side of the imaging lens 702 enters the pixel 100 on the right side of the figure, and light transmitted through the right side of the imaging lens 702 enters the pixel 100 on the left side of the figure. Using the phase difference signals of the pixels 100 of multiple pixel blocks 20, multiple phase difference signals based on the light transmitted through the left side of the imaging lens 702 and multiple phase difference signals based on the light transmitted through the right side of the imaging lens 702 are used to generate images of the subject. The focal position of the subject can be detected based on the phase difference between these two images.

[0030] Phase difference pixels can be composed of pairs of pixels 100 from the four pixels 100 in Figure 2. When dividing the pupil in the vertical direction in Figure 2, pixels 100a and 100c, and pixels 100b and 100d are used as phase difference pixels, respectively. When dividing the pupil in the horizontal direction in Figure 2, pixels 100a and 100b, and pixels 100c and 100d are used as phase difference pixels, respectively.

[0031] [Concentration of incident light] Figure 4A shows an example of incident light focusing in a pixel according to the first embodiment of this disclosure. This figure is a simplified diagram of the pixel block 20 described in Figure 3. The arrows in this figure indicate the arrival of the incident light. Since the on-chip lens 170 has a non-focusing region 171, the incident light is focused over a relatively wide area of ​​the semiconductor substrate 120. The focusing range 310 in this figure represents the range over which the incident light is focused by the on-chip lens 170. Note that when the size of the pixel 100 is as small as the wavelength of the incident light, the wave nature of the light becomes dominant. Therefore, the incident light is distributed even in the area at the edges of the pixel 100. Even in this case, the non-focusing region 171 focuses the incident light over a relatively wide area of ​​the semiconductor substrate 120.

[0032] Figure 4B shows another example of incident light focusing in a pixel according to the first embodiment of the present disclosure. This figure illustrates the focusing of incident light in a second pixel block 30 in which a second on-chip lens 179, configured with a hemispherical cross-section, is commonly arranged for multiple pixels 100. Since the second on-chip lens 179 does not have a non-focusing region 171, a relatively narrow focusing range 320 can be obtained in the second pixel block 30. Therefore, a phase difference signal can be generated in the second pixel block 30 with a high separation ratio. The second pixel block 30 in the figure can also be arranged in the pixel region 3.

[0033] Figure 5 is a plan view showing an example of incident light focusing in a pixel according to the first embodiment of this disclosure. The figure illustrates the focusing ranges of the pixel block 20 and the second pixel block 30. Note that the figure shows an example where the on-chip lens 170 and the second on-chip lens 179 are positioned offset to the lower right of the drawing. The centers of the focusing range 310 of the on-chip lens 170 and the focusing range 320 of the second on-chip lens 179 are positioned offset to the lower right of the drawing. As a result, the amount of incident light to pixels 100a, 100b, 100c and 100d changes.

[0034] In the second pixel block 30 equipped with a second on-chip lens 179, the light-gathering range 320 is relatively narrow, resulting in a significant difference in the amount of incident light to pixels 100a, 100b, 100c, and 100d. Specifically, the amount of incident light to pixel 100a is almost zero, and most of the incident light is focused to pixel 100d.

[0035] In contrast, the pixel block 20 equipped with an on-chip lens 170 has a relatively wide light-gathering range 310. This reduces the difference in the amount of incident light to pixels 100a, 100b, 100c, and 100d. Furthermore, even when pixels 100a, 100b, 100c, and 100d are used as phase-difference pixels, the error included in the detected phase difference can be reduced.

[0036] [Pixel block placement] Figure 6A is a diagram showing an example of pixel block arrangement according to the first embodiment of this disclosure. This figure is a plan view showing an example of the arrangement of pixel block 20 and second pixel block 30 in pixel region 3. In the pixel region 3 shown in the figure, a pixel block region 300 is arranged in the center. The second pixel block 30 is arranged in this pixel block region 300. Pixel block 20 is arranged in the area outside the pixel block region 300. In the central part of pixel region 3, incident light is incident approximately vertically. For this reason, the second pixel block 30 is arranged in the central part of pixel region 3. As the light collection range 320 is relatively narrow, the phase difference separation ratio can be improved, and the phase difference detection accuracy can be improved.

[0037] In the central pixel 100, the effect of variations in the height of the on-chip lens 170 is small. This is because the incident light is incident almost perpendicularly, resulting in small horizontal displacement. On the other hand, in the peripheral area of ​​pixel region 3, the effect of variations in the height of the on-chip lens 170 becomes large. This is because the horizontal incident position displacement becomes large.

[0038] Positional misalignment caused by oblique incident light at the peripheral edges where the image height is high can be corrected by pupil correction. However, positional misalignment due to variations in the height of the on-chip lens 170 (manufacturing variations) cannot be corrected by pupil correction. Therefore, the effect of manufacturing variations of the on-chip lens 170 is reduced by widening the light-gathering area. This makes it possible to reduce the sensitivity difference between the pixels 100 of the pixel block 20.

[0039] [Other arrangements of pixel blocks] Figure 6B is a diagram showing another arrangement example of the pixel blocks according to the first embodiment of the present disclosure. Similar to Figure 6A, this figure is a plan view showing an example of the arrangement of the pixel block 20 and the second pixel block 30 in the pixel region 3. In this figure, the second pixel block 30 is placed in the center of the pixel region 3, and the pixel blocks 20 are placed in other areas. The arranged pixel blocks 20 adjust the light-gathering range 310 of the on-chip lens 170 according to their distance from the center. Specifically, the on-chip lens 170 of the pixel block 20 in the area close to the center of the pixel region 3 has a narrower light-gathering range 310. Then, as you move away from the center of the pixel region 3, the light-gathering range 310 of the on-chip lens 170 is continuously widened. This adjusts the opening of the recess that constitutes the non-gathering region 171 according to the angle of incidence of the incident light. do This can be done by doing so.

[0040] Adjusting the opening of this recess includes, for example, adjusting the size and position of the opening. The opening of the recess can be adjusted by adjusting at least one of the size and position of the opening.

[0041] The light-gathering range 310 can be adjusted, for example, by adjusting the range of the non-light-gathering area 171. Specifically, in the pixel block 20 near the center of the pixel area 3, the non-light-gathering area 171 of the on-chip lens 170 is narrowed. On the other hand, in the pixel block 20 at the periphery of the pixel area 3, the non-light-gathering area 171 of the on-chip lens 170 is widened. In this way, the on-chip lens 170 of The size of the non-focusing area 171 is adjusted according to its distance from the center of the pixel area 3. This allows an on-chip lens 170 with a focusing range 310 corresponding to the incident angle of the incident light to be positioned in the pixel block 20.

[0042] [Manufacturing method for on-chip lenses] Figures 7A-7D show an example of a method for manufacturing an on-chip lens according to the present disclosure. These figures illustrate the manufacturing process of the on-chip lens 170. First, a material film 400 for the on-chip lens 170 is formed on the surface of a color filter 150 (not shown) stacked on a semiconductor substrate 120. Next, a resist 401 is placed on the surface of the material film 400 (Figure 7A). These steps can be carried out, for example, by a coating method.

[0043] Next, openings 402 and 403 are formed in the resist 401. Opening 402 is a groove-shaped opening located at the boundary of the pixel block 20. Opening 403 is an opening located in the center of the pixel block 20 (Figure 7B). These openings 402 and 403 can be formed by exposing and developing the resist 401.

[0044] Next, the resist 401 is shaped like a lens. (Resist 404 in Figure 7C) This is done by heating and softening the resist 401 (Figure 7C).

[0045] Next, register 404 The shape is transferred to the material film 400 (Figure 7D). This can be done, for example, by etching the material film 400 using the resist 401 as a mask. Dry etching can be applied to this etching process.

[0046] The on-chip lens 170 can be formed by the above process. Next, the shape of the resist 401 in Figure 7B will be described.

[0047] Figure 8 shows an example of the configuration of a resist used for forming an on-chip lens according to the embodiment of this disclosure. The figure shows an example of the configuration of the resist 401. As shown in the figure, the opening 402 is a groove-shaped opening formed at the boundary of the pixel block 20. The opening 403 is formed in the center of the pixel block 20. The opening 403 in the figure is shown as an example of a rectangular shape. The figure shows an example of the resist 401 when forming an on-chip lens 170 which is configured as a rectangular shape in a plan view. By arranging the opening 402, the thickness of the central part of the resist 401 after heating can be reduced. By etching the material film 400 using a resist 401 of this shape, an on-chip lens 170 having a non-focusing region 171 configured in a recess can be formed.

[0048] Furthermore, when forming the second on-chip lens 179, a resist 401 without an aperture 403 is used.

[0049] [First variation] Figure 9 is a diagram showing an example of a pixel configuration according to a first modification of the first embodiment of the present disclosure. This figure is a plan view showing an example of the configuration of a pixel block 20, similar to Figure 2. The on-chip lens 170 in this figure differs from the on-chip lens 170 in Figure 2 in that it is positioned offset from the center of the pixel block 20. This figure shows an example where the on-chip lens 170 is positioned offset to the left of the figure. As mentioned above, for a pixel block 20 positioned in an area other than the center of the pixel area 3, the incident light is incident at an oblique angle. Therefore, the on-chip lens 170 is positioned offset in the direction of incidence of the incident light. The pixel block 20 in this figure shows an example of a pixel block 20 positioned on the right side of the pixel area 3. This process of positioning the on-chip lens 170 offset in the direction of incidence of the incident light is called pupil correction. In the pixel block 20 of this figure, the on-chip lens 170 can be positioned offset according to the angle of incidence of the incident light.

[0050] [Second variation] Figure 10 is a diagram showing an example of a pixel configuration according to a second modification of the first embodiment of the present disclosure. This figure is a cross-sectional view showing an example of the configuration of a pixel block 20, similar to Figure 4A. The on-chip lens 170 in this figure differs from the on-chip lens 170 in Figure 4A in that it includes a non-focusing region 172 configured as a flat area. By configuring the surface to be flat, incident light travels in a straight line, and the focusing range 310 of the on-chip lens 170 can be widened.

[0051] In Figure 4A, the non-focusing region 171 is composed of a concave curved surface, and the non-focusing region 172 in the same figure is composed of a plane (a surface with zero curvature). In addition to these, convex portions with small curvature are also included in the non-focusing regions of this disclosure. For example, a convex portion with a curvature that does not substantially contribute to the focusing of incident light, where the focal position is the wiring region 140 of the semiconductor substrate 120, is also included in the non-focusing region.

[0052] Thus, the imaging device 1 of the first embodiment of this disclosure can widen the light-gathering range 310 by arranging an on-chip lens 170, which includes a non-light-gathering region 171, etc., in the pixel block 20. This reduces the effect of light-gathering misalignment even if the position of the on-chip lens 170 varies.

[0053] (2. Second Embodiment) The imaging device 1 of the first embodiment described above used an on-chip lens 170 with a uniform thickness at its periphery. In contrast, the imaging device 1 of the second embodiment of this disclosure differs from the first embodiment in that it uses an on-chip lens 170 with an adjusted thickness at its periphery.

[0054] [Pixel composition] Figure 11 is a diagram showing an example of the pixel configuration according to the second embodiment of the present disclosure. This figure is a cross-sectional view showing an example of the configuration of a pixel block 20, similar to Figure 4A. The pixel block 20 in this figure differs from the pixel block 20 in Figure 4A in that it includes an on-chip lens 173 with adjusted thickness in the peripheral area.

[0055] The on-chip lens 173 in the figure adjusts the thickness of a portion of the peripheral area adjacent to the non-focusing region 171. Specifically, the thickness of the peripheral area on the right side of the figure is reduced compared to the thickness of the peripheral area on the left side. This widens the focusing range of incident light in the peripheral area on the right side. As a result, when incident light is incident at an angle from the left side of the figure, the focusing range can be widened, and the effect of focusing misalignment can be reduced. The on-chip lens 173 can be formed by shifting the position of the aperture 403 of the resist 401 as described in Figure 8. In this way, by reducing the incident angle for oblique incidence, the positional misalignment error due to height variation of the on-chip lens 170 can be reduced.

[0056] The rest of the configuration of the imaging device 1 is the same as that of the imaging device 1 in the first embodiment of this disclosure, so a description will be omitted.

[0057] Thus, the imaging apparatus 1 of the second embodiment of this disclosure includes an on-chip lens 170 having a peripheral portion whose thickness is adjusted according to the direction of incidence of the incident light. This further reduces the effect of light focusing misalignment.

[0058] (3. Third Embodiment) In the imaging device 1 of the first embodiment described above, a color filter 150 was arranged in the pixel block 20. In contrast, the pixel block 20 of the third embodiment of this disclosure differs from the first embodiment described above in that it selects the type of color filter 150 to be arranged.

[0059] [Pixel composition] Figure 12 is a diagram showing an example of the pixel configuration according to the third embodiment of this disclosure. Similar to Figure 2, this figure is a plan view showing an example of the configuration of a pixel block 20. The pixel block 20 in this figure differs from the pixel block 20 in Figure 2 in that it has color filters 150 corresponding to red and blue light. In addition, the color filter 150 corresponding to green light is located in the second pixel block 30. A phase difference signal is generated in the second pixel block 30 in this figure. For this purpose, a second on-chip lens 179 is placed to focus the light to the center of the second pixel block 30. This makes it possible to improve the separation ratio.

[0060] On the other hand, an on-chip lens 170 is placed in the pixel block where the color filters 150 corresponding to red and blue light are located to widen the light-gathering range. As explained in Figure 3, a separation section 135 for the pixel 100 is located in the center of the pixel block 20. This separation section 135 scatters the incident light, causing color mixing. Therefore, in the pixel block 20 shown in the figure, which does not generate a phase difference signal, the on-chip lens 170 widens the light-gathering range to reduce scattered incident light. This makes it possible to reduce color mixing in the pixel block 20 where the color filters 150 corresponding to red and blue light are located.

[0061] [Other pixel configurations] Figure 13 shows another example of a pixel configuration according to the third embodiment of this disclosure. Like Figure 12, this figure is a plan view showing an example of a pixel block 20 configuration. The pixel block 20 in this figure differs from the pixel block 20 in Figure 12 in that it has color filters 150 corresponding to green light and blue light. Green light and blue light, which have relatively short wavelengths, are focused near the surface on the back side of the semiconductor substrate 120. Therefore, on-chip lenses 170 are placed in these pixel blocks to widen the focusing range.

[0062] On the other hand, red light, which has a relatively long wavelength, is focused deep within the semiconductor substrate 120. Therefore, pixel blocks equipped with a color filter 150 corresponding to red light are less susceptible to the effects of focusing misalignment. Accordingly, a second on-chip lens 179 is placed in the pixel block where the color filter 150 corresponding to red light is located. This narrows the focusing range of the second pixel block 30 and improves the separation ratio.

[0063] Furthermore, by adjusting the focusing state for each wavelength of incident light, the phase difference at each wavelength becomes approximately the same, which can improve the accuracy of autofocus.

[0064] The rest of the configuration of the imaging device 1 is the same as that of the imaging device 1 in the first embodiment of this disclosure, so a description will be omitted.

[0065] Thus, the imaging apparatus 1 of the third embodiment of this disclosure selects the on-chip lens 170 and the second on-chip lens 179 according to the type of color filter 150 arranged in the pixel block. This makes it possible to set the light-gathering range to correspond to the wavelength of light selected by the color filter 150.

[0066] (4. Fourth Embodiment) In the imaging device 1 of the first embodiment described above, four pixels 100 were arranged in the pixel block. In contrast, the imaging device 1 of the fourth embodiment of this disclosure differs from the first embodiment described above in that two pixels 100 are arranged in the pixel block.

[0067] [Pixel composition] Figure 14A is a diagram showing an example of the pixel configuration according to the fourth embodiment of this disclosure. This figure is a plan view showing an example of the configuration of a pixel block 20, similar to Figure 2. The pixel block 20 in this figure differs from the pixel block 20 in Figure 2 in that an on-chip lens (on-chip lens 174) is commonly arranged for two pixels 100.

[0068] The on-chip lens 174 in the figure is configured in an elliptical shape when viewed from above. A non-focusing region 175, formed by a groove-like recess, is located in the center of the on-chip lens 174. Pixels 100a and 100b in the figure generate phase difference signals. These pixels 100a and 100b divide the subject into pupils in adjacent directions. The non-focusing region 175 in the figure is formed in a direction perpendicular to the direction of pupil division of pixels 100a and 100b.

[0069] [On-chip lens configuration] Figures 14B-14C show examples of on-chip lens configurations according to a fourth embodiment of the present disclosure. Figure 14B is a cross-sectional view of the on-chip lens 174 along the line a-a' in Figure 14A. Figure 14C is a cross-sectional view of the on-chip lens 174 along the line b-b' in Figure 14A. By arranging a non-focusing region 175 of this shape, the focusing range can be widened in the direction of pupil division.

[0070] Figure 14D is a cross-sectional view showing an example configuration of the on-chip lens 176 located in the second pixel block 30. This figure, like Figure 14B, shows the shape of the longitudinal cross-section of the on-chip lens 176. The shape of the short-axis cross-section of the on-chip lens 176 can be the same as that in Figure 14C. The on-chip lens 176 in this figure has a relatively narrow light-gathering range.

[0071] [Pixel block placement] Figure 15 is a diagram showing an example of pixel block arrangement according to the fourth embodiment of this disclosure. The figure is a plan view showing an example of pixel block 20 arrangement. Pixel blocks 20 can be arranged with a shift of 1 pixel (100 pixels) in each row of the pixel region 3. Alternatively, four or five adjacent pixel blocks 20 can be grouped together, and the pixel blocks 20 can be arranged in a Bayer array in four groups.

[0072] [Other arrangements of pixel blocks] Figure 16 shows another example of pixel block arrangement according to the fourth embodiment of this disclosure. This figure shows an example in which four adjacent pixel blocks 20 are grouped together, and four such groups are arranged in a Bayer array. This differs from the four groups that make up the Bayer array in Figure 15 in that the number of pixel blocks 20 corresponding to green is equal to the number of pixel blocks 20 corresponding to red and blue (four each).

[0073] [Other arrangements of pixel blocks] Figure 17 shows another example of pixel block arrangement according to the fourth embodiment of this disclosure. This figure shows an example in which the pixel blocks 20 are rotated by 45 degrees and four adjacent pixel blocks 20 are grouped together, with four such groups arranged in a Bayer array. This differs from the four groups constituting the Bayer array in Figure 15 in that the number of pixel blocks 20 corresponding to green is equal to the number of pixel blocks 20 corresponding to red and blue.

[0074] The rest of the configuration of the imaging device 1 is the same as that of the imaging device 1 in the first embodiment of this disclosure, so a description will be omitted.

[0075] Thus, in the imaging device 1 of the fourth embodiment of this disclosure, an on-chip lens 174 is arranged in common for two pixels 100, widening the light-gathering range. This makes it possible to reduce the effect of light-gathering misalignment in a pixel block 20 having two pixels 100.

[0076] (5. Fifth Embodiment) The imaging device 1 of the fourth embodiment described above used square-shaped pixels 100. In contrast, the imaging device 1 of the fifth embodiment of this disclosure differs from the fourth embodiment described above in that it uses rectangular-shaped pixels 100.

[0077] [Pixel block configuration] Figure 18 is a diagram showing an example configuration of a pixel block according to the fifth embodiment of this disclosure. This figure is a plan view showing an example configuration of a pixel block 20. The pixel block 20 in this figure comprises pixels 100a and 100b that are rectangular in shape in plan view. Therefore, the pixel block 20 in this figure is configured to be square in shape in plan view. The on-chip lens 170 can also be configured to be circular in shape in plan view. Furthermore, the on-chip lens 170 in this figure shows an example in which a non-focusing region 171 is arranged in the center.

[0078] [Other configurations of a pixel block] Figure 19A is a diagram showing another example of the configuration of a pixel block according to the fifth embodiment of the present disclosure. The figure is a plan view showing an example of the configuration of a pixel block 20. The pixel block 20 in the figure has an on-chip lens 177 that includes a non-focusing region 178 formed by groove-shaped recesses, similar to the on-chip lens 174 described in Figure 14A.

[0079] Figure 19B and 19C This figure shows an example configuration of an on-chip lens according to the fifth embodiment of this disclosure. Figure 19B is a cross-sectional view of the on-chip lens 177 along the line a-a' in Figure 19A. Figure 19C is a cross-sectional view of the on-chip lens 177 along the line b-b' in Figure 19A. By arranging a non-focusing region 178 of this shape, the focusing range can be widened in the direction of pupil division.

[0080] [Pixel block placement] Figure 20 is a diagram showing an example of the arrangement of pixel blocks according to the fifth embodiment of this disclosure. This figure is a plan view showing an example of the arrangement of pixel blocks 20. Pixel region 3 in the figure shows an example in which pixel blocks 20 and a second pixel block 30 that divide the pupil in the left-right direction of the figure are arranged. Note that the pixel block 20 in the figure can be the pixel block 20 shown in Figure 18. Furthermore, the second pixel block 30 in the figure can be a second pixel block 30 configured in which a second on-chip lens 179 is commonly arranged on the two pixels 100a and 100b shown in Figure 18.

[0081] A second pixel block 30 is positioned along a line passing through the center of the pixel area 3. Pixel blocks 20 can be positioned in the remaining pixel areas 3. These pixel blocks 20 adjust the light-gathering range 310 of the on-chip lens 170 according to their distance from the line passing through the center of the pixel area 3. Specifically, the on-chip lens 170 of the pixel block 20 in the area close to the line passing through the center of the pixel area 3 has a narrower light-gathering range 310. As the distance from the line passing through the center of the pixel area 3 increases, the light-gathering range 310 of the on-chip lens 170 widens. Furthermore, the pixel block 20 can perform pupil correction for the on-chip lens 170.

[0082] [Other arrangements of pixel blocks] Figure 21 shows another example of the arrangement of the pixel block according to the fifth embodiment of this disclosure. This figure shows an example in which the on-chip lens 173 described in Figure 11 is arranged in the pixel block 20. In this figure as well, the pixel block 20 can perform pupil correction of the on-chip lens 173.

[0083] The rest of the configuration of the imaging device 1 is the same as that of the imaging device 1 in the first embodiment of this disclosure, so a description will be omitted.

[0084] Thus, the imaging apparatus 1 of the fifth embodiment of this disclosure can reduce the effect of light collection misalignment in a pixel block 20 having rectangular pixels 100a and 100b. Furthermore, at the periphery of the pixel region 3, the incident light is obliquely incident on the pixel 100. at The light-shielding film 159 causes vignetting, which is the blocking of incident light, reducing the separation ratio in the phase-difference pixels. However, by placing the non-focusing region 171 on the on-chip lens 170, the angle of incident light can be reduced (shallowed), thereby suppressing vignetting. This improves the separation ratio.

[0085] (6. Sixth Embodiment) The imaging device 1 of the first embodiment described above had a pixel region 3 in which a plurality of pixel blocks 20 were arranged in a Bayer array. In contrast, the imaging device 1 of the sixth embodiment of this disclosure differs from the first embodiment described above in that it has a pixel unit composed of a plurality of pixel blocks 20.

[0086] [Pixel Unit Configuration] Figure 22 is a diagram showing an example configuration of a pixel unit according to the sixth embodiment of the present disclosure. The figure is a plan view showing an example configuration of a pixel unit 50. The pixel unit 50 in the figure is composed of a plurality of pixel blocks 20 having color filters 150 corresponding to the same color, arranged in two rows and two columns. The figure also shows an example in which four pixel units 50, each consisting of a pixel block 20 having color filters 150 corresponding to red light, green light, and blue light, are arranged in a Bayer array. By providing a pixel region 3 in which such a pixel unit 50 consisting of a plurality of pixel blocks 20 having color filters 150 of the same color is arranged, the resolution of the imaging device 1 can be easily changed. Specifically, the resolution of the imaging device 1 can be changed to three types: a resolution based on pixels 100, a resolution based on pixel blocks 20, and a resolution based on pixel units 50.

[0087] The pixel unit 50 in the figure represents an example in which the non-focusing region 171 of the on-chip lens 170 of each pixel block 20 is positioned offset outwards from the pixel unit 50. By offsetting the non-focusing region 171 of the on-chip lens 170 outwards from the pixel unit 50, incident light can be focused onto the pixels 100 inside the pixel unit 50. This reduces the amount of incident light directed towards other adjacent pixel units 50, thereby reducing color mixing.

[0088] [Pixel Unit Liquid Configuration] Figure 23 is a diagram showing another example configuration of a pixel unit according to the sixth embodiment of this disclosure. This figure is a plan view showing an example configuration of a pixel unit 50, similar to Figure 22. The pixel unit 50 in this figure differs from the pixel unit 50 in Figure 22 in that the non-focusing region 171 of the on-chip lens 170 of the pixel unit 50 corresponding to green light is positioned in a shifted direction toward the inside of the pixel unit 50. The non-focusing region 171 of the on-chip lens 170 of the pixel block 20 corresponding to red and blue light in this figure is positioned in a position that is not shifted.

[0089] By positioning the non-focusing region 171 of the on-chip lens 170 of the pixel unit 50 corresponding to green light in a position shifted inward from the pixel unit 50, the sensitivity of the pixels 100 at the periphery of the pixel unit 50 can be improved. This reduces the influence of color mixing from pixel units 50 corresponding to other colors on the pixel unit 50 corresponding to green light. The configuration of the on-chip lens 170 in which the non-focusing region 171 is positioned inward from the pixel unit 50 can be applied to at least one of the pixel units 50 corresponding to red light, green light, and blue light.

[0090] Furthermore, the configurations of the pixel units 50 in Figures 22 and 23 can be combined. For example, the arrangement of the non-focusing region 171 of the on-chip lens 170 in the pixel unit 50 corresponding to red light in Figure 22 can be applied to the pixel unit 50 corresponding to red light in Figure 23. In this case, the non-focusing region 171 of the on-chip lens 170 in the pixel unit 50 corresponding to red light can be shifted outward to focus the incident light onto the pixels 100 inside the pixel unit 50. This makes it possible to reduce color mixing of the pixels 100 surrounding the pixel unit 50 corresponding to red light. This further reduces color mixing of long-wavelength incident light, which is often a problem.

[0091] [Pixel Unit Liquid Configuration] Figures 24 and 25 are diagrams showing other configuration examples of the pixel unit according to the sixth embodiment of the present disclosure. These figures are plan views showing an example configuration of the pixel unit 50, similar to Figure 22. The pixel unit 50 in these figures differs from the pixel unit 50 in Figure 22 in that it is composed of a pixel block 20 having pixels 100a and 100b as shown in Figure 18. Figure 24, similar to Figure 22, shows an example in which the non-focusing regions 171 of the on-chip lens 170 of each pixel block 20 of the pixel unit 50 are positioned offset outwards from the pixel unit 50. Figure 25, similar to Figure 23, shows an example in which the non-focusing regions 171 of the on-chip lens 170 of the pixel unit 50 corresponding to green light are positioned offset inwards from the pixel unit 50.

[0092] The rest of the configuration of the imaging device 1 is the same as that of the imaging device 1 in the first embodiment of this disclosure, so a description will be omitted.

[0093] Thus, the imaging apparatus 1 of the sixth embodiment of this disclosure adjusts the position of the non-focusing region 171 of the on-chip lens 170 for each pixel unit 50. This reduces color mixing.

[0094] (7. Seventh Embodiment) In the imaging device 1 of the fourth embodiment described above, a plurality of pixel blocks 20 having two pixels 100 each were arranged with a one-pixel offset. In contrast, the imaging device 1 of the seventh embodiment of this disclosure differs from the fourth embodiment described above in that it adjusts the size of the non-focusing region 171 of the on-chip lens 170 for a plurality of pixel blocks 20 having two pixels 100 each.

[0095] [pixel block [Configuration] Figure 26 is a diagram showing an example configuration of a pixel block according to the seventh embodiment of the present disclosure. The figure is a plan view showing an example configuration of a pixel block 20. Similar to Figure 15, the pixel block 20 in the figure has two pixels 100 that are adjacent in the row direction and have a color filter 150 that transmits incident light of the same wavelength and The An on-chip lens 174 is positioned in common to two pixels 100. Prepare The pixel blocks 20 are arranged in the matrix direction. These pixel blocks 20 are positioned with a shift of 1 pixel 100 in each row.

[0096] Here, two pixel blocks 20 adjacent to each other in the row direction (pixel blocks 20a and 20b in the figure) equipped with a color filter 150 that transmits incident light of the same wavelength, and a pixel block 20 (pixel block 20c in the figure) arranged adjacent to these pixel blocks 20 in the row direction and equipped with a color filter 150 that transmits incident light of a different wavelength, are referred to as a pixel group 40. The pixel region 3 in the figure can be considered as an arrangement of multiple pixel groups 40. Furthermore, among the pixel groups 40, the two pixel blocks 20a and 20b having color filters 150 corresponding to the same color are referred to as a multi-pixel section 41, and the single pixel block 20c having a different color filter 150 than the pixel block 20 of the multi-pixel section 41 is referred to as a single-pixel section 42.

[0097] The pixel group 40 in the figure has non-light-collecting regions of different sizes in the multi-pixel section 41 and the single-pixel section 42. 175 This shows an example of how they are arranged. Specifically, the single-pixel portion 42 in the figure is the non-light-collecting region of the multi-pixel portion 41. 175a and 175bSmaller non-light-collecting area 175c It is equipped with this. This allows the pixel block of the multi-pixel section 41 20a and 20b In contrast, the pixel block of the single pixel section 42 20c The light-gathering range can be narrowed.

[0098] In the pixel block 20 shown in the figure, color mixing within the pixel block 20 becomes a problem. In a configuration where the pixel blocks 20 are arranged with a shift in each row, as shown in the figure, if there is an image boundary in the column direction (for example, in the direction of the white arrow in the figure), the color mixing changes from row to row for adjacent pixels 100 in the column direction. Specifically, in the area indicated by the white arrow in the figure, even if the actual image is the same in the column direction, the mixing alternates between mixing with the pixel 100 to the right or the pixel 100 to the left in the row direction. As a result, the output image in the area indicated by the white arrow in the figure becomes non-uniform, and the image quality at the boundary of the actual image may deteriorate.

[0099] This image variation is influenced by the intensity of internal color mixing in pixel block 20. This internal color mixing in pixel block 20 is controlled by the on-chip lens. 174 The narrower the light-gathering range, the greater the effect. To mitigate this effect, the light-gathering range of the pixel blocks 20 located at the boundaries of the same-colored pixel blocks 20 is widened, and the light-gathering range of the pixel blocks 20 located in the center of the same-colored pixel blocks 20 is narrowed. Specifically, the pixel blocks of the single-pixel section 42 20c on-chip lens 174c Non-light-gathering region 175c The size is reduced to narrow the light-gathering range. This reduces the pixel block of the single pixel section 42. 20c This increases the internal color mixing and reduces the variation in color mixing in the row direction. Note that the pixel block of the multi-pixel section 41 20a and 20b on-chip lens 174c and 174b Non-light-gathering region 175a and 175b It can also be deleted.

[0100] [pixel block Other configurations] Figure 27 is a diagram showing another example of the configuration of a pixel block according to the seventh embodiment of this disclosure. This figure is a plan view showing an example of the configuration of a pixel block 20, similar to Figure 26. The pixel blocks 20a and 20b that constitute the multi-pixel section 41 in this figure have non-light-collecting regions of different sizes. 175 It differs from the pixel block 20 in Figure 26 in that each element is arranged in a different way.

[0101] The pixel group 40 at the periphery of pixel region 3 is illuminated by incident light at an oblique angle. For example, when the incident light is illuminated at an oblique angle in the row direction of the figure, the effect of color mixing on pixel block 20b increases compared to pixel block 20a. This is because a pixel block 20 corresponding to a different color is located to the right of pixel block 20b. Therefore, the non-light-collecting region of pixel block 20b 175b The size of the non-light-collecting region of pixel block 20a 175a By making it larger and widening the light-gathering area, the effects of color mixing can be reduced.

[0102] The rest of the configuration of the imaging device 1 is the same as that in the fourth embodiment of this disclosure, so we will omit the explanation.

[0103] Thus, the imaging apparatus 1 of the seventh embodiment of this disclosure adjusts the size of the non-focusing region 171 of each pixel block 20 of the pixel group 40. This reduces the effect of color mixing.

[0104] (8. Eighth Embodiment) In the imaging device 1 of the first embodiment described above, a pixel block 20 in which a common on-chip lens 170 is arranged for multiple pixels 100 is arranged in the pixel region 3. In contrast, the imaging device 1 of the eighth embodiment of this disclosure differs from the first embodiment in that it has a pixel region 3 in which each of its pixels 100 has an on-chip lens arranged for it.

[0105] [Pixel Unit Configuration] Figure 28 shows a pixel according to the eighth embodiment of this disclosure. unitThis figure shows an example of the configuration. The figure shows an example in which a pixel unit 50, composed of multiple pixels 100 on which a circular on-chip lens 189 is placed, is arranged in a Bayer array. In part of the four pixel units 50 of this Bayer array, a pixel block 20 is placed where an on-chip lens 174 is placed in common for two pixels 100. This pixel block 20 generates a phase difference signal. Furthermore, by placing a non-focusing region 175 in the on-chip lens 170 of this pixel block 20, color mixing can be reduced. This effect is particularly noticeable at the periphery of the pixel region 3.

[0106] The rest of the configuration of the imaging device 1 is the same as that of the imaging device 1 in the first embodiment of this disclosure, so a description will be omitted.

[0107] (9. The ninth embodiment) In the imaging device 1 of the first embodiment described above, the pixels 100 were arranged in the pixel region 3. In contrast, the imaging device 1 of the ninth embodiment of this disclosure differs from the first embodiment described above in that the spectroscopic element is arranged in the pixels 100.

[0108] [Pixel composition] Figure 29 is a diagram showing an example of the configuration of a pixel according to the ninth embodiment of this disclosure. This figure, like Figure 3, is a cross-sectional view showing an example of the configuration of a pixel 100. The pixel 100 in this figure differs from the pixel 100 in Figure 3 in that a spectroscopic element 160 is further arranged between the color filter 150 and the on-chip lens 170.

[0109] The spectroscopic element 160 spectrally separates incident light within a predetermined wavelength range. Specifically, the spectroscopic element 160 spectrally separates the incident light in different directions depending on the wavelength.

[0110] [Pixel block configuration] Figures 30A and 30B are diagrams showing example pixel configurations according to the ninth embodiment of this disclosure. These figures are plan views showing an example configuration of pixel 100, similar to Figure 2. These figures also show an example configuration of pixel block 20 according to the ninth embodiment of this disclosure. In these figures, the white arrows indicate the spectral direction of the spectroscopic element 160. The spectroscopic element 160 spectrally separates long-wavelength incident light and short-wavelength incident light in different directions. Taking the pixel unit 50 corresponding to green light in Figure 30A as an example, the spectroscopic element 160 spectrally separates long-wavelength incident light and short-wavelength incident light in different directions (up and down directions indicated by the white arrows in the figure) relative to the wavelength approximately in the center of the wavelength band corresponding to green light. As a result, the upper and lower pixels 100 of the pixel unit 50 receive narrow-band green light compared to a normal pixel 100 that detects incident light in the wavelength band corresponding to green light, thereby improving the wavelength resolution of the incident light. This improves color reproduction.

[0111] The groove-shaped non-focusing region 175 of the on-chip lens 174 in the figure can be formed approximately parallel to the spectral direction of the spectroscopic element 160. This allows for a wider focusing range in the spectral direction of the spectroscopic element 160 and a weaker focusing effect. In other words, in the direction of detecting the image plane phase difference (perpendicular to the arrow in the figure), the incident light is focused into a narrow region to ensure the separation ratio of the phase difference pixels. This assumes an imaging device 1 to which autofocus requiring a relatively high separation ratio is applied. On the other hand, for spectral directions that do not contribute to the separation ratio, the focusing range of the incident light is widened to reduce scattering by the separation section 135 and reduce color mixing. Furthermore, when using an angle-dependent material such as a metasurface or prism as the spectroscopic element 160, weakening the focusing effect allows for a shallower incident angle and improved spectral characteristics. Figure 30A shows an example where pixel blocks 20 with the same spectral direction of the spectroscopic element 160 are arranged, and Figure 30B shows an example where pixel blocks 20 with different spectral directions of the spectroscopic element 160 are arranged.

[0112] The rest of the configuration of the imaging device 1 is the same as that of the imaging device 1 in the first embodiment of this disclosure, so a description will be omitted.

[0113] Thus, the imaging apparatus 1 of the ninth embodiment of this disclosure has a spectroscopic element 160 arranged in the pixel 100 and an on-chip lens 174 having a groove-shaped non-focusing region 175 parallel to the spectral direction of the spectroscopic element 160. This makes it possible to improve the spectral ratio of the spectroscopic element 160.

[0114] (10. Tenth Embodiment) In the imaging device 1 of the fifth embodiment described above, pixels 100a and 100b were separated by a separation unit 135. In contrast, the imaging device 1 of the tenth embodiment of this disclosure differs from the fifth embodiment described above in that pixels 100a and 100b are separated by means other than the separation unit 135.

[0115] [Pixel composition] Figure 31 is a diagram showing an example of the configuration of a pixel block according to the tenth embodiment of this disclosure. This figure is a plan view showing an example of the configuration of a pixel block 20, similar to Figure 18. The pixel block 20 in this figure differs from the pixel block 20 in Figure 18 in that pixels 100a and 100b are separated by a separation part 137.

[0116] The separation section 137 is composed of a semiconductor region with a relatively high impurity concentration. By separating pixels 100a and 100b using this separation section 137, color mixing to adjacent pixels 100 due to scattering can be reduced. This is because components that scatter incident light, such as the separation section 135, can be reduced. As in Figure 21, pupil correction is performed at the periphery of the pixel region 3 by shifting the position of the on-chip lens 170 toward the center of the pixel region 3. The non-focusing region 171 of the on-chip lens 170 is configured as a circular recess in a plan view. The non-focusing region 171 of the on-chip lens 170 can also be positioned shifted toward the periphery of the pixel region 3. In this case, the position of the non-focusing region 171 can be adjusted according to the color filter 150 of the pixel block 20 to adjust the focusing range.

[0117] [On-chip lens configuration] Figures 32A-32C show examples of on-chip lens configurations according to the tenth embodiment of this disclosure. These figures are cross-sectional views showing examples of on-chip lens configurations for pixel blocks 20 at the periphery of pixel region 3. As described above, pupil correction causes the on-chip lens 170 to be positioned shifted toward the central part of pixel region 3.

[0118] Figures 32A, 32B, and 32C are diagrams illustrating example configurations of on-chip lenses 170, with pixel blocks 20 corresponding to red light, green light, and blue light, respectively.

[0119] As described above, the pixel block 20 in the figure can adjust the position of the non-focusing region 171 of the on-chip lens 170 according to the corresponding wavelength of the color filter 150. Pixels 100a and 100b of the pixel block 20 constitute phase difference pixels. In these phase difference pixels, a phase difference detection error occurs when the separation ratio, which is the ratio of sensitivity to the incident angle of incident light, differs for each pixel (pixels 100a and 100b). A difference in separation ratio occurs when the focusing position of the on-chip lens 170 shifts from the boundary between pixels 100a and 100b. Therefore, in the pixel block 20 located at the periphery of the pixel region 3, pupil correction is performed to compensate for the shift in the focusing position.

[0120] However, the semiconductor material such as silicon (Si) that constitutes the photoelectric conversion element 101 has a light absorption rate that changes depending on the wavelength. Specifically, short-wavelength light with a high absorption rate is absorbed in the shallow part of the photoelectric conversion element 101, while long-wavelength light with a low absorption rate is absorbed in the deeper part of the photoelectric conversion element 101. Therefore, the focusing position of incident light that is incident at an oblique angle will shift depending on the wavelength of the incident light. Specifically, when pupil correction of the on-chip lens 170 is performed using green incident light as a reference, the focusing position of red light that reaches the deeper part of the photoelectric conversion element 101 will be shifted to the back side in the direction of oblique incidence, increasing the amount of absorption in the pixels 100 on the back side (pixels 100b in Figure 32A, etc.) and causing a difference in the separation ratio. On the other hand, the focusing position of blue light will be shifted to the front side in the direction of oblique incidence (towards the center of the pixel area 3), increasing the amount of absorption in the pixels 100 on the front side (pixels 100a in Figure 32A, etc.) and causing a difference in the separation ratio, similar to red light.

[0121] Therefore, the pixel block 20 corresponding to red light is focused towards the center of the pixel area 3 compared to the pixel block 20 corresponding to green light. In other words, the pixel block 20 corresponding to red light is focused towards the center of the pixel area 3. Specifically, as shown in Figure 32A, the non-focusing region 171 is shifted towards the periphery of the pixel area 3, causing the incident light to refract at a steeper angle. On the other hand, the pixel block 20 corresponding to blue light is focused towards the periphery of the pixel area 3 compared to the pixel block 20 corresponding to green light. As shown in Figure 32C, the non-focusing region 171 is shifted towards the center of the pixel area 3, making the incident angle of the incident light shallower.

[0122] [Other pixel configurations] Figure 33 shows another example of the configuration of a pixel block according to the tenth embodiment of this disclosure. This figure is a plan view showing an example of the configuration of a pixel block 20, similar to Figure 32. The pixel block 20 in this figure differs from the pixel 100 in Figure 32 in that pixels 100a and 100b are separated by a separation section 138 having an opening in the center. The opening of the separation section 138 constitutes an overflow path between pixels 100a and 100b. The rest of the configuration of the pixel block 20 is the same as that of the pixel block 20 in Figure 32, so a description is omitted.

[0123] Furthermore, the configuration of the pixel block 20 in Figures 31 and 33 can be applied to the pixel block 20 in Figure 2. This example will be explained using Figures 34 and 35.

[0124] [Other pixel configurations] Figure 34 shows another example of the configuration of a pixel block according to the tenth embodiment of this disclosure. This figure shows an example in which pixels 100a-100d constituting the pixel block 20 are separated by a separation unit 137. The separation unit 137 in this figure is configured in a cross shape in plan view and separates pixels 100a-100d.

[0125] Figure 35 shows another example of a pixel block configuration according to the tenth embodiment of this disclosure. This figure shows an example in which pixels 100a-100d constituting the pixel block 20 are separated by two orthogonal separation sections 138.

[0126] The configuration of the on-chip lens 170 and non-focusing region 171 of the pixel block 20 in Figures 34 and 35 is the same as the on-chip lens 170 and non-focusing region 171 in Figure 32. and Adopting a similar configuration can .

[0127] (11. Eleventh Embodiment) This section describes the variations of the on-chip lens 170.

[0128] [Pixel composition] Figures 36A and 36B show examples of on-chip lens configurations according to the eleventh embodiment of the present disclosure. Figure 36A shows an example of an on-chip lens 180 having four protrusions 182 and a non-focusing region 181. Figure 36B shows an example of an on-chip lens 183 having a circular configuration in plan view and a cross-shaped non-focusing region 184.

[0129] Furthermore, the configuration of the second modified example of the first embodiment of this disclosure can be applied to other embodiments. Specifically, the non-light-gathering region 172 in Figure 10 can be applied to the second to fifth embodiments of this disclosure.

[0130] The configuration of the second embodiment of this disclosure can be applied to other embodiments. Specifically, the on-chip lens 173 in Figure 11 can be applied to the third and fourth embodiments of this disclosure.

[0131] (12. Example of imaging device configuration) The imaging device 1 described above can be applied to various electronic devices, such as imaging systems like digital still cameras and digital video cameras, mobile phones equipped with imaging functions, or other devices equipped with imaging functions.

[0132] Figure 37 is a block diagram showing an example configuration of an imaging device mounted on an electronic device. This figure is a block diagram representing an example configuration of imaging device 701.

[0133] As shown in Figure 37, the imaging device 701 includes a shooting lens 702, an image sensor 703, and a DSP (Digital Signal Processor) 704. The DSP 704, display device 705, operating system 706, memory 708, recording device 709, and power supply system 710 are connected via a bus 707, and the device is capable of capturing both still and moving images.

[0134] The photographic lens 702 is composed of one or more lenses and guides the image light (incident light) from the subject to the image sensor 703, forming an image on the light-receiving surface (sensor part) of the image sensor 703.

[0135] Image sensor 703 for The imaging device 1 described in any of the above-mentioned configuration examples is applied. Electrons are accumulated in the image sensor 703 for a certain period of time, depending on the image formed on the light-receiving surface via the imaging lens 702. Then, a signal corresponding to the electrons accumulated in the image sensor 703 is input to the DSP 704.

[0136] The DSP 704 performs various signal processing on the signal from the image sensor 703 to acquire an image, and temporarily stores the image data in the memory 708. The image data stored in the memory 708 is recorded in the recording device 709 or supplied to the display device 705 to display the image. The operation system 706 receives various operations from the user and supplies operation signals to each block of the imaging device 701, and the power supply system 710 supplies the power necessary to drive each block of the imaging device 701.

[0137] (13. Examples of applications to mobile devices) The technology disclosed herein (the Technology) can be applied to a variety of products. For example, the Technology disclosed herein may be implemented as a device mounted on any type of mobile vehicle, such as an automobile, electric vehicle, hybrid electric vehicle, motorcycle, bicycle, personal mobility device, airplane, drone, ship, or robot.

[0138] Figure 38 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a mobile control system to which the technology described herein may be applied.

[0139] The vehicle control system 12000 comprises multiple electronic control units connected via a communication network 12001. In the example shown in Figure 38, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an external information detection unit 12030, an internal information detection unit 12040, and an integrated control unit 12050. The functional configuration of the integrated control unit 12050 is shown in the figure, which includes a microcomputer 12051, an audio / image output unit 12052, and an in-vehicle network interface 12053.

[0140] The drivetrain control unit 12010 controls the operation of devices related to the vehicle's drivetrain according to various programs. For example, the drivetrain control unit 12010 functions as a control device for a drivetrain generating device that generates driving force for the vehicle, such as an internal combustion engine or a drive motor; a drivetrain transmission mechanism that transmits driving force to the wheels; a steering mechanism that adjusts the steering angle of the vehicle; and a braking device that generates braking force for the vehicle.

[0141] The body system control unit 12020 controls the operation of various devices mounted on the vehicle body according to various programs. For example, the body system control unit 12020 functions as a control device for a keyless entry system, a smart key system, a power window system, or various lamps such as headlights, reverse lights, brake lights, turn signals, or fog lights. In this case, the body system control unit 12020 may receive radio waves transmitted from a portable device that replaces a key or signals from various switches. The body system control unit 12020 receives these radio waves or signals and controls the vehicle's door lock system, power window system, lamps, etc.

[0142] The external information detection unit 12030 detects information from outside the vehicle equipped with the vehicle control system 12000. For example, an imaging unit 12031 is connected to the external information detection unit 12030. The external information detection unit 12030 causes the imaging unit 12031 to capture images of the outside of the vehicle and receives the captured images. Based on the received images, the external information detection unit 12030 may perform object detection processing such as detecting people, cars, obstacles, signs, or characters on the road surface, or distance detection processing.

[0143] The imaging unit 12031 is an optical sensor that receives light and outputs an electrical signal corresponding to the amount of light received. The imaging unit 12031 can output the electrical signal as an image or as distance measurement information. The light received by the imaging unit 12031 may be visible light or invisible light such as infrared light.

[0144] The in-vehicle information detection unit 12040 detects information inside the vehicle. The in-vehicle information detection unit 12040 is connected to, for example, a driver status detection unit 12041 that detects the driver's state. The driver status detection unit 12041 includes, for example, a camera that images the driver, and the in-vehicle information detection unit 12040 may calculate the driver's level of fatigue or concentration, or determine whether the driver is drowsy, based on the detection information input from the driver status detection unit 12041.

[0145] The microcomputer 12051 can calculate control target values ​​for the drive force generator, steering mechanism, or braking system based on information from inside and outside the vehicle acquired by the external information detection unit 12030 or the internal information detection unit 12040, and output control commands to the drive system control unit 12010. For example, the microcomputer 12051 can perform cooperative control aimed at realizing ADAS (Advanced Driver Assistance System) functions, including collision avoidance or impact mitigation, following based on distance between vehicles, maintaining vehicle speed, vehicle collision warning, or vehicle lane departure warning.

[0146] Furthermore, the microcomputer 12051 can perform cooperative control for purposes such as autonomous driving, where the vehicle drives autonomously without driver intervention, by controlling the drive force generating device, steering mechanism, or braking device, etc., based on information about the vehicle's surroundings acquired by the external information detection unit 12030 or the internal information detection unit 12040.

[0147] Furthermore, the microcomputer 12051 can output control commands to the body system control unit 12020 based on external information acquired by the external information detection unit 12030. For example, the microcomputer 12051 can control the headlights according to the position of a preceding or oncoming vehicle detected by the external information detection unit 12030, and perform coordinated control aimed at reducing glare, such as switching from high beams to low beams.

[0148] The audio-image output unit 12052 transmits at least one of audio and image output signals to an output device capable of visually or audibly notifying information to the vehicle's occupants or to those outside the vehicle. In the example shown in Figure 38, the output devices are exemplified as an audio speaker 12061, a display unit 12062, and an instrument panel 12063. The display unit 12062 may include, for example, at least one of an onboard display and a head-up display.

[0149] Figure 39 shows an example of the installation position of the imaging unit 12031.

[0150] In Figure 39, the imaging unit 12031 includes imaging units 12101, 12102, 12103, 12104, and 12105.

[0151] The imaging units 12101, 12102, 12103, 12104, and 12105 are installed, for example, on the front nose, side mirrors, rear bumper, back door, and the upper part of the windshield inside the vehicle 12100. The imaging unit 12101 installed on the front nose and the imaging unit 12105 installed on the upper part of the windshield inside the vehicle mainly acquire images of the front of the vehicle 12100. The imaging units 12102 and 12103 installed on the side mirrors mainly acquire images of the sides of the vehicle 12100. The imaging unit 12104 installed on the rear bumper or back door mainly acquires images of the rear of the vehicle 12100. The imaging unit 12105 installed on the upper part of the windshield inside the vehicle is mainly used for detecting preceding vehicles, pedestrians, obstacles, traffic lights, traffic signs, or lanes.

[0152] Figure 39 shows an example of the imaging range of imaging units 12101 to 12104. Imaging range 12111 indicates the imaging range of imaging unit 12101 located on the front nose, imaging ranges 12112 and 12113 indicate the imaging ranges of imaging units 12102 and 12103 located on the side mirrors, respectively, and imaging range 12114 indicates the imaging range of imaging unit 12104 located on the rear bumper or back door. For example, by superimposing the image data captured by imaging units 12101 to 12104, an overhead view image of the vehicle 12100 can be obtained.

[0153] At least one of the imaging units 12101 to 12104 may have a function for acquiring distance information. For example, at least one of the imaging units 12101 to 12104 may be a stereo camera consisting of multiple image sensors, or an image sensor having pixels for phase difference detection.

[0154] For example, the microcomputer 12051, based on distance information obtained from imaging units 12101 to 12104, can determine the distance to each object within the imaging range 12111 to 12114 and the temporal change of this distance (relative speed to vehicle 12100). In particular, it can extract the nearest object on the vehicle 12100's path that is traveling in approximately the same direction as vehicle 12100 at a predetermined speed (e.g., 0 km / h or more) as the preceding vehicle. Furthermore, the microcomputer 12051 can set a predetermined distance to be maintained before the preceding vehicle and perform automatic braking control (including follow-and-stop control) and automatic acceleration control (including follow-and-start control), etc. In this way, cooperative control aimed at autonomous driving, where the vehicle drives autonomously without driver intervention, can be performed.

[0155] For example, the microcomputer 12051 can use distance information obtained from imaging units 12101 to 12104 to classify and extract three-dimensional object data related to three-dimensional objects, such as motorcycles, passenger cars, heavy vehicles, pedestrians, utility poles, and other three-dimensional objects, and use this data for automatic obstacle avoidance. For example, the microcomputer 12051 identifies obstacles around the vehicle 12100 into obstacles that are visible to the driver of the vehicle 12100 and obstacles that are difficult to see. The microcomputer 12051 then determines the collision risk, which indicates the degree of risk of collision with each obstacle. If the collision risk is above a set value and there is a possibility of collision, the microcomputer 12051 can provide driving assistance to avoid collisions by outputting a warning to the driver via the audio speaker 12061 or display unit 12062, or by performing forced deceleration or evasive steering via the drive system control unit 12010.

[0156] At least one of the imaging units 12101 to 12104 may be an infrared camera that detects infrared light. For example, the microcomputer 12051 can recognize pedestrians by determining whether or not pedestrians are present in the images captured by the imaging units 12101 to 12104. Such pedestrian recognition is performed, for example, by a procedure to extract feature points from the images captured by the imaging units 12101 to 12104 as infrared cameras, and a procedure to perform pattern matching on a series of feature points that indicate the contour of an object to determine whether or not it is a pedestrian. When the microcomputer 12051 determines that a pedestrian is present in the images captured by the imaging units 12101 to 12104 and recognizes a pedestrian, the audio-image output unit 12052 controls the display unit 12062 to superimpose a rectangular contour line for emphasis on the recognized pedestrian. The audio-image output unit 12052 may also control the display unit 12062 to display an icon indicating a pedestrian at a desired position.

[0157] The above describes an example of a vehicle control system to which the technology relating to this disclosure may be applied. The technology relating to this disclosure can be applied to the imaging unit 12031 of the configuration described above. Specifically, the imaging device 1 shown in Figure 1 can be applied to the imaging unit 12031.

[0158] (14. Examples of application to endoscopic surgical systems) The technology disclosed herein (the Technology) can be applied to a variety of products. For example, the Technology disclosed herein may be applied to an endoscopic surgical system.

[0159] Figure 40 is a diagram showing an example of a schematic configuration of an endoscopic surgical system to which the technology described herein (the technology) may be applied.

[0160] Figure 40 illustrates a surgeon (physician) 11131 performing surgery on a patient 11132 on a patient bed 11133 using an endoscopic surgical system 11000. As shown in the figure, the endoscopic surgical system 11000 consists of an endoscope 11100, other surgical instruments 11110 such as an insufflation tube 11111 and an energy treatment device 11112, a support arm device 11120 for supporting the endoscope 11100, and a cart 11200 equipped with various devices for endoscopic surgery.

[0161] The endoscope 11100 consists of a barrel 11101, the tip of which is inserted into the body cavity of the patient 11132 for a predetermined length, and a camera head 11102 connected to the base end of the barrel 11101. In the illustrated example, the endoscope 11100 is shown as a so-called rigid endoscope having a rigid barrel 11101, but the endoscope 11100 may also be configured as a so-called flexible endoscope having a flexible barrel.

[0162] An opening into which an objective lens is fitted is provided at the tip of the endoscope tube 11101. A light source device 11203 is connected to the endoscope 11100, and the light generated by the light source device 11203 is guided to the tip of the endoscope tube by a light guide extending inside the endoscope tube 11101, and is irradiated through the objective lens towards the object to be observed inside the body cavity of the patient 11132. The endoscope 11100 may be a straight-viewing endoscope, an oblique-viewing endoscope, or a side-viewing endoscope.

[0163] The camera head 11102 contains an optical system and an image sensor. Reflected light from the object being observed (observation light) is focused onto the image sensor by the optical system. The image sensor converts the observation light into electrical signals, generating an electrical signal corresponding to the observation light, i.e., an image signal corresponding to the observed image. This image signal is transmitted as RAW data to the camera control unit (CCU) 11201.

[0164] The CCU11201 consists of a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), and other components, and comprehensively controls the operation of the endoscope 11100 and the display device 11202. Furthermore, the CCU11201 receives image signals from the camera head 11102 and performs various image processing operations on these image signals, such as development processing (demosaic processing), to display the image based on those image signals.

[0165] The display device 11202 displays an image based on an image signal that has been processed by the CCU 11201, under control from the CCU 11201.

[0166] The light source device 11203 consists of a light source such as an LED (Light Emitting Diode) and supplies illumination light to the endoscope 11100 when photographing the surgical area, etc.

[0167] The input device 11204 is an input interface for the endoscopic surgical system 11000. The user can input various information and instructions to the endoscopic surgical system 11000 via the input device 11204. For example, the user can input instructions to change the imaging conditions (type of light, magnification, focal length, etc.) of the endoscope 11100.

[0168] The treatment instrument control device 11205 controls the drive of the energy treatment instrument 11112 for purposes such as tissue cauterization, incision, or vascular sealing. The insufflation device 11206 delivers gas into the patient's body cavity via the insufflation tube 11111 to inflate the body cavity of the patient 11132 for the purpose of securing a field of view by the endoscope 11100 and securing the operator's working space. The recorder 11207 is a device capable of recording various information related to the surgery. The printer 11208 is a device capable of printing various information related to the surgery in various formats such as text, images, or graphs.

[0169] The light source device 11203, which supplies illumination light to the endoscope 11100 when photographing the surgical area, can be configured as a white light source consisting of, for example, an LED, a laser light source, or a combination thereof. When the white light source is configured as a combination of RGB laser light sources, the output intensity and output timing of each color (each wavelength) can be controlled with high precision, so the white balance of the captured image can be adjusted in the light source device 11203. In this case, it is also possible to time-divisionally capture images corresponding to each of the RGB light sources by irradiating the observation target with laser light from each RGB laser light source and controlling the drive of the image sensor of the camera head 11102 in synchronization with the irradiation timing. According to this method, a color image can be obtained without providing a color filter on the image sensor.

[0170] Furthermore, the light source device 11203 may be controlled to change the intensity of the light it outputs at predetermined time intervals. By controlling the drive of the image sensor of the camera head 11102 in synchronization with the timing of the change in light intensity, images can be acquired in time-division order, and these images can be combined to generate high dynamic range images without so-called black crushing and white clipping.

[0171] Furthermore, the light source device 11203 may be configured to supply light in a predetermined wavelength band corresponding to special light observation. In special light observation, for example, by utilizing the wavelength dependence of light absorption in body tissue and irradiating with narrow-band light compared to the irradiation light used during normal observation (i.e., white light), so-called narrow-band imaging is performed to image predetermined tissues such as blood vessels on the surface of mucosa with high contrast. Alternatively, in special light observation, fluorescence observation may be performed to obtain an image from fluorescence generated by irradiation with excitation light. In fluorescence observation, excitation light is irradiated onto body tissue and fluorescence from the body tissue is observed (autofluorescence observation), or a reagent such as indocyanine green (ICG) is injected into body tissue and excitation light corresponding to the fluorescence wavelength of the reagent is irradiated onto the body tissue to obtain a fluorescence image. The light source device 11203 may be configured to supply narrow-band light and / or excitation light corresponding to such special light observation.

[0172] Figure 41 is a block diagram showing an example of the functional configuration of the camera head 11102 and CCU 11201 shown in Figure 40.

[0173] The camera head 11102 includes a lens unit 11401, an imaging unit 11402, a drive unit 11403, a communication unit 11404, and a camera head control unit 11405. The CCU 11201 includes a communication unit 11411, an image processing unit 11412, and a control unit 11413. The camera head 11102 and the CCU 11201 are connected to each other via a transmission cable 11400 so that they can communicate with one another.

[0174] The lens unit 11401 is an optical system provided at the connection point with the lens barrel 11101. Observation light taken in from the tip of the lens barrel 11101 is guided to the camera head 11102 and then incident on the lens unit 11401. The lens unit 11401 is composed of a combination of multiple lenses, including a zoom lens and a focus lens.

[0175] The imaging unit 11402 may consist of one image sensor (a so-called single-chip system) or multiple image sensors (a so-called multi-chip system). If the imaging unit 11402 is configured as a multi-chip system, for example, each image sensor may generate image signals corresponding to RGB, and these signals may be combined to obtain a color image. Alternatively, the imaging unit 11402 may be configured to have a pair of image sensors for acquiring image signals for the right eye and left eye, respectively, corresponding to 3D (dimensional) display. By performing 3D display, the surgeon 11131 can more accurately grasp the depth of the biological tissue in the surgical area. In addition, if the imaging unit 11402 is configured as a multi-chip system, multiple lens units 11401 may be provided corresponding to each image sensor.

[0176] Furthermore, the imaging unit 11402 does not necessarily have to be located in the camera head 11102. For example, the imaging unit 11402 may be located inside the lens barrel 11101, directly behind the objective lens.

[0177] The drive unit 11403 is composed of actuators and, under control from the camera head control unit 11405, moves the zoom lens and focus lens of the lens unit 11401 along the optical axis by a predetermined distance. This allows the magnification and focus of the image captured by the imaging unit 11402 to be adjusted as appropriate.

[0178] The communication unit 11404 consists of communication devices for sending and receiving various types of information with the CCU 11201. The communication unit 11404 transmits the image signal obtained from the imaging unit 11402 as RAW data to the CCU 11201 via the transmission cable 11400.

[0179] Furthermore, the communication unit 11404 receives control signals from the CCU 11201 to control the drive of the camera head 11102 and supplies them to the camera head control unit 11405. These control signals include information regarding imaging conditions, such as information to specify the frame rate of the captured image, information to specify the exposure value at the time of imaging, and / or information to specify the magnification and focus of the captured image.

[0180] The imaging conditions such as frame rate, exposure value, magnification, and focus may be specified by the user as appropriate, or they may be automatically set by the control unit 11413 of the CCU11201 based on the acquired image signal. In the latter case, the endoscope 11100 will be equipped with so-called AE (Auto Exposure), AF (Auto Focus), and AWB (Auto White Balance) functions.

[0181] The camera head control unit 11405 controls the drive of the camera head 11102 based on the control signal received from the CCU 11201 via the communication unit 11404.

[0182] The communication unit 11411 consists of a communication device for sending and receiving various types of information with the camera head 11102. The communication unit 11411 receives image signals transmitted from the camera head 11102 via the transmission cable 11400.

[0183] Furthermore, the communication unit 11411 transmits control signals to the camera head 11102 to control the driving of the camera head 11102. Image signals and control signals can be transmitted by telecommunications, optical communications, etc.

[0184] The image processing unit 11412 performs various image processing operations on the image signal, which is RAW data transmitted from the camera head 11102.

[0185] The control unit 11413 performs various controls related to imaging the surgical area, etc., by the endoscope 11100, and the display of the images obtained from imaging the surgical area, etc. For example, the control unit 11413 generates control signals to control the driving of the camera head 11102.

[0186] Furthermore, the control unit 11413 displays the captured image showing the surgical area on the display device 11202 based on the image signal processed by the image processing unit 11412. At this time, the control unit 11413 may recognize various objects in the captured image using various image recognition technologies. For example, the control unit 11413 can recognize surgical instruments such as forceps, specific biological sites, bleeding, mist when using the energy treatment device 11112, etc., by detecting the shape and color of the edges of objects included in the captured image. When the control unit 11413 displays the captured image on the display device 11202, it may use the recognition results to superimpose various surgical support information onto the image of the surgical area. By superimposing the surgical support information and presenting it to the surgeon 11131, the burden on the surgeon 11131 can be reduced, and the surgeon 11131 can proceed with the surgery with confidence.

[0187] The transmission cable 11400 connecting the camera head 11102 and the CCU 11201 is an electrical signal cable compatible with electrical signal communication, an optical fiber compatible with optical communication, or a composite cable thereof.

[0188] In the illustrated example, communication was performed via a wired connection using the transmission cable 11400, but communication between the camera head 11102 and the CCU 11201 may be performed wirelessly.

[0189] The above describes an example of an endoscopic surgical system to which the technology described herein may be applied. The technology described herein can be applied to the endoscope 11100 and the imaging unit 11402 of the camera head 11102, among the configurations described above. Specifically, the imaging device 1 in Figure 1 can be applied to the imaging unit 11402.

[0190] While an endoscopic surgical system has been described here as an example, the technology described herein may also be applied to other systems, such as microsurgical systems.

[0191] Furthermore, the effects described herein are merely illustrative and not limiting, and other effects may also occur.

[0192] (effect) The imaging device 1 has a plurality of pixels 100 and an on-chip lens 170. The pixels 100 perform photoelectric conversion of incident light from a subject to generate an image signal. The on-chip lens 170 is commonly arranged for the plurality of pixels 100 and has a non-focusing region 171 in the center, while focusing the incident light to the plurality of pixels 100 in the peripheral part. This makes it possible to widen the focusing range of the incident light.

[0193] Furthermore, the on-chip lens 170 may include a non-focusing region 171 formed by a recess.

[0194] Furthermore, the on-chip lens 170 may include a non-focusing region 171, which is composed of a region whose surface curvature is smaller than that of the peripheral region.

[0195] Furthermore, the on-chip lens 170 may include a non-focusing region 172, which is composed of a region with a flat surface.

[0196] Furthermore, the on-chip lens (on-chip lens 173) may have a peripheral portion whose thickness is adjusted according to the direction of incidence of the incident light. This allows for adjustment of the focusing range of the incident light.

[0197] Furthermore, the multiple pixels 100 may also be four pixels 100 arranged in a 2x2 grid.

[0198] Furthermore, the multiple pixels 100 may be two adjacent pixels 100.

[0199] Furthermore, two adjacent pixels 100 among the multiple pixels 100 may generate multiple phase difference signals as image signals to detect the image plane phase difference by dividing the subject into pupils. This makes it possible to detect the focal position of the subject.

[0200] Furthermore, the on-chip lens (on-chip lens 174) may include a non-focusing region 175, which is formed by groove-shaped recesses that are perpendicular to the direction of pupil division.

[0201] Furthermore, the pixel region 3 includes a plurality of pixel blocks 20, each having a plurality of pixels 100 and an on-chip lens 170 commonly arranged for the plurality of pixels 100, and each pixel block 20 may have a color filter 150 that transmits incident light of the same wavelength to its plurality of pixels 100.

[0202] Furthermore, the pixel region 3 may further include a second pixel block 30 in which a color filter 150 is arranged that transmits incident light of the same wavelength to a plurality of pixels 100, and a second on-chip lens 179 is commonly arranged to collect incident light to the plurality of pixels 100. This makes it possible to adjust the collection range of incident light according to the type of color filter 150.

[0203] Furthermore, the second pixel block 30 may generate multiple phase difference signals as image signals for detecting the image plane phase difference by having two adjacent pixels 100 among its own multiple pixels 100 divide the subject into pupils.

[0204] Furthermore, the second pixel block 30 may have a color filter 150 that transmits green light placed on multiple of its pixels 100. This makes it possible to narrow the light-gathering range of the incident light in the pixels that detect the phase difference signal.

[0205] Furthermore, the second pixel block 30 may have color filters 150 that transmit long-wavelength light placed in multiple of its pixels 100. This simplifies the configuration of the second pixel block 30 in which the color filters 150 that transmit long-wavelength light are placed.

[0206] Furthermore, the pixel region 3 may have a second pixel block 30 in the center and pixel blocks 20 in the periphery. This allows the focusing range to be adjusted according to the angle of incidence of the incident light.

[0207] Furthermore, the on-chip lenses 170 in the pixel region 3 may be positioned offset for each pixel block 20 according to the angle of incidence of the incident light. This allows the focusing position to be adjusted according to the angle of incidence of the incident light.

[0208] The electronic device comprises a plurality of pixels 100 that perform photoelectric conversion of incident light from a subject to generate an image signal, an on-chip lens 170 that is commonly arranged among the plurality of pixels 100 and has a non-focusing region in the center while focusing the incident light onto the plurality of pixels 100 at its periphery, and a column signal processing circuit 5 that processes the generated image signal. The focusing range of the incident light can be widened.

[0209] Furthermore, the effects described herein are merely illustrative and not limiting, and other effects may also occur.

[0210] Furthermore, this technology can also be configured as follows. (1) Multiple pixels that perform photoelectric conversion of incident light from the subject to generate an image signal, An on-chip lens is arranged in common to the plurality of pixels, has a non-light-collecting region in the center, and focuses the incident light onto the plurality of pixels at the periphery. An imaging device having (2) The imaging apparatus according to (1) above, wherein the on-chip lens comprises the non-light-collecting region formed by the recess. (3) The imaging apparatus according to (2), wherein the on-chip lens comprises the recess whose aperture is adjusted according to the angle of incidence of the incident light. (4) The imaging apparatus according to (3), wherein the on-chip lens comprises the recess whose aperture size is adjusted according to the angle of incidence of the incident light. (5) The imaging apparatus according to (3), wherein the on-chip lens comprises the recess whose position of the aperture is adjusted according to the angle of incidence of the incident light. (6) The imaging apparatus according to any one of (1) to (5) above, wherein the on-chip lens comprises the non-focusing region, which is composed of a region whose surface curvature is smaller than that of the peripheral region. (7) The imaging apparatus according to any one of (1) to (5) above, wherein the on-chip lens comprises the non-light-collecting region which is composed of a region with a flat surface. (8) The imaging apparatus according to any one of (1) to (7) above, wherein the on-chip lens comprises the peripheral portion whose thickness is adjusted according to the direction of incidence of the incident light. (9) The imaging device according to any one of (1) to (8) above, wherein the plurality of pixels are four pixels arranged in a 2x2 grid. (10) The imaging device according to any one of (1) to (8) above, wherein the plurality of pixels are two adjacent pixels. (11) The imaging apparatus according to any one of (1) to (10), wherein two adjacent pixels among the plurality of pixels generate a plurality of phase difference signals as the image signal for pupil division of the subject and detection of image plane phase difference. (12) The imaging apparatus according to (11), wherein the on-chip lens comprises the non-light-gathering region, which is formed by groove-shaped recesses formed in a direction perpendicular to the direction of pupil division. (13) a pixel region having a plurality of pixel blocks each including the plurality of pixels and the on-chip lens commonly arranged for the plurality of pixels, In the pixel block, a color filter that transmits incident light of the same wavelength is arranged for the plurality of pixels of the pixel block itself The imaging apparatus according to any one of (1) to (12) above. (14) The imaging apparatus according to (13), wherein the pixel region further includes a second pixel block that is provided with the plurality of pixels and a second on-chip lens that is commonly arranged for the plurality of pixels to collect the incident light, and in which a color filter that transmits incident light of the same wavelength to the plurality of pixels is arranged. (15) The imaging apparatus according to (14), wherein in the second pixel block, two adjacent pixels among the plurality of pixels of the second pixel block itself generate a plurality of phase difference signals for detecting an image plane phase difference by pupil division of the subject as the image signals. (16) The imaging apparatus according to (15), wherein in the second pixel block, the color filter that transmits green light is arranged for the plurality of pixels of the second pixel block itself. (17) The imaging apparatus according to (13) or (15), wherein in the second pixel block, the color filter that transmits long-wavelength light is arranged for the plurality of pixels of the second pixel block itself. (18) The imaging apparatus according to any one of (14) to (17), wherein in the pixel region, the second pixel block is arranged in a central portion and the pixel blocks are arranged in a peripheral portion. (19) The imaging apparatus according to any one of (13) to (18), wherein in the pixel region, the on-chip lens is arranged to be shifted for each of the pixel blocks in accordance with an incident angle of incident light. (20) The imaging apparatus according to (13), wherein the pixel region has a pixel unit configured by a plurality of the pixel blocks each including the color filter that transmits incident light of the same wavelength. (21) The imaging apparatus according to (20), wherein the pixel region includes the pixel unit in which the non-light-collecting region of the on-chip lens of each of the pixel blocks is disposed at a position shifted in a direction outward of its own pixel unit. (22) The pixel region includes a plurality of the pixel units in which the color filters that transmit incident light of different wavelengths are respectively disposed, wherein at least one of the plurality of pixel units provided with the color filters that transmit incident light of different wavelengths includes the on-chip lens in which the non-light-collecting region is disposed at a position shifted in a direction inward of its own pixel unit The imaging apparatus according to (20). (23) The imaging apparatus according to (13), wherein in the pixel region, a plurality of the pixel blocks each including two pixels adjacent in a row direction and provided with the color filters that transmit incident light of the same wavelength, and the on-chip lens commonly disposed for the pixels, are arranged in a matrix direction, and the pixel blocks are arranged to be shifted by the pixel for each row. (24) The imaging apparatus according to (23), wherein a plurality of pixel groups are arranged in the matrix direction, each pixel group being constituted by a multi-pixel portion that is two of the pixel blocks adjacent in the row direction and provided with the color filters that transmit incident light of the same wavelength, and a single-pixel portion that is the pixel block adjacent to the multi-pixel portion in the row direction and provided with the color filter that transmits incident light of a wavelength different from that of the color filter of the multi-pixel portion. (25) The imaging apparatus according to (24), wherein the pixel group includes the single-pixel portion provided with the on-chip lens having the non-light-collecting region of a size different from the non-light-collecting region of the on-chip lens of each of the multi-pixel portions. (26) The pixel group includes the multi-pixel portion constituted by the pixel blocks each provided with the on-chip lens having the non-light-collecting region configured to have different sizes of The imaging apparatus according to (24), comprising. (27) The system further includes a spectroscopic element that is commonly arranged in the plurality of pixels and spectrally analyzes the incident light in a predetermined wavelength range. The on-chip lens includes the non-focusing region of a groove-shaped recess substantially parallel to the direction of spectral dispersion. The imaging device described in (1) above. (28) Multiple pixels that perform photoelectric conversion of incident light from the subject to generate an image signal, An on-chip lens is provided which is commonly arranged for the plurality of pixels, has a non-light-collecting region in the center, and focuses the incident light onto the plurality of pixels at the periphery, A processing circuit that processes the generated image signal and A powerful electronic device. [Explanation of symbols]

[0211] 1,701 Imaging device 3 pixel area 5-column signal processing circuit 20 pixel blocks 30 Second pixel block 40-pixel group 41 Multiple pixel section 42 Single pixel section 50 pixel unit 100, 100a, 100b, 100c, 100d pixels 101 Photoelectric conversion element 120 Semiconductor substrates 135, 137, 138 Separation section 150 Color Filters 160 Spectroscopic Element 170, 173, 174, 176, 177, 180, 183 On-chip lenses 171, 172, 175, 178, 181, 184 Non-focus area 179 Second on-chip lens 300-pixel block area 702 Shooting Lens 703 Image sensor 11402, 12031, 12101~12105 Imaging Unit

Claims

1. Multiple pixels that perform photoelectric conversion of incident light from a subject to generate an image signal, and multiple pixel blocks that are commonly arranged among the multiple pixels and have an on-chip lens in the central part that has a non-focusing region and a peripheral part that focuses the incident light onto the multiple pixels, and each of the multiple pixels has a color filter that transmits incident light of the same wavelength. A second pixel block comprising a plurality of pixels and a second on-chip lens commonly arranged across the plurality of pixels that collects the incident light and does not have a non-collecting region, and a color filter that transmits incident light of the same wavelength is arranged across the plurality of pixels. Equipped pixel area An imaging device having

2. The imaging apparatus according to claim 1, wherein the on-chip lens comprises the non-light-collecting region formed by the recess.

3. The imaging apparatus according to claim 2, wherein the on-chip lens comprises the recess whose aperture is adjusted according to the angle of incidence of the incident light.

4. The imaging apparatus according to claim 3, wherein the on-chip lens comprises the recess whose aperture size is adjusted according to the angle of incidence of the incident light.

5. The imaging apparatus according to claim 3, wherein the on-chip lens comprises the recess whose position of the aperture is adjusted according to the angle of incidence of the incident light.

6. The imaging apparatus according to claim 1, wherein the on-chip lens comprises the non-light-gathering region, which is composed of a region whose surface curvature is smaller than that of the peripheral portion.

7. The imaging apparatus according to claim 1, wherein the on-chip lens comprises the non-light-collecting region which is composed of a region with a flat surface.

8. The imaging apparatus according to claim 1, wherein the on-chip lens comprises the peripheral portion whose thickness is adjusted according to the direction of incidence of the incident light.

9. The imaging apparatus according to claim 1, wherein the plurality of pixels are four pixels arranged in two rows and two columns.

10. The imaging apparatus according to claim 1, wherein the plurality of pixels are two adjacent pixels.

11. The imaging apparatus according to claim 1, wherein two adjacent pixels among the plurality of pixels generate a plurality of phase difference signals as the image signal for pupil division of the subject and detection of image plane phase difference.

12. The imaging apparatus according to claim 11, wherein the on-chip lens comprises the non-light-gathering region, which is formed by groove-shaped recesses formed in a direction perpendicular to the direction of pupil division.

13. The imaging apparatus according to claim 1, wherein the second pixel block generates a plurality of phase difference signals as the image signal for detecting the image plane phase difference by having two adjacent pixels among its plurality of pixels divide the subject into pupils.

14. The imaging apparatus according to claim 13, wherein the second pixel block has the color filter that transmits green light arranged in its plurality of pixels.

15. The imaging apparatus according to claim 1, wherein the second pixel block has the color filter that transmits long wavelength light arranged in its plurality of pixels.

16. The imaging apparatus according to claim 1, wherein the pixel region has the second pixel block arranged in the central part and the pixel block arranged in the peripheral part.

17. The imaging apparatus according to claim 1, wherein the pixel region is such that the on-chip lenses are arranged in a shifted manner according to the angle of incidence of the incident light for each pixel block.

18. A plurality of pixels that perform photoelectric conversion of incident light from a subject to generate an image signal, and a plurality of pixel blocks each comprising an on-chip lens commonly arranged among the plurality of pixels, having a non-focusing region in the center and focusing the incident light onto the plurality of pixels at the periphery, and a color filter that transmits incident light of the same wavelength arranged among the plurality of pixels, A second pixel block comprising a plurality of pixels and a second on-chip lens commonly arranged across the plurality of pixels that collects the incident light and does not have a non-collecting region, and a color filter that transmits incident light of the same wavelength is arranged across the plurality of pixels. Equipped pixel area An imaging device equipped with, A processing circuit that processes the generated image signal and A powerful electronic device.

Images