A package with at least two contact points for microtechnology, a method for handling the package, and a tool for implementing the method.

Abstract

To provide a package which can perform an arrangement of a contact point at the same time and with high accuracy, and thereby can save time.SOLUTION: The present invention relates to a package 10 having at least two contact points 11 for a microtechnology. Each contact point 11 includes a contact surface 12, each contact point 11 is connected to at least one support structure body 13, and the contact points 11 are separated from each other. The contact surface 12 is distributed so as to be directed in the same direction while being distributed on the same plane. The support structure body 13 is manufactured from a connection material that can be separated and / or can be destroyed by a laser. In addition, the present invention relates to a method for handling the package 10 and a tool for executing the method.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a package comprising at least two contacts for microtechnology, a method for handling a package comprising at least two contacts for microtechnology, and a tool for carrying out the method.

Background Art

[0002] Due to the small size of microtechnology structures, the handling and manufacture of electronic components is particularly cumbersome and must be carried out with high precision. In particular, the arrangement of the contacts must be precise, otherwise some parts of the electronic component may be short-circuited by incorrect arrangement of the contacts, or may not make sufficient contact and fail to function as expected. In most cases, correction is not possible, and the electronic component becomes unusable. If the arrangement is not precise, a large number of rejected parts will result. However, precise arrangement is time-consuming.

[0003] As a result, there is a high demand for a fast but at the same time precise method for providing and arranging contacts, which does not require accepting the deterioration of the quality of electronic components and can save time and effort.

Summary of the Invention

Problems to be Solved by the Invention

[0004] Accordingly, the object of the present invention is to provide contacts in a manner that allows simultaneous and still precise arrangement of the contacts, thus resulting in time savings. In doing so, the method can still be carried out with the usual high precision.

Means for Solving the Problems

[0005] This object is achieved in a surprisingly simple and effective manner by a package comprising at least two contacts as set forth in claim 1 and a method for arranging these contacts as set forth in claim 13.

[0006] According to the present invention, a package for microtechnology is proposed having at least two contacts, each of which has a contact surface, the contacts are connected to at least one support structure, and the contacts are spaced apart from each other and arranged such that their contact surfaces are flush with each other and oriented in the same direction.

[0007] The package is characterized in that the support structure is fabricated from a connecting material that is separable and / or destructible by laser. The present invention is based on the fundamental idea that in electronic components in microtechnology, contacts are generally arranged at predetermined positions on the electronic component at predetermined distances from one another. The positioning of these predetermined positions is given in advance from the design of the electronic component. Within the scope of the present invention, it is recognized that the predetermined positions have set distances from one another in order to enable the interchangeability of as many electronic components as possible. The predetermined positions are arranged flush and oriented in the same direction. This means that if at least two contacts are arranged at set distances on the electronic component before mounting, and the set distances correspond to the distances of the predetermined positions on the electronic component, then the precise orientation of the contacts is sufficient to precisely and accurately orient at least one other contact as well. As a result, time is saved because several contacts can be precisely oriented simultaneously.

[0008] In this regard, the precise distance intended by the present invention is ensured by a support structure that stabilizes the contacts at a set distance from each other and allows the contacts to move together.

[0009] However, after installation, the support structure must be removed; otherwise, an unintended short circuit that could impair the function of the electronic components could occur between at least two contacts. Because the structures of microtechnology are so small, the isolation and / or destruction of the support structure must be extremely precise. Laser beams are characterized by their coherent light and high intensity, thus enabling energy input in a highly precise, selective, and targeted manner. Due to the small size of the microtechnology structures, selective and targeted isolation and destruction of the support structure is possible by laser, but without damaging other areas of the package, particularly the contacts, and / or electronic components. In microelectronics, contacts serve to establish conductive connections, for example, to other electronic components or conductors. For this purpose, contacts must be fixed in place on the electronic components, typically arranged at a predetermined distance from each other. The predetermined location connects to the internal circuitry of the electronic component, giving it its function. Apart from, or instead of, electrical connections, several contacts can establish mechanical connections to different electronic components. In principle, contacts are designed to allow for easy attachment to different electronic components. Other contact design options are also possible.

[0010] The package comprises at least two contacts that are positioned and mounted simultaneously. Preferably, the package comprises at least two, three, four, five, six, seven, eight, nine, ten, eleven, twelve, thirteen, fourteen, fifteen, sixteen, seventeen, eighteen, nineteen, twenty, twenty-five, thirty, thirty, thirty-five, forty, forty-five, fifty, fifty, sixteen, sixteen, seventeen, eighteen, nineteen, twenty-five, thirty-five, forty-five, forty-five, forty-five, fifty, fifty-five, sixty, sixteen, seventy, seventy-five, eighty, eighty, eighty, ninety, ninety-five, or one hundred contacts. The contacts have contact surfaces that function to connect electrically and / or mechanically to an electronic component at a given location. For this reason, at least two contacts having contact surfaces must be positioned such that their contact surfaces are flush, oriented in the same direction, and located at a predetermined distance from each other. In this way, the contacts can be mounted simultaneously at two or more adjacent predetermined locations on an electronic component. To ensure this orientation and the distance between the contacts throughout the handling, the package has a support structure. This means that the support structure not only fixes the contacts together so that the contact surfaces remain flush and oriented in the same direction, but also ensures the distance between them. Those skilled in the art are familiar with suitable materials that possess both the required separability and / or destructiveness as well as the required stability. Suitable materials are metals and metal alloys in particular. Suitable methods for laser separation and / or destruction are described elsewhere.

[0011] Preferably, the connecting material has a thermal conductivity of at least 10 W / mK. Within the scope of the present invention, several methods for applying contacts to electronic components are used in microtechnology, and these methods are recognized to require or be thermally induced to establish a connection between the electronic component and the contacts during mounting. Heating all contacts is cumbersome. Within the scope of the present invention, it is recognized that support structures are generally suitable for conducting heat from one contact to another. For this purpose, the support structure is made from a material having a thermal conductivity of at least 10 W / mK. Heat can then be conducted from one contact of the package to all other contacts, meaning that when one contact is heated, all contacts can be sufficiently heated. This means that all contacts of the package can be mounted on the electronic component at the same time, in addition to positioning them simultaneously. In doing so, the support structure undertakes the additional task of conducting the heat required for the connection process of the contacts to all contacts of the package when the contacts are mounted on the electronic component. To enable this, the support structure is made from a connecting material having a thermal conductivity of at least 10 W / mK. Due to the small size of the microtechnology structure, this is a sufficiently high thermal conductivity, and even higher thermal conductivity is preferable.

[0012] The term "package" refers to a selection of compounds with at least two fixed contact points relative to each other.

[0013] The term "contact point" refers to a conductive component that helps to electrically and / or mechanically connect one electronic component to another electronic component or conductor.

[0014] The term "support structure" refers to a structure that properly secures at least two points of contact to each other.

[0015] The term "connecting material" refers to the material from which the support structure is made. The package according to the present invention allows for the simultaneous placement of contacts and connection to electronic components, thus enabling the simultaneous placement of several contacts on electronic components of microtechnology. This significantly saves time and effort.

[0016] Advantageous embodiments of the present invention, which can be realized individually or in combination with each other, are described in detail in the dependent claims.

[0017] The contacts are fabricated from a contact material, and the connecting material may have a lower burning point and / or melting point than the contact material. As mentioned above, in order to eliminate the short circuit between the two contacts caused by the support structure, it is necessary to separate and / or destroy the support structure after mounting the contacts to the electronic components. This can be done, for example, by burning and / or melting the support structure. In order not to impair the functionality of the contacts in this process, it is advantageous that the connecting material of the support structure has a lower burning point and / or melting point than the contact material.

[0018] Alternatively, to enable the rapid and simple manufacturing of the package according to the present invention, the connecting material and the contact material may be identical and therefore have identical properties.

[0019] In further embodiments, the contacts may be flat and arranged parallel to each other. A flat design allows the contacts to be positioned at a preferred distance from each other. In principle, predetermined positions that set the distance between the contacts are adjacent to each other, and the contacts are intended to be positioned parallel to each other at a later stage. In this case, it is advantageous that the contacts are flat and arranged parallel to each other.

[0020] The term "flat" refers to an embodiment in which the extension of the contact in one spatial direction, namely height, is significantly smaller than in the other two spatial directions. Particularly preferred, the contact is designed as an extruder, in particular as a prism, and the extrusion is carried out in the height direction. The term "parallel" refers to an orientation of a flat contact such that the height-limiting sides are oriented parallel to each other.

[0021] Furthermore, the contacts may be designed identically. Identical contact designs allow for simple and predictable handling. Different contact designs allow for targeted adaptation of the contacts to electronic components installed later. In this case, the package may include at least a first portion of contacts, i.e., a first number of contacts, in the first embodiment, and at least a second portion of contacts, i.e., a second number of contacts, in the second embodiment. In this regard, the first portion of contacts may include, for example, identical contacts, and the second portion of contacts may also include identical contacts, but different from the first design.

[0022] It is further conceivable that the contacts are oriented in the same direction and / or different directions. The contacts are arranged such that their contact surfaces are flush and oriented in the same direction. However, this makes it possible to rotate the contacts relative to each other about an axis perpendicular to this plane, and / or to displace the contacts parallel to each other within this plane. If the contacts are oriented in the same direction, they can move to each other via simple displacement in the plane, and rotation of the individual contacts is not required. If the contacts are oriented in different directions, rotation in the plane is required to move the contacts to each other. It is particularly preferable that the contacts are oriented in different directions. Most preferably, the contacts are oriented so as to rotate 180° relative to each other. In this regard, in a package having three or more contacts, it is also conceivable that a first portion of the contacts are oriented in the same direction, a second portion of the contacts are oriented in the same direction, and the first portion is oriented in a different direction from the second portion.

[0023] In yet another further embodiment of the present invention, it is conceivable that at least one contact has at least one recess. Preferably, at least two, three, four, five, six, seven, eight, nine, ten, eleven, twelve, thirteen, fourteen, fifteen, sixteen, seventeen, eighteen, nineteen, twenty, twenty-five, thirty, thirty, thirty-five, forty, forty-five, fifty, fifty, fifty, sixty, sixteen, seventeen, eighteen, nineteen, twenty-five, thirty-one, thirty-five, forty-five, forty-five, fifty-five, sixty, sixteen, seventeen, nineteen, eighteen, nineteen, or ten identical or different recesses. The shape of the recesses is generally not important, but the recesses are particularly preferably rectangular. A portion of the support structure can be accommodated within the recess, allowing the contact point to be connected to the support structure in a simple yet reliable manner, thereby enabling its fixation.

[0024] Furthermore, the support structure may comprise at least one bar. The bar is preferably a rectangular component, either circular or rectangular. Although the bar is easy to manufacture, it can be effectively utilized as a support structure. In this regard, the bar may be at least partially disposed in at least one recess of one, two, more, or all of the contacts, as described elsewhere. More preferably, the bar may be disposed laterally on the contacts.

[0025] It is further conceivable that the support structure comprises at least one block, the block being positioned between two contact points. The block is a polyhedron, preferably a finite polyhedron and / or a cuboid. Particularly preferably, the block is a cuboid. In this regard, the first contact point is positioned on at least one first side of the block, and the second contact point is positioned on at least one second side of the block, the second side being preferably opposite the first side. The block is preferably applied to the contact points, particularly the sides of the contact points.

[0026] In a further embodiment, it is contemplated that the package comprises at least three contacts, the support structure is designed with a plurality of parts having a first portion, and the first portion of the support structure is connected to two of the contacts. This means that the first portion of the support structure is connected to only two of the three contacts. In this context, it is conceivable that the first portion is a block. Preferably, the first portion is disposed between two adjacent contacts. However, alternatively, it is contemplated that the first portion is connected to two non-adjacent contacts. This is possible, in particular, if at least two of the three contacts are designed differently and / or are oriented in different directions.

[0027] It is contemplated that the support structure is connected to the contacts by a material-to-material joint and / or is designed monolithically with the contacts. The material-to-material joint and / or the monolithic design ensures a secure hold between the support structure and the contacts, so that the fixation of the contacts relative to one another and the heat transfer from the support structure to the contacts are optimally ensured.

[0028] The term "monolithic" refers to an object that is continuous from a single piece, designed without grooves, and cannot be separated without destruction.

[0029] In another further embodiment of the present invention, it is contemplated that the package is laminated. In this context, it is preferable to first apply a mask to a suitable structure and / or surface by photolithography in order to shape the contacts, and then produce the first contact by ion plating. The photoresist forming the mask is removed together with the excess coating, after which another mask is produced by photolithography and the support structure is fabricated by ion plating. The photoresist of the support structure mask is removed together with the excess coating, and another mask is produced for a further contact. These steps are repeated until the desired number of contacts in the package is obtained. The layered design means that the package can be manufactured quickly, easily and precisely.

[0030] In yet another further embodiment of the present invention, the package may have a length, width, and / or height of at least 2500 μm. As described above, the package is intended for use in microtechnology. These dimensions correspond to those used in microtechnology.

[0031] The definitions and / or explanations of the terms above are presumed to apply to all aspects described below, unless otherwise stated.

[0032] According to the present invention, a method for handling packages as described elsewhere is proposed, the method comprising the following steps: a. To grasp the package, b. Heat at least one of the contacts to join the contact surfaces of all the contacts on the package. c. Separating and / or destroying the support structure using a laser.

[0033] Within the scope of the present invention, it is recognized that processing contacts simultaneously, particularly joining package contacts simultaneously, saves time. This is achieved by handling several contacts at the same time. This advantage can be achieved, in particular, by the predetermined positions of the electronic components to which the contacts are attached, generally having a predetermined distance and orientation from each other. For this reason, the contacts can be fixed and positioned at this distance by a support structure as early as possible during manufacturing. In this way, it is possible to grip several contacts simultaneously, and by precisely positioning the first contact, they can be precisely positioned at different predetermined locations at the same time. The support structure according to the present invention makes it possible to heat all contacts simultaneously by heating only one contact. However, the support structure causes a short circuit and impairs the functionality of the electronic components. For this reason, the support structure must be destroyed as a final step.

[0034] Laser beams are characterized by their coherent light and high intensity, which means that energy input can be delivered in a highly precise, selective, and targeted manner. Due to the small size of the microtechnology structures, targeted isolation and / or destruction of supporting structures is made possible by lasers without damaging other areas of the package, particularly contacts and / or electronic components.

[0035] First, the package is grasped with an appropriate tool. After grasping, the tool can be used to transport the package, in particular, to the electronic component in which it will be installed. In the next step, which can be performed before, during, and / or after transporting the package to its designated position, the package is heated in preparation for bonding. In this way, the contact surfaces of the contacts are placed in their designated position and / or on the material applied thereto to enable bonding. Subsequently, the support structure is broken and / or separated.

[0036] Preferably, the heating in step b is also performed by a laser. The laser allows the package to be heated in a selective and targeted manner at at least one contact without damaging other areas of the package, particularly the contacts and / or electronic components. In a preferred embodiment, the laser beam is directed at at least one of the contacts during heating.

[0037] The term "joint" refers to the formation of a permanent electrical and / or mechanical connection between a contact point and a predetermined location on an electronic component.

[0038] The term "separation" refers to the process by which a supporting structure is divided and / or split into two or more parts.

[0039] The term "destruction" refers to the process of damaging a support structure to the point where it loses its functionality. In this context, the function of the support structure is to fix contact points to each other.

[0040] In another further embodiment of the present invention, the separation and / or destruction of the support structure in step c may be carried out by laser ablation. Ablation is a simple, rapid, and precise method for separating and / or destroying the support structure.

[0041] In relation to lasers, the term "ablation" refers to the process by which a supporting structure is ablated via the use of a laser, where the laser energy is directed at the material in a targeted manner, particularly pulsed, thereby causing the material to evaporate or be ablated in the form of particles. In doing so, the connecting material of the supporting structure is heated for a short time on its surface to such a high temperature that electrons forming chemical bonds within the connecting material are excited and vibrate thermally, causing the electrons to break the chemical bonds and leave the connecting material. In doing so, the material can be chipped away for a Coulomb explosion, intensifying the ablation process.

[0042] It is further conceivable that the joining in step b is carried out by soldering, particularly by a previously applied solder deposit. In this regard, it is preferable that the solder deposit is applied to a predetermined location on the electronic component and then fused together via the heat of the contacts, which is applied to the package and extends to the contact surface when the package is placed in place. Soldering is a simple yet effective method for permanently connecting contacts to electronic components in a predetermined location, both electrically and mechanically.

[0043] Furthermore, it is conceivable that the gripping in step a is performed by a gripper having at least two jaws, with each jaw gripping the package on the outer surface or side of the outermost contact of the package, and that the heating in step b is performed by transferring heat to at least one of the contacts via the jaws. Gripping with a gripper is an easy and controllable method for gripping a package. The package can be gripped on the outer surface of the corresponding outermost package, as this is a particularly easy and quick method to implement from a procedural standpoint. Alternatively, the package can be gripped at one of the contacts, thereby enabling particularly precise placement of the package, as displacement or damage to the already positioned package or contact by the jaws of the gripper can be prevented. The contact is heated by one or more of the heated jaws, and the heat is dissipated through the jaws to one or more of the contacts. This has the advantage that heating can be performed during transport to a predetermined position, and if a laser is used for heating, damage to the support structure is prevented before bonding is prevented. Preferably, the gripper is designed as a parallel gripper with two jaws. For example, one or both jaws may be driven to enable gripping of a contact or package via shape pairing and / or force pairing.

[0044] Furthermore, according to the present invention, a tool is proposed for carrying out the method described elsewhere, the tool comprising a gripper, the gripper comprising at least two jaws. The tool is characterized in that at least one of the jaws comprises a heat transfer region. Through the heat transfer region, it is possible to heat at least one contact while the gripper is holding the package. In this way, a laser beam is directed directly to the heat transfer region and the heat is transferred through the jaws to the contact that the jaws are in contact with. This has the advantage of preventing damage to the support structure before bonding.

[0045] The term "jaw" refers to the part of the gripper that directly contacts the object being gripped, i.e., the contact point or package. The jaws may be replaceable and may be equipped with special friction pads to enhance stiction. In particular, the jaws may be designed as gripping fingers that, together with at least one other gripping fingers, serve to hold the package or contact point. At least one of the jaws is mounted so as to be movable around an axis. The jaws preferably have a shape suited to their function. Particularly preferably, the jaws are flat and / or tapered.

[0046] The term "heat transfer region" refers to a surface or portion of the jaw, particularly an exposed surface or portion, which can be heated by a laser and is suitable for transferring heat input via the laser to a contact or a package having several contacts.

[0047] Further details, features, and advantages of the present invention can be derived from the following description of preferred exemplary embodiments, in conjunction with the dependent claims. Herein, each feature can be realized individually or in combination with one another. The present invention is not limited to these exemplary embodiments. Exemplary embodiments are schematically shown in the drawings. In the individual drawings, the same reference numerals refer to the same elements, elements with the same function, and / or elements with the same function as one another. [Brief explanation of the drawing]

[0048] [Figure 1] This is an isometric view of the first package according to the present invention. [Figure 2A] A top view of a second embodiment of the package according to the present invention is shown. [Figure 2B] This shows a front view of a second embodiment of the package according to the present invention. [Figure 3] This shows an isometric view of a third embodiment of the package according to the present invention. [Figure 4A] A side view of a fourth embodiment of the package according to the present invention is shown. [Figure 4B]This shows a front view of a fourth embodiment of the package according to the present invention. [Figure 4C] A top view of a fourth embodiment of the package according to the present invention is shown. [Figure 5A] Step a of the method according to the present invention is shown. [Figure 5B] Step b of the method according to the present invention is shown. [Figure 5C] Step c of the method according to the present invention is shown. [Figure 6] A first embodiment of the gripper according to the present invention is shown while step b of the method according to the present invention is being carried out. [Figure 7] A second embodiment of the gripper according to the present invention is shown. [Figure 8] A third embodiment of the gripper according to the present invention is shown. [Figure 9] A fourth embodiment of the gripper according to the present invention is shown. [Modes for carrying out the invention]

[0049] Figure 1 shows an isometric view of a first embodiment of the package 10 according to the present invention. The package 10 according to the present invention comprises three identical flat contacts 11 oriented in the same direction and arranged parallel to each other. Each of the contacts 11 comprises a contact surface 12 located at the bottom of Figure 1. The contact surfaces 12 of the contacts 11 are flush and oriented in the same direction. The contacts 11 are connected via a support structure 13 designed in two parts, each of which is designed as a beam. Each beam of the support structure 13 is located in a recess 14, and each contact 11 has two recesses 14. The contacts 11 of the package 10 are fixed relative to each other at their distance and orientation via the intermaterial joints of the support structure 13 within the recesses 14.

[0050] Figure 2A shows a top view of a second package 10 according to the present invention, and Figure 2B shows a front view. The package 10 also comprises three contacts 11 connected via a support structure 13, thereby fixed in their distance and orientation. Each of the contacts 11 comprises a contact surface 12, which is positioned at a predetermined location 21 of an electronic component 20 and connected to it in Figures 2A and 2B. The contact surfaces 12 are flush and oriented in the same direction, as can be seen particularly in Figure 2B. The contacts 11 are identical, oriented in the same direction, flat, and arranged parallel to each other.

[0051] Figure 3 shows an isometric view of a third embodiment of the package 10 according to the present invention. The package 10 according to the present invention comprises three identical flat contacts oriented in the same direction and arranged parallel to each other. Each of the contacts 11 comprises a contact surface 12 located at the bottom of Figure 3. The contact surfaces 12 of the contacts 11 are flush and oriented in the same direction. The contacts 11 are connected via a support structure 13 designed in multiple parts, the parts of which are designed as blocks. In this regard, in each case, two blocks are arranged between two contacts 11. On the outermost contact 11, two blocks are also arranged on the outside, and a fourth contact 10 (not shown) can be arranged on two blocks. Through the intermaterial bonding of the blocks of the support structure 13, the contacts 11 of the package 10 are fixed relative to each other at their distance and orientation.

[0052] Figure 4A shows a side view of a fourth embodiment of the package 10 according to the present invention, Figure 4B shows a front view, and Figure 4C shows a top view. The side view in Figure 4A is a cross-section of the package 10 cut along axis A in Figure 4C. The package 10 also comprises three contacts 11 fixed at their distance and orientation via a support structure 13. The contacts 11 are flat, each having a contact surface 12, the contact surfaces 12 are positioned at three predetermined positions 21 of the electronic component 20. The contacts 11 are parallel but oriented in different directions, the two external contacts 11 are oriented in the same direction, and the central contact 11 is rotated 180°. The support structure 13 is designed of three parts. In this regard, it can be easily seen that the parts of the support structure 13, designed as a block and a rectangular parallelepiped, are positioned below the contacts 11 between the contacts 11 in each case. The block-shaped support structure 13 is positioned on the first contact 11 by its first side and on the second contact 11 by its second side. Another part of the support structure 13 is positioned between both external contacts 11 of the package 10, which is connected to one of the contacts 11 as a block by its first side and to the other contact 11 as a block by its second side opposite the first side.

[0053] Figure 5A shows step a of the method according to the present invention. In this regard, a package 10 having three contacts 11 connected to each other via a support structure 13 is gripped via a gripping tool 31. Figure 5A further shows a second identical package, but not gripped.

[0054] Figure 5B shows step b of the method according to the present invention, in which the package 10 gripped in step a is heated by a heating tool 32. The gripping tool 31 is not shown in this context. The heating tool 32 is a laser, which heats the package 10 by a laser beam 40. Furthermore, an electronic component 20 having a plurality of predetermined positions 21 is shown. In this regard, the package 10 is already positioned at the predetermined positions 21. In Figure 5B, it can be seen further which predetermined positions 21 the heated package 10 should be positioned at. Here, the contacts 11 of the heated package 10 are positioned at the predetermined positions 21 of the electronic component 20, are still free, and are soldered thereon by heat.

[0055] Figure 5C shows step c of the method according to the present invention, in which the support structure 13 of the package 10 is cut by a cutting tool 33. This isolates the contacts 11 that do not have direct electrical connections. The electronic components 20 can then be connected to other electronic components via the contacts 11. The support structure 13 is cut by a laser beam 40 emitted from the laser.

[0056] Figure 6 shows a first embodiment of the gripper 50 during step b of the method according to the present invention. The gripper 50 grips the package 10 using two jaws 51. In this regard, one jaw 51 abuts against the outer surface of the external contact 11. The gripper 50 transports the still-free package 10 to a predetermined position 21 on the electronic component 20 where the other package 10 is already disposed. The laser beam 40 of the heating tool 32, designed as a laser, is directed towards the heat transfer region 52. This heats the heat transfer region 52, and the heat is transferred to the contact 11 via the jaws 51, which means that the contact 11 also heats up, and therefore can be joined at the predetermined position 21.

[0057] Figure 7 shows a second embodiment of the gripper 50 according to the present invention. The gripper 50 corresponds to the gripper 50 shown in Figure 6, with the heat transfer region 52 located on the other jaws 51. The gripper 50 grips a package 10 having three contacts 11. The laser beam 40 of a heating tool 32, designed as a laser, is directed towards the heat transfer region 52. This means that the heat transfer region 52 is heated, and the heat is transferred through the jaws 51 to the contacts 11 shown on the right side of Figure 7, so that the contacts 11 are also heated. The other contacts are heated via a support structure 13 that transfers heat from the contacts 11 shown on the right side of Figure 7 to the other contacts.

[0058] Figure 8 shows a third embodiment of the gripper 50 according to the present invention. This corresponds to the gripper 50 shown in Figure 7, with a narrower jaw portion 51. This allows the jaw portion 51 of the gripper 50 to be inserted, at least partially, into the gap between the two contacts 11. Thus, the gripper 50 can grip the package 10 at the central contact 11. The laser beam 40 of the heating tool 32, designed as a laser, is directed towards the heat transfer region 52. This heats the heat transfer region 52, and the heat is transferred to the central contact 11 via the jaw portion 51.

[0059] Figure 9 shows a third embodiment of the gripper 50. This corresponds to the gripper 50 shown in Figure 7, and both jaws 51 are equipped with heat transfer regions 52 to which the laser beam 40 of the heating tool is directed. [Explanation of Symbols]

[0060] List of symbols 10 packages 11 contacts 12 Contact surface 13 Support structure 14 recess 20 Electronic Components 21 Designated position 31 Gripping Tools 32 Heating Tools 33 Cutting Tools 40 laser beams 50 Grippa 51. Jaw 52 Heat transfer region

Claims

1. A package (10) for microtechnology comprising at least two contacts (11), each of the contacts (11) having a contact surface (12), the contacts (11) being connected to at least one support structure (13), the contacts (11) being spaced apart from each other, and the contact surfaces (12) being arranged flush and oriented in the same direction, The support structure (13) is made from a connecting material that is separable and / or destructible by a laser. The aforementioned contacts (11) have a flattened shape and are arranged parallel to each other. If we define a first, second, and third direction that is orthogonal to each other, The contacts (11) are spaced apart from each other with a gap in the first direction. The aforementioned contact (11) is A side surface perpendicular to the first direction, The contact surface is perpendicular to the second direction and defined by one end of the side surface in the second direction, Having a top surface that is perpendicular to the second direction and defined by the other end of the side surface in the second direction, The side surfaces of the contact (11) that define the top surface of the contact (11) are oriented parallel to each other. The dimension of the contact (11) in the first direction is smaller than the dimension in the second direction. The dimension of the contact (11) in the first direction is smaller than the dimension in the third direction. The support structure (13) comprises at least one block, the block being disposed between the side surfaces of the contact (11) at a position away from the top surface of the contact (11). A package (10) characterized by the following.

2. The contact (11) is made from a contact material, and the connecting material has a lower burning point and / or melting point than the contact material. The package (10) according to claim 1, characterized by the above.

3. The shapes and dimensions of the plurality of contacts (11) are designed to be the same and / or different from one another. The package (10) according to claim 1 or 2, characterized by the above.

4. The contacts (11) are oriented in the same direction and / or different directions. The package (10) according to claim 3, characterized by the above.

5. At least one contact point (11) has at least one recess (14). The package (10) according to claim 1 or 2, characterized by the above.

6. The support structure (13) comprises at least one bar. The package (10) according to claim 1 or 2, characterized by the above.

7. The bar is disposed on the side surface of the contact (11) extending along the first direction. The package (10) according to claim 6, characterized by the above.

8. The package (10) is provided with at least three contacts (11), and the support structure (13) is designed with multiple components, and a portion of the support structure (13) is connected to two contacts (11). The package (10) according to claim 1 or 2, characterized by the above.

9. The support structure (13) is connected to the contact (11) by an intermaterial joint and / or is designed monolithically with the contact (11). The package (10) according to claim 1 or 2, characterized by the above.

10. It is constructed in layers by ion plating. The package (10) according to claim 1 or 2, characterized by the above.

11. Having a maximum length, width, and / or height of 2500 μm The package (10) according to claim 1 or 2, characterized by the above.

12. A method for handling the package (10) according to claim 1 or 2, a. To grasp the package (10), b. Heating at least one of the contacts (11) to join the contact surfaces of all the contacts (11) of the package (10), c. Separating and / or destroying the support structure (13) by laser Methods that include...

13. The method according to claim 12, wherein the separation and / or destruction in step c is carried out by laser ablation.

14. The method according to claim 12, wherein the joining in step b is performed by soldering.

15. The method according to claim 12, wherein the gripping in step a is performed by a gripper (50) having at least two jaws (51), each jaw (51) gripping the package (10) on the outer surface or side of the outermost contact (11) of the package, and the heating in step b is performed by transferring heat to at least one of the contacts (11) via the jaws (51).

16. A method according to claim 12, comprising a gripper (50) having at least two jaws (51) for gripping the package (10) and for transferring heat to at least one of the contacts (11), At least one of the jaw portions (51) is provided with a heat transfer region (52). A tool characterized by the following:

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