EFEM
Patent Information
- Application Number
- JP2025023889
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2025-02-18
- Publication Date
- 2026-10-22
- Estimated Expiration
- 2038-03-15
Smart Images

Figure 0007939579000001 
Figure 0007939579000002 
Figure 0007939579000003
Abstract
Description
Technical Field
[0001] The present invention relates to an EFEM (Equipment Front End Module) capable of supplying an inert gas to a closed transfer chamber to replace the inside with an inert gas atmosphere.
Background Art
[0002] Patent Document 1 describes an EFEM that transfers wafers between a processing apparatus that performs predetermined processing on wafers and a FOUP, the EFEM including a load port on which a FOUP (Front-Opening Unified Pod) accommodating wafers (semiconductor substrates) is placed, and a casing that is closed by connecting the load port to an opening provided on a front wall and forms a transfer chamber in which wafers are transferred.
[0003] Conventionally, the influence of oxygen, moisture and the like in the transfer chamber on semiconductor circuits manufactured on wafers was small, but in recent years, along with further miniaturization of semiconductor circuits, those influences have become apparent. Accordingly, the EFEM described in Patent Document 1 is configured such that the inside of the transfer chamber is filled with nitrogen which is an inert gas. Specifically, the EFEM has a circulation flow path composed of the transfer chamber and a gas return path for circulating nitrogen inside the casing, a gas supply unit configured to supply nitrogen from an upper portion of the gas return path, and a gas discharge unit configured to discharge nitrogen from a lower portion of the gas return path. Nitrogen is appropriately supplied and discharged according to fluctuations in the oxygen concentration and the like in the circulation flow path. Thereby, the transfer chamber can be maintained in a nitrogen atmosphere.
Prior Art Documents
Patent Documents
[0004]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0005] The load port of the EFEM described in Patent Document 1 above has an opening / closing mechanism that can open and close the lid of the placed FOUP, and a containment chamber that communicates with the transport chamber and houses a part of the opening / closing mechanism, but the gas discharge means is connected to the lower part of the gas return path of the circulation path. For this reason, when the EFEM is started (including after maintenance), even if nitrogen is supplied to the circulation path and gas is discharged from the circulation path, the containment chamber that communicates with the transport chamber is not included in the circulation path, so a problem arises in that it takes time to replace the atmosphere in the containment chamber with a nitrogen atmosphere. Furthermore, a problem arises in that particles in the containment chamber are stirred up by the operation of the opening / closing mechanism and can easily enter the transport chamber.
[0006] Therefore, the object of the present invention is to provide an EFEM that can easily replace the containment chamber with an inert gas while also being able to discharge particles from within the containment chamber. [Means for solving the problem]
[0007] The EFEM of the present invention comprises a load port, a housing that is closed when the load port is connected to an opening in the side wall and which forms a transport chamber for transporting substrates, a substrate transport device disposed in the transport chamber for transporting the substrates, an inert gas supply means for supplying inert gas to the transport chamber, and a gas discharge means for discharging gas from the transport chamber. The load port has an opening / closing mechanism that can open and close the lid of the placed FOUP, and a housing chamber that communicates with the transport chamber and houses a part of the opening / closing mechanism, and the gas discharge means is connected to the housing chamber to discharge gas from the transport chamber via the housing chamber.
[0008] According to this, by connecting the gas discharge means to the containment chamber of the load port where the opening and closing mechanism is housed, it becomes easier to replace the containment chamber with an inert gas atmosphere. For example, when the EFEM is started up (including after maintenance), supplying inert gas with the inert gas supply means and discharging the gas with the gas discharge means makes it easier to quickly replace the transport chamber and containment chamber with an inert gas atmosphere, thus shortening the time until operations such as transporting substrates can be started. In addition, it becomes possible to discharge particles in the containment chamber when the gas is discharged, making it less likely for particles in the containment chamber to be stirred up when the opening and closing mechanism is operated, and making it less likely for particles to enter the transport chamber.
[0009] In the present invention, it is preferable that the conveying chamber further comprises a gas outlet provided at the top of the conveying chamber for supplying inert gas into the conveying chamber, a gas suction port provided at the bottom of the conveying chamber for drawing in the inert gas from the conveying chamber, a gas return path for returning the inert gas drawn in from the gas suction port to the gas outlet, and a filter for removing particles contained in the inert gas supplied from the gas outlet. This makes it possible to circulate the inert gas through the gas return path while generating a downward airflow of particle-free inert gas in the conveying chamber. As a result, it is possible to suppress the consumption of inert gas and reduce costs.
[0010] Furthermore, in the present invention, it is preferable that the containment chamber is provided with a fan that supplies inert gas to the gas discharge means. This makes it possible to suppress the stirring up of particles more effectively than if the fan were provided in the conveying chamber.
[0011] Furthermore, in the present invention, it is preferable that the containment chamber is located below the mounting section on which the FOUP is placed, and that the gas discharge means is connected to the bottom wall constituting the containment chamber. This makes it possible to effectively discharge particles.
[0012] Furthermore, in the present invention, it is preferable that the housing is provided with a plurality of load ports, and that the gas discharge means is connected to each of the containment chambers of the load ports. This makes it possible to effectively discharge particles from the containment chamber of each load port. [Effects of the Invention]
[0013] According to the EFEM of the present invention, the gas discharge means is connected to the containment chamber of the load port where the opening and closing mechanism is housed, making it easier to replace the containment chamber with an inert gas atmosphere. For example, when the EFEM is started (including after maintenance), supplying inert gas with the inert gas supply means and discharging the gas with the gas discharge means makes it easier to quickly replace the transport chamber and containment chamber with an inert gas atmosphere, thus shortening the time until operations such as transporting substrates can be started. In addition, it is possible to discharge particles in the containment chamber when the gas is discharged, making it less likely for particles in the containment chamber to be stirred up when the opening and closing mechanism is operated, and making it less likely for particles to enter the transport chamber. [Brief explanation of the drawing]
[0014] [Figure 1] This is a plan view showing the schematic configuration of an EFEM and its surroundings according to one embodiment of the present invention. [Figure 2] Figure 1 shows the electrical configuration of the EFEM. [Figure 3] Figure 1 is a front view of the enclosure as seen from the front. [Figure 4] This is a cross-sectional view along the line IV-IV shown in Figure 3. [Figure 5] This is a cross-sectional view along the VV line shown in Figure 3. [Figure 6] This is a cross-sectional view along the line VI-VI shown in Figure 3. [Figure 7] This is a side cross-section of the load port showing the door in the closed position. [Figure 8] This is a side cross-section of the load port showing the door in the open position. MODE FOR CARRYING OUT THE INVENTION
[0015] Hereinafter, an EFEM 1 according to an embodiment of the present invention will be described with reference to FIGS. 1 to 8. For convenience of description, the directions shown in FIG. 1 are defined as front-rear and left-right directions. That is, in the present embodiment, the direction in which the EFEM (Equipment Front End Module) 1 and the substrate processing apparatus 6 are arranged side by side is defined as the front-rear direction, the EFEM 1 side is defined as the front, and the substrate processing apparatus 6 side is defined as the rear. The direction orthogonal to the front-rear direction and in which a plurality of load ports 4 are arranged side by side is defined as the left-right direction. The direction orthogonal to both the front-rear direction and the left-right direction is defined as the up-down direction.
[0016] (Schematic Configuration of EFEM and Its Periphery) First, the schematic configuration of the EFEM 1 and its periphery will be described with reference to FIG. 1 and FIG. 2. FIG. 1 is a plan view showing the schematic configuration of the EFEM 1 according to the present embodiment and its periphery. FIG. 2 is a diagram showing the electrical configuration of the EFEM 1. As shown in FIG. 1, the EFEM 1 includes a housing 2, a transfer robot 3 (substrate transfer apparatus), three load ports 4, and a control device 5. At the rear of the EFEM 1, a substrate processing apparatus 6 that performs predetermined processing on a wafer W (substrate) is disposed. The EFEM 1 transfers the wafer W between a FOUP (Front-Opening Unified Pod) 100 placed on the load port 4 and the substrate processing apparatus 6 by the transfer robot 3 disposed in the housing 2. The FOUP 100 is a container capable of accommodating a plurality of wafers W arranged side by side in the up-down direction, and is provided with an openable and closable lid 101 (lid portion) at its rear end portion (the end portion on the housing 2 side in the front-rear direction). The FOUP 100 is, for example, a known OHT (overhead traveling automatic transpor t vehicle: not shown). The FOUP 100 is transferred between the OHT and the load port 4.
[0017] The housing 2 is for connecting the three load ports 4 and the substrate processing apparatus 6. Inside the housing 2, a transfer chamber 41 is formed which is substantially sealed from the external space and is used to transfer wafers W without exposing them to the ambient air. When the EFEM 1 is in operation, the transfer chamber 41 is filled with nitrogen. In the present embodiment, the transfer chamber 41 is filled with nitrogen, but any inert gas other than nitrogen may also be used. The housing 2 is configured such that nitrogen circulates in the internal space including the transfer chamber 41 (details will be described later). Further, an openable and closable door 2a is provided at the rear end portion of the housing 2, and the transfer chamber 41 is connected to the substrate processing apparatus 6 across the door 2a.
[0018] The transfer robot 3 is arranged in the transfer chamber 41 and performs transfer of wafers W. The transfer robot 3 has a base portion 90 (see FIG. 3) with a fixed position, an arm mechanism 70 (see FIG. 3) which is arranged above the base portion 90 and holds and transfers wafers W, and a robot control unit 11 (see FIG. 2). The transfer robot 3 mainly performs operations of taking out wafers W in the FOUP 100 and delivering them to the substrate processing apparatus 6, and operations of receiving wafers W processed by the substrate processing apparatus 6 and returning them to the FOUP 100.
[0019] The load port 4 is for placing the FOUP 100 (see Figure 7). Multiple load ports 4 are arranged side by side in the left-right direction along the front partition wall 33 of the housing 2, as shown in Figures 1 and 5. Each load port 4 closes three openings (not shown) formed in the partition wall 33 of the housing 2 with a base 51 (see Figure 7) at its rear end. These three openings are formed between four columns 21-24 in the left-right direction. This creates a nearly sealed transport chamber 41 within the housing 2. The load port 4 is also configured to allow the atmosphere inside the FOUP 100 to be replaced with nitrogen. A door 4a, which is part of the opening / closing mechanism 54 described later, is provided at the rear end of the load port 4. The door 4a is opened and closed by a door drive mechanism 55 (part of the opening / closing mechanism 54). The door 4a is configured to release the lock on the lid 101 of the FOUP 100 and to hold the lid 101. With the unlocked lid 101 held by the door 4a, the door drive mechanism 55 opens the door 4a, thereby opening the lid 101. This allows the wafer W inside the FOUP 100 to be removed by the transport robot 3. The transport robot 3 can also store the wafer W inside the FOUP 100.
[0020] As shown in Figure 2, the control device 5 is electrically connected to the robot control unit 11 of the transport robot 3, the load port control unit 12 of the load port 4, and the control unit (not shown) of the substrate processing device 6, and communicates with these control units. The control device 5 is also electrically connected to the oxygen concentration meter 85, pressure gauge 86, hygrometer 87, etc., installed inside the housing 2, and receives the measurement results from these measuring instruments to obtain information about the atmosphere inside the housing 2. In addition, the control device 5 is electrically connected to the supply valve 112 and the discharge valve 113 (described later), and adjusts the nitrogen atmosphere inside the housing 2 as appropriate by adjusting the opening of these valves.
[0021] As shown in Figure 1, the substrate processing apparatus 6 includes, for example, a load lock chamber 6a and a processing chamber 6b. The load lock chamber 6a is a room for temporarily holding wafers W, connected to the transport chamber 41 across the door 2a of the housing 2. The processing chamber 6b is connected to the load lock chamber 6a across the door 6c. In the processing chamber 6b, predetermined processing is performed on the wafers W by a processing mechanism (not shown).
[0022] (Enclosure and its internal configuration) Next, the enclosure 2 and its internal configuration will be explained using Figures 3 to 6. Figure 3 shows the enclosure This is a front view of body 2 as seen from the front. Figure 4 is a cross-sectional view along the line IV-IV shown in Figure 3. Figure 5 is a cross-sectional view along the line VV shown in Figure 3. Figure 6 is a cross-sectional view along the line VI-VI shown in Figure 3. Note that the bulkheads are not shown in Figures 3 and 6. Also, in Figure 5, the transport robot 3 and other components are not shown, and the load port 4 is indicated by a dashed line.
[0023] The housing 2 has a roughly rectangular parallelepiped shape overall. As shown in Figures 3 to 5, the housing 2 has columns 21 to 26, connecting pipes 27, and partition walls 31 to 36. The partition walls 31 to 36 are attached to the columns 21 to 26 which extend in the vertical direction, and the internal space of the housing 2 is configured to be roughly sealed from the external space.
[0024] More specifically, as shown in Figure 4, at the front end of the housing 2, columns 21-24 are arranged sequentially from left to right, spaced apart from each other. Columns 21-24 are also erected vertically. Columns 21 and 24 have approximately the same vertical length. Columns 22 and 23 also have approximately the same vertical length, but are shorter than column 21. At the rear end of the housing 2, two columns 25 and 26 are erected vertically on both the left and right sides. A connecting pipe 27 extends horizontally, connecting the four columns 21-24 to each other. The connecting pipe 27 is connected to the upper ends of columns 22 and 23, and to the middle sections of columns 21 and 24.
[0025] As shown in Figure 3, a partition wall 31 is located at the bottom of the housing 2, and a partition wall 32 is located at the top. As shown in Figure 4, a partition wall 33 (side wall) is located at the front end, a partition wall 34 at the rear end, a partition wall 35 at the left end, and a partition wall 36 at the right end. Three openings (not shown) are formed in partition wall 33. These three openings are located between the four columns 21-24 in the left-right direction and are closed by the base 51 of the load port 4. A mounting section 83 (see Figure 3) on which the aligner 84, which will be described later, is placed is provided at the right end of the housing 2. The aligner 84 and the mounting section 83 are also housed inside the housing 2 (see Figure 4).
[0026] As shown in Figure 5, a support plate 37 extending horizontally is positioned in the upper part of the housing 2, on the rear end side of the connecting pipe 27. This divides the interior of the housing 2 into the aforementioned transport chamber 41 formed on the lower side and the FFU installation chamber 42 formed on the upper side. Three FFUs (fan filter units) 44, which will be described later, are arranged in the FFU installation chamber 42. Three openings 37a are formed in the center of the support plate 37 in the front-to-back direction, opposite the FFUs 44 in the vertical direction, connecting the transport chamber 41 and the FFU installation chamber 42. These three openings 37a are arranged side by side along the left-to-right direction. Furthermore, as shown in Figure 6, the three openings 37a are positioned between four columns 21-24 in the left-to-right direction. These openings 37a are gas outlets for delivering the supplied nitrogen (inert gas). Furthermore, the partition walls 33-36 of the housing 2 are divided into a lower wall for the transport chamber 41 and an upper wall for the FFU installation chamber 42 (see, for example, the front partition walls 33a, 33b and the rear partition walls 34a, 34b in Figure 5).
[0027] Next, the internal configuration of the enclosure 2 will be described. Specifically, the configuration for circulating nitrogen within the enclosure 2 and its surrounding configuration, as well as the equipment and other items placed in the transport chamber 41, will be described.
[0028] The configuration for circulating nitrogen within the enclosure 2 and its surrounding configuration will be explained using Figures 3 to 5. As shown in Figure 5, a circulation path 40 for circulating nitrogen is formed inside the enclosure 2. The circulation path 40 consists of a transport chamber 41, an FFU installation chamber 42, and a return path 43 (gas return path). In the circulation path 40, clean nitrogen is sent downward from the FFU installation chamber 42 through each opening 37a and reaches the lower end of the transport chamber 41. The aircraft then ascends via the return path 43 and returns to the FFU installation room 42 (see arrow in Figure 5). A detailed explanation follows.
[0029] As shown in Figures 5 and 6, the FFU installation chamber 42 is equipped with three FFUs 44 positioned on a support plate 37 and three chemical filters 45 positioned on the FFUs 44. As shown in Figure 5, each FFU 44 has a fan 44a and a filter 44b. The FFU 44 uses the fan 44a to send nitrogen downwards from the FFU installation chamber 42, while the filter 44b removes particles (not shown) contained in the nitrogen. The chemical filters 45 are for removing, for example, active gases brought into the circulation path 40 from the substrate processing apparatus 6. The nitrogen purified by the FFUs 44 and chemical filters 45 is sent from the FFU installation chamber 42 to the transport chamber 41 through an opening 37a formed in the support plate 37. The nitrogen sent to the transport chamber 41 forms a laminar flow and flows downwards.
[0030] The return path 43 is formed in the columns 21-24 (column 23 in Figure 5) and the connecting pipe 27 located at the front end of the housing 2. The interiors of columns 21-24 and the connecting pipe 27 are hollow, and spaces 21a-24a and 27a, respectively, are formed that allow nitrogen to flow between them (see Figure 4). The spaces 21a-24a in columns 21-24 are formed to extend in the vertical direction, and each extends from the lower end of columns 21-24 to the position of the connecting pipe 27. The space 27a in the connecting pipe 27 extends in the horizontal direction. In addition, as shown in Figures 5 and 6, communication openings 27b-27e are formed on the lower surface of the connecting pipe 27 to connect the spaces 21a-24a and space 27a of columns 21-24 to each other. Furthermore, the upper surface of the connecting pipe 27 has three openings 27f to 27h that open toward the FFU installation chamber 42 (i.e., upward). These three openings 27f to 27h are arranged between the four columns 21 to 24 in the left-right direction and have a rectangular planar shape that is elongated in the left-right direction. In this way, the connecting pipe 27 is configured to allow nitrogen flowing in from the four spaces 21a to 24a to merge before being sent out to the FFU installation chamber 42 through the three openings 27f to 27h. Thus, spaces 21a to 24a and 27a constitute the return path 43.
[0031] The return path 43 will be explained in more detail with reference to Figure 5. Although Figure 5 shows column 23, the same applies to the other columns 21, 22, and 24. An introduction duct 28 is attached to the lower end of column 23 to facilitate the flow of nitrogen from the transport chamber 41 into the return path 43 (space 23a). An opening 28a is formed in the introduction duct 28, allowing nitrogen that has reached the lower end of the transport chamber 41 to flow into the return path 43. In other words, the opening 28a is a gas intake port that draws nitrogen from the transport chamber 41 into the return path 43.
[0032] The upper part of the introduction duct 28 has an expanded section 28b that widens towards the rear as it extends downward. A fan 46 is positioned inside the introduction duct 28, below the expanded section 28b. The fan 46 is driven by a motor (not shown) and draws nitrogen that has reached the lower end of the transport chamber 41 into the return path 43 (space 23a in Figure 5) and sends it upward, returning the nitrogen to the FFU installation chamber 42. The nitrogen returned to the FFU installation chamber 42 is drawn into the FFU 44 side from the upper surface of the chemical filter 45, purified by the FFU 44 and chemical filter 45, and then sent back to the transport chamber 41 through the opening 37a. In this way, nitrogen is able to circulate within the circulation path 40.
[0033] Furthermore, as shown in Figure 3, a supply pipe 47 for supplying nitrogen into the FFU installation chamber 42 (circulation path 40) is located at the upper rear end of the FFU installation chamber 42. The supply pipe 47 is connected to an external pipe 48 which is connected to a nitrogen supply source 111. A supply valve 112 is provided in the middle of the external pipe 48, which can change the amount of nitrogen supplied per unit time. These supply pipe 47, external pipe 48, supply valve 112, and supply source 111 constitute an inert gas supply means. Note that if the inert gas supply line is installed in a factory or the like... This can be achieved by connecting the supply line and the supply pipe 47. Therefore, the inert gas supply means may consist only of the supply pipe 47.
[0034] As shown in Figures 3 and 6, the supply pipe 47 extends along the left-right direction and has three outlets 47a. The three outlets 47a are spaced apart from each other along the left-right direction and discharge nitrogen from the supply pipe 47 into the FFU installation chamber 42. As shown in Figure 5, these three outlets 47a are configured to discharge nitrogen downwards. Furthermore, the three outlets 47a are positioned in the same positional relationship as the center of the FFC 44 in the left-right direction.
[0035] Furthermore, as shown in Figure 5, a discharge pipe 49 for discharging gas from the circulation path 40 is connected to the lower end of the load port 4. The load port 4 is connected to the transport chamber 41 via a slit 51b formed in the base 51, where a storage chamber 60 housing a door drive mechanism 55 is located (see Figure 7). The discharge pipe 49 is connected to the storage chamber 60. The discharge pipe 49 is connected to, for example, an exhaust port (not shown), and a discharge valve 113 is provided along its length, which can change the amount of gas discharged per unit time from the circulation path 40. These discharge pipe 49 and discharge valve 113 constitute the gas discharge means.
[0036] The supply valve 112 and the discharge valve 113 are electrically connected to the control device 5 (see Figure 2). This makes it possible to supply and discharge nitrogen to the circulation path 40 as needed. For example, when starting EFEM1 (including when starting EFME1 after maintenance, etc.), if the oxygen concentration in the circulation path 40 is high, the oxygen concentration can be lowered by supplying nitrogen to the circulation path 40 from the supply source 111 via the external piping 48 and the supply pipe 47, and by discharging the gas (including nitrogen and oxygen, etc.) in the circulation path 40 and the containment chamber 60 via the discharge pipe 49. In other words, the circulation path 40 and the containment chamber 60 can be replaced with a nitrogen atmosphere. Furthermore, if the oxygen concentration in the circulation path 40 rises while EFEM1 is in operation, the oxygen concentration can be lowered by temporarily supplying a large amount of nitrogen to the circulation path 40 and discharging oxygen along with the nitrogen via the discharge pipe 49. In the EFEM1, which circulates nitrogen, it is necessary to maintain the pressure inside the circulation path 40 slightly higher than the external pressure in order to suppress nitrogen leakage from the circulation path 40 to the outside while reliably suppressing atmospheric intrusion from the outside into the circulation path 40. Specifically, the pressure is in the range of 1 Pa(G) to 3000 Pa(G), preferably 3 Pa(G) to 500 Pa(G), and more preferably 5 Pa(G) to 100 Pa(G). Therefore, when the pressure inside the circulation path 40 falls outside the predetermined range, the control device 5 changes the nitrogen discharge flow rate by changing the opening of the discharge valve 113, and adjusts the pressure so that it becomes a predetermined target pressure. In this way, the oxygen concentration and pressure are controlled by adjusting the nitrogen supply flow rate based on the oxygen concentration and adjusting the nitrogen discharge flow rate based on the pressure. In this embodiment, the differential pressure is adjusted to 10 Pa(G).
[0037] Next, the equipment and other items arranged in the transport chamber 41 will be explained using Figures 3 and 4. As shown in Figures 3 and 4, the transport robot 3, the control unit housing box 81, the measuring instrument housing box 82, and the aligner 84 are arranged in the transport chamber 41. The control unit housing box 81 is installed, for example, to the left of the base portion 90 (see Figure 3) of the transport robot 3, and is positioned so as not to interfere with the arm mechanism 70 (see Figure 3). The robot control unit 11 and the load port control unit 12 described above are housed in the control unit housing box 81. The measuring instrument housing box 82 is installed, for example, to the right of the base portion 90, and is positioned so as not to interfere with the arm mechanism 70. The measuring instrument housing box 82 can accommodate measuring instruments such as the oxygen concentration meter 85, pressure meter 86, and hygrometer 87 described above (see Figure 2).
[0038] The aligner 84 is used to detect how much the holding position of the wafer W, which is held by the arm mechanism 70 (see Figure 3) of the transport robot 3, deviates from the target holding position. For example, inside the FOUP 100 (see Figure 1) transported by the OHT (not shown) described above, there is a risk that the wafer W may move slightly. Therefore, the transport robot 3 places the unprocessed wafer W, which has been removed from the FOUP 100, onto the aligner 84. The aligner 84 measures how far the wafer W was held by the transport robot 3 from the target holding position and transmits the measurement result to the robot control unit 11. Based on the measurement result, the robot control unit 11 corrects the holding position by the arm mechanism 70, controls the arm mechanism 70 to hold the wafer W at the target holding position, and transports it to the load lock chamber 6a of the substrate processing apparatus 6. This enables the substrate processing apparatus 6 to process the wafer W normally.
[0039] (Load port configuration) Next, the configuration of the load port will be described below with reference to Figures 7 and 8. Figure 7 is a side cross-sectional view of the load port with the door closed. Figure 8 is a side cross-sectional view of the load port with the door open. Note that Figures 7 and 8 are drawn with the external cover 4b (see Figure 5), located below the mounting base 53, removed.
[0040] As shown in Figure 7, the load port 4 has a plate-shaped base 51 erected vertically and a horizontal base 52 formed projecting forward from the central part of the base 51 in the vertical direction. A mounting platform 53 (mounting section) for placing the FOUP 100 is provided on the upper part of the horizontal base 52. With the FOUP 100 placed on it, the mounting platform 53 can be moved in the front-rear direction by a mounting platform drive unit (not shown).
[0041] The base 51 constitutes part of the partition wall 33 that isolates the transport chamber 41 from the external space. The base 51 has a roughly rectangular planar shape that is elongated in the vertical direction. The base 51 also has a window portion 51a formed at a position that allows it to face the mounted FOUP 100 in the front-rear direction. In the vertical direction, the base 51 has a vertically extending slit 51b formed below the horizontal base portion 52, through which the support frame 56 (described later) can move. The slit 51b is formed only in the range in which the support frame 56 can move vertically while passing through the base 51, and the opening width in the left-right direction is small. As a result, it is difficult for particles from the containment chamber 60 to enter the transport chamber 41 through the slit 51b.
[0042] The load port 4 has an opening and closing mechanism 54 that can open and close the lid 101 of the FOUP 100. The opening and closing mechanism 54 has a door 4a that can close the window section 51a and a door drive mechanism 55 for driving the door 4a. The door 4a is configured to be able to close the window section 51a. The door 4a is also configured to be able to unlock the lid 101 of the FOUP 100 and to hold the lid 101. The door drive mechanism 55 includes a support frame 56 for supporting the door 4a, a movable block 58 that supports the support frame 56 so that it can move in the front-rear direction via a slide support means 57, and a slide rail 59 that supports the movable block 58 so that it can move in the up-down direction relative to the base 51.
[0043] The support frame 56 supports the lower rear of the door 4a and is a roughly crank-shaped plate member that extends downward, passes through a slit 51b provided in the base 51, and then protrudes forward from the base 51. The slide support means 57, movable block 58, and slide rail 59 for supporting this support frame 56 are provided in front of the base 51. In other words, the drive point for moving the door 4a is on the outside of the housing 2 and is housed in a housing chamber 60 provided below the horizontal base 52. The housing chamber 60 is enclosed by the horizontal base 52 and the roughly box-shaped cover 61 and base 51 that extend downward from the horizontal base 52, and is in a roughly sealed state.
[0044] The bottom wall 61a of the cover 61 is connected to the aforementioned discharge pipe 49. In other words, the storage chamber 60 and the discharge pipe 49 are connected. In this embodiment, the three load ports 4 Even in the misaligned sections, the containment chamber 60 and the discharge pipe 49 are connected. This allows the gas from the circulation path 40 to be discharged from the discharge pipe 49 via the containment chamber 60 of each load port 4. Therefore, when the gas is discharged from the discharge pipe 49, the particles present in each containment chamber 60 can also be discharged along with the gas. In addition, a fan 62 is provided on the bottom wall 61a of the containment chamber 60, facing the discharge pipe 49. The placement of the fan 62 inside the containment chamber 60 makes it easier to discharge the gas from the containment chamber 60 to the discharge pipe 49 while suppressing the stirring up of particles. If a fan were provided to send the gas in the transport chamber 41 towards the containment chamber 60, turbulence would easily occur in the airflow inside the transport chamber 41, making it easier for particles inside the transport chamber 41 to be stirred up. However, in this embodiment, since the fan 62 is located inside the containment chamber 60, it is possible to suppress the stirring up of particles inside the transport chamber 41. Furthermore, in this embodiment, the connection point of the gas discharge means (discharge pipe 49) (the installation location of the fan 62) is set at a distance from the communication point by the slit 51b, and is provided on the bottom wall 61a of the wall surface constituting the containment chamber 60.
[0045] Next, the opening and closing operation of the lid 101 and door 4a of the FOUP 100 will be described below. First, as shown in Figure 7, the FOUP 100, which is placed on the mounting platform 53 while separated from the base 51, is moved backward so that the lid 101 and door 4a come into contact. At this time, the door 4a of the opening and closing mechanism 54 unlocks the lid 101 of the FOUP 100 and holds the lid 101 in place.
[0046] Next, as shown in Figure 8, the support frame 56 is moved backward. This causes the door 4a and the lid 101 to move backward. As a result, the lid 101 of the FOUP 100 opens and the door 4a opens, creating communication between the transport chamber 41 of the housing 2 and the FOUP 100.
[0047] Next, as shown in Figure 8, the support frame 56 is moved downward. This causes the door 4a and lid 101 to move downward. This opens the FOUP 100 wide as an loading / unloading entrance, making it possible to move the wafer W between the FOUP 100 and the EFEM 1. To close the lid 101 and door 4a, the reverse of the above operation is performed. The series of operations of the load port 4 are controlled by the load port control unit 12.
[0048] As described above, in the EFEM1 of this embodiment, the discharge pipe 49 constituting the gas discharge means is connected to the housing chamber 60 of the load port 4, which houses a part of the opening / closing mechanism 54. This makes it easier to quickly replace the atmosphere inside the housing chamber 60 with a nitrogen atmosphere when replacing the atmosphere in the circulation path 40 with a nitrogen atmosphere. For example, when starting up the EFEM1 (including after maintenance), supplying nitrogen from the supply pipe 47 (inert gas supply means) and discharging the gas through the discharge pipe 49 (gas discharge means) makes it easier to quickly replace the atmosphere in the transport chamber 41 and the housing chamber 60 with a nitrogen atmosphere. This shortens the time until operations such as transporting wafers W (substrates) can be started. In addition, it is possible to discharge particles inside the housing chamber 60 when the gas is discharged, making it less likely for particles inside the housing chamber 60 to be stirred up when the opening / closing mechanism 54 is operated, and making it less likely for particles to enter the transport chamber 41.
[0049] Furthermore, the conveying chamber 41 has an opening 37a (gas outlet) at the top for supplying nitrogen, an opening 28a (gas intake) at the bottom for drawing in nitrogen, and a return path 43 (gas return path) for returning nitrogen from opening 28a to opening 37a. A filter 44b is provided between the fan 44a and opening 37a (gas outlet), which makes it possible to generate a downward airflow of nitrogen with particles removed in the conveying chamber 41 while circulating the nitrogen through the return path 43. This makes it possible to suppress nitrogen consumption and reduce costs.
[0050] Furthermore, the discharge pipe 49 is connected to the bottom wall 61a. This allows the partition inside the containment chamber 60 to This allows for the effective removal of particles that have accumulated at the bottom.
[0051] Furthermore, since the discharge pipe 49 is connected to the load port 4 located at the front of the housing 2, the flexibility of the piping layout of the discharge pipe 49 is improved. For example, if the discharge pipe is connected to the rear end of the housing 2, there is a risk of interference with the substrate processing device 6, and if it is connected to the left or right end of the housing 2, the installation area of the EFEM1 itself in the left-right direction will increase, thus easily imposing constraints on the piping layout.
[0052] Although preferred embodiments of the present invention have been described above, the present invention is not limited to the embodiments described above, and various modifications are possible as long as they are within the scope of the claims. In the embodiments described above, a fan 62 is provided, but the discharge pipe 49 may be connected to a suction means (for example, a vacuum in a factory) without providing a fan 62. Also, the discharge pipe 49 may be connected to a part other than the bottom wall 61a, as long as it is connected to the containment chamber 60.
[0053] In this embodiment, the amount of gas discharged from the containment chamber 60 is adjusted by controlling the opening of the discharge valve 113 while keeping the rotation speed of the fan 62 constant. However, the amount of gas discharged from the containment chamber 60 may also be adjusted by controlling the rotation speed of the fan 62.
[0054] Furthermore, a return path 43 does not necessarily have to be provided inside the housing 2. In other words, it is not necessary to circulate nitrogen (inert gas). Also, although the spaces 21a to 24a and 27a formed inside the columns 21 to 24 and the connecting pipe 27 are assumed to be the return path 43, this is not the only option. That is, the return path 43 may be formed by other members.
[0055] Alternatively, a gas discharge means may be provided in the return path in addition to the gas discharge means described above.
[0056] Furthermore, although this embodiment describes a configuration in which the transported item is a semiconductor substrate and an inert gas is supplied to an EFEM1 equipped with a load port 4 having a containment chamber 60, it is not limited to this. For example, the transported item may be a pharmaceutical product, a specimen, or a cell, and the supplied gas may be a decontamination gas (e.g., H2O2 gas) or a gas with controlled carbon dioxide concentration.
[0057] The transport system comprises a container opening / closing device equipped with an opening / closing mechanism for opening and closing the lid of a container containing items to be transported; a housing provided adjacent to the container opening / closing device and comprising a transport chamber for transporting items; a gas supply means for supplying a predetermined gas into the transport chamber; and a gas discharge means for discharging the gas from the transport chamber. The container opening / closing device may be characterized by comprising a housing chamber that houses a part of the opening / closing mechanism and communicates with the transport chamber, and the gas discharge means being connected to the housing chamber to discharge the gas from the transport chamber via the housing chamber. [Explanation of Symbols]
[0058] 1 EFEM 2 cabinets 3. Transport robot (circuit board transport device) 4 Load Ports 28a Opening (gas suction port) 33 Bulkhead (side wall) 37a Opening (gas outlet) 41 Transport Room 43. Return Route (Gas Return Route) 44b filter 47. Supply pipe (means for supplying inert gas) 49. Discharge pipe (gas discharge means) 53 Mounting platform (mounting section) 54 Opening and closing mechanism 60 Confinement Rooms 61a Bottom wall 62 Fans 100 FOUP 101 Lid (lid part) W wafer (substrate)
Claims
1. A container opening and closing device that constitutes at least a part of the wall surface of a housing having a transport chamber for transporting articles to be transported, and for opening and closing the lid of a container in which the articles to be transported are stored, A plate-shaped base is erected vertically to close the opening of the transport chamber, A mounting platform for placing the aforementioned container, A door that can close the window section provided on the base, A housing chamber for housing the drive mechanism for moving the aforementioned door, It comprises a discharge pipe connected to the containment chamber for discharging gas that has flowed from the transport chamber into the containment chamber, The container opening and closing device is characterized in that the discharge pipe passes on the opposite side of the base from the conveying chamber, bends, and is positioned toward the conveying chamber.
2. The container opening and closing device according to claim 1, characterized in that the storage chamber is installed on the opposite side from the transport chamber, separated by the base.
3. The discharge pipe further includes a discharge valve installed in the middle of the discharge pipe, which can change the amount of gas discharged per unit time. The container opening and closing device according to claim 1 or 2, characterized in that the discharge valve is positioned between the partition wall at the front end and the partition wall at the rear end of the conveying chamber.
4. The container opening and closing device according to any one of claims 1 to 3, characterized in that the discharge pipe is connected to the bottom wall of the containment chamber.
Citation Information
Patent Citations
Load port apparatus and dust exhaust method for load port apparatus
JP2011066260A
Wafer processing apparatus
JP2013120760A
efem
JP2015146349A
Loading port and loading port atmoshpere substitution method
WO2016035675A1