Device manufacturing method

Abstract

To stably bond a mounted member.SOLUTION: A manufacturing method of a device contains: a step of exhausting a bonding material for fixing a mounted member to a predetermined position of a base body by bonding a mounting surface of the base body and a bonding surface of the mounted member from a nozzle of a bonding device where an outer edge-formed area of a tip end surface of the nozzle is 75% or larger of an area of the bonding surface, and coating, with the bonding material, a mounting surface in such a size and shape that at least one part of an outer edge of the bonding material is deviated from the bonding surface; and a step of distributing the mounted member to the predetermined position of the base body, further deviating at least one part of the bonding material nipped between the mounting surface and the bonding surface from the bonding surface by pressing force, and thereby bonding the mounted member to the base body.SELECTED DRAWING: Figure 3C

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a device such as a light-emitting device, or to a light-emitting device.

Background Art

[0002] For example, a bonding material is used when fixing a semiconductor chip at a predetermined position on a base body. In Patent Document 1, in consideration of phenomena such as the bonding material creeping up to the upper surface of the semiconductor chip, a paste-like bonding material is used, and the bonding material is transferred so that the applied thickness is thinner than the thickness of the semiconductor chip. The method is disclosed.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problem to be Solved by the Invention

[0004] There is still room for improvement in methods for stably bonding a member to be mounted, such as a semiconductor chip, which is an object to be mounted.

Means for Solving the Problem

[0005] The method for manufacturing a device disclosed in the embodiment includes discharging a bonding material for bonding the mounting surface of a base body and the bonding surface of a member to be mounted to fix the member to be mounted at a predetermined position of the base body from a nozzle of a bonding apparatus in which the area of the outer edge shape of the tip end surface of the nozzle is 75% or more of the area of the bonding surface, and applying the bonding material onto the mounting surface in a size and shape such that at least a part of the outer edge of the bonding material protrudes from the bonding surface; and disposing the member to be mounted at the predetermined position of the base body, and pressing at least a part of the bonding material sandwiched between the mounting surface and the bonding surface to further protrude from the bonding surface, thereby bonding the member to be mounted to the base body.

[0006] Furthermore, the light-emitting device disclosed in the embodiment comprises a light-emitting element, a submount having a thickness of 150 μm to 500 μm on which the light-emitting element is arranged on the upper surface, a substrate on which the submount is mounted, an intervening portion provided between the submount and the substrate, and a protruding portion extending beyond the submount, wherein at least a part of the protruding portion has a two-stage shape, and in cross-sectional view, the outermost point of the upper stage of the two-stage shape of the joint is located outside and above the connection point between the upper and lower stages, and the apex of the upper stage is located away from the side surface of the submount. [Effects of the Invention]

[0007] In the manufacturing of devices such as light-emitting devices, the components to be mounted can be stably joined. Alternatively, devices such as light-emitting devices can be supplied with stable quality. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a flowchart of the joining method according to the embodiment. [Figure 2A] Figure 2A is a schematic diagram of a bonding apparatus according to an embodiment. [Figure 2B] Figure 2B is a plan view of the nozzle of the bonding apparatus according to the embodiment. [Figure 2C] Figure 2C is a cross-sectional view of the nozzle of the bonding apparatus according to the embodiment. [Figure 3A] Figure 3A is a top view illustrating an example of the positional relationship between the position where the bonding material is applied and the position where the member to be mounted is placed in the bonding method according to the embodiment. [Figure 3B] Figure 3B is a cross-sectional view illustrating an example of how the bonding material is applied by a bonding apparatus in the bonding method according to the embodiment. [Figure 3C] Figure 3C is a cross-sectional view illustrating an example of the appearance of the bonding material applied to the substrate by a bonding apparatus in the bonding method according to the embodiment. [Figure 3D]Figure 3D is a top view illustrating an example of the appearance of the bonding material applied to the substrate by a bonding apparatus in the bonding method according to the embodiment. [Figure 3E] Figure 3E is a top view illustrating another example of the positional relationship between the position where the bonding material is applied and the position where the member to be mounted is placed in the bonding method according to the embodiment. [Figure 3F] Figure 3F is a top view illustrating another example of the appearance of the bonding material applied to the substrate by the bonding apparatus in the bonding method according to the embodiment. [Figure 3G] Figure 3G is a top view illustrating another example of the appearance of the bonding material applied to the substrate by the bonding apparatus in the bonding method according to the embodiment. [Figure 3H] Figure 3H is a top view illustrating another example of the positional relationship between the position where the bonding material is applied and the position where the member to be mounted is placed in the bonding method according to the embodiment. [Figure 3I] Figure 3I is a top view illustrating another example of the positional relationship between the position where the bonding material is applied and the position where the member to be mounted is placed in the bonding method according to the embodiment. [Figure 4A] Figure 4A is a side view illustrating an example of how a component to be mounted is joined to a base body by the joining method according to the embodiment. [Figure 4B] Figure 4B is a side view illustrating another example of how a component to be mounted is joined to a base body by the joining method according to the embodiment. [Figure 5A] Figure 5A is a top view illustrating an example of how the bonding material applied to the substrate by a bonding apparatus in a conventional bonding method. [Figure 5B] Figure 5B is a cross-sectional view illustrating an example of how bonding material is applied to a substrate by a bonding apparatus in a conventional bonding method. [Figure 5C] Figure 5C is a side view illustrating an example of how a component to be mounted is joined to a substrate using a conventional joining method. [Figure 6]FIG. 6 is a graph comparing the applied amount of a bonding material between a conventional bonding method and a bonding method according to an embodiment. [Figure 7A] FIG. 7A is an image showing an example of a state where the mounted member is peeled off from the base body when the mounted member is stably bonded. [Figure 7B] FIG. 7B is an image showing an example of a state where the mounted member is peeled off from the base body when the mounted member is not stably bonded. [Figure 8A] FIG. 8A is an image showing an example of a bonded state by the bonding method according to the embodiment. [Figure 8B] FIG. 8C is an image showing another example of a bonded state by the bonding method according to the embodiment. [Figure 8C] FIG. 8C is an image showing an example of a bonded state by a conventional bonding method. [Figure 9] FIG. 9 is a perspective view of a light-emitting device according to the embodiment. [Figure 10] FIG. 10 is a top view of the light-emitting device according to the embodiment. [Figure 11] FIG. 11 is a top view for explaining the internal structure of the light-emitting device according to the embodiment. MODE FOR CARRYING OUT THE INVENTION

[0009] In the present specification or claims, regarding polygons such as triangles and quadrangles, shapes obtained by subjecting the corners of a polygon to processing such as corner rounding, chamfering, corner cutting, and rounding are also referred to as polygons. Further, not limited to corners (ends of sides), shapes obtained by subjecting the middle portions of sides to processing are also referred to as polygons. That is, shapes that are partially processed while remaining based on a polygon are included in the interpretation of "polygon" described in the present specification and claims.

[0010] Furthermore, the same applies not only to polygons, but also to words describing specific shapes such as trapezoids, circles, and concave shapes. The same also applies when dealing with each side that forms such a shape. In other words, even if a side has been processed at a corner or in the middle, the interpretation of "side" includes the processed part. When distinguishing a "polygon" or "side" without partial processing from a processed shape, the term "strictly" should be added, for example, "strictly quadrilateral."

[0011] Furthermore, within this specification or the claims, expressions such as up and down, left and right, front and back, front and back, etc. merely describe relative positions, orientations, and directions, and do not necessarily correspond to the relationships in use.

[0012] The embodiments for carrying out the present invention will be described below with reference to the drawings. However, while the embodiments shown embody the technical concept of the present invention, they do not limit the present invention. In the following description, the same names and reference numerals indicate the same or similar components, and redundant explanations may be omitted as appropriate. Note that the size and positional relationships of the components shown in each drawing may be exaggerated for clarity of explanation.

[0013] <Joining method according to this embodiment> This section describes a bonding method for mounting components onto a substrate during the manufacturing of a device such as a light-emitting device according to the embodiment. Figure 1 is a flowchart of the bonding method. Figure 2A is a schematic diagram of a bonding apparatus. Figure 2B is a plan view of the nozzle portion of the bonding apparatus. Figure 2C is a cross-sectional view of the nozzle portion of the bonding apparatus. Figures 3A to 3I are supplementary diagrams illustrating each step of the bonding method according to the embodiment. Figures 4A and 4B are side views showing the components to be mounted on the substrate after bonding by the bonding method according to the embodiment.

[0014] The method for joining the member to be mounted 1 according to the embodiment includes a step of applying a bonding material (step S1) and a step of joining the member to be mounted (step S2). In step S1, the bonding material 2 is applied onto the base body 10, and in step S2, the member to be mounted 1 is joined to the base body 10 by the applied bonding material 2.

[0015] The component to be mounted 1 is the component to be mounted, and an example of this is a light-emitting element in the manufacture of a light-emitting device. The substrate 10 has a mounting surface on which the component to be mounted 1 is mounted, and an example of this is a flat substrate. The bonding material 2 is a material used to bond the component to be mounted 1 to the substrate 10. A bonding apparatus 3 is used to apply the bonding material 2.

[0016] (Bonding device 3) As illustrated in Figures 2A to 2C, the bonding apparatus 3 includes a syringe 31 and a nozzle 32. The syringe 31 is filled with bonding material 2. The amount of bonding material 2 filled in the syringe 31 is controlled by the drive circuit of the bonding apparatus 3 and dispensed from the nozzle 32. The syringe 31 can be filled with 1 ml or more of bonding material 2.

[0017] (Nozzle 32) The tip of the nozzle 32 has a discharge section 33, an internal section 34, a tip surface 35, and one or more outer surfaces 36. The bonding material 2 filled in the syringe 31 is discharged from the tip of the nozzle 32. The bonding material 2 can be a paste material in which metal particles are dispersed in a resin or organic solvent.

[0018] Examples of paste materials include metal paste materials such as Au paste and Ag paste. Epoxy and silicone resin paste materials can also be used. Furthermore, the bonding material 2 can have a viscosity of 10 Pa·s to 150 Pa·s. In the bonded apparatus 3 shown in the diagram, an Au paste material with a viscosity of 40 Pa·s to 70 Pa·s is used as the bonding material 2.

[0019] In the dispensing section 33, a discharge port is formed from which the bonding material 2 filled in the syringe 31 is dispensed. One or more discharge ports are formed in the dispensing section 33. In the bonding apparatus 3 shown in the figure, there is one discharge port, but there may be multiple.

[0020] A circular discharge port is formed in a plan view. Note that it is not limited to a circle; it may also be elliptical or rectangular. In a plan view, the maximum length of the discharge port is 0.05 mm to 0.5 mm. In a plan view, the area of ​​the discharge port is 0.002 mm². 2 0.2mm or more 2 The following applies. This allows the adhesive 2 to be applied in an appropriate shape (shape and size). Note that the maximum length and area of ​​the discharge port do not have to be limited to this range.

[0021] As will be explained in detail later, in the area where the adhesive 2 is applied, the area directly below the discharge port has a thicker layer of adhesive 2 compared to the outer peripheral area 21. The central area 22, where the adhesive 2 applied to the surface is relatively thicker, can be considered as the area directly below the discharge port. However, due to the viscosity and other properties of the adhesive 2, there may be some discrepancy between the central area 22 and the area directly below the discharge port. In any case, the shape of the discharge port allows for the formation of the central area 22 in an appropriate shape.

[0022] The internal portion 34 has one or more internal surfaces for applying the adhesive 2 discharged from the discharge port in a predetermined shape. In a plan view, the discharge port is surrounded by the internal portion 34. When applying the adhesive 2, the adhesive 2 discharged from the discharge port is surrounded by one or more internal surfaces of the internal portion 34 and the application surface to which the adhesive 2 is applied, and is contained within the internal portion 34.

[0023] The outer edge shape of the enclosed portion 34, formed by one or more enclosed surfaces, is circular. However, the outer edge shape of the enclosed portion 34 is not limited to a circle; it may also be elliptical, rectangular, or other shapes. The maximum length of the outer edge shape of the enclosed portion 34 is 0.5 mm to 2 mm. The area of ​​the outer edge shape of the enclosed portion 34 is 0.2 mm². 2 3.14mm 2The following applies. This allows the outer edge of the adhesive material 2 to be applied to be shaped appropriately. Note that the maximum length and area of ​​the outer edge shape of the inner portion 34 are not limited to this range.

[0024] When applying the bonding agent 2, the bonding agent 2 discharged from the discharge port will overflow from the outer edge of the inner part 34. The shape of the outer edge of the bonding agent 2 applied to the application surface may correspond to the shape of the outer edge of the inner part 34. In other words, the shape of the outer edge of the applied bonding agent 2 may be the same as, or approximately the same as, the outer edge of the inner part 34. It is also possible to make the shape of the applied bonding agent 2 smaller than the outer edge of the inner part 34.

[0025] For example, a nozzle 32 can be used in which the outer edge shape of the inner part 34 and the shape of the discharge port are a circle with a diameter of 0.5 mm and a diameter of 0.1 mm, a nozzle 32 with a diameter of 0.9 mm and a diameter of 0.2 mm, or a nozzle 32 with a diameter of 1.1 mm and a diameter of 0.3 mm. However, the nozzle 32 is not limited to these examples.

[0026] One or more enclosed surfaces define the discharge port and include an opposing surface facing the coating surface. One or more enclosed surfaces include an inner surface that intersects with the tip surface 35. In the enclosed portion 34, the region between the opposing surface and the inner surface is R-shaped, and the opposing surface and the inner surface can be considered as a single continuous surface. Alternatively, the enclosed portion 34 may have a shape where the opposing surface and the inner surface intersect and can be considered as separate surfaces. In a plan view, the center of the outer edge shape of the enclosed portion 34 coincides with the discharge port.

[0027] The tip surface 35 is the surface that comes closest to the application surface when the bonding material 2 is applied. The tip surface 35 surrounds the internal part 34. The tip surface 35 is annular in shape. The inner and outer edges of the tip surface 35 are circular. The shape of the inner edge of the tip surface 35 is the same as, or similar to, the shape of the outer edge of the internal part. The tip surface 35 intersects with the outer edge of the internal part 34.

[0028] The tip surface 35 is flat, and the discharge portion 33 and the internal portion 34 are recessed inward from the imaginary plane that includes the tip surface 35. If the tip surface 35 is the lower surface of the nozzle 32, then the discharge portion 33 and the internal portion 34 can be said to be formed above the imaginary plane that includes the tip surface 35. The discharge portion 33 and the internal portion 34 are formed above the imaginary plane that includes the inner edge of the tip surface 35. The discharge portion 33 and the internal portion 34 are formed above the imaginary plane that includes the outer edge of the tip surface 35.

[0029] The tip surface 35 and the opposing surface of the internal portion 34 are parallel. A hypothetical plane containing the inner edge of the tip surface 35 is parallel to the opposing surface of the internal portion 34. A hypothetical plane containing the outer edge of the tip surface 35 is parallel to the opposing surface of the internal portion 34. In a plan view, the center position of the inner edge shape of the tip surface 35 coincides with the discharge port. In a plan view, the center position of the outer edge shape of the tip surface 35 coincides with the discharge port.

[0030] The maximum height from the tip surface 35, a virtual plane including the inner edge of the tip surface 35, or a virtual plane including the outer edge of the tip surface 35 to the opposing surface of the enclosed portion 34 is between 20 μm and 80 μm. By setting the maximum height within this range, the bonding material 2 can be applied thinly. As will be described in detail later, in the area where the bonding material 2 is applied, the thickness of the outer peripheral region 21, which is the area where the bonding material 2 is applied thinly, can be made 50 μm or less. Note that this maximum height is not limited to this range; it can be greater than 80 μm or less than 20 μm.

[0031] When applying the adhesive 2, the adhesive 2 discharged from the nozzle either remains near the outer edge of the tip surface 35 or spills over beyond the outer edge. Therefore, the outer edge shape of the adhesive 2 applied to the application surface can correspond to the outer edge shape of the tip surface 35. In other words, the outer edge shape of the applied adhesive 2 can be the same as, or approximately the same as, the outer edge shape of the tip surface 35. It is also possible to make the shape of the applied adhesive 2 smaller than the outer edge shape of the tip surface 35.

[0032] Furthermore, the bonding apparatus 3 does not necessarily have to have an internal portion 34. In this case, the tip surface 35 defines the discharge port instead of the opposing surface of the internal portion 34. In such a bonding apparatus 3, the tip surface 35 is provided in the area where the tip surface 35 of the bonding apparatus 3 and the opposing surface of the internal portion 34 are combined as shown in the plan view. It can also be said that it is both the tip surface 35 and the opposing surface.

[0033] Therefore, including such forms, it can be said that it is preferable that the maximum height from the tip surface 35, a virtual plane including the inner edge of the tip surface 35, or a virtual plane including the outer edge of the tip surface 35 to the opposing surface of the encapsulating portion 34 in the bonding apparatus 3 is greater than 0 μm and 80 μm or less, or 0 μm (i.e., there is no encapsulating portion 34).

[0034] One or more outer surfaces 36 have the same shape as the outer edge shape of the internal portion 34, and are larger than the outer edge of the internal portion 34. One or more outer surfaces 36 intersect with the tip surface 35. In plan view, the outer edge shape of one or more outer surfaces 36 matches the combined shape of the outer edge shape of the internal portion 34 and the tip surface 35.

[0035] In a plan view, the width of the tip surface 35 can be half the value obtained by subtracting the maximum length of the outer edge shape of the inner portion 34 from the maximum length of the outer edge shape of one or more outer surfaces 36. Preferably, the width of this tip surface 35 is 0.05 mm or more and 0.5 mm or less. By setting it to 0.5 mm or less, variations in the shape of the adhesive material 2 to be applied can be suppressed. Also, by setting it to 0.05 mm or more, the strength of the nozzle tip 32 can be maintained, and damage to the nozzle 32 due to contact with the base body 10 can be made less likely.

[0036] (Joining method: The process involves applying a bonding agent.) In step S1, which involves applying a bonding material, the nozzle 32 of the bonding apparatus 3 is positioned at a predetermined application location on the base body 10, and the bonding material 2 is discharged from the discharge section 33. The application location of the bonding material 2 is determined based on where the member to be mounted 1 is positioned on the base body 10 for mounting. In other words, in order to apply the bonding material 2 to fix the member to be mounted 1 at a predetermined location on the base body 10, the predetermined location on the mounting surface of the base body 10 where the member to be mounted 1 is placed, and the size and shape of the bonding surface of the member to be mounted 1 facing the mounting surface of the base body 10 become parameters for determining the application location.

[0037] As shown in Figure 3A, in this process, the application position of the bonding material 2 is determined based on the position where the bonding surface of the component to be mounted 1 is mounted, such that the outer edge of the tip surface 35 fits within the bonding surface of the component to be mounted 1 when viewed from above. In other words, the outer edge shape of the tip surface 35 is of a size and shape that fits inside the bonding surface of the component to be mounted 1.

[0038] It is preferable that the bonding apparatus 3 satisfies the condition that the area of ​​the outer edge shape of the tip surface 35 is 75% or more and 100% or less of the area of ​​the bonding surface of the member to be mounted 1. By satisfying this condition, even if the outer edge shape of the tip surface 35 is contained within the bonding surface of the member to be mounted 1, a sufficient bonding area for the bonding material 2 can be secured, and the member to be mounted 1 can be stably bonded.

[0039] Furthermore, the application position of the bonding material 2 is determined such that, when viewed from above, there exists a virtual straight line that intersects the outer edge of the tip surface 35 at two points and passes through the joint surface of the member to be mounted 1. Preferably, the length (distance) between the two points where this virtual straight line intersects the outer edge of the tip surface 35 is 80% to 100% of the length over which this straight line passes through the joint surface of the member to be mounted 1. By satisfying this condition, it is possible to check the bonding state by allowing a portion of the bonding material 2 to protrude from the joint surface of the member to be mounted 1 after the bonding process is completed. In addition, the amount of bonding material 2 used for bonding can be reduced.

[0040] Furthermore, these conditions based on area ratios and length ratios may also be influenced by the difference between the outer edge shape of the tip surface 35 and the shape of the joining surface of the member to be mounted 1. For example, when the outer edge shape of the tip surface 35 is circular and the shape of the joining surface of the member to be mounted 1 is rectangular with an aspect ratio of 0.4 or more to 1 or less, the joining method according to the embodiment satisfies the above-mentioned area ratio condition, the length ratio condition, or both conditions.

[0041] The component to be mounted 1 is not particularly limited as long as it is an object to be mounted on the substrate 10. Examples of the component to be mounted 1 include a light-emitting element and a submount. It may also be a reflective element such as a mirror, an optical element such as a lens, or a light-emitting device. In the illustrated example of the joining method, the component to be mounted 1 is a submount on which a light-emitting element is arranged, and the joining surface that joins with the mounting surface of the substrate 10 is rectangular.

[0042] The area of ​​the bonding surface of the mounted component 1 is 0.5 mm². 2 More than 3mm 2 The following conditions apply. Furthermore, the height of the mounted component 1 from the joining surface is 150 μm or more and 500 μm or less. In the joining method according to the embodiment, a stable joining can be achieved by using a mounted component 1 that satisfies these conditions. Even if the conditions are outside this range, it is possible to achieve a stable joining by applying the joining method according to the embodiment.

[0043] As shown in Figure 3E, in this process, the application position of the bonding material 2 may be determined such that at least a portion of the outer edge of the tip surface 35 protrudes from the member to be mounted 1. Furthermore, the application position of the bonding material 2 may be determined such that a portion protrudes from at least two opposing locations on either side of the member to be mounted 1.

[0044] Hereafter, in the process S1 of applying the bonding material, the cases in which the outer edge of the tip surface 35 does not protrude from the bonding surface of the mounted member 1 and the cases in which it does protrude will be simply referred to as the "bonding method without protrusion" and the "bonding method with protrusion," respectively. As will be described in detail later, in either bonding method, at least a portion of the applied bonding material 2 may protrude from the bonding surface of the mounted member 1.

[0045] In the joining method that involves overhang, there are two possibilities: as shown in Figure 3E, the outer edge shape of the tip surface 35 may be such that it overhangs only a portion of the outer edge of the joining surface of the member to be mounted 1; or as shown in Figures 3H and 3I, the outer edge shape of the tip surface 35 may be such that it overhangs the entire outer edge of the joining surface of the member to be mounted 1. In either case, the member to be mounted 1 can be joined stably.

[0046] In the former case, it is preferable that the above-mentioned area ratio condition satisfies the condition that the area of ​​the outer edge shape of the tip surface 35 is 80% or more and 200% or less of the area of ​​the joining surface of the mounted member 1. By satisfying this condition, a sufficient joining area for the joining material 2 can be secured. If it exceeds 200%, the application area of ​​the joining material 2 applied to the mounting surface of the base body 10 may become too large.

[0047] Furthermore, regarding the length ratio described above, it is preferable that the length (distance) between the two points where the imaginary straight line intersects with the outer edge of the enclosed portion 34 is greater than 100% of the length over which this straight line passes through the joint surface of the mounted member 1, and less than or equal to 120%. Satisfying this condition allows for a reduction in the amount of bonding material 2 used for joining. If it exceeds 120%, the application area of ​​the bonding material 2 applied to the mounting surface of the base body 10 may become too large.

[0048] In the latter case, it is preferable that the above-mentioned area ratio condition satisfies the condition that the area of ​​the outer edge shape of the tip surface 35 exceeds 100% of the area of ​​the joining surface of the mounted member 1, and is 230% or less. By satisfying this condition, a sufficient joining area for the joining material 2 can be secured. If it exceeds 230%, the application area of ​​the joining material 2 applied to the mounting surface of the base body 10 may become too large.

[0049] Furthermore, regarding the length ratio described above, it is preferable that the length (distance) between the two points where the imaginary straight line intersects with the outer edge of the enclosed portion 34 exceeds 100% of the length over which this straight line passes through the joint surface of the mounted member 1, and is 120% or less. If it exceeds 120%, the application area of ​​the bonding material 2 applied to the mounting surface of the base body 10 may become too large.

[0050] From this point forward, unless otherwise specified, the explanation of the joining method that allows for overhang will be based on the former case shown in Figure 3E. Note that any part of the explanation based on the former case that corresponds to Figure 3H or Figure 3I will also apply to the explanation based on the latter case.

[0051] In the bonding method that involves overhang, the nozzle 32 of the bonding apparatus 3 has a size such that at least a portion of the outer edge of the tip of the nozzle 32 extends beyond the bonding surface of the member to be mounted 1. The outer edge of the tip of the nozzle 32 is partially or entirely larger than the bonding surface of the member to be mounted 1. Here, the statement that the outer edge of the nozzle 32 is partially larger than the bonding surface means that the maximum length of the outer edge shape of the tip of the nozzle 32 is greater than the length of the bonding surface of the member to be mounted 1 in at least one direction. Alternatively, it means that the minimum length of the bonding surface of the member to be mounted 1 is smaller than the length of the outer edge shape of the tip of the nozzle 32 in at least one direction. Note that even if "outer edge of the tip of the nozzle 32" is replaced with "outer edge shape of the tip surface 35", it can be said that at least a portion of it extends beyond the bonding surface of the member to be mounted 1. In the bonding apparatus 3 shown in the figure, the outer edge of the tip surface 35 is also the outer edge of the tip of the nozzle 32.

[0052] For example, if the joint surface of the component to be mounted 1 is rectangular and the outer edge shape of the tip surface 35 is circular, the diameter of the outer edge of the tip surface 35 is larger than the shorter side of the rectangle. Also, this diameter is smaller than the longer side of the rectangle. At least a portion of the outer edge of the tip of the nozzle 32 protrudes from two opposing longer sides of the joint surface of the component to be mounted 1. Note that this diameter may be larger than the longer side of the rectangle. In this case, at least a portion of the outer edge of the tip of the nozzle 32 protrudes from all four sides of the joint surface of the component to be mounted 1.

[0053] The bonding material 2 discharged from the discharge section 33 fills the space between the mounting surface of the base body 10 and the internal section 34. Subsequently, by withdrawing the bonding device 3, the bonding material 2 is applied to the mounting surface of the base body 10.

[0054] At the stage when the bonding apparatus 3 is lifted, the bonding material 2 applied to the mounting surface of the substrate 10 is larger than the outer edge of the tip surface 35. Figures 3D and 3F show the size of the bonding material 2 applied to the mounting surface of the substrate 10 in bonding methods that do not allow overflow and bonding methods that allow overflow, respectively.

[0055] As shown in Figures 3D and 3F, the outer edge of the bonding material 2 is outside the outer edge of the tip surface 35. Also, at least a portion of the bonding material 2 protrudes from the joint surface of the component to be mounted on the base 10. In other words, the bonding material 2 is applied to the mounting surface of the base 10 in a size and shape such that at least a portion of the outer edge of the bonding material 2 protrudes from the joint surface of the component to be mounted 1.

[0056] As shown in Figure 3E, the application position of the bonding material 2 by the bonding device 3 may be determined such that at least a portion of the outer edge of the tip surface 35 protrudes from the member to be mounted 1, and then, as shown in Figure 3G, the bonding material 2 may be provided so that it remains inside the outer edge of the tip surface 35. In this case as well, the bonding material 2 is applied in a size and shape such that at least a portion of the bonding material 2 protrudes from the bonding surface of the member to be mounted 1 which is mounted on the base body 10.

[0057] In the bonding method that prevents overflow, the outer edge of the bonding material 2 applied so that the outer edge of the tip surface 35 fits within the bonding surface of the member to be mounted 1 will, at least a portion of it, protrude from the bonding surface of the member to be mounted 1 when the bonding device 3 is lifted up. In other words, in the bonding method that prevents overflow, the bonding material 2 is applied to the mounting surface of the base body 10 so that, when the bonding material 2 applied to the mounting surface of the base body 10 is separated from the bonding device 3, at least a portion of the bonding material 2 applied to the mounting surface of the base body 10 protrudes from the bonding surface of the member to be mounted 1.

[0058] The bonding material 2 applied to the mounting surface of the base body 10 has a raised central region 22 located directly below the discharge port. This raised portion is formed by the pulling action of the bonding device 3. The bonding material 2 applied to the base body 10 has an outer peripheral region 21 that is flat and has a nearly constant thickness, and a central region 22 that is surrounded by the outer peripheral region 21 and rises from the outer peripheral region 21.

[0059] The outer peripheral region 21 of the bonding material 2 can be formed such that its thickness (height) from the mounting surface of the base body 10 is less than 50 μm. However, it is not required to be less than 50 μm, and it is preferable that the thickness of the outer peripheral region 21 be formed to be between 5 μm and 80 μm. This makes it possible to suppress the maximum height of the bonding material 2 when the member to be mounted 1 is bonded.

[0060] The central region 22 of the joining material 2 is a region located more centrally than the outer region 21. The central region 22 is surrounded by the outer region 21. When viewed from above, the central region 22 is a region of size and shape that fits within the joining surface of the component to be mounted 1.

[0061] The central region 22 has a greater thickness (height) from the mounting surface of the substrate 10 than the outer region 21. The maximum thickness in the central region 22 is 100 μm or more. This allows the bonding material 2 in the central region 22 to protrude sufficiently. However, the maximum thickness of the central region 22 may be less than 100 μm.

[0062] The maximum thickness of the central region 22 is preferably 50 μm or more greater than the maximum thickness of the outer peripheral region 21. If the difference in thickness between the central region 22 and the outer peripheral region 21 is small, the bonding material 2 of the central region 22 may not protrude sufficiently from the bonding surface, making it difficult to confirm that a stable bonding state has been achieved.

[0063] (Joining method: The process of joining the components to be mounted) In step S2, which involves joining the components to be mounted, the component to be mounted 1 is positioned at a predetermined location on the mounting surface of the base body 10, starting from above the mounting surface of the base body 10. In relation to the component to be mounted 1 located above the mounting surface of the base body 10, the joining material 2, when viewed from above, has its central region 22 covered by the component to be mounted 1, and at least a portion of its outer edge protrudes from the component to be mounted 1.

[0064] The bonding material 2 applied to the base body 10 is sandwiched and pressed between the mounting surface of the base body 10 and the joining surface of the member to be mounted 1. This pressing causes at least a portion of the bonding material 2 to protrude from the joining surface of the member to be mounted 1. In other words, a portion of the bonding material 2 protrudes from the joining surface of the member to be mounted 1 during the bonding material application step S1, and a further portion of the bonding material 2 protrudes from the joining surface of the member to be mounted 1 during the joining step S2 of the member to be mounted 1.

[0065] The bonding material 2 in the central region 22 is pushed outwards. A portion of the bonding material 2 in the central region 22 protrudes from the mounted member 1 when viewed from above. The outer edge of the bonding material 2 after pressing is defined further outwards than the outer peripheral region 21 of the bonding material 2 applied in step S1 of applying the bonding material. The bonding material 2 is hardened with the bonding material 2 protruding, and the mounted member 1 is joined to the base 10.

[0066] Furthermore, even before the bonding material 2 protrudes due to pressing, at least a portion of the bonding material 2 in the outer peripheral region 21 is of a size and shape that protrudes from the bonding surface of the mounted member 1. Therefore, after pressing, both the bonding material 2 applied to the outer peripheral region 21 and the bonding material 2 applied to the central region 22 will protrude from the mounted member 1.

[0067] The bonding material 2 protrudes from at least 50% of the outer edge of the joint surface of the mounted member 1 by pressing. Here, the portion that protrudes due to pressing is at least 50%, and the portion that protruded from the joint surface even without pressing is not considered. It is preferable that the bonding material 2 protrudes from at least two-thirds of the outer edge of the joint surface of the mounted member 1 by pressing. The degree of bonding of the bonding material 2 can be determined by the degree of protrusion, and when confirming that the joint is sufficiently bonded using this method, a larger ratio of the portion of the bonding material 2 that protrudes to the total length of the outer edge indicates that the joint is more stable.

[0068] In a joining method that prevents overhang, comparing the state of the joining material 2 before pressing with the state in which the member to be mounted 1 is joined to the base body 10, the proportion of the joining material 2 overhanging from the outer edge of the joining surface of the member to be mounted 1 is greater in the joined state. In the state in which the joining material 2 overhangs due to pressing, or in the state in which the member to be mounted 1 is joined to the base body 10, the joining material 2 is made to overhang from at least two sides of the rectangular joining surface of the member to be mounted 1 by pressing. Preferably, these two sides are opposite sides. Alternatively, it may be made to overhang from three sides or even four sides.

[0069] In the joining method that causes the joining material to protrude, when comparing the state of the joining material 2 before pressing with the state in which the member to be mounted 1 is joined to the base body 10, the proportion of the joining material 2 protruding from the outer edge of the joining surface of the member to be mounted 1 is equal or greater in the joined state. In the state in which the joining material 2 protrudes due to pressing, or in the state in which the member to be mounted 1 is joined to the base body 10, the joining material 2 is made to protrude from at least two sides of the rectangular joining surface of the member to be mounted 1 by pressing. Preferably, these two sides are opposite sides. Alternatively, it may be made to protrude from three sides or even four sides.

[0070] Furthermore, for a rectangular mounting member 1 with a joint surface, it is preferable that the number of sides of the joining material 2 that protrude when the mounting member 1 is joined to the base 10 is greater than the number of sides of the joining material 2 that protrude when the joining material 2 is joined to the base 10.

[0071] Here, the portion of the joining material 2 that protrudes from the joining surface of the member to be mounted 1 when viewed from above is referred to as the protruding portion 24 of the joining material 2. On the other hand, the portion that does not protrude from the joining surface of the member to be mounted 1 and is provided between the base 10 and the member to be mounted 1 is referred to as the intervening portion 23.

[0072] When using adhesive material 2 with a viscosity of 40 Pa·s or more and 120 Pa·s or less, the excess portion of adhesive material 2 will have a bulging shape outwards. Note that this bulging shape can occur even with adhesive material 2 that does not have a viscosity of 40 Pa·s or more and 120 Pa·s or less.

[0073] With the component to be mounted 1 joined to the base 10, the protruding portion 24 of the joining material 2 is in contact with the side surface of the component to be mounted 1 that intersects with the joining surface. The highest point of the joining material 2 from the mounting surface of the base 10 is located outside the side surface of the component to be mounted 1. In other words, this highest point is located away from the side surface of the component to be mounted 1. The highest point of the joining material 2 in the region in contact with the side surface of the component to be mounted 1 from the mounting surface of the base 10 is lower than the highest point of the protruding portion 24 of the joining material 2.

[0074] When the component to be mounted 1 is joined to the base 10, or when the joining material 2 has hardened, the shape of the joining material 2 will be as shown in Figure 4A or Figure 4B. The respective shapes will now be explained.

[0075] Figure 4A is a side view showing an example of a state in which the member to be mounted 1 is joined to the base body 10. In Figure 4A, the case in which the member to be mounted 1 is joined to the base body 10 is shown such that the outer edge of the overflow portion 24 of the joining material 2 produced in the joining process S2 is located outside the outer edge of the joining material 2 applied in the joining material application process S1. In this case, the overflow portion 24 of the joining material 2 appears as a single step.

[0076] This shape of the joining material 2 is formed when joining is done using a method that does not allow for overhang. However, it can also be formed when joining is done using a method that allows for overhang.

[0077] The overhang portion 24 of the bonding material 2 includes the bonding material 2 applied to the outer peripheral region 21 and the bonding material 2 applied to the central region 22 in the bonding material application step S1. The maximum distance from the bonding surface of the mounted member 1 to the outer edge of the overhang portion 24 of the bonding material 2 is greater than 1 and less than or equal to 5 times the maximum distance from the bonding surface of the mounted member 1 to the outer edge of the bonding material 2 at the stage applied in the bonding material application step S1. Preferably, it is 3 times or less. This makes it possible to reduce the amount of bonding material 2 applied.

[0078] Figure 4B is a side view showing another example of the state in which the member to be mounted 1 is joined to the base body 10. In Figure 4B, the case in which the member to be mounted 1 is joined to the base body 10 is shown such that the outer edge of the overflow portion 24 of the joining material 2 produced in the joining process S2 is located inside the outer edge of the joining material 2 applied in the joining material application process S1. In this case, the overflow portion 24 of the joining material 2 has a two-tiered shape in appearance.

[0079] This shape of the joining material 2 is formed when joining using a joining method that allows for overhang. However, it can also be formed when joining using a joining method that does not allow for overhang.

[0080] In the protruding portion 24 of the bonding material 2, the lower tier 26 of the two-tiered shape includes the bonding material 2 applied to the outer peripheral region 21 in step S1 of applying the bonding material, but does not include the bonding material 2 applied to the central region 22. Therefore, the thickness of the lower tier 26 of the two-tiered shape is equal to the thickness of the outer peripheral region 21. Here, "equal" allows for a difference in thickness that may fluctuate due to the hardening of the bonding material 2.

[0081] The upper tier 25 of the two-tiered structure includes the bonding material 2 applied to the outer peripheral region 21 and the bonding material 2 applied to the central region 22 in the bonding material application process S1. The maximum height of the base body 10 from the mounting surface in the upper tier 25 of the two-tiered structure is between 2 and 20 times the maximum height of the base body 10 from the mounting surface in the lower tier 26 of the two-tiered structure.

[0082] In the two-tiered shape, the outermost point of the upper tier 25 is located outside and above the connection point between the upper tier 25 and the lower tier 26, and the apex of the upper tier 25 is located away from the side surface of the component to be mounted 1. The connection point between the upper tier 25 and the lower tier 26 can be defined as the intersection point between the outer peripheral region 21 of the bonding material 2 applied in step S1 of applying the bonding material and the bonding material 2 that protrudes during step S2 of joining the component to be mounted.

[0083] The distance from a virtual plane containing the side surface of the mounted member 1 to which the upper tier 25 of the two-tiered structure abuts is to the outermost point of the lower tier 26 of the two-tiered structure in a direction perpendicular to this plane, is greater than 1 and less than or equal to 3 times the distance to the outermost point of the upper tier 25 of the two-tiered structure in a direction perpendicular to this plane. Preferably, it is 1.5 times or less. This makes it possible to suppress the degree of overhang of the upper tier 25 relative to the degree of overhang of the lower tier 26 of the two-tiered structure.

[0084] Next, the joining method according to this embodiment will be described in comparison with a conventional joining method. First, the conventional joining method will be described. Figures 5A to 5C are diagrams illustrating the shape of the joining material 2 applied by the conventional joining method. Figure 5A is a top view showing the application area of ​​the joining material 2 to the member to be mounted 1 placed on the base body 10. Figure 5B is a cross-sectional view showing the shape of the joining material 2 applied to the base body 10. Figure 5C is a side view showing the state in which the member to be mounted 1 is joined to the base body 10 by this conventional joining method.

[0085] As shown in Figure 5A, in the conventional joining method, the joining material 2 is applied only to the central region 22. The joining material 2 is applied well inward from the outer edge of the joining surface of the component to be mounted 1. Also, as shown in Figure 5B, in the conventional joining method, the joining material 2 is applied to the central region 22 in a teardrop shape. Then, as shown in Figure 5C, the joining material 2 hardens with a portion of it protruding from the component to be mounted 1 as it is compressed by the component to be mounted 1.

[0086] Thus, in conventional joining methods, the process does not take into account the shape of the joining surface of the component to be mounted 1 and apply the joining material 2 to cover a sufficient area of ​​the joining surface. As a result, the amount of joining material 2 applied tends to be greater than in the joining method according to the embodiment.

[0087] For example, one method for determining whether the component to be mounted 1 is stably joined to the base 10 by the bonding material 2 is to check whether the bonding material 2 protrudes from the component to be mounted 1. When using this determination method, in order to prevent an increase in bonding defects, it is necessary to adjust the amount of bonding material 2 applied so that it protrudes from the component to be mounted 1.

[0088] This adjustment must take into account variations in the amount of bonding material 2 applied by the bonding device. Furthermore, it must be considered that due to differences in how force is applied to the bonding material 2 by pressing, the bonding material 2 does not always spread in the same direction and overflow by the same amount. As with conventional methods, if the distance over which the bonding material 2 overflows onto the mounted member 1 is long, these effects become larger. Therefore, the bonding method according to this embodiment can reduce the amount of bonding material 2 applied compared to conventional bonding methods.

[0089] Figure 6 shows the results of comparing the amount of adhesive required to maintain stable joint strength. The determination of whether or not stable joint strength is present was made if the following two conditions were met. The first condition is that when a force is applied from the side to the mounted member 1 after joining, the force at which the mounted member 1 is peeled from the base 10 is greater than or equal to a predetermined threshold. The threshold can be set as appropriate, but in this determination, it was set to 2 kgf. The second condition is that when the mounted member 1 is peeled from the base 10, the adhesive 2 is evenly applied to both the joining surface and the mounting surface within the area contained by the outer edge of the adhesive 2. Figure 7A is an example of a state that satisfies this condition, and Figure 7B is an example of a state that does not satisfy this condition.

[0090] As shown in Figure 6, in the joining method according to the embodiment, the amount of single-stage joining material 2 applied is reduced by approximately 40%, and the amount of double-stage joining material 2 applied is reduced by more than 20% compared to the conventional joining method. Thus, the joining method according to the embodiment can stably join the components to be mounted with a smaller amount of joining material compared to the conventional joining method.

[0091] Furthermore, differences may arise not only in terms of the amount of adhesive 2 applied, but also in the shape of the adhesive 2 when the mounted member 1 is joined, compared to conventional joining methods. Figure 8A is an image showing an example of the state in which the mounted member 1 is joined to the base 10 by a joining method that does not allow the adhesive to protrude. Figure 8B is an image showing an example of the state in which the mounted member 1 is joined to the base 10 by a joining method that allows the adhesive to protrude. Figure 8C is an image showing an example of the state in which the mounted member 1 is joined to the base 10 by a conventional joining method.

[0092] Comparing Figure 8A and Figure 8C, it can be seen that there is a difference in the shape of the protruding portion 24 of the bonding material 2. In the bonding method according to the embodiment, the amount of bonding material 2 applied can be reduced, and therefore the height of the bonding material 2 that protrudes from the bonding surface of the mounted member 1 is reduced accordingly.

[0093] In conventional joining methods, the maximum height of the joining material 2 protruding from the side surface of the component 1 was greater than the height of the joining material 2 in contact with the side surface of the component 1 to be mounted, in the range of 150 μm to 200 μm. On the other hand, in the joining method that prevents protrusion according to the embodiment, the maximum height of the joining material 2 protruding from the side surface of the component 1 is limited to being greater than the height of the joining material 2 in contact with the side surface of the component 1 to be mounted, in the range of 80 μm to 120 μm.

[0094] Figure 8B shows that, compared to Figure 8C, the protruding portion 24 of the bonding material 2 is formed more outward from the side surface of the component to be mounted 1. This is thought to be because a two-tiered lower layer is provided when the bonding material 2 is applied, and the central region 22 of the bonding material 2 spreads outward on top of this lower layer. In other words, it is thought that it is easier for the bonding material 2 to spread on top of the same bonding material 2 than to spread on the mounting surface of the base body 10.

[0095] By causing the joining material 2 to bulge outward, the maximum height of the joining material 2 in the protruding portion can be reduced. In other words, when the maximum height of the joining material 2 in the protruding portion is the same for both the conventional joining method and the protruding joining method according to the embodiment, the distance from the mounted member 1 to the maximum height of the joining material 2 is longer for the protruding joining method according to the embodiment than for the conventional joining method.

[0096] <Light-emitting device manufactured by the manufacturing method according to the embodiment> Next, a light-emitting device according to an embodiment will be described. The light-emitting device according to an embodiment is manufactured by a manufacturing method including the joining method described above. The light-emitting device can be considered an example of a device in the device manufacturing method described above. Figure 9 is a perspective view of a light-emitting device 100, which is an example of a light-emitting device according to an embodiment. Figure 10 is a top view of the light-emitting device 100. Figure 11 is a top view of the light-emitting device 100 with some components removed in order to explain the internal structure.

[0097] The light-emitting device 100 comprises a base 10A, a plurality of light-emitting elements 101, a plurality of submounts 1A, one or more light-reflecting members 1B, a plurality of protective elements 102, a sealing member 103, and a lens member 104, among other components. The light-emitting device 100 may further have other components.

[0098] Next, we will explain each component. (Base 10A) The base 10A has a base portion and a side wall projecting upward from the base portion. The base portion and the side wall form a concave shape with the inside of the side wall recessed. The base portion has a mounting surface, and the side wall surrounds the mounting surface. The base 10A is an example of the base 10 described in the joining method according to the embodiment.

[0099] The substrate 10A can be formed from a ceramic material such as silicon nitride, aluminum nitride, or silicon carbide. It can also be formed from a metallic material such as iron, iron alloy, or copper. Furthermore, the substrate 10A can be formed by joining together a base and side walls made of different materials.

[0100] (light-emitting element 101) The light-emitting element 101 has a light-emitting surface from which light is emitted. For example, a semiconductor laser element can be used as the light-emitting element 101. The light-emitting element 101 has a top surface, a bottom surface, and one or more sides. One side of the light-emitting element 101 is the light-emitting surface. The light-emitting surface of the light-emitting element 101 may be on any other surface.

[0101] The emission peak wavelength of the light-emitting element 101 is in the range of 320 nm to 530 nm, typically in the range of 430 nm to 480 nm. As such a light-emitting element 101, for example, a semiconductor element containing a nitride semiconductor can be used. Examples of nitride semiconductors that can be used include GaN, InGaN, and AlGaN. However, the emission peak wavelength of the light-emitting element 101 is not limited to this wavelength range.

[0102] (Submount 1A) Submount 1A is an example of the member to be mounted 1 described in the joining method according to the embodiment. Submount 1A has a bottom surface, a top surface, and one or more sides. The bottom surface of submount 1A is the joining surface. Submount 1A has the smallest width in the vertical direction. Submount 1A is also configured in the shape of a rectangular parallelepiped. However, the shape is not limited to a rectangular parallelepiped.

[0103] Submount 1A has a thickness of 150 μm to 500 μm. Submount 1A is formed using, for example, silicon nitride, aluminum nitride, or silicon carbide. Other materials may also be used. The conductive region of submount 1A can be formed by providing, for example, Ti / Pt / Au. The bonding region of submount 1A can be formed by providing Pt / AuSn in a part of the region where Ti / Pt / Au is provided.

[0104] (Light-reflecting member 1B) The light-reflecting member 1B has a bonding surface and a light-reflecting surface inclined with respect to the bonding surface. The light-reflecting surface has, for example, a reflectance of 90% or more with respect to the peak wavelength of the irradiated light. The light reflectance here can be 100% or less or less than 100%.

[0105] The light-reflecting member 1B can use glass, metal, or other materials as the main material that forms its outer shape. The main material should preferably be heat-resistant; for example, glass such as quartz or BK7 (borosilicate glass), metals such as aluminum, or Si can be used. The light-reflecting surface can be formed using, for example, metals such as Ag or Al, or dielectric multilayer films such as Ta2O5 / SiO2, TiO2 / SiO2, or Nb2O5 / SiO2. Note that the term "main material" refers to the material with the highest proportion when multiple materials are used, but to that single material when only one material is used.

[0106] (Protection element 102) The protection element 102 is a circuit element that prevents excessive current from flowing through a specific element (e.g., the light-emitting element 101) and causing it to be destroyed. A typical example of the protection element 102 is a constant voltage diode such as a Zener diode. For example, a Si diode can be used as the Zener diode.

[0107] (Sealing member 103) The sealing member 103 has an upper surface and a lower surface. The sealing member 103 is translucent from the upper surface to the lower surface. Translucency means that the transmittance of the main light incident thereon is 80% or more.

[0108] The sealing member 103 may be partially translucent. For example, the sealing member 103 may have a non-translucent frame having one or more openings, and one or more translucent members that cover one or more openings in the frame.

[0109] The main material of the sealing member 103 can be, for example, a translucent material such as glass, sapphire, or quartz. The main material of the frame can be, for example, metal, and the translucent member can be made from the translucent material mentioned above.

[0110] (Lens component 104) The lens member 104 has an upper surface and a lower surface. The lens member 104 has multiple lens surfaces. The multiple lens surfaces are formed on the upper surface side of the lens member 104. It can be said that the upper surface of the lens member 104 is composed of multiple lens surfaces. In the lens member 104, the portion that forms each lens surface is called the lens portion.

[0111] The lens member 104 may have multiple lens surfaces arranged in an array. The lens member 104 may have multiple lens surfaces arranged in a matrix. The multiple lens surfaces have at least two or more lens surfaces arranged side by side. The lens member 104 can be formed using a translucent material such as glass or synthetic quartz.

[0112] (Light-emitting device 100) Next, the light-emitting device 100 will be described. In the light-emitting device 100, each of the multiple light-emitting elements 101 is mounted on a submount 1A. One or more light-emitting elements 101 are mounted on a single submount 1A. In the illustrated example of the light-emitting device 100, one light-emitting element 101 is mounted on each of the multiple submounts 1A.

[0113] In the light-emitting device 100, the submount 1A on which the light-emitting element 101 is mounted is positioned on the mounting surface of the base body 10A. The bonding surface of the submount 1A is bonded to the mounting surface of the base body 10A via the bonding material 2 by the bonding method described above. In the light-emitting device 100, the portion where the bonding material 2 is provided is referred to as the bonding portion 2A.

[0114] In the light-emitting device 100, for example, a two-tiered joint portion 2A is formed by the overhanging joining method described above. In a cross-sectional view where the joining surface passes through a hypothetical straight line connecting the centers of two opposing sides of the rectangular submount 1A, the joint portion 2A of the light-emitting device 100 has a two-tiered shape, with the outermost point of the upper tier located outside and above the connection point between the upper and lower tiers, and the apex of the upper tier located away from the side surface of the submount.

[0115] In the light-emitting device 100, the light-reflecting members 1B are placed on the mounting surface of the substrate 10A. The bonding surfaces of one or more light-reflecting members 1B are bonded to the mounting surface of the substrate 10A via the bonding material 2 by the bonding method described above. The light-reflecting members 1B are positioned so that their light-reflecting surfaces face the light-emitting surfaces of the light-emitting elements 101. A light-reflecting member 1B can be individually placed for each of the multiple light-emitting elements 101.

[0116] Since the light-emitting elements 101 and the light-reflecting members 1B corresponding to each light-emitting element 101 are arranged in close proximity, the bonding method described above reduces the amount of bonding material 2 applied, making it less likely for the bonding material 2 joining adjacent mounted members 1 to interfere with each other. This makes it less likely for the bonding material 2 to bulge due to interference, causing current leakage, or to obstruct light directed toward the light-reflecting surface. As a result, the quality of the light-emitting device 100 is stabilized. Therefore, devices such as light-emitting devices can be provided with stable quality.

[0117] In the light-emitting device 100, the protective elements 102 are mounted on the submount 1A. Each of the multiple protective elements 102 is positioned corresponding to one of the multiple light-emitting elements 101. Each protective element 102 is positioned near the corresponding light-emitting element 101.

[0118] In the light-emitting device 100, the sealing member 103 is joined to the base body 10A. The lower surface of the sealing member 103 is joined to the upper surface of the base body 10A. A sealing space is formed by joining the base body 10A and the sealing member 103. The sealing member 103 is joined by a method different from the joining method described above. For example, the sealing member 103 is joined to the base body 10A using AuSn solder.

[0119] The light-emitting element 101 is confined within this sealing space. A sealed space can also be formed by joining the substrate 10A and the sealing member 103 under a predetermined gaseous atmosphere. By confining the light-emitting element 101 within this sealing space, dust collection on the light-emitting surface of the light-emitting element 101 can be suppressed, thereby preventing a decrease in luminous efficiency. Light reflected by the light-reflecting member 1B passes through the sealing member 103.

[0120] In the light-emitting device 100, the lens member 104 is located above the plurality of light-emitting elements 101. The lens member 104 is positioned above the sealing member 103. The lens member 104 is joined to the sealing member 103. The lens member 104 is joined by a method different from the joining method described above. For example, the lens member 104 is joined to the sealing member 103 using a UV-curable adhesive. The lens member 104 is positioned so that light emitted from each light-emitting element 101 passes through each lens surface before being emitted.

[0121] As explained above, the present invention, having the technical features disclosed in the specification, is not limited to the structures described in each embodiment of the specification. For example, the present invention can be applied to light-emitting devices having components not disclosed in the embodiments, and differences from the disclosed structure do not constitute grounds for the invention being inapplicable. Furthermore, from the perspective of the minimum components necessary to complete the invention, it can be said that some components of the light-emitting device disclosed in the embodiments may not be essential.

[0122] This means that the light-emitting devices disclosed in the embodiments of this specification include not only the viewpoint of completing the invention, but also the viewpoint of disclosing a rational configuration for a particular use case. While the application of the invention is not limited to its exemplary use case, there are aspects in which it works more effectively when applied to that use case.

[0123] From this perspective, it may not be necessary to include all the components disclosed in one embodiment of the present invention (claims). For example, if some components of the light-emitting device disclosed in the embodiment are not described in the claims, we request that a person skilled in the art be allowed design freedom for those components, such as substitution, omission, modification of shape, or change of material, and that the invention described in the claims be applied in such a manner. [Industrial applicability]

[0124] The joining method described in the embodiment can be incorporated into a manufacturing method when manufacturing devices such as light-emitting devices. Furthermore, the light-emitting device described in the embodiment can be used in a projector. In other words, a projector is one application to which the present invention is applied. However, the present invention is not limited to this and can be used as a light source for lighting, in-vehicle headlights, head-mounted displays, and other display backlights. Moreover, the device described in the embodiment is not limited to a light-emitting device and can be used for purposes other than light sources. [Explanation of Symbols]

[0125] 1. Components to be mounted 2 Bonding material 21 Outer area 22 Central area 23 Intervening part 24. Overhang 25 Upper section 26 Lower section 3 Bonding equipment 31 Syringe 32 nozzles 33 Discharge part 34. Internal part 35 Tip surface 36 External surface 10 Base 100 Light-emitting devices 10A base 1A Submount 1B Light-reflecting member 2A joint 101 Light-emitting element 102 Protective element 103 Sealing member 104 Lens component

Claims

1. A bonding material for bonding the mounting surface of a base body and the bonding surface of a member to be mounted to fix the member to be mounted in a predetermined position on the base body is dispensed from a nozzle of a bonding apparatus, the nozzle having a shape and size such that the outer edge of the tip surface of the nozzle does not protrude from the bonding surface, and the bonding material is applied to the mounting surface using the nozzle such that only a portion of the outer edge of the bonding material protrudes from the bonding surface. The steps include: positioning the member to be mounted at a predetermined position on the base, pressing at least a portion of the bonding material sandwiched between the mounting surface and the bonding surface to cause it to protrude further from the outer edge of the bonding surface, excluding a portion of the outer edge, thereby bonding the member to be mounted to the base; A method for manufacturing a device that includes [a specific component].

2. A bonding material for bonding the mounting surface of a base body and the bonding surface of a member to be mounted to fix the member to be mounted in a predetermined position on the base body is dispensed from the nozzle of a bonding apparatus, the nozzle tip having a size and shape that does not extend beyond the bonding surface, and the bonding material is applied to the mounting surface in such a size and shape that only a portion of the outer edge of the bonding material extends beyond the bonding surface. The steps include: positioning the member to be mounted at a predetermined position on the base, pressing at least a portion of the bonding material sandwiched between the mounting surface and the bonding surface to cause it to protrude further from the outer edge of the bonding surface, excluding a portion of the outer edge, thereby bonding the member to be mounted to the base; Includes, A method for manufacturing a device, comprising the step of applying the bonding material, wherein the bonding material has a maximum outer edge shape length of 0.5 mm or more and 2 mm or less.

3. A bonding material for bonding the mounting surface of a base body and the bonding surface of a member to be mounted to fix the member to be mounted in a predetermined position on the base body is dispensed from the nozzle of a bonding apparatus, the nozzle tip having a size and shape that does not extend beyond the bonding surface, and the bonding material is applied to the mounting surface in such a size and shape that only a portion of the outer edge of the bonding material extends beyond the bonding surface. The steps include: positioning the member to be mounted at a predetermined position on the base, pressing at least a portion of the bonding material sandwiched between the mounting surface and the bonding surface to cause it to protrude further from the outer edge of the bonding surface, excluding a portion of the outer edge, thereby bonding the member to be mounted to the base; Includes, A method for manufacturing a device, wherein the area of ​​the outer edge shape of the tip surface of the nozzle is 75% or more and 100% or less of the area of ​​the bonding surface.

4. The joining surface is a rectangle having a long side and a short side, In the step of applying the bonding material, the outer edge of the bonding material is of a size and shape that extends beyond the two long sides that are opposite sides of the bonding surface. The manufacturing method according to any one of claims 1 to 3, wherein in the step of joining the member to be mounted to the base body, at least a portion of the joining material protrudes further from at least one of the two short sides that are opposite sides of the joining surface due to pressing.

5. In the step of applying the bonding material, the bonding material is applied to the substrate such that an outer peripheral region is formed, the thickness from the mounting surface is less than 50 μm, and a central region is located in the center of the outer peripheral region, the thickness from the mounting surface is greater than that of the outer peripheral region, and the maximum thickness is 100 μm or more. The manufacturing method according to any one of claims 1 to 4, wherein in the step of joining the member to be mounted to the base body, the member to be mounted is positioned at a predetermined position on the mounting surface from a position above the mounting surface, such that, in a top view, the central region is covered by the member to be mounted and a part of the outer edge of the joining material protrudes from the member to be mounted, and the member to be mounted is joined to the base body such that a part of the joining material in the central region protrudes from the joining surface by pressing.

6. A bonding material for bonding the mounting surface of a base body and the bonding surface of a member to be mounted to fix the member to be mounted in a predetermined position on the base body is dispensed from the nozzle of a bonding apparatus, the nozzle tip having a size and shape that does not extend beyond the bonding surface, and the bonding material is applied to the mounting surface in such a size and shape that only a portion of the outer edge of the bonding material extends beyond the bonding surface. The steps include: positioning the member to be mounted at a predetermined position on the base, pressing at least a portion of the bonding material sandwiched between the mounting surface and the bonding surface to cause it to protrude further from the outer edge of the bonding surface, excluding a portion of the outer edge, thereby bonding the member to be mounted to the base; Includes, In the step of applying the bonding material, the bonding material is applied to the substrate such that an outer peripheral region is formed, the thickness from the mounting surface is less than 50 μm, and a central region is located in the center of the outer peripheral region, the thickness from the mounting surface is greater than that of the outer peripheral region, and the maximum thickness is 100 μm or more. A method for manufacturing a device, comprising the step of joining the member to be mounted to the base body, wherein the member to be mounted is positioned at a predetermined location on the mounting surface above the mounting surface, such that, in a top view, the central region is covered by the member to be mounted and a portion of the outer edge of the joining material protrudes from the member to be mounted, and the member to be mounted is joined to the base body such that a portion of the joining material in the central region protrudes from the joining surface by pressure.

7. The manufacturing method according to claim 5 or 6, wherein in the step of joining the member to be mounted to the base body, at least a portion of the joining material in the central region is pressed so that it protrudes from at least two opposing short sides of the rectangular joining surface, thereby joining the member to be mounted to the base body.

8. The joining surface is a rectangle having a long side and a short side, In the step of applying the bonding material, the outer edge of the bonding material is of a size and shape that extends beyond the two long sides that are opposite sides of the bonding surface. The manufacturing method according to any one of claims 1 to 7, wherein in the step of joining the member to be mounted to the base body, the outer edge of the portion that protrudes from the long side of the joining surface by pressing is located inside the outer edge of the joining material applied in the step of applying the joining material.

9. The manufacturing method according to claim 8, wherein in the step of joining the member to be mounted to the base body, the maximum height of the joining material from the base body in the portion that protrudes from the long side of the joining surface by pressing is 2 times or more and 20 times or less the maximum height of the joining material from the base body outside the portion that protrudes from the long side of the joining surface by pressing.

10. A bonding material for bonding the mounting surface of a base body and the bonding surface of a member to be mounted to fix the member to be mounted in a predetermined position on the base body is dispensed from the nozzle of a bonding apparatus, the nozzle tip having a size and shape that does not extend beyond the bonding surface, and the bonding material is applied to the mounting surface in such a size and shape that only a portion of the outer edge of the bonding material extends beyond the bonding surface. The steps include: positioning the member to be mounted at a predetermined position on the base, pressing at least a portion of the bonding material sandwiched between the mounting surface and the bonding surface to cause it to protrude further from the outer edge of the bonding surface, excluding a portion of the outer edge, thereby bonding the member to be mounted to the base; Includes, The joining surface is a rectangle having a long side and a short side, In the step of applying the bonding material, the outer edge of the bonding material is of a size and shape that extends beyond the two long sides that are opposite sides of the bonding surface. In the step of joining the member to be mounted to the base body, the outer edge of the portion that protrudes from the long side of the joining surface due to pressing is located inside the outer edge of the joining material applied in the step of applying the joining material. A method for manufacturing a device, wherein, in the step of joining the member to be mounted to the base body, the maximum height of the joining material from the base body in the portion that protrudes from the long side of the joining surface by pressing is 2 times or more and 20 times or less the maximum height of the joining material from the base body outside the portion that protrudes from the long side of the joining surface by pressing.

11. The joining surface is a rectangle having a long side and a short side, In the step of applying the bonding material, the outer edge of the bonding material is of a size and shape that extends beyond the two long sides that are opposite sides of the bonding surface. The manufacturing method according to any one of claims 1 to 10, wherein in the step of joining the member to be mounted to the base body, the outer edge of the portion that protrudes from the long side of the joining surface by pressing is located outside the outer edge of the joining material applied in the step of applying the joining material.

12. A bonding material for bonding the mounting surface of a base body and the bonding surface of a member to be mounted to fix the member to be mounted in a predetermined position on the base body is dispensed from the nozzle of a bonding apparatus, the nozzle tip having a size and shape that does not extend beyond the bonding surface, and the bonding material is applied to the mounting surface in such a size and shape that only a portion of the outer edge of the bonding material extends beyond the bonding surface. The steps include: positioning the member to be mounted at a predetermined position on the base, pressing at least a portion of the bonding material sandwiched between the mounting surface and the bonding surface to cause it to protrude further from the outer edge of the bonding surface, excluding a portion of the outer edge, thereby bonding the member to be mounted to the base; Includes, The joining surface is a rectangle having a long side and a short side, In the step of applying the bonding material, the outer edge of the bonding material is of a size and shape that extends beyond the two long sides that are opposite sides of the bonding surface. A method for manufacturing a device, wherein, in the step of joining the member to be mounted to the base body, the outer edge of the portion that protrudes from the long side of the joining surface by pressing is located outside the outer edge of the joining material applied in the step of applying the joining material.

13. The manufacturing method according to claim 11 or 12, wherein the maximum distance from the long side of the joining surface to the outer edge of the joining material that is applied and extends beyond the long side of the joining surface in the step of applying the joining material is greater than 1 and less than or equal to 3 times the maximum distance from the long side of the joining surface to the outer edge of the portion that extends beyond the long side of the joining surface by pressing in the step of joining the member to be mounted to the base body.

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