Light-emitting module

Abstract

To provide a method of manufacturing a light-emitting module which suppresses scattering of emitted light, and to provide the light-emitting module.SOLUTION: The light emitting module includes a plurality of light emitting elements 1, a first mounting board 10 having first external connection terminals 11 and second external connection terminals 12 disposed on one side and the other side of an element mounting region 13 on which the light emitting elements are mounted, a second mounting board 20 having first wire connection terminals 21 and second wire connection terminals 22 disposed along one side and the other side of a substrate mounting region 23 on which the first mounting board is mounted, and a plurality of first wires 31 electrically connecting the first external connection terminals and the first wire connection terminals. A plurality of second wires 32 electrically connecting the second external connection terminals and the second wire connection terminals, and a dark-colored covering resin 40 covering the first wires and the second wires and surrounding the element mount region at positions adjacent to each other, wherein the covering resin has different heights between the tops of the first wires and the wires, and between the tops of the second wires and the wires.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present disclosure relates to a light-emitting module and a method for manufacturing the light-emitting module.

Background Art

[0002] Conventionally, light-emitting modules using a plurality of light-emitting elements have been used as in-vehicle light sources and light sources for projectors. When a light-emitting module is used, a configuration is adopted in which light is emitted through a lens on an optical path. In the light-emitting module, a black resin is disposed at a position distant from the light extraction surface of the light-emitting element, so that the surface of the resin can be processed, and light reflection may be prevented (for example, refer to Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the conventional light-emitting module, since the light-emitting element and the black resin are separated from each other, the suppression of scattered light is insufficient, and improvement in light extraction efficiency is demanded. An embodiment according to the present disclosure aims to provide a light-emitting module that suppresses scattered light and has excellent light extraction efficiency, and a method for manufacturing the light-emitting module.

Means for Solving the Problems

[0005] A light-emitting module according to the embodiment of the present disclosure includes: a first substrate having a plurality of light-emitting elements and an element mounting area on which the plurality of light-emitting elements are electrically connected and mounted, and further having a plurality of first external connection terminals located on one side of the element mounting area and a plurality of second external connection terminals located on the other side opposite the element mounting area, and a second substrate having a substrate mounting area on which the first substrate is mounted, and further having a plurality of first wire connection terminals located along one side of the substrate mounting area and a plurality of second wire connection terminals located along the other side opposite the substrate mounting area, and the first external connection terminals and the first wire connection terminals are electrically connected The device comprises a plurality of first wires connected to and arranged along one side of the first substrate, a plurality of second wires electrically connecting the second external connection terminal and the second wire connection terminal and arranged along the other side of the first substrate, and a dark-colored coating resin covering the plurality of first wires and the plurality of second wires and surrounding the element mounting area at adjacent positions, wherein in a cross-sectional view at a position connecting the tops of the plurality of first wires, the height of the coating resin between adjacent first wires is lower than the height at the point where the first wires are placed, and in a cross-sectional view at a position connecting the tops of the plurality of second wires, the height of the coating resin between adjacent second wires is lower than the height at the point where the second wires are placed.

[0006] A method for manufacturing a light-emitting module according to the embodiment of the present disclosure includes the steps of: placing a plurality of light-emitting elements on an element mounting area of ​​a first substrate; mounting and connecting the first substrate to a substrate mounting area of ​​a second substrate; connecting a plurality of first external connection terminals located on one side of the element mounting area outside the element mounting area of ​​the first substrate and a plurality of first wire connection terminals located along one side of the element mounting area outside the substrate mounting area of ​​the second substrate with a plurality of first wires; connecting a plurality of second external connection terminals located on the other side of the element mounting area outside the element mounting area of ​​the first substrate and a plurality of second wire connection terminals located along the other side of the substrate mounting area outside the substrate mounting area of ​​the second substrate with a plurality of second wires; and placing on the first substrate The process includes the steps of forming a dark-colored first resin frame in a position adjacent to and surrounding the element mounting area, inside the plurality of first external connection terminals and the plurality of second external connection terminals, and forming a dark-colored second resin frame on the second substrate outside the plurality of first wires and the plurality of second wires, surrounding the first substrate, and filling the space between the first resin frame and the second resin frame with a dark-colored coating resin having a lower viscosity than the first resin frame and the second resin frame, wherein the coating resin is formed such that, in a cross-sectional view along a line connecting the tops of the plurality of first wires, the height of the coating resin between adjacent first wires is lower than the height at the point where the first wire is placed, and in a cross-sectional view along a line connecting the tops of the plurality of second wires, the height of the coating resin between adjacent second wires is lower than the height at the point where the second wire is placed. [Effects of the Invention]

[0007] According to the embodiments of this disclosure, it is possible to provide a light-emitting module that suppresses scattered light and has excellent light extraction efficiency, as well as a method for manufacturing the same. [Brief explanation of the drawing]

[0008] [Figure 1]This is a schematic perspective view showing the entire light-emitting module according to the embodiment. [Figure 2] This is a schematic plan view showing the entire light-emitting module according to the embodiment. [Figure 3] This is a cross-sectional view along line III-III in Figure 2. [Figure 4] This is a cross-sectional view of the portion along the line IV-IV in Figure 2. [Figure 5] Figure 2 is an enlarged cross-sectional view schematically showing the second wire and the coating resin in an enlarged view. [Figure 6A] Figure 2 is a cross-sectional view along the VIA-VIA line. [Figure 6B] Figure 2 is a cross-sectional view along the VIB-VIB line. [Figure 7] This is an enlarged cross-sectional view schematically showing a magnified portion of the line VII-VII in Figure 2. [Figure 8] This is a schematic plan view showing the state of the first wire, second wire, and third wire in a light-emitting module according to an embodiment, with the coating resin between the first resin frame and the second resin frame removed. [Figure 9] This is a flowchart illustrating the manufacturing method of the light-emitting module according to the embodiment. [Figure 10A] This is a schematic plan view showing the first substrate in the manufacturing method of the light-emitting module according to the embodiment. [Figure 10B] This is a schematic plan view of the first substrate showing the state in which the light-emitting element in the manufacturing method of the light-emitting module according to the embodiment is placed on the element mounting area. [Figure 10C] This is a schematic diagram showing a magnified portion of the alignment state of the light-emitting elements in the manufacturing method of the light-emitting module according to the embodiment. [Figure 10D] This is a schematic plan view showing the second substrate in the manufacturing method of the light-emitting module according to the embodiment. [Figure 10E] This is a schematic plan view showing the state in which the first substrate is placed on the substrate mounting area of ​​the second substrate in the manufacturing method of the light-emitting module according to the embodiment. [Figure 10F]FIG. 2 is a plan view schematically illustrating a state in which a first wire is connected to a first external connection terminal and a first wire connection terminal, a second wire is connected to a second external connection terminal and a second wire connection terminal, and a third wire is connected to a first drive terminal and a second drive terminal, in the method for manufacturing a light-emitting module according to the embodiment. [Figure 10G] FIG. 3 is a plan view illustrating a state in which a first resin frame and a second resin frame are formed in the method for manufacturing a light-emitting module according to the embodiment. [Figure 11A] FIG. 4 is an explanatory view schematically showing, in cross-section, a height difference between the top position of the first wire and the position between the wires in the covering resin of the light-emitting module according to the embodiment. [Figure 11B] FIG. 5 is an explanatory view schematically showing, in cross-section, another embodiment for describing the height difference between the top position of the first wire and the position between the wires in the covering resin of the light-emitting module according to the embodiment. [Figure 11C] FIG. 6 is an explanatory view schematically showing, in cross-section, another embodiment for describing the height difference between the top position of the first wire and the position between the wires in the covering resin of the light-emitting module according to the embodiment. [Figure 12] FIG. 7 is a cross-sectional view schematically illustrating a modification of the second substrate of the light-emitting module according to the embodiment. [Mode for Carrying Out the Invention]

[0009] Hereinafter, the light-emitting device according to the embodiment will be described with reference to the drawings. Note that the sizes, positional relationships, and the like of members shown in the respective drawings may be exaggerated for clarity of explanation. In addition, the dimensions and arrangement positions of respective members may not strictly match between a plan view and a corresponding cross-sectional view. Further, in the following description, the directions of up, down, left, right, front and rear are relative, and do not indicate absolute directions. In principle, the same names and reference numerals denote the same or homogeneous members, and detailed descriptions thereof may be omitted as appropriate.

[0010] <First Embodiment> [Configuration of Light-Emitting Device] The configuration of the light-emitting device according to the embodiment will be described with reference to FIGS. 1 to 8. Figure 1 is a schematic perspective view showing the entire light-emitting module according to the embodiment. Figure 2 is a schematic plan view showing the light-emitting module according to the embodiment. Figure 3 is a cross-sectional view taken along line III-III in Figure 2. Figure 4 is a cross-sectional view of a portion taken along line IV-IV in Figure 2. Figure 5 is an enlarged cross-sectional view schematically showing the second wire and coating resin in Figure 2 in an enlarged view. Figure 6A is a cross-sectional view taken along line VIA-VIA in Figure 2. Figure 6B is a cross-sectional view taken along line VIB-VIB in Figure 2. Figure 7 is an enlarged cross-sectional view schematically showing the portion taken along line VII-VII in Figure 2 in an enlarged view. Figure 8 is a schematic plan view showing the state of the first wire, second wire and third wire in the light-emitting module according to the embodiment, with the coating resin between the first resin frame and the second resin frame removed.

[0011] The light-emitting module 100 has a plurality of light-emitting elements 1 and an element mounting area 13 on which the plurality of light-emitting elements 1 are electrically connected and mounted. Furthermore, outside the element mounting area 13, there is a plurality of first external connection terminals 11 located on one side of the element mounting area 13 and a plurality of second external connection terminals 12 located on the other side of the element mounting area 13. The module also has a substrate mounting area 23 (see Figure 10D) on which the first substrate 10 is mounted. Furthermore, outside the substrate mounting area 23, there is a plurality of first wire connection terminals 21 located along one side of the substrate mounting area 23. The first substrate 10 comprises a second substrate 20 having a plurality of second wire connection terminals 22 arranged along the other side of the substrate mounting area 23, a plurality of first wires 31 electrically connecting the first external connection terminal 11 and the first wire connection terminal 21 and arranged along one side of the first substrate 10, a plurality of second wires 32 electrically connecting the second external connection terminal 12 and the second wire connection terminal 22 and arranged along the other side of the first substrate 10, and a dark-colored coating resin 40 that covers the plurality of first wires 31 and the plurality of second wires 32 and surrounds the element mounting area 13 at adjacent positions.

[0012] Furthermore, the coating resin 40 is formed such that, in a cross-sectional view at the point where the tops 31a of the multiple first wires 31 are connected, the height of the coating resin 40 between adjacent first wires is lower than the height at the point where the first wires 31 are positioned, and in a cross-sectional view at the point where the tops 32a of the multiple second wires 32 are connected, the height of the coating resin 40 between adjacent second wires is lower than the height at the point where the second wires 32 are positioned. The light-emitting module 100 is provided with a wavelength conversion member 5 on the light extraction surface side of the light-emitting element 1, and a reflective member 7 that covers the side surface of the light-emitting element 1. In other words, the light-emitting module 100 comprises a plurality of light-emitting elements 1, a first substrate 10 on which the light-emitting elements 1 are mounted and which has a first external connection terminal 11 and a second external connection terminal 12, a second substrate 20 on which the first substrate 10 is mounted and which has a first wire connection terminal 21 and a second wire connection terminal 22, a first wire 31 and a second wire 32 that electrically connect the first substrate 10 and the second substrate 20, a rectangular annular covering resin 40 provided to cover the first wire 31 and the second wire 32 around the light-emitting elements 1 on the first substrate 10, a reflective member 7 covering the side surface of the light-emitting elements 1, and a wavelength conversion member 5 provided on the light extraction surface of the light-emitting elements 1. The following describes each of these components.

[0013] (First board) The first substrate 10 comprises a flat support member, an element mounting region 13 on the upper surface and inside the support member where wiring is formed, a first external connection terminal 11, and a second external connection terminal 12. The first substrate 10 is a semiconductor substrate such as silicon, and the areas on the upper surface where wiring is not exposed are covered with an insulating film. The wiring forms a semiconductor integrated circuit. The element mounting area 13 is the area where the light-emitting element 1 and the protective element are mounted and wiring is arranged to form a predetermined electrical circuit. In a plan view, the element mounting area 13 can be a rectangular area. In this element mounting area 13, it is a rectangular area. Furthermore, the element mounting area 13 is the area located between the first external connection terminal 11 and the second external connection terminal 12, and is equivalent to the wavelength conversion member 5 described later, or the area surrounding the part to which the light-emitting element 1 is connected. Multiple first external connection terminals 11 are formed outside the element mounting area 13, on one of the longer sides of the rectangular element mounting area 13. These first external connection terminals 11 are terminals to which one end of the first wire 31 is connected. Here, as an example, each first external connection terminal 11 is formed as a rectangle and is spaced apart from each other, arranged in a line along one of the longer sides of the element mounting area 13. The first external connection terminals 11 can be arranged at equal intervals. The spacing between the first external connection terminals 11 can be between 20 μm and 100 μm. Multiple second external connection terminals 12 are formed outside the element mounting area 13, along the other long side of the rectangular element mounting area 13 (the side located on the opposite side of the element mounting area 13 from the aforementioned long side). These second external connection terminals 12 are terminals to which one end of the second wire 32 is connected. Here, as an example, each second external connection terminal 12 is formed as a rectangle and is spaced apart from each other, aligned in a line along the other long side of the element mounting area 13. The second external connection terminals 12 can be aligned at equal intervals. The spacing between the aligned second external connection terminals 12 can be between 20 μm and 100 μm. The spacing between the aligned first external connection terminals 11 and the spacing between the aligned second external connection terminals 12 may be the same.

[0014] In this example, the first substrate 10 has a first drive terminal 15 for driving the light-emitting element 1, which is positioned outside and spaced apart from the external connection terminals. The third wire 33, which will be described later, will be connected to this first drive terminal 15. Furthermore, the light-emitting elements 1 mounted on the first substrate 10 may be arranged in a vertical and horizontal configuration in multiple units, with multiple light-emitting elements 1 connected by wiring across one first external connection terminal 11 and one second external connection terminal 12, and the wiring pattern may be such that multiple light-emitting elements 1 are connected in series or in parallel in predetermined groups. The first external connection terminal 11 and the second external connection terminal 12 are provided on the upper surface of the support member and can be formed using metals such as Cu, Ag, Au, Al, Pt, Ti, W, Pd, Fe, and Ni, or their alloys. Such first external connection terminals 11 and second external connection terminals 12 can be formed by electroplating, electroless plating, vapor deposition, sputtering, etc. Furthermore, for example, when using Au bumps for mounting the light-emitting element 1, using Au on the outermost surface of the wiring improves the bonding with the light-emitting element 1.

[0015] (Second board) The second substrate 20 comprises a flat substrate, a substrate mounting area 23 located on the upper surface of the substrate, a first wire connection terminal 21, and a second wire connection terminal 22. The substrate mounting area 23 is the area on which the first substrate 10 is mounted via a bonding member. This substrate mounting area 23 is located, for example, between the first wire connection terminal 21 and the second wire connection terminal 22, and is set to have an area equivalent to the area of ​​the first substrate 10. If the first substrate 10 is rectangular in plan view, the substrate mounting area 23 can also be rectangular. Multiple first wire connection terminals 21 are formed outside the substrate mounting area 23, on one of the longer sides of the rectangular substrate mounting area 23. These first wire connection terminals 21 are terminals for connecting the other end of the first wire 31. Here, as an example, each first wire connection terminal 21 is formed in a rectangular shape and is spaced apart from each other, aligned in a line along one of the longer sides of the substrate mounting area 23. The first wire connection terminals 21 can be aligned at equal intervals. The spacing between the aligned first wire connection terminals 21 can be between 50 μm and 200 μm. Multiple second wire connection terminals 22 are formed outside the substrate mounting area 23, on the other long side of the rectangular substrate mounting area 23 (the side located on the opposite side of the substrate mounting area 23 from the aforementioned long side). These second wire connection terminals 22 are terminals for connecting the other end of the second wire 32. Here, as an example, each second wire connection terminal 22 is formed in a rectangular shape and is spaced apart from each other, aligned in a line along the other long side of the substrate mounting area 23. The second wire connection terminals 22 can be aligned at equal intervals. The spacing between the aligned second wire connection terminals 22 can be 50 μm or more and 200 μm or less. The spacing between the aligned first wire connection terminals 21 and the spacing between the aligned second wire connection terminals 22 may be the same. The first wire connection terminal 21 and the second wire connection terminal 22 are provided on the upper surface of the substrate and can be formed, for example, by the same materials and forming methods as the first external connection terminal 11 and the second external connection terminal 12 described above.

[0016] The substrate is preferably made of a material with high heat dissipation properties, and more preferably a material with high light shielding properties and substrate strength. Specifically, examples include ceramics such as alumina, aluminum nitride, and mullite; resins such as phenolic resin, epoxy resin, polyimide resin, BT resin (bismaleimide triazine resin), and polyphthalamide (PPA); and composite materials composed of resin and metal or ceramics. The substrate mounting area 23 of the substrate uses a bonding material such as an Ag sintered body, solder, or adhesive resin to bond the first substrate 10. The substrate can be a flat plate, or it can be a substrate with a cavity on the upper surface and a heat dissipation member inserted into the cavity.

[0017] The first wire 31 and the second wire 32 are conductive wires made of metals such as gold, copper, platinum, and aluminum, and alloys containing at least these metals. Gold is particularly preferred due to its excellent thermal resistance. The diameter of the wire is preferably 15 μm to 70 μm, and more preferably 23 μm to 45 μm. In this case, a third wire 33 is used to handle the driving signal for turning the light-emitting element 1 on and off. The third wire 33 is connected to the first drive terminal 15 formed outside the first external connection terminal 11 on the first substrate 10 and to the second drive terminals 16 formed on the second substrate 20. The third wire 33 is made of the same material as the first wire 31 or the second wire 32, differing only in the length of the wiring.

[0018] The first wire 31, connected to the first external connection terminal 11 and the first wire connection terminal 21, can be positioned perpendicular to the long side of the first substrate 10 in a plan view. The second wire 32, connected to the second external connection terminal 12 and the second wire connection terminal 22, can be positioned perpendicular to the long side of the first substrate 10 in a plan view. Furthermore, among the multiple aligned first wires 31, the first wire 31 located towards the center can be positioned perpendicular to the long side of the first substrate 10 in a plan view, as described above, while the first wire 31 located towards the edges can be positioned diagonally to the long side of the first substrate 10 in a plan view. The same applies to the second wire 32. The spacing between the multiple first wires 31 may be the same as or different from the spacing between the multiple first wires 31. The spacing between the first wires 31 can be between 20 μm and 100 μm. The spacing between the second wires 32 can be between 20 μm and 100 μm. The spacing between the first wires 31 and the spacing between the second wires 32 may be the same.

[0019] (light-emitting element) The light-emitting element 1, for example, has a substantially rectangular shape in plan view and includes a translucent substrate and a semiconductor laminate, with a pair of electrodes on the surface of the semiconductor laminate. Preferably, the light-emitting element 1 has a positive and negative pair of electrodes on the same side. This allows the light-emitting element 1 to be flip-chip mounted on the first substrate 10. In this case, the surface opposite to the surface on which the pair of electrodes are formed becomes the main light extraction surface of the light-emitting element 1. In the light-emitting module 100, the light-emitting elements 1 are used aligned at predetermined intervals in the matrix direction. The light-emitting element 1 can be selected to have any wavelength. For example, as a blue-green light-emitting element 1, ZnSe or nitride semiconductor (In X Al Y Ga 1-X-Y A suitable choice is a light-emitting element using N (0 ≤ X, 0 ≤ Y, X + Y ≤ 1) or GaP. Furthermore, a nitride semiconductor represented by GaAlAs or AlInGaP can be preferably used as the red light-emitting element 1. In addition, semiconductor light-emitting elements made of materials other than those listed above can also be used. The composition, emission color, size, and number of light-emitting elements 1 can be appropriately selected according to the purpose.

[0020] (Protective element) The light-emitting module 100 may include semiconductor elements (e.g., protective elements) different from the light-emitting element 1. The protective elements are provided to protect the light-emitting element 1 from electrostatic discharge. A Zener diode can preferably be used as the protective element. Depending on the application of the light-emitting module, the protective elements may not be provided. If other semiconductor elements other than the light-emitting element 1, such as protective elements or transistors for driving and controlling the light-emitting element 1, are provided on the first substrate 10, it is preferable to place them between the element mounting area 13 and the first resin frame 41.

[0021] (Jointing member) As shown in Figure 7, the light-emitting element 1 is joined to the wiring provided on the upper surface of the first substrate 10 by a bonding member, which is a conductive member for mechanical and electrical bonding. When the light-emitting element 1 is flip-chip mounted on the first substrate 10, metal bumps made of metal materials such as Au, Ag, Cu, and Al, such as wire bumps and plated bumps, can be used as bonding members. The metal bumps may be provided in advance to bond to the n-side electrode and p-side electrode of the light-emitting element 1, or to each wiring, before the light-emitting element 1 is joined to the first substrate 10. In this case, the light-emitting element 1 can be joined to the first substrate 10 by ultrasonic bonding. Furthermore, solder such as AuSn alloy or Sn-based lead-free solder may be used as the bonding material. In this case, the light-emitting element 1 can be bonded to the first substrate 10 by reflow soldering. Alternatively, a conductive adhesive containing conductive particles in a resin can be used as the bonding material. The joining members can be formed using a plating method. Copper is an example of the material used.

[0022] (Reflective material) As shown in Figures 3, 4, and 7, the reflective member 7 is a member that covers the side surface of the light-emitting element 1. The reflective member 7 is provided to seal the light-emitting element 1, protecting it from external forces, dust, gases, etc., and to improve the heat resistance, weather resistance, and light resistance of the light-emitting element 1. The reflective member 7 also reflects the light emitted from the side surface of the light-emitting element 1, causing it to be emitted from the upper surface of the wavelength conversion member 5, which is the light-emitting surface of the light-emitting module 100. As a result, the light extraction efficiency of the light-emitting module 100 can be increased, the boundary between the light-emitting area and the non-light-emitting area becomes clear without blurring (improved clarity), and the contrast ratio between the light-emitting area and the non-light-emitting area is also improved. The reflective member 7 is also provided spaced apart from the covering resin 40 (first resin frame 41).

[0023] Furthermore, it is preferable to use a soft resin with relatively low elasticity and excellent shape conformability for the reflective member 7. Suitable materials for the reflective member 7 include resin materials with good transparency and insulation properties, such as thermosetting resins like epoxy resin and silicone resin. It is also preferable to form it using a white resin that has been imparted with light reflectivity by incorporating particles of a light-reflective substance into the base resin. Suitable light-reflective substances include, for example, titanium oxide, aluminum oxide, zinc oxide, barium carbonate, barium sulfate, boron nitride, aluminum nitride, and glass fillers. By using a white resin, the reflective member 7 can be imparted with light reflectivity. Note that the reflective member 7, as a member covering the side surface of the light-emitting element 1, is not limited to a reflective material; it may also be a light-absorbing material (black resin).

[0024] Before providing the reflective member 7, an underfill may be provided on the lower surface of the light-emitting element 1 and the upper surface of the first substrate 10. The underfill fills the space between the upper surface of the first substrate 10 and the lower surface of the light-emitting element 1 and is provided to a height that covers a portion of the side surface of the light-emitting element 1. If an underfill is provided, the reflective member 7 will be formed on top of the underfill. The underfill can be made of the same resin or light-reflective material as the reflective member 7.

[0025] (Wavelength conversion component) The wavelength conversion member 5 is provided on the upper side of the plurality of light-emitting elements 1. In a plan view, the wavelength conversion member 5 is substantially rectangular in shape and contains a material that can convert the light emitted from the light-emitting elements 1 and extract it to the outside. The sides of the wavelength conversion member 5 may be covered with a light-shielding material. When the sides of the wavelength conversion member 5 are covered with a light-shielding material, the contrast ratio between the light-emitting area and the non-light-emitting area is improved. Alternatively, the sides of the wavelength conversion member 5 may not be covered with a light-shielding material. In this case, since light is not absorbed on the sides of the wavelength conversion member 5, light extraction is improved. The wavelength conversion member 5 is a roughly rectangular shape larger than the collection of all the light-emitting elements 1 aligned in a plan view, and is positioned to encompass and cover the element mounting region 13 on which the light-emitting elements 1 are arranged.

[0026] The wavelength conversion member 5 contains a light-diffusing material and a wavelength conversion substance (e.g., a phosphor) in a light-transmitting member that converts at least a portion of the light incident from the light-emitting element 1 into light of a different wavelength. Examples of the wavelength conversion member 5 include film (sheet), plate, and layered forms coated by spraying. Specifically, the wavelength conversion substance can be a sintered phosphor or a material containing phosphor powder in resin, glass, or other inorganic material, such as YAG glass. The sintered phosphor may be formed by sintering only the phosphor, or by sintering a mixture of the phosphor and a sintering aid. When sintering a mixture of the phosphor and a sintering aid, it is preferable to use an inorganic material such as silicon dioxide, aluminum oxide, or titanium dioxide as the sintering aid. This suppresses discoloration and deformation of the sintering aid due to light and heat, even if the light-emitting element 1 is high-powered. The higher the transparency of the wavelength conversion member 5, the better. The thickness of the wavelength conversion member 5 is not particularly limited and can be changed as appropriate, but for example, it can be approximately 50 μm to 300 μm.

[0027] As the phosphor, any phosphor used in this field can be appropriately selected. For example, phosphors that can be excited by a blue light-emitting element or an ultraviolet light-emitting element include cerium-activated yttrium-aluminum-garnet phosphors (Ce:YAG), cerium-activated lutetium-aluminum-garnet phosphors (Ce:LAG), europium and / or chromium-activated nitrogen-containing calcium aluminosilicate phosphors (CaO-Al2O3-SiO2), europium-activated silicate phosphors ((Sr,Ba)2SiO4), β-sialon phosphors, CASN phosphors, SCASN phosphors and other nitride phosphors, KSF phosphors (K2SiF6:Mn), sulfide phosphors, and quantum dot phosphors. By combining these phosphors with a blue light-emitting element or an ultraviolet light-emitting element, light-emitting devices of various colors (for example, white light-emitting devices) can be manufactured. When the light-emitting module 100 is capable of emitting white light, the type and concentration of the phosphor contained in the wavelength conversion member 5 are adjusted to achieve white light. The concentration of the phosphor contained in the wavelength conversion member 5 is, for example, about 5 to 50% by mass. Examples of light-diffusing materials that can be contained in the wavelength conversion member 5 include titanium dioxide, barium titanate, aluminum oxide, and silicon dioxide.

[0028] (Coating resin) The coating resin 40 is made of a dark-colored resin that covers the first wire 31 and the second wire 32 and surrounds the element mounting area 13 at adjacent positions. Here, adjacent positions refer to being separated by 100 μm to 500 μm. In this case, the coating resin 40 is also formed to cover the third wire 33. The coating resin 40 is formed to be spaced away from the wavelength conversion member 5 and surrounded by an annular rectangular frame (a frame in which both the inner and outer circumferences are rectangular in a plan view). Because the coating resin 40 is positioned away from the wavelength conversion member 5, the light contrast with the wavelength conversion member 5, which is the light extraction surface, becomes clear (that is, if the coating resin 40 and the wavelength conversion member 5 were in contact, the light emitted from the wavelength conversion member 5 would penetrate the coating resin 40, causing the area of ​​the coating resin 40 to also appear to glow, blurring the boundary between the light-emitting area and the non-light-emitting area, and worsening the contrast ratio between the light-emitting area and the non-light-emitting area). The distance between the wavelength conversion member 5 and the coating resin 40 is preferably between 100 μm and 500 μm. If the distance is less than 100 μm, light from the light-emitting element can easily penetrate the coating resin 40, and if this occurs, the contrast ratio between the light-emitting area and the non-light-emitting area will deteriorate as described above. If the distance is greater than 500 μm, the package size will increase, and costs will rise.

[0029] Similarly, the distance between the reflective member 7 and the coating resin 40 is preferably 100 μm or more and 500 μm or less. The distance between the wavelength conversion member 5 and the coating resin 40 may be equal to or different from the distance between the reflective member 7 and the coating resin 40. Furthermore, in the longer-side region of the coating resin 40 that covers the first wire 31 and the second wire 32, the width is formed to be wider so as to cover from the end of the wire on the external connection terminal side to the end on the wire connection terminal side, while the width of the shorter-side region of the coating resin 40 is formed to be narrower. In addition, the coating resin 40 is formed such that the top position 40MX is higher in the longer-side region than in the shorter-side region. The coating resin 40 is higher on the longer side of the first substrate 10 and lower on the shorter side. In particular, the lower height of the coating resin 40 on the shorter side improves light extraction because light from the light-emitting element can be emitted to the outside without being blocked by the coating resin 40. Furthermore, by making the height of the coating resin 40 lower on the shorter side, the amount of resin can also be reduced. The coating resin 40 is formed such that the top position 40MX is higher than the top of the first resin frame 41, which will be described later. The top position 40MX of the coating resin 40 may be higher than the top of the first resin frame 41.

[0030] Furthermore, in a cross-sectional view at the positions where the tops 31a of the multiple first wires 31 are connected, the height of the coating resin 40 between adjacent first wires is lower than the height of the coating resin 40 at the points where the first wires 31 are positioned. Similarly, in a cross-sectional view at the positions where the tops 32a of the multiple second wires 32 are connected, the height of the coating resin 40 between adjacent second wires is lower than the height of the coating resin 40 at the points where the second wires 32 are positioned. Consequently, the coating resin 40 is higher at the positions 40a of the tops 31a of the first wires 31 and the tops 32a of the second wires 32, and lower at the positions 40b between the wires, resulting in a cross-sectional shape that repeats in an uneven manner. By varying the height of the coating resin 40 in a cross-sectional view at the positions of the tops 31a of the first wires 31 and the tops 32a of the second wires 32, light from the light-emitting element 1 is made more likely to escape outwards. This is because light arriving at points where the height of the coating resin 40 is lower between wires is emitted outwards without hitting the coating resin 40. For comparison, if the height of the coating resin 40 between wires is about the same as the height of the coating resin 40 at the point where the wires are placed, the light arriving between wires will hit the coating resin 40, resulting in reduced light extraction. Furthermore, because the coating resin 40 is dark in color, it can absorb light reflected from the lens (scattered light). In addition, light reflected from the lens that is incident perpendicularly to the upper surface of the coating resin 40 (or incident at an angle close to perpendicular) is absorbed more than light from a flat surface because the upper surface of the coating resin 40 has an uneven shape.

[0031] Furthermore, the difference in height of the uneven shape of the coating resin 40 between position 40a at the top 31a of the first wire 31 and position 40b between the wires, and the difference in height of the uneven shape of the coating resin 40 between position 40a at the top 32a of the second wire 32 and position 40b between the wires, becomes gentler towards the inner and outer sides of the frame-shaped coating resin 40. At the outer edge of the frame, there is no difference in height and it is formed to be a single plane. On the other hand, it is preferable that a difference in height of the uneven shape of the coating resin 40 remains at the inner edge of the frame. The remaining difference in height of the uneven shape of the coating resin 40 reduces the amount of light from the light-emitting element that hits the coating resin 40, improving light extraction. Furthermore, the position 40MX at the top of the coating resin 40 and the position 40a of the coating resin 40 at the top 31a of the first wire 31 may be the same or different positions. It is preferable that the uneven shape of the coating resin 40 in a cross-sectional view at the positions where the tops 31a of multiple first wires 31 are connected, and the uneven shape of the coating resin 40 in a cross-sectional view at the positions where the tops 32a of multiple second wires 32 are connected, are similar. By making them similar, the way light appears can be made symmetrical.

[0032] The coating resin 40 can be made from, for example, a translucent base material containing a dark-colored material that absorbs or reflects light poorly. For example, the coating resin 40 uses a resin as the base material, containing pigments or carbon powder, carbon black, or graphite, and dispersing particles of light-absorbing material to produce a dark black color. The base resin can be a thermosetting resin such as epoxy resin or silicone resin. Furthermore, the carbon powder or pigment used to produce the dark color can be a black or near-black color that absorbs light.

[0033] The coating resin 40 may be provided between a first resin frame 41, which is provided to surround the element mounting area 13 on the first substrate 10 at adjacent positions, and a second resin frame 42, which is provided on the second substrate 20 to surround the first substrate 10 outside of the plurality of first wires 31 and plurality of second wires 32. In other words, the coating resin 40 may be formed by first creating a frame-shaped resin dam and then filling the frame with resin. The first resin frame 41 and the second resin frame 42 are formed to a predetermined height by providing multiple layers of resin with adjusted viscosity in the height direction. For example, the first resin frame 41 and the second resin frame 42 are formed by applying resin adjusted to a predetermined viscosity from a nozzle to form a frame around the substrate, and then repeating this process to layer the resin to a predetermined height.

[0034] The height of the second resin frame 42 may be greater than the height of the first resin frame when compared on the same plane. By making the second resin frame higher, it is possible to suppress the coating resin 40 from overflowing to the outside of the second resin frame. The resin used here can be a thermosetting resin such as epoxy resin or silicone resin. It is preferable that the coating resin 40 that is filled into the frames after the first resin frame 41 and the second resin frame 42 are formed has a viscosity lower than that of the first resin frame 41 and the second resin frame 42. The coating resin 40 may also be formed by filling the space between the first resin frame 41 and the second resin frame 42 multiple times. If the first substrate 10 is rectangular and the plurality of first external connection terminals 11, plurality of second external connection terminals 12, plurality of first wire connection terminals 21, and plurality of second wire connection terminals 22 are arranged on the long side of the first substrate 10, then it is preferable that the distance between the first resin frame 41 and the second resin frame 42 is narrower on the short side of the first substrate 10 than the distance on the long side of the first substrate 10. As a result, the top of the coating resin 40 provided on the short side of the first substrate 10 is lower than the top of the coating resin 40 provided on the long side of the first substrate 10, improving light extraction.

[0035] The light-emitting module 100 having the above configuration can be used, for example, as a light source for the headlights of a vehicle, ship, or aircraft. The light-emitting module 100 may have a lens system arranged in the optical path. The light-emitting module 100 lights up the light-emitting element 1 using an external power switch. The light-emitting module 100 is configured to allow some or all of the light-emitting elements 1 to be turned on or off in a pre-set manner. The light emitted from the light-emitting module 100 exits the wavelength conversion member 5 along the optical path and is sent to the lens system arranged in the optical path.

[0036] In the light-emitting module 100, the coating resin 40 has an uneven surface by varying its height at position 40a at the top 31a of the first wire 31 and at position 40b between the first wires, and further varying its height at position 40a at the top 32a of the second wire 32 and at position 40b between the second wires. This allows light directed towards the lower height of the coating resin 40 to be emitted to the outside, improving light extraction. In addition, in the light-emitting module 100, scattered light reflected back from the lens system arranged in the optical path can be absorbed by the coating resin 40 formed adjacent to the light-emitting surface. Furthermore, light reflected back from the lens system that is incident perpendicularly (or at an angle close to perpendicular) to the upper surface of the coating resin 40 is absorbed more effectively than light from a flat surface due to the uneven surface of the coating resin 40. Therefore, the light-emitting module 100 suppresses scattered light returning from the lens system and has good light extraction efficiency.

[0037] [Manufacturing method for light-emitting devices] Next, the manufacturing method of the light-emitting module will be explained with reference to Figures 9 to 10G. Figure 9 is a flowchart illustrating a method for manufacturing a light-emitting module according to the embodiment. Figure 10A is a schematic plan view showing the first substrate in the method for manufacturing a light-emitting module according to the embodiment. Figure 10B is a schematic plan view of the first substrate showing the state in which the light-emitting element is placed on the element mounting area in the method for manufacturing a light-emitting module according to the embodiment. Figure 10C is a schematic diagram showing a magnified part of the alignment state of the light-emitting element in the method for manufacturing a light-emitting module according to the embodiment. Figure 10D is a schematic plan view showing the second substrate in the method for manufacturing a light-emitting module according to the embodiment. Figure 10E is a schematic plan view of the second substrate showing the state in which the first substrate is placed on the substrate mounting area of ​​the second substrate in the method for manufacturing a light-emitting module according to the embodiment. Figure 10F is a schematic plan view showing the state in which the first wire is connected to the first external connection terminal and the first wire connection terminal, the second wire is connected to the second external connection terminal and the second wire connection terminal, and the third wire is connected to the first drive terminal 15 and the second drive terminal 16 in the method for manufacturing a light-emitting module according to the embodiment. Figure 10GF is a plan view showing the state in which the first resin frame and the second resin frame have been formed in the manufacturing method of the light-emitting module according to the embodiment. Note that the light-emitting elements 1 are placed at predetermined intervals, but the intervals are omitted in all figures except Figure 10C due to size constraints.

[0038] The manufacturing method of the light-emitting module includes an element mounting step S11, which is the step of mounting and connecting a plurality of light-emitting elements 1 to the element mounting area 13 of the first substrate 10; a first substrate mounting step S13, which is the step of mounting the first substrate 10 to the substrate mounting area 23 of the second substrate 20; a plurality of first external connection terminals 11 located on one side of the element mounting area 13 outside the element mounting area 13 of the first substrate 10, and a plurality of first wire connection terminals 21 located along one side of the element mounting area 13 outside the substrate mounting area 23 of the second substrate 20, connected by a plurality of first wires 31; a plurality of second external connection terminals 12 located on the other side of the element mounting area 13, opposite to the one side, outside the element mounting area 13 of the first substrate 10, and the substrate mounting area 23 of the second substrate 20. The process includes: a wire connection step S14, which is the process of connecting a plurality of second wire connection terminals 22, which are arranged along the opposite side of the mounting area 23, with a plurality of second wires 32; a resin frame formation step S15, which is the process of forming a dark-colored first resin frame 41 on the first substrate 10 inward from a plurality of first external connection terminals 11 and a plurality of second external connection terminals 12, adjacent to and surrounding the element mounting area 13, and forming a dark-colored second resin frame 42 on the second substrate 20 outward from a plurality of first wires 31 and a plurality of second wires 32, surrounding the first substrate 10; and a resin filling step S16, which is the process of filling the space between the first resin frame 41 and the second resin frame 42 with a dark-colored coating resin 40 having a lower viscosity than the first resin frame 41 and the second resin frame 42.

[0039] Furthermore, the light-emitting module manufacturing method includes a wavelength conversion member formation step S17, which is a step in which wavelength conversion members 5 are formed on the upper surfaces of multiple light-emitting elements, after the resin filling step S16 in which a coating resin 40 is filled. In addition, the light-emitting module manufacturing method includes a reflective member formation step S12, which is a step in which reflective members 7 that reflect light are formed on each side surface of multiple light-emitting elements 1, before the first substrate mounting step S13. Each step will be described below.

[0040] The element mounting process S11 is a process of mounting and connecting multiple light-emitting elements 1 to the element mounting area 13 of the first substrate 10. In the element mounting process S11, after attaching the multiple light-emitting elements 1 to the sapphire substrate, the multiple light-emitting elements are transferred to a support substrate and prepared as individual pieces corresponding to the size of the element mounting area 13 of the first substrate 10 by dicing or the like. These individual pieces are then joined to the element mounting area 13. In addition, the first substrate 10 has a first external connection terminal 11 and a second external connection terminal 12 and wiring formed on it before the light-emitting elements 1 are mounted. The first external connection terminal 11 and the second external connection terminal 12 can be formed by attaching metal foil such as Cu or Al, applying a paste of metal powder such as Cu or Ag, or plating with Cu or the like. In addition, the wiring that electrically connects to the light-emitting elements 1 can be patterned by etching or printing. The light-emitting elements 1 can be electrically joined to the element mounting area 13 on the first substrate 10 by plating. The light-emitting elements 1 are arranged in a matrix direction with predetermined intervals between them.

[0041] The reflective member formation step S12 is a step in which, after the light-emitting element 1 is placed on the element mounting area 13 of the first substrate 10, the side surface of the light-emitting element 1 is covered with a reflective member. When performing the reflective member formation step S12, after the light-emitting element 1 is placed on the first substrate 10, a reflective member, such as a white resin, is filled between the light-emitting elements 1 on the side surface of the light-emitting element 1. It is preferable to provide a mask on the upper surface of the light-emitting element 1 before filling with the white resin in the reflective member formation step S12. If the mask is removed after filling with the white resin, it is possible to prevent the formation of white resin on the upper surface of the light-emitting element 1.

[0042] The first substrate mounting step S13 is the step of mounting the first substrate 10 onto the substrate mounting area 23 of the second substrate 20. In the first substrate mounting step S13, the first substrate 10 on which the light-emitting element 1 is mounted is bonded to the substrate mounting area 23 of the second substrate 20 using a bonding material such as sintered Ag. The second substrate 20 has wiring such as the first wire connection terminal 21 and the second wire connection terminal 22 formed in advance. In addition, when using the third wire 33, the first drive terminal 15 and the second drive terminal 16 are also formed.

[0043] The wire connection process S14 involves connecting a plurality of first external connection terminals 11 on the first substrate 10 to a plurality of first wire connection terminals 21 on the second substrate 20 with a plurality of first wires 31, and connecting a plurality of second external connection terminals 12 on the first substrate 10 to a plurality of second wire connection terminals 22 on the second substrate 20 with a plurality of second wires 32. In the wire connection process S14, a third wire 33 is connected to the first drive terminal 15 on the first substrate 10 and the second drive terminal 16 on the second substrate 20. It is preferable to first connect the wire to the first external connection terminal 11 provided on the first substrate 10, and then to the first wire connection terminal 21 provided on the second substrate. By connecting the wires in this order, a shape with a raised top can be formed.

[0044] The resin frame forming step S15 is a step in which a dark-colored first resin frame 41 is formed on the first substrate 10 in a position adjacent to and surrounding the element mounting area 13, inside the plurality of first external connection terminals 11 and plurality of second external connection terminals 12, and a dark-colored second resin frame 42 is formed on the second substrate 20 outside the plurality of first wires 31 and plurality of second wires 32, surrounding the first substrate 10. In the resin frame forming step S15, the first resin frame 41 may be formed first, followed by the formation of the second resin frame 42, or the second resin frame 42 may be formed, followed by the formation of the first resin frame 41. Alternatively, the resin frame forming step S15 may form the first resin frame 41 and the second resin frame 42 substantially simultaneously. In the resin frame forming step S15, the first resin frame 41 and the second resin frame 42 are formed by applying a resin with a pre-adjusted viscosity from a resin application nozzle. When forming the first resin frame 41 and the second resin frame 42, resin is applied multiple times from the nozzle, and the resin is layered to achieve a predetermined height.

[0045] The resin filling step S16 is a step of filling the space between the first resin frame 41 and the second resin frame 42 with a dark-colored coating resin having a lower viscosity than the first resin frame 41 and the second resin frame 42. In the resin filling step S16, the resin may be filled between the first resin frame 41 and the second resin frame 42 in a single filling, or it may be filled in multiple fillings. The position 40MX of the top of the coating resin 40 formed in the resin filling step S16 is formed to be higher than the top 41a of the first resin frame 41. To make the position 40MX of the top of the coating resin 40 higher than the top 41a of the first resin frame 41, for example, it is preferable to fill the resin again before the filled resin has completely hardened and repeat the process until the predetermined height is reached. In addition, the coating resin 40 is formed such that the top of the region on the longer side of the rectangular frame is higher than the top of the region on the shorter side.

[0046] Furthermore, when filling with coating resin 40, the resin may be applied along the direction in which the multiple first wires 31 are arranged, and also along the direction in which the multiple second wires 32 are arranged. In this case, since the coating resin 40 is applied only to the area where the gap between the first resin frame and the second resin frame is wide, the area where the gap between the first resin frame and the second resin frame is narrow can be filled by the coating resin that has been filled in the area where the gap between the first resin frame and the second resin frame is wide flowing into it. In this way, the operation of the nozzle that supplies the resin when filling with the coating resin 40 can be minimized, thereby increasing work efficiency, and furthermore, it is possible to suppress the coating resin 40 from spilling out to the outside of the second resin frame 42. When filling with the coating resin 40, it is preferable to apply it directly above the top of the wire. This makes it easier for the top of the wire to be coated with the coating resin 40.

[0047] The resin frame forming step S15 and the resin filling step S16 together constitute a coating resin forming step. The first resin frame 41 and the second resin frame 42 are, for example, silicone resin. The resin to be filled is, for example, epoxy resin. The viscosity of the coating resin can be adjusted by the amount of solvent used in the resin material and the amount of appropriate filler added. Furthermore, forming the first resin frame 41 and the second resin frame 42 in this step includes placing uncured, or preferably partially cured, resin material, and is not limited to completing the process up to full curing.

[0048] The coating resin 40 is formed such that, in a cross-sectional view at a position where the tops of multiple first wires are virtually connected, the height of position 40b of the coating resin 40 between adjacent first wires is lower than the height of position 40a of the coating resin 40 at the point where the first wire 31 is placed, and in a cross-sectional view at a position where the tops of multiple second wires 32 are virtually connected, the height of position 40b of the coating resin 40 between adjacent second wires 32 is lower than the height of position 40a of the coating resin 40 at the point where the second wire 32 is placed. The coating resin 40 forms alternating high and low portions at the tops and between the wires of the first wire 31, and at the tops and between the wires of the second wire 32, creating a dark-colored uneven surface adjacent to the light extraction surface.

[0049] The wavelength conversion member formation step S17 is a step in which wavelength conversion members 5 are formed on the upper surfaces of a plurality of light-emitting elements 1. In the wavelength conversion member formation step S17, the wavelength conversion members 5 are formed adjacent to and separated from the inner surface of the coating resin 40. Note that the inner surface of the coating resin 40 refers to the same position as the inner surface of the first resin frame 41. The wavelength conversion members 5 are formed in advance to a predetermined size and are joined to the light extraction surface of the light-emitting elements 1 via a bonding member. Since the wavelength conversion members 5 are adjacent to and separated from the coating resin 40, the outline of the wavelength conversion members 5 that become the light extraction surface is clear, and the light contrast is clear. Note that in this specification, "separated" is a wording that indicates that they are separated from each other, as is clear from the relationship between the coating resin 40 and the wavelength conversion members 5 shown in Figure 12.

[0050] The light-emitting module 100 can adjust the position 40a of the coating resin 40 at the top 31a of the first wire 31 and the top 32a of the second wire 32, and the position 40b between the wires, as shown in Figures 11A to 11C. The position 40a of the coating resin 40 at the top 31a of the first wire 31 and the position 40b of the coating resin between the wires, and the position 40a of the coating resin 40 at the top 32a of the second wire 32 and the position 40b of the coating resin 40 between the wires are shown similarly in the cross-sectional view, so the configuration on the first wire 31 side will be explained as a representative example, and the configuration on the second wire 32 side will be omitted.

[0051] As shown in Figure 11A, the position 40a of the top 31a of the first wire 31 in the coating resin 40 is formed to be higher than the position 40b of the coating resin 40 between the wires. This height difference L1 is formed to be large in a cross-sectional view at a position where each top 31a of the first wire 31 is virtually connected, and to become smaller towards one end or the other end of the first wire 31. As shown in Figure 11B, the position 40a1 of the coating resin 40 at the top 31a of the first wire 31 is formed to be higher than the position 40b1 of the coating resin 40 between the wires. The height difference L2 of the coating resin 40 is smaller compared to the configuration in Figure 11A, the position 40b1 of the coating resin 40 between the wires is approximately at the same position as the upper surface of the first wire 31, and the thickness of the coating resin 40 at position 40a1 at the top 31a of the first wire 31 is formed to be thicker than the thickness in Figure 11A. With this configuration, the wires can be reliably covered with the coating resin 40, and the quality of the product can be improved. Note that the unevenness caused by the height difference L2 of the coating resin 40 is formed gently when Figure 11A is assumed to be the reference.

[0052] As shown in Figure 11C, the position 40a2 of the coating resin 40 at the top 31a of the first wire 31 is formed to be higher than the position 40b2 of the coating resin 40 between the wires. The height difference L3 of the coating resin 40 is larger compared to the configuration in Figure 11A, so that the position 40b2 of the coating resin 40 between the wires is lower than the bottom surface of the first wire 31, and the thickness of the coating resin 40 at position 40a2 at the top 31a of the first wire 31 is formed to be thinner than the thickness in Figure 11A. The uneven surface due to the height difference L3 of the coating resin 40 is formed to have a large height difference when Figure 11A is assumed to be the reference. By creating such a large height difference, light from the light-emitting element 1 can pass through more easily, and the efficiency of light extraction can be increased. As described above, the coating resin 40 can suppress scattered light by forming height differences L, L1, and L2 between the positions 40a, 40a1, and 40a of the top 31a of the first wire 31 and the positions 40b, 40b1, and 40b2 between the wires. The larger the height difference, the higher the likelihood of absorbing scattered light.

[0053] Furthermore, as shown in Figure 12, the second substrate 20A may have a recess 24 in the center, and a substrate mounting area 23A may be set within the recess 24. In this way, the overall thickness of the light-emitting module 100A can be reduced by forming a recess 24 in the second substrate 20A and setting a substrate mounting area 23A. The light-emitting device and its manufacturing method according to the present invention have been described in detail above with respect to embodiments for carrying out the invention. However, the spirit of the present invention is not limited to these descriptions and must be interpreted broadly based on the claims. Furthermore, it goes without saying that various changes and modifications based on these descriptions are also included in the spirit of the present invention. [Industrial applicability]

[0054] The light-emitting module 100 according to the embodiment of this disclosure can be used in various light sources such as headlights for vehicles, ships, and aircraft, as well as in projector devices. [Explanation of Symbols]

[0055] 1 Light-emitting element 5 Wavelength conversion component 7 Reflective material 10. First board 11. First external connection terminal 12. Second external connection terminal 13 Element mounting area 15. First drive terminal 16. Second drive terminal 20,20A Second board 21 First wire connection terminal 22 Second wire connection terminal 23. Substrate mounting area 24 recesses 31. First wire 31a Top of the first wire 32. Second wire 32a Top of the second wire 33 Third wire 40 Coating resin 41. First resin frame 42. Second resin frame 100, 100A Light-Emitting Module S11 Element placement process S12 Reflective member formation process S13 First substrate mounting process S14 Wire connection process S15 Resin frame forming process S16 Resin filling process S17 Wavelength conversion component formation process

Claims

1. Multiple light-emitting elements, A first substrate having an element mounting area for electrically connecting and mounting the plurality of light-emitting elements, and further having a first external connection terminal located outside the element mounting area on one side of the element mounting area and a second external connection terminal located on the other side of the element mounting area, A second substrate having a rectangular substrate mounting area on which the first substrate is mounted, and further having a first wire connection terminal located outside the substrate mounting area and on one side of the substrate mounting area, and a second wire connection terminal located on the other side of the substrate mounting area, A first wire electrically connects the first external connection terminal and the first wire connection terminal, A second wire electrically connects the second external connection terminal and the second wire connection terminal, A frame is provided on the second substrate, located outside the first wire and the second wire, and surrounding the first substrate. A covering resin that covers the first wire and the second wire and is in contact with the frame, Equipped with, A light-emitting module in which, in a cross-sectional view, the distance between a light-emitting element located at one end of the plurality of light-emitting elements and the frame facing the light-emitting element located at one end of the plurality of light-emitting elements is greater than the distance between a light-emitting element located at the other end of the plurality of light-emitting elements and the frame facing the light-emitting element located at the other end of the plurality of light-emitting elements.

2. A first frame provided so as to surround the element mounting area on the first substrate at adjacent positions, The light-emitting module according to claim 1, comprising a second frame corresponding to the aforementioned frame.

3. The light-emitting module according to claim 2, wherein the coating resin is provided between the first frame and the second frame.

4. The light-emitting module according to claim 2, wherein the first frame and the second frame are each formed by a plurality of frames overlapping in the height direction.

5. The light-emitting module according to any one of Claims 2 to 4, wherein a wavelength conversion member is arranged on the upper surface side of the plurality of light-emitting elements, and the wavelength conversion member is provided in a position adjacent to the first frame.

6. The light-emitting module according to any one of claims 2 to 5, wherein reflective members that reflect light are provided on the sides of the plurality of light-emitting elements.

7. The light-emitting module according to claim 6, wherein the reflective member is separated from the first frame.

8. The light-emitting module according to any one of claims 2 to 7, wherein the coating resin is formed such that its top is higher than the top of the first frame.

9. The first substrate is rectangular, The first external connection terminal, the second external connection terminal, the first wire connection terminal, and the second wire connection terminal are located on the long side of the first substrate. The light-emitting module according to any one of claims 2 to 8, wherein the distance between the first frame and the second frame is narrower on the short side of the first substrate than the distance on the long side of the first substrate.

10. The light-emitting module according to claim 9, wherein the top of the coating resin provided on the short side of the first substrate is lower than the top of the coating resin provided on the long side of the first substrate.

11. The light-emitting module according to any one of claims 1 to 10, wherein the coating resin is black in color by containing a pigment or carbon powder in the base resin.

12. The light-emitting module according to any one of claims 1 to 11, wherein the plurality of light-emitting elements are blue light-emitting elements.

13. The light-emitting module according to any one of claims 1 to 11, wherein the plurality of light-emitting elements are red light-emitting elements.

14. The light-emitting module according to any one of claims 1 to 11, wherein the plurality of light-emitting elements are green light-emitting elements.

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