Electronic unit and its manufacturing method

Abstract

A method for manufacturing an electronic unit 1 and an electronic unit are proposed, comprising a first component 2 having a plurality of first electrical contacts 3, including an integrated circuit 6, and a second component 4 having a plurality of second electrical contacts 5, wherein the first electrical contacts 3 and the second electrical contacts 5 are electrically connected to each other via a conductive structure 8 comprising a multitude of conductive particles 9.

Description

Technical Field

[0001] The present invention particularly relates to an electronic unit including an integrated circuit, and a connection technology for electrically connecting two components of the electronic unit.

Background Art

[0002] In electronic device manufacturing, individualized fragments of a wafer (chips, English: die) are usually fixed on a carrier structure and electrically connected to the carrier structure. This is also referred to as chip bonding or die bonding. The carrier structure can be, for example, a housing for the chip, or in chip-on-board technology, can be a substrate such as a circuit board, a ceramic substrate, or a thick-film circuit, which can also hold further components. The chips can also be arranged on top of further chips (chip-on-chip technique), where a stacked structure of a plurality of chips is produced. In this case, the carrier structure is a further chip.

[0003] Various methods for mounting a chip on a carrier structure are known from the prior art. To name just a few examples, there are bonding using conductive or non-conductive adhesives, hot air soldering, wave soldering, reflow soldering (melting of solder balls), or wire bonding. The mounting of the chip can in principle be carried out using connecting wires (bonding wires) or directly without further connecting wires.

[0004] For example, in so-called flip-chip mounting, a chip that is not housed in a housing is directly fixed onto the substrate by contact bumps (so-called "bumps") without using any further connecting wires. In this case, the chip is provided with numerous small solder balls, which are arranged adjacent to each other in a grid of rows and columns (BGA: Ball Grid Array). During mounting, the chip is placed on the substrate with the solder balls facing downwards. Then, the solder balls are wetted with flux, and this structure is heated, causing the solder to melt and establishing an electrical connection between the contact surface of the chip and the contacts on the substrate (housing, package). This is also called reflow soldering.

[0005] BGA technology allows for particularly small dimensions between the chip and the substrate, enabling shorter conductor lengths. Here, the bump size is less than 100 μm. However, even smaller dimensions are desirable for special applications, particularly in mobile wireless technology. [Overview of the Initiative]

[0006] This disclosure enables the provision and / or manufacture of improved electronic units, in particular compact electronic units in which, for example, the distance between adjacent electrical contacts is reduced and / or the distance between the chip and the carrier structure is reduced.

[0007] This is made possible, in particular, by the features described in the independent claim. Further forms of this disclosure can be obtained from the dependent claims.

[0008] The present disclosure proposes an electronic unit comprising a first component, for example in the form of an integrated circuit, having a plurality of first electrical contacts, and a second component, having a plurality of second electrical contacts. The present disclosure describes how the first and second electrical contacts are electrically connected to each other via a conductive structure comprising a plurality of conductive particles, the conductive particles forming aggregates based on their physical or chemical properties and bonding with the first and second electrical contacts.

[0009] The particles and / or electrical contacts can, for example, be provided with and / or functionalized by at least one functional group, thereby preferably bonding the particles to the electrical contacts by, for example, weak interactions and / or covalent bonds. In this case, the use of conventional connection techniques such as soldering, bonding, or ultrasonic welding is not required.

[0010] The aforementioned particles are, for example, microparticles or nanoparticles, and can have various shapes such as rod-shaped, spherical, star-shaped, or further geometric shapes.

[0011] According to preferred embodiments of the present disclosure, the particles are rod-shaped nanoparticles. In this case, the conductive structure includes a plurality of nanoparticles aligned parallel to a given direction and capable of contacting each other.

[0012] For example, each conductive structure may include a plurality of conductive particles that can be aligned parallel to one another. Here, at least some of the conductive particles may extend from one of the first electrical contacts of the first component toward a second electrical contact of the opposing second component. In particular, the longitudinal extension direction of at least some of the particles may be aligned essentially parallel to the surface normal vectors of the first and / or second contacts.

[0013] Optionally, each conductive structure may include a plurality of particles that are arranged adjacent to each other in a direction parallel to (or perpendicular to) the surface normal vectors of the first and / or second electrical contacts. Particles that are directly adjacent to each other may be in at least partial contact with each other so as to be able to form conductive connections between the particles.

[0014] Alternatively or additionally, each conductive structure may include a plurality of particles that are arranged front to back parallel to the surface normal vectors of the first and / or second contacts. Particles arranged directly front to back may be in at least partial contact with each other so as to be able to form conductive connections between the particles. For example, each conductive structure may include a plurality of particles that are arranged adjacent to each other and front to back in a pattern similar to a brickwork.

[0015] The particles are conductive and preferably consist of (at least partially) metalloid and / or metallic materials, and / or polymers, ceramics, and / or materials such as gold, silver, copper and / or bronze, tin, zinc, lead, tungsten, mercury, or alloys thereof, and / or have a metallic surface coating. In addition, further materials such as carbon nanotubes, graphene, graphite, semiconductors (silicon, germanium), fullerenes, and polytetrafluoroethylenes are also possible.

[0016] Surface coating of particles can be achieved, for example, by functionalization with polymers containing (terminal) reactive groups, particularly at least one thiol group, e.g., 11-mercaptoundecanoic acid, or multiple thiol groups, e.g., dithiols, particularly 1,2-ethanedithiol, 1,3-propanedithiol, 1,4-butanedithiol, 1,5-pentanedithiol, benzene-1,4-dithiol, 2,2'-ethylenedioxydiethanethiol, 1,6-hexanedithiol, tetra(ethylene glycol)dithiol, 1,8-octanedithiol, 1,9-nonanedithiol, 1,11-undecanedithiol, hexa(ethylene glycol)dithiol, 1,16-hexadecanedithiol, etc. The functionalized particles selectively bind to metal particles, and the metal particles accumulate along the surface of the functionalized particles to form a coating.

[0017] According to one embodiment of the present disclosure, at least one of the following elements, namely a particle, a first contact point, or a second contact point, is functionalized, i.e., provided with at least one functional group. Functionalization achieves selective bonding of the element to other materials and / or to other elements. For example, functionalizing an element with a thiol group strengthens the bond of the element to a metal surface.

[0018] In one embodiment, for example, only the particles can be functionalized exclusively and / or individually, thereby allowing the particles to bond and / or adhere better to the metal surfaces of the first and second contacts. Here, the first and / or second contacts can each be functionalized and / or not functionalized. In other words, the first and / or second contacts can be untreated and / or uncoated. At least some of the particles can bond to at least one of the first and second contacts via, for example, weak interactions. This can improve the electrical connection between the particles and the first and / or second contacts. It can also be possible to form conductive structures as intended and controlled, thus enabling generally more compact forms of electronic units. In addition, the distance between directly adjacent first contacts of the first component and / or directly adjacent second contacts of the second component can be reduced, thus further reducing the structural size of the electronic unit.

[0019] In further embodiments, the particles and at least one of the first contacts and / or at least one of the second contacts are functionalized. For example, the particles and all of the first contacts may be functionalized, while the second contacts may not be functionalized. Alternatively, the particles and all of the second contacts may be functionalized, while the first contacts may not be functionalized. Alternatively, the particles, the first contacts, and the second contacts may be functionalized.

[0020] In other embodiments, the electrical contacts, or both elements, i.e., the electrical contacts and particles, can be functionalized.

[0021] The functionalization of metal nanoparticles is known, for example, from International Publication No. 2015 / 103028, Canadian Patent No. 2712306, and U.S. Patent No. 8,790,552. Thiol functionalization is described, for example, in Kellon JE, Young SL, & Hutchison JE (2019), "Engineering the Nanoparticle-Electrode Interface", Chemistry of Materials, 31(8), 2685-2701, and also in Kubackova J., et al. (2014), "Sensitive surface-enhanced Raman spectroscopy (SERS) detection of organochlorine Ahonen P., Laaksonen T., Nykaenen A., Ruokolainen J., & Kontturi K. (2006), "Formation of stable Agnanoparticle aggregates induced by dithiol cross-linking", The Journal of Physical Chemistry B, 110(26), This is known from 12954-12958 and Dong TY, Huang C., Chen CP, & Lin MC (2007), "Molecular self-assembled monolayers of ruthenium (II)-terpyridine dithiol complex on gold electrode and nanoparticles", Journal of Organometallic Chemistry, 692(23), 5147-5155.

[0022] Depending on the application, there are various suitable functional groups. Examples include alkanes, cycloalkanes, alkenes, alkynes, phenyl substituents, benzyl substituents, vinyls, allyls, carbenes, alkyl halides, phenols, ethers, epoxides, ethers, peroxides, ozonides, aldehydes, hydrates, imines, oximes, hydrazones, semicarbazones, hemiacetals, hemiketals, lactols, acetals / ketals, aminals, carboxylic acids, carboxylic acid esters, lactones, orthoesters, anhydrides, imides, carboxylic acid halides, carboxyl groups, carboxylic acid derivatives, amides, lactams, peroxy acids, nitriles, carbamates, urea, guanidine, carbodiimide, amines, aniline, hydroxylamines, hydrazines, hydrazones, azo compounds, nitro compounds, thiols, mercaptans, sulfides, phosphines, p-ylenes, p-ylides, biotin, streptavidin, metallocenes, and the like. These bond with different strengths or with different partners. One or more of the functional groups listed above can be used to functionalize particles, first contacts, and / or second contacts.

[0023] According to preferred embodiments of the present disclosure, one of the elements listed above, namely the particle, the first contact, and / or the second contact (particularly the particle), is functionalized with a carboxyl group, and another element of the particle, the first contact, and the second contact (e.g., the first electrical contact and / or the second electrical contact) is functionalized with a primary amine. The carboxyl group is preferably activated by EDC / NHS, thereby covalently bonding the two elements (the particle and the first and / or second electrical contact). Subsequently, optionally, any still-free functional groups can be blocked with an ethanolamine.

[0024] According to another embodiment of the present disclosure, one of the elements listed above, namely the particle, the first contact, and / or the second contact (in particular the particle), is functionalized with thiol groups. At least one further one of the particle, the first contact, and the second contact (e.g., the first electrical contact and / or the second electrical contact) is not functionalized. In this case, selective bonding between the above elements can occur via weak interactions.

[0025] It is also conceivable that the particle bonds to the first contact via a weak interaction and the particle bonds to the second contact via a covalent bond. Alternatively, it is conceivable that the particle bonds to the second contact via a weak interaction and the particle bonds to the first contact via a covalent bond.

[0026] The particle and the electrical contact can each be functionalized with one or more identical or different functional groups.

[0027] The particles are preferably capable of spontaneously aligning in a predetermined direction. This self-alignment property can be achieved, for example, by thiol groups and / or Janus (nano)particles and / or patch particles, and / or by magnetism (the particles and surfaces are magnetic), and / or via electrostatic interactions. Such interactions can be achieved, for example, by positively or negatively charged surfaces, and / or via weak interactions, and / or via chemical reaction(s) such as click chemistry (e.g., thiol-ene click chemistry), Michael reaction, and the like.

[0028] The first component mentioned at the outset can be, for example, a packaged (encapsulated) chip, a die, or an electronic system with a plurality of chips and optionally further members (with or without a housing). The second component can be, for example, a housing, a chip, a circuit board, or another substrate.

[0029] According to specific embodiments of the present disclosure, the first component is a die, and the second component is a circuit board, a chip housing, or another substrate.

[0030] According to an embodiment of the present disclosure, the first component and / or the second component include one or more spacers, and the spacers are dimensioned such that the opposing contact surfaces of the first contact and the second contact face each other at a distance. This distance can be, for example, several μm, such as 20 μm, or may be in the nm range, for example, 100 nm or less.

[0031] The contacts of the first component and / or the second component preferably have flat contact surfaces, but the contact surfaces may have spherical, concave, or convex surfaces. The concave contact surface is particularly advantageous when capsules containing conductive particles are applied onto the electrical contacts. The contacts of the component are preferably coplanar.

[0032] The conductive structure formed by the conductive particles mentioned initially can be manufactured in different processes. According to the first variant proposed herein, a suspension containing the particles as suspended matter is applied directly to at least one of the components. According to the second variant, a suspension with capsules containing conductive particles is applied to at least one of the components. Alternatively, the capsules can also be applied as a powder.

[0033] Regarding the first variant, the present disclosure relates to a method of manufacturing an electronic unit comprising a first component having a plurality of first electrical contacts, for example in the form of an integrated circuit, and a second component having a plurality of second electrical contacts, the method at least comprising: producing and / or preparing a suspension containing particles as suspended matter; and applying the suspension to at least one of the components such that a conductive structure comprising and / or provided with one or more of the conductive particles is formed on the electrical contacts of the at least one component; A step of arranging a first component and a second component together with opposing first contacts and second contacts at a given distance, wherein the application of the suspension can be performed, for example, before or after arranging the first component and the second component. A step of washing away and / or removing conductive particles that are not coupled to electrical contacts, Regarding the method of doing so.

[0034] As described above, it is preferable that at least one of the following elements, namely the particles, the first contact point, and the second contact point, is provided with one or more functional groups. All of the foregoing and subsequent statements in this disclosure relating to the functionalization of the particles, the first contact point, and / or the second contact point apply equally to the methods described herein.

[0035] According to one embodiment, the method further includes the steps of functionalizing only particles with functional groups and bonding at least a portion of the particles to at least one of a first contact point and a second contact point via weak interactions. In other words, only particles can be functionalized and bonded to the first contact point and / or the second contact point via weak interactions.

[0036] According to one embodiment, this method is Functionalizing particles with functional groups, Functionalizing at least one of the first and second contact points with a functional group, Covalently bonding at least a portion of the particle to at least one of the first and second contact points, It also includes. In other words, a particle can be functionalized with a first and / or second contact point. When both bonding partners, i.e., the particle and the first or second contact point, are functionalized, the particle can bond to each bonding partner (i.e., the first or second contact point) via covalent bonding. When only one bonding partner, i.e., the particle or the first or second contact point, is functionalized, the particle can bond to each bonding partner (i.e., the first or second contact point) via weak interactions.

[0037] The suspensions mentioned above contain, as basic substances, a solvent that includes at least one of the following substances: water and ethanol.

[0038] It is preferable to apply the suspension to at least one of the parts and then perform a drying step to dry at least one of the parts.

[0039] In addition, the electronic unit can be heated for a short time above the melting point of the particles contained in the conductive structure. Heating of the unit can be done, for example, in a reflow oven at temperatures of 40°C to 250°C. This melts the individual particles, forming a cohesive conductive solid that electrically and mechanically connects the opposing contacts. Alternatively or additionally, the particles and / or underfill can be released and / or cross-linked through the reflow process.

[0040] Finally, an electrical insulating material can be applied to at least one of the components, either before or after joining the components together. In electronic equipment manufacturing, particularly in flip-chip mounting, the electrical insulating material is also called underfill. The main reason for using underfill is the difference in thermal expansion coefficients between the silicon chip and the substrate. Without underfill, temperature changes can place a very high load on the connection between the chip and the substrate, leading to fatigue and cracking. In addition, underfill helps to prevent short circuits.

[0041] As an underfill or electrical insulating material, for example, an adhesive, particularly epoxy resin, PU adhesive, or acrylate adhesive can be used.

[0042] According to the second variant, nanocapsules and / or microcapsules containing conductive particles are coated onto at least one of the components. Encapsulation allows for the provision of a specified mass or volume of particles or other substances at a given location, and their release as intended via an activation mechanism.

[0043] With respect to a second variant, the present disclosure is a method for manufacturing an electronic unit comprising a first component, for example in the form of an integrated circuit, having a plurality of first electrical contacts, and a second component, having a plurality of second electrical contacts, the method comprising at least, The steps include manufacturing and / or preparing capsules (i.e., first capsules) each containing one or more conductive particles, The steps include applying the capsule (for example, as a suspension or powder) to at least one of the parts, A step of arranging a first component and a second component together with opposing first contacts and second contacts at a given distance, wherein the application of the suspension can be performed, for example, before or after arranging the first component and the second component. The steps include activating a capsule such that conductive particles are released and placed on the electrical contacts of at least one component, forming a conductive structure containing one or more conductive particles, Regarding the method of doing so.

[0044] According to preferred embodiments of the present disclosure, a suspension containing the capsules as a suspended substance is prepared. The suspension is applied to one or both of the parts. Alternatively, the capsules may be applied to the parts(s) as a powder or paste, and optionally using a template.

[0045] From the prior art, various methods for manufacturing nanocapsules or microcapsules are known. For example, capsules can be manufactured by solvent evaporation, thermal gelation, gel formation, interfacial polycondensation, polymerization, spray drying, fluidized bed, droplet freezing, extrusion, supercritical fluid, coacervation, air suspension, pan coating, coextrusion, solvent extraction, molecular incorporation, spray crystallization, phase separation, emulsion, in situ polymerization, interfacial deposition, emulsification by nanomolecular sieving, ion channel gelation, coacervation phase separation, matrix polymerization, interfacial crosslinking, solidification, centrifugal extrusion, and / or one or more further methods.

[0046] The shell of the capsule containing the conductive particles is preferably functionalized so that the capsule bonds particularly strongly to the metal surface of the electrical contact, for example, by weak interactions and / or covalent bonds. Alternatively or additionally, the electrical contact and possibly the particles themselves can also be functionalized. All of the foregoing and subsequent statements in this disclosure relating to the functionalization of the particles, the first contact, and / or the second contact apply equally to the methods described herein.

[0047] According to one embodiment of the present disclosure, a capsule containing particles is functionalized with one or more thiol groups. The electrical contacts are preferably not functionalized, but optionally the first contact, the second contact, or both the first and second contacts may be functionalized. In other respects, all of the foregoing of the present disclosure applies equally to the functionalization of the capsule and / or the electrical contacts.

[0048] According to one embodiment, the method further includes the steps of functionalizing only the capsule (also called the first capsule) with a functional group, and bonding at least a portion of the (first) capsule to at least one of the first and second contacts via a weak interaction. In other words, only the (first) capsule can be functionalized, and it can be bonded to the first and / or second contacts via a weak interaction. Optionally, the particle, the first contact, and / or the second contact can be functionalized.

[0049] According to one embodiment, this method is Functionalizing the (first) capsule with a functional group, Functionalizing at least one of the first and second contact points with a functional group, Covalently bonding at least a portion of the (first) capsule to at least one of the first and second contact points, It also includes. In other words, the (first) capsule, the particle, the first contact point, and / or the second contact point can be functionalized.

[0050] The shell of a microcapsule or the coating on the surface of a microcapsule may, in particular, include the following substances: for example, albumin, gelatin, collagen, agarose, chitosan, starch, carrageenan, polystarch, polydextran, lactide, glycolide and copolymer, polyalkylcyanoacrylate, polyanhydride, polyethyl methacrylate, acrolein, glycidyl methacrylate, epoxy polymer, gum arabic, polyvinyl alcohol, methylcellulose, metals, metal nanoparticles, carboxymethylcellulose, hydroxyethylcellulose, arabinogalactan, polyacrylic acid, ethylcellulose, polyethylene, polymethacrylate, polyamide (nylon), polyethylene vinyl acetate, cellulose nitrate, silicone, poly(lactide-co-glycolide), paraffin, carnauba wax, whale wax, beeswax, stearic acid, stearyl alcohol, glycerol stearate, shellac, cellulose acetate phthalate, zein, hydrogel, etc.

[0051] To release the substances contained within a capsule, the capsule can be opened precisely as intended. This can also be called "activation." Activation can be achieved, for example, by changes in pressure and pH, UV radiation, penetration, temperature, light intensity, humidity, ultrasound, induction, water addition, or by enzymes. This allows for precise control over the timing of the release of the substances contained within the capsule.

[0052] The capsule is preferably activated in accordance with this disclosure after both the first and second components have been joined together.

[0053] As capsules, for example, simple core-shell capsules, capsules having cationic or anionic properties, capsules having multiple shells or multiple layers of shell material (so-called multilayer microcapsules), and granules can be used.

[0054] A capsule may be a single capsule, or it may be part of a multi-capsule system that includes multiple capsules that can optionally be bound to one another. For example, a multi-capsule system such as a two-component capsule system (2K capsule system) can be used to release different substances in a specified amount or ratio. It should be emphasized here that the components of a multi-capsule system may consist of multiple unbound capsules or multiple bound capsules.

[0055] The individual capsules in a multi-capsule complex may be identical or different. These individual capsules may differ, for example, in shell material, shell thickness, size, capsule contents, or activation mechanism.

[0056] For example, a capsule system that reacts to pressure and releases a liquid accordingly is known from U.S. Patent Application Publication 2012 / 0107601. Further capsule systems are known from International Publication 2017 / 192407, U.S. Patent No. 8,747,999, International Publication 2017 / 042709, International Publication 2016 / 049308, and International Publication 2018 / 028058.

[0057] According to preferred embodiments of the present disclosure, conductive particles are contained in a first capsule, the first capsule can optionally be coupled with at least one second capsule. The second capsule may be empty or may contain, for example, an electrical insulating material (underfill) or other desired material.

[0058] Alternatively, single capsules not bound to other capsules may be used. According to one embodiment of the present disclosure, a first group of capsules containing conductive particles is provided, and a second group of capsules containing a second material, in particular an underfill, is provided. Both groups can be applied simultaneously or sequentially to components (or more) of an electronic unit.

[0059] The method may further include the step of applying a second capsule containing an electrical insulating material to at least one of the first and second components.

[0060] According to one embodiment, one or more of the following elements, namely a first electrical contact, a second electrical contact, particles, a first capsule containing conductive particles, a second capsule containing insulating material, a first intermediate region between directly adjacent first electrical contacts of a first component, and a second intermediate region between directly adjacent second electrical contacts of a second component, are functionalized with one or more functional groups.

[0061] In particular, in a multicapsule system comprising a first capsule and a second capsule that can be optionally bonded, heterogeneous functionalization of complementary bonding partners is possible, in which case the functionalization of the first capsule and the second capsule may differ. Alternatively or additionally, the functionalization of the first and second contact points may differ from the functionalization of the first and second intermediate regions.

[0062] For example, a first gap or intermediate region can be provided between directly adjacent first electrical contacts of a first component, and a second gap or intermediate region can be provided between directly adjacent second electrical contacts of a second component, with the second gap facing the first gap. In order to form a conductive structure between the opposing first and second electrical contacts by particles contained in the first capsule, the first capsule and at least one of the first and second contacts can be functionalized to bond the first capsule to the first and / or second contacts. For example, the first capsule can be functionalized with a thiol group or an amine, and the first and / or second electrical contacts can be provided with corresponding complementary functionalization such as a thiol group or a carboxyl group. Optionally, to ensure the bonding of particles to the first and / or second contacts, the particles can also be functionalized with a thiol group or an amine, similar to the first capsule. However, other complementary functionalizations, as described above and below, are also possible.

[0063] Alternatively or additionally, it may be conceivable to functionalize the second capsule and the first and / or second gaps of the first and / or second component. This functionalization can optionally differ from the functionalization of the first capsule, electrical contacts, and / or particles. This ensures that the second capsule accumulates in the gaps and the first capsule accumulates between the electrical contacts.

[0064] For example, the second capsule can be functionalized with an amine or thiol group, and the first intermediate region and / or the second intermediate region can be provided with corresponding complementary functionalizations such as a carboxyl group or a thiol group. However, other complementary functionalizations, as described above and below, are also possible.

[0065] The size of the first capsule can roughly correspond in one dimension to, for example, the size of an electrical contact (e.g., the length or width of the contact in the case of a rectangular contact surface).

[0066] According to preferred embodiments of the present disclosure, the size of the second capsule generally corresponds to the distance between two adjacent electrical contacts of the same component. This reduces the distance between directly adjacent contacts of the first or second component. This also reduces the structural size of the electronic unit and / or improves the circuit density or the contact density of the first and / or second contacts.

[0067] The first capsule and the second capsule can be activated sequentially in time, for example. However, the first capsule and the second capsule can also be activated simultaneously.

[0068] Delayed activation of the second capsule can be achieved, for example, by the second capsule containing a thicker shell and / or a different shell material than the first capsule. Alternatively, delayed and / or sequential activation of the first and second capsules can be achieved, for example, by different activation mechanisms that activate the first and second capsules by increasing temperature and / or pressure and / or other methods. The first capsule can be activated, for example, by heating to a first temperature at a first time point, and the second capsule can be activated at a second time point later than the first time point by heating to a second temperature higher than the first temperature.

[0069] The shells of the first and second capsules may contain at least partially crosslinked (co)polymers. Sequential or temporally sequential activation of the first and second capsules may occur due to different degrees of crosslinking of the (co)polymers in the shells of the first and second capsules. Alternatively or additionally, different activation mechanisms may be used for the activation of the first and second capsules. For example, the first capsule may be activated by temperature and / or temperature-inducible, and the second capsule may be activated by pressure and / or pressure-inducible or otherwise.

[0070] Preferably, at least one of the capsules in the multi-capsule system is functionalized. The first and / or second contacts may also be functionalized selectively or additionally. According to a preferred embodiment of the present disclosure, the first capsule containing conductive particles is functionalized with one or more functional groups. The second capsule containing an electrical insulating material is preferably not functionalized, but may be functionalized at an optional rate.

[0071] Functional groups can essentially bond to elements directly or via so-called linkers. The choice of linker essentially determines the distance between the functionalized element (particles and / or electrical contacts and / or capsules) and a second element to which the functionalized element selectively bonds. Possible linkers include, for example, biopolymers, proteins, silk, polysaccharides, cellulose, starch, chitin, nucleic acids, synthetic polymers, homopolymers, DNA, halogens, polyethylene, polypropylene, polyvinyl chloride, polylactam, natural rubber, polyisoprene, copolymers, random copolymers, gradient copolymers, alternating copolymers, block copolymers, graft copolymers, acrylonitrile butadiene styrene (ABS), styrene acrylonitrile (SAN), butyl rubber, polymer blends, polymer alloys, inorganic polymers, polysiloxanes, polyphosphazenes, polysilazanes, ceramics, basalt, isotactic polymers, syndiotactic polymers, atactic polymers, linear polymers, crosslinked polymers, elastomers, thermoplastic elastomers, thermosetting plastics, semicrystalline linkers, thermoplastics, cis-trans polymers, conductive polymers, and supramolecular polymers.

[0072] In one embodiment, the first capsule and the second capsule can be linked to each other via one or more of the linkers listed above. In particular, the first capsule and the second capsule can be covalently linked to each other.

[0073] Further aspects of this disclosure relate to one or more electronic units manufactured according to one or more of the above and below manufacturing methods.

[0074] The following describes exemplary embodiments with reference to the drawings. The representations in the drawings are schematic and not to scale. When the same or similar reference numerals are used in the following description of the drawings, they refer to the same or similar elements.

[0075] The present disclosure will be described in more detail below, with reference to the attached drawings. [Brief explanation of the drawing]

[0076] [Figure 1] This is a diagram of an electronic unit comprising two components electrically connected to each other via a conductive structure made of numerous conductive particles. [Figure 2] This is a diagram of the electronic unit in Figure 1 with underfill added. [Figure 3] This is a diagram of an electronic unit comprising two components and an additional spacer. [Figure 4] This figure shows one of various states of a method for manufacturing an electronic unit comprising two electronic components, in which a suspension containing conductive particles as a suspended substance is applied to one of the components before both components are joined together. [Figure 5] This figure shows one of various states of a method for manufacturing an electronic unit comprising two electronic components, in which a suspension containing conductive particles as a suspended substance is applied to one of the components before both components are joined together. [Figure 6] This figure shows one of various states of a method for manufacturing an electronic unit comprising two electronic components, in which a suspension containing conductive particles as a suspended substance is applied to one of the components before both components are joined together. [Figure 7] This figure shows one of various states of a method for manufacturing an electronic unit comprising two electronic components, in which a suspension containing conductive particles as a suspended substance is applied to one of the components before both components are joined together. [Figure 8] This figure shows one of various states of a method for manufacturing an electronic unit comprising two electronic components, in which a suspension containing conductive particles as a suspended substance is applied to one of the components before both components are joined together. [Figure 9] This figure shows one of various states of a method for manufacturing an electronic unit comprising two electronic components, in which a suspension containing conductive particles as a suspended substance is applied to one of the components before both components are joined together. [Figure 10] This figure shows one of various states of a method for manufacturing an electronic unit comprising two electronic components, in which a suspension containing conductive particles as a suspended substance is applied to one of the components before both components are joined together. [Figure 11] This figure shows one of various states of a method for manufacturing an electronic unit comprising two electronic components, in which, after the components are joined together, a suspension containing conductive particles as a suspended material is applied to both components of the electronic unit. [Figure 12] This figure shows one of various states of a method for manufacturing an electronic unit comprising two electronic components, in which, after the components are joined together, a suspension containing conductive particles as a suspended material is applied to both components of the electronic unit. [Figure 13] This figure shows one of various states of a method for manufacturing an electronic unit comprising two electronic components, in which, after the components are joined together, a suspension containing conductive particles as a suspended material is applied to both components of the electronic unit. [Figure 14] This figure shows one of various states of a method for manufacturing an electronic unit comprising two electronic components, in which, after the components are joined together, a suspension containing conductive particles as a suspended material is applied to both components of the electronic unit. [Figure 15] This figure shows one of various states of a method for manufacturing an electronic unit comprising two electronic components, in which, after the components are joined together, a suspension containing conductive particles as a suspended material is applied to both components of the electronic unit. [Figure 16]This figure shows one of various states of a method for manufacturing an electronic unit comprising two electronic components, in which a suspension containing encapsulated particles is applied to one of the components before both components are joined together. [Figure 17] This figure shows one of various states of a method for manufacturing an electronic unit comprising two electronic components, in which a suspension containing encapsulated particles is applied to one of the components before both components are joined together. [Figure 18] This figure shows one of various states of a method for manufacturing an electronic unit comprising two electronic components, in which a suspension containing encapsulated particles is applied to one of the components before both components are joined together. [Figure 19] This figure shows one of various states of a method for manufacturing an electronic unit comprising two electronic components, in which a suspension containing encapsulated particles is applied to one of the components before both components are joined together. [Figure 20] This figure shows one of various states of a method for manufacturing an electronic unit comprising two electronic components, in which a suspension containing encapsulated particles is applied to one of the components before both components are joined together. [Figure 21] This figure shows one of various states of a method for manufacturing an electronic unit comprising two electronic components, in which a suspension containing encapsulated particles is applied to one of the components before both components are joined together. [Modes for carrying out the invention]

[0077] Figure 1 shows an electronic unit 1 comprising two components 2 and 4 that are electrically connected to each other via a conductive structure 8 made of numerous conductive particles 9.

[0078] The first component 2 may be, for example, a die or a chip in a housing, which includes an integrated circuit 6 and has a plurality of electrical contacts 3 arranged adjacent to each other on its surface. The second component 4 may be, for example, a chip housing, a further chip, a circuit board, or any other substrate 7, which similarly has a plurality of electrical contacts 5 arranged at a distance from each other.

[0079] The conductive particles 9 are preferably microparticles or nanoparticles, which may be made of, for example, gold, silver, copper, tin, zinc, or various alloys, or base metals having a contact surface with another metal. In the illustrated embodiment, the particles are rod-shaped nanoparticles aligned parallel to each other in a given direction, and these particles are in contact with each other.

[0080] Due to the small size of particle 9, the distance between opposing contact points 3 and 5 in the contact pair becomes particularly small, and can be, for example, 500 nm or less.

[0081] The conductive particles 9 and / or contacts 3 or 5 are preferably functionalized such that the particles 9 are bonded to the electrical contacts 3 and 5.

[0082] Figure 2 shows the configuration of Figure 1, in which an electrical insulating material 11 (so-called underfill) is additionally provided in the gap 10 between adjacent contact pairs 3 and 5. The underfill can be, for example, epoxy resin, PU adhesive, or acrylate adhesive, plastic, or polymer.

[0083] Figure 3 shows an alternative embodiment of the electronic unit 1, in which each component 2 and 4 is provided with a spacer 12, the spacer 12 being sized such that when both components 2 and 4 are joined together, the opposing contact surfaces of the contacts 3 and 5 are at a given distance from each other. In the illustrated embodiment, the spacer protrudes outward from the components 2 and 4 and is realized as a projection made of a non-conductive material. In other respects, the electronic unit 1 shown in Figure 2 is ideally identical in structure to the electronic unit 1 in Figure 1; therefore, please refer to the description in Figure 1.

[0084] Figures 4 to 10 show various states of a method for manufacturing an electronic unit 1, in which a suspension 13 containing conductive particles 9 as a suspended substance is applied to one of the components 2 and 4 before both components 2 and 4 are joined together.

[0085] Here, the particles 9 are functionalized with thiol groups and therefore selectively bond to the metal surface of the electrical contact 5. Furthermore, the electrical contact 5 may also be functionalized and have one or more functional groups.

[0086] Figure 4 shows the suspension 13 containing conductive particles 9 being poured from the container 14 onto the second component 4.

[0087] Figure 5 shows the state in which conductive particles 9 accumulate on the metal surface of the second electrical contact 5 through functionalization during the manufacturing process. In contrast, in the gap 10 between adjacent electrical contacts 5, the bonding effect is weaker or absent, so there are fewer conductive particles 9 present there.

[0088] Figure 6 illustrates a further embodiment in which both the conductive particles 9 and the second electrical contact 5 are functionalized. Here, the conductive particles 9 include a first functional group R1, such as a carboxyl group, and the electrical contact 5 includes a second functional group R2, such as a primary amine. Furthermore, the functional groups R1 and R2 of both are bonded to each other particularly strongly and selectively so that the desired aggregation of the conductive particles 9 occurs on the electrical contact 5.

[0089] Figure 7 shows a further method step in which conductive particles 9 that are not adhering to the surface of the second component 4 are washed away by a cleaning solution 15. For example, water, ethanol, or a mixture thereof can be used as the cleaning solution 15. Alternatively, compressed air or other fluids can be used in the cleaning process. It is preferable that the unbound conductive particles 9 are washed away in the fluid flow. Regarding the fluid velocity, care should be taken not to make the velocity too high so that the particles 9 placed on the electrical contacts 5 do not unintentionally detach.

[0090] In Figure 8, both electronic components 2 and 4 are joined together by opposing contacts 3 and 5 so as to be electrically connected via aggregates of conductive particles 9.

[0091] Figure 9 shows the application of underfill 11 to the gap 10 between adjacent contact pairs 3 and 5 of the electronic unit 1. The underfill can be applied, for example, by a measuring device around the electronic unit 1, as is known from electronic equipment manufacturing, and flows through the gap 10 of the electronic unit 1 until the gap 10 is filled with the underfill 11, based on capillary action. The underfill can be, for example, an adhesive such as epoxy resin, or another electrical insulating material. As a result, an electronic unit 1 with a very compact structure is obtained, as shown in Figure 10.

[0092] Figures 11 to 15 show various states of a method for manufacturing an electronic unit 1, in which conductive particles 9 are applied in the form of a suspension 13 after both components 2 and 4 have been joined together.

[0093] Figure 11 shows an electronic unit 1 comprising two electrical components 2 and 4, each having a plurality of planar contacts 3 and 5. The components 2 and 4 are arranged together with opposing electrical contacts 3 and 5 such that the first electrical contact 3 and the second electrical contact 5 are in contact. In the illustrated embodiment, the first electrical contact 3 and the second electrical contact 5 each have portions that protrude beyond the remaining contact surfaces, and these portions function as spacers 12. The remaining contact surfaces are positioned at a distance from each other.

[0094] After joining parts 2 and 4 together, a suspension 13 containing conductive particles 9 as a suspended substance is applied. This is shown in Figure 12.

[0095] The conductive particles 9 are functionalized with thiol groups and therefore preferably accumulate on the metal surfaces of the electrical contacts 3 and 5. As shown in Figure 13, the free space remaining between the opposing contact surfaces of the electrical contacts 3 and 5 is filled with the conductive particles 9.

[0096] Figure 14 shows the process steps for washing away conductive particles 9 that are not bonded to the metal surface using a cleaning solution 15. As described above, the cleaning solution may include water, ethanol, or other fluids.

[0097] Finally, in Figure 15, we add underfill 11 as already described above with respect to Figure 10.

[0098] Finally, Figures 16 to 21 further illustrate various states of the method for manufacturing the electronic unit 1, in which conductive particles 9 are coated in the form of capsules K.

[0099] In the illustrated embodiment, a double capsule is used, comprising a first capsule K1 and a second capsule K2 bonded together. The first capsule K1 contains conductive particles 9, and the second capsule K2 contains an electrical insulating material 11 or underfill. Capsule K can be manufactured by known processes, as described earlier. Bonding the two capsules K1 and K2 to form a double capsule can be achieved, for example, by functionalization, as also described in the general part of this specification.

[0100] Figure 16 shows that the suspension 13, containing numerous double capsules 17 as suspended material, is first applied. In this case, the double capsules 17 are uniformly distributed on the surface by simply pouring the suspension 13 onto the surface of the second electronic component 4. The first capsules K1, containing nanoparticles, are functionalized with thiol groups and therefore bond particularly strongly to the metal surface of the second contact 5.

[0101] The size of the first capsule K1 roughly corresponds to the size of the contact surface of the electrical contact 5. On the other hand, the size of the second capsule K2 roughly corresponds to the distance 10 between two adjacent electrical contacts 5. The second capsule K2 is not functionalized. Therefore, after the suspension 13 is applied to the surface of the second component 4, the double capsules 17 are arranged as shown in Figures 17 and 18. Here, the first capsule K1 is located on each contact surface of the electrical contact 5, and the second capsule K2 substantially fills the space between adjacent electrical contacts 5.

[0102] In the next method step, the first electronic component 2 is positioned on the second component 4 such that the contact surfaces of the first component 2 and the second component 4 face each other at a given distance (see arrow B in Figure 19). The desired distance between components 2 and 4 is again achieved by a spacer 12 (not shown).

[0103] Subsequently, the first capsule K1 is activated by increasing the temperature, thereby releasing the nanoparticles 9 contained within. Since the nanoparticles 9 are functionalized with thiol groups, they selectively bond to the metal surfaces of the first contact 3 and the second contact 5. The electrical contacts 3 and 5 can also be functionalized selectively or additionally.

[0104] Next, in the following step, the second capsule K2 is activated (see Figure 20), thereby releasing the underfill 11 contained within it. Delaying the activation of the second capsule K2 can be achieved, for example, by the second capsule K2 containing a thicker shell and / or a different shell material than the first capsule. Alternatively, this can be done by further temperature or pressure increases, or by other means. Subsequently, as seen in Figure 20, the underfill 11 spreads into the space between the electrical contacts 3 and 5, firmly bonding the two components 2 and 4 together. The completed electronic unit 1 is shown in Figure 21.

[0105] The shells of the first and second capsules may contain at least partially crosslinked (co)polymers. Sequential or temporally sequential activation of the first and second capsules may occur due to different degrees of crosslinking of the (co)polymers of the shells of the first and second capsules. Alternatively or additionally, different activation mechanisms may be used for the activation of the first and second capsules.

[0106] The contact between the first contact 3 and the second contact 5 using microparticles or nanoparticles 9, as used here, results in a very low packing density, which in turn allows for the manufacture of a small, compact electronic unit 1. Moreover, this method is particularly simple and cost-effective.

[0107] Please note that "includes" and "equip" do not exclude other elements or steps, and words that do not specify a quantity do not exclude the possibility of being plural.

[0108] Furthermore, it should be noted that any features or steps described with reference to one of the above embodiments may be used in combination with other features or steps of the other embodiments described above. Reference numerals in the claims should not be construed as limiting. The present invention may include the following embodiments. Section 1. A method for manufacturing an electronic unit (1) comprising a first component (2) having a plurality of first electrical contacts (3) including an integrated circuit (6), and a second component (4) having a plurality of second electrical contacts (5), Prepare capsules (K) each containing one or more conductive particles (9), The capsule (K) is applied to at least one of the aforementioned parts (2, 4), The first component (2) and the second component (4) are arranged together with the opposing first contact (3) and second contact (5) at a given distance, The capsule (K) is activated such that the conductive particles (9) are released and placed on the electrical contacts (3, 5) of at least one of the components (2, 4), forming a conductive structure (8) containing one or more of the conductive particles (9). Methods that include... Section 2. A method for manufacturing the electronic unit (1) described in item 1, wherein the capsule (K) is activated after the first component (2) and the second component (4) are arranged together with the opposing first contact (3) and second contact (5). Section 3. A method for manufacturing an electronic unit (1) as described in item 1 or 2, wherein the conductive particles (9) are contained within a first capsule (K1), and the method further comprises coating at least one of the first component (2) and the second component (4) with a second capsule (K2) containing an electrical insulating material (11). Section 4. A method for manufacturing an electronic unit (1) according to any one of items 1 to 3, wherein the conductive particles (9) are contained within a first capsule (K1), the first capsule (K1) is coupled with at least one second capsule (K2) containing an electrical insulating material (11), and the capsules (K1, K2) are applied to at least one of the components (2, 4). Section 5. A method for manufacturing an electronic unit (1) as described in item 3 or 4, wherein the size of the first capsule (K1) generally corresponds in one dimension to the size of the electrical contacts (3, 5). Section 6. A method for manufacturing an electronic unit (1) as described in any one of paragraphs 3 to 5, wherein the size of the second capsule (K2) is approximately equal to the distance between two adjacent electrical contacts (3, 5) of the same component (2, 4). Section 7. A method for manufacturing an electronic unit (1) as described in any one of paragraphs 3 to 6, wherein the first capsule (K1) and the second capsule (K2) are activated sequentially in time. Section 8. A method for manufacturing an electronic unit (1) as described in any one of paragraphs 1 to 7, wherein at least one of the following elements, namely the capsule (K1), the first capsule (K1), the particles (9), the first contact (3), the second contact (5), and the second capsule (K2) comprising an electrical insulating material (11), is functionalized with a functional group (R). Section 9. Functionalizing only the aforementioned capsule (K1) with a functional group, To connect at least a portion of the capsule (K1) to at least one of the first contact point (3) and the second contact point (5) via a weak interaction, The method described in any one of items 1 to 8, further including the method described in any one of items 1 to 8. Section 10. The aforementioned capsule (K1) is functionalized with a functional group, Functionalizing at least one of the first contact point (3) and the second contact point (5) with a functional group, At least a portion of the capsule (K1) is covalently bonded to at least one of the first contact point (3) and the second contact point (5), The method described in any one of items 1 to 9, further including the method described in any one of items 1 to 9. Section 11. A method for manufacturing an electronic unit (1) comprising a first component (2) including an integrated circuit (6) and a plurality of first electrical contacts (3), and a second component (4) having a plurality of second electrical contacts (5), Prepare a suspension (13) containing the aforementioned particles (9) as suspended matter, The suspension (13) is applied to at least one of the parts (2, 4) such that a conductive structure (8) containing one or more of the conductive particles (9) is formed on the electrical contacts (3, 5) of at least one of the parts (2, 4). The first component (2) and the second component (4) are arranged together with the opposing first contact (3) and second contact (5) at a given distance, Washing away the conductive particles (9) from the surface of at least one of the aforementioned components (2, 4) that is not covered by the electrical contacts (3, 5), Methods that include... Section 12. A method for manufacturing the electronic unit (1) described in item 11, further comprising the step of functionalizing at least one of the following elements, namely the particle (9), the first contact (3), and the second contact (5), with a functional group (R). Section 13. Functionalizing only the aforementioned particles (9) with a functional group, To bond at least a portion of the particle (9) to at least one of the first contact point (3) and the second contact point (5) via a weak interaction, The method described in item 11 or 12, further comprising: Section 14. The aforementioned particles (9) are functionalized with a functional group, Functionalizing at least one of the first contact point (3) and the second contact point (5) with a functional group, To covalently bond at least a portion of the particle (9) to at least one of the first contact point (3) and the second contact point (5), The method described in any one of items 11 to 13, further including the method described in any one of items 11 to 13. Section 15. A method for producing an electronic unit (1) as described in any one of paragraphs 11 to 14, wherein the suspension comprises at least one of the following substances: water and ethanol. Section 16. A method for manufacturing an electronic unit (1) as described in any one of paragraphs 11 to 15, comprising applying the suspension (13) to at least one of the components (2, 4), and then performing a drying step of drying the at least one component (2, 4). Section 17. A method for manufacturing an electronic unit (1) as described in any one of paragraphs 11 to 16, comprising manufacturing the conductive structure (8) and then applying an electrical insulating material (11) to at least one of the components (2, 4). Section 18. An electronic unit (19) manufactured according to the method described in any one of the items 1 to 10 or the method described in any one of the items 11 to 17. Section 19. Electronic unit (1), A first component (2) having a plurality of first electrical contacts (3) including an integrated circuit (6), A second component (4) having multiple second electrical contacts (5), Equipped with, An electronic unit in which the first electrical contact (3) and the second electrical contact (5) are electrically connected to each other via a conductive structure (8) containing a plurality of conductive particles (9). Section 20. An electronic unit (1) as described in item 19, wherein the particle (9) is a microparticle or nanoparticle. Section 21. An electronic unit (1) according to item 19 or 20, wherein the particles (9) are rod-shaped nanoparticles aligned parallel to each other in a given direction and in direct contact with one another. Section 22. An electronic unit (1) as described in any one of paragraphs 19 to 21, wherein the second component (4) is a housing, chip, circuit board, or other board (7). Section 23. An electronic unit (1) as described in any one of paragraphs 19 to 22, wherein the first component (2) is a chip not housed in a housing. Section 24. An electronic unit (1) according to any one of paragraphs 19 to 23, wherein at least one of the following elements, namely the particle (9), the first contact (3), and the second contact (5), is functionalized by bonding with a functional group (R). Section 25. An electronic unit (1) as described in item 24, wherein the functionalized element is functionalized by a plurality of identical or different functional groups (R1, R2). Section 26. The electronic unit (1) described in item 24 or 25, wherein only the particles (9) are functionalized with a functional group, and / or An electronic unit in which the first contact (3) and the second contact (5) are each functionalized, and thereby the particle (9) is coupled to at least one of the first contact (3) and the second contact (5) via a weak interaction. Section 27. An electronic unit (1) as described in item 24 or 25, wherein the particle (9) is functionalized with a functional group, An electron unit in which at least one of the first contact (3) and the second contact (5) is functionalized with a functional group, thereby the particle (9) is covalently bonded to at least one of the first contact (3) and the second contact (5). Section 28. An electronic unit (1) according to any one of items 24 to 27, wherein the functional group comprises at least one thiol group and / or carboxyl group. Section 29. An electronic unit (1) according to any one of paragraphs 19 to 28, wherein at least the first component (2) or the second component (4) comprises a spacer (12) such that when both components (2, 4) are joined together, the opposing contact surfaces of the first contact (3) and the second contact (5) are spaced apart from each other. Section 30. An electronic unit (1) as described in any one of paragraphs 19 to 29, wherein the contacts (3, 5) of the first component (2) and the second component (4) are each located in a plane.

Claims

1. A method for manufacturing an electronic unit (1) comprising a first component (2) having a plurality of first electrical contacts (3) including an integrated circuit (6), and a second component (4) having a plurality of second electrical contacts (5), The first capsule (K1) is prepared, each containing one or more conductive particles (9), and each first capsule (K1) is bonded to at least one second capsule (K2) containing an electrical insulating material (11). The first capsule (K1) and the second capsule (K2) are applied to at least one of the aforementioned parts (2, 4), The first component (2) and the second component (4) are arranged together with the opposing first contact (3) and second contact (5) at a given distance from each other. The first capsule (K1) is activated such that the conductive particles (9) are released and placed on the electrical contacts (3, 5) of at least one of the components (2, 4), forming a conductive structure (8) containing one or more of the conductive particles (9). Methods that include...

2. A method for manufacturing the electronic unit (1) described in claim 1, comprising arranging the first component (2) and the second component (4) together with opposing first contacts (3) and second contacts (5), and then activating the capsule (K).

3. A method for manufacturing an electronic unit (1) according to claim 1 or 2, wherein the conductive particles (9) are contained within a first capsule (K1), and the method further comprises coating at least one of the first component (2) and the second component (4) with a second capsule (K2) containing an electrical insulating material (11).

4. A method for manufacturing the electronic unit (1) described in claim 1, wherein the size of the first capsule (K1) generally corresponds to the size of the electrical contacts (3, 5) in one dimension.

5. A method for manufacturing the electronic unit (1) described in claim 1, wherein the size of the second capsule (K2) is approximately equal to the distance between two adjacent electrical contacts (3, 5) of the same component (2, 4).

6. A method for manufacturing the electronic unit (1) described in claim 1, wherein the first capsule (K1) and the second capsule (K2) are activated sequentially in time.

7. A method for manufacturing the electronic unit (1) described in claim 1, wherein at least one of the following elements, namely the capsule (K1), the first capsule (K1), the particles (9), the first contact (3), the second contact (5), and the second capsule (K2) comprising an electrical insulating material (11), is functionalized with a functional group (R).

8. Functionalizing only the aforementioned capsule (K1) with a functional group, To connect at least a portion of the capsule (K1) to at least one of the first contact point (3) and the second contact point (5) via a weak interaction, The method according to claim 1, further comprising:

9. The capsule (K1) is functionalized with a functional group, Functionalizing at least one of the first contact point (3) and the second contact point (5) with a functional group, At least a portion of the capsule (K1) is covalently bonded to at least one of the first contact point (3) and the second contact point (5), The method according to claim 1, further comprising:

Images