Inspection device, inspection method, and battery manufacturing method

Abstract

To provide an inspection device, an inspection method, and a method for manufacturing a battery capable of achieving accurate inspection.SOLUTION: According to an embodiment, an inspection device includes an acquisition unit that acquires data obtained from an object to be inspected, and a processing unit that processes the data. The data includes two-dimensional magnetic field data related to a plane including first and second directions. The plane includes first and second areas, and first to third positions. The third position is a mid point between the first position and the second position in the first direction. The first area is located between the first position and the third position in the first direction. The second area is located between the third position and the second position in the first direction. The magnetic field data includes first area data related to the first area and second area data related to the second area. The processing unit inspects the object to be inspected on the basis of difference data between the first area data and second area inverted data obtained by inverting a magnetic field value included in the second area data in the first direction.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] Embodiments of the present invention relate to an inspection apparatus, an inspection method, and a battery manufacturing method.

Background Art

[0002] For example, an inspection target such as a battery is inspected by detecting a magnetic field generated from the inspection target. Inspections with higher accuracy are desired.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Embodiments provide an inspection apparatus, an inspection method, and a battery manufacturing method capable of high-accuracy inspection.

Means for Solving the Problems

[0005] According to one embodiment, the inspection apparatus includes an acquisition unit configured to acquire data obtained from an object to be inspected, and a processing unit configured to perform a first operation for processing the data acquired by the acquisition unit. The data includes two-dimensional magnetic field data relating to a plane including a first direction and a second direction intersecting the first direction. The plane includes a first region, a second region, a first position, a second position, and a third position. The direction from the first region to the second region is along the first direction. The third position is the midpoint between the first position and the second position in the first direction. The first region lies between the first position and the third position in the first direction. The second region lies between the third position and the second position in the first direction. The magnetic field data includes first region data relating to the first region and second region data relating to the second region. In the first operation, the processing unit inspects the object to be inspected based on the difference data between the first region data and the second region inverted data, which is obtained by inverting the magnetic field values ​​included in the second region data in the first direction. [Brief explanation of the drawing]

[0006] [Figure 1] Figure 1 is a schematic diagram illustrating an inspection apparatus according to the first embodiment. [Figure 2] Figure 2 is a flowchart illustrating the operation of the inspection apparatus according to the first embodiment. [Figure 3] Figure 3 is a schematic diagram illustrating an inspection apparatus according to the first embodiment. [Figure 4] Figure 4 is a schematic diagram illustrating an inspection apparatus according to the first embodiment. [Figure 5] Figure 5 is a schematic diagram illustrating an inspection apparatus according to the first embodiment. [Figure 6] Figure 6 is a schematic diagram illustrating an inspection apparatus according to the first embodiment. [Figure 7] Figure 7 is a schematic diagram illustrating an inspection apparatus according to the first embodiment. [Figure 8] Figure 8 is a schematic diagram illustrating an inspection apparatus according to the first embodiment. [Figure 9] Figure 9 is a schematic diagram illustrating an inspection apparatus according to the first embodiment. [Figure 10] Figure 10 is a flowchart illustrating a method for manufacturing a battery according to the third embodiment. [Modes for carrying out the invention]

[0007] The embodiments of the present invention will be described below with reference to the drawings. Drawings are schematic or conceptual, and the relationships between the thickness and width of each part, as well as the ratios of the sizes of different parts, are not necessarily identical to those of reality. Even when representing the same part, the dimensions and ratios may be depicted differently in different drawings. In this specification and in each figure, elements similar to those described above are denoted by the same reference numerals with respect to previously shown figures, and detailed explanations are omitted as appropriate.

[0008] (First Embodiment) Figure 1 is a schematic diagram illustrating an inspection apparatus according to the first embodiment. Figure 2 is a flowchart illustrating the operation of the inspection apparatus according to the first embodiment. Figures 3 to 7 are schematic diagrams illustrating an inspection apparatus according to the first embodiment. As shown in Figure 1, the inspection apparatus 110 according to this embodiment includes an acquisition unit 71 and a processing unit 70. The acquisition unit 71 is configured to acquire data 10A obtained from the object to be inspected 80. The processing unit 70 is configured to perform a first operation to process the data 10A acquired by the acquisition unit 71. The acquisition unit 71 is, for example, an interface. The processing unit 70 may be, for example, a processor circuit (for example, an electrical circuit).

[0009] Figure 2 illustrates an inspection method performed by the inspection device 110. As shown in Figure 2, for example, the acquisition unit 71 acquires data 10A (step S111). For example, the processing unit 70 processes the data 10A (step S112). For example, the processing unit 70 outputs the processing result (step S113). The processing result includes the inspection result.

[0010] In one example, the object under inspection 80 may be a battery 80C. The battery 80C may include, for example, a first electrode 81, a second electrode 82, and a battery section 83. The battery section 83 is provided, for example, between the first electrode 81 and the second electrode 82.

[0011] In one example, during the inspection of battery 80C, a voltage is applied between the first electrode 81 and the second electrode 82. The application of voltage causes a current to flow between the first electrode 81 and the second electrode 82. The current generates a magnetic field. The generated magnetic field is detected by a magnetic field sensor 85. The magnetic field sensor 85 may include a sensor element 86 and a control unit 87. The relative position between the sensor element 86 and the object to be inspected 80 is changed.

[0012] Thus, the magnetic field sensor 85 is configured to acquire two-dimensional magnetic field data 10D from the object under inspection 80. The control unit 87 can, for example, control changes in the relative position between the sensor element 86 and the object under inspection 80. The control unit 87 can, for example, control the orientation of the sensor element 86. The sensor element 86 can detect magnetic fields in any direction. The control unit 87 may, for example, process the signal obtained from the sensor element 86. Signal processing may include, for example, amplification. Signal processing may include any processing, for example, A / D conversion. The two-dimensional magnetic field data 10D is supplied, for example, from the control unit 87 to the acquisition unit 71.

[0013] Communication (data exchange) between the magnetic field sensor 85 and the acquisition unit 71 can be conducted using any method, whether wired or wireless. The two-dimensional magnetic field data 10D may be stored, for example, in a storage unit 70M.

[0014] The magnetic field data 10D obtained from the inspection target 80 includes two-dimensional magnetic field data 10D. Figure 3 schematically illustrates the two-dimensional magnetic field data 10D. The two-dimensional magnetic field data 10D relates to a plane PL1 that includes a first direction D1 and a second direction D2 that intersects the first direction D1. In Figure 3, the magnetic field strength in the first direction D1 and the second direction D2 is shown by the grayscale of the image.

[0015] FIG. 4 shows the positional relationship between two-dimensional magnetic field data 10D and a battery 80C in this example. As shown in FIG. 4, the magnetic field data 10D may include information related to magnetic fields in a region wider than the battery 80C.

[0016] As shown in FIG. 3 and FIG. 4, the magnetic field data 10D obtained from the inspection object 80 may include magnetic fields originating from terminals that supply a voltage (signal) to the first electrode 81 and the second electrode 82. In this example, the two-dimensional magnetic field data 10D includes a first terminal magnetic field 81H originating from a first terminal 81T electrically connected to the first electrode 81, and a second terminal magnetic field 82H originating from a second terminal 82T electrically connected to the second electrode 82.

[0017] As shown in FIG. 3, the plane PL1 includes a first region r1, a second region r2, a first position p1, a second position p2, and a third position p3. The direction from the first region r1 to the second region r2 is along the first direction D1. These positions are positions in the first direction D1. The third position p3 is the midpoint between the first position p1 and the second position p2 in the first direction D1. The first region r1 lies between the first position p1 and the third position p3 in the first direction D1. The second region r2 lies between the third position p3 and the second position p2 in the first direction D1. The magnetic field data 10D includes first region data 11D related to the first region r1, and second region data 12D related to the second region r2.

[0018] The first region data 11D corresponds to the magnetic field data (magnetic field values) in the first region 11 between the first position p1 and the third position p3. The second region data 12D corresponds to the magnetic field data (magnetic field values) in the second region 12 between the third position p3 and the second position p2.

[0019] In the first operation, the processing unit 70 inspects the inspection object 80 based on difference data between the first region data 11D and second region inverted data 12R obtained by inverting the magnetic field values included in the second region data 12D in the first direction D1. For example, when the difference data exceeds a threshold value, it is determined that a defect exists.

[0020] Figure 5 illustrates the second-domain inverted data 12R. The second-domain inverted data 12R is obtained by inverting the second-domain data 12D, as exemplified in Figure 3, with respect to the first direction D1. The difference data between this second-domain inverted data 12R (Figure 5) and the first-domain data 11D (see Figure 3) is calculated.

[0021] Figures 6 and 7 illustrate the difference data 10F. In these figures, the magnitude of the difference data 10F is indicated by the intensity of the image. As described above, the difference data 10F corresponds to the difference between the second domain inverted data 12R and the first domain data 11D. Therefore, the number of data points included in the distribution of the difference data 10F is half the number of 2D magnetic field data 10D before processing. As shown in Figures 6 and 7, the difference data 10F may include the terminal-induced magnetic field 89H, which corresponds to the difference between the first terminal magnetic field 81H and the second terminal magnetic field 82H. Since the terminal-induced magnetic field 89H is not caused by the object under inspection 80, it may be excluded from the processing for inspection of the object under inspection 80. For example, the terminal-induced magnetic field 89H may be removed from the difference data 10F. Below, we will focus on the data excluding the terminal-induced magnetic field 89H. In Figures 6 and 7, the value of the difference data 10F is locally large in the region excluding the terminal-induced magnetic field 89H. This location corresponds to the location of defect 89D in the inspection target 80.

[0022] In the example in Figure 6, the case where defect 89D is located in the first region 11 is illustrated. In the example in Figure 7, the case where defect 89D is located in the second region 12 is illustrated.

[0023] In this embodiment, the approximate location of the defect 89D may be estimated from information other than the difference data 10F described above. For example, the processing unit 70 may estimate the location of the defect 89D from the two-dimensional magnetic field data 10D prior to the processing of the first operation described above. However, the accuracy of the location of the defect 89D estimated from the two-dimensional magnetic field data 10D is low. In contrast, by using the difference data 10F relating to the difference between the two regions of data, the location of the defect 89D can be derived with high accuracy.

[0024] In this embodiment, it is not possible to accurately determine whether the location of defect 89D, derived using the difference data 10F, is located in the first region 11 or the second region 12. Therefore, by using the difference data 10F and the estimated approximate location of defect 89D, the location of defect 89D can be accurately determined.

[0025] Thus, the processing unit 70 may be configured to determine the location of the defect 89D of the inspection target 80 based on the estimation result that the location of the defect 89D of the inspection target 80 is in either the first region 11 or the second region 12, and the difference data 10F described above. The first region 11 corresponds to the region from which the first region data 11D is obtained. The second region 12 corresponds to the region from which the second region data 12D is obtained. The order of the estimation and the first operation described above is arbitrary.

[0026] The estimation that the location of defect 89D of the inspection target 80 is in either the first region 11 or the second region 12 may be made, for example, based on at least one of the following first, second, and third processes.

[0027] In the first process, based on the two-dimensional magnetic field data 10D, the highest value of the magnetic field in the first region 11 is defined as the first highest value. The highest value of the magnetic field in the second region 12 is defined as the second highest value. If the first highest value is higher than the second highest value, it is estimated that the location of defect 89D is included in the first region 11. If the first highest value is not higher than the second highest value, it is estimated that the location of defect 89D is included in the second region 12.

[0028] In the second process, estimation is performed by referring to the positions of the first electrode 81 and the second electrode 82 contained in the battery 80C. Specifically, the first distance is defined as the distance between the position where the highest value of the magnetic field in the first region 11 (first highest value) is obtained (first position) and the position of the first electrode 81, based on the two-dimensional magnetic field data 10D. The second distance is defined as the distance between the position where the highest value of the magnetic field in the second region 12 (second highest value) is obtained (second position) and the position of the second electrode 82, based on the two-dimensional magnetic field data 10D. If the first distance is shorter than the second distance, it is estimated that the position of the defect 89D is included in the first region 11. If the first distance is not shorter than the second distance, it is estimated that the position of the defect 89D is included in the second region 12.

[0029] In the third process, based on past inspection results for the inspection target 80, it is estimated that the location of the defect 89D of the inspection target 80 is in either the first region 11 or the second region 12. Past inspection results may be stored, for example, in the memory unit 70M. In the third process, the information stored in the memory unit 70M is read out, and estimation is performed based on the read out information. Past inspection results for the inspection target 80 may be obtained, for example, by machine learning.

[0030] In the first and second processes described above, the maximum value of the magnetic field may be calculated excluding the influence of the magnetic field (terminal-induced magnetic field 89H) caused by the terminals that supply the voltage (signal) applied to the first electrode 81 and the second electrode 82. In one example, the magnetic field caused by the terminals (terminal-induced magnetic field 89H) may be removed or reduced based on the difference between the two-dimensional magnetic field data 10D of a known normal product and the two-dimensional magnetic field data 10D of the product being inspected 80.

[0031] As described above, the processing unit 70 may be configured to derive an estimation result from the two-dimensional magnetic field data 10D that the location of the defect 89D of the object to be inspected 80 is located in either the first region 11 or the second region 12.

[0032] In this embodiment, an estimation result may be derived, based on past inspection results, that the location of the defect 89D of the inspection target 80 is located in either the first region 11 or the second region 12.

[0033] In the examples in Figures 6 and 7, the location of defect 89D is illustrated in the image data. The location of defect 89D may also be output as coordinate values. Displaying the location of defect 89D in the image data makes it easier for the user of the inspection device 110 to recognize the inspection results.

[0034] Figures 8 and 9 are schematic diagrams illustrating an inspection apparatus according to the first embodiment. Figure 8 corresponds to the inspection results in Figure 6. The difference data 10F is displayed in the first region 11 illustrated in Figure 8. In Figure 8, the image corresponding to the case where the difference is smaller than the threshold is displayed in the second region 12. This makes it easier for the user of the inspection device 110 to recognize the location of the defect 89D. Figure 9 corresponds to the inspection results in Figure 7. The difference data 10F is displayed in the second region 12 illustrated in Figure 9. In Figure 9, the image corresponding to the case where the difference is smaller than the threshold is displayed in the first region 11. This makes it easier for the user of the inspection device 110 to recognize the location of the defect 89D.

[0035] Such an image (inspection result) may be displayed, for example, on a display device 70D (see Figure 1). The inspection device 110 may include at least one of the display device 70D and the storage unit 70M.

[0036] In the embodiment, the two-dimensional magnetic field data 10D is fine with respect to the component in the second direction D2. For example, the second direction D2 may be perpendicular to the first direction D1. For example, in the inspection of the battery 80C, there is a difference in characteristics based on positive and negative values ​​between the first electrode 81 and the second electrode 82. Therefore, the magnetic field values ​​included in the two-dimensional magnetic field data 10D are asymmetric with respect to the first direction D1. In the embodiment, the location of the defect 89D can be accurately derived by deriving the difference in the second-dimensional magnetic field data 10D for the component in the second direction D2.

[0037] In this embodiment, the two-dimensional magnetic field data 10D may include a magnetic field component in a second direction D2. The magnetic field component along the first direction D1 may be used in part of the inspection. For example, the magnetic field component along the first direction D1 may be used to estimate the approximate location of a defect 89D in the object under inspection 80.

[0038] As shown in Figure 4, the direction from the first electrode 81 to the second electrode 82 may be along the first direction D1 of the two-dimensional magnetic field data 10D. The direction from the first terminal 81T, which supplies voltage (signal) to the first electrode 81, to the second terminal 82T, which supplies voltage (signal) to the second electrode 82, may be along the first direction D1. The two-dimensional magnetic field data 10D includes the distribution of the magnetic field generated from the battery 80C when a voltage (signal) is applied between the first electrode 81 and the second electrode 82. The voltage (signal) may be supplied from the control unit 87 (Figure 1). The voltage (signal) may be, for example, an AC voltage (AC signal). The two-dimensional magnetic field data 10D may include data obtained by detection based on the frequency of the AC voltage. For example, the control unit 87 may include a lock-in amplifier. The lock-in amplifier may detect the magnetic field strength extracted in synchronization with the AC voltage (AC signal). The extracted magnetic field strength may be used as the magnetic field data 10D. This will enable inspections with higher accuracy.

[0039] (Second Embodiment) The second embodiment relates to an inspection method. In the inspection method, data 10A obtained from the object to be inspected 80 is acquired (step S111 in Figure 2). The data 10A is processed (step S112 in Figure 2).

[0040] Data 10A includes two-dimensional magnetic field data 10D relating to a plane PL1 that includes a first direction D1 and a second direction D2 intersecting the first direction D1. Plane PL1 includes a first position p1, a second position p2, and a third position p3. The third position p3 is the midpoint between the first position p1 and the second position p2 in the first direction D1. Magnetic field data 10D includes first region data 11D between the first position p1 and the third position p3, and second region data 12D between the third position p3 and the second position p2.

[0041] In this embodiment, the object to be inspected 80 is inspected based on the difference data 10F between the second region inverted data 12R, which is obtained by inverting the magnetic field value contained in the second region data 12D in the first direction D1, and the first region data 11D. High-precision inspection can be performed. The inspection result may be output (step S113 in Figure 2).

[0042] For example, the magnetic field data 10D relates to the component in the second direction D2. The second direction D2 may be perpendicular to the first direction D1. The object under inspection 80 may be a battery 80C. The battery 80C includes a first electrode 81, a second electrode 82, and a battery section 83 between the first electrode 81 and the second electrode 82. The direction from the first electrode 81 to the second electrode 82 is along the first direction D1 of the two-dimensional magnetic field data 10D. For example, the two-dimensional magnetic field data 10D includes the distribution of the magnetic field generated from the battery 80C when an AC voltage (AC signal) is applied between the first electrode 81 and the second electrode 82.

[0043] In this embodiment, the location of the defect 89D of the inspection target 80 may be determined based on the estimation result that the location of the defect 89D is in either the first region 11 or the second region 12, and the difference data 10F described above. The first region 11 corresponds to the region from which the first region data 11D is obtained. The second region 12 corresponds to the region from which the second region data 12D is obtained.

[0044] (Third embodiment) Figure 10 is a flowchart illustrating a method for manufacturing a battery according to the third embodiment. As shown in Figure 10, a battery 80C to be inspected is manufactured (step S100). The battery 80C is inspected according to the inspection method of the second embodiment (step S110). In the inspection, the processes described with respect to the first and second embodiments may be performed. High-precision inspection can be performed.

[0045] For example, the battery 80C may include a first electrode 81, a second electrode 82, and a battery section 83 between the first electrode 81 and the second electrode 82. The direction from the first electrode 81 to the second electrode 82 is along the first direction D1 of the two-dimensional magnetic field data 10D. For example, the two-dimensional magnetic field data 10D includes the distribution of the magnetic field generated from the battery 80C when an AC voltage is applied between the first electrode 81 and the second electrode 82.

[0046] For example, the location of defect 89D of the inspection target 80 may be determined based on the estimation result that the location of defect 89D is in either the first region 11 or the second region 12, and the difference data 10F. The first region 11 corresponds to the first region data 11D. The second region 12 corresponds to the second region data 12D.

[0047] As shown in Figure 10, repairs may be performed based on the inspection results (step S120). The repaired inspection target 80 (battery 80C) may be inspected again.

[0048] As shown in Figure 10, the conditions may be changed based on the inspection results (step S130). For example, the conditions include the formation conditions of the battery 80C. For example, changing the conditions may include changing the material of the battery 80C. For example, changing the conditions may include changing the design of the battery 80C. The inspection apparatus 110 and inspection method according to the embodiment may be used for defect analysis of the inspection target 80.

[0049] The embodiment may include the following configuration (e.g., proposed technical details). (Technical proposal 1) An acquisition unit configured to acquire data obtained from the object being inspected, A processing unit configured to perform a first operation to process the data acquired by the acquisition unit, Equipped with, The aforementioned data includes two-dimensional magnetic field data relating to a plane that includes a first direction and a second direction intersecting the first direction. The plane includes a first region, a second region, a first position, a second position, and a third position. The direction from the first region to the second region is along the first direction, The third position is the midpoint between the first position and the second position in the first direction. The first region is located between the first position and the third position in the first direction. The aforementioned second region is located between the aforementioned third position and the aforementioned second position in the aforementioned first direction. The magnetic field data includes first region data relating to the first region and second region data relating to the second region. The processing unit inspects the object to be inspected in the first operation based on the difference data between the first region data and second region inverted data, which is obtained by inverting the magnetic field values ​​included in the second region data in the first direction.

[0050] (Technical proposal 2) The magnetic field data relating to the component in the second direction is obtained using the inspection apparatus described in Technical Proposal 1.

[0051] (Technical proposal 3) The inspection apparatus according to Technical Proposal 1 or 2, wherein the second direction is perpendicular to the first direction.

[0052] (Technical proposal 4) The inspection device described in any one of Technical Proposals 1 to 3, wherein the object of inspection is a battery.

[0053] (Technical proposal 5) The battery includes a first electrode, a second electrode, and a battery section between the first electrode and the second electrode. The inspection apparatus according to Technical Proposal 4, wherein the direction from the first electrode to the second electrode is along the first direction of the two-dimensional magnetic field data.

[0054] (Technical proposal 6) The inspection apparatus according to Technical Proposal 5, wherein the two-dimensional magnetic field data includes the distribution of the magnetic field generated from the battery when an alternating voltage is applied between the first electrode and the second electrode.

[0055] (Technical proposal 7) The processing unit is configured to determine the location of the defect based on the estimation result that the location of the defect to be inspected is in either the first region or the second region, and the difference data. The first region corresponds to the data of the first region, The second region is an inspection device described in any one of Technical Proposals 1 to 6, corresponding to the data in the second region.

[0056] (Technical proposal 8) The inspection apparatus according to Technical Proposal 7, wherein the processing unit is configured to derive the estimation result from the two-dimensional magnetic field data.

[0057] (Technical proposal 9) An inspection apparatus according to any one of Technical Proposals 1 to 8, further comprising a magnetic field sensor configured to acquire the two-dimensional magnetic field data from the object to be inspected.

[0058] (Technical proposal 10) We obtain data from the subjects of the test, Processing the aforementioned data, The aforementioned data includes two-dimensional magnetic field data relating to a plane that includes a first direction and a second direction intersecting the first direction. The plane includes a first region, a second region, a first position, a second position, and a third position. The direction from the first region to the second region is along the first direction, The third position is the midpoint between the first position and the second position in the first direction. The first region is located between the first position and the third position in the first direction. The aforementioned second region is located between the aforementioned third position and the aforementioned second position in the aforementioned first direction. The magnetic field data includes first region data relating to the first region and second region data relating to the second region. An inspection method for inspecting an object to be inspected based on the difference data between the first region data and second region inverted data, which is obtained by inverting the magnetic field values ​​contained in the second region data in the first direction. (Technical proposal 11)

[0059] The aforementioned magnetic field data relates to the component in the second direction, as described in Technical Proposal 10.

[0060] (Technical proposal 12) The inspection method according to technical proposal 10 or 11, wherein the second direction is perpendicular to the first direction.

[0061] (Technical proposal 13) The inspection method described in any one of Technical Proposals 10 to 12, wherein the object of inspection is a battery.

[0062] (Technical proposal 14) The battery includes a first electrode, a second electrode, and a battery section between the first electrode and the second electrode. The inspection method according to technical proposal 13, wherein the direction from the first electrode to the second electrode is along the first direction of the two-dimensional magnetic field data.

[0063] (Technical proposal 15) The inspection method according to Technical Proposal 14, wherein the two-dimensional magnetic field data includes the distribution of the magnetic field generated from the battery when an alternating voltage is applied between the first electrode and the second electrode.

[0064] (Technical proposal 16) Based on the estimation result that the location of the defect to be inspected is in either the first region or the second region, and the difference data, the location of the defect is determined. The first region corresponds to the data of the first region, The second domain is the inspection method described in any one of the technical proposals 10 to 15, which corresponds to the data in the second domain.

[0065] (Technical proposal 17) The batteries to be inspected are manufactured, A method for manufacturing a battery, comprising inspecting the battery using the inspection method described in any one of Technical Proposals 10 to 12.

[0066] (Technical proposal 18) The battery includes a first electrode, a second electrode, and a battery section between the first electrode and the second electrode. A method for manufacturing a battery according to Technical Proposal 17, wherein the direction from the first electrode to the second electrode is along the first direction of the two-dimensional magnetic field data.

[0067] (Technical proposal 19) A method for manufacturing a battery according to Technical Proposal 18, wherein the two-dimensional magnetic field data includes the distribution of the magnetic field generated from the battery when an alternating voltage is applied between the first electrode and the second electrode.

[0068] (Technical proposal 20) Based on the estimation result that the location of the defect to be inspected is in either the first region or the second region, and the difference data, the location of the defect is determined. The first region corresponds to the data of the first region, The second region is a method for manufacturing a battery described in any one of Technical Proposals 17 to 19, which corresponds to the data in the second region.

[0069] According to the embodiment, a high-precision inspection device, an inspection method, and a battery manufacturing method can be provided.

[0070] The embodiments of the present invention have been described above with reference to specific examples. However, the present invention is not limited to these specific examples. For example, the specific configuration of each element, such as the acquisition unit and processing unit included in the inspection device, is included within the scope of the present invention as long as it can be implemented in the same way and similar effects can be obtained by appropriately selecting from the range known to those skilled in the art.

[0071] Furthermore, combinations of two or more elements from any of the specific examples, to the extent technically feasible, are also included within the scope of the present invention, insofar as they encompass the gist of the invention.

[0072] Furthermore, all inspection devices, inspection methods, and battery manufacturing methods that can be appropriately designed and implemented by those skilled in the art based on the above-described embodiments of the present invention also fall within the scope of the present invention, insofar as they encompass the gist of the present invention.

[0073] Furthermore, within the scope of the concept of the present invention, a person skilled in the art could conceive of various modifications and alterations, and it is understood that such modifications and alterations also fall within the scope of the present invention.

[0074] While several embodiments of the present invention have been described, these embodiments are presented as examples only and are not intended to limit the scope of the invention. These novel embodiments can be carried out in a variety of other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents. [Explanation of Symbols]

[0075] 10A: Data, 10D: Magnetic field data, 10F: Difference data, 11, 12: First and second regions, 11D, 12D: First and second region data, 12R: Second region inversion data, 70: Processing unit, 70D: Display device, 70M: Memory unit, 71: Acquisition unit, 80: Object to be inspected, 80C: Battery, 81, 82: First and second electrodes, 81H, 82H: First and second terminal magnetic fields, 81T, 82T: First and second terminals, 83: Battery unit, 85: Magnetic field sensor, 86: Sensor element, 87: Control unit, 89D: Defect, 89H: Terminal-induced magnetic field 89, 110: Inspection device, D1, D2: First and second directions, PL1: Plane, p1~p3: First to third positions

Claims

1. An acquisition unit configured to acquire data obtained from the object being inspected, A processing unit configured to perform a first operation to process the data acquired by the acquisition unit, Equipped with, The aforementioned data includes two-dimensional magnetic field data relating to a plane that includes a first direction and a second direction intersecting the first direction. The plane includes a first region, a second region, a first position, a second position, and a third position. The direction from the first region to the second region is along the first direction, The third position is the midpoint between the first position and the second position in the first direction. The first region is located between the first position and the third position in the first direction. The second region is located between the third position and the second position in the first direction. The magnetic field data includes first region data relating to the first region and second region data relating to the second region. In the first operation, the processing unit inspects the object to be inspected based on the difference data between the second region inverted data, which is obtained by inverting the magnetic field values ​​included in the second region data in the first direction, and the first region data. The object of inspection is a battery, The battery includes a first electrode, a second electrode, and a battery section between the first electrode and the second electrode. The direction from the first electrode to the second electrode is along the first direction of the two-dimensional magnetic field data, The processing unit is configured to determine the location of the defect based on the estimation result that the location of the defect to be inspected is in either the first region or the second region, and the difference data. The first region corresponds to the data of the first region, The second region is an inspection device corresponding to the data in the second region.

2. The inspection apparatus according to claim 1, wherein the magnetic field data relates to the component in the second direction.

3. The inspection apparatus according to claim 1, wherein the two-dimensional magnetic field data includes the distribution of the magnetic field generated from the battery when an alternating voltage is applied between the first electrode and the second electrode.

4. The inspection apparatus according to claim 1, wherein the processing unit is configured to derive the estimation result from the two-dimensional magnetic field data.

5. The inspection apparatus according to any one of claims 1 to 4, further comprising a magnetic field sensor configured to acquire the two-dimensional magnetic field data from the object to be inspected.

6. We obtain data from the subjects of the test, Processing the aforementioned data, The aforementioned data includes two-dimensional magnetic field data relating to a plane that includes a first direction and a second direction intersecting the first direction. The plane includes a first region, a second region, a first position, a second position, and a third position. The direction from the first region to the second region is along the first direction, The third position is the midpoint between the first position and the second position in the first direction. The first region is located between the first position and the third position in the first direction. The second region is located between the third position and the second position in the first direction. The magnetic field data includes first region data relating to the first region and second region data relating to the second region. The object to be inspected is inspected based on the difference data between the second region inverted data, which is obtained by inverting the magnetic field values ​​contained in the second region data in the first direction, and the first region data. The object of inspection is a battery, The battery includes a first electrode, a second electrode, and a battery section between the first electrode and the second electrode. The direction from the first electrode to the second electrode is along the first direction of the two-dimensional magnetic field data, Based on the estimation result that the location of the defect to be inspected is in either the first region or the second region, and the difference data, the location of the defect is determined. The first region corresponds to the data of the first region, The second region is an inspection method corresponding to the data in the second region.

7. The batteries to be inspected are manufactured, A method for manufacturing a battery, comprising inspecting the battery using the inspection method described in claim 6.

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