Mounting device and mounting method

Abstract

Provided are a mounting device and a mounting method with which it is possible to reduce bonding failure due to the lapse of time from preprocessing of an electronic component and a mounting substrate to bonding. A mounting device 1 according to an embodiment comprises: a supply body cleaning unit 110; a mounting substrate cleaning unit 120; a surface processing unit 100 for processing the surfaces of a component supply body TW and a mounting substrate BW; a bonding unit 180 that mounts an electronic component E on the component supply body TW onto the mounting substrate BW; a supply body buffer unit 160 and a mounting substrate buffer unit 170 for temporarily housing the component supply body TW and the mounting substrate BW; a conveyance unit 190; and a control unit 240 for performing control so that cleaning processing of the component supply body TW and cleaning processing of the mounting substrate BW are performed simultaneously in parallel with each other.

Description

Technical Field

[0001] The present invention relates to a mounting apparatus and a mounting method.

Background Art

[0002] As a method for mounting electronic components such as semiconductor chips on a mounting substrate, there is direct bonding. Direct bonding is a method in which connection terminals of a mounting substrate and an electronic component are directly bonded to each other by solid-phase bonding without using a bonding member (adhesive) such as a solder bump. This eliminates the need to consider the influence of the bonding member, enables a narrow connection terminal pitch, and allows high-density packaging.

[0003] When an electronic component is directly bonded to a mounting substrate, pretreatment is performed on the electronic component and the mounting substrate before the bonding. In this pretreatment, surface treatments such as activation treatment and cleaning treatment, and washing treatment are performed. The activation treatment is a treatment of activating the surfaces of the electronic component and the mounting substrate by active species such as ions and radicals generated by converting a reaction gas into plasma. Activation refers to breaking chemical bonds of molecules on the surface. In addition, the cleaning treatment uses generated ions, radicals, and The activity active species to clean the surfaces of the electronic component and the mounting substrate. Cleaning refers to removing particles adhering to the surface by blowing them off, or decomposing and removing organic substances. The washing treatment is a treatment of washing particles and the like remaining on the surfaces of the electronic component and the mounting substrate.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of Invention

Problems to be Solved by the Invention

[0005] The surface condition of electronic components and mounting substrates that have undergone the above pretreatment may gradually change over time due to deactivation or the accumulation of organic matter on the surface. This may reduce the bonding strength during joining. If the bonding strength is insufficient, it will result in a faulty bond and lead to a defective product.

[0006] Furthermore, in bonding processes using bonding equipment to tightly attach electronic components to a substrate, when multiple electronic components are mounted on a single substrate, the timing of supplying the substrate and electronic components to the bonding equipment may not coincide. There are also differences in the preparation time required between electronic components and substrates, from activation and cleaning treatments until they can be fed into the bonding equipment. Such differences in processing timing and the number of components processed (number of components mounted) during the bonding process (mounting process) between electronic components and substrates can lead to differences in the surface condition during bonding, increasing the likelihood of deactivation or adhesion of organic matter to either the electronic components or the substrate.

[0007] The embodiments of the present invention aim to provide a mounting apparatus and mounting method that can reduce bonding defects caused by the passage of time from pre-treatment of electronic components and mounting substrates to bonding treatment. [Means for solving the problem]

[0008] The mounting apparatus of the embodiment includes a load port on which a transport container is mounted containing a component supply body in which wafers, separated into individual electronic components, are attached to a tape mounted on a ring, either unprocessed or processed, and a mounting substrate on which the electronic components are mounted; a supply body cleaning unit for cleaning the component supply body; a mounting substrate cleaning unit for cleaning the mounting substrate; a surface processing unit for surface-treating the surface of the component supply body and / or the mounting substrate with plasma; an adjustment processing unit for adjusting the tape so that the adhesive strength of the tape is reduced by irradiating the tape with UV light; a bonding unit for detaching the electronic components from the component supply body and mounting them on the mounting substrate; and the bonding unit This becomes acceptable. The aforementioned parts supply unit is temporarily housed, The storage facility has a compartment capable of accommodating multiple component supply units stacked at intervals.A supply buffer section and the bonding section This becomes acceptable. The previously mentioned mounting board is temporarily housed, The storage compartment has a capacity to accommodate multiple of the aforementioned mounting boards stacked with spacing between them. The system includes a mounting substrate buffer section, a transport section for transporting the component supply and the mounting substrate, and a control section for controlling the transport section to transport the component supply and / or the mounting substrate from the supply buffer section, the mounting substrate buffer section, or the bonding section to the supply cleaning section, the mounting substrate cleaning section, or the surface processing section, and the control section That was, The supply unit cleaning unit, the mounted substrate cleaning unit, and the transport unit are controlled to include a state in which the cleaning process of the component supply unit and the cleaning process of the mounted substrate are performed simultaneously and in parallel with each other. The control unit includes a normal mode processing unit that causes the surface processing unit to perform surface treatment on the component supply unit or the mounting substrate transported from the load port by the transport unit, and to mount the electronic components on the mounting substrate in the bonding unit, and a return mode processing unit that causes the surface processing unit to perform surface treatment on the component supply unit or the mounting substrate transported from the supply unit buffer unit, the mounting substrate buffer unit, or the bonding unit by the transport unit, and the control unit is provided to be able to selectively switch between executing the normal mode by the normal mode processing unit and executing the return mode by the return mode processing unit.

[0009] The mounting method of the embodiment includes a mounting step in which a transport container containing a component supply body, on which wafers separated into individual electronic components are attached to an unprocessed or processed tape attached to a ring, and a mounting substrate on which the electronic components are mounted, is mounted on a load port; a surface treatment step in which a surface treatment unit surface treats the surface of the component supply body and / or the mounting substrate with plasma; a supply body cleaning step in which a supply body cleaning unit cleans the component supply body; a mounting substrate cleaning step in which a mounting substrate cleaning unit cleans the mounting substrate, including a state in parallel with the supply body cleaning step; and an adjustment step in which an adjustment unit adjusts the tape by irradiating it with UV light so that the adhesive strength of the tape is reduced. , Bo The bonding section includes a bonding process in which the electronic component is detached from the component supply body and mounted on the mounting substrate, It has a storage compartment capable of accommodating multiple of the aforementioned component supply units stacked at intervals. The supply buffer section, Before the bonding portion becomes acceptable A supply body housing step for temporarily housing the aforementioned parts supply body, It has a storage compartment capable of accommodating multiple of the aforementioned mounting boards stacked with spacing between them. The mounted board buffer section is Before the bonding portion becomes acceptable The process includes a mounting board housing step for temporarily housing the aforementioned mounting board. The surface processing unit is selectively switched to perform a normal mode in which it performs surface treatment on the component supply unit or the mounting substrate transported from the load port by the transport unit, and the bonding unit mounts the electronic components onto the mounting substrate, or to perform a return mode in which it performs surface treatment on the component supply unit or the mounting substrate transported from the supply unit buffer unit, the mounting substrate buffer unit, or the bonding unit by the transport unit. [Effects of the Invention]

[0010] Embodiments of the present invention can reduce bonding defects caused by the passage of time from pre-treatment of electronic components and mounting substrates to bonding treatment. [Brief Description of the Drawings]

[0011] [Figure 1] This is an explanatory diagram showing the processing of the mounting apparatus of the embodiment. [Figure 2] This is a simplified perspective plan view showing the configuration of the mounting apparatus of the embodiment. [Figure 3] This is a simplified configuration diagram showing the supply body cleaning unit and the mounting substrate cleaning unit of the mounting apparatus. [Figure 4] This is a block diagram showing the control unit. [Figure 5] This is a flowchart showing the operation procedure of the embodiment. [Figure 6] This is a timing chart showing the operation procedure of the embodiment. [Figure 7] This is a flowchart showing the operation procedure of the return mode of the embodiment. [Mode for Carrying Out the Invention]

[0012] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the drawings are schematic diagrams, and the sizes, ratios, and the like of respective portions include parts exaggerated for ease of understanding.

[0013] [Overview] In the present embodiment, as shown in FIG. 1, processing is performed targeting the component supply body TW and the mounting substrate BW. The component supply body TW is configured such that a wafer (semiconductor wafer) W is affixed to a tape T attached to a ring R. The wafer W at this time is singulated into individual electronic components E. The tape T is a stretchable sheet having an adhesive surface, and its adhesive force can be reduced by irradiation with UV (ultraviolet) light. The mounting substrate BW is a wafer (semiconductor wafer) to which the electronic components E detached from the component supply body TW are bonded (mounted). The processing for the component supply body TW in the following description means the processing for the electronic components E.

[0014] As shown in Figure 2, the mounting apparatus 1 of the present embodiment is an apparatus that performs preprocessing (activation processing, cleaning processing, washing processing) one by one on component supply bodies TW and mounting substrates BW that are supplied after a plurality of them are housed in a transport container F such as a FOUP (Front Opening Unified Pod) or FOSB (Front Opening Shipping Box) in a previous step, to mount electronic components E.

[0015] The mounting apparatus 1 is configured by arranging a plurality of chambers 12 each accommodating an apparatus for performing various processes around a base 11 which is a box-shaped container. The base 11 is provided with a load port 13 on which the transport container F is mounted. The transport container F accommodating unprocessed component supply bodies TW and mounting substrates BW is mounted on the load port 13, and the component supply bodies TW and mounting substrates BW are taken out one by one from this transport container F by a transport unit 190, to be carried into each chamber 12, processed, and carried out. Further, the base 11 is provided with an unillustrated FFU (Fan Filter Unit) on the ceiling, and is configured such that the inside of the base 11 is maintained in a clean atmosphere by generating a downflow of clean air. Such an FFU is also provided in the chambers 12 as necessary.

[0016] The mounting apparatus 1 of the present embodiment includes a preprocessing apparatus that performs preprocessing including activation processing, cleaning processing, and washing processing for the electronic components E, a buffer apparatus that temporarily houses the component supply bodies TW and the mounting substrates BW, and a bonding apparatus that pressure-bonds the electronic components E to the mounting substrates BW.

[0017] More specifically, the mounting apparatus 1 of the present embodiment is an apparatus including a surface processing unit 100, a supply body cleaning unit 110, a mounting substrate cleaning unit 120, an adjustment processing unit 130, a gauging unit 140, an alignment unit 150, a supply body buffer unit 160, a mounting substrate buffer unit 170, a bonding unit 180, a transport unit 190, and a control unit 200.

[0018] The preprocessing device is composed of a surface treatment unit 100, a supply cleaning unit 110, a mounting substrate cleaning unit 120, an adjustment processing unit 130, a gauging unit 140, and an alignment unit 150. The buffer device is composed of a supply buffer unit 160 and a mounting substrate buffer unit 170. The bonding device is composed of a bonding unit 180. The transfer device, which is a transfer unit 190, is configured to transfer workpieces to each device. Then, the control unit 200 controls each device, and the mounting device 1 is composed of these devices.

[0019] [Surface treatment] The surface treatment chamber 100 is a processing chamber for performing surface treatment on the component supply unit TW and the mounting substrate BW. Surface treatment is a process that modifies (activates, cleans) the surfaces to which the component supply unit TW and the mounting substrate BW are joined. Such modification also produces a hydrophilic effect. In this embodiment, the surface treatment chamber 100 has a plasma generator that turns a reaction gas introduced into a vacuum chamber 12 into plasma, and modifies the surfaces of the component supply unit TW and the mounting substrate BW by irradiating them with the generated ions to which they are joined.

[0020] [Supply body cleaning section] The supply unit cleaning unit 110 is a processing chamber for cleaning the component supply unit TW. The supply unit cleaning unit 110 cleans particles remaining on the plasma-treated component supply unit TW or particles generated by the plasma treatment with water. The cleaning targets are the surface of the electronic component E, the spaces between electronic component E and the adhesive surface of the tape T, and particles adhering to these surfaces are cleaned and removed. In addition to water cleaning, hydroxyl groups are also introduced to the surface of the electronic component E.

[0021] As shown in Figure 3, the supply unit cleaning unit 110 includes a cleaning chamber 111 which is a container for performing cleaning processing internally, a support part 112 which supports the parts supply unit TW, a rotating mechanism 113 which rotates the support part 112, a cup 114 which receives the splashing cleaning liquid L from around the parts supply unit TW, and a supply unit 115 which supplies the cleaning liquid L. The supply unit 115 is equipped with a nozzle 115a which drops the cleaning liquid L and a moving mechanism 115b which moves the nozzle 115a.

[0022] The cleaning process is performed by supplying a cleaning liquid L from a nozzle 115a to the surface to be processed of the parts supply body TW, which is supported by a support part 112 and rotated by a rotation mechanism 113. For example, DIW is used as the cleaning liquid L. The cleaning chamber 111 is provided with an opening 111a for loading and unloading the parts supply body TW, and the opening 111a is configured to be opened and closed by a shutter 111b.

[0023] The rotating mechanism 113 of the supply body cleaning unit 110, although not shown in the figure, includes an expander that expands the tape T of the supply body cleaning unit 110, which is supported by the support unit 112, to widen the gaps between electronic components E and clean the particles in those gaps.

[0024] [Plastic board cleaning section] The mounting substrate cleaning unit 120 is a processing chamber for cleaning the mounting substrate BW. The mounting substrate cleaning unit 120 cleans particles remaining on the plasma-treated mounting substrate BW or particles generated by the plasma treatment with water. In addition to water cleaning, it also imparts hydroxyl groups to the surface of the mounting substrate BW. Similar to the supply unit cleaning unit 110 shown in Figure 3, the mounting substrate cleaning unit 120 has a cleaning chamber 111 which is a container for performing cleaning processing inside, a support part 112 which supports the mounting substrate BW, a rotating mechanism 113 which rotates the support part 112, a cup 114 which receives the splashing cleaning liquid L from around the mounting substrate BW, and a supply part 115 which supplies the cleaning liquid L.

[0025] [Adjustment Processing Unit] The adjustment processing unit 130 adjusts the adhesive strength of the tape T of the parts supply unit TW after cleaning by irradiating it with UV light. As shown in Figure 1, the adjustment processing unit 130 has an irradiation device 131 that irradiates UV light over the entire area below the contained parts supply unit TW by scanning the UV light source.

[0026] [Gauging section] The gauging unit 140 positions the component supply unit TW. The gauging unit 140 is a contact-type centering device that adjusts the position of the component supply unit TW by contacting its outer circumference so that the center of the component supply unit TW coincides with a reference position provided inside it.

[0027] [Alignment Department] The alignment unit 150 positions the mounting substrate BW. The alignment unit 150 is a non-contact (optical) centering device that adjusts the position of the mounting substrate BW so that its center coincides with a reference position provided inside.

[0028] [Supplier Buffer Section] The supply buffer section 160 temporarily houses the component supply units TW before they are transported to the bonding section 180. As shown in Figure 1, the supply buffer section 160 has a storage compartment 161 that can accommodate multiple component supply units TW stacked at intervals.

[0029] [Mounted board buffer section] The mounting board buffer section 170 temporarily houses the mounting boards BW before they are transferred to the bonding section 180. The mounting board buffer section 170 has a storage compartment 171 that can accommodate multiple mounting boards BW stacked with spacing between them.

[0030] [Bonding section] The bonding section 180 is a processing chamber that detaches electronic components E from the component supply unit TW and mounts them onto the mounting substrate BW. Although not shown in the figures, the bonding section 180 includes a supply mechanism, a pickup mechanism, and a mounting mechanism. The electronic components E from the component supply unit TW, which are brought into the supply mechanism, are picked up by the pickup mechanism and transferred to the mounting mechanism, where they are mounted onto the mounting substrate BW. In this embodiment, as shown in Figure 1, the bonding section 180 inverts the picked-up electronic components E and mounts the pre-treated surface onto the surface of the pre-treated mounting substrate BW.

[0031] [Conveying Section] The transport unit 190 transports component supply units TW and mounted substrates BW between the load port 13 and each chamber 12, and between each chamber 12. As shown in Figure 2, the transport unit 190 has a transport robot 191 and a moving mechanism 192. The transport robot 191 is a double-arm type and has a pair of robot hands 191a. One of the pair of robot hands 191a can support the component supply units TW, and the other can support the mounted substrates BW. The moving mechanism 192 moves the transport robot 191 to position it at the load port 13 and each chamber 12. The robot hands 191a load and unload component supply units TW and mounted substrates BW into and out of each transport container F and each chamber 12.

[0032] [Control Unit] The control unit 200 is a computer that controls each part of the mounting device 1. The control unit 200 has a processor that executes programs, a memory that stores various information such as programs and operating conditions, and drive circuits that drive each element. In other words, the control unit 200 controls the surface processing unit 100, the supply body cleaning unit 110, the mounting substrate cleaning unit 120, the adjustment processing unit 130, the gauging unit 140, the alignment unit 150, the supply body buffer unit 160, the mounting substrate buffer unit 170, the bonding unit 180, and the transport unit 190. As shown in Figure 4, the control unit 200 has a storage unit 210 that stores information, an input unit 220 that inputs information, and a display unit 230 that displays information.

[0033] In this embodiment, the control unit 200 controls the transport unit 190 to transport the component supply unit TW and / or the mounting substrate BW from the supply unit buffer unit 160, the mounting substrate buffer unit 170, or the bonding unit 180 to either the supply unit cleaning unit 110, the mounting substrate cleaning unit 120, or the surface treatment unit 100.

[0034] In other words, the transport unit 190 is controlled by the control unit 200 to transport the component supply unit TW, which is housed in the supply unit buffer unit 160, to the surface treatment unit 100 and the supply unit cleaning unit 110. Similarly, the transport unit 190 is controlled by the control unit 200 to transport the mounted substrate BW, which is housed in the mounted substrate buffer unit 170, to the surface treatment unit 100 and the mounted substrate cleaning unit 120. Furthermore, the transport unit 190 is controlled by the control unit 200 to transport the component supply unit TW and mounted substrate BW from the bonding unit 180 to the surface treatment unit 100, the supply unit cleaning unit 110, and the mounted substrate cleaning unit 120.

[0035] Through this transport process, workpieces (component supply unit TW, mounting board BW) that have undergone surface treatment and cleaning are returned to the surface treatment unit 100, supply unit cleaning unit 110, and mounting board cleaning unit 120, where processing is repeated in each unit. There is no limit to the number of times this reprocessing by returning the workpieces can be repeated as needed.

[0036] Furthermore, the control unit 200 is configured to allow the transport unit 190 to switch between transporting the component supply unit TW and / or the mounted substrate BW from the supply unit buffer unit 160, the mounted substrate buffer unit 170, or the bonding unit 180 to either the supply unit cleaning unit 110, the mounted substrate cleaning unit 120, or the surface treatment unit 100, or to the transport container F of the load port 13.

[0037] The mounting apparatus 1 of this embodiment typically performs a single surface treatment or cleaning on the workpiece. process The pre-processing is performed, followed by bonding. This process is repeated until all electronic components E are bonded to the mounting area of ​​the mounting board BW. This mode, in which bonding is performed after only one pre-processing step, is called the normal mode. As will be described later, in some cases, the pre-processing can be repeated. That is, a workpiece that has already undergone pre-processing is subjected to pre-processing again. This mode, in which pre-processing is repeated and re-processed, is called the return mode because it returns to the pre-processing stage.

[0038] Furthermore, the control unit 200 of this embodiment includes a cleaning control unit 240. The cleaning control unit 240 controls the supply unit cleaning unit 110, the mounting board cleaning unit 120, and the transport unit 190 so that the cleaning process of the component supply unit TW and the cleaning process of the mounting board BW are performed simultaneously and in parallel with each other. "Performing simultaneously and in parallel" does not mean that the start and end of the cleaning of the component supply unit TW (supply unit cleaning process) and the start and end of the cleaning of the mounting board BW (mounting board cleaning process) must perfectly coincide; it is sufficient that there is an overlap in the time of both processes.

[0039] Furthermore, the control unit 200 includes a normal mode processing unit 241 and a return mode processing unit 242. The normal mode processing unit 241 performs surface treatment on the component supply body TW or mounting substrate BW transported from the load port 13 and executes a normal mode in which the bonding unit 180 mounts the electronic components E onto the mounting substrate BW. In normal mode, for example, the surface processing unit 100 performs surface treatment once on the component supply body TW and / or mounting substrate BW.

[0040] The return mode processing unit 242 causes the component supply unit TW or mounted substrate BW transported from the supply buffer unit 160, the mounted substrate buffer unit 170, or the bonding unit 180 to repeatedly perform surface treatment and execute a return mode that reprocesses the pre-treatment. The return mode may also be called the repetition mode. In other words, repetition here refers to the reprocessing of a workpiece (component supply unit TW and / or mounted substrate BW) that has already undergone surface treatment or cleaning pre-treatment once. In the return mode, for example, the same processing as in the normal mode is performed, but the cleaning process by the supply cleaning unit 110 and the mounted substrate cleaning unit 120 is performed multiple times. In other words, plasma treatment is performed repeatedly, or the cleaning of the surface of the component supply unit TW and the surface of the mounted substrate BW is repeated. To clarify and avoid misunderstanding, repeating the plasma treatment here does not mean performing plasma treatment multiple times on the component supply unit TW and / or mounted substrate BW while they remain in the surface processing unit 100. Furthermore, the plasma treatment is not performed multiple times by repeatedly inserting and removing the component supply unit TW and / or mounting substrate BW into the surface treatment unit 100 without transporting them from the surface treatment unit 100 to other treatment units.

[0041] Furthermore, the control unit 200 is configured to selectively switch between executing the normal mode by the normal mode processing unit 241 and executing the return mode by the return mode processing unit 242. In other words, the control unit 200 has a selection unit 250 that selectively switches between the normal mode and the return mode. For example, the selection unit 250 selects the return mode when an electronic component E is to be mounted on a mounting board BW that already has an electronic component E mounted on it, and selects the normal mode otherwise. When an electronic component E is to be mounted on a mounting board BW that already has an electronic component E mounted on it, examples include when an electronic component E is mounted on a part of the mounting board BW and then another type of electronic component E is mounted on another part of the mounting board BW, or when an electronic component E is mounted on top of an electronic component E already mounted on the mounting board BW.

[0042] For example, drive chips and cache memory elements are mounted around the processing unit and image sensor. In this case, the processing unit and image sensor are mounted across the entire mounting area of ​​the mounting substrate BW, and then the component supply unit TW is replaced to mount the surrounding elements. During this replacement of the component supply unit TW, the mounting substrate BW remains idle. Also, since multiple types of electronic components E are mounted, the mounting substrate BW stays in the bonding section 180 for a long time. As a result, the surface condition of the mounting substrate BW gradually becomes unsuitable for bonding. Therefore, the mounting substrate BW is removed from the bonding section 180 and reprocessed. This process is the same, for example, when stacking memory elements.

[0043] When stacking memory elements, the picked-up memory element, electronic component E, is inverted, and the pre-treated surface is mounted onto the mounting substrate BW. However, in this case, the surface of the electronic component E after mounting is the side that has not been modified by surface treatment. In other words, when stacking electronic components E, mounting is performed on the side of the electronic component E that has not been surface-treated. In such cases, it is necessary to perform surface treatment or cleaning on the exposed surface of the inverted and mounted electronic component E using the reverse mode.

[0044] Information regarding whether or not to mount another electronic component E on a mounting board BW that already has an electronic component E mounted on it is input in advance by the input unit 220 and stored in the storage unit 210. The selection unit 250 uses this information to pre-select whether the process performed by the mounting device 1 will be in normal mode or return mode. When determining the processing mode in advance from the stored information in this way, the process of mounting the electronic component E on the first mounting board BW will be in normal mode, and then the return mode will be selected to reprocess the mounting board BW. In other words, when mounting another electronic component E on a mounting board BW that already has an electronic component E mounted on it, the return mode is selected for that mounting board BW.

[0045] Furthermore, the selection unit 250 can select between normal mode and return mode depending on the elapsed time after surface treatment of the component supply unit TW and the mounted substrate BW. In other words, the selection unit 250 measures how much time has elapsed since surface treatment when transporting the component supply unit TW and the mounted substrate BW to the bonding unit 180, and selects return mode if a preset time has elapsed. The time referred to here is preferably the allowable time between surface treatment and transport to the bonding unit 180.

[0046] The acceptable time is defined as the time during which the surface condition of the electronic component E and the surface condition of the mounting substrate BW remain within an acceptable range for the mounting strength. In other words, it is defined as the time during which the surface condition does not deteriorate to an unacceptable degree for the mounting strength to decrease. Such a time is determined in advance through experiments or other means. It should be noted that as long as the mounting strength remains within an acceptable range, it is acceptable even if the active state of the bonding surface between the electronic component E and the mounting substrate BW gradually deactivates, or if the clean state gradually disappears.

[0047] The time compared to the pre-set time should be any time that allows for determination of whether or not it is within an acceptable time frame. For example, instead of measuring the elapsed time after surface treatment, the elapsed time after being placed in the supply buffer section 160 and the mounting board buffer section 170 may be measured, and the return mode may be selected when the pre-set time has elapsed. Alternatively, if the surface condition is maintained while the material is placed in the supply buffer section 160 and the mounting board buffer section 170, the return mode may be selected when the time obtained by subtracting the time the material is placed in the supply buffer section 160 and the mounting board buffer section 170 from the elapsed time after the surface treatment is completed has exceeded the pre-set time.

[0048] Thus, the selection unit 250 can initially select the normal mode to start the implementation process, and then switch to the return mode during the process based on the elapsed time at a predetermined step during the process.

[0049] In this embodiment, since the cleaning process is also reprocessed in the return mode, when the return mode is selected, the control unit 200 causes the transport unit 190 to unload the component supply unit TW from the supply unit buffer unit 160 and unload it into the surface processing unit 100, and unload the mounted substrate BW from the mounted substrate buffer unit 170 and unload it into the surface processing unit 100. After surface processing in the surface processing unit 100, the transport unit 190 unloads the component supply unit TW and mounted substrate BW into the supply unit cleaning unit 110 and mounted substrate cleaning unit 120, respectively, where they are cleaned.

[0050] [Operation] The operation of the mounting device 1 of this embodiment, as described above, will be explained with reference to the flowchart in Figure 5, the timing chart in Figure 6, and the flowchart in Figure 7, in addition to Figures 1 to 4 above. A mounting method for mounting electronic components E onto the mounting board BW by the following procedure is also one aspect of this embodiment. The following explanation follows the flowcharts in Figures 5 and 7, but as shown in Figure 6, each process includes a state in which each process is performed simultaneously in parallel.

[0051] As shown in Figure 2, the transport container F containing the component supply TW and the transport container F containing the mounted substrate BW are loaded onto the load port 13 (loading process). The transport robot 191 receives the component supply TW from the transport container F in the load port 13, transports the component supply TW to the surface treatment unit 100, and activates and cleans the surface of the electronic components E by plasma treatment (supply surface treatment process: step S101). While the surface treatment of the component supply TW is being performed, the transport robot 191 receives the mounted substrate BW from the transport container F. The transport robot 191 receives the surface-treated component supply TW from the surface treatment unit 100 and transports the mounted substrate BW to the surface treatment unit 100. In the surface treatment unit 100, the surface of the mounted substrate BW is activated and cleaned by plasma treatment (mounted substrate surface treatment process: step S102).

[0052] The transport robot 191 transfers the surface-treated parts supply unit TW to the support unit 112 of the supply unit cleaning unit 110. The supply unit cleaning unit 110 cleans the parts supply unit TW by supplying cleaning liquid L while rotating it with the support unit 112 and the rotating mechanism 113 (supply unit cleaning process: step S103). At this time, the tape T of the parts supply unit TW is expanded by the expander unit, and the electronic components E are cleaned with wider spacing between them. After the cleaning is performed by supplying cleaning liquid L, the supply unit rotates at high speed to shake off the cleaning liquid L and dry it, and then the expander unit releases the tape T and shrinks it back to its original state, returning the spacing between the electronic components E to normal.

[0053] After the surface treatment of the mounted substrate BW in the surface treatment unit 100 is completed, the transfer robot 191 receives the mounted substrate BW from the surface treatment unit 100 and hands it over to the mounted substrate cleaning unit 120. The mounted substrate cleaning unit 120 cleans the mounted substrate BW by supplying cleaning liquid L while rotating it (mounted substrate cleaning process: step S104). After supplying the cleaning liquid L and cleaning, the substrate is rotated at high speed to shake off the cleaning liquid L and dry. This mounted substrate cleaning process includes a state in which it is performed simultaneously with the supply unit cleaning process, as shown by the dotted rectangle in Figure 6. In other words, the time spent cleaning the component supply unit TW and the time spent cleaning the mounted substrate BW overlap.

[0054] After the cleaning process of the component supply unit TW is completed, the transport robot 191 receives the component supply unit TW from the supply unit cleaning unit 110 and hands it over to the gauging unit 140. In the gauging unit 140, the component supply unit TW is aligned (positioning process: step S105). After the alignment is complete, the transport robot 191 receives the component supply unit TW from the gauging unit 140 and hands it over to the adjustment processing unit 130. In the adjustment processing unit 130, an adjustment process is performed to reduce the adhesive strength of the tape T by irradiating the component supply unit TW with UV light (adjustment process: step S106). As shown in Figure 6, these positioning and adjustment processes overlap with the mounting substrate cleaning process.

[0055] After the cleaning process of the mounted substrate BW is completed, the transport robot 191 receives the mounted substrate BW from the mounted substrate cleaning unit 120 and hands it over to the alignment unit 150. In the alignment unit 150, the mounted substrate BW is aligned (positioning process: step S107).

[0056] After the adjustment process for the component supply unit TW is completed, the transport robot 191 receives the component supply unit TW from the adjustment processing unit 130 and hands it over to the supply unit buffer unit 160. After the alignment of the mounted board BW is completed, the transport robot 191 receives the mounted board BW from the alignment unit 150 and hands it over to the mounted board buffer unit 170.

[0057] In this manner, the component supply unit TW and the mounting board BW are placed in the supply unit buffer unit 160 and the mounting board buffer unit 170 (storage process: step S108). When the bonding unit 180 becomes ready to accept the components, the transport robot 191 receives the component supply unit TW and the mounting board BW and hands them over to the bonding unit 180. In other words, in response to the signal from the bonding unit 180 indicating that it is ready to accept the components, the transport robot 191 takes the component supply unit TW and the mounting board BW from the supply unit buffer unit 160 and the mounting board buffer unit 170 and carries them into the bonding unit 180. In the bonding unit 180, electronic components E are picked up from the component supply unit TW and mounted onto the mounting board BW (mounting process: step S109).

[0058] Furthermore, if the bonding section 180 has not undergone any processing or is in a completed processing state after surface treatment and / or cleaning, the component supply unit TW and the mounted substrate BW can be supplied directly to the bonding section 180 without going through the supply unit buffer section 160 and the mounted substrate buffer section 170.

[0059] In normal mode, during assembly, the transport robot 191 receives the next component supply TW and the mounting board BW from the transport container F of the load port 13 and performs the same processing for the second and subsequent boards as described above. After the first board is completed, in between each processing step for the second and subsequent boards, the transport robot 191 receives the component supply TW and the mounting board BW from the bonding unit 180 and transports them to the transport container F of the load port 13 for handover.

[0060] The above operations are repeated to mount the electronic component E onto the mounting board BW, and the mounting process is completed when the supply of component suppliers TW and / or mounting boards BW is finished.

[0061] Furthermore, if an electronic component E is mounted in one area of ​​the mounting substrate BW, and then another type of electronic component E is mounted in another area, or if an electronic component E is mounted on top of an electronic component E already mounted on the mounting substrate BW, the return mode is selected in advance. The operation procedure in this case will be explained with reference to the flowchart in Figure 7. First, the transport robot 191 receives the mounting substrate BW from the bonding unit 180 and hands it over to the surface treatment unit 100. In the surface treatment unit 100, the surface of the mounting substrate BW is reactivated and cleaned again by plasma treatment (mounting substrate resurface treatment process: step S201). After the surface treatment of the mounting substrate BW in the surface treatment unit 100 is completed, the transport robot 191 receives the mounting substrate BW from the surface treatment unit 100 and hands it over to the mounting substrate cleaning unit 120. The mounting substrate cleaning unit 120 cleans the mounting substrate BW again by supplying cleaning liquid L while rotating it (mounting substrate re-cleaning process: step S202).

[0062] After the cleaning process of the mounted substrate BW is completed, the transport robot 191 receives the mounted substrate BW from the mounted substrate cleaning unit 120 and hands it over to the alignment unit 150. In the alignment unit 150, the mounted substrate BW is aligned (positioning process: step S203). After the alignment of the mounted substrate BW is completed, the transport robot 191 receives the mounted substrate BW from the alignment unit 150 and hands it over to the mounted substrate buffer unit 170 (storage process: step S204). The transport robot 191 sequentially receives the mounted substrate BWs that have been stored in the mounted substrate buffer unit 170 for the longest time and hands them over to the bonding unit 180. In the bonding unit 180, electronic components E are picked up from the component supply unit TW and bonded to the unmounted area of ​​the mounted substrate BW or to an already mounted electronic component E (mounting process: step S205). At this time, the electronic components E to be layered may be the same electronic component E or different electronic components E.

[0063] Furthermore, the selection unit 250 selects the return mode if a preset time has elapsed while the component supply unit TW housed in the supply unit buffer unit 160 or the mounted substrate BW housed in the mounted substrate buffer unit 170 is waiting before being transported to the bonding unit 180. In this case, the transport robot 191 takes the component supply unit TW from the supply unit buffer unit 160 or the mounted substrate BW from the mounted substrate buffer unit 170 and transports them to the surface treatment unit 100. After that, surface treatment and cleaning are performed in the same manner as described above.

[0064] [effect] (1) The mounting apparatus 1 of this embodiment as described above includes a load port 13 on which a transport container F is mounted that contains a component supply unit TW, on which wafers W separated into individual electronic components E are attached to tape T attached to a ring R, whether unprocessed or processed, and a mounting substrate BW on which the electronic components E are mounted; a supply unit cleaning unit 110 for cleaning the component supply unit TW; a mounting substrate cleaning unit 120 for cleaning the mounting substrate BW; a surface treatment unit 100 for surface treatment of the surface of the component supply unit TW and / or the mounting substrate BW by plasma; an adjustment treatment unit 130 for adjusting the adhesive strength of the tape T by irradiating it with UV light; a bonding unit 180 for detaching the electronic components E from the component supply unit TW and mounting them on the mounting substrate BW; and a loading unit 180 for transporting components to the bonding unit 180. The system includes a supply buffer section 160 for temporarily housing the previous component supply unit TW, a mounting substrate buffer section 170 for temporarily housing the mounting substrate BW before it is transported to the bonding section 180, a transport section 190 for transporting the component supply unit TW and the mounting substrate BW, and a control unit 200 that controls the transport section 190 to transport the component supply unit TW and / or the mounting substrate BW from the supply buffer section 160, the mounting substrate buffer section 170, or the bonding section 180 to either the supply cleaning section 110, the mounting substrate cleaning section 120, or the surface treatment section 100. The control unit 200 further controls the supply cleaning section 110, the mounting substrate cleaning section 120, and the transport section 190 so that the cleaning process for the component supply unit TW and the cleaning process for the mounting substrate BW are performed simultaneously and in parallel with each other.

[0065] The mounting method of this embodiment includes a mounting step in which a transport container F containing a component supply unit TW, on which wafers W separated into individual electronic components E are attached to a tape T attached to a ring R (either unprocessed or processed), and a mounting substrate BW on which the electronic components E are mounted, is mounted on a load port 13; a surface treatment step in which a surface treatment unit 100 performs a surface treatment on the surface of the component supply unit TW and / or the mounting substrate BW using plasma; a supply unit cleaning step in which a supply unit cleaning unit 110 cleans the component supply unit TW; and a mounting substrate cleaning unit 120. However, the process includes a mounting substrate cleaning step in which the mounting substrate BW is cleaned, which is performed in parallel with the supply body cleaning step; an adjustment step in which the adjustment processing unit 130 adjusts the adhesive strength of the tape T to decrease; a supply body accommodation step in which the supply body buffer unit 160 temporarily accommodates the component supply body TW; a mounting substrate accommodation step in which the mounting substrate buffer unit 170 temporarily accommodates the mounting substrate BW; and a bonding step in which the bonding unit 180 detaches the electronic component E from the component supply body TW and mounts it on the mounting substrate BW.

[0066] In this way, by processing the component supply TW and the mounted substrate BW within a single device, continuous processing can be performed in a clean environment. This suppresses changes in the surface state of the electronic components E and mounted substrate BW that contribute to bonding over time, allowing processing to be performed while maintaining an active and clean state. As a result, the weakening of bonding strength is suppressed.

[0067] Furthermore, by having a supply unit cleaning unit 110 and a mounting substrate cleaning unit 120, the mounting substrate BW can be cleaned while the component supply unit TW is being cleaned (the time shown by the dotted line in Figure 6), thereby reducing the time lag between the pre-treatment of the component supply unit TW and the pre-treatment of the mounting substrate BW. This reduces the waiting time from pre-treatment to mounting, and allows mounting to be performed while maintaining the active and clean surface state of the component supply unit TW and the mounting substrate BW, thus suppressing a decrease in bonding strength.

[0068] (2) The control unit 200 is configured such that the transport unit 190 can switch between transporting the component supply unit TW and / or the mounted substrate BW from the supply unit buffer unit 160, the mounted substrate buffer unit 170, or the bonding unit 180 to either the supply unit cleaning unit 110, the mounted substrate cleaning unit 120, or the surface treatment unit 100, or to the transport container F of the load port 13.

[0069] Therefore, it becomes possible to activate and clean mounted substrates BW and component supply units TW that are inactive, uncleaned, insufficiently active, insufficiently cleaned, or potentially deactivated or contaminated. Since the bonding unit 180, surface treatment unit 100, supply unit cleaning unit 110, and mounted substrate cleaning unit 120 are configured within a common mounting apparatus 1, reprocessing of surface treatment and cleaning can be performed efficiently.

[0070] As a more specific example of configuration, the control unit 200 includes a normal mode processing unit 241 that executes a normal mode in which the surface processing unit 100 performs surface treatment on the component supply unit TW or mounting substrate BW transported from the load port 13 and mounts electronic components E onto the mounting substrate BW in the bonding unit 180, and a return mode processing unit 242 that executes a return mode in which the surface processing unit 100 performs surface treatment on the component supply unit TW or mounting substrate BW transported from the supply unit buffer unit 160, mounting substrate buffer unit 170, or bonding unit 180, and the control unit 200 is provided to selectively switch between executing the normal mode by the normal mode processing unit 241 and executing the return mode by the return mode processing unit 242.

[0071] (3) When mounting electronic components E on a mounting substrate BW on which electronic components E are already mounted, the control unit 200 selects a return mode for the mounting substrate BW. For example, when stacking memory elements, this allows the inactive and uncleaned exposed surfaces of the inverted mounted electronic components E to be activated and cleaned. In addition, cleaning with a cleaning solution L can be performed. Alternatively, only cleaning can be performed. Depending on the surface condition of the electronic components E in the lower layer of the stacking, various reprocessing can be performed in the necessary combinations. Therefore, when directly stacking electronic components E, the required bonding strength can be easily achieved.

[0072] For example, if an electronic component E is mounted in one area of ​​a mounting substrate BW, and then a different type of electronic component E is mounted in another area, it may be necessary to replace the component supply unit TW. When such a replacement occurs, the mounting substrate BW will be on standby during that time. Furthermore, the mounting substrate BW will remain in the bonding area 180 for a long period of time. This increases the likelihood that the surface condition of the mounting substrate BW will become unsuitable for mounting.

[0073] Furthermore, in some areas of a mounting substrate BW on which electronic components E are mounted, the components may become deactivated or accumulate organic matter over time. Therefore, if a predetermined time has elapsed, the mounting substrate BW is resurfaced in a return mode. Also, in some cases, electronic components E may remain on a single component supply unit TW in order to replace them with other electronic components E. In such cases as well, if a predetermined time has elapsed on a component supply unit TW, the surface is resurfaced in a return mode.

[0074] Similar to the stacking of electronic components E, cleaning with cleaning solution L can also be performed. Alternatively, only cleaning can be performed. Necessary reprocessing can be combined. Therefore, when mounting another electronic component E on a single mounting board BW, the required bonding strength can be easily achieved.

[0075] In this way, by executing the reset mode, the surface condition of the mounting board BW and component supply unit TW can be restored to an appropriate state.

[0076] (4) The control unit 200 selects either the normal mode or the return mode depending on the elapsed time after the surface treatment of the mounting substrate BW. The control unit 200 also selects either the normal mode or the return mode depending on the elapsed time after the surface treatment of the component supply body TW. This allows the mounting substrate BW and component supply body TW, which may become deactivated or contaminated over time, to be surface treated and cleaned again.

[0077] (5) When the control unit 200 selects the return mode, it causes the transport unit 190 to unload the mounted substrate BW from the mounted substrate buffer unit 170 and to transport it to the surface treatment unit 100 or the mounted substrate cleaning unit 120. When the control unit 200 selects the return mode, it causes the transport unit 190 to unload the component supply unit TW from the supply unit buffer unit 160 and to transport it to the surface treatment unit 100. In this way, the mounted substrate BW and component supply unit TW can be efficiently transported by the transport unit 190 within the mounting apparatus 1, and pre-treatments such as surface treatment and cleaning can be repeatedly performed.

[0078] (6) The transport unit 190 has a transport robot 191 equipped with a pair of robot hands 191a. One robot hand 191a supports the component supply unit TW, and the other robot hand 191a supports the mounting substrate BW. As a result, the component supply unit TW and the mounting substrate BW can be transported simultaneously and in parallel, and the transport time from pre-processing to mounting can be shortened. In addition, as in the above embodiment, by arranging the supply unit cleaning unit 110 and the mounting substrate cleaning unit 120 adjacent to each other, simultaneous and parallel transfer by the transport unit 190 can be facilitated.

[0079] In particular, in this embodiment, the supply buffer section 160 and the mounting substrate buffer section 170 are arranged adjacent to the bonding section 180. Therefore, the component supply TW and the mounting substrate BW can be removed together and transported together to the surface treatment section 100. Thus, in the return mode, productivity can be improved by efficiently moving the transport section 190 when transporting the component supply TW and the mounting substrate BW.

[0080] (modified version) The selection unit 250 may measure the time after cleaning and switch between normal mode and return mode depending on the time after cleaning. In other words, after cleaning the component supply unit TW or the mounted substrate BW, if a threshold time has elapsed, the return mode is activated and surface treatment and cleaning are performed again, thereby preventing a decrease in bonding strength due to the passage of time.

[0081] Furthermore, the selection unit 250 can also switch to the return mode as appropriate, depending on whether to prioritize the activated and cleaned state of the surface or the hydroxyl group-forming state after cleaning, by using both the elapsed time after surface treatment and the elapsed time after cleaning. It is also possible to perform only the cleaning process without repeating the surface treatment. Because various processes can be selected in this way, it is possible to perform treatments according to the various surface properties of the component supply body TW or mounting substrate BW. This increases the number of applicable products (see Figure 1).

[0082] When the selection unit 250 transports a component supply unit TW or a mounting substrate BW to the bonding unit 180, if it determines that a predetermined threshold time has elapsed while the transported component supply unit TW or mounting substrate BW is being mounted in the bonding unit 180, it can also switch to a return mode instead of transporting the component supply unit TW or mounting substrate BW to the bonding unit 180. This prevents a situation where the component supply unit TW or mounting substrate BW is transported to the bonding unit 180 when the measurement time at the moment of the decision to transport to the bonding unit 180 is within a predetermined time tolerance range, and immediately after transport, the time from surface treatment exceeds the tolerance range, resulting in continued mounting that reduces the mounting strength.

[0083] Furthermore, if it is determined that the time until such an excess occurs is sufficiently far in the future, the component supply TW or mounted substrate BW can be transported to the bonding unit 180 without switching to the return mode processing. This determination can be made based on the elapsed time since the surface treatment of the component supply TW or mounted substrate BW that can be transported to the bonding unit 180 next.

[0084] The selection unit 250, the normal mode processing unit 241, and the return mode processing unit 242 may each be composed of hardware such as independent electrical circuits, or they may be composed of programs. When processing in return mode, process control is performed for all component supply units TW and mounting boards BW fed into the mounting device 1, and in addition, process control is required for component supply units TW and mounting boards BW that undergo repeated processing in return mode. Process control requires each processing unit to understand what processing each component supply unit TW and each mounting board BW is currently performing, when it will be completed, and to grasp the processing status of each component supply unit TW and each mounting board BW before and after, as well as to create a transport plan and processing plan for the next processing to be performed.

[0085] Therefore, executing the return mode requires processing power capable of handling a massive amount of computation. Thus, as described above, the normal mode processing unit 241 and the return mode processing unit 242 are constructed independently in hardware. For example, the processing power required to perform the return mode is covered by multiple arithmetic processors. When executing the normal mode, only a portion of these arithmetic processors are used. This reduces power consumption. Furthermore, even if an electrical circuit is constructed with arithmetic processors sufficient for the normal mode, and both modes are used interchangeably, efficient processing can be achieved with low power consumption by performing processing on hardware optimized for both modes.

[0086] The same applies to programs. Of the routines that execute the complex return mode, only a limited number are used in normal mode. Therefore, if a program capable of executing the return mode is used to execute the normal mode, the amount of processing that skips unnecessary processes increases, resulting in decreased efficiency. By configuring the normal mode processing unit 241 and the return mode processing unit 242 as separate routines (programs), processing can be performed with programs optimized for both modes, enabling efficient processing with low power consumption. Furthermore, the cycle time can also be shortened.

[0087] To accommodate the return mode, a separate transport unit 190 dedicated to return can be provided. Furthermore, this return-dedicated transport unit 190 can be provided separately for the component supply unit TW and the mounted substrate BW. Since the transport process in return mode can be performed in parallel with the transport unit 190 used in normal mode, a high-speed, parallel processing-based, and highly productive mounting apparatus 1 can be realized.

[0088] [Other embodiments] Although embodiments and modifications of the present invention have been described above, these embodiments and modifications are presented as examples only and are not intended to limit the scope of the invention. These novel embodiments described above can be implemented in various other forms, and various omissions, substitutions, modifications, and combinations can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the invention described in the claims. [Explanation of Symbols]

[0089] 1. Mounting device 11 Base 12 Chambers 13 Load Ports 100 Surface treatment 110 Supply body cleaning section 111 Washing Room 111a aperture 111b Shutter 112 Support part 113 Rotation mechanism 114 cups 115 Supply section 115a nozzle 115b Moving mechanism 120 Mounting board cleaning section 130 Adjustment Processing Unit 131 Irradiation equipment 140 Gauging section 150 Alignment Section 160 Supply Buffer Section 161 Hangar 170 Mounting board buffer section 171 Hangar 180 Bonding section 190 Conveying section 191 Transport robot 191a Robot Hand 192 Moving mechanism 200 Control Unit 210 Storage section 220 Input section 230 Display section 240 Cleaning Control Unit 241 Normal Mode Processing Unit 242 Return Mode Processing Unit 250 Selection Section

Claims

1. A load port is equipped with a component supply unit in which wafers, separated into individual pieces for electronic components, are attached to tape mounted on a ring, either unprocessed or processed, and a transport container containing a mounting substrate on which the electronic components are mounted. A supply body cleaning unit for cleaning the aforementioned parts supply body, A mounting board cleaning unit for cleaning the aforementioned mounting board, A surface treatment unit for surface-treating the surface of the component supply body and / or the mounting substrate by plasma, An adjustment processing unit that adjusts the tape so that its adhesive strength is reduced by irradiating it with UV light, A bonding portion is used to detach the electronic component from the component supply body and mount it on the mounting substrate. A supply buffer section having a storage compartment for temporarily accommodating the component supply body before it becomes receivable by the bonding section, and capable of accommodating multiple component supply bodies stacked at intervals, A mounting substrate buffer section has a storage compartment that temporarily accommodates the mounting substrate before it can be accepted by the bonding section, and can accommodate multiple mounting substrates stacked with spacing between them, A transport unit for transporting the component supply unit and the mounted substrate, A control unit controls the transport unit to transport the component supply unit and / or the mounted substrate from the supply unit buffer unit, the mounted substrate buffer unit, or the bonding unit to one of the supply unit cleaning unit, the mounted substrate cleaning unit, or the surface processing unit, It has, The control unit controls the supply unit cleaning unit, the mounting board cleaning unit, and the transport unit so that the cleaning process of the component supply unit and the cleaning process of the mounting board are performed simultaneously and in parallel with each other. The control unit, The surface treatment unit includes a normal mode processing unit that performs surface treatment on the component supply body or the mounting substrate transported from the load port by the transport unit, and the bonding unit that mounts the electronic components onto the mounting substrate, and The surface treatment unit includes a return mode processing unit that causes the surface treatment to be performed on the component supply unit or the mounted substrate that is transported by the transport unit from the supply unit buffer unit, the mounted substrate buffer unit, or the bonding unit, It has, The control unit, The system is designed to allow selective switching between executing the normal mode by the normal mode processing unit and executing the return mode by the return mode processing unit. A mounting device characterized by the following features.

2. The mounting apparatus according to claim 1, characterized in that the control unit is provided so as to be able to switch whether the transport unit transports the component supply body and / or the mounted substrate from the supply body buffer unit, the mounted substrate buffer unit or the bonding unit to the supply body cleaning unit, the mounted substrate cleaning unit or the surface processing unit, or to the transport container of the load port.

3. The mounting apparatus according to claim 1, characterized in that the control unit selects the return mode for the mounting board when mounting further electronic components on the mounting board on which the electronic components are mounted.

4. The mounting apparatus according to claim 1, characterized in that the control unit selects either the normal mode or the return mode according to the elapsed time after surface treatment of the mounting substrate.

5. The mounting apparatus according to claim 1, characterized in that the control unit selects either the normal mode or the return mode according to the elapsed time after surface treatment of the component supply body.

6. The mounting apparatus according to claim 1, characterized in that the transport unit comprises a pair of robot hands, one of which supports the component supply body, and the other robot hand supports the mounting substrate.

7. A loading process in which a component supply unit, in which wafers separated into individual electronic components are attached to tape mounted on a ring, either unprocessed or processed, and a transport container containing a mounting substrate on which the electronic components are mounted, are loaded onto a load port, The surface treatment process includes a surface treatment step of performing a plasma surface treatment on the surface of the component supply body and / or the mounting substrate, The supply unit cleaning unit includes a supply unit cleaning step in which it cleans the parts supply unit, A mounting substrate cleaning step includes a state in which the mounting substrate cleaning section is performed simultaneously with the supply body cleaning step, and The adjustment process involves an adjustment step in which the adjustment processing unit irradiates the tape with UV light to adjust it so that the adhesive strength of the tape is reduced. The bonding section includes a bonding process in which the electronic component is detached from the component supply and mounted on the mounting substrate, A supply buffer section having a storage compartment capable of accommodating multiple component supply units stacked at intervals includes a supply unit accommodating the component supply units before they become receivable by the bonding section, A mounting substrate buffer section having a storage compartment capable of accommodating multiple mounting substrates stacked with spacing between them, includes a mounting substrate accommodation step in which the mounting substrates are temporarily accommodated before they become ready for acceptance by the bonding section, Includes, The surface treatment unit can be selectively switched to perform a normal mode in which it performs surface treatment on the component supply unit or the mounting substrate transported from the load port by the transport unit, and the bonding unit mounts the electronic components onto the mounting substrate, or to perform a return mode in which it performs surface treatment on the component supply unit or the mounting substrate transported from the supply unit buffer unit, the mounting substrate buffer unit, or the bonding unit by the transport unit. An implementation method characterized by the following:

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