Component mounting device

Abstract

This component mounting device comprises: a control unit that controls a first working unit and a second working unit in a plurality of operating modes that include a linked mode in which component mounting work is performed jointly by the first working unit and the second working unit on a substrate in a first substrate conveyance lane or a second substrate conveyance lane, and an independent mode in which component mounting work is performed by the first working unit on a substrate in the first substrate conveyance lane and the component mounting work is performed by the second working unit on a substrate in the second substrate conveyance lane; and a control parameter setting unit that is able to individually set control parameters for the first working unit and control parameters for the second working unit. The control unit uses the control parameters set by the control parameter setting unit to cause the first working unit and the second working unit to operate to perform the component mounting work.

Description

Technical Field

[0001] The present invention relates to a component mounting apparatus that mounts components onto a substrate.

Background Art

[0002] A component mounting apparatus that produces mounting substrates includes a substrate transport lane that transports substrates, and a working unit that moves a working head holding a component by a working head moving mechanism to mount the component onto the substrate. In addition, the required accuracy for mounting components on mounting substrates varies depending on the size of the components, the surrounding conditions of the mounting positions, and the like. When the required accuracy is high, the component mounting apparatus controls the working unit, for example, by reducing the moving speed of the working head, to ensure the required mounting accuracy. The component mounting apparatus disclosed in Patent Document 1 has a plurality of operation modes with different accuracies, and changes the operation mode according to a sequence in which required accuracy is set for each mounting order, so as to ensure the mounting accuracy required for each mounting position.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of Invention

[0004] However, in the conventional techniques including Patent Document 1, although components can be mounted at appropriate required accuracy for each mounting position on a substrate, there is no disclosure regarding control when mounting work is performed simultaneously on a plurality of substrates with different required accuracies in a component mounting apparatus that includes a plurality of substrate transport lanes and a plurality of working units to perform mounting work on a plurality of substrates in parallel, and there is room for further improvement in order to appropriately perform component mounting work on a plurality of substrates with different required accuracies in a component mounting apparatus provided with a plurality of substrate transport lanes and a plurality of working units.

[0005] Therefore, the present invention aims to provide a component mounting apparatus that can appropriately perform component mounting operations in parallel on multiple substrates with different required precisions.

[0006] The component mounting apparatus of the present invention includes: a first substrate transport lane that transports a substrate along a horizontally extending axis; a second substrate transport lane positioned away from the first substrate transport lane in a direction along another axis perpendicular to the first axis in the horizontal plane, and transporting a substrate along the first axis; a first component supply unit having a plurality of component supply units arranged in parallel along the first axis, positioned at a location opposite to the second substrate transport lane in the direction along the other axis, and away from the first substrate transport lane; a second component supply unit having a plurality of component supply units arranged in parallel along the first axis, positioned at a location opposite to the first substrate transport lane in the direction along the other axis, and away from the second substrate transport lane; a first work head that holds components and mounts them on a substrate; and the first work head being at least the first component supply unit The system includes: a first work unit including a first work head moving mechanism that moves the work head from above the part to a first area above the second substrate transport lane; a second work unit including a second work head that holds components and mounts them on a substrate, and a second work head moving mechanism that moves the second work head from at least above the second component supply unit to a second area above the first substrate transport lane; a control unit that controls the first work unit and the second work unit in multiple operating modes, including a cooperative mode in which the first work unit and the second work unit jointly perform component mounting work on substrates in the first substrate transport lane or the second substrate transport lane, and an independent mode in which the first work unit performs component mounting work on substrates in the first substrate transport lane and the second work unit performs component mounting work on substrates in the second substrate transport lane; and a control parameter setting unit that can separately set control parameters for the first work unit and control parameters for the second work unit. The control unit uses the control parameters set by the control parameter setting unit to cause the first work unit and the second work unit to perform the parts mounting operation. The control parameter setting unit sets control parameters corresponding to the required quality of the substrate, and when the control parameter setting unit controls the first work unit and the second work unit in the independent mode, it sets control parameters for the first work unit based on the first required quality of the substrate on which components are mounted in the first substrate transport lane, and sets control parameters for the second work unit based on the second required quality of the substrate on which components are mounted in the second substrate transport lane, and if the first required quality is lower than the second required quality, the control parameter setting unit corrects the control parameters for the first work unit. .

[0007] According to the present invention, component mounting operations can be performed appropriately and in parallel on multiple substrates with different required precisions. [Brief explanation of the drawing]

[0008] [Figure 1] Plan view showing the schematic structure of a component mounting device according to one embodiment of the present invention. [Figure 2] Explanation diagram of the function of the main part of a component mounting device according to one embodiment of the present invention. [Figure 3] (a) Explanatory diagram of the cooperative mode and (b) Explanatory diagram of the independent mode in a component mounting device according to one embodiment of the present invention. [Figure 4] Block diagram showing the configuration of the control system for a component mounting device according to one embodiment of the present invention. [Figure 5] (a) Diagram illustrating the height of the suction nozzle in the component pickup of a component mounting device according to one embodiment of the present invention; (b) Diagram illustrating the velocity; (c) Diagram illustrating the acceleration. [Figure 6] (a) Diagram illustrating the height of the suction nozzle in component mounting of a component mounting device according to one embodiment of the present invention; (b) Diagram illustrating the velocity; (c) Diagram illustrating the acceleration. [Figure 7] This diagram illustrates an example of control parameters included in component data used in a component mounting device according to one embodiment of the present invention. [Figure 8] Flowchart showing the processing of the control parameter setting unit in a component mounting device according to one embodiment of the present invention. [Figure 9] An explanatory diagram illustrating an example of a control parameter correction coefficient table used in another embodiment of a component mounting device according to one embodiment of the present invention. [Figure 10] Flowchart showing the processing of the control parameter setting unit in another embodiment of the component mounting device according to one embodiment of the present invention. [Modes for carrying out the invention]

[0009] An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are illustrative examples for illustrative purposes and can be modified as appropriate according to the specifications of the component mounting device. In the following, corresponding elements are denoted by the same reference numerals in all drawings, and redundant explanations are omitted. In Figure 1 and in some parts described later, the X-axis (vertical direction in Figure 1) in the substrate transport direction and the Y-axis (horizontal direction in Figure 1) perpendicular to the substrate transport direction are shown as two mutually orthogonal axes in the horizontal plane. In Figure 1 and in some parts described later, the Z-axis (perpendicular direction in Figure 1) is shown as the height direction perpendicular to the horizontal plane.

[0010] First, the detailed configuration of the component mounting device 1 will be described with reference to Figures 1 and 2. Figure 2 is an explanatory diagram of the functions of the main part of the front first work section W1. At the top center of the base 2, a first substrate transport lane L1 is located on the front side in the Y-axis direction, and a second substrate transport lane L2 is located on the rear side. That is, the second substrate transport lane L2 is located at a distance from the first substrate transport lane L1 in the direction along the Y-axis (one axis and the other axis perpendicular in the horizontal plane). The first substrate transport lane L1 is equipped with a pair of first substrate transport conveyors K1 that transport substrates 3 along the X-axis (one axis extending horizontally). The second substrate transport lane L2 is equipped with a pair of second substrate transport conveyors K2 that transport substrates 3 along the X-axis.

[0011] A first component supply unit S1 is located in front of the first substrate transport lane L1. A second component supply unit S2 is located behind the second substrate transport lane L2. Multiple component supply units 4 (tape feeders) are mounted on top of the first component supply unit S1 and the second component supply unit S2. The component supply units 4 feed carrier tapes holding components at a pitch and supply them to the component supply positions.

[0012] In other words, the first component supply unit S1 is located away from the first substrate transport lane L1 in the direction along the Y-axis (other axis) and on the opposite side from the second substrate transport lane L2, and has a plurality of component supply units 4 arranged in parallel along the X-axis (one axis).

[0013] In Figures 1 and 2, a first Y-axis table 5A is positioned at one end of the upper surface of the base 2 in the X-axis direction, and a second Y-axis table 5B is positioned at the other end opposite to the first end. Both the first Y-axis table 5A and the second Y-axis table 5B are equipped with Y-axis linear motors extending along the Y-axis. The first X-axis table 6A, extending along the X-axis, is connected to the first Y-axis table 5A. The first X-axis table 6A is driven by the Y-axis linear motor and moves back and forth (arrow a) along the first Y-axis table 5A. The second X-axis table 6B, extending along the X-axis, is connected to the second Y-axis table 5B. The second X-axis table 6B is driven by the Y-axis linear motor and moves back and forth along the second Y-axis table 5B.

[0014] The first X-axis table 6A and the second X-axis table 6B are each equipped with an X-axis linear motor extending along the X-axis. The first X-axis table 6A is connected to a first work head H1, which is driven by the X-axis linear motor and moves left and right along the X-axis (arrow b). The second X-axis table 6B is connected to a second work head H2, which is driven by the X-axis linear motor and moves left and right along the X-axis.

[0015] In FIG. 2, the first working head H1 and the second working head H2 are each equipped with a plurality of suction nozzles 7 that hold components at their lower end portions. The first working head H1 and the second working head H2 are each provided with a suction nozzle elevating unit 20 and a suction nozzle rotating unit 21 respectively corresponding to the plurality of suction nozzles 7 (see FIG. 4). The suction nozzle elevating unit 20 moves the suction nozzle 7 up and down along the Z-axis (arrow c). Further, the suction nozzle rotating unit 21 rotates the suction nozzle 7 around the Z-axis.

[0016] In FIG. 1 and FIG. 2, the first working head H1 is moved in the horizontal direction (X-axis direction, Y-axis direction) by the Y-axis linear motor and the X-axis linear motor, holds the component supplied to the component supply position by the component supply unit 4, and mounts it on the substrate 3 (arrow d). The first Y-axis table 5A and the first X-axis table 6A constitute a first working head moving mechanism 9A that moves the first working head H1 at least within the first region A1 above the second substrate transport lane L2 from above the first component supply section S1. Further, the first working head H1 and the first working head moving mechanism 9A constitute a first working unit W1.

[0017] The second working head H2 is moved in the horizontal direction (X-axis direction, Y-axis direction) by the Y-axis linear motor and the X-axis linear motor, holds the component supplied to the component supply position by the component supply unit 4, and mounts it on the substrate 3. The second Y-axis table 5B and the second X-axis table 6B constitute a second working head moving mechanism 9B that moves the second working head H2 at least within the second region A2 above the first substrate transport lane L1 from above the second component supply section S2. Further, the second working head H2 and the second working head moving mechanism 9B constitute a second working unit W2.

[0018] In FIG. 1 and FIG. 2, a control unit 10 is arranged on the base 2. The control unit 10 controls the first substrate transport conveyor K1, the second substrate transport conveyor K2, the first working unit W1, and the second working unit W2, so as to cause the substrate 3 transported by the first substrate transport lane L1 or the second substrate transport lane L2 to perform component mounting operations in a plurality of operation modes.

[0019] Next, with reference to FIG. 3, the cooperative mode and the independent mode will be described as examples of operation modes in which the control unit 10 controls the first work unit W1 and the second work unit W2 to perform component mounting work.

[0020] First, the cooperative mode will be described with reference to FIG. 3(a). In the cooperative mode, the control unit 10 alternately performs the work of mounting, on the board 3A conveyed by the first board conveyance lane L1, a component picked up by the first work head H1 of the first work unit W1 from the component supply unit 4 of the first component supply section S1 (arrow e1), and the component mounting work of mounting a component picked up by the second work head H2 of the second work unit W2 from the component supply unit 4 of the second component supply section S2 (arrow e2).

[0021] Further, the control unit 10 alternately performs the work of mounting, on the board 3B conveyed by the second board conveyance lane L2, a component picked up by the first work head H1 of the first work unit W1 from the component supply unit 4 of the first component supply section S1 (arrow f1), and the component mounting work of mounting a component picked up by the second work head H2 of the second work unit W2 from the component supply unit 4 of the second component supply section S2 (arrow f2).

[0022] Next, the independent mode will be described with reference to FIG. 3(b). In the independent mode, the control unit 10 causes the component mounting work of mounting a component picked up by the first work head H1 of the first work unit W1 from the component supply unit 4 of the first component supply section S1 on the board 3A conveyed by the first board conveyance lane L1 to be performed (arrow g1). Further, the control unit 10 causes the component mounting work of mounting a component picked up by the second work head H2 of the second work unit W2 from the component supply unit 4 of the second component supply section S2 on the board 3B conveyed by the second board conveyance lane L2 to be performed (arrow g2).

[0023] Thus, the control unit 10 controls the first work unit W1 and the second work unit W2 in multiple operating modes, including a cooperative mode (Figure 3(a)) in which the first work unit W1 and the second work unit W2 jointly perform component mounting work on substrates 3A and 3B in the first substrate transport lane L1 or the second substrate transport lane L2, and an independent mode (Figure 3(b)) in which the first work unit W1 performs component mounting work on substrate 3A in the first substrate transport lane L1 and the second work unit W2 performs component mounting work on substrate 3B in the second substrate transport lane L2.

[0024] The so-called two-stage / two-head component mounting apparatus 1 of this embodiment can perform component mounting operations on multiple substrates 3A and 3B in parallel. Therefore, while one work head (first work head H1 or second work head H2) is stopped above the substrates 3A and 3B and lowering the suction nozzle 7 to mount components onto the substrates 3A and 3B, the other work head may be performing operations such as moving and stopping horizontally (X-axis direction, Y-axis direction) or mounting components held by the suction nozzle 7 onto the substrates 3A and 3B.

[0025] When the work head starts or stops moving, or when the component held by the suction nozzle 7 lands on the substrates 3A and 3B, vibrations are generated in the base 2, which may affect the operation of the other work head. The magnitude of the vibrations generated depends on the speed and acceleration of the work head as it moves and stops, and the speed and acceleration of the suction nozzle 7 as it moves up and down. In other words, the smaller the speed and acceleration, the smaller the vibrations generated. That is, the 2-stage / 2-head component mounting device 1 is affected by the working conditions (control parameters) of the opposing work head.

[0026] Next, with reference to Figure 4, the configuration of the control system of the component mounting device 1 will be described. The control unit 10 of the component mounting device 1 includes a first control unit 11, a second control unit 12, a drive control unit 13, a drive control unit 14, a storage unit 15, and a control parameter setting unit 19. The storage unit 15 is a memory device that stores production data 16, component data 17, parameter coefficients 18, etc. An example of the control unit 10 is a computer. At least some of the functions of the control unit 10 can be realized by the computer's processor.

[0027] The production data 16 includes information necessary for component mounting, such as the mounting position (X coordinate, Y coordinate) of the components on the substrate 3, the type of component to be mounted (component name), mounting direction, mounting order, the placement of components in the first component supply unit S1 and the second component supply unit S2, required quality (required precision), and operating mode. The production data 16 is basically created for each type of mounted substrate. When mounting substrates of multiple types are produced together using a single component mounting device 1, the production data 16 includes information necessary for component mounting work on substrates of multiple types.

[0028] In Figure 4, the part data 17 contains information necessary for the part loading device 1 to perform part loading operations, such as the shape and size of the part, control parameters related to the movement of the suction nozzle 7, and information on the operation and algorithm during part loading operations, for each type of part (part name). The part data 17 is associated with the production data 16 according to the part name (part type).

[0029] In Figure 4, the first control unit 11 includes a drive control unit 11a for driving the first X-axis table 6A of the first work unit W1, a drive control unit 11b for driving the first Y-axis table 5A, a drive control unit 11c for driving the suction nozzle lifting unit 20, and a drive control unit 11d for driving the suction nozzle rotating unit 21. The second control unit 12 includes a drive control unit 12a for driving the second X-axis table 6B of the second work unit W2, a drive control unit 12b for driving the second Y-axis table 5B, a drive control unit 12c for driving the suction nozzle lifting unit 20, and a drive control unit 12d for driving the suction nozzle rotating unit 21.

[0030] The drive control unit 13 drives and controls the first substrate conveyor K1 on the first substrate conveying lane L1. The drive control unit 14 drives and controls the second substrate conveyor K2 on the second substrate conveying lane L2. Each of the drive control units 11a to 11d, 12a to 12d, 13, and 14 controls its respective part based on the control parameters contained in the component data 17. That is, the control unit 10 performs the component mounting operation while referring to the production data 16 which contains information on the mounting position of components on the substrate 3, and the component data 17 which contains control parameters for each component name (type of component).

[0031] Here, we will explain examples of control parameters with reference to Figures 5 and 6. Figure 5 shows the time progression of the height Hz (Figure 5(a)), the speed Vz (Figure 5(b)), and the acceleration Az (Figure 5(c)) of the suction nozzle 7 when the first work head H1 (second work head H2), which has moved above the parts supply unit 4 of the first parts supply unit S1 (second parts supply unit S2), picks up parts supplied to the parts supply position by raising and lowering the suction nozzle 7 using the suction nozzle lifting unit 20.

[0032] In part pickup, the suction nozzle 7 descends from a standby height Hz1 to a landing height Hz2 at a speed Vz1, stops at the landing height Hz2 for a suction time D1, and then rises from the landing height Hz2 to the standby height Hz1 at a speed Vz2. At the suction ON timing T1, just before the descending suction nozzle 7 reaches the landing height Hz2, the supply of suction force to the tip of the suction nozzle 7 is started from the negative pressure supply unit (not shown). In part pickup, the suction time D1, suction ON timing T1, descent speed Vz1, and risen speed Vz2 are control parameters. Additionally, the acceleration Az1 at the start of descent, Az2 at the end of descent, Az3 at the start of rise, and Az4 at the end of rise are also control parameters for part pickup.

[0033] Figure 6 shows the time progression of the height Hz (Figure 6(a)), the lifting speed Vz (Figure 6(b)), and the lifting acceleration Az (Figure 6(c)) of the suction nozzle 7 when the first work head H1 (second work head H2), which has moved above the substrate 3 on the first substrate transport lane L1 (second substrate transport lane L2), lifts and lowers the suction nozzle 7 by the suction nozzle lifting unit 20 to mount the held component to the mounting position.

[0034] During component loading, the suction nozzle 7 descends from a standby height Hz1 to a landing height Hz2 at a speed Vz1, stops at the landing height Hz2 for a pushing time D2, and then rises from the landing height Hz2 to the standby height Hz1 at a speed Vz2. Also, at the suction OFF timing T2, just before the descending suction nozzle 7 reaches the landing height Hz2, the supply of suction force from the negative pressure supply unit to the tip of the suction nozzle 7 is stopped. Furthermore, at the blow ON timing T3, just before the suction nozzle 7 begins to rise, air blow is supplied from the positive pressure supply unit (not shown) to the tip of the suction nozzle 7 for a predetermined time.

[0035] For component loading, the control parameters are the push-in time D2, the suction OFF timing T2, the blow ON timing T3, the descent speed Vz1, and the rise speed Vz2. Additionally, the acceleration Az1 at the start of descent of the suction nozzle 7, the acceleration Az2 at the end of descent, the acceleration Az3 at the start of rise, and the acceleration Az4 at the end of rise are also control parameters for component loading. Note that the speeds Vz1, Vz2 and accelerations Az1-Az4 for component pickup and component loading do not need to be the same. Thus, the control parameters for component pickup and component loading include not only control parameters related to the lifting and lowering motion (speeds Vz1, Vz2, accelerations Az1-Az4), but also control parameters related to timing and time (suction ON timing T1, suction OFF timing T2, blow ON timing T3, suction time D1, push-in time D2).

[0036] Next, with reference to Figure 7, an example of control parameters included in part data 17 will be described. Part data 17 contains various control parameters registered for each part name (part type). In this example, the registered control parameters include acceleration Axy and velocity Vxy for moving the first work head H1 (second work head H2) horizontally, acceleration Az1 and velocity Vz1 for lowering the suction nozzle 7, suction time D1, pushing time D2, suction ON timing T1, suction OFF timing T2, and blow ON timing T3.

[0037] Furthermore, in this embodiment, the component data 17 has control parameters of three ranks registered for each component name. Rank 1 is the control parameter for a required quality of "standard," rank 2 is for "high quality," and rank 3 is for "ultra-high quality." For example, the acceleration Axy that moves the first work head H1 (second work head H2) horizontally decreases in the order of rank 1 (Axy1), rank 2 (Axy2), and rank 3 (Axy3). As a result, the vibration generated when the first work head H1 moves decreases in the order of rank 1, rank 2, and rank 3, and the quality of component mounting improves. On the other hand, the time required for movement increases in this order, and productivity decreases.

[0038] In Figure 4, the control parameter setting unit 19 sets control parameters for the first work unit W1 and the second work unit W2 that correspond to the required quality of the mounted board, based on the information regarding the operating mode included in the production data 16 and the required quality of the mounted board. Then, the control unit 10 uses the control parameters set by the control parameter setting unit 19 to operate the first work unit W1 and the second work unit W2 to perform the component mounting work.

[0039] Specifically, when the operating mode is independent mode, the control parameter setting unit 19 sets control parameters for the first work unit W1 based on the required quality (first required quality) of the substrate 3A on which components are mounted in the first substrate transport lane L1, and sets control parameters for the second work unit W2 based on the required quality (second required quality) of the substrate 3B on which components are mounted in the second substrate transport lane L2. For example, if the required quality of substrate 3A is rank 1 and the required quality of substrate 3B is rank 2, the control parameter setting unit 19 sets rank 1 control parameters for the first work unit W1 and rank 2 control parameters for the second work unit W2.

[0040] Furthermore, when the operating mode is linked mode, the control parameter setting unit 19 sets the same required quality control parameters for both the control parameters for the first work unit W1 and the control parameters for the second work unit W2. If the required quality of board 3A, on which components are mounted in the first board transport lane L1, and the required quality of board 3B, on which components are mounted in the second board transport lane L2, are different, the control parameter setting unit 19 sets the control parameters for the board with the higher required quality. For example, if the required quality of board 3A is rank 1 and the required quality of board 3B is rank 2, the control parameter setting unit 19 sets the same rank 2 control parameters for both the first work unit W1 and the second work unit W2. In other words, if the required quality of board 3A (first required quality) is lower than the required quality of board 3B (second required quality), the control parameter setting unit 19 corrects the control parameters for the first work unit W1 from rank 1 (standard) to rank 2 (high quality).

[0041] Thus, the control parameter setting unit 19 can set the control parameters for the first work unit W1 and the control parameters for the second work unit W2 separately. In cooperative mode, the same control parameters can be set for both the first work unit W1 and the second work unit W2, while in independent mode, different control parameters can be set. This allows for the appropriate parallel operation of component mounting work on multiple substrates 3A and 3B with different required accuracy (required quality).

[0042] Next, the method for setting control parameters by the control parameter setting unit 19 will be explained with reference to the flow chart in Figure 8. The setting of control parameters by the control parameter setting unit 19 is performed before the start of the component mounting work. First, the control parameter setting unit 19 determines whether the operating mode included in the production data 16 is an independent mode or not (ST1).

[0043] If the operating mode is independent mode (Yes in ST1), the control parameter setting unit 19 checks the required quality included in the production data 16 for boards 3A and 3B on which component mounting work is scheduled, separately for each board transport lane (first board transport lane L1, second board transport lane L2) (ST2). Next, the control parameter setting unit 19 determines the control parameters to be used separately for the first control unit 11 that controls the first work unit W1 and for the second control unit 12 that controls the second work unit W2 (ST3).

[0044] In Figure 8, if the independent mode is not the independent mode (No in ST1), the control parameter setting unit 19 checks the required quality included in the production data 16 for boards 3A and 3B, which are scheduled to have component mounting work done on the first board transport lane L1 and the second board transport lane L2 (ST4). Next, the control parameter setting unit 19 determines the control parameters to be used in common for the first control unit 11 that controls the first work unit W1 and the second control unit 12 that controls the second work unit W2 (ST5).

[0045] Furthermore, if the component mounting device 1 is configured to produce mounted boards of multiple models on a single board transport lane (first board transport lane L1, second board transport lane L2), then in (ST2) and (ST4), the most stringent quality requirements among the models for which component mounting work is scheduled will be confirmed.

[0046] As described above, the component mounting device 1 of this embodiment includes a first substrate transport lane L1 for transporting substrates 3, a second substrate transport lane L2 for transporting substrates 3, a first component supply unit S1 having a plurality of component supply units 4, a second component supply unit S2 having a plurality of component supply units 4, a first work unit W1 including a first work head H1 and a first work head moving mechanism 9A for moving the first work head H1, and a second work unit W2 including a second work head H2 and a second work head moving mechanism 9B for moving the second work head.

[0047] Furthermore, the component mounting device 1 includes a control unit 10 that controls the first work unit W1 and the second work unit W2 in multiple operating modes, including a cooperative mode in which the first work unit W1 and the second work unit W2 jointly perform component mounting work on the substrate 3 in the first substrate transport lane L1 or the second substrate transport lane L2, and an independent mode in which the first work unit W1 performs component mounting work on the substrate 3 in the first substrate transport lane L1 and the second work unit W2 performs component mounting work on the substrate 3 in the second substrate transport lane L2, and a control parameter setting unit 19 that can separately set control parameters for the first work unit W1 and control parameters for the second work unit W2.

[0048] The control unit 10 then uses the control parameters set in the control parameter setting unit 19 to operate the first work unit W1 and the second work unit W2 to perform component mounting work. This makes it possible to perform component mounting work appropriately and in parallel on multiple circuit boards with different required precision (quality).

[0049] Next, another embodiment of the component mounting device 1 will be described. In another embodiment of the component mounting device 1, when the operating mode is independent mode and the required quality of the substrate 3A in the first substrate transport lane L1 and the substrate 3B in the second substrate transport lane L2 is different, the control parameter setting unit 19 sets the control parameters for the first work unit W1 and the second work unit W2 based on the parameter coefficients 18 stored in the storage unit 15.

[0050] First, with reference to Figure 9, an example of a parameter coefficient 18 included in the control parameter correction coefficient table will be explained. The parameter coefficient 18 is a coefficient used by the control parameter setting unit 19 to correct the control parameter of the lower quality requirement when the required quality on the first substrate transport lane L1 side and the required quality on the second substrate transport lane L2 side are different.

[0051] The parameter coefficient 18 is applied to the control parameters for the work unit on the substrate transport lane (our side). Specifically, if the required quality of the substrates on our substrate transport lane is lower than the required quality of the substrates on the other side, the control parameters for our work unit are corrected using the parameter coefficient 18. In other words, if our work unit has control parameters that are more productive than those of the other work unit, the control parameter setting unit 19 corrects our control parameters (for example, by correcting acceleration or velocity).

[0052] When setting control parameters for the first work unit W1, the control parameter setting unit 19 uses a parameter coefficient 18 determined by the required quality of the substrate 3 in the first substrate transport lane L1 (our side) and the required quality of the substrate 3 in the second substrate transport lane L2 (the other side). On the other hand, when setting control parameters for the second work unit W2, the control parameter coefficient 18 determined by the required quality of the substrate 3 in the second substrate transport lane L2 (our side) and the required quality of the substrate 3 in the first substrate transport lane L1 (the other side).

[0053] In Figure 9, if the required quality of our board transport lane is standard (rank 1), high quality (rank 2), or ultra-high quality (rank 3), and the required quality of the other board transport lane is standard, the parameter coefficient 18 is set to "1.0". Also, if the required quality of our board transport lane is high quality or ultra-high quality, and the required quality of the other board transport lane is high quality, the parameter coefficient 18 is set to "1.0". Furthermore, if the required quality of our board transport lane is ultra-high quality, and the required quality of the other board transport lane is ultra-high quality, the parameter coefficient 18 is set to "1.0". In other words, if the required quality of our board transport lane is the same as or higher than that of the other, our control parameters are not corrected.

[0054] In Figure 9, when the required quality of our board transport lane is standard, the parameter coefficient 18 is set to "0.9" if the required quality of the other board transport lane is high, and to "0.8" if it is ultra-high quality. Also, when the required quality of our board transport lane is high, the parameter coefficient 18 is set to "0.9" if the required quality of the other board transport lane is ultra-high quality. In other words, if the required quality of the other board transport lane is higher than ours, the control parameters for our work unit are corrected, and the correction amount increases as the difference in required quality between our board transport lane and the other board transport lane increases.

[0055] The control parameter correction is performed by the control parameter setting unit 19, and control parameters that affect quality, such as acceleration Axy,Az1 and velocity Vxy,Vz1, are corrected by the corresponding parameter coefficient 18. For example, if the parameter coefficient 18 is "0.9", control parameters such as acceleration Axy,Az1 and velocity Vxy,Vz1 are corrected to 0.9 times their original value. In this way, by correcting the control parameter with the lower quality requirement, component mounting work can be performed appropriately and in parallel on multiple boards with different required precision (quality).

[0056] Next, with reference to the flowchart in Figure 10, the control parameter setting method by the control parameter setting unit 19 in another embodiment of the component mounting device 1 will be described. Hereafter, the same reference numerals will be used for the same steps as in the control parameter setting method shown in Figure 8, and detailed explanations will be omitted. The control parameter setting method shown in Figure 10 differs from the control parameter setting method shown in Figure 8 in that, in independent mode (Yes in ST1), the control parameters to be used separately for the first work unit W1 and the second work unit W2 are determined (ST3), and then the control parameter setting unit 19 corrects the control parameters based on the parameter coefficients 18 (ST6).

[0057] In other words, in (ST6), if the required quality of board 3A on the first board transport lane L1 where component mounting work will be performed differs from the required quality of board 3B on the second board transport lane L2, the control parameter setting unit 19 corrects the control parameter for the board with the lower required quality based on the parameter coefficient 18. This makes it possible to perform component mounting work appropriately and in parallel on multiple boards with different required precision (quality). [Industrial applicability]

[0058] The component mounting apparatus of the present invention has the effect of being able to perform component mounting work appropriately and in parallel on multiple substrates with different required precisions, and is useful in the field of mounting components on substrates. [Explanation of Symbols]

[0059] 1. Component mounting device 3, 3A, 3B board 4. Parts supply unit 9A First work head movement mechanism 9B Second work head movement mechanism 10 Control Unit A1 1st area A2 2nd area H1 First work head H2 Second work head L1 First substrate transport lane L2 Second board transport lane S1 First Parts Supply Unit S2 2nd parts supply section W1 First Working Group W2, Second Working Group

Claims

1. A first substrate transport lane that transports substrates along a horizontally extending axis, A second substrate transport lane is positioned away from the first substrate transport lane in a direction along another axis perpendicular to the first axis in the horizontal plane, and transports substrates along the first axis. A first component supply unit having a plurality of component supply units arranged in parallel along one axis, positioned in the direction along the other axis opposite to the second substrate transport lane with respect to the first substrate transport lane, and at a position away from the first substrate transport lane, A second component supply unit having a plurality of component supply units arranged in parallel along one axis, positioned opposite to the first substrate transport lane in the direction along the other axis, and located away from the second substrate transport lane, A first work unit including a first work head for holding components and mounting them on a substrate, and a first work head moving mechanism for moving the first work head from at least above the first component supply unit into a first area above the second substrate transport lane, A second work unit includes a second work head for holding components and mounting them on a substrate, and a second work head moving mechanism for moving the second work head from at least above the second component supply unit into a second area above the first substrate transport lane. A control unit that controls the first and second work units in a plurality of operating modes, including a cooperative mode in which the first and second work units jointly perform component mounting work on the substrates in the first substrate transport lane or the second substrate transport lane, and an independent mode in which the first work unit performs component mounting work on the substrates in the first substrate transport lane and the second work unit performs component mounting work on the substrates in the second substrate transport lane. The system includes a control parameter setting unit that can separately set the control parameters for the first work unit and the control parameters for the second work unit, The control unit uses the control parameters set in the control parameter setting unit to cause the first work unit and the second work unit to perform the component mounting operation. The control parameter setting unit sets control parameters corresponding to the required quality of the substrate. When the control parameter setting unit controls the first work unit and the second work unit in the independent mode, it sets control parameters for the first work unit based on the first required quality of the substrate on which components are mounted in the first substrate transport lane, and sets control parameters for the second work unit based on the second required quality of the substrate on which components are mounted in the second substrate transport lane. If the first required quality is lower than the second required quality, the control parameter setting unit corrects the control parameters for the first work unit, component mounting device.

2. The control parameter setting unit is, In the aforementioned collaborative mode, the same control parameters are set for the control parameters of the first work unit and the control parameters of the second work unit. The component mounting device according to claim 1, wherein different control parameters are set for the control parameters for the first work unit and the control parameters for the second work unit when in the independent mode.

3. The control unit causes the first and second work units to perform the component mounting work while referring to production data including information regarding the mounting position of components on the substrate. The component mounting apparatus according to claim 1, wherein the control parameter setting unit sets control parameters based on the information regarding the operating mode included in the production data.

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