Electronic devices

Abstract

To provide an electronic device capable of shortening a development time and dealing with large current and high breakdown voltage.SOLUTION: An electronic device S100 includes a first electronic component 10, and an adapter 30 having a housing portion 35 for housing the first electronic component 10 formed therein. The adapter 30 has: an adapter body 31 having a first surface 31a and a second surface 31b opposite the first surface 31a in a thickness direction of the adapter 30; and a conductive post 38 penetrating the adapter body 31 from the first surface 31a to the second surface 31b. The housing portion 35 is formed as a recess on the first surface 31a, and a mounting portion P1 for mounting the second electronic component 20 is formed on the second surface 31b.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an electronic device.

Background Art

[0002] Conventionally, packaged electronic devices in which a plurality of electronic components are molded with resin are known (see, for example, Patent Document 1). The molded electronic component is electrically connected to a circuit pattern of a substrate on which the electronic device is mounted, via external terminals formed on the bottom surface of the electronic device.

Prior Art Literature

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the conventional configuration, since the molded electronic component is connected to the external circuit pattern through the external terminals of the electronic device, it is necessary to design the circuit configuration inside the package and perform performance evaluation each time an electronic device is developed, which causes a prolonged development period. On the other hand, in recent years, electric devices capable of handling large currents and high withstand voltages have been desired.

[0005] The present invention has been made in view of these points, and an object thereof is to provide an electric device that can shorten the development period and can handle large currents and high withstand voltages.

Means for Solving the Problems

[0006] An electronic device in one embodiment of the present invention for solving the above problems comprises a first electronic component and an adapter having a housing portion for housing the first electronic component, wherein the adapter has an adapter body having a first surface and a second surface opposite to the first surface in the thickness direction of the adapter, and a conductive post penetrating the adapter body from the first surface to the second surface, wherein the housing portion is formed as a recess on the first surface and a mounting portion for mounting a second electronic component is formed on the second surface.

[0007] The conductive post may include a first conductive post and a second conductive post provided on the opposite side of the first conductive post with the housing portion in between, and the second electronic component mounted on the mounting portion may be electrically connected to the first conductive post and the second conductive post.

[0008] The conductive post includes a first conductive post and a second conductive post provided on the opposite side of the first conductive post with the housing portion in between, and the adapter body is divided into a plurality of components, the plurality of components including a first member provided with the first conductive post and a second member provided with the second conductive post, the first member having a first thickened portion which is the part where the first conductive post is provided and a first extension portion which extends from the first thickened portion toward the side of the second member, the second member having a second thickened portion which is the part where the second conductive post is provided and a second extension portion which extends from the second thickened portion toward the side of the first member, the first extension portion and the second extension portion extending so as to cover the first electronic component, and a gap may be formed between the first extension portion and the second extension portion in the assembled state of the electronic device.

[0009] The aforementioned gap may extend from one end face to the other end face of the adapter body, forming a heat dissipation passage through which air can flow.

[0010] The heat dissipation passage may face a portion of the outer surface of the second electronic component.

[0011] The adapter may further include at least one of a first protruding electrode portion formed to protrude from the first conductive post toward the second conductive post and exposed on the second surface in the mounting portion, and a second protruding electrode portion formed to protrude from the second conductive post toward the first conductive post and exposed on the second surface in the mounting portion.

[0012] The adapter may further have on its second surface another mounting portion on which a third electronic component is mounted, the third electronic component having electrode portions at both ends, wherein the distance between the electrode portions is shorter than the distance between the electrode portions of the second electronic component.

[0013] The adapter may further have a connecting electrode portion that extends from the conductive post toward the side end face of the adapter body and is exposed at the side end face. [Effects of the Invention]

[0014] The present invention offers the advantages of shortening the development period and providing electrical devices capable of handling high currents and high voltages. [Brief explanation of the drawing]

[0015] [Figure 1] This is a diagram showing an electronic device according to the first embodiment. [Figure 2] This figure shows the electronic device shown in Figure 1. [Figure 3] This figure shows an electronic device according to the second embodiment. [Figure 4] Figure 3 shows the disassembled state of the electronic device. [Figure 5] This figure shows an electronic device according to the third embodiment. [Figure 6] This figure shows a modified example of the third embodiment. [Figure 7] This figure shows an electronic device according to the fourth embodiment. [Figure 8] Figure 7 is a cross-sectional view along line BB. [Figure 9] It is a diagram showing an electronic device according to a modification of the present invention.

Mode for Carrying Out the Invention

[0016] <First Embodiment> Figure 1 is a diagram showing the electronic device of the first embodiment. Figure 1(a) is a side view, and Figure 1(b) is a cross-sectional view taken along line A-A in Figure 2. Figure 2 is a diagram showing the electronic device of Figure 1. Figure 2(a) is a plan view, and Figure 2(b) is a bottom view.

[0017] In the following description, terms indicating directions such as up, down, left, right, front, and rear are used in accordance with the orientation of the objects depicted in the drawings, and these terms are not used with the intention of limiting the present invention. The vertical direction corresponds to the thickness direction of the electronic device and the adapter.

[0018] The electronic device S100 is a single packaged device, and includes a first electronic component 10, a second electronic component 20, and an adapter 30.

[0019] The first electronic component 10 is any arbitrary electronic component, and in the present embodiment, it is a DFN (Dual-Flat No-leads) type component as an example. The first electronic component 10 has a structure in which a semiconductor chip is molded with resin. The first electronic component 10 has a rectangular parallelepiped shape as an example, and has a quadrangular contour shape in plan view as shown in Figure 2(b). The first electronic component 10 is not limited to a specific thickness, but is 1 mm or less as an example, specifically for example 0.7 mm or less. A plurality of terminals 11 are formed on the lower surface of the first electronic component 10.

[0020] Terminal 11 is formed of a conductive material and is electrically connected to the internal semiconductor chip. Terminal 11 is exposed on the bottom and side surfaces of the first electronic component 10. Terminal 11 is soldered to a predetermined printed circuit board, for example. In this embodiment, since the first electronic component 10 forms part of the outer shape of the electronic device S100, it can also be said that terminal 11 is exposed on the bottom and side surfaces of the electronic device S100.

[0021] The second electronic component 20 is located on the upper surface of the adapter 30. The second electronic component 20 may be any electronic component such as an inductor, capacitor, resistor, or semiconductor device, but in this embodiment, it is a coil (chip inductor) as an example. The second electronic component 20 has a main body 21 and a pair of electrodes 22. The application of the electronic device S100 is not particularly limited, but in a configuration in which a semiconductor chip including a transistor for switching current is built into the electronic device S100, a small DC / DC converter can be constructed by mounting such a chip inductor.

[0022] The adapter 30 is a component to which the first electronic component 10 and the second electronic component 20 are fixed. For example, the adapter 30 has a roughly rectangular parallelepiped shape. The adapter 30 comprises an adapter body 31 and a conductive post 38.

[0023] As shown in Figures 1 and 2, the adapter body 31 has a first surface 31a which is the bottom surface, a second surface 31b which is the top surface, a front surface 31c, a back surface 31d, a first side surface 31e, and a second side surface 31f. The second surface 31b is the surface opposite to the first surface 31a in the thickness direction of the adapter 30.

[0024] A housing portion 35 is formed on the first surface 31a of the adapter 30. The housing portion 35 is a portion for housing the first electronic component 10. Specifically, as shown in Figures 1(b) and 2(b), the housing portion 35 is a recess that has a rectangular cross-sectional shape in the thickness direction of the electronic device S100 and extends linearly from the front surface 31c to the back surface 31d. As an example, the housing portion 35 is formed to a depth such that, when the first electronic component 10 is placed inside, the bottom surface of the first electronic component 10 does not protrude from the first surface 31a.

[0025] The housing portion 35 can be formed by any processing step, and for example, it may be formed by making an incision in the first surface 31a of the adapter body 31 with a dicing machine.

[0026] In this embodiment, the housing portion 35 is a recess connecting the front surface 31c and the back surface 31d. However, the housing portion 35 may be a recess carved out from the first surface 31a and not exposed to any of the front surface 31c, back surface 31d, first side surface 31e, or second side surface 31f of the adapter body 31. The manufacturing method for forming such a recess is arbitrary, but for example, the recess may be formed by a mold or by machining such as an end mill.

[0027] As shown in Figure 1(b), a mounting area P1 on the second surface 31b is formed on which the second electronic component 20 is mounted. This mounting area P1 includes the area on which the second electronic component 20 is placed and the upper surfaces of the two conductive posts 38.

[0028] The conductive post 38 is a conductive member that penetrates the adapter body 31. The material of the conductive post 38 is, for example, copper. In this embodiment, a first conductive post 38-1 and a second conductive post 38-2 are provided as conductive posts 38. The first conductive post 38-1 is provided on the left side of Figure 1, and the second conductive post 38-2 is provided on the right side of Figure 1, that is, on the opposite side of the first conductive post 38-1 with the housing portion 35 in between. Since the first conductive post 38-1 and the second conductive post 38-2 have the same structure, they will not be distinguished and will simply be described as conductive post 38 below.

[0029] The conductive post 38 is formed to penetrate from the first surface 31a to the second surface 31b of the adapter body 31. The upper surface of the conductive post 38 is exposed to the second surface 31b, and the lower surface of the conductive post 38 is exposed to the first surface 31a. The upper surface of the conductive post 38 functions as a land for mounting the second electronic component 20. The lower surface of the conductive post 38 is electrically connected to a circuit pattern on a predetermined substrate.

[0030] In this embodiment, each electrode 22 of the second electronic component 20 is electrically connected to each conductive post 38. The electrical connection between the electrodes 22 and the conductive posts 38 can be made by any means, but in this embodiment, solder is used, for example.

[0031] The horizontal cross-sectional shape of the conductive post 38 can be any shape, such as a square, polygon, or circle, but in this example it is a square.

[0032] As can be seen from Figure 2, the conductive post 38 is embedded inside the adapter body 31. The conductive post 38 is not exposed on any of the front 31c, rear 31d, first side 31e, or second side 31f. Because the conductive post 38 is not exposed on the side of the electronic device S100, the signal flowing through the conductive post 38 is less likely to appear on the side of the electronic device S100. Therefore, even if other electronic devices are placed near the electronic device S100, the influence of the current flowing through the conductive post 38 on the other electronic devices S100 is reduced. This configuration has the advantage of allowing the device on which the electronic device S100 is mounted to be miniaturized.

[0033] The conductive post 38 has a relatively large cross-sectional area in the horizontal direction, that is, in the direction parallel to the first surface 31a or the second surface 31b. Furthermore, the horizontal cross-sectional area of ​​the conductive post 38 is, for example, 5% or more of the area of ​​the adapter body 31 in a plan view, preferably 10% or more. The front-to-back dimension of the conductive post 38 is, for example, 1 / 4 or more of the front-to-back dimension of the adapter body 31, preferably 1 / 3 or more. The left-to-right (width) dimension of the conductive post 38 is, for example, 1 / 10 or more of the left-to-right (width) dimension of the adapter body 31. With this configuration, the conductive post 38 has a large cross-sectional area and a large current capacity, making it possible to mount the second electronic component 20, which carries a large current, on the adapter 30. Also, because the conductive post 38 has a higher thermal conductivity than the resin material, it functions as a heat dissipation member, effectively dissipating heat from the electronic device S100. In the configuration of this embodiment, when the electronic device S100 is assembled, the upper surface of the conductive post 38 is partially exposed to the upper surface of the adapter 30, allowing for effective heat dissipation. Furthermore, the heat from the conductive post 38 can also be released to the outside of the device through the pattern of the substrate on which the electronic device S100 is mounted.

[0034] From the viewpoint of enabling a large current to flow through the conductive post 38, it is preferable that the horizontal area of ​​the conductive post 38 be formed to be as large as described above. However, the present invention is not limited thereto, and the horizontal cross-sectional area of ​​the conductive post 38 may be smaller than the above range.

[0035] (Functions of electronic device S100) In the electronic device S100 configured as described above, the lower surface of the conductive post 38 and the multiple terminals 11 function as external terminals of the electronic device S100. That is, the electronic device S100 is mounted on a predetermined substrate by electrically connecting the lower surface of the conductive post 38 and the multiple terminals 11 to a circuit pattern on a predetermined substrate.

[0036] (Effects of electronic device S100) According to the electronic device S100 of this embodiment, the terminals 11 of the first electronic component 10 housed in the housing section 35 of the adapter body 31 can be used directly as external terminals of the electronic device S100. Therefore, unlike conventional structures in which electronic components are molded, there is no need to create a connection circuit to connect the first electronic component 10 and the external terminals of the electronic device S100. Consequently, for example, an existing first electronic component 10 can be used as is, thus shortening the development period of the electronic device S100.

[0037] Furthermore, according to the configuration of this embodiment, the cross-sectional area (horizontal cross-sectional area) of the conductive post 38 is formed to be large, so in a configuration in which the second electronic component 20 is electrically connected to the first conductive post 38-1 and the second conductive post 38-2, it is possible to accommodate the second electronic component 20 with high current and high voltage resistance. In addition, the conductive post 38 has a higher thermal conductivity than resin material, and in this embodiment in particular, the upper surface of the conductive post 38 is exposed to the second surface 31b of the adapter 30, so the heat of the electronic device S100 can be dissipated well.

[0038] Furthermore, in the configuration of this embodiment, the housing portion 35 is formed to extend from the front surface 31c to the back surface 31d. This configuration has the advantage that the housing portion 35, which is a recess, can be easily formed by processing with a dicer or the like.

[0039] In the above explanation, a configuration in which multiple terminals 11 are exposed on the underside of the first electronic component 10 was used as an example, but the terminals of the first electronic component 10 do not necessarily have to be exposed on the underside.

[0040] <Second Embodiment> In the configuration of the first embodiment, it is necessary to appropriately change the width dimension of the housing section 35 according to the size of the first electronic component 10 housed in the housing section 35. Therefore, in order to accommodate various sizes of the first electronic component 10, one embodiment of the electronic device of the present invention may be configured as follows.

[0041] Figure 3 shows an electronic device according to the second embodiment. Figure 4 shows the electronic device of Figure 3 in a disassembled state.

[0042] The electronic device S101 comprises a first electronic component 10, a second electronic component 20, and an adapter 130. Except that the adapter 130 has a different structure from the adapter 30 of the first embodiment, the electronic device S101 has the same configuration as the electronic device S100 of the first embodiment.

[0043] The adapter 130 comprises a first adapter body 131-1, a first conductive post 38-1, a second adapter body 131-2, and a second conductive post 38-2. Since the first adapter body 131-1 and the second adapter body 131-2 have symmetrical shapes, the first adapter body 131-1 will be used as an example for the following explanation.

[0044] The first adapter body 131-1 is a first component that makes up the adapter body 131, and has a first thickened portion 132-1 and a first extended portion 133-1.

[0045] The first thickened portion 132-1 is the area where the first conductive post 38-1 is provided. In the adapter body 31 of the first embodiment, the first thickened portion 132-1 corresponds to the part of the adapter body 31 adjacent to the side of the housing portion 35.

[0046] The first extension portion 133-1 corresponds to a part of the adapter body 31 above the housing portion 35 in the adapter body 31 of the first embodiment. The first extension portion 133-1 extends horizontally from the upper end of the first thickened portion 132-1 toward the side of the second adapter body 131-2. The first extension portion 133-1 partially covers the upper surface of the first electronic component 10.

[0047] The second adapter body 131-2 is configured in the same way as the first adapter body 131-1. The second adapter body 131-2 is a second component of the adapter body 131 and has a second thickened portion 132-2 and a second extended portion 133-2.

[0048] The second thickened portion 132-2 is similar to the first adapter body 131-1, but the second conductive post 38-2 is provided in this portion. The second extended portion 133-2 extends from the second thickened portion 132-2 toward the first adapter body 131-1.

[0049] As can be seen from Figure 3, the first extension 133-1 and the second extension 133-2 extend to cover the first electronic component 10, and in the assembled state of the electronic device S101, a gap Sa is formed between the first extension 133-1 and the second extension 133-2. In other words, the tip of the first extension 133-1 and the tip of the second extension 133-2 are not in contact with each other, and a gap Sa is formed between them.

[0050] The upper surface of the first electronic component 10 is fixed, for example, to the first extension portion 133-1 and the second extension portion 133-2. Adhesive may be used for fixing.

[0051] The air gap Sa extends from one end face (the front 31c of the adapter body 31) to the other end face (the back 31d of the adapter body 31) of the adapter body 131. In other words, the air gap Sa forms a heat dissipation passage through which air can flow from one end face to the other of the adapter body 131. The air gap Sa extends so as to face a portion of the outer surface (top surface) of the first electronic component 10. The air gap Sa also extends so as to face a portion of the outer surface (bottom surface) of the second electronic component 20. In this embodiment, since the air gap Sa is provided in this way and a heat dissipation passage is formed to release heat from the first electronic component 10 and / or the second electronic component 20, the heat generated during operation of the electronic device 101 can be effectively dissipated.

[0052] Referring to Figure 4, the manufacturing of the electronic device S101 will be briefly described. The first adapter body 131-1 and the second adapter body 131-2 can be manufactured, for example, by cutting the thin portion (the part above the housing portion 35) of the adapter body 31 of the first embodiment. As shown in Figure 4, the first adapter body 131-1 and the second adapter body 131-2 are arranged to sandwich the first electronic component 10 from both sides. With the first electronic component 10 fixed inside the first adapter body 131-1 and the second adapter body 131-2, the second electronic component 20 is placed on the upper surfaces of the first adapter body 131-1 and the second adapter body 131-2. Then, by electrically connecting each electrode 22 of the second electronic component 20 to each conductive post 38, the electronic device S101 is manufactured.

[0053] According to the configuration of the second embodiment, various sizes of first electronic components 10 can be easily attached to the adapter 130, and therefore, there is no need to prepare multiple adapters 130 with different shapes of housing sections 35.

[0054] According to the configuration of this embodiment, in the assembled state of the electronic device S100, a gap Sa is formed between the first extension portion 133-1 and the second extension portion 133-2. Since this gap Sa functions as a heat dissipation passage, heat generated during the operation of the electronic device S101 can be effectively dissipated. When the gap Sa is formed to extend from the front to the back of the adapter 130, that is, when the end of the heat dissipation passage is exposed to both the front and back of the adapter 130, heat can be dissipated particularly effectively through the end of this heat dissipation passage. Heat may also be efficiently dissipated by flowing air through the gap Sa.

[0055] Furthermore, since air is present in the void Sa, compared to a configuration where the first electronic component 10 and the second electronic component 20 are adjacent to each other via a thin-walled portion of an adapter member made of resin, for example, this configuration has the effect of suppressing the transfer of heat from one of the first electronic component 10 and the second electronic component 20 to the other.

[0056] Although the effects of the void Sa have been explained above, the main feature of the second embodiment is that the first electronic component 10 is sandwiched between a pair of adapter bodies 131, and the void Sa being a cavity is not an essential component. For example, the void Sa may be filled with a material such as adhesive.

[0057] <Third Embodiment> The adapter in the electronic device of the present invention can mount second electronic components 20 of various sizes. As mentioned above, the conductive post 38 has a relatively large horizontal cross-sectional area and a long width dimension (the left-right dimension in Figure 1), so even with configurations like those in the first and second embodiments, it is possible to mount second electronic components 20 of somewhat different sizes. However, to enable the mounting of second electronic components 20 of a wider range of sizes, the electronic device may be configured as follows.

[0058] Figure 5 shows an electronic device according to the third embodiment. Figure 5(a) is a cross-sectional view, and Figure 5(b) is a plan view with the second electronic component 20 omitted. The electronic device S102 is similar in basic structure to the electronic device S100 of the first embodiment, but differs in that it has a protruding electrode portion 39.

[0059] In this example, the protruding electrode portion 39 is provided as a first protruding electrode 39-1 and a second protruding electrode 39-2. The first protruding electrode 39-1 is formed to protrude from the first conductive post 38-1 toward the second conductive post 38-2. Specifically, the first protruding electrode 39-1 is formed to extend to the area above the first electronic component 10. The first protruding electrode 39-1 is exposed on the second surface 31b of the adapter in the mounting portion where the second electronic component 20 is mounted. Similarly, the second protruding electrode 39-2 protrudes from the second conductive post 38-2 toward the first conductive post 38-1, with its upper surface exposed on the second surface 31b.

[0060] With this configuration, because the protruding electrode portion 39 is formed, the upper surface of the protruding electrode portion 39, in addition to the upper surface of the conductive post 38, also becomes a land to which the electrodes 22 of the second electronic component 20 can be connected. As a result, the land area is increased, and the second electronic component 20 of various sizes can be mounted.

[0061] Furthermore, since the protruding electrode portion 39, which is made of conductive material, can also function as a shielding member for the first electronic component 10, this configuration can be expected to reduce the influence that electronic components have on each other due to electromagnetic wave leakage.

[0062] In the above description, a configuration in which both the first protruding electrode 39-1 and the second protruding electrode 39-2 are provided is given as an example, but only one of them may be formed.

[0063] Figure 6 shows a modified example of the third embodiment. The above-described configuration may be applied to a configuration similar to that of the second embodiment in which a void Sa is formed, as shown in Figure 6.

[0064] <Fourth Embodiment> In the electronic device of the present invention, one or more third electronic components may be mounted in addition to the first electronic component 10 and the second electronic component 20. Figure 7 shows an electronic device according to the fourth embodiment. Figure 8 is a cross-sectional view along line BB in Figure 7.

[0065] The electronic device S103 comprises a first electronic component 10, a second electronic component 20, a third electronic component 50, and an adapter 230. Except for the presence of the third electronic component 50 and the fact that the adapter 230 has a structural component electrically connected to the third electronic component 50, the basic structure is the same as in the first embodiment, and therefore, redundant explanations are omitted. While this description focuses on an example with a basic structure common to the first embodiment, the configuration in which the third electronic component 50 is provided may be combined with, for example, the configuration of the second embodiment.

[0066] In this example, two third electronic components 50 are provided: third electronic component 50-1 and third electronic component 50-2. Since third electronic component 50-1 and third electronic component 50-2 have the same configuration, third electronic component 50-1 will be described below. As an example, the third electronic component 50 is an electronic component that is smaller than the first electronic component 10 and the second electronic component 20. The third electronic component 50 can be any electronic component, but for example, it is a chip capacitor. Electrodes are provided at both ends of the third electronic component 50. The distance between the electrodes of the third electronic component 50 is shorter than the distance between the electrodes of the second electronic component 20.

[0067] As shown in Figure 7(a), the adapter 230 has a mounting section P on which the third electronic component 50 is mounted. The present invention has 2. The mounting section P2 is provided on the upper surface (second surface) of the adapter 230. In the configuration shown in Figure 7, one mounting section P2 is provided on the front side and one on the back side of the adapter 230, but the present invention is not limited to this.

[0068] As shown in Figures 7 and 8, the adapter 230 also has a conductive member 240 that is connected to the third electronic component 50. Specifically, the conductive member 240 consists of a first conductive member 240-1 and a second conductive member 240-2. Since the first conductive member 240-1 and the second conductive member 240-2 have similar structures, the first conductive member 240-1 will be described below as an example.

[0069] As shown in Figure 8, the first conductive member 240-1 has a through electrode portion 245 and a protruding electrode portion 246. The material of the first conductive member 240-1 is, for example, copper.

[0070] The through-electrode portion 245, like the conductive post 38, is formed to penetrate the adapter 230 in its thickness direction. The upper surface of the through-electrode portion 245 is exposed to the upper surface of the adapter 230, and the lower surface of the through-electrode portion 245 is exposed to the lower surface of the adapter 230.

[0071] The protruding electrode portion 246 is an electrode that extends from the upper end of the through-electrode portion 245 toward the side of the second conductive member 240-2. The upper surface of the protruding electrode portion 246 is exposed on the upper surface of the adapter 230. The protruding electrode portion 246 of the second conductive member 240-2 is configured in the same manner. The third electronic component 50 is mounted on the pair of protruding electrode portions 246 formed in this manner. The electrode portions at the ends of the third electronic component 50 are each electrically connected to the protruding electrode portion 246.

[0072] As described above, the modular configuration of the first electronic component 10, the second electronic component 20, and the third electronic component 50 makes the electronic device S100 more functional.

[0073] Figure 9 shows an electronic device of a modified example of the present invention. All of the electrical devices in Figure 9 are examples in which electrodes are provided near the conductive post 38 of the electronic device S100 in Figure 1. As shown in Figure 9(a), one embodiment of the present invention may have a connecting electrode portion 41.

[0074] The connecting electrode section 41 is an electrode section provided inside the adapter 30. In the example shown in Figure 9, the connecting electrode section 41 consists of a first connecting electrode section 41-1 and a second connecting electrode section 41-2, but since they have similar structures, the first connecting electrode section 41-1 will be described below as an example.

[0075] The first connecting electrode portion 41-1 is provided on the lower side of the conductive post 38 and extends from the first conductive post 38-1 toward the side end face (first side surface 31e) of the adapter body 31. The end face of the first connecting electrode portion 41-1 is exposed to the first side surface 31e.

[0076] Similarly, the second connecting electrode portion 41-2 extends from the second conductive post 38-2 toward the second side surface 31f. The end face of the second connecting electrode portion 41-2 is exposed to the second side surface 31f.

[0077] With this configuration, the connection electrode portion 41 can be used as an external connection terminal for the electronic device, making it easier to electrically connect the electronic device to other devices or circuit patterns.

[0078] The connecting electrode portion 41 may be provided in a position as shown in Figure 9(b), rather than as shown in Figure 9(a). Specifically, in the electronic device shown in Figure 9(b), the connecting electrode portion 41 is provided at an intermediate position in the height direction of the conductive post 38. The connecting electrode portion 41 is exposed on the first side surface 31e, but not on either the first surface 31a or the second surface 31b. In other words, the resin members of the adapter 30 are present above and below the connecting electrode portion 41.

[0079] This configuration produces the following effect. Specifically, in the configuration shown in Figure 9(a), burrs may form on the material of the connecting electrode portion 41 when manufacturing the electronic device (specifically, when cutting the adapter 30 from a predetermined material). Specifically, if the adapter 30 is cut from the top surface to the bottom surface using a dicing machine, for example, the connecting electrode portion 41, which is made of a material such as copper, may not be cleanly cut off, and burrs may form on the lower end of the connecting electrode portion 41.

[0080] In contrast, the configuration shown in Figure 9(b), in which the connecting electrode portion 41 is located at an intermediate position in the height direction of the conductive post 38 and the top and bottom of the connecting electrode portion 41 are sandwiched between molded material, is advantageous in that it is less likely to generate burrs compared to the configuration in Figure 9(a).

[0081] Although the present invention has been described above using embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments, and various modifications and changes are possible within the scope of its gist. For example, all or part of the apparatus can be configured by functionally or physically distributing and integrating in any unit. Furthermore, new embodiments resulting from any combination of multiple embodiments are also included in the embodiments of the present invention. The effects of the new embodiments resulting from the combinations are combined with the effects of the original embodiments. [Explanation of symbols]

[0082] 10 First Electronic Components 11 terminals 20 Second Electronic Components 21 Main body 22 electrodes 30 adapters 31 Adapter body 31a 1st page 31b 2nd side 31c front 31d back 31e 1st side 31f 2nd side 35 Accommodation 38 conductive posts 38-1 First conductive post 38-2 Second conductive post 39 Protruding electrode part 39-1 1st protruding electrode 39-2 2nd protruding electrode 41 Connecting electrode section 41-1 First connecting electrode section 41-2 Second connecting electrode section 50 Third Electronic Components 130 adapter 131 Adapter body 131-1 First Adapter Body 131-2 Second Adapter Body 132-1 1st thick part 132-2 2nd thick part 133-2 Second extension part 230 adapter 240 Conductive member 245 Through electrode section 246 Protruding electrode part P1, P2 Implementation Section S100 Electronic Devices S101 Electronic Devices S102 Electronic Devices S103 Electronic Devices Sa void

Claims

1. First electronic component and, An adapter having a housing section for housing the first electronic component, Equipped with, The aforementioned adapter is An adapter body having a first surface and a second surface opposite to the first surface in the thickness direction of the adapter, The adapter body includes a conductive post that penetrates from the first surface to the second surface, It has, The housing portion is formed as a recess on the first surface, and the mounting portion on the second surface is formed on which the second electronic component is mounted. As the aforementioned conductive post, First conductive post and A second conductive post is provided on the opposite side of the first conductive post, with the aforementioned housing portion in between, It has, The adapter body is divided into multiple components, As the plurality of constituent members, The first member provided with the first conductive post, The second member provided with the second conductive post, It has, The first member has a first thickened portion which is the part in which the first conductive post is provided, and a first extended portion which extends from the first thickened portion toward the side of the second member. The second member has a second thickened portion, which is the portion where the second conductive post is provided, and a second extended portion that extends from the second thickened portion toward the first member. The first extension and the second extension extend to cover the first electronic component, and in the assembled state of the electronic device, a gap is formed between the first extension and the second extension. Electronic devices.

2. The second electronic component mounted on the mounting section is electrically connected to the first conductive post and the second conductive post, The electronic device according to claim 1.

3. The aforementioned void is It extends from one end face to the other end face of the adapter body, forming a heat dissipation passage through which air can flow. The electronic device according to claim 1 or 2.

4. The heat dissipation passage faces a part of the outer surface of the second electronic component. The electronic device according to claim 3.

5. The aforementioned adapter is A first protruding electrode portion is formed to protrude from the first conductive post toward the second conductive post and is exposed on the second surface in the mounting portion. And, The second protruding electrode portion is formed to protrude from the second conductive post toward the first conductive post and is exposed on the second surface in the mounting portion. Having at least one of the following: The electronic device according to claim 1 or 2.

6. The aforementioned adapter is The second surface further has another mounting portion on which a third electronic component is mounted, the third electronic component having electrode portions at both ends, wherein the distance between the electrode portions is shorter than the distance between the electrode portions of the second electronic component. The electronic device according to claim 1 or 2.

7. The adapter further has a connecting electrode portion that extends from the conductive post toward the side end face of the adapter body and is exposed at the side end face. The electronic device according to claim 1 or 2.

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