Electronic component handling equipment and electronic component testing equipment

Abstract

To provide an electronic component handling device which can easily deal with product class replacement of a DUT and can adopt a configuration that can individually adjust temperatures and parallel degrees of the plurality of DUTs.SOLUTION: An electronic component handling device 20 comprises: a plurality of holding blocks 40 which is arranged so as to correspond to a probe head 17 and holds a DUT 200; a holding plate 50 which has a plurality of openings 51 into which the holding blocks are inserted, the holding plate holding the plurality of holding blocks in an idling manner; an alignment unit 70 which is provided independently of the holding block and positions the DUT relative to the probe head by moving the holding block relative to the holding plate; and a pressure device 60 which presses the DUT to the probe head by moving the holding plate holding the holding block relative to the probe head.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an electronic component handling apparatus for handling a device under test (DUT) such as a semiconductor integrated circuit element, and an electronic component testing apparatus provided with the electronic component handling apparatus.

Background Art

[0002] An electronic component handling apparatus is known that includes a thermal head holding a plurality of bare dies, and a moving device that moves the thermal head, and is provided with an alignment unit that individually positions the plurality of bare dies relative to a contact portion and then simultaneously presses the plurality of bare dies against the contact portion (see, for example, Patent Document 1).

Prior Art Literature

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the above-described electronic component handling apparatus, the thermal head is fixed to the moving device. Therefore, when the pitch or arrangement of the contact portions on the test head is changed along with a change in the type of DUT, the entire alignment unit needs to be replaced, which poses a problem that it may not be possible to easily cope with the replacement of DUT types.

[0005] Further, in the above-described electronic component handling apparatus, the plurality of bare dies are held on the same holding surface of the thermal head. Therefore, there is a problem that it is difficult to adopt a configuration that allows the temperature and parallelism of the plurality of bare dies to be individually adjusted.

[0006] The problem that the present invention aims to solve is to provide an electronic component handling apparatus and an electronic component testing apparatus that can easily accommodate changes in the type of DUT and can employ a configuration that allows for individual adjustment of the temperature and parallelism of multiple DUTs. [Means for solving the problem]

[0007] [1] One aspect of the present invention is an electronic component handling device for moving a DUT to a contact portion, comprising: a plurality of holders, each arranged to correspond to the contact portion and each holding the DUT; a holding plate having a plurality of first openings into which each of the holders is inserted, and which movably holds the plurality of holders; a positioning device provided independently of the holders and which positions the DUT relative to the contact portion by moving the holders relative to the holding plate; and a pressing device which presses the DUT to the contact portion by moving the holding plate that holds the holders relative to the contact portion, wherein the positioning device contacts the holders and then moves the holders in a planar direction relative to the holding plate.

[0008] [2] A second aspect of the present invention is an electronic component handling device according to the first aspect, wherein the pressing device comprises a holding frame that detachably holds the holding plate, and a first moving device that moves the holding frame that holds the holding plate.

[0009] [3] Embodiment 3 of the present invention is an electronic component handling device according to Embodiment 1 or 2, wherein the plurality of holders are individually equipped with parallelism adjustment devices for adjusting the parallelism of the DUT with respect to the contact portion.

[0010] [4] A fourth aspect of the present invention is an electronic component handling device according to the third aspect, wherein the parallelism adjustment device comprises a first adjustment unit for tilting the DUT about a first axis and a second adjustment unit for tilting the DUT about a second axis, wherein the first axis is substantially parallel to the plane direction of the contact portion, and the second axis is substantially parallel to the plane direction of the contact portion and is substantially perpendicular to the first axis when the second axis is projected in the direction normal to the contact portion.

[0011] [5] Embodiment 5 of the present invention is an electronic component handling device according to Embodiment 3 or 4, wherein the electronic component handling device comprises a parallelism detection device for detecting the parallelism of the DUT with respect to the contact portion, and a first control device for controlling the parallelism adjustment device based on the parallelism detected by the parallelism detection device.

[0012] [6] Aspect 6 of the present invention is an electronic component handling device according to aspect 5, wherein the parallelism detection device comprises a first sensor for detecting the height of a predetermined position on the DUT, a second sensor for detecting the height of a predetermined position on the contact portion, and a calculation unit for calculating the parallelism of the DUT with respect to the contact portion based on the detection results of the first and second sensors.

[0013] [7] Aspect 7 of the present invention is an electronic component handling device according to aspect 6, wherein the electronic component handling device comprises a second moving device for moving the first and second sensors, the second moving device comprises a first parallel movement unit for moving the first and second sensors along a direction substantially parallel to the arrangement direction of the holders, and the first parallel movement unit has an operating range that allows the first and second sensors to face the plurality of holders.

[0014] [8] Embodiment 8 of the present invention is an electronic component handling device in any one of embodiments 3 to 7, wherein the plurality of holders are individually equipped with height adjustment devices for adjusting the height of the DUT relative to the contact portion.

[0015] [9] Aspect 9 of the present invention is an electronic component handling device according to aspect 6 or 7, wherein each of the plurality of holders is individually equipped with a height adjustment device for adjusting the height of the DUT relative to the contact portion, and the electronic component handling device is an electronic component handling device equipped with a second control device for controlling the height adjustment device based on the detection results of the first and second sensors.

[0016]

[10] Embodiment 10 of the present invention is an electronic component handling device in any one of embodiments 1 to 9, wherein the plurality of holders are individually equipped with heat exchangers that perform heat exchange with the DUT.

[0017]

[11] Embodiment 11 of the present invention is an electronic component handling device according to Embodiment 10, wherein the plurality of holders are each provided with a parallelism adjustment device for adjusting the parallelism of the DUT with respect to the contact portion, the heat exchanger is in contact with and holds the DUT, and the parallelism adjustment device is an electronic component handling device that adjusts the parallelism of the DUT via the heat exchanger.

[0018]

[12] Embodiment 12 of the present invention is an electronic component handling device in any one of embodiments 1 to 11, wherein the positioning device comprises a contact body that contacts the holder and a third moving device for moving the contact body, the third moving device comprising a second parallel moving unit for moving the contact body along a direction substantially parallel to the arrangement direction of the holders, and the second parallel moving unit having an operating range that allows the contact body to face the plurality of holders.

[0019]

[13] Aspect 13 of the present invention may be the electronic component handling apparatus according to any one of Aspects 1 to 12, wherein the electronic component handling apparatus includes a position detection device that detects a relative position of the DUT with respect to the contact portion, and a third control device that controls the positioning device based on the relative position detected by the position detection device.

[0020]

[14] Aspect 14 of the present invention may be the electronic component handling apparatus according to Aspect 13, wherein the third control device controls the positioning device so as to sequentially position the plurality of DUTs respectively held by the holders with respect to the contact portion.

[0021]

[15] Aspect 15 of the present invention may be the electronic component handling apparatus according to any one of Aspects 1 to 14, wherein the DUT includes a single bare die, a 2.5D device intermediate body in which a plurality of bare dies are arranged side by side on a silicon interposer, or a 3D device intermediate body in which a plurality of bare dies are stacked on each other.

[0022]

[16] Aspect 16 of the present invention is an electronic component test apparatus for testing electrical characteristics of a DUT, comprising: the electronic component handling apparatus according to any one of Aspects 1 to 15; and a tester to which the contact portion is electrically connected.

Effects of the Invention

[0023] According to the present invention, since the positioning device is independent of the holder, it is possible to easily cope with the type change of the DUT by exchanging the holder and the holding plate holding the holder.

[0024] Further, according to the present invention, since the plurality of holders are individually held by the holding plate and the plurality of DUTs are not held on the same holding surface, a configuration capable of individually adjusting the temperature and parallelism of the plurality of DUTs can be adopted.

Brief Description of the Drawings

[0025] [Figure 1] Figure 1 is a cross-sectional view showing the internal structure of an electronic component testing apparatus according to an embodiment of the present invention. [Figure 2] Figure 2 is a cross-sectional view taken along line II-II of Figure 1. [Figure 3] Figure 3 is a cross-sectional view of a holding block according to the embodiment of the present invention, and is an enlarged view of part III in Figure 1. [Figure 4] Figure 4(a) is a plan view of a camera unit and a sensor unit according to the embodiment of the present invention, Figure 4(b) is a cross-sectional view taken along line IVB-IVB of Figure 4(a), and Figure 4(c) is a cross-sectional view taken along line IVC-IVC of Figure 4(a). [Figure 5] Figure 5 is a block diagram showing a control system of an electronic component handling apparatus according to the embodiment of the present invention. [Figure 6] Figure 6 is a flowchart showing a positioning method performed by the electronic component testing apparatus according to the embodiment of the present invention. [Figure 7] Figure 7(a) and Figure 7(b) are cross-sectional views illustrating the operation of the electronic component testing apparatus according to the embodiment of the present invention, and are diagrams showing step S10 in Figure 6. [Figure 8] Figure 8(a) and Figure 8(b) are cross-sectional views illustrating the operation of the electronic component testing apparatus according to the embodiment of the present invention, and are diagrams showing step S20 in Figure 6. [Figure 9] Figure 9 is a cross-sectional view illustrating the operation of the electronic component testing apparatus according to the embodiment of the present invention, is a diagram showing step S30 in Figure 6, and is an enlarged view corresponding to part IX in Figure 8. [Figure 10] Figure 10(a) and Figure 10(b) are cross-sectional views illustrating the operation of the electronic component testing apparatus according to the embodiment of the present invention, and are diagrams showing step S40 in Figure 6. [Figure 11] Figure 11(a) and Figure 11(b) are cross-sectional views illustrating the operation of the electronic component testing apparatus according to the embodiment of the present invention, and are diagrams showing step S50 in Figure 6. [Figure 12]Figures 12(a) and 12(b) are cross-sectional views showing the operation of the electronic component testing apparatus in an embodiment of the present invention, and are diagrams showing step S60 in Figure 6. [Figure 13] Figures 13(a) and 13(b) are cross-sectional views showing the operation of the electronic component testing apparatus in an embodiment of the present invention, and are diagrams showing step S10 in Figure 6. [Figure 14] Figures 14(a) and 14(b) are cross-sectional views showing the operation of the electronic component testing apparatus in an embodiment of the present invention, and are diagrams showing step S80 in Figure 6. [Modes for carrying out the invention]

[0026] Embodiments of the present invention will be described below with reference to the drawings.

[0027] Figure 1 is a cross-sectional view showing the internal structure of the electronic component testing apparatus 1 in an embodiment of the present invention, and Figure 2 is a cross-sectional view along the line II-II in Figure 1.

[0028] The electronic component testing apparatus 1 of this embodiment is a device for testing the electrical characteristics of a DUT200. As shown in Figures 1 and 2, this electronic component testing apparatus 1 comprises a tester 10 for testing the DUT200 and a handler 20 for transporting the DUT200 and pressing it onto a probe card 15. This handler 20 corresponds to an example of an "electronic component handling device" in an embodiment of the present invention.

[0029] A concrete example of the DUT200 being tested is, for instance, a bare die (bare chip) after dicing a semiconductor wafer. Note that the DUT200 is not limited to a bare die alone; for example, the DUT200 may be a 2.5D device intermediate or a 3D device intermediate.

[0030] Here, a 2.5D device intermediate is a device intermediate comprising a silicon interposer and a plurality of bare dies arranged on the silicon interposer. This 2.5 device intermediate becomes a final product (i.e., a 2.5D device (2.5-dimensional device)) when it is mounted on a wiring board, for example, and packaged with a resin material.

[0031] On the other hand, a 3D device intermediate is a device intermediate comprising multiple bare dies that are stacked on top of each other and electrically connected by through-silicon vias (TSVs). Like the 2.5D device intermediate described above, this 3D device intermediate also becomes a final product (i.e., a 3D device) by being mounted on a wiring board and packaged with a resin material.

[0032] As shown in Figures 1 and 2, the tester 10 comprises a main frame (tester body) 11 and a test head 12. The main frame 11 is connected to the test head 12 via a cable (not shown). A probe card 15 is electrically connected to the test head 12. This probe card 15 enters the inside of the handler 20 through an opening 211 formed in the upper base 21 of the handler 20.

[0033] The probe card 15 comprises a wiring board 16 and four probe heads 17 mounted on the wiring board 16. Each probe head 17 corresponds to one DUT 200, and in this embodiment, it is possible to test four DUT 200s simultaneously. These four probe heads 17 are arranged in a line on the wiring board 16 at equal intervals along the X direction in the figure. These probe heads 17 correspond to an example of a "contact portion" in an embodiment of the present invention.

[0034] The number of probe heads 17 on the probe card 15 is not limited to the above and can be set according to the number of DUTs 200 to be tested simultaneously in the electronic component testing apparatus 1 (number of simultaneous measurements). Furthermore, the arrangement of the probe heads 17 on the probe card 15 is not limited to the above.

[0035] Each probe head 17 includes a contactor 18 that contacts the terminals of the DUT 200 and a housing 19 that holds the contactor 18. The contactor 18 is not particularly limited, but examples include a pogo pin, a vertical probe needle, a cantilever-type probe needle, an anisotropic conductive rubber sheet, a bump provided on a membrane, or a contactor manufactured using MEMS technology. For example, each probe head 17 is fixed to the wiring board 16 by screwing the housing 19 to the wiring board 16.

[0036] As shown in Figures 1 and 2, the handler 20 includes a contact unit 30, an alignment unit 70, a camera unit 80, a sensor unit 90, and a control device 100 (see Figure 5).

[0037] The contact unit 30 is a unit that presses the DUT200 against the probe head 17. The alignment unit 70 is a device that positions the DUT200 relative to the probe head 17 by horizontally moving the holding block 40 (described later) of the contact unit 30 that holds the DUT200.

[0038] The camera unit 80 is a unit that images the probe head 17 and the DUT 200 held by the holding block 40. The sensor unit 90 is a unit that detects the height of predetermined positions on the probe head 17 and the DUT 200, respectively.

[0039] The control device 100 is a device that controls the various actuators provided by the contact unit 30 and the alignment unit 70. The control device 100 also has the function of performing image processing on the image information acquired by the camera unit 80 and recognizing the relative position of the DUT 200 with respect to the probe head 17. Furthermore, the control device 100 also has the function of detecting the relative parallelism of the DUT 200 with respect to the probe head 17 and detecting the relative height of the DUT 200 with respect to the probe head 17, based on the detection results of the sensor unit 90.

[0040] In this embodiment, although not specifically shown, the transport device picks up the DUT200 before testing from the tray or plate and transports the DUT200 to the holding block 40 of the contact unit 30.

[0041] Specific examples of such transport devices include, but are not limited to, a pick-and-place device equipped with suction pads. Specific examples of the trays include, but are not limited to, a customer tray conforming to the JEDEC (Joint Electron Device Engineering Council) standard. The plates also include, but are not limited to, a buffer plate capable of holding the DUT200. Alternatively, the DUT200 before testing may be held in a ring frame (wafer ring) instead of the trays or plates.

[0042] Then, once the DUT200 is held in the holding block 40, the alignment unit 70 adjusts the position of the holding block 40 to position the DUT200 relative to the probe head 17. Next, the pressing device 60 of the contact unit 30 presses the DUT200 against the probe head 17, electrically connecting the DUT200 to the probe head 17. In this state, the tester 10 tests the electrical characteristics of the DUT200.

[0043] Once the DUT200 testing is complete, the transport device described above picks up the tested DUT200 from the holding block 40 and transports it to a tray or plate. Alternatively, the transport device may transport the tested DUT200 to a ring frame (wafer ring) instead of a tray or plate.

[0044] The configurations of the contact unit 30, alignment unit 70, camera unit 80, sensor unit 90, and control device 100 will be described in detail below, with reference to Figures 1 and 2, as well as Figures 3 to 5.

[0045] Figure 3 is a cross-sectional view of the holding block 40 in this embodiment, and is an enlarged view of part III in Figure 1. Figure 4(a) is a plan view of the camera unit and sensor unit in an embodiment of the present invention, Figure 4(b) is a cross-sectional view along the line IVB-IVB in Figure 4(a), and Figure 4(c) is a cross-sectional view along the line IVC-IVC in Figure 4(a). Figure 5 is a block diagram showing the control system of the handler 20 in this embodiment.

[0046] As shown in Figures 1 and 2, the contact unit 30 comprises a retaining block 40, a retaining plate 50, and a pressing device 60. In this embodiment, the contact unit 30 has four retaining blocks 40, corresponding to the number of probe heads 17 that the probe card 15 has. These retaining blocks 40 correspond to an example of a "retainer" in the embodiment of the present invention. The number of retaining blocks 40 in the contact unit 30 is not limited to the above and can be set according to the number of probe heads 17 that the probe card 15 has.

[0047] In this embodiment, the contact block 71 (described later) of the alignment unit 70 can contact the holding block 40, and the holding block 40 is independent of the alignment unit 70. Therefore, it is possible to easily accommodate changes in the variety of the DUT200 by replacing the holding block 40 with one that is suitable for the DUT200 after the variety change.

[0048] Furthermore, in this embodiment, since the four holding blocks 40 are individually held by the holding plate 50, it is possible to adopt a configuration in which the temperature and parallelism of the four DUTs 200 can be individually adjusted.

[0049] Specifically, each holding block 40 includes a thermal head 41, a parallelism adjustment device 42, a height adjustment device 43, and a main body 44, as shown in Figure 3. This thermal head 41 corresponds to an example of a "heat exchanger" in an embodiment of the present invention.

[0050] The thermal head 41 is a component that holds the DUT 200 and exchanges heat with the DUT 200. The DUT 200, which has been transported by the transport device (not shown) described above, is placed on the upper surface 411 of the thermal head 41. An adsorption nozzle 412 opens on the upper surface 411 of the thermal head 41. This adsorption nozzle 412 is connected to a vacuum pump (not shown) via a flow path 413 formed inside the thermal head 41, and is capable of adsorbing and holding the DUT 200.

[0051] Furthermore, a flow channel 414 through which a temperature-regulating liquid can flow is formed inside the thermal head 41. This flow channel 414 is provided with, for example, multiple fins 415, enabling efficient heat exchange with the liquid. The shape of the flow channel 414 is not particularly limited as long as it is a shape that allows for efficient heat exchange.

[0052] Although not specifically shown in the diagram, a temperature control device capable of supplying two types of liquids, a refrigerant and a heating medium, is connected to this flow path 414. For example, if the temperature of the DUT200 is higher than the target temperature, a liquid with a temperature sufficient to cool the DUT200 is supplied to the flow path 414. Conversely, if the temperature of the DUT200 is lower than the target temperature, a liquid with a temperature sufficient to heat the DUT200 is supplied to the flow path 414.

[0053] The temperature control device connected to the flow path 414 may be a device capable of supplying only one of either the refrigerant or the heating medium. If the temperature control device supplies only the refrigerant to the flow path 414, the thermal head 41 may be equipped with a heating device such as a heater. Alternatively, if the temperature control device supplies only the heating medium to the flow path 414, the thermal head 41 may be equipped with a cooling device such as a Peltier element. Alternatively, the thermal head 41 may be equipped with both a heating device and a cooling device instead of the flow path 414 described above.

[0054] The parallelism adjustment device 42 is located below the thermal head 41, and the thermal head 41 is fixed to the parallelism adjustment device 42. The parallelism adjustment device 42 is a device that adjusts the rolling and pitching of the DUT 200 held by the thermal head 41, and is a so-called two-axis goniometer stage, for example, comprising a first adjustment unit 421 and a second adjustment unit 422. Although not particularly limited, in this embodiment, the second adjustment unit 422 is provided below the first adjustment unit 421, and the first and second adjustment units 421 and 422 are fixed to each other.

[0055] The first adjustment unit 421 is a goniometer stage that rotates (tilts) the thermal head 41 around the first axis, and is a device for adjusting the rolling of the DUT 200. Here, the first axis is an axis substantially parallel to the planar direction of the probe head 17 (XY direction in the figure), and is an axis substantially parallel to the Y axis in the figure.

[0056] This first adjustment unit 421 is driven by a first actuator 423. Specific examples of this first actuator 423 are not particularly limited, but examples include an electric motor equipped with a worm gear mechanism.

[0057] In contrast, the second adjustment unit 422 is a goniometer stage that rotates (tilts) the thermal head 41 around the second axis, and is a device for adjusting the pitching of the DUT 200. Here, the second axis is substantially parallel to the planar direction of the probe head 17 (XY direction in the figure), and when the second axis is projected onto the normal direction of the probe head 17 (Z direction in the figure) (the direction in which the DUT 200 is pressed onto the probe head 17), it is substantially perpendicular to the first axis, and is substantially parallel to the X axis in the figure.

[0058] This second adjustment unit 422 is driven by a second actuator 424. While not particularly limited, a specific example of this second actuator 424 could be an electric motor equipped with a worm gear mechanism, similar to the first actuator 423 described above.

[0059] The first adjustment unit 421 rotates the thermal head 41 about a first axis, and the second adjustment unit 422 rotates the thermal head 41 about a second axis, thereby allowing the DUT 200 held in the thermal head 41 to be tilted arbitrarily, and the parallelism of the DUT 200 with respect to the probe head 17 to be adjusted. The mechanism of this parallelism adjustment device 42 is not limited to the goniometer stage described above, as long as it is a mechanism that can tilt the DUT 200 arbitrarily.

[0060] The height adjustment device 43 is located below the parallelism adjustment device 42, and the parallelism adjustment device 42 is fixed to the height adjustment device 43. The height adjustment device 43 is capable of moving the thermal head 41 and the parallelism adjustment device 42 vertically (in the Z-axis direction in the figure) by an actuator 431. The height adjustment device 43 is used to cancel the vertical displacement of the DUT 200 that occurs as a result of the parallelism adjustment of the DUT 200 by the parallelism adjustment device 42. Specific examples of the actuator 431 of the height adjustment device 43 are not particularly limited, but examples include an electric motor connected to a ball screw mechanism.

[0061] Furthermore, if the first and second axes of the parallelism adjustment device 42 described above coincide with the center of gravity of the DUT200 held by the holding block 40, the height adjustment device 43 may be omitted.

[0062] The main body 44 is located below the height adjustment device 43, and the height adjustment device 43 is fixed to the main body 44. The main body 44 has a flange 441 on its upper part that protrudes horizontally (in the XY plane direction in the figure). This flange 441 has a larger outer diameter than the portion 442 of the main body 44 that is below the flange 441. The actuators 423, 424, and 431 described above may be housed inside this main body 44.

[0063] The retaining plate 50 of the contact unit 30 is a plate-shaped member having four openings 51, as shown in Figures 1 and 2. These four openings 51 are arranged in a row at equal intervals along the X direction in the figures, corresponding to the arrangement of the probe heads 17 in the probe card 15 described above. The retaining plate 50 may also include a suction holding mechanism that suction-holds the retaining blocks 40 inserted into the openings 51.

[0064] The number of openings 51 in the retaining plate 50 is not limited to the above and can be set according to the number of probe heads 17 in the probe card 15. Similarly, the arrangement of the openings 51 in the retaining plate 50 is not limited to the above and can be set according to the arrangement of the probe heads 17 in the probe card 15.

[0065] Each opening 51 has an inner diameter smaller than the outer diameter of the flange 441 of the main body portion 44 of the retaining block 40 described above, and larger than the outer diameter of the lower portion 442 of the main body portion 44. This opening 51 corresponds to an example of the "first opening" in the embodiment of the present invention.

[0066] The four retaining blocks 40 are then inserted from above into the openings 51 of the retaining plate 50. As shown in Figure 3, the inner diameter of the opening 51 is larger than the outer diameter of the lower portion 442 of the main body 44, so the lower portion 442 enters the opening 51. Conversely, the inner diameter of the opening 51 is smaller than the outer diameter of the flange 441 of the main body 44, so the flange 441 is locked to the periphery of the opening 51.

[0067] Therefore, the retaining block 40 is movably held by the retaining plate 50. In other words, by pushing the retaining block 40 upward and moving it horizontally, it is possible to move the retaining block 40 horizontally relative to the retaining plate 50 within the range of the opening 51.

[0068] The pressing device 60 of the contact unit 30 is a device that moves the retaining plate 50, which holds the retaining block 40, in the vertical direction (Z-axis direction in the figure) relative to the probe card 15, and presses the DUT 200 held by the retaining block 40 against the probe head 17. As shown in Figures 1 and 2, this pressing device 60 comprises a retaining frame 61 that holds the retaining plate 50 and a moving device 62 that moves the retaining frame 61. This moving device 62 corresponds to an example of the "first moving device" in an embodiment of the present invention.

[0069] The retaining frame 61 is a frame-shaped member having an opening 611. This opening 611 has an inner diameter that encompasses all the openings 51 of the retaining plate 50 in a plan view. This opening 611 is positioned to face all the openings 51 of the retaining frame 61 when the retaining plate 50 is held by the retaining frame 61.

[0070] The shape of the retaining frame 61 is not particularly limited to the above. For example, the retaining frame 61 may be provided with the same number of openings 611 as the number of openings 51 in the retaining plate 50, and the multiple openings 611 of the retaining frame 61 may be individually corresponded to the multiple openings 51 in the retaining plate 50. Alternatively, the retaining frame 61 may be composed of a pair of members that hold only the mutually opposing short sides of the retaining plate 50, instead of the frame-shaped member described above.

[0071] This retaining frame 61 detachably holds the retaining plate 50 described above. Therefore, when the DUT200 is changed in variety, it is possible to easily accommodate the change in the DUT200 variety by replacing the retaining block 40 with a retaining plate 50 that is suitable for the DUT200 after the variety change.

[0072] With respect to the retaining block 40, for example, it is replaced with a retaining block 40 having a retaining surface (upper surface 411 of the thermal head 41) that corresponds to the size of the DUT200 after the variety change. Also, with respect to the retaining plate 50, for example, it is replaced with a retaining plate 50 having openings 51 that correspond to the pitch and arrangement of the probe heads 17 for testing the DUT200 after the variety change.

[0073] The moving device 62 comprises a support member 63, a Z-direction rail 64, and an actuator 65. The support member 63 is not shown in particular, but is fixed to, for example, the lower base 22 of the handler 20. As will be described later, this support member 63 may be made horizontally movable relative to the lower base 22.

[0074] This support member 63 supports the holding frame 61 via a Z-direction rail 64. The holding frame 61 is slidable vertically (in the Z-axis direction in the figure) by the Z-direction rail 64. This holding frame 61 is driven by an actuator 65. Specific examples of such actuators 65 are not particularly limited, but examples include an electric motor equipped with a ball screw mechanism.

[0075] An opening 631 is also formed in this support member 63. Similar to the opening 611 of the retaining frame 61 described above, this opening 631 has an inner diameter that encompasses all the openings 51 of the retaining plate 50 in a plan view. This opening 631 is positioned to face the opening 611 of the retaining frame 61 when the retaining frame 61 is held by the support member 63.

[0076] As shown in Figures 1 and 2, the alignment unit 70 includes a contact block 71 and a moving device 72. This alignment unit 70 corresponds to an example of a "positioning device" in an embodiment of the present invention, the contact block 71 corresponds to an example of a "contact body" in an embodiment of the present invention, and the moving device 72 corresponds to an example of a "third moving device" in an embodiment of the present invention.

[0077] The contact block 71 is a member that contacts the holding block 40 of the contact unit 30. The contact block 71 may be equipped with a rotation drive unit 711 (see Figure 3) that rotates the holding block 40 about the Z axis. In this embodiment, the contact block 71 is in contact with the bottom surface of the lower portion 442 of the main body 44 of the holding block 40, but this is not limited to this, and the contact block 71 may be in contact with the flange 441 of the main body 44. Furthermore, the contact block 71 may be equipped with a suction holding mechanism that suction-holds the holding block 40 that the contact block 71 is in contact with.

[0078] The moving device 72 is a device for moving the contact block 71. This moving device 72 comprises an X-direction rail 721, an X-direction stage 722, a Y-direction rail 723, a Y-direction stage 724, a Z-direction rail 725, and a Z-direction actuator 726. The X-direction rail 721 and the X-direction stage 722 correspond to an example of the "second parallel movement section" in an embodiment of the present invention.

[0079] The X-direction rail 721 is provided on the lower base 22 of the handler 20 and extends along the X direction. The X-direction stage 722 is slidably held on this X-direction rail 721 and can be moved along the X direction by an actuator (not shown). In this embodiment, the X-direction rail 721 is installed in a range that encompasses all the retaining blocks 40 held by the retaining plate 50 in a plan view, and the moving device 72 has an operating range that allows the contact block 71 to face all the retaining blocks 40.

[0080] The Y-direction rail 723 is provided on the X-direction stage 722 and extends along the Y-direction. The Y-direction stage 724 is slidably held on the Y-direction rail 723 and can move along the Y-direction by an actuator (not shown).

[0081] The Z-direction rail 725 is provided on the Y-direction stage 724 and extends along the Z-direction. The contact block 71 is slidably held on the Z-direction rail 725 and can be moved in the Z-direction by the Z-direction actuator 726. Specific examples of such a Z-direction actuator 726 are not particularly limited, but examples include an electric motor equipped with a ball screw mechanism. As a result, this moving device 72 is capable of moving the contact block 71 in the XYZ directions.

[0082] Furthermore, in this embodiment, as shown in Figure 2, a support member 73 is provided on the Y-direction stage 724, and the camera unit 80 and the sensor unit 90 are supported at the upper end of this support member 73. This support member 73 is positioned at the end of the Y-direction stage 724, and when the contact block 71 is located directly below the holding block 40, the camera unit 80 and the sensor unit 90 can be moved out of the space between the probe head 17 and the holding block 40.

[0083] As shown in Figures 4(a) and 4(b), the camera unit 80 includes a first camera 81, a second camera 82, prisms 83 and 84, and a support member 85.

[0084] The prism 83 is supported by a support member 85 so as to be located on the optical axis of the first camera 81. The first camera 81 images the probe head 17 of the probe card 15 located inside the handler 20 via the prism 83. The first camera 81 is connected to a control device 100, which will be described later, and is capable of transmitting the image information of the imaged probe head 17 to the control device 100.

[0085] The prism 84 is also supported by the support member 85 so as to be located on the optical axis of the second camera 82. This second camera 82 images the DUT 200 held in the holding block 40 via the prism 84. This second camera 82 is also connected to the control device 100, which will be described later, and is capable of transmitting the image information of the captured DUT 200 to the control device 100.

[0086] As shown in Figures 4(a) and 4(c), the sensor unit 90 includes a first sensor 91, a second sensor 92, prisms 93 and 94, and a support member 95.

[0087] The first sensor 91 is a sensor that detects the height of a predetermined position of the probe head 17 of the probe card 15 located within the handler 20. Specific examples of this first sensor 91 are not particularly limited, but a laser displacement sensor can be cited as an example.

[0088] The prism 93 is supported by the support member 95 so as to be located on the optical axis of the first sensor 91. The first sensor 91 detects the height of a predetermined position of the probe head 17 via the prism 93. The first sensor 91 is connected to a control device 100, which will be described later, and is capable of transmitting the detected height of the predetermined position of the probe head 17 to the control device 100.

[0089] Here, a specific example of a predetermined position of the probe head 17 detected by the first sensor 91 is the four corners of the probe head 17. However, the predetermined position of the probe head 17 is not limited to the above, as long as there are three or more mutually distinct positions on the probe head 17.

[0090] The second sensor 92 is a sensor that detects the height of a predetermined position of the DUT 200 held by the holding block 40. While there are no particular limitations on specific examples of this second sensor 92, similar to the first sensor 91 described above, a laser displacement sensor can be used as an example.

[0091] The prism 94 is supported by the support member 95 so as to be located on the optical axis of the second sensor 92. The second sensor 92 detects the height of a predetermined position of the DUT 200 via the prism 94. This second sensor 92, like the first sensor 91 described above, is connected to the control device 100 described later, and is capable of transmitting the detected height of the predetermined position of the DUT 200 to the control device 100.

[0092] Here, a specific example of a predetermined position of the DUT200 detected by the second sensor 92 is the four corners of the DUT200. However, the predetermined position of the DUT200 is not limited to the above, as long as there are three or more mutually distinct positions on the DUT200.

[0093] In this embodiment, the camera unit 80 and the sensor unit 90 are fixed to the moving device 72 of the alignment unit 70 via the support member 73, so that the camera unit 80 and the sensor unit 90 can be moved in the XY direction by the moving device 72. In other words, in this embodiment, the moving device 72 of the alignment unit 70 is also used as a moving device for the camera unit 80 and the sensor unit 90.

[0094] Therefore, this moving device 72 corresponds to an example of the "third moving device" in an embodiment of the present invention, as well as an example of the "second moving device" in an embodiment of the present invention. Furthermore, the X-direction rail 721 and X-direction stage 722 of the moving device 72 correspond to an example of the "second parallel movement section" in an embodiment of the present invention, as well as an example of the "first parallel movement section" in an embodiment of the present invention.

[0095] Although not specifically shown in the diagram, the moving device for the camera unit 80 and the sensor unit 90 may be a separate moving device independent of the moving device 72 for the alignment unit 70. In this case, the moving device for the camera unit 80 and the moving device for the sensor unit 90 may be independent of each other.

[0096] The control device 100 is configured, for example, as a computer equipped with a processor, and as shown in Figure 5, it functionally includes an image processing unit 110, a first calculation unit 120, a second calculation unit 130, a third calculation unit 140, and a drive control unit 150. These functions 110 to 150 are realized by the processor executing software installed on the computer that constitutes the control device 100. Alternatively, the control device 100 may be configured using a circuit board instead of a computer.

[0097] The image processing unit 110 detects the position and orientation of the contactor 18 of the probe head 17 (see Figures 1 and 2) by performing image processing on the image information output from the first camera 81. The image processing unit 110 also detects the position and orientation of the terminal 210 of the DUT 200 (see Figure 3) by performing image processing on the image information output from the second camera 82. This image processing unit 110 and the aforementioned cameras 81 and 82 constitute an example of a "position detection device" in an embodiment of the present invention.

[0098] The first calculation unit 120 calculates the correction amount for the position of the DUT 200 relative to the probe head 17 based on the detection results of the image processing unit 110.

[0099] Specifically, the first calculation unit 120 calculates the relative amount of deviation between the position of the contactor 18 of the probe head 17 and the position of the terminal 210 of the DUT 200 based on the detection results of the image processing unit 110, and calculates a position correction amount that cancels out this deviation. In other words, the first calculation unit 120 calculates a position correction amount that makes the position of the contactor 18 of the probe head 17 and the position of the terminal 210 of the DUT 200 relatively match based on the detection results of the image processing unit 110.

[0100] The second calculation unit 130 detects the parallelism of the DUT 200 with respect to the probe head 17 based on the detection results of the first and second sensors 91 and 92. This second calculation unit 130 corresponds to an example of a "calculation unit" in an embodiment of the present invention.

[0101] Specifically, the second calculation unit 130 first obtains the height of a predetermined position of the probe head 17 from the first sensor 91, and calculates the inclination of the probe head 17 from this predetermined height. The second calculation unit 130 also obtains the height of a predetermined position of the DUT 200 from the second sensor 92, and calculates the inclination of the DUT 200 from this predetermined height. Then, the second calculation unit 130 calculates the relative inclination (parallelism) of the DUT 200 with respect to the probe head 17 from the inclination of the probe head 17 and the inclination of the DUT 200, and further calculates an inclination correction amount for the DUT 200 that cancels out this relative inclination.

[0102] The third calculation unit 140 detects the height of the DUT 200 relative to the probe head 17 based on the detection results of the first and second sensors 91 and 92.

[0103] Specifically, the third calculation unit 140 first obtains the height of a predetermined position of the probe head 17 from the first sensor 91. Then, after the parallelism adjustment device 42 corrects the tilt of the DUT 200 based on the tilt correction amount, the third calculation unit 140 obtains the height of a predetermined position of the DUT 200 from the second sensor 92. Next, the third calculation unit 140 calculates the relative height of the DUT 200 with respect to the probe head 17 from the height of the predetermined position of the probe head 17 and the height of the predetermined position of the DUT 200. Then, the third calculation unit 140 calculates the difference between this relative height and a predetermined value and calculates a height correction amount for the DUT 200 that cancels out this difference.

[0104] The drive control unit 150 controls the parallelism adjustment device 42, height adjustment device 43, and pressing device 60 of the contact unit 30, as well as the drive of the alignment unit 70.

[0105] For example, the drive control unit 150 drives the alignment unit 70 based on the position correction amount calculated by the first calculation unit 120 described above. The drive control unit 150 also drives the parallelism adjustment device 42 based on the tilt correction amount calculated by the second calculation unit 130 described above. The drive control unit 150 also drives the height adjustment device 43 based on the height correction amount calculated by the third calculation unit 140 described above. Furthermore, the drive control unit 150 drives the pressing device 60 to press the DUT 200 against the probe head 17.

[0106] This drive control unit 150 corresponds to an example of the "first control device" and the "third control device" in an aspect of the present invention. Furthermore, this drive control unit 150 and the above-described third calculation unit 140 correspond to an example of the "second control device" in an aspect of the present invention.

[0107] The positioning operation of the DUT200 by the electronic component testing apparatus 1 in this embodiment will be described below with reference to Figures 6 and 7(a) to 14(b). Figure 6 is a flowchart showing the positioning method by the electronic component testing apparatus 1 in this embodiment, and Figures 7(a) to 14(b) are cross-sectional views showing the operation of the electronic component testing apparatus 1 in this embodiment.

[0108] First, in step S10 of Figure 6, as shown in Figure 7(b), the Y-direction stage 724 of the alignment unit 70's moving device 72 is moved in the -Y direction to interpose the camera unit 80 and sensor unit 90 between the probe head 17 and the holding block 40. Next, as shown in Figure 7(a), the moving device 72 moves the contact block 71 in the +X direction to the holding block 40 at the right end of the figure.

[0109] During this movement in the +X direction, the second camera 82 captures images of each DUT200 held in the holding block 40. The image processing unit 110 of the control device 100 then performs image processing on the image information output from the second camera 82 to detect the position of the terminals 210 of the DUT200. The position of the contactor 18 of the probe head 17 is detected in advance using the first camera 81 at the start of a batch or when the probe card 15 is replaced. The first calculation unit 120 of the control device 100 calculates the position correction amount for the DUT200 from these detection results. The position correction amount is calculated for all DUT200s held in the four holding blocks 40.

[0110] Furthermore, during this movement in the +X direction, the Y-direction stage 724 of the moving device 72 is appropriately moved in the Y direction, allowing the height of the four corners of the DUT 200 to be detected by the second sensor 92. The height of the four corners of the probe head 17 has been previously detected using the first sensor 91 at the start of a batch or when the probe card 15 is replaced. The second calculation unit 130 of the control device 100 calculates the tilt correction amount of the DUT 200 from these detection results. The tilt correction amount is calculated for all DUT 200s held in the four holding blocks 40. Note that when the second calculation unit 130 calculates the tilt correction amount of the DUT 200, it may also take into account the position correction amount calculated in step S10 described above.

[0111] The timing of the detection of the heights of the four corners of the DUT200 by the second sensor 92 is not limited to the above, as long as it is performed before step S50. For example, the detection of the heights of the four corners of the DUT200 by the second sensor 92 may be performed after step S40 in Figure 6.

[0112] Next, in step S20 of Figure 6, as shown in Figure 8(b), the Y-direction stage 724 of the moving device 72 is moved in the +Y direction to retract the camera unit 80 and the sensor unit 90 from between the probe head 17 and the holding block 40, and the contact block 71 is brought opposite the holding block 40.

[0113] Then, as shown in Figures 8(a) and 8(b), the moving device 72 raises the contact block 71. As a result, the contact block 71 comes into contact with the holding block 40, and the contact block 71 further pushes the holding block 40 upward, causing the holding block 40 to separate from the holding plate 50.

[0114] Next, in step 30 of Figure 6, the contact block 71 is moved in the XY plane by the above position correction amount using the moving device 72 of the alignment unit 70, thereby canceling the relative positional misalignment of the DUT 200 with respect to the probe head 17. For example, in the example shown in Figure 9, the moving device 72 moves the contact block 71 slightly in the -X direction, causing the holding block 40 held by the contact block 71 to move relative to the holding plate 50.

[0115] Next, in step S40 of Figure 6, as shown in Figures 10(a) and 10(b), the moving device 72 lowers the contact block 71. As a result, the holding block 40 is held by the holding plate 50, and the contact block 71 separates from the holding block 40.

[0116] Next, in step S50 of Figure 6, as shown in Figures 11(a) and 11(b), the parallelism adjustment device 42 of the holding block 40 is driven, causing the DUT 200 to tilt by the above-mentioned tilt correction amount. As a result, the relative tilt of the DUT 200 with respect to the probe head 17 is canceled, and the DUT 200 becomes parallel to the probe head 17.

[0117] Next, in step S60 of Figure 6, as shown in Figure 12(b), the Y-direction stage 724 of the alignment unit 70's moving device 72 is moved in the -Y direction. Then, the camera unit 80 and the sensor unit 90 are interposed again between the probe head 17 and the holding block 40, and the height of the four corners of the DUT 200 is detected by the second sensor 92. As described above, the height of the four corners of the probe head 17 has been detected in advance using the first sensor 91 at the start of a batch or when the probe card 15 is replaced. The second calculation unit 130 of the control device 100 calculates the height correction amount of the DUT 200 from these detection results.

[0118] In this embodiment, since the position of the DUT200 detected by the second sensor 92 in step S60 is the same as the position of the DUT200 detected by the second sensor 92 in step S10, the detection result of the second sensor 92 in step S60 may be used to confirm whether the relative tilt of the DUT200 with respect to the probe head 17 is properly canceled.

[0119] Note that the position of the DUT200 detected by the second sensor 92 in step S60 may differ from the position of the DUT200 detected by the second sensor 92 in step S10. For example, in step S10, the height of the four corners of the DUT200 may be detected by the second sensor 92, while in step S60, only the height of the central part of the DUT200 may be detected by the second sensor 92. In this case, at the start of a batch or when replacing the probe card 15, the height of the central part of the probe head 17, in addition to the height of the four corners of the probe head 17, is also detected in advance using the first sensor 91.

[0120] Then, as shown in Figures 12(a) and 12(b), the height adjustment device 43 of the holding block 40 is driven by the above height correction amount, thereby adjusting the height of the DUT 200 and canceling out the height displacement of the DUT 200 that occurred as a result of the parallelism adjustment of the DUT 200 in step S50.

[0121] Next, in step S70 of Figure 6, the control device 100 determines whether or not the positioning of all DUT200s has been completed.

[0122] If the positioning of all DUT200s is not complete (NO in step S70), the process returns to step S10, and as shown in Figures 13(a) and 13(b), the moving device 72 of the alignment unit 70 moves the contact block 71 to the holding block 40 holding the next DUT200 (for example, the second holding block from the right in the figure). Then, the positioning of the next DUT200 is performed in the same manner as in steps S20 to S60 described above.

[0123] In contrast, if all DUT200s have been positioned (YES in step S70), then in step S80 of Figure 6, as shown in Figures 14(a) and 14(b), the moving device 62 of the pressing device 60 raises the holding frame 61, pressing the DUT200s against the probe head 17. This electrically connects the terminals 210 of the DUT200s with the contactors 18 of the probe head 17. In this state, the tester 10 tests the electrical characteristics of the DUT200s.

[0124] As described above, in this embodiment, since the alignment unit 70 is independent of the holding block 40, it is possible to easily change the type of DUT200 by replacing the holding block 40 and the holding plate 50.

[0125] Furthermore, in this embodiment, since multiple holding blocks 40 are individually held on the holding plate 50 and multiple DUTs 200 are not held on the same holding surface, a configuration can be adopted in which the temperature and parallelism of multiple DUTs 200 can be individually adjusted.

[0126] Furthermore, in this embodiment, since the holding block 40 of the contact unit 30 is equipped with a parallelism adjustment device 42, the relative tilt of the DUT 200 with respect to the probe head 17 can be canceled, and the occurrence of contact errors between the probe head 17 and the DUT 200 can be suppressed. In particular, the effect of suppressing the above-mentioned contact errors is significant in 2.5D device intermediates and 3D device intermediates having a laminated structure.

[0127] Furthermore, in this embodiment, since the holding block 40 of the contact unit 30 is equipped with a height adjustment device 43, the height displacement of the DUT 200 caused by the parallelism adjustment device 42 of the DUT 200 can be canceled, and the occurrence of contact errors between the probe head 17 and the DUT 200 can be further suppressed.

[0128] The embodiments described above are provided to facilitate understanding of the present invention and are not intended to limit it. Therefore, each element disclosed in the above embodiments is intended to include all design modifications and equivalents that fall within the technical scope of the present invention.

[0129] For example, the handler 20 may be equipped with two contact units 30, and the support members 63 of the pressing devices 60 of each contact unit 30 may be supported on the lower base 22 so as to be movable in the horizontal direction. This allows the positioning of the DUT 200 by the other contact unit 30 to be performed while one contact unit 30 is performing the test of the DUT 200, thereby improving the efficiency of the testing process. [Explanation of symbols]

[0130] 1…Electronic component testing equipment 10... Tester 15…Probe card 17…Probe head 18... Contactor 20…Handler 30… Contact Unit 40…Holding block 41... Thermal head 414...Flow channel for temperature control 42...Parallelism adjustment device 421...First adjustment unit 422...Second adjustment section 43... Height adjustment device 44...Main body 441…Flange 50…Retaining plate 51...Aperture 60...Pressing device 61…Retaining frame 62... Mobile device 70…Alignment Unit 71... Contact block 72... Mobile device 73…Support member 80...Camera unit 81...First camera 82...Second Camera 90...Sensor unit 91...First sensor 92...Second sensor 100...Control device 110…Image Processing Unit 120-140...1st to 3rd calculation units 150…Drive Control Unit 200...DUT

Claims

1. An electronic component handling device for moving a DUT to a contact area, A plurality of holders are arranged to correspond to the contact portion and each holds the DUT, A retaining plate having a plurality of first openings into which each of the retaining bodies is inserted, and which movably holds the plurality of retaining bodies, A positioning device is provided independently of the retaining body, and by moving the retaining body relative to the retaining plate, the DUT is positioned relative to the contact portion. The system includes a pressing device, which is provided independently of the positioning device, and which presses the DUT against the contact portion by moving the holding plate that holds the holder relative to the contact portion. The positioning device is an electronic component handling device that contacts the holder and then moves the holder in a planar direction relative to the holding plate.

2. An electronic component handling device according to claim 1, The aforementioned pressing device is A retaining frame that detachably holds the aforementioned retaining plate, An electronic component handling device comprising: a first moving device for moving the retaining frame that holds the retaining plate.

3. An electronic component handling device according to claim 1, An electronic component handling device in which each of the plurality of holders is individually equipped with a parallelism adjustment device for adjusting the parallelism of the DUT with respect to the contact portion.

4. An electronic component handling device according to claim 3, The parallelism adjustment device is, A first adjustment unit that tilts the DUT about a first axis, It includes a second adjustment unit that tilts the DUT about a second axis, The first axis is an axis substantially parallel to the planar direction of the contact portion, An electronic component handling device wherein the second axis is substantially parallel to the planar direction of the contact portion and, when the second axis is projected in the direction normal to the contact portion, is substantially perpendicular to the first axis.

5. An electronic component handling device according to claim 3, The aforementioned electronic component handling device is A parallelism detection device for detecting the parallelism of the DUT with respect to the contact portion, An electronic component handling device comprising: a first control device that controls the parallelism adjustment device based on the parallelism detected by the parallelism detection device.

6. An electronic component handling device according to claim 5, The parallelism detection device is A first sensor for detecting the height of a predetermined position in the DUT, A second sensor for detecting the height of a predetermined position in the contact portion, An electronic component handling device comprising: a calculation unit that calculates the degree of parallelism of the DUT with respect to the contact portion based on the detection results of the first and second sensors.

7. An electronic component handling device according to claim 6, The electronic component handling device includes a second moving device for moving the first and second sensors. The second moving device includes a first parallel movement unit that moves the first and second sensors along a direction substantially parallel to the arrangement direction of the holders, The first parallel movement unit has an operating range that allows the first and second sensors to face the plurality of holders, in an electronic component handling device.

8. An electronic component handling device according to claim 3, An electronic component handling device in which each of the plurality of holders is individually equipped with a height adjustment device for adjusting the height of the DUT relative to the contact portion.

9. An electronic component handling device according to claim 6, Each of the plurality of holders is individually equipped with a height adjustment device for adjusting the height of the DUT relative to the contact portion. The electronic component handling device is an electronic component handling device that includes a second control device that controls the height adjustment device based on the detection results of the first and second sensors.

10. An electronic component handling device according to claim 1, The plurality of holders are individually equipped with heat exchangers that perform heat exchange with the DUT, making this an electronic component handling device.

11. An electronic component handling device according to claim 10, Each of the plurality of holders is individually equipped with a parallelism adjustment device for adjusting the parallelism of the DUT with respect to the contact portion. The heat exchanger is held in contact with the DUT, The parallelism adjustment device is an electronic component handling device that adjusts the parallelism of the DUT via the heat exchanger.

12. An electronic component handling device according to claim 1, The positioning device is, A contact body that contacts the holder, It comprises a third moving device for moving the contact body, The third moving device comprises a second parallel movement unit that moves the contact body along a direction substantially parallel to the arrangement direction of the holders, The second parallel movement unit has an operating range that allows the contact body to face the plurality of holding bodies, in an electronic component handling device.

13. An electronic component handling device according to claim 1, The aforementioned electronic component handling device is A position detection device for detecting the relative position of the DUT with respect to the contact portion, An electronic component handling device comprising: a third control device that controls the positioning device based on the relative position detected by the position detection device; and

14. An electronic component handling device according to claim 13, The third control device is an electronic component handling device that controls the positioning device so as to sequentially position the plurality of DUTs, each held by the holder, relative to the contact portion.

15. An electronic component handling device according to claim 1, The aforementioned DUT is, Bear Dye alone, A 2.5D device intermediate in which multiple bare dies are arranged side by side on a silicon interposer, or An electronic component handling device that includes a 3D device intermediate formed by stacking multiple bare dies on top of each other.

16. An electronic component testing apparatus for testing the electrical characteristics of a DUT, An electronic component handling device according to any one of claims 1 to 15, An electronic component testing apparatus comprising a tester to which the contact portion is electrically connected.

Images