Automatic wafer teaching apparatus for semiconductor manufacturing equipment.

Abstract

An invention of an automatic teaching device for wafers for semiconductor manufacturing equipment is disclosed. The automatic teaching device for wafers for semiconductor manufacturing equipment is characterized by including a load port provided along one side edge of the FFM with at least one connected to the inside of the FFM, a transport robot that transports the wafers provided inside the FFM to the multiple load ports with an end effector for processing, and a load port teaching unit that detects a fixed position so that the end effector can place the wafer in a fixed position inside the load port after unloading the wafer. [Representative diagram] Figure 2

Description

Technical Field

[0001] The present invention relates to an automatic wafer teaching apparatus for semiconductor manufacturing equipment, and more specifically, without the need for a separate teaching jig to be manually installed and used, by detecting the fixed position setting of the end effector of a transfer robot inside the load port and station provided along the edge of the Equipment Front End Module (EFEM) for the wafer processing process, the present invention relates to an automatic wafer teaching apparatus for semiconductor manufacturing equipment that aims to reduce teaching time compared to the process of performing teaching work for end effectors and wafers using existing manually installed teaching jigs.

Background Art

[0002] Semiconductor elements are manufactured through a large number of processes such as thin film deposition processes, ion implantation processes, diffusion processes, cleaning processes, photolithography processes, and etching processes. As apparatuses for performing these semiconductor manufacturing processes, single-wafer apparatuses that process wafers one by one are widely used.

[0003] For example, in the cleaning process, single-wafer cleaning, in which wafers are cleaned one by one to meet high cleanliness by treating the wafers with chemicals to remove contaminants such as particles, metal impurities, and organic substances, is widely used. A single-wafer cleaning apparatus generally has a buffer unit that makes wafers stand by to smooth the supply of wafers between a loading unit where wafers are loaded and a cleaning unit where the cleaning process is performed.

[0004] When a wafer is loaded into the buffer unit by the transfer robot, if the transfer robot is misaligned, the wafer is placed in the wafer slot of the buffer unit with its position shifted.

[0005] If the position of the wafer in the buffer unit is misaligned, problems may occur such as the wafer detaching from the transfer robot and being damaged when the wafer is transferred to the cleaning unit, or the cleaning operation stopping because the wafer is not placed correctly in the cleaning unit.

[0006] Furthermore, even if the wafer does not detach from the transport robot, if a discrepancy in the wafer's position is detected by the wafer position sensor, the process must be stopped, the manufacturing equipment shut down, the degree of the transport robot's discrepancy measured, and the transport robot must be manually taught.

[0007] Shutting down the manufacturing equipment to teach the transport robots takes time, reducing process productivity. Furthermore, because the FILM is open to the atmosphere and workers enter the clean space inside the FILM to manually set up jigs and teach the transport robots, foreign objects brought in from outside the FILM can contaminate the inside of the FILM, lowering the overall cleanliness of the manufacturing equipment. This necessitates repeated cleaning of the inside of the FILM to restore the cleanliness to the desired level, resulting in longer overall working times.

[0008] In the IFIM, which can accommodate five wafer carriers (FOUPs), unlike the three central wafer carriers where the transport robot's hand can access the opening of the wafer carrier in a nearly straight line, the two wafer carriers at both ends may require the transport robot's hand to access them at an angle depending on the reach of the hand. In this case, the robot's hand may interfere with its surroundings, particularly the side walls of the wafer carrier, making safe teaching difficult.

[0009] Therefore, there is a need to improve it.

[0010] Related technology is proposed in Korean Published Patent Publication No. 10-2013-0058413 (Publication Date: 2013.06.04, Title of Invention: Substrate Processing Device). The above technical configuration is background information intended to aid in understanding the present invention and does not represent prior art widely known in the technical field to which the present invention belongs. [Overview of the project] [Problems that the invention aims to solve]

[0011] The present invention was devised to improve upon the above-mentioned problems, and aims to provide an automated wafer teaching device for semiconductor manufacturing equipment that shortens the teaching time compared to the process of manually setting up an end effector and wafer, by setting the end effector in fixed positions in the Y and Z directions using a front sensor provided on the end effector of a transport robot, via a load port and station detection pins and a crescent block provided along the edge of the wafer for the wafer processing process, and then setting the end effector in fixed positions in the X and Z directions using a central sensor in the central hole formed in the end effector, without requiring the manual installation and use of a separate teaching jig.

[0012] Furthermore, the disclosed embodiment aims to provide a teaching jig that can be placed on a load port, similar to a wafer carrier (FOUP) capable of accommodating wafers, thereby enabling the automatic teaching process for a transport robot while maintaining a clean space within the FM without workers entering the FM and with the FM open to the atmosphere.

[0013] Furthermore, the embodiments of the disclosure aim to provide a teaching system and teaching jig that enable the hand of a transport robot to safely and accurately teach the wafer transfer position without interfering with its surroundings (particularly the side walls of the wafer carrier), even when the hand of the transport robot must access the wafer in the wafer carrier at an oblique angle. [Means for solving the problem]

[0014] The automatic wafer teaching apparatus for semiconductor manufacturing equipment according to the present invention includes a load port provided along one side edge such that at least one is connected to the inside of a wafer sheet (YFM), a transport robot that transports wafers provided inside the YFM to a plurality of load ports using an end effector for processing, a load port teaching unit that performs position detection so that an end effector with an unloaded wafer can place the wafer in a fixed position inside the load port, a station provided along the other side edge of the YFM such that at least one is connected to the inside of the YFM, and a station teaching unit that performs position detection so that an end effector with an unloaded wafer can place the wafer in a fixed position inside the station.

[0015] The end effector includes a base pad whose upper surface is at least planar in shape, and two forks extending forward of the base pad.

[0016] As an example, the load port teaching unit includes: a detection pin formed to protrude from the inner bottom surface of a specific load port, dummy port, or YFM so as to correspond to the front edge or center on the plane of the wafer; a crescent block formed to protrude from the inner bottom surface of a specific load port, dummy port, or YFM at a position separated by a set distance in a straight line from the detection pin in the direction of entry of the end effector; a front end sensor provided in a straight line opposite each of the forks, which detects and guides the entry position of the end effector in the Y and Z directions so that the detection pin is positioned at a set height and in the center of the plane between the forks; a central hole formed through the base pad so that the detection pin is positioned when the forks move forward and the front end sensor detects the crescent block; and one or more central sensors provided on the base pad along the end of the central hole to interact inward with the central hole and position the end effector in the X and Z directions so that the detection pin is set to the set position.

[0017] As another example, the load port teaching unit includes a base plate placed at a set position on the inner bottom of a specific load port, dummy port, or YFM; a detection pin formed protruding from the bottom surface of the base plate to correspond to the front edge or center on the plane of the wafer; a crescent block formed protruding from the base plate at a set distance away from the detection pin in a straight line in the direction of entry of the end effector; a front end sensor provided in a straight line opposite each of the forks to detect and guide the entry position of the end effector in the Y and Z directions so that the detection pin is positioned at a set height and the center on the plane between the forks; a central hole formed through the base pad so that the detection pin is positioned when the forks move forward and the front end sensor detects the crescent block; and one or more central sensors provided on the base pad along the end of the central hole to interact inward with the central hole and position the end effector in the X and Z directions so that the detection pin is set to the set position.

[0018] When the dummy port is located inside a specific load port, the dummy port is fixed in position relative to the load port by the first position setting unit.

[0019] As another example, a transport device equipped with a teaching system for teaching the transfer position of a wafer in a wafer carrier (FOUP) placed on a load port installed in a transport device that forms a clean space, comprising: a robot equipped with a hand capable of holding a wafer, an arm for moving the hand horizontally and vertically, and a sensor provided on the hand; a robot control device that performs detection by at least the sensor and controls the movement of the arm and the hand; and a teaching jig placed on the load port and configured to maintain the clean space of the transport device at the same position as the transfer position of the wafer in the wafer carrier by the robot, wherein the teaching jig is equipped with a specific shaped portion arranged to grasp the relative positional relationship with the transfer position of the wafer in the wafer carrier, and the robot control device operates the hand to detect the specific shaped portion of the teaching jig with the sensor, and stores the transfer position of the wafer based on the detected position of the specific shaped portion.

[0020] As another example, a teaching system for teaching the transfer position of a wafer within a wafer carrier (FOUP) placed on a load port installed in a transport device that forms a clean space, comprising: a robot equipped with a hand capable of holding a wafer, an arm for moving the hand horizontally and vertically, and a sensor provided on the hand; a robot control device that performs detection by at least the sensor and controls the movement of the arm and the hand; and a teaching jig placed on the load port and configured to maintain the clean space of the transport device at the same position as the wafer transfer position within the wafer carrier by the robot, wherein the teaching jig is provided with a specific shaped portion arranged to grasp the relative positional relationship with the wafer transfer position within the wafer carrier, and the robot control device operates the hand to detect the specific shaped portion of the teaching jig with the sensor, and stores the wafer transfer position based on the detected position of the specific shaped portion.

[0021] As another example, a teaching jig for teaching a robot the wafer transfer position within a wafer carrier (FOUP) placed on a load port installed in a transport device that forms a clean space, the teaching jig is placed on the load port and configured to maintain the clean space of the transport device at the same position as the wafer transfer position within the wafer carrier by the robot, and includes a housing having an opening on one side, wherein a specific shaped part is provided inside the housing, which is arranged to grasp the relative positional relationship with the wafer transfer position within the wafer carrier.

[0022] As another example, a robot that transfers wafers between a wafer carrier (FOUP) placed on a load port installed in a transfer device that forms a clean space, the robot comprising a hand capable of holding a wafer, an arm for moving the hand horizontally and vertically, and a sensor provided on the hand, wherein the robot is taught the wafer transfer position by detecting a teaching jig for teaching the wafer transfer position within the wafer carrier with the sensor, the teaching jig is placed on the load port and configured so that the robot maintains the clean space of the transfer device at the same position as the wafer transfer position within the wafer carrier, and includes a specific shaped part arranged to grasp the relative positional relationship with the wafer transfer position within the wafer carrier, the robot operating the hand to detect the specific shaped part of the teaching jig with the sensor, and the wafer transfer position is taught based on the detected position of the specific shaped part. [Effects of the Invention]

[0023] As described above, the automatic wafer teaching apparatus for semiconductor manufacturing equipment according to the present invention is different from the prior art, and without the need to manually install and use a separate teaching jig, through the detection pins and half-moon blocks of the load port and station provided along the edge of the equipment front end module for the wafer processing process, the front end sensor provided on the end effector of the transfer robot sets the end effector to a fixed position in the Y direction and Z direction, then the central sensor in the central hole formed in the end effector sets the end effector to a fixed position in the X direction and Z direction to complete the wafer teaching process. Compared with the process of teaching the end effector and wafer using an existing manually installed teaching jig, the teaching time can be shortened.

[0024] In addition, the teaching system according to the present embodiment can perform teaching work for the transfer robot while maintaining the clean space inside the equipment front end module without workers entering the equipment front end module.

[0025] In particular, even when the hand of the transfer robot has to access the wafer at an angle, the hand of the transfer robot can safely and accurately teach the wafer transfer position without interfering with the surroundings (especially the side wall of the FOUP).

[0026] Furthermore, since the teaching jig can be installed on the load port of the equipment front end module where the wafer carrier is placed without workers entering the equipment front end module, the robot teaching position can be checked automatically on a regular basis while maintaining the clean space of the equipment front end module, and the teaching can be re-performed if the teaching position is periodically acquired and deviates from the predetermined reference. In addition, by periodically acquiring the teaching position and accumulating this data, teaching can be performed at appropriate intervals. [Brief Description of the Drawings]

[0027] Figure 1 is a plan view showing a transfer device of a semiconductor manufacturing apparatus to which an automatic wafer teaching apparatus for semiconductor manufacturing facilities according to an embodiment of the present invention is applied, and is a plan view showing its initial state. Figure 2 is a plan view showing a state where the robot of the transfer device of the semiconductor manufacturing apparatus to which the automatic wafer teaching apparatus for semiconductor manufacturing facilities according to one embodiment of the present invention is applied performs load port teaching in Figure 1. Figure 3 is a main part view sequentially showing the teaching process in which the end effector of the robot according to the embodiment of the present invention is advanced by the load port teaching unit. Figure 4 is a plan view showing a state where the end effector of the transfer device of the semiconductor manufacturing apparatus to which the automatic wafer teaching apparatus for semiconductor manufacturing facilities according to the embodiment of the present invention is applied supplies the wafer to the buffer after teaching is completed. Figure 5 is a plan view showing a state where the robot of the transfer device of the semiconductor manufacturing apparatus to which the automatic wafer teaching apparatus for semiconductor manufacturing facilities according to one embodiment of the present invention is applied performs station teaching. Figure 6 is a main part view sequentially showing the teaching process in which the end effector of the transfer device of the semiconductor manufacturing apparatus to which the automatic wafer teaching apparatus for semiconductor manufacturing facilities according to the embodiment of the present invention is applied proceeds by the station teaching unit. Figure 7 is a plan view showing a state where the end effector of the transfer device of the semiconductor manufacturing apparatus to which the automatic wafer teaching apparatus for semiconductor manufacturing facilities according to the embodiment of the present invention is applied supplies the wafer to the station after teaching is completed. Figure 8 is a cross-sectional view showing a state in which the dummy port of the transfer device of the semiconductor manufacturing apparatus to which the automatic wafer teaching apparatus for semiconductor manufacturing facilities according to the embodiment of the present invention is applied is positioned and fixed to the load port. Figure 9 is a plan view showing a state where the robot of the transfer device of the semiconductor manufacturing apparatus to which the automatic wafer teaching apparatus for semiconductor manufacturing facilities according to another embodiment of the present invention is applied performs load port teaching. Figure 10 is a plan view showing a state in which a robot in a semiconductor manufacturing equipment transfer device to which an automatic wafer teaching device for semiconductor manufacturing equipment according to another embodiment of the present invention is applied is performing station teaching. Figure 11 is a diagram of the main parts of a transport device according to a modified example of the present invention, where (a) shows a robot accessing a wafer carrier (FOUP) 460 located at the second load port 420-2, and (b) shows a robot accessing a teaching jig 500 located at the first load port 420-1. Figure 12 shows a wafer carrier (FOUP) placed in the load port of the transport device. Figure 13 shows a teaching jig placed in the load port of a transport device, and illustrates a state in which a plate-shaped substrate with a specific shape is housed inside. Figure 14 is a side cross-sectional view illustrating the state in which a teaching jig is placed on a load port provided in a conveying device. Figure 15 shows an example of a first placement position in which a specific shaped part is positioned within the teaching jig. Figure 16 shows an example of a second placement position in which a specific shaped part is positioned within the teaching jig. Figure 17 shows a teaching jig in which plate-shaped substrates, each having a specific shape, are arranged in a hierarchical manner in multiple stages. [Modes for carrying out the invention]

[0028] Hereinafter, embodiments of the automatic wafer teaching apparatus for semiconductor manufacturing equipment according to the present invention will be described with reference to the attached drawings. In this process, the thickness of lines and the size of components shown in the drawings may be exaggerated for clarity and convenience of explanation. Furthermore, the terms described later are defined in consideration of the function in the present invention, and these may change depending on the intent or convention of the user or operator. Therefore, the definitions of these terms should be based on the content throughout this specification.

[0029] Figure 1 is a plan view showing a transport device for a semiconductor manufacturing equipment to which an automatic wafer teaching device for semiconductor manufacturing equipment according to one embodiment of the present invention is applied, and is a plan view showing the initial state of the automatic wafer teaching device for semiconductor manufacturing equipment; Figure 2 is a plan view showing the state in which the robot of the transport device for a semiconductor manufacturing equipment to which the automatic wafer teaching device for semiconductor manufacturing equipment according to one embodiment of the present invention is applied is performing load port teaching; and Figure 3 is a main part diagram showing sequentially the teaching process in which the end effector of the robot according to one embodiment of the present invention is carried out by the load port teaching unit.

[0030] Figure 4 is a plan view showing the state in which the end effector of a transport device for a semiconductor manufacturing equipment to which an automatic wafer teaching device for semiconductor manufacturing equipment according to one embodiment of the present invention is applied supplies a wafer to the buffer after teaching is completed.

[0031] Figure 5 is a plan view showing a state in which a robot in a semiconductor manufacturing equipment transfer device to which an automatic wafer teaching device for semiconductor manufacturing equipment according to one embodiment of the present invention is applied is performing station teaching, and Figure 6 is a main part diagram sequentially showing the teaching process in which the end effector of the semiconductor manufacturing equipment transfer device to which the automatic wafer teaching device for semiconductor manufacturing equipment according to one embodiment of the present invention is applied is carried out by the station teaching unit.

[0032] Figure 7 is a plan view showing the state in which the end effector of the transport device of a semiconductor manufacturing equipment to which the automatic wafer teaching device for semiconductor manufacturing equipment according to one embodiment of the present invention is applied supplies a wafer to the station after teaching is completed, and Figure 8 is a cross-sectional view showing the state in which the dummy port of the transport device of a semiconductor manufacturing equipment to which the automatic wafer teaching device for semiconductor manufacturing equipment according to one embodiment of the present invention is applied is positioned and fixed to the load port.

[0033] Referring to Figures 1 to 8, the transfer device 100 of a semiconductor manufacturing equipment to which an automatic teaching device for semiconductor manufacturing equipment wafers 10 according to one embodiment of the present invention is applied includes an EFEM (Equipment Front End Module) 110, a transfer robot 130, a load port (LP) 120, a load port teaching unit 200, a station 140, and a station teaching unit 300.

[0034] The FM110 has a planar polygonal shape and provides a clean space for transporting wafers 10 while maintaining a clean internal environment and preventing contamination. For convenience, the FM110 is shown to have a planar rectangular shape.

[0035] The load ports 120 are arranged one or more times along one side edge of the FIEM 110, and each is connected to the interior of the FIEM 110. At this time, the load ports 120 play a role in enabling robots and other devices to access the wafer carrier (here also called a FOUP or buffer) that stores the processed wafers 10 from inside the FIEM. For convenience, it is assumed that there are three load ports 120 arranged along one side edge of the FIEM 110, and that the dummy port 150 housed in the leftmost load port 120 in Figure 1 is provided with a detection pin 220 and a crescent block 230 and is referred to as a specific load port, while buffers 122 are stored in the central and rightmost load ports 120. The buffers 122 have openable and closable doors and store wafers in multi-stage wafer slots (wafer storage stages), and correspond to wafer carriers (FOUP: Front Opening Unified Pod) that store wafers. As shown in Figure 12, the FOUP460 has a housing 464 with an opening on one side and a cover 462 that opens and closes the opening. Inside the housing, wafer mounting ends for storing wafers are installed in multiple stages. The load port 120 is sometimes described and illustrated in a configuration in which the buffer 122 is housed (stacked) in its internal space, but it is not limited to this configuration, and the buffer 122 may also be placed on a loading platform (stage) of the load port.

[0036] Furthermore, one or more stations 140 are arranged along the other edge of the FM 110, each connected to the interior of the FM 110. Station 140 serves to allow the wafer processing equipment (not shown) to exchange wafers at station 140, for example, when wafers 10 are loaded before processing, switching between a vacuum state with the internal gas evacuated and a pressure state approximately equal to atmospheric pressure by purging an inert gas. Therefore, station 140 has an empty space inside. For convenience, two stations 140 are shown along the other edge of the FM 110.

[0037] The transport robot 130 is either fixed in position inside the FM 110 or is provided to move along a set trajectory, and its role is to directly transport the wafers 10 between the load port 120 and the station 140. That is, the transport robot 130 carries wafers from the buffer 122 (wafer carrier) loaded in the load port 120 to the FM 110 and passes them to the station 140, and passes the wafers carried in from the station 140 to the buffer 122 (wafer carrier) in the load port 140. For convenience, the transport robot 130 is shown as being fixed inside the FM 110.

[0038] In particular, in this embodiment, the transport robot 130 includes a body 132, a middle link arm 134, and an end effector 136.

[0039] The body 132 remains fixed to the inner bottom of the FM 110 and supports the middle link arm 134 and the end effector (hand) 136.

[0040] The middle link arm 134 is connected to the body 132 on one side so as to be rotatable by a set angle. In this case, the middle link arm 134 may be provided as a single unit or as a plurality of units linked together.

[0041] The end effector (hand) 136 is rotatably linked to the middle link arm 134, is movable in the horizontal and vertical directions, and is equipped to be folded initially or unfolded for loading or unloading the wafer 10.

[0042] Furthermore, the end effector 136 includes a base pad 137 and a fork 138.

[0043] The base pad 137 is formed with at least its upper surface in a substantially flat shape, and it stably supports a portion of the wafer 10 by making contact with it.

[0044] Then, a pair of forks 138 extend forward from the base pad 137 to contact and support the wafer 10 while reducing the load on the end effector 136. Of course, the base pad 137 and forks 138 are deformable into various shapes.

[0045] On the other hand, the load port teaching unit 200 plays a role in detecting the fixed position inside the load port 120, i.e., the wafer transfer position, when the wafer 10 has been unloaded, i.e., when the wafer 10 is not placed in the end effector 136, so that the wafer 10 can be placed in a fixed position inside the load port 120.

[0046] For this purpose, the load port teaching unit 200 includes detection pins 220, a crescent block 230, a front end sensor 240, a central hole 250, and a central sensor 260. The detection pins 220 and the crescent block 230 are examples of teaching jigs for teaching the wafer transfer position to the transport robot 130, and correspond to examples of specific shaped parts arranged to grasp the relative positional relationship with the wafer transfer position. The front end sensor 240, the central hole 250, and the central sensor 260 are provided on the end effector (hand) 136 of the transport robot 130.

[0047] The detection pin 220 is formed to protrude from the inner bottom surface of a specific load port 120, dummy port 150, or IFIM 110 so as to correspond to the front edge or center on the plane of the wafer 10. For convenience, in the following, a specific load port 120 is assumed to have a dummy port 150 inside, and the detection pin 220 is formed to protrude from the inner bottom surface of the dummy port 150. In this case, the detection pin 220 will protrude from the front edge of the inner bottom of the dummy port 150 into which the end effector 136 enters. Of course, the detection pin 220 can be applied to various shapes and is not limited to size.

[0048] The crescent block 230 is formed to protrude from the inner bottom surface of a specific load port 120, dummy port 150, or FM 110, at a position aligned with the detection pin 220 in the direction of entry of the end effector 136, and separated by a set distance. In this case, the crescent block 230 is formed to protrude from the inner bottom surface of the dummy port 150 from which the detection pin 220 is formed. Of course, the crescent block 230 can be applied to various shapes and is not limited to size and height.

[0049] As shown in Figure 8, the dummy port 150, which has detection pins 220 and a crescent-shaped block 230 formed on its internal bottom surface, is located in the load port 120 on which the actual wafer carrier is placed, and has the shape of a housing with an opening into which the end effector 136 can enter.

[0050] Furthermore, the front end sensor 240 is positioned in a straight line opposite each of the pair of forks 138 extending from the base pad 137 of the end effector 136. That is, the front end sensor 240 is located on the tip side of the end effector (hand) 136 and will be referred to below as an example of the first sensor. Therefore, the end effector 136 is equipped with a pair of front end sensors 240, one of which may be a light-receiving unit and the other front end sensor 240 may be a light-emitting unit. Alternatively, the pair of front end sensors 240 may be limit sensors.

[0051] Therefore, when the end effector 136 enters the dummy port 150, the detection pin 220 is positioned between the pair of forks 138.

[0052] In particular, the front sensor 240 detects the position of the detection pin 220 between the corresponding forks 138, and detects and guides the entry position of the end effector 136 in the Y and Z directions so that the end effector 136 is positioned in the center of the plane and at a set height with respect to the position detected by the detection pin 220.

[0053] Here, the Y direction represents the direction in which the end effector 136 enters the dummy port 150, and the Z direction represents the up and down direction.

[0054] Of course, the front sensor 240 can be fixedly installed on the corresponding fork 138 in various ways.

[0055] Therefore, the end effector 136 is positioned above the detection pin 220 so as to prevent collision with the detection pin 220 during forward movement, after detecting the Y and Z positions of the pair of forks 138 relative to the detection pin 220.

[0056] The central hole 250 is formed through the base pad 137 so that the detection pin 220 is positioned when the pair of front-end sensors 240 detect (sense) the crescent block 230 after the end effector 136, located above the detection pin 220, has moved forward by a set distance in the Y direction.

[0057] In this case, the central hole 250 is configured to be large enough to secure an area in which the end effector 136 can move for teaching.

[0058] The central sensor 260 is provided on the base pad 137 along the edge of the central hole 250, one or more of which interact inward with the central hole 250 and position the end effector 136 in the X and Z directions so that the detection pin 220 is set to a set position. As shown in Figure 3, the central sensor 260 is provided on the base end side of the end effector 136 than the front sensor 240 and is provided so as to cross the hole of the central hole 250, and will be referred to below as an example of a second sensor. The central sensor 260 is shown as being provided in two in the central hole 250, one of which has an optical axis parallel to the optical axis of the front sensor 240 and is also called an alpha sensor, and the other central sensor has an optical axis perpendicular to the optical axis of the one central sensor and the front sensor 240, respectively, and is also called a beta sensor. Alternatively, only one central sensor 260 may be provided, in which case the central sensor 260 has an optical axis perpendicular to the optical axis of the front sensor 240.

[0059] In other words, when the end effector 136 moves forward in the Y direction from above the detection pin 220 and the pair of front end sensors 240 detect the crescent block 230, the end effector 136 stops moving forward. At this time, the detection pin 220 is located in the inner region of the central hole 250.

[0060] Subsequently, the central sensor 260 continuously senses the detection pin 220 so that it is positioned in the set position, i.e., the center, of the central hole 250. In this case, the end effector 136 is moved in the X and Z directions so that the detection pin 220 is positioned in the central region of the central hole 250. That is, when the front sensor 240 senses the crescent block 230, the detection pin 220 enters the central hole 250. Here, "X direction" means the direction perpendicular to the Y direction.

[0061] At this time, the control unit controls the movement of the end effector 136 by motor force so that the detection pin 220 is positioned in the center between the pair of front end sensors 240 and in the center of the central hole 250.

[0062] Finally, the detection pin 220 is positioned in the central inner region of the central hole 250, and the crescent block 230 is positioned in the center between the pair of forks 138. This completes the teaching process of the end effector 136 to the load port 120.

[0063] In this case, as the central sensor 260 senses the detection pin 220 and teaches the position of the end effector 136, and the front sensor 240 senses the crescent block 230 and teaches the position of the end effector 136, the end effector 136 is controlled to be positioned in a combined manner in the X, Y, and Z directions by motor force.

[0064] In this case, the dummy port 150 provided for teaching purposes in a particular load port 120 may be different from or the same as the buffer 122 provided inside the other load ports 120.

[0065] If the dummy port 150 and buffer 122 are different, after the teaching process is complete, the dummy port 150 is removed from the specific load port 120, and then buffer 122 is installed in the specific load port 120.

[0066] Subsequently, the end effector 136 unloads the wafer 10 after transporting it into all load ports 120 or all buffers 122 based on the teaching values.

[0067] In particular, if the dummy port 150 is located inside a specific load port 120, the dummy port 150 is fixedly positioned relative to the load port 120 by the first position setting unit 160. The buffer 122 may also be fixedly positioned inside the load port 120 by the first position setting unit 160.

[0068] Here, the first position setting unit 160 includes a first setting pin 162 and a first setting groove 164.

[0069] Multiple first setting pins 162 are formed protruding from the lower side of the dummy port 150 and buffer 122.

[0070] The first setting groove 164 is recessed in the inner bottom surface of the load port 120 to accommodate the first setting pin 162 one-to-one. Thus, the dummy port 150 or buffer 122 remains fixed in position on the corresponding load port 120. Therefore, the first setting pin 162 and the first setting groove 164 play a role in fixing the dummy port 150 (or buffer) to the load port 120, but are not limited to this and are capable of various modifications. For example, the first setting pin 162 may be provided on the bottom surface of the load port, and the first setting groove 164 may be provided on the underside of the dummy port 150 (or buffer).

[0071] As a result, before the end effector 136 transports the wafer 10 into the load port 120 or buffer 122 and unloads it, only the end effector 136 enters a specific load port 120 or a dummy port 150 inside a specific load port 120. The end effector 136 is then taught to position itself inside the specific load port 120 or dummy port 150 by the detection pins 220 being positioned sequentially by the front sensor 240 and the center sensor 260, and by the position of the crescent block 230 being positioned by the front sensor 240.

[0072] Meanwhile, the station teaching unit 300 plays the role of detecting the fixed position so that the end effector 136, with the wafer 10 unloaded, can place the wafer 10 in the fixed position inside the station 140.

[0073] For this purpose, the FM 110 may have a dummy station 170 on its internal bottom surface at a set location, or it may have a dummy station 170 inside a specific station 140. For convenience, a dummy station 170 the same size as station 140 is fixed to the internal bottom surface of the FM 110 in order to teach the wafer 10 inside station 140. In this case, the dummy station 170 can be fixed to the FM 110 in various ways.

[0074] In particular, the station teaching unit 300 shall have the same limited configuration as the load port teaching unit 200 described above for ease of manufacture and compatibility.

[0075] In other words, the station teaching unit 300 includes a detection pin 220, a crescent block 230, a front end sensor 240, a central hole 250, and a central sensor 260.

[0076] The detection pins 220 are formed to protrude from the inner bottom surface of a specific station 140 or dummy station 170 so as to correspond to the front edge or center on the plane of the wafer 10. For convenience, the dummy station 170 is shown to be located on the configured inner bottom surface of the FM 110.

[0077] The crescent-shaped block 230 is then formed to protrude from the inner bottom surface of a specific station 140 or dummy station 170.

[0078] At this time, the functions of the detection pin 220 and the crescent block 230 are replaced with those described above. Furthermore, the functions of the front end sensor 240, the central hole 250, and the central sensor 260 are replaced with those described above.

[0079] Of course, the detection pin 220 and the crescent block 230 may be located on the inner bottom surface of a particular station 140.

[0080] Furthermore, the detailed explanation of how the end effector 136 is taught through the interaction of the detection pin 220, the crescent block 230, the front sensor 240, the central hole 250, and the central sensor 260 will be replaced with the explanation given above.

[0081] Figure 9 is a plan view showing a state in which a robot of an automatic wafer teaching apparatus for semiconductor manufacturing equipment, according to another embodiment of the present invention, is performing load port teaching, and Figure 10 is a plan view showing a state in which a robot of an automatic wafer teaching apparatus for semiconductor manufacturing equipment, according to another embodiment of the present invention, is performing station teaching.

[0082] Referring to Figures 9 and 10, the transfer device 100 of a semiconductor manufacturing equipment to which an automatic wafer teaching device for semiconductor manufacturing equipment according to another embodiment of the present invention is applied includes an EFEM (Equipment Front End Module) 110, a transfer robot 130, a load port (LP) 120, a load port teaching unit 200, a station 140, and a station teaching unit 300.

[0083] At this time, the FM 110, transport robot 130, load port 120, and station 140 are replaced with those described above.

[0084] The load port teaching section 200 includes a base plate 210, detection pins 220, a crescent block 230, a front end sensor 240, a central hole 250, and a central sensor 260.

[0085] The base plate 210 is placed in a fixed position at the inner bottom of a specific load port 120, or a dummy port 150 located inside a specific load port 120. For convenience, the base plate 210 is assumed to be located in a fixed position at the inner bottom of the dummy port 150, but is not limited to this, and may be located at the same height as the wafer placed in the buffer 122 within the dummy port 150.

[0086] In one embodiment, the detection pin 220 and the crescent block 230 are formed to protrude from the base plate 210. In particular, the functions of the detection pin 220 and the crescent block 230 are replaced with those described above in one embodiment.

[0087] Therefore, the base plate 210 must be positioned in such a way that the detection pin 220 is located on the open front side of the dummy port 150. The base plate 210 can be deformed into various shapes. For example, the base plate 210 may be a plate-shaped substrate, which may have the same diameter as the actual wafer.

[0088] Furthermore, the front end sensor 240, the central hole portion 250, and the central sensor 260 are replaced with those described above.

[0089] The station teaching unit 300 shall be configured in the same way as the limited configuration of the load port teaching unit 200 in this embodiment.

[0090] In other words, the station teaching unit 300 includes a base plate 210, detection pins 220, a crescent block 230, a front end sensor 240, a central hole 250, and a central sensor 260.

[0091] The base plate 210 is fixed to the inner bottom surface of the dummy station 170, which is fixed to the internal setting position of the station 140 or the FM 110. For convenience, the base plate 210 is assumed to be fixed to the inner bottom surface of the dummy station 170.

[0092] The detection pin 220 and the crescent block 230 are formed to protrude from the base plate 210. In particular, the functions of the detection pin 220 and the crescent block 230 are replaced with those described above in one embodiment.

[0093] Therefore, the base plate 210 must be positioned in such an orientation that the detection pin 220 is located on the open front side of the dummy station 170. The base plate 210 is deformable into various shapes.

[0094] Furthermore, the front end sensor 240, the central hole portion 250, and the central sensor 260 are replaced with those described above.

[0095] The embodiments disclosed herein are not limited to those described above, and various modifications are possible without departing from the spirit and technical idea thereof.

[0096] In other words, although the previous embodiment described an example in which three load ports 120 are provided along one side edge of the FM 110, the same applies when more than three load ports 120 are installed on the FM 110. Also, although the previous embodiment provided detection pins 220 and a crescent block 230, additional detection pins may be added. Furthermore, although the previous embodiment described an example in which the buffer 122, which is a wafer carrier, and the dummy port 150 are loaded (housed) in the internal space of the load port 120, the same applies when the buffer 122, which is a wafer carrier, and the dummy port 150 are placed on the stage (placement platform) 470 of the load port 120.

[0097] The following describes a modified version of the transport device. In this modified version of the transport device, five load ports are provided along one side edge of the wafer carrier, and a dummy port for teaching the wafer transfer position is placed on a loading platform 470 on which a wafer carrier can be placed. In addition to the detection pins 220 and crescent blocks 230 described in the above embodiment, the dummy port is provided with additional detection pins. In describing the modified version below, the dummy port placed on the load port will be called a teaching jig, and in order to distinguish it from the previous embodiment which has detection pins 220 and crescent blocks 230, the detection pins 220 and crescent blocks 230 which were called examples of specific shapes in the previous embodiment will be called examples of first specific shapes in this modified version, while the additionally introduced detection pins will be called examples of second specific shapes. For convenience of explanation, the detection pins 220 may also be called examples of first detection parts, and the crescent blocks 230 may be called examples of second detection parts.

[0098] Referring to Figure 11(a), the transport device 400 according to this modified example includes a FM 410, a load port 420, a teaching jig 500, a robot 430, a station 440, and a robot control device 450. Configurations that remain unchanged compared to the previously described embodiments are omitted from the description.

[0099] As mentioned above, the FM410 provides a clean space for transporting wafers while maintaining a clean environment inside to prevent contamination of the wafers.

[0100] Five load ports 420 are arranged along one side edge of the FM 410. In the figure, they are referred to from left to right as the first load port 420-1, the second load port 420-2, the third load port 420-3, the fourth load port 420-4, and the fifth load port 420-5. A wafer carrier (FOUP) 460, capable of loading wafers inside, as shown in Figure 12, is placed on the loading platform (stage) 470 of the load ports 420. Wafers stored in the wafer carrier 460 can be loaded into the FM 410 by a robot 430 located inside the FM 410, and conversely, wafers held by the robot 430 can be loaded into the wafer carrier 460.

[0101] As in previous embodiments, one or more stations 440 are arranged along the other side edge of the FFEM 410 opposite to one side edge of the FFEM 410 where the load port 420 is located, and each is connected to the interior of the FFEM 410.

[0102] Similar to the previous embodiment, the robot 430 transfers wafers to and from a wafer carrier 460 located in a load port 420 installed in a FIEM 410 that forms a clean space.

[0103] The robot 430 comprises a body 431 fixed to the inner bottom of the FM 410, an arm 432 rotatably connected to the body 431 on one side, a hand 434 that is movable horizontally and vertically by the arm 432 and capable of holding a wafer, and a sensor provided on the hand 434. The hand 434 corresponds to the end effector 136 of the previous embodiment and has the same structure as the end effector 136, so a detailed explanation is omitted.

[0104] Furthermore, the sensors provided on the hand 434 of the robot 430 include a first sensor provided on the tip side of the hand and a second sensor provided on the base end side of the hand 434, and have the same configuration and function as the sensors (front sensor 240, central sensor 260) provided on the end effector 136 of the previous embodiment, so a detailed explanation will be omitted. That is, the front sensor 240 in the previous embodiment corresponds to the first sensor in this modified example, and the central sensor 260 corresponds to the second sensor.

[0105] In the modified example, the teaching jig 500 is placed on a load port 120 provided in the FM 110 which forms a clean space in the previous embodiment, and teaches the robot 130 the wafer transfer position, similar to the dummy port 150 which has a detection pin 220 and a crescent block 230, which are examples of specific shapes. As shown in Figure 11(b), the teaching jig 500 is positioned on the load port 420 and is configured to maintain a clean space in the transport device 400 at the same position as the wafer transfer position in the wafer carrier 460 by the robot 430.

[0106] In other words, the teaching jig 500 only needs to be positioned on the load port 420 in the form of a housing that can maintain a clean space within the transport device 400, and there are no restrictions on its form. For example, the housing 570 of the teaching jig 500 can have a form similar to the wafer carrier (FOUP) 460 shown in Figure 12. Furthermore, the teaching jig 500 can have the same form as the wafer carrier 460. As shown in Figure 13, the teaching jig 500 has an opening surface 580 on one side of the housing 570, and the opening surface 580 is further provided with a cover 560 that covers the opening surface 580. Since the cover 560 of the teaching jig 500 is closed during transport of the teaching jig 500, its interior can be maintained at a level of cleanliness maintained within the transport device 400. The cover 560 is configured to be opened and closed by the load port 420 when the teaching jig 500 is placed on the load port 420, so that a clean space can be maintained in the transport device when teaching wafer transfer positions using the teaching jig 500.

[0107] Figure 14 shows a side cross-sectional view of the conveying device 400 to illustrate the state in which the teaching jig 500 is placed in the load port 420 of the conveying device 400 and the robot hand 434 accesses the teaching jig 500 while the clean space of the conveying device 400 is maintained. When the teaching jig 500 is placed in the load port 420 with the cover 560 closed, as shown in Figure 14, the opening and closing mechanism of the load port 420 separates the cover 560 of the teaching jig 500 from the housing 570 and moves below the teaching jig 500 to open, so that the robot hand 434 can access the inside of the teaching jig 500 through the opening surface 580 of the teaching jig 500.

[0108] The housing 570 of the teaching jig 500 has a shape on its other side such that the load port 420 holds the teaching jig 500 when the teaching jig 500 is placed on the load port 420. Figure 13 shows that the lower surface of the housing 570 is provided with a shape that allows the teaching jig 500 to be held by the load port 420. As an example of this shape, a setting groove 510 can be formed recessed in the lower surface of the housing 570 of the teaching jig 500, and the setting groove 510 can be accommodated one-to-one with a setting pin 480 provided at a position corresponding to the setting groove 510 on the loading base 470 of the load port 420, thereby allowing the teaching jig 500 to be held by the load port 420.

[0109] Furthermore, the teaching jig 500 includes specific shaped parts 530, 535, and 540 arranged to grasp the relative positional relationship with the wafer transfer position within the wafer carrier 460. In this modified example, as an example of a specific shaped part, as shown in Figure 13, a configuration can be used in which the second detection pin 540, the first detection pin 530, and the crescent block 535 are arranged in order from the opening surface into which the hand 434 of the robot 430 enters. However, it is not limited to this configuration, and various modifications are possible as long as the hand 434 of the robot 430 can accurately recognize the wafer transfer position located within the wafer carrier.

[0110] In the following, the first detection pin 530 and the crescent block 535 may be described separately as examples of the first specific shape portion, and the second detection pin 540 may be described separately as an example of the second specific shape portion. In addition, the first detection pin 530 and the crescent block 535, which are examples of the first specific shape portion, may be described separately as examples of the first detection portion and the second detection portion, respectively.

[0111] Furthermore, the specific shaped portion can be provided, for example, on a plate-shaped substrate 550. In this case, as shown in Figure 13, the first detection pin 530 and the crescent block 535 can be formed to protrude from the surface of the substrate 550, and the second detection pin 540 can be formed to protrude from the back surface of the substrate 550. The plate-shaped substrate 550 on which the specific shaped portion is provided can be stored in a teaching jig 500 having a similar shape to the wafer carrier 460, at a position corresponding to the wafer storage position in the actual wafer carrier 460. The plate-shaped substrate 550 may be a substrate having the same diameter as the actual wafer.

[0112] The first specific shape portions 530, 535 and the second specific shape portion 540 are arranged so that their relative positional relationship to each other can be understood. The second specific shape portion 540 is positioned closer to the cover 560 of the teaching jig 500 compared to the first specific shape portions 530, 535. In this modified example, as described above, a detection pin 530 and a crescent block 535 formed on the surface of a plate-shaped substrate 550 are used as an example of the first specific shape portion, and a detection pin 540 formed on the back surface of the plate-shaped substrate 550 is used as an example of the second specific shape portion, but the invention is not limited to this and various modifications are possible.

[0113] Furthermore, the teaching jig 500 has a first placement position and a second placement position, which is different from the first, as placement positions for the first specific shaped parts 530, 535 and the second specific shaped part 540 when viewed from above.

[0114] Figure 15 shows an example of the first placement position, and Figure 16 shows an example of the second placement position. In a plan view, when the teaching jig 500 is placed on a load port that is not the outermost of the multiple load ports 420, for example, the second to fourth load ports 420-2, 420-3, and 420-4, and the hand 434 accesses the teaching jig 500 from the opening surface 580 while maintaining a state in which the angle made by the axis of the hand 434 with respect to the opening surface is perpendicular, the first specific shape parts 530, 535 and the second specific shape part 540 are placed in the first placement position, as shown in Figure 15, in a direction perpendicular to the opening surface 580 of the teaching jig 500.

[0115] On the other hand, if the teaching jig 500 is positioned in the outermost of the multiple load ports 420, for example, the first load port 420-1 or the fifth load port 420-5, and is accessed from the opening surface 580 of the teaching jig 500 while maintaining a state in which the angle made by the axis of the hand 434 with respect to the opening surface is not perpendicular, then, as shown in Figure 16, it is positioned in a second position where the specific shaped part is inclined in a direction that is not perpendicular to the opening surface 580 of the teaching jig 500.

[0116] When a wafer carrier 460 is positioned on the first or fifth load port 420-1, 420-5, the angle formed by the axis of the hand 434 with respect to its opening surface may not be perpendicular due to the length limitations of the robot arm 432 and the hand 434. Therefore, the hand 434 entering the outermost load port 420, for example, the first load port 420-1 or the fifth load port 420-5, will access it at an oblique angle rather than perpendicularly.

[0117] Ultimately, the first specific shaped parts 530, 535 and the second specific shaped part 540 of the teaching jig 500 are positioned according to the angle formed by the axis of the hand 434 with respect to the opening surface 580 of the teaching jig 500. In this modified example, the axis of the hand 434 refers to the line connecting the center of the sensing line formed by the front end sensor 240 provided at the tip of the hand 434, the center of the central hole 250 provided at the base end of the hand 434, and the rotation axis of the hand 434.

[0118] Furthermore, in the second placement position, the surface on which the first specific shape portions 530 and 535 are located is different from the surface on which the second specific shape portion 540 is located. That is, in the second placement position as shown in Figure 16, the first detection pin 530 and the crescent block 535, which are examples of the first specific shape portion, are located on the surface of the substrate 550, while the second detection pin 540, which is an example of the second specific shape portion, is located on the back surface of the substrate 550.

[0119] In addition, in the first placement position shown in Figure 15, the second detection pin 540, which is an example of the second specific shape portion, may be omitted.

[0120] A teaching jig 500, equipped with a specific shape portion, is placed at each placement position and then placed at the load port 420 to be taught according to that placement position. That is, the teaching jig 500 equipped with a specific shape portion, placed at the first placement position, is placed at the second to fourth load ports 420-2, 420-3, and 420-4, and the teaching jig 500 equipped with a specific shape portion, placed at the second placement position, is placed at the first or fifth rod port 420-1, 420-5. This allows the wafer transfer position in the wafer carrier 460 located at each load port 420 to be taught using the teaching jig.

[0121] The method for detecting the first specific shape portion 530, 535 and the second specific shape portion 540 using the front end sensor 240 and the central sensor 260 provided on the hand 434 of the robot 430 will be described later.

[0122] Furthermore, multiple plate-shaped substrates 550, each having a specific shape, may be provided within the teaching jig 500, as shown in Figure 17. For example, by storing the plate-shaped substrates 550 in multiple wafer storage positions within the teaching jig 500, multiple specific shape sections can be provided hierarchically in multiple stages within the teaching jig 500. In this case, the storage position of each plate-shaped substrate 550 corresponds to the height of the wafer stored in the wafer carrier.

[0123] Furthermore, when multiple plate-shaped substrates 550, each equipped with a specific shape, are housed within a single teaching jig 500, the positions of the specific shape on each substrate 550 can differ from one another. For example, the bottommost substrate 550-C may have the specific shape positioned at the second position shown in Figure 16(a), the substrate 550-B above it may have the specific shape positioned at the first position shown in Figure 15, and the substrate 550-A above it may have the specific shape positioned at the second position shown in Figure 16(b). By housing multiple substrates 550-A, 550-B, and 550-C, each with different positions for the specific shape, within a single teaching jig 500, multiple teaching jigs become unnecessary for teaching operations corresponding to the position of the load port 420.

[0124] The first specific shape sections 530 and 535 may include a first detection section 530 and a second detection section 535. In Figure 13, as in previous embodiments, a first detection pin formed protruding from the surface of the substrate 550 is used as an example of the first detection section 530, and a crescent-shaped block formed protruding from the same surface as the first detection pin is used as an example of the second detection section 535.

[0125] As shown in Figure 13, the first detection unit 530 is located closer to the cover 560 of the teaching jig 500 than the second detection unit 535, and a second detection pin, which is an example of the second specific shape portion 540, is located closer to the cover 560 of the teaching jig 500 than the first detection unit 530. The second detection unit 535 is positioned at a predetermined distance from the first detection unit 530 in the direction in which the hand 434 enters, and is positioned so as to ensure a gap between the side wall of the housing 570 of the teaching jig 500 and the hand 434 when detected by the front end sensor 240 provided at the tip of the hand 434 of the robot 430. The predetermined distance is determined by the distance between the front end sensor 240 (example of the first sensor) provided at the tip of the hand 434 of the robot 430 and the central sensor 260 (example of the second sensor) provided so as to cross the central hole portion 250 formed on the base end side of the hand 434 of the robot 430. Specifically, the predetermined distance corresponds to the distance between the straight line formed by the light-emitting and light-receiving parts of the front end sensor 240 and the center position of the central hole 250. That is, the first detection unit 530 and the second detection unit 535 are in a relative positional relationship such that the central sensor 260 can detect the first detection unit 530 and the front end sensor 240 can detect the second detection unit 535 at the same time.

[0126] Therefore, when the front sensor 240 detects the second detection unit 535, the first detection unit 530 is located in the inner region of the central hole 250 and can be detected by the central sensor 260. As the hand 434 moves, the first detection unit 530 enters the inside of the central hole 250, so the hand 434 does not collide with the first detection unit 530. Also, at this time, the second specific shape portion 540 of the hand 434, which is away from the central hole 250, is located on a different surface from the first detection unit 530, so it does not interfere with the hand 434 when the first detection unit 530 and the second detection unit 535 detect each other.

[0127] The robot control device 450 in this modified example is a device that detects with sensors 240 and 260 provided on the hand 434 and controls the movement of the hand 434. The device operates the hand 434 to detect the first specific shape portion 540 of the teaching jig 500 located in the load port 420 of the transport device 400 with the first sensor 240. Based on the detected position of the second specific shape portion 540, the hand 434 is moved to the first specific shape portions 530 and 535 of the teaching jig 500 to detect the first specific shape portions 530 and 535 with the first and second sensors 240 and 260, and the wafer transfer position is obtained based on the position of the first specific shape portion.

[0128] That is, when the teaching jig 500 is placed on the load port 420 of the transport device 400, and the cover 560 of the teaching jig 500 is opened by the load port 420, the robot control device 450 moves the hand 434 of the robot 430 into the interior of the teaching jig 500 through the opening surface 580 of the teaching jig 500, detects the second specific shape portion 540 provided on the teaching jig 500 with the first sensor 240, and then moves the hand 434 to a position where the first sensor 240 can detect the second detection portion 535 of the first specific shape portion and the second sensor 260 can detect the first detection portion 530 of the first specific shape portion, thereby detecting the positions of the first and second detection portions and storing the wafer transfer position.

[0129] In Figure 11, the robot control device 450 is integrated with the robot 430, but the robot control device 450 may be provided separately from the robot 430, although this is not the only option.

[0130] As in this modified example, when five load ports 420 are provided along one side edge of the FM 410, due to the limitations of the internal space of the FM 410 and the length of the arm 432 and hand 434 of the robot 430, the robot control device 450 controls the hand 434 so that its axis is tilted relative to the opening surface of the first load port 420-1, as shown in Figure 11(b), because the hand 434 cannot enter the wafer carrier 460 located in the first load port 420-1 in a state perpendicular to the opening surface. The same applies when the wafer carrier 460 is located in the fifth load port 420-5. However, even when the wafer carrier 460 is located in the first or fifth load port 420-1 or 420-5, the teaching jig 500 of this modified example can be used to automatically teach the wafer transfer position within the wafer carrier while maintaining a clean space.

[0131] The following describes the teaching process using the modified teaching jig 500.

[0132] A teaching jig 500 is placed on a load port 420 formed on one side edge of the FM 410. The teaching jig 500 can be automatically positioned by an OHT (Overhead Hoist Transport) or an AGV (Automated Guided Vehicle). A setting groove 510 provided on the lower surface of the housing 570 of the teaching jig 500 engages with a setting pin 480 provided on the positioning base 470 of the load port 420, thereby holding the teaching jig 500 on the rod port 420.

[0133] When the teaching jig 500 is held on the load port 420, the cover 560 of the teaching jig 500 is opened while maintaining a clean space within the conveying device 400. An exemplary embodiment of how the load port 420 opens the cover 560 of the teaching jig 500 can be seen in Figure 14, but is not limited thereto.

[0134] When the cover 560 of the teaching jig 500 is opened, the robot control device 450 controls the robot 430, which is installed inside the FM 410, to allow the hand 434 to enter the teaching jig 500 through the opening 580 of the teaching jig 500.

[0135] As the hand 434 passes through the opening 580 of the teaching jig 500 and accesses the interior of the teaching jig 500, the first sensor 240 located at the tip of the hand 434 detects the second specific shape portion 540 of the teaching jig 500 that is closest to the opening 580. When the second specific shape portion 540 is detected, the robot control device 450 adjusts the position of the hand 434 in the X, Y, and Z directions so that the hand 434 is positioned at the center of the plane of the first sensor 240 and at a set height, relative to the position of the detected second specific shape portion 540. The Y direction is perpendicular to the opening 580 of the teaching jig 500, the X direction is perpendicular to the Y direction in a plan view, and the Z direction is the vertical direction of the teaching jig 500.

[0136] Subsequently, the robot control device 450 moves the hand 434 in the Y and Z directions to detect the first specific shape portions 530 and 535 formed on the opposite side of the plate-shaped substrate 550. At this time, the position of the hand 434 may be further adjusted to prevent the hand 434 from colliding with the side wall of the housing 570 of the teaching jig 500 when it enters the teaching jig 500 to detect the first specific shape portions 530 and 535. In this way, by using the second specific shape portion 540, which is closer to the opening surface 580 of the teaching jig 500, rather than the first specific shape portions 530 and 535, which are located closer to the actual wafer transfer position (the position where the teaching jig is to be used), the hand 434 can safely approach the first specific shape portions 530 and 535 without interfering with the surrounding parts such as the side wall of the housing 570 of the teaching jig 500. However, if the second specific shape portion is not provided on the teaching jig 500, the detection operation of the second specific shape portion described above can be omitted.

[0137] Subsequently, the robot control device 450 moves the hand 434 into the teaching jig 500 while maintaining the angle between the axis of the hand 434 and the opening surface 580, and detects the first specific shape portion 530, 535 using the first sensor 240 and the second sensor 260 to store the transfer position for the hand 434 to transfer the wafer within the wafer carrier 460. This operation is substantially the same as the operation described in the previous embodiment.

[0138] That is, by moving the hand 434 while maintaining the angle that the axis of the hand 434 makes with respect to the opening surface 580, the first detection unit 530 of the first specific shape part 530, 535 is positioned between the first sensors 240 provided at the tip of the hand 434, and the position of the first detection unit 530 is detected. When the position of the first detection unit 530 is detected, the robot control device 450 adjusts the position of the hand 434 so that the hand 434 is positioned at the center of the plane of the first sensor 240 and at a set height, based on the detected position of the first detection unit 530. After the hand 434 moves in the Z direction to prevent collision with the first detection unit 530 when moving forward, as the hand 434 moves while maintaining the angle that the axis of the hand 434 makes, the second detection unit 535 of the first specific shape part 530, 535 is positioned between the first sensors 240 provided at the tip of the hand 434, and the second detection unit 535 is detected. In this way, when the second detection unit 535 is detected by the first sensor 240, the predetermined distance between the first detection unit 530 and the second detection unit 535 corresponds to the distance between the straight line formed by the first sensor 240 provided at the tip of the hand 434 and the center position of the central hole 250. Therefore, the first detection unit 530 of the first specific shape is located in the central hole 250 of the hand 434, and the first detection unit 530 can be detected by the second sensor 260, which is provided so as to cross the central hole 250.

[0139] At this time, the robot control device 450 controls the hand 434 so that the first detection unit 530 is positioned at the center of the central hole 250. When the first detection unit 530 is positioned at the center of the central hole 250 of the hand 434, the corresponding position of the hand 434 is determined to be the transfer position in the wafer carrier 460 where the hand 434 will transfer the wafer, and the robot control device 450 stores that position.

[0140] Subsequently, the robot control device 450 controls the robot 430 to transfer wafers to and from the wafer carrier 460 located in the load port 420 based on the stored position.

[0141] Unexplained drawing symbols should be replaced with those described above.

[0142] Although the present invention has been described with reference to the embodiments shown in the drawings, these are merely illustrative, and a person with ordinary skill in the art will understand that various modifications and equivalent other embodiments are possible. Therefore, the true scope of technical protection of the present invention should be defined by the following claims. [Explanation of symbols]

[0143] 10: Wafer 100: Conveyor 110: FM 120: Load Port 122: Buffer 130: Transport robot 136: End effector 137: Bass pad 138: Fork 140: Station 150: Dummy port 160: First position setting unit 170: Dummy Station 200: Loadport Teaching Department 210: Base plate 220: Detection pin 230: Half-moon block 240: Front end sensor 250: Central hole 260: Central sensor 300: Station Teaching Department 410: FM 420: Loadport 430: Robot 431: Body 432: Arm 434: Hand 440: Station 450: Robot control device 460: Wafer Carrier 470: Placement stand 480: Setting pin 500: Teaching Jig 510: Setting groove 530: First detection unit 535: Second detection unit 540:Second specific shape part 550: Plate-shaped substrate 560: Cover 570: Housing 580: Opening surface

Claims

1. FM and, A load port is provided along one side edge of the FFMM such that at least one is connected to the inside of the FFMM, A transport robot that transports wafers located inside the aforementioned YFM to multiple load ports using an end effector for processing, A load port teaching unit for detecting a fixed position is provided so that the end effector, with the wafer unloaded, can place the wafer in a fixed position inside the load port. Includes a control unit for controlling the transport robot, The end effector includes a base pad whose upper surface is formed to be flat, and two forks extending in front of the base pad. The aforementioned load port teaching unit is, The first object to be detected is placed in the load port, A second object to be detected is placed in the load port, A first sensor is provided on the fork to detect the first object to be detected, A second sensor is provided on the base pad for detecting the second object to be detected, Equipped with, The first detected object is positioned in the load port further back than the second detected object in the direction of entry of the end effector. The control unit, The end effector is moved forward above the second object to be detected, and the forward movement is stopped when the first sensor detects the first object to be detected. An automatic wafer teaching device for semiconductor manufacturing equipment, characterized in that, after the forward movement stops, the end effector is lowered so that the second sensor detects the second object to be detected, and the fixed position is detected based on the detection result of the position of the second object to be detected.

2. The aforementioned load port teaching unit is, The second object to be detected includes a detection pin formed to protrude from a specific load port, dummy port, or the inner bottom surface of the wafer so as to correspond to the leading edge or center on the plane of the wafer, As the first object to be detected, a crescent-shaped block is formed to protrude from a specific load port, dummy port, or the inner bottom surface of the YFM, at a position behind the detection pin in the entry direction of the end effector, and at a position separated by a set distance in a straight line from the detection pin, The first sensor is provided in a straight line opposite each of the forks, and detects and guides the entry position of the end effector in the Y and Z directions so that the detection pin is positioned at the center of the plane between the forks and at a set height, and detects the half-moon block when the end effector moves forward, and When the fork moves forward and the front end sensor detects the crescent block, a central hole is formed through the base pad so that the detection pin is positioned, As the second sensor, one or more central sensors are provided on the base pad along the edge of the central hole to interact in the inward direction of the central hole and to position the end effector in the X and Z directions so that the detection pin is set to a set position, An automatic wafer teaching apparatus for semiconductor manufacturing equipment according to claim 1, characterized by including the following:

3. The load port teaching unit further includes a base plate that is placed at a specific load port, dummy port, or set position on the inner bottom of the YFM, The second object to be detected includes a detection pin formed protruding from the base plate so as to correspond to the leading edge or center on the plane of the wafer, As the first object to be detected, the base plate has a crescent-shaped block that protrudes from it at a position set at a distance from the detection pin in a straight line with the detection pin, on the side behind the detection pin in the direction of entry of the end effector, The first sensor is provided in a straight line opposite each of the forks, and detects and guides the entry position of the end effector in the Y and Z directions so that the detection pin is positioned at the center of the plane between the forks and at a set height, and detects the half-moon block when the end effector moves forward, and When the fork moves forward and the front end sensor detects the crescent block, a central hole is formed through the base pad so that the detection pin is positioned, As the second sensor, one or more central sensors are provided on the base pad along the edge of the central hole to interact in the inward direction of the central hole and to position the end effector in the X and Z directions so that the detection pin is set to a set position, An automatic wafer teaching apparatus for semiconductor manufacturing equipment according to claim 1, characterized by including the following:

4. The automatic wafer teaching apparatus for semiconductor manufacturing equipment according to claim 3, characterized in that, when the dummy port is located inside a specific load port, the dummy port is fixedly positioned relative to the load port by a first position setting unit.

5. A station is provided along the other edge of the aforementioned FM such that at least one is connected to the inside of the FM, An automatic wafer teaching apparatus for semiconductor manufacturing equipment according to claim 1, comprising a station teaching unit that detects a fixed position so that the end effector, in a state in which the wafer has been unloaded, can place the wafer in a fixed position inside the station.

6. A transfer device equipped with a teaching system for teaching the transfer position of wafers within a wafer carrier (FOUP) placed on a load port installed in a transfer device that forms a clean space, A robot comprising a hand capable of holding a wafer, an arm for moving the hand in the horizontal and vertical directions, and a first sensor and a second sensor provided on the hand, A robot control device that performs detection by at least the first sensor and the second sensor, and controls the movement of the arm and the hand, The system includes a teaching jig placed on the load port and configured to maintain a clean space in the transport device at the same position as the transfer position of the wafer within the wafer carrier by the robot, The teaching jig comprises a second object to be detected and a first object to be detected, which are arranged to grasp the relative positional relationship with the transfer position of the wafer within the wafer carrier. The first object to be detected is positioned further back in the teaching jig than the second object to be detected in the direction of the hand's entry. The robot control device is The hand is moved forward above the second object to be detected, and the forward movement is stopped when the first sensor detects the first object to be detected. A transport device that, after the forward movement stops, lowers the hand so that the second sensor detects the second object to be detected, and stores the transfer position of the wafer based on the detection result of the position of the second object to be detected.

7. The conveying device according to claim 6, wherein the teaching jig includes a housing having an opening on one side and a shape on the other side for the load port to hold the teaching jig, the second object to be detected and the first object to be detected are provided inside the housing, and the robot can access the second object to be detected and the first object to be detected through the opening of the teaching jig which maintains a clean space in the conveying device.

8. The conveying apparatus according to claim 6, wherein the teaching jig is a wafer carrier (FOUP) capable of accommodating wafers, and a plate-shaped substrate having the second object to be detected and the first object to be detected is mounted on the wafer mounting stage of the wafer carrier.

9. The transport device according to claim 7, wherein the second object to be detected and the first object to be detected are provided on a plate-shaped substrate located at the same height as the wafer placed on the wafer carrier.

10. The conveying device according to claim 7, wherein the teaching jig further comprises a cover that covers the opening surface, and the cover is opened and closed by the load port.

11. The teaching jig further comprises a third object to be detected, which is positioned even closer to the opening surface than the second object to be detected. The transport device according to claim 7, wherein the robot control device operates the hand to detect the third object to be detected with the first sensor, moves the hand toward the first object to be detected and the second object to be detected based on the position of the detected third object, detects the first object to be detected with the first sensor, detects the second object to be detected with the second sensor, and obtains the wafer transfer position based on the position of the second object to be detected.

12. The conveying device according to claim 11, wherein the third object to be detected, the second object to be detected, and the first object to be detected are arranged in positions corresponding to the angle made by the axis of the hand with respect to the opening surface in a plan view.

13. The conveying device according to claim 12, wherein the teaching jig has a first position and a second position different from the first position, and the third object to be detected, the second object to be detected and the first object to be detected are positioned at the first position when the hand accesses the opening surface while maintaining a state in which the angle made by the axis of the hand with respect to the opening surface is perpendicular in a plan view, and are positioned at the second position when the hand accesses the opening surface while maintaining a state in which the angle made by the axis of the hand with respect to the opening surface is not perpendicular.

14. The conveying device according to claim 11, wherein the second object to be detected and the first object to be detected are positioned so as to be detectable by the first sensor and the second sensor, while maintaining the angle that the axis of the hand makes with respect to the opening surface, after the third object to be detected by the first sensor.

15. The transport device according to claim 11, wherein the third object to be detected is positioned such that, when detected by the first sensor, a gap is secured between at least the side wall of the housing and the hand.

16. The conveying device according to claim 11, wherein the third detected object, the second detected object, and the first detected object are provided in a hierarchical manner in multiple stages within the teaching jig.

17. The conveying device according to claim 13, wherein, at the second arrangement position, the surface on which the second object to be detected and the first object to be detected are located is different from the surface on which the third object to be detected is located.

18. The conveying device according to claim 11, wherein the first sensor is provided on the tip side of the hand, the second sensor is provided on the base end side of the hand than the first sensor and has an optical axis perpendicular to the optical axis of the first sensor, and after the first sensor detects the third object to be detected, the robot control device moves the hand to a position in which the first sensor can detect the first object to be detected and the second sensor can detect the second object to be detected.

19. The transport device according to claim 18, wherein the second sensor is provided so as to cross a hole provided on the base end side of the hand, and is configured so that the hand and the third object do not interfere with each other when the first sensor detects the first object to be detected and the second object to be detected enters the hole.

20. The transport device according to claim 19, wherein the second sensor comprises an alpha sensor having an optical axis parallel to the optical axis of the first sensor, and a beta sensor having an optical axis orthogonal to the alpha sensor and the optical axis of the first sensor, respectively, and the beta sensor is provided so as to cross the hole.

21. The conveying device according to claim 6, wherein the teaching jig is placed on the load port by an OHT (Overhead Hoist Transport) or an AGV (Automated Guided Vehicle).

22. A teaching system for teaching the transfer position of wafers within a wafer carrier (FOUP) placed on a load port installed in a transport device that forms a clean space, A robot comprising a hand capable of holding a wafer, an arm for moving the hand in the horizontal and vertical directions, and a first sensor and a second sensor provided on the hand, A robot control device that performs detection by at least the first sensor and the second sensor, and controls the movement of the arm and the hand, The system includes a teaching jig placed on the load port and configured to maintain a clean space in the transport device at the same position as the transfer position of the wafer within the wafer carrier by the robot, The teaching jig comprises a second object to be detected and a first object to be detected, which are arranged to grasp the relative positional relationship with the transfer position of the wafer within the wafer carrier. The first object to be detected is positioned further back in the teaching jig than the second object to be detected in the direction of the hand's entry. The robot control device is The hand is moved forward above the second object to be detected, and the forward movement is stopped when the first sensor detects the first object to be detected. A teaching system that, after the forward movement stops, lowers the hand so that the second sensor detects the second object to be detected, and stores the transfer position of the wafer based on the detection result of the position of the second object to be detected.

23. A robot that transfers wafers between a wafer carrier (FOUP) placed on a load port installed in a transport device that forms a clean space, A handle capable of holding a wafer, The arm moves the hand in the horizontal and vertical directions, A first sensor provided on the tip side of the hand, The system comprises a second sensor provided on the base end side of the hand than the first sensor, The robot detects a teaching jig for teaching the wafer transfer position within the wafer carrier using the first and second sensors, thereby teaching the wafer transfer position. The teaching jig is placed on the load port and is configured to maintain a clean space in the transport device at the same position as the wafer transfer position within the wafer carrier, and includes a second object to be detected and a first object to be detected which are arranged to grasp the relative positional relationship with the wafer transfer position within the wafer carrier. The first object to be detected is positioned further back in the teaching jig than the second object to be detected in the direction of the hand's entry. The aforementioned robot, The hand is moved forward above the second object to be detected, and the forward movement is stopped when the first sensor detects the first object to be detected. After the forward movement stops, the hand is lowered so that the second sensor detects the second object to be detected. A robot in which the transfer position of the wafer is taught based on the detection result of the position of the second object to be detected.

24. A transport device comprising a teaching system for teaching the transfer position of a wafer within a wafer carrier (FOUP) placed on a load port installed in a transport device that forms a clean space, A robot comprising a hand capable of holding a wafer, an arm for moving the hand in the horizontal and vertical directions, and a first sensor and a second sensor provided on the hand, A robot control device that performs detection by at least the first sensor and the second sensor, and controls the movement of the arm and the hand, The system includes a teaching jig placed on the load port and configured to maintain a clean space in the transport device at the same position as the transfer position of the wafer within the wafer carrier by the robot, The teaching jig comprises a second object to be detected and a first object to be detected, which are arranged to grasp the relative positional relationship with the transfer position of the wafer within the wafer carrier. The first object to be detected is positioned further back in the teaching jig than the second object to be detected in the direction of the hand's entry. The second sensor is provided on the hand at a position where it can detect the second object when the first sensor detects the first object to be detected. The teaching jig includes a housing having an opening on one side and a shape on the other side in which the load port holds the teaching jig, the second object to be detected and the first object to be detected are provided inside the housing, and the robot can access the second object to be detected and the first object to be detected through the opening of the teaching jig which maintains a clean space for the conveying device. The teaching jig further comprises a third object to be detected, which is positioned even closer to the opening surface than the second object to be detected. The robot control device is a transport device that operates the hand to detect the third object to be detected with the first sensor, moves the hand toward the first object to be detected and the second object to be detected based on the position of the detected third object, detects the first object to be detected with the first sensor, detects the second object to be detected with the second sensor, and obtains the wafer transfer position based on the position of the second object to be detected.

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