Cooling device for cooling electrical and / or electronic assemblies

Abstract

A cooling device for cooling an electrical and / or electronic assembly (2), comprising a cover plate (3) and a base plate (4), the base plate (4) being formed as a deep-drawn part having a recess (40), the cover plate (3) and the base plate (4) being arranged such that a cooling channel (5) is formed between the cover plate (3) and the base plate (4) by the recess (40), the cover plate (3) and the base plate (4) being connected to each other in a contact area (8) outside the recess (40), a cooling fluid stream of a cooling fluid being able to flow through the cooling channel (5), the cooling device (1) further comprising at least one turbulator (6) arranged in the recess (40) of the cooling channel (5), the turbulator (6) abutting against a bottom surface (44) within the recess (40) of the base plate (4), the bottom surface (44) facing the cover plate (3), with regard to the cooling device, it is proposed that the base plate (4) has a profiling (7) in a curved region (43) at the edge of the bottom surface (44).

Description

TECHNICAL FIELD

[0001] The present invention relates to a cooling device for cooling electrical and / or electronic assemblies, and to an electronic device arrangement. BACKGROUND ART

[0002] In hybrid vehicles or electric vehicles, power modules such as inverter structures or converter structures are used. For example, an inverter is used to operate an electric machine, and supplies phase currents for the electric machine. A power module may include, for example, a carrier substrate having conductor tracks, on which for example power semiconductors are arranged, which together with the carrier substrate form an electronic unit. During operation, the electronic unit generates heat, which must be dissipated to a cooling device. For this purpose, the electronic unit is thermally connected to the cooling device. It is known that cooling channels are provided in cooling devices, through which a cooling fluid can flow, and the cooling fluid dissipates heat from the heat sink. So-called turbulators can be arranged in the cooling channels, which serve to improve the heat dissipation from the cooling device to the cooling fluid flowing through the cooling device. The turbulators generate turbulence and enlarge the cooling surface. SUMMARY OF THE INVENTION

[0003] According to the present invention, a cooling device for cooling an electrical and / or electronic assembly is proposed. The cooling device includes a cover plate and a base plate, the base plate being formed as a deep-drawn part having a recess, the cover plate and the base plate being arranged such that a cooling channel is formed between the cover plate and the base plate by the recess, the cover plate and the base plate being connected to each other in the contact area outside the recess, and a cooling fluid stream of a cooling fluid being able to flow through the cooling channel, the cooling device further includes at least one turbulator disposed within the recess of the cooling channel, the turbulator being in contact with the bottom surface within the recess of the base plate, and the bottom surface facing the cover plate. The base plate has a molded portion in a curved region at the edge of the bottom surface. [Advantages of the product] Compared to the prior art, a cooling device having the features of the independent claim has particularly high efficiency with respect to cooling the electrical and / or electronic assembly to be cooled. By embossing, bypass flow through the bypass region at the edge of the turbulator can be blocked or significantly limited. By embossing, the recess of the base plate is enlarged. By embossing the curved region at the edge of the bottom surface, the recess of the curved region at the edge of the bottom surface is enlarged. The rounded edge of the bottom surface, which is rounded by deep drawing of the base plate, loses its roundness by embossing. As a result, the turbulator can occupy a larger area in the recess and therefore in the cooling channel. Thus, the deep-drawn base plate is later fitted to the shape of the turbulator in order to keep the distance between the turbulator and the base plate, and therefore the bypass flow, as small as possible. Thus, the turbulator fits into the embossed area and occupies a favorably large area in the cooling channel. Thus, the lateral bypass region of the turbulator is favorably reduced. As a result, bypass flow through the bypass region at the edge of the turbulator can be blocked or significantly limited.

[0004] Further advantageous embodiments and developments of the present invention are enabled by the features presented in the dependent claims.

[0005] According to an advantageous exemplary embodiment, the radius of the curved region of the base plate at the bottom edge is intended to be reduced by the embossing. Thus, the radius of the curved region at the bottom edge within the cooling channel can be advantageously reduced, and the embossing within the cooling channel can form the curved region, for example, substantially perpendicular. Thus, the turbulator can advantageously penetrate deeper into the curved region, and advantageously reduce bypass flow in the bypass region.

[0006] According to an advantageous exemplary embodiment, the embossed portion is intended to form a shape particularly perpendicular to the curved region at the edge of the bottom surface. Thus, a turbulator having a curved portion itself in the region facing the curved region of the base plate can, advantageously, penetrate deeply into the embossed portion and the bypass region.

[0007] According to an advantageous exemplary embodiment, solder material is provided between the turbulator and the base plate in the embossing section, and the turbulator is intended to be connected to the base plate by the solder material in the embossing section. Advantageously, the solder material can be easily drawn into the minimized gap between the turbulator and the base plate in the embossing section by capillary action. Thus, advantageously, bypass flow between the turbulator and the base plate in the embossing section can be reduced.

[0008] A cooling device according to any one of claims 1 to 4, characterized in that the gap between the turbulator and the base plate in the embossing section is completely filled with solder. Thus, the area between the turbulator and the bottom region in the embossing section is completely closed and blocked with respect to bypass flow of cooling fluid that would otherwise bypass the turbulator. The solder can, advantageously, be easily drawn into the gap by capillary action.

[0009] A cooling device according to any one of claims 1 to 5, characterized in that solder material is provided between the cover plate and the base plate in a region where the cover plate is separated from the base plate, and / or between the turbulator and the base plate in a region outside the embossed area. Thus, the bypass region in the cooling channel is further closed by the excess solder material in the cooling device that is not required for, for example, the connection between the base plate, cover plate, and turbulator. Thus, more cooling fluid flows through the turbulator and less cooling fluid bypasses the turbulator, and the cooling device improves the efficiency of cooling the electrical and / or electronic assembly. Here again, the solder material can be easily drawn into the corresponding gap, advantageously by capillary action.

[0010] The cooling device according to any one of claims 1 to 6, characterized in that the turbulator is made from bent sheet metal, and the sheet metal has a curved portion having a radius of the turbulator in the region of the turbulator facing the curved region of the base plate. Such a turbulator can be advantageously easily manufactured by cutting and shaping sheet metal, for example, by punching and bending, as well as by, for example, a cover plate and a base plate.

[0011] In an advantageous exemplary embodiment, it is intended that the radius of the curved region of the base plate at the bottom edge is smaller than the radius of the turbulator in the region of the turbulator facing the curved region of the base plate. Thus, the turbulator can advantageously penetrate deeply into the embossed portion, contact the base plate in the bottom and side regions of the base plate, and / or be fixed to the base plate, for example, by soldering.

[0012] A cooling device according to any one of claims 1 to 8, characterized in that the embossed portion is recessed relative to the bottom surface at the edge of the bottom surface. Thus, a notch is punched out of the bottom surface at the edge of the bottom surface. This is advantageous in that overlapping between parts can be prevented and it can be ensured that the turbulator can fit into the embossed portion. Thus, an enlarged gap can be formed between the turbulator and the base plate in the embossed portion, and this gap can be advantageously well filled with solder.

[0013] Furthermore, this cooling device can be included in an electronics configuration, which further includes at least one electrical and / or electronic assembly to be cooled, with the electronic components positioned on a cover plate or base plate.

[0014] Exemplary embodiments of the present invention are shown in the drawings and described in more detail below. [Brief explanation of the drawing]

[0015] [Figure 1] This is a cross-sectional view through an exemplary embodiment of an electronic device configuration equipped with a cooling device. [Figure 2] This is an enlarged partial view of an exemplary embodiment of an electronic device configuration equipped with a cooling device. [Figure 3] This is a partial diagram of a second exemplary embodiment of the electronic device configuration. [Modes for carrying out the invention]

[0016] Figure 1 shows a cross-sectional view through an exemplary embodiment of the electronic device configuration 50. The electronic device configuration 50 includes a cooling device 1 and an electrical and / or electronic assembly on the cooling device 1. Figure 2 shows an enlarged sub-view of the exemplary embodiment of the cooling device 1 in Figure 1. Figure 3 shows a second exemplary embodiment of the cooling device 1.

[0017] The cooling device 1 is provided for cooling an electrical and / or electronic assembly 2, such as a power circuit. The electrical and / or electronic assembly 2 may be a power circuit, such as an inverter structure or converter structure in a hybrid or electric vehicle. The electrical and / or electronic assembly 2 can be configured as a power module, for example, and includes a carrier substrate having, for example, conductor tracks, on which power semiconductors are arranged, and the power semiconductors together with the carrier substrate form an electronic unit. During operation, the electrical and / or electronic assembly 2 generates heat, which must be dissipated to the cooling device 1. For this purpose, the electrical and / or electronic assembly 2 is placed on the mounting surface of the cooling device 1, for example, a cover plate 3 or a base plate 4. One or more layers can be placed between the cooling device 1 and the electrical and / or electronic assembly 2 to fix the electrical and / or electronic assembly 2 to the heat sink 1 and thermally connect them. For example, the mounting surface of the cover plate 3 facing the electrical and / or electronic assembly 2 can be coated with copper. The cooling device 1 can also have multiple electrical and / or electronic assemblies 2 arranged, for example, side by side on the cover plate 3 of the cooling device 1. Thus, each electrical and / or electronic assembly 2 is thermally connected to and fixed to the cooling device 1.

[0018] The base plate 4 and the cover plate 3 form the outer wall of the cooling device 1. The base plate 4 forms the lower side of the cooling device 1. The cover plate 3 forms the upper side of the cooling device 1. The base plate 4 and the cover plate 3 can be made from a material with high thermal conductivity, such as metal, such as aluminum. The base plate 4 and the cover plate 3 are made from sheet metal. The base plate 4 and / or the cover plate 3 each have a certain thickness, for example. The base plate 4 and the cover plate 3 can have the same thickness, for example. However, the base plate 4 and the cover plate 3 may have different thicknesses.

[0019] A recess 40 is formed in the base plate 4. Therefore, the base plate 4 is formed in a substantially trough shape. The cover plate 3 is positioned on the base plate 4 such that the recess 40 of the base plate 4 is covered by the cover plate 3. The base plate 4 and the cover plate 3 are positioned relative to each other such that a cooling channel 5 is formed between the base plate 4 and the cover plate 3 by the recess 40. The cooling channel 5 extends between the base plate 4 and the cover plate 3. The base plate 4 and the cover plate 3 form a wall that defines the cooling channel 5. The base plate 4 is formed as a deep-drawn part. For example, an edge 41 of the base plate 4 formed in one plane is connected to an edge 31 of the cover plate 3. The region where the base plate 4 is connected to the cover plate 3 is called the contact region 8. The edge 41 of the base plate 4 extends around the entire circumference of the recess 40 of the base plate 4. The edge 41 of the base plate 4 is placed, for example, directly on or with an intermediate layer in between, the edge 31 of the cover plate 3. The edge 41 of the base plate 4 is firmly connected to the edge 31 of the cover plate 3, and is specifically soldered. The edge 41 of the base plate 4 can also be connected to the edge 31 of the cover plate 3 directly, or through one or more intermediate layers or elements, and is specifically soldered. The edge 41 of the base plate 4 is connected to the edge 31 of the cover plate 3, for example, by brazing. The edge 41 of the base plate 4 is connected to the edge 31 of the cover plate 3 completely around its circumference, and is specifically soldered.

[0020] In the region of the recess 40, the base plate 4 is spaced apart from the cover plate 3, forming a circulating cavity between the base plate 4 and the cover plate 3, within which the cooling channel 5 extends. Here, as in this exemplary embodiment, the edge 41 of the base plate 40 can extend flatly in a first plane. Furthermore, for example, the plate portion 42 of the base plate 40 that forms the bottom of the recess 40 can extend in a second plane that extends particularly parallel to the first plane. Thus, the edge 41 of the base plate 40 and the plate portion 42 of the base plate 4 are each arranged in a planar manner and parallel to each other. The cover plate 3 can be formed, for example, in a planar shape or as a deep-drawn part. The recess 40, and therefore the cooling channel 5, can be formed elongated relative to the base plate 4, and in particular, at least partially rectangular. The cooling channel 5 extends at least partially along the longitudinal direction. Preferably, the cooling channel 5 has an elongated region having a particularly rectangular geometric shape when viewed on the plate plane of the cover plate 3, and this region extends along the longitudinal direction defined in particular by a straight line.

[0021] Within the recess 40 of the base plate 4, the base plate 4 has an embossed portion 7. In the embossed portion 7, the base plate 4 is deformed by embossing. The base plate 4 is embossed inside the recess. The embossed portion 7 is located at the edge of the bottom surface 44 of the base plate. The bottom surface 44 of the base plate 4 extends particularly planar into the plate portion 42. The bottom surface 44 is the surface of the base plate 4 facing the cooling channel 5 and the cover plate 3. The bottom surface 44 forms the bottom of the cooling channel 5 in the base plate 4. The embossed portion 7 is located at the edge of the bottom surface 44. The edge of the bottom surface 44 is the region in which the base plate 4 is deformed from the plane of the bottom surface 44 toward the cover plate 3. The edge of the bottom surface 44 is located within the curved region 43 of the base plate 4, in which the base plate 4 is bent toward the cover plate 3 at the edge of the planar plate portion 42. The embossing section 7 reduces the radius R4 of the curved region 43 within the recess 40 compared to the radius of the curved region 43 before embossing. The recess 40, and therefore the cooling channel 5, is enlarged within the curved region 43 by the embossing section 7. The embossing section 7 is embossed into the curved region 43, for example, as a substantially rectangular corner. At the edge of the bottom surface 44, a right-angle shape is embossed into the curved region 43 of the base plate 4. Thus, the planar plate portion 42 transitions into the curved region 43 of the base plate 4 at an angle, particularly a right angle, at the edge of the bottom surface 44 within the recess 40. The bottom surface 44 is positioned at an angle, particularly substantially right angle, to the side surface connected to the bottom surface 44 within the recess 40. The curvature radius R4 of the base plate 4 between the bottom surface 44 and the side surface is reduced by the embossing section 7. The embossing section 7 embosses a certain angle, particularly a substantially right angle, into the curved region 43 of the base plate 4. The embossing section 7 can connect to the bottom surface 44 in a planar manner, for example, in the first exemplary embodiment of the cooling device 1 in Figure 2. Thus, the bottom surface 44 is widened by the embossing section 7. However, the embossing section 7 can also be recessed relative to the bottom surface 44, for example, to form a notch at the edge of the bottom surface 44. This is shown in the second exemplary embodiment of the cooling device 1 in Figure 3.

[0022] For example, an intermediate plate can be placed between the cover plate 3 and the base plate 4. Such an intermediate plate can, for instance, provide an additional distance above the base plate 4 to accommodate the height of the cooling channel 5. Alternatively, as in the illustrated exemplary embodiment, the cover plate 3 and the first plate portion 41 of the base plate 4 may be in direct contact.

[0023] Furthermore, the cooling device 1 includes an inlet opening (not shown) through which cooling fluid can be supplied to the cooling channel 5 of the cooling device 1. Furthermore, the cooling device 1 has an outlet opening through which cooling fluid can flow out of the cooling channel 5 and the cooling device 1. The cooling fluid may be, for example, water. The inlet opening and / or outlet opening can be formed, for example, by an opening in a recess 40 of the base plate 4. The opening may be, for example, a through hole in the base plate 4. An inlet nozzle may be placed or formed in the inlet opening. Similarly, an outlet nozzle may be placed or formed in the outlet opening. A cooling fluid stream of the cooling fluid can flow through the cooling channel 5 from the inlet opening to the outlet opening. The cooling fluid can flow into the cooling channel 5 through the inlet opening of the cooling device 1 and flow out again from the cooling channel 5 of the cooling device 1 through the outlet opening of the cooling device 1. The cooling channel 5 is formed to allow the cooling fluid to flow through the cooling device 1. The cooling channel 5 in the cooling device 1 extends within the cooling device 1 from the inlet opening to the outlet opening. A cooling fluid stream can flow through the cooling channel 5 along the longitudinal direction, from the inlet to the outlet.

[0024] The cooling device 1 further includes at least one turbulator 6. The turbulator 6 is arranged in the cooling channel 5. The turbulator 6 is arranged in a turbulator section 56 extending along the longitudinal direction of the cooling channel 5. The turbulator 6 is arranged between the cover plate 3 and the base plate 4. The turbulator 6 can extend completely through the cooling channel 5 from the cover plate 3 to the base plate 4. In particular, the turbulator 6 is in indirect and / or direct heat transfer contact with the cover plate 3 and the base plate 4. The turbulator 6 is fixed to the cover plate 3 and / or the base plate 4, for example by a brazing method. The turbulator 6 abuts against the base plate 4 at the bottom surface 44, and / or is connected, in particular soldered, to the bottom surface 44. The turbulator 6 extends over the bottom surface 44. The turbulator 6 extends into the embossed portion 7. A cooling fluid flows in the longitudinal direction through the turbulator 6, for example parallel to the, for example, planar formed plate portion 42 of the, for example, planar formed cover plate 3 and / or base plate 4. The turbulator 6 is provided with a structure that increases surface area, guides flow, and transfers heat. The turbulator 6 is made of, for example, a metal with excellent thermal conductivity, such as aluminum. The turbulator 6 can also be provided with a coating, for example. The turbulator 6 can be formed as a structured plate, for example. In order to achieve the highest possible cooling efficiency, as large a portion as possible of the flow cross-section of the cooling channel 5 between the base plate 4 and the cover plate 3 is occupied by the turbulator 6. The turbulator 6 extends substantially plane-parallel, for example relative to the cover plate 3 and / or relative to the, for example, planar plate portion 42 of the base plate 4. The turbulator 6 has, for example, substantially the same planar extent as the mounting surface of the cover plate 3 on which the electric and / or electronic assembly 2 is arranged.

[0025] The turbulator 6 is made, for example, from a single piece. The turbulator 6 is made from sheet metal, for example, by cutting and shaping, particularly punching and bending. The turbulator 6 is provided to generate turbulence in the cooling fluid. The turbulator 6 is structured to generate turbulence in the cooling fluid. The turbulator 6 has, for example, several turbulence regions formed in it, which are arranged at an angle to the flow direction of the cooling fluid through the cooling channel 5, particularly in the longitudinal direction. The turbulence regions work to generate vortices in the cooling fluid flowing through the cooling channel 5. This allows for particularly effective heat dissipation. The turbulence regions can be formed, for example, in a wavy or zigzag pattern, or as periodically repeating convex and / or concave sections within the turbulator. The turbulence regions of the turbulator 6 can be formed, for example, by cutting and shaping, such as punching and bending, the sheet metal from which the turbulator 6 is made.

[0026] To achieve high cooling efficiency, as large a portion of the flow cross-section of the cooling channel 5 as possible is covered by the turbulator 6. Since the base plate 4 is a deep-drawn component, a draft angle and a radius at the edge of the recess 40 are required for the demolding process during deep drawing. These radii created by deep drawing are reduced by the embossed portion 7. The turbulator 6 is arranged below the electrical and / or electronic assembly 2. At the edge of the cooling channel 5, laterally adjacent to the turbulator 6, and between the turbulator 6, the base plate 4, and the cover plate 3, a bypass region 55 is located. The bypass region 55 is positioned next to the electrical and / or electronic assembly 2 when viewed in the plane of the mounting surface for the electrical and / or electronic assembly 2. In the bypass region 55, the cooling channel 5 is formed to be tapered. No eddy current of the cooling fluid stream occurs in the bypass region 55. Due to the embossed portion 7, the turbulator 6 can extend into the embossed portion 7 without changing its spread from the base plate 4 to the cover plate 3, and occupy an advantageously large portion of the cooling channel 5. In the region of the turbulator 6 facing the curved region 43 of the base plate 4, the turbulator 6 is bent and has a turbulator radius R6. The radius R4 denotes the radius of the curved region 43 at the edge of the bottom surface 44. The radius R6 of the turbulator 6 is larger than the radius R4 of the curved region 43 at the edge of the bottom surface 44. Accordingly, the turbulator 6 can extend deep into the embossed portion 7 and occupy an advantageously large portion of the cooling channel 5.

[0027] As shown in the figure, the cooling device 1 may also be further provided with solder material 20 at various locations. The solder material 20 may be drawn into narrow areas within the cooling device 1, for example, by capillary action. The solder material 20 may be placed, for example, within the area of ​​the embossing section 7 and / or within the embossing section 7, between the turbulator 6 and the base plate 4. Here, for example, the gap between the turbulator 6 and the base plate 4, particularly within the embossing section 7, can be filled with the solder material 20. Areas within the cooling device 1 where the cover plate 3 is separated from the base plate 4 can also be filled with the solder material 20. Furthermore, the solder material 20 may also be provided in the area between the base plate 4 and the turbulator 6 outside the embossing section 7. The solder material 20 closes off areas where the cooling fluid could potentially flow around the turbulator 6. Thus, bypass flow of the cooling fluid around the turbulator 6 is reduced or prevented, improving the cooling efficiency of the electrical and / or electronic assembly 2 by the cooling device 1.

[0028] Naturally, further exemplary embodiments and composite forms of the demonstrated exemplary embodiments are also possible.

Claims

1. A cooling device for cooling an electrical and / or electronic assembly (2), comprising a cover plate (3) and a base plate (4), wherein the base plate (4) is formed as a deep-drawn part having a recess (40), the cover plate (3) and the base plate (4) are arranged such that the recess (40) forms a cooling channel (5) between the cover plate (3) and the base plate (4), the cover plate (3) and the base plate (4) are connected to each other at an external contact area (8) of the recess (40), a cooling fluid stream of a cooling fluid is circulating through the cooling channel (5), and the cooling device (1) further comprises at least one turbulator (6) disposed within the recess (40) of the cooling channel (5), the turbulator (6) abutting against a bottom surface (44) within the recess (40) of the base plate (4), the bottom surface (44) facing the cover plate (3), The base plate (4) has an embossed portion (7) in the curved region (43) at the edge of the bottom surface (44), A cooling device characterized in that the embossed portion (7) is a notch recessed from the bottom surface (44) at the edge of the bottom surface (44).

2. The cooling device (1) described in claim 1, An electronic device configuration comprising at least one electrical and / or electronic assembly (2) to be cooled, wherein the electrical and / or electronic assembly (2) is positioned on the cover plate (3) or the base plate (4), Electronic equipment configuration.

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