Solid electrolytic capacitor

Abstract

This solid electrolytic capacitor comprises: at least one capacitor element 11 having a positive electrode part 11a and a negative electrode part 11b; a positive electrode lead terminal 12 electrically connected to the positive electrode part 11a; and a negative electrode lead terminal 13 electrically connected to the negative electrode part 11b. The positive electrode lead terminal 12 and the negative electrode lead terminal 13 each have a first main surface 14, a second main surface 15, and a cut surface 16 which has been cut from the first main surface 14 toward the second main surface 15. Among the positive electrode lead terminal 12 and the negative electrode lead terminal 13, in the cut surface 16 of at least the negative electrode lead terminal 13, a first distance L1 from the first main surface 14 to the boundary between a shear surface 16b and a fracture surface 16c is not more than 80% of a second distance L2 from the first main surface 14 to the second main surface 15. Using such a solid electrolytic capacitor makes it possible to provide a solid electrolytic capacitor in which the occurrence of shorting is suppressed.

Description

solid electrolytic capacitor

[0001] The present disclosure relates to solid electrolytic capacitors.

[0002] Conventionally, a solid electrolytic capacitor including at least one capacitor element, an anode lead terminal, and a cathode lead terminal has been known (for example, see Patent Document 1). In the solid electrolytic capacitor of Patent Document 1, at least one capacitor element is stacked on both sides of each of the anode lead terminal and the cathode lead terminal. The anode lead terminal is electrically connected to the anode portion of the capacitor element, while the cathode lead terminal is electrically connected to the cathode portion of the capacitor element.

[0003] JP 2010-028139 A

[0004] A solid electrolytic capacitor according to one aspect of the present disclosure includes at least one capacitor element having an anode portion and a cathode portion, an anode lead terminal electrically connected to the anode portion, and a cathode lead terminal electrically connected to the cathode portion, wherein the anode lead terminal and the cathode lead terminal each have a first main surface, a second main surface, and a cut surface cut from the first main surface toward the second main surface, and at the cut surface of at least the cathode lead terminal of the anode lead terminal and the cathode lead terminal, a first distance from the first main surface to a boundary between a shear surface and a fracture surface is 80% or less of a second distance from the first main surface to the second main surface.

[0005] According to the present disclosure, the occurrence of a short circuit phenomenon can be suppressed.

[0006] FIG. 1 is a cross-sectional view schematically showing a solid electrolytic capacitor according to a first embodiment. FIG. 2 is a perspective view schematically showing a capacitor element. FIG. 3 is a perspective view schematically showing each lead terminal. FIG. 4 is a perspective view showing a state in which a plurality of capacitor elements are stacked on each lead terminal. FIG. 5 is a cross-sectional view schematically showing the peripheral region of the cut surface of each lead terminal. FIG. 6 is a cross-sectional view schematically showing a solid electrolytic capacitor according to a second embodiment.

[0007] Prior to describing the embodiments, the following briefly describes the problems with the prior art. Generally, anode lead terminals and cathode lead terminals are fabricated by cutting metal sheets using press processing or the like. Therefore, burrs formed during cutting are present on the edges of the cut surfaces of the anode lead terminals and cathode lead terminals. If such burrs penetrate into a capacitor element, electrical continuity between the anode and cathode portions (hereinafter referred to as a short circuit) may occur. In such a situation, one of the objectives of the present disclosure is to suppress the occurrence of a short circuit. In consideration of the above-described problems, the present disclosure can realize a solid electrolytic capacitor capable of suppressing the occurrence of a short circuit. Below, examples of embodiments of a solid electrolytic capacitor according to the present disclosure are described. However, the present disclosure is not limited to the examples described below. While the following description may use specific numerical values ​​and materials as examples, other numerical values ​​and materials may be used as long as the effects of the present disclosure are achieved.

[0008] (Solid Electrolytic Capacitor) A solid electrolytic capacitor according to the present disclosure includes at least one capacitor element, an anode lead terminal, and a cathode lead terminal.

[0009] The capacitor element has an anode portion and a cathode portion. An insulating portion may be provided between the anode portion and the cathode portion to electrically insulate them from each other. The insulating portion may be made of, for example, insulating tape or insulating resin.

[0010] The anode section may be configured to include a portion of an anode body (a portion on one side of the insulating section) made of a valve metal included in the capacitor element. The cathode section may be configured of a solid electrolyte layer and a cathode layer formed in this order on a surface of a cathode-forming portion (a portion on the other side of the insulating section) that is the remainder of the anode body. A dielectric layer is provided between the anode body and the solid electrolyte layer.

[0011] Examples of the valve metal constituting the anode body include aluminum, tantalum, niobium, titanium, etc. The anode body may be a foil of the valve metal or a porous sintered body made of the valve metal.

[0012] The dielectric layer is formed on the surface of at least the cathode-forming portion, which is the remaining portion of the anode body. The dielectric layer may be made of an oxide (e.g., aluminum oxide) formed on the surface of the anode body by a gas phase method such as anodic oxidation or vapor deposition.

[0013] The solid electrolyte layer is formed on the surface of the dielectric layer. The solid electrolyte layer may include a conductive polymer. The solid electrolyte layer may further include a dopant, if necessary.

[0014] Conductive polymers that can be used include known polymers used in solid electrolytic capacitors, such as π-conjugated conductive polymers. Examples of conductive polymers include polymers with a basic skeleton of polypyrrole, polythiophene, polyaniline, polyfuran, polyacetylene, polyphenylene, polyphenylene vinylene, polyacene, and polythiophene vinylene. Of these, polymers with a basic skeleton of polypyrrole, polythiophene, or polyaniline are preferred. The above polymers also include homopolymers, copolymers of two or more monomers, and derivatives thereof (e.g., substituted products having substituents). For example, polythiophenes include poly(3,4-ethylenedioxythiophene). Conductive polymers may be used alone or in combination.

[0015] The dopant may be at least one selected from the group consisting of low-molecular-weight anions and polyanions. Examples of anions include, but are not limited to, sulfate ions, nitrate ions, phosphate ions, borate ions, organic sulfonate ions, and carboxylate ions. Examples of dopants that generate sulfonate ions include benzenesulfonic acid, p-toluenesulfonic acid, and naphthalenesulfonic acid. Examples of polyanions include polymeric polysulfonic acids and polymeric polycarboxylic acids. Examples of polymeric polysulfonic acids include polyvinylsulfonic acid, polystyrenesulfonic acid, polyallylsulfonic acid, polyacrylicsulfonic acid, and polymethacrylicsulfonic acid. Examples of polymeric polycarboxylic acids include polyacrylic acid and polymethacrylic acid. Examples of polyanions include polyestersulfonic acid and phenolsulfonic acid novolac resin. However, the polyanions are not limited to these.

[0016] The solid electrolyte layer may further contain, as necessary, known additives and known conductive materials other than conductive polymers, such as at least one selected from the group consisting of conductive inorganic materials such as manganese dioxide and TCNQ complex salts.

[0017] The cathode layer may be composed of a carbon layer formed on the surface of the solid electrolyte layer and a conductor layer formed on the surface of the carbon layer. The conductor layer may be composed of a silver paste. The silver paste may be, for example, a composition containing silver particles and a resin component (binder resin). Although a thermoplastic resin may be used as the resin component, it is preferable to use a thermosetting resin such as an imide resin or an epoxy resin.

[0018] The anode lead terminal is electrically connected to the anode portion of the capacitor element. The anode lead terminal has a first main surface, a second main surface opposite the first main surface, and a cut surface cut from the first main surface toward the second main surface. The cut surface includes a sagging, a shear surface, and a fracture surface from the first main surface toward the second main surface. The sagging refers to a smooth surface formed by pulling the first main surface.

[0019] The cathode lead terminal is electrically connected to the cathode portion of the capacitor element. The cathode lead terminal has a first main surface, a second main surface opposite to the first main surface, and a cut surface cut from the first main surface toward the second main surface. The cut surface includes a sag, a shear surface, and a fracture surface from the first main surface toward the second main surface.

[0020] At the cut surface of at least the cathode lead terminal out of the anode lead terminal and the cathode lead terminal, a first distance from the first main surface to the boundary between the shear surface and the fracture surface is 80% or less of a second distance from the first main surface to the second main surface. When the first distance falls within this range, only extremely small burrs are formed at the edge of the cut surface on the second main surface side during fabrication of each lead terminal. Even if such extremely small burrs come into contact with the capacitor element, they do not penetrate from the cathode layer to the dielectric layer, and no short circuit occurs. Therefore, the occurrence of a short circuit can be suppressed.

[0021] In the cut surface of at least the cathode lead terminal out of the anode lead terminal and the cathode lead terminal, the first distance may be 70% or less of the second distance. With this configuration, burrs formed on the edge of the cut surface on the second main surface side are further reduced, thereby further suppressing the occurrence of short circuits.

[0022] Each of the anode lead terminal and the cathode lead terminal may be made of a copper alloy containing copper and an element other than copper (e.g., at least one selected from the group consisting of tin, nickel, chromium, phosphorus, zinc, silicon, and iron). Among the elements other than copper, at least one selected from the group consisting of tin, nickel, and phosphorus is preferred, and a copper alloy containing the three elements tin, nickel, and phosphorus is more preferred. The content of the elements other than copper contained in the copper alloy may be, for example, 1% by mass or more and 3% by mass or less. The tin content may be 0.9% by mass or more and 2.5% by mass or less. The nickel content may be 0.1% by mass or more and 1.2% by mass or less. The phosphorus content may be 0.01% by mass or more and 0.2% by mass or less. Each lead terminal made of such a copper alloy is less likely to stretch when cut, and therefore does not form large burrs on the edges of the cut surface. This further reduces the occurrence of short circuits.

[0023] The capacitor element may be electrically connected to the cathode lead terminal at only one of the first main surface and the second main surface.

[0024] The capacitor element may be electrically connected to the anode lead terminal at only one of the first main surface and the second main surface.

[0025] The solid electrolytic capacitor may include a plurality of capacitor elements, some of which may be electrically connected to the cathode lead terminal on one of the first and second main surfaces, and the remaining of which may be electrically connected to the cathode lead terminal on the other of the first and second main surfaces.

[0026] The solid electrolytic capacitor may include a plurality of capacitor elements, some of which may be electrically connected to the anode lead terminal on one of the first and second main surfaces, and the remaining of which may be electrically connected to the anode lead terminal on the other of the first and second main surfaces.

[0027] The anode lead terminal may have a through hole in a connection surface to which at least one capacitor element is connected. With this configuration, when the anode portion of the capacitor element and the anode lead terminal are connected by resistance welding, good welding can be performed, thereby reducing the equivalent series resistance (ESR) of the solid electrolytic capacitor.

[0028] The cathode lead terminal may have a guide portion for guiding at least one capacitor element. Such a guide portion allows the capacitor element to be easily positioned. The guide portion may be formed, for example, by providing a protrusion at an end of the cathode lead terminal and bending the protrusion so as to fit along a side surface of the cathode portion.

[0029] As described above, according to the present disclosure, the occurrence of a short circuit phenomenon can be suppressed in a solid electrolytic capacitor.

[0030] An example of a solid electrolytic capacitor according to the present disclosure will be specifically described below with reference to the drawings. The components described above can be applied to the components of the example solid electrolytic capacitor described below. The components of the example solid electrolytic capacitor described below can be modified based on the above description. Furthermore, the matters described below may be applied to the above-described embodiment. Of the components of the example solid electrolytic capacitor described below, components that are not essential for the solid electrolytic capacitor according to the present disclosure may be omitted. Note that the diagrams shown below are schematic and do not accurately reflect the shapes and numbers of actual components.

[0031] Embodiment 1 Embodiment 1 of the present disclosure will be described. A solid electrolytic capacitor 10 of this embodiment has a double-sided laminated structure (a structure in which capacitor elements are laminated on both sides of each lead terminal). As shown in Figures 1 to 5, the solid electrolytic capacitor 10 includes a plurality of capacitor elements 11, an anode lead terminal 12, a cathode lead terminal 13, and an exterior resin 17.

[0032] The capacitor elements 11 each have an anode portion 11a, a cathode portion 11b, and an insulating portion 11c. The anode portion 11a is composed of a part of an anode body made of a valve metal (e.g., aluminum). The cathode portion 11b is composed of a solid electrolyte layer and a cathode layer formed in sequence on the surface of a cathode-forming portion, which is the remaining part of the anode body. The insulating portion 11c is composed of insulating tape and electrically insulates the anode portion 11a from the cathode portion 11b. A dielectric layer is provided between the anode body and the solid electrolyte layer.

[0033] Some of the plurality of capacitor elements 11 (in this example, the four upper capacitor elements 11 in FIG. 1 ) are electrically connected to the anode lead terminal 12 and the cathode lead terminal 13 on a first main surface 14 described below. The remaining plurality of capacitor elements 11 (in this example, the four lower capacitor elements 11 in FIG. 1 ) are electrically connected to the anode lead terminal 12 and the cathode lead terminal 13 on a second main surface 15 described below.

[0034] The anode lead terminal 12 is electrically connected to the anode portion 11a of the capacitor element 11. The anode lead terminal 12 has a first main surface 14 (the main surface facing upward in each drawing), a second main surface 15 opposite the first main surface 14, and a cut surface 16 cut from the first main surface 14 toward the second main surface 15. The cut surface 16 includes a sag 16a, a shear surface 16b, and a fracture surface 16c from the first main surface 14 toward the second main surface 15 (see FIG. 5 ).

[0035] The anode lead terminal 12 is made of a copper alloy containing copper and at least one selected from the group consisting of tin, nickel, chromium, phosphorus, zinc, silicon, and iron, although the anode lead terminal 12 may be made of other metals.

[0036] The anode lead terminal 12 has a through hole 12b in a connection surface 12a to which a plurality of capacitor elements 11 are connected. The through hole 12b is a circular hole that penetrates the anode lead terminal 12 in the thickness direction. The through hole 12b is positioned so as to overlap the anode portion 11a of the capacitor element 11 when viewed in the thickness direction of the anode lead terminal 12 (the vertical direction in FIG. 1 ). The shape of the through hole 12b is not limited to a circle and may be any other shape.

[0037] Cathode lead terminal 13 is electrically connected to cathode portion 11b of capacitor element 11. Cathode lead terminal 13 has a first main surface 14 (the main surface facing upward in each drawing), a second main surface 15 opposite to first main surface 14, and a cut surface 16 cut from first main surface 14 toward second main surface 15. Cut surface 16 includes sagging 16a, shear surfaces 16b, and fracture surfaces 16c from first main surface 14 toward second main surface 15 (see FIG. 5 ).

[0038] The cathode lead terminal 13 is made of a copper alloy containing copper and at least one selected from the group consisting of tin, nickel, chromium, phosphorus, zinc, silicon, and iron. However, the cathode lead terminal 13 may be made of other metals. The constituent material of the cathode lead terminal 13 may be the same as or different from the constituent material of the anode lead terminal 12.

[0039] The cathode lead terminal 13 has a connection portion 13a that is connected to the side surfaces of the plurality of capacitor elements 11 via conductive paste (not shown). The connection portion 13a may be formed by bending a portion of the cathode lead terminal 13. Such a connection portion 13a can reduce the resistance between the cathode portion 11b of each capacitor element 11 and the cathode lead terminal 13. As a result, the ESR of the solid electrolytic capacitor 10 can be suppressed.

[0040] The exterior resin 17 covers the capacitor elements 11 with a portion of each of the anode lead terminals 12 and the cathode lead terminals 13 exposed to the outside. The exterior resin 17 is made of an insulating resin material. The exposed portions of the anode lead terminals 12 and the cathode lead terminals 13 form the external terminals of the solid electrolytic capacitor 10.

[0041] At each cut surface 16 of the anode lead terminal 12 and the cathode lead terminal 13, the first distance L1 from the first main surface 14 to the boundary between the shear surface 16b and the fracture surface 16c is 0% to 80% of the second distance L2 from the first main surface 14 to the second main surface 15 (i.e., the thickness of each lead terminal 12, 13), preferably 0% to 70%, and more preferably 40% to 60%. When the first distance L1 falls within this range, burrs (not shown) formed at the fracture surface 16c are extremely small (e.g., 0.5 μm or less). This prevents short circuits in the solid electrolytic capacitor 10. In this embodiment, the first distance L1 is approximately 60% of the second distance L2.

[0042] Second Embodiment A second embodiment of the present disclosure will be described. Solid electrolytic capacitor 10 of this embodiment differs from the first embodiment in that it has a single-surface layer structure (a structure in which a capacitor element is laminated on one side of each lead terminal). The following mainly describes the differences from the first embodiment.

[0043] 6, the plurality of capacitor elements 11 are electrically connected to the anode lead terminal 12 only on the first main surface 14. The plurality of capacitor elements 11 are electrically connected to the cathode lead terminal 13 only on the first main surface 14.

[0044] The cathode lead terminal 13 has a guide portion 13b that guides the plurality of capacitor elements 11. The cathode lead terminal 13 of this embodiment has two guide portions 13b. One guide portion 13b is formed in a plate shape that guides the upper side surface (upper side surface in FIG. 6 ) of the stack of the plurality of capacitor elements 11. The other guide portion 13b is formed in a plate shape that guides the lower side surface (lower side surface in FIG. 6 ) of the stack. This other guide portion 13b also serves as the connection portion 13a that is connected to the lower surface of the capacitor element 11. Each guide portion 13b is formed by bending a portion of the cathode lead terminal 13. Note that the guide portion 13b may also be formed in a plate shape that guides the side surface of the stack of the plurality of capacitor elements 11.

[0045] The frequency of occurrence of short circuits was investigated for the solid electrolytic capacitors 10 of Examples 1 to 6 and Comparative Examples 1 to 6 shown below. Here, the frequency of occurrence of short circuits refers to the number of solid electrolytic capacitors 10 in which a short circuit occurred per 10,000 solid electrolytic capacitors 10. For example, an occurrence frequency of 100 means that a short circuit occurred in 100 solid electrolytic capacitors 10 out of 10,000 solid electrolytic capacitors 10.

[0046] The term "temper" used in the following explanations of each example and comparative example refers to the state of a material that has been subjected to necessary treatment in order to impart specific physical or mechanical properties to a wrought copper product, as defined in JIS H 0500.

[0047] In each of the following examples and comparative examples, the ratio of the first distance L1 to the second distance L2 was determined by observing the cut surface 16 of each lead terminal 12, 13 of the fabricated solid electrolytic capacitor 10 with an optical microscope, measuring the first distance L1 and the second distance L2 at ten points, and averaging the measured values.

[0048] Example 1 In the double-sided laminated solid electrolytic capacitor 10 of the first embodiment, the anode lead terminal 12 and the cathode lead terminal 13 were each fabricated using MF202 (manufactured by Mitsubishi Electric Metex Corporation) with a temper classification of H. MF202 contained 1.7 to 2.3 mass% tin, 0.1 to 0.4 mass% nickel, 0.15 mass% or less phosphorus, and the remainder copper. The first distance L1 was approximately 65% ​​of the second distance L2. The frequency of short-circuiting was 0.

[0049] Example 2 In the double-sided laminated solid electrolytic capacitor 10 of the first embodiment, the anode lead terminal 12 and the cathode lead terminal 13 were each fabricated using NB109 (manufactured by Dowa Metaltech Co., Ltd.) with a temper grade of EH. NB109 contained 1.0% by mass of nickel, 0.9% by mass of tin, 0.05% by mass of phosphorus, and the remainder being copper. The first distance L1 was approximately 60% of the second distance L2. The frequency of short-circuiting was 0.

[0050] Example 3 In the double-sided laminated solid electrolytic capacitor 10 of Embodiment 1, the anode lead terminal 12 and the cathode lead terminal 13 were each fabricated using KLF-5 (manufactured by Kobe Steel, Ltd.) with a temper classification of H. KLF-5 contains 2.0% by mass of tin, 0.1% by mass of iron, 0.03% by mass of phosphorus, and the remainder being copper. The first distance L1 was approximately 50% of the second distance L2. The frequency of short-circuiting was 0.

[0051] Example 4 In the single-surface layer type solid electrolytic capacitor 10 of the second embodiment, the anode lead terminal 12 and the cathode lead terminal 13 were each fabricated using MF202 (manufactured by Mitsubishi Electric Metex Corporation) with a temper classification of H. The first distance L1 was approximately 65% ​​of the second distance L2. The orientation of each lead terminal 12, 13 was set so that the main surface on which burrs were formed, i.e., the second main surface 15, faced the capacitor element 11. The frequency of short-circuiting was zero.

[0052] Example 5 In the single-surface layer type solid electrolytic capacitor 10 of the second embodiment, the anode lead terminal 12 and the cathode lead terminal 13 were each fabricated using NB109 (manufactured by Dowa Metaltech Co., Ltd.) with a temper grade of EH. The first distance L1 was approximately 60% of the second distance L2. The orientation of each lead terminal 12, 13 was set so that the main surface on which burrs were formed, i.e., the second main surface 15, faced the capacitor element 11. The frequency of short-circuiting was zero.

[0053] Example 6 In the single-area layer type solid electrolytic capacitor 10 of the second embodiment, the anode lead terminal 12 and the cathode lead terminal 13 were each fabricated using KLF-5 (manufactured by Kobe Steel, Ltd.) with a temper classification of H. The first distance L1 was approximately 50% of the second distance L2. The orientation of each lead terminal 12, 13 was set so that the main surface on which burrs were formed, i.e., the second main surface 15, faced the capacitor element 11. The frequency of short-circuiting was zero.

[0054] Comparative Example 1 In the double-sided laminated solid electrolytic capacitor 10 of the first embodiment, the anode lead terminal 12 and the cathode lead terminal 13 were each fabricated using KFC (manufactured by Kobe Steel, Ltd.) with a temper classification of H. The KFC contained 0.1% by mass of iron, 0.03% by mass of phosphorus, and the remainder copper. The first distance L1 was approximately 97% of the second distance L2. The frequency of short-circuiting was 71.

[0055] Comparative Example 2: In the double-sided laminated solid electrolytic capacitor 10 of the first embodiment, the anode lead terminal 12 and the cathode lead terminal 13 were each fabricated using C194 (manufactured by Hitachi Metals Neomaterial, Ltd.) with a temper grade of H. C194 contained 2.3% by mass of iron, 0.12% by mass of zinc, 0.05% by mass of phosphorus, and the remainder being copper. The first distance L1 was approximately 85% of the second distance L2. The frequency of short-circuiting was 3.

[0056] Comparative Example 3 In the double-sided laminated solid electrolytic capacitor 10 of the first embodiment, the anode lead terminal 12 and the cathode lead terminal 13 were each fabricated using NFC11 (manufactured by Furukawa Electric Co., Ltd.) with a temper classification of H. NFC11 contained 0.3% by mass of chromium, 0.8% by mass of tin, 0.2% by mass of zinc, and the remainder being copper. The first distance L1 was approximately 98% of the second distance L2. The frequency of short-circuiting was 30.

[0057] Comparative Example 4 In the single-area layer type solid electrolytic capacitor 10 of the second embodiment, the anode lead terminal 12 and the cathode lead terminal 13 were each fabricated using KFC (manufactured by Kobe Steel, Ltd.) with a temper classification of H. The first distance L1 was approximately 97% of the second distance L2. The orientation of each lead terminal 12, 13 was set so that the main surface on which burrs were formed, i.e., the second main surface 15, faced the capacitor element 11. The frequency of short-circuiting was 40.

[0058] Comparative Example 5 In the single-surface layer type solid electrolytic capacitor 10 of the second embodiment, the anode lead terminal 12 and the cathode lead terminal 13 were each fabricated using C194 (manufactured by Hitachi Metals Neomaterial, Ltd.) with a temper grade of H. The first distance L1 was approximately 85% of the second distance L2. The orientation of each lead terminal 12, 13 was set so that the main surface on which burrs were formed, i.e., the second main surface 15, faced the capacitor element 11. The frequency of short-circuiting was 15.

[0059] Comparative Example 6 In the single-area layer type solid electrolytic capacitor 10 of the second embodiment, the anode lead terminal 12 and the cathode lead terminal 13 were each fabricated using NFC11 (manufactured by Furukawa Electric Co., Ltd.) with a temper classification of H. The first distance L1 was approximately 98% of the second distance L2. The orientation of each lead terminal 12, 13 was set so that the main surface on which burrs were formed, i.e., the second main surface 15, faced the capacitor element 11. The frequency of short-circuiting was 11.

[0060] As described above, the frequency of occurrence of short circuits was zero in all of Examples 1 to 6, while this was not the case in Comparative Examples 1 to 6. This demonstrates the superiority of Examples 1 to 6.

[0061] The present disclosure can be used for solid electrolytic capacitors.

[0062] 10: Solid electrolytic capacitor 11: Capacitor element 11a: Anode portion 11b: Cathode portion 11c: Insulating portion 12: Anode lead terminal 12a: Connection surface 12b: Through hole 13: Cathode lead terminal 13a: Connection portion 13b: Guide portion 14: First main surface 15: Second main surface 16: Cut surface 16a: Sagging 16b: Shear surface 16c: Fracture surface 17: Exterior resin L1: First distance L2: Second distance

Claims

1. at least one capacitor element having an anode portion and a cathode portion; an anode lead terminal electrically connected to the anode portion; a cathode lead terminal electrically connected to the cathode portion; Equipped with each of the anode lead terminal and the cathode lead terminal has a first main surface, a second main surface, and a cut surface cut from the first main surface toward the second main surface; a first distance from the first main surface to a boundary between a shear surface and a fracture surface at the cut surface of at least the cathode lead terminal among the anode lead terminal and the cathode lead terminal, the first distance being 80% or less of a second distance from the first main surface to the second main surface.

2. 2 . The solid electrolytic capacitor according to claim 1 , wherein the first distance is 70% or less of the second distance at the cut surface of at least the cathode lead terminal out of the anode lead terminal and the cathode lead terminal.

3. 3. The solid electrolytic capacitor according to claim 1, wherein the capacitor element is electrically connected to the cathode lead terminal at only one of the first main surface and the second main surface.

4. A plurality of the capacitor elements are provided, some of the capacitor elements are electrically connected to the cathode lead terminal at one of the first main surface and the second main surface; 3 . The solid electrolytic capacitor according to claim 1 , wherein the remaining portions of the plurality of capacitor elements are electrically connected to the cathode lead terminal on the other of the first main surface and the second main surface.

5. 3. The solid electrolytic capacitor according to claim 1, wherein the anode lead terminal has a through hole in a connection surface to which the at least one capacitor element is connected.

6. 3. The solid electrolytic capacitor according to claim 1, wherein the cathode lead terminal has a guide portion that guides the at least one capacitor element.