Thermosetting composition, cured product, and optical member

Abstract

This thermosetting composition contains: an ultraviolet radiation absorber that contains at least one type of compound A selected from among a compound represented by formula (1) and a compound represented by formula (2); a thermosetting compound; and at least one type of thermosetting aid selected from among a thermal polymerization initiator and a polymerization catalyst. The present invention also provides a cured product and optical member obtained using the thermosetting composition.

Description

Thermosetting composition, cured product, and optical component

[0001] The present invention relates to a thermosetting composition containing an ultraviolet absorber, and also to a cured product and an optical component using the thermosetting composition.

[0002] Benzobisdithiol compounds have excellent ultraviolet absorption properties and are used as ultraviolet absorbers, etc. For example, Patent Document 1 describes an invention relating to eyeglass lenses that use a specific benzobisdithiol compound as an ultraviolet absorber.

[0003] Japanese Patent Application Laid-Open No. 2019-191219

[0004] One of the required properties of an ultraviolet absorber is that it is less colored.

[0005] Furthermore, according to the investigations of the present inventors, it has been found that when an ultraviolet absorber is added to a thermosetting composition, the resulting cured product tends to have a large haze.

[0006] Therefore, an object of the present invention is to provide a thermosetting composition that can produce a cured product with little coloration and reduced haze, a cured product, and an optical component.

[0007] The present invention provides the following: <1> A thermosetting composition containing an ultraviolet absorber containing at least one compound A selected from the group consisting of a compound represented by formula (1) and a compound represented by formula (2), a thermosetting compound, and at least one thermosetting auxiliary selected from the group consisting of a thermal polymerization initiator and a polymerization catalyst; In formula (1), R １ and R ２ each independently represents a hydrogen atom, an alkyl group, an aryl group, an acyl group, a carbamoyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, or an ethylenically unsaturated bond-containing group; R ３ and R ４each independently represents a hydrogen atom, a halogen atom, an alkyl group, an aryl group, an alkoxy group, an aryloxy group, an acyloxy group, an alkylamino group, an anilino group, an acylamino group, an alkylsulfonylamino group, an arylsulfonylamino group, an alkylthio group, an arylthio group, or an ethylenically unsaturated bond-containing group; R ５ and R ６ each independently represents a hydrogen atom, an alkyl group having two or more carbon atoms, an aralkyl group, an aryl group, a heterocyclic group, or an ethylenically unsaturated bond-containing group; R １ and R ３ may be bonded to form a ring, R ３ and R ４ may be bonded to form a ring, R ２ and R ４ may be bonded to form a ring, R ５ and R ６ may be bonded to form a ring; １１ and R １２ each independently represents a hydrogen atom, an alkyl group, an aryl group, an acyl group, a carbamoyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, or an ethylenically unsaturated bond-containing group; Q １ represents a group represented by formula (Q-1), ２ is =O, =S, =NR ｑ１ or =CR ｑ２ R ｑ３ represents R ｑ１ ~R ｑ３ each independently represents a hydrogen atom or a substituent, R ｑ２ and R ｑ３ may be bonded to each other to form a ring; In formula (Q-1), * represents a bond, R １０１ and R １０２ each independently represents a hydrogen atom, an alkyl group, an aralkyl group, an aryl group, a heterocyclic group, or an ethylenically unsaturated bond-containing group. ３ and R ４<3> The thermosetting composition according to <1>, wherein one of Q in formula (2) represents a hydrogen atom, and the other represents a halogen atom, an alkyl group, an aryl group, an alkoxy group, an aryloxy group, an acyloxy group, an alkylamino group, an anilino group, an acylamino group, an alkylsulfonylamino group, an arylsulfonylamino group, an alkylthio group, an arylthio group, or an ethylenically unsaturated bond-containing group. ２ Is, Q １ The thermosetting composition according to <1>, wherein the compound A is a group having a structure different from that of the compound A. <4> The thermosetting composition according to any one of <1> to <3>, wherein the content of the compound A is 0.01 to 20 mass% of the total solid content of the thermosetting composition. <5> The thermosetting composition according to any one of <1> to <4>, wherein the thermosetting compound includes at least one selected from a phenolic resin, an epoxy resin, a melamine resin, a urea resin, a polyester resin, an alkyd resin, a polyimide resin, a polyurethane resin, a polythiourethane resin, a diallyl phthalate resin, an episulfide resin, a siloxane resin, and a precursor thereof. <6> A cured product obtained using the thermosetting composition according to any one of <1> to <5>. <7> An optical member comprising the cured product according to <6>.

[0008] The present invention can provide a thermosetting composition that can produce a cured product with little coloration and reduced haze, a cured product, and an optical component.

[0009] The present invention will be described in detail below. In the present specification, when a group (atomic group) is represented without specifying whether it is substituted or unsubstituted, it encompasses both unsubstituted and substituted groups. For example, the term "alkyl group" encompasses not only unsubstituted alkyl groups (unsubstituted alkyl groups) but also substituted alkyl groups (substituted alkyl groups). In the present specification, a numerical range expressed using "to" refers to a range that includes the numerical values ​​before and after "to" as the lower and upper limits. In the present specification, the term "total solids" refers to the total amount of all components of a composition excluding the solvent. In the present specification, "(meth)acrylate" refers to either or both of acrylate and methacrylate, "(meth)acrylic" refers to either or both of acrylic and methacrylic, "(meth)allyl" refers to either or both of allyl and methallyl, and "(meth)acryloyl" refers to either or both of acryloyl and methacryloyl. In this specification, the term "process" does not only mean an independent process, but also includes a process that cannot be clearly distinguished from other processes as long as the intended effect of the process is achieved. In this specification, the weight average molecular weight (Mw) and number average molecular weight (Mn) are defined as values ​​measured by gel permeation chromatography (GPC) in terms of polystyrene.

[0010] <Thermosetting composition> The thermosetting composition of the present invention is characterized by containing an ultraviolet absorber containing at least one compound A selected from the group consisting of compounds represented by formula (1) and compounds represented by formula (2), a thermosetting compound, and at least one thermosetting auxiliary selected from the group consisting of a thermal polymerization initiator and a polymerization catalyst.

[0011] The compound represented by formula (1) and the compound represented by formula (2) have high solubility in organic solvents, and therefore can prevent precipitation of these compounds on the surface of a cured product obtained using the thermosetting composition of the present invention. Furthermore, the compound represented by formula (1) and the compound represented by formula (2) have excellent thermal stability and are also highly stable against radicals and peroxides, and therefore can prevent decomposition and denaturation during curing of the thermosetting composition. Therefore, by using the thermosetting composition of the present invention, a cured product with minimal coloration and reduced haze can be produced.

[0012] Furthermore, by using the thermosetting composition of the present invention, a cured product having excellent solvent resistance can be obtained. The reason for such effects is presumed to be that the compound represented by formula (1) and the compound represented by formula (2) have high compatibility with the thermosetting compound and are unlikely to inhibit the thermal curing of the thermosetting compound.

[0013] Furthermore, the compound represented by formula (1) and the compound represented by formula (2) have excellent absorption performance for light with a wavelength of around 400 nm, and by using the thermosetting composition of the present invention, a cured product with excellent shielding performance for light with a wavelength of around 400 nm can be produced.

[0014] Each component contained in the thermosetting composition will be described below.

[0015] <<Ultraviolet Absorber>> The thermosetting composition of the present invention contains an ultraviolet absorber. The ultraviolet absorber contains at least one compound A (hereinafter also referred to as a specific compound) selected from the group consisting of compounds represented by formula (1) and compounds represented by formula (2). In formula (1), R １ and R ２ each independently represents a hydrogen atom, an alkyl group, an aryl group, an acyl group, a carbamoyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, or an ethylenically unsaturated bond-containing group; R ３ and R ４each independently represents a hydrogen atom, a halogen atom, an alkyl group, an aryl group, an alkoxy group, an aryloxy group, an acyloxy group, an alkylamino group, an anilino group, an acylamino group, an alkylsulfonylamino group, an arylsulfonylamino group, an alkylthio group, an arylthio group, or an ethylenically unsaturated bond-containing group; R ５ and R ６ each independently represents a hydrogen atom, an alkyl group having two or more carbon atoms, an aralkyl group, an aryl group, a heterocyclic group, or an ethylenically unsaturated bond-containing group; R １ and R ３ may be bonded to form a ring, R ３ and R ４ may be bonded to form a ring, R ２ and R ４ may be bonded to form a ring, R ５ and R ６ may be bonded to form a ring; １１ and R １２ each independently represents a hydrogen atom, an alkyl group, an aryl group, an acyl group, a carbamoyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, or an ethylenically unsaturated bond-containing group; Q １ represents a group represented by formula (Q-1), ２ is =O, =S, =NR ｑ１ or =CR ｑ２ R ｑ３ represents R ｑ１ ~R ｑ３ each independently represents a hydrogen atom or a substituent, R ｑ２ and R ｑ３ may be bonded to each other to form a ring; In formula (Q-1), * represents a bond, R １０１ and R １０２ each independently represents a hydrogen atom, an alkyl group, an aralkyl group, an aryl group, a heterocyclic group, or an ethylenically unsaturated bond-containing group.

[0016] First, the compound represented by formula (1) will be described.

[0017] -R １ and R２ Regarding - R in formula (1) １ and R ２ each independently represents a hydrogen atom, an alkyl group, an aryl group, an acyl group, a carbamoyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, or an ethylenically unsaturated bond-containing group.

[0018] R １ and R ２ The alkyl group represented by is preferably an alkyl group having 1 to 30 carbon atoms, more preferably an alkyl group having 1 to 20 carbon atoms, further preferably an alkyl group having 1 to 15 carbon atoms, and particularly preferably an alkyl group having 1 to 10 carbon atoms. The alkyl group may be linear, branched, or cyclic, but is preferably a linear or branched alkyl group. The alkyl group may have a substituent. Examples of the substituent include the groups listed as substituent T described below.

[0019] R １ and R ２ The aryl group represented by is preferably an aryl group having 6 to 30 carbon atoms, and more preferably an aryl group having 6 to 10 carbon atoms. The aryl group may have a substituent. Examples of the substituent include the groups listed as the substituent T described below.

[0020] R １ and R ２ The acyl group represented by is preferably an acyl group having 2 to 30 carbon atoms. The acyl group may have a substituent. Examples of the substituent include the groups listed as the substituent T described below.

[0021] R １ and R ２ The carbamoyl group represented by is preferably a carbamoyl group having 1 to 30 carbon atoms. The carbamoyl group may have a substituent. Examples of the substituent include the groups listed as the substituent T described below.

[0022] R １ and R ２The alkoxycarbonyl group represented by the formula (I) includes an alkoxycarbonyl group having 2 to 30 carbon atoms. The alkoxycarbonyl group may have a substituent. Examples of the substituent include the groups listed as the substituent T described below.

[0023] R １ and R ２ The aryloxycarbonyl group represented by the formula (I) includes an aryloxycarbonyl group having 7 to 30 carbon atoms. The aryloxycarbonyl group may have a substituent. Examples of the substituent include the groups exemplified as the substituent T described below.

[0024] R １ and R ２ Examples of the ethylenically unsaturated bond-containing group represented by formula (R100) include a vinyl group, a (meth)allyl group, a (meth)acryloyl group, a (meth)acryloyloxy group, a (meth)acryloylamino group, a vinylphenyl group, and a group represented by formula (R100).

[0025] *-X Ｒ１ -Y Ｒ１ -Z Ｒ１ ... (R100)

[0026] In formula (R100), X Ｒ１ is a single bond, -C(=O)- ＊１ , —C(═O)O— ＊１ or -C(=O)NRx １ - ＊１ represents Rx １ represents a hydrogen atom, an alkyl group or an aryl group, ＊１ Is Y Ｒ１ represents a bond with Y Ｒ１ represents a single bond or a divalent linking group; Z Ｒ１ represents a vinyl group, a (meth)allyl group, a (meth)acryloyl group, a (meth)acryloyloxy group, a (meth)acryloylamino group, or a vinylphenyl group.

[0027] Rx １The alkyl group represented by is preferably an alkyl group having 1 to 30 carbon atoms, more preferably an alkyl group having 1 to 20 carbon atoms, further preferably an alkyl group having 1 to 15 carbon atoms, and particularly preferably an alkyl group having 1 to 10 carbon atoms. The alkyl group may be linear, branched, or cyclic, but is preferably a linear or branched alkyl group. １ The aryl group represented by is preferably an aryl group having 6 to 30 carbon atoms, and more preferably an aryl group having 6 to 10 carbon atoms.

[0028] X Ｒ１ is -C(=O)NH- ＊１ It is preferable that:

[0029] Y Ｒ１ The divalent linking group represented by is a hydrocarbon group, -NH-, -S(=O) ２ Examples of the hydrocarbon group include -, -O-, -C(=O)-, -OC(=O)-, -C(=O)O-, -NHC(=O)-, -C(=O)NH-, and groups formed by combining two or more of these. Examples of the hydrocarbon group include an aliphatic hydrocarbon group and an aromatic hydrocarbon group, with an aliphatic hydrocarbon group being preferred. The aliphatic hydrocarbon group preferably has 1 to 30 carbon atoms, more preferably 1 to 20, and even more preferably 1 to 15. The aliphatic hydrocarbon group may be linear, branched, or cyclic. The cyclic aliphatic hydrocarbon group may be a monocyclic or fused ring. The cyclic aliphatic hydrocarbon group may have a crosslinked structure. The aromatic hydrocarbon group preferably has 6 to 30 carbon atoms, more preferably 6 to 20, and even more preferably 6 to 10. The hydrocarbon group may have a substituent. Examples of the substituent include the substituent T described below. For example, the substituent may be a hydroxy group. Y Ｒ１ The divalent linking group represented by is preferably a hydrocarbon group or a group in which two or more hydrocarbon groups are linked by a single bond or a divalent linking group. Examples of the linking group linking two or more hydrocarbon groups include -NH-, -S(=O) ２-, -O-, -C(=O)-, -OC(=O)-, -C(=O)O-, -NHC(=O)- and -C(=O)NH- are mentioned, and -O-, -C(=O)-, -OC(=O)-, -C(=O)O-, -NHC(=O)- or -C(=O)NH- is preferred.

[0030] Z Ｒ１ is preferably a (meth)acryloyloxy group or a vinylphenyl group, and more preferably a (meth)acryloyloxy group.

[0031] R in formula (1) １ and R ２ are preferably each independently an alkyl group, an acyl group, a carbamoyl group or an ethylenically unsaturated bond-containing group.

[0032] R １ and R ２ However, when each of them is independently an alkyl group, it is excellent in terms of ultraviolet shielding ability.

[0033] R １ and R ２ are each independently an acyl group or a carbamoyl group, the compound is excellent in terms of light resistance.

[0034] R １ and R ２ are each independently an ethylenically unsaturated bond-containing group, the solvent resistance of the resulting cured product can be further improved.

[0035] -R ３ and R ４ Regarding - R in formula (1) ３ and R ４ each independently represents a hydrogen atom, a halogen atom, an alkyl group, an aryl group, an alkoxy group, an aryloxy group, an acyloxy group, an alkylamino group, an anilino group, an acylamino group, an alkylsulfonylamino group, an arylsulfonylamino group, an alkylthio group, an arylthio group, or an ethylenically unsaturated bond-containing group.

[0036] R ３ and R ４The halogen atom represented by the formula (I) includes a fluorine atom, a chlorine atom and a bromine atom.

[0037] R ３ and R ４ The alkyl group represented by is preferably an alkyl group having 1 to 30 carbon atoms, more preferably an alkyl group having 1 to 10 carbon atoms, even more preferably an alkyl group having 1 to 5 carbon atoms, still more preferably an alkyl group having 1 or 2 carbon atoms, and particularly preferably a methyl group. The alkyl group is preferably a linear or branched alkyl group, more preferably a linear alkyl group. The alkyl group may have a substituent. Examples of the substituent include the groups listed as the substituent T described below.

[0038] R ３ and R ４ The aryl group represented by is preferably an aryl group having 6 to 30 carbon atoms, and more preferably an aryl group having 6 to 10 carbon atoms. The aryl group may have a substituent. Examples of the substituent include the groups listed as the substituent T described below.

[0039] R ３ and R ４ The alkoxy group represented by is preferably an alkoxy group having 1 to 30 carbon atoms. The alkoxy group may have a substituent. Examples of the substituent include the groups listed as the substituent T described below.

[0040] R ３ and R ４ The aryloxy group represented by is preferably an aryloxy group having 6 to 30 carbon atoms. The aryloxy group may have a substituent. Examples of the substituent include the groups exemplified as the substituent T described below.

[0041] R ３ and R ４ The acyloxy group represented by is preferably an acyloxy group having 2 to 30 carbon atoms. The acyloxy group may have a substituent. Examples of the substituent include the groups exemplified as the substituent T described below.

[0042] R ３ and R ４The alkylamino group represented by is preferably an alkylamino group having 1 to 30 carbon atoms. The alkylamino group may have a substituent. Examples of the substituent include the groups listed as the substituent T described below.

[0043] R ３ and R ４ The anilino group represented by is preferably an anilino group having 6 to 40 carbon atoms, more preferably an anilino group having 6 to 30 carbon atoms, still more preferably an anilino group having 6 to 20 carbon atoms, particularly preferably an anilino group having 6 to 15 carbon atoms, and most preferably an anilino group having 6 to 12 carbon atoms. The anilino group may have a substituent. Examples of the substituent include the groups explained for the substituent T below.

[0044] R ３ and R ４ The acylamino group represented by is preferably an acylamino group having 2 to 30 carbon atoms, more preferably an acylamino group having 2 to 20 carbon atoms, still more preferably an acylamino group having 2 to 15 carbon atoms, and particularly preferably an acylamino group having 2 to 10 carbon atoms. The acylamino group may have a substituent. Examples of the substituent include the groups explained for the substituent T below.

[0045] R ３ and R ４ The alkylsulfonylamino group represented by is preferably an alkylsulfonylamino group having 2 to 30 carbon atoms, more preferably an alkylsulfonylamino group having 2 to 20 carbon atoms, still more preferably an alkylsulfonylamino group having 2 to 15 carbon atoms, and particularly preferably an alkylsulfonylamino group having 2 to 10 carbon atoms. The alkylsulfonylamino group may have a substituent. Examples of the substituent include the groups explained for the substituent T described below.

[0046] R ３ and R ４The arylsulfonylamino group represented by is preferably an arylsulfonylamino group having 6 to 40 carbon atoms, more preferably an arylsulfonylamino group having 6 to 30 carbon atoms, still more preferably an arylsulfonylamino group having 6 to 20 carbon atoms, particularly preferably an arylsulfonylamino group having 6 to 15 carbon atoms, and most preferably an arylsulfonylamino group having 6 to 12 carbon atoms. The arylsulfonylamino group may have a substituent. Examples of the substituent include the groups described below for the substituent T.

[0047] R ３ and R ４ The alkylthio group represented by is preferably an alkylthio group having 1 to 30 carbon atoms, more preferably an alkylthio group having 1 to 20 carbon atoms, even more preferably an alkylthio group having 1 to 15 carbon atoms, particularly preferably an alkylthio group having 1 to 10 carbon atoms, and most preferably an alkylthio group having 1 to 8 carbon atoms. The alkylthio group may be either linear or branched. The alkylthio group may have a substituent. Examples of the substituent include the groups explained for the substituent T below.

[0048] R ３ and R ４ The arylthio group represented by is preferably an arylthio group having 6 to 40 carbon atoms, more preferably an arylthio group having 6 to 30 carbon atoms, even more preferably an arylthio group having 6 to 20 carbon atoms, particularly preferably an arylthio group having 6 to 15 carbon atoms, and most preferably an arylthio group having 6 to 12 carbon atoms. The arylthio group may have a substituent. Examples of the substituent include the groups described below for the substituent T.

[0049] R ３ and R ４ The ethylenically unsaturated bond-containing group represented by R １ and R ２ Examples of the ethylenically unsaturated bond-containing group include the groups represented by the formula:

[0050] R ３ and R ４At least one of R is preferably a halogen atom, an alkyl group, an aryl group, an alkoxy group, an aryloxy group, an acyloxy group, an alkylamino group, an anilino group, an acylamino group, an alkylsulfonylamino group, an arylsulfonylamino group, an alkylthio group, an arylthio group, or an ethylenically unsaturated bond-containing group. ３ and R ４ It is preferred that one of R is a hydrogen atom and the other is a halogen atom, an alkyl group, an aryl group, an alkoxy group, an aryloxy group, an acyloxy group, an alkylamino group, an anilino group, an acylamino group, an alkylsulfonylamino group, an arylsulfonylamino group, an alkylthio group, an arylthio group or an ethylenically unsaturated bond-containing group, ３ and R ４ It is more preferable that one of R is a hydrogen atom and the other is an alkyl group. ３ and R ４ It is particularly preferred that one of these is a hydrogen atom and the other is a methyl group.

[0051] R in formula (1) １ and R ３ may be bonded to form a ring, and R ３ and R ４ may be bonded to form a ring, and R ２ and R ４ may be bonded to form a ring. The ring formed by bonding these groups is preferably a 5- or 6-membered ring. The ring formed may have a substituent. Examples of the substituent include the groups explained below for the substituent T.

[0052] -R ５ and R ６ Regarding - R in formula (1) ５ and R ６ each independently represents a hydrogen atom, an alkyl group having two or more carbon atoms, an aralkyl group, an aryl group, a heterocyclic group, or an ethylenically unsaturated bond-containing group.

[0053] R ５ and R ６The alkyl group represented by is an alkyl group having 2 or more carbon atoms, preferably an alkyl group having 3 or more carbon atoms, and more preferably an alkyl group having 4 or more carbon atoms. The number of carbon atoms in the alkyl group is preferably 30 or less, more preferably 20 or less, even more preferably 15 or less, still more preferably 10 or less, and particularly preferably 8 or less. The alkyl group may be linear, branched, or cyclic, and is preferably linear or branched. The alkyl group may have a substituent. Examples of the substituent include the groups described below for the substituent T.

[0054] R ５ and R ６ The number of carbon atoms in the alkyl portion of the aralkyl group represented by is preferably 1 to 10, more preferably 1 to 5, and even more preferably 1 to 3. The number of carbon atoms in the aryl portion of the aralkyl group is preferably 6 to 30, more preferably 6 to 20, even more preferably 6 to 15, particularly preferably 6 to 10, and most preferably 6 to 8. The aralkyl group may have a substituent. Examples of the substituent include the groups explained in the description of the substituent T below. Specific examples of the aralkyl group include a benzyl group.

[0055] R ５ and R ６ The aryl group represented by is preferably an aryl group having 6 to 40 carbon atoms, more preferably an aryl group having 6 to 30 carbon atoms, even more preferably an aryl group having 6 to 20 carbon atoms, particularly preferably an aryl group having 6 to 15 carbon atoms, and most preferably an aryl group having 6 to 12 carbon atoms. The aryl group is preferably a phenyl group or a naphthyl group, more preferably a phenyl group. The aryl group may have a substituent. Examples of the substituent include the groups described below for the substituent T.

[0056] R ５ and R ６The heterocyclic ring in the heterocyclic group represented by the formula (I) preferably contains a 5- or 6-membered saturated or unsaturated heterocyclic ring. An aliphatic ring, an aromatic ring, or another heterocyclic ring may be condensed with the heterocyclic ring. Heteroatoms constituting the heterocyclic ring include B, N, O, S, Se, and Te, with N, O, and S being preferred. It is preferred that the carbon atom in the heterocyclic ring has a free valence (monovalent) (the heterocyclic group is bonded at a carbon atom). The number of carbon atoms in the heterocyclic group is preferably 1 to 40, more preferably 1 to 30, and even more preferably 1 to 20. Examples of saturated heterocyclic rings in the heterocyclic group include a pyrrolidine ring, a morpholine ring, a 2-bora-1,3-dioxolane ring, and a 1,3-thiazolidine ring. Examples of unsaturated heterocyclic rings in the heterocyclic group include an imidazole ring, a thiazole ring, a benzothiazole ring, a benzoxazole ring, a benzotriazole ring, a benzoselenazole ring, a pyridine ring, a pyrimidine ring, and a quinoline ring. The heterocyclic group may have a substituent. Examples of the substituent include the groups described below for the substituent T.

[0057] R ５ and R ６ The ethylenically unsaturated bond-containing group represented by R １ and R ２ Examples of the ethylenically unsaturated bond-containing group include the groups represented by the formula:

[0058] R in formula (1) ５ and R ６ may be bonded to form a ring. The ring formed by bonding these groups is preferably a 5- or 6-membered ring. Specific examples of the ring include a hexahydropyridazine ring, a tetrahydropyridazine ring, and a tetrahydrophthalazine ring. The ring formed may have a substituent. Examples of the substituent include the groups explained in the description of the substituent T below.

[0059] R in formula (1) ５ and R ６are each independently preferably an alkyl group, an aralkyl group, or an aryl group having 2 or more carbon atoms, more preferably an alkyl group or aralkyl group having 2 or more carbon atoms, and even more preferably an alkyl group or aralkyl group having 4 or more carbon atoms.

[0060] Next, the compound represented by formula (2) will be described.

[0061] -R １１ and R １２ Regarding - R in formula (2) １１ and R １２ each independently represents a hydrogen atom, an alkyl group, an aryl group, an acyl group, a carbamoyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, or an ethylenically unsaturated bond-containing group.

[0062] R in formula (2) １１ and R １２ The alkyl group, aryl group, acyl group, carbamoyl group, alkoxycarbonyl group, aryloxycarbonyl group and ethylenically unsaturated bond-containing group represented by R in formula (1) are １ and R ２ The preferred ranges are also the same as those described above.

[0063] R in formula (2) １１ and R １２ are preferably each independently an alkyl group, an acyl group, a carbamoyl group or an ethylenically unsaturated bond-containing group.

[0064] R １１ and R １２ However, when each of them is independently an alkyl group, it is excellent in terms of ultraviolet shielding ability.

[0065] R １１ and R １２ are each independently an acyl group or a carbamoyl group, the compound is excellent in terms of light resistance.

[0066] R １１ and R １２ are each independently an ethylenically unsaturated bond-containing group, the solvent resistance of the resulting cured product can be further improved.

[0067] -Q １ Regarding - Q in equation (2) １ represents a group represented by formula (Q-1). R in formula (Q-1) １０１ and R １０２ each independently represents a hydrogen atom, an alkyl group, an aralkyl group, an aryl group, a heterocyclic group, or an ethylenically unsaturated bond-containing group.

[0068] R １０１ and R １０２ The number of carbon atoms in the alkyl group represented by is preferably 1 to 30. The upper limit is preferably 20 or less, more preferably 15 or less, even more preferably 10 or less, and even more preferably 8 or less. The lower limit is preferably 2 or more, more preferably 3 or more. The alkyl group may be linear, branched, or cyclic, and is preferably linear or branched. The alkyl group may have a substituent. Examples of the substituent include the groups described below for the substituent T.

[0069] R １０１ and R １０２ The number of carbon atoms in the alkyl portion of the aralkyl group represented by is preferably 1 to 10, more preferably 1 to 5, and still more preferably 1 to 3. The number of carbon atoms in the aryl portion of the aralkyl group is preferably 6 to 30, more preferably 6 to 20, still more preferably 6 to 15, particularly preferably 6 to 10, and most preferably 6 to 8. The aralkyl group may have a substituent. Examples of the substituent include the groups described below for the substituent T.

[0070] R １０１ and R １０２ The number of carbon atoms in the aryl group represented by is preferably 6 to 30, more preferably 6 to 20, still more preferably 6 to 15, particularly preferably 6 to 10, and most preferably 6 to 8. The aryl group may have a substituent. Examples of the substituent include the groups described below for the substituent T.

[0071] R １０１ and R １０２The heterocyclic ring in the heterocyclic group represented by the formula (I) preferably contains a 5- or 6-membered saturated or unsaturated heterocyclic ring. An aliphatic ring, an aromatic ring, or another heterocyclic ring may be condensed with the heterocyclic ring. Heteroatoms constituting the heterocyclic ring include B, N, O, S, Se, and Te, with N, O, and S being preferred. It is preferred that the carbon atom in the heterocyclic ring has a free valence (monovalent) (the heterocyclic group is bonded at a carbon atom). The number of carbon atoms in the heterocyclic group is preferably 1 to 40, more preferably 1 to 30, and even more preferably 1 to 20. Examples of saturated heterocyclic rings in the heterocyclic group include a pyrrolidine ring, a morpholine ring, a 2-bora-1,3-dioxolane ring, and a 1,3-thiazolidine ring. Examples of unsaturated heterocyclic rings in the heterocyclic group include an imidazole ring, a thiazole ring, a benzothiazole ring, a benzoxazole ring, a benzotriazole ring, a benzoselenazole ring, a pyridine ring, a pyrimidine ring, and a quinoline ring. The heterocyclic group may have a substituent. Examples of the substituent include the groups described below for the substituent T.

[0072] R １０１ and R １０２ The ethylenically unsaturated bond-containing group represented by R １ and R ２ Examples of the ethylenically unsaturated bond-containing group include the groups represented by the formula:

[0073] R in formula (Q-1) １０１ and R １０２ are each independently preferably an alkyl group, an aralkyl group, or an aryl group, more preferably an alkyl group or an aralkyl group, and even more preferably an aralkyl group.

[0074] -Q ２ Regarding - Q in equation (2) ２ is =O, =S, =NR ｑ１ or =CR ｑ２ R ｑ３ represents R ｑ１ ~R ｑ３ each independently represents a hydrogen atom or a substituent, R ｑ２ and R ｑ３ may be bonded to each other to form a ring.

[0075] R ｑ１ ~R ｑ３ Examples of the substituent represented by include a cyano group, a carbamoyl group, a sulfamoyl group, a nitro group, an acyl group, an alkylsulfonyl group, an arylsulfonyl group, an alkylsulfinyl group, an arylsulfinyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, an alkyl group, an aryl group, and a heterocyclic group. These groups may further have a substituent. Examples of the substituent include the groups listed as the substituent T described below.

[0076] The carbamoyl group includes carbamoyl groups having 1 to 10 carbon atoms, preferably carbamoyl groups having 2 to 8 carbon atoms, and more preferably carbamoyl groups having 2 to 5 carbon atoms.

[0077] The sulfamoyl group includes sulfamoyl groups having 0 to 10 carbon atoms, preferably sulfamoyl groups having 2 to 8 carbon atoms, and more preferably sulfamoyl groups having 2 to 5 carbon atoms.

[0078] The acyl group includes an acyl group having 1 to 20 carbon atoms, preferably an acyl group having 1 to 12 carbon atoms, and more preferably an acyl group having 1 to 8 carbon atoms.

[0079] The alkylsulfonyl group includes alkylsulfonyl groups having 1 to 20 carbon atoms, preferably alkylsulfonyl groups having 1 to 10 carbon atoms, and more preferably alkylsulfonyl groups having 1 to 8 carbon atoms.

[0080] The arylsulfonyl group includes an arylsulfonyl group having 6 to 20 carbon atoms, and an arylsulfonyl group having 6 to 10 carbon atoms is preferred.

[0081] The alkylsulfinyl group includes alkylsulfinyl groups having 1 to 20 carbon atoms, preferably alkylsulfinyl groups having 1 to 10 carbon atoms, and more preferably alkylsulfinyl groups having 1 to 8 carbon atoms.

[0082] The arylsulfinyl group includes an arylsulfinyl group having 6 to 20 carbon atoms, and an arylsulfinyl group having 6 to 10 carbon atoms is preferred.

[0083] The alkoxycarbonyl group includes an alkoxycarbonyl group having 2 to 20 carbon atoms, preferably an alkoxycarbonyl group having 2 to 12 carbon atoms, and more preferably an alkoxycarbonyl group having 2 to 8 carbon atoms.

[0084] The aryloxycarbonyl group includes an aryloxycarbonyl group having 6 to 20 carbon atoms, preferably an aryloxycarbonyl group having 6 to 12 carbon atoms, and more preferably an aryloxycarbonyl group having 6 to 8 carbon atoms.

[0085] The alkyl group may be an alkyl group having 1 to 18 carbon atoms, preferably an alkyl group having 1 to 10 carbon atoms, and more preferably an alkyl group having 1 to 5 carbon atoms.

[0086] The aryl group may be an aryl group having 6 to 20 carbon atoms, preferably an aryl group having 6 to 15 carbon atoms, and more preferably an aryl group having 6 to 10 carbon atoms.

[0087] The heterocycle in the heterocyclic group preferably contains a 5- or 6-membered saturated or unsaturated heterocycle. An aliphatic ring, an aromatic ring, or another heterocycle may be condensed with the heterocycle. Heteroatoms constituting the heterocycle include B, N, O, S, Se, and Te, with N, O, and S being preferred. It is preferred that the carbon atoms in the heterocycle have a free valence (monovalent) (the heterocyclic group is bonded at a carbon atom). The number of carbon atoms in the preferred heterocyclic group is 1 to 40, more preferably 1 to 30, and even more preferably 1 to 20.

[0088] Q in equation (2) ２ is used because the effect of the present invention is more pronounced. ｑ２ R ｑ３ It is preferable that R ｑ２ and R ｑ３ At least one of R is preferably an electron-withdrawing group, ｑ２and R ｑ３ More preferably, is an electron-withdrawing group.

[0089] Examples of electron-withdrawing groups include substituents with a Hammett's substituent constant σp value of 0.2 or greater. The Hammett's substituent constant σ value will now be explained. Hammett's rule is an empirical rule proposed by L. P. Hammett in 1935 to quantitatively discuss the influence of substituents on the reaction or equilibrium of benzene derivatives, and is now widely recognized as valid. The substituent constants determined by Hammett's rule include σp and σm values, and these values ​​can be found in many general textbooks. For example, detailed information is provided in J. A. Dean, ed., "Lange's Handbook of Chemistry," 12th Edition, 1979 (McGraw-Hill); "Chemical Domain" Special Edition, No. 122, pp. 96-103, 1979 (Nankodo); and Chem. Rev., Vol. 91, pp. 165-195, 1991. In this specification, a substituent having a Hammett's substituent constant σp value of 0.2 or more indicates an electron-withdrawing group. The electron-withdrawing group is preferably a group having a Hammett's substituent constant σp value of 0.25 or more, more preferably a group having a Hammett's substituent constant σp value of 0.3 or more, and even more preferably a group having a Hammett's substituent constant σp value of 0.35 or more.

[0090] Specific examples of groups having a Hammett's substituent constant σp value of 0.2 or more include a cyano group (σp value = 0.66), a carboxyl group (-COOH: σp value = 0.45), an alkoxycarbonyl group (-COOMe: σp value = 0.45), an aryloxycarbonyl group (-COOPh: σp value = 0.44), a carbamoyl group (-CONH ２ : σp value = 0.36), alkylcarbonyl group (-COMe: σp value = 0.50), arylcarbonyl group (-COPh: σp value = 0.43), alkylsulfonyl group (-SO ２ Me: σp value = 0.72), and an arylsulfonyl group (—SO ２ Ph: σp value = 0.68). Me represents a methyl group, and Ph represents a phenyl group. The values ​​in parentheses are the σp values ​​of representative substituents, excerpted from Chem. Rev., 1991, Vol. 91, pp. 165-195.

[0091] R ｑ２ and R ｑ３ are each preferably independently a hydrogen atom, a cyano group, a carbamoyl group, a sulfamoyl group, an acyl group, an alkylsulfonyl group, an arylsulfonyl group, an alkylsulfinyl group, an arylsulfinyl group, a nitro group, an alkoxycarbonyl group, or an aryloxycarbonyl group. ｑ２ and R ｑ３ At least one of R is preferably a cyano group, an alkoxycarbonyl group, a nitro group, or an alkylsulfonyl group, and more preferably a cyano group. ｑ２ and R ｑ３ is preferably a cyano group and the other is preferably a cyano group, a carbamoyl group, a sulfamoyl group, an acyl group, an alkylsulfonyl group, an arylsulfonyl group, an alkylsulfinyl group, an arylsulfinyl group, a nitro group, an alkoxycarbonyl group, or an aryloxycarbonyl group, ｑ２ and R ｑ３ It is more preferable that one of R is a cyano group and the other is a cyano group, a carbamoyl group, a sulfamoyl group, an acyl group, an alkylsulfonyl group, an arylsulfonyl group, an alkylsulfinyl group, an arylsulfinyl group, an alkoxycarbonyl group, or an aryloxycarbonyl group, ｑ２ and R ｑ３ It is more preferred that one of R is a cyano group and the other is a cyano group or an alkoxycarbonyl group. ｑ２ and R ｑ３ In another preferred embodiment, R ｑ２ or R ｑ３ An embodiment in which one of the groups is a cyano group and the other is an alkoxycarbonyl group is exemplified.

[0092] =CR ｑ２ R ｑ３ R ｑ２ and R ｑ３may be bonded to each other to form a ring. Examples of the ring formed include a cyclopropane ring, a cyclobutane ring, a cyclopentane ring, a cyclohexane ring, a cycloheptane ring, a pyrrolidine ring, a tetrahydrofuran ring, a tetrahydrothiophene ring, an oxazoline ring, a thiazoline ring, a pyrroline ring, a pyrazoline ring, an imidazoline ring, an imidazolidine ring, a piperidine ring, a piperazine ring, a pyran ring, and a pyrazolidine ring. These may have a substituent at any position.

[0093] CR ｑ２ R ｑ３ R ｑ２ and R ｑ３ When they are bonded to each other to form a ring, the ring formed is preferably a ring other than the structure represented by formula (Q-1), because the effects of the present invention are more pronounced.

[0094] The effect of the present invention is more significantly exhibited by h, Q in formula (2) ２ Is, Q １ It is preferable that Q is a group having a structure different from that of ２ is =O, =S, =NR ｑ１ or =CR ｑ２ R ｑ３ represents R ｑ２ and R ｑ３ When they are bonded to form a ring, =CR ｑ２ R ｑ３ Is Q １ It is preferable that the structure is not the same as that of the compound "R ｑ２ and R ｑ３ When they are bonded to form a ring, =CR ｑ２ R ｑ３ Is Q １ The phrase "is not the same structure as Rq in formula (Q-1)" refers not only to the case where a ring other than the structure represented by formula (Q-1) is formed, but also to the case where a ring other than the structure represented by formula (Q-1) is formed, but Rq in formula (Q-1) is not the same structure as Rq in formula (Q-1) １ and Rq ２ The type of １ This also includes cases where a ring having a structure that is a different type of group from the above is formed.

[0095] (Substituent T) Examples of the substituent T include the following groups: halogen atoms (for example, chlorine atoms, bromine atoms, and iodine atoms); alkyl groups [linear, branched, and cyclic alkyl groups; Specifically, it includes linear or branched alkyl groups (preferably linear or branched alkyl groups having 1 to 30 carbon atoms, such as methyl, ethyl, n-propyl, isopropyl, t-butyl, n-octyl, eicosyl, 2-chloroethyl, 2-cyanoethyl, and 2-ethylhexyl), cycloalkyl groups (preferably cycloalkyl groups having 3 to 30 carbon atoms, such as cyclohexyl, cyclopentyl, and 4-n-dodecylcyclohexyl), bicycloalkyl groups (preferably bicycloalkyl groups having 5 to 30 carbon atoms, i.e., monovalent groups obtained by removing one hydrogen atom from a bicycloalkane having 5 to 30 carbon atoms, such as bicyclo[1,2,2]heptan-2-yl and bicyclo[2,2,2]octan-3-yl), and tricyclo structures having more ring structures. The alkyl groups in the substituents described below (such as the alkyl group of an alkylthio group) also represent alkyl groups within this concept. alkenyl groups [linear, branched, and cyclic alkenyl groups. Specifically, these include linear or branched alkenyl groups (preferably linear or branched alkenyl groups having 2 to 30 carbon atoms, such as vinyl, allyl, prenyl, geranyl, and oleyl), cycloalkenyl groups (preferably cycloalkenyl groups having 3 to 30 carbon atoms, i.e., monovalent groups obtained by removing one hydrogen atom from a cycloalkene having 3 to 30 carbon atoms, such as 2-cyclopenten-1-yl and 2-cyclohexen-1-yl), and bicycloalkenyl groups (preferably bicycloalkenyl groups having 5 to 30 carbon atoms, i.e., monovalent groups obtained by removing one hydrogen atom from a bicycloalkene having one double bond, such as bicyclo[2,2,1]hept-2-en-1-yl and bicyclo[2,2,2]oct-2-en-4-yl). an alkynyl group (preferably a linear or branched alkynyl group having 2 to 30 carbon atoms, for example, an ethynyl group or a propargyl group);

[0096] an aryl group (preferably an aryl group having 6 to 30 carbon atoms, for example, a phenyl group, a p-tolyl group, a naphthyl group, a m-chlorophenyl group, or an o-hexadecanoylaminophenyl group); a heterocyclic group (preferably a monovalent group obtained by removing one hydrogen atom from a 5- or 6-membered aromatic or non-aromatic heterocyclic compound, more preferably a 5- or 6-membered aromatic heterocyclic group having 1 to 20 carbon atoms, for example, a 2-furyl group, a 2-thienyl group, a 2-pyrimidinyl group, or a 2-benzothiazolyl group); a cyano group; a hydroxy group; a nitro group; a carboxyl group; an alkoxy group (preferably a straight-chain or branched alkoxy group having 1 to 30 carbon atoms, for example, a methoxy group, an ethoxy group, an isopropoxy group, a t-butoxy group, an n-octyloxy group, or a 2-methoxyethoxy group); an aryloxy group (preferably an aryloxy group having 6 to 30 carbon atoms, for example, a phenoxy group, a 2-methylphenoxy group, a 4-t-butylphenoxy group, a 3-nitrophenoxy group, or a 2-tetradecanoylaminophenoxy group); a heterocyclic oxy group (preferably a heterocyclic oxy group having 2 to 30 carbon atoms, for example, a 1-phenyltetrazole-5-oxy group or a 2-tetrahydropyranyloxy group); an acyloxy group (preferably a formyloxy group, an alkylcarbonyloxy group having 2 to 30 carbon atoms, or an arylcarbonyloxy group having 6 to 30 carbon atoms, for example, a formyloxy group, an acetyloxy group, a pivaloyloxy group, a stearoyloxy group, a benzoyloxy group, or a p-methoxyphenylcarbonyloxy group);

[0097] a carbamoyloxy group (preferably a carbamoyloxy group having 1 to 30 carbon atoms, for example, an N,N-dimethylcarbamoyloxy group, an N,N-diethylcarbamoyloxy group, a morpholinocarbonyloxy group, an N,N-di-n-octylaminocarbonyloxy group, or an N-n-octylcarbamoyloxy group); an alkoxycarbonyloxy group (preferably an alkoxycarbonyloxy group having 2 to 30 carbon atoms, for example, a methoxycarbonyloxy group, an ethoxycarbonyloxy group, a t-butoxycarbonyloxy group, or an n-octylcarbonyloxy group); an aryloxycarbonyloxy group (preferably an aryloxycarbonyloxy group having 7 to 30 carbon atoms, for example, a phenoxycarbonyloxy group, a p-methoxyphenoxycarbonyloxy group, or a p-n-hexadecyloxyphenoxycarbonyloxy group); an amino group (preferably, an amino group, an alkylamino group having 1 to 30 carbon atoms, or an anilino group having 6 to 30 carbon atoms, for example, an amino group, a methylamino group, a dimethylamino group, an anilino group, an N-methyl-anilino group, or a diphenylamino group); an acylamino group (preferably, a formylamino group, an alkylcarbonylamino group having 2 to 30 carbon atoms, or an arylcarbonylamino group having 6 to 30 carbon atoms, for example, a formylamino group, an acetylamino group, a pivaloylamino group, a lauroylamino group, a benzoylamino group, or a 3,4,5-tri-n-octyloxyphenylcarbonylamino group);

[0098] an aminocarbonylamino group (preferably an aminocarbonylamino group having 1 to 30 carbon atoms, for example, a carbamoylamino group, an N,N-dimethylaminocarbonylamino group, an N,N-diethylaminocarbonylamino group, or a morpholinocarbonylamino group); an alkoxycarbonylamino group (preferably an alkoxycarbonylamino group having 2 to 30 carbon atoms, for example, a methoxycarbonylamino group, an ethoxycarbonylamino group, a t-butoxycarbonylamino group, an n-octadecyloxycarbonylamino group, or an N-methylmethoxycarbonylamino group); an aryloxycarbonylamino group (preferably an aryloxycarbonylamino group having 7 to 30 carbon atoms, for example, a phenoxycarbonylamino group, a p-chlorophenoxycarbonylamino group, or an m-n-octyloxyphenoxycarbonylamino group); a sulfamoylamino group (preferably a sulfamoylamino group having 0 to 30 carbon atoms, for example, a sulfamoylamino group, an N,N-dimethylaminosulfonylamino group, or an N-n-octylaminosulfonylamino group); an alkyl or arylsulfonylamino group (preferably an alkylsulfonylamino group having 1 to 30 carbon atoms, or an arylsulfonylamino group having 6 to 30 carbon atoms, for example, a methylsulfonylamino group, a butylsulfonylamino group, a phenylsulfonylamino group, a 2,3,5-trichlorophenylsulfonylamino group, or a p-methylphenylsulfonylamino group); a mercapto group; an alkylthio group (preferably an alkylthio group having 1 to 30 carbon atoms, for example, a methylthio group, an ethylthio group, or an n-hexadecylthio group); an arylthio group (preferably an arylthio group having 6 to 30 carbon atoms, for example, a phenylthio group, a p-chlorophenylthio group, or an m-methoxyphenylthio group); a heterocyclic thio group (preferably a heterocyclic thio group having 2 to 30 carbon atoms, for example, a 2-benzothiazolylthio group, a 1-phenyltetrazol-5-ylthio group);

[0099] a sulfamoyl group (preferably a sulfamoyl group having 0 to 30 carbon atoms, for example, an N-ethylsulfamoyl group, an N-(3-dodecyloxypropyl)sulfamoyl group, an N,N-dimethylsulfamoyl group, an N-acetylsulfamoyl group, an N-benzoylsulfamoyl group, or an N-(N'-phenylcarbamoyl)sulfamoyl group); a sulfo group; an alkyl or arylsulfinyl group (preferably an alkylsulfinyl group having 1 to 30 carbon atoms, or an arylsulfinyl group having 6 to 30 carbon atoms, for example, a methylsulfinyl group, an ethylsulfinyl group, a phenylsulfinyl group, or a p-methylphenylsulfinyl group); an alkyl or arylsulfonyl group (preferably an alkylsulfonyl group having 1 to 30 carbon atoms, or an arylsulfonyl group having 6 to 30 carbon atoms, for example, a methylsulfonyl group, an ethylsulfonyl group, a phenylsulfonyl group, or a p-methylphenylsulfonyl group);

[0100] acyl groups (preferably formyl groups, alkylcarbonyl groups having 2 to 30 carbon atoms, arylcarbonyl groups having 7 to 30 carbon atoms, and heterocyclic carbonyl groups having 4 to 30 carbon atoms and bonded to a carbonyl group at a carbon atom, such as acetyl groups, pivaloyl groups, 2-chloroacetyl groups, stearoyl groups, benzoyl groups, p-n-octyloxyphenylcarbonyl groups, 2-pyridylcarbonyl groups, and 2-furylcarbonyl groups); aryloxycarbonyl groups (preferably aryloxycarbonyl groups having 7 to 30 carbon atoms, such as phenoxycarbonyl groups, o-chlorophenoxycarbonyl groups, m-nitrophenoxycarbonyl groups, and p-t-butylphenoxycarbonyl groups); an alkoxycarbonyl group (preferably an alkoxycarbonyl group having 2 to 30 carbon atoms, for example, a methoxycarbonyl group, an ethoxycarbonyl group, a t-butoxycarbonyl group, an n-octadecyloxycarbonyl group, an n-butoxycarbonyl group, or a 2-ethylhexyloxycarbonyl group); a carbamoyl group (preferably a carbamoyl group having 1 to 30 carbon atoms, for example, a carbamoyl group, an N-methylcarbamoyl group, an N,N-dimethylcarbamoyl group, an N,N-di-n-octylcarbamoyl group, or an N-(methylsulfonyl)carbamoyl group); an aryl or heterocyclic azo group (preferably an arylazo group having 6 to 30 carbon atoms, or a heterocyclic azo group having 3 to 30 carbon atoms, for example, a phenylazo group, a p-chlorophenylazo group, or a 5-ethylthio-1,3,4-thiadiazol-2-ylazo group); imido group (preferably, an N-succinimido group, an N-phthalimido group); phosphino group (preferably, a phosphinyl group having 2 to 30 carbon atoms, for example, a dimethylphosphino group, a diphenylphosphino group, or a methylphenoxyphosphino group); phosphinyl group (preferably, a phosphinyl group having 2 to 30 carbon atoms, for example, a phosphinyl group, a dioctyloxyphosphinyl group, or a diethoxyphosphinyl group); phosphinyloxy group (preferably, a phosphinyloxy group having 2 to 30 carbon atoms, for example, a diphenoxyphosphinyloxy group, or a dioctyloxyphosphinyloxy group); phosphinylamino group (preferably, a phosphinylamino group having 2 to 30 carbon atoms.For example, a dimethoxyphosphinylamino group, a dimethylaminophosphinylamino group); an ethylenically unsaturated bond-containing group (for example, a vinyl group, a (meth)allyl group, a (meth)acryloyl group, a (meth)acryloyloxy group, a (meth)acryloylamino group, a vinylphenyl group, etc.).

[0101] Of the groups listed above, in groups having a hydrogen atom, one or more hydrogen atoms may be substituted with the above-mentioned substituent T. Examples of such a substituent include an alkylcarbonylaminosulfonyl group, an arylcarbonylaminosulfonyl group, an alkylsulfonylaminocarbonyl group, and an arylsulfonylaminocarbonyl group. Specific examples include a methylsulfonylaminocarbonyl group, a p-methylphenylsulfonylaminocarbonyl group, an acetylaminosulfonyl group, and a benzoylaminosulfonyl group. In addition, the sulfo group and the carboxyl group may be in the form of an anion through dissociation of the hydrogen atom, or may form a salt. Examples of atoms or atomic groups constituting the salt include alkali metal ions (Li ＋ , Na ＋ , K. ＋ etc.), alkaline earth metal ions (Ca ２＋ , Mg ２＋ etc.), ammonium ions (tetraalkylammonium ions, trialkylammonium ions etc.), imidazolium ions, pyridinium ions (pyridinium ions, N-methylpyridinium ions, N-ethylpyridinium ions etc.), phosphonium ions etc.

[0102] The maximum absorption wavelength of the specific compound is preferably in the wavelength range of 360 to 430 nm, more preferably in the wavelength range of 370 to 420 nm, still more preferably in the wavelength range of 380 to 420 nm, and particularly preferably in the wavelength range of 380 to 410 nm.

[0103] The molar absorption coefficient of the specific compound at its maximum absorption wavelength is preferably 10,000 L / mol cm or more, more preferably 20,000 L / mol cm or more, and even more preferably 30,000 L / mol cm or more. The molar absorption coefficient of the specific compound at a wavelength of 400 nm is preferably 1,000 L / mol cm or more, more preferably 3,000 L / mol cm or more, and even more preferably 5,000 L / mol cm or more.

[0104] The maximum absorption wavelength and molar absorption coefficient of a specific compound can be determined by measuring the spectroscopic spectrum of a solution prepared by dissolving the specific compound in ethyl acetate using a 1 cm quartz cell at room temperature (25° C.) An example of a measuring device is UV-1800PC (manufactured by Shimadzu Corporation).

[0105] The specific compound can be produced in accordance with the methods described in JP-A-2009-067984, JP-A-2009-263616, JP-A-2009-263617, WO 2009 / 022736, and WO 2017 / 122503.

[0106] Specific examples of the specific compound include compounds having the following structure: In the structural formula shown below, Me is a methyl group, Et is an ethyl group, Pr is a propyl group, Bu is a butyl group, tBu is a tert-butyl group, and Ph is a phenyl group.

[0107]

[0108] The ultraviolet absorber used in the thermosetting composition of the present invention may contain another ultraviolet absorber having a maximum absorption wavelength on the shorter wavelength side than the specific compound described above.

[0109] The maximum absorption wavelength of the other ultraviolet absorber is preferably in the wavelength range of 300 to 380 nm, more preferably in the wavelength range of 300 to 370 nm, even more preferably in the wavelength range of 310 to 360 nm, and particularly preferably in the wavelength range of 310 to 350 nm. According to this embodiment, a cured product that can block light in the ultraviolet region over a wide range of wavelengths can be formed.

[0110] Furthermore, the difference between the maximum absorption wavelength of the specific compound and the maximum absorption wavelength of the other ultraviolet absorber is preferably 1 to 70 nm, more preferably 10 to 60 nm, and even more preferably 20 to 50 nm. According to this embodiment, a cured product capable of blocking light in the ultraviolet region over a wide range of wavelengths can be formed.

[0111] Other ultraviolet absorbers include aminobutadiene compounds, dibenzoylmethane compounds, benzotriazole compounds, benzophenone compounds, salicylic acid compounds, acrylate compounds, and triazine compounds, of which benzotriazole compounds, benzophenone compounds, and triazine compounds are preferred, and benzotriazole compounds and triazine compounds are more preferred. Specific examples of other ultraviolet absorbers include 2-(2'-hydroxy-5'-t-butylphenyl)benzotriazole, 2-(2'-hydroxy-3'-t-butyl-5'-methylphenyl)-5-chlorobenzotriazole, 2-(4-butoxy-2-hydroxyphenyl)-4,6-di(4-butoxyphenyl)-1,3,5-triazine, 2-[2-hydroxy-4-(2-hydroxy-3-butyloxypropoxy)phenyl]-4,6-bis(2,4-dimethyl)-1,3,5-triazine, 2,2',4,4'-tetrahydroxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, etc. Other ultraviolet absorbers include the compounds described in paragraphs 0065 to 0070 of JP 2009-263616 A and the compounds described in paragraph 0065 of WO 2017 / 122503 A.

[0112] The content of the ultraviolet absorber in the total solid content of the thermosetting composition is preferably 0.01 to 30% by mass. The lower limit is preferably 0.05% by mass or more, more preferably 0.1% by mass or more. The upper limit is preferably 25% by mass or less, more preferably 20% by mass or less. The content of the specific compound in the total solid content of the thermosetting composition is preferably 0.01 to 30% by mass. The lower limit is preferably 0.05% by mass or more, more preferably 0.1% by mass or more. The upper limit is preferably 25% by mass or less, more preferably 20% by mass or less. The thermosetting composition of the present invention can form a film with little coloration and reduced haze, even if the content of the specific compound is high. Therefore, the content of the specific compound in the total solid content of the thermosetting composition can be 0.01 to 30% by mass, 0.01 to 25% by mass, or 0.01 to 20% by mass. The thermosetting composition may contain only one type of ultraviolet absorber or may contain two or more types. When two or more types of ultraviolet absorbers are contained, the total amount thereof is preferably in the above range.

[0113] <<Thermosetting Compound>> The thermosetting composition of the present invention contains a thermosetting compound. The thermosetting compound is a compound that can be cured by a chemical reaction under heating conditions, and unless otherwise specified, includes compounds that form the molecular skeleton of a product (i.e., a cured product) in a thermosetting reaction. The thermosetting compound may be a compound that thermosets alone, a compound that thermosets in combination with two or more types, or a compound that thermosets in the presence of an additive such as a known curing agent.

[0114] For example, in the case of phenolic resin, it can be thermally cured by heating in the presence of an amine-based curing agent, epoxy resin, or the like.

[0115] The form of the thermosetting compound is not limited to a monomer, but includes, for example, an oligomer, a prepolymer, and a resin.

[0116] The thermosetting compound is preferably a compound having a reactive group such as an isocyanate group, an isothiocyanate group, an epoxy group, a methylol group, an alkoxysilyl group, a hydroxy group, a mercapto group, or an amino group.

[0117] Examples of the thermosetting compound include phenolic resins, epoxy resins, melamine resins, urea resins, polyester resins, alkyd resins, polyimide resins, polyurethane resins, polythiourethane resins, diallyl phthalate resins, episulfide resins, siloxane resins, and precursors thereof. Polyurethane resins, polythiourethane resins, diallyl phthalate resins, and precursors thereof are preferred, and polythiourethane resins or precursors thereof are more preferred, because they have a high refractive index, are lightweight, and are excellent in impact resistance.

[0118] Here, the precursor of the resin in the thermosetting compound refers to a compound that produces the resin by a thermosetting reaction. The precursor may be a compound that produces the resin by thermosetting alone, a compound that produces the resin by thermosetting in combination with two or more types of compounds, or a compound that produces the resin by thermosetting in the presence of an additive such as a known curing agent.

[0119] Precursors of the resins include isocyanate compounds, isothiocyanate compounds, methylol compounds, epoxy compounds, phenol compounds, melamine compounds, diallyl phthalate compounds, alkoxysilane compounds, etc. The form of these precursors is not limited to monomers, and includes, for example, oligomers, prepolymers, and resins.

[0120] For example, a precursor of a diallyl phthalate resin is diallyl phthalate, which is thermally cured to produce a diallyl phthalate resin.

[0121] Examples of precursors for polythiourethane resins and precursors for polyurethane resins include isocyanate compounds and isothiocyanate compounds. Polythiourethane resins are produced by thermosetting reactions between an isocyanate compound or an isothiocyanate compound and a polythiol compound. Polyurethane resins are also produced by thermosetting reactions between an isocyanate compound or an isothiocyanate compound and a polyol compound. A prepolymer obtained by reacting at least one compound selected from an isocyanate compound and an isothiocyanate compound with a polythiol compound can also be used as a precursor for polythiourethane resins. A prepolymer obtained by reacting at least one compound selected from an isocyanate compound and an isothiocyanate compound with a polyol compound can also be used as a precursor for polyurethane resins.

[0122] The isocyanate compound may be a compound having two or more isocyanate groups in one molecule, and the isothiocyanate compound may be a compound having two or more isothiocyanate groups in one molecule. Specific examples of the isocyanate compound and the isothiocyanate compound include aliphatic polyisocyanate compounds such as hexamethylene diisocyanate, 2,2-dimethylpentane diisocyanate, 2,2,4-trimethylhexane diisocyanate, butene diisocyanate, 1,3-butadiene-1,4-diisocyanate, 2,4,4-trimethylhexamethylene diisocyanate, 1,6,11-undecane triisocyanate, 1,3,6-hexamethylene triisocyanate, 1,8-diisocyanate 4-isocyanate methyl octane, bis(isocyanate ethyl) carbonate, bis(isocyanate ethyl) ether, lysine diisocyanate methyl ester, and lysine triisocyanate; Alicyclic polyisocyanate compounds such as 2,5-bis(isocyanatemethyl)-bicyclo[2.2.1]heptane, 2,6-bis(isocyanatemethyl)-bicyclo[2.2.1]heptane, bis(isocyanatemethyl)cyclohexane, dicyclohexylmethane diisocyanate, and isophorone diisocyanate;1,2-diisocyanate benzene, 1,3-diisocyanate benzene, 1,4-diisocyanate benzene, 2,4-diisocyanate toluene, ethyl phenylene diisocyanate, isopropyl phenylene diisocyanate, dimethyl phenylene diisocyanate, diethyl phenylene diisocyanate, diisopropyl phenylene diisocyanate, trimethylbenzene triisocyanate, benzene triisocyanate, biphenyl diisocyanate, toluidine diisocyanate, 4,4'-methylenebis(phenyl isocyanate), 4,4'-methylenebis(2-methylphenyl)isocyanate polyisocyanate compounds having an aromatic ring compound, such as bis(isocyanatemethyl)benzene, bis(isocyanateethyl)benzene, bis(isocyanatepropyl)benzene, α,α,α',α'-tetramethylxylylene diisocyanate, bis(isocyanatebutyl)benzene, bis(isocyanatemethyl)naphthalene, bis(isocyanatemethylphenyl)ether, bis(isocyanateethyl)phthalate, and 2,6-di(isocyanatemethyl)furan;Bis(isocyanate methyl) sulfide, bis(isocyanate ethyl) sulfide, bis(isocyanate propyl) sulfide, bis(isocyanate hexyl) sulfide, bis(isocyanate methyl) sulfone, bis(isocyanate methyl) disulfide, bis(isocyanate ethyl) disulfide, bis(isocyanate propyl) disulfide, bis(isocyanate methylthio)methane, bis(isocyanate ethylthio)methane, bis(isocyanate methylthio)ethane, bis(isocyanate ethylthio)ethane sulfur-containing aliphatic polyisocyanate compounds such as 1,5-diisocyanate-2-isocyanatemethyl-3-thiapentane, 1,2,3-tris(isocyanatemethylthio)propane, 1,2,3-tris(isocyanateethylthio)propane, 3,5-dithia-1,2,6,7-heptane tetraisocyanate, 2,6-diisocyanatemethyl-3,5-dithia-1,7-heptane diisocyanate, 2,5-diisocyanatemethylthiophene, and -isocyanateethylthio-2,6-dithia-1,8-octane diisocyanate; Aromatic sulfide-based polyisocyanate compounds such as 2-isocyanatephenyl-4-isocyanate phenyl sulfide, bis(4-isocyanatephenyl) sulfide, and bis(4-isocyanatemethylphenyl) sulfide; Aromatic disulfide-based polyisocyanate compounds such as bis(4-isocyanatephenyl) disulfide, bis(2-methyl-5-isocyanatephenyl) disulfide, bis(3-methyl-5-isocyanatephenyl) disulfide, bis(3-methyl-6-isocyanatephenyl) disulfide, bis(4-methyl-5-isocyanatephenyl) disulfide, and bis(4-methoxy-3-isocyanatephenyl) disulfide;Sulfur-containing alicyclic polyisocyanate compounds such as 2,5-diisocyanate tetrahydrothiophene, 2,5-diisocyanate methyl tetrahydrothiophene, 3,4-diisocyanato methyl tetrahydrothiophene, 2,5-diisocyanate 1,4-dithiane, 2,5-diisocyanate methyl-1,4-dithiane, 4,5-diisocyanate 1,3-dithiolane, 4,5-bis(isocyanate methyl)-1,3-dithiolane, and 4,5-diisocyanate methyl-2-methyl-1,3-dithiolane; aliphatic polyisothiocyanates such as 1,2-diisothiocyanate ethane and 1,6-diisothiocyanate hexane; alicyclic polyisothiocyanate compounds such as cyclohexane diisothiocyanate; Aromatic polyisothiocyanate compounds such as 1,2-diisothiocyanate benzene, 1,3-diisothiocyanate benzene, 1,4-diisothiocyanate benzene, 2,4-diisothiocyanate toluene, 2,5-diisothiocyanate m-xylene, 4,4'-methylenebis(phenyl isothiocyanate), 4,4'-methylenebis(2-methylphenyl isothiocyanate), 4,4'-methylenebis(3-methylphenyl isothiocyanate), 4,4'-diisothiocyanate benzophenone, 4,4'-diisothiocyanate 3,3'-dimethylbenzophenone, and bis(4-isothiocyanate phenyl) ether; Carbonyl polyisothiocyanate compounds such as 1,3-benzenedicarbonyl diisothiocyanate, 1,4-benzenedicarbonyl diisothiocyanate, (2,2-pyridine)-4,4-dicarbonyl diisothiocyanate; sulfur-containing aliphatic polyisothiocyanate compounds such as thiobis(3-isothiocyanatepropane), thiobis(2-isothiocyanateethane), dithiobis(2-isothiocyanateethane); sulfur-containing aromatic polyisothiocyanate compounds such as 1-isothiocyanate-4-[(2-isothiocyanate)sulfonyl]benzene, thiobis(4-isothiocyanatebenzene), sulfonyl(4-isothiocyanatebenzene), dithiobis(4-isothiocyanatebenzene); sulfur-containing alicyclic polyisothiocyanate compounds such as 2,5-diisothiocyanatethiophene, 2,5-diisothiocyanate-1,4-dithiane;Examples of the polyiso(thio)cyanate compound include polyiso(thio)cyanate compounds having an isocyanate group and an isothiocyanate group, such as 1-isocyanate 6-isothiocyanate hexane, 1-isocyanate 4-isothiocyanate cyclohexane, 1-isocyanate 4-isothiocyanate benzene, 4-methyl-3-isocyanate 1-isothiocyanate benzene, 2-isocyanate 4,6-diisothiocyanate 1,3,5-triazine, 4-isocyanate phenyl-4-isothiocyanate phenyl sulfide, and 2-isocyanate ethyl-2-isothiocyanate ethyl disulfide;

[0123] Furthermore, halogen-substituted compounds such as chlorine-substituted compounds and bromine-substituted compounds, alkyl-substituted compounds, alkoxy-substituted compounds, and nitro-substituted compounds, prepolymer-type modified compounds with polyhydric alcohols, carbodiimide-modified compounds, urea-modified compounds, biuret-modified compounds, dimerization or trimerization reaction products, etc., can also be used. Commercially available isocyanate compounds and isothiocyanate compounds may also be used. Examples of commercially available products include Duranate TPA100 (manufactured by Asahi Kasei Corporation, compound name: polyisocyanurate of hexamethylene diisocyanate).

[0124] Examples of polythiol compounds that can be used to produce polythiourethane resins by reacting with an isocyanate compound or an isothiocyanate compound include: Methanedithiol, 1,2-ethanedithiol, 1,1-propanedithiol, 1,2-propanedithiol, 1,3-propanedithiol, 2,2-propanedithiol, 1,6-hexanedithiol, 1,2,3-propanetrithiol, 1,1-cyclohexanedithiol, 1,2-cyclohexanedithiol, 2,2-dimethylpropane-1,3-dithiol, 3,4-dimethoxybutane-1,2-dithiol, 2-methylcyclohexane-2,3-dithiol, 1,1-bis(mercaptomethyl)cyclohexane, thiomalic acid bis(2-mercaptoethyl ester), 2,3-dimercapto-1-propanol(2-mercaptoacetate), 2,3-dimercapto-1-propanol(3-mercaptopropionate), diethylene glycol bis( aliphatic polythiol compounds such as ethylene glycol bis(2-mercaptoacetate), diethylene glycol bis(3-mercaptopropionate), 1,2-dimercaptopropyl methyl ether, 2,3-dimercaptopropyl methyl ether, 2,2-bis(mercaptomethyl)-1,3-propanedithiol, bis(2-mercaptoethyl)ether, ethylene glycol bis(2-mercaptoacetate), ethylene glycol bis(3-mercaptopropionate), trimethylolpropane bis(2-mercaptoacetate), trimethylolpropane bis(3-mercaptopropionate), pentaerythritol tetrakis(2-mercaptoacetate), pentaerythritol tetrakis(3-mercaptopropionate), and tetrakis(mercaptomethyl)methane;1,2-Dimercaptobenzene, 1,3-Dimercaptobenzene, 1,4-Dimercaptobenzene, 1,2-Bis(mercaptomethyl)benzene, 1,3-Bis(mercaptomethyl)benzene, 1,4-Bis(mercaptomethyl)benzene, 1,2-Bis(mercaptoethyl)benzene, 1,3-Bis(mercaptoethyl)benzene, 1,4-Bis(mercaptoethyl)benzene, 1,2,3-Trimercaptobenzene, 1,2,4-Trimercaptobenzene, 1,3,5-Trimercaptobenzene, 1,2,3-Tris(mercaptomethyl)benzene, 1,2,4 aromatic polythiol compounds such as tris(mercaptomethyl)benzene, 1,3,5-tris(mercaptomethyl)benzene, 1,2,3-tris(mercaptoethyl)benzene, 1,2,4-tris(mercaptoethyl)benzene, 1,3,5-tris(mercaptoethyl)benzene, 2,5-toluenedithiol, 3,4-toluenedithiol, 1,3-di(p-methoxyphenyl)propane-2,2-dithiol, 1,3-diphenylpropane-2,2-dithiol, phenylmethane-1,1-dithiol, and 2,4-di(p-mercaptophenyl)pentane; aromatic polythiol compounds containing sulfur atoms in addition to mercapto groups, such as 1,2-bis(mercaptoethylthio)benzene, 1,3-bis(mercaptoethylthio)benzene, 1,4-bis(mercaptoethylthio)benzene, 1,2,3-tris(mercaptomethylthio)benzene, 1,2,4-tris(mercaptomethylthio)benzene, 1,3,5-tris(mercaptomethylthio)benzene, 1,2,3-tris(mercaptoethylthio)benzene, 1,2,4-tris(mercaptoethylthio)benzene, 1,3,5-tris(mercaptoethylthio)benzene, and their nuclear alkylated products;

[0125] Bis(mercaptomethyl) sulfide, bis(mercaptomethyl) disulfide, bis(mercaptoethyl) sulfide, bis(mercaptoethyl) disulfide, bis(mercaptopropyl) sulfide, bis(mercaptomethylthio)methane, bis(2-mercaptoethylthio)methane, bis(3-mercaptopropylthio)methane, 1,2-bis(mercaptomethylthio)ethane, 1,2-bis(2-mercaptoethylthio)ethane, 1,2-bis(3-mercaptopropyl)ethane, 1,3- Bis(mercaptomethylthio)propane, 1,3-bis(2-mercaptoethylthio)propane, 1,3-bis(3-mercaptopropylthio)propane, 1,2,3-tris(mercaptomethylthio)propane, 1,2,3-tris(2-mercaptoethylthio)propane, 1,2,3-tris(3-mercaptopropylthio)propane, 1,2-bis[(2-mercaptoethyl)thio]-3-mercaptopropane, 4,8-dimercaptomethyl-1,11-dimercapto-3,6,9-trithiaune Decane, 4,7-dimercaptomethyl-1,11-dimercapto-3,6,9-trithiaundecane, 5,7-dimercaptomethyl-1,11-dimercapto-3,6,9-trithiaundecane, bis(mercaptomethyl)-3,6,9-trithia-1,11-undecanedithiol, tetrakis(mercaptomethylthiomethyl)methane, tetrakis(2-mercaptoethylthiomethyl)methane, tetrakis(3-mercaptopropylthiomethyl)methane, bis(2,3-dimercaptopropyl)sulfonyl aliphatic polythiol compounds containing sulfur atoms in addition to mercapto groups, such as bis(1,3-dimercaptopropyl)sulfide, 2,5-dimercapto-1,4-dithiane, 2,5-dimercaptomethyl-1,4-dithiane, 2,5-dimercaptomethyl-2,5-dimethyl-1,4-dithiane, bis(mercaptomethyl)disulfide, bis(mercaptoethyl)disulfide, and bis(mercaptopropyl)disulfide, and thioglycolic acid and mercaptopropionic acid esters thereof;Hydroxymethyl sulfide bis(2-mercaptoacetate), hydroxymethyl sulfide bis(3-mercaptopropionate), hydroxyethyl sulfide bis(2-mercaptoacetate), hydroxyethyl sulfide bis(3-mercaptopropionate), hydroxypropyl sulfide bis(2-mercaptoacetate), hydroxypropyl sulfide bis(3-mercaptopropionate), hydroxymethyl disulfide bis(2-mercaptoacetate) ester), hydroxymethyl disulfide bis(3-mercaptopropionate), hydroxyethyl disulfide bis(2-mercaptoacetate), hydroxyethyl disulfide bis(3-mercaptopropionate), hydroxypropyl disulfide bis(2-mercaptoacetate), hydroxypropyl disulfide bis(3-mercaptopropionate), 2-mercaptoethyl ether bis(2-mercaptoacetate), 2-mercaptoethyl ether bis(3 -mercaptopropionate), 1,4-dithiane-2,5-diol bis(2-mercaptoacetate), 1,4-dithiane-2,5-diol bis(3-mercaptopropionate), thiodiglycolic acid bis(2-mercaptoethyl ester), thiodipropionic acid bis(2-mercaptoethyl ester), 4,4-thiodibutyric acid bis(2-mercaptoethyl ester), dithiodiglycolic acid bis(2-mercaptoethyl ester), dithiodipropionic acid bis(2-mercaptoethyl ester aliphatic polythiol compounds containing a sulfur atom and an ester bond in addition to a mercapto group, such as 4,4-dithiodibutyric acid bis(2-mercaptoethyl ester), 4,4-dithiodibutyric acid bis(2-mercaptoethyl ester), thiodiglycolic acid bis(2,3-dimercaptopropyl ester), thiodipropionic acid bis(2,3-dimercaptopropyl ester), dithioglycolic acid bis(2,3-dimercaptopropyl ester), and dithiodipropionic acid bis(2,3-dimercaptopropyl ester);

[0126] Heterocyclic compounds containing a sulfur atom in addition to a mercapto group, such as 3,4-thiophenedithiol and 2,5-dimercapto-1,3,4-thiadiazole; 2-mercaptoethanol, 3-mercapto-1,2-propanediol, glycerin di(mercaptoacetate), 1-hydroxy-4-mercaptocyclohexane, 2,4-dimercaptophenol, 2-mercaptohydroquinone, 4-mercaptophenol, 3,4-dimercapto-2-propanol, 1,3-dimercapto-2-propanol, 2,3-dimercapto-1-propanol, 1,2-dimercapto-1,3-butanediol, pentaerythritol tris( compounds containing a hydroxy group in addition to a mercapto group, such as pentaerythritol mono(3-mercaptopropionate), pentaerythritol bis(3-mercaptopropionate), pentaerythritol tris(thioglycolate), dipentaerythritol pentakis(3-mercaptopropionate), hydroxymethyl-tris(mercaptoethylthiomethyl)methane, and 1-hydroxyethylthio-3-mercaptoethylthiobenzene; 1,1,3,3-tetrakis(mercaptomethylthio)propane, 1,1,2,2-tetrakis(mercaptomethylthio)ethane, 4,6-bis(mercaptomethylthio)-1,3-dithiacyclohexane, 1,1,5,5-tetrakis(mercaptomethylthio)-3-thiapentane, 1,1,6,6-tetrakis(mercaptomethylthio)-3,4-dithiahexane, 2,2-bis(mercaptomethylthio)ethanethiol, 2-(4,5-dimercapto-2-thiapentyl)-1,3-dithiacyclopentane, 2,2-bis(mercaptomethylthio) mercaptomethylthio)-1,3-dithiacyclopentane, 2,5-bis(4,4-bis(mercaptomethylthio)-2-thiabutyl)-1,4-dithiane, 2,2-bis(mercaptomethylthio)-1,3-propanedithiol, 3-mercaptomethylthio-1,7-dimercapto-2,6-dithiaheptane, 3,6-bis(mercaptomethylthio)-1,9-dimercapto-2,5,8-trithianonane, 4,6-bis(mercaptomethylthio)-1,9-dimercapto-2,5,8-trithianonane, 3-mercaptomethylthio-1,6-dimercapto-2,5-dithiahexane, 2-(2,2-bis(mercaptomethylthio)ethyl)-1,3-dithietane, 1,1,9,9-tetrakis(mercaptomethylthio)-5-(3,3-bis(mercaptomethylthio)-1-thiapropyl)3,7-dithianonane, tris(2,2-bis(mercaptomethylthio)ethyl)methane, tris(4,4-bis(mercaptomethylthio)-2-thiabutyl)methane, tetrakis(2,2-bis(mercaptomethylthio)ethyl)methane, tetrakis(4,4-bis(mercaptomethylthio)-2-thiabutyl)methane, 3,5,9,11-tetrakis(mercaptomethylthio)-1,13-dimercapto-2,6,8,12-tetrathiatridecane, 3,5,9,11,15,17-hexakis(mercaptomethylthio)-1,19-dimercapto-2,6,8,12,14,18-hexathianonadecane, 9-(2,2-bis(mercaptomethylthio)ethyl)-3,5,13,15-tetrakis(mercaptomethylthio)-1,17-dimercapto-2,6,8,10,12,16-hexathiaheptadecane, 3,4,8,9-tetrakis(mercaptomethylthio)- 1,11-dimercapto-2,5,7,10-tetrathiaundecane, 3,4,8,9,13,14-hexakis(mercaptomethylthio)-1,16-dimercapto-2,5,7,10,12,15-hexathiahexadecane, 8-{bis(mercaptomethylthio)methyl}-3,4,12,13-tetrakis(mercaptomethylthio)-1,15-dimercapto-2,5,7,9,11,14-hexathiapentadecane, 4,6-bis{3,5-bis(mercaptomethylthio)-7-mercapto-2,6-dithiaheptylthio}-1,3-dithiane , 4-{3,5-bis(mercaptomethylthio)-7-mercapto-2,6-dithiaheptylthio}-6-mercaptomethylthio-1,3-dithiane, 1,1-bis{4-(6-mercaptomethylthio)-1,3-dithianylthio}-3,3-bis(mercaptomethylthio)propane, 1,3-bis{4-(6-mercaptomethylthio)-1,3-dithianylthio}-1,3-bis(mercaptomethylthio)propane, 1-{4-(6-mercaptomethylthio)-1,3-dithianylthio}-3-{2,2-bis(mercaptomethylthio)ethyl}-7,9-bis(mercaptomethylthio)-2,4,6,10-tetrathiaundecane, 1-{4-(6-mercaptomethylthio)-1,3-dithianylthio}-3-{2-(1,3-dithietanyl)}methyl-7,9-bis(mercaptomethylthio)-2,4,6,10-tetrathiaundecane, 1,5-bis{4-(6-mercaptomethylthio)-1,3-dithianylthio}-3-{2-(1,3-dithietanyl)}methyl-2,4-dithiapentane, 4,6-bis[3-{2-(1,3-dithietanyl)}methyl-5-mercapto-2,4-dithiapen methylthio]-1,3-dithiane, 4,6-bis{4-(6-mercaptomethylthio)-1,3-dithianylthio}-1,3-dithiane, 4-{4-(6-mercaptomethylthio)-1,3-dithianylthio}-6-{4-(6-mercaptomethylthio)-1,3-dithianylthio}-1,3-dithiane, 3-{2-(1,3-dithietanyl)}methyl-7,9-bis(mercaptomethylthio)-1,11-dimercapto-2,4,6,10-tetrathiaundecane, 9-{2-(1,3-dithietanyl)}methyl-3,5,13,15-tetrakis(mercaptomethylthio) 3-{2-(1,3-dithietanyl)}methyl-7,9,13,15-tetrakis(mercaptomethylthio)-1,17-dimercapto-2,4,6,10,12,16-hexathiaheptadecane, 3,7-bis{2-(1,3-dithietanyl)}methyl-1,9-dimercapto-2,4,6,8-tetrathianonane, 4-{3,4,8,9-tetrakis(mercaptomethylthio)-11-mercapto-2,5,7,10-tetrathiaundecyl}-5-mercaptomethylthio-1,3-dithiolane, 4,5-bis{3,4-bis(mercaptomethylthio)-6-mercapto-2,5-dithiahexylthio}-1,3-dithiolane, 4-{3,4-bis(mercaptomethylthio)-6-mercapto-2,5-dithiahexylthio}-5-mercaptomethylthio-1,3-dithiolane, 4-{3-bis(mercaptomethylthio)methyl-5,6-bis(mercaptomethylthio)-8-mercapto-2,4,7-trithiaoctyl}-5-mercaptomethylthio-1,3-dithiolane, 2-[bis{3,4-bis(mercaptomethylthio)-6-mercapto-2,5-dithiahexylthio}methyl]-1,3-dithietane, 2-{3,4-bis(mercaptomethylthio)-6-mercapto-2,5-dithiahexylthio}mercaptomethylthiomethyl-1,3-dithietane, 2-{3,4,8,9-tetrakis(mercaptomethylthio)-11-mercapto-2,5,7,10-tetrathiaundecylthio}mercaptomethylthiomethyl-1,3-dithietane, 2-{3-bis(mercaptomethylthio)methyl-5,6-bis(mercaptomethylthio)-8-mercapto-2,4,7-trithiaoctyl}mercaptomethylthiomethyl-1,3-dithietane, 4,5-bis[1-{2-(1,3- compounds having a dithioacetal or dithioketal skeleton, such as 4-[1-{2-(1,3-dithietanyl)}-3-mercapto-2-thiapropylthio]-1,3-dithiolane, 4-[1-{2-(1,3-dithietanyl)}-3-mercapto-2-thiapropylthio]-5-{1,2-bis(mercaptomethylthio)-4-mercapto-3-thiabutylthio}-1,3-dithiolane, 2-[bis{4-(5-mercaptomethylthio-1,3-dithiolanyl)thio}]methyl-1,3-dithietane, 4-{4-(5-mercaptomethylthio-1,3-dithiolanyl)thio}-5-[1-{2-(1,3-dithietanyl)}-3-mercapto-2-thiapropylthio]-1,3-dithiolane, and oligomers thereof;

[0127] Tris(mercaptomethylthio)methane, tris(mercaptoethylthio)methane, 1,1,5,5-tetrakis(mercaptomethylthio)-2,4-dithiapentane, bis(4,4-bis(mercaptomethylthio)-1,3-dithiabutyl)(mercaptomethylthio)methane, tris(4,4-bis(mercaptomethylthio)-1,3-dithiabutyl)methane, 2,4,6-tris(mercaptomethylthio)-1,3,5-trithiacyclohexane San, 2,4-bis(mercaptomethylthio)-1,3,5-trithiacyclohexane, 1,1,3,3-tetrakis(mercaptomethylthio)-2-thiapropane, bis(mercaptomethyl)methylthio-1,3,5-trithiacyclohexane, tris((4-mercaptomethyl-2,5-dithiacyclohexyl-1-yl)methylthio)methane, 2,4-bis(mercaptomethylthio)-1,3-dithiacyclopentane, 2-mercaptoethyl Thio-4-mercaptomethyl-1,3-dithiacyclopentane, 2-(2,3-dimercaptopropylthio)-1,3-dithiacyclopentane, 4-mercaptomethyl-2-(2,3-dimercaptopropylthio)-1,3-dithiacyclopentane, 4-mercaptomethyl-2-(1,3-dimercapto-2-propylthio)-1,3-dithiacyclopentane, tris(2,2-bis(mercaptomethylthio)-1-thiaethyl)methane, tris compounds having an orthotrithioformate skeleton such as (3,3-bis(mercaptomethylthio)-2-thiapropyl)methane, tris(4,4-bis(mercaptomethylthio)-3-thiabutyl)methane, 2,4,6-tris(3,3-bis(mercaptomethylthio)-2-thiapropyl)-1,3,5-trithiacyclohexane, tetrakis(3,3-bis(mercaptomethylthio)-2-thiapropyl)methane, and oligomers thereof;Examples include compounds having an orthotetrathiocarbonate skeleton, such as 3,3'-di(mercaptomethylthio)-1,5-dimercapto-2,4-dithiapentane, 2,2'-di(mercaptomethylthio)-1,3-dithiacyclopentane, 2,7-di(mercaptomethyl)-1,4,5,9-tetrathiaspiro[4,4]nonane, 3,9-dimercapto-1,5,7,11-tetrathiaspiro[5,5]undecane, and oligomers thereof;

[0128] Examples of polythiol compounds used in producing polyurethane resins by reacting with an isocyanate compound or an isothiocyanate compound include polyols (also called long-chain polyols) that have multiple hydroxy groups and in which the hydroxy groups are connected via a carbon chain with 6 or more carbon atoms (the number of carbon atoms in the linear portion connecting the hydroxy groups).

[0129] The carbon chain having 6 or more carbon atoms in the long-chain polyol refers to a chain having 6 or more carbon atoms in the linear portion connecting the hydroxy groups. Examples of the carbon chain having 6 or more carbon atoms include an alkylene group, or a divalent group formed by combining one or more alkylene groups with one or more groups selected from -O-, -C(=O)-, and -C(=O)-O-. A long-chain polyol in which a hydroxy group is connected via a carbon chain having 6 or more carbon atoms is a -[CO(CH ２ ) ｎ１Ｏ ] ｎ２ It is preferable that the compound has a structure of —H (where n1 represents 1 or more and 10 or less (preferably 3 or more and 6 or less, more preferably 5), and n2 represents 1 or more and 50 or less (preferably 1 or more and 35 or less, more preferably 1 or more and 10 or less)).

[0130] Examples of long-chain polyols include bifunctional polycaprolactone diols, trifunctional polycaprolactone triols, and tetrafunctional or higher polycaprolactone polyols.

[0131] Examples of bifunctional polycaprolactone diols include -[CO(CH ２ ) ｎ１１ O] ｎ１２-H (where n11 represents 1 or more and 10 or less (preferably 3 or more and 6 or less, more preferably 5), and n12 represents 1 or more and 50 or less (preferably 4 or more and 35 or less)), and has two groups having a hydroxyl group at its terminal.

[0132] Examples of trifunctional polycaprolactone diols include -[CO(CH ２ ) ｎ２１ O] ｎ２２ -H (where n21 represents 1 or more and 10 or less (preferably 3 or more and 6 or less, more preferably 5), and n22 represents 1 or more and 50 or less (preferably 1 or more and 28 or less)), and has three groups having a hydroxyl group at its terminal.

[0133] Commercially available polyols include PLACCEL 308 (manufactured by Daicel Corporation).

[0134] The hydroxyl value of the long-chain polyol is preferably 30 to 300 mgKOH / g, and more preferably 50 to 250 mgKOH / g. The hydroxyl value refers to the number of milligrams of potassium hydroxide required to acetylate the hydroxyl groups (hydroxy groups) in 1 g of sample. The hydroxyl value herein is measured in accordance with the method (potentiometric titration) specified in JIS K0070-1992. However, if the sample is insoluble, a solvent such as dioxane or tetrahydrofuran may be used. Commercially available polythiourethane resin precursors may also be used. Examples of commercially available polythiourethane resin precursors include MR-6, MR-7, MR-8, MR-8Plus, MR-60, MR-10, and MR-20 (all manufactured by Mitsui Chemicals, Inc.), and EYAS1.60 (manufactured by HOYA Corporation).

[0135] Other examples of precursors of the resins that can be used include methylol compounds, epoxy compounds, phenol compounds, melamine compounds, and alkoxysilane compounds.

[0136] The methylol compound may be a compound having two or more methylol groups in one molecule. Specific examples of the methylol compound include alkoxymethylated melamine, methylolated melamine, alkoxymethylated benzoguanamine, methylolated benzoguanamine, alkoxymethylated glycoluril, methylolated glycoluril, alkoxymethylated urea, methylolated urea, and a trimethylolpropane-added compound of tolylene diisocyanate.

[0137] Examples of epoxy compounds include compounds having two or more epoxy groups per two molecules. Epoxy compounds may be either low molecular weight compounds (e.g., molecular weight less than 1000) or high molecular weight compounds (macromolecules) (e.g., molecular weight of 1000 or more, or in the case of polymers, weight average molecular weight of 1000 or more). The weight average molecular weight of the epoxy compound is preferably 2000 to 100,000. The upper limit of the weight average molecular weight is preferably 10,000 or less, more preferably 5,000 or less, and even more preferably 3,000 or less. Commercially available epoxy compounds include polyfunctional epoxy compounds such as CELLOXIDE 2021P (trade name: 3',4'-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate) manufactured by Daicel Corporation and LIKARESIN DME-100 (trade name: containing 1,4-cyclohexanedimethanol diglycidyl ether as the main component) manufactured by New Japan Chemical Co., Ltd. As the epoxy compound, the compounds described in paragraphs 0006 to 0011 of JP-A-2008-013759 and the compounds described in paragraphs 0032 to 0100 of JP-A-2013-227451 can also be used.

[0138] Examples of the alkoxysilane compound include tetramethoxysilane, tetraethoxysilane, tetra-n-propoxysilane, tetra-i-propoxysilane, tetra-n-butoxysilane, methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, n-propyltrimethoxysilane, n-propyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, γ-glycidyloxypropyltrimethoxysilane, γ-glycidyloxypropyltriethoxysilane, γ-glycidyloxypropylmethyldimethoxysilane, γ-glycidyloxypropylmethyldiethoxysilane, γ-methacryloyloxypropyltrimethoxysilane, γ-methacryloyloxypropyltriethoxy ... Examples of suitable silanes include methyldimethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, 3,4-epoxycyclohexylethyltrimethoxysilane, 3,4-epoxycyclohexylethyltriethoxysilane, tris-(trimethoxysilylpropyl)isocyanurate, 4-trimethoxysilylstyrene, 3,3,3-trifluoropropyltrimethoxysilane, dimethyldimethoxysilane, dimethyldiethoxysilane, diethyldimethoxysilane, diethyldiethoxysilane, di-n-propyldimethoxysilane, di-n-propyldiethoxysilane, diphenyldimethoxysilane, divinyldiethoxysilane, bis(triethoxysilylpropyl)tetrasulfide, 3-(trimethoxysilyl)propyl isocyanate, and 3-(triethoxysilyl)propyl isocyanate.

[0139] The thermosetting compound may also be a thermosetting resin, such as a phenolic resin, an epoxy resin, a melamine resin, a urea resin, a polyester resin, an alkyd resin, a polyimide resin, a polyurethane resin, a polythiourethane resin, a diallyl phthalate resin, an episulfide resin, or a siloxane resin.

[0140] Examples of epoxy resins include bisphenol A epoxy resins, bisphenol F epoxy resins, phenol novolac epoxy resins, cresol novolac epoxy resins, and aliphatic epoxy resins. Commercially available epoxy resins may be used. Examples of commercially available epoxy resins include the following:

[0141] Commercially available examples of bisphenol A type epoxy resins include jER152, jER154, jER157S70, jER157S65, jER806, jER807, jER825, jER827, jER828, jER834, jER1001, jER1002, jER1003, jER1031S, jER1055, jER1007, jER1009, jER1010, jER4004, jER4005, jER4007, and jER4010 (all manufactured by Mitsubishi Chemical Corporation), EPICLON N-660, EPICLON N-665, EPICLON N-670, EPICLON N-671, EPICLON N-672, EPICLON N-673, EPICLON N-674, EPICLON N-675, EPICLON N-676, EPICLON N-677, EPICLON N-678, EPICLON N-679, EPICLON N-680, EPICLON N-681, EPICLON N-682, EPICLON N-683, EPICLON N-684, EPICLON N-685, EPICLON N-686, EPICLON N-687, EPICLON N-688, EPICLON N-689 ... N-673, EPICLON N-680, EPICLON N-690, EPICLON N-695, EPICLON N-740, EPICLON N-770, EPICLON N-775, EPICLON 860, EPICLON 1050, EPICLON 1051, EPICLON 1055, EPICLON 830, and EPICLON 835 (all manufactured by DIC Corporation), NC-2000, NC-3000, NC-7300, XD-1000, EOCN-1020, EPPN-201, EPPN-501, EPPN-502, LCE-21, and RE-602S (all manufactured by Nippon Kayaku Co., Ltd.), ADEKA RESIN EP series (e.g., EP-4080S, EP-4085S, and EP-4088S; manufactured by ADEKA Corporation), Celloxide 2021P, Celloxide 2081, Celloxide 2083, Celloxide 2085, EHPE3150, EPOLEAD PB 3600, and EPOLEAD PB 4700 (all manufactured by Daicel Corporation), Denacol Examples of the epoxy group-containing polymer include EX-212L, EX-214L, EX-216L, EX-321L, and EX-850L (all manufactured by Nagase ChemteX Corporation), Marproof G-0150M, G-0105SA, G-0130SP, G-0250SP, G-1005S, G-1005SA, G-1010S, G-2050M, G-01100, and G-01758 (all manufactured by NOF Corporation, epoxy group-containing polymers), and Epotohto ZX-1059 (manufactured by Nippon Steel Chemical & Material Co., Ltd.).

[0142] The content of the thermosetting compound in the total solid content of the thermosetting composition is preferably 10% by mass or more, more preferably 15% by mass or more, and even more preferably 20% by mass or more. The upper limit can be set to 99% by mass or less. The thermosetting composition may contain only one type of thermosetting compound, or may contain two or more types. When two or more types of thermosetting compounds are contained, the total amount thereof is preferably within the above range.

[0143] <<Thermosetting Auxiliary Agent>> The thermosetting composition of the present invention contains at least one thermosetting auxiliary agent selected from a thermal polymerization initiator and a polymerization catalyst. The type of thermosetting auxiliary agent can be appropriately selected depending on the thermosetting compound.

[0144] The thermal polymerization initiator may be a compound that generates active species such as radicals or cations upon heating, specifically a thermal radical polymerization initiator or a thermal cationic polymerization initiator.

[0145] The thermal radical polymerization initiator is a compound that generates radicals upon heating, and examples of the thermal radical polymerization initiator include aromatic ketone compounds, onium salt compounds, organic peroxides, azo compounds, thio compounds, hexaarylbiimidazole compounds, ketoxime ester compounds, borate compounds, azinium compounds, metallocene compounds, active ester compounds, and compounds having a carbon-halogen bond.

[0146] Examples of the azo compound include 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile), 2,2'-azobis(2,4-dimethylvaleronitrile), dimethyl-2,2'-azobis(2-methylpropionate), 2,2'-azobis(2-methylbutyronitrile), 1,1'-azobis(cyclohexane-1-carbonitrile), 2,2'-azobis[N-(2-propenyl)2-methylpropionamide], 1-[(1-cyano-1-methylethyl)azo]formamide, 2,2'-azobis(N-butyl-2-methylpropionamide), and 2,2'-azobis(N-cyclohexyl-2-methylpropionamide). Commercially available azo compounds include V-70, V-65, V-60, V-59, V-40, V-30, V-501, V-601, VE-073, VA-080, VA-086, VF-096, VAm-110, VAm-111, VA-044, VA-046B, VA-060, VA-061, V-50, VA-057, VA-067, and VR-110 (all manufactured by Wako Pure Chemical Industries, Ltd.).

[0147] Examples of organic peroxides include methyl ethyl ketone peroxide, cyclohexanone peroxide, 3,3,5-trimethylcyclohexanone peroxide, methylcyclohexanone peroxide, acetylacetone peroxide, 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane, 1,1-bis(tert-butylperoxy)cyclohexane, 2,2-bis(tert-butylperoxy)butane, tert-butyl hydroperoxide, cumene hydroperoxide, diisopropyl methyl ketone peroxide, methyl cyclohexanone peroxide, methyl methyl ketone ... Propylbenzene hydroperoxide, paramethane hydroperoxide, 2,5-dimethylhexane-2,5-dihydroperoxide, 1,1,3,3-tetramethylbutyl hydroperoxide, tert-butylcumyl peroxide, dicumyl peroxide, bis(tert-butylperoxyisopropyl)benzene, 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane, 2,5-xanoyl peroxide, succinic peroxide, benzoyl peroxide, 2,4-dichlorobenzoyl peroxide Side, meta-toluoyl peroxide, diisopropyl peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, di-2-ethoxyethyl peroxydicarbonate, dimethoxyisopropyl peroxycarbonate, di(3-methyl-3-methoxybutyl) peroxydicarbonate, tert-butyl peroxyacetate, tert-butyl peroxypivalate, tert-butyl peroxyneodecanoate, tert-butyl peroxyoctanoate, tert-butylperoxy-3,5 ,5-trimethylhexanoate, tert-butylperoxylaurate, 3,3'4,4'-tetra-(tert-butylperoxycarbonyl)benzophenone, 3,3'4,4'-tetra-(t-amylperoxycarbonyl)benzophenone, 3,3'4,4'-tetra-(tert-hexylperoxycarbonyl)benzophenone, 3,3'4,4'-tetra-(tert-octylperoxycarbonyl)benzophenone, 3,3'4,4'-tetra-(cumylperoxycarbonyl)benzophenone, 3,3'4,Examples of commercially available organic peroxides include 4'-tetra-(p-isopropylcumylperoxycarbonyl)benzophenone, carbonyl di(tert-butylperoxydihydrogen diphthalate), carbonyl di(tert-hexylperoxydihydrogen diphthalate), etc. Commercially available organic peroxides include Pertetra A, Perhexa HC, Perhexa C, Perhexa V, Perhexa 22, Perbutyl H, Percumyl H, Percumyl P, Permenta H, Perocta H, Perbutyl C, Perbutyl D, Perhexyl D, Perloyl IB, Perloyl 355, Perloyl L, Perloyl SA, Niper BW, Niper BMT-K40, Niper BMT-M, Perloyl IPP, Perloyl NPP, Perloyl TCP, and Perloyl O. Examples of such phenols include PP, Peroyl SBP, Percumyl ND, Perocta ND, Perhexyl ND, Perbutyl ND, Perhexyl PV, Perbutyl PV, Perhexa 25O, Perocta O, Perhexyl O, Perbutyl O, Perbutyl L, Perbutyl 355, Perhexyl I, Perbutyl I, Perbutyl E, Perhexa 25Z, Perbutyl A, Perhexyl Z, Perbutyl ZT, and Perbutyl Z (all manufactured by NOF Corporation).

[0148] The thermal cationic polymerization initiator is a compound that generates cations upon heating, and examples of the thermal cationic polymerization initiator include diazomethane compounds, sulfonate compounds, carboxylate compounds, phosphate compounds, sulfonimide compounds, sulfonebenzotriazole compounds, and organic onium salt compounds.

[0149] Examples of the organic onium salt compound include organic onium salt compounds in which a cation component and an anion component are paired. Examples of the cation component include organic sulfonium, organic oxonium, organic ammonium, organic phosphonium, and organic iodonium. Examples of the anion component include BF ４ － , B(C ６ F ５ ) ４ － , SbF ６ － , AsF ６ － , P.F.６ － , C.F. ３ SO ３ － , C ４ F ９ SO ３ － , (CF ３ SO ２ ) ３ C － Examples of the organic onium salt compound include diphenyl(methyl)sulfonium tetrafluoroborate, benzyl(4-hydroxyphenyl)methylsulfonium hexafluoroantimonate, (4-hydroxyphenyl)methyl(2-methylbenzyl)sulfonium hexafluoroantimonate, and (4-hydroxyphenyl)dimethylsulfonium hexafluorophosphate.

[0150] Examples of sulfonate compounds include cyclohexyl p-toluenesulfonate, tetraethylene glycol bis(p-toluenesulfonate), butyl p-toluenesulfonate, 4-hydroxyphenyldimethylsulfonium trifluoromethanesulfonate, benzyl-4-hydroxyphenylmethylsulfonium trifluoromethanesulfonate, 2-methylbenzyl-4-hydroxyphenylmethylsulfonium trifluoromethanesulfonate, 4-acetoxyphenyldimethylsulfonium trifluoromethanesulfonate, 4-acetoxyphenylbenzylmethylsulfonium trifluoromethanesulfonate, 4-(methoxycarbonyloxy)phenyldimethylsulfonium trifluoromethanesulfonate, and benzyl-4-(methoxycarbonyloxy)phenylmethylsulfonium trifluoromethanesulfonate.

[0151] Examples of sulfonimide compounds include N-(trifluoromethylsulfonyloxy)succinimide (trade name "SI-105", Midori Chemical Co., Ltd.), N-(camphorsulfonyloxy)succinimide (trade name "SI-106", Midori Chemical Co., Ltd.), N-(4-methylphenylsulfonyloxy)succinimide (trade name "SI-101", Midori Chemical Co., Ltd.), N-(2-trifluoromethylphenylsulfonyloxy)succinimide, N-(4-fluorophenylsulfonyloxy)succinimide, N-(trifluoromethylsulfonyloxy)succinimide, N-(camphorsulfonyloxy)phthalimide, N-(2-trifluoromethylphenylsulfonyloxy)phthalimide, N-(2-fluorophenylsulfonyloxy)phthalimide, N-(trifluoromethylsulfonyloxy)diphenylmaleimide (trade name "PI-105", Midori Chemical Co., Ltd.), N-(camphorsulfonyloxy)diphenylmaleimide, 4-methylphenylsulfonyloxy)diphenylmaleimide, N-(2-trifluoromethylphenylsulfonyloxy)diphenylmaleimide , N-(4-fluorophenylsulfonyloxy)diphenylmaleimide, N-(4-fluorophenylsulfonyloxy)diphenylmaleimide, N-(phenylsulfonyloxy)bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylimide (trade name "NDI-100", Midori Chemical Co., Ltd.), N-(4-methylphenylsulfonyloxy)bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylimide (trade name "NDI-101", Midori Chemical Co., Ltd.), N-(trifluoromethanesulfonyloxy)bicyclo[2 2.1]hept-5-ene-2,3-dicarboxylimide (trade name "NDI-105", Midori Chemical Co., Ltd.), N-(nonafluorobutanesulfonyloxy)bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylimide (trade name "NDI-109", Midori Chemical Co., Ltd.), N-(camphorsulfonyloxy)bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylimide (trade name "NDI-106", Midori Chemical Co., Ltd.), N-(camphorsulfonyloxy)-7-oxabicyclo[2.2.1]hept-5-ene-2,3-dicarboxylimide3-Dicarboxylimide, N-(trifluoromethylsulfonyloxy)-7-oxabicyclo[2.2.1]hept-5-ene-2,3-dicarboxylimide, N-(4-methylphenylsulfonyloxy)bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylimide, N-(4-methylphenylsulfonyloxy)-7-oxabicyclo[2.2.1]hept-5-ene-2,3-dicarboxylimide, N-(2-trifluoromethylphenylsulfonyloxy)bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylimide, N-(2-trifluoromethylphenylsulfonyloxy)-7-oxabicyclo[2.2.1]hept-5-ene-2,3-dicarboxylimide, N-(4-fluorophenylsulfonyloxy)bicyclo[2.2.1]hept-5-ene-2 ,3-dicarboxylimide, N-(4-fluorophenylsulfonyloxy)-7-oxabicyclo[2.2.1]hept-5-ene-2,3-dicarboxylimide, N-(trifluoromethylsulfonyloxy)bicyclo[2.2.1]heptane-5,6-oxy-2,3-dicarboxylimide, N-(camphorsulfonyloxy)bicyclo[2.2.1]heptane-5,6-oxy-2,3-dicarboxylimide, N-(4-methylphenylsulfonyloxy)bicyclo[2.2.1]heptane-5,6-oxy-2,3-dicarboxylimide, N-(2-trifluoromethylphenylsulfonyloxy)bicyclo[2.2.1]heptane-5,6-oxy-2,3-dicarboxylimide, N-(4-fluorophenylsulfonyloxy)bicyclo[2.2.1]heptane-5,6-oxy-2,3-dicarboxylimide,3-Dicarboxylimide, N-(trifluoromethylsulfonyloxy)naphthyldicarboxylimide (trade name "NAI-105", Midori Chemical Co., Ltd.), N-(camphorsulfonyloxy)naphthyldicarboxylimide (trade name "NAI-106", Midori Chemical Co., Ltd.), N-(4-methylphenylsulfonyloxy)naphthyldicarboxylimide (trade name "NAI-101", Midori Chemical Co., Ltd.), N-(phenylsulfonyloxy)naphthyldicarboxylimide (trade name "NAI-100", Midori Chemical Co., Ltd.), N-(2-trifluoromethylphenylsulfonyloxy)naphthyldicarboxylimide, N-(4-fluorophenylsulfonyloxy)naphthyldicarboxylimide, N-(pentafluoroethylsulfonyloxy)naphthyldicarboxylimide, N-(heptafluoropropyl Examples thereof include N-(propylsulfonyloxy)naphthyldicarboxylimide, N-(nonafluorobutylsulfonyloxy)naphthyldicarboxylimide (trade name "NAI-109", Midori Chemical Co., Ltd.), N-(ethylsulfonyloxy)naphthyldicarboxylimide, N-(propylsulfonyloxy)naphthyldicarboxylimide, N-(butylsulfonyloxy)naphthyldicarboxylimide (trade name "NAI-1004", Midori Chemical Co., Ltd.), N-(pentylsulfonyloxy)naphthyldicarboxylimide, N-(hexylsulfonyloxy)naphthyldicarboxylimide, N-(heptylsulfonyloxy)naphthyldicarboxylimide, N-(octylsulfonyloxy)naphthyldicarboxylimide, and N-(nonylsulfonyloxy)naphthyldicarboxylimide.

[0152] Commercially available thermal cationic polymerization initiators include San-Aid SI-45, SI-47, SI-60, SI-60L, SI-80, SI-80L, SI-100, SI-100L, SI-110, SI-110L, SI-145, SI-150, SI-160, SI-180L, SI-B3, SI-B2A, and SI-B3A. B3A, SI-B4, SI-300 (manufactured by Sanshin Chemical Industry Co., Ltd.), CI-2921, CI-2920, CI-2946, CI-3128, CI-2624, CI-2639, CI-2064 (manufactured by Nippon Soda Co., Ltd.), CP-66, CP-77 (manufactured by ADEKA Corporation), FC-520 (manufactured by 3M), K-PURE TAG-2396, TAG-2713S, TAG-2713, TAG-2172, TAG-2179, TAG-2168E, TAG-2722, TAG-2507, T AG-2678, TAG-2681, TAG-2679, TAG-2689, TAG-2690, TAG-2700, TAG-2710, TAG-2100 (KING INDUSTRY), CDX-3027, CXC-1615, CXC-1616, CXC-1750, CXC-1738, CXC-1614, CXC-1742, CXC-1743, CXC-1613 , CXC-1739, CXC-1751, CXC-1766, CXC-1763, CXC-1736, CXC-1756, CXC-1821, CXC-1802-60 (manufactured by Kusumoto Kasei Co., Ltd.).

[0153] Examples of the polymerization catalyst include tertiary amine compounds and salts thereof, such as diazabicycloundecene, diazabicyclononene, and tris(dimethylaminomethyl)phenol; phosphine compounds, such as tributylphosphine, tricyclohexylphosphine, triphenylphosphine, tri(o-tolyl)phosphine, and 1,3,5-triaza-7-phosphaadamantane; phosphonium salts, such as ethyltriphenylphosphonium chloride, tetrabutylphosphonium bromide, ethyltriphenylphosphonium bromide, tetrabutylphosphonium iodide, ethyltriphenylphosphonium iodide, and tetraphenylphosphonium tetraphenylborate; imidazole compounds, such as 1-cyanoethyl-2-ethyl-4-methylimidazole and 2-ethyl-4-methylimidazole; bismuth compounds, such as bismuth carboxylate; tin compounds, such as dibutyltin dichloride and dibutyltin; and metal complex compounds, such as aluminum complexes and zirconium complexes.

[0154] Commercially available polymerization catalysts include the Neostan series (for example, Neostan U-600) manufactured by Nitto Kasei Co., Ltd. and the K-KAT series manufactured by King Industries.

[0155] The content of the thermosetting aid is preferably 0.001 to 10 parts by mass per 100 parts by mass of the thermosetting compound. The upper limit is preferably 8 parts by mass or less, and more preferably 5 parts by mass or less. The lower limit is preferably 0.002 parts by mass or more, and more preferably 0.005 parts by mass or more. The thermosetting composition may contain only one type of thermosetting aid, or may contain two or more types. When two or more types of thermosetting aids are contained, the total amount thereof is preferably within the above range.

[0156] <<Curing Agent>> The thermosetting composition of the present invention may further contain a curing agent. By containing a curing agent, a cured product having excellent properties such as solvent resistance can be formed. The curing agent can be appropriately selected depending on the type of thermosetting compound. Examples of curing agents include polythiol compounds, polyol compounds, amine compounds, phenol compounds, guanidine compounds, imidazole compounds, naphthol compounds, acrylic compounds, acid anhydrides, active ester compounds, benzoxazine compounds, and cyanate ester compounds. Examples of thiol compounds and polyol compounds include the materials described above. In addition, examples of commercially available phenolic curing agents include KAYAHARD GPH-65 (Nippon Kayaku Co., Ltd.).

[0157] The content of the curing agent is preferably 5 to 90 parts by mass relative to 100 parts by mass of the thermosetting compound. The upper limit is preferably 85 parts by mass or less, more preferably 80 parts by mass or less. The lower limit is preferably 8 parts by mass or more, more preferably 10 parts by mass or more. The thermosetting composition may contain only one type of curing agent, or may contain two or more types. When two or more types of curing agents are contained, the total amount thereof is preferably within the above range.

[0158] <<Other Resins>> The thermosetting composition of the present invention may further contain resins other than the thermosetting compound. Examples of the other resins include (meth)acrylic resins, ene-thiol resins, polyester resins, polycarbonate resins, vinyl polymers [e.g., polydiene resins, polyalkene resins, polystyrene resins, polyvinyl ether resins, polyvinyl alcohol resins, polyvinyl ketone resins, polyfluorovinyl resins, and polyvinyl bromide resins], polythioether resins, polyphenylene resins, polyurethane resins, polysulfonate resins, nitrosopolymer resins, polysiloxane resins, polysulfide resins, polythioester resins, polysulfone resins, polysulfonamide resins, polyamide resins, polyimine resins, polyurea resins, polyphosphazene resins, polysilane resins, polysilazane resins, polyfuran resins, and polybenzoxane resins. Examples of the resin include oxazole resin, polyoxadiazole resin, polybenzothiazinophenothiazine resin, polybenzothiazole resin, polypyrazinoquinoxaline resin, polyquinoxaline resin, polybenzimidazole resin, polyoxoisoindoline resin, polydioxoisoindoline resin, polytriazine resin, polypyridazine resin, polypiperazine resin, polypyridine resin, polypiperidine resin, polytriazole resin, polypyrazole resin, polypyrrolidine resin, polycarborane resin, polyoxabicyclononane resin, polydibenzofuran resin, polyphthalide resin, polyacetal resin, polyimide resin, polyamideimide resin, olefin resin, cyclic olefin resin, and cellulose acylate resin.

[0159] The other resin may be an alkali-soluble resin. Examples of the alkali-soluble resin include resins having an acid group. Examples of the acid group include a carboxyl group, a phosphoric acid group, a sulfonic acid group, and a phenolic hydroxy group. The acid group may be of only one type, or may be of two or more types.

[0160] The alkali-soluble resin is preferably one that is soluble in an organic solvent and can be developed with a weak alkaline aqueous solution. Examples of such alkali-soluble resins include polymers having a carboxyl group in the side chain, such as methacrylic acid copolymers, acrylic acid copolymers, itaconic acid copolymers, crotonic acid copolymers, maleic acid copolymers, and partially esterified maleic acid copolymers, as described in JP-A-59-044615, JP-B-54-034327, JP-B-58-012577, JP-B-54-025957, JP-A-59-053836, and JP-A-59-071048, and acidic cellulose derivatives having a carboxyl group in the side chain.

[0161] As the alkali-soluble resin, a resin obtained by adding an acid anhydride to a polymer having a hydroxy group is also useful.

[0162] The alkali-soluble resin may be a resin copolymerized with a hydrophilic monomer. Examples of hydrophilic monomers include alkoxyalkyl (meth)acrylate, hydroxyalkyl (meth)acrylate, glycerol (meth)acrylate, (meth)acrylamide, N-methylolacrylamide, secondary or tertiary alkylacrylamide, dialkylaminoalkyl (meth)acrylate, morpholine (meth)acrylate, N-vinylpyrrolidone, N-vinylcaprolactam, vinylimidazole, vinyltriazole, methyl (meth)acrylate, ethyl (meth)acrylate, branched or linear propyl (meth)acrylate, branched or linear butyl (meth)acrylate, and phenoxyhydroxypropyl (meth)acrylate. Other useful hydrophilic monomers include monomers containing a tetrahydrofurfuryl group, a phosphate group, a phosphate ester group, a quaternary ammonium base, an ethyleneoxy chain, a propyleneoxy chain, a sulfonic acid group and a group derived from a salt thereof, and a morpholinoethyl group.

[0163] The weight average molecular weight of the alkali-soluble resin is preferably 3,000 to 200,000, and more preferably 5,000 to 50,000.

[0164] The acid value of the alkali-soluble resin is preferably 30 to 200 mgKOH / g. The lower limit of the acid value is preferably 50 mgKOH / g or more, more preferably 70 mgKOH / g or more. The upper limit of the acid value is preferably 150 mgKOH / g or less, more preferably 120 mgKOH / g or less. The acid value of the resin is measured in accordance with JIS K0070 (1992) and calculated by converting 1 mmol / g = 56.1 mgKOH / g.

[0165] For the alkali-soluble resin, the description in paragraphs 0558 to 0571 of JP-A-2012-208494 (corresponding to paragraphs 0685 to 0700 of U.S. Patent Application Publication No. 2012 / 0235099) and the description in paragraphs 0076 to 0099 of JP-A-2012-198408 can be referred to, the contents of which are incorporated herein by reference.

[0166] The content of the other resin in the total solid content of the thermosetting composition is preferably 80% by mass or less, more preferably 60% by mass or less, and even more preferably 50% by mass or less. The lower limit can be 1% by mass or more. The thermosetting composition may contain only one type of other resin, or may contain two or more types. When two or more types of other resins are contained, it is preferable that the total amount thereof is within the above range. It is also preferable that the thermosetting composition of the present invention does not contain any other resin.

[0167] <<Surfactant>> The thermosetting composition of the present invention may contain a surfactant. Examples of the surfactant include those described in paragraph

[0017] of Japanese Patent No. 4,502,784 and paragraphs

[0060] to

[0071] of JP-A-2009-237362.

[0168] The surfactant is preferably a nonionic surfactant, a fluorine-based surfactant, or a silicone-based surfactant.

[0169] Commercially available fluorine-based surfactants include Megafac F-171, F-172, F-173, F-176, F-177, F-141, F-142, F-143, F-144, F-437, F-475, F-477, F-479, F-482, F-551-A, F-552, F-554, F-555-A, F-556, F-557, F-558, F-559, and F-5 60, F-561, F-565, F-563, F-568, F-575, F-780, EXP, MFS-330, R-41, R-41-LM, R-01, R-40, R-40-LM, RS-43, TF-1956, RS-90, R-94, RS-72-K, DS-21 (all manufactured by DIC Corporation), Fluorad FC430, FC431, FC171 (all manufactured by Sumitomo 3M Limited), Surflon S-382, SC-101, SC-103, SC-104, SC-105, SC-1068, SC-381, SC-383, S-393, KH-40 (all manufactured by AGC Inc.), PolyFox PF636, PF656, PF6320, PF6520, PF7002 (all manufactured by OMNOVA), Ftergent Examples include 710FM, 610FM, 601AD, 601ADH2, 602A, 215M, 245F, 251, 212M, 250, 209F, 222F, 208G, 710LA, 710FS, 730LM, 650AC, and 681 (all manufactured by NEOS Corporation).

[0170] As the fluorosurfactant, an acrylic compound having a molecular structure with a functional group containing a fluorine atom, which cleaves the functional group when heated, causing the fluorine atom to volatilize, can also be suitably used. Examples of such fluorosurfactants include the Megafac DS series manufactured by DIC Corporation (The Chemical Daily (February 22, 2016), The Nikkei Business Daily (February 23, 2016)), such as Megafac DS-21.

[0171] As the fluorine-based surfactant, it is also preferable to use a polymer of a fluorine atom-containing vinyl ether compound having a fluorinated alkyl group or a fluorinated alkylene ether group and a hydrophilic vinyl ether compound.

[0172] The fluorine-based surfactant may also be a block polymer.

[0173] As the fluorine-based surfactant, a fluorine-containing polymer compound containing a repeating unit derived from a (meth)acrylate compound having a fluorine atom and a repeating unit derived from a (meth)acrylate compound having two or more (preferably five or more) alkyleneoxy groups (preferably ethyleneoxy groups or propyleneoxy groups) can also be used.

[0174] The fluorine-containing surfactant may also be a fluorine-containing polymer having an ethylenically unsaturated bond-containing group in the side chain. Commercially available products include Megafac RS-101, RS-102, RS-718K, and RS-72-K (all manufactured by DIC Corporation).

[0175] Furthermore, since there are concerns about the environmental compatibility of compounds having a linear perfluoroalkyl group having seven or more carbon atoms, it is preferable to use a fluorosurfactant that uses an alternative material to perfluorooctanoic acid (PFOA) or perfluorooctanesulfonic acid (PFOS).

[0176] Examples of silicone surfactants include linear polymers formed from siloxane bonds and modified siloxane polymers having organic groups introduced into the side chains or terminals. Commercially available silicone surfactants include DOWSIL 8032 ADDITIVE, Toray Silicone DC3PA, Toray Silicone SH7PA, Toray Silicone DC11PA, Toray Silicone SH21PA, Toray Silicone SH28PA, Toray Silicone SH29PA, Toray Silicone SH30PA, and Toray Silicone SH8400 (all manufactured by Dow Corning Toray Co., Ltd.), X-22-4952, X-22-4272, X-22-6266, KF-351A, K354L, KF-355A, and KF-94. No. 5, KF-640, KF-642, KF-643, X-22-6191, X-22-4515, KF-6004, KP-341, KF-6001, KF-6002 (all manufactured by Shin-Etsu Silicones Co., Ltd.), F-4440, TSF-4300, TSF-4445, TSF-4460, TSF-4452 (all manufactured by Momentive Performance Materials), BYK307, BYK323, BYK330 (all manufactured by BYK-Chemie).

[0177] Examples of nonionic surfactants include glycerol, trimethylolpropane, trimethylolethane, and their ethoxylates and propoxylates (for example, glycerol propoxylate, glycerol ethoxylate, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, and sorbitan fatty acid esters. Commercially available nonionic surfactants include Pluronic L10, L31, L61, L62, 10R5, 17R2, and 25R2 (manufactured by BASF), Tetronic 304, 701, 704, 901, 904, and 150R1 (manufactured by BASF), Solsperse 20000 (manufactured by Lubrizol Nippon Co., Ltd.), NCW-101, NCW-1001, and NCW-1002 (manufactured by Fujifilm Wako Pure Chemical Industries Co., Ltd.), Paionin D-6112, D-6112-W, and D-6315 (manufactured by Takemoto Oil & Fat Co., Ltd.), and Olfine E1010 and Surfynol 104, 400, and 440 (manufactured by Nissin Chemical Industry Co., Ltd.).

[0178] The content of the surfactant in the total solid content of the thermosetting composition is preferably 0.001% by mass to 5.0% by mass. The lower limit is preferably 0.005% by mass or more, more preferably 0.01% by mass or more, even more preferably 0.05% by mass or more, and particularly preferably 0.10% by mass or more. The upper limit is preferably 3.0% by mass or less, more preferably 1.0% by mass or less, and even more preferably 0.80% by mass or less. Only one type of surfactant may be used, or two or more types may be used. When two or more types are used, it is preferable that the total amount be within the above range.

[0179] <<Organic Solvent>> The thermosetting composition of the present invention may contain an organic solvent. Examples of the organic solvent include alcohol-based solvents, ester-based solvents, ether-based solvents, ketone-based solvents, amide-based solvents, hydrocarbon-based solvents, and halogen-based solvents. Specific examples of the alcohol-based solvent include methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, 2-methyl-1-propanol, 1-methoxy-2-propanol, 2-ethoxyethanol, 2-butoxyethanol, ethylene glycol, propylene glycol, and glycerin. Specific examples of ester solvents include methyl acetate, ethyl acetate, n-butyl acetate, isobutyl acetate, amyl formate, isoamyl acetate, isobutyl acetate, butyl propionate, isopropyl butyrate, ethyl butyrate, butyl butyrate, methyl lactate, ethyl lactate, alkoxyacetic acid alkyl esters (e.g., methyl alkoxyacetate, ethyl alkoxyacetate, butyl alkoxyacetate (specifically, methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, etc.)), 3-oxypropionic acid alkyl esters, and 2-oxypropionic acid alkyl esters. , methyl 2-oxy-2-methylpropionate, ethyl 2-oxy-2-methylpropionate, methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, methyl 2-oxobutanoate, ethyl 2-oxobutanoate, methyl cellosolve acetate, ethyl cellosolve acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethylene carbonate, and the like.Specific examples of ether-based solvents include diethylene glycol dimethyl ether, tetrahydrofuran, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, polyethylene glycol monoalkyl ether, polypropylene glycol monoalkyl ether, polyethylene glycol, polypropylene glycol, ethylene glycol dialkyl ether, propylene glycol dialkyl ether, polyethylene glycol dialkyl ether, polypropylene glycol dialkyl ether, and dioxane. Specific examples of amide-based solvents include N-methylpyrrolidone, dimethylformamide, and dimethylacetamide. Specific examples of ketone-based solvents include methyl ethyl ketone, cyclohexanone, cyclopentanone, 2-heptanone, and 3-heptanone. Specific examples of hydrocarbon-based solvents include toluene and xylene. Specific examples of halogen-based solvents include chloroform and methylene chloride. Two or more of these organic solvents may be used in combination.

[0180] The organic solvent preferably contains at least one selected from methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl cellosolve acetate, ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, cyclohexanone, cyclopentanone, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether, and propylene glycol monomethyl ether acetate.

[0181] The content of the organic solvent in the thermosetting composition is preferably 95% by mass or less. One preferred embodiment is one in which the content of the organic solvent in the thermosetting composition is 10 to 95% by mass. In this embodiment, the content of the organic solvent in the thermosetting composition is preferably 30 to 95% by mass, and more preferably 50 to 95% by mass. Another preferred embodiment is one in which the content of the organic solvent in the thermosetting composition is 10% by mass or less. In this embodiment, the content of the organic solvent in the thermosetting composition is preferably 5% by mass or less, and more preferably 1% by mass or less. Alternatively, the thermosetting composition may be substantially free of organic solvent. A thermosetting composition that is substantially free of organic solvent means that the content of the organic solvent in the thermosetting composition is 0.1% by mass or less, preferably 0.01% by mass or less, and more preferably contains no organic solvent.

[0182] <<Other Additives>> The thermosetting composition of the present invention may contain any additives, such as an antioxidant, a light stabilizer, a processing stabilizer, an antiaging agent, a polymerization inhibitor, a flame retardant, and an antistatic agent, as needed.

[0183] <Method for producing thermosetting composition> The method for producing the thermosetting composition of the present invention is not particularly limited. For example, the thermosetting composition can be produced by mixing an ultraviolet absorber, a thermosetting compound, a thermosetting auxiliary, and optional components as needed.

[0184] When producing a thermosetting composition, the components contained in the thermosetting composition may be blended all at once, or the components may be dissolved or dispersed in a solvent and then blended sequentially. The order of addition and working conditions for blending are not particularly limited. For example, the thermosetting composition may be produced by simultaneously dissolving or dispersing all the components in a solvent, or, if necessary, the components may be prepared as two or more solutions or dispersions, which are mixed at the time of use (application) to prepare the thermosetting composition.

[0185] When producing a thermosetting composition, it is preferable to filter the components after mixing them for the purpose of removing foreign matter and reducing defects. Filters that have traditionally been used for filtration purposes can be used without any particular limitation. Specific examples include filters made of fluororesins such as PTFE (polytetrafluoroethylene), polyamide resins such as nylon-6 and nylon-6,6, and polyolefin resins (including high-density and ultra-high-molecular-weight ones) such as polyethylene and polypropylene (PP). Among these filter materials, polyamide resins such as nylon-6 and nylon-6,6, and polypropylene (including high-density polypropylene) are preferred. The pore size of the filter is preferably 0.01 to 7.0 μm, more preferably 0.01 to 2.5 μm, and even more preferably 0.01 to 2.0 μm. The nominal value of the filter manufacturer can be referenced for the pore size value of the filter. As the filter, various filters provided by Nippon Pall Corporation (DFA4201NXEY, DFA4201NAEY, DFA4201J006P, etc.), Advantec Toyo Co., Ltd., Nippon Integris Co., Ltd. (formerly Nippon Microlith Co., Ltd.), Kitz Microfilter Co., Ltd., etc. can be used.

[0186] When using filters, different filters (e.g., a first filter and a second filter) may be combined. In this case, filtration with each filter may be performed only once or twice or more times. Furthermore, filters with different pore sizes within the above-mentioned range may be combined.

[0187] <Applications of Thermosetting Composition> The thermosetting composition of the present invention can also be suitably used in applications where it may be exposed to sunlight or light including ultraviolet rays. Specific examples include coating materials or films for window glass in homes, facilities, transportation equipment, etc.; interior and exterior materials and interior and exterior paints for homes, facilities, transportation equipment, etc.; ultraviolet light source components such as fluorescent lamps and mercury lamps; components for solar cells, precision machinery, electronic and electrical equipment, and display devices; containers or packaging materials for food, chemicals, medicines, etc.; agricultural and industrial sheets; textile products and fibers for clothing such as sportswear, stockings, and hats; lenses or coating materials for such lenses as plastic lenses, contact lenses, glasses, and artificial eyes; optical products such as optical filters, prisms, mirrors, and photographic materials; stationery such as tapes and inks; sign plates, markers, etc., and surface coating materials thereof. For details of these, please refer to paragraphs 0158 to 0218 of JP-A-2009-263617 and paragraphs 0161 to 0194 of JP-A-2009-096971, the contents of which are incorporated herein by reference.

[0188] The thermosetting composition of the present invention can be preferably used for optical components, etc. For example, it is preferably used as a thermosetting composition for an ultraviolet cut filter, a lens, or a protective material. The form of the protective material is not particularly limited, but examples include a coating film, a film, and a sheet. The thermosetting composition of the present invention can also be used as a pressure-sensitive adhesive or an adhesive.

[0189] The thermosetting composition of the present invention can also be used in various components of display devices. For example, in the case of a liquid crystal display device, it can be used in components constituting the liquid crystal display device, such as an antireflection film, a polarizing plate protective film, an optical film, a retardation film, a pressure-sensitive adhesive, and an adhesive. In the case of an organic electroluminescence display device, it can be used in components constituting the organic electroluminescence display device, such as an optical film, a polarizing plate protective film in a circular polarizer, a retardation film such as a quarter-wave plate, an adhesive, or a pressure-sensitive adhesive.

[0190] <Cured Product and Applications Thereof> The cured product of the present invention is obtained by using the above-described thermosetting composition of the present invention.

[0191] The cured product of the present invention may be a molded product obtained by molding the thermosetting composition into a desired shape and heat curing it. The shape of the molded product can be appropriately selected depending on the application and purpose. Examples of the molded product include a coating film, a film, a sheet, a plate, a lens, a tube, and a fiber.

[0192] The cured product of the present invention is preferably used as an optical element, such as an ultraviolet cut filter, a lens, or a protective material. It can also be used as a polarizing plate.

[0193] The ultraviolet cut filter can be used in products such as optical filters, display devices, solar cells, window glass, etc. The type of display device is not particularly limited, but examples include liquid crystal display devices and organic electroluminescence display devices.

[0194] When the cured product of the present invention is used for a lens, the cured product of the present invention itself may be formed into a lens shape and used. The cured product of the present invention may also be used as a coating film on a lens surface or as an intermediate layer (adhesive layer) of a cemented lens. Examples of cemented lenses include those described in paragraphs 0094 to 0102 of WO 2019 / 131572, the contents of which are incorporated herein by reference.

[0195] The type of protective material is not particularly limited, but examples thereof include protective materials for display devices, protective materials for solar cells, protective materials for window glass, organic electroluminescence display devices, etc. The shape of the protective material is not particularly limited, but examples thereof include coating film, film, sheet, etc.

[0196] <Optical Element> The optical element of the present invention includes a cured product obtained using the above-described thermosetting composition of the present invention. The cured product of the present invention may be a molded product obtained by molding the above-described thermosetting composition of the present invention into a desired shape and thermally curing it. The shape of the molded product can be appropriately selected depending on the application and purpose. Examples of shapes include a coating film, a film, a sheet, a plate, a lens, a tube, and a fiber.

[0197] The optical members include ultraviolet cut filters, lenses, and protective materials.

[0198] The ultraviolet cut filter can be used in products such as optical filters, display devices, solar cells, window glass, etc. The type of display device is not particularly limited, but examples include liquid crystal display devices and organic electroluminescence display devices.

[0199] Examples of lenses include those in which the cured product of the present invention itself is formed into a lens shape; and those in which the cured product of the present invention is used as a coating film on the surface of a lens or as an intermediate layer (adhesive layer or pressure-sensitive adhesive layer) of a cemented lens.

[0200] The type of protective material is not particularly limited, but examples thereof include protective materials for display devices, protective materials for solar cells, protective materials for window glass, etc. The shape of the protective material is not particularly limited, but examples thereof include coating film, film, sheet, etc.

[0201] Another embodiment of the optical member is an optical member having a laminate of a support and a resin layer, in which at least one of the support and the resin layer contains the cured product of the present invention.

[0202] The thickness of the resin layer in the laminate is preferably 1 μm to 2500 μm, and more preferably 10 μm to 500 μm.

[0203] The support in the laminate is preferably a material having transparency to the extent that the optical performance is not impaired. The support being transparent means that the support is optically transparent, specifically, the support has a total light transmittance of 85% or more. The total light transmittance of the support is preferably 90% or more, more preferably 95% or more.

[0204] A suitable example of the support is a resin film. Examples of resins constituting the resin film include ester resins (e.g., polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), polycyclohexanedimethylene terephthalate (PCT)), olefin resins (e.g., polypropylene (PP), polyethylene (PE)), polyvinyl chloride (PVA), tricellulose acetate (TAC), etc. Among these, PET is preferred in terms of versatility.

[0205] The thickness of the support can be appropriately selected depending on the application or purpose, etc. In general, the thickness is preferably 5 μm to 2500 μm, and more preferably 20 μm to 500 μm.

[0206] The support may be a peelable support. Such a laminate is preferably used for a polarizing plate or the like. Here, the peelable support refers to a support that can be peeled from the resin film. The stress when peeling the support from the resin film is preferably 0.05 N / 25 mm or more and 2.00 N / 25 mm or less, more preferably 0.08 N / 25 mm or more and 0.50 N / 25 mm or less, and even more preferably 0.11 N / 25 mm or more and 0.20 N / 25 mm or less. The stress when peeling the support from the resin film was evaluated by first pasting and fixing the surface of the laminate cut to a width of 25 mm and a length of 80 mm to a glass substrate via an acrylic pressure-sensitive adhesive sheet, and then using a tensile tester (RTF-1210 manufactured by A&D Co., Ltd.), one end of the length direction of the test piece (one side of the 25 mm width) was gripped and a 90° peel test (in accordance with Japanese Industrial Standards (JIS) K 6854-1:1999 "Adhesives - Test method for peel adhesion strength - Part 1: 90° peel") was carried out in an atmosphere of 23°C and 60% relative humidity at a crosshead speed (grip movement speed) of 200 mm / min.

[0207] The release support preferably contains polyethylene terephthalate (PET) as the main component (the component with the highest mass content among the components constituting the support). From the viewpoint of mechanical strength, the weight-average molecular weight of PET is preferably 20,000 or more, more preferably 30,000 or more, and even more preferably 40,000 or more. The weight-average molecular weight of PET can be determined by dissolving the support in hexafluoroisopropanol (HFIP) and using the GPC method described above. The thickness of the support is not particularly limited, but is preferably 0.1 to 100 μm, more preferably 0.1 to 75 μm, even more preferably 0.1 to 55 μm, and particularly preferably 0.1 to 10 μm. The support may also be subjected to known surface treatments such as corona treatment, glow discharge treatment, and undercoating.

[0208] Another embodiment of the optical member is a laminate having a hard coat layer, a transparent support, and a pressure-sensitive adhesive layer or adhesive layer laminated in this order. Such a laminate is preferably used as an ultraviolet cut filter or a protective material (protective film, protective sheet). In this embodiment of the optical member, any of the support, the hard coat layer, and the pressure-sensitive adhesive layer or adhesive layer may contain the cured product of the present invention.

[0209] Examples of hard coat layers include those described in JP 2013-045045 A, JP 2013-043352 A, JP 2012-232459 A, JP 2012-128157 A, JP 2011-131409 A, JP 2011-131404 A, JP 2011-126162 A, JP 2011-075705 A, JP 2009-286981 A, JP 2009-263567 A, and JP 2009 The hard coat layer described in JP-A-075248, JP-A-2007-164206, JP-A-2006-096811, JP-A-2004-075970, JP-A-2002-156505, JP-A-2001-272503, WO 2012 / 018087, WO 2012 / 098967, WO 2012 / 086659, and WO 2011 / 105594 can be applied. The thickness of the hard coat layer is preferably 5 to 100 μm in order to further improve scratch resistance.

[0210] This optical component has a pressure-sensitive adhesive layer or adhesive layer on the side of the supporting substrate opposite the side having the hard coat layer. The type of pressure-sensitive adhesive or adhesive used in the pressure-sensitive adhesive layer or adhesive layer is not particularly limited, and known pressure-sensitive adhesives or adhesives can be used. It is also preferable to use a pressure-sensitive adhesive or adhesive containing an acrylic resin described in paragraphs 0056 to 0076 of JP 2017-142412 A and a crosslinking agent described in paragraphs 0077 to 0082 of JP 2017-142412 A. The pressure-sensitive adhesive or adhesive may also contain an adhesion improver (silane compound) described in paragraphs 0088 to 0097 of JP 2017-142412 A, and an additive described in paragraph 0098 of JP 2017-142412 A. The pressure-sensitive adhesive or adhesive layer can be formed by the method described in paragraphs 0099 to 0100 of JP 2017-142412 A. The thickness of the adhesive layer or the bonding layer is preferably 5 μm to 100 μm in terms of achieving both adhesive strength and ease of handling.

[0211] The optical member of the present invention can be preferably used as a component of a display such as a liquid crystal display device (LCD) or an organic electroluminescence display device (OLED).

[0212] Examples of liquid crystal display devices include those containing the cured product of the present invention in components such as antireflection films, polarizing plate protective films, optical films, retardation films, pressure-sensitive adhesives, adhesives, etc. Optical components containing the cured product of the present invention may be placed on either the viewer side (front side) or the backlight side of the liquid crystal cell, and may also be placed on either the side of the polarizer farther from the liquid crystal cell (outer side) or the side close to the liquid crystal cell (inner side).

[0213] Examples of organic electroluminescent display devices include those containing the cured product of the present invention in components such as optical films, polarizer protective films in circular polarizers, retardation films such as quarter-wave plates, adhesives, pressure-sensitive adhesives, etc. By using the cured product of the present invention in the above configuration, deterioration of the organic electroluminescent display device due to external light can be suppressed.

[0214] The present invention will be explained in more detail below with reference to examples. The materials, amounts used, ratios, processing details, processing procedures, etc. shown in the following examples can be appropriately changed without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below.

[0215] Test Example 1 Example 1-1 60 parts by mass of dicyclohexylmethane diisocyanate, 0.05 parts by mass of dimethyltin dichloride, and 0.10 parts by mass of an acidic phosphate ester (manufactured by Stepan, trade name Zelec UN) were mixed and dissolved at 10 to 15°C. Furthermore, 40 parts by mass of a polythiol primarily composed of 1,2-bis[(2-mercaptoethyl)thio]-3-mercaptopropane was added, and the mixture was degassed under reduced pressure for 1 hour and then filtered to produce thiourethane resin precursor 1. Subsequently, 10 g of thiourethane resin precursor 1 was mixed with 3 mg of the aforementioned compound 1-5 as a UV absorber and 0.001 g of dibutyltin dichloride, a polymerization catalyst and a heat curing aid, to obtain a thermosetting composition. The amount of UV absorber added was adjusted so that the cured product had an absorbance of 1 at a wavelength of 400 nm. The resulting thermosetting composition was filled into a mold and then heated at 130° C. for 2 hours to cure, thereby producing a cured product, which was a molded article having a thickness of 2 mm.

[0216] (Examples 1-2 to 1-10, Comparative Examples 1-1 and 1-2) Thermosetting compositions and molded articles were produced in the same manner as in Example 1-1, except that the type and amount of UV absorber added were changed as shown in the table below. The amount of UV absorber added was adjusted so that the absorbance of the cured product at a wavelength of 400 nm was 1.

[0217] Example 2-1 A thermosetting composition was produced by mixing 10 g of diallyl phthalate (manufactured by Tokyo Chemical Industry Co., Ltd.), which is a precursor monomer of diallyl phthalate resin, 6 mg of the above-mentioned compound 1-5 as an ultraviolet absorber, and 0.2 g of organic peroxide Perbutyl O (NOF Corporation) as a heat curing aid. The amount of ultraviolet absorber added was adjusted so that the absorbance of the cured product at a wavelength of 400 nm was 1. The obtained thermosetting composition was filled into a mold and then heated at 100°C for 4 hours, 120°C for 2 hours, and 150°C for 2 hours to cure, producing a cured product that was a molded product with a thickness of 1 mm.

[0218] (Examples 2-2 to 2-10, Comparative Examples 2-1 and 2-2) Thermosetting compositions and molded articles were produced in the same manner as in Example 2-1, except that the type and amount of UV absorber added were changed as shown in the table below. The amount of UV absorber added was adjusted so that the absorbance of the cured product at a wavelength of 400 nm was 1.

[0219] Example 3-1: n-Butyl methacrylate (nBMA) and hydroxyethyl methacrylate (HEMA) were mixed at a molar ratio of 3:3. Furthermore, a polymerization initiator (azobisisobutyronitrile (AIBN)) was added at a ratio of 2% by mass relative to the polymerizable monomer, and methyl ethyl ketone (MEK) was added at a ratio of 40% by mass relative to the polymerizable monomer to prepare a polymerizable monomer solution. This polymerizable monomer solution was placed in a dropping funnel and added dropwise over 3 hours with stirring to MEK at a ratio of 50% by mass relative to the polymerizable monomer, which had been heated to 80°C under nitrogen reflux, to polymerize. Furthermore, a liquid consisting of MEK at a ratio of 10% by mass relative to the polymerizable monomer and AIBN at a ratio of 0.5% by mass relative to the polymerizable monomer was added dropwise over 1 hour to complete the reaction. The temperature was maintained at 80°C and stirring was continued during the reaction. In this manner, acrylic resin prepolymer 1 was synthesized. The hydroxyl value of the obtained acrylic resin prepolymer 1 was 206 mgKOH / g. The weight average molecular weight of the acrylic resin prepolymer 1 was 17,100. Next, 4.0 g of a solution of acrylic resin prepolymer 1 (solid content 50% by mass), 3.6 g of a long-chain polyol (polycaprolactone triol, PLACCEL 308, manufactured by Daicel Corporation, molecular weight 850, hydroxyl value 190 to 200 mg KOH / g), 3.6 g of a polyfunctional isocyanate (Duranate TPA100, manufactured by Asahi Kasei Corporation, compound name: polyisocyanurate of hexamethylene diisocyanate), 0.02 g of Neostan U-600 (manufactured by Nitto Kasei Co., Ltd., dibutyltin) as a heat curing aid, 7.5 g of methyl ethyl ketone, and 100 mg of the above-mentioned compound 1-5 as an ultraviolet absorber were mixed and degassed under reduced pressure for 10 minutes to produce a thermosetting composition. The amount of ultraviolet absorber added was adjusted so that the absorbance of the cured product at a wavelength of 400 nm was 1. The obtained thermosetting composition was applied to a 125 μm thick black polyethylene terephthalate film (Lumirror X30, manufactured by Toray Industries, Inc.) using a bar coater and cured at 80° C. for 2 hours to produce a cured resin film.

[0220] (Examples 3-2 to 3-10, Comparative Examples 3-1 and 3-2) Thermosetting compositions and resin films were produced in the same manner as in Example 3-1, except that the type and amount of UV absorber added were changed as shown in the table below. The amount of UV absorber added was adjusted so that the absorbance of the cured product at a wavelength of 400 nm was 1.

[0221] Example 4-1 36 mg of the above-described compound 1-5 as an ultraviolet absorber, 3.0 g of an epoxy resin (EPPN-201 (manufactured by Nippon Kayaku Co., Ltd.)), 3.0 g of an epoxy resin (Epotohto ZX-1059, manufactured by Nippon Steel Chemical & Material Co., Ltd.), and a phenol compound (KAYAHARD A thermosetting composition was prepared by mixing 4 g of GPH-65 (manufactured by Nippon Kayaku Co., Ltd.), 0.06 g of triphenylphosphine (a polymerization catalyst) as a thermosetting aid, and 8 g of cyclohexanone. The amount of UV absorber added was adjusted so that the absorbance of the cured product at a wavelength of 400 nm was 1. The resulting thermosetting composition was applied to a substrate so that the coating film had a thickness of 0.5 mm after drying, and dried at 140°C for 10 minutes to form a coating film. Next, the resulting coating film was vacuum pressed (pressure: 5 MPa, temperature: 140°C, time: 20 minutes) and further heated at 150°C for 20 minutes to produce a sheet-like molded product.

[0222] (Examples 4-2 to 4-10, Comparative Examples 4-1 and 4-2) Thermosetting compositions and molded articles were produced in the same manner as in Example 4-1, except that the type and amount of UV absorber added were changed as shown in the table below. The amount of UV absorber added was adjusted so that the absorbance of the cured product at a wavelength of 400 nm was 1.

[0223] <Colorability> The absorption spectrum of each of the cured products of the Examples and Comparative Examples was measured using a spectrophotometer (UV-1900PC, manufactured by Shimadzu Corporation). The absorbance at a wavelength of 400 nm (A ４００ ) and absorbance at a wavelength of 430 nm (A ４３０ ) absorbance ratio (A ４００ / A ４３０ The absorbance ratio (A) was calculated and the coloring property was evaluated. The results are shown in the table below.４００ / A ４３０ ) indicates that the greater the value, the less coloring occurs.

[0224] <Haze> The haze of each of the cured products of the Examples and Comparative Examples was measured immediately after production. A haze meter (model: NDH 7000) manufactured by Nippon Denshoku Industries Co., Ltd. was used as the measuring device. The lower the measured haze value (%), the more excellent the transparency. The results are shown in the table below. The unit "%" is omitted from the evaluation result values.

[0225] <Solvent Resistance> Each of the cured products of the Examples and Comparative Examples was immersed in propylene glycol monomethyl ether acetate (PGMEA) for 10 minutes, the absorbance retention rate was calculated, and the solvent resistance was evaluated according to the following criteria: Absorbance retention rate (%) = (Absorbance at maximum absorption wavelength of cured product after immersion in PGMEA / Absorbance at maximum absorption wavelength of cured product before immersion in PGMEA) x 100 AA: Absorbance retention rate is 95% or more A: Absorbance retention rate is 85% or more and less than 95% B: Absorbance retention rate is 70% or more and less than 85% C: Absorbance retention rate is less than 70%

[0226]

[0227]

[0228]

[0229]

[0230] As shown in the above table, in the examples, cured products with low haze and suppressed coloration were produced.

[0231] Compounds 1-5, 1-46, 1-52, 1-69, 1-72, A-1, A-6, A-18, A-232, and A-259 used as ultraviolet absorbers are compounds 1-5, 1-46, 1-52, 1-69, 1-72, A-1, A-6, A-18, A-232, and A-259 shown as specific examples of the above-mentioned specific compounds. Compounds C-1 and C-2 used as ultraviolet absorbers in comparative examples are compounds having the following structures, respectively.

[0232] <Test Example 2> (Examples 5-1 to 5-10, Comparative Example 5-1) A thermosetting composition and a molded article were produced in the same manner as in Example 3-1, except that the type and amount of the ultraviolet absorber were changed as shown in the table below. The haze and solvent resistance were evaluated in the same manner as in Test Example 1.

[0233]

[0234] The amount of ultraviolet absorber added in Examples 5-1 to 5-10 was twice that of Examples 3-1 to 3-10, but in all of the Examples, cured products with low haze and excellent solvent resistance were produced.

[0235] <Test Example 3> The change in colorability before and after thermal curing was confirmed for the thermosetting compositions of Examples 2-1 to 2-10 and Comparative Examples 2-1 and 2-2. Regarding the colorability of the thermosetting composition before thermal curing, each thermosetting composition was poured into a 1 mm thick spectroscopic cell, and the absorption spectrum was measured to obtain the absorbance (A ４００ ) and absorbance at a wavelength of 430 nm (A ４３０ ) absorbance ratio (A ４００ / A ４３０ Regarding the colorability after thermal curing, the absorbance (A) of the cured product at a wavelength of 400 nm was calculated in the same manner as in Test Example 1. ４００ ) and absorbance at a wavelength of 430 nm (A ４３０ ) absorbance ratio (A ４００ / A ４３０ The results are shown in the table below.

[0236]

[0237] Examples 2-1 to 2-10 show the absorbance ratio (A ４００ / A ４３０ ) changes were small.

Claims

1. an ultraviolet absorber comprising at least one compound A selected from the group consisting of a compound represented by formula (1) and a compound represented by formula (2); A thermosetting compound; a thermosetting composition comprising at least one thermosetting auxiliary selected from a thermal polymerization initiator and a polymerization catalyst; 【Chemistry 1】 In formula (1), R 1 and R 2 each independently represents a hydrogen atom, an alkyl group, an aryl group, an acyl group, a carbamoyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, or an ethylenically unsaturated bond-containing group, R 3 and R 4 each independently represents a hydrogen atom, a halogen atom, an alkyl group, an aryl group, an alkoxy group, an aryloxy group, an acyloxy group, an alkylamino group, an anilino group, an acylamino group, an alkylsulfonylamino group, an arylsulfonylamino group, an alkylthio group, an arylthio group, or an ethylenically unsaturated bond-containing group, R 5 and R 6 each independently represents a hydrogen atom, an alkyl group having two or more carbon atoms, an aralkyl group, an aryl group, a heterocyclic group, or an ethylenically unsaturated bond-containing group, R 1 and R 3 may be bonded to form a ring, R 3 and R 4 may be bonded to form a ring, R 2 and R 4 may be bonded to form a ring, R 5 and R 6 may be linked to form a ring; In formula (2), R 11 and R 12 each independently represents a hydrogen atom, an alkyl group, an aryl group, an acyl group, a carbamoyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, or an ethylenically unsaturated bond-containing group, Q 1 represents a group represented by formula (Q-1), Q 2 =O, =S, =NR q1 Or = CR q2 R q3 represents R q1 ~R q3 each independently represents a hydrogen atom or a substituent; R q2 and R q3 may be bonded to each other to form a ring; 【Chemistry 2】 In formula (Q-1), * represents a bond; 101 and R 102 each independently represents a hydrogen atom, an alkyl group, an aralkyl group, an aryl group, a heterocyclic group, or an ethylenically unsaturated bond-containing group.

2. R in the above formula (1) 3 and R 4 The thermosetting composition according to claim 1, wherein one of the groups represents a hydrogen atom, and the other represents a halogen atom, an alkyl group, an aryl group, an alkoxy group, an aryloxy group, an acyloxy group, an alkylamino group, an anilino group, an acylamino group, an alkylsulfonylamino group, an arylsulfonylamino group, an alkylthio group, an arylthio group, or an ethylenically unsaturated bond-containing group.

3. Q in the formula (2) 2 Is, Q 1 The thermosetting composition according to claim 1 , wherein the R 1 and R 2 are groups having a structure different from that of the R 1 and R 2 groups.

4. The thermosetting composition according to any one of claims 1 to 3, wherein the content of the compound A is 0.01 to 20 mass% based on the total solid content of the thermosetting composition.

5. The thermosetting composition according to any one of claims 1 to 3, wherein the thermosetting compound comprises at least one selected from the group consisting of a phenolic resin, an epoxy resin, a melamine resin, a urea resin, a polyester resin, an alkyd resin, a polyimide resin, a polyurethane resin, a polythiourethane resin, a diallyl phthalate resin, an episulfide resin, a siloxane resin, and precursors thereof.

6. A cured product obtained by using the thermosetting composition according to any one of claims 1 to 3.

7. An optical member comprising the cured product according to claim 6.

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