Resin sealing device and resin sealing method

Abstract

A resin sealing device (1) is provided with: a resin sealing mold (21) which seals an electronic component (P) with a resin by compression molding a resin material onto a workpiece (W); and a resin amount calculation unit (79) which calculates, for each workpiece, the resin amount in the resin material to be supplied to the workpiece (W) on the basis of the mounting state of the electronic component (P) on the workpiece (W). The resin material contains a first resin (R1) and a second resin (R2); the first resin (R1) is a sheet-like resin; the second resin is a granulated resin, a powdered resin or a liquid resin; and among the first resin (R1) and the second resin (R2), at least the amount of the second resin (R2) to be supplied is determined for each workpiece on the basis of the resin amount that is calculated by the resin amount calculation unit (79).

Description

Resin sealing device and resin sealing method

[0001] The present invention relates to a resin sealing apparatus and a resin sealing method.

[0002] When electronic components such as semiconductor elements are encapsulated in resin, the amount of resin supplied may be adjusted based on the mounting status of the electronic components. For example, Patent Document 1 discloses a resin molding device that removes excess sheet-shaped resin depending on the mounting status of the electronic components.

[0003] Japanese Patent Application Laid-Open No. 2021-118244

[0004] However, in the resin molding device disclosed in Patent Document 1, since excess sheet resin is removed from the workpiece, unnecessary sheet resin may be generated, and the device and process may become complicated due to the transportation and storage of the unnecessary sheet resin.

[0005] The present invention has been made in consideration of the above circumstances, and an object of the present invention is to provide a resin sealing apparatus and a resin sealing method that can supply an appropriate amount of resin to each workpiece while eliminating waste of resin.

[0006] A resin sealing device according to one embodiment of the present invention is a compression molding type resin sealing device that resin-seals electronic components of a workpiece including a substrate and electronic components, and is equipped with a resin sealing mold that compressively molds a resin material onto the workpiece to resin-seal the electronic components, and a resin amount calculation unit that calculates the amount of resin material to be supplied to the workpiece on a workpiece-by-workpiece basis based on the mounting status of the electronic components on the workpiece, wherein the resin material includes a first resin and a second resin, the first resin is a sheet-like resin, and the second resin is a granular resin, powdered resin, or liquid resin, and the supply amount of at least the second resin of the first resin and the second resin is determined on a workpiece-by-work basis based on the resin amount calculated by the resin amount calculation unit.

[0007] According to this aspect, the amount of resin material to be supplied to each workpiece is calculated for each workpiece according to the workpiece mounting status, and the amount of the second resin to be supplied is determined for each workpiece based on the calculated amount of resin. Therefore, for example, while supplying the first resin to each workpiece, the remaining amount of resin can be adjusted to an appropriate amount using the second resin. Therefore, it is possible to supply an appropriate amount of resin to each workpiece while eliminating waste of supplied resin.

[0008] Another aspect of the resin sealing method of the present invention is a compression molding type resin sealing method for resin-sealing electronic components in a workpiece including a substrate and electronic components, the method including calculating the amount of resin material to be supplied to the workpiece on a workpiece basis based on the mounting status of the electronic components on the workpiece, supplying the workpiece to a resin sealing mold, supplying the resin material to the resin sealing mold, and compression-molding the resin material onto the workpiece using the resin sealing mold to resin-seal the electronic components, the resin material including a first resin and a second resin, the first resin being a sheet-like resin, and the second resin being a granular resin, powdered resin, or liquid resin, and the supply amount of at least the second resin of the first resin and the second resin being determined on a workpiece basis based on the resin amount of the resin material calculated on a workpiece basis.

[0009] According to this aspect, the amount of resin material to be supplied to each workpiece is calculated for each workpiece according to the workpiece mounting status, and the amount of the second resin to be supplied is determined for each workpiece based on the calculated amount of resin. Therefore, for example, while supplying the first resin to each workpiece, the remaining amount of resin can be adjusted to an appropriate amount by using the second resin. This makes it possible to supply an appropriate amount of resin to each workpiece while eliminating waste of supplied resin.

[0010] According to the present invention, it is possible to supply an appropriate amount of resin to each workpiece while eliminating waste of the supplied resin.

[0011] FIG. 2 is a plan view of a resin sealing apparatus according to one embodiment of the present invention. FIG. 3 is a partially enlarged view of the resin sealing apparatus of FIG. 1. FIG. 4 is a cross-sectional view of the resin sealing mold of FIG. 1. FIG. 5 is a flowchart showing a resin sealing method according to one embodiment of the present invention. FIG. 6 is a view for explaining a resin sealing method according to one embodiment of the present invention. FIG. 7 is a view for explaining a resin sealing method according to one embodiment of the present invention. FIG. 8 is a view for explaining a resin sealing method according to one embodiment of the present invention. FIG. 9 is a view for explaining a resin sealing method according to another embodiment of the present invention. FIG. 10 is a view for explaining a resin sealing method according to another embodiment of the present invention. FIG. 11 is a view for explaining a resin sealing method according to another embodiment of the present invention. FIG. 12 is a view for explaining a resin sealing method according to another embodiment of the present invention. FIG. 13 is a view for explaining a resin sealing method according to another embodiment of the present invention.

[0012] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The drawings of each embodiment are merely examples, and the dimensions and shapes of each part are schematic, so the technical scope of the present invention should not be interpreted as being limited to the embodiment.

[0013] [First Embodiment] <Resin Sealing Apparatus> The configuration of a resin sealing apparatus 1 according to an embodiment of the present invention will be described with reference to Figures 1 to 3. Figure 1 is a plan view of the resin sealing apparatus according to this embodiment. Figure 2 is a partially enlarged view of the resin sealing apparatus, and Figure 3 is a cross-sectional view of a resin sealing mold. Note that for the sake of clarity, each of Figures 1 to 3 is labeled with directions such as front, back, left, right, and up and down to clarify the relationship between the drawings and to help understand the positional relationship of each component.

[0014] The resin sealing apparatus 1 is a manufacturing apparatus that applies resin to a workpiece W to produce a molded product M. The workpiece W includes a substrate B and electronic components P. The molded product M can be produced by molding resin onto the workpiece W and resin-sealing the electronic components P of the workpiece W. Here, the workpiece W has a surface on which the electronic components P are mounted (hereinafter referred to as the "surface of the workpiece W") and a surface opposite the surface (hereinafter referred to as the "rear surface of the workpiece W"). The rear surface of the workpiece W is the surface on which the electronic components P are not mounted. In the following description, the up-down relationship between the surface and rear surface of the workpiece W can be reversed as appropriate depending on the structure of the resin sealing mold. For convenience of explanation, the workpiece W after resin sealing may be referred to as the molded product M. The substrate B may be, for example, an interposer substrate, a lead frame, a carrier plate with an adhesive sheet, or a semiconductor substrate. The electronic components P may be, for example, semiconductor elements such as IC chips, but are not limited thereto and may include various active elements, passive elements, MEMS devices, etc. As shown in FIG. 3 , the resin is composed of a first resin R1 and a second resin R2. The first resin R1 and the second resin R2 may have different properties or the same properties. For example, the second resin R2 may have higher mold releasability than the first resin R1. In this embodiment, the first resin R1 and the second resin R2 are in different states. Specifically, the first resin R1 is a sheet-like resin, while the second resin R2 is a granular resin, powdered resin, or liquid resin. The sheet-like resin used as the first resin R1 is preferably a fixed amount of resin with a constant thickness, width, and length for each resin to be supplied. This makes it easier to determine how much additional resin to supply in relation to the total amount of resin required. In this embodiment, the combination of the first resin R1 and the second resin R2 is described as a combination of a sheet-like resin and a granular resin. However, this combination is not limited to this. For example, the second resin R2 may be in a powder or liquid form.

[0015] The resin sealing apparatus 1 according to this embodiment is a compression molding type (in other words, a compression type) resin sealing apparatus. As shown in FIG. 1 , the resin sealing apparatus 1 includes a work supply unit 10, resin molding units 20 and 30, a second resin supply unit 40, a first resin supply unit 50, a first loader 60, a second loader 70, and a molded product recovery unit 90. The first loader 60 transports the workpieces W and is configured to be movable along a first guide portion 60R. The second loader 70 transports the first resin R1 (e.g., a sheet-like resin) and the second resin R2 (e.g., a granular resin) and is configured to be movable along the second guide portion 70R.

[0016] The planar layout of the resin sealing apparatus 1 is not particularly limited, but in the example shown in FIG. 1 , the work supply unit 10, the resin molding unit 20, the second resin supply unit 40, the resin molding unit 30, and the molded product recovery unit 90 are arranged in this order from left to right along a first guide portion 60R in FIG. 1 . Furthermore, with respect to the first guide portion 60R as a reference, the second resin supply unit 41 is arranged on the rear side, and the first resin supply unit 50 is arranged on the front side. The first resin supply unit 50 and the second resin supply unit 40 are arranged in this order along a second guide portion 70R from front to rear in FIG. Furthermore, with respect to the second guide portion 70R as a reference, the work supply unit 10 and the resin molding unit 20 are arranged on the left side, and the resin molding unit 30 and the molded product recovery unit 90 are arranged on the right side.

[0017] The workpiece supply unit 10 supplies the workpiece W to the first loader hand 61 of the first loader 60. The workpiece supply unit 10 includes a workpiece storage section 11, a workpiece transfer section 13, a workpiece preheating section 15, and a workpiece supply control panel 19. Furthermore, for example, the workpiece supply control panel 19 may integrate a display section that displays control parameters of the molded product recovery unit 90, the second resin supply unit 40, the first resin supply unit 50, the first loader 60, and the second loader 70, which will be described later, and an input section that inputs the control parameters.

[0018] The work storage unit 11 stores a plurality of workpieces W and sequentially delivers the workpieces W. For example, the work storage unit 11 includes a plurality of workpiece magazines and a workpiece elevation. The workpiece magazine set in the work storage unit 11 stores a plurality of workpieces W stacked vertically. The workpiece elevation adjusts the position of the workpiece magazine in order to deliver the workpieces W to the workpiece transfer unit 13.

[0019] The workpiece transfer unit 13 transfers the workpieces W received from the workpiece storage unit 11 to the workpiece preheating unit 15. For example, the workpiece transfer unit 13 includes a workpiece index that receives and aligns the workpieces W sent out by the workpiece storage unit 11, and a workpiece pick and place that transfers the workpieces W aligned by the workpiece index to the workpiece preheating unit 15.

[0020] The workpiece preheating unit 15 preheats the workpiece W received from the workpiece transfer unit 13 and delivers it to the first loader hand 61 of the first loader 60. Preheating the workpiece W before it is transported to the resin molding units 20, 30 can prevent deformation of the workpiece W due to a sudden temperature change inside the resin sealing molds 21, 31. For example, the workpiece preheating unit 15 may include a preheat rail that heats the workpiece W from its end. Alternatively, the workpiece preheating unit 15 may include a hot plate that heats the entire surface of the workpiece W. Note that the workpiece preheating unit 15 may not be provided, and the workpiece W may not be preheated. In this case, the time from when the workpiece W is transported to the resin molding units 20, 30 until the start of loading the first resin R1 and the second resin R2 into the resin molding units 20, 30 or the start of mold closing may be controlled.

[0021] The work supply control panel 19 controls the operation of the work supply unit 10. When viewed from above as shown in FIG. 1 , the work supply control panel 19 is disposed on the front surface of the work supply unit 10. For example, the work supply control panel 19 includes a display unit that displays the control parameters of the work supply unit 10, and an input unit for inputting the control parameters of the work supply unit 10.

[0022] The work supply unit 10 includes a work mounting status measuring unit 16 that measures the mounting status of the electronic components P on the work W. For example, the unit may further include a volume measuring unit that measures the mounting status of the electronic components P from the volume of the work W, a weight measuring unit that measures the mounting status of the electronic components P from the weight of the work W, an appearance measuring unit that measures the appearance of the work W, and the like.

[0023] The molded product recovery unit 90 recovers the molded products M from the first loader hand 61 of the first loader 60. The molded product recovery unit 90 includes a molded product receiving section 91, a molded product delivery section 93, and a molded product storage section 95. In the example shown in Fig. 1, the molded product recovery unit 90 is disposed on the opposite side of the resin molding units 20, 30 from the workpiece supply unit 10 in the left-right direction. As a modified example, the molded product recovery unit 90 may be disposed on the same side of the resin molding units 20, 30 as the workpiece supply unit 10 in the left-right direction.

[0024] The molded product receiving section 91 delivers the molded product M received from the first loader hand 61 of the first loader 60 to the molded product delivery section 93. For example, the molded product receiving section 91 is provided with a cooling pallet for cooling the molded product M. Alternatively, a configuration may be adopted in which the cooling pallet is not provided and the workpiece W is not cooled.

[0025] The molded product delivery section 93 delivers the molded products M received from the molded product receiving section 91 to the molded product storage section 95. For example, the molded product delivery section 93 includes a molded product index that receives and aligns the molded products M sent out by the molded product receiving section 91, and a molded product pick and place that delivers the molded products M aligned by the molded product index to the molded product storage section 95.

[0026] The molded product storage section 95 receives and stores the molded products M. For example, the molded product storage section 95 includes a plurality of molded product magazines and a molded product elevation. The molded product magazine set in the molded product storage section 95 stores a plurality of molded products M stacked vertically. The molded product elevation adjusts the position of the molded product magazine in order to receive the molded products M from the molded product delivery section 93.

[0027] The molded product recovery unit 90 may further include a volume measuring section for measuring the volume of the molded product M, an appearance inspection section for inspecting the appearance of the molded product M, and the like.

[0028] The resin molding unit 20 molds the first resin R1 and the second resin R2 onto the workpiece W. The resin molding unit 20 includes a resin sealing mold 21, a film handler 27, and a resin molding control panel 29.

[0029] As shown in Fig. 3, the resin sealing mold 21 includes a pair of openable upper and lower molds 22 and 23 that fill an internal cavity 25 with a first resin R1 and a second resin R2 to form a mold. In the example shown in Fig. 3, the resin sealing mold 21 is a compression molding mold with a so-called movable upper cavity structure. Specifically, the surface of the lower mold 23 facing the upper mold 22 is flat, and a cavity 25 is formed on the surface of the upper mold 22 facing the lower mold 23. The cavity 25 is a recess (an example of a cavity recess) that opens toward the lower mold 23.

[0030] The upper mold 22 includes an upper plate 22a, a cavity piece 22b, a clamper 22c, and a biasing member 22d. The cavity piece 22b is fixedly attached to the lower surface of the upper plate 22a (the surface facing the lower mold 23). The clamper 22c is configured in a frame shape surrounding the cavity piece 22b. The clamper 22c is attached to the upper plate 22a via the biasing member 22d so as to be movable up and down. The cavity piece 22b forms the bottom surface of the cavity 25, and the clamper 22c forms the side surface of the cavity 25. The upper mold 22 is provided with suction holes 22e and 22f penetrating the clamper 22c and a suction hole 22g penetrating the upper plate 22a and the cavity piece 22b. The suction hole 22e opens to the lower surface of the clamper 22c. Suction hole 22f opens on the inner surface of clamper 22c facing cavity piece 22b. A seal member (not shown) is inserted below suction hole 22f. Suction hole 22g opens on the top surface of cavity piece 22b, i.e., the bottom surface of cavity 25. Suction holes 22e, 22f, and 22g are used to suck film F set in upper mold 22.

[0031] The lower mold 23 includes a lower plate 23a and a cavity plate 23b. The cavity plate 23b is fixedly assembled to the upper surface of the lower plate 23a (the surface facing the upper mold 22). The lower mold 23 is provided with a suction hole 23c that penetrates the lower plate 23a and the cavity plate 23b. The suction hole 23c opens to the lower surface of the cavity plate 23b. The suction hole 23c is a suction hole for sucking the workpiece W set in the lower mold 23.

[0032] The film handler 27 supplies a film F to the resin sealing mold 21. The film F is a release film that prevents the first resin R1 and the second resin R2 from entering the gaps in the upper mold 22 that form the recess of the cavity 25 and facilitates the release of the molded product M from the upper mold 22. The film handler 27 handles, for example, a roll of film and includes an unwinding section that supplies unused film F and a winding section that collects used film F. As shown in FIG. 1 , the unwinding section and the winding section of the film handler 27 are disposed to the left and right of the resin sealing mold 21. The film F can be made of a polymeric material that has excellent heat resistance, ease of release, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene-ethylene copolymer), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), PET (polyethylene terephthalate), PP (polypropylene), and PVDC (polyvinylidine chloride). The thickness of the film F is suitably selected depending on the physical properties of the material, and is, for example, about 50 μm. The shape of the film F is not limited to a roll, and may be a strip.

[0033] The resin molding control panel 29 controls the operation of the resin molding unit 20. When viewed from above as shown in FIG. 1 , the resin molding control panel 29 is disposed on the front surface of the resin molding unit 20. For example, the resin molding control panel 29 includes a display unit that displays the control parameters of the resin molding unit 20 and an input unit that inputs the control parameters of the resin molding unit 20.

[0034] The resin molding unit 30 includes a resin sealing mold 31, a film handler 37, and a resin molding control panel 39. In the following description, details of the resin sealing mold 31, the film handler 37, and the resin molding control panel 39 will be omitted, but the same configurations as those described for the resin molding unit 20 can be applied.

[0035] At least some of the functions of the resin molding control panels 29, 39 may be integrated into the workpiece supply control panel 19. For example, the control parameters of the resin molding units 20, 30 may be displayed on the display unit of the workpiece supply control panel 19, and the control parameters of the resin molding units 20, 30 may be input into the input unit of the workpiece supply control panel 19. When all of the functions of the control panels of the respective units are integrated into the workpiece supply control panel 19, the resin molding control panels 29, 39 may be omitted.

[0036] The first resin supply unit 50 includes a first resin storage section 51 and a first resin delivery section 53 .

[0037] The first resin storage unit 51 stores a plurality of first resins R1 and sequentially delivers the first resins R1. For example, the first resin storage unit 51 includes a plurality of magazines and an elevation. The magazines set in the first resin storage unit 51 may be slit magazines in which a plurality of first resins R1 are stored so as to be stacked in the vertical direction, or may be stack magazines in which a plurality of first resins R1 are stored so as to be stacked in the vertical direction. The elevation adjusts the position of the magazine to deliver the first resin R1 to the first resin delivery unit 53.

[0038] The first resin delivery unit 53 delivers the first resin R1 received from the first resin storage unit 51 to the holding tool 78. For example, the first resin delivery unit 53 receives the second resin R2 sent out by the first resin storage unit 51, aligns it, and delivers it to the holding tool 78. At this time, the first resin R1 may be picked up by a chucking function provided in the holding tool 78.

[0039] In addition, the first resin supply unit 50 may further include a volume measuring unit that measures the volume of the first resin R1 or a weight measuring unit that measures the weight of the first resin R1, an appearance inspection unit that inspects the appearance of the first resin R1, or a first resin preheating unit that preheats the first resin R1.

[0040] The second resin supply unit 40 supplies a granular second resin R2 onto the first resin R1. The second resin supply unit 40 includes a second resin supply section 41 and a resin heater 80.

[0041] The second resin supply unit 41 supplies the second resin R2 onto the first resin R1 held by the holding tool 78. The second resin supply unit 41 includes a hopper 42 and a feeder 43. When the second resin is liquid, the resin supply unit may include a syringe that stores the resin, a piston that pushes out the resin, and a pinch valve that opens and closes the tip of the syringe.

[0042] The resin heater 80 heats the first resin R1 and the second resin R2 supplied on top of the first resin R1. A known heating mechanism such as an electric wire heater or an infrared heater is used as the heat source of the resin heater 80. The resin heater 80 may be omitted.

[0043] In the second resin supply unit 40, a resin guard 44 (described later) is preferably disposed inside the holding tool 78. The resin guard 44 is configured in a frame shape along the outer shape of the first resin R1 and is used as a frame that defines the region where the second resin R2 is dispersed. For example, the resin guard 44 is attached to the holding tool 78 before the second resin R2 is supplied and is removed from the holding tool 78 after the second resin R2 is heated. Note that if the holding tool 78 can be used as a frame that defines the region where the resin R is dispersed, the resin guard 44 may be omitted.

[0044] The second resin supply unit 40 also includes a resin amount calculation unit 79. The resin amount calculation unit 79 calculates and sets the amount of resin to be supplied based on the mounting status of each workpiece acquired by the workpiece mounting status measurement unit 16. Specifically, the total amount of resin required for one resin encapsulation is calculated from the number of chips mounted on the workpiece and the chip stacking height as indicators of the mounting status. The amount of second resin R2 to be supplied can be determined based on this amount of resin and the amount of first resin R1. The amount of first resin R1 to be supplied may be determined based on a predetermined volume or weight, etc., by using a fixed amount of resin sheet-like resin with a constant thickness, width, and length. Alternatively, the amount of first resin R1 to be supplied may be determined by measuring the volume, etc., of the first resin R1. The amount of second resin R2 to be supplied may be determined based on the difference between the amount of resin calculated by the resin amount calculation unit 79 and the amount of first resin R1 to be supplied. The amount of first resin R1 to be supplied is based on the amount of resin required when all electronic components P are mounted. In this embodiment, the resin is supplied using the first resin R1 and the second resin R2. However, only the first resin R1 may be supplied. The supply amount of the second resin R2 may be smaller than the supply amount of the first resin R1. In this case, by adjusting the supply amount of the second resin R2 to make up for the shortfall, an appropriate amount of resin can be supplied to each workpiece while eliminating waste of the supplied resin. The supply amount of the second resin R2 is determined by the amount of resin corresponding to the volume of the electronic components P that is insufficient. Therefore, depending on the proportion of the electronic components P in the cavity, the supply amount of the second resin R2 may be adjusted to be greater than or equal to the supply amount of the first resin R1. Furthermore, if the number of workpieces with electronic components P mounted thereon does not reach the specified number, workpieces without electronic components P mounted thereon (i.e., dummy workpieces) may be added. In this case, the second resin R2 is supplied up to the maximum supply amount.

[0045] In addition, the second resin supply unit 40 may further include a weight measuring unit that measures the weight of the second resin R2, a vibration unit that disperses the second resin R2 by vibration, and an inspection unit that inspects the degree of dispersion of the second resin R2.

[0046] The first loader 60 transports the workpiece W from the workpiece supply unit 10 to the resin molding units 20, 30. The first loader 60 is configured to be movable along a first guide portion 60R. The first guide portion 60R extends in the left-right direction across the workpiece supply unit 10, the resin molding units 20, 30, the second resin supply unit 40, and the molded product recovery unit 90. When viewed from above as shown in FIG. 1 , the first guide portion 60R is provided, for example, behind the resin sealing molds 21, 31 and in front of the second resin supply portion 41. In the configuration example shown in FIG. 1 , the first loader 60 transports the molded product M from the resin molding units 20, 30 to the molded product recovery unit 90.

[0047] As shown in FIG. 2, the first loader 60 includes a first loader hand 61 , a first base 62 , and a first guide rod 63 .

[0048] The first loader hand 61 is configured to be able to advance and retreat from the rear of the resin sealing mold 21. In other words, the first loader hand 61 has a transport path for the workpiece W or molded product M (one example of a workpiece) on the rear side of the resin sealing mold 21. The first loader hand 61 holds the workpiece W or molded product M. The first loader hand 61 has, for example, an L-shaped opening and closing claw that supports the underside of the workpiece W or molded product M, but is not limited to this. The first loader hand 61 may adsorb the workpiece W or molded product M by electrostatic force, or may adsorb the workpiece W or molded product M by suction and exhaust.

[0049] As shown in FIG. 2, the first base 62 is connected to the first guide portion 60R so as to be movable in the left-right direction.

[0050] 2, the first guide rod 63 is connected to the first base 62 and supports the first loader hand 61. The first guide rod 63 is configured to be extendable and retractable in the front-rear direction, and moves the first loader hand 61 in the front-rear direction.

[0051] As an example, after receiving the workpiece W at the workpiece transfer section 13, the first loader hand 61 is transported rightward by the first base 62 and moves to a position facing the resin sealing mold 21 in the front-to-rear direction. Next, while holding the workpiece W, the first loader hand 61 advances into the resin sealing mold 21 from the rear by extending the first guide rod 63. That is, the first loader hand 61 loads the workpiece W into the resin sealing mold 21. After delivering the workpiece W to the lower mold 23 of the resin sealing mold 21, the first loader hand 61 moves rearward of the resin sealing mold 21 by contracting the first guide rod 63. After the molded product M is molded and the resin sealing mold 21 is opened, the first loader hand 61 unloads the molded product M from the resin sealing mold 21 by performing the same operation as when the workpiece W was loaded. The first loader hand 61 is then transported rightward by the first base 62 and delivers the molded product M at the molded product receiving section 91.

[0052] The second loader 70 transports the first resin R1 and the second resin R2. The second loader 70 is configured to be movable along a second guide portion 70R. The second guide portion 70R is provided, for example, on the second resin supply unit 40 and extends in the front-rear direction. When viewed from above as shown in FIG. 1 , the second guide portion 70R intersects, for example, with the first guide portion 60R.

[0053] As shown in FIG. 2, the second loader 70 includes a second loader hand 71 , a second base 72 , and a second guide rod 73 .

[0054] As shown in Figure 2, the second base 72 is configured to be movable in the front-to-rear direction relative to the second guide portion 70R, but it is not limited to movement in the front-to-rear direction and may be configured to be movable in the left-to-right direction.

[0055] 2, the second guide rod 73 is connected to the second base 72 and supports the second loader hand 71. The second guide rod 73 is configured to be extendable and rotatable from the point where it is connected to the second base 72. As a result, the second guide rod 73 moves the second loader hand 71 in the front-to-back or left-to-right directions, and also rotates the second loader hand 71 around the second base 72.

[0056] As an example, the second loader hand 71 transports the holding tool 78 to the first resin transfer section 53. After receiving the first resin R1 by the holding tool 78 at the first resin transfer section 53, the second loader hand 71 is transported rearward by the second base 72 and transports the first resin R1 via the holding tool 78 to position P2 rearward of the first resin transfer section 53. Next, the second loader hand 71 moves to position P1 in front of the second resin supply section 41 by pivoting the second guide rod 73. Next, the second loader hand 71 moves to the second resin supply section 41 by extending the second guide rod 73. At the second resin supply section 41, the second loader hand 71 releases the holding tool 78. A resin guard 44 is set inside the released holding tool 78. Then, after the second resin R2 is received on top of the first resin R1 and inside the resin guard 44, the first resin R1 and the second resin R2 are heated, and after heating, the resin guard 44 is removed. The second loader hand 71 then picks up the holding tool 78 again and returns to position P1 by contracting the second guide rod 73. Next, the second loader hand 71 moves to position P3 to the right of the resin sealing mold 21 by rotating the second guide rod 73. Next, while holding the first resin R1 and the second resin R2 via the holding tool 78, the second loader hand 71 enters the resin sealing mold 21 from the right by extending the second guide rod 73. That is, the second loader hand 71 delivers the first resin R1 and the second resin R2 into the resin sealing mold 21 via the holding tool 78. After delivering the first resin R1 and the second resin R2 to the resin sealing mold 21, the second loader hand 71 moves to the right of the resin sealing mold 21 as the second guide rod 73 contracts.

[0057] In this way, if the second loader hand 71 can move from the second resin supply unit 40 to the first resin transfer section 53 by extending and contracting the second guide rod 73, the first resin supply unit 50 can be added without extending the second guide section 70R to the first resin supply unit 50.

[0058] The first loader 60 and the second loader 70 operate in the same manner as they do in the resin sealing mold 21 of the resin molding unit 20 with respect to the resin sealing mold 31 of the resin molding unit 30. Therefore, a description of the operations of the first loader 60 and the second loader 70 with respect to the resin sealing mold 31 will be omitted. However, the operation of the second loader 70 with respect to the resin sealing mold 31 is the left-right reverse of the operation of the second loader 70 with respect to the resin sealing mold 21.

[0059] Next, the transport path when the first loader hand 61 supplies the workpiece W to the resin sealing mold 21 will be described. The first loader hand 61 receives the workpiece W at the workpiece preheating unit 15. Alternatively, the workpiece preheating unit 15 may be configured to be movable along the first guide unit 60R. At this time, the first loader 60 is restricted from moving left and right. Then, with the first loader hand 61 holding the workpiece W, the first loader 60 moves rightward along the first guide unit 60R and transports the workpiece W to the rear of the resin sealing mold 21. Then, as shown in FIG. 2 , the first loader hand 61 and the workpiece W are transported to the resin sealing mold 21 by the extension and contraction of the first guide rod 63, and the workpiece W is placed on the resin sealing mold 21 by the first loader hand 61. After the workpiece W is resin-encapsulated in the resin sealing mold 21, the workpiece W, while held by the first loader hand 61, retreats from the resin sealing mold 21 by the extension and contraction of the first guide rod 63.

[0060] On the other hand, the transfer path when the first loader hand 61 removes the workpiece from the resin-sealing mold 21 will be described. As shown in FIG. 2 , the first loader hand 61 is transferred to the resin-sealing mold 21 by extension and contraction of the first guide rod 63. With the workpiece W held by the first loader hand 61, the workpiece W is retracted from the resin-sealing mold 21 by extension and contraction of the first guide rod 63. Thereafter, the first loader 60, with the first loader hand 61 still holding the workpiece W, moves rightward along the first guide portion 60R and delivers the workpiece W to the molded product receiving portion 91. Alternatively, the molded product receiving portion 91 may be configured to be movable along the first guide portion 60R. At this time, the movement of the first loader 60 in the left-right direction is restricted. The transfer path for supplying or removing the workpiece W described above also applies to the resin-sealing mold 31.

[0061] In the present embodiment, the first loader hand 61 transports the workpiece W, and the second loader hand 71 transports the first resin R1 and the second resin R2, but this is not limiting. For example, one loader hand may transport the workpiece and the resin simultaneously, or may transport one of the workpiece and the resin first and then the other.

[0062] In the example shown in Figures 1 and 2, the transport path of the first loader hand 61 is located behind the resin sealing molds 21 and 31, but this is not limited to this configuration.For example, a first loader hand may be provided behind the resin sealing mold 21, and another first loader hand may be provided behind the resin sealing mold 31.

[0063] The second resin R2 preferably has higher releasability than the first resin R1. In this case, the second loader hand 71 transports the second resin R2 placed on top of the first resin R1 to the resin sealing mold 21. The second resin R2 is then pressed and placed in the recess of the cavity 25. According to this embodiment, the high releasability makes it easy to release the second resin R2 from the film F after resin molding.

[0064] As described above, the resin sealing device described in this embodiment can adjust the amount of resin material depending on the mounting status of the workpieces, thereby providing a resin sealing device that can supply an appropriate amount of resin to each workpiece while eliminating waste of supplied resin.

[0065] <Resin sealing method> Next, the resin sealing method will be described with reference to Figures 4 to 9. Figure 4 is a flowchart showing an example of a resin sealing method using the resin sealing apparatus according to this embodiment. Figures 5 to 9 are views for explaining the resin sealing method according to this embodiment. In the following explanation, a method using a resin sealing apparatus having a cavity in the upper mold will be described. Note that the resin sealing mold 21 of the resin molding unit 20 will be described as an example, and a description of the resin sealing mold 31 of the resin molding unit 30, which operates in a similar manner, will be omitted.

[0066] First, the amount of resin material to be supplied to the workpiece W is calculated for each workpiece (S10).

[0067] 1 includes a workpiece mounting status measuring unit 16 that measures the mounting status of electronic components P on the workpiece W, and calculates the amount of resin to be supplied by a volume measuring unit that measures the mounting status of electronic components P from the volume of the workpiece W, a weight measuring unit that measures the mounting status of electronic components P from the weight of the workpiece W, an appearance inspection unit that inspects the appearance of the workpiece W, or the like. Alternatively, the amount of resin to be supplied may be calculated using data obtained by measuring the mounting status in advance. The amount of resin to be supplied of the second resin R2 in the resin amount calculation unit 79 may be calculated based on the mounting status obtained by the workpiece mounting status measuring unit 16.

[0068] Next, the first loader hand 61 supplies the workpiece W to the resin sealing molds 21, 31 (S20).

[0069] Specifically, the workpiece W received from the workpiece transfer section 13 in Fig. 1 is preheated in the workpiece preheating section 15 and held by the first loader hand 61 of the first loader 60. Thereafter, the first loader hand 61 moves to the resin molding unit 20 while holding the workpiece W, as shown in Fig. 5. Before or after this process, the film F is moved to the cavity 25 provided on the upper mold 22 side. After the film F is moved, it is sucked by the suction holes 22g and set in the cavity 25.

[0070] Next, the first resin R1 is supplied (S30).

[0071] Specifically, the first resin R1 stored in the first resin storage unit 51 is transferred to the first resin transfer unit 53. The first resin transfer unit 53 then transfers the first resin R1 received from the first resin storage unit 51 to the holding tool 78. The amount of first resin supplied at this time may be constant, or may be adjusted based on the mounting status obtained by the workpiece mounting status measuring unit 16. Alternatively, the amount of first resin supplied may be adjusted using data obtained by measuring the mounting status in advance. Furthermore, the first resin R1 may be prepared for a workpiece (i.e., a dummy workpiece) on which no electronic component P is mounted. The holding tool 78, holding the first resin R1, is then picked up by the second loader hand 71 and transported to the second resin supply unit 40.

[0072] Next, the second resin R2 is supplied (S40).

[0073] Specifically, the first resin R1 transported by the second loader hand 71 is transferred to the second resin supply unit 41. Thereafter, as shown in FIG. 6, a resin guard 44 is provided on the first resin R1, and the second resin R2 is supplied. At this time, the amount of second resin supplied is adjusted based on the mounting status obtained by the work mounting status measurement unit 16. As an index of the mounting status at this time, the amount of resin required for one resin sealing may be calculated from the number of chips mounted on the work and the chip stacking height, and the amount of second resin R2 supplied may be determined.

[0074] Next, the first resin R1 and the second resin R2 are fused together (S50).

[0075] Specifically, the first resin R1 and the second resin R2 are heated by the resin heater 80. The resin heater 80 may heat the second resin R2 from above. The resin heating temperature is preferably 90°C or less. After the resin is heated, the resin guard 44 is removed as shown in FIG. 7. In this embodiment, an example in which the first resin R1 and the second resin R2 are fused together in S50 has been described, but this is not limiting, and the transport process described below may be performed without necessarily fusing them together.

[0076] Next, the first resin R1 and the second resin R2 are transported to the resin sealing mold 21 by the second loader hand 71 (S60).

[0077] Specifically, as shown in FIG. 8, the first resin R1 and the second resin R2 are placed on a second loader hand 71 and then transported to the resin sealing mold 21.

[0078] Next, the first resin R1 and the second resin R2 are molded (S70).

[0079] 9, a resin sealing mold 21 is clamped, and the first resin R1 and the second resin R2 are heated while being pressed by an upper mold 22 and a lower mold 23. Once the first resin R1 and the second resin R2 are cured, the mold is opened.

[0080] As described above, the resin sealing method described in this embodiment can adjust the amount of resin material depending on the mounting state of the workpieces, thereby providing a resin sealing method that can supply an appropriate amount of resin to each workpiece while eliminating waste of the supplied resin.

[0081] Second Embodiment <Resin Sealing Apparatus> Next, the structure of a resin sealing die 121 according to a second embodiment will be described with reference to FIGS.

[0082] In this embodiment, unlike the first embodiment, a cavity 125 is provided on the lower mold 123 side. The resin sealing mold 21 is a pair of openable and closable molds that fill the internal cavity 125 with a first resin R1 and a second resin R2 to form a mold. The resin sealing mold 121 includes an upper mold 122 and a lower mold 123. The surface of the lower mold 123 facing the upper mold 122 is flat, and the cavity 125 is formed on the surface of the upper mold 122 facing the lower mold 123. In other words, the resin sealing mold 121 is a compression molding mold with a so-called movable lower cavity structure. The cavity 125 is a recess that opens toward the lower mold 123 and corresponds to an example of a "cavity recess" according to the present invention.

[0083] The upper mold 122 includes an upper plate 122a and a cavity plate 122b. The cavity plate 122b is fixedly assembled to the lower surface of the upper plate 122a (the surface facing the lower mold 123). The upper mold 122 is provided with a suction hole 122c that penetrates the upper plate 122a and the cavity plate 122b. The suction hole 122c opens to the lower surface of the cavity plate 122b. The suction hole 122c is a suction hole for sucking the workpiece W set in the upper mold 122.

[0084] The lower mold 123 includes a lower plate 123a, a cavity piece 123b, a clamper 123c, and a biasing member 123d. The cavity piece 123b is fixedly attached to the upper surface of the lower plate 123a (the surface facing the upper mold 122). The clamper 123c is configured in a frame shape surrounding the cavity piece 123b. The clamper 123c is attached to the lower plate 123a via the biasing member 123d so that it can move up and down. The cavity piece 123b forms the bottom surface of the cavity 125, and the clamper 123c forms the side surface of the cavity 125. The lower mold 123 is provided with suction holes 123e and 123f that penetrate the clamper 123c and a suction hole 123g that penetrates the lower plate 123a and the cavity piece 123b. Suction hole 123e opens to the top surface of clamper 123c. Suction hole 123f opens to the inner surface of clamper 123c facing cavity piece 123b. A seal member (not shown) is inserted below suction hole 123f. Suction hole 123g opens to the top surface of cavity piece 123b, i.e., the bottom surface of cavity 125. Suction holes 123e, 123f, and 123g are suction holes for sucking film F set in lower mold 123.

[0085] The first resin R1 preferably has higher releasability than the second resin R2. In this case, the second loader hand 71 transports the second resin R1 placed on top of the first resin R2 to the resin sealing mold 21. The first resin R1 is then pressed and placed in the recess of the cavity 25. According to this embodiment, the high releasability makes it easy to release the first resin R1 from the film F after resin molding.

[0086] By using such a resin sealing mold, it becomes possible to perform compression molding of a movable lower cavity structure having a cavity 125 on the lower mold 123 side. Furthermore, the amount of resin material can be adjusted depending on the mounting status of the workpiece. Therefore, it is possible to provide a resin sealing device that can supply the appropriate amount of resin to each workpiece while eliminating waste of supplied resin.

[0087] <Resin sealing method> Next, a resin sealing method using a resin sealing mold 121 according to a second embodiment will be described with reference to FIGS. 10 and 11. FIGS. 10 and 11 are diagrams for explaining the resin sealing method according to this embodiment. In the following explanation, a method using a resin sealing device having a cavity in the lower mold will be described. The resin sealing mold 121 of this embodiment has a cavity 125 in the lower mold 123. Therefore, unlike the first embodiment in which the workpiece W was placed on the lower mold 23, in this embodiment the workpiece W is placed on the upper mold 122.

[0088] 10, the second loader hand 71, while holding the first resin R1 and the second resin R2, enters the resin sealing mold 121. As shown in FIG. 11, the first resin R1 and the second resin R2 are set in a cavity 125 provided in a lower mold 123.

[0089] [Modifications] Modifications different from the above embodiment will be described.

[0090] [First Modification] In the above embodiment, the second resin R2 is supplied on top of the first resin R1, but the top and bottom may be reversed. That is, the first resin may be supplied on top of the second resin. Specifically, as shown in FIG. 12A , the second resin R2 is supplied to an area surrounded by a holding tool 78 and a plunger 81. Next, as shown in FIG. 12B , the first resin R1 is supplied on top of the second resin R2. Next, as shown in FIG. 12C , the first resin R1 and the second resin R2 are heated and fused together. Next, as shown in FIG. 12D , the plunger 81 pushes up the first resin R1 while suction is applied from above by an adsorption pad 82. Then, the first resin R1 and the second resin R2 are transported to the resin sealing mold 121. Note that the adsorption pad 82 may be an electrostatic chuck.

[0091] [Second Modification] When a sheet of film is used as the film, as shown in Fig. 13A, a first resin R1 is supplied to an area surrounded by the sheet of film and a holding tool 78. Then, as shown in Fig. 13B, a second resin R2 is supplied on top of the first resin R1. In this modification, the second resin R2 may be supplied as shown in Fig. 14A, and then the first resin R1 may be supplied as shown in Fig. 14B.

[0092] As described above, a resin sealing apparatus according to one embodiment of the present invention is a compression molding type resin sealing apparatus that resin-seals electronic components of a workpiece including a substrate and electronic components, and is equipped with a resin sealing mold that compresses and molds a resin material onto the workpiece to resin-seal the electronic components, and a resin amount calculation unit 79 that calculates the amount of resin material to be supplied to the workpiece on a workpiece-by-workpiece basis based on the mounting status of the electronic components on the workpiece, wherein the resin material includes a first resin and a second resin, the first resin is a sheet-like resin, and the second resin is a granular resin, powdered resin, or liquid resin, and the supply amount of at least the second resin of the first resin and the second resin is determined on a workpiece-by-work basis based on the resin amount calculated by the resin amount calculation unit 79.

[0093] This allows the amount of resin material to be adjusted depending on the workpiece mounting status, thereby providing a resin sealing device that can supply an appropriate amount of resin to each workpiece while eliminating waste of the supplied resin.

[0094] In the above-described embodiment, the second resin is a resin having the same or different properties as the first resin.

[0095] In the above aspect, the device further includes a first resin supply unit that supplies the first resin and a second resin supply unit that supplies the second resin, and the second resin supply unit is configured to supply the second resin into the opening of the guide unit on top of the first resin supplied by the first resin supply unit.

[0096] In the above-described aspect, the resin-sealing mold includes an upper mold and a lower mold, and the upper mold has a cavity recess that opens toward the lower mold.

[0097] In the above aspect, a loader hand is further provided for transporting the resin material to the resin sealing mold, the second resin having a property of higher demoldability than the first resin, and the loader hand is configured to place the first resin and the second resin in the cavity recess with the second resin facing the upper mold.

[0098] In the above-described aspect, the resin-sealing mold includes an upper mold and a lower mold, and the lower mold has a cavity recess that opens toward the upper mold.

[0099] In the above aspect, the device further includes a loader hand for transporting the resin material to the resin sealing mold, wherein the first resin has a property of higher demoldability than the second resin, and the loader hand is configured to place the first resin and the second resin in the cavity recess with the first resin facing the lower mold.

[0100] In the above aspect, the device further includes a first resin supply section that supplies the first resin and a second resin supply section that supplies the second resin, the second resin supply section being configured to supply the second resin into the opening of the guide section, and the first resin supply section being configured to supply the first resin on the second resin.

[0101] In the above aspect, a loader hand for transporting the resin material to the resin sealing mold may be further provided, and the loader hand may have an adsorption pad or an electrostatic chuck.

[0102] In the above aspect, a loader hand is further provided for transporting the resin material to the resin sealing mold, and the loader hand is configured to transport the first resin and the second resin to the resin sealing mold in a state in which the first resin and the second resin are fused together.

[0103] In the above aspect, the supply amount of the second resin is determined based on the difference between the resin amount calculated by the resin amount calculation unit and the supply amount of the first resin.

[0104] In the above aspect, the supply amount of the second resin is smaller than the supply amount of the first resin. The supply amount of the second resin may be adjusted to be greater than or equal to the supply amount of the first resin. Furthermore, if the number of workpieces on which electronic components are mounted does not reach the specified number, workpieces on which no electronic components are mounted (i.e., dummy workpieces) may be added, in which case the second resin is supplied up to the maximum supply amount. Furthermore, if there is variation or a defect in the supply amount of the first resin, the shortage or excess may be compensated for by using the second resin.

[0105] Another aspect of the resin sealing method of the present invention is a compression molding type resin sealing method for resin-sealing electronic components in a workpiece including a substrate and electronic components, the method including calculating the amount of resin material to be supplied to the workpiece on a workpiece basis based on the mounting status of the electronic components on the workpiece, supplying the workpiece to a resin sealing mold, supplying the resin material to the resin sealing mold, and compression-molding the resin material onto the workpiece using the resin sealing mold to resin-seal the electronic components, the resin material including a first resin and a second resin, the first resin being a sheet-like resin and the second resin being a granular resin, powdered resin, or liquid resin, and the supply amount of at least the second resin of the first resin and the second resin being determined on a workpiece basis based on the resin amount of the resin material calculated on a workpiece basis.

[0106] This allows the amount of resin material to be adjusted depending on the workpiece mounting status, thereby providing a resin sealing method that can supply an appropriate amount of resin to each workpiece while eliminating waste of the supplied resin.

[0107] The above-described embodiments are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The elements of the embodiments, as well as their arrangement, materials, conditions, shapes, sizes, etc., are not limited to those illustrated and can be modified as appropriate. Furthermore, configurations shown in different embodiments can be partially substituted or combined with each other.

[0108] REFERENCE SIGNS LIST 1...Resin sealing apparatus 10...Work supply unit 20, 30...Resin molding unit 21, 31...Resin sealing mold 25, 35...Cavity 27, 37...Film handler 40...Second resin supply unit 44...Resin guard 50...First resin supply unit 60...First loader 61...First loader hand 70...Second loader 71...Second loader hand 80...Resin heater 90...Molded product recovery unit W...Work P...Electronic component B...Substrate R1...First resin R2...Second resin F...Film

Claims

1. A compression molding type resin sealing apparatus for resin-sealing an electronic component of a workpiece including a substrate and an electronic component, a resin sealing die that compresses and molds a resin material onto the workpiece to resin-seal the electronic components; a loader hand that transports the resin material to the resin sealing mold; a resin amount calculation unit that calculates an amount of the resin material to be supplied to the workpiece on a per-workpiece basis based on a mounting state of the electronic components on the workpiece; Equipped with the resin-sealing mold includes an upper mold and a lower mold, the upper mold having a cavity recess that opens toward the lower mold, the resin material includes a first resin and a second resin; the first resin is a sheet-shaped resin, The second resin is a granular resin, a powdered resin, or a liquid resin, Of the first resin and the second resin, at least the supply amount of the second resin is determined on a work-by-work basis based on the resin amount calculated by the resin amount calculation unit, The loader hand is configured to place the first resin and the second resin in the cavity recess with the second resin facing the upper mold.

2. A compression molding type resin sealing apparatus for resin-sealing an electronic component of a workpiece including a substrate and an electronic component, a resin sealing die that compresses and molds a resin material onto the workpiece to resin-seal the electronic components; a loader hand that transports the resin material to the resin sealing mold; a resin amount calculation unit that calculates an amount of the resin material to be supplied to the workpiece on a per-workpiece basis based on a mounting state of the electronic components on the workpiece; Equipped with the resin-sealing mold includes an upper mold and a lower mold, the upper mold having a cavity recess that opens toward the lower mold, the resin material includes a first resin and a second resin; the first resin is a sheet-shaped resin, The second resin is a granular resin, a powdered resin, or a liquid resin, Of the first resin and the second resin, at least the supply amount of the second resin is determined on a work-by-work basis based on the resin amount calculated by the resin amount calculation unit, The loader hand is configured to place the first resin and the second resin in the cavity recess with the first resin facing the upper mold.

3. A first resin supply unit that supplies the first resin; a second resin supply unit that supplies the second resin; Further equipped with The second resin supply unit is configured to supply the second resin into the opening of the guide unit on the first resin supplied by the first resin supply unit. The resin sealing apparatus according to claim 1 .

4. A compression molding type resin sealing apparatus for resin-sealing an electronic component of a workpiece including a substrate and an electronic component, a resin sealing die that compresses and molds a resin material onto the workpiece to resin-seal the electronic components; a loader hand that transports the resin material to the resin sealing mold; a resin amount calculation unit that calculates an amount of the resin material to be supplied to the workpiece on a per-workpiece basis based on a mounting state of the electronic components on the workpiece; Equipped with the resin-sealing mold includes an upper mold and a lower mold, the lower mold having a cavity recess that opens toward the upper mold, the resin material includes a first resin and a second resin; the first resin is a sheet-shaped resin, The second resin is a granular resin, a powdered resin, or a liquid resin, Of the first resin and the second resin, at least the supply amount of the second resin is determined on a work-by-work basis based on the resin amount calculated by the resin amount calculation unit, The loader hand is configured to place the first resin and the second resin in the cavity recess with the first resin facing the lower mold.

5. A compression molding type resin sealing apparatus for resin-sealing an electronic component of a workpiece including a substrate and an electronic component, a resin sealing die that compresses and molds a resin material onto the workpiece to resin-seal the electronic components; a loader hand that transports the resin material to the resin sealing mold; a resin amount calculation unit that calculates an amount of the resin material to be supplied to the workpiece on a per-workpiece basis based on a mounting state of the electronic components on the workpiece; Equipped with the resin-sealing mold includes an upper mold and a lower mold, the lower mold having a cavity recess that opens toward the upper mold, the resin material includes a first resin and a second resin; the first resin is a sheet-shaped resin, The second resin is a granular resin, a powdered resin, or a liquid resin, Of the first resin and the second resin, at least the supply amount of the second resin is determined on a work-by-work basis based on the resin amount calculated by the resin amount calculation unit, The loader hand is configured to place the first resin and the second resin in the cavity recess with the second resin facing the lower mold.

6. (delete)

7. (delete)

8. (delete)

9. The loader hand has an adsorption pad or an electrostatic chuck. The resin sealing device according to claim 1 .

10. the loader hand is configured to transport the first resin and the second resin to the resin sealing mold in a state in which the first resin and the second resin are fused together. The resin sealing apparatus according to claim 1 .

11. The supply amount of the second resin is determined based on a difference between the amount of the resin calculated by the resin amount calculation unit and the amount of the first resin supplied. The resin sealing apparatus according to any one of claims 1 to 5, 9 and 10.

12. The supply amount of the second resin is smaller than the supply amount of the first resin. The resin sealing apparatus according to any one of claims 1 to 5 and 9 to 11.

13. A compression molding resin sealing method for resin-sealing an electronic component of a workpiece including a substrate and an electronic component, comprising: calculating an amount of resin of the resin material to be supplied to the workpiece on a per-workpiece basis based on a mounting state of the electronic components on the workpiece; Supplying the workpiece to a resin sealing die; Supplying a resin material to the resin molding die; and The resin material is compressed and molded onto the workpiece by the resin sealing die to resin-seal the electronic component. Including, the resin-sealing mold includes an upper mold and a lower mold, the upper mold having a cavity recess that opens toward the lower mold, the resin material includes a first resin and a second resin, the first resin being a sheet-like resin, and the second resin being a granular resin, a powdered resin, or a liquid resin; determining a supply amount of at least the second resin out of the first resin and the second resin on a work-by-work basis based on the resin amount of the resin material calculated on a work-by-work basis; A resin sealing method, in which a loader hand that transports the resin material to the resin sealing mold places the first resin and the second resin in the cavity recess with the second resin facing the upper mold.