Thermoplastic resin composition, molded body, and constituting member of IC socket for inspection

Abstract

This thermoplastic resin composition contains component (A), which is at least one thermoplastic resin selected from the group consisting of (a1) a crystalline thermoplastic resin having a melting point of 270°C or more and (a2) an amorphous thermoplastic resin having a glass transition temperature of 200°C or more, and component (B), which is an inorganic filler including (b1) zirconium oxide, wherein the content of the component (b1) based on 100 parts by mass of the component (A) is 2-40 parts by mass, and the content of the component (B) based on 100 parts by mass of the component (A) is 2-60 parts by mass.

Description

Thermoplastic resin composition, molded body, and component of IC socket for inspection

[0001] The present invention relates to a thermoplastic resin composition, a molded article, and a component of an IC socket for testing.

[0002] Engineering plastics are thermoplastic resins with excellent moldability, heat resistance, strength, and other properties, and are used in a wide range of fields, including automotive parts, machine parts, and electrical and electronic components. Thermoplastic resin compositions containing functional fillers in engineering plastics are also known. For example, Patent Document 1 describes a low-contamination injection-molded article formed from a resin composition containing a thermoplastic resin component containing a crystalline thermoplastic resin and an amorphous thermoplastic resin, a carbon precursor, and a conductive filler in predetermined amounts, which can precisely control the surface resistivity to a desired value within the semiconductive range and produce significantly less foreign particulate matter. Patent Document 2 discloses a flame-retardant polyimide molding material containing a semi-aromatic polyimide resin and a predetermined amount of graphite, carbon fiber, etc., which exhibits excellent moldability and high flame retardancy.

[0003] Meanwhile, a test socket is known that is used to inspect the electrical characteristics of semiconductor devices to check whether they satisfy desired specifications (see, for example, Patent Document 3). Patent Document 3 discloses that the ball guide film 180 that constitutes the test socket can be made of a thin polyimide film with excellent abrasion resistance.

[0004] Japanese Patent Application Laid-Open No. 2005-290328 International Publication No. 2021 / 024624 Special Publication No. 2018-529932

[0005] The flame-retardant polyimide molding material described in Patent Document 2 is also described as being applicable to IC sockets for testing. Examples of IC sockets for testing include IC sockets for product testing (test sockets) and IC sockets for burn-in testing (burn-in sockets). While numerous components are available for constructing these IC sockets, the flame-retardant polyimide molding material can be applied to a substantially flat plate-shaped component used to mount a device to be tested. A method for manufacturing such components using a molded product containing a thermoplastic resin and an inorganic filler, such as the flame-retardant polyimide molding material, includes, for example, cutting the molded product to produce a flat plate and then drilling fine through-holes in the plate for fitting the measuring device. However, in the prior art, there is room for further improvement in the cutting processability of the molded product and the micromachining processability when using the cut plate to manufacture components for IC sockets. For example, there is a problem with the cutting processability of molded products, in that when a molded product produced by injection molding or the like is cut, the resulting plate's surface is significantly uneven, making it unsuitable for micromachining. Furthermore, with regard to micro-processability, when a large number of through holes are drilled at narrow pitches in the obtained flat plate, the hole diameter distribution increases, the pattern collapses, burrs occur, and the plate is unsuitable for manufacturing components of IC sockets for testing.

[0006] An object of the present invention is to provide a thermoplastic resin composition from which molded articles having excellent machinability and fine processability can be produced.

[0007] The present inventors have found that a thermoplastic resin composition containing a specific thermoplastic resin and a specific inorganic filler can solve the above-mentioned problems. Specifically, the present invention relates to the following: [1] A thermoplastic resin composition containing: component (A): at least one thermoplastic resin selected from the group consisting of a crystalline thermoplastic resin (a1) having a melting point of 270°C or higher and an amorphous thermoplastic resin (a2) having a glass transition temperature of 200°C or higher; and component (B): an inorganic filler containing zirconium oxide (b1), wherein the content of component (b1) is 2 to 40 parts by mass per 100 parts by mass of component (A), and the content of component (B) is 2 to 60 parts by mass per 100 parts by mass of component (A). [2] The thermoplastic resin composition according to the above [1], wherein the component (A) is at least one selected from the group consisting of a polyimide resin, a polyetherimide resin, a polyetherimide sulfone resin, a polyphenylene sulfide resin, a polyether ether ketone resin, a polyether ketone ketone resin, a liquid crystal polymer, and a wholly aromatic polyester resin other than a liquid crystal polymer. [3] The thermoplastic resin composition according to the above [1] or [2], wherein the component (A) comprises a polyimide resin (a1-1) containing a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), wherein the content of the repeating structural unit of the formula (1) relative to the total of the repeating structural units of the formula (1) and the repeating structural units of the formula (2) is 20 to 70 mol %: (R １ is a divalent group having 6 to 22 carbon atoms and containing at least one alicyclic hydrocarbon structure. ２ is a divalent chain aliphatic group having 5 to 16 carbon atoms. １ and X ２are each independently a tetravalent group having 6 to 22 carbon atoms and containing at least one aromatic ring.) [4] The thermoplastic resin composition according to any one of [1] to [3] above, wherein the volume median particle size (D50) of component (b1) is 1 μm or less. [5] The thermoplastic resin composition according to any one of [1] to [4] above, wherein component (b1) is a spherical particle. [6] The thermoplastic resin composition according to any one of [1] to [5] above, wherein component (B) further contains an inorganic filler (b2) other than component (b1), and component (b2) is at least one selected from the group consisting of talc, mica, silica, alumina, silicon nitride, aluminum nitride, boron nitride, silicon carbide, boron carbide, calcium carbonate, and titanium oxide. [7] The thermoplastic resin composition according to [6] above, wherein the content of component (b2) per 100 parts by mass of component (A) is 1 to 40 parts by mass. [8] A molded article comprising the thermoplastic resin composition according to any one of [1] to [7] above. [9] A component of an IC socket for testing, obtained by processing the molded article according to [8] above.

[0008] The thermoplastic resin composition of the present invention can be used to prepare a molded article having excellent machinability and fine processability, which is suitable for producing components such as IC sockets for testing.

[0009] 1 is a schematic plan view showing one embodiment of a component 100 of a testing IC socket.

[0010] [Definition] In this specification, "excellent cutting processability of a molded article" means that when a molded article obtained by thermoforming a thermoplastic resin composition is cut to produce a flat plate-shaped molded article (hereinafter simply referred to as "flat plate"), the resulting flat plate has a low surface roughness on the cut surface. Surface roughness can be evaluated by the arithmetic mean roughness (Ra). Furthermore, if the flat plate obtained by cutting has little warping, the molded article is considered to have better cutting processability. In this specification, "excellent micromachinability of a molded article" means that when a large number of through holes are formed in the flat plate at a narrow pitch, the through holes have little variation in hole diameter, are less likely to cause pattern collapse or burrs, and have a good appearance. The through holes referred to here mean fine through holes with a diameter of, for example, 200 μm or less, preferably 100 μm or less, and more preferably less than 100 μm, and the pitch is, for example, in the range of 1 to 5 times the diameter of the through holes. Specifically, cutting processability and micromachinability can be evaluated by the methods described in the Examples.

[0011] [Thermoplastic Resin Composition] The thermoplastic resin composition of the present invention is a thermoplastic resin composition containing: component (A): at least one thermoplastic resin selected from the group consisting of crystalline thermoplastic resins (a1) having a melting point of 270°C or higher and amorphous thermoplastic resins (a2) having a glass transition temperature of 200°C or higher; and component (B): an inorganic filler containing zirconium oxide (b1), wherein the content of component (b1) is 2 to 40 parts by mass per 100 parts by mass of component (A), and the content of component (B) is 2 to 60 parts by mass per 100 parts by mass of component (A).

[0012] The thermoplastic resin composition of the present invention can produce a molded article with excellent machinability and fine processability by using a thermoplastic resin (A) having predetermined thermal properties and a predetermined amount of inorganic filler (B) containing zirconium oxide (b1). As described below, the volume median particle size (D50) of the zirconium oxide (b1) is preferably 1 μm or less. While the reason for the above-mentioned effects of the present invention is unclear, it is presumed that the use of submicron-level fine zirconium oxide (b1) particles as the inorganic filler suppresses unevenness caused by particles present on the machined surface, achieving low surface roughness. Furthermore, when fine through-holes are formed in the molded article, the wall surfaces of the fine through-holes are also maintained smooth, thereby improving the accuracy of hole formation and suppressing an increase in hole size distribution and pattern collapse. Furthermore, it is presumed that the inclusion of a predetermined amount of the high-hardness component (b1) in the thermoplastic resin (A) moderately embrittles the material, thereby suppressing the occurrence of burrs.

[0013] <Thermoplastic Resin (A)> The thermoplastic resin (A) used in the present invention (hereinafter also referred to simply as "component (A)" or "thermoplastic resin (A)") is at least one selected from the group consisting of a crystalline thermoplastic resin (a1) having a melting point of 270°C or higher and an amorphous thermoplastic resin (a2) having a glass transition temperature of 200°C or higher. In this specification, a crystalline thermoplastic resin refers to a resin having a melting point and a glass transition temperature, and an amorphous thermoplastic resin refers to a resin having a glass transition temperature but no melting point. Note that resins that are essentially crystalline but have an extremely slow crystallization rate and can only be processed in an amorphous state in various molding methods are classified as amorphous thermoplastic resins.

[0014] (Crystalline Thermoplastic Resin (a1)) The crystalline thermoplastic resin (a1) used as component (A) (hereinafter also referred to simply as "component (a1)") is a crystalline thermoplastic resin having a melting point of 270 ° C. or higher from the viewpoint of producing a molded article having excellent machinability and fine processability. The melting point of component (a1) is preferably 280 ° C. or higher, more preferably 290 ° C. or higher, and even more preferably 300 ° C. or higher from the viewpoint of improving the machinability and fine processability of the resulting molded article. Furthermore, from the viewpoint of ease of thermoforming, it is preferably 400 ° C. or lower, more preferably 380 ° C. or lower, and even more preferably 350 ° C. or lower. The melting point of component (a1) can be measured using a differential scanning calorimeter, specifically by the method described in the examples.

[0015] The glass transition temperature (Tg) of component (a1) is not particularly limited, but from the viewpoint of improving the machinability and micromachinability of the resulting molded article, it is preferably 130° C. or higher, more preferably 140° C. or higher, and even more preferably 150° C. or higher, and from the viewpoint of ease of molding, it is preferably 250° C. or lower, more preferably 230° C. or lower, and even more preferably 200° C. or lower. The glass transition temperature of component (a1) can be measured using a differential scanning calorimeter, specifically by the method described in the Examples.

[0016] (Amorphous Thermoplastic Resin (a2)) The amorphous thermoplastic resin (a2) used as component (A) (hereinafter also referred to simply as "component (a2)") is an amorphous thermoplastic resin having a glass transition temperature of 200°C or higher from the viewpoint of producing a molded article having excellent machinability and micromachinability. The glass transition temperature (Tg) of component (a2) is preferably 210°C or higher, more preferably 230°C or higher, and even more preferably 250°C or higher from the viewpoint of improving the machinability and micromachinability of the resulting molded article. Furthermore, from the viewpoint of ease of thermoforming, it is preferably 400°C or lower, more preferably 350°C or lower, and even more preferably 300°C or lower. The glass transition temperature of component (a2) can be measured by the same method as described above.

[0017] Examples of component (A) include thermoplastic resins corresponding to either component (a1) or component (a2) among polyimide resins, polyamide resins, polyetherimide resins, polyetherimide sulfone resins, polyphenylene sulfide resins, polyether ether ketone resins, polyether ketone ketone resins, polycarbonate resins, polyamide imide resins, polysulfone resins, polyether sulfone resins, polyarylate resins, liquid crystal polymers, wholly aromatic polyester resins other than liquid crystal polymers, polyether ketone resins, polyether ether ketone ketone resins, and polybenzimidazole resins. Among the above, from the viewpoint of producing a molded article excellent in machinability and micromachinability, component (A) is preferably at least one selected from the group consisting of polyimide resins, polyetherimide resins, polyetherimide sulfone resins, polyphenylene sulfide resins, polyether ether ketone resins, polyether ketone ketone resins, liquid crystal polymers, and wholly aromatic polyester resins other than liquid crystal polymers, and more preferably at least one selected from the group consisting of polyimide resins, polyetherimide resins, polyphenylene sulfide resins, and polyether ether ketone resins. When low dielectric properties are required, component (A) is more preferably a polyimide resin, and among these, a polyimide resin having an aliphatic structure (other than wholly aromatic) or a polyimide resin having a bulky structure such as a halogen atom.

[0018] Component (A) can be component (a1), component (a2), or a mixture of component (a1) and component (a2). From the viewpoint of improving the cutting processability and fine processing ability of the resulting molded article, component (A) preferably contains component (a1), which is a crystalline thermoplastic resin. From the viewpoint of improving the cutting processability and fine processing ability of the resulting molded article, the content of component (a1) in component (A) is preferably 50% by mass or more, more preferably 60% by mass or more, even more preferably 70% by mass or more, even more preferably 80% by mass or more, and even more preferably 90% by mass or more, and 100% by mass or less.

[0019] When component (A) contains component (a1), from the viewpoints of improving the machinability and micromachinability of the resulting molded article, facilitating thermoforming, and obtaining low dielectric properties, component (a1) is more preferably a polyimide resin, and more preferably a polyimide resin (a1-1) containing a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), in which the content of the repeating structural unit of formula (1) relative to the total of the repeating structural units of formula (1) and formula (2) is 20 to 70 mol %: (R １ is a divalent group having 6 to 22 carbon atoms and containing at least one alicyclic hydrocarbon structure. ２ is a divalent chain aliphatic group having 5 to 16 carbon atoms. １ and X ２ are each independently a tetravalent group containing at least one aromatic ring and having 6 to 22 carbon atoms.

[0020] The polyimide resin (a1-1) is a crystalline thermoplastic resin, and is preferably in the form of powder or pellets. This polyimide resin is distinguished from polyimide resins that do not have a glass transition temperature (Tg) or that decompose at a temperature lower than the glass transition temperature, and are formed by molding a polyimide precursor such as polyamic acid and then closing the imide ring.

[0021] The repeating structural unit of formula (1) is described in detail below. １ is a divalent group having 6 to 22 carbon atoms and containing at least one alicyclic hydrocarbon structure. Here, the alicyclic hydrocarbon structure refers to a ring derived from an alicyclic hydrocarbon compound, and the alicyclic hydrocarbon compound may be saturated or unsaturated, and may be monocyclic or polycyclic. Examples of alicyclic hydrocarbon structures include, but are not limited to, cycloalkane rings such as a cyclohexane ring, cycloalkene rings such as cyclohexene, bicycloalkane rings such as norbornane, and bicycloalkene rings such as norbornene. Among these, a cycloalkane ring is preferred, a cycloalkane ring having 4 to 7 carbon atoms is more preferred, and a cyclohexane ring is even more preferred. R １has 6 to 22 carbon atoms, preferably 8 to 17. １ contains at least one alicyclic hydrocarbon structure, preferably 1 to 3.

[0022] R １ is preferably a divalent group represented by the following formula (R1-1) or (R1-2): (m １１ and m １２ are each independently an integer of 0 to 2, preferably 0 or 1. １３ ~m １５ are each independently an integer of 0 to 2, preferably 0 or 1.

[0023] R １ is particularly preferably a divalent group represented by the following formula (R1-3): In the divalent group represented by the above formula (R1-3), the positional relationship of the two methylene groups with respect to the cyclohexane ring may be either cis or trans, and the ratio of cis to trans may be any value.

[0024] X １ is a tetravalent group having 6 to 22 carbon atoms and containing at least one aromatic ring. The aromatic ring may be a single ring or a condensed ring, and examples thereof include a benzene ring, a naphthalene ring, an anthracene ring, and a tetracene ring, but are not limited to these. Among these, a benzene ring and a naphthalene ring are preferred, and a benzene ring is more preferred. X １ has 6 to 22 carbon atoms, preferably 6 to 18. １ contains at least one aromatic ring, preferably 1 to 3.

[0025] X １ is preferably a tetravalent group represented by any one of the following formulae (X-1) to (X-4). (R １１ ~R １８ are each independently an alkyl group having 1 to 4 carbon atoms. １１ ~p １３ are each independently an integer of 0 to 2, preferably 0. １４ , p １５ , p１６ and p １８ are each independently an integer of 0 to 3, preferably 0. １７ is an integer of 0 to 4, preferably 0. １１ ~L １３ are each independently a single bond, an ether group, a carbonyl group, or an alkylene group having 1 to 4 carbon atoms. １ is a tetravalent group having 6 to 22 carbon atoms and containing at least one aromatic ring, and therefore, R １２ , R １３ , p １２ and p １３ is selected so that the number of carbon atoms of the tetravalent group represented by formula (X-2) is in the range of 10 to 22. Similarly, L in formula (X-3) １１ , R １４ , R １５ , p １４ and p １５ is selected so that the number of carbon atoms of the tetravalent group represented by formula (X-3) is in the range of 12 to 22, and L in formula (X-4) １２ , L １３ , R １６ , R １７ , R １８ , p １６ , p １７ and p １８ is selected so that the number of carbon atoms in the tetravalent group represented by formula (X-4) falls within the range of 18 to 22.

[0026] X １ is particularly preferably a tetravalent group represented by the following formula (X-5) or (X-6).

[0027] Next, the repeating structural unit of formula (2) will be described in detail below. ２ is a divalent chain aliphatic group having 5 to 16 carbon atoms, preferably 6 to 14 carbon atoms, more preferably 7 to 12 carbon atoms, and even more preferably 8 to 10 carbon atoms. Here, the chain aliphatic group means a group derived from a chain aliphatic compound, and the chain aliphatic compound may be saturated or unsaturated, linear or branched, and may contain a heteroatom such as an oxygen atom. ２is preferably an alkylene group having 5 to 16 carbon atoms, more preferably an alkylene group having 6 to 14 carbon atoms, even more preferably an alkylene group having 7 to 12 carbon atoms, and among these, an alkylene group having 8 to 10 carbon atoms is preferred. The alkylene group may be a linear alkylene group or a branched alkylene group, but is preferably a linear alkylene group. ２ is preferably at least one selected from the group consisting of an octamethylene group and a decamethylene group, and particularly preferably an octamethylene group.

[0028] Also, R ２ Another preferred embodiment of the group R2-1 is a divalent chain aliphatic group containing an ether group and having 5 to 16 carbon atoms. The number of carbon atoms is preferably 6 to 14, more preferably 7 to 12, and even more preferably 8 to 10. Among these, a divalent group represented by the following formula (R2-1) or (R2-2) is preferred. (m ２１ and m ２２ are each independently an integer of 1 to 15, preferably 1 to 13, more preferably 1 to 11, and even more preferably 1 to 9. ２３ ~m ２５ are each independently an integer of 1 to 14, preferably 1 to 12, more preferably 1 to 10, and even more preferably 1 to 8. ２ is a divalent chain aliphatic group having 5 to 16 carbon atoms (preferably 6 to 14 carbon atoms, more preferably 7 to 12 carbon atoms, and even more preferably 8 to 10 carbon atoms), and therefore, m in formula (R2-1) ２１ and m ２２ is selected so that the carbon number of the divalent group represented by formula (R2-1) is in the range of 5 to 16 (preferably 6 to 14 carbon atoms, more preferably 7 to 12 carbon atoms, and even more preferably 8 to 10 carbon atoms). ２１ +m ２２ is 5 to 16 (preferably 6 to 14, more preferably 7 to 12, and even more preferably 8 to 10). ２３ ~m ２５is selected so that the carbon number of the divalent group represented by formula (R2-2) is in the range of 5 to 16 (preferably 6 to 14 carbon atoms, more preferably 7 to 12 carbon atoms, and even more preferably 8 to 10 carbon atoms). ２３ +m ２４ +m ２５ has 5 to 16 carbon atoms (preferably 6 to 14 carbon atoms, more preferably 7 to 12 carbon atoms, and even more preferably 8 to 10 carbon atoms).

[0029] X ２ is X in formula (1). １ The definitions and preferred embodiments are the same as above.

[0030] The content ratio of the repeating structural unit of formula (1) relative to the total of the repeating structural units of formula (1) and formula (2) is 20 to 70 mol%. When the content ratio of the repeating structural unit of formula (1) is within the above range, it is possible to sufficiently crystallize the polyimide resin (a1-1) even in a typical injection molding cycle. If the content ratio is less than 20 mol%, the thermoformability decreases, and if it exceeds 70 mol%, the crystallinity decreases, resulting in a decrease in heat resistance. From the viewpoint of achieving high crystallinity, the content ratio of the repeating structural unit of formula (1) relative to the total of the repeating structural units of formula (1) and formula (2) is preferably 65 mol% or less, more preferably 60 mol% or less, and even more preferably 50 mol% or less. In particular, the content ratio of the repeating structural unit of formula (1) relative to the total of the repeating structural units of formula (1) and formula (2) is preferably 20 mol% or more but less than 40 mol%. Within this range, the crystallinity of the polyimide resin (a1-1) is high, and a resin composition having better heat resistance can be obtained. From the viewpoint of thermoformability, the content ratio is preferably 25 mol% or more, more preferably 30 mol% or more, and even more preferably 32 mol% or more, and from the viewpoint of exhibiting high crystallinity, it is even more preferably 35 mol% or less.

[0031] The combined content of the repeating structural units of formula (1) and formula (2) relative to all repeating structural units constituting the polyimide resin (a1-1) is preferably 50 to 100 mol %, more preferably 75 to 100 mol %, even more preferably 80 to 100 mol %, and still more preferably 85 to 100 mol %.

[0032] The polyimide resin (a1-1) may further contain a repeating structural unit of the following formula (3). In this case, the content ratio of the repeating structural unit of formula (3) relative to the total of the repeating structural units of formula (1) and formula (2) is preferably 25 mol% or less. On the other hand, there is no particular lower limit, as long as it is greater than 0 mol%. From the viewpoint of improving heat resistance, the content ratio is preferably 5 mol% or more, more preferably 10 mol% or more, while from the viewpoint of maintaining crystallinity, the content ratio is preferably 20 mol% or less, more preferably 15 mol% or less. (R ３ is a divalent group having 6 to 22 carbon atoms and containing at least one aromatic ring. ３ is a tetravalent group having 6 to 22 carbon atoms and containing at least one aromatic ring.

[0033] R ３ is a divalent group having 6 to 22 carbon atoms and containing at least one aromatic ring. The aromatic ring may be a single ring or a condensed ring, and examples thereof include a benzene ring, a naphthalene ring, an anthracene ring, and a tetracene ring, but are not limited to these. Among these, a benzene ring and a naphthalene ring are preferred, and a benzene ring is more preferred. R ３ has 6 to 22 carbon atoms, preferably 6 to 18. ３ contains at least one aromatic ring, preferably 1 to 3. The aromatic ring may have a monovalent or divalent electron-withdrawing group bonded thereto. Examples of the monovalent electron-withdrawing group include a nitro group, a cyano group, a p-toluenesulfonyl group, halogen, a halogenated alkyl group, a phenyl group, and an acyl group. Examples of the divalent electron-withdrawing group include a fluorinated alkylene group (e.g., -C(CF ３ ) ２ -, - (CF ２ ) ｐIn addition to halogenated alkylene groups such as - (where p is an integer from 1 to 10), -CO-, -SO ２ -, -SO-, -CONH-, -COO- and the like.

[0034] R ３ is preferably a divalent group represented by the following formula (R3-1) or (R3-2). (m ３１ and m ３２ are each independently an integer of 0 to 2, preferably 0 or 1. ３３ and m ３４ are each independently an integer of 0 to 2, preferably 0 or 1. ２１ , R ２２ , and R ２３ are each independently an alkyl group having 1 to 4 carbon atoms, an alkenyl group having 2 to 4 carbon atoms, or an alkynyl group having 2 to 4 carbon atoms. ２１ , p ２２ and p ２３ is an integer of 0 to 4, preferably 0. ２１ is a single bond, an ether group, a carbonyl group, or an alkylene group having 1 to 4 carbon atoms. ３ is a divalent group having 6 to 22 carbon atoms and containing at least one aromatic ring, and therefore, m ３１ , m ３２ , R ２１ and p ２１ is selected so that the number of carbon atoms of the divalent group represented by formula (R3-1) is in the range of 6 to 22. Similarly, L in formula (R3-2) ２１ , m ３３ , m ３４ , R ２２ , R ２３ , p ２２ and p ２３ is selected so that the number of carbon atoms in the divalent group represented by formula (R3-2) falls within the range of 12 to 22.

[0035] X ３ is X in formula (1). １ The definitions and preferred embodiments are the same as above.

[0036] The polyimide resin (a1-1) may further contain a repeating structural unit represented by the following formula (4): (R ４ Ha-SO ２ - or -Si(R ｘ ) (R ｙ ) is a divalent group containing O—, and R ｘ and R ｙ each independently represents a chain aliphatic group having 1 to 3 carbon atoms or a phenyl group. ４ is a tetravalent group having 6 to 22 carbon atoms and containing at least one aromatic ring. ４ is X in formula (1). １ The definitions and preferred embodiments are the same as above.

[0037] The terminal structure of the polyimide resin (a1-1) is not particularly limited, but it is preferable that the polyimide resin (a1-1) has a chain aliphatic group having 5 to 14 carbon atoms at the terminal. The chain aliphatic group may be saturated or unsaturated, and may be linear or branched. When the polyimide resin (a1-1) has the above-mentioned specific group at the terminal, a resin composition having excellent heat aging resistance can be obtained. Examples of saturated chain aliphatic groups having 5 to 14 carbon atoms include an n-pentyl group, an n-hexyl group, an n-heptyl group, an n-octyl group, an n-nonyl group, an n-decyl group, an n-undecyl group, a lauryl group, an n-tridecyl group, an n-tetradecyl group, an isopentyl group, a neopentyl group, a 2-methylpentyl group, a 2-methylhexyl group, a 2-ethylpentyl group, a 3-ethylpentyl group, an isooctyl group, a 2-ethylhexyl group, a 3-ethylhexyl group, an isononyl group, a 2-ethyloctyl group, an isodecyl group, an isododecyl group, an isotridecyl group, and an isotetradecyl group. Examples of unsaturated chain aliphatic groups having 5 to 14 carbon atoms include 1-pentenyl, 2-pentenyl, 1-hexenyl, 2-hexenyl, 1-heptenyl, 2-heptenyl, 1-octenyl, 2-octenyl, nonenyl, decenyl, dodecenyl, tridecenyl, and tetradecenyl groups. Among these, the chain aliphatic groups are preferably saturated chain aliphatic groups, and more preferably saturated linear chain aliphatic groups. Furthermore, from the viewpoint of obtaining heat aging resistance, the chain aliphatic groups preferably have 6 or more carbon atoms, more preferably 7 or more carbon atoms, and even more preferably 8 or more carbon atoms, and preferably have 12 or less carbon atoms, more preferably 10 or less carbon atoms, and even more preferably have 9 or less carbon atoms. The chain aliphatic groups may be of one type, or two or more types. The chain aliphatic group is particularly preferably at least one selected from the group consisting of an n-octyl group, an isooctyl group, a 2-ethylhexyl group, an n-nonyl group, an isononyl group, an n-decyl group, and an isodecyl group, further preferably at least one selected from the group consisting of an n-octyl group, an isooctyl group, a 2-ethylhexyl group, an n-nonyl group, and an isononyl group, and most preferably at least one selected from the group consisting of an n-octyl group, an isooctyl group, and a 2-ethylhexyl group.From the viewpoint of heat aging resistance, the polyimide resin (a1-1) preferably has, at its terminal, in addition to a terminal amino group and a terminal carboxy group, only a chain aliphatic group having 5 to 14 carbon atoms. When a group other than the above is present at its terminal, the content thereof is preferably 10 mol % or less, more preferably 5 mol % or less, relative to the chain aliphatic group having 5 to 14 carbon atoms.

[0038] From the viewpoint of exhibiting excellent heat aging resistance, the content of the chain aliphatic groups having 5 to 14 carbon atoms in the polyimide resin (a1-1) is preferably 0.01 mol% or more, more preferably 0.1 mol% or more, and even more preferably 0.2 mol% or more, based on 100 mol% of the total of all repeating structural units constituting the polyimide resin (a1-1). Furthermore, in order to ensure a sufficient molecular weight and obtain good mechanical properties, the content of the chain aliphatic groups having 5 to 14 carbon atoms in the polyimide resin (a1-1) is preferably 10 mol% or less, more preferably 6 mol% or less, and even more preferably 3.5 mol% or less, based on 100 mol% of the total of all repeating structural units constituting the polyimide resin (a1-1). The content of the chain aliphatic groups having 5 to 14 carbon atoms in the polyimide resin (a1-1) can be determined by depolymerizing the polyimide resin (a1-1).

[0039] The polyimide resin (a1-1) preferably has a melting point of 360°C or lower and a glass transition temperature of 150°C or higher. From the viewpoint of heat resistance, the melting point of the polyimide resin is more preferably 280°C or higher, even more preferably 290°C or higher, and from the viewpoint of exhibiting high moldability, it is preferably 345°C or lower, more preferably 340°C or lower, even more preferably 335°C or lower. Furthermore, from the viewpoint of heat resistance, the glass transition temperature of the polyimide resin (a1-1) is more preferably 160°C or higher, more preferably 170°C or higher, and from the viewpoint of exhibiting high moldability, it is preferably 250°C or lower, more preferably 230°C or lower, even more preferably 200°C or lower. The melting point and glass transition temperature of the polyimide resin (a1-1) can both be measured using a differential scanning calorimeter. Furthermore, from the viewpoint of improving crystallinity, heat resistance, mechanical strength, and chemical resistance, the polyimide resin (a1-1) preferably has a calorific value of 5.0 mJ / mg or more, more preferably 10.0 mJ / mg or more, and even more preferably 17.0 mJ / mg or more, of the heat value of the exothermic crystallization peak observed when the polyimide resin is melted and then cooled at a temperature decreasing rate of 20°C / min, as measured by a differential scanning calorimeter. The upper limit of the exothermic value of crystallization is not particularly limited, but is usually 45.0 mJ / mg or less. The melting point, glass transition temperature, and exothermic value of crystallization of the polyimide resin (a1-1) can be specifically measured by the methods described in the Examples.

[0040] The logarithmic viscosity of a 0.5 mass % solution of polyimide resin (a1-1) in concentrated sulfuric acid at 30°C is preferably in the range of 0.2 to 2.0 dL / g, more preferably 0.3 to 1.8 dL / g. If the logarithmic viscosity is 0.2 dL / g or higher, sufficient mechanical strength can be obtained when the resulting polyimide resin composition is molded into a molded article, and if it is 2.0 dL / g or lower, good moldability and handleability can be obtained. The logarithmic viscosity μ can be calculated by measuring the flow times of concentrated sulfuric acid and the polyimide resin solution at 30°C using a Cannon-Fenske viscometer, and then using the following formula: μ=ln(ts / t ０ ) / C t ０: Time during which concentrated sulfuric acid flows ts: Time during which polyimide resin solution flows C: 0.5 (g / dL)

[0041] The weight average molecular weight Mw of the polyimide resin (a1-1) is preferably in the range of 10,000 to 150,000, more preferably 15,000 to 100,000, even more preferably 20,000 to 80,000, even more preferably 30,000 to 70,000, and even more preferably 35,000 to 65,000. If the weight average molecular weight Mw of the polyimide resin (a1-1) is 10,000 or more, the mechanical strength of the resulting molded article will be good, if it is 40,000 or more, the stability of the mechanical strength will be good, and if it is 150,000 or less, the thermoformability will be good. The weight average molecular weight Mw of the polyimide resin (a1-1) can be measured by gel permeation chromatography (GPC) using polymethyl methacrylate (PMMA) as a standard sample.

[0042] (Method for Producing Polyimide Resin (a1-1)) The polyimide resin (a1-1) can be produced by reacting a tetracarboxylic acid component with a diamine component. The tetracarboxylic acid component contains a tetracarboxylic acid and / or a derivative thereof containing at least one aromatic ring, and the diamine component contains a diamine containing at least one alicyclic hydrocarbon structure and a chain aliphatic diamine.

[0043] The tetracarboxylic acid containing at least one aromatic ring is preferably a compound in which four carboxy groups are directly bonded to the aromatic ring, and may contain an alkyl group in the structure. The tetracarboxylic acid preferably has 6 to 26 carbon atoms. Examples of the tetracarboxylic acid include pyromellitic acid, 2,3,5,6-toluenetetracarboxylic acid, 3,3',4,4'-benzophenonetetracarboxylic acid, 3,3',4,4'-biphenyltetracarboxylic acid, and 1,4,5,8-naphthalenetetracarboxylic acid. Among these, pyromellitic acid is more preferred.

[0044] Examples of the derivative of a tetracarboxylic acid containing at least one aromatic ring include anhydrides or alkyl esters of tetracarboxylic acids containing at least one aromatic ring. The tetracarboxylic acid derivative preferably has 6 to 38 carbon atoms. Examples of the anhydrides of tetracarboxylic acids include pyromellitic acid monoanhydride, pyromellitic acid dianhydride, 2,3,5,6-toluenetetracarboxylic acid dianhydride, 3,3',4,4'-diphenylsulfonetetracarboxylic acid dianhydride, 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride, 3,3',4,4'-biphenyltetracarboxylic acid dianhydride, and 1,4,5,8-naphthalenetetracarboxylic acid dianhydride. Examples of alkyl esters of tetracarboxylic acids include dimethyl pyromellitic acid, diethyl pyromellitic acid, dipropyl pyromellitic acid, diisopropyl pyromellitic acid, dimethyl 2,3,5,6-toluenetetracarboxylate, dimethyl 3,3',4,4'-diphenylsulfonetetracarboxylate, dimethyl 3,3',4,4'-benzophenonetetracarboxylate, dimethyl 3,3',4,4'-biphenyltetracarboxylate, dimethyl 1,4,5,8-naphthalenetetracarboxylate, etc. In the alkyl esters of tetracarboxylic acids, the alkyl group preferably has 1 to 3 carbon atoms.

[0045] The tetracarboxylic acid and / or derivative thereof containing at least one aromatic ring may be at least one compound selected from the above, and may be used alone or in combination of two or more compounds.

[0046] The diamine containing at least one alicyclic hydrocarbon structure preferably has 6 to 22 carbon atoms, and examples thereof include 1,2-bis(aminomethyl)cyclohexane, 1,3-bis(aminomethyl)cyclohexane, 1,4-bis(aminomethyl)cyclohexane, 1,2-cyclohexanediamine, 1,3-cyclohexanediamine, 1,4-cyclohexanediamine, 4,4'-diaminodicyclohexylmethane, 4,4'-methylenebis(2-methylcyclohexylamine), carvonediamine, limonenediamine, isophoronediamine, norbornanediamine, bis(aminomethyl)tricyclo[5.2.1.0] ... ２，６]decane, 3,3'-dimethyl-4,4'-diaminodicyclohexylmethane, 4,4'-diaminodicyclohexylpropane, etc. are preferred. These compounds may be used alone, or two or more compounds selected from these may be used in combination. Of these, 1,3-bis(aminomethyl)cyclohexane is preferably used. Note that diamines containing an alicyclic hydrocarbon structure generally have structural isomers, but the ratio of cis / trans isomers is not limited.

[0047] The chain aliphatic diamine may be linear or branched, and preferably has 5 to 16 carbon atoms, more preferably 6 to 14, and even more preferably 7 to 12. Furthermore, as long as the chain portion has 5 to 16 carbon atoms, it may contain an ether bond therebetween. Preferred examples of the chain aliphatic diamine include 1,5-pentamethylenediamine, 2-methylpentane-1,5-diamine, 3-methylpentane-1,5-diamine, 1,6-hexamethylenediamine, 1,7-heptamethylenediamine, 1,8-octamethylenediamine, 1,9-nonamethylenediamine, 1,10-decamethylenediamine, 1,11-undecamethylenediamine, 1,12-dodecamethylenediamine, 1,13-tridecamethylenediamine, 1,14-tetradecamethylenediamine, 1,16-hexadecamethylenediamine, and 2,2'-(ethylenedioxy)bis(ethyleneamine). The chain aliphatic diamine may be used alone or in combination. Among these, chain aliphatic diamines having 8 to 10 carbon atoms are preferably used, and at least one selected from the group consisting of 1,8-octamethylenediamine and 1,10-decamethylenediamine is particularly preferably used.

[0048] When producing polyimide resin (a1-1), the molar ratio of the amount of diamine containing at least one alicyclic hydrocarbon structure charged to the total amount of diamine containing at least one alicyclic hydrocarbon structure and chain aliphatic diamine is preferably 20 to 70 mol %. This molar amount is preferably 25 mol % or more, more preferably 30 mol % or more, and even more preferably 32 mol % or more, and from the viewpoint of exhibiting high crystallinity, is preferably 60 mol % or less, more preferably 50 mol % or less, even more preferably less than 40 mol %, and even more preferably 35 mol % or less.

[0049] The diamine component may also contain a diamine containing at least one aromatic ring. The diamine containing at least one aromatic ring preferably has 6 to 22 carbon atoms, and examples thereof include ortho-xylylenediamine, meta-xylylenediamine, para-xylylenediamine, 1,2-diethynylbenzenediamine, 1,3-diethynylbenzenediamine, 1,4-diethynylbenzenediamine, 1,2-diaminobenzene, 1,3-diaminobenzene, 1,4-diaminobenzene, 4,4'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenylmethane, α,α'-bis(4-aminophenyl)1,4-diisopropylbenzene, α,α'-bis(3-aminophenyl)-1,4-diisopropylbenzene, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 2,6-diaminonaphthalene, and 1,5-diaminonaphthalene.

[0050] In the above, the molar ratio of the amount of the diamine containing at least one aromatic ring to the total amount of the diamine containing at least one alicyclic hydrocarbon structure and the chain aliphatic diamine is preferably 25 mol% or less. On the other hand, the lower limit is not particularly limited, as long as it is greater than 0 mol%. From the viewpoint of improving heat resistance, the molar ratio is preferably 5 mol% or more, more preferably 10 mol% or more. On the other hand, from the viewpoint of maintaining crystallinity, the molar ratio is preferably 20 mol% or less, more preferably 15 mol% or less. Furthermore, from the viewpoint of reducing coloration of the polyimide resin, the molar ratio is preferably 12 mol% or less, more preferably 10 mol% or less, even more preferably 5 mol% or less, and even more preferably 0 mol%.

[0051] When producing the polyimide resin (a1-1), the ratio of the amount of the tetracarboxylic acid component to the amount of the diamine component charged is preferably 0.9 to 1.1 moles of the diamine component per mole of the tetracarboxylic acid component.

[0052] Furthermore, when producing the polyimide resin (a1-1), a terminal-capping agent may be mixed in addition to the tetracarboxylic acid component and the diamine component. The terminal-capping agent is preferably at least one selected from the group consisting of monoamines and dicarboxylic acids. The amount of terminal-capping agent used may be any amount sufficient to introduce the desired amount of terminal groups into the polyimide resin (a1-1), and is preferably 0.0001 to 0.1 mol, more preferably 0.001 to 0.06 mol, and even more preferably 0.002 to 0.035 mol per mol of the tetracarboxylic acid and / or its derivative. Among these, monoamine terminal-capping agents are preferred. From the viewpoint of introducing the aforementioned linear aliphatic group having 5 to 14 carbon atoms to the terminal of the polyimide resin (a1-1) to improve heat aging resistance, monoamines having a linear aliphatic group having 5 to 14 carbon atoms are more preferred, and monoamines having a saturated linear aliphatic group having 5 to 14 carbon atoms are even more preferred. The end-capping agent is particularly preferably at least one selected from the group consisting of n-octylamine, isooctylamine, 2-ethylhexylamine, n-nonylamine, isononylamine, n-decylamine, and isodecylamine, more preferably at least one selected from the group consisting of n-octylamine, isooctylamine, 2-ethylhexylamine, n-nonylamine, and isononylamine, and most preferably at least one selected from the group consisting of n-octylamine, isooctylamine, and 2-ethylhexylamine.

[0053] As a polymerization method for producing the polyimide resin (a1-1), a known polymerization method can be applied, and the method described in WO 2016 / 147996 can be used.

[0054] The content of polyimide resin (a1-1) in component (A) is preferably 30% by mass or more, more preferably 50% by mass or more, even more preferably 60% by mass or more, still more preferably 70% by mass or more, still more preferably 80% by mass or more, and still more preferably 90% by mass or more, but 100% by mass or less, from the viewpoints of improving the cutting processability and microprocessability of the resulting molded article, ease of thermoforming, and obtaining low dielectric properties.

[0055] The content of component (A) in the thermoplastic resin composition is preferably 40% by mass or more, more preferably 50% by mass or more, even more preferably 60% by mass or more, still more preferably 65% ​​by mass or more, and even more preferably 70% by mass or more from the viewpoint of thermoformability and improving the cutting processability and fine processing ability of the resulting molded article. Also, from the viewpoint of improving the cutting processability and fine processing ability of the resulting molded article, it is preferably 95% by mass or less, more preferably 90% by mass or less, still more preferably 85% by mass or less, and even more preferably 80% by mass or less.

[0056] <Component (B): Inorganic Filler Containing Zirconium Oxide (b1)> The thermoplastic resin composition of the present invention contains an inorganic filler containing zirconium oxide (b1) as component (B). By using the thermoplastic resin (A) and the inorganic filler (B) containing a predetermined amount of zirconium oxide (b1), a molded article having excellent machinability and fine processability can be produced.

[0057] (Component (b1): Zirconium oxide) The shape of the zirconium oxide (b1) used in the present invention is not particularly limited, and examples thereof include spherical, plate-like, scaly, columnar, and fibrous shapes. Among these, from the viewpoint of improving the machinability and fine-machinability of the resulting molded article, spherical or plate-like particles are preferred, and spherical particles are more preferred. From the viewpoint of improving the machinability and fine-machinability of the resulting molded article and from the viewpoint of availability, it is preferable that the particle size of zirconium oxide (b1) is small. For example, from the viewpoint of improving the machinability and fine-machinability of the resulting molded article, the volume median particle size (D50) of component (b1) is preferably 1 μm or less, more preferably 0.80 μm or less, even more preferably 0.60 μm or less, still more preferably 0.50 μm or less, and still more preferably 0.40 μm or less. Furthermore, from the viewpoints of improving the machinability and micromachinability of the resulting molded article, availability, and ease of handling, the particle size is usually 0.01 μm or more, more preferably 0.02 μm or more, and even more preferably 0.05 μm or more. The D50 of component (b1) can be measured using a laser diffraction light scattering particle size distribution analyzer.

[0058] Examples of commercially available zirconium oxide particles that can be used as component (b1) include the KZ series manufactured by Kyoritsu Material Co., Ltd., the TZ series manufactured by Tosoh Corporation, and the UEP series manufactured by Daiichi Kigenso Kagaku Kogyo Co., Ltd. Among these, the KZ series high-purity zirconia "KZ-0Y-LSF" manufactured by Kyoritsu Material Co., Ltd. can be suitably selected.

[0059] From the viewpoint of improving the cutting processability and fine processability of the resulting molded article, the content of component (b1) in component (B) is preferably 20% by mass or more, more preferably 30% by mass or more, even more preferably 35% by mass or more, still more preferably 40% by mass or more, still more preferably 50% by mass or more, still more preferably 60% by mass or more, and is 100% by mass or less, preferably 90% by mass or less, more preferably 80% by mass or less, and still more preferably 70% by mass or less.

[0060] The content of component (b1) in the thermoplastic resin composition relative to 100 parts by mass of component (A) is 2 to 40 parts by mass, preferably 5 to 35 parts by mass, more preferably 5 to 30 parts by mass, even more preferably 10 to 30 parts by mass, and still more preferably 20 to 30 parts by mass, from the viewpoint of thermoformability and from the viewpoint of improving the cutting processability and fine processability of the resulting molded article.

[0061] (Component (b2): Inorganic Filler Other Than Component (b1)) Component (B) may be an inorganic filler consisting solely of component (b1), or may further contain an inorganic filler (b2) other than component (b1). Examples of component (b2) include talc, mica, silica, alumina, wollastonite, silicon nitride, aluminum nitride, boron nitride, silicon carbide, boron carbide, calcium carbonate, titanium oxide, zinc oxide, calcium oxide, magnesium carbonate, barium carbonate, magnesium sulfate, barium sulfate, antimony trisulfide, tin sulfide, copper sulfide, iron sulfide, bismuth sulfide, and zinc sulfide, and one or more of these may be used. Among the above, from the viewpoint of improving the cutting workability and fine processing ability of the resulting molded article, component (b2) is preferably at least one selected from the group consisting of talc, mica, silica, alumina, silicon nitride, aluminum nitride, boron nitride, silicon carbide, boron carbide, calcium carbonate, and titanium oxide, more preferably at least one selected from the group consisting of talc, mica, silica, and titanium oxide, even more preferably at least one selected from the group consisting of talc and silica, and still more preferably talc. Note that, when it is desired to further improve the low dielectric properties, it is preferable to use a hollow inorganic filler such as hollow silica or hollow alumina.

[0062] The shape of component (b2) is not particularly limited, and examples thereof include spherical, plate-like, scaly, columnar, and fibrous shapes. Among these, spherical or plate-like particles are preferred from the viewpoints of improving the machinability and micromachinability of the resulting molded article, as well as from the viewpoint of availability.

[0063] The volume median particle size (D50) of component (b2) is preferably 3 μm or less, more preferably 2 μm or less, even more preferably 1.5 μm or less, even more preferably 1.2 μm or less, and even more preferably 1 μm or less, from the viewpoint of improving the machinability and micromachinability of the resulting molded article and from the viewpoint of availability and ease of handling. Furthermore, from the viewpoint of improving the machinability and micromachinability of the resulting molded article, availability, and ease of handling, the volume median particle size (D50) is usually 0.01 μm or more, more preferably 0.05 μm or more, and even more preferably 0.1 μm or more. The D50 of component (b2) can be measured in the same manner as for component (b1).

[0064] When component (b2) is used, the content of component (b2) in component (B) is, from the viewpoint of thermoformability and from the viewpoint of improving the cutting processability and fine processability of the resulting molded article, preferably 80% by mass or less, more preferably 70% by mass or less, even more preferably 65% ​​by mass or less, still more preferably 60% by mass or less, still more preferably 50% by mass or less, still more preferably 40% by mass or less, and is also preferably 1% by mass or more, more preferably 5% by mass or more, still more preferably 10% by mass or more, still more preferably 15% by mass or more, still more preferably 20% by mass or more, and still more preferably 30% by mass or more.

[0065] When component (b2) is used, the content of component (b2) per 100 parts by mass of component (A) in the thermoplastic resin composition is preferably 1 to 40 parts by mass, more preferably 2 to 30 parts by mass, even more preferably 5 to 30 parts by mass, and still more preferably 10 to 20 parts by mass, from the viewpoint of improving the cutting processability and fine processability of the resulting molded article.

[0066] The content of component (B) per 100 parts by mass of component (A) in the thermoplastic resin composition is 2 to 60 parts by mass, preferably 5 to 50 parts by mass, more preferably 10 to 45 parts by mass, even more preferably 15 to 45 parts by mass, still more preferably 20 to 45 parts by mass, still more preferably 25 to 45 parts by mass, and still more preferably 30 to 45 parts by mass, from the viewpoint of thermoformability and from the viewpoint of improving the cutting processability and fine processability of the resulting molded article.

[0067] <Additives> The thermoplastic resin composition of the present invention may contain additives other than component (B), such as reinforcing fibers, delustering agents, plasticizers, antistatic agents, coloring inhibitors, antigelling agents, colorants, sliding property improvers, antioxidants, conductive agents, and resin modifiers, as needed. In particular, graphite, carbon black, graphite, ketjen black, or carbon nanotubes can be used as an antistatic agent, because sufficient antistatic effects can be achieved even with small amounts that do not impair the properties of the thermoplastic resin composition of the present invention. When using such additives, there are no particular restrictions on their amount, but from the perspective of achieving the desired effect, their amount in the thermoplastic resin composition is typically 50% by mass or less, preferably 0.0001 to 30% by mass, more preferably 0.001 to 15% by mass, and even more preferably 0.01 to 10% by mass.

[0068] Furthermore, the thermoplastic resin composition of the present invention can be blended with other resins than the thermoplastic resin (A) as long as the properties of the composition are not impaired. When the thermoplastic resin (A) and other resins are used in combination, there are no particular limitations on the blending ratio as long as the properties of the thermoplastic resin composition are not impaired.

[0069] However, from the viewpoint of obtaining the effects of the present invention, the total content of component (A) and component (B) in the thermoplastic resin composition of the present invention is preferably 30% by mass or more, more preferably 40% by mass or more, even more preferably 50% by mass or more, still more preferably 70% by mass or more, still more preferably 80% by mass or more, and still more preferably 90% by mass or more, and is 100% by mass or less.

[0070] The thermoplastic resin composition of the present invention can take any form, but is preferably in the form of pellets. The thermoplastic resin composition of the present invention can be produced, for example, by dry-blending the thermoplastic resin (A), the inorganic filler (B), and, if necessary, various optional components, or by separately feeding the inorganic filler (B) and optional components from a location separate from the feed of the thermoplastic resin (A) into the extruder, melt-kneading the mixture in the extruder to extrude strands, and then cutting the strands to form pellets. Furthermore, molded articles having desired shapes can be easily produced by introducing the pellets into various molding machines and thermoforming them using the methods described below. Alternatively, molded articles can also be obtained without going through the pelletized form. For example, a molded article can be obtained directly by dry-blending the thermoplastic resin (A), the inorganic filler (B), and, if necessary, various optional components, and then placing the blended material in a mold and performing compression molding by hot pressing. From the perspective of forming pellets and performing compression molding, the thermoplastic resin composition of the present invention preferably does not contain a solvent. Specifically, the solvent content in the thermoplastic resin composition is preferably 5% by mass or less, more preferably 1% by mass or less, and even more preferably 0.1% by mass or less.

[0071] [Molded Article] The present invention provides a molded article comprising the thermoplastic resin composition. The molded article of the present invention can be produced by thermoforming the thermoplastic resin composition. Thermoforming methods include injection molding, extrusion molding, inflation molding, blow molding, hot press molding (compression molding), vacuum molding, pressure molding, laser molding, welding, and welding. Any molding method involving a thermal melting step is possible. From the viewpoint of thermoforming using the above-mentioned pellets and cutting the resulting molded article, injection molding or extrusion molding is preferred. In particular, injection molding is preferred from the viewpoint of production efficiency, and extrusion molding is preferred from the viewpoint of higher dimensional stability.

[0072] The method for producing a molded article varies depending on the melting point or glass transition temperature of the thermoplastic resin (A). However, when the thermoplastic resin (A) contains the polyimide resin (a1-1), it is preferable to thermoform the thermoplastic resin composition at 290 to 380°C. Thermoforming at temperatures above 380°C to 400°C is also possible, but from the viewpoint of suppressing deterioration of the thermoplastic resin (A) and other components, thermoforming at a temperature of 380°C or less is preferred. Specific procedures include, for example, the following method. First, the inorganic filler (B) and various optional components as needed are added to the thermoplastic resin (A) and dry-blended, and then the mixture is introduced into an extruder, melted preferably at 290 to 380°C, and melt-kneaded and extruded in the extruder to produce pellets. Alternatively, the thermoplastic resin (A) may be introduced into an extruder, melted preferably at 290 to 380°C, and the inorganic filler (B) and various optional components as needed are introduced thereto. The mixture is melt-kneaded with the thermoplastic resin (A) in the extruder, and extruded to produce the pellets. After drying the pellets, they are introduced into various molding machines and thermoformed preferably at 290 to 380° C. to produce a molded article having a desired shape.

[0073] The molded article obtained by the thermoforming may be further subjected to cutting or the like to form a desired shape. For example, an injection-molded article may be produced using the thermoplastic resin composition, and then the molded article may be subjected to cutting to obtain a molded article having a desired shape.

[0074] The molded article obtained by the thermoforming is preferably further annealed from the viewpoint of further improving machinability and micromachining. When a molded article obtained by thermoforming a thermoplastic resin composition and then annealing it is cut, a flat plate with low surface roughness and little warping can be obtained. Furthermore, using this flat plate, finer through-holes can be formed. The annealing temperature can be set depending on the type of thermoplastic resin (A) used. When the thermoplastic resin (A) is a crystalline thermoplastic resin (a1), the annealing temperature is a temperature below the melting point of the crystalline thermoplastic resin (a1) from the viewpoint of avoiding deformation of the molded article. From the viewpoint of further improving machinability and micromachining, and from the viewpoint of avoiding deformation of the molded article, the annealing temperature is preferably in the range of Tm-100°C to Tm-20°C, where Tm (°C) is the melting point of the crystalline thermoplastic resin (a1). When the thermoplastic resin (A) is an amorphous thermoplastic resin (a2), the annealing temperature is a temperature less than the glass transition temperature of the amorphous thermoplastic resin (a2) from the viewpoint of avoiding deformation of the molded body, and from the viewpoint of further improving machinability and micromachinability, and from the viewpoint of avoiding deformation of the molded body, where Tg (°C) is the glass transition temperature of the amorphous thermoplastic resin (a2), it is preferably in the range of Tg-100 ° C to Tg-20 ° C. Specific examples of the annealing temperature, when the thermoplastic resin (A) contains the polyimide resin (a1-1), from the viewpoint of further improving machinability and micromachinability, and from the viewpoint of avoiding deformation of the molded body, are preferably in the range of 200 to 360 ° C, more preferably 220 to 340 ° C, even more preferably 240 to 330 ° C, and even more preferably 250 to 320 ° C. The annealing time is not particularly limited, but from the viewpoint of further improving the machinability and micromachinability of the molded body, and from the viewpoint of improving production efficiency, it is preferably in the range of 1 to 120 minutes, more preferably 5 to 60 minutes. The annealing treatment of the molded body can be carried out using a known heating device. After the annealing treatment, the molded body is slowly cooled to a temperature of preferably 100° C. or less in order to prevent the molded body from warping due to residual stress.

[0075] [Constituent Component of Testing IC Socket] The present invention further provides a constituent component of a testing IC socket (hereinafter simply referred to as "component of the present invention" or "component") obtained by processing the molded article. Examples of the testing IC socket in this specification include IC sockets for product testing (test sockets) and IC sockets for burn-in testing (burn-in sockets). The component of the present invention may be any component that constitutes at least a portion of the testing IC socket, and examples thereof include a substantially flat plate-shaped component used in a location where a device to be tested is mounted. The substantially flat plate-shaped component has fine through-holes for fitting the device. The component of the present invention can be produced, for example, by the following method. First, the thermoplastic resin composition is thermoformed (preferably injection molded) to produce a molded body. Next, preferably after annealing, the molded body is machined using an electric drill or the like to obtain a machined plate. This machined plate is then micromachined using an electric drill, laser, or the like to form a plurality of through-holes, thereby obtaining a component having a desired shape.

[0076] 1 is a schematic plan view showing one embodiment of a component 100 of a testing IC socket. In FIG. 1, 10 is a machined plate, and 20 is a through-hole forming area.

[0077] From the viewpoint of improving micromachining properties, it is preferable that the machined surface of the machined plate 10 used to produce the member 100 has a low surface roughness. For example, the arithmetic mean roughness (Ra) of the machined surface of the machined plate 10 is preferably 1 μm or less, more preferably 0.8 μm or less, even more preferably 0.6 μm or less, and even more preferably 0.3 μm or less. The arithmetic mean roughness can be measured specifically by the method described in the examples.

[0078] A plurality of through holes are regularly arranged at a narrow pitch in the through hole formation area 20. The diameter of the through holes is typically selected in the range of Φ0.01 to 0.20 mm, and the pitch is selected in the range of 0.02 to 0.40 mm. Note that a hole diameter of 0.1 mm or more is preferable because various probes such as wire probes and spring probes can be used, while a hole diameter of less than 0.1 mm is preferable because it can be adapted to more detailed inspections by using an even smaller diameter wire probe.

[0079] Molded articles produced by injection molding or the like using the thermoplastic resin composition of the present invention have low surface roughness on the machined surface when machined, resulting in good machineability. Furthermore, when a large number of through-holes are drilled at narrow pitches in the machined plate using an electric drill, laser, or the like, the hole size distribution is less likely to increase, the pattern is less likely to collapse, and burrs are less likely to occur, resulting in good fine-machinability. Furthermore, because molded articles produced by injection molding or the like using the thermoplastic resin composition of the present invention have excellent machineability as described above, they are also highly adaptable to applications requiring precision machined processing, such as gears, bearings, and watch housings, in addition to IC socket components.

[0080] The present invention will now be described in more detail with reference to examples, but the present invention is not limited thereto. In addition, various measurements and evaluations in each production example and example were carried out as follows.

[0081] <Infrared Spectroscopic Analysis (IR Measurement)> IR measurement of the polyimide resin was carried out using a JEOL Ltd. "JIR-WINSPEC50".

[0082] <Logarithmic Viscosity μ> After drying a polyimide resin at 190 to 200°C for 2 hours, 0.100 g of the polyimide resin was dissolved in 20 mL of concentrated sulfuric acid (96%, manufactured by Kanto Chemical Co., Inc.) to prepare a polyimide resin solution as a measurement sample, and measurement was carried out at 30°C using a Cannon-Fenske viscometer. Logarithmic viscosity μ was calculated using the following formula: μ = ln(ts / t ０ ) / C t ０ : Time during which concentrated sulfuric acid flows ts: Time during which polyimide resin solution flows C: 0.5 g / dL

[0083] <Melting Point, Glass Transition Temperature, Crystallization Temperature, and Crystallization Heat Amount> The melting point Tm, glass transition temperature Tg, crystallization temperature Tc, and crystallization heat amount ΔHm of the polyimide resin were measured using a differential scanning calorimeter (DSC-6220 manufactured by SII Nanotechnology, Inc.). Under a nitrogen atmosphere, the polyimide resin was subjected to the following thermal history conditions. The thermal history conditions were a first heating (heating rate of 10°C / min), followed by cooling (heating rate of 20°C / min), followed by a second heating (heating rate of 10°C / min). The melting point Tm was determined by reading the peak-top value of the endothermic peak observed during the second heating. The glass transition temperature Tg was determined by reading the value observed during the second heating. The crystallization temperature Tc was determined by reading the peak-top value of the exothermic peak observed during cooling. The crystallization heat amount ΔHm (mJ / mg) was calculated from the area of ​​the exothermic peak observed during cooling.

[0084] <Crystallization Half Time> The crystallization half time of a polyimide resin was measured using a differential scanning calorimeter (DSC-6220 manufactured by SII Nanotechnology, Inc.). The measurement conditions for a polyimide resin with a crystallization half time of 20 seconds or less were as follows: the polyimide resin was held at 420°C for 10 minutes in a nitrogen atmosphere until it was completely melted, and then rapidly cooled at a cooling rate of 70°C / minute. The crystallization half time was determined by calculating the time required from the appearance of the observed crystallization peak until it reached its peak top.

[0085] <Weight-average molecular weight> The weight-average molecular weight (Mw) of the polyimide resin was measured using a gel permeation chromatography (GPC) measuring device "Shodex GPC-101" manufactured by Showa Denko K.K. under the following conditions: Column: Shodex HFIP-806M Mobile phase solvent: HFIP containing 2 mM sodium trifluoroacetate Column temperature: 40°C Mobile phase flow rate: 1.0 mL / min Sample concentration: approximately 0.1% by mass Detector: IR detector Injection volume: 100 μm Calibration curve: standard PMMA

[0086] Production Example 1 (Production of Polyimide Resin 1) 500 g of 2-(2-methoxyethoxy)ethanol (manufactured by Nippon Nyukazai Co., Ltd.) and 218.12 g (1.00 mol) of pyromellitic dianhydride (manufactured by Mitsubishi Gas Chemical Co., Ltd.) were introduced into a 2 L separable flask equipped with a Dean-Stark apparatus, a Liebig condenser, a thermocouple, and four paddle blades. After nitrogen flow, the mixture was stirred at 150 rpm to obtain a uniform suspension. Meanwhile, using a 500 mL beaker, 49.79 g (0.35 mol) of 1,3-bis(aminomethyl)cyclohexane (manufactured by Mitsubishi Gas Chemical Co., Ltd., cis / trans ratio = 7 / 3) and 93.77 g (0.65 mol) of 1,8-octamethylenediamine (manufactured by Kanto Chemical Co., Ltd.) were dissolved in 250 g of 2-(2-methoxyethoxy)ethanol to prepare a mixed diamine solution. This mixed diamine solution was gradually added using a plunger pump. Although heat was generated during the dropwise addition, the internal temperature was adjusted to remain within the range of 40 to 80°C. During the dropwise addition of the mixed diamine solution, nitrogen flow was maintained throughout, and the stirring impeller rotation speed was set to 250 rpm. After the dropwise addition was completed, 130 g of 2-(2-methoxyethoxy)ethanol and 1.284 g (0.0100 mol) of n-octylamine (Kanto Chemical Co., Inc.), an end-capping agent, were added and further stirred. At this stage, a pale yellow polyamic acid solution was obtained. Next, the stirring speed was increased to 200 rpm, and the polyamic acid solution in the 2-L separable flask was heated to 190°C. During the temperature increase, precipitation of polyimide resin powder and dehydration associated with imidization were observed between 120 and 140°C. After holding at 190°C for 30 minutes, the solution was allowed to cool to room temperature and then filtered. The obtained polyimide resin powder was washed with 300 g of 2-(2-methoxyethoxy)ethanol and 300 g of methanol, filtered, and then dried in a dryer at 180°C for 10 hours to obtain 317 g of powder of a crystalline thermoplastic resin, Polyimide Resin 1. Measurement of the IR spectrum of Polyimide Resin 1 revealed a ν(C=O) 1768, 1697 (cm －１ The inherent viscosity was 1.30 dL / g, Tm was 323°C, Tg was 184°C, Tc was 266°C, the exotherm of crystallization was 21.0 mJ / mg, the half-crystallization time was 20 seconds or less, and Mw was 55,000.

[0087] The composition and evaluation results of the polyimide resin in Production Example 1 are shown in Table 1. The mole percentages of the tetracarboxylic acid component and the diamine component in Table 1 are values ​​calculated from the amounts of each component charged when the polyimide resin was produced.

[0088]

[0089] The abbreviations in Table 1 are as follows: PMDA: pyromellitic dianhydride 1,3-BAC: 1,3-bis(aminomethyl)cyclohexane OMDA: 1,8-octamethylenediamine

[0090] Examples 1 to 9 and Comparative Examples 1 to 6 (Production and Evaluation of Thermoplastic Resin Compositions and Molded Articles (1)) Component (A) and component (B) shown in Table 2 were thoroughly mixed by dry blending. The resulting mixed powder was extruded into strands having a diameter of 2 to 3 mm using a co-rotating twin-screw kneading extruder ("HK-25D-41D" manufactured by Parker Corporation, screw diameter: 25 mm) at a barrel temperature of 360°C and a screw rotation speed of 120 rpm. The discharge amount and discharge properties of the strands were observed, and the production stability of the resin composition during twin-screw extrusion was evaluated according to the following criteria.

[0091] <Production Stability During Twin-Screw Extrusion> The discharge rate (kg / h) and discharge properties of the strands extruded from the twin-screw kneading extruder using the method described above were observed, and the production stability of the resin composition during twin-screw extrusion was evaluated according to the following criteria. AA: The discharge rate was more than 4 kg / h, and the strands were discharged uniformly. A: The discharge rate was 3 to 4 kg / h, and the strands were discharged uniformly. B: The discharge rate was 3 to 4 kg / h, and the strands were discharged unevenly. C: The discharge rate was less than 3 kg / h.

[0092] The strand extruded from the extruder was air-cooled and then pelletized using a pelletizer ("Fan Cutter FC-Mini-4 / N" manufactured by Hoshi Plastics Co., Ltd.). The resulting pellets (thermoplastic resin composition) were dried at 150°C for 10 hours and then used for injection molding. Using an injection molding machine ("Roboshot α-S30iA" manufactured by Fanuc Corporation), injection molding was performed at a barrel temperature of 375°C, a mold temperature of 200°C, and a molding cycle of 60 seconds to produce a 70 mm x 70 mm x 4 mm thick plate-shaped injection molded article. The injection moldability of this product was evaluated using the following method.

[0093] <Evaluation of Injection Moldability> The injection moldability of the resin composition was evaluated based on the following three items.

[0094] (Device Load) The torque was observed when the resin composition pelletized by the above method was fed into the cylinder of the injection molding machine, and the device load was evaluated according to the following criteria: A: When feeding the pellets into the cylinder, there was a sufficient margin up to the torque limit. B: When feeding the pellets into the cylinder, the torque limit was reached, but molding was possible. C: When feeding the pellets into the cylinder, the torque limit was reached and molding was not easy.

[0095] (Surface roughness of molded article) The surface of the injection molded article obtained by the above method was visually observed and evaluated for surface roughness according to the following criteria: AA: No silver or bubbles. A: Slight silver or bubbles. B: A large amount of silver or bubbles is observed, but not over the entire surface. C: A large amount of silver or bubbles is observed over the entire surface.

[0096] (Burning of Molded Article) The surface of the injection molded article obtained by 10 consecutive injection molding shots using the above method was visually observed, and the burning was evaluated according to the following criteria: AA: No burning was observed during 10 consecutive molding shots. A: Burning was gradually observed during 10 consecutive molding shots. B: Burning was observed from the first shot. C: Burning was observed from the first shot, and the burning gradually became stronger.

[0097] <Evaluation of Machinability (1)> The machinability of the injection molded article was evaluated by the following method. (Surface Roughness During Cutting) The injection molded article obtained by the above method was cut to prepare a flat plate measuring 50 mm x 50 mm x 3 mm thick. On the cut surface of the obtained flat plate, the arithmetic mean roughness (Ra) of a continuous area 20 mm long in the direction perpendicular to the cutting direction was measured using a 3D shape measuring device ("VR-6000" manufactured by Keyence Corporation), and the surface roughness was evaluated according to the following criteria. A: Arithmetic mean roughness is 0.6 μm or less B: Arithmetic mean roughness is more than 0.6 μm and 1 μm or less C: Arithmetic mean roughness is more than 1 μm

[0098] <Evaluation of Micromachining (1)> The micromachining of the flat plate (machined plate) was evaluated based on the following two criteria. (Hole Diameter Distribution of Microholes (100 μm)) 24 × 24 through holes were drilled at a pitch of 0.12 mm using an electric drill (drill diameter: Φ0.10 mm) in an area 20 (within an area of ​​approximately 3 mm × 3 mm) near the center of the machined plate 10 measuring 50 mm × 50 mm × 3 mm thick, as shown in FIG. 1 , for a total of 576 holes. The diameters of the formed through holes were measured using a high-precision image dimension measuring device (Keyence Corporation, "LM Series"), and the diameter distribution was evaluated according to the following criteria: A: The diameters of all through holes were between Φ0.090 and Φ0.110 mm. C: Some through holes had diameters outside the Φ0.090 to Φ0.110 mm range.

[0099] (Appearance and burr state of micropores (100 μm)) The appearance of the through holes formed by the above method was observed with a digital microscope (Keyence Corporation's "VHX-7000", magnification: 50x) and evaluated according to the following criteria: AA: No pattern collapse and few burrs. A: Slight pattern collapse and burrs present. C: Major pattern collapse, holes close to each other, or a large amount of burrs present.

[0100] The results of the above evaluations are shown in Table 2. Note that, for Comparative Examples 2 and 5, the injection moldability was poor, so that it was not possible to evaluate the machinability and fine processability after injection molding.

[0101]

[0102] Examples 6, 10-12 (Production and Evaluation of Thermoplastic Resin Composition and Molded Article (2)) Component (A) and component (B) shown in Table 3 were thoroughly mixed by dry blending. The resulting mixed powder was extruded into strands with a diameter of 2-3 mm using a co-rotating twin-screw kneading extruder ("HK-25D-41D" manufactured by Parker Corporation, screw diameter: 25 mm) at a barrel temperature of 360°C and a screw rotation speed of 120 rpm. The strands extruded from the extruder were air-cooled and then pelletized using a pelletizer ("Fan Cutter FC-Mini-4 / N" manufactured by Hoshi Plastics Co., Ltd.). The resulting pellets (thermoplastic resin composition) were dried at 150°C for 10 hours and then used for injection molding. Using an injection molding machine ("Roboshot α-S30iA" manufactured by Fanuc Corporation), injection molding was performed at a barrel temperature of 375°C, a mold temperature of 200°C, and a molding cycle of 60 seconds to produce a 70 mm x 70 mm x 4 mm thick plate-shaped injection molded article. The injection molded article was annealed for 60 minutes at the temperature shown in Table 3 using a constant temperature incubator ("DN610H" manufactured by Yamato Scientific Co., Ltd.), and then slowly cooled to room temperature. The injection molded article was recovered and evaluated by the following methods.

[0103] <Evaluation of Machinability (2)> The machinability of the injection molded article after the annealing treatment was evaluated according to the following two items. (Warpage during cutting) The injection molded article obtained by the above method was cut to prepare a flat plate measuring 50 mm x 50 mm x 3 mm thick. The state of warpage of the obtained flat plate was checked from eight directions using a strain gauge and evaluated according to the following criteria. A: Warpage of 40 μm or less in all eight directions. B: Warpage exceeding 40 μm in one or more locations. C: Strong waviness was observed overall, making it difficult to measure the warpage.

[0104] (Surface roughness during cutting) The injection molded article obtained by the above method was cut to prepare a flat plate measuring 50 mm x 50 mm x 3 mm thick. On the cut surface of the obtained flat plate, the arithmetic mean roughness (Ra) of a continuous region 20 mm long in the direction perpendicular to the cutting direction was measured using a 3D shape measuring device ("VR-6000" manufactured by Keyence Corporation), and the surface roughness was evaluated according to the following criteria. AA: Arithmetic mean roughness is 0.3 μm or less A: Arithmetic mean roughness is more than 0.3 μm and 0.6 μm or less B: Arithmetic mean roughness is more than 0.6 μm and 1 μm or less C: Arithmetic mean roughness is more than 1 μm

[0105] <Evaluation of Micromachining (2)> The micromachining of the flat plate (machined plate) was evaluated based on the following two criteria. (Hole Diameter Distribution of Microholes (50 μm)) Four through-holes (4 × 20, totaling 80) were drilled at a pitch of 0.1 mm using an electric drill (drill diameter: Φ0.05 mm) in an area 20 (within an area of ​​approximately 3 mm × 3 mm) near the center of the machined plate 10 measuring 50 mm × 50 mm × 3 mm (as shown in FIG. 1). The diameters of the formed through-holes were measured using a high-precision image dimension measuring device (Keyence Corporation, "LM Series"), and the diameter distribution was evaluated based on the following criteria: A: All through-holes had diameters between Φ0.047 and Φ0.053 mm. C: Some through-holes had diameters outside the Φ0.047 to Φ0.053 mm range. In Table 3, those for which micromachining itself was difficult were marked with "-".

[0106] (Appearance and burr state of micropores (50 μm)) The appearance of the through holes formed by the above method was observed with a digital microscope ("VHX-7000" manufactured by Keyence Corporation, magnification: 50x) and evaluated according to the following criteria. AA: No pattern collapse and few burrs. A: Some pattern collapse and burrs present. C: Major pattern collapse, holes close to each other, or a large amount of burrs present. In Table 3, those for which microfabrication itself was difficult were marked with "-".

[0107] The evaluation results are shown in Table 3. From Table 3, it can be seen that the molded bodies of Examples 10 to 12, which were annealed, were superior in machinability and fine processing ability to the molded body of Example 6, which was not annealed.

[0108]

[0109] The details of each component shown in Tables 2 and 3 are as follows: <Thermoplastic resin (A)> (a1-1) Polyimide resin 1 obtained in Production Example 1 <Inorganic filler (B)> (b1) Zirconium oxide, high-purity zirconia "KZ-0Y-LSF" manufactured by Kyoritsu Material Co., Ltd., spherical particles, D50: 0.2 μm, Mohs hardness: 8 (b2-1) Silica, "KS-1" manufactured by Kyoritsu Material Co., Ltd., plate-like particles, D50: 1.4 μm, Mohs hardness: 7 (b2-2) Talc, "Nano Ace D-800" manufactured by Nippon Talc Co., Ltd., plate-like particles, D50: 0.8 μm, Mohs hardness: 1 (b2-3) Mica, hard mica "A-11" manufactured by Yamaguchi Mica Co., Ltd., plate-like particles, D50: 3 μm, Mohs hardness: 2.0 to 3.2

[0110] The thermoplastic resin composition of the present invention can be used to prepare a molded article having excellent machinability and fine processability, which is suitable for producing components such as IC sockets for testing.

[0111] 100: Constituent member of inspection IC socket 10: Cutting processing plate 20: Through hole forming area

Claims

1. Component (A): at least one thermoplastic resin selected from the group consisting of a crystalline thermoplastic resin (a1) having a melting point of 270° C. or higher and a non-crystalline thermoplastic resin (a2) having a glass transition temperature of 200° C. or higher; and Component (B): an inorganic filler containing zirconium oxide (b1); A thermoplastic resin composition comprising: The content of the component (b1) is 2 to 40 parts by mass relative to 100 parts by mass of the component (A), The thermoplastic resin composition has a content of the component (B) of 2 to 60 parts by mass relative to 100 parts by mass of the component (A).

2. The thermoplastic resin composition according to claim 1, wherein the component (A) is at least one selected from the group consisting of polyimide resins, polyetherimide resins, polyetherimide sulfone resins, polyphenylene sulfide resins, polyether ether ketone resins, polyether ketone ketone resins, liquid crystal polymers, and wholly aromatic polyester resins other than liquid crystal polymers.

3. The thermoplastic resin composition according to claim 1, wherein the component (A) comprises a polyimide resin (a1-1) that contains a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), and the content of the repeating structural unit of the formula (1) relative to the total of the repeating structural units of the formula (1) and the repeating structural units of the formula (2) is 20 to 70 mol %: 【Chemistry 1】 (R １ R is a divalent group having 6 to 22 carbon atoms and containing at least one alicyclic hydrocarbon structure. ２ is a divalent chain aliphatic group having 5 to 16 carbon atoms. １ and X ２ are each independently a tetravalent group having 6 to 22 carbon atoms and containing at least one aromatic ring.

4. The thermoplastic resin composition according to claim 1, wherein the component (b1) has a volume median particle size (D50) of 1 μm or less.

5. The thermoplastic resin composition according to claim 1 , wherein the component (b1) is a spherical particle.

6. 2. The thermoplastic resin composition according to claim 1, wherein the component (B) further comprises an inorganic filler (b2) other than the component (b1), and the component (b2) is at least one selected from the group consisting of talc, mica, silica, alumina, silicon nitride, aluminum nitride, boron nitride, silicon carbide, boron carbide, calcium carbonate, and titanium oxide.

7. The thermoplastic resin composition according to claim 6, wherein the content of the component (b2) is 1 to 40 parts by mass relative to 100 parts by mass of the component (A).

8. A molded article comprising the thermoplastic resin composition according to any one of claims 1 to 7.

9. A component of an IC socket for testing, obtained by processing the molded article according to claim 8.

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