Rolled copper foil, copper-clad laminate, method for manufacturing copper-clad laminate, method for manufacturing flexible printed circuit board, and method for manufacturing electronic part

Abstract

Provided is a rolled copper foil having greater flexural properties than conventional flexural properties when passing through CCL manufacturing using a lamination method and being made into FPC. The present invention is a rolled copper foil containing at least 99.9 mass% Cu, the remainder being unavoidable impurities, and having an arithmetic mean Cube area ratio of at least 77.0% when measuring a total of three points, one arbitrary point and two other points separated equidistantly therefrom such as by 5 mm each in a direction perpendicular to rolling, when heat-treated at a soak temperature of 370°C for a soak time of 1 sec.