Information processing device, semiconductor chip, and control method

Abstract

Provided is an information processing device comprising a first semiconductor chip, and a second semiconductor chip that performs wireless communication with the first semiconductor chip, the information processing device being characterized in that the first semiconductor chip includes a processor that performs information processing, and a communication unit that receives a wireless signal from the second semiconductor chip, and the processor has a state determination unit that determines a state of at least one among the first semiconductor chip and the second semiconductor chip on the basis of time-series changes in a measurement value of the wireless signal received via the communication unit from the second semiconductor chip.

Description

Information processing device, semiconductor chip, and control method

[0001] The present invention relates to an information processing device, a semiconductor chip, and a control method.

[0002] Techniques for performing wireless communication using coils between multiple semiconductor chips have been known for some time. For example, Patent Document 1 proposes an information processing device that exchanges information between multiple horizontally integrated semiconductor chips via short-range wireless communication.

[0003] Japanese Patent Application Laid-Open No. 2021-87044

[0004] When an information processing device using multiple semiconductor chips is used for a long period of time, it is necessary to monitor that each semiconductor chip is operating normally and to repair or replace it as necessary. However, with the conventional technology such as that shown in Patent Document 1, although it is possible to detect when communication with an adjacent semiconductor chip has been interrupted, it is difficult to grasp the state of the semiconductor chip, such as when a semiconductor chip has failed or when the distance between the chips has changed.

[0005] The present invention has been made in view of the above background, and provides an information processing device, a semiconductor chip, and a state monitoring device that are capable of grasping the state of a semiconductor chip.

[0006] One aspect of the present invention to address the above problem is an information processing device comprising a first semiconductor chip and a second semiconductor chip that performs wireless communication with the first semiconductor chip, wherein the first semiconductor chip comprises a processor that performs information processing and a communication unit that receives wireless signals from the second semiconductor chip, and the processor has a state determination unit that determines the state of at least one of the first semiconductor chip and the second semiconductor chip based on time-series changes in the measurement value of the wireless signal received from the second semiconductor chip via the communication unit.

[0007] Other problems and solutions disclosed in this application will be made clear in the section on preferred embodiments of the invention and the drawings.

[0008] According to the present invention, it is possible to provide an information processing device, a semiconductor chip, and a control method that are capable of grasping the state of the semiconductor chip.

[0009] 1 is a diagram showing an example of the overall configuration of an information processing device according to an embodiment of the present invention; FIG. 2 is a diagram showing an example of the hardware configuration of an information processing device according to an embodiment of the present invention; FIG. 3 is a block diagram showing the functional configuration of a semiconductor chip according to an embodiment of the present invention; FIG. 4 is a control flow diagram showing the operation of an information processing device according to an embodiment of the present invention; FIG. 5 is a diagram showing an example of information stored in a measurement value storage unit of the present invention; FIG. 6 is a diagram showing another example of information stored in a measurement value storage unit of the present invention; FIG. 7 is a diagram showing an example of a wireless signal and a coil voltage value communicated between semiconductor chips according to an embodiment of the present invention; FIG. 8 is a diagram showing a first application example of an information processing device according to the present invention; FIG. 9 is a diagram showing a second application example of an information processing device according to the present invention; FIG. 10 is a diagram showing an example of a format of a wireless signal frame for sensing processing; FIG. 11 is a flowchart of processing (evaluation value acquisition processing of the sensing processing) in which a semiconductor chip 1 acquires an evaluation value of a wireless signal received from another semiconductor chip 1; FIG. 12 is a flowchart of a state determination processing of the sensing processing; FIG. 13 is a diagram showing an example of a format of a wireless signal frame for sensing processing; FIG. 14 is a diagram showing an example of a format of a wireless signal frame for sensing processing;

[0010] <System Overview> FIG. 1 is a diagram showing an example of the configuration of an information processing device according to an embodiment of the present invention. The information processing device of this embodiment is configured to include multiple semiconductor chips (1a, 1b). Each semiconductor chip 1 is a device capable of measuring the relative positional relationship with other semiconductor chips 1. The multiple semiconductor chips 1 are arranged on the surface of or inside a measurement object 4, and by measuring the relative positional relationship with the other semiconductor chips 1, the state of the measurement object 4 (e.g., the operating state, deformation, temperature, vibration, pressure, electromagnetic waves, volume, humidity, etc. of the measurement object) can be measured. The measurement object 4 may be, for example, a device that moves or deforms, such as a door or a motor, a civil engineering or construction material, such as embankment or concrete, or water or air.

[0011] The semiconductor chip 1 includes a processor 10 and a communication unit 30, and the processor 10 includes a memory 20. At least a portion of the memory 20 includes a non-volatile storage device and can store a program to be executed by the processor 10. The communication unit 30 can function as an antenna. The communication unit 30 can transmit and receive signals to and from the communication unit 30 of another semiconductor chip 1 arranged adjacently by inductive coupling (which is also synonymous with near-field inductive coupling, magnetic field coupling, or electromagnetic induction) or other communication methods.

[0012] At least one of the multiple semiconductor chips 1 (semiconductor chip 1a in FIG. 1) is connected to be able to communicate with the computer 2. Communication between the computer 2 and the semiconductor chip 1 can be wireless communication via a communication unit 30. Note that wired communication can also be used between the computer 2 and the semiconductor chip 1.

[0013] The calculator 2 is a computer that can receive at least one of information indicating whether or not a failure has occurred in its own semiconductor chip 1a or another semiconductor chip 1b with which it communicates wirelessly, detected by the semiconductor chip 1a itself, and information indicating the relative positional relationship between its own semiconductor chip 1a and the other semiconductor chip 1b, and perform analysis of the failure state of the semiconductor chip 1 and the relative positional relationship of the semiconductor chips.

[0014] The information processing device of this embodiment can determine the relative positional relationship and the presence or absence of a fault among the multiple semiconductor chips 1 that make up the information processing device. By determining the relative positional relationship among the multiple semiconductor chips 1, and if the absolute position (expressed in latitude and longitude, for example) of at least one of the multiple semiconductor chips 1 is given, it is also possible to determine the absolute positions of all of the multiple semiconductor chips 1.

[0015] 2 shows an example of a hardware configuration for realizing the communication unit 30 (communication circuit), in which a coil 70 and a transmission / reception circuit 80 are provided on the outer periphery of a processor in a semiconductor chip 1. The example shown in Fig. 2 shows an example in which semiconductor chips 1 are used in pairs, and the semiconductor chip 1 includes processors (10a, 10b), memories (20a, 20b) provided in the processors, transmission / reception circuits (80a, 80b) communicatively connected to the processors and generating signals flowing through the coil 70, coils (70a, 70b) connected to the transmission / reception circuits, first negative power supply terminals (61a, 61b) for supplying power to the processors and the transmission / reception circuits, and second positive power supply terminals (62a, 62b).

[0016] The first and second power supply terminals can receive power from outside the semiconductor chip. The semiconductor chip may be configured to receive power wirelessly instead of receiving power via the first and second power supply terminals as shown in FIG. 2 . The coil 70 can function as an antenna. The coil 70 can transmit and receive signals to and from the coil 70 of another adjacent semiconductor chip 1 via inductive coupling or other communication methods. Similarly, the coil 70 can transmit and receive signals to and from the computer 2 via inductive coupling or other communication methods. Here, FIG. 7 shows the voltage value acquired by the coil 70 in response to a transmission signal from a nearby semiconductor chip and the received signal generated based on the voltage value. In this way, the coil acquires the voltage value induced in the coil when receiving a wireless signal from a nearby semiconductor chip.

[0017] In the two adjacent semiconductor chips (1a, 1b) shown in FIG. 2, the strength of inductive coupling changes as the relative position, including at least one of the relative distance and relative angle, between the coils (70a, 70b) changes, causing a change in the voltage value or voltage amplitude generated in the coil 70. In this embodiment, the transceiver circuit 80 detects the voltage value or voltage amplitude generated in the coil 70, and the processor 10 acquires the detected voltage value or voltage amplitude as a measurement value, thereby detecting a change in the relative position, including at least one of the relative distance and relative angle, between the semiconductor chips. The memory 20 records the detected change in relative position. Here, as shown in FIG. 7, for example, when a coil receives a wireless signal, the voltage value or voltage amplitude induced in the coil is acquired as a measurement value. If the voltage amplitude decreases, it can be determined that the relative positions of the chips have become farther apart, and if the voltage amplitude increases, it can be determined that the relative positions of the chips have become closer.

[0018] By inseparably mounting the processor and communication unit shown in FIG. 2 on a semiconductor chip, the semiconductor chip in this embodiment can be configured as a CPU. In this case, the diameter of the semiconductor chip can be, for example, approximately 0.3 mm, allowing for miniaturization of the semiconductor chip. Note that this size is an example, and the size of the semiconductor chip in this invention is not limited to this. For example, the processor and communication unit can be inseparably mounted on the semiconductor chip (on a single chip). Here, a semiconductor chip is defined as a small piece of silicon (silicon die or die) with an electronic circuit embedded therein. Alternatively, in some cases, it can be defined as a package in which the silicon die is sealed.

[0019] 3 is a block diagram showing the functional configuration of the semiconductor chip 1. The semiconductor chip 1 includes a sensing unit 111, a communication unit 112, a state determination unit 120, a measurement value storage unit 131, a reference condition storage unit 132, a reference value storage unit 133, a determination condition storage unit 134, a relative position storage unit 135, and a fault state storage unit 136, and the state determination unit 120 includes a reference value determination unit 121, a relative position determination unit 122, and a fault determination unit 123. The sensing unit 111, the communication unit 112, and the state determination unit 120 (the reference value determination unit 121, the relative position determination unit 122, and the fault determination unit 123) can be realized by a processor 10 included in the semiconductor chip executing a program stored in a memory 20. The measurement value memory unit 131, the reference condition memory unit 132, the reference value memory unit 133, the judgment condition memory unit 134, the relative position memory unit 135, and the fault state memory unit 136 can be realized as part of the memory area of ​​the memory 20 provided in the semiconductor chip.

[0020] The measurement value storage unit 131 stores history information of measurement values ​​acquired by the coil. More specifically, as shown in Fig. 5 and Fig. 6, the measurement values ​​(voltage values) can be stored with a time stamp attached.

[0021] The reference condition storage unit 132 stores reference conditions for defining a steady state in which a plurality of semiconductor chips 1 are placed on the measurement target 4 and before a large change occurs in the relative positions between the semiconductor chips. As an example of the reference condition, a state in which the fluctuation range of the measurement values ​​(voltage values) received via the coils from all semiconductor chips that can communicate remains within a predetermined range for a predetermined period of time or more (i.e., a stable state in which there is no change in the relative positions with each semiconductor chip continues) can be set as the reference condition.

[0022] The reference value storage unit 133 stores, as a reference value, an acquired voltage value when the reference condition stored in the reference condition storage unit 132 is satisfied. For example, as an example of the reference condition, when the fluctuation range of the measurement values ​​(voltage values) received via the coils from all semiconductor chips that can communicate remains within a predetermined range for a predetermined period of time or more, the measurement value of the signal from each semiconductor chip at the time when the condition is satisfied can be stored as the reference value. Alternatively, the average value of the measurement values ​​for a period going back a predetermined time from the time when the condition is satisfied can be stored as the reference value.

[0023] The judgment condition storage unit 134 stores conditions for detecting a change in relative position and conditions for detecting a semiconductor chip failure. For example, a condition for determining a change in relative position may be determined when a measured value differs from a reference value by a predetermined value or more (e.g., 0.5 V or more) for a predetermined time or more (e.g., 0.5 seconds or more). The condition for determining a change in relative position is not limited to this; a gradual change in voltage value over a predetermined time or more until the difference from the reference value reaches a predetermined value or more may also be used as a judgment condition. For example, a condition for detecting a semiconductor chip failure may be determined when the measured voltage value reaches a value near zero (e.g., 0.5 V to -0.5 V) within a predetermined time (e.g., within 0.5 seconds). The conditions stored in the judgment condition storage unit 134 may be written during initial configuration of the semiconductor chip, or may be rewritten externally via the communication unit 112 during operation.

[0024] The relative position storage unit 135 stores the identification information of the semiconductor chip whose relative position has changed, time information, and information on the estimated relative position when the relative position determination unit 122 determines that the relative value of the semiconductor chip 1 has changed. The relative position storage unit 135 may store the information on the relative position that is constantly estimated together with the time information and the identification information of the semiconductor chip, not just when the relative position determination unit 122 determines that the relative value of the semiconductor chip 1 has changed.

[0025] The failure state storage unit 136 stores the identification information of the semiconductor chip determined to be faulty, time information, and failure determination information when the failure determination unit 123 determines that the semiconductor chip 1 has failed. The failure state storage unit 136 may store information on the presence or absence of a failure, which is determined at all times, together with the time information and the identification information of the semiconductor chip, not just when the failure determination unit 123 determines that the semiconductor chip 1 has failed.

[0026] The sensing unit 111 acquires information for determining the relative position between its own semiconductor chip 1 and another semiconductor chip 1 that can communicate via the coil 70, as well as the fault state of the other semiconductor chip. When the relative position (including the relative distance and relative angle) between its own semiconductor chip 1 and the other semiconductor chip 1 changes, the strength of the inductive coupling of the coil 70 of the semiconductor chip changes, and the voltage value or amplitude of the voltage generated in the coil 70 changes, so the sensing unit 111 acquires information about this voltage.

[0027] The communication unit 112 can communicate with other semiconductor chips 1, the computer 2, or other devices external to the semiconductor chip 1. The communication unit 112 communicates with other semiconductor chips 1, the computer 2, or the like by using the coil 70 as an antenna, for example.

[0028] The reference value determination unit 121 determines a reference value that serves as a reference for determining at least one of the relative position and the fault state of the semiconductor chip. Specifically, when the state of the semiconductor chip satisfies a reference condition stored in the reference condition storage unit 132, the reference value is determined to be the measurement value of the signal received from each of the other semiconductor chips communicating via the coil at the time when the condition is met. Alternatively, the reference value may be determined to be the average value of the measurement values ​​over a predetermined time period going back from the time when the condition is met, or any value between the maximum and minimum values ​​of the measurement values ​​over a predetermined time period going back from the time when the condition is met. The reference value determined by the reference value determination unit 121 is stored in the reference value storage unit 133.

[0029] The relative position determination unit 122 determines changes in the relative position between its own semiconductor chip and the other semiconductor chip of the communication partner based on time-series changes in the measurement values. Specifically, it compares the voltage value acquired by the sensing unit with the reference value stored in the reference value storage unit 133. If the acquired voltage value and the reference value are substantially the same (the difference is within a predetermined range), it determines that the relative position has not changed from the steady state. On the other hand, if the difference between the acquired voltage value and the reference value exceeds the predetermined range and the difference gradually increases over time, it determines that the relative position has changed. Here, the relative position determination unit 122 may not only determine whether or not the relative position has changed, but also detect the relative position. The results determined by the relative position determination unit 122 are stored in the relative position storage unit 135.

[0030] Here, the relative position determined by the relative position determination unit 122 can include at least one of the relative distance between the semiconductor chips and the relative angle between the semiconductor chips. As the relative distance between the semiconductor chips increases, the voltage value acquired by the sensing unit gradually decreases, and as the relative distance decreases, the voltage value acquired by the sensing unit gradually increases, so it is possible to detect changes in the relative position based on changes in the voltage value over time.

[0031] 2, when the sensing unit uses a coil provided on the chip plane of the semiconductor chip, the voltage value acquired by the sensing unit gradually decreases as the angle of the semiconductor chip gradually changes to approach an angle along the same plane, and conversely, the voltage value acquired by the sensing unit gradually increases as the angle of the semiconductor chip gradually changes to approach an angle at which the chip faces face each other. Therefore, it is possible to detect changes in relative position based on changes in the voltage value over time.

[0032] The failure determination unit 123 determines a failure of the semiconductor chip based on the time-series changes in the measurement values ​​and the failure determination conditions for the semiconductor chip stored in the determination condition storage unit 134. The results of the determination by the failure determination unit 123 are stored in the failure state storage unit 136.

[0033] <Control Flow> Figure 4 is a control flow diagram showing the operation of the information processing device. The semiconductor chip 1 acquires the coil voltage value using the sensing unit 111 (S141). Next, the reference value determination unit 121 determines whether the state of the semiconductor chip, including the coil voltage value, satisfies the reference conditions stored in the reference condition storage unit 132 (S142). If the reference conditions are not satisfied, the process returns to S141 and the voltage value is acquired again. On the other hand, if the reference conditions are satisfied, the process proceeds to S143.

[0034] If the state of the semiconductor chip satisfies the reference condition, the reference value determination unit 121 determines a reference value that serves as a reference for determining at least one of the relative position and the fault state of the semiconductor chip, and stores the determined reference value in the reference value storage unit 133 (S143). Next, the sensing unit 111 acquires the coil voltage value (S144). Next, the relative position determination unit 122 determines a change in the relative position between the semiconductor chip itself and the other semiconductor chips (S145). If a change in the relative position is detected in S145, the process proceeds to S146. On the other hand, if a change in the relative position is not detected in S145, the process proceeds to S147.

[0035] If a change in relative position is detected in S145, the change in relative position detected by the relative position determination unit 122 is stored in the relative position storage unit 135 (S146). On the other hand, if a change in relative position is not detected in S145, the failure determination unit 123 determines a failure of the semiconductor chip based on the semiconductor chip failure determination conditions stored in the determination condition storage unit 134 (S147). If a failure state of the semiconductor chip is detected in S147, the process proceeds to S148.

[0036] If a fault state of the semiconductor chip is detected in S147, the fault state detected by the fault determination unit 123 is stored in the fault state storage unit 136 (S148). On the other hand, if a fault state of the semiconductor chip is not detected in S147, the process returns to S144, and the coil voltage value is acquired. Next, a specific example of the determination process of the relative position determination unit 122 and the fault determination unit 123 will be described. Figure 5 is a diagram showing an example of information stored in the measurement value storage unit 131.

[0037] The measurement value storage unit 131 stores, as a measurement value, information on the elapsed time since the start of measurement (measurement time), as well as the voltage value of a signal received from nearby semiconductor chips (chips A, B, and C) that can communicate wirelessly via inductive coupling or the like. The example shown in FIG. 5 shows an example in which a modulation-based data communication method capable of simultaneous communication with multiple nearby semiconductor chips (chips A, B, and C) is employed, and the coil voltage value is measured at intervals of 1 / 10 of a second. The semiconductor chip of the present invention records identification information and communication frequencies assigned to each of the multiple nearby semiconductor chips, as shown in FIG. 5, allowing simultaneous communication with the multiple semiconductor chips and measuring the voltage value of the communication signal from each semiconductor chip. The coil 70 of the semiconductor chip 1 can measure voltage values ​​by receiving wireless signals from multiple nearby semiconductor chips (chips A, B, and C) via inductive coupling or the like. FIG. 7 shows the voltage value acquired by the coil 70 in response to a transmission signal from nearby chip A and the received signal generated based on that voltage value. In this way, the coil acquires a voltage value induced in the coil when receiving a wireless signal from a nearby semiconductor chip.

[0038] 5, the voltage values ​​at an elapsed time of 10.1 seconds are 3.00V for chip A, 5.00V for chip B, and 2.00V for chip C, and each voltage value is approximately the same as the reference value stored in reference value storage unit 133, and the state of each semiconductor chip is steady. The voltage values ​​induced by the wireless signals from each chip in the steady state are different because the relative positions of chips A to C and their own semiconductor chips are different. Because the measured value of the wireless signal from chip A is larger than that of the other chips, it can be estimated that chip A is closer in relative distance than the other chips, or that the relative angle is closer to the angle at which the chip faces face each other.

[0039] The voltage value induced by the wireless signal from chip A is 3.00 V at the time when 10.1 seconds have elapsed, and gradually decreases to 1.28 V at about 11.1 seconds. Therefore, since this satisfies the determination condition for a relative position change stored in the determination condition storage unit 134 (when the state in which the measured value differs from the reference value by a predetermined value or more (e.g., 0.5 V or more) continues for a predetermined time or more (e.g., 0.5 seconds or more)), it can be determined that the relative position between chip A and its own semiconductor chip has changed.

[0040] On the other hand, the voltage value induced by the wireless signal from chip B is approximately 5.00 V between 10.1 seconds and 10.8 seconds, but drops sharply to 0.03 V (approximately 0 V) ​​at 10.9 seconds. Therefore, since this satisfies the failure determination condition stored in the determination condition storage unit 134 (the measured voltage value becomes close to zero (e.g., 0.5 V to -0.5 V) within a predetermined time (e.g., within 0.5 seconds)), it can be determined that chip A has failed.

[0041] Furthermore, the voltage value induced by the wireless signal from chip C remained at approximately 2.00 V from 10.1 seconds to 11.3 seconds, with no change exceeding 0.5 V, so it can be determined that no relative position change or failure has occurred.

[0042] FIG. 5 shows an example of measurement values ​​when a modulation-based data communication method capable of simultaneously communicating with multiple nearby semiconductor chips (chips A, B, and C) is employed. However, FIG. 6 shows an example of measurement values ​​when near-field communication is employed as the communication method. The example shown in FIG. 6 shows an example of measuring the coil voltage value when a non-modulation-based data communication method is employed in which near-field communication is used to communicate with multiple nearby semiconductor chips (chips A, B, and C) by switching communication partners at intervals of 1 / 20 of a second. The semiconductor chip of the present invention records identification information and communication time interval information assigned to each of the multiple nearby semiconductor chips, as shown in FIG. 6 , and can communicate with the multiple semiconductor chips and measure the voltage value of the communication signal. The coil 70 of the semiconductor chip 1 receives wireless signals from multiple nearby semiconductor chips (chips A, B, and C) at intervals of 1 / 20 of a second through near-field communication using inductive coupling, thereby measuring the voltage value of the wireless signal received by each nearby semiconductor chip.

[0043] 6, the voltage value of chip A at 10.00 seconds elapsed is 3.00V, that of chip B at 10.05 seconds is 5.00V, and that of chip C at 10.10 seconds is 2.00V. Each voltage value is approximately the same as the reference value stored in reference value storage unit 133, and each semiconductor chip is in a steady state. The voltage values ​​induced by the wireless signals from each chip in the steady state differ because the relative positions of chips A to C and their own semiconductor chips are different. Because the measured value of the wireless signal of chip A is larger than that of the other chips, it can be estimated that chip A is closer in relative distance than the other chips, or that the relative angle is closer to the angle at which the chip faces face each other.

[0044] The voltage value induced by the wireless signal from chip A is 3.00 V at the time when 10.00 seconds have elapsed, and gradually decreases to 1.25 V at approximately 11.20 seconds. Therefore, since this satisfies the determination condition for a relative position change stored in the determination condition storage unit 134 (when the state in which the measured value differs from the reference value by a predetermined value or more (e.g., 0.5 V or more) continues for a predetermined time or more (e.g., 0.5 seconds or more)), it can be determined that the relative position between chip A and its own semiconductor chip has changed.

[0045] On the other hand, the voltage value induced by the wireless signal from chip B is approximately 5.00 V between 10.05 seconds and 10.80 seconds, but suddenly drops to 0.03 V (approximately 0 V) ​​at 10.95 seconds. Therefore, since this satisfies the failure determination condition stored in the determination condition storage unit 134 (the measured voltage value becomes close to zero (e.g., 0.5 V to -0.5 V) within a predetermined time (e.g., within 0.5 seconds)), it can be determined that chip A has failed.

[0046] Furthermore, the voltage value induced by the wireless signal from chip C remains at approximately 2.00 V from 10.10 seconds to 11.30 seconds, with no change exceeding 0.5 V, so it can be determined that no relative position change or fault has occurred.

[0047] 8 and 9 are diagrams illustrating application examples of an information processing device. The information processing device of the present invention, which has the function of determining changes in the relative position of semiconductor chips, can be used to determine the movement of a movable member, such as a door shown in FIG. 8 . As shown in the upper diagram of FIG. 8 , one semiconductor chip 1a is mounted on a movable member, and the other semiconductor chip 1b is mounted on a fixed member. In the reference state, the movable member is stationary with the semiconductor chips 1a and 1b in close proximity to each other. Therefore, the measurement values ​​acquired by each semiconductor chip in this reference state are stored as reference values ​​in a reference value storage unit. Here, as shown in the lower diagram of FIG. 8 , when the movable member moves to a post-change state, the relative positions of the semiconductor chips 1a and 1b change, and the semiconductor chips 1a and 1b can detect the change in their relative positions based on the voltage values ​​of their coils. In other words, it is possible to detect a change in the door from a closed state to an open state.

[0048] Furthermore, the information processing device of the present invention can be used to determine the condition of a construction member such as a door made of concrete, wood, asphalt, or steel frame, as shown in FIG. 9 , by installing it inside or on the surface of the construction member. The upper diagram of FIG. 9 shows a reference state, and the measurement values ​​in this reference state are stored as reference values ​​in each semiconductor chip. As shown in the lower diagram of FIG. 9 , if a crack or other defect occurs in the construction member 4, the relative distance between the semiconductor chips increases, allowing the semiconductor chips 1a and 1b to detect a change in their relative positions based on the voltage values ​​of their coils. In other words, cracks or other defects occurring in the construction member 4 can be detected.

[0049] <Another Example of Sensing Processing Based on Received Wireless Signal> The processing described with reference to Figure 4 is an example of sensing processing performed by the semiconductor chip 1 based on a wireless signal received from another semiconductor chip 1. The sensing processing is processing in which the semiconductor chip 1 acquires an evaluation value representing the quality of the wireless signal and determines the state of at least one of the semiconductor chip 1 and the other semiconductor chip 1 based on the acquired evaluation value. That is, the sensing processing includes processing for acquiring the evaluation value (evaluation value acquisition processing) and processing for determining the state (state determination processing). In the example of Figure 4, the semiconductor chip 1 acquires a voltage value induced in the coil 70 by the wireless signal (an example of a measured value of the wireless signal) as an evaluation value representing the quality of the wireless signal.

[0050] Hereinafter, another example of sensing processing performed by a semiconductor chip 1 based on a wireless signal received from another semiconductor chip 1 will be described with reference to FIGS.

[0051] Here, the operating mode of the semiconductor chip 1 that enables sensing processing is called the sensing mode. In the sensing mode, the semiconductor chip 1 transmits a wireless signal for sensing processing to another adjacent semiconductor chip 1. For example, in the information processing device shown in FIG. 2, the semiconductor chip 1b transmits a wireless signal for sensing processing to the semiconductor chip 1a, and the semiconductor chip 1a performs sensing processing based on the received wireless signal. Furthermore, the semiconductor chip 1a transmits a wireless signal for sensing processing to the semiconductor chip 1b, and the semiconductor chip 1b performs sensing processing based on the received wireless signal.

[0052] The timing of transmitting the wireless signal for the sensing process is determined in advance, and the semiconductor chip 1 knows the timing at which a wireless signal is transmitted to itself from another semiconductor chip 1. For example, in the information processing device shown in Fig. 2, the semiconductor chip 1b transmits the wireless signal for the sensing process to the semiconductor chip 1a every 0.2 seconds, such as 0.2 seconds, 0.4 seconds, 0.6 seconds, and so on, from the start of the sensing mode. Furthermore, the semiconductor chip 1a transmits the wireless signal for the sensing process to the semiconductor chip 1b every 0.2 seconds, with a 0.1 second delay from the timing of the semiconductor chip 1a, such as 0.1 seconds, 0.3 seconds, 0.5 seconds, and so on, from the start of the sensing mode.

[0053] The wireless signal for the sensing process is transmitted as a wireless signal frame having a predetermined frame format.

[0054] Fig. 10 is a diagram showing an example of the format of a wireless signal frame for sensing processing. In the example of Fig. 10, the wireless signal frame for sensing processing has a frame format including a preamble signal, a frame control signal, a frame length signal, a destination ID signal, a source ID signal, an evaluation signal, and a frame check signal.

[0055] The preamble signal is a predetermined signal sequence (for example, a bit sequence of a specific pattern such as "101101") that indicates the presence of a wireless signal frame. By detecting the presence of the preamble signal, a semiconductor chip 1 can detect that a wireless signal frame has been transmitted from another semiconductor chip 1.

[0056] The frame control signal is a signal that indicates the type of a wireless signal frame. Types of wireless signal frames include "information frame," "control frame," "management frame," and "evaluation frame." In the case of a wireless signal frame for sensing processing, information indicating an evaluation frame as the type is set in the frame control signal. In other words, when the type of a wireless signal frame is an evaluation frame, the wireless signal frame is used as a wireless signal frame for sensing processing.

[0057] The frame length signal is a control signal that includes information about the length of a radio signal frame.

[0058] The destination ID signal indicates identification information (ID) of the semiconductor chip 1 that is the destination of the wireless signal frame. For example, the destination ID signal of the wireless signal frame that the semiconductor chip 1b transmits to the semiconductor chip 1a includes the address of the semiconductor chip 1a as the ID of the semiconductor chip 1a.

[0059] The sender ID signal indicates identification information (ID) of the semiconductor chip 1 that transmits the wireless signal frame. For example, the sender ID signal of the wireless signal frame transmitted from the semiconductor chip 1b to the semiconductor chip 1a includes the address of the semiconductor chip 1b as the ID of the semiconductor chip 1b.

[0060] The evaluation signal is a signal used by the semiconductor chip 1 to obtain an evaluation value of the wireless signal. The evaluation signal is a predetermined signal sequence (e.g., a bit sequence of a specific pattern such as "11100111"). For example, the semiconductor chip 1 can obtain an evaluation value of the wireless signal by comparing a known evaluation signal with an actually received evaluation signal (the evaluation value obtaining process will be described in detail later).

[0061] The frame check signal is a signal used to check whether or not there are any errors in the received wireless signal frame. For example, a cyclic redundancy check (CRC) code is used as the frame check signal. Upon receiving the frame check signal, the semiconductor chip 1 completes reception of the wireless signal frame.

[0062] 11 is a flowchart of a process (evaluation value acquisition process of the sensing process) in which a semiconductor chip 1 acquires an evaluation value of a wireless signal received from another semiconductor chip 1. As an example, the following describes a case in which, in the information processing device of FIG. 2, semiconductor chip 1b transmits a wireless signal for sensing processing to semiconductor chip 1a, and semiconductor chip 1a acquires an evaluation value of the received wireless signal.

[0063] In the sensing mode, the transceiver circuit 80a of the semiconductor chip 1a supplies the processor 10a with a pulse train corresponding to the voltage value of the coil 70a induced by the received wireless signal. Therefore, for example, the received signal (pulse train) shown in the lower part of FIG. 7, which corresponds to the voltage value shown in the middle part of FIG. 7, is supplied to the processor 10a. As described above, the sensing unit 111 can be implemented by the processor 10a executing a program stored in the memory 20a. Therefore, the sensing unit 111 can acquire the pulse train supplied from the transceiver circuit 80a and obtain a binary signal sequence (bit sequence) represented by 1 (High) or 0 (Low) by sampling the acquired pulse train at a predetermined sampling period to decode the wireless signal. Therefore, when the semiconductor chip 1b transmits a wireless signal to the semiconductor chip 1a in the sensing mode, the sensing unit 111 of the semiconductor chip 1a can acquire the signal sequence represented by the wireless signal.

[0064] In S1101, the sensing unit 111 of the semiconductor chip 1a determines whether a known preamble signal has been detected in the wireless signal (i.e., whether the adjacent semiconductor chip 1b is transmitting a wireless signal frame). Specifically, the sensing unit 111 compares the signal sequence obtained by decoding the pulse sequence supplied from the transmission / reception circuit 80a with the known preamble signal, and if the two match, determines that a known preamble signal has been detected in the wireless signal. The sensing unit 111 repeats the process of S1101 until a preamble signal is detected. When a preamble signal is detected, the process proceeds to S1102.

[0065] In S1102, the sensing unit 111 decodes the frame control signal following the preamble signal and determines whether the type of the wireless signal frame is an evaluation frame. If the type of the wireless signal frame is an evaluation frame, the process proceeds to S1104; if not, the process proceeds to S1003.

[0066] In S1103, the sensing unit 111 performs a process (a process separate from the sensing process) according to the type of the wireless signal frame as appropriate, and then the process returns to S1101.

[0067] In S1104, the sensing unit 111 decodes the frame length signal and confirms the length of the wireless signal frame.

[0068] In S1105, the sensing unit 111 decodes the destination ID signal and determines whether the wireless signal frame is addressed to itself (whether the destination ID is the address of the semiconductor chip 1a). If the wireless signal frame is addressed to itself, the process proceeds to S1106; if not, the process returns to S1101.

[0069] In S1106, the sensing unit 111 decodes the source ID signal and acquires the ID (address) of the semiconductor chip 1b that is the source of the wireless signal frame.

[0070] In S1107, the sensing unit 111 acquires an evaluation value of the wireless signal based on the evaluation signal. The evaluation value of the wireless signal may be, for example, a value based on a measurement value (e.g., a voltage value) of the evaluation signal or a value based on the number of bit errors in the evaluation signal. The evaluation value of the wireless signal is not limited to these examples, and any type of value may be used as long as it is an indicator of the quality of the wireless signal and can be used to determine the state of at least one of the semiconductor chip 1a (destination of the wireless signal) and the semiconductor chip 1b (sender of the wireless signal).

[0071] When a value based on the voltage value of the evaluation signal is used as the evaluation value of the wireless signal, the sensing unit 111 acquires, for example, the voltage value of the part of the wireless signal frame corresponding to the evaluation signal, measured by the transmission / reception circuit 80a, as the evaluation value.

[0072] When a value based on the number of bit errors in the evaluation signal is used as the evaluation value of the wireless signal, the sensing unit 111, for example, counts the number of bit errors in the evaluation signal by comparing the decoded evaluation signal with a known evaluation signal, and obtains the number of bit errors as the evaluation value. In this case, the fewer the number of bit errors, the better the quality of the wireless signal is considered to be. Alternatively, the sensing unit 111 may calculate a bit error rate based on the number of bits and the number of bit errors in the evaluation signal, and obtain the bit error rate as the evaluation value based on the number of bit errors in the evaluation signal.

[0073] As described with reference to FIG. 4 , when the voltage value of a wireless signal is used as the evaluation value, the sensing unit 111 can acquire the voltage value of any wireless signal, not just the evaluation signal, as the evaluation value. However, in this case, if the voltage value of the coil 70a fluctuates due to noise, for example, the sensing unit 111 may mistakenly recognize the noise as a wireless signal and acquire the voltage value of the noise as the evaluation value of the wireless signal. On the other hand, according to the processing of FIG. 11 , the sensing unit 111 can acquire the voltage value of a known evaluation signal located at a known position within the wireless signal frame after confirming that the wireless signal frame addressed to the semiconductor chip 1a from the semiconductor chip 1b has actually been received. This reduces the possibility of erroneously acquiring a voltage value that does not correspond to the actually transmitted wireless signal (e.g., a voltage value caused by noise) as the evaluation value.

[0074] In S1108, the sensing unit 111 records the evaluation value acquired in S1107 in the measurement value storage unit 131. That is, in the process shown in FIG. 11 , the measurement value storage unit 131 serves as an evaluation value storage unit that stores evaluation values. In doing so, the sensing unit 111 associates the reception time of the wireless signal frame from which the evaluation value was acquired and the source ID of the wireless signal frame with the evaluation value and records them. As a result, information indicating time-series changes in the evaluation value corresponding to a specific source is accumulated in the measurement value storage unit 131.

[0075] In S1109, the sensing unit 111 decodes the frame check signal and determines whether the wireless signal frame has been received without error. If the wireless signal frame has been received without error (if the frame check is OK), the process proceeds to S1110; if not, the process proceeds to S1111.

[0076] In S1110, the sensing unit 111 transmits an Acknowledgement (ACK) signal to the semiconductor chip 1b that transmitted the wireless signal frame. Then, the process returns to S1101.

[0077] In S1111, the sensing unit 111 transmits a Negative ACK (NACK) signal to the semiconductor chip 1b that transmitted the wireless signal frame, and then the process returns to S1101.

[0078] As another example of the evaluation value of the wireless signal, the result of the frame inspection in S1109 (a value indicating whether the frame inspection is successful or unsuccessful) may be used. In this case, after performing the frame inspection, the sensing unit 111 records the result in the measurement value storage unit 131 as the evaluation value.

[0079] Next, the state determination process of the sensing process will be described with reference to Fig. 12. The state determination process of Fig. 12 is executed in parallel with the evaluation value acquisition process of Fig. 11. Therefore, the evaluation value is repeatedly acquired in parallel with the state determination process. As an example, similar to the description of Fig. 11, a case will be described below in which the semiconductor chip 1b in the information processing device of Fig. 2 transmits a wireless signal for sensing process to the semiconductor chip 1a, and the semiconductor chip 1a acquires an evaluation value of the wireless signal received.

[0080] In S1201, the sensing unit 111 of the semiconductor chip 1a determines whether a new evaluation value has been acquired by the evaluation value acquisition process. The sensing unit 111 repeats the process of S1201 until a new evaluation value is acquired. When a new evaluation value is acquired, the process proceeds to S1202.

[0081] In S1202, the reference value determination unit 121 determines whether the state of the semiconductor chip 1a, including the evaluation value, satisfies the reference condition stored in the reference condition storage unit 132, similar to S142 in FIG. 4. The reference condition is not particularly limited and is determined appropriately depending on the type of evaluation value used. For example, if the voltage value of the coil 70a is used as the evaluation value, the same reference condition as used in S142 in FIG. 4 can be used in S1202. If the reference condition is satisfied, the process proceeds to S1203; if the reference condition is not satisfied, the process returns to S1201.

[0082] In S1203, similar to S143 in FIG. 4, the reference value determination unit 121 determines a reference value (reference information) that serves as a basis for determining the state of at least one of the semiconductor chips 1a and 1b (for example, at least one of the relative position between the semiconductor chips 1a and 1b and the fault state of the semiconductor chip 1b), and stores the determined value in the reference value memory unit 133.

[0083] In S1204, the sensing unit 111 determines whether a new evaluation value has been acquired by the evaluation value acquisition process. The sensing unit 111 repeats the process of S1204 until a new evaluation value is acquired. When a new evaluation value is acquired, the process proceeds to S1205.

[0084] In S1205, the relative position determination unit 122 determines a change in the relative position between the semiconductor chip 1a and the semiconductor chip 1b based on the determination conditions for the relative position change stored in the determination condition storage unit 134, similar to S145 of FIG. 4. The determination conditions for the relative position change are not particularly limited and are determined appropriately depending on the type of evaluation value used. For example, if the voltage value of the coil 70a is used as the evaluation value, the same determination conditions as those used in S145 of FIG. 4 can be used in S1205. If a change in the relative position is detected, the process proceeds to S1206, and if no change in the relative position is detected, the process proceeds to S1207.

[0085] 4, the relative position determination unit 122 stores the detected change in relative position in the relative position storage unit 135. The relative position determination unit 122 may also notify the computer 2 of the change in relative position using the communication unit 112. Then, the process returns to S1204.

[0086] In S1207, the failure determination unit 123 determines whether or not there is a failure in the semiconductor chip 1b based on the failure determination conditions stored in the determination condition storage unit 134, similar to S147 in FIG. 4 . The failure determination conditions are not particularly limited and are determined appropriately depending on the type of evaluation value used. For example, if the voltage value of the coil 70a is used as the evaluation value, the same failure determination conditions as those used in S147 in FIG. 4 can be used in S1207. If a failure in the semiconductor chip 1b is detected, the process proceeds to S1208; if no failure in the semiconductor chip 1b is detected, the process returns to S1204.

[0087] 4, the failure determination unit 123 stores the detected failure state in the failure state storage unit 136. The failure determination unit 123 may also notify the computer 2 of the failure state using the communication unit 112. Thereafter, the process returns to S1204.

[0088] As described above in relation to the processing of S145 in FIG. 4 , an example of a condition for determining a relative position change is that the measured value differs from the reference value by a predetermined value or more (e.g., 0.5 V or more) for a predetermined time or more (e.g., 0.5 seconds or more). This condition is based on the reference value and the time-series changes in the measured value (evaluation value). However, as described above, the condition for determining a relative position change is not particularly limited. For example, a condition that does not depend on the reference value may be adopted. Furthermore, a condition based on the most recently acquired measured value (evaluation value) rather than the time-series changes in the measured value (evaluation value) may be adopted. As an example, consider a case where the evaluation value is the number of bit errors in the evaluation signal, and the condition for determining a relative position change is that the number of bit errors is a predetermined number (e.g., 2 bits) or more. In this case, if the fault determination condition also does not depend on the reference value, the state determination processing of FIG. 12 can start from S1204. Then, in S1205, the relative position determination unit 122 determines whether the number of bit errors, which is the evaluation value, is equal to or greater than a predetermined number, and if the number of bit errors is equal to or greater than the predetermined number, detects a change in the relative position.

[0089] Another example of a condition for determining a change in relative position may be that the number of bit errors, which is the evaluation value, is equal to or greater than a predetermined number (e.g., 2 bits) and continues for a predetermined time or longer (e.g., 0.5 seconds or longer). This condition does not depend on a reference value but is based on the time-series change in the evaluation value. In this case, if the fault determination condition is also independent of the reference value, the state determination process of FIG. 12 can start from S1204. Then, in S1205, the relative position determination unit 122 determines whether the number of bit errors, which is the evaluation value, is equal to or greater than a predetermined number and continues for a predetermined time or longer. If the number of bit errors is equal to or greater than a predetermined number and continues for a predetermined time or longer, a change in relative position is detected.

[0090] In the above description, the wireless signal frame for sensing processing has the format shown in Fig. 10. However, the format of the wireless signal frame for sensing processing is not limited to the format shown in Fig. 10, and may be, for example, the format shown in Fig. 13 or 14.

[0091] In the case of Fig. 13, the sensing unit 111 determines whether or not a preamble signal has been detected by processing similar to that of S1101 in Fig. 11. If a preamble signal has been detected, the sensing unit 111 acquires an evaluation value of the wireless signal by processing similar to that of S1107 in Fig. 11. However, while the evaluation value was acquired based on the evaluation signal portion (an example of a "specific signal portion") when the wireless signal frame of Fig. 10 was used, the sensing unit 111 acquires the evaluation value based on the preamble signal portion (another example of a "specific signal portion") when the wireless signal frame of Fig. 13 is used.

[0092] If a bit error occurs in the preamble signal, the preamble signal will not be detected in S1101. Therefore, the sensing unit 111 may acquire the evaluation value by taking advantage of the fact that the timing at which the semiconductor chip 1b transmits a wireless signal frame for sensing processing in the sensing mode is known. In this case, the sensing unit 111 can acquire the evaluation value based on the wireless signal transmitted at the known transmission timing of the wireless signal frame, regardless of whether the preamble signal is detected. For example, by comparing the signal sequence represented by the wireless signal transmitted at the known transmission timing with the known preamble signal, the sensing unit 111 can acquire the evaluation value based on the number of bit errors, even if a bit error occurs in the preamble signal.

[0093] In the case of Fig. 14, similarly to the case of Fig. 13, the sensing unit 111 can acquire an evaluation value based on a preamble signal included in a wireless signal frame. Furthermore, since the wireless signal frame in Fig. 14 includes a frame check signal, the sensing unit 111 can determine whether the wireless signal frame has been received without error by processing similar to S1109 in Fig. 11. Therefore, the sensing unit 111 may acquire the result of the frame check (a value indicating the success or failure of the frame check) as the evaluation value.

[0094] Furthermore, while the semiconductor chip 1b is operating in sensing mode, information data to be transmitted to the semiconductor chip 1a may be generated. In this case, the semiconductor chip 1b may transmit the information frame shown in FIG. 15 to the semiconductor chip 1a at the timing when the wireless signal frame for sensing processing should be transmitted. The format of the information frame is similar to the format of the evaluation frame shown in FIG. 10, but the frame control signal includes information indicating the type of information frame. Furthermore, the information frame includes a data signal representing the information data instead of the evaluation signal. Similar to the wireless signal frame shown in FIG. 14, the information frame includes a preamble signal and a frame check signal. Therefore, when an information frame is transmitted from the semiconductor chip 1b to the semiconductor chip 1a, the sensing unit 111 can obtain an evaluation value based on the preamble signal or obtain the results of the frame check as an evaluation value, similar to the case of FIG. 14.

[0095] <Example of Sensing Processing Based on Transmitted Wireless Signal> As mentioned above, the processing described with reference to Fig. 4 is an example of sensing processing performed by a semiconductor chip 1 based on a wireless signal received from another semiconductor chip 1. That is, in the example of Fig. 4, a configuration is adopted in which the semiconductor chip 1 on the receiving side of the wireless signal performs the sensing processing. On the other hand, it is also possible to adopt a configuration in which the semiconductor chip 1 on the transmitting side of the wireless signal performs the sensing processing.

[0096] The following describes a configuration in which a semiconductor chip 1 transmitting a wireless signal performs sensing processing, with reference to Fig. 16. Fig. 16 is a flowchart of sensing processing performed by a semiconductor chip 1 based on a wireless signal transmitted to another semiconductor chip 1. As an example, the following describes a case in which, when semiconductor chip 1b transmits a wireless signal to semiconductor chip 1a in the information processing device of Fig. 2, sensing processing is performed based on the wireless signal transmitted by semiconductor chip 1b.

[0097] 16, the communication unit 112 of the semiconductor chip 1b repeatedly transmits a wireless signal to the semiconductor chip 1a using the transmission / reception circuit 80b. The transmission timing of the wireless signal is not particularly limited, but for example, the communication unit 112 may transmit the wireless signal at the same transmission timing as the transmission timing in the example of FIG.

[0098] In S1601 , the sensing unit 111 of the semiconductor chip 1 b acquires an evaluation value of the transmitted wireless signal and stores the acquired evaluation value in the measurement value storage unit 131 .

[0099] The evaluation value can be, for example, the value of the current flowing through the coil 70b (and the transceiver circuit 80b connected to the coil 70b) when a wireless signal is transmitted. When a voltage corresponding to the wireless signal to be transmitted is applied to the coil 70b, a voltage is induced in the coil 70a of the semiconductor chip 1a due to electromagnetic induction. As a result, a current flows through the coil 70a (and the transceiver circuit 80a connected to the coil 70a). Here, for example, if the coupling coefficient between the coils 70a and 70b decreases and the quality of the wireless communication deteriorates, the voltage induced in the coil 70a of the semiconductor chip 1a decreases, and the current flowing through the coil 70a also decreases. As a result, the current flowing through the coil 70b of the semiconductor chip 1b becomes larger than when the quality of the wireless communication is good. Therefore, the value of the current flowing through the coil 70b measured when a wireless signal is transmitted can be used as an evaluation value representing the quality of the transmitted wireless signal.

[0100] Another example of an evaluation value is the voltage value measured at the coil 70b (e.g., measured at the connection between the transceiver circuit 80b and the coil 70b). When a voltage corresponding to a wireless signal to be transmitted is applied to the coil 70b, a voltage is induced in the coil 70a of the semiconductor chip 1a due to electromagnetic induction. In this case, the reflected component of the voltage induced in the coil 70a causes a voltage drop at the connection between the transceiver circuit 80b and the coil 70b. Here, for example, if the coupling coefficient between the coils 70a and 70b decreases and the quality of wireless communication deteriorates, the voltage induced in the coil 70a of the semiconductor chip 1a decreases, thereby reducing the voltage drop at the connection between the transceiver circuit 80b and the coil 70b. In other words, if the quality of wireless communication deteriorates, the voltage value of the coil 70b (the voltage value measured at the coil 70b) will be larger than when the quality of wireless communication is good. Therefore, the voltage value at the connection between the transceiver circuit 80b and the coil 70b (the voltage value at the coil 70b) measured when a wireless signal is transmitted can be used as an evaluation value representing the quality of the transmitted wireless signal.

[0101] 10, 14, or 15 is transmitted as a wireless signal for sensing processing, the semiconductor chip 1a that receives the wireless signal frame transmits an ACK signal or a NACK signal to the semiconductor chip 1b depending on the result of a frame check based on the frame check signal. In this case, the sensing unit 111 of the semiconductor chip 1b may acquire, as an evaluation value, information indicating whether or not an ACK signal has been received. If an ACK signal is received, the quality of the wireless signal is considered to be better than if an ACK signal is not received (if a NACK signal is received, or if neither an ACK signal nor a NACK signal is received).

[0102] 4, the reference value determination unit 121 determines whether the state of the semiconductor chip 1b, including the evaluation value, satisfies the reference condition stored in the reference condition storage unit 132. The reference condition is not particularly limited and is determined appropriately depending on the type of evaluation value used. As an example of the reference condition, the reference condition can be determined when the fluctuation range of the evaluation value remains within a predetermined range for a predetermined period of time or more (i.e., when a stable state continues with no change in the relative position between the semiconductor chip 1a and the semiconductor chip 1b).

[0103] In S1603, the reference value determination unit 121 determines a reference value (reference information) that serves as a basis for determining the relative position between the semiconductor chip 1a and the semiconductor chip 1b, similar to S143 in Figure 4, and stores it in the reference value memory unit 133.

[0104] In S1604 , the sensing unit 111 acquires an evaluation value of the transmitted wireless signal and stores the acquired evaluation value in the measurement value storage unit 131 .

[0105] In S1605, the relative position determination unit 122 determines a change in the relative position between the semiconductor chip 1a and the semiconductor chip 1b based on the determination conditions for the relative position change stored in the determination condition storage unit 134, similar to S145 of FIG. 4. The determination conditions for the relative position change are not particularly limited and are determined appropriately depending on the type of evaluation value used. For example, if the evaluation value is the voltage value of the coil 70b, an example of the determination condition for the relative position change may be that the voltage value differs from the reference value by a predetermined value or more (e.g., 0.5 V or more) for a predetermined period of time or more (e.g., 0.5 seconds or more). If a change in the relative position is detected, processing proceeds to S1206. If no change in the relative position is detected, processing proceeds to S1207.

[0106] As in the case of Fig. 12, a condition that does not depend on the reference value may be adopted as a determination condition for a relative position change. Also, as in the case of Fig. 12, a determination condition based on the most recently acquired evaluation value may be adopted instead of a time-series change in the evaluation value.

[0107] In S1606, similarly to S146 in Fig. 4, the relative position determination unit 122 stores the detected change in relative position in the relative position storage unit 135. Thereafter, the processing returns to S1604.

[0108] <Example in which evaluation value acquisition processing and state determination processing are shared by separate semiconductor chips 1> The evaluation value acquisition processing and state determination processing included in the sensing processing may be shared and executed by separate semiconductor chips 1. For example, consider a case in which, in the information processing device of FIG. 2, semiconductor chip 1b transmits a wireless signal for sensing processing to semiconductor chip 1a. In this case, the sensing unit 111 of semiconductor chip 1a can acquire an evaluation value of the received wireless signal according to any evaluation value acquisition processing in the various sensing processing examples described above. Next, the sensing unit 111 of semiconductor chip 1a transmits the acquired evaluation value to semiconductor chip 1b. While the method of transmitting the evaluation value is not particularly limited, as an example, when transmitting an ACK signal or NACK signal to semiconductor chip 1b in accordance with the frame inspection result of the wireless signal frame, the sensing unit 111 of semiconductor chip 1a may include the evaluation value in the ACK signal or NACK signal.

[0109] The sensing unit 111 of the semiconductor chip 1b records the evaluation value received from the semiconductor chip 1a in the measurement value storage unit 131. Then, the sensing unit 111 of the semiconductor chip 1b can perform a state determination process based on the evaluation value received from the semiconductor chip 1a, in accordance with any state determination process in the various sensing process examples described above.

[0110] When the evaluation value acquisition process and the state determination process are shared by separate semiconductor chips 1 as described above, the semiconductor chip 1a that does not execute the state determination process does not need to be equipped with a configuration for the state determination process (the state determination unit 120 and the various storage units indicated by reference numerals 131 to 136). Therefore, the configuration of the semiconductor chip 1a can be simplified. Furthermore, when an information processing device includes one or more semiconductor chips other than the semiconductor chips 1a and 1b, adopting a configuration in which the evaluation value acquisition process and the state determination process are shared by separate semiconductor chips 1 makes it possible to aggregate evaluation values ​​of wireless signals between multiple semiconductor chips 1 and execute the state determination process. In this case, the semiconductor chip 1 that executes the state determination process may be a semiconductor chip 1 (such as the semiconductor chip 1c, not shown) that is not involved in the transmission and reception of wireless signals corresponding to the evaluation values ​​used.

[0111] Although the present embodiment has been described above, the above embodiment is intended to facilitate understanding of the present invention and is not intended to limit the present invention. The present invention may be modified or improved without departing from the spirit thereof, and equivalents thereof are also included in the present invention. For example, the semiconductor chip 1 may be configured to include an interposer or a substrate (not shown).

[0112] This application claims priority based on Japanese Patent Application No. 2022-142979, filed on September 8, 2022, the entire contents of which are incorporated herein by reference.

[0113] REFERENCE SIGNS LIST 1 semiconductor chip 2 computer 4 measurement object 10 processor 20 memory 30 communication unit 61, 62 power supply terminal 70 coil 111 sensing unit 112 communication unit 120 state determination unit 121 reference value determination unit 122 relative position determination unit 123 fault determination unit 131 measurement value storage unit 132 reference condition storage unit 133 reference value storage unit 134 determination condition storage unit 135 relative position storage unit 136 fault state storage unit

Claims

1. An information processing device comprising a first semiconductor chip and a second semiconductor chip that performs wireless communication with the first semiconductor chip, The first semiconductor chip is A processor that performs information processing, The system comprises a communication unit that receives wireless signals from the second semiconductor chip, The processor has a state determination unit that, based on the time-series change of the measured value of the wireless signal received from the second semiconductor chip via the communication unit, determines that a change in the relative position between the first semiconductor chip and the second semiconductor chip has occurred when the time-series change of the measured value shows a first change, and determines that a failure has occurred in the first or second semiconductor chip when the time-series change of the measured value shows a second change different from the first change. An information processing device characterized by the following:

2. An information processing apparatus according to claim 1, The state determination unit determines that, when the time-series change of the measured value indicates the first change, a change in the relative distance between the first semiconductor chip and the second semiconductor chip has occurred as the change in relative position. An information processing device characterized by the following:

3. An information processing apparatus according to claim 1, The state determination unit determines, when the time-series change of the measured value indicates the first change, that a change in the relative angle between the first semiconductor chip and the second semiconductor chip has occurred as the change in relative position. An information processing device characterized by the following:

4. An information processing apparatus according to claim 1, The first semiconductor chip further includes a reference information storage unit that, when the wireless signal received from the second semiconductor chip via the communication unit satisfies predetermined reference conditions, records the measured value or information relating to the measured value in that reference state as reference information. The state determination unit determines a change in the relative position between the first semiconductor chip and the second semiconductor chip based on the measured value of the wireless signal received via the communication unit and the reference information stored in the reference information storage unit. An information processing device characterized by the following:

5. An information processing apparatus according to claim 3, The first semiconductor chip further includes a reference information storage unit that, when the wireless signal received from the second semiconductor chip via the communication unit satisfies predetermined reference conditions, records the measured value or information relating to the measured value in that reference state as reference information. The state determination unit determines the change in the relative angle between the first semiconductor chip and the second semiconductor chip based on the measured value of the wireless signal received via the communication unit and the reference information stored in the reference information storage unit. An information processing device characterized by the following:

6. An information processing apparatus according to claim 4 or 5, The case of a standard state that satisfies the predetermined standard conditions is when the amplitude change range of the measured value of the wireless signal remains smaller than a predetermined range for a first predetermined time. An information processing device characterized by the following:

7. An information processing apparatus according to claim 4, The state determination unit, As the first change, when the amplitude of the measured value of the wireless signal received via the communication unit gradually decreases and becomes smaller than the reference information stored in the reference information storage unit, it is determined that the relative distance between the first semiconductor chip and the second semiconductor chip is greater than the relative distance in the reference state. As a second change, if the amplitude of the measured value of the wireless signal received via the communication unit becomes near zero in a time shorter than a second predetermined time, it is determined that a failure has occurred in the first or second semiconductor chip. An information processing device characterized by the following:

8. An information processing device according to claim 5, The first and second semiconductor chips are arranged horizontally on substantially the same plane. The state determination unit, As the first change, when the amplitude of the measured value of the wireless signal received via the communication unit gradually increases and becomes larger than the reference information stored in the reference information storage unit, it is determined that the relative angle between the first semiconductor chip and the second semiconductor chip has changed from a horizontal arrangement on the same plane. As a second change, if the amplitude of the measured value of the wireless signal received via the communication unit becomes near zero in a time shorter than a second predetermined time, it is determined that a failure has occurred in the first or second semiconductor chip. An information processing device characterized by the following:

9. An information processing device according to claim 5, The first and second semiconductor chips are arranged so that their surfaces face each other. The state determination unit, As the first change, when the amplitude of the measured value of the wireless signal received via the communication unit gradually decreases and becomes smaller than the reference information stored in the reference information storage unit, it is determined that the relative angle between the first semiconductor chip and the second semiconductor chip has changed from its original position. As a second change, if the amplitude of the measured value of the wireless signal received via the communication unit becomes near zero in a time shorter than a second predetermined time, it is determined that a failure has occurred in the first or second semiconductor chip. An information processing device characterized by the following:

10. The first semiconductor chip, Communication circuit and An acquisition means for acquiring an evaluation value representing the quality of a wireless signal received from a second semiconductor chip via the aforementioned communication circuit, A determination means that determines that a change in the relative position between the first semiconductor chip and the second semiconductor chip has occurred when the time-series change of the evaluation value shows a first change, and determines that a failure has occurred in the first or second semiconductor chip when the time-series change of the evaluation value shows a second change different from the first change. A first semiconductor chip characterized by comprising the following:

11. The first semiconductor chip according to claim 10, The communication circuit includes a first coil and performs wireless communication with the second semiconductor chip by utilizing the inductive coupling between the first coil and the second coil of the second semiconductor chip. A first semiconductor chip characterized by the following:

12. A first semiconductor chip according to claim 10 or 11, The evaluation value is based on the voltage value of the wireless signal. A first semiconductor chip characterized by the following:

13. The first semiconductor chip according to claim 12, The aforementioned wireless signal includes a specific signal portion for transmitting a predetermined sequence of signals, The evaluation value is based on the voltage value of the specific signal portion of the wireless signal. A first semiconductor chip characterized by the following:

14. A first semiconductor chip according to claim 10 or 11, The evaluation value is based on the number of bit errors in the wireless signal. A first semiconductor chip characterized by the following:

15. The first semiconductor chip according to claim 14, The aforementioned wireless signal includes a specific signal portion for transmitting a predetermined sequence of signals, The evaluation value is based on the number of bit errors in the specific signal portion of the wireless signal. A first semiconductor chip characterized by the following:

16. An information processing device comprising a first semiconductor chip and a second semiconductor chip, The first semiconductor chip is The first communication circuit and An acquisition means for acquiring an evaluation value representing the quality of a wireless signal received from the second semiconductor chip via the first communication circuit, A transmission means for transmitting the evaluation value to the second semiconductor chip via the first communication circuit, Includes, The second semiconductor chip is The second communication circuit, A determination means that determines that a change in the relative position between the first semiconductor chip and the second semiconductor chip has occurred when the time-series change of the evaluation value received from the first semiconductor chip via the second communication circuit shows a first change, and determines that a failure has occurred in the first or second semiconductor chip when the time-series change of the evaluation value shows a second change different from the first change, An information processing device characterized by comprising:

17. A control method for a first semiconductor chip equipped with a communication circuit, An acquisition step of acquiring an evaluation value representing the quality of a wireless signal received from a second semiconductor chip via the aforementioned communication circuit, A determination step in which, if the time-series change of the evaluation value shows a first change, it is determined that a change in the relative position between the first semiconductor chip and the second semiconductor chip has occurred, and if the time-series change of the evaluation value shows a second change different from the first change, it is determined that a failure has occurred in the first or second semiconductor chip. A control method characterized by comprising: