Processing system and processing method

Abstract

Provided is a processing system comprising a processing device which includes an emission optical system and a material supply unit and shapes a shaped object, a measurement device which acquires information relating to the size of a melt pool formed by emission of a processing beam, a recording device which records the information relating to the size of the melt pool in association with information relating to the position of the melt pool, and a control device. The control device controls the processing device such that the size of the melt pool formed by the emission of the processing beam matches the size of the melt pool read from the recording device.

Description

Processing system, data structure and processing method

[0001] The present invention relates to the technical field of a processing system, a data structure, and a processing method for processing an object.

[0002] An example of a processing system for processing an object is described in Patent Document 1. One of the technical challenges that such a processing system faces is to process the object appropriately.

[0003] U.S. Patent No. 7,043,330

[0004] According to a first aspect, a processing system is provided which includes a processing device for forming a shaped object, the processing device comprising: an irradiation optical system capable of irradiating a processing beam; a material supply unit capable of supplying a forming material to a location where a molten pool is formed by irradiating the processing beam; a measuring device for acquiring information regarding the size of the molten pool formed by irradiating the processing beam; a recording device for recording the information regarding the size of the molten pool acquired by the measuring device in association with information regarding the position of the molten pool; and a control device, wherein the control device reads the information regarding the size of the molten pool from the recording device and controls the processing device so that the size of the molten pool formed by irradiating the processing beam matches the size of the molten pool read from the recording device.

[0005] According to a second aspect, a processing system is provided which includes a processing device for forming a shaped object, an irradiation optical system capable of irradiating a processing beam, a material supply unit capable of supplying a forming material to a location where a molten pool is formed by irradiating the processing beam, a moving device capable of moving the irradiation position of the processing beam along a target trajectory based on a processing path, and a deflection optical system capable of deflecting the processing beam in a direction intersecting the target trajectory, a measuring device for acquiring information about the size of the molten pool formed by irradiating the processing beam, and a control device, and the control device controls the processing device based on the measurement results by the measuring device and changes the area of ​​the molten pool to be measured by the measuring device based on deflection conditions, which are conditions for deflecting the processing beam.

[0006] According to a third aspect, a processing system is provided which includes a processing device for forming a shaped object, the processing device comprising an irradiation optical system capable of irradiating a processing beam, a material supply unit capable of supplying a forming material to a location where a molten pool is formed by irradiating the processing beam, a measuring device for acquiring information about the molten pool formed by irradiating the processing beam, a recording device for recording the information about the molten pool acquired by the measuring device in association with information about the position of the molten pool, and a control device, wherein the control device reads the information about the molten pool from the recording device and controls the processing device so that the molten pool formed by irradiating the processing beam reproduces the molten pool read from the recording device.

[0007] According to a fourth aspect, a processing system is provided which includes a processing device that processes an object and has an irradiation optical system capable of irradiating a processing beam, a measuring device that acquires information about a molten pool formed by irradiating the processing beam, a recording device that records the information about the molten pool acquired by the measuring device in association with information about the position of the molten pool, and a control device, wherein the control device controls the processing device based on the information about the molten pool read from the recording device.

[0008] According to a fifth aspect, there is provided a processing system comprising: a processing device for processing an object, which includes an irradiation optical system capable of irradiating a processing beam; a first moving device capable of moving the irradiation position of the processing beam along a target trajectory based on a processing path; a second moving device capable of moving the processing beam in a direction intersecting the target trajectory; a measuring device for acquiring information about a molten pool formed by irradiating the processing beam; and a control device, wherein the control device determines an area to be measured by the measuring device based on movement conditions which are conditions for moving the processing beam by the second moving device.

[0009] According to a sixth aspect, a data structure is provided for use in a processing device for forming a shaped object, the data structure comprising an irradiation optical system capable of irradiating a processing beam and a material supply unit capable of supplying a forming material to a location where the processing beam is irradiated to form a molten pool, the data structure correlating information regarding the size of the molten pool formed by the processing device with the position where the molten pool is formed.

[0010] According to the seventh aspect, a data structure is provided for use in a processing device capable of forming a shaped object, the data structure comprising an irradiation optical system capable of irradiating a processing beam, a material supply unit capable of supplying a forming material to a location where the processing beam is irradiated to form a molten pool, a moving device capable of moving the irradiation position of the processing beam along a target trajectory based on a processing path, and a deflection optical system capable of deflecting the processing beam in a direction intersecting the target trajectory, the data structure corresponding to deflection conditions that are conditions for deflecting the processing beam and information regarding the measurement target area measured by the measuring device.

[0011] According to an eighth aspect, a processing method is provided that includes irradiating an object with a processing beam, supplying a manufacturing material to a location where the processing beam is irradiated to form a molten pool, thereby manufacturing a shaped object, acquiring information regarding the size of the molten pool formed by irradiating the processing beam, recording the acquired information regarding the size of the molten pool in association with information regarding the position of the molten pool, reading out the information regarding the size of the molten pool, and controlling the manufacturing so that the size of the molten pool formed by irradiating the processing beam matches the size of the molten pool read out from the recording device.

[0012] According to a ninth aspect, a processing method is provided that includes irradiating an object with a processing beam, moving the irradiation position of the processing beam along a target trajectory based on a processing path, deflecting the processing beam in a direction intersecting the target trajectory, supplying a manufacturing material to a location where the processing beam is irradiated to form a molten pool to form a structure, acquiring information regarding the size of the molten pool formed by irradiating the processing beam, controlling the manufacturing based on the acquired information regarding the size of the molten pool, and changing the measurement target area of ​​the molten pool to acquire information regarding the size of the molten pool based on deflection conditions, which are conditions for deflecting the processing beam.

[0013] According to a tenth aspect, there is provided a processing method including: irradiating an object with a processing beam; supplying a manufacturing material to a location where the processing beam is irradiated to form a molten pool to form a shaped object; acquiring information about the molten pool formed by irradiating the processing beam; recording the acquired information about the molten pool in association with information about the position of the molten pool; reading out the information about the molten pool; and controlling the manufacturing so that the molten pool formed by irradiating the processing beam reproduces the read-out molten pool.

[0014] The functions and other advantages of the present invention will become apparent from the following detailed description of the preferred embodiments.

[0015] FIG. 1 is a cross-sectional view showing the structure of a processing system according to this embodiment. FIG. 2 is a system configuration diagram showing the system configuration of the processing system according to this embodiment. FIG. 3 is a perspective view showing the structure of an irradiation optical system. FIGS. 4A to 4E are cross-sectional views showing the state when a certain area on a workpiece is irradiated with processing light and a modeling material is supplied. FIGS. 5A to 5C are cross-sectional views showing the process of forming a three-dimensional structure. FIG. 6A is a plan view showing the movement trajectory of a target irradiation area within a modeling unit area. FIG. 6B is a plan view showing an example of combining the movement of the target irradiation area and the movement of the machining head / stage device. FIG. 6C is a schematic diagram showing the area where a model is formed when the operation shown in FIG. 6B is performed. FIG. 7 shows an example of a workpiece image. FIG. 8A is a plan view showing the movement trajectory of a target irradiation area when the width of the modeling unit area is changed. FIG. 8B is a plan view showing an example of moving the machining head / stage device while changing the size of the modeling unit area. FIG. 8C is a schematic diagram showing an area where a model is formed when the operation shown in FIG. 8B is performed. FIG. 9A is a plan view showing a movement trajectory of the target irradiation area when the movement speed of the target irradiation area is sufficiently fast with respect to the movement speed of the machining head / stage device. FIG. 9B is a plan view showing a movement trajectory of the target irradiation area when the movement speed of the target irradiation area is moderately fast with respect to the movement speed of the machining head / stage device. FIG. 9C is a plan view showing a movement trajectory of the target irradiation area when the movement speed of the target irradiation area is slow with respect to the movement speed of the machining head / stage device. FIG. 10 is a schematic diagram showing an irradiation trajectory of the laser light on the model. FIG. 11 is a plan view showing a movement trajectory of a modeling unit area on the modeling surface. FIG. 12 is a plan view showing an example of the movement trajectory of the target irradiation area within the modeling unit area. FIG. 13 is a plan view showing another example of the movement trajectory of the target irradiation area within the modeling unit area. Fig. 14 is a plan view showing another example of a movement trajectory of a target irradiation area within a unit area for fabrication. Fig. 15 is an explanatory diagram showing a method for detecting a molten pool from a workpiece image. Fig. 16 is an explanatory diagram showing an example of a method for detecting a molten pool from a workpiece image.(a) to (f) of Figure 17 show image processing methods when multiple integration thresholds are set. (a) and (b) of Figure 18 show workpiece images in the conventional technology, and (c) and (d) of Figure 18 show workpiece images in this embodiment. (b) and (c) of Figure 18 show workpiece images in this embodiment. (c) and (d) of Figure 19 show enlarged views of the M and N layers in one object. (d) and (e) of Figure 20 show enlarged views of the M and N layers in the first object and the M#2 and N#2 layers in the second object. (e) and (f) of Figure 21 show workpiece images when the center and left-right width of the molten pool are controlled to be constant. (f) and (f) of Figure 22 show a control method for maintaining the center and left-right width of the molten pool constant. (f) and (f) of Figure 23 show a control method for equalizing the number of pixels on the left and right of the molten pool.

[0016] Hereinafter, with reference to the drawings, embodiments of a processing method, a processing system, a measurement method, and a measurement system will be described. Hereinafter, embodiments of the processing method, the processing system, the measurement method, and the measurement system will be described using a processing system SYS that performs additive processing on a workpiece W, which is an example of an object, to form a model BO on the workpiece W. In particular, below, embodiments of the processing method, the processing system, the measurement method, and the measurement system will be described using a processing system SYS that performs additive processing based on laser metal deposition (LMD). Additional processing based on laser metal deposition is additive processing that forms a model BO that is integrated with the workpiece W or that can be separated from the workpiece W by melting a modeling material M supplied to the workpiece W with processing light EL (i.e., an energy beam in the form of light).

[0017] Laser build-up welding (LMD) may also be referred to as direct metal deposition, directed energy deposition, laser cladding, laser engineered net shaping, direct light fabrication, laser consolidation, shape deposition manufacturing, wire-feed laser deposition, gas-through-wire, laser powder fusion, laser metal forming, selective laser powder remelting, laser direct casting, laser powder deposition, laser additive manufacturing, or laser rapid forming.

[0018] In the following description, the positional relationships of the various components constituting the machining system SYS will be described using an XYZ Cartesian coordinate system defined by mutually orthogonal X, Y, and Z axes. For ease of explanation, the X-axis and Y-axis directions are each assumed to be horizontal (i.e., a predetermined direction within a horizontal plane), and the Z-axis direction is assumed to be vertical (i.e., a direction perpendicular to the horizontal plane, essentially an up-down direction). Furthermore, the rotation directions around the X-axis, Y-axis, and Z-axis (in other words, tilt directions) are referred to as the θX direction, θY direction, and θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. Furthermore, the XY plane may be assumed to be horizontal.

[0019] (1) Structure of the Machining System SYS First, the structure of the machining system SYS of this embodiment will be described with reference to Figures 1 and 2. Figure 1 is a cross-sectional view showing an example of the structure of the machining system SYS of this embodiment. Figure 2 is a system configuration diagram showing an example of the system configuration of the machining system SYS of this embodiment.

[0020] The processing system SYS is capable of molding (in other words, forming) a shaped object BO. Note that the shaped object BO in this embodiment may refer to any object molded by the processing system SYS. The shaped object BO is typically a three-dimensional object having a size in all three-dimensional directions (i.e., a solid object, in other words, an object having a size in the X-axis direction, the Y-axis direction, and the Z-axis direction). An example of the shaped object BO is a three-dimensional structure ST (see FIG. 4C) having a desired three-dimensional shape. An example of the shaped object BO is a part of the three-dimensional structure ST. An example of the shaped object BO is any object molded in the process of molding the three-dimensional structure ST. When the three-dimensional structure ST is composed of multiple structural layers SL (see FIGS. 4A to 4C) as described below, an example of the shaped object BO is the structural layer SL. An example of the shaped object BO is a part of the structural layer SL. An example of the shaped object BO is any object formed in the process of forming the structure layer SL, but the shaped object BO is not limited to the objects exemplified here.

[0021] The processing system SYS is capable of forming the object BO on a workpiece W, which serves as a base (e.g., a base material) for forming the object BO. In other words, the processing system SYS performs forming on the workpiece W. The processing system SYS is capable of forming the object BO by performing additional processing on the workpiece W. If the workpiece W is the stage 31 described below, the processing system SYS is capable of forming the object BO on the stage 31. If the workpiece W is a mounted object, which is an object placed on the stage 31, the processing system SYS is capable of forming the object BO on the mounted object. In this case, the processing system SYS may form the object BO integrated with the mounted object. The operation of forming the object BO integrated with the mounted object is equivalent to the operation of adding a new structure to the mounted object. The existing structure may be, for example, an object with a missing part (e.g., an item requiring repair). Alternatively, the processing system SYS may form a molded object BO that can be separated from the placed object. The placed object placed on the stage 31 may be another molded object BO (i.e., an existing structure (primary object, first object)) formed by the processing system SYS. Note that FIG. 1 shows an example in which the workpiece W is an existing structure held by the stage 31. In the following, the explanation will also be given using an example in which the workpiece W is an existing structure held by the stage 31.

[0022] As described above, the processing system SYS can form the object BO by laser build-up welding. In other words, the processing system SYS can also be said to be a 3D printer that forms an object using additive manufacturing technology. Note that additive manufacturing technology is also called rapid prototyping, rapid manufacturing, or additive manufacturing.

[0023] The processing system SYS processes a modeling material M using processing light EL, which is a processing beam, to form a model BO. The modeling material M is a material that can be melted by irradiation with processing light EL of a predetermined intensity or higher. For example, at least one of a metallic material and a resinous material can be used as the modeling material M. However, materials other than metallic materials and resinous materials may also be used as the modeling material M. In one example, the modeling material M is a powdered material. That is, the modeling material M is a powder. The powder may contain a granular material in addition to the powdered material. The modeling material M may contain, for example, powder with a particle size within a range of 90 micrometers ±40 micrometers. The average particle size of the powder constituting the modeling material M may be, for example, 75 micrometers or less, within a range of 10 micrometers to 25 micrometers, or another size. For example, the average particle size of the powder can be approximately 200, 190, 180, 170, 160, 150, 140, 130, 120, 110, 100, 95, 90, 85, 80, 75, 70, 65, 60, 55, 50, 45, 40, 35, 30, 25, 20, 15, 10 micrometers, or less. In other examples, the building material M can be a material other than powder. For example, at least one of a wire-shaped building material and a gas-shaped building material may be used as the building material M. The above numerical values ​​are merely examples, and the present invention is not limited thereto.

[0024] The type of workpiece W may be the same as the type of modeling material M. For example, if a metallic material is used as the modeling material M, the workpiece W may be the same type (or a different type) of metal as the modeling material M. For example, if a resinous material is used as the modeling material M, the workpiece W may be the same type (or a different type) of resin as the modeling material M.

[0025] 1 and 2 , in order to form the object BO, the processing system SYS includes a material supply device 1, a processing device 2, a stage device 3, a light source 4, a gas supply device 5, a housing 6, a measuring device 71, a recording device 72, and a control device 8. At least a portion of each of the processing device 2, the stage device 3, and the measuring device 71 is housed in a chamber space 63IN inside the housing 6. In this case, the processing system SYS may perform additional processing in the chamber space 63IN. Note that at least one of the processing device 2 and the stage device 3 does not have to be housed in the chamber space 63IN inside the housing 6.

[0026] The material supply device 1 supplies the modeling material M to the processing device 2. Specifically, the material supply device 1 and the processing device 2 (particularly the material nozzle 212 described later) are connected via a supply pipe 11. The material supply device 1 supplies the modeling material M to the processing device 2 via the supply pipe 11. At this time, the material supply device 1 may supply a desired amount of modeling material M according to the required amount so that the amount of modeling material M required per unit time for the processing device 2 to perform additional processing is supplied to the processing device 2. The material supply device 1 is an example of a "material supply unit."

[0027] The processing device 2 forms a model BO using the modeling material M supplied from the material supply device 1. In order to form the model BO using the modeling material M, the processing device 2 includes a processing head 21 and a head drive system 22. The processing head 21 further includes an irradiation optical system 211 and a material nozzle (i.e., a supply system or supply device that supplies the modeling material M) 212. The processing head 21 and the head drive system 22 are housed in the chamber space 63IN. However, at least a portion of the processing head 21 and / or the head drive system 22 may be disposed in an external space 64OUT, which is a space outside the housing 6. The external space 64OUT may be a space accessible to an operator of the processing system SYS.

[0028] The irradiation optical system 211 is an optical system (e.g., a focusing optical system) for emitting the processing light EL from the emission unit 213. Specifically, the irradiation optical system 211 is optically connected to a light source 4 that emits the processing light EL via a light transmission member 41 such as an optical fiber or a light pipe. In the example shown in Fig. 2, the modeling system SYS includes one light source 4, and the irradiation optical system 211 is optically connected to the light source 4 via the light transmission member 41. The irradiation optical system 211 emits the processing light EL propagated from the light source 4 via the light transmission member 41. Note that the modeling system SYS may be configured to include, for example, multiple irradiation optical systems 211.

[0029] The irradiation optical system 211 irradiates the processing light EL downward (i.e., toward the -Z side). A stage 31 is disposed below the irradiation optical system 211. When a workpiece W is placed on the stage 31, the irradiation optical system 211 irradiates the emitted processing light EL onto the workpiece W (particularly the surface of the workpiece W). Specifically, the irradiation optical system 211 can irradiate the processing light EL onto a target irradiation area (target irradiation position) EA set on or near the workpiece W as an area to be irradiated (typically, focused) with the processing light EL. Furthermore, under the control of the control device 8, the state of the irradiation optical system 211 can be switched between a state in which the processing light EL is irradiated onto the target irradiation area EA and a state in which the processing light EL is not irradiated onto the target irradiation area EA. Note that the direction of the processing light EL emitted from the irradiation optical system 211 is not limited to directly downward (i.e., aligned with the -Z axis direction) and may be, for example, a direction tilted at a predetermined angle with respect to the Z axis.

[0030] 3 shows an example of the structure of the irradiation optical system 211. As shown in FIG. 3, the irradiation optical system 211 may include a state control optical system 2111, a galvanometer mirror 2112, and an fθ lens 2113.

[0031] The state control optical system 2111 is an optical system capable of controlling the state of the processing light EL emitted by the irradiation optical system 211. For example, the state control optical system 2111 may include a focus control optical system capable of controlling (e.g., changing) the focusing position (i.e., convergence position) of the processing light EL. The state control optical system 2111 may control the focusing position of the processing light EL, for example, by changing the distance (positional relationship) between the state control optical system 2111 and the fθ lens 2113 in the traveling direction of the processing light EL, changing the distance (positional relationship) between the state control optical system 2111 and the material nozzle 212, or changing the distance (positional relationship) between the state control optical system 2111 and the powder supply position by the material nozzle 212. The focus control optical system may include, for example, multiple lenses arranged along the traveling direction of the processing light EL. In this case, the focusing position of the processing light EL may be changed by moving at least one of the multiple lenses along its optical axis direction. The state control optical system 2111 may also include an intensity control optical system capable of controlling (e.g., changing) the intensity of the processing light EL. The intensity control optical system may include a shutter capable of blocking at least a part of the processing light EL, a filter capable of reducing light, etc. However, the irradiation optical system does not necessarily have to include the state control optical system 2111.

[0032] The processing light EL that passes through the state control optical system 2111 is incident on the galvanometer mirror 2112. The galvanometer mirror 2112 deflects the processing light EL (i.e., changes the deflection angle (emission angle) of the processing light EL) to change the emission direction of the processing light EL from the galvanometer mirror 2112. For this reason, the galvanometer mirror 2112 may also be referred to as a deflection member or a deflection optical system. When the emission direction of the processing light EL from the galvanometer mirror 2112 is changed, the position from which the processing light EL is emitted from the processing head 21 is changed. When the position from which the processing light EL is emitted from the processing head 21 is changed, the target irradiation area EA onto which the processing light EL is irradiated moves on the surface of the workpiece W (more specifically, the printing surface MS, described below, on which additional processing is performed). In other words, the irradiation position onto which the processing light EL is irradiated moves on the printing surface MS. In other words, the processing light EL moves on the printing surface MS.

[0033] The galvanometer mirror 2112 includes, for example, an X-scanning mirror 2112X and a Y-scanning mirror 2112Y. The X-scanning mirror 2112X and the Y-scanning mirror 2112Y may each be referred to as the galvanometer mirror 2112. The X-scanning mirror 2112X and the Y-scanning mirror 2112Y are tilt-angle variable mirrors whose angles relative to the optical path of the processing light EL incident on each mirror can be changed. The X-scanning mirror 2112X reflects the processing light EL toward the Y-scanning mirror 2112Y. The X-scanning mirror 2112X can swing or rotate around a rotation axis along the Y-axis. The swing or rotation of the X-scanning mirror 2112X causes the processing light EL to scan the printing surface MS along the X-axis direction. For example, when only the X-scanning mirror 2112X is operated, the swing or rotation of the X-scanning mirror 2112X moves the target irradiation area EA on the printing surface MS along the X-axis direction. The Y-scanning mirror 2112Y reflects the processing light EL toward the fθ lens 2113. The Y-scanning mirror 2112Y can swing or rotate around a rotation axis along the X-axis. The swing or rotation of the Y-scanning mirror 2112Y causes the processing light EL to scan the printing surface MS along the Y-axis direction. For example, when only the Y-scanning mirror 2112Y is operated, the swing or rotation of the Y-scanning mirror 2112Y moves the target irradiation area EA along the Y-axis direction on the printing surface MS. Furthermore, by simultaneously operating the X-scanning mirror 2112X and the Y-scanning mirror 2112Y, it is possible to move the target irradiation area EA two-dimensionally on the printing surface MS.

[0034] The galvanometer mirror 2112 allows the processing light EL to scan within the forming shot area ESA. The irradiation optical system 211 is able to irradiate the processing light EL onto the forming shot area ESA, which is determined based on the irradiation optical system 211. The target irradiation area EA is movable within the forming shot area ESA, which is determined based on the irradiation optical system 211. Note that, for example, when multiple irradiation optical systems 211 are provided, the forming shot areas ESA of the respective irradiation optical systems 211 may coincide with each other, or the forming shot areas ESA of the respective irradiation optical systems 211 may be partially different from each other. When the multiple forming shot areas ESA coincide with each other or partially overlap each other, the direction of the processing light EL emitted from each of the multiple irradiation optical systems 211 may be inclined by a predetermined angle with respect to the Z axis, and the optical axes of the respective irradiation optical systems 211 on the forming surface MS side (typically, the optical axes of the focusing optical systems (fθ lenses 2113) of the irradiation optical systems 211) may intersect with each other on or near the forming surface MS.

[0035] The target irradiation area EA can be moved along the X-axis direction within the shaping shot area ESA by the X-scanning mirror 2112X. Furthermore, the target irradiation area EA can be moved along the Y-axis direction within the shaping shot area ESA by the Y-scanning mirror 2112Y. Furthermore, as described above, the focusing position of the processing light EL can be changed along the Z-axis direction by the state control optical system 2111. Therefore, the irradiation optical system 211 can move the irradiation position of the processing light EL within the shaping shot area ESA (specifically, the position of the target irradiation area EA in each of the X-axis and Y-axis directions, and the focusing position in the Z-axis direction) along each of the X-axis, Y-axis, and Z-axis directions. More specifically, the target irradiation area EA can be moved two-dimensionally on the XY plane by the X-scanning mirror 2112X and the Y-scanning mirror 2112Y, and the focusing position can be moved in the Z-axis direction. That is, the irradiation optical system 211 can arbitrarily set the irradiation position of the processing light EL in three-dimensional space on the shaping shot area ESA side of the irradiation optical system 211. Furthermore, the irradiation optical system 211 can move the processing light EL along each of the X-axis direction, Y-axis direction, and Z-axis direction within the shaping shot area ESA.

[0036] The manufacturing shot area ESA indicates the maximum area (in other words, the maximum range) in which the machining head 21 can perform additional machining using the processing light EL when the positional relationship between the irradiation optical system 211 and the manufacturing surface MS is fixed. Typically, the manufacturing shot area ESA may coincide with the maximum scanning range of the processing light EL deflected by the galvanometer mirror 2112 when the positional relationship between the irradiation optical system 211 and the manufacturing surface MS is fixed. In other words, the manufacturing shot area ESA may be an area determined based on the effective movable range of the galvanometer mirror 2112. Furthermore, by irradiating the manufacturing surface MS with the processing light EL via the fθ lens 2113, the manufacturing shot area ESA may be an area determined based on the optical effective range of the fθ lens 2113.

[0037] The printing shot area ESA may be defined in a plane perpendicular to the optical axis AX of the irradiation optical system 211. The optical axis AX of the irradiation optical system 211 is an axis along the traveling direction of the processing light EL that is irradiated onto the printing surface MS. The optical axis AX of the irradiation optical system 211 may be the optical axis of the fθ lens 2113. Alternatively, if the traveling direction of the processing light EL is changed by a deflecting member such as a mirror after the processing light EL is emitted from the fθ lens 2113, the optical axis AX of the irradiation optical system 211 may be different from the optical axis of the fθ lens 2113. In the following explanation, an example will be described in which the optical axis AX is an axis along the Z axis.

[0038] The processing head 21 may perform additional processing within a shaping unit area BSA set within the shaping shot area ESA. As with the shaping shot area ESA, if there are multiple irradiation optical systems 211, the shaping unit areas BSA in each irradiation optical system 211 may be the same, or the shaping unit areas BSA may be partially different from each other.

[0039] The shaping unit area BSA indicates the area (in other words, the range) where the machining head 21 actually performs additional machining using the processing light EL while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. In other words, the machining head 21 may perform additional machining on the entire surface of the shaping unit area BSA. The shaping unit area BSA indicates the area (in other words, the range) where the machining head 21 actually scans with the processing light EL while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. The shaping unit area BSA indicates the area where the target irradiation area EA actually moves while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. Such a shaping unit area BSA coincides with at least a portion of the shaping shot area ESA. For example, the shaping unit area BSA may coincide with the shaping shot area ESA. Alternatively, the shaping unit area BSA may coincide with a portion of the shaping shot area ESA. In other words, the shaping unit area BSA may be smaller than the shaping shot area ESA. In this case, the smaller the rotation amount of the galvanometer mirror 2112 (i.e., the smaller the rotation angle of the galvanometer mirror 2112), the smaller the area scanned by the processing light EL, and therefore the smaller the shaping unit area BSA. Therefore, the irradiation optical system 211 may set a shaping unit area BSA of a desired size within the shaping shot area ESA by controlling the rotation amount of the galvanometer mirror 2112 (more specifically, the rotation amount of the X scanning mirror 2112X and the Y scanning mirror 2112Y) under the control of the control device 8.

[0040] In the example shown in FIG. 3 , the shape of the shaping unit area BSA is rectangular. However, the shape of the shaping unit area BSA may be a shape other than rectangular (for example, circular, elliptical, or polygonal). Furthermore, when a rectangular shape is used as the shape of the shaping unit area BSA, the corners of the rectangle may be rounded. The size of the shaping unit area BSA in the X-axis direction and the Y-axis direction may be several millimeters. However, the size of the shaping unit area BSA is not limited to several millimeters. For example, the size of the shaping unit area BSA can be approximately 10, 9, 8, 7, 6, 5, 4, 3, 2, 1 millimeter, or less. The same applies to the shape of the shaping shot area ESA. The above numerical values ​​are merely examples, and the present invention is not limited thereto.

[0041] When the processing light EL is irradiated onto the printing surface MS in units of printing unit areas BSA, the printing unit areas BSA are scanned with the processing light EL by the galvanometer mirror 2112. Therefore, compared to when the processing light EL is irradiated onto the printing surface MS without using the galvanometer mirror 2112, the distribution of the amount of heat transferred from the processing light EL to the printing unit areas BSA is less likely to vary within the printing unit areas BSA. In other words, the amount of heat transferred from the processing light EL to the printing unit areas BSA can be made uniform. As a result, the printing system SYS can print a model on the printing surface MS with relatively high printing accuracy.

[0042] However, the modeling system SYS does not have to irradiate the modeling surface MS with the processing light EL in units of modeling unit areas BSA. The modeling system SYS may irradiate the modeling surface MS with the processing light EL without using the galvanometer mirror 2112. In this case, the target irradiation area EA may move on the modeling surface MS in accordance with the movement of at least one of the processing head 21 and the stage 31.

[0043] The fθ lens 2113 is an optical system for emitting the processing light EL from the galvanometer mirror 2112 toward the printing surface MS. In particular, the fθ lens 2113 is an optical element that can focus the processing light EL from the galvanometer mirror 2112 on a focusing surface. For this reason, the fθ lens 2113 may also be referred to as a focusing member. The focusing surface of the fθ lens 2113 may be set, for example, on the printing surface MS. Note that the irradiation optical system 211 may also include a focusing member (focusing optical system) different from the fθ lens 2113.

[0044] It should be noted that while the processing head 21 includes a part of the irradiation optical system 211, another part of the irradiation optical system 211 may be disposed outside the processing head 21.

[0045] 1 and 2 , the material nozzle 212 has a supply outlet 214. The material nozzle 212 supplies (e.g., ejects, jets, spouts, or sprays) the modeling material M from the supply outlet 214. For this reason, the material nozzle 212 may be referred to as a material supply member. The material nozzle 212 is physically connected to the material supply device 1, which is a supply source of the modeling material M, via the supply pipe 11 and the mixer 12. The material nozzle 212 supplies the modeling material M supplied from the material supply device 1 via the supply pipe 11 and the mixer 12. The material nozzle 212 may pressure-feed the modeling material M supplied from the material supply device 1 via the supply pipe 11. That is, the modeling material M from the material supply device 1 and the conveying gas (i.e., a pressure-feed gas, for example, an inert gas such as nitrogen or argon) may be mixed in the mixer 12 and then pressure-feed to the material nozzle 212 via the supply pipe 11. As a result, the material nozzle 212 supplies the modeling material M together with the transport gas. For example, a purge gas supplied from the gas supply device 5 is used as the transport gas. However, a gas supplied from a gas supply device other than the gas supply device 5 may be used as the transport gas. Although the material nozzle 212 is depicted as a tube in FIG. 1 , the shape of the material nozzle 212 is not limited to this. The material nozzle 212 supplies the modeling material M toward a target or target area in the chamber space 63IN. The material nozzle 212 supplies the modeling material M downward (i.e., toward the −Z side) from the material nozzle 212. A stage 31 is disposed below the material nozzle 212. When a workpiece W is mounted on the stage 31, the material nozzle 212 supplies the modeling material M toward the workpiece W or the vicinity of the workpiece W. The direction of travel of the modeling material M supplied from the material nozzle 212 is inclined at a predetermined angle (for example, an acute angle) with respect to the Z-axis direction, but may also be inclined toward the -Z side (i.e., directly downward). The inclination of the material nozzle 212 is not limited to the above and can be set arbitrarily.

[0046] The material nozzle 212 supplies the building material M to a location irradiated with the processing light EL from the irradiation optical system 211. That is, the material nozzle 212 supplies the building material M to a target irradiation area EA onto which the irradiation optical system 211 irradiates the processing light EL. For this reason, the material nozzle 212 and the irradiation optical system 211 are aligned so that a target supply area MA, which is set on or near the workpiece W as an area onto which the material nozzle 212 supplies the building material M, coincides with (or at least partially overlaps with) the target irradiation area EA. In one example, the material nozzle 212 may supply the building material M to a molten pool MP (see FIG. 4 , etc., described later) formed by the processing light EL emitted from the irradiation optical system 211. Note that the sizes of the target supply area MA and the target irradiation area EA do not have to be the same. For example, the target supply area MA may be larger than the target irradiation area EA. Alternatively, the target supply area MA may be smaller than the target irradiation area EA. In another example, the material nozzle 212 may not supply the building material M to the molten pool MP. For example, the processing system SYS may melt the building material M from the material nozzle 212 using the processing light EL before the building material M reaches the workpiece W, and then adhere the molten building material M to the workpiece W.

[0047] As described above, in this embodiment, the processing system SYS uses the irradiation optical system 211 provided in the processing head 21 to irradiate the workpiece W with the processing light EL from the light source 4, and uses the material nozzle 212 provided in the processing head 21 to supply the modeling material M from the material supply device 1 to the workpiece W, thereby forming the model BO. For this reason, an apparatus including the processing head 21 (i.e., the irradiation optical system 211 and the material nozzle 212) that is mainly used to form the model BO, and at least one of the material supply device 1 and the light source 4 may be referred to as a processing apparatus 2.

[0048] The head drive system 22 moves the machining head 21. The head drive system 22 moves the machining head 21, for example, within the chamber space 63IN. The head drive system 22 moves the machining head 21 along at least one of the X-axis, Y-axis, and Z-axis. When the machining head 21 moves along at least one of the X-axis and Y-axis, the target irradiation area EA and the target supply area MA each move along at least one of the X-axis and Y-axis to any position on the workpiece W or within the chamber space 63IN. Furthermore, the head drive system 22 may move the machining head 21 along at least one of the θX direction, θY direction, and θZ direction in addition to or instead of at least one of the X-axis, Y-axis, and Z-axis. In other words, the head drive system 22 may rotate the machining head 21 around at least one of the X-axis, Y-axis, and Z-axis. The head drive system 22 may change the orientation of the machining head 21 around at least one of the X-axis, Y-axis, and Z-axis. The head drive system 22 includes, for example, an actuator such as a motor.

[0049] When the head drive system 22 moves the machining head 21, the relative positions of the machining head 21, the stage 31, and the workpiece W supported by the stage 31 change. That is, the relative positions of the irradiation optical system 211 and the material nozzle 212 (supply outlet 214), the stage 31, and the workpiece W change. Therefore, the head drive system 22 may function as a position change device for changing the relative positional relationship between the irradiation optical system 211 and the material nozzle 212 (supply outlet 214), the stage 31, and the workpiece W. Furthermore, when the relative positions of the machining head 21, the stage 31, and the workpiece W change, the relative positions of the target irradiation area EA of the machining light EL irradiated from the machining head 21, the stage 31, and the workpiece W change. Therefore, the head drive system 22 may function as a position change device for changing the relative positional relationship between the target irradiation area EA, the stage 31, and the workpiece W. Furthermore, when the relative positions of the machining head 21, the stage 31, and the workpiece W change, the target irradiation area EA and the target supply area MA (and further, the molten pool MP) move relative to the workpiece W. Therefore, the head drive system 22 may function as a moving device that moves the target irradiation area EA and the target supply area MA (and further, the molten pool MP) relative to the workpiece W.

[0050] The stage device 3 includes a stage 31. A workpiece W, which is an object, is placed on the stage 31. Specifically, the workpiece W is placed on a placement surface 311, which is at least a portion of the upper surface of the stage 31. The stage 31 may be capable of holding the workpiece W placed thereon. In this case, the stage 31 may be equipped with at least one of a mechanical chuck, an electrostatic chuck, a vacuum chuck, or the like to hold the workpiece W. Alternatively, the stage 31 may not be capable of holding the workpiece W placed thereon. In this case, the workpiece W may be placed on the stage 31 in a clampless manner. The irradiation optical system 211 described above emits processing light EL for at least a portion of the period during which the workpiece W is placed on the stage 31. Furthermore, the material nozzle 212 described above supplies the modeling material M for at least a portion of the period during which the workpiece W is placed on the stage 31.

[0051] The stage device 3 further includes a stage drive system 32. The stage drive system 32 moves the stage 31. For example, the stage drive system 32 moves the stage 31 along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction. When the stage drive system 32 moves the stage 31, the relative positions of the machining head 21, the stage 31, and the workpiece W placed on the stage 31 change. Therefore, the stage drive system 32 may function as a position changing device for changing the relative positional relationships between the machining head 21, the stage 31, and the workpiece W. Furthermore, when the relative positions of the machining head 21, the stage 31, and the workpiece W change, the target irradiation area EA and the target supply area MA (and further, the molten pool MP) move relative to the workpiece W.

[0052] The light source 4 emits, for example, at least one of infrared light, visible light, and ultraviolet light as the processing light EL. However, other types of light may be used as the processing light EL. The processing light EL may include multiple pulsed lights (i.e., multiple pulse beams). The processing light EL may be laser light. In this case, the light source 4 may include a laser light source (e.g., a semiconductor laser such as a laser diode (LD: Laser Diode). The laser light source may be a fiber laser, a CO2 laser, a YAG laser, an excimer laser, etc. However, the processing light EL does not have to be laser light. The light source 4 may include any light source (e.g., at least one of an LED (Light Emitting Diode) and a discharge lamp, etc.).

[0053] The gas supply device 5 is a supply source of purge gas for purging the chamber space 63IN. The purge gas includes an inert gas. Examples of the inert gas include nitrogen gas and argon gas. The gas supply device 5 is connected to the chamber space 63IN via a supply port 62 formed in a partition member 61 of the housing 6 and a supply pipe 51 connecting the gas supply device 5 to the supply port 62. The gas supply device 5 supplies purge gas to the chamber space 63IN via the supply pipe 51 and the supply port 62. As a result, the chamber space 63IN becomes a space purged with the purge gas. The purge gas supplied to the chamber space 63IN may be discharged from an exhaust port (not shown) formed in the partition member 61. The gas supply device 5 may be a cylinder containing an inert gas such as nitrogen gas or argon gas. When the inert gas is nitrogen gas, the gas supply device 5 may be a nitrogen gas generator that generates nitrogen gas using atmospheric air as a raw material.

[0054] As described above, when the material nozzle 212 supplies the modeling material M together with the purge gas, the gas supply device 5 may supply the purge gas to the mixer 12 to which the modeling material M from the material supply device 1 is supplied in addition to the chamber space 63IN. Specifically, the gas supply device 5 may be connected to the mixer 12 via a supply pipe 52 connecting the gas supply device 5 and the mixer 12. As a result, the gas supply device 5 supplies the purge gas to the mixer 12 via the supply pipe 52. In this case, the modeling material M from the material supply device 1 may be supplied (specifically, pressure-fed) through the supply pipe 11 toward the material nozzle 212 by the purge gas supplied from the gas supply device 5 via the supply pipe 52. In other words, the gas supply device 5 may be connected to the material nozzle 212 via the supply pipe 52, the mixer 12, and the supply pipe 11. In this case, the material nozzle 212 supplies the modeling material M from the supply outlet 214 together with the purge gas for pressure-fed the modeling material M.

[0055] The housing 6 is an accommodation device that accommodates at least a portion of each of the processing device 2, the stage device 3, and the measurement device 71 in a chamber space 63IN, which is the internal space of the housing 6. The housing 6 includes a partition member 61 that defines the chamber space 63IN. The partition member 61 is a member that separates the chamber space 63IN from an external space 64OUT of the housing 6. The partition member 61 faces the chamber space 63IN via its inner wall 611 and faces the external space 64OUT via its outer wall 612. In this case, the space surrounded by the partition member 61 (specifically, the space surrounded by the inner wall 611 of the partition member 61) becomes the chamber space 63IN. The partition member 61 may be provided with an openable / closable door. This door may be opened when the workpiece W is placed on the stage 31. The door may be opened when the workpiece W and / or the object BO is removed from the stage 31. The door may be closed during processing (i.e., during additional processing or joining processing). Note that an observation window (not shown) for visually observing the chamber space 63IN from the external space 64OUT of the housing 6 may be provided in the partition member 61.

[0056] The measuring device 71 is disposed in the chamber space 63IN. The measuring device 71 is capable of measuring at least a portion of the workpiece W placed on the stage 31 within the chamber space 63IN. In one example, the measuring device 71 includes a detector for detecting parameters related to the measurement target, a sensor for acquiring information related to the parameters of the measurement target, and / or a sensor for acquiring an image of the measurement target. In particular, the measuring device 71 is capable of measuring the molten pool MP formed on the workpiece W by the processing light EL (i.e., formed on the workpiece W by the processing head 21). In this case, the measurement results of the measuring device 71 include at least information related to the size of the molten pool MP. Therefore, the measuring device 71 may function as a device capable of acquiring information related to the molten pool MP (at least one physical parameter or shape parameter of the molten pool MP). Note that the measuring device 71 may also be a device that performs coaxial measurement, observing from the same axis as the processing optical axis, such as TTL (Through The Lens). In this case, for example, a semi-transparent mirror may be installed between the fθ lens 2113 and the Y scanning mirror 2112Y in FIG. 3, so that the molten pool MP can be observed from the side.

[0057] In this embodiment, the measuring device 71 may be capable of measuring the size (i.e., the dimension) of the molten pool MP formed by irradiation with the processing light EL. For example, the measuring device 71 may be capable of measuring the size (i.e., the length) of the molten pool MP in a direction along the surface of the workpiece W (or a later-described build surface MS on which the molten pool MP is formed). The measuring device 71 may be capable of measuring the size (i.e., the length or the width, etc.) of the molten pool MP in at least one of the X-axis direction and the Y-axis direction. In this case, the measurement results of the measuring device 71 include information regarding the size of the molten pool MP. Therefore, the measuring device 71 may function as a device capable of acquiring information regarding the size of the molten pool MP.

[0058] Furthermore, the measuring device 71 may function as a device capable of acquiring shape information (e.g., physical parameters, shape parameters) about the molten pool MP, which is continuously moving as it is formed at different positions by the processing light EL deflected by the deflection optical system (galvanometer mirror 2112). In this case, the measurement results of the measuring device 71 also include information about the size of the molten pool MP. The control device 8 may control shaping by the processing system SYS based on the shape information about the molten pool MP measured by the measuring device 71.

[0059] The measurement results of the measuring device 71 (e.g., information regarding the size of the molten pool MP) are output to the control device 8. The control device 8 may calculate the characteristics of the molten pool MP (e.g., the size of the molten pool MP) based on the measurement results of the measuring device 71.

[0060] The measuring device 71 may be any type of measuring device as long as it is capable of measuring the workpiece W (particularly, the molten pool MP). For example, the measuring device 71 may be a measuring device capable of optically measuring the workpiece W (particularly, the molten pool MP). The measuring device 71 may be a measuring device capable of measuring the workpiece W (particularly, the molten pool MP) without contacting the workpiece W. An example of a measuring device capable of optically measuring the workpiece W (particularly, the molten pool MP) without contacting the workpiece W is an imaging device capable of imaging the workpiece W. In the following description, an example will be described in which the measuring device 71 is an imaging device. In this case, the measuring device 71 images the workpiece W to generate an image in which the workpiece W is reflected (particularly, an image in which the molten pool MP is reflected (a captured image including the molten pool MP), hereinafter referred to as a "workpiece image IW"). The workpiece image IW is output to the control device 8 as the measurement result of the measuring device 71 (i.e., information regarding the molten pool MP).

[0061] Note that the chamber space 63IN may contain unwanted substances, including a portion of the building material M supplied from the material nozzle 212 that was not used in forming the object BO. Furthermore, the chamber space 63IN may contain unwanted substances, including metal vapors (so-called fumes) that have evaporated due to the irradiation of the processing light EL. If such unwanted substances adhere to the measuring device 71 disposed in the chamber space 63IN, the measuring device 71 may be unable to properly measure the molten pool MP. For this reason, the measuring device 71 may be disposed in the chamber space 63IN while being housed in a housing that prevents unwanted substances from adhering to the measuring device 71.

[0062] The recording device 72 is disposed in an external space 64OUT, separate from the chamber space 63IN. The recording device 72 is connected to a control device, which will be described in detail later. The recording device 72 can record various input information (e.g., measured parameters and / or calculated parameters). The recording device 72 records at least information related to the molten pool MP. In this embodiment, the recording device 72 may record information related to the size of the molten pool MP obtained by the measuring device 71 and information related to the position of the molten pool MP in association with each other. The recording device 72 may record information related to the target size of the molten pool MP in association with the deflection conditions of the processing light EL by the galvanometer mirror 2112 and the target irradiation position (target irradiation area EA). The deflection conditions of the processing light EL include the deflection trajectory shape (wobble shape) as well as the amplitude, deflection speed, and amplitude direction of the processing light EL. The recording device 72 may record information related to the measurement target area of ​​the molten pool MP in association with the deflection conditions of the processing light EL by the galvanometer mirror 2112. The recording device 72 may record information about the measurement target area of ​​the molten pool MP in association with the movement direction of the irradiation position of the processing beam by the first moving device (the stage 31 and the head drive system 22). The recording device 72 may function as a storage device that can output information about the molten pool MP that has been input in advance in response to an output signal.

[0063] The recording results of the recording device 72 (e.g., information about the molten pool MP) are output to the control device 8. The control device 8 may change the control mode of the machining system SYS based on the measurement results of the measuring device 71 and the output results from the recording device 72.

[0064] The control device 8 controls the operation of the processing system SYS. For example, the control device 8 may control the processing device 2 (e.g., at least one of the processing head 21 and the head drive system 22) included in the processing system SYS. For example, the control device 8 may control the material supply device 1 included in the processing system SYS. For example, the control device 8 may control the light source 4 included in the processing system SYS. As a result, the control device 8 may control at least one of the processing device 2, the material supply device 1, and the light source 4 to form the object BO. In other words, the control device 8 may control the formation by at least one of the processing device 2, the material supply device 1, and the light source 4. The control device 8 may control at least one of the processing device 2, the material supply device 1, and the light source 4 so that the processing device 2 performs a desired formation (specifically, forms a desired object BO) using the formation material M supplied from the material supply device 1 and the processing light EL supplied from the light source 4.

[0065] The control device 8 may control the operation of the modeling system SYS based on modeling condition information (modeling parameters) that define the modeling conditions for the object to be modeled by the modeling system SYS. The modeling condition information may be input to the control device 8 via an input device (not shown) that the modeling system SYS is equipped with. The input device may include an operation device (e.g., at least one of a keyboard, a mouse, and a touch panel) that an operator of the modeling system SYS can operate to input the modeling condition information. The input device may include a communication device that can receive modeling condition information transmitted by a device external to the modeling system SYS. The input device may include a recording medium reading device that can read modeling condition information recorded on a recording medium that can be externally attached to the modeling system SYS.

[0066] The control device 8 may include, for example, an arithmetic device and a storage device. The arithmetic device may include, for example, at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The storage device may include, for example, a memory. The control device 8 functions as a device that controls the operation of the machining system SYS when the arithmetic device executes a computer program. This computer program is a computer program for causing the arithmetic device to perform (i.e., execute) the operations to be performed by the control device 8, which will be described later. In other words, this computer program is a computer program for causing the control device 8 to function so as to cause the machining system SYS to perform the operations to be performed later. The computer program executed by the arithmetic device may be recorded in a storage device (i.e., a recording medium) included in the control device 8, or may be recorded in any storage medium (e.g., a hard disk or a semiconductor memory) built into or externally attachable to the control device 8. Alternatively, the arithmetic device may download the computer program to be executed from a device external to the control device 8 via a network interface.

[0067] The control device 8 may control the emission mode of the processing light EL by the irradiation optical system 211. The emission mode may include, for example, at least one of the intensity of the processing light EL and the emission timing of the processing light EL. If the processing light EL is pulsed light, the emission mode may include, for example, at least one of the emission duration of the pulsed light, the emission cycle of the pulsed light, and the ratio between the emission duration of the pulsed light and the emission cycle of the pulsed light (so-called duty ratio). Note that the emission mode of the processing light EL by the irradiation optical system 211 is primarily determined by the emission mode of the processing light EL by the light source 4. Therefore, controlling the emission mode of the processing light EL by the irradiation optical system 211 may be considered equivalent to controlling the emission mode of the processing light EL by the irradiation optical system 211. In other words, the control device 8 may control the emission mode of the processing light EL by the irradiation optical system 211 by controlling the emission mode of the processing light EL by the light source 4. Furthermore, the control device 8 may control the movement mode of the processing head 21 by the head drive system 22. Furthermore, the control device 8 may control the movement mode of the stage 31 by the stage drive system 32. The movement mode may include, for example, at least one of the movement amount, movement speed, movement direction, and movement timing. Furthermore, the control device 8 may control the supply mode of the modeling material M by the material nozzle 212. The supply mode may include, for example, at least one of the supply amount (particularly, the supply amount per unit time) and the supply timing. Note that the supply mode of the modeling material M by the material nozzle 212 is primarily determined by the supply mode of the modeling material M by the material supply device 1. Therefore, controlling the supply mode of the modeling material M by the material supply device 1 may be considered equivalent to controlling the supply mode of the modeling material M by the material nozzle 212. In other words, the control device 8 may control the supply mode of the modeling material M by the material nozzle 212 by controlling the supply mode of the modeling material M by the material supply device 1.

[0068] Particularly in this embodiment, the control device 8 may control the operation of the processing system SYS based on the measurement results of the measuring device 71 and the recording results of the recording device 72. For example, the control device 8 may control at least one of the processing device 2, the material supply device 1, and the light source 4 based on the measurement results of the measuring device 71 and the recording results of the recording device 72. Details of the operation of controlling the processing system SYS based on the measurement results of the measuring device 71 and the recording results of the recording device 72 will be described later.

[0069] The control device 8 does not have to be provided inside the machining system SYS. For example, the control device 8 may be provided as a server or the like outside the machining system SYS. In this case, the control device 8 and the machining system SYS may be connected via a wired and / or wireless network (or a data bus and / or communication line). The wired network may be a network using a serial bus interface, such as at least one of IEEE 1394, RS-232x, RS-422, RS-423, RS-485, and USB. The wired network may be a network using a parallel bus interface. The wired network may be a network using an interface compliant with Ethernet (registered trademark), such as at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T. The wireless network may be a network using radio waves. An example of a network using radio waves is a network compliant with IEEE 802.1x (e.g., at least one of a wireless LAN and Bluetooth (registered trademark)). A network using infrared rays may be used as the wireless network. A network using optical communication may be used as the wireless network. In this case, the control device 8 and the machining system SYS may be configured to be able to transmit and receive various information via the network. The control device 8 may also be able to transmit information such as commands and control parameters to the machining system SYS via the network. The machining system SYS may include a receiving device that receives information such as commands and control parameters from the control device 8 via the network. The machining system SYS may also include a transmitting device (i.e., an output device that outputs information to the control device 8) that transmits information such as commands and control parameters to the control device 8 via the network. Alternatively, a first control device that performs part of the processing performed by the control device 8 may be provided inside the machining system SYS, while a second control device that performs another part of the processing performed by the control device 8 may be provided outside the machining system SYS.

[0070] The recording medium for recording the computer program executed by the control device 8 may include at least one of the following: a CD-ROM, CD-R, CD-RW, a flexible disk, an MO, a DVD-ROM, a DVD-RAM, a DVD-R, a DVD+R, a DVDRW, a DVD+RW, and an optical disk such as Blu-ray (registered trademark), a magnetic medium such as a magnetic tape, a magneto-optical disk, a semiconductor memory such as a USB memory, and any other medium capable of storing a program. The recording medium may also include a device capable of recording a computer program (e.g., a general-purpose device or a dedicated device in which a computer program is implemented in an executable state in at least one of software and firmware forms). Furthermore, each process or function included in the computer program may be realized by a logical processing block realized within the control device 8 when the control device 8 (i.e., a computer) executes the computer program, or by hardware such as a predetermined gate array (FPGA, ASIC) included in the control device 8, or may be realized in a form that combines logical processing blocks and partial hardware modules that realize some elements of the hardware.

[0071] (2) Operation of the Machining System SYS of the Present Embodiment Next, the operation of the machining system SYS will be described. As described above, the machining system SYS performs a molding operation to form a molded object BO by performing additive machining on the workpiece W (i.e., molding the molded object BO). Furthermore, during at least a portion of the period during which the molding operation is performed, the machining system SYS performs a molten pool information acquisition operation to generate and record molten pool information SI, which associates information about the size of the molten pool MP with information about the position of the molten pool MP, from the recording device 72. Furthermore, the machining system SYS performs a processing light control operation to control the machining operation (e.g., the intensity of the processing light EL, the machining path, etc.) in the current machining operation based on the read and recorded information about the size of the molten pool MP. Furthermore, before performing the processing light control operation, the machining system SYS performs a control signal generation operation to generate a control signal for controlling the processing light EL. Therefore, the following will sequentially describe the molding operation, the molten pool information acquisition operation, the processing light control operation, and the control signal generation operation.

[0072] (2-1) Forming Operation First, the forming operation for forming the object BO will be described. As described above, the processing system SYS performs the forming operation by the laser build-up welding method. Therefore, the processing system SYS may form the object BO by performing an existing additive processing operation that complies with the laser build-up welding method. Below, a brief description will be given of an example of the additive processing operation for forming a three-dimensional structure ST, which is an example of the object BO, using the laser build-up welding method.

[0073] The processing system SYS forms a three-dimensional structure ST on a workpiece W based on three-dimensional model data (e.g., CAD (Computer Aided Design) data) of the three-dimensional structure ST to be formed. Measurement data of a three-dimensional object measured by at least one of a measuring device (e.g., measuring device 71) provided in the processing system SYS and a three-dimensional shape measuring device provided separately from the processing system SYS may be used as the three-dimensional model data. To form the three-dimensional structure ST, the processing system SYS sequentially forms, for example, a plurality of layered partial structures (hereinafter referred to as "structural layers") SL arranged along the Z-axis direction. As described above, the structural layer SL (and further, an object forming a part of the structural layer SL, which is formed in the process of forming the structural layer SL) also corresponds to the formed object BO. For example, the processing system SYS sequentially forms a plurality of structural layers SL obtained by slicing the three-dimensional structure ST along the Z-axis direction, one by one. As a result, a three-dimensional structure ST is formed, which is a layered structure in which a plurality of structural layers SL are stacked. Below, a flow of operations for forming the three-dimensional structure ST by sequentially forming the plurality of structural layers SL one by one will be described.

[0074] First, the operation of forming each structure layer SL will be described with reference to FIGS. 4A to 4E. Under the control of the control device 8, the processing system SYS moves at least one of the processing head 21 and the stage 31 so that the target irradiation area EA is set in a desired area on the printing surface MS corresponding to the surface of the workpiece W or the surface of the already-formed structure layer SL. The processing system SYS then irradiates the target irradiation area EA with the processing light EL from the irradiation optical system 211. At this time, the focus position (i.e., the condensed position) of the processing light EL may coincide with the printing surface MS. Alternatively, the condensed surface may be offset from the printing surface MS in the Z-axis direction. As a result, as shown in FIG. 4A, a molten pool MP (i.e., a pool of metal or the like melted by the processing light EL) is formed on the printing surface MS irradiated with the processing light EL. Furthermore, as shown in FIG. 4B, under the control of the control device 8, the processing system SYS supplies the printing material M from the material nozzle 212. As a result, the printing material M is supplied to the molten pool MP. The modeling material M supplied to the molten pool MP is melted by the processing light EL irradiated onto the molten pool MP. Alternatively, the modeling material M supplied from the material nozzle 212 may be melted by the processing light EL before reaching the molten pool MP, and the molten modeling material M may be supplied to the molten pool MP.

[0075] Furthermore, the irradiation optical system 211 uses the galvanometer mirror 2112 to move the target irradiation area EA within the building unit area BSA. That is, the irradiation optical system 211 uses the galvanometer mirror 2112 to scan the building unit area BSA with the processing light EL. As the target irradiation area EA moves and the processing light EL is no longer irradiated onto the molten pool MP, the molten building material M in the molten pool MP cools and solidifies (i.e., solidifies). Furthermore, as the target irradiation area EA moves, the molten pool MP also moves. As a result, as shown in FIG. 4( c), a building object BO made of the solidified building material M is deposited on the building surface MS. Note that the molten pool MP may be formed over almost the entire building unit area BSA.

[0076] During the period when the target irradiation area EA is moving within the shaping unit area BSA, the shaping system SYS may move at least one of the processing head 21 and the stage 31 so that the shaping unit area BSA moves on the shaping surface MS. In other words, the shaping system SYS may move the target irradiation area EA within the shaping unit area BSA and the shaping unit area BSA on the shaping surface MS in parallel.

[0077] Alternatively, during the period in which the target irradiation area EA is moving within the shaping unit area BSA, the shaping system SYS may not move the machining head 21 and the stage 31 so that the shaping unit area BSA does not move on the shaping surface MS. In this case, after the additional processing (i.e., shaping) within the shaping unit area BSA is completed, the shaping system SYS may move at least one of the machining head 21 and the stage 31 so that the shaping unit area BSA is set in another area on the shaping surface MS. In other words, the shaping system SYS may move at least one of the machining head 21 and the stage 31 so that the shaping unit area BSA moves on the shaping surface MS. In this case, the modeling system SYS may move at least one of the machining head 21 and the stage 31 so that an area on the modeling surface MS where a modeling unit area BSA has already been set (i.e., an area where additional processing has already been performed) and an area on the modeling surface MS where a modeling unit area BSA has newly been set (i.e., an area where additional processing will now be performed) are adjacent to each other. In one example, the modeling system SYS may move at least one of the machining head 21 and the stage 31 so that an area on the modeling surface MS where a modeling unit area BSA has already been set and an area on the modeling surface MS where a modeling unit area BSA has newly been set do not overlap. In another example, the modeling system SYS may move at least one of the machining head 21 and the stage 31 so that an area on the modeling surface MS where a modeling unit area BSA has already been set and an area on the modeling surface MS where a modeling unit area BSA has newly been set partially overlap each other.

[0078] The machining system SYS repeats a series of molding processes, including forming a molten pool MP by irradiating the machining light EL, supplying the molding material M to the molten pool MP, melting the supplied molding material M, and solidifying the molten molding material M, while moving the machining head 21 relative to the printing surface MS along at least one of the X-axis direction and the Y-axis direction, as shown in FIG. 4( d ). Typically, the machining system SYS repeats a scanning operation in which the machining head 21 moves relative to the printing surface MS along at least one of the X-axis direction and the Y-axis direction while irradiating the printing surface MS with the machining light EL at a desired timing, and a stepping operation in which the machining head 21 moves relative to the printing surface MS along the other of the X-axis direction and the Y-axis direction without irradiating the printing surface MS with the machining light EL. These operations are sometimes called wobbles. During this scanning operation, the machining system SYS irradiates the region on the printing surface MS where the object BO is to be printed with the processing light EL, while not irradiating the region on the printing surface MS where the object BO is not to be printed with the processing light EL. In other words, the machining system SYS moves the target irradiation area EA along a predetermined movement trajectory on the printing surface MS, and irradiates the printing surface MS with the processing light EL at a timing appropriate to the distribution of the region where the object BO is to be printed. Typically, the machining system SYS repeats a scanning operation in which the target irradiation area EA is moved relative to the printing surface MS along either the X-axis direction or the Y-axis direction while irradiating the target irradiation area EA with the processing light EL at the desired timing, and a step operation in which the target irradiation area EA is moved relative to the printing surface MS along the other of the X-axis direction or the Y-axis direction without irradiating the target irradiation area EA with the processing light EL. As a result, the molten pool MP also moves on the printing surface MS along a movement trajectory appropriate to the movement trajectory of the target irradiation area EA. Specifically, the molten pool MP is formed sequentially on the manufacturing surface MS in the area irradiated with the processing light EL along the movement trajectory of the target irradiation area EA. As a result, as shown in FIG. 4( e), a structure layer SL corresponding to the object BO, which is an aggregate of the melted and then solidified building material M, is formed on the manufacturing surface MS.In other words, a structure layer SL corresponding to an aggregate of objects BO formed on the building surface MS in a pattern corresponding to the movement trajectories of the building unit areas BSA (i.e., a structure layer SL having a shape corresponding to the movement trajectories of the building unit areas BSA in a planar view) is formed. When the target irradiation area EA is set in an area where the object BO is not desired to be formed, the processing system SYS may irradiate the target irradiation area EA with the processing light EL and stop the supply of the building material M. When the target irradiation area EA is set in an area where the object BO is not desired to be formed, the processing system SYS may supply the building material M to the target irradiation area EA and irradiate the target irradiation area EA with the processing light EL at an intensity sufficient to prevent the formation of a molten pool MP.

[0079] The movement path (i.e., movement trajectory) of the shaping unit area BSA may be referred to as a machining path (i.e., a tool path). Machining path information (machining path parameters) related to the machining path may be included in the above-mentioned shaping condition information (shaping condition parameters). The machining path information may include information (e.g., coordinate information) related to multiple positions where at least one of the shaping unit areas BSA is sequentially set. In this case, each position where at least one of the shaping unit areas BSA is set may be referred to as a unit machining path. The control device 8 may move at least one of the machining head 21 and the stage 31 so that the shaping unit area BSA moves along the movement path specified by the machining path information. Note that, since additional machining (i.e., shaping) is performed within the shaping unit area BSA, the machining path may also refer to the path along which the machining device 2 performs shaping on the shaping surface MS.

[0080] The shaping condition information may include shaping size information regarding the size of the shaping unit area BSA. For example, the shaping size information may include information regarding the size of the shaping unit area BSA in the X-axis direction. For example, the shaping size information may include information regarding the size of the shaping unit area BSA in the Y-axis direction. As described above, when the processing path information includes information regarding each position (i.e., unit processing pass) where the shaping unit area BSA is set, the shaping size information may include information regarding the size of the shaping unit area BSA at each position where the shaping unit area BSA is set (i.e., the size per unit processing pass). As described above, when the shaping unit area BSA moves in conjunction with the movement of at least one of the processing head 21 and the stage 31, the size of the shaping unit area BSA along the movement direction of the shaping unit area BSA may be referred to as the length of the shaping unit area BSA. On the other hand, the size of the shaping unit area BSA along a direction intersecting the movement direction of the shaping unit area BSA may be referred to as the width of the shaping unit area BSA. Since shaping is performed within the shaping unit area BSA, the width of the shaping unit area BSA may be referred to as the shaping width. Since the shaping unit area BSA moves in conjunction with the movement of at least one of the machining head 21 and the stage 31, the movement direction of the shaping unit area BSA may also refer to the movement direction of at least one of the machining head 21 and the stage 31. The movement direction of the shaping unit area BSA may also be considered equivalent to the movement direction of at least one of the head drive system 22 and the stage drive system 32. The control device 8 may control the galvanometer mirror 2112 of the irradiation optical system 211 so that the target irradiation area EA moves within the shaping unit area BSA having the size specified by the shaping size information. Since additional machining (i.e., shaping) is performed within the shaping unit area BSA, the processing path may also refer to the path along which the machining device 2 performs shaping on the shaping surface MS. The shaping condition information may also include a shaping unit area shape related to the shape of the shaping unit area BSA.

[0081] Note that software capable of creating a general machining path (tool path) is known, which allows input of a single-line printing width. In this case, the control device 8 may acquire information regarding the printing width input using such software and control the galvanometer mirror 2112 based on the acquired information regarding the printing width. The control device 8 may acquire information regarding the printing width input using such software and control the galvanometer mirror 2112 based on the acquired information regarding the printing width so that the size of each printing unit area BSA (particularly, the size in a direction intersecting the movement direction of the printing unit area BSA) matches the printing width. The control device 8 may acquire information regarding the printing width input using such software and control the galvanometer mirror 2112 based on the acquired information regarding the printing width so that the size of each printing unit area BSA (particularly, the size in a direction intersecting the movement direction of the printing unit area BSA) matches the size determined based on the printing width.

[0082] The machining system SYS repeatedly performs operations for forming such a structure layer SL based on the 3D model data under the control of the control device 8. Specifically, before performing operations for forming the structure layer SL, the control device 8 first slices the 3D model data at the layer pitch to create slice data. The machining system SYS performs operations for forming a first structure layer SL#1 on a printing surface MS corresponding to the surface of the workpiece W based on the slice data corresponding to the structure layer SL#1. As a result, the structure layer SL#1 is formed on the printing surface MS, as shown in FIG. 5A, for example. The machining system SYS then sets the surface (i.e., the upper surface) of the structure layer SL#1 as a new printing surface MS, and then forms a second structure layer SL#2 on the new printing surface MS. To form the structure layer SL#2, the control device 8 first controls at least one of the head drive system 22 and the stage drive system 32 to move the machining head 21 along the Z axis relative to the stage 31. Specifically, the control device 8 controls at least one of the head drive system 22 and the stage drive system 32 to move the processing head 21 toward the +Z side and / or the stage 31 toward the -Z side so that the target irradiation area EA is set on the surface of the structural layer SL#1 (i.e., the new printing surface MS). Thereafter, under the control of the control device 8, the processing system SYS forms a structural layer SL#2 on the structural layer SL#1 based on the slice data corresponding to the structural layer SL#2, in a manner similar to the operation for forming the structural layer SL#1. As a result, the structural layer SL#2 is formed, for example, as shown in FIG. 5( b). Thereafter, similar operations are repeated until all structural layers SL constituting the three-dimensional structure ST to be formed on the workpiece W are formed. As a result, for example, as shown in FIG. 5( c), the three-dimensional structure ST is formed by a stacked structure in which multiple structural layers SL are stacked. Furthermore, the multiple structural layers SL may be integrated with one another when the three-dimensional structure ST is formed (in other words, there may be no boundaries between the multiple structural layers SL in the three-dimensional structure).

[0083] Next, the processing path in the modeling of this embodiment will be described. In this embodiment, as an example, a case will be described in which a structural layer SL elongated in the Y-axis direction is modeled, as shown in (c) of FIG. 6, (c) of FIG. 8, and FIG. 10, etc. FIG. 6(a) is a plan view showing the movement trajectory of the target irradiation area EA within the modeling unit area BSA. FIG. 6(b) is a plan view showing an example of combining the movement of the target irradiation area EA and the movement of the machining head 21 / stage 31. FIG. 6(c) is a schematic diagram showing the area in which a modeled object BO is formed when the operation shown in (b) of FIG. 6 is performed. When modeling, the control device 8 moves at least one of the machining head 21 and the stage 31 so that the movement trajectory MTO of the modeling unit area BSA on the modeling surface MS is a linear movement trajectory along the Y-axis of the modeling surface MS, as shown in (a) of FIG. 6, (b) of FIG. 10, etc. The control device 8 also controls the galvanometer mirror 2112 of the irradiation optical system 211 so that the target irradiation area EA moves within the shaping unit area BSA at least along a direction intersecting the movement direction of the shaping unit area BSA. In this case, the width of the shaping unit area BSA corresponds to the bead width. The galvanometer mirror 2112, functioning as a deflection optical system, can deflect the processing light EL to move the irradiation position of the processing light EL on the shaping surface MS. In other words, the control device 8 may control the galvanometer mirror 2112 so that the target irradiation area EA moves within the shaping unit area BSA at least along a direction intersecting the movement trajectory MT0 of the shaping unit area BSA. In this case, the shape of the shaping unit area BSA may be rectangular, with the movement direction of the target irradiation area EA (i.e., the direction intersecting the movement trajectory MT0) as the longitudinal direction. Note that FIG. 6A illustrates an example in which the shaping unit area BSA is a rectangular area. In this case, the size of the shaping unit area BSA in the X-axis direction (i.e., the movement direction of the shaping unit area BSA) may be the same as the spot width of the processing light EL, or the size of the shaping unit area BSA in the movement direction may be considered to be essentially zero.

[0084] Furthermore, as shown in FIG. 6B , by moving at least one of the machining head 21 and the stage 31, the shaping unit area BSA moves linearly (in the Y direction in the example shown in FIG. 6B ). In the example shown in FIG. 6 , the shaping unit area BSA has the same pattern (period, amplitude). Therefore, by moving the galvanometer mirror 2112 relative to at least one of the machining head 21 and the stage 31, ideally, when the movement of the target irradiation area EA due to the operation of the galvanometer mirror 2112 is sufficiently faster than the movement speed of at least one of the machining head 21 and the stage 31, as shown in FIG. 6C , a molten pool MP is formed evenly in a rectangular area having a width equivalent to the width dimension of the shaping unit area BSA in the X direction from position P1 to position P2 (molten pools are formed sequentially). This allows the shaping object BO to be formed in the rectangular area shown in FIG. 6C . At this time, by controlling the speed, the increase / decrease of the speed, etc., a wavy trajectory of the molten pool MP may be formed in the XY plane. The wave-like trajectory may be a triangular wave, a cosine wave, a sine wave, or the like.

[0085] FIG. 7 shows an example of a workpiece image. The width of the molten pool MP in FIG. 7 corresponds to the width (bead width) of the shaping unit area BSA in FIG. 6(b). In other words, FIG. 7 is a photographed image showing a workpiece image when an amplitude movement equivalent to the width (bead width) of the shaping unit area BSA is performed. In the following description, amplitude refers to amplitude along the X direction. The machining system SYS uses a measurement device 71 to acquire information (molten pool information) regarding the size of the molten pool MP from an image such as that shown in FIG. 7. The method of acquiring molten pool information using the measurement device 71 will be described later.

[0086] As another example, a processing path when processing while changing the width of the shaping unit area BSA in shaping of this embodiment using the galvanometer mirror 2112 will be described. (a) of FIG. 8 is a plan view showing the movement trajectory of the target irradiation area EA when the width of the shaping unit area BSA in the X direction is changed. Each diagram in (a) of FIG. 8 shows the movement trajectory of the target irradiation area EA at different positions in the Y direction, for example. In other words, when the processing head 21 / stage 31 is moved in the Y direction, the state in which the width in the X direction changes over time is shown. (b) of FIG. 8 is a plan view showing an example in which the processing head 21 / stage 31 is moved in the Y direction while changing the width of the shaping unit area BSA in the X direction. (c) of FIG. 8 is a schematic diagram showing the area in which the shaping object BO is formed when the operation shown in (b) of FIG. 8 is performed. Note that when the processing head 21 / stage 31 is moved in the Y direction while changing the width in the X direction, the change may be continuous, as shown in (c) of FIG. 8, or may be stepwise. As in FIG. 6 , when performing modeling, the control device 8 controls the galvanometer mirror 2112 of the irradiation optical system 211 so that the target irradiation area EA moves within the modeling unit area BSA at least in a direction intersecting the movement direction of the modeling unit area BSA, as shown in FIG. 8A . At this time, the width of the target irradiation area EA (bead width) may be changed. That is, it is possible to change the setting of the width (bead width) of the modeling unit area BSA in the X direction. In this case, since the width (bead width) of the target irradiation area EA changes sequentially at each time during modeling, the shape of the model BO may be a shape other than the rectangular shape shown in FIG. 6 .

[0087] As shown in Fig. 8(b), the shaping unit area BSA moves linearly (in the Y direction in the example shown in Fig. 8(b)) by moving at least one of the machining head 21 and the stage 31. In the example shown in Fig. 8, the pattern of the shaping unit area BSA (in the example shown in Fig. 8(b)), changes sequentially while the target irradiation area EA is relatively moved in the Y direction by at least one of the machining head 21 and the stage 31. As an example, as shown in Fig. 8(b), the bead width may be gradually increased from position P1 to position P2, and gradually decreased from position P2 to position P3. In this case, as shown in FIG. 8( c), ideally (when the speed at which the target irradiation area EA is moved by the galvanometer mirror 2112 is sufficiently faster than the speed at which at least one of the machining head 21 and the stage 31 is moved), a molten pool MP is formed evenly over the entire area from position P1 to position P3 (molten pools MP are formed sequentially). As a result, as shown in FIG. 8( c), a molded object BO can be formed in an area with arc-shaped sides whose width changes smoothly, like an ellipse with both ends cut off. Note that although FIG. 8 describes an example in which the bead width is changed continuously during molding, the bead width may also be changed in steps (in stages).

[0088] 9A is a plan view showing the movement trajectory of the target irradiation area EA when the movement speed of the target irradiation area EA is sufficiently fast relative to the movement speed of the machining head 21 / stage 31. Note that multiple circles in each diagram of FIG. 9 indicate the target irradiation area EA. Each diagram of FIG. 9 also shows how the position of the target irradiation area EA changes from right to left (X direction) over time. FIG. 9B is a plan view showing the movement trajectory of the target irradiation area EA when the movement speed of the target irradiation area EA is moderately fast relative to the movement speed of the machining head 21 / stage 31. FIG. 9C is a plan view showing the movement trajectory of the target irradiation area EA when the movement speed of the target irradiation area EA is slow relative to the movement speed of the machining head 21 / stage 31. Compared to FIG. 9A, in FIGS. 9B and 9C, the trajectory during one forward movement of the galvanometer mirror 2112 in the X direction includes more Y-direction components. As described above, the target irradiation area EA moves within the shaping unit area BSA while moving at least one of the machining head 21 and the stage 31. Therefore, when the speed at which the target irradiation area EA is moved by the galvanometer mirror 2112 is sufficiently faster than the speed at which at least one of the machining head 21 and the stage 31 is moved (see FIG. 9A), the target irradiation area EA can be considered to be moving along the X direction. On the other hand, when the speed at which the target irradiation area EA is moved by the galvanometer mirror 2112 approaches the speed at which at least one of the machining head 21 and the stage 31 is moved (see FIGS. 9B and 9C), the trajectory of the galvanometer mirror 2112 in one forward path during one reciprocal movement in the X direction includes more Y-direction components. In this way, by adjusting (setting) the relative movement speed of the target irradiation area EA with respect to the movement speed of at least one of the machining head 21 and the stage 31, it is possible to homogenize the molten pool MP within the area where the object BO is to be formed. For example, by moving the target irradiation area EA at a moderate relative speed as shown in (b) of Figure 9, a molten pool MP (object BO) having a shape as shown in Figure 10, which is a schematic diagram showing the irradiation trajectory of the laser light on the object BO, can be formed.

[0089] As described above, the control device 8 may move at least one of the machining head 21 and the stage 31 so that the shaping unit area BSA moves on the shaping surface MS, even while using the galvanometer mirror 2112 to move the target irradiation area EA within the shaping unit area BSA. As a result, the target irradiation area EA moves along the movement trajectory MT shown in FIG. 11 on the shaping surface MS due to the movement of the target irradiation area EA within the shaping unit area BSA and the movement of the shaping unit area BSA itself. Specifically, the target irradiation area EA moves along the movement trajectory MT0 of the shaping unit area BSA while also moving in a direction intersecting the movement trajectory MT0. In other words, the target irradiation area EA moves along a waveform-shaped movement trajectory MT that oscillates around the movement trajectory MT0. In the following description, the shape of the trajectory of the processing light EL deflected and scanned by the galvanometer mirror 2112 may be referred to as a wobble shape. The recording device 72 may record this wobble shape. In the above example, the wobble shape is described as a wave shape, but for example, modeling may be performed by scanning the processing light EL so that the wobble shape is circular. Note that the operation of deflecting and scanning the processing light EL on the modeling surface MS by the galvanometer mirror 2112 may also be referred to as wobbling.

[0090] For example, as shown in FIG. 12 , which is a plan view illustrating an example of the movement trajectory of the target irradiation area EA within the shaping unit area BSA, at least a portion of the movement trajectory of the target irradiation area EA within the shaping unit area BSA may be located between two adjacent partial trajectories that constitute the movement trajectory of the target irradiation area EA within the shaping unit area BSA. In FIG. 12 , the control device 8 repeats the operation of moving the target irradiation area EA back and forth once along the X-axis direction multiple times while gradually changing the movement trajectory of the target irradiation area EA. As a result, by moving the target irradiation area EA back and forth multiple times along the X-axis direction, the shape of the shaping unit area BSA through which the target irradiation area EA moves may be considered to be the same as a rectangle, as shown in FIG. 12 . By adjusting the movement trajectory of the target irradiation area EA in this way, the control device 8 can shape the shaping unit area BSA into a desired shape.

[0091] 13 is a plan view showing another example of the movement trajectory of the target irradiation area EA within the shaping unit area BSA. The control device 8 may control the galvanometer mirror 2112 so that the target irradiation area EA moves along a single direction within the shaping unit area BSA. In particular, the control device 8 may control the galvanometer mirror 2112 so that the target irradiation area EA moves back and forth at least once (or, in some cases, repeatedly) along a single direction within the shaping unit area BSA. In this case, the shape of the shaping unit area BSA through which the target irradiation area EA moves may be a rectangle whose longitudinal direction is the movement direction of the target irradiation area EA. In the example shown in FIG. 13, the target irradiation area EA moves back and forth repeatedly along the X-axis direction. In this case, the shape of the shaping unit area BSA may be a rectangle whose longitudinal direction is the X-axis direction.

[0092] 14 is a plan view showing another example of the movement trajectory of the target irradiation area EA within the shaping unit area BSA, the control device 8 may move the target irradiation area EA in multiple directions so that the movement trajectory of the target irradiation area EA within the shaping unit area BSA is a circular movement trajectory. In this case, the control device 8 may control the galvanometer mirror 2112 so that, in a coordinate system with the center of the shaping unit area BSA as the origin, the X-coordinate X of the target irradiation area EA at time t is expressed by the mathematical formula "X = A × sin(2π × f × t + α)" and the Y-coordinate Y of the target irradiation area EA at time t is expressed by the mathematical formula "Y = A × cos(2π × f × t + α)." In the above formula, "f" indicates the number of times the target irradiation area EA moves back and forth (i.e., frequency), "A" indicates amplitude equivalent to half the amount of reciprocating movement of the target irradiation area EA, and "α" indicates a phase amount indicating the initial position of the target irradiation area EA in each of the X-axis direction and the Y-axis direction. At least one of f, A, and α may be designated by an operator of the modeling system SYS.

[0093] The recording device 72 may record the scanning direction and scanning position of the processing light EL. In this case, for example, the recording device 72 may record the changes in the wobble shape, scanning direction, and scanning position in association with the current position of the object (which may include the current irradiation position of the processing light EL and position coordinates) or the elapsed time since the start of modeling.

[0094] As another example, as shown in FIG. 11 , which illustrates the movement trajectory MT0 of the printing unit area BSA on the printing surface MS, the control device 8 moves at least one of the machining head 21 and the stage 31 so that the movement trajectory MT0 of the printing unit area BSA on the printing surface MS is a curved movement trajectory along the printing surface MS. In this case, similarly, the galvanometer mirror 2112 may be controlled so that the target irradiation area EA within the printing unit area BSA moves at least along a direction intersecting the movement direction of the printing unit area BSA. Alternatively, the target irradiation area EA may move along a waveform-shaped movement trajectory MT that oscillates around the movement trajectory MT0. The movement trajectory MT0 may be a tool path created by slicing software. The amplitude, frequency, pattern, and other parameters of the movement trajectory MT shown in FIG. 11 may be input by the operator. These parameters may also be determined automatically based on the printing width information input by the operator.

[0095] The moving center MTC1 of the target irradiation area EA may mean the center of amplitude of the wave-shaped moving locus MT of the target irradiation area EA on the printing surface MS. In other words, the moving center MTC1 of the target irradiation area EA may mean the center of vibration when the moving locus MT of the target irradiation area EA on the printing surface MS is assumed to be a vibration.

[0096] When the moving center MTC1 moves outward from the moving center MTC0, the control device 8 may shorten the period of the movement locus of the processing light EL corresponding to the moving center MTC1 that moves outward from the moving center MTC0, compared to when the moving center MTC1 coincides with the moving center MTC0. That is, the control device 8 may shorten the period of the movement locus MT of the target irradiation area EA that corresponds to the moving center MTC1 that moves outward from the moving center MTC0. Note that when the processing light EL moves back and forth periodically within the shaping unit area BSA (i.e., when the target irradiation area EA moves back and forth periodically), the period of the movement locus of the processing light EL (i.e., the period of the movement locus MT of the target irradiation area EA) may be considered to be equivalent to the time required for the processing light EL to make one round trip (i.e., the time required for the target irradiation area EA to make one round trip).

[0097] (2-2) Weld Pool Information Acquisition Operation Next, with reference to Figures 7 and 15 to 20, we will explain the weld pool information acquisition operation performed by the machining system SYS during at least a part of the period during which the manufacturing operation is performed. Note that the machining system SYS typically performs the weld pool information acquisition operation in parallel with the above-mentioned manufacturing operation. The weld pool information acquisition operation is broadly divided into an imaging operation and an image processing operation that processes the captured workpiece image IW. These operations will be explained in order below.

[0098] (2-2-1) Imaging Operation The measurement device 71 includes an imaging head 80 (see FIG. 1). The imaging head 80 is disposed at a position away from the optical path of the processing light EL irradiated from the processing head 21 (particularly, the irradiation optical system 211) to the workpiece W. As a result, even when the imaging head 80 is attached to the processing head 21, the imaging head 80 does not block the processing light EL. In other words, even when the imaging head 80 is attached to the processing head 21, the processing light EL is appropriately irradiated to the workpiece W. Furthermore, the imaging head 80 is disposed at a position away from the supply path of the shaping material M supplied from the processing head 21 (particularly, the material nozzle 212) to the workpiece W. As a result, even when the imaging head 80 is attached to the processing head 21, the imaging head 80 does not block the shaping material M. In other words, even when the imaging head 80 is attached to the processing head 21, the shaping material M is appropriately supplied to the workpiece W. The imaging head 80 may be attached to the processing head 21 at any position. The optical path of the imaging head 80 (measuring device 71) may partially overlap with the optical path of the processing light EL, and may partially overlap with the supply path of the modeling material M.

[0099] In this embodiment, the state in which "the imaging head 80 is attached to the machining head 21" may include a state in which "the imaging head 80 is aligned with respect to the machining head 21 so that the imaging head 80 comes into physical contact with the machining head 21". The state in which "the imaging head 80 is attached to the machining head 21" may include a state in which "the imaging head 80 is aligned with respect to the machining head 21 so that the imaging head 80 does not come into physical contact with the machining head 21". The same applies to a state in which "the control device 8 is attached to the machining system SYS".

[0100] The imaging head 80 is used to capture an image of the molten pool MP formed on the workpiece W. Here, when the imaging head 80 is attached to the machining head 21 as described above, the imaging head 80 and the machining head 21 may be aligned so that the imaging range of the imaging head 80 includes at least a portion of the workpiece W (particularly, at least a portion of the molten pool MP formed on the workpiece W) while the imaging head 80 is attached to the machining head 21. In this case, because the imaging head 80 moves together with the machining head 21, even if the head drive system 22 moves the machining head 21, the imaging range of the imaging head 80 includes at least a portion of the molten pool MP formed on the workpiece W. In other words, the imaging range of the imaging head 80 can essentially track at least a portion of the molten pool MP that the imaging head 80 is to capture. In order to capture an image of at least a portion of the molten pool MP, the imaging head 80 may be provided with a separate imaging device, a mirror, a housing, etc. Note that the imaging range may include a manufacturing shot area, a manufacturing unit area BSA, etc.

[0101] The imaging head 80 is a camera capable of capturing an image of the molten pool MP. Specifically, the imaging head 80 is equipped with an imaging element that receives light from at least a portion of the molten pool MP. In the following description, light from at least a portion of the workpiece W is referred to as "workpiece light WL." The imaging head 80 captures an image of at least a portion of the workpiece W (in particular, at least a portion of the molten pool MP) by receiving (i.e., detecting) the workpiece light WL using the imaging element. As a result, the measuring device 71 generates a workpiece image WI that captures the molten pool MP.

[0102] The imaging head 80 captures an image of at least a portion of the workpiece W (particularly, at least a portion of the molten pool MP). Therefore, as shown in FIG. 7 , which shows an example of the workpiece image WI, at least a portion of the workpiece W (particularly, at least a portion of the molten pool MP) is reflected in the workpiece image WI. Here, the intensity of the workpiece light WL from the portion of the workpiece W where the molten pool MP is formed is typically higher than the intensity of the workpiece light WL from the portion of the workpiece W where the molten pool MP is not formed. Therefore, differences in the intensity of the workpiece light WL appear, for example, as differences in brightness (typically, differences in gradation) on the workpiece image WI. Therefore, the control device 8 can relatively easily identify the portion of the workpiece image WI where the molten pool MP is reflected (molten pool MPI on the image) based on the brightness (gradation) of the workpiece image WI.

[0103] For example, the control device 8 may identify an image portion of the workpiece image WI whose brightness is higher than a predetermined threshold as a portion of the workpiece image WI in which the molten pool MP is reflected. The control device 8 then calculates information regarding the size of the molten pool MP based on the image size (e.g., the number of pixels) of the portion of the workpiece image WI in which the molten pool MP is reflected. Note that the size of the molten pool MP actually formed on the workpiece may not necessarily be the same as the measurement results. In this case, appropriate corrections may be made to ensure consistency between the measurement results (i.e., the molten pool MPI on the image) and the actual molten pool MP.

[0104] The size of the molten pool MP may be determined by the number of pixels constituting the workpiece image WI (or a value determined according to the number of pixels (e.g., a value proportional to the number of pixels), the same applies below). For example, as described above, if the size of the molten pool MP along a predetermined direction is used as information regarding the size of the molten pool MP, the number of pixels (number of pixels) in the workpiece image WI whose brightness is higher than a predetermined threshold and that are aligned along the predetermined direction may be used as information regarding the size of the molten pool MP. As described above, if the area of ​​the molten pool MP is used as the size of the molten pool MP, the number of pixels in the workpiece image WI whose brightness is higher than a predetermined threshold may be used as information regarding the size of the molten pool MP. Note that if the workpiece image WI is a color image, information regarding the size of the molten pool MP may be measured using differences in color. Furthermore, if the workpiece image WI is a color temperature image, information regarding the size of the molten pool MP may be measured using differences in color temperature.

[0105] As described above, the workpiece W is irradiated with the processing light EL. Therefore, there is a possibility that the processing light EL (e.g., the processing light EL reflected by the workpiece W) passing through the workpiece W may be incident on the imaging element of the imaging head 80. Here, the intensity of the processing light EL is set to an intensity capable of melting the workpiece W. Therefore, if the processing light EL passing through the workpiece W were to be incident on the imaging element of the imaging head 80, the imaging element may be damaged due to the processing light EL. For this reason, the imaging head 80 may be configured to prevent the processing light EL from the workpiece W from being incident on the imaging element. For example, the imaging head 80 may be equipped with an optical element that prevents the processing light EL from the workpiece W from being incident on the imaging element. An example of such an optical element is a filter that has a relatively low transmittance for the processing light EL but a relatively high transmittance for the workpiece light WL. An example of such an optical element is a filter that has a relatively high absorptance for the processing light EL but a relatively low absorptance for the workpiece light WL.

[0106] The imaging head 80 may further include a cooling device for cooling the imaging head 80, a removal mechanism for preventing and removing adhesion of unnecessary substances, and the like.

[0107] The control device 8 controls the operation of the machining system SYS based on the workpiece image WI generated by the measuring device 71. For example, the control device 8 may generate characteristic information regarding the characteristics of the molten pool MP based on the workpiece image WI, and control the operation of the machining system SYS based on the characteristic information. In this case, the control device 8 may function as a characteristic information generating device capable of generating characteristic information.

[0108] Specifically, the control device 8 may measure the size of the molten pool MP reflected in the workpiece image WI and control the operation of the machining system SYS based on the measurement result and the target size of the molten pool MP formed by the machining system SYS. In this case, the measured size of the molten pool MP may be set as the target size. Alternatively, the target size of the molten pool MP may be set based on the deflection conditions of the galvanometer mirror 2112, which are the conditions for deflecting the processing light EL. The target size of the molten pool MP may be changed each time the deflection conditions change. Thereafter, the control device 8 may set the target intensity of the processing light EL generated by the light source 4 based on the set size of the molten pool MP. In this case, the control device 8 may set other than the target intensity of the processing light EL generated by the light source 4.

[0109] For example, if the calculated size of the molten pool MP is smaller than the target size (i.e., the size of the molten pool MP already recorded in the recording device 72), the control device 8 may set a new target intensity of the processing light EL that is greater than the target intensity. In this case, the intensity of the processing light EL irradiated onto the workpiece W is greater than before the new target intensity was set, and therefore the amount of melted forming material M increases. As a result, the measured size of the molten pool MP becomes larger, approaching the target size, compared to before the new target intensity was set.

[0110] For example, if the calculated size of the molten pool MP is larger than the target size, the control device 8 may set a new target intensity that is smaller than the reference value of the target intensity. In this case, the intensity of the processing light EL irradiated onto the workpiece W is smaller than before the new target intensity was set, and therefore the amount of melted molding material M is reduced. As a result, the size of the molten pool MP becomes smaller and closer to the target size than before the new target intensity was set.

[0111] For example, if the calculated size of the molten pool MP matches the target size, the target intensity may be maintained at the reference value. In other words, the control device 8 may continue to set the reference value of the target intensity to the target intensity. In this case, the intensity of the processing light EL irradiated onto the workpiece W is maintained, so the amount of melted molding material M does not change. As a result, the size of the molten pool MP, which matched the target size, is maintained.

[0112] The control device 8 may change the target size of the weld pool MP based on information about the target size of the weld pool MP associated with the deflection conditions of the processing light EL by the galvanometer mirror 2112, which is recorded in the recording device 72. The control device 8 may also record the target size of the weld pool MP corresponding to each wobble shape of the processing light EL by the galvanometer mirror 2112, which is recorded in the recording device 72. In this case, the target size of the weld pool MP may be changed in response to changes in the wobble shape. The control device 8 may also record the target size of the weld pool MP corresponding to each scanning direction or scanning position of the processing light EL, which is recorded in the recording device 72. In this case, the target size of the weld pool MP may be changed in response to changes in the scanning direction or scanning position of the processing light EL.

[0113] The control device 8 may refer to the information recorded in the recording device 72 (including information on the size of the molten pool MP, polarization information of the processing light EL, position information, etc.) and determine the amount of change in at least one of the wobble shape of the processing light EL, the scanning direction of the processing light EL, and the scanning position of the processing light EL based on the information recorded in the recording device 72 and the processing information of the object being formed. Determining the amount of change includes calculating the difference between the information recorded in the recording device 72 and the processing information of the object being formed, and comparing the magnitude of the calculated difference with a threshold. The threshold may be set in advance by the user or may be automatically generated based on, for example, a machine learning model. The control device 8 may update the target size of the molten pool MP if the amount of change exceeds the threshold. In this case, the control device 8 may automatically determine the amount of change in at least one of the wobble shape of the processing light EL, the scanning direction of the processing light EL, and the scanning position of the processing light EL. In other words, the control device 8 may automatically determine the amount of change in at least one of the wobble shape of the processing light EL, the scanning direction of the processing light EL, and the scanning position of the processing light EL based on the information recorded in the recording device 72 and the processing information of the object being formed, and update the target size of the molten pool MP based on the determined amount of change.

[0114] (2-2-2) Image Processing Operation The image processing operation of the workpiece image WI captured by the imaging head 80 to measure the size of the molten pool MP will be described in detail. As shown in FIG. 7 , which shows an example of the workpiece image WI, the captured workpiece image WI captures not only the molten pool MP, which is the image target, but also multiple spatters SP generated by the switching operation of the galvanometer mirror 2112. These spatters SP are observed when the laser is irradiated onto flying powder before it reaches the molten pool MP, causing the flying powder to melt and emit light, or when molten metal splashes off the molten pool MP and forms in a location other than the build surface. For example, when the powder or laser is irradiated downward in the Z direction, spatters SP are observed above the molten pool MP in the Z direction. The shapes of the molten pool MP and spatters SP change depending on the processing conditions. Because spatter SP information is not necessary to measure the size of the molten pool MP, the control device 8 performs image processing to detect only the molten pool MP from the captured workpiece image WI. In this embodiment, image processing is performed by adding together multiple workpiece images WI captured at different times (i.e., different shutter frames of the camera) and determining the portion displayed with a brightness higher than a predetermined threshold as the molten pool MP. Specifically, in the example shown in FIG. 15 , four workpiece images WI (Frames 1 to 4) captured consecutively under the same or similar machining conditions (layers of the object, characteristics of the machining light EL, scanning direction, etc.) may be added together. In this case, Frames 1 to 4 may be consecutive frames captured within a very short time, or workpiece images WI in non-consecutive frames may be used. The number of workpiece images WI to be added together is not limited to four. The brightness of the added image (Frame Sum in FIG. 15 ) may then be measured, and the area where the image brightness is equal to or higher than a predetermined threshold may be determined to be the molten pool MP. The control device 8 may measure the size of the molten pool MP by counting the number of pixels in the high-brightness area, i.e., the area determined to be the molten pool MP in the added image.

[0115] Note that "adding" may mean adding signal values ​​at the same position in different frames. Furthermore, "adding" may also mean "averaging." In this case, the pixel values ​​of each frame may be divided by the number of frames (rounded up or rounded down as appropriate) and added together, or the pixel values ​​of each frame may be added and then divided by the number of frames (rounded up or rounded down as appropriate). In the case of 10 frames, 1 / 10 of the pixel values ​​may be added, or the values ​​may be added and then divided by 10. The molten pool MP may also be calculated using a moving average. For example, when adding 10 frames, rather than adding frames 1 to 10 in the first frame and then adding frames 11 to 20 in the second frame, the frames may be buffered sequentially and added together so that the first frame contains frames 1 to 10, the second frame contains frames 2 to 11, and the third frame contains frames 3 to 12.

[0116] 16, which is an explanatory diagram showing an example of a method for detecting a molten pool MP (MPI) from a workpiece image WI, addition may be performed so that the frame rate does not change. For example, when adding 10 frames at 60 fps, the first data (see the upper row of FIG. 16) may be the sum of frames 1 to 10, the second data (see the middle row of FIG. 16) may be the sum of frames 2 to 11, the third data (see the lower row of FIG. 16) may be the sum of frames 3 to 12, and so on. In this case, the interval between the first and second data is 1 / 60 seconds, and the interval between the second and third data is also 1 / 60 seconds, so the frame rate does not change.

[0117] Furthermore, as an image processing method for detecting only the molten pool MP from the captured workpiece image WI, image processing may be performed to detect only the molten pool MP, for example, by performing a process to remove spatter SP from the captured workpiece image WI.

[0118] Furthermore, information that was removed in the image processing method described above (information about spatter SP in the additive image) may be effectively utilized to achieve more precise processing control. Figures 17(a) to 17(c) show an image processing method in which multiple integration thresholds (i.e., brightness thresholds for image addition) for the additive image (Frame Sum in Figure 15) are set in this embodiment in which the wobble shape is wave-shaped. In each of Figures 17(a) to 17(c), the horizontal axis of the graph represents the gray level of the image. The gray level decreases (approaching black) toward the left and increases (approaching white) toward the right. The vertical axis represents the number of pixels at the corresponding gray level. Figure 17(a) shows the relationship between the gray level and the number of pixels before building, Figure 17(b) shows the relationship between the gray level and the number of pixels during building, and Figure 17(c) shows the relationship between the gray level and the number of pixels after offsetting the integration threshold for the molten pool MP. First, as shown in (a) of FIG. 17 , an integrated threshold 81 of the molten pool when the wobble shape is a wave shape may be set in advance. In this case, image processing (feedback processing) may be performed so that the peak PK1 of the pixel count during modeling matches the set integrated threshold 81. At this time, a range of integrated thresholds within which modeling is possible (hereinafter, referred to as a printable range 82) may be set on both sides of the integrated threshold 81. In this embodiment, the printable range 82 is set on both sides of the integrated threshold 81. However, the printable range 82 may be set only on one side of the integrated threshold 81. The size of the printable range 82 may differ between one side of the integrated threshold 81 and the other side.

[0119] When the fabrication starts, as shown in FIG. 17(b), a second peak PK2 appears in the region with a gray level lower than the integrated threshold 81 due to an increase in spatter SP. This indicates that, when fabricating under the processing conditions shown in FIG. 17(b), the intensity of the processing light EL becomes so high that spatter occurs. Therefore, in this case, as shown in FIG. 17(c), a new offset integrated threshold 84 may be set on the lower gray level side of the initially set integrated threshold 81 and within the buildable range 82. In this case, peak PK1 shifts overall to the lower gray level side in accordance with the new offset integrated threshold 84. This reduces the influence of spatter SP and makes it possible to detect only the molten pool MP. Note that in this case, information about the occurrence of spatter SP may be fed back into the processing conditions. For example, the control device 8 may change the processing conditions to reduce the occurrence of spatter SP.

[0120] As another example, (d) to (f) of FIG. 17 show an image processing method when the wobble shape is circular. The basic image processing method is the same as the image processing when the wobble shape is wave-shaped, as shown in (a) to (c) of FIG. 17. (d) of FIG. 17 shows the relationship between the gray level and the number of pixels before printing, (e) of FIG. 17 shows the relationship between the gray level and the number of pixels during printing, and (f) of FIG. 17 shows the relationship between the gray level and the number of pixels after offsetting the integrated threshold value of the molten pool MP. As shown in (d) of FIG. 17, in this case, image processing (feedback processing) may be performed so that the peak PK11 coincides with the gray level on the lower side of the integrated threshold value 85 by a predetermined value. In addition, a range of integrated threshold values ​​within which printing is possible (hereinafter referred to as the printable range 86) may be set on both sides of the integrated threshold value 85. The printable range 86 may be set only on the side of the integrated threshold value 85. The size of the modelable range 86 may be different on one side and the other side of the integrated threshold value 85 .

[0121] When modeling begins, as shown in (e) of FIG. 17 , a second peak PK12 appears in the region with a lower gray level than the integrated threshold 85 due to an increase in spatter SP. This indicates that, in modeling under the processing conditions shown in (e) of FIG. 17 , the intensity of the processing light EL is high enough to generate spatter. Therefore, in this case, as shown in (f) of FIG. 17 , a new offset integrated threshold 88 may be set on the lower gray level side of the initially set integrated threshold 85 and within the modelable range 86. In this case, peak PK11 shifts overall to the lower gray level side in accordance with the new offset integrated threshold 88. This reduces the influence of spatter SP, allowing only the molten pool MP to be detected.

[0122] Furthermore, processing for speeding up image processing may also be performed. The control device 8 may control processing (shaping) by the processing system SYS based on the measurement results by the measuring device 71, and may change the measurement target area 100 of the molten pool MP by the measuring device 71 based on deflection conditions that are conditions for deflecting the processing light EL. The control device 8 may measure the size of the molten pool MP based on image information of the molten pool MP located within the measurement target area 100.

[0123] 18(a) and 18(b) show workpiece images in the prior art. In FIGS. 18(a) and 18(b), an example is described in which the molten pool MP is imaged obliquely relative to the object. Specifically, if the printing direction is a first direction, the imaging head 80 (camera) may image the molten pool MP along a second direction opposite the first direction. That is, the molten pool MP may be imaged from an oblique direction opposite the printing direction. FIG. 18(a) shows a workpiece image IW at the center (a portion midway along a straight line) of a series of machining paths along the first direction, while FIG. 18(b) shows a workpiece image IW at a corner (the end of a straight line) of a series of machining paths along the first direction. When imaging from an oblique direction like this, the size and shape of the molten pool MP imaged vary depending on the printing position. Specifically, in the center portion shown in FIG. 18(a), the lower part of the processing light EL is covered by the lower printed layer, so the molten pool MP appears relatively small in size. On the other hand, at the corner shown in Figure 18(b), the size of the molten pool MP is captured larger than that of the central part because the corner is open downward. In other words, the depth direction of the molten pool MP affects the measured size of the molten pool MP (number of pixels).

[0124] Therefore, in this embodiment, as shown in (c) and (d) of FIG. 18 , a measurement target area 100 may be set in a portion of the workpiece image IW. The measurement target area 100 may be set by, for example, detecting the upper, lower, left, and right edges of the molten pool MP by performing binarization processing on an image captured at the center of the build direction as shown in (c) of FIG. 18 . Specifically, a first line extending horizontally on the workpiece image IW may be set based on the point corresponding to the upper edge of the detected molten pool MP. Similarly, a second line extending horizontally on the workpiece image IW may be set based on the point corresponding to the lower edge of the molten pool MP, a third line extending vertically on the workpiece image IW based on the point corresponding to the left edge of the molten pool MP, and a fourth line extending vertically on the workpiece image IW based on the point corresponding to the right edge of the molten pool MP, thereby setting a rectangular measurement target area 100. The shape of the measurement target area 100 is not limited to a rectangle, but may be set to any shape such as an oval or a diamond.

[0125] The measurement target area 100 may be set to be slightly larger than the molten pool MP. For example, after detecting the top, bottom, left, and right edges of the molten pool MP using the binarization process described above, the center position of the measurement target area 100 may be determined. The measurement target area 100 may be expanded around the center position of the measurement target area 100 while maintaining the aspect ratio of the length and width.

[0126] The control device 8 may measure only the molten pool MP located inside the measurement target area 100 in the workpiece image IW. In other words, information on the image of the workpiece image IW located outside the measurement target area 100 may not be used for measurement. This may eliminate spatter SP and the like outside the measurement target area 100. The control device 8 may measure the size of the molten pool MP during construction by counting the number of pixels in the molten pool MP located within the measurement target area 100. Furthermore, the control device 8 may apply the measurement target area 100 set in the center to the corner. That is, as shown in (d) of FIG. 18 , in the workpiece image IW capturing an image of a corner, only the molten pool MP located within the measurement target area 100 may be measured. In this case, there is a possibility that part of the captured molten pool MP (strictly speaking, the area in the additive image that exceeds a predetermined brightness threshold) may fall outside the measurement target area 100. The control device 8 may determine that the area located within the measurement target area 100 and that exceeds a predetermined brightness threshold in the additive image is the molten value MP. For example, as shown in (d) of Figure 18, by detecting the boundary between the area where the brightness exceeds a predetermined threshold and the area where the brightness does not exceed the threshold within the measurement target area 100, the upper, left, and right edges of the molten pool MP are detected, but if the lower edge of the molten pool MP is not detected (located below the measurement target area 100), a horizontal line (second line) below the measurement target area 100 may be determined to be the lower edge of the molten pool MP. In this case, the vertical size of the melt value in the workpiece image IW may coincide with the distance between the detected upper edge of the molten pool MP and the second line of the measurement target area 100. As another example, the upper, lower, left, and right edges of the molten pool MP (or the outer edge shape of the molten pool MP) may be detected by comparing them with the brightness threshold, and then the size of the molten pool MP may be measured by updating the portions outside the measurement target area 100 to coincide with the outer edge of the measurement target area 100.

[0127] The control device 8 may set the measurement target area 100 or update the measurement target area 100 each time the machining conditions change. The control device 8 may change the measurement target area 100 of the molten pool MP based on information related to the measurement target area 100 of the molten pool MP associated with the deflection conditions recorded in the recording device 72. In this case, the deflection conditions may include the wobble shape of the processing light EL. In this case, the control device 8 may set the measurement target area 100 for each wobble shape of the processing light EL. The control device 8 may set a corresponding measurement target area 100 for each scanning direction of the processing light EL. The control device 8 may set a corresponding measurement target area 100 for each scanning position of the processing light EL. The control device 8 may determine the amount of change in at least one of the wobble shape of the processing light EL, the scanning direction of the processing light EL, and the scanning position of the processing light EL based on the machining information of the object BO, and update the setting of the measurement target area 100 if the determined amount of change exceeds a predetermined threshold. In this case, the control device 8 may automatically determine the amount of change in at least one of the wobble shape of the processing light EL, the scanning direction of the processing light EL, and the scanning position of the processing light EL. When performing automatic determination, the amount of change may be automatically determined from the workpiece image IW based on a machine-learned learning model. The user may manually set the measurement target area 100 based on the measurement results of the measuring device 71. Changing the measurement target area 100 of the molten pool MP by the measuring device 71 may also include changing the measurement target area 100 for image processing related to the molten pool MP. In other words, the area for image processing when performing other image processing (e.g., spatter removal) or feedback, as well as when measuring the size of the molten pool MP, may be limited to the measurement target area 100.

[0128] The size of the molten pool MP to be measured may be the larger of the size of the molten pool MP along a predetermined direction (e.g., any one of the X-axis direction, Y-axis direction, and Z-axis direction) and the size of the molten pool MP in a direction intersecting (typically perpendicular) the predetermined direction. The size of the molten pool MP may be the smaller of the size of the molten pool MP along the predetermined direction and the size of the molten pool MP in a direction intersecting (typically perpendicular) the predetermined direction. The size of the molten pool MP may be the average of the size of the molten pool MP along the predetermined direction and the size of the molten pool MP in a direction intersecting (typically perpendicular) the predetermined direction. The area of ​​the molten pool MP may be used as the size of the molten pool MP.

[0129] (2-3) Processing Light Control Operation Next, with reference to FIGS. 19 and 20 , the processing light control operation performed by the processing system SYS during at least a portion of the period during which the manufacturing operation is performed will be described. FIG. 19 is an enlarged view showing the M and N layers of one object BO. FIG. 20 is an enlarged view showing the M and N layers of the first object BO1 and the M#2 and N#2 layers of the second object BO2. The processing system SYS typically performs the processing light control operation in parallel with the above-described manufacturing operation. In this embodiment, as an example, the control device 8 calculates information about the size of the molten pool MP based on the workpiece image WI (i.e., generates characteristic information about the size of the molten pool MP), records the calculated information about the size of the molten pool MP in a recording device, and controls the operation of the processing system SYS to satisfy the condition that the size of the molten pool MP formed by irradiation with the processing light EL matches the size of the molten pool read from the recording device (i.e., the size of the molten pool MP matches the target size). However, the control device 8 may control any device of the processing system SYS (for example, at least one of the material supply device 1, the processing device 2, the stage device, and the gas supply device 5) based on the workpiece image WI so as to satisfy any condition.

[0130] The control device 8 first sets the target size of the weld pool MP. This is because, as described above, the processing light control operation is an operation for controlling the processing light EL so that the size of the weld pool MP formed on the workpiece W matches the target size. Here, the "target size" in this embodiment refers to the predetermined size of the weld pool MP recorded in the recording device 72. Therefore, "setting the target size of the weld pool MP" can be rephrased as follows: The control device 8 first reads information related to the size of the weld pool MP recorded in the recording device 72. The processing light control operation is an operation for controlling the processing light EL so that the size of the weld pool MP formed on the workpiece W matches the size of the weld pool MP read from the recording device 72.

[0131] As an example, the details of the processing light control operation will be described with reference to FIG. 19 , which is an enlarged view showing the Mth and Nth layers of one object BO. In FIG. 19 , the vertical direction is the Z direction, which is the stacking direction, the horizontal direction is the X direction, and the direction perpendicular to the Z and X directions is the Y direction. First, the recording device 72 records information about the size of the molten pool MP during the formation of the Mth layer (M is a natural number > 0) of one object BO. As shown in FIG. 10 , the information about the size of the molten pool MP during the formation of the Mth layer may include information about the position of the molten pool MP, information about the characteristics of the processing light EL (including the scanning direction, scanning position, scanning speed, light intensity, etc.), and information about the size of the molten pool MP. The information about the position of the molten pool MP may include either position information or time information. In other words, the recording device 72 may record information about a predetermined position coordinate or information about the size of the molten pool MP at a predetermined time as reference information. For example, in the example shown in FIG. 10 , information associating the size MPS1 of the molten pool MP in a specific first machining pass that forms a straight line in the waveform-like wobble shape with the position coordinates (X1, Y1, Z1) at which the size MPS1 of the molten pool MP was measured is recorded as the reference information. In this case, instead of the position coordinates (X1, Y1, Z1), the time T1 at which the size MPS1 of the molten pool MP was measured (e.g., the time from the start of manufacturing) may be recorded in association with the size MPS1 of the molten pool MP. Furthermore, the recording device 72 may record, as the reference information, information associating the size MPS2 of the molten pool MP in a second machining pass that has at least different manufacturing conditions from the first machining pass described above with the position coordinates (X2, Y2, Z2) at which the size MPS2 of the molten pool MP was measured. In this case, instead of the position coordinates (X2, Y2, Z2), the time T2 at which the size MPS2 of the molten pool MP was measured (e.g., the time from the start of manufacturing) may be recorded in association with the size MPS2 of the molten pool MP. In this way, the recording device 72 records information about the size of the molten pool MP during the formation of the Mth layer of one object BO in association with at least one of the position coordinates and time. Note that the recording device 72 may update the reference information every time the scanning direction of the processing light EL changes. The recording device 72 may update the reference information every time the deflection conditions of the processing light EL change.The recording device 72 may also update the reference information when at least one of the following conditions is met: when the current modeling position has changed from a predetermined position coordinate by more than a threshold value; or when the current modeling time has changed from a predetermined time by more than a threshold value.

[0132] Returning to FIG. 19 , the control device 8 next controls the formation of the molten pool MP by the machining system SYS in the Nth layer (N is a natural number and N>M) of the same object BO based on information about the size of the molten pool MP in the Mth layer. The shape of the Nth layer may be, for example, the same as the shape of the Mth layer. The control device 8 may control the molding of the Nth layer so as to reproduce the size of the molten pool MP in the Mth layer, whose X and Y coordinates are the same. In other words, the control device 8 controls the machining by the machining system SYS under a coordinate system defined by a first axis (the X axis in this embodiment), a second axis (the Y axis in this embodiment), and a third axis (the Z axis in this embodiment) that are orthogonal to each other. When machining an upper layer, the control device 8 may use reference information from at least a reference layer that was machined before the upper layer and serves as a reference for machining. The reference layer may have a different coordinate position in the third axis direction from the reference layer, but may be at the same coordinate position as the reference layer in the first and second axis directions. In this case, the Mth layer may be set as the reference layer, and information including the size of the molten pool MP in the Mth layer may be recorded as reference information. The control device 8 controls the processing of other layers based on the reference information so as to reproduce the size of the molten pool MP in the reference layer. The reference layer may be multiple layers, such as the Mth layer, the Oth layer, and the Pth layer, and multiple pieces of reference information may be recorded in association with the layer numbers of multiple layers. For example, when building the Nth layer, the operator may decide which of the Mth, Oth, and Pth layer's reference information to use, or this may be decided automatically. The Nth layer may be built using multiple pieces of information (for example, on average).

[0133] The reference layer may be a layer predetermined by the user. For example, the reference layer may be the first layer of the object BO. That is, M may be 1. The control device may use reference information on the reference layer to control processing on layers above the reference layer. The Nth layer may be any layer above the Mth layer, and may be, for example, two or more layers away from the Mth layer.

[0134] Another example will be described with reference to FIG. 20 , which is an enlarged view showing the M and N layers of the first object (first object) BO1 and the M#2 and N#2 layers of the second object (second object) BO2, which is different from the first object BO1. In this case, the recording device 72 may record information regarding the size of the molten pool MP in the Mth layer of the first object BO1 as reference information. In this case, the Mth layer of the first object BO1 serves as the reference layer. The control device 8 may control the formation of the molten pool MP by the machining system SYS in the Mth layer of the second object BO2, which is different from the first object BO1, based on the information regarding the size of the molten pool MP in the Mth layer of the first object BO1. The shape of the first object BO1 and the shape of the second object BO2 may be the same. The control device 8 may control the formation of the M#2 layer so as to reproduce the size of the molten pool MP in the Mth layer, which is the same time from the start of manufacturing. Similarly, the control device 8 may control the fabrication of the N#2 layer so as to reproduce the size of the molten pool MP in the Nth layer, which has the same time from the start of fabrication. The control device 8 controls the processing of the M#2 layer of the second object BO2 so as to reproduce the size of the molten pool MP in the reference layer, based on the reference information, which is the information in the Mth layer of the first object BO1. The same applies to the relationship between the Nth layer and the N#2 layer. Two or more copies may be created using the same reference information. Note that when creating object 1, object 2, object 3, ..., object N, objects 2 to N may be fabricated using the reference information recorded for object 1. In this case, information about the molten pools of objects 2 to N does not need to be recorded.

[0135] In the processing light control operation, the control device 8 may calculate the deviation between the set target size (the size of the molten pool MP recorded in the recording device 72) and the actually measured size of the molten pool MP. The control device 8 may then control the intensity of the processing light EL based on the calculated deviation. As described above, the control device 8 controls the intensity of the processing light EL so that the actually measured size of the molten pool MP matches the target size. Therefore, the control device 8 may control the intensity of the processing light EL so that the deviation becomes zero (approaches zero). At this time, the control device 8 may control the intensity of the processing light EL so that the deviation is within an allowable range.

[0136] As an example, if the measured size of the molten pool MP is larger than the target size, the measured size of the molten pool MP needs to be reduced to match the target size. Here, the smaller the intensity of the processing light EL, the smaller the amount of energy transferred from the processing light EL to the printing surface MS. The smaller the amount of energy transferred from the processing light EL to the printing surface MS, the smaller the amount of molding material M melted on the printing surface MS. The smaller the amount of molding material M melted on the printing surface MS, the smaller the size of the molten pool MP formed on the printing surface MS. Therefore, if the measured size of the molten pool MP is larger than the target size, the intensity of the processing light EL may be controlled so that the intensity of the processing light EL is weakened by an amount based on the deviation.

[0137] As another example, if the measured size of the molten pool MP is smaller than the target size, the measured size of the molten pool MP needs to be increased to match the target size. Here, the greater the intensity of the processing light EL, the greater the amount of energy transferred from the processing light EL to the printing surface MS. The greater the amount of energy transferred from the processing light EL to the printing surface MS, the greater the amount of printing material M melted on the printing surface MS. The greater the amount of printing material M melted on the printing surface MS, the larger the size of the molten pool MP formed on the printing surface MS. Therefore, if the measured size of the molten pool MP is smaller than the target size, the intensity of the processing light EL may be controlled so that the intensity is increased by an amount based on the deviation.

[0138] The operation of controlling the intensity of the processing light EL based on the deviation may be considered to be an operation of feedback-controlling the intensity of the processing light EL based on the deviation, because the operation of controlling the intensity of the processing light EL based on the deviation is an operation of controlling the intensity of the processing light EL, which affects the size of the molten pool MP, so that the actually measured size of the molten pool MP calculated from the measurement results of the measuring device 71 matches (i.e., approaches) the target size.

[0139] When the intensity of the processing light EL is feedback-controlled, the control device 8 may perform feedback control including P control (Proportional control). The control device 8 may perform feedback control including PI control (Proportional Integral control). The control device 8 may perform feedback control including PID control (Proportional Integral Differential control). When feedback control including P control is performed, the behavior of the feedback control is determined by the proportional gain Kp. When feedback control including PI control is performed, the behavior of the feedback control is determined by the proportional gain Kp and the integral gain Ki. When feedback control including PID control is performed, the behavior of the feedback control is determined by the proportional gain Kp, the integral gain Ki, and the differential gain Kd.

[0140] The proportional gain Kp, the integral gain Ki, and the derivative gain Kd are each an example of a control parameter K that defines the behavior of the processing light control operation. Therefore, at least one of the proportional gain Kp, the integral gain Ki, and the derivative gain Kd may be generated in advance before the light intensity control operation is performed. Therefore, the control device 8 may perform the processing light control operation using a control parameter K (e.g., at least one of the proportional gain Kp, the integral gain Ki, and the derivative gain Kd) that has been generated in advance before the light intensity control operation is performed.

[0141] The control device 8 may control the intensity of the processing light EL by controlling the light source 4. Alternatively, if the irradiation optical system 211 of the processing head 21 is equipped with an optical element that can control the intensity of the processing light EL, the control device 8 may control the intensity of the processing light EL by controlling the irradiation optical system 211 in addition to or instead of the light source 4.

[0142] Note that the control device 8 may control the irradiation time of the processing light EL instead of or in addition to controlling the intensity of the processing light EL. As an example, if the processing light EL is pulsed light, the control device 8 may change the amount of energy transmitted to a predetermined point on the printing surface MS by controlling the time interval between the pulsed light or the emission time of each pulsed light. Also, the amount of energy transmitted to a predetermined point on the printing surface MS may be changed by controlling the speed of the scanning operation (e.g., the movement speed of the target irradiation area EA due to the scanning operation).

[0143] Next, feedback in the line width direction of the molten pool MP will be described with reference to FIGS. 21 and 22 . While FIG. 21 illustrates an example of observing the XY plane, the present invention is not limited to this. It may also be the result of observing the XZ plane, or the result of observing these planes obliquely. Here, if feedback control is performed by observing only the size of the molten pool MP, uniform feedback can only be performed even if the center position is shifted if the molten pool MP is within the angle of view of the workpiece image IW. To solve this problem, the control device 8 may record information about the molten pool position. For example, the control device 8 may record the positions of both ends (hereinafter, left and right ends) of the measured molten pool MP in the line width direction on a reference layer, and perform feedback control so that the center position and left and right width of the molten pool MP on layers subsequent to the reference layer are consistent. Specifically, the measurement device 71 may acquire center position information regarding the center position of the region formed by the molten pool MP formed at different positions by the processing light EL deflected by the galvanometer mirror 2112 as a deflection optical system. Furthermore, the control device 8 may control shaping by the processing system SYS based on the center position information read from the measurement device 71. In this case, the control device 8 may control at least one of the laser intensity and the heat input amount by performing high-speed laser modulation based on the measurement result of the center position of the molten pool MP. The control device 8 may control the orbital speed of the processing light EL by operating the galvanometer mirror 2112 based on the measurement result of the center position of the molten pool MP.

[0144] In this case, the measuring device 71 may measure the center position of the molten pool MP based on the captured image (workpiece image IW), and the control device 8 may control the formation so that the center position of the molten pool MP is located at the center of the workpiece image IW as shown in the right figure of Figure 21, from a state in which both the width and center position of the molten pool MP are shifted as shown in the left figure of Figure 21, and the center position of the molten pool MP in the width direction also coincides with the center of the workpiece image IW.

[0145] Furthermore, the control device 8 may control the shaping operation in the machining system SYS so as to approximate a pre-set or stored ideal shape 90 of the molten pool MP. For example, a device capable of measuring three-dimensional shapes, such as a 3D scanner, may be connected to the control device 8 (or the recording device 72 capable of communicating with the control device 8), and the ideal shape 90 of the molten pool MP shown in FIG. 22 may be pre-set based on the measurement results. In the example shown in FIG. 22, the ideal shape 90 is recorded as a cube, but the shape of the ideal shape 90 is not limited to a cube. The ideal shape 90 may be a shape that is bilaterally symmetrical in the width direction of the molten pool MP. Multiple ideal shapes 90 may be recorded in the recording device 72. The control device 8 may automatically select an optimal ideal shape 90 from the multiple recorded ideal shapes based on a machine-learned learning model. The ideal shape may also be manually selected by a user based on, for example, machining conditions.

[0146] The control device 8 may control the operation of the galvanometer mirror 2112 so that the shape of the observed molten pool MP does not overlap with the abnormal region 101, which is a region that deviates from the ideal shape 90. In other words, the control device 8 may control the operation of the galvanometer mirror 2112 so that the shape of the observed molten pool MP overlaps with the normal region 102, which is a region that matches the ideal shape 90. In order to bring the molten pool MP closer to the ideal shape 90, the control device 8 may calculate a difference between the shape of the molten pool MP actually measured by the measuring device 71 and the ideal shape 90, and cancel out the difference to control shaping so that the shape of the measured molten pool MP approaches the ideal shape 90. In this case, the optimal ideal shape 90 may be selected from multiple ideal shapes depending on at least one of the wobble shape of the processing light EL, the scanning direction of the processing light EL, the scanning position of the processing light EL, and the measured shape of the molten pool MP.

[0147] In addition to the control of aligning the center position and width of the molten pool MP with the center position of the workpiece image IW, the control device 8 may also control the workpiece image IW to reduce the difference in pixel count between the left and right sides of the aligned center position. The upper part of Figure 23 shows a workpiece image IW in which the difference in pixel count between the left and right sides of the center position is large (i.e., the line width of the molten pool MP is uneven). The lower part of Figure 23 shows a workpiece image IW in which the difference in pixel count between the left and right sides of the center position is uniform (i.e., the line width of the molten pool MP is uniform). As shown in the upper part of Figure 23, when the difference in pixel count between the left and right sides is large, the resulting object BO may have different heights or different roundness (corner R) at the left and right corners of the object BO, which may affect the accuracy of the object BO. Therefore, the control device 8 may control at least one of the laser intensity and the heat input amount based on the measurement results of the shape of the molten pool MP, for example, by performing high-speed laser modulation of the galvanometer mirror 2112. This results in a workpiece image IW with a small difference in the number of pixels between the left and right sides, as shown in the lower part of Fig. 23. By reducing the difference in the number of pixels between the left and right sides in the workpiece image IW, the build height or the roundness (corner R) of the corners of the object BO may be made uniform between the left and right sides. Note that the control device 8 may control the trajectory speed of the processing light EL, for example, by operating the galvanometer mirror 2112, based on the measurement results of the shape of the molten pool MP.

[0148] When the control device 8 determines that the molding operation has ended, the control device 8 ends the processing light control operation described above. After the molding operation has ended, the control device 8 may output a file of information that associates the recorded information about the size of the molten pool MP with information about the position or the molding time. The output file may be used in the next molding to reproduce the previous molding in the next molding.

[0149] (2-4) Control Signal Generation Operation Next, the control signal generation operation will be described. The control device 8 may acquire information regarding the reference value of the target intensity from the control device 8 included in the machining system SYS. The control device 8 may generate a control signal SG1 for controlling the light source 4 so that the intensity of the processing light EL generated by the light source 4 becomes the set target intensity (i.e., the reference value of the target intensity). In this case, the control device 8 may acquire the control signal SG1 as information regarding the reference value of the target intensity. In this case, the control device 8 may be considered to have set the target intensity of the processing light EL based on the workpiece image WI and the control signal SG1. Furthermore, the control device 8 may generate a control signal SG2 for controlling the intensity (i.e., characteristics) of the processing light EL generated by the light source 4 so that the intensity of the processing light EL generated by the light source 4 becomes the controlled target intensity. In this case, the control device 8 may generate the control signal SG2 for controlling the light source 4 based on the size of the molten pool MP measured from the workpiece image IW by the measuring device 71. Specifically, the control device 8 sets a target intensity of the processing light EL generated by the light source 4 based on the measured size of the molten pool MP and a control signal SG1 acquired from the control device 8. The control device 8 then generates a control signal SG2 for controlling the light source 4 so that the intensity of the processing light EL generated by the light source 4 becomes the set target intensity. As a result, the light source 4 is driven based on the control signal SG2 generated by the control device 8 instead of the control signal SG1 generated by the control device 8. In other words, the light source 4 generates processing light EL of the desired intensity so that the size of the molten pool MP matches the target size.

[0150] The control device 8 may not perform the melting value information acquisition operation during at least a portion of the period when the light source 4 is not generating the processing light EL. To determine whether the light source 4 is generating the processing light EL, the control device 8 may acquire a control signal SG1 from the control device 8 and determine whether the light source 4 is generating the processing light EL based on the acquired control signal SG1. Alternatively, the control device 8 may acquire light on / off information from the control device 8 indicating whether the light source 4 is generating the processing light EL and determine whether the light source 4 is generating the processing light EL based on the acquired information. As described above, the light on / off information may be input to the control device 8 using, for example, a signal pin of an input / output connector (not shown).

[0151] (3) Technical Effects of the Machining System SYS of the Present Embodiment As described above, in the present embodiment, the machining system SYS includes a measuring device 71 that acquires information about the size of the molten pool MP and a recording device 72 that records the information about the size of the molten pool MP acquired by the measuring device 71 in association with information about the position of the molten pool MP. By providing the recording device 72 that records the molten pool MP in this manner, the size of the molten pool MP relative to the position coordinates or time on the reference layer can be recorded. Furthermore, the control device 8 controls the machining system SYS so that the size of the molten pool MP formed by irradiating the machining light EL matches the size of the molten pool MP read from the recording device 72. This makes it possible to reproduce the size of the molten pool MP of the reference layer in subsequent layers. Furthermore, by outputting the recorded information to a file, the output file information can be applied to the next model (a model different from the model having the reference layer) to reproduce the model having the reference layer.

[0152] In this embodiment, the control device 8 controls the machining system SYS based on the measurement results of the measuring device 71 and changes the measurement target area 100 of the molten pool MP measured by the measuring device 71 based on the deflection conditions, which are the conditions for deflecting the machining light EL. This allows image processing to be performed only on the area of ​​the workpiece image IW required for feedback, thereby speeding up image processing. Furthermore, by narrowing the image processing range, not only is processing speed increased, but the area value of the displayed molten pool MP can be detected with high accuracy. In other words, the size of the molten pool MP can be measured with high accuracy. Furthermore, by limiting the image area used for feedback to only the measurement target area 100, spatter removal can be performed simultaneously. Furthermore, the influence of the number of pixels on the workpiece image IW, which varies depending on the positional relationship between the imaging head 80 (camera) and the object, for example, can be suppressed, thereby preventing deformation due to a decrease in laser output.

[0153] In this embodiment, the recording device 72 presets an ideal shape 90 of the molten pool MP. The control device 8 calculates the difference between the shape of the molten pool MP measured by the measuring device 71 and the ideal shape 90, and offsets the difference to control the molding so that the measured shape of the molten pool MP approaches the ideal shape 90. The ideal shape 90 is symmetrical in the width direction. The control device 8 controls the center position and left-right width of the molten pool MP in the reference layer to be constant, thereby uniforming the line width of one line of the molded object BO. This suppresses changes in line width due to overlapping of the molded object BO. Furthermore, the control device 8 controls the workpiece image IW to reduce the difference in the number of pixels between the left and right sides relative to the center position of the molten pool MP. By aligning the number of pixels (reducing the difference between the left and right sides), the molding height and angle R of the molded object BO can be uniformed.

[0154] The configuration of the above-described processing system SYS can be rephrased as follows: The processing system SYS includes an irradiation optical system 211 capable of irradiating a processing beam (processing light EL), a material supply unit (material supply device 1) capable of supplying a building material M to a portion where a molten pool MP is to be formed by irradiation with the processing beam, a processing device 2 that forms a molded object BO, a measuring device 71 that acquires information about the size of the molten pool MP formed by irradiation with the processing beam, a recording device 72 that records the information about the size of the molten pool MP acquired by the measuring device 71 in association with information about the position of the molten pool MP, and a control device 8, wherein the recording device 72 records the information about the size of the molten pool MP in molding the Mth layer of the first object BO1, and the control device 8 controls the formation of the molten pool MP by the processing device 2 in the Mth layer of a second object BO2, which is different from the first object BO1, based on the information about the size of the molten pool MP in the Mth layer of the first object BO1.

[0155] Alternatively, the processing system SYS can be rephrased as follows: the processing system SYS includes an irradiation optical system 211 capable of irradiating a processing beam (processing light EL), a material supply unit (material supply device 1) capable of supplying a forming material M to a portion where a molten pool MP is to be formed by irradiation with the processing beam, a processing device 2 that forms a molded object BO, a measuring device 71 that acquires information about the size of the molten pool MP formed by irradiation with the processing beam, a recording device 72 that records the information about the size of the molten pool MP acquired by the measuring device 71 in association with information about the position of the molten pool MP, and a control device 8, the recording device 72 records the information about the size of the molten pool MP in forming the Mth layer (M is a natural number greater than 0) of the object, and the control device 8 controls the formation of the molten pool MP by the processing device 2 in the Nth layer (N is a natural number and N > M) of the object, based on the information about the size of the molten pool MP in the Mth layer.

[0156] Alternatively, it can be rephrased as follows: That is, the machining system SYS includes a machining device 2 that processes an object, an irradiation optical system capable of irradiating a machining beam (machining light EL), a first moving device (e.g., the stage 31 in this embodiment) that can move the irradiation position of the machining beam along a target trajectory based on a machining path, a second moving device (e.g., the galvanometer mirror 2112 in this embodiment) that can move the machining beam in a direction intersecting the target trajectory, a measuring device 71 that acquires information about the molten pool MP formed by irradiation with the machining beam, and a control device 8, and the control device 8 may determine the area 100 to be measured by the measuring device 71 based on movement conditions that are conditions for moving the machining beam by the second moving device.

[0157] Alternatively, the processing system SYS may be rephrased as follows: the processing system SYS includes a processing device 2 that forms a molded object BO, the processing device 2 including an irradiation optical system 211 that can irradiate a processing beam (processing light EL), a material supply unit (material supply device 1) that can supply a build material to a portion where a molten pool MP is to be formed by irradiation with the processing beam, a measuring device 71 that acquires information about the molten pool MP formed on a first object by irradiation with the processing beam, a recording device 72 that records the information about the molten pool MP acquired by the measuring device 71 in association with information about the position of the molten pool MP, and a control device 8, the control device 8 may read the information about the molten pool MP from the recording device 72, and control the processing device 2 so that the molten pool MP formed on a second object by irradiation with the processing beam reproduces the molten pool MP read from the recording device 72. In this case, the control device 8 may control the processing device 2 so that the molten pool MP formed on the first object reproduces on the second object, based on the information about the molten pool MP read from the recording device 72 that corresponds to the position on the second object where the processing beam is irradiated. The molten pool MP formed on the first object may be a molten pool formed for forming the Mth layer (M > 0, a natural number) of the first object, and the molten pool MP formed on the second object may be a molten pool formed for forming the Mth layer of a second object different from the first object. The molten pool MP formed on the first object may be a molten pool formed for forming the Mth layer (M > 0, a natural number) of the object BO, and the molten pool MP formed on the second object may be a molten pool formed for forming the Nth layer (N is a natural number and N > M) of the object BO.

[0158] Furthermore, the configuration of the above-described processing system SYS can be rephrased as the control device 8 having a data structure with the following configuration: That is, the data structure of the control device 8 is a data structure used by a processing device 2 that forms a molded object BO, the data structure including an irradiation optical system 211 capable of irradiating a processing beam (processing light EL) and a material supply unit (material supply device 1) that can supply a molding material to a portion where the processing beam is irradiated to form a molten pool MP, and in which information on the size of the molten pool MP formed by the processing device 2 is associated with the position where the molten pool MP is formed.

[0159] The data structure of the control device 8 may be a data structure used in a processing device 2 that is capable of forming an object BO and that includes an irradiation optical system 211 that can irradiate a processing beam (processing light EL), a material supply unit (material supply device 1) that can supply a forming material to a portion where the processing beam is irradiated to form a molten pool MP, a moving device (e.g., the stage 31 in this embodiment) that can move the irradiation position of the processing beam along a target trajectory based on the processing path, and a deflection optical system (galvanometer mirror 2112) that can deflect the processing beam in a direction intersecting the target trajectory, and the data structure may associate deflection conditions, which are conditions for deflecting the processing beam, with information about the measurement target area 100 measured by the measurement device 71. Note that the above-mentioned data structure may be provided outside the control device 8 (e.g., an externally attachable device, etc.).

[0160] Furthermore, the configuration of the processing system SYS described above can be rephrased as a processing method for a molded object BO having the following configuration: That is, the method for processing a molded object BO includes irradiating an object with a processing beam (processing light EL), supplying a processing material to a portion where the processing beam is irradiated to form a molten pool MP, thereby forming the molded object BO, acquiring information about the size of the molten pool MP formed by the irradiation of the processing beam, recording the acquired information about the size of the molten pool MP in association with information about the position of the molten pool MP, reading out the information about the size of the molten pool MP, and controlling the molding so that the size of the molten pool MP formed by the irradiation of the processing beam matches the size of the molten pool MP read out from the recording device 72.

[0161] A method for processing a molded object BO may include irradiating an object with a processing beam (processing light EL), moving the irradiation position of the processing beam along a target trajectory based on a processing path, deflecting the processing beam in a direction intersecting the target trajectory, supplying a molding material to a location where the processing beam is irradiated to form a molten pool MP to form a molded object, acquiring information regarding the size of the molten pool MP formed by irradiation with the processing beam, controlling the molding based on the acquired information regarding the size of the molten pool MP, and changing a measurement target area 100 of the molten pool MP to acquire information regarding the size of the molten pool MP based on a deflection condition, which is a condition for deflecting the processing beam.

[0162] A method for processing a molded object BO may include irradiating an object with a processing beam (processing light EL), supplying a processing material to a location where the processing beam is irradiated to form a molten pool MP, and forming the molded object, acquiring information about the molten pool MP formed by irradiating the processing beam, recording the acquired information about the molten pool MP in association with information about the position of the molten pool MP, reading out the information about the molten pool MP, and controlling the molding so that the molten pool MP formed by irradiating the processing beam reproduces the read-out molten pool MP.

[0163] (4) Modifications Next, modifications of the processing system SYS, data structure, and processing method will be described. Note that, although modifications of the processing system SYS will be described below, these configurations can also be applied to the data structure and processing method.

[0164] In the above-described embodiment, the imaging head 80 is attachable to the processing head 21. However, the imaging head 80 may be attachable to a member different from the processing head 21. For example, the imaging head 80 may be attachable to at least a part of the processing device 2. For example, the imaging head 80 may be attachable to at least a part of the stage device 3 (for example, at least a part of the stage 31). For example, the imaging head 80 may be attachable to at least a part of the housing 6. Alternatively, the imaging head 80 may be integrated with a member different from the processing head 21.

[0165] In the above-described embodiment, the processing system SYS includes a mirror as an optical member for guiding the work light WL from the work W to the imaging head 80. However, an optical member other than a mirror may be used as the optical member for guiding the work light WL from the work W to the imaging head 80. For example, a prism may be used as the optical member for guiding the work light WL from the work W to the imaging head 80.

[0166] The processing system SYS does not need to include a mirror. In other words, the control device 8 does not need to include an optical member for guiding the workpiece light WL from the workpiece W to the imaging head 80. In this case, the imaging head 80 may receive the workpiece light WL without passing through a mirror.

[0167] In the above-described embodiment, the imaging head 80 receives workpiece light WL including light emitted by the workpiece W (for example, workpiece light WL including light emitted by the molten pool MP formed on the workpiece W). However, an illumination device may irradiate illumination light onto the workpiece W, and the imaging head 80 may receive workpiece light WL including illumination light transmitted through the workpiece W (for example, light reflected by the workpiece W). The illumination device may be provided within the control device 8. The illumination device may be provided outside the control device 8. Furthermore, the imaging head 80 may receive workpiece light WL transmitted through at least a portion of the irradiation optical system 211.

[0168] The imaging head 80 may receive the workpiece light WL from at least a portion of the workpiece W (particularly, at least a portion of the molten pool MP) through a predetermined optical filter. An example of the predetermined optical filter is a filter that allows infrared light (e.g., light having a wavelength in the range of approximately 700 nm to 1 mm) to pass through but does not allow light other than infrared light (e.g., light having a wavelength outside the range of approximately 700 nm to 1 mm, such as visible light) to pass through. In this case, the workpiece image WI generated by the imaging head 80 receiving the workpiece light WL may be used as an image (so-called temperature map) representing the temperature distribution of at least a portion of the workpiece W. In other words, the imaging head 80 may generate a workpiece image WI representing the temperature distribution of at least a portion of the workpiece W (i.e., usable as a temperature map). The imaging head 80 may also be used as a temperature measurement device that acquires information regarding the temperature of at least a portion of the workpiece W.

[0169] In the above-described embodiment, the imaging head 80 captures an image of at least a portion of the workpiece W (particularly, at least a portion of the molten pool MP) to generate a workpiece image WI in which the molten pool MP is captured. However, the imaging head 80 may also capture an image of the molten pool MP and at least a portion of the solidified metal distributed around the molten pool MP (i.e., a structure, hereinafter referred to as a "peripheral structure") to generate a workpiece image WI in which the molten pool MP and the peripheral structure are captured. The imaging head 80 may also capture an image of the peripheral structure to generate a workpiece image WI in which the molten pool MP is not captured but in which the peripheral structure is captured. In this case, the control device 8 may control the operation of the machining system SYS based on the workpiece image WI in which the peripheral structure is captured. For example, the control device 8 may calculate the positions (e.g., positions in the Z-axis direction, essentially heights) of peripheral objects constituting one structural layer SL based on the workpiece image WI, and control the operation of the machining system SYS to form the remaining part of one structural layer SL based on the calculated positions of the peripheral objects. For example, the control device 8 may calculate the positions (e.g., positions in the Z-axis direction, essentially heights) of peripheral objects constituting one structural layer SL based on the workpiece image WI, and control the operation of the machining system SYS to form another structural layer SL to be formed on the one structural layer SL based on the calculated positions of the peripheral objects.

[0170] The imaging head 80 may image an object other than the workpiece W. For example, the imaging head 80 may image at least a portion of the stage 31. For example, the imaging head 80 may image at least a portion of the processing head 21. For example, the imaging head 80 may image at least a portion of the material nozzle 212. For example, the imaging head 80 may image at least a portion of the modeling material M supplied from the material nozzle 212. For example, the imaging head 80 may image at least a portion of the chamber space. Even in this case, the control device 8 may control the operation of the processing system SYS based on the image generated by the imaging head 80.

[0171] In the above description, the imaging head 80 is housed in the housing 6. However, the imaging head 80 does not have to be housed in the housing 6. In this case, the imaging head 80 does not have to have a housing 6. In the above description, the measuring device 71 (imaging head 80) measures (images) the molten pool MP from an oblique angle relative to the molded object. However, the measuring device 71 (imaging head 80) may measure (image) the molten pool MP from directly above the molded object (from a direction along the optical axis of the irradiation optical system 211).

[0172] In the above-described embodiment, the measuring device 71 included in the machining system SYS is disposed in the chamber space 63IN. However, the measuring device 71 may be disposed at a position different from the chamber space 63IN. For example, the measuring device 71 may be disposed in the external space 64OUT. The measuring device 71 may be capable of measuring the workpiece W (particularly, the molten pool MP formed on the workpiece W) from the external space 64OUT.

[0173] In the above-described embodiment, the machining system SYS includes the measuring device 71 capable of measuring the size of the molten pool MP formed on the workpiece W. However, the machining system SYS may also include a first measuring device capable of measuring the molten pool MP formed on the workpiece W, and a second measuring device capable of measuring the object to be formed on the workpiece W. In other words, the machining system SYS may be provided with separate functions for measuring the molten pool MP and for measuring the object BO.

[0174] In the above-described embodiment, both the imaging operation and the image processing operation are performed during the molten pool information acquisition operation. However, it is not necessary to perform all of the above-described image processing operations during the molten pool information acquisition operation. In other words, only some of the image processing operations may be performed. Specifically, only some of the following may be performed: (1) the process of removing spatter by adding the workpiece image IW; (2) the process of removing spatter by setting a new offset integration threshold 84 within the buildable range 82 relative to the initially set integration threshold 81; or (3) the process of speeding up image processing by setting a measurement target area 100 in part of the workpiece image IW and measuring the size of the molten pool MP based on image information of the molten pool MP located within the measurement target area 100.

[0175] In the above-described embodiment, the processing system SYS includes the head drive system 22. That is, the processing head 21 is movable. However, the processing system SYS does not necessarily have to include the head drive system 22. That is, the processing head 21 does not necessarily have to be movable. Also, in the above description, the processing system SYS includes the stage drive system 32. That is, the stage 31 is movable. However, the processing system SYS does not necessarily have to include the stage drive system 32. That is, the stage 31 does not necessarily have to be movable.

[0176] In the above-described embodiment, the processing device 2 melts the shaping material M by irradiating the shaping material M with the processing light EL. However, the processing device 2 may melt the shaping material M by irradiating the shaping material M with an arbitrary energy beam. In this case, the processing device 2 may include a beam irradiation device capable of irradiating the arbitrary energy beam in addition to or instead of the irradiation optical system 211. Examples of the arbitrary energy beam include at least one of a charged particle beam (e.g., at least one of an electron beam and an ion beam) and an electromagnetic wave.

[0177] The control device 8 may change the target size of the molten pool MP when the type of the building material M used in the building operation changes. When the type of the building material M used in the building operation changes, the relationship between the line width of the object BO and the target size of the molten pool MP may change even if the building conditions (e.g., light intensity conditions and scanning speed conditions) remain unchanged. For example, when the building operation is performed using a processing light EL having a first intensity and moving at a first scanning speed and a first type of building material M, a building object BO with a first line width may be formed if a molten pool MP with a first size is formed. On the other hand, when the building operation is performed using a processing light EL having a first intensity and moving at a first scanning speed and a second type of building material M different from the first type, a building object BO with a second line width different from the first line width may be formed if a molten pool MP with a first size is formed. For this reason, the control device 8 may set the target size of the molten pool MP based on the type of building material M.

[0178] The control device 8 may correct the calculated size of the molten pool MP or the workpiece image IW itself based on the processing information. The control device 8 may correct the workpiece image WI based on the processing information and measure the size of the molten pool MP based on the corrected workpiece image WI. For example, the control device 8 may correct the workpiece image WI so that the correction method for the workpiece image WI when the target irradiation area EA is moving in the first movement direction is different from the correction method for the workpiece image WI when the target irradiation area EA is moving in the second movement direction. For example, the control device 8 may correct the workpiece image WI so that the correction method for the workpiece image WI when the angle of the stage 31 is a first angle is different from the correction method for the workpiece image WI when the angle of the stage 31 is a second angle. For example, the control device 8 may correct the workpiece image WI so that the correction method for the workpiece image WI when the shape of the existing object is a first shape is different from the correction method for the workpiece image WI when the shape of the existing object is a second shape.

[0179] Specifically, for example, in a situation where the apparent size of the molten pool MP reflected in the workpiece image WI is smaller than the actual size of the molten pool MP, the control device 8 may correct the workpiece image WI so that the molten pool MP reflected in the workpiece image WI becomes larger. For example, in a situation where the apparent size of the molten pool MP reflected in the workpiece image WI is larger than the actual size of the molten pool MP, the control device 8 may correct the workpiece image WI so that the molten pool MP reflected in the workpiece image WI becomes smaller. For example, in a situation where the apparent size of the molten pool MP reflected in the workpiece image WI matches the actual size of the molten pool MP, the control device 8 may not need to correct the workpiece image WI. In other words, the control device 8 may correct the workpiece image WI so that the apparent size of the molten pool MP reflected in the workpiece image WI approaches or matches the actual size of the molten pool MP.

[0180] The machining system SYS may further include a display. The display functions as a display device capable of displaying a desired image under the control of the control device 8. The display may include a display provided in the machining system SYS (i.e., a display built into the machining system SYS). The display may include a display that can be externally attached to the machining system SYS. Alternatively, a display provided in a device different from the machining system SYS may display a desired image under the control of the control device 8. For example, a display provided in at least one of a laptop computer and a tablet terminal may display a desired image under the control of the control device 8. In this case, the machining system SYS does not need to include a display.

[0181] In the above description, the processing system SYS performs additive processing using the laser build-up welding method. However, the processing system SYS may form the object BO from the building material M using any other method that can form the object BO by irradiating the building material M with processing light EL (or any energy beam). Alternatively, the processing system SYS may form the object BO using any method for additive processing that is different from the method of irradiating the building material M with processing light EL (or any energy beam).

[0182] As an example, the processing system SYS may form the three-dimensional structure ST by performing additive processing using powder bed fusion, such as selective laser sintering (SLS). That is, the processing system SYS may form the three-dimensional structure ST by repeatedly spreading a powder used as the building material M evenly and then irradiating at least a portion of the evenly spread powder with processing light EL. In this case, the control device 8 may regard the evenly spread powder as the workpiece W. That is, the control device 8 may capture an image of at least a portion of the workpiece W corresponding to the evenly spread powder, generate a workpiece image WI, and control the operation of the processing system SYS based on the workpiece image WI. Also, when the powder bed fusion method is used, a molten pool MP (i.e., a molten pool MP formed by molten powder) is formed in at least a portion of the evenly spread powder by irradiating the processing light EL. In this case, the control device 8 may generate a workpiece image WI by capturing an image of at least a portion of the molten pool MP formed in at least a portion of the evenly spread powder, and may control the operation of the processing system SYS based on the workpiece image WI.

[0183] Alternatively, in addition to or instead of additive processing, the processing system SYS may perform removal processing, which is capable of removing at least a portion of an object by irradiating an object such as the workpiece W with processing light EL (or any energy beam). Alternatively, in addition to or instead of additive processing and / or removal processing, the processing system SYS may perform marking processing, which is capable of forming a mark (e.g., a letter, number, or figure) on at least a portion of the object by irradiating an object such as the workpiece W with processing light EL (or any energy beam). The above-mentioned processing device 2 (particularly, the processing head 21) may be attached to a robot (typically, an articulated robot). For example, the processing device 2 (particularly, the processing head 21) may be attached to a welding robot for welding. For example, the processing device 2 (particularly, the processing head 21) may be attached to a self-propelled mobile robot.

[0184] At least some of the components of each of the above-described embodiments can be appropriately combined with at least some of the other components of each of the above-described embodiments. Some of the components of each of the above-described embodiments may not be used.

[0185] The present invention is not limited to the above-described embodiments, but can be modified as appropriate within the scope that does not contradict the gist or idea of ​​the invention that can be read from the claims and the entire specification, and the processing system, data structure and processing method that involve such modifications are also included in the technical scope of the present invention.

[0186] REFERENCE SIGNS LIST 1 Material supply device (material supply unit) 2 Processing device 8 Control device 22 Head drive system (moving device) 31 Stage (moving device) 71 Measuring device 72 Recording device 90 Ideal shape 100 Measurement target area 211 Irradiation optical system 2112 Galvanometer mirror (deflection optical system) BO Object BO1 First object (first object) BO2 Second object (second object) EL Processing light IW Workpiece image M Building material MP Molten pool SYS Processing system

Claims

1. a processing device for forming a model, the processing device including an irradiation optical system capable of irradiating a processing beam and a material supply unit capable of supplying a modeling material to a portion where a molten pool is formed by irradiation of the processing beam; a measuring device for obtaining information regarding a size of a molten pool formed by irradiation of the processing beam; a recording device that records information about the size of the molten pool obtained by the measuring device in association with information about the position of the molten pool; A control device, the recording device records information regarding a size of the molten pool in modeling of an Mth layer of a first object, The control device controls formation of the molten pool by the processing device in the Mth layer of a second object different from the first object, based on information about a size of the molten pool in the Mth layer of the first object. Processing system.

2. a processing device for forming a model, the processing device including an irradiation optical system capable of irradiating a processing beam and a material supply unit capable of supplying a modeling material to a portion where a molten pool is formed by irradiation of the processing beam; a measuring device for obtaining information regarding a size of a molten pool formed by irradiation of the processing beam; a recording device that records information about the size of the molten pool obtained by the measuring device in association with information about the position of the molten pool; A control device, the recording device records information regarding a size of the molten pool in modeling of an Mth layer (M is a natural number>0) of the object, The control device controls formation of the molten pool by the processing device in an Nth layer (N is a natural number and N>M) of the object based on information about the size of the molten pool of the Mth layer. Processing system.

3. The information regarding the position of the molten pool includes one of position information and time information. The processing system according to claim 1 or 2.

4. The recording device records information about the size of the molten pool at a predetermined position coordinate or a predetermined time as reference information, and updates the reference information every time the scanning direction of the processing beam changes. The processing system of claim 3 .

5. The recording device records information about the size of the molten pool at a predetermined position coordinate or a predetermined time as reference information, and updates the reference information every time a deflection condition of the processing beam is changed. The processing system of claim 3 .

6. the recording device records information about the size of the molten pool at a predetermined position coordinate or a predetermined time as reference information; The recording device updates the reference information when at least one of the following conditions is satisfied: when the current modeling position has changed from the predetermined position coordinates by a threshold value or more; and when the current modeling time has changed from the predetermined time by a threshold value or more. The processing system of claim 3 .

7. the recording device records information about a size of the molten pool formed in a reference layer set in the object as reference information; The control device controls processing in other layers so as to reproduce the size of the molten pool in the reference layer based on the reference information. The processing system of claim 3 .

8. The reference layer is a layer that is predefined by the user. The processing system of claim 7.

9. The reference layer is the first layer of the object. The processing system of claim 7.

10. The control device controls processing in layers above the reference layer using the reference information in the reference layer. The processing system of claim 7.

11. the control device controls the machining by the machining device under a coordinate system defined by a first axis, a second axis, and a third axis that are orthogonal to each other; The control device uses the reference information for the reference layer to perform the processing of the upper layer at a coordinate position different from that of the reference layer in the third axis direction and at the same coordinate position as that of the reference layer in the first axis direction and the second axis direction. The processing system of claim 10.

12. a processing device for forming a molded object, the processing device comprising: an irradiation optical system capable of irradiating a processing beam; a material supply unit capable of supplying a modeling material to a portion where a molten pool is formed by irradiation of the processing beam; a moving device capable of moving an irradiation position of the processing beam along a target trajectory based on a processing path; and a deflection optical system capable of deflecting the processing beam in a direction intersecting with the target trajectory; a measuring device for obtaining information regarding a size of a molten pool formed by irradiation of the processing beam; A control device. The control device controls the processing device based on a measurement result by the measuring device, and changes an area of ​​the molten pool to be measured by the measuring device based on a deflection condition that is a condition for deflecting the processing beam. Processing system.

13. a recording device for recording information about a measurement target area of ​​the molten pool in association with the deflection condition; The control device changes the measurement target area of ​​the molten pool based on information about the measurement target area of ​​the molten pool associated with the deflection condition recorded in the recording device. The processing system of claim 12.

14. The deflection optics is capable of periodically moving the processing beam along a scan direction that intersects the target trajectory. The processing system of claim 12.

15. The deflection optical system is capable of moving an irradiation position of the processing beam on a surface of an object by deflecting the processing beam. The processing system of claim 12.

16. the deflection condition includes a wobble shape of the processing beam; The control device sets the measurement target area for each wobble shape of the processing beam. The processing system of claim 12.

17. The control device sets the corresponding measurement target area for each scanning direction of the processing beam. The processing system of claim 12.

18. The control device sets the corresponding measurement target area for each scanning position of the processing beam. The processing system of claim 12.

19. The control device determines an amount of change in at least one of a wobble shape of the processing beam, a scanning direction of the processing beam, and a scanning position of the processing beam based on processing information of the object, and updates a setting of the measurement target area when the determined amount of change exceeds a threshold value. The processing system of claim 12.

20. The control device automatically determines an amount of change in at least one of a wobble shape of the processing beam, a scanning direction of the processing beam, and a scanning position of the processing beam from the captured image, and updates a setting of the measurement target area based on the determined amount of change. The processing system of claim 12.

21. The control device automatically determines the amount of change from the image based on a machine learning model.

21. The processing system of claim 20.

22. A user manually sets the measurement target area based on the measurement results of the measurement device. The processing system of claim 12.

23. Changing the measurement target area of ​​the molten pool by the measurement device includes changing a target area for image processing of the molten pool. The processing system of claim 12.

24. the control device controls the processing device based on a measurement result by the measuring device and a target size of the molten pool formed by the processing device; The target size of the molten pool is changed based on a deflection condition that is a condition for deflecting the processing beam. The processing system of claim 12.

25. a recording device for recording information regarding a target size of the molten pool in association with the deflection condition; The control device changes the target size of the molten pool based on information about the target size of the molten pool associated with the deflection condition recorded in the recording device.

25. The processing system of claim 24.

26. The recording device further records a wobble shape of the processing beam, and records the corresponding target size for each of the wobble shapes.

26. The processing system of claim 25.

27. The recording device further records a scanning direction of the processing beam, and records the corresponding target size for each of the scanning directions.

26. The processing system of claim 25.

28. The recording device further records the scanning positions of the processing beam, and records the corresponding target size for each of the scanning positions.

26. The processing system of claim 25.

29. The recording device determines an amount of change in at least one of a wobble shape of the processing beam, a scanning direction of the processing beam, and a scanning position of the processing beam based on processing information of the object, and updates the target size when the determined amount of change exceeds a threshold value.

26. The processing system of claim 25.

30. The recording device automatically determines an amount of change in at least one of a wobble shape of the processing beam, a scanning direction of the processing beam, and a scanning position of the processing beam from the captured image, and updates the target size based on the determined amount of change.

26. The processing system of claim 25.

31. The recording device automatically determines the amount of change from the image based on a machine learning model.

31. The processing system of claim 30.

32. The deflection optics is capable of periodically moving the processing beam along a scan direction that intersects the target trajectory.

25. The processing system of claim 24.

33. The deflection optical system is capable of moving an irradiation position of the processing beam on a surface of an object by deflecting the processing beam.

25. The processing system of claim 24.

34. The processing device further includes a moving device capable of moving an irradiation position of the processing beam along a target trajectory based on a processing path, and a deflection optical system capable of deflecting the processing beam in a direction intersecting with the target trajectory, the measuring device is capable of acquiring shape information regarding a molten pool that is continuously moving as the molten pool is formed at different positions by the processing beam deflected by the deflection optical system; The control device controls the shaping by the processing device based on the shape information. The processing system of claim 1 .

35. The control device controls at least one of the laser intensity and the heat input amount by performing high-speed laser modulation based on the measurement result of the shape of the molten pool.

35. The processing system of claim 34.

36. The control device controls the orbital speed of the processing beam by operating a galvanometer mirror based on the measurement result of the shape of the molten pool.

35. The processing system of claim 34.

37. The control device has an ideal shape of the molten pool preset therein, The control device calculates a difference between the shape of the molten pool actually measured by the measuring device and the ideal shape, and controls the shaping so that the measured shape of the molten pool approaches the ideal shape by offsetting the difference.

35. The processing system of claim 34.

38. The ideal shape is a shape that is symmetrical in the width direction of the molten pool.

38. The processing system of claim 37.

39. A plurality of the ideal shapes are stored in the control device, and an optimal ideal shape is selected from the plurality of ideal shapes according to at least one of the wobble shape of the processing beam, the scanning direction of the processing beam, the scanning position of the processing beam, and the actually measured shape of the molten pool.

38. The processing system of claim 37.

40. The control device automatically selects an optimal ideal shape from among a plurality of ideal shapes based on a learning model learned by machine learning.

40. The processing system of claim 39.

41. The processing device further includes a moving device capable of moving an irradiation position of the processing beam along a target trajectory based on a processing path, and a deflection optical system capable of deflecting the processing beam in a direction intersecting with the target trajectory, the measuring device acquires center position information regarding a center position of an area formed by a molten pool formed at a different position by the processing beam deflected by the deflection optical system, The control device controls the shaping by the processing device based on the center position information. The processing system of claim 1 .

42. The control device controls at least one of a laser intensity and a heat input amount by performing high-speed laser modulation based on a measurement result of the center position of the molten pool.

42. The processing system of claim 41.

43. The control device controls the orbital velocity of the processing beam by operating a galvanometer mirror based on the measurement result of the center position of the molten pool.

43. The processing system of claim 42.

44. the measuring device measures the center position based on a captured image, The measurement device controls the shaping so that the center position of the molten pool is located at the center of the image.

42. The processing system of claim 41.

45. The control device reads information on the size of the molten pool from the recording device, and controls the processing device so that the size of the molten pool formed by irradiation of the processing beam coincides with the size of the molten pool read from the recording device. The processing system of claim 1 .

46. a processing device for forming a model, the processing device including an irradiation optical system capable of irradiating a processing beam and a material supply unit capable of supplying a modeling material to a portion where a molten pool is formed by irradiation of the processing beam; a measurement device for acquiring information about a molten pool formed on a first object by irradiation with the processing beam; a recording device that records information about the molten pool obtained by the measuring device in association with information about a position of the molten pool; A control device, The control device reads information about the molten pool from the recording device, and controls the processing device so that the molten pool formed on the second object by irradiation with the processing beam reproduces the molten pool read from the recording device. Processing system.

47. The control device controls the processing device so that the molten pool formed on the first object is reproduced on the second object based on information about the molten pool read from the recording device, the information corresponding to the position on the second object where the processing beam is irradiated.

47. The processing system of claim 46.

48. the molten pool formed on the first object is a molten pool formed for forming an Mth layer (M is a natural number>0) of a first object, The molten pool formed on the second object is a molten pool formed for forming an Mth layer of a second object different from the first object.

47. The processing system of claim 46.

49. the molten pool formed on the first object is a molten pool formed for forming an Mth layer (M is a natural number>0) of the object, The molten pool formed on the second object is a molten pool formed for forming an Nth layer (N is a natural number and N>M) of the object.

47. The processing system of claim 46.

50. a processing device that includes an irradiation optical system capable of irradiating a processing beam and processes an object; a measuring device for acquiring information about a molten pool formed by irradiation of the processing beam; a recording device that records information about the molten pool obtained by the measuring device in association with information about a position of the molten pool; A control device, The control device controls the processing device based on the information about the molten pool read from the recording device. Processing system.

51. a processing device for processing an object, the processing device comprising: an irradiation optical system capable of irradiating a processing beam; a first moving device capable of moving an irradiation position of the processing beam along a target trajectory based on a processing path; and a second moving device capable of moving the processing beam in a direction intersecting with the target trajectory; a measuring device for acquiring information about a molten pool formed by irradiation of the processing beam; A control device, The control device determines an area to be measured by the measurement device based on a movement condition that is a condition for moving the processing beam by the second movement device. Processing system.

52. Irradiating an object with a processing beam; supplying a modeling material to a portion where the processing beam is irradiated to form a molten pool, thereby manufacturing a model; acquiring information regarding a size of a molten pool formed by irradiating the processing beam in forming an M-th layer of a first object; recording the acquired information regarding the size of the molten pool in the modeling of the Mth layer of the first object in association with information regarding the position of the molten pool; controlling formation of the molten pool in the Mth layer of a second object different from the first object, based on information about a size of the molten pool in the Mth layer of the first object; A processing method comprising the steps of:

53. Irradiating an object with a processing beam; supplying a modeling material to a portion where the processing beam is irradiated to form a molten pool, thereby manufacturing a model; acquiring information about a size of a molten pool formed by irradiating the processing beam in forming an Mth layer (M is a natural number>0) of the object; and recording the acquired information regarding the size of the molten pool in the modeling of the Mth layer of the object in association with information regarding the position of the molten pool; controlling formation of a molten pool in an Nth layer (N is a natural number and N>M) of the object based on information regarding a size of the molten pool in the Mth layer; A processing method comprising the steps of:

54. Irradiating an object with a processing beam; moving an irradiation position of the processing beam along a target trajectory based on a processing path; Deflecting the processing beam in a direction intersecting the target trajectory; supplying a modeling material to a portion where the processing beam is irradiated to form a molten pool, thereby manufacturing a model; Obtaining information regarding a size of the molten pool formed by irradiation of the processing beam; Controlling the shaping based on the acquired information about the size of the molten pool, and changing a measurement target area of ​​the molten pool for acquiring information about the size of the molten pool based on a deflection condition that is a condition for deflecting the processing beam; A processing method comprising the steps of:

55. Irradiating an object with a processing beam; supplying a modeling material to a portion where the processing beam is irradiated to form a molten pool, thereby manufacturing a model; acquiring information about a molten pool formed by irradiation of the processing beam; recording the acquired information about the molten pool in association with information about a position of the molten pool; reading information about the molten pool and controlling a shaping process so that a molten pool formed by irradiating the processing beam reproduces the read-out molten pool; A processing method comprising the steps of: