Semiconductor module and method for manufacturing semiconductor module

Abstract

A semiconductor module (1) comprises a substrate (34), a first connector (36), and a second connector (31). The first connector (36) is provided on the substrate (34). The second connector (31) is located on one end-side of an optical fiber cable (32) and is optically connected to the first connector (36). Additionally, the second connector (31) has a body part (31a) and a projecting part (31b). The body part (31a) accommodates therein the optical fiber cable (32). The projecting part (31b) projects from the body part (31a) and a tip part of the optical fiber cable (32) is exposed from a second surface (31c).

Description

Semiconductor module and method for manufacturing the same

[0001] SUMMARY OF THE INVENTION The disclosed embodiments relate to a semiconductor module and a method for manufacturing the semiconductor module.

[0002] Conventionally, semiconductor modules have been known in which semiconductor devices (hereinafter also referred to as optical devices) that convert electrical signals into optical signals are mounted on a substrate, and in some cases, these semiconductor modules are connected to optical fiber cables that transmit the converted optical signals from the optical devices to the outside (see Patent Document 1).

[0003] Patent No. 6311558

[0004] The semiconductor module of the present disclosure includes a substrate, a first connector, and a second connector. The first connector is provided on the substrate. The second connector is located on one end side of an optical fiber cable and is optically connected to the first connector. The second connector also has a main body and a protrusion. The main body houses the optical fiber cable. The protrusion protrudes from the main body, and the tip of the optical fiber cable is exposed from a second surface.

[0005] FIG. 1 is a perspective view of a semiconductor module according to an embodiment, as seen from diagonally above. FIG. 2 is a perspective view of the semiconductor module according to an embodiment, as seen from diagonally below. FIG. 3 is a cross-sectional view of the semiconductor module according to an embodiment. FIG. 4 is a top view of a first connector and a second connector according to an embodiment. FIG. 5 is a diagram for explaining a positioning step of the second connector according to an embodiment. FIG. 6 is a diagram for explaining a positioning step of the second connector according to an embodiment. FIG. 7 is a diagram for explaining a positioning step of the second connector according to an embodiment. FIG. 8 is a diagram for explaining a positioning step of the second connector according to an embodiment. FIG. 9 is a top view of a second connector according to another embodiment 1. FIG. 10 is a top view of a second connector according to another embodiment 2. FIG. 11 is a cross-sectional view of a first connector and a second connector according to another embodiment 3. FIG. 12 is a diagram for explaining a positioning step of the second connector according to another embodiment 3. FIG. 13 is a diagram for explaining a positioning step of the second connector according to another embodiment 3.

[0006] Hereinafter, with reference to the accompanying drawings, embodiments of the semiconductor module and the method for manufacturing the semiconductor module disclosed herein will be described. Note that the present disclosure is not limited to the embodiments described below. Furthermore, each embodiment can be appropriately combined within the scope of not causing any contradiction in the processing content. Furthermore, the same components in each of the following embodiments will be assigned the same reference numerals, and duplicated explanations will be omitted.

[0007] Furthermore, in the following embodiments, expressions such as "constant," "orthogonal," "perpendicular," or "parallel" may be used, but these expressions do not necessarily mean "constant," "orthogonal," "perpendicular," or "parallel" in the strict sense. In other words, the above expressions allow for deviations due to, for example, manufacturing precision, installation precision, etc.

[0008] In addition, in the drawings referred to below, for ease of understanding, an orthogonal coordinate system may be shown in which the X-axis direction, Y-axis direction, and Z-axis direction, which are perpendicular to each other, are defined, and the positive Z-axis direction is the vertically upward direction.

[0009] Conventionally, semiconductor modules have been known in which semiconductor devices (hereinafter also referred to as optical devices) that convert electrical signals into optical signals are mounted on a substrate. These semiconductor modules may be connected to optical fiber cables that transmit the converted optical signals from the optical devices to the outside.

[0010] However, in the above-mentioned conventional technology, the strength of the connection between the connector on the semiconductor device side and the connector on the optical fiber cable side is sometimes insufficient, which can cause the optical fiber cable to become detached from the semiconductor module.

[0011] Therefore, there is a need for a technology that can overcome the above-mentioned problems and improve the joint strength of optical fiber cables.

[0012] <Overall Configuration of Semiconductor Module> First, the overall configuration of a semiconductor module 1 according to an embodiment will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is a perspective view of the semiconductor module 1 according to an embodiment as seen obliquely from above, and Fig. 2 is a perspective view of the semiconductor module 1 according to an embodiment as seen obliquely from below.

[0013] In each of the following embodiments, the semiconductor module 1 will be described as an optical module in which an optical device 3 is mounted on a substrate, but the semiconductor module according to the present disclosure does not necessarily have to be an optical module.

[0014] As shown in FIGS. 1 and 2, a semiconductor module 1 according to the embodiment includes a substrate 2, a plurality of optical devices 3 (optical devices 3a to 3d), and a heat dissipation member 4.

[0015] The substrate 2 has, for example, a rectangular plate shape in a plan view. In addition to the optical devices 3a to 3d and the heat dissipation member 4, a power supply IC, a control IC, chip resistors, and the like (not shown) are located on a first surface 21 (here, the top surface) of the substrate 2. Furthermore, a capacitor, a coil, and the like (not shown) may also be located on the first surface 21 of the substrate 2.

[0016] A connector 25 is located on the second surface 22 (here, the lower surface) of the substrate 2. The substrate 2 is electrically connected to a motherboard via the connector 25.

[0017] The optical devices 3 are semiconductor devices that convert electrical signals into optical signals. Alternatively, the optical devices 3 may convert optical signals into electrical signals. A second connector 31 is located on the top surface of each optical device 3. The second connector 31 is connected to an optical connector 33 via a cable group consisting of a plurality of optical fiber cables 32.

[0018] The heat dissipation member 4 is a so-called heat sink and is located above the plurality of optical devices 3. Note that the heat dissipation member 4 does not necessarily have to cover the entire upper surfaces of the plurality of optical devices 3. That is, as shown in FIG. 1 , the upper surfaces of the plurality of optical devices 3 may be partially exposed from the heat dissipation member 4.

[0019] The heat dissipation member 4 is located close to the optical devices 3 and dissipates heat generated from the optical devices 3 to the outside of the semiconductor module 1. The heat dissipation member 4 may be in direct contact with the optical devices 3. Alternatively, the heat dissipation member 4 may be in contact with the optical devices 3 via a thermal interface material (TIM). In other words, the heat dissipation member 4 may be thermally connected to the optical devices 3.

[0020] The heat dissipation member 4 may be made of a metal with a relatively high thermal conductivity, such as aluminum, copper, iron, etc. A TIM is a composite material containing a thermally conductive filler in a resin.

[0021] The heat dissipation member 4 has a plate-shaped portion 41, a plurality of legs 42, and a plurality of heat dissipators 45. The plate-shaped portion 41 is a plate-shaped portion that is disposed opposite the first surface 21 of the substrate 2 with a gap therebetween. The plurality of legs 42 are provided on the plate-shaped portion 41. Specifically, the plurality of legs 42 extend from the plate-shaped portion 41 toward the substrate 2 and come into contact with the substrate 2 (are placed on the substrate 2).

[0022] These legs 42 are shaped so that their thickness increases partially from the plate-shaped portion 41. The legs 42 may be integrated with the plate-shaped portion 41. The multiple legs 42 may be connected to the plate-shaped portion 41 and the substrate 2. The multiple legs 42 extend in a fixed direction (here, the X-axis direction).

[0023] The plurality of heat sinks 45 are located on the surface of the plate-shaped portion 41 opposite to the surface facing the substrate 2. Although Figures 1 and 2 show an example in which the heat sinks 45 have a pin shape (i.e., heat sink pins), the heat sinks 45 may also have a plate shape (i.e., heat sink fins), for example.

[0024] A blower (not shown), such as a cooling fan, that blows air toward the semiconductor module 1 may be located on the negative X-axis side of the semiconductor module 1. Such a blower generates air that blows in the positive X-axis direction.

[0025] The air sent from the blower hits the multiple heat sinks 45 and flows along the first surface 21 of the substrate 2, passing through the ventilation passage 100 formed between the substrate 2 and the plate-shaped portion 41 of the heat sink member 4.

[0026] In the embodiment, this air blows onto the optical devices 3 positioned on the outlet side of the ventilation passage 100, thereby further improving the heat dissipation efficiency of the optical devices 3.

[0027] <Connection Configuration of Optical Fiber Cable> Next, the connection configuration of the optical fiber cable 32 in the semiconductor module 1 according to the embodiment will be described with reference to Fig. 3 and Fig. 4. Fig. 3 is a cross-sectional view of the semiconductor module 1 according to the embodiment, and Fig. 4 is a top view of the first connector 36 and the second connector 31 according to the embodiment.

[0028] 3, the optical device 3 according to the embodiment includes a substrate 34, an optical element 35, and a first connector 36. The optical element 35 is an example of a semiconductor element.

[0029] The substrate 34 supports various components (for example, the optical element 35 and the first connector 36) that constitute the optical device 3. The substrate 34 is, for example, a silicon substrate.

[0030] The optical element 35 is located, for example, on the main surface of the substrate 34. The optical element 35 includes an LD (laser diode), a driver, a receiver, etc., and converts an electrical signal into an optical signal. The optical element 35 may also convert an optical signal into an electrical signal. Note that the optical element 35 according to the embodiment may be configured such that the LD, the driver, and the receiver are separate entities.

[0031] The first connector 36 is located, for example, on the main surface of the substrate 34. The first connector 36 is optically connected to the optical element 35 via an optical transmission line (not shown) located on the substrate 34 or the like.

[0032] The first connector 36 has a main body 36 a, a plurality of optical pins 36 b, and a cover member 36 c. The main body 36 a accommodates the plurality of optical pins 36 b therein and supports the plurality of optical pins 36 b so that the optical pins 36 b do not come into contact with one another.

[0033] The optical pin 36b is optically connected to an optical transmission path extending from the optical element 35 and transmits an optical signal. The optical pins 36b are also optically connected to the optical fiber cables 32 housed in the second connector 31, respectively.

[0034] 3, the optical pin 36b is positioned so as to extend (for example, along the Z-axis direction) toward the second connector 31. Note that the optical pin 36b according to the embodiment may be positioned so as to be inclined with respect to the Z-axis direction.

[0035] As shown in FIG. 4, the optical pins 36b are arranged side by side along a predetermined first direction (the Y-axis direction in the drawing), for example.

[0036] The cover member 36c is positioned to cover and protect the tips of the multiple optical pins 36b arranged side by side. The cover member 36c is made of a material capable of transmitting optical signals (e.g., optical glass). The second connector 31 is positioned opposite the cover member 36c (i.e., the multiple optical pins 36b).

[0037] The cover member 36c and the second connector 31 are fixed together by a fixing member 37. The fixing member 37 is made of, for example, an adhesive (such as a UV curable resin) that can transmit optical signals.

[0038] The second connector 31 is located at one end of the plurality of optical fiber cables 32 and is optically connected to the first connector 36. The second connector 31 has a main body 31a and a protrusion 31b. The main body 31a accommodates the plurality of optical fiber cables 32 therein.

[0039] The protrusion 31b is a portion that protrudes from the main body 31a. For example, the protrusion 31b protrudes toward the side of the main body 31a that faces the first connector 36 (the negative Z-axis direction in the drawing). The protrusion 31b may be formed integrally with the main body 31a, or may be formed separately from the main body 31a and joined to the main body 31a with a joining member or the like.

[0040] The protrusion 31b has a bottom surface 31c and a plurality of side surfaces 31d. The bottom surface 31c is an example of a second surface and is a flat surface facing the first connector 36. The tips of the plurality of optical fiber cables 32 are exposed from the bottom surface 31c.

[0041] The tip ends of the plurality of optical fiber cables 32 do not necessarily have to be exposed from the bottom surface 31c, but may be located, for example, inside the protruding portion 31b and near the bottom surface 31c.

[0042] 4, the bottom surface 31c according to the embodiment has a rectangular shape in a plan view. The side surfaces 31d are surfaces that contact the respective sides of the rectangular bottom surface 31c and intersect with the bottom surface 31c.

[0043] In the embodiment, since the second connector 31 has the protrusion 31b, as shown in Fig. 3, not only the bottom surface 31c but also the plurality of side surfaces 31d contribute to the connection with the first connector 36. That is, in the embodiment, since the second connector 31 has the protrusion 31b, the connection area of ​​the second connector 31 can be increased.

[0044] This improves the joint strength between the first connector 36 and the second connector 31. Therefore, according to the embodiment, the joint strength of the optical fiber cable 32 can be improved.

[0045] In addition, in the embodiment, the protruding portion 31b may protrude on the side facing the first connector 36. This allows the fixing member 37 to smoothly wrap around the multiple side surfaces 31d of the protruding portion 31b, thereby further improving the bonding strength between the first connector 36 and the second connector 31.

[0046] Therefore, according to the embodiment, the joining strength of the optical fiber cable 32 can be further improved.

[0047] In addition, in the embodiment, the surface roughness of at least one side surface 31 d of the protruding portion 31 b may be greater than the surface roughness of the bottom surface 31 c. This creates a so-called anchor effect between the side surface 31 d with greater surface roughness and the fixing member 37, thereby further improving the bonding strength between the first connector 36 and the second connector 31.

[0048] Therefore, according to the embodiment, it is possible to further improve the joining strength of the optical fiber cable 32. Furthermore, in the embodiment, by reducing the surface roughness of the bottom surface 31c, it is possible to improve the optical transmission efficiency between the first connector 36 and the second connector 31.

[0049] In addition, in the embodiment, the surface roughness of all the side surfaces 31 d of the protruding portion 31 b may be greater than the surface roughness of the bottom surface 31 c, which creates an anchor effect between all the side surfaces 31 d and the fixing member 37, thereby further improving the bonding strength between the first connector 36 and the second connector 31.

[0050] Therefore, according to the embodiment, it is possible to further improve the bonding strength of the optical fiber cable 32. In this case, it is preferable that the surface roughness Ra of the bottom surface 31c is 0.01 μm or less, and the surface roughness Ra of the side surface 31d is 100 to 500 times the surface roughness Ra of the bottom surface 31c. Specifically, the surface roughness Ra of the side surface 31d may be 1 μm or more and 5 μm or less.

[0051] In addition, in the embodiment, the first connector 36 and the second connector 31 may be fixed together by a fixing member 37 such as an adhesive. This allows the first connector 36 and the second connector 31 to be fixed together easily, thereby reducing the manufacturing cost of the semiconductor module 1.

[0052] 3, the fixing member 37 may have a thin portion 37a and a thick portion 37b. The thin portion 37a is a portion of the fixing member 37 that faces the bottom surface 31c. The thick portion 37b is located around the thin portion 37a and is thicker than the thin portion 37a.

[0053] In this way, since the fixing member 37 has the thin portion 37a, the distance between the optical pin 36b and the optical fiber cable 32 can be shortened, thereby improving the optical transmission efficiency between the first connector 36 and the second connector 31.

[0054] Furthermore, since the fixing member 37 has the thick portion 37b, the joining strength between the first connector 36 and the second connector 31 can be further improved.

[0055] <Step of Aligning Second Connector> Next, the step of aligning the second connector 31 in the manufacturing process of the semiconductor module 1 according to the embodiment will be described in detail with reference to Figures 5 to 8. Figures 5 to 8 are diagrams for explaining the step of aligning the second connector 31 according to the embodiment.

[0056] In the embodiment, first, as shown in FIG. 5, a control unit of a manufacturing apparatus (not shown) tilts the second connector 31 in a predetermined rotational direction R1 with respect to a second direction (the X-axis direction in the drawing) in which the optical fiber cable 32 extends in the semiconductor module 1 (see FIG. 3).

[0057] As a result, a first side 31e1 formed by the bottom surface 31c and a side surface 31d1 on the negative X-axis direction side of the bottom surface 31c is closer to the first connector 36 than the other sides. The side surface 31d1 is an example of a first side surface.

[0058] Next, as shown in Figure 6, the control unit of the manufacturing device (not shown) moves the second connector 31 in an inclined state toward the first connector 36, bringing the first edge 31e1 into contact with the main surface 36d of the cover member 36c of the first connector 36.

[0059] Then, the control unit of the manufacturing device measures the height position of the first side 31 e 1 when the first side 31 e 1 is in contact with the first connector 36 .

[0060] Next, as shown in FIG. 7, the control unit of the manufacturing apparatus (not shown) tilts the second connector 31 in a rotational direction R2 opposite to the predetermined rotational direction R1 with respect to the second direction (the X-axis direction in the figure) in which the optical fiber cable 32 extends in the semiconductor module 1 (see FIG. 3).

[0061] As a result, a second side 31e2 formed by the bottom surface 31c and a side surface 31d2 on the X-axis positive side relative to the bottom surface 31c is closer to the first connector 36 than the other sides. The side surface 31d2 is an example of a second side surface.

[0062] Next, as shown in Figure 8, the control unit of the manufacturing apparatus (not shown) moves the second connector 31 in an inclined state toward the first connector 36, bringing the second edge 31e2 into contact with the main surface 36d of the cover member 36c of the first connector 36.

[0063] Then, the control unit of the manufacturing device measures the height position of the second side 31 e 2 when the second side 31 e 2 is in contact with the first connector 36 .

[0064] Next, the control unit of the manufacturing equipment adjusts the inclination of the bottom surface 31c based on the height position of the first side 31e1 measured in the state shown in Figure 6 and the height position of the second side 31e2 measured in the state shown in Figure 8.

[0065] Specifically, the control unit of the manufacturing device adjusts the inclination of the bottom surface 31c based on the height position of the first edge 31e1 and the height position of the second edge 31e2 so that the bottom surface 31c and the main surface 36d of the cover member 36c are parallel in a cross-sectional view in the XZ plane.

[0066] This reduces tilt between the first connector 36 and the second connector 31 in a cross-sectional view in the XZ plane. Therefore, according to the embodiment, the optical fiber cable 32 and the optical pin 36b can be aligned with high precision.

[0067] <Other Embodiments> Next, semiconductor modules 1 according to various other embodiments will be described with reference to Fig. 9 to Fig. 13. Fig. 9 is a top view of a second connector 31 according to another embodiment 1.

[0068] 9, in another embodiment 1, the planar shape of the protrusion 31b is different from that of the above-described embodiment. Specifically, in another embodiment 1, the bottom surface 31c of the protrusion 31b may be hexagonal rather than rectangular.

[0069] This allows the area of ​​the side surface 31d to be increased, thereby further increasing the joining area of ​​the second connector 31.

[0070] Therefore, according to another embodiment 1, it is possible to further improve the joint strength between the first connector 36 and the second connector 31, thereby further improving the joint strength of the optical fiber cable 32. The bottom surface 31c of the protrusion 31b may be polygonal, such as an octagonal shape.

[0071] Fig. 10 is a top view of a second connector 31 according to another embodiment 2. As shown in Fig. 10, in another embodiment 2, a bottom surface 31c of a protrusion 31b may have a rectangular shape with rounded corners.

[0072] This allows the area of ​​the side surface 31d to be increased, thereby further increasing the joining area of ​​the second connector 31.

[0073] Therefore, according to the second alternative embodiment, the bonding strength between the first connector 36 and the second connector 31 can be further improved, thereby further improving the bonding strength of the optical fiber cable 32. The bottom surface 31c of the protrusion 31b may be oval-shaped.

[0074] Fig. 11 is a cross-sectional view of a first connector 36 and a second connector 31 according to another embodiment 3. As shown in Fig. 11, in another embodiment 3, the cross-sectional shape of the protrusion 31b differs from that of the above-described embodiment.

[0075] Specifically, in another embodiment 3, the protrusion 31b may have a tapered shape that narrows toward the bottom surface 31c when viewed in cross section on the XZ plane.

[0076] Thus, since the second connector 31 has the tapered protrusion 31b, not only the bottom surface 31c but also the multiple side surfaces 31d contribute to the connection with the first connector 36. That is, in another embodiment 3, since the second connector 31 has the tapered protrusion 31b, the connection area of ​​the second connector 31 can be increased.

[0077] This can improve the joint strength between the first connector 36 and the second connector 31. Therefore, according to the third alternative embodiment, the joint strength of the optical fiber cable 32 can be improved.

[0078] In another embodiment 3, the protrusion 31b is tapered toward the bottom surface 31c, which allows for more accurate alignment of the second connector 31. The reason for this will be described with reference to FIGS. 12 and 13.

[0079] 12 and 13 are diagrams for explaining the positioning step of the second connector 31 according to another embodiment 3. FIG.

[0080] Similar to the above-described embodiment, in another embodiment 3, first, as shown in FIG. 12, a control unit of a manufacturing apparatus (not shown) tilts the second connector 31 in a predetermined rotational direction R1 (see FIG. 5) relative to the second direction (the X-axis direction in the figure).

[0081] As a result, a first side 31e1 formed by the bottom surface 31c and the side surface 31d1 on the negative X-axis direction side of the bottom surface 31c is closer to the first connector 36 than the other sides.

[0082] Next, the control unit of the manufacturing apparatus moves the second connector 31 in an inclined state toward the first connector 36 so that the first side 31 e 1 comes into contact with the main surface 36 d of the cover member 36 c of the first connector 36 .

[0083] Then, the control unit of the manufacturing device measures the height position of the first side 31 e 1 when the first side 31 e 1 is in contact with the first connector 36 .

[0084] Here, in another embodiment 3, since the protrusion 31b has a tapered shape when viewed in cross section in the XZ plane, the first angle θ1 (see Figure 11) formed between the bottom surface 31c contacting the first edge 31e1 and the side surface 31d1 is greater than 90 (°).

[0085] This increases the contact area of ​​the first edge 31e1 with the main surface 36d of the cover member 36c, allowing the control unit of the manufacturing apparatus to sensitively detect that the first edge 31e1 has come into contact with the first connector 36.

[0086] That is, in another embodiment 3, by making the first angle θ1 between the bottom surface 31c and the side surface 31d1 larger than 90°, the control unit of the manufacturing apparatus can accurately measure the height position of the first edge 31e1.

[0087] Next, as shown in Figure 13, the control unit of the manufacturing device (not shown) tilts the second connector 31 in a rotational direction R2 (see Figure 7) opposite to the predetermined rotational direction R1 (see Figure 5) with respect to the second direction (the X-axis direction in the figure).

[0088] As a result, a second side 31e2 formed by the bottom surface 31c and the side surface 31d2 on the X-axis positive side relative to the bottom surface 31c is closer to the first connector 36 than the other sides.

[0089] Next, the control unit of the manufacturing apparatus moves the second connector 31 in an inclined state toward the first connector 36 so that the second side 31 e 2 comes into contact with the main surface 36 d of the cover member 36 c of the first connector 36 .

[0090] Then, the control unit of the manufacturing device measures the height position of the second side 31 e 2 when the second side 31 e 2 is in contact with the first connector 36 .

[0091] Here, in another embodiment 3, since the protrusion 31b has a tapered shape when viewed in cross section in the XZ plane, the second angle θ2 (see Figure 11) formed between the bottom surface 31c contacting the second edge 31e2 and the side surface 31d2 is greater than 90 (°).

[0092] This increases the contact area of ​​the second edge 31e2 with the main surface 36d of the cover member 36c, allowing the control unit of the manufacturing apparatus to sensitively detect that the second edge 31e2 has come into contact with the first connector 36.

[0093] That is, in another embodiment 3, by making the second angle θ2 between the bottom surface 31c and the side surface 31d2 larger than 90°, the control unit of the manufacturing equipment can accurately measure the height position of the second edge 31e2.

[0094] As described above, in another embodiment 3, by making the protrusion 31b tapered when viewed in cross section in the XZ plane, it is possible to further reduce the tilt between the first connector 36 and the second connector 31 when viewed in cross section in the XZ plane.

[0095] Therefore, according to the third alternative embodiment, the optical fiber cable 32 and the optical pin 36b can be aligned with higher precision.

[0096] In another embodiment 3, the first angle θ1 formed between the bottom surface 31c and the side surface 31d1 may be different from the second angle θ2 formed between the bottom surface 31c and the side surface 31d2.

[0097] For example, the first angle θ1 corresponding to the first side 31e1 that first contacts the main surface 36d in the alignment step may be larger than the second angle θ2 corresponding to the second side 31e2 that next contacts the main surface 36d.

[0098] In this way, by increasing the first angle θ1, it is possible to detect with even greater sensitivity that the first edge 31e1, which comes into contact first, has come into contact with the first connector 36.

[0099] Furthermore, by making the second angle θ2 smaller than the first angle θ1, the dimension of the protrusion 31b in the X-axis direction can be reduced, and therefore the size of the second connector 31 can be reduced.

[0100] Note that, in the example of Figure 11, the case where the first angle θ1 and the second angle θ2 are both greater than 90 (°) is shown, but the present disclosure is not limited to such an example, and for example, the first angle θ1 may be greater than 90 (°) and the second angle θ2 may be 90 (°).

[0101] Although not shown, in another embodiment 3, the protrusion 31b may have a tapered shape tapering toward the bottom surface 31c when viewed in cross section in the YZ plane.

[0102] In other words, in another embodiment 3, the angle formed between the bottom surface 31c and the side surface 31d3 (see Figure 4) on the positive side of the Y axis, and the angle formed between the bottom surface 31c and the side surface 31d4 (see Figure 4) on the negative side of the Y axis may both be greater than 90 (°).

[0103] This allows the height position of the side located between the bottom surface 31c and the side surface 31d3 to be measured with high accuracy during the alignment process of the second connector 31, and also allows the height position of the side located between the bottom surface 31c and the side surface 31d4 to be measured with high accuracy.

[0104] Therefore, according to the third alternative embodiment, it is possible to reduce the occurrence of tilt between the first connector 36 and the second connector 31 in a cross-sectional view in the YZ plane.

[0105] Although the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above-described embodiments, and various modifications are possible without departing from the spirit of the present disclosure.

[0106] Further advantages and other aspects may readily occur to those skilled in the art. Therefore, the disclosure in its broader aspects is not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.

[0107] The present technology can also be configured as follows. (1) A semiconductor module comprising: a substrate; a first connector provided on the substrate; and a second connector located on one end side of an optical fiber cable and optically connected to the first connector, wherein the second connector has: a main body that houses the optical fiber cable; and a protrusion that protrudes from the main body and exposes a tip end of the optical fiber cable from a second surface. (2) The semiconductor module described in (1), wherein the protrusion protrudes on a side facing the first connector. (3) The semiconductor module described in (1) or (2), wherein the first connector has a plurality of optical pins positioned side by side along a predetermined first direction, and the protrusion has a tapered shape that narrows toward the second surface when viewed in cross section on a plane perpendicular to the predetermined first direction. (4) The semiconductor module according to (3), wherein the protrusion has a first side surface and a second side surface intersecting a second direction in which the optical fiber cable extends from the main body, and a first angle formed between the second surface and the first side surface is different from a second angle formed between the second surface and the second side surface. (5) The semiconductor module according to any one of (1) to (4), wherein the protrusion has a tapered shape that narrows toward the second surface when viewed in cross section along a plane perpendicular to the second direction in which the optical fiber cable extends from the main body. (6) The semiconductor module according to any one of (1) to (5), wherein the protrusion has a plurality of side surfaces intersecting the second surface, and a surface roughness of at least one of the side surfaces is greater than the surface roughness of the second surface. (7) The semiconductor module according to any one of (1) to (6), further including a fixing member located between the first connector and the second connector and fixing the first connector and the second connector. (8) The semiconductor module according to (7), wherein the fixing member has: a thin portion facing the second surface; and a thick portion positioned around the thin portion and thicker than the thin portion.(9) A method for manufacturing a semiconductor module, comprising: a step of aligning a first connector provided on a first surface of a substrate with a second connector having a protruding portion that protrudes from a main body that houses an optical fiber cable therein and has a protruding portion with a tip end of the optical fiber cable exposed from a second surface, wherein the aligning step comprises: a step of bringing a first side formed by the second surface and a first side surface intersecting the second surface into contact with the first connector while tilting the second connector in a predetermined rotational direction with respect to a second direction in which the optical fiber cable extends from the main body, and measuring a height position of the first side; a step of bringing a second side formed by the second surface and a second side surface located opposite to the first side surface into contact with the first connector while tilting the second connector in a rotational direction opposite to the predetermined rotational direction with respect to the second direction, and measuring a height position of the second side; and a step of adjusting the tilt of the second surface based on the height positions of the first side and the second side.

[0108] 1 Semiconductor module 2 Substrate 21 First surface 3, 3a to 3d Optical device 31 Second connector 31a Main body 31b Protrusion 31c Bottom surface (an example of a second surface) 31d Side surface 31d1 Side surface (an example of a first side surface) 31d2 Side surface (an example of a second side surface) 31e1 First side 31e2 Second side 32 Optical fiber cable 35 Optical element (an example of a semiconductor element) 36 First connector 36a Main body 36b Optical pin 36c Cover member θ1 First angle θ2 Second angle R1, R2 Rotation direction

Claims

1. A substrate; a first connector provided on the substrate; a second connector located at one end of the optical fiber cable and optically connected to the first connector; Equipped with The second connector is a main body that houses the optical fiber cable; a protrusion that protrudes from the main body and exposes a tip of the optical fiber cable from the second surface; A semiconductor module having:

2. The protruding portion protrudes toward the side facing the first connector. The semiconductor module according to claim 1 .

3. the first connector has a plurality of optical pins arranged side by side along a predetermined first direction; The protrusion has a tapered shape tapering toward the second surface when viewed in cross section along a plane perpendicular to the predetermined first direction. The semiconductor module according to claim 1 .

4. the protrusion has a first side surface and a second side surface that intersect with a second direction in which the optical fiber cable extends from the main body portion; a first angle formed by the second surface and the first side surface and a second angle formed by the second surface and the second side surface are different from each other; The semiconductor module according to claim 3 .

5. The protrusion has a tapered shape that narrows toward the second surface when viewed in cross section along a surface perpendicular to a second direction in which the optical fiber cable extends from the main body. The semiconductor module according to any one of claims 1 to 4.

6. the protrusion has a plurality of side surfaces that intersect with the second surface; The surface roughness of at least one side surface is greater than the surface roughness of the second surface. The semiconductor module according to any one of claims 1 to 4.

7. a fixing member positioned between the first connector and the second connector and fixing the first connector and the second connector together. The semiconductor module according to any one of claims 1 to 4.

8. The fixing member is a thin portion facing the second surface; a thick portion located around the thin portion and thicker than the thin portion; The semiconductor module according to claim 7 .

9. a step of aligning a first connector provided on the first surface of the substrate with a second connector having a protrusion that protrudes from a main body that houses an optical fiber cable therein and exposes a tip end of the optical fiber cable from the second surface, The aligning step includes: a step of bringing a first side formed by the second surface and a first side surface intersecting the second surface into contact with the first connector while tilting the second connector in a predetermined rotation direction with respect to a second direction in which the optical fiber cable extends from the main body, and measuring a height position of the first side; a step of bringing a second side formed by the second surface and a second side surface located opposite to the first side surface into contact with the first connector while tilting the second connector in a rotation direction opposite to the predetermined rotation direction with respect to the second direction, and measuring a height position of the second side; adjusting the inclination of the second surface based on the height position of the first side and the height position of the second side; A method for manufacturing a semiconductor module comprising: