Electronic component, electronic component manufacturing method, and traceability system

Abstract

An electronic component 1 comprising an element body 10 and external electrodes 21, 22 that are provided on the element body 10, wherein metal particles 31 having a particle radius of 10-1000 nm are disposed on the element body 10 so as to form a code 30.

Description

Electronic components, manufacturing methods for electronic components, and traceability systems

[0001] The present invention relates to an electronic component, a method for manufacturing an electronic component, and a traceability system.

[0002] In recent years, there has been a social demand for a circular economy. Furthermore, the amount of discarded electronic equipment (e-waste) is increasing year by year. However, mounted electronic components are often crushed and discarded. To recycle these resources, it is important to understand what electronic components removed from discarded electronic circuit boards are, where they were made, and what materials (components) they contain.

[0003] Patent Document 1 describes a traceability system for electronic components that are produced in batches by lot and stored separately on multiple reels in each lot, and includes a lot number input device, an identification mark reader that reads a unique identification mark attached to each reel, a host computer that associates reel-based traceability information and lot-based traceability information with the identification mark for each reel, and a user terminal that acquires lot-based traceability information and reel-based traceability information for each reel based on the identification mark.

[0004] Patent document 2 describes an electronic component having an authentication pattern formed on an exposed surface, the authentication pattern including a base portion containing resin and colored particles having a color tone that can be identified within the base portion, and the colored particles form a dispersed dot pattern within the base portion.

[0005] Patent Document 3 describes a small electronic component in which a lot number consisting of the component manufacturing date and serial number is displayed using a fill-in pattern distinguished by symbols that can be distinguished even when overlapping, and the lot code is displayed using a grid display in which the numbers are represented by the position of the grids.

[0006] Patent document 4 describes a laminated chip component having a laminated structure including multiple ceramic layers, and comprising a base body having a code including multiple arranged dot-shaped depressions on a main surface perpendicular to the stacking direction, the dot-shaped depressions having a semicircular cross-sectional shape.

[0007] Patent document 5 describes a method for manufacturing laminated chip components, which includes the steps of forming a code indicating at least information identifying an intermediate product at a previous stage and information identifying a final product after singulation in each of multiple singulation areas on the main surface of a laminated substrate on which multiple green sheets are stacked, singulating the laminated substrate for each singulation area to form multiple green chips, and converting the green chips into laminated chip components, which are the final products.

[0008] JP 2014-229647 A JP 2012-043953 A JP 06-325967 A JP 2021-125584 A JP 2021-125585 A

[0009] However, when lot descriptions are given on a reel-by-reel basis, it is not possible to verify the history of each component when it is mounted on a circuit board and then removed from the market. Also, because the stickers attached to the reels can be replaced, they are easily counterfeited.

[0010] While it is possible to print or mark large units such as semiconductor chips and their modules, it is difficult to do so with small components. With coating methods such as inkjet printing, the area of ​​the printing area is on the order of millimeters.

[0011] When cutting the element body using laser processing or other methods, there is a risk of a decrease in mechanical strength and of the absorption of contaminants during the cutting process, which can lead to abnormal characteristics and poor appearance. Furthermore, when processing unfired green sheets, deformation occurs after firing, which can lead to a decrease in the accuracy of code identification. Furthermore, there are subsequent processes such as a barrel process to remove the corners of the product and a coating and plating process to form external electrodes, which can lead to a decrease in yield during these processes.

[0012] The present invention has been made to solve the above problems, and aims to provide an electronic component that can suppress a decrease in mechanical strength, a method for manufacturing an electronic component, and a traceability system.

[0013] In a first aspect, the present invention provides an electronic component comprising a base body and an external electrode provided on the base body, wherein metal particles having a particle radius of 10 nm or more and 1000 nm or less are arranged on the base body so as to form a code.

[0014] In a second aspect, the present invention provides an electronic component comprising an element body and external electrodes provided on the element body, wherein depressions having a radius of 10 nm or more and 1000 nm or less in a planar view are arranged on the element body so as to form a code.

[0015] In a third aspect, the present invention provides a method for manufacturing an electronic component according to the first aspect, comprising the steps of: preparing a solution containing metal ions; filling a cylindrical probe having an electrode disposed therein with the solution; controlling X, Y, and Z points of the probe to bring the tip of the probe close to an element body of an electronic component; bringing the solution coming out of the tip of the probe into contact with the element body to form a meniscus between the element body and the probe; and, with the meniscus formed, applying a voltage between an external electrode of the electronic component and the electrode to precipitate metal particles on the element body.

[0016] In a fourth aspect, the present invention provides a method for manufacturing an electronic component according to the second aspect, comprising the steps of: preparing a solution containing a strong acid; filling a cylindrical probe with the solution; controlling X, Y, and Z points of the probe to bring the tip of the probe close to an element body of an electronic component; bringing the solution coming out of the tip of the probe into contact with the element body to form a meniscus between the element body and the probe; and, with the meniscus formed, dissolving a portion of the element body to form a depression on the element body.

[0017] In a fifth aspect, the present invention provides a traceability system, wherein the code indicates information including the type of the electronic component, the traceability system comprising: a code reader that reads the code of an electronic component according to the first or second aspect; a database that stores component processing information that specifies a post-use disposal method for each type of electronic component; and an information processing device that compares the type of electronic component read by the code reader with the component processing information in the database to determine a post-use disposal method for the electronic component.

[0018] According to the present invention, it is possible to provide an electronic component that can suppress a decrease in mechanical strength, a method for manufacturing an electronic component, and a traceability system.

[0019] FIG. 1 is a perspective view schematically illustrating an example of an electronic component according to an embodiment of the present invention. FIG. 2 is an example of a cross-sectional view of the electronic component shown in FIG. 1 taken along line A-A. FIG. 3 is another example of the cross-sectional view of the electronic component shown in FIG. 1 taken along line A-A, illustrating a case in which the electronic component is a multilayer ceramic capacitor. FIG. 4 is an enlarged plan view of the code-forming portion of the electronic component shown in FIG. 1. FIG. 5 is an example of a cross-sectional view of the electronic component shown in FIG. 4 taken along line B-B. FIG. 6 is a plan view schematically illustrating a modified example of the electronic component shown in FIG. 1, with the code-forming portion enlarged. FIG. 7 is a plan view schematically illustrating another modified example of the electronic component shown in FIG. 1, with the code-forming portion enlarged. FIG. 8 is an example of a cross-sectional view of the electronic component shown in FIG. 7, with the code-forming portion enlarged. FIG. 9 is a cross-sectional view schematically illustrating yet another modified example of the electronic component shown in FIG. 1, with the code-forming portion enlarged. FIG. 10 is a cross-sectional view schematically illustrating yet another modified example of the electronic component shown in FIG. 1, with the code-forming portion enlarged. FIG. 11 is an example of a cross-sectional view of the electronic component shown in FIG. 10 taken along line D-D. FIG. 12 is a plan view schematically showing another modified example of the electronic component shown in FIG. 1 , with the code formation portion enlarged. FIG. 13 is an example of a cross-sectional view of the electronic component shown in FIG. 12 taken along line E-E. FIG. 14 is a cross-sectional view schematically showing an example of filling a probe with a solution in a method for manufacturing an electronic component according to an embodiment of the present invention. FIG. 15 is a cross-sectional view schematically showing an example of an apparatus used in a method for manufacturing an electronic component according to an embodiment of the present invention. FIG. 16 is a cross-sectional view schematically showing an example of bringing the tip of a probe close to an element body of an electronic component in a method for manufacturing an electronic component according to an embodiment of the present invention. FIG. 17 is a cross-sectional view schematically showing an example of forming a meniscus between the element body and the probe in a method for manufacturing an electronic component according to an embodiment of the present invention. FIG. 18 is a cross-sectional view schematically showing an example of depositing metal particles on an element body in a method for manufacturing an electronic component according to an embodiment of the present invention. FIG. 19 is a cross-sectional view schematically showing an example of scanning a probe over an element body in a method for manufacturing an electronic component according to an embodiment of the present invention. 20 is a cross-sectional view schematically showing an example of a mode in which a recess is formed on an element body in a method for manufacturing an electronic component according to an embodiment of the present invention. FIG. 21 is a perspective view schematically showing another example of a method for manufacturing an electronic component according to an embodiment of the present invention.FIG. 22 is a diagram schematically illustrating an example of a traceability system according to an embodiment of the present invention.

[0020] The electronic components, the manufacturing method for electronic components, and the traceability system of the present invention are described below. However, the present invention is not limited to the following configurations, and can be modified as appropriate within the scope of the present invention. Note that a combination of two or more of the individual desirable configurations described below also constitutes the present invention.

[0021] (Electronic Component) First, an electronic component according to an embodiment of the present invention will be described. Fig. 1 is a perspective view schematically showing an example of an electronic component according to an embodiment of the present invention.

[0022] The electronic component 1 shown in FIG. 1 is a small chip-type electronic component (surface-mounted electronic component), and includes an element body 10 and external electrodes 21 and 22 provided on the element body 10 .

[0023] The size of the electronic component 1 is not particularly limited, but may be, for example, 1005 size, 0603 size, 0402 size, 0201 size, or the like.

[0024] There are no particular limitations on the specific type of electronic component 1. Specific examples include multilayer ceramic electronic components such as a multilayer ceramic capacitor, a multilayer coil, a multilayer thermistor, a multilayer varistor, a multilayer LC filter, and a multilayer piezoelectric filter.

[0025] In this case, the element body 10 is preferably made of a laminate in which at least one of dielectric ceramic layers, magnetic ceramic layers, piezoelectric ceramic layers, and semiconductor ceramic layers is laminated with internal electrode layers as internal conductors.

[0026] Furthermore, the electronic component 1 does not have to be a laminated component as described above. Specific examples of such a component include a silicon capacitor, a ferrite coil, and an inductor made of a composite material of metal powder and resin.

[0027] The base body 10 includes a dielectric layer 11 and an internal conductor (internal electrode layer, not shown in Figure 1), and has a top surface 10a and a bottom surface 10b that face each other in a height direction T, a first side surface 10c and a second side surface 10d that face each other in a length direction L that is perpendicular to the height direction T, and a third side surface 10e and a fourth side surface 10f that face each other in a width direction W that is perpendicular to the height direction T and the length direction L.

[0028] Although the element body 10 has a substantially rectangular parallelepiped outer shape, the corners and ridges may be rounded. A corner is a portion where three faces of the element body 10 intersect, and a ridge is a portion where two faces of the element body 10 intersect.

[0029] The electronic component 1 is mounted on a mounting board so that the bottom surface 10b faces the mounting surface of the mounting board. In other words, the bottom surface 10b is the mounting surface.

[0030] The areas of the top surface 10a and the bottom surface 10b may be substantially the same as or different from the areas of the third side surface 10e and the fourth side surface 10f, and the areas of the first side surface 10c and the second side surface 10d may be substantially the same as or different from the areas of the third side surface 10e and the fourth side surface 10f.

[0031] The surface of the element body 10 , except for the exposed portions of the internal conductors, is made up of a dielectric layer 11 .

[0032] The dielectric layer 11 can be formed of, for example, a dielectric material (oxide). The dielectric material can be appropriately selected depending on the type of electronic component 1, and examples thereof include a dielectric ceramic material, a magnetic ceramic material, a piezoelectric ceramic material, and a semiconductor ceramic material.

[0033] Examples of dielectric ceramic materials include those containing a main component such as barium titanate, calcium titanate, strontium titanate, barium calcium titanate, or calcium zirconate. When the electronic component 1 contains any of the above dielectric ceramic materials as the main component, it can function as a multilayer ceramic capacitor. However, depending on the desired characteristics of the multilayer ceramic capacitor, it is also possible to use a material containing a minor component, such as an Mg compound, an Mn compound, an Si compound, an Al compound, a V compound, an Ni compound, or a rare earth compound, in a content less than that of the main component.

[0034] The magnetic ceramic material may be, for example, a material containing a ferrite ceramic material as a main component. When a magnetic ceramic material is used, the electronic component 1 can function as a laminated coil.

[0035] Specific examples of piezoelectric ceramic materials include PZT (lead zirconate titanate) ceramic materials, etc. When a piezoelectric ceramic material is used, the electronic component 1 can function as a multilayer piezoelectric filter.

[0036] Specific examples of semiconducting ceramic materials include spinel-based ceramic materials, etc. When a semiconducting ceramic material is used, the electronic component 1 can function as a multilayer thermistor.

[0037] The external electrodes 21 and 22 are provided on the surface of the element body 10 .

[0038] The external electrode 21 is provided on the first side surface 10c of the element body 10. In Fig. 1, the external electrode 21 is provided from the first side surface 10c to each of the top surface 10a, the bottom surface 10b, the third side surface 10e, and the fourth side surface 10f of the element body 10. The external electrode 21 is electrically connected to the internal conductor exposed from the element body 10 at the first side surface 10c.

[0039] The external electrode 22 is provided on the second side surface 10d of the element body 10. In Fig. 1, the external electrode 22 is provided from the second side surface 10d to each of the top surface 10a, the bottom surface 10b, the third side surface 10e, and the fourth side surface 10f of the element body 10. The external electrode 22 is electrically connected to the internal conductor exposed from the element body 10 at the second side surface 10d.

[0040] Fig. 2 is an example of a cross-sectional view taken along line AA of the electronic component shown in Fig. 1. Note that in Fig. 2, the internal conductor of element body 10 is omitted.

[0041] As shown in Fig. 2, the external electrodes 21, 22 have a resin electrode layer 23 containing a conductive component and a resin component. The conductive component mainly contains a metal such as silver, copper, nickel, or tin, or an alloy containing at least one of these metals. The resin component mainly contains an epoxy resin, a phenolic resin, or the like. The resin electrode layer can be formed using a conductive paste such as silver paste.

[0042] The external electrodes 21, 22 may have a baked electrode layer of copper or silver instead of the resin electrode layer 23. The baked electrode layer of copper or silver is specifically an electrode formed by baking a copper or silver paste material containing a glass component.

[0043] The external electrodes 21, 22 also have a so-called plating layer formed by plating on the resin electrode layer 23 (or a baked electrode layer of copper or silver; the same applies below). Specifically, the external electrodes 21, 22 have a Ni plating layer 24 provided to cover the resin electrode layer 23, and a Sn plating layer 26 provided as an outermost layer 25 to cover the Ni plating layer 24.

[0044] Instead of the Sn plating layer 26, an Au plating layer may be provided as the outermost layer 25 of the external electrodes 21, 22.

[0045] In the present invention, the external electrodes may be disposed on only part of the surface of the element body, and are not particularly limited in their location. For example, they may be disposed only on the bottom surface of the element body, or they may be disposed so as to cover part of one of the side surfaces of the element body and extend from that side surface to cover part of the bottom surface (L-shaped in cross section), or they may be disposed so as to cover part or all of one of the side surfaces of the element body and extend from that side surface to cover part of the top surface and part of the bottom surface (C-shaped in cross section).

[0046] In the present invention, the number of external electrodes is not particularly limited as long as at least one external electrode is provided for the element body. For example, four external electrodes may be provided for the element body (four terminals), or six external electrodes may be provided for the element body (six terminals).

[0047] FIG. 3 is another example of a cross-sectional view of the electronic component shown in FIG. 1 taken along line AA, showing a case where the electronic component is a multilayer ceramic capacitor.

[0048] In this case, the element body 10 is a laminate in which dielectric ceramic layers 12 as dielectric layers 11 and internal electrode layers 13 and 14 as internal conductors are stacked.

[0049] The internal electrode layer 13 is extended to a first side surface 10 c of the element body 10 and connected to an external electrode 21 , and the internal electrode layer 14 is extended to a second side surface 10 d of the element body 10 and connected to an external electrode 22 .

[0050] The dielectric ceramic layer 12 can be obtained by forming a dielectric slurry containing a dielectric ceramic material and an organic solvent into a sheet.

[0051] The internal electrode layers 13 and 14 can be obtained by printing an electrode paste containing a conductive component. The internal electrode layers 13 and 14 are preferably Ni electrode layers that use Ni as the conductive component.

[0052] Moreover, the Ni electrode layer may be replaced with an Ag electrode layer, a Pd electrode layer, or a Cu electrode layer.

[0053] Fig. 4 is an enlarged plan view of a code forming portion of the electronic component shown in Fig. 1. Fig. 5 is an example of a cross-sectional view of the electronic component shown in Fig. 4 taken along line BB.

[0054] As shown in FIGS. 1 to 5 , metal particles 31 having a particle radius of 10 nm or more and 1000 nm or less are arranged on the element body 10 to form the code 30. Because the code 30 is formed of metal fine particles on the element body 10 in this manner, a decrease in the mechanical strength of the electronic component 1 can be suppressed, and the code 30 is difficult to counterfeit. Furthermore, because the code 30 made of metal particles 31 is provided for each electronic component 1, the identification information and history information of each electronic component 1 can be confirmed. Furthermore, because the code 30 made of metal particles 31 can be formed in a very small area, it can also be provided on small electronic components. Furthermore, because there is no need to grind the element body 10, characteristic abnormalities and appearance defects associated with the adsorption of contaminants can be prevented. Furthermore, because the code 30 made of metal particles 31 can be formed after the element body 10 is fired, as described below, it is also possible to prevent a decrease in the identification accuracy of the code 30 due to deformation caused by firing.

[0055] The metal particles 31 and the metal particles 41 described below can be observed, for example, using a scanning electron microscope (SEM) or a microscope capable of magnification of 5000 times or more, and the particle radii can be measured based on the observed image. Specifically, the radii measured when the metal particles 31 and 41 are viewed in plan in the observed image (observed from a direction perpendicular to the surface of the element body 10) are defined as the particle radii. Note that, when the metal particles 31 and 41 have shapes such as circles or ellipses in plan view but have different radii, the shortest length is defined as the particle radius.

[0056] The code 30 is a two-dimensional code conforming to the rules of, for example, a DataMatrix code, a QR code (registered trademark), or a MicroQR code, and is formed in a rectangular area. The code 30 may be a matrix type or a stack type. In the code 30, data cells representing the smallest units of data are dot-shaped (which may be triangular or rectangular), and metal particles 31 are provided as dots in some of the data cells. In other words, the code 30 is formed by an aggregate of multiple arranged metal particles 31. In the case shown in FIG. 1 , each dot is made up of one metal particle 31, and one metal particle 31 is arranged for one data cell.

[0057] FIG. 6 is a plan view schematically showing a modified example of the electronic component shown in FIG. 1, and is an enlarged view of the code forming portion.

[0058] As shown in FIG. 6, each dot may be made up of a plurality of metal particles 31, and a plurality of metal particles 31 may be arranged in one data cell.

[0059] The location of the cord 30 is not particularly limited, but it is preferably on any of the top surface 10a, bottom surface 10b, third side surface 10e, and fourth side surface 10f, and more preferably on any of the top surface 10a, third side surface 10e, and fourth side surface 10f.

[0060] 4, the cord 30 is preferably disposed within a range d1 of 100 μm (more preferably 50 μm) from the external electrode 22 (or 21). This allows the metal particles 31 to be easily deposited by utilizing leakage current from the external electrode 22 (or 21) using a manufacturing method described later.

[0061] The information indicated by code 30 includes, for example, a component ID which is information for identifying electronic component 1, product type information which is information indicating the product type of electronic component 1, and material information which is information indicating the materials contained in electronic component 1.

[0062] The product type information may be information that directly indicates the product type of the electronic component 1, such as a product type name, or information that indirectly indicates the product type of the electronic component 1, such as a product type number assigned to each product type. The same applies to material information.

[0063] The particle radius of the metal particles 31 is preferably 10 nm or more and 1000 nm or less, and more preferably 100 nm or more and 500 nm or less.

[0064] The shape of the metal particles 31 is usually spherical, oblate spheroidal, hemispherical, discoidal with depressions in the center on both sides, snowman-shaped, etc. When the metal particles 31 are hemispherical, they are usually arranged on the element body 10 so that their flat surfaces are in surface contact with the element body 10.

[0065] The material of the metal particles 31 is not particularly limited, and examples thereof include Ni, Cu, Au, Ag, etc. Among these, Ni and Cu are preferred from the viewpoints of having a melting point equal to or higher than the temperature during mounting (e.g., 250° C.) and being inexpensive.

[0066] Since the metal particles 31 and the element body 10 are made of different materials, an image with contrast between the metal particles 31 and the element body 10 can be obtained, and the code 30 can be read based on this image.

[0067] Fig. 7 is a plan view schematically showing another modified example of the electronic component shown in Fig. 1, and is an enlarged view of the code forming portion. Fig. 8 is an example of a cross-sectional view taken along line CC of the electronic component shown in Fig. 7.

[0068] 7 and 8, metal particles 41 having a particle radius different from that of the metal particles 31 forming the code 30 may be arranged on the element body 10 so as to form a frame 40 surrounding the code 30. This makes it easier to identify the area in which the code 30 is formed, making it easier to read the code 30. The frame 40 may be rectangular, for example.

[0069] The particle radius of the metal particles 41 forming the frame portion 40 is preferably larger than the particle radius of the metal particles 31 forming the cord 30. Specifically, the particle radius of the metal particles 41 is preferably 100 nm or more and 1000 nm or less, more preferably 200 nm or more and 1000 nm or less, and even more preferably 500 nm or more and 1000 nm or less.

[0070] The shape of metal particles 41 may typically be spherical, oblate spheroidal, hemispherical, discoidal with depressions in the center on both sides, snowman-shaped, etc. When metal particles 41 are hemispherical, they are typically arranged on element body 10 so that their flat surfaces are in surface contact with element body 10. Metal particles 31 and metal particles 41 may have different shapes or may have substantially the same shape.

[0071] The material of the metal particles 41 is not particularly limited, and examples thereof include Ni, Cu, Au, and Ag. Among these, Ni and Cu are preferred from the viewpoints of having a melting point equal to or higher than the temperature during mounting (e.g., 250°C) and being inexpensive. The materials of the metal particles 31 and the metal particles 41 may be different from each other or may be substantially the same.

[0072] FIG. 9 is a cross-sectional view schematically showing yet another modified example of the electronic component shown in FIG. 1, and is an enlarged view of the code forming portion.

[0073] 9, a glass coating film 50 that covers the metal particles 31 that form the code 30 may be further provided on the element body 10. This effectively prevents the metal particles 31 from falling off the surface of the element body 10, thereby effectively preventing a decrease in the identification accuracy of the code 30 due to the falling off of the metal particles 31. The shape of the glass coating film 50 may be the same as the shape of the area where the code 30 is formed, for example, rectangular.

[0074] The type of glass constituting the glass coating film 50 is not particularly limited, and may be SiO ２ , TiO ２ , Al ２ O ３ and mixtures thereof, and compositions containing various additives and fillers. ２Glasses with this as the main component are easy to collect and have a wide range of compositions, including additives.

[0075] The thickness of the glass coating film 50 is not particularly limited, but is preferably 50 nm to 3000 nm, more preferably 300 nm to 2000 nm, and even more preferably 500 nm to 1500 nm.

[0076] When the frame portion 40 is formed, it is preferable that the glass coating film 50 covers the frame portion 40 together with the cord 30 .

[0077] Fig. 10 is a cross-sectional view schematically showing yet another modified example of the electronic component shown in Fig. 1, and is an enlarged view of the code forming portion. Fig. 11 is an example of a cross-sectional view taken along line DD of the electronic component shown in Fig. 10.

[0078] As shown in FIGS. 10 and 11 , depressions 32 having a radius of 10 nm or more and 1000 nm or less in a plan view may be arranged on the element body 10 to form the code 30. That is, such depressions 32 may be arranged instead of metal particles 31 as dots in the data cells of the code 30, or the code 30 may be formed by an aggregate of multiple arranged depressions 32. The depressions 32 are formed by partially removing the surface of the element body 10. However, because they are very fine, even in this case, a decrease in the mechanical strength of the electronic component 1 can be suppressed, and the code 30 is difficult to counterfeit. Furthermore, because the code 30 formed by the depressions 32 is provided for each electronic component 1, the identification information and history information of each electronic component 1 can be confirmed. Furthermore, because the code 30 formed by the depressions 32 can be formed in a very small area, it can be formed even on small electronic components. Furthermore, because the depressions 32 can be formed by local dissolution of the element body 10, as described below, characteristic abnormalities and poor appearance due to the adsorption of contaminants can be prevented. Furthermore, since the code 30 using the recesses 32 can be formed after the element body 10 is fired as described below, it is also possible to prevent a decrease in the identification accuracy of the code 30 due to deformation caused by firing.

[0079] Note that the depressions 32 and the depressions 42 described below can be observed, for example, with a scanning electron microscope (SEM) or a microscope capable of magnification of 5000 times or more, and their radii can be measured based on the observed image. Specifically, the radii of the depressions 32 and 42 are defined as the radii measured when viewed in plan (observed from a direction perpendicular to the surface of the element body 10) in the observed image. Note that although the depressions 32 and 42 have a circular or elliptical shape in plan view, if they have different radii, the shortest length is defined as the radius.

[0080] In the case shown in FIG. 10, each dot is made up of one dent 32, and one dent 32 is arranged for one data cell.

[0081] However, similarly to the case of the metal particles 31 shown in FIG. 6, there may be a plurality of depressions 32 constituting each dot, and a plurality of depressions 32 may be arranged for one data cell.

[0082] 10, similarly to the case of the metal particles 31, the cord 30 is preferably arranged within a range d1 of 100 μm (more preferably 50 μm) from the external electrode 22 (or 21). This makes it possible to easily deposit the depressions 32 by utilizing leakage current from the external electrode 22 (or 21) using a manufacturing method described later.

[0083] The radius of the recess 32 in plan view is preferably 10 nm or more and 1000 nm or less, and more preferably 100 nm or more and 500 nm or less.

[0084] The shape of the recess 32 in plan view is usually circular, but may be elliptical.

[0085] The depth of the recess 32 is not particularly limited, but is preferably 10 nm or more and 1000 nm or less, more preferably 50 nm or more and 500 nm or less, and even more preferably 100 nm or more and 300 nm or less.

[0086] Because depressions 32 are formed on the surface of the element body 10 in this manner, an image can be obtained in which the depressions 32 and areas of the element body 10 other than the depressions 32 are contrasted, and the code 30 can be read based on this image.

[0087] Fig. 12 is a plan view schematically showing another modified example of the electronic component shown in Fig. 1, and is an enlarged view of the code forming portion. Fig. 13 is an example of a cross-sectional view taken along line E-E of the electronic component shown in Fig. 12.

[0088] 12 and 13 , depressions 42 having a radius different from that of the depressions 32 in a plan view may be arranged on the element body 10 so as to form a frame 40 surrounding the code 30. This makes it easier to identify the area in which the code 30 is formed, making it easier to read the code 30. The frame 40 may be rectangular, for example.

[0089] The radius, in plan view, of the recess 42 that forms the frame portion 40 is preferably larger than the radius, in plan view, of the recess 32 that forms the cord 30. Specifically, the radius, in plan view, of the recess 42 is preferably 100 nm or more and 1000 nm or less, more preferably 200 nm or more and 1000 nm or less, and even more preferably 500 nm or more and 1000 nm or less.

[0090] The shape of the recess 42 in a plan view is usually circular, but may be elliptical. The shapes of the recess 32 and the recess 42 in a plan view may be different from each other or may be substantially the same shape.

[0091] The depth of the recess 42 forming the frame portion 40 is not particularly limited, but is preferably 100 nm or more and 1000 nm or less, more preferably 200 nm or more and 500 nm or less, and even more preferably 30 nm or more and 500 nm or less.

[0092] (Method for Manufacturing Electronic Component) Next, a method for manufacturing an electronic component according to an embodiment of the present invention will be described.

[0093] The method for manufacturing an electronic component according to the embodiment of the present invention is a method for manufacturing the electronic component 1 according to the embodiment described above.

[0094] First, a solution containing metal ions is prepared.

[0095] Examples of metal ions include Ni ions, Cu ions, Au ions, Ag ions, etc. Among these, Ni ions and Cu ions are preferred from the viewpoints that the metal has a melting point equal to or higher than the temperature during mounting (e.g., 250°C) and is inexpensive.

[0096] Examples of solutions containing metal ions that can be used include a nickel sulfate bath, a nickel sulfamate bath, a copper sulfate bath, a copper pyrophosphate bath, a gold cyanide bath, a gold sodium sulfite bath, a silver cyanide bath, and a silver methanesulfonate bath.

[0097] The concentration of metal ions in the solution is not particularly limited, but is preferably 0.1 mol / L or more and 2 mol / L or less, and more preferably 0.5 mol / L or more and 1.5 mol / L or less.

[0098] Fig. 14 is a cross-sectional view schematically showing an example of how a probe is filled with a solution in a method for manufacturing an electronic component according to an embodiment of the present invention. Fig. 15 is a cross-sectional view schematically showing an example of an apparatus used in a method for manufacturing an electronic component according to an embodiment of the present invention. Note that in Fig. 15 and Fig. 16 described below, the internal conductors of element body 10 are not shown.

[0099] 14, the above-mentioned solution 61 is filled into a cylindrical probe 63 having an electrode 62 disposed therein. The probe 63 has a cylindrical shape tapered toward the tip, and the rod-shaped electrode 62 is inserted and fixed in the internal space.

[0100] An opening having a circular shape in plan view is provided at the tip of the probe 63. The tip diameter (radius of the opening) of the probe 63 is preferably 10 nm or more and 1000 nm or less, and more preferably 100 nm or more and 500 nm or less.

[0101] As shown in Fig. 14, one end of the electrode 62 is inserted close to the tip of the probe 63, and as shown in Fig. 15, the other end is electrically connected to an electricity supply means 64. The material of the electrode 62 is not particularly limited, but a general reference electrode such as a hydrogen electrode or a silver-silver chloride electrode can be used. The distance d2 between one end of the electrode 62 and the tip of the probe 63 is preferably 1 µm or more and 100 µm or less, and more preferably 10 µm or more and 50 µm or less.

[0102] 15 corresponds to the electronic component 1 at a stage before the cord 30 is formed (the same as the electronic component 1 except that the cord 30 is not formed), and is arranged so that the external electrodes 21, 22 are in contact with the electrical supply plate 65. In other words, the electronic component 1A is an individualized electronic component after firing. The electrical supply plate 65 is electrically connected to an electrical supply means 64.

[0103] A position control device (not shown) that controls the position of the probe 63 in three-dimensional space is connected to the probe 63. The position control device includes, for example, a Z-axis stage that holds the probe 63 movably in the Z direction (vertical direction, for example, height direction T), an XY-axis stage that holds the placed electricity supply plate 65 movably in the X and Y directions (horizontal directions, for example, directions parallel to the length direction L and width direction W), and a controller that controls the Z-axis stage and the XY-axis stage.

[0104] 16 is a cross-sectional view showing an example of how a probe tip is brought close to an element body of an electronic component in a manufacturing method of an electronic component according to an embodiment of the present invention, and FIG. 17 is a cross-sectional view showing an example of how a meniscus is formed between the element body and the probe in a manufacturing method of an electronic component according to an embodiment of the present invention.

[0105] 16, the X, Y, and Z points of the probe 63 are controlled to bring the tip of the probe 63 close to the element body 10 of the electronic component 1A (probe position control step). That is, the position control device moves the probe 63, and the tip is positioned above the region of the element body 10 where metal particles are to be formed.

[0106] 17, the solution 61 coming out from the tip of the probe 63 is brought into contact with the element body 10. That is, the position control device moves the probe 63 downward until the solution 61 comes into contact with the element body 10. A meniscus 66 is then formed between the element body 10 and the probe 63 (meniscus formation process). As a result, the solution 61 does not spread endlessly over the element body 10, but rather remains on the element body 10 due to its surface tension, forming a hemispherical shape. The amount of solution 61 that comes into contact with the element body 10 is extremely small.

[0107] In this case, the shortest distance d3 between the tip of the probe 63 and the element body 10 is preferably 15 nm or more and 1500 nm or less, more preferably 150 nm or more and 750 nm or less, and even more preferably 300 nm or more and 750 nm or less.

[0108] The radius of the meniscus 66 is not particularly limited, but is preferably 20 nm or more and 2000 nm or less, more preferably 50 nm or more and 1000 nm or less, and even more preferably 100 nm or more and 500 nm or less.

[0109] FIG. 18 is a cross-sectional view that schematically shows an example of how metal particles are deposited on an element body in a method for manufacturing an electronic component according to an embodiment of the present invention.

[0110] 18 , with meniscus 66 formed, a voltage is applied between external electrodes 21, 22 and electrode 62 of electronic component 1A, causing metal particles 31 to precipitate on element body 10 (metal particle precipitation process). That is, when electricity is supplied to external electrodes 21, 22 and electrode 62 by electricity supply means 64, a leakage current occurs, and metal ions are reduced on element body 10, causing metal particles 31 to precipitate. Thereafter, the tip of probe 63 is moved away from meniscus 66.

[0111] A pulse voltage is applied to the external electrodes 21, 22 and the electrode 62 in the cathodic direction, and by controlling this voltage, the particle radius of the metal particles 31 can be controlled. Specifically, the larger the voltage value of the pulse voltage and the longer the application time of the pulse voltage, the larger the particle radius of the deposited metal particles 31 can be. This makes it possible to separately produce metal particles 31 for forming the cord 30 and metal particles 41 for forming the frame portion 40.

[0112] The voltage of the pulse voltage is preferably 1V or more and 100V or less, and more preferably 10V or more and 50V or less.

[0113] The application time of the pulse voltage is preferably 100 μs or more and 10 s or less, and more preferably 500 μs or more and 1 s or less.

[0114] A predetermined voltage may be constantly applied to the external electrodes 21, 22 and the electrode 62, even before the solution 61 coming out of the tip of the probe 63 is brought into contact with the element body 10. This allows a leakage current that occurs the moment the solution 61 comes into contact with the element body 10 to be detected, and a pulse voltage may be applied at the timing of this detection to precipitate the metal particles 31.

[0115] Although this leakage current may occur from conductive parts such as the external electrodes 21 and 22 and the internal electrode layers 13 and 14, utilizing the leakage current from the external electrode 22 (or 21) allows for more effective deposition of the metal particles 31. Therefore, it is preferable to arrange the cord 30 in the vicinity of the external electrode 22 (or 21) as described above.

[0116] FIG. 19 is a cross-sectional view that schematically shows an example of how a probe is scanned over an element body in a method for manufacturing an electronic component according to an embodiment of the present invention.

[0117] 19 , by repeatedly performing the above-described probe 63 position control step, meniscus formation step, and metal particle deposition step, metal particles 31 can be deposited while controlling the particle radius and arrangement. In other words, it is possible to form a code 30 using metal particles 31. Furthermore, according to this method, even if there are steps in element body 10, the code 30 can be formed by scanning probe 63 along the steps.

[0118] FIG. 20 is a cross-sectional view that schematically shows an example of how a recess is formed on an element body in a method for manufacturing an electronic component according to an embodiment of the present invention.

[0119] In the above example, metal particles 31 are precipitated using solution 61 containing metal ions, but as shown in Fig. 20, solution 67 containing a strong acid may be used instead of solution 61. Then, with meniscus 66 formed, a voltage may be applied between external electrodes 21, 22 and electrode 62 of electronic component 1A to dissolve part of element body 10 and form depressions 32 on element body 10 (depression forming step).

[0120] The strong acid is an electrolyte that almost completely ionizes protons when equilibrium is reached in the solution 67. Specifically, for example, hydrochloric acid, nitric acid, sulfuric acid, and mixtures thereof can be used. The solution 67 is usually an aqueous solution of a strong acid containing a strong acid and water.

[0121] The concentration of the strong acid in the solution 67 is not particularly limited, but is preferably 1 mol / L or more and 10 mol / L or less, and more preferably 2 mol / L or more and 5 mol / L or less.

[0122] The conditions are the same as when the solution 61 containing metal ions is used.

[0123] In addition, even when the solution 67 is used, the radius of the recess 32 can be increased by increasing the voltage value of the pulse voltage (in the anode direction) and by increasing the application time of the pulse voltage. This makes it possible to separately form the recess 32 for forming the cord 30 and the recess 42 for forming the frame portion 40.

[0124] However, when using solution 67, it is not necessary to apply a voltage between external electrodes 21, 22 and electrode 62. In other words, simply contacting element body 10 with solution 67 can dissolve a portion of element body 10 and form depressions 32 on element body 10. In this case, the longer the contact time, the larger the radius of depression 32 can be. However, from the perspective of controlling the shape of depression 32, it is preferable to apply a voltage between external electrodes 21, 22 and electrode 62 even when solution 67 is used.

[0125] According to the above-described method, the code 30 can be formed after the barrel process for rounding the corners of the electronic component 1, the coating and plating process for forming the external electrodes 21, 22, etc., and therefore, a decrease in yield during these processes can be prevented.

[0126] FIG. 21 is a perspective view schematically showing another example of a method for manufacturing an electronic component according to an embodiment of the present invention.

[0127] 21 , codes 30 may be formed in each electronic component region before a semi-finished electronic component block 70 is diced into individual electronic components, and then the electronic component block 70 may be cut to diced into individual electronic components. In this case, dummy electrodes 71 for current application may be formed, for example, only on the top surface, and terminals 72 electrically connected to power supply means 64 may be brought into contact with the dummy electrodes 71 to form the codes 30, followed by dicing, and then regular external electrodes may be formed on the side and bottom surfaces as well, thereby obtaining the structure of the electronic component 1 described above.

[0128] (Traceability System) Next, a traceability system according to an embodiment of the present invention will be described. Fig. 22 is a diagram schematically showing an example of the traceability system according to an embodiment of the present invention.

[0129] The traceability system 100 shown in Figure 22 includes a code reader 110, an information processing device 120 communicatively connected to the code reader 110 via a network, and a database 130 communicatively connected to the information processing device 120 via the network.

[0130] The code reader 110 reads the code 30 of the electronic component 1. The code reader 110 includes, for example, an image acquisition unit (not shown) that acquires an image (gray image) of the code 30, and an image processing unit (not shown) that performs binarization processing on the acquired image of the code 30 to generate a binary image, decodes the code 30 based on the generated binary image, and restores the information indicated by the code 30.

[0131] The code reader 110 reads the part ID, product type information, and material information indicated by the code 30 .

[0132] It should be noted that, for example, an optical microscope with a camera, such as a microscope, can be used as the image acquisition unit of the code reader 110. Alternatively, the image acquisition unit of the code reader 110 may include a scanning electron microscope (SEM).

[0133] The image processing section of the code reader 110 is configured as a computer system including a CPU (Central Processing Unit), memory, etc., and the above-mentioned processing is realized by executing a predetermined software program in the CPU.

[0134] The database 130 stores (memorizes) component disposal information that specifies the post-use disposal method for each type of electronic component. Examples of post-use disposal methods include recycling, reuse, rebuilding, and disposal of electronic components.

[0135] The information processing device 120 is configured as a computer system including a CPU, memory, etc., and also includes input devices such as a keyboard and a mouse, and a display device such as a liquid crystal display.

[0136] The information processing device 120 compares the type of electronic component 1 read by the code reader 110 with the component processing information in the database 130 to determine (search for) a post-use disposal method for the electronic component 1. The information processing device 120 then outputs the determination result to a display device, allowing the user to check the post-use disposal method for the electronic component 1 on the display device.

[0137] The database 130 may store (memorize) component processing information that specifies the post-use disposal method for each type and material of the electronic component, and the information processing device 120 may compare the type and material of the electronic component 1 read by the code reader 110 with the component processing information in the database 130 to determine the post-use disposal method for the electronic component 1.

[0138] In the above embodiment, a two-dimensional code is provided, but in the present invention, the code may be a one-dimensional code such as a barcode. In this case, each line of the one-dimensional code can be drawn using a plurality of metal particles or depressions.

[0139] Furthermore, in the above embodiment, the case where the cord is formed only from metal particles or depressions has been described, but in the present invention, one cord may be formed using both metal particles and depressions.

[0140] The present specification discloses the following:

[0141] <1> An electronic component comprising an element body and external electrodes provided on the element body, wherein metal particles having a particle radius of 10 nm or more and 1000 nm or less are arranged on the element body so as to form a code.

[0142] <2> The electronic component according to <1>, wherein metal particles having a particle radius different from that of the metal particles are arranged on the element body so as to form a frame surrounding the cord.

[0143] <3> The electronic component according to <1> or <2>, further comprising a glass coating film on the element body that covers the metal particles that form the code.

[0144] <4> The electronic component according to any one of <1> to <3>, wherein the cord is disposed within a range of 100 μm from the external electrode.

[0145] <5> An electronic component comprising an element body and external electrodes provided on the element body, wherein depressions having a radius of 10 nm or more and 1000 nm or less in a plan view are arranged on the element body so as to form a code.

[0146] <6> The electronic component according to <5>, wherein a recess having a different radius from the recess in a plan view is arranged on the element body so as to form a frame that surrounds the cord.

[0147] <7> The electronic component according to <5> or <6>, wherein the cord is disposed within a range of 100 μm from the external electrode.

[0148] <8> The electronic component according to any one of <1> to <7>, wherein the code is a two-dimensional code.

[0149] <9> The electronic component according to any one of <1> to <8>, wherein the information indicated by the code includes information indicating the type of the electronic component.

[0150] <10> The electronic component according to <9>, wherein the information indicated by the code further includes information indicating a material of the electronic component.

[0151] <11> A method for manufacturing an electronic component according to any one of <1> to <10>, comprising the steps of: preparing a solution containing metal ions; filling a cylindrical probe having an electrode disposed therein with the solution; controlling an X point, a Y point, and a Z point of the probe to bring a tip of the probe close to an element body of an electronic component; bringing the solution coming out of the tip of the probe into contact with the element body to form a meniscus between the element body and the probe; and applying a voltage between an external electrode of the electronic component and the electrode in a state in which the meniscus is formed, to deposit metal particles on the element body.

[0152] <12> A method for manufacturing an electronic component according to any one of <1> to <10>, comprising: preparing a solution containing a strong acid; filling a cylindrical probe with the solution; controlling an X point, a Y point, and a Z point of the probe to bring a tip of the probe close to an element body of an electronic component; bringing the solution coming out of the tip of the probe into contact with the element body to form a meniscus between the element body and the probe; and dissolving a part of the element body while the meniscus is formed to form a depression on the element body.

[0153] <13> The method for manufacturing an electronic component according to <12>, wherein the probe has an electrode disposed therein, and in the step of forming the recess, a voltage is applied between the electrode and an external electrode of the electronic component in a state where the meniscus is formed.

[0154] <14> A traceability system comprising: a code reader that reads the code of the electronic component described in <9> or <10>; a database that stores component processing information that specifies a post-use disposal method for each type of electronic component; and an information processing device that compares the type of electronic component read by the code reader with the component processing information in the database to determine a post-use disposal method for the electronic component.

[0155] REFERENCE SIGNS LIST 1, 1A Electronic component 10 Body 10a Top surface 10b Bottom surface 10c First side surface 10d Second side surface 10e Third side surface 10f Fourth side surface 11 Dielectric layer 12 Dielectric ceramic layer 13, 14 Internal electrode layer 21, 22 External electrode 23 Resin electrode layer 24 Ni plating layer 25 Outermost layer 26 Sn plating layer 30 Code 31, 41 Metal particles 32, 42 Recess 40 Frame 50 Glass coating film 61, 67 Solution 62 Electrode 63 Probe 64 Electricity supply means 65 Electricity supply plate 66 Meniscus 70 Electronic component block 71 Dummy electrode 72 Terminal 100 Traceability system 110 Code reader 120 Information processing device 130 Database

Claims

1. An electronic component comprising: an element body; and an external electrode provided on the element body, An electronic component, wherein metal particles having a particle radius of 10 nm or more and 1000 nm or less are arranged on the element body so as to form a code.

2. The electronic component according to claim 1 , wherein metal particles having a particle radius different from that of the metal particles are arranged on the base body so as to form a frame surrounding the cord.

3. 3. The electronic component according to claim 1, further comprising a glass coating film on said element body, said glass coating film covering said metal particles forming said code.

4. The electronic component according to claim 1 , wherein the code is disposed within a range of 100 μm from the external electrode.

5. An electronic component comprising: an element body; and an external electrode provided on the element body, An electronic component, wherein depressions having a radius of 10 nm or more and 1000 nm or less in a plan view are arranged on the element body so as to form a code.

6. The electronic component according to claim 5 , wherein a recess having a different radius from the recess in a plan view is arranged on the element body so as to form a frame surrounding the cord.

7. The electronic component according to claim 5 , wherein the code is disposed within a range of 100 μm from the external electrode.

8. The electronic component according to claim 1 , wherein the code is a two-dimensional code.

9. The electronic component according to claim 1 , wherein the information indicated by the code includes information indicating a product type of the electronic component.

10. The electronic component according to claim 9 , wherein the information indicated by the code further includes information indicating a material of the electronic component.

11. A method for manufacturing an electronic component comprising: an element body; and an external electrode provided on the element body, wherein metal particles having a particle radius of 10 nm or more and 1000 nm or less are arranged on the element body so as to form a code, Providing a solution containing metal ions; filling the solution into a cylindrical probe having electrodes disposed therein; a step of controlling an X point, a Y point, and a Z point of the probe to bring the tip of the probe close to an element of an electronic component; bringing the solution coming out of the tip of the probe into contact with the element body to form a meniscus between the element body and the probe; and applying a voltage between an external electrode of the electronic component and the electrode while the meniscus is formed, thereby precipitating metal particles onto the element body.

12. A method for manufacturing an electronic component comprising: an element body; and an external electrode provided on the element body, wherein depressions having a radius of 10 nm or more and 1000 nm or less in a plan view are arranged on the element body so as to form a code, Providing a solution containing a strong acid; filling a cylindrical probe with the solution; a step of controlling an X point, a Y point, and a Z point of the probe to bring the tip of the probe close to an element of an electronic component; bringing the solution coming out of the tip of the probe into contact with the element body to form a meniscus between the element body and the probe; and a step of dissolving a portion of the element body while the meniscus is formed to form a depression on the element body.

13. The probe has an electrode disposed therein, The method for producing an electronic component according to claim 12 , wherein in the step of forming the recess, a voltage is applied between an external electrode of the electronic component and the electrode in a state in which the meniscus is formed.

14. A code reader for reading a code of an electronic component; a database storing part processing information that specifies a post-use processing method for each type of electronic part; an information processing device that compares the type of the electronic component read by the code reader with the component processing information in the database to determine a processing method for the electronic component after use; the electronic component comprises an element body and external electrodes provided on the element body, On the element, metal particles having a particle radius of 10 nm or more and 1000 nm or depressions having a radius of 10 nm or more and 1000 nm or less in a plan view are arranged so as to form a code; A traceability system in which the information indicated by the code includes information indicating the type of the electronic component.