Photosensitive composition, cured product, display device, and production method for cured product

Abstract

A photosensitive composition according to the present invention contains a binder resin (A) and a photosensitizer (C). The photosensitizer (C) contains a naphthoquinone diazide compound (C1). The photosensitive composition also contains methanol and / or ethanol and satisfies condition (7). (7) The total methanol and ethanol content of the photosensitive composition is 0.0010–30,000 mass ppm. The photosensitive composition has excellent sensitivity during exposure, suppresses post-development residues, and has excellent storage stability. This display device, which comprises a cured product produced by curing the photosensitive composition, has excellent light emission intensity.

Description

Photosensitive composition, cured product, display device, and method for producing the cured product

[0001] The present invention relates to a photosensitive composition, a cured product, a display device, and a method for producing the cured product.

[0002] In recent years, technologies related to organic electroluminescence (hereinafter "OLED") displays, quantum dot displays, and micro light-emitting diode (hereinafter "LED") displays have been actively researched for thin displays such as smartphones. For example, the pixel division layer of an OLED display is formed by photolithography. To reduce the process time in the manufacture of OLED displays, the materials used must have high sensitivity during exposure. Furthermore, it is also necessary to suppress development residues during positive or negative pattern formation by photolithography. Furthermore, for example, foreign matter may be generated after storage of a photosensitive composition at room temperature, and the foreign matter may remain in the openings of the pixel division layer. Such foreign matter can lead to the generation of dark spots in the pixel area and a shortened lifespan of the light-emitting element. Therefore, the materials used must also have excellent storage stability to prevent the generation of foreign matter.

[0003] Micro LED displays are expected to be used not only for televisions and smartphones, but also for new applications such as signage, AR (Augmented Reality), VR (Virtual Reality), and transparent displays. Micro LED displays emit light in all directions from the LEDs that serve as light sources, so if light is absorbed by the insulating layer, protective layer, or partitions of the surrounding components, the light extraction efficiency will decrease. Therefore, there is a need to improve brightness by improving the configuration of the insulating layer, protective layer, or partitions, as well as the physical properties of the materials used.

[0004] Examples of the photosensitive composition include a positive photosensitive composition containing polyimide as a resin (see, for example, Patent Document 1) and a positive photosensitive composition containing polysiloxane as a resin (see Patent Document 2).

[0005] JP 2002-091343 A JP 2006-178436 A

[0006] However, the compositions described in Patent Documents 1 and 2 have problems in achieving sensitivity during exposure, suppression of residue after development, storage stability, and luminescence brightness at the same time, and therefore further improvements in the properties of photosensitive compositions have been desired.

[0007] An object of the present invention is to provide a photosensitive composition that combines excellent sensitivity during exposure, suppression of residue after development, and excellent storage stability, a cured product obtained by curing the photosensitive composition, a method for producing the cured product, and a display device that includes the cured product and has excellent luminescence brightness.

[0008] In order to solve the above-mentioned problems, the present invention has the following configurations [1] to

[17] . [1] A photosensitive composition containing (A) a binder resin and (C) a photosensitizer, wherein the (C) photosensitizer contains (C1) a naphthoquinone diazide compound, and further contains methanol and / or ethanol, and the photosensitive composition satisfies the following condition (7): (7) The total content of methanol and ethanol in the photosensitive composition is 0.0010 to 30,000 ppm by mass. [2] The photosensitive composition according to [1] above, further containing one or more solvents selected from the group consisting of 1-methoxy-2-propanol, 1-ethoxy-2-propanol, methyl acetate, ethyl acetate, allyl methyl ether, allyl ethyl ether, isoallyl methyl ether, and isoallyl ethyl ether, and the photosensitive composition satisfies the following condition (8). (8) The photosensitive composition according to item (1) or (2) above, further comprising one or more members selected from the group consisting of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, 2-methoxy-1-propyl acetate, 2-ethoxy-1-propyl acetate, methallyl methyl ether, and methallyl ethyl ether, and the photosensitive composition satisfies the following condition (9): (9) The photosensitive composition according to any one of items (1) to (3), further comprising water, and satisfying the following condition (3): (4) the total content of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, 2-methoxy-1-propyl acetate, 2-ethoxy-1-propyl acetate, methallyl methyl ether, and methallyl ethyl ether in the photosensitive composition is 0.0010 to 1,000 ppm by mass; and (5) the total content of 2-methoxy-1-propanol, 2-ethoxy-1-propyl acetate, methallyl methyl ether, and methallyl ethyl ether in the photosensitive composition is 0.0010 to 1,000 ppm by mass.(3) The content of water in the photosensitive composition is 0.010 to 3.0 mass %. [5] The photosensitive composition according to any one of the above items [1] to [4], which contains one or more ions selected from the group consisting of sulfate ions, sulfite ions, nitrate ions, nitrite ions, phosphate ions, phosphite ions, hypophosphite ions, formate ions, acetate ions, and oxalate ions, and satisfies the following condition (4); and / or, which contains one or more ions selected from the group consisting of phosphoric acid esters, phosphonic acid, phosphonic acid esters, phosphite esters, phosphinic acid, and hypophosphite esters, and satisfies the following condition (5). (4) The total content of sulfate ions, sulfite ions, nitrate ions, nitrite ions, phosphate ions, phosphite ions, hypophosphite ions, formate ions, acetate ions, and oxalate ions in the total solid content of the photosensitive composition is 0.0010 to 30,000 ppm by mass. (5) The total content of phosphoric acid esters, phosphonic acid esters, phosphonic acid esters, phosphite esters, phosphinic acid, and hypophosphite esters in the total solid content of the photosensitive composition is 0.0010 to 30,000 ppm by mass. [6] The photosensitive composition according to any one of items (1) to (5) above, further comprising a tertiary amine compound and / or a quaternary ammonium ion, and satisfying the following condition (6): (6) The photosensitive composition according to any one of the above items [1] to [6], wherein the total content of the tertiary amine compound and the quaternary ammonium ion in the total solid content of the photosensitive composition is 0.0010 to 50,000 ppm by mass. [7] The photosensitive composition according to any one of the above items [1] to [6], wherein the binder resin (A) satisfies the following condition (P1a): (P1a) The content of fluorine elements in the structure of the binder resin (A) is 10,000 ppm by mass or less. [8] The photosensitive composition according to any one of the above items [1] to [7], wherein the binder resin (A) satisfies the following condition (1a): (1a) The photosensitive composition has a fluorine element content of 1,000 mass ppm or less in the total solid content of the photosensitive composition. [9] The photosensitive composition according to any one of the above items [1] to [8], wherein the (A) binder resin contains (A1) a weakly acidic group-containing resin, and the (A1) weakly acidic group-containing resin has, as the (WA) weakly acidic group, one or more groups selected from the group consisting of a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, a 1,1-bis(trifluoromethyl)methylol group, and a mercapto group.

[10] The photosensitive composition according to [9] above, wherein the (A1) weakly acidic group-containing resin comprises a (A1x-1) resin:polysiloxane.

[11] The photosensitive composition according to

[10] above, wherein the photosensitive composition is diluted with water to prepare a diluted solution, and when the solids concentration of the diluted solution is 1 / 100 of the solids concentration of the photosensitive composition, the hydrogen ion exponent of the diluted solution is 5.5 to 7.0.

[12] The photosensitive composition according to

[10] or

[11] above, wherein the (A1x-1) resin has a trifunctional organosilane unit represented by general formula (9) and a tetrafunctional organosilane unit represented by general formula (10). In the general formula (9) and the general formula (10), R ６１ represents a hydrogen atom or a monovalent organic group. １ ~* ３each independently represents a bonding point in the resin.

[13] The photosensitive composition according to any one of [1] to

[12] above, wherein the (C) photosensitizer further contains (C3) a photoacid generator and / or (C4) a photobase generator.

[14] A cured product obtained by curing the photosensitive composition according to any one of [1] to

[13] above.

[15] A display device comprising the cured product according to

[14] above.

[16] A method for producing a cured product, comprising: (1) a step of forming a coating film of the photosensitive composition according to any one of [1] to

[13] above on a substrate; (2) a step of irradiating the coating film of the photosensitive composition with actinic rays through a photomask; (3) a step of developing the coating film with a developer to form a pattern of the photosensitive composition; and (4) a step of heating the pattern to obtain a cured pattern of the photosensitive composition.

[17] A display device having a substrate, a redistribution layer, an interlayer insulating layer for the redistribution layer, and a semiconductor chip, and further having a partition layer and / or a planarizing layer, wherein the semiconductor chip is a light-emitting element, the area of ​​the redistribution layer is larger than the area of ​​the semiconductor chip in a planar view, the partition layer is formed between adjacent semiconductor chips, and the planarizing layer is formed so as to cover at least a portion of the semiconductor chip, and the partition layer and / or the planarizing layer contain methanol and / or ethanol and satisfy the following conditions (X1a) and / or (X1b): (X1a) the total content of methanol and ethanol in the partition layer is 0.0010 to 30,000 ppm by mass, and (X1b) the total content of methanol and ethanol in the planarizing layer is 0.0010 to 30,000 ppm by mass.

[0009] The photosensitive composition of the present invention can achieve excellent sensitivity during exposure, reduced residue after development, and excellent storage stability. In addition, it is possible to provide a cured product that can be used in a display device with excellent luminance. Furthermore, the display device of the present invention can provide a display device with excellent luminance.

[0010] 1 is a schematic cross-sectional view of a micro LED display having a partition layer and a planarization layer; 2 is a schematic cross-sectional view of another type of micro LED display having a partition layer and a planarization layer; 3 is a plan view showing the manufacturing process of steps 1 to 4 for the substrate of an organic EL display used in evaluating light-emitting characteristics.

[0011] The photosensitive composition of the present invention will be described in detail below, along with embodiments. However, the present invention is not limited to the following embodiments, and various modifications are naturally possible as long as the object of the invention can be achieved and the gist of the invention is not deviated from. In the following description, the main chain of a resin refers to the longest chain among the chains constituting a resin containing structural units. The side chain of a resin refers to a chain branched from or bonded to the main chain among the chains constituting a resin containing structural units, which is shorter than the main chain. The term "terminal end of a resin" refers to a structure that blocks the main chain, such as a structure derived from a terminal blocking agent.

[0012] <Photosensitive Composition> The photosensitive composition of the present invention has the configuration [1] above. By adopting the configuration [1] above, the photosensitive composition of the present invention can combine excellent sensitivity during exposure, reduced residue after development, and excellent storage stability. In addition, it is possible to provide a cured product that can be used in a display device with excellent luminance. This is thought to be because the inclusion of trace amounts of the above-mentioned methanol and / or ethanol in the photosensitive composition promotes dissolution in a developer due to the hydrophilicity of the compound, thereby achieving excellent sensitivity during exposure and reduced residue after development. Furthermore, the surface of the substrate is modified by the compound, which is thought to prevent residue adhesion at openings, thereby achieving the effect of reduced residue after development.

[0013] Furthermore, intentionally incorporating trace amounts of the above-mentioned methanol and / or ethanol is believed to stabilize the polar groups of the resin in the photosensitive composition through interactions mediated by hydrogen bonds via the hydroxy groups in the compound. In particular, when a polysiloxane is incorporated into the photosensitive composition, this is suitable for stabilizing the silanol groups in the polysiloxane. Additionally, the hydroxy groups in the compound are believed to control the polarization structure and charge balance in the photosensitive composition. As a result, it is believed that excellent storage stability is achieved. Furthermore, when a pattern of the photosensitive composition is formed on wiring such as metal, the compound in the photosensitive composition is believed to surface-modify the wiring surface that becomes the opening or the wiring surface that contacts the pattern. Furthermore, it is believed that the hydroxy groups in the compound contained in the cured product capture trace amounts of metal impurities and ionic impurities in the cured product, and these impurities migrate to the wiring surface, thereby acting as carriers in the wiring. As a result, the conductivity of the metal wiring or other wiring is controlled, enabling low-voltage operation, thereby achieving the effect of high luminescence brightness.

[0014] <(A) Binder Resin> The photosensitive composition of the present invention contains (A) binder resin. The (A) binder resin is a heat-resistant resin, at least a portion of which remains in a cured product obtained by curing the composition. Furthermore, the (A) binder resin in the composition may remain in a cured product obtained by curing the composition. The (A) binder resin is preferably a resin that hardens by forming a crosslinked structure through a reaction. The reaction is not particularly limited, and may be caused by heating, irradiation with energy rays, or the like, and a crosslinked structure may also be formed by a (F) crosslinking agent described below. The (A) binder resin is preferably a thermosetting resin.

[0015] The (A) binder resin is preferably an alkali-soluble resin having an acidic group or an organic solvent-soluble resin having an organic solvent-soluble structure. The (A) binder resin is preferably a resin that has solubility that allows the composition to be imparted with positive or negative photosensitivity by the (C) photosensitizer described below and that can form a positive or negative pattern.

[0016] The binder resin (A) more preferably has an acidic group in its structural unit. From the viewpoint of pattern processability in an alkaline developer, the acidic group is preferably a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, a 1,1-bis(trifluoromethyl)methylol group, a mercapto group, a carboxy group, a carboxylic acid anhydride group, or a sulfonic acid group, and from the viewpoint of improving sensitivity during exposure and suppressing residues after development, a carboxy group, a carboxylic acid anhydride group, or a sulfonic acid group is more preferred.

[0017] The binder resin (A) preferably has a radical polymerizable group, more preferably has a radical polymerizable group in a structural unit of the resin. The radical polymerizable group preferably has an ethylenically unsaturated double bond group, more preferably a photoreactive group, an alkenyl group having 2 to 5 carbon atoms, or an alkynyl group having 2 to 5 carbon atoms. The photoreactive group is preferably a styryl group, a cinnamoyl group, a maleimide group, a nadimide group, or a (meth)acryloyl group, and from the viewpoint of improving sensitivity during exposure, a (meth)acryloyl group is more preferred. On the other hand, the alkenyl group having 2 to 5 carbon atoms or the alkynyl group having 2 to 5 carbon atoms is preferably a vinyl group, an allyl group, a 2-methyl-2-propenyl group, a crotonyl group, a 2-methyl-2-butenyl group, a 3-methyl-2-butenyl group, a 2,3-dimethyl-2-butenyl group, an ethynyl group, or a 2-propargyl group, and from the viewpoint of improving sensitivity during exposure, a vinyl group or an allyl group is more preferable.

[0018] <(A1) Resin and (A2) Resin> The binder resin (A) preferably contains a weakly acidic group-containing resin (A1) and / or a weakly acidic group-free resin (A2).

[0019] From the viewpoint of improving sensitivity during exposure, the (A) binder resin contains a (A1) weakly acidic group-containing resin, and the (A1) weakly acidic group-containing resin preferably has, as the (WA) weakly acidic group, one or more groups selected from the group consisting of a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, a 1,1-bis(trifluoromethyl)methylol group, and a mercapto group, and more preferably has a (WA) weakly acidic group in a structural unit of the resin. Hereinafter, these groups may be collectively referred to as the "(WA) weakly acidic group." From the viewpoint of improving sensitivity during exposure and suppressing residues after development, the (WA) weakly acidic group is preferably a phenolic hydroxyl group, a silanol group, or a 1,1-bis(trifluoromethyl)methylol group (hereinafter referred to as the "specific (WA) weakly acidic group"). When the (A) binder resin satisfies the conditions (P1a) and / or (P2a) described below, or when the photosensitive composition of the present invention satisfies the conditions (1a) and / or (2a) described below, the acidic group possessed by the (A) binder resin is preferably a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, a mercapto group, a carboxy group, a carboxylic acid anhydride group, or a sulfonic acid group, and the (WA) weakly acidic group is preferably one or more groups selected from the group consisting of a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, and a mercapto group. The (A1) weakly acidic group-containing resin exhibits improved solubility in exposed areas due to the moderate acidity of the (WA) weakly acidic group and its interaction with the (C) photosensitizer described below, thereby achieving a significant effect of improving sensitivity during exposure. Certain (WA) weakly acidic groups among the (WA) weakly acidic groups promote alkaline dissolution, thereby achieving a significant effect of suppressing residues after development. Furthermore, when the composition has positive photosensitivity, a specific one of the (WA) weakly acidic groups can enhance the dissolution contrast between the exposed and unexposed areas due to strong interaction with the (C) photosensitizer, and also enhance the dissolution-promoting effect in the exposed areas, resulting in significant effects of improving sensitivity during exposure and suppressing residues after development.

[0020] From the viewpoint of suppressing residues after development, the binder resin (A) preferably contains a resin (A2) that does not have a weakly acidic group. The resin (A2) that does not have a weakly acidic group preferably has an acidic group different from the weakly acidic group (WA), and more preferably has an acidic group different from the weakly acidic group (WA) in the structural unit of the resin. From the viewpoint of improving sensitivity during exposure and suppressing residues after development, the acidic group different from the weakly acidic group (WA) is more preferably a carboxy group, a carboxylic acid anhydride group, or a sulfonic acid group.

[0021] From the viewpoint of improving sensitivity during exposure, the binder resin (A) preferably contains a weakly acidic group-containing resin (A1), which has a radically polymerizable group. Examples and preferred descriptions regarding the radically polymerizable group are as described above for the binder resin (A).

[0022] It is preferred that the (A) binder resin contains (A1) a weakly acidic group-containing resin and / or (A2) a resin not having a weakly acidic group, the (A1) weakly acidic group-containing resin contains (A1x) a resin having one or more structures selected from the group consisting of imide structures, amide structures, oxazole structures, and siloxane structures (hereinafter, "imide structures, etc.") in the structural units of the resin, and / or (A1y) a resin having a phenolic hydroxyl group in the structural units of the resin, and the (A2) resin not having a weakly acidic group contains (A2x) a resin having a radically polymerizable group and / or (A2y) a resin not having a radically polymerizable group.

[0023] From the viewpoints of improving sensitivity during exposure and suppressing residues after development, the binder resin (A) preferably contains a weakly acidic group-containing resin (A1) and a resin (A2) that does not have a weakly acidic group.

[0024] In addition, when the (A1x) resin, (A1y) resin, (A2x) resin, and (A2y) resin each have a structure or group that constitutes a different resin, they are classified into one of the classification methods shown in Table 1-1 below. When a certain resin can fall into two or more of the (A1x) resin, (A1y) resin, (A2x) resin, and (A2y) resin, the resin to which it falls is determined by the classification method.

[0025]

[0026] The (A) binder resin preferably contains an (A1x) resin and / or an (A1y) resin, more preferably contains an (A1x) resin, and even more preferably contains an (A1x) resin and an (A1y) resin. The (A) binder resin preferably contains an (A1x) resin and / or an (A1y) resin and further contains an (A2x) resin, and more preferably contains an (A1x) resin, an (A1y) resin, and an (A2x) resin. The (A) binder resin also preferably contains an (A1x) resin, an (A1y) resin, or an (A2x) resin and further contains an (A2y) resin. From the viewpoint of improving the properties of each resin, the (A) binder resin also preferably contains two or more resins selected from the group consisting of an (A1x) resin, an (A1y) resin, an (A2x) resin, and an (A2y) resin.

[0027] <(A1x) Resin> When the binder resin (A) contains a weakly acidic group-containing resin (A1), the weakly acidic group-containing resin (A1) preferably contains a (A1x) resin from the viewpoints of improving sensitivity during exposure, improving the reliability of the light-emitting device, and improving luminance. From the viewpoints of improving sensitivity during exposure, improving the reliability of the light-emitting device, and improving luminance, the (A1x) resins are selected from the group consisting of (A1x-1) resin: polysiloxane, (A1x-2) resin: polyimide, (A1x-3) resin: polyimide precursor, (A1x-4) resin: polybenzoxazole, (A1x-5) resin: polybenzoxazole precursor, (A1x-6) resin: polyamideimide, (A1x-7) resin: polyamideimide precursor, and (A1x-8) resin: polyamide, maleimide resin, maleimide-styrene resin. Preferably, the resin (A1x) contains one or more resins selected from the group consisting of acrylate resins, maleimide-triazine resins, maleimide-oxazine resins, and copolymers thereof, more preferably one or more resins selected from the group consisting of (A1x-1) resins, (A1x-2) resins, (A1x-3) resins, (A1x-4) resins, (A1x-5) resins, (A1x-6) resins, (A1x-7) resins, (A1x-8) resins, and copolymers thereof, and even more preferably resin (A1x-1). The resin (A1x) may be either a single resin or a copolymer thereof.

[0028] When the binder resin (A) contains the weakly acidic group-containing resin (A1), the weakly acidic group-containing resin (A1) preferably contains a polysiloxane resin (A1x-1), from the viewpoints of improving sensitivity during exposure, improving the reliability of the light-emitting device, and improving the luminance of light emitted from the light-emitting device.

[0029] The (A1x) resin has an imide structure, an amide structure, an oxazole structure, or a siloxane structure in its structural unit, and these structures capture metal impurities, ionic impurities, etc. that adversely affect electrical insulation, thereby suppressing ion migration and electromigration, and is presumed to improve the reliability of the light-emitting device. Furthermore, these structures are presumed to control the conductivity of wiring such as metal, thereby improving the luminance of the light-emitting device.

[0030] On the other hand, from the viewpoints of improving sensitivity during exposure, suppressing residues after development, and improving the reliability of the light-emitting device, it is preferable that the (A2x) resin and the (A2y) resin contain one or more resins selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, polyamideimide precursor, polyamide, maleimide resin, maleimide-styrene resin, maleimide-triazine resin, maleimide-oxazine resin, and copolymers thereof.

[0031] From the viewpoint of improving sensitivity during exposure and reliability of the light-emitting device, the resin (A1x) preferably has a radical polymerizable group. Examples and preferred descriptions of the radical polymerizable group are as described above for the binder resin (A). The radical polymerizable group is preferably obtained by reacting a portion of the phenolic hydroxyl groups and / or carboxyl groups of the resin with a compound having a radical polymerizable group.

[0032] From the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving the reliability of light-emitting devices, and improving luminance, the (A1x) resin preferably contains an (A1x) resin that does not have a radical polymerizable group and an (A1x) resin that has a radical polymerizable group. By adopting the above-described configuration, the (A1x) resin that does not have a radical polymerizable group is thought to suppress residue after development due to its acidic group or organic solvent-soluble structure, to capture metal impurities and ionic impurities, and to control the conductivity of metal wiring, while the (A1x) resin that has a radical polymerizable group is thought to improve sensitivity during exposure and improve the degree of crosslinking of the film by promoting radical polymerization. As a result, outgassing is suppressed, and the effect of improving the reliability of light-emitting devices is significant. Such functional separation in the (A1x) resin significantly improves multiple properties.

[0033] The acid equivalent of the (A1x) resin is preferably 200 g / mol or more from the viewpoint of improving sensitivity during exposure. On the other hand, the acid equivalent of the (A1x) resin is preferably 600 g / mol or less from the viewpoint of suppressing residue after development. The exposure here refers to irradiation with active actinic rays (radiation), and examples include irradiation with visible light, ultraviolet light, electron beams, and X-rays. Hereinafter, exposure refers to irradiation with active actinic rays (radiation). The double bond equivalent of the (A1x) resin is preferably 200 g / mol or more from the viewpoint of suppressing residue after development. On the other hand, the double bond equivalent of the (A1x) resin is preferably 3,000 g / mol or less from the viewpoint of improving sensitivity during exposure.

[0034] <Polysiloxane> (A1x-1) Resin: Polysiloxane has silanol groups and contains a siloxane structure in the structural unit of the resin, and is therefore classified as an (A1x) resin. Examples of the (A1x-1) resin include resins obtained by hydrolyzing and dehydrating condensation of one or more organosilanes selected from the group consisting of trifunctional organosilanes, tetrafunctional organosilanes, difunctional organosilanes, and monofunctional organosilanes.

[0035] From the viewpoints of improving sensitivity during exposure, suppressing residues after development, improving the reliability of the light-emitting device, and improving the luminance of light emitted, the (A1x-1) resin preferably has a trifunctional organosilane unit represented by general formula (9) and a tetrafunctional organosilane unit represented by general formula (10).

[0036]

[0037] In the general formula (9) and the general formula (10), R ６１ represents a hydrogen atom or a monovalent organic group. １ ~* ３ each independently represents a bonding point in the resin.

[0038] In the general formula (9) and the general formula (10), R ６１is preferably a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, a halogenated alkyl group having 1 to 10 carbon atoms, a halogenated cycloalkyl group having 4 to 10 carbon atoms, or a halogenated aryl group having 6 to 15 carbon atoms. The above-mentioned substituents and structures may have a heteroatom, and may be either unsubstituted or substituted.

[0039] From the viewpoint of improving sensitivity during exposure, the content ratio of the trifunctional organosilane unit represented by general formula (9) in the resin (A1x-1) is preferably 50 to 100 mol %, more preferably 60 to 100 mol %, and even more preferably 70 to 100 mol %, in terms of Si atom molar ratio.

[0040] The content of the tetrafunctional organosilane unit represented by general formula (10) in the resin (A1x-1) is preferably 1 mol % or more, more preferably 5 mol % or more, and even more preferably 10 mol % or more, in terms of Si atom molar ratio, from the viewpoint of suppressing residues after development. On the other hand, the content of the tetrafunctional organosilane unit represented by general formula (10) is preferably 40 mol % or less, more preferably 30 mol % or less, and even more preferably 20 mol % or less, in terms of Si atom molar ratio, from the viewpoint of improving the reliability of light-emitting devices.

[0041] The content of the bifunctional organosilane unit in the resin (A1x-1) is preferably 1 mol % or more, more preferably 5 mol % or more, and even more preferably 10 mol % or more, in terms of Si atom molar ratio, from the viewpoints of improving storage stability, reducing the taper of the pattern shape, and improving mechanical properties. On the other hand, the content of the bifunctional organosilane unit is preferably 40 mol % or less, more preferably 30 mol % or less, and even more preferably 20 mol % or less, in terms of Si atom molar ratio, from the viewpoint of improving the reliability of the light-emitting device.

[0042] From the viewpoint of improving storage stability, the content of the monofunctional organosilane unit in the resin (A1x-1) is preferably 1 mol % or more, more preferably 5 mol % or more, and even more preferably 10 mol % or more, in terms of Si atom molar ratio. On the other hand, from the viewpoint of improving reliability of the light-emitting device, the content of the monofunctional organosilane unit is preferably 40 mol % or less, more preferably 30 mol % or less, and even more preferably 20 mol % or less, in terms of Si atom molar ratio.

[0043] From the viewpoint of pattern processability in an alkaline developer, the resin (A1x-1) preferably has an organosilane unit containing an acidic group. From the viewpoint of improving sensitivity during exposure, it is more preferable that the resin (A1x-1) has an organosilane unit (WA) containing a weakly acidic group. From the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving chemical resistance, and improving the reliability of light-emitting devices, the resin (A1x-1) preferably has an organosilane unit (WA) containing a weakly acidic group and a fused polycyclic structure, a fused polycyclic heterocyclic structure, or an aromatic structure, and more preferably has an organosilane unit containing a 1,1-bis(trifluoromethyl)-1-hydroxymethylphenyl group or a phenolic hydroxyl group. Furthermore, from the viewpoints of improving sensitivity during exposure and suppressing residue after development, it is also preferable that the resin (A1x-1) has an organosilane unit containing a carboxy group, a carboxylic acid anhydride group, or a sulfonic acid group. Examples and preferred descriptions of the acidic group and the weakly acidic group (WA) are as described above for the binder resin (A). From the viewpoint of improving the above-mentioned properties, the content of organosilane units containing an acidic group in resin (A1x-1) is preferably 1 mol % or more, more preferably 5 mol % or more, and even more preferably 10 mol % or more, in terms of Si atom molar ratio. On the other hand, from the viewpoint of pattern processability in an alkaline developer, the content of organosilane units containing an acidic group is preferably 40 mol % or less, more preferably 30 mol % or less, and even more preferably 20 mol % or less, in terms of Si atom molar ratio.

[0044] From the viewpoints of improving sensitivity during exposure, improving chemical resistance, and improving the reliability of the light-emitting device, the resin (A1x-1) preferably has an organosilane unit containing a radical polymerizable group, and more preferably has an organosilane unit containing a styryl group, a (meth)acryloyl group, a vinyl group, or an allyl group. Examples and preferred descriptions of the radical polymerizable group are as described above for the binder resin (A).

[0045] From the viewpoints of suppressing residues after development, improving chemical resistance, and improving the reliability of light-emitting devices, the (A1x-1) resin preferably has an organosilane unit containing an epoxy group or an oxetanyl group, and more preferably has an organosilane unit containing a cyclohexylepoxy group, a glycidyl group, or an oxetanyl group.

[0046] From the viewpoints of improving sensitivity during exposure, suppressing residues after development, improving chemical resistance, and improving the reliability of light-emitting devices, the resin (A1x-1) preferably has an organosilane unit containing a fused polycyclic structure, a fused polycyclic heterocyclic structure, or an aromatic structure, more preferably has an organosilane unit containing a naphthyl group, an anthracenyl group, a biphenyl group, a phenyl group, a tolyl group, or a methoxyphenyl group, and even more preferably has an organosilane unit containing a naphthyl group or an anthracenyl group.

[0047] From the viewpoints of suppressing residues after development, improving the reliability of the light-emitting device, and improving the luminance of emitted light, the (A1x-1) resin preferably has organosilane units to which (G) inorganic particles are bonded, as described below. Hereinafter, (A1x-1) resins having such organosilane units may be collectively referred to as "inorganic particle-containing polysiloxanes." The inorganic particle-containing polysiloxane is preferably a resin obtained by hydrolyzing and dehydrating condensation of one or more organosilanes selected from the group consisting of trifunctional organosilanes, tetrafunctional organosilanes, difunctional organosilanes, and monofunctional organosilanes in the presence of (G) inorganic particles. The (G) inorganic particles are preferably silica particles. Examples and preferred descriptions of the (G) inorganic particles are as described below for the (G) inorganic particles.

[0048] <Polyimide-Based Resins and Other Resins> Hereinafter, (A1x) resin, (A2x) resin, or (A2y) resin, namely, polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, polyamideimide precursor, polyamide, and copolymers thereof, will be collectively described. These resins may also be collectively referred to as polyimide-based resins. Examples of polyimide precursors include polyamic acid, polyamic acid ester, polyamic acid amide, and polyisoimide. Examples of polyimides include resins obtained by dehydrating and cyclizing a polyimide precursor. Examples of polybenzoxazole precursors include polyhydroxyamide. Examples of polybenzoxazoles include resins obtained by dehydrating and cyclizing a polybenzoxazole precursor. Examples of polyamideimide precursors include resins obtained by reacting, for example, tricarboxylic acid anhydrides with diamines. Examples of polyamideimides include resins obtained by dehydrating and cyclizing a polyamideimide precursor. Examples of polyamides include resins obtained by reacting, for example, dicarboxylic acid chlorides with diamines.

[0049] From the viewpoint of improving sensitivity during exposure, the polyimide precursor preferably has an amic acid ester structural unit and / or an amic acid amide structural unit. The polyimide precursor may also have an imide ring-closed structural unit in which a portion of the amic acid structural unit, amic acid ester structural unit, or amic acid amide structural unit is ring-closed into an imide ring. The above-mentioned polyimides, polyimide precursors, polybenzoxazoles, polybenzoxazole precursors, polyamideimides, and polyamideimide precursors may be copolymers with polyamides.

[0050] From the viewpoint of improving sensitivity during exposure, the polyimide resin preferably contains a carboxylic acid residue having a fluorine atom and / or an amine residue having a fluorine atom. The total content of the carboxylic acid residues having a fluorine atom and the amine residues having a fluorine atom in the total carboxylic acid residues and the total amine residues in each resin is preferably 10 to 100 mol%, more preferably 30 to 100 mol%, and even more preferably 50 to 100 mol%. The preferred ranges for the total content of the amine residues having a fluorine atom in the total amine residues and the total content of the carboxylic acid residues having a fluorine atom in the total carboxylic acid residues are the same as those described above.

[0051] From the viewpoint of improving storage stability, the polyimide resin preferably has a structure in which the terminal of the resin is blocked with a monoamine, a dicarboxylic acid anhydride, or a monocarboxylic acid derivative. From the viewpoint of improving sensitivity during exposure and reliability of the light-emitting device, the polyimide resin preferably has a radical polymerizable group or a crosslinkable group capable of reacting with resins, etc., at the terminal of the resin, and more preferably has a maleimide group or a nadic acid anhydride. Examples of acid monomers having these groups include maleic anhydride and nadic anhydride.

[0052] <Fluorine Element Content in the Structure of the (A) Binder Resin> From the viewpoints of suppressing residue after development, improving the reliability of the light-emitting device, and improving luminance, it is preferable that the (A) binder resin satisfy the following condition (P1a). It is more preferable that the (A) binder resin further satisfy the following condition (P2a). Similarly, when the (A) binder resin is a polyimide-based resin, it is also preferable that the (A) binder resin satisfy the following condition (P1a), and more preferably the following condition (P2a), from the viewpoints of suppressing residue after development, improving the reliability of the light-emitting device, and improving luminance. (P1a) The fluorine element content in the structure of the (A) binder resin is 10,000 ppm by mass or less. (P2a) The fluoride ion content in the structure of the (A) binder resin is 10,000 ppm by mass or less.

[0053] From the viewpoint of the effects of the present invention, the content of elemental fluorine in the structure of the (A) binder resin is preferably 0 ppm by mass or more, more preferably 0.010 ppm by mass or more, even more preferably 0.030 ppm by mass or more, even more preferably 0.050 ppm by mass or more, particularly preferably 0.070 ppm by mass or more, and most preferably 0.10 ppm by mass or more. On the other hand, from the viewpoint of the effects of the present invention, the content of elemental fluorine is preferably 10,000 ppm by mass or less, more preferably 5,000 ppm by mass or less, even more preferably 1,000 ppm by mass or less, even more preferably 500 ppm by mass or less, particularly preferably 300 ppm by mass or less, and most preferably 100 ppm by mass or less. Furthermore, the fluorine content is preferably 50 ppm by mass or less, more preferably 30 ppm by mass or less, even more preferably 10 ppm by mass or less, even more preferably 5 ppm by mass or less, particularly preferably 3 ppm by mass or less, and most preferably 1 ppm by mass or less.

[0054] The preferred range of the content of fluoride ions in the structure of the binder resin (A) is the same as the preferred range of the content of fluorine element in the structure of the binder resin (A) described above.

[0055] The content of fluorine element in the structure of (A) binder resin may be 0 ppm by mass, and the content of fluoride ion in the structure of (A) binder resin may also be 0 ppm by mass.

[0056] By incorporating a binder resin (A) having a fluorine content of a specific value or less into the photosensitive composition, the content of fluorine element, fluoride ions, or fluorine-containing anions derived from these resins is reduced to a specific value or less. It is believed that this leads to local activation of protons in the photosensitive composition due to interactions such as hydrogen bonding between the components in the photosensitive composition. Therefore, the effect of promoting dissolution in the developer is thought to be significant in suppressing residue after development. Furthermore, intentionally reducing the content of the above components in the resin to a specific value or less is thought to reduce the content of the above components in the cured product of the photosensitive composition, thereby controlling the polarization structure and charge balance in the cured product. As a result, it is believed that the reliability and luminance of light-emitting devices are improved by suppressing ion migration and electromigration caused by metal impurities and ionic impurities that adversely affect light-emitting properties or electrical insulation. It is also believed that the suppression of migration and aggregation of metals in electrodes or metal wiring improves the reliability of display devices.

[0057] A maleimide resin is a resin having at least two maleimide groups. A maleimide-styrene resin is a resin having a maleimide group and a unit derived from a styrene derivative. A maleimide-triazine resin is a resin having a maleimide group and a unit containing a triazine structure. A maleimide-oxazine resin is a resin having a maleimide group and a unit containing an oxazine structure. These resins are different from polyimide-based resins.

[0058] <Resin (A1y)> From the viewpoint of improving sensitivity during exposure and suppressing residue after development, the weakly acidic group-containing resin (A1) preferably contains a resin (A1y). From the viewpoint of improving sensitivity during exposure and suppressing residue after development, the resin (A1y) preferably contains one or more resins selected from the group consisting of phenolic resins, polyhydroxystyrenes, phenolic group-containing epoxy resins, and phenolic group-containing acrylic resins. The resin (A1y) may be either a single resin or a copolymer thereof.

[0059] The phenolic resin is preferably a novolak resin, a resol resin, or a phenol aralkyl resin.The phenolic resin preferably has a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, an aromatic structure, or a heterocyclic structure.

[0060] The polyhydroxystyrene preferably has a unit derived from a (meth)acrylic acid ester derivative containing a fused polycyclic structure, a fused polycyclic heterocyclic structure, or an aromatic structure, or a unit derived from a styrene derivative.

[0061] Examples of phenol group-containing epoxy resins include resins obtained by reacting a polyfunctional epoxy compound with a phenol compound having an epoxy-reactive group, and phenol group-containing cardo resins or phenol group-containing epoxy-modified resins are preferred. The phenol group-containing epoxy-modified resin is preferably a phenol group-containing epoxy ester resin. The phenol group-containing cardo resin preferably has a condensed polycyclic structure or a condensed polycyclic heterocyclic structure. The phenol group-containing epoxy resin preferably has a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, or an aromatic structure.

[0062] Examples of phenol group-containing acrylic resins include resins obtained by reacting an acrylic resin described below with a phenol compound having an addition reactive group. Other examples include resins obtained by radical copolymerization of a copolymerization component having a phenolic hydroxyl group with another copolymerization component such as a (meth)acrylic acid derivative. The phenol group-containing acrylic resin is a resin different from polyhydroxystyrene. The phenol group-containing acrylic resin preferably has a unit derived from a (meth)acrylic acid ester derivative having a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, or an aromatic structure, or a unit derived from a styrene derivative.

[0063] The fused polycyclic structure, fused polycyclic heterocyclic structure, aromatic structure, or heterocyclic structure in these resins is a fluorene structure, an anthracene structure, a naphthalene structure, a tricyclo[5.2.1.0] structure, ２，６] A decane structure, an adamantane structure, a xanthene structure, an isoindolinone structure, a biphenyl structure, a benzene structure, a bisphenol A structure, a bisphenol F structure, a bisphenol AF structure, an isocyanuric acid structure, or a triazine structure is preferred.

[0064] <Resin (A2x) and Resin (A2y)> From the viewpoints of improving sensitivity during exposure and suppressing residue after development, the resin (A2) that does not have a weak acidic group preferably contains a resin (A2x), and more preferably contains a resin (A2y). From the viewpoints of improving sensitivity during exposure and suppressing residue after development, the resin (A2x) and / or the resin (A2y) preferably contains one or more resins selected from the group consisting of polycyclic side chain-containing resins, acid-modified epoxy resins, and acrylic resins. The resin (A2x) and the resin (A2y) may be either a single resin or a copolymer thereof.

[0065] From the viewpoint of improving the reliability of the light-emitting device, the polycyclic side chain-containing resin is preferably a cardo resin having a condensed polycyclic structure or a condensed polycyclic heterocyclic structure. From the viewpoint of improving the reliability of the light-emitting device, the acid-modified epoxy resin is preferably an epoxy (meth)acrylate resin having a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, or an aromatic structure. From the viewpoint of improving the reliability of the light-emitting device, the acrylic resin preferably has a unit derived from a (meth)acrylic acid ester derivative having a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, or an aromatic structure, or a unit derived from a styrene derivative. It is also preferable to have a unit derived from a (meth)acrylic acid ester derivative having an epoxy group. The condensed polycyclic structure, condensed polycyclic heterocyclic structure, or aromatic structure in these resins is preferably a fluorene structure, an anthracene structure, a naphthalene structure, a tricyclo[5.2.1.0] structure, or a methyl group. ２，６ ] A decane structure, an adamantane structure, a xanthene structure, an isoindolinone structure, a biphenyl structure, or a benzene structure is preferred.

[0066] The total content of the (A1x) resins relative to 100% by mass of the total binder resins (A) is preferably 10% by mass or more, more preferably 30% by mass or more, even more preferably 50% by mass or more, and particularly preferably 70% by mass or more, from the viewpoints of improving sensitivity during exposure, reducing the taper of the pattern shape, and improving the reliability of the light-emitting device. On the other hand, the total content of the (A1x) resins is preferably 100% by mass or less, more preferably 90% by mass or less, and even more preferably 80% by mass or less, from the viewpoints of suppressing residue after development. Furthermore, the total content of the (A1y) resins is preferably 5.0% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, and particularly preferably 30% by mass or more, from the viewpoints of improving sensitivity during exposure, reducing residue after development, and reducing the taper of the pattern shape. On the other hand, the total content of the (A1y) resins is preferably 70% by mass or less, more preferably 60% by mass or less, and even more preferably 50% by mass or less, from the viewpoint of improving the reliability of the light-emitting device. The total content of the (A2x) resin and the (A2x) resin is preferably 5.0% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, and particularly preferably 30% by mass or more, from the viewpoints of improving sensitivity during exposure, suppressing residues after development, and reducing the taper of the pattern shape. On the other hand, the total content of the (A2x) resin and the (A2y) resin is preferably 70% by mass or less, more preferably 60% by mass or less, and even more preferably 50% by mass or less, from the viewpoint of improving the reliability of the light-emitting device.

[0067] The content ratio of the (A) binder resin in the total solid content of the photosensitive composition of the present invention is preferably 10% by mass or more from the viewpoint of improving the properties of each resin. On the other hand, the content ratio of the (A) binder resin is preferably 75% by mass or less from the viewpoint of improving the properties of each resin. The total solid content of the composition refers to the sum of the masses of all components in the composition excluding the solvent. The solid content concentration can be calculated by heating 1 g of the composition at 150°C for 30 minutes to evaporate to dryness, measuring the mass remaining after heating, and calculating the solid content concentration from the masses before and after heating.

[0068] <(B) Radical Polymerizable Compound> The photosensitive composition of the present invention preferably further contains (B) a radical polymerizable compound (hereinafter referred to as "(B) compound") and / or (F) a crosslinking agent. The (B) compound refers to a compound having a radical polymerizable group. Examples and preferred descriptions regarding the radical polymerizable group are as described above for the (A) binder resin. The radical polymerizable group is preferably a (meth)acryloyl group from the viewpoints of promoting radical polymerization, improving sensitivity during exposure, and improving the reliability of the light-emitting element. The number of radical polymerizable groups possessed by the (B) compound is preferably 2 or more, more preferably 3 or more, and even more preferably 4 or more, from the viewpoints of improving sensitivity during exposure and improving the reliability of the light-emitting element. On the other hand, the number of radical polymerizable groups is preferably 12 or less, more preferably 10 or less, even more preferably 8 or less, and particularly preferably 6 or less, from the viewpoint of improving the reliability of the light-emitting element.

[0069] When the photosensitive composition of the present invention contains an (A) binder resin and a (B) compound, the content of the (A) binder resin, relative to 100 parts by mass of the total of the (A) binder resin and the (B) compound, is preferably 25 parts by mass or more, more preferably 35 parts by mass or more, and even more preferably 45 parts by mass or more, from the viewpoint of reducing the taper of the pattern shape and improving the reliability of the light-emitting device. On the other hand, the content of the (A) binder resin is preferably 85 parts by mass or less, more preferably 80 parts by mass or less, and even more preferably 75 parts by mass or less, from the viewpoint of improving sensitivity during exposure and suppressing residue after development. Furthermore, the content of the (B) compound, relative to 100 parts by mass of the total of the (A) binder resin and the (B) compound, is preferably 15 parts by mass or more, from the viewpoint of improving the above-mentioned properties. On the other hand, the content of the (B) compound is preferably 75 parts by mass or less, from the viewpoint of improving the above-mentioned properties.

[0070] <(C) Photosensitizer> The photosensitive composition of the present invention contains a (C) photosensitizer. The (C) photosensitizer refers to a compound that undergoes bond cleavage, reaction, or structural change upon exposure to generate another compound, thereby imparting positive or negative photosensitivity to the composition. Examples of the (C) photosensitizer include a (C1) naphthoquinone diazide compound (hereinafter, "(C1) compound"), a (C2) photopolymerization initiator (hereinafter, "(C2) compound"), a (C3) photoacid generator (hereinafter, "(C3) compound"), and a (C4) photobase generator (hereinafter, "(C4) compound"). When imparting positive photosensitivity to the composition, it is preferable to contain a (C1) compound and / or a (C3) compound, and it is also preferable to further contain a (C2) compound or a (C4) compound.

[0071] When negative photosensitivity is to be imparted to the composition, it is preferable that the composition contains the compound (C2) and / or the compound (C3), and it is also preferable that the composition further contains the compound (C1) or the compound (C4).

[0072] The photosensitive composition of the present invention also contains a (C) photosensitizer, and the (C) photosensitizer contains a (C1) naphthoquinone diazide compound. Therefore, the photosensitive resin composition of the present invention is excellent in improving sensitivity during exposure and suppressing residues after development. From the same viewpoint, it is also preferable that the photosensitive resin composition contains a (C1) naphthoquinone diazide compound and further contains a (C3) photoacid generator and / or a (C4) photobase generator.

[0073] The content of the (C) photosensitizer is preferably 1.0 part by mass or more, based on 100 parts by mass of the total of the (A) binder resin and the (B) compound, from the viewpoint of improving sensitivity during exposure, while the content of the (C) photosensitizer is preferably 30 parts by mass or less, from the viewpoint of suppressing residues after development.

[0074] <(C1) Naphthoquinonediazide Compound> The (C1) compound refers to a compound that undergoes a structural change upon exposure to generate an indenecarboxylic acid and / or a sulfoindenecarboxylic acid. The inclusion of the (C1) compound is suitable for forming a positive-tone pattern. During exposure, the exposed portion of the film of the composition is selectively solubilized in an alkaline developer due to the acidic compound resulting from the structural change of the (C1) compound. This significantly improves the resolution after development.

[0075] The (C1) compound is preferably a 1,2-naphthoquinonediazide-5-sulfonic acid ester (hereinafter referred to as "5-ester") or a 1,2-naphthoquinonediazide-4-sulfonic acid ester (hereinafter referred to as "4-ester") of a compound having a phenolic hydroxyl group. From the viewpoint of improving resolution after development, the (C1) compound preferably contains a 5-ester, and from the viewpoint of improving sensitivity during exposure, the (C1) compound preferably contains a 4-ester. From the viewpoints of improving sensitivity during exposure, suppressing residues after development, and improving resolution after development, the (C1) compound more preferably contains a 5-ester and a 4-ester.

[0076] The total content ratio of 5-ester groups and 4-ester groups (hereinafter referred to as "ester ratio") relative to the total number of moles of phenolic hydroxyl groups, 1,2-naphthoquinonediazide-5-sulfonic acid ester groups (hereinafter referred to as "5-ester groups"), and 1,2-naphthoquinonediazide-4-sulfonic acid ester groups (hereinafter referred to as "4-ester groups") in the compound (C1) is preferably 50 mol% or more, more preferably 55 mol% or more, and even more preferably 60 mol% or more, from the viewpoint of improving resolution after development. On the other hand, from the viewpoint of improving sensitivity during exposure, the esterification ratio is preferably 100 mol% or less, more preferably 90 mol% or less, even more preferably 80 mol% or less, and particularly preferably 70 mol% or less. It is also preferable to mix two or more types of (C1) compounds having different esterification ratios to achieve the above-mentioned esterification ratio.

[0077] The total content of the compound having one 5-ester group or one 4-ester group in the molecule and the compound having two 5-ester groups or two 4-ester groups in the molecule (hereinafter referred to as the "low ester substitution ratio") in 100 mol % of the compound (C1) is preferably 60 mol % or more, more preferably 70 mol % or more, and even more preferably 80 mol % or more, from the viewpoint of improving sensitivity during exposure. On the other hand, the low ester substitution ratio is preferably 100 mol % or less, more preferably 95 mol % or less, and even more preferably 90 mol % or less, from the viewpoint of improving resolution after development.

[0078] The proportion of low ester substitution products in the total 100 mol% of the compound (C1) is preferably 0 mol% or more, more preferably 10 mol% or more, even more preferably 20 mol% or more, and particularly preferably 30 mol% or more, from the viewpoint of improving sensitivity during exposure. On the other hand, the proportion of low ester substitution products is preferably less than 60 mol%, more preferably 50 mol% or less, and even more preferably 40 mol% or less, from the viewpoint of suppressing residues after development.

[0079] Examples of methods for producing compound (C1) include a method of esterifying a compound having a phenolic hydroxyl group with naphthoquinone diazide sulfonic acid, a method of esterifying a compound having a phenolic hydroxyl group with naphthoquinone diazide sulfonic acid chloride, etc. The naphthoquinone diazide sulfonic acid chloride is preferably 1,2-naphthoquinone diazide-5-sulfonic acid chloride or 1,2-naphthoquinone diazide-4-sulfonic acid chloride.

[0080] <(C2) Photopolymerization Initiator> The (C2) compound refers to a compound that generates radicals by bond cleavage and / or reaction upon exposure. The inclusion of the (C2) compound is suitable for forming a negative pattern. Even if the amount of radicals generated from the (C2) compound during exposure is small, radical polymerization of the above-mentioned (B) compound and the like proceeds in a chain reaction, resulting in a significant effect of improving sensitivity during exposure.

[0081] The compound (C2) is preferably a benzyl ketal compound, an α-hydroxyketone compound, an α-aminoketone compound, a biimidazole compound, a phosphine oxide compound, an oxime ester compound, an acridine compound, a titanocene compound, a benzophenone compound, an acetophenone compound, an aromatic ketoester compound, or a benzoate ester compound. From the viewpoint of improving sensitivity during exposure and improving the reliability of the light-emitting element, an α-hydroxyketone compound, an α-aminoketone compound, a biimidazole compound, a phosphine oxide compound, or an oxime ester compound is more preferred, and an oxime ester compound is even more preferred.

[0082] The above-mentioned α-hydroxyketone compounds, α-aminoketone compounds, biimidazole compounds, phosphine oxide compounds, and oxime ester compounds have the effect of improving the degree of crosslinking of the cured product and accelerating the ring-closing reaction of the resin due to the generation of radicals upon heating and the interaction of the hydroxy group, amino group, imidazole structure, phosphine oxide structure, or oxime ester structure, and therefore have a significant effect of improving the reliability of light-emitting elements.

[0083] <(C3) Photoacid Generator> The (C3) compound refers to a compound that generates an acid by bond cleavage and / or reaction upon exposure. The inclusion of the (C3) compound is suitable for negative pattern formation from the viewpoint of promoting cationic polymerization, etc. On the other hand, when a resin or the like has an acidic group protected by an acid-dissociable group, it is suitable for positive pattern formation from the viewpoint of liberating the acidic group upon exposure, and the effect of improving sensitivity during exposure is remarkable.

[0084] Examples of the (C3) compound include ionic compounds and nonionic compounds. The ionic compound is preferably a triorganosulfonium salt compound. The nonionic compound is preferably a halogen-containing compound, a diazomethane compound, a sulfone compound, a sulfonate compound, a carboxylate compound, a sulfonimide compound, a phosphate compound, or a sulfonebenzotriazole compound.

[0085] <(C4) Photobase Generator> The (C4) compound refers to a compound that generates a base by bond cleavage and / or reaction upon exposure. The inclusion of the (C4) compound is suitable for negative pattern formation from the viewpoint of promoting anionic polymerization, etc. On the other hand, when a resin or the like has an acidic group protected by a base-dissociable group, it is suitable for positive pattern formation from the viewpoint of liberating the acidic group upon exposure, and the effect of improving sensitivity during exposure is remarkable.

[0086] Examples of the (C4) compound include ionic compounds and nonionic compounds. The ionic compound is preferably a diazabicycloalkene salt compound, a triazabicycloalkene salt compound, an α-keto quaternary ammonium salt compound, a benzyl quaternary ammonium salt compound, a guanidine salt compound, or a biguanide salt compound. The ionic compound preferably has a ketoprofen structure, an oxoxanthene structure, a benzofuran structure, or a naphthalene structure. The nonionic compound is preferably a nitrobenzyl carbamate compound, an anthracenyl carbamate compound, a benzoin-based carbamate compound, an anthraquinone-based carbamate compound, a hydroxycinnamamide-based compound, or a coumarinamide-based compound.

[0087] <(D) Colorant> The photosensitive composition of the present invention preferably further contains a (D) colorant. The (D) colorant refers to a compound that imparts color by absorbing light of a visible light wavelength (380 to 780 nm). The (D) colorant is preferably a pigment or a dye. From the viewpoint of suppressing external light reflection, the (D) colorant preferably contains a black agent or a mixture of two or more colorants. The black agent preferably contains an organic black pigment and / or an inorganic black pigment. The black color in the (D) colorant is as described in paragraphs

[0284] and

[0285] of WO 2019 / 087985.

[0088] The content of the colorant (D) relative to the total solid content of the photosensitive composition of the present invention is preferably 5.0% by mass or more, more preferably 10% by mass or more, and even more preferably 20% by mass or more, from the viewpoints of suppressing external light reflection and improving device reliability, while the content of the colorant (D) is preferably 70% by mass or less, more preferably 50% by mass or less, from the viewpoints of improving sensitivity during exposure and suppressing residues after development.

[0089] From the viewpoints of suppressing residue after development, reducing the taper of the pattern shape, and improving the reliability of the light-emitting device, the organic black pigment preferably contains one or more types selected from the group consisting of benzofuranone-based black pigments, perylene-based black pigments, and azomethine-based black pigments. Furthermore, from the viewpoint of improving sensitivity during exposure, it is more preferable to contain a benzofuranone-based black pigment. The organic black pigment is also preferably an anthraquinone-based black pigment, an aniline-based black pigment, an azo-based black pigment, or carbon black. The carbon black is preferably resin-coated, dye-coated, oxidized, surface-modified with an organic group having an ionic group, or surface-treated with a sulfonic acid group.

[0090] From the viewpoints of suppressing residues after development and reducing the taper of the pattern shape, the mixture of colorants of two or more colors preferably contains a mixture of color pigments of two or more colors and / or a mixture of color dyes of two or more colors, and the two or more colors preferably include blue and / or purple, and also red and orange, and the color pigment is preferably an anthraquinone-based pigment, a diketopyrrolopyrrole-based pigment, a perylene-based pigment, an isoindoline-based pigment, an isoindolinone-based pigment, an imidazolone-based pigment, a quinacridone-based pigment, a pyranthrone-based pigment, a phthalocyanine-based pigment, an indanthrone-based pigment, or a dioxazine-based pigment, and the color dye is preferably a squarylium-based dye, a xanthene-based dye, a triarylmethane-based dye, or a phthalocyanine-based dye.

[0091] From the viewpoints of suppressing residues after development and reducing the taper of the pattern shape, the inorganic black pigment contains one or more metal elements selected from the group consisting of nitrides containing a metal element, carbides containing a metal element, and oxynitrides containing a metal element, and the metal element is preferably one or more metal elements selected from the group consisting of zirconium, vanadium, niobium, hafnium, and tantalum, and more preferably one or more metal elements selected from the group consisting of nitrides, carbides, and oxynitrides of zirconium, vanadium, niobium, hafnium, or tantalum, and further from the viewpoint of improving sensitivity during exposure, it is even more preferable for the inorganic black pigment to contain one or more metal elements selected from the group consisting of zirconium nitrides, zirconium carbides, and zirconium oxynitrides.

[0092] <(E) Dispersant> The photosensitive composition of the present invention preferably further contains a (E) dispersant. The (E) dispersant refers to a compound having a structure that interacts with the pigment surface and a structure that inhibits approach of pigments to each other. From the viewpoint of improving the dispersion stability of the pigment, the (E) dispersant preferably has a basic group, an acidic group, or a salt structure thereof, and more preferably has a basic group or a salt structure thereof.

[0093] <(F) Crosslinking Agent> The photosensitive composition of the present invention preferably further contains a (B) compound and / or a (F) crosslinking agent. The (F) crosslinking agent refers to a compound having a crosslinkable group, a cationically polymerizable group, or an anionically polymerizable group capable of reacting with a resin or the like. From the viewpoint of improving sensitivity during exposure and improving the reliability of the light-emitting device, the (F) crosslinking agent preferably has one or more groups selected from the group consisting of an alkoxyalkyl group, a hydroxyalkyl group, an epoxy group, an oxetanyl group, and a blocked isocyanate group (hereinafter referred to as "specific crosslinking group"). The alkoxyalkyl group is preferably an alkoxymethyl group or an alkoxyethyl group, and more preferably a methoxymethyl group or a methoxyethyl group. The hydroxyalkyl group is preferably a methylol group or an ethylol group. From the viewpoint of improving sensitivity during exposure and improving the reliability of the light-emitting device, the number of specific crosslinkable groups possessed by the (F) crosslinking agent is preferably 2 or more, more preferably 3 or more, even more preferably 4 or more, and particularly preferably 6 or more. On the other hand, the number of specific crosslinkable groups is preferably 12 or less, more preferably 10 or less, and even more preferably 8 or less, from the viewpoint of improving the reliability of the light-emitting device.

[0094] The content of the (F) crosslinking agent is preferably 1.0 part by mass or more, based on 100 parts by mass of the total of the (A) binder resin and the (B) compound, from the viewpoints of improving sensitivity during exposure and improving the reliability of the light-emitting device, whereas the content of the (F) crosslinking agent is preferably 30 parts by mass or less, from the viewpoints of suppressing residues after development and improving the reliability of the light-emitting device.

[0095] From the viewpoint of suppressing residues after development and improving the reliability of the light-emitting device, the (F) crosslinking agent preferably contains a (F1) compound: a compound having at least two phenolic hydroxyl groups and at least two specific crosslinkable groups and / or a (F2) compound: a compound having a structure containing a heterocyclic structure and at least two specific crosslinkable groups. The preferred contents of these (F) crosslinking agents are also the same as those described above.

[0096] From the viewpoint of improving the reliability of the light-emitting device, the compound (F1) preferably has at least two structures in which a phenolic hydroxyl group and a specific crosslinkable group are bonded to one aromatic structure, and more preferably has at least two structures in which a phenolic hydroxyl group and at least two specific crosslinkable groups are bonded to one aromatic structure. From the viewpoint of improving the reliability of the light-emitting device, the heterocyclic structure in the compound (F2) is preferably a nitrogen-containing cyclic structure, more preferably a cyclic structure having at least two nitrogen atoms, and even more preferably an isocyanuric acid structure, a triazine structure, a glycoluril structure, an imidazolidone structure, a pyrazole structure, an imidazole structure, a triazole structure, a tetrazole structure, or a purine structure. The number of nitrogen atoms in the heterocyclic structure in the compound (F2) is preferably one or more, more preferably two or more, and even more preferably three or more. On the other hand, the number of nitrogen atoms is preferably six or less, more preferably four or less.

[0097] <(G) Inorganic Particles> From the viewpoint of improving the reliability and luminance of light-emitting devices, the photosensitive composition of the present invention preferably further contains (G) inorganic particles. The photosensitive composition of the present invention may contain (G) inorganic particles in either the inorganic particle-containing polysiloxane or the inorganic particle added to the photosensitive composition. The photosensitive composition of the present invention preferably contains the inorganic particle-containing polysiloxane and further contains (G) inorganic particles. It is also preferable that the photosensitive composition does not contain the inorganic particle-containing polysiloxane and further contains (G) inorganic particles. The (G) inorganic particles refer to particles containing, as a main component, an element selected from the group consisting of a metal element, a metalloid element, and a semiconductor element. The main component refers to the component that is most abundant in terms of mass among the constituent components. From the viewpoint of improving the reliability of light-emitting devices, the (G) inorganic particles preferably have hydroxy groups and / or silanol groups on the particle surface.

[0098] From the viewpoint of improving the reliability and luminance of the light-emitting device, the (G) inorganic particles preferably contain one or more particles selected from the group consisting of silica particles, alumina particles, titania particles, vanadium oxide particles, chromium oxide particles, iron oxide particles, cobalt oxide particles, copper oxide particles, zinc oxide particles, zirconium oxide particles, niobium oxide particles, tin oxide particles, and cerium oxide particles, and from the viewpoint of suppressing external light reflection, the (G) inorganic particles more preferably contain silica particles.

[0099] The above-mentioned silica particles are believed to capture metallic impurities, ionic impurities, and other impurities that adversely affect electrical insulation due to the acidity and negative charge of the hydroxyl groups and / or silanol groups on the particle surface. Furthermore, the robust structure of the particles allows them to retain the captured impurities even after heat treatment or voltage application, which is believed to improve the reliability of light-emitting devices. Furthermore, the silica particles unevenly distributed on the surface of the cured product are believed to reduce the reflection and scattering of incident external light. As a result, the effects of optical interference with incident external light are suppressed, resulting in a significant improvement in luminance.

[0100] The content ratio of the (G) inorganic particles in the total solid content of the photosensitive composition of the present invention is preferably 5.0% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, and particularly preferably 30% by mass or more, from the viewpoint of improving the reliability and luminance of the light-emitting element. On the other hand, the content ratio of the (G) inorganic particles is preferably 90% by mass or less, more preferably 70% by mass or less, even more preferably 60% by mass or less, and particularly preferably 50% by mass or less, from the viewpoint of suppressing residues after development. The content ratio of the (G) inorganic particles refers to the sum of the (G) inorganic particles in the inorganic particle-containing polysiloxane and the (G) inorganic particles added to the photosensitive composition.

[0101] <Other Additives and Solvents> The photosensitive composition of the present invention preferably further contains a thermal color former, an oxidative color former, a dissolution promoter, an ink repellent, a sensitizer, a chain transfer agent, a polymerization inhibitor, a silane coupling agent, or a surfactant. Known additives may be used as these additives. The photosensitive composition of the present invention preferably further contains a solvent. When the photosensitive composition of the present invention contains a pigment and further contains a dispersant, the solvent is preferably a compound having an acetate bond, a propionate bond, or a butyrate bond, from the viewpoint of improving the dispersion stability of the pigment.

[0102] <Contents of Elemental Chlorine, Elemental Bromine, Chloride Ion, and Bromide Ion> From the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, improving reliability of the light-emitting device, and improving luminance, the photosensitive composition of the present invention preferably further contains one or more components selected from the group consisting of components containing elemental chlorine, components containing elemental bromine, components containing chloride ions, and components containing bromide ions (hereinafter referred to as "specific halogen components"), and satisfies the following condition (1): (1) The total content of elemental chlorine and elemental bromine in the total solid content of the photosensitive composition is 0.0010 to 1,000 ppm by mass, and / or the total content of elemental chloride and bromide ions in the total solid content of the photosensitive composition is 0.0010 to 1,000 ppm by mass.

[0103] The chlorine-containing component and the bromine-containing component are preferably alkyl chloride compounds, cycloalkyl chloride compounds, aryl chloride compounds, alkyl bromide compounds, cycloalkyl bromide compounds, or aryl bromide compounds. The chloride ion-containing component and the bromide ion-containing component preferably contain ammonium ions, primary ammonium ions, secondary ammonium ions, tertiary ammonium ions, or quaternary ammonium ions as cationic species. The quaternary ammonium ions are preferably specific quaternary ammonium ions described below, and more preferably satisfy the condition (6) described below.

[0104] The total content of chlorine and bromine elements in the total solid content of the photosensitive composition, and the total content of chloride ions and bromide ions in the total solid content of the photosensitive composition, are preferably 0.010 ppm by mass or more, more preferably 0.030 ppm by mass or more, even more preferably 0.050 ppm by mass or more, even more preferably 0.070 ppm by mass or more, and particularly preferably 0.10 ppm by mass or more, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, improving reliability of the light-emitting device, and improving luminance. On the other hand, the total content of chlorine and bromine elements, and the total content of chloride ions and bromide ions, are preferably 500 ppm by mass or less, more preferably 300 ppm by mass or less, and even more preferably 100 ppm by mass or less, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, improving reliability of the light-emitting device, and improving luminance. Furthermore, it is preferably 50 ppm by mass or less, more preferably 30 ppm by mass or less, even more preferably 10 ppm by mass or less, even more preferably 5 ppm by mass or less, particularly preferably 3 ppm by mass or less, and most preferably 1 ppm by mass or less.

[0105] From the viewpoints of improving sensitivity during exposure, suppressing residues after development, improving storage stability, improving reliability of the light-emitting device, and improving luminance, it is preferable that the photosensitive composition of the present invention further satisfies the following condition (2): (2) the total content of chlorine and bromine elements in the total solid content of the photosensitive composition is 0.0010 to 1,000 ppm by mass, and the total content of chloride ions and bromide ions in the total solid content of the photosensitive composition is 0.0010 to 1,000 ppm by mass.

[0106] When the above condition (2) is satisfied, it is preferable that the photosensitive composition of the present invention contains a component containing a chlorine element and / or a component containing a bromine element, and further contains a component containing a chloride ion and / or a component containing a bromide ion.

[0107] By incorporating a trace amount of the specific halogen component into the photosensitive composition, protons are activated by these anions or anions derived from these components, promoting dissolution in the developer and preventing residue adhesion at the openings, resulting in significant improvements in sensitivity during exposure and suppression of residue after development. Furthermore, it is believed that the reliability of light-emitting devices is improved by suppressing metal migration and aggregation through control of the polarization structure and charge balance in the cured product. Additionally, it is believed that control of conductivity through surface modification of the wiring surface improves luminance. Furthermore, it is believed that interaction with the specific halogen component stabilizes polar groups possessed by the resin in the photosensitive composition. In particular, when a polysiloxane is incorporated into the photosensitive composition, this is suitable for stabilizing silanol groups in the polysiloxane. Additionally, it is believed that interaction with the resin in the photosensitive composition via unshared electron pairs or vacant 3d orbitals controls the polarization structure and charge balance in the photosensitive composition. As a result, the effect of improving storage stability is significantly improved.

[0108] <Fluorine Element Content> From the viewpoints of suppressing residue after development, improving the reliability of the light-emitting device, and improving the luminance of light emitted, the photosensitive composition of the present invention preferably satisfies the following condition (1a): The photosensitive composition of the present invention more preferably further satisfies the following condition (2a): (1a) The fluorine element content relative to the total solid content of the photosensitive composition is 1,000 ppm by mass or less (2a) The fluoride ion content relative to the total solid content of the photosensitive composition is 1,000 ppm by mass or less.

[0109] From the viewpoint of the effects of the present invention, the content of elemental fluorine in the total solid content of the photosensitive composition is preferably 0 ppm by mass or more, more preferably 0.010 ppm by mass or more, even more preferably 0.030 ppm by mass or more, even more preferably 0.050 ppm by mass or more, particularly preferably 0.070 ppm by mass or more, and most preferably 0.10 ppm by mass or more. On the other hand, from the viewpoint of the effects of the present invention, the content of elemental fluorine is preferably 1,000 ppm by mass or less, more preferably 500 ppm by mass or less, even more preferably 300 ppm by mass or less, and particularly preferably 100 ppm by mass or less. Furthermore, the content of elemental fluorine is preferably 50 ppm by mass or less, more preferably 30 ppm by mass or less, even more preferably 10 ppm by mass or less, even more preferably 5 ppm by mass or less, particularly preferably 3 ppm by mass or less, and most preferably 1 ppm by mass or less.

[0110] The preferred range of the content of fluoride ions in the total solid content of the photosensitive composition is the same as the preferred range of the content of elemental fluorine in the total solid content of the photosensitive composition described above.

[0111] The content of elemental fluorine in the total solid content of the photosensitive composition may be 0 ppm by mass. The content of fluoride ions in the total solid content of the photosensitive composition may also be 0 ppm by mass. When the content of elemental fluorine and / or the content of fluoride ions in the total solid content of the photosensitive composition exceeds 0 ppm by mass, the photosensitive composition of the present invention preferably contains a fluorine atom or a fluoride ion in the structure of the (A) binder resin, the (C) photosensitizer, the (B) compound, or the (F) crosslinking agent, or further contains a component containing a fluorine element and / or a component containing a fluoride ion.

[0112] The component containing elemental fluorine is preferably a phenol compound, a fluorinated alkyl compound, a fluorinated cycloalkyl compound, or a fluorinated aryl compound having a substituent containing a fluorinated alkyl group. The component containing fluoride ions preferably contains an ammonium ion, a primary ammonium ion, a secondary ammonium ion, a tertiary ammonium ion, or a quaternary ammonium ion as a cationic species. The quaternary ammonium ion preferably has a linear or branched hydrocarbon group. The hydrocarbon group is preferably an alkyl group having 1 to 15 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, or a hydroxyalkyl group having 1 to 6 carbon atoms, more preferably an alkyl group having 1 to 10 carbon atoms, and even more preferably an alkyl group having 1 to 6 carbon atoms.

[0113] By controlling the content of compounds containing fluorine atoms in their structures or components containing fluorine atoms in the photosensitive composition to a specific value or less, the content of fluorine atoms, fluoride ions, or anions containing fluorine atoms derived from these components is controlled to a specific value or less. Therefore, it is believed that interactions such as hydrogen bonding between the components in the photosensitive composition locally activate protons in the photosensitive composition. Therefore, it is believed that the effect of promoting dissolution in the developer significantly reduces residue after development. Furthermore, it is believed that intentionally controlling the content of the above components to a specific value or less controls the polarization structure and charge balance in the cured product. As a result, it is believed that ion migration and electromigration caused by metal impurities and ionic impurities that adversely affect light-emitting properties or electrical insulation are suppressed, thereby improving the reliability and luminance of light-emitting devices. It is also believed that the suppression of migration and aggregation of metals in electrodes or metal wiring improves the reliability of display devices.

[0114] <Water Content> From the viewpoints of improving sensitivity during exposure, suppressing residues after development, improving storage stability, and improving the reliability of light-emitting devices, the photosensitive composition of the present invention preferably further contains water and satisfies the following condition (3): (3) The content of water in the photosensitive composition is 0.010 to 3.0% by mass.

[0115] The content of water in the photosensitive composition is preferably 0.030% by mass or more, more preferably 0.050% by mass or more, even more preferably 0.070% by mass or more, and particularly preferably 0.10% by mass or more, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and improving the reliability of the light-emitting element. On the other hand, the content of water is preferably 2.5% by mass or less, more preferably 2.2% by mass or less, and even more preferably 2.0% by mass or less, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and improving the reliability of the light-emitting element. Furthermore, it is preferably 1.7% by mass or less, more preferably 1.5% by mass or less, even more preferably 1.2% by mass or less, even more preferably 1.0% by mass or less, particularly preferably 0.70% by mass or less, and most preferably 0.50% by mass or less.

[0116] By setting the water content in the photosensitive composition within the above range, the hydrogen bonding of water molecules improves the stability of anions in the photosensitive composition, activating protons. This promotes dissolution in the developer and prevents residue adhesion at the openings, resulting in significant improvements in sensitivity during exposure and suppression of residue after development. It is also believed that the dipole moment of water molecules, hydrogen bonding, and other interactions stabilize the polar groups of the resin in the photosensitive composition. In particular, when polysiloxane is contained in the photosensitive composition, this is suitable for stabilizing silanol groups in the polysiloxane. As a result, the effect of improving storage stability is significant. Furthermore, the water captures metal impurities and ionic impurities that adversely affect electrical insulation through interactions such as the dipole moment of water molecules and hydrogen bonding, thereby suppressing ion migration and electromigration and improving the reliability of light-emitting devices.

[0117] <Content of Specific Anion and Specific Phosphorus Compound> From the viewpoints of improving sensitivity during exposure, suppressing residues after development, improving storage stability, improving reliability of the light-emitting device, and improving luminance, the photosensitive composition of the present invention preferably contains one or more anions selected from the group consisting of sulfate ions, sulfite ions, nitrate ions, nitrite ions, phosphate ions, phosphite ions, hypophosphite ions, formate ions, acetate ions, and oxalate ions (hereinafter referred to as "specific anions") and satisfies the following condition (4); and / or contains one or more anions selected from the group consisting of phosphoric acid esters, phosphonic acid, phosphonic acid esters, phosphite esters, phosphinic acid, and hypophosphite esters (hereinafter referred to as "specific phosphorus compounds") and satisfies the following condition (5).

[0118] (4) The total content of sulfate ions, sulfite ions, nitrate ions, nitrite ions, phosphate ions, phosphite ions, hypophosphite ions, formate ions, acetate ions, and oxalate ions in the total solid content of the photosensitive composition is 0.0010 to 30,000 ppm by mass.

[0119] (5) The total content of phosphoric acid ester, phosphonic acid ester, phosphonic acid ester, phosphorous acid ester, phosphinic acid, and hypophosphite ester in the total solid content of the photosensitive composition is 0.0010 to 30,000 ppm by mass.

[0120] When the above condition (4) is satisfied, the photosensitive composition of the present invention preferably contains a component containing a specific anion. The component containing a specific anion preferably contains an ammonium ion, a primary ammonium ion, a secondary ammonium ion, a tertiary ammonium ion, or a quaternary ammonium ion as a cationic species. The quaternary ammonium ion is preferably a specific quaternary ammonium ion described below, and more preferably satisfies the condition (6) described below.

[0121] The specific phosphorus compound is preferably a compound having a substituent containing a carbon element and an acidic group containing a phosphorus element. The carbon element-containing substituent is preferably a mono- or divalent aliphatic group having 1 to 18 carbon atoms, a mono- or divalent alicyclic group having 4 to 18 carbon atoms, a mono- or divalent aromatic group having 6 to 15 carbon atoms, a mono- or divalent fluorine-containing aliphatic group having 1 to 18 carbon atoms, a mono- or divalent fluorine-containing alicyclic group having 4 to 18 carbon atoms, or a mono- or divalent fluorine-containing aromatic group having 6 to 15 carbon atoms. The specific phosphorus compound is preferably a phosphoric acid monoester, a phosphoric acid diester, a phosphonic acid, a phosphonic acid monoester, a phosphorous acid monoester, a phosphorous acid diester, a phosphinic acid, or a hypophosphite monoester.

[0122] The total content of the specific anions in the total solid content of the photosensitive composition and the total content of the specific phosphorus compounds in the total solid content of the photosensitive composition are, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, improving reliability of the light-emitting device, and improving luminance, preferably 0.010 ppm by mass or more, more preferably 0.030 ppm by mass or more, even more preferably 0.050 ppm by mass or more, still more preferably 0.070 ppm by mass or more, and particularly preferably 0.10 ppm by mass or more. On the other hand, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, improving reliability of the light-emitting device, and improving luminance, the total content of the specific anions and the total content of the specific phosphorus compounds are, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, improving reliability of the light-emitting device, and improving luminance, preferably 25,000 ppm by mass or less, more preferably 20,000 ppm by mass or less, and even more preferably 15,000 ppm by mass or less. Furthermore, it is preferably 12,000 ppm by mass or less, more preferably 10,000 ppm by mass or less, even more preferably 7,000 ppm by mass or less, even more preferably 5,000 ppm by mass or less, particularly preferably 3,000 ppm by mass or less, and most preferably 1,000 ppm by mass or less. Furthermore, from the viewpoint of improving the above-mentioned properties, it is preferably 500 ppm by mass or less, more preferably 300 ppm by mass or less, and even more preferably 100 ppm by mass or less. Furthermore, it is preferably 50 ppm by mass or less, more preferably 30 ppm by mass or less, even more preferably 10 ppm by mass or less, even more preferably 5 ppm by mass or less, particularly preferably 3 ppm by mass or less, and most preferably 1 ppm by mass or less.

[0123] Similarly, by incorporating a trace amount of the specific anion or the specific phosphorus compound into the photosensitive composition, the effect of promoting dissolution in the developer and preventing residue adhesion in the openings is achieved, resulting in significant improvements in sensitivity during exposure and suppression of residue after development. Furthermore, the stabilization of polar groups possessed by the resin in the photosensitive composition and the control of the polarization structure and charge balance in the photosensitive composition significantly improve storage stability. Furthermore, the control of the polarization structure and charge balance in the cured product is believed to suppress metal migration and aggregation, thereby improving the reliability of the light-emitting device. Additionally, the control of conductivity through surface modification of the wiring surface is believed to improve luminance.

[0124] <Contents of Tertiary Amine Compound and Quaternary Ammonium Ion> From the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, improving reliability of the light-emitting device, and improving luminance, the photosensitive composition of the present invention preferably further contains a tertiary amine compound and / or a quaternary ammonium ion and satisfies the following condition (6): (6) The total content of the tertiary amine compound and the quaternary ammonium ion in the total solid content of the photosensitive composition is 0.0010 to 50,000 ppm by mass.

[0125] When the photosensitive composition of the present invention satisfies the above condition (6) and contains a quaternary ammonium ion, it is preferable that the photosensitive composition of the present invention contains a component containing a quaternary ammonium ion. The component containing a quaternary ammonium ion preferably contains an anion species. The anion species is preferably the above-mentioned chloride ion, the above-mentioned bromide ion, or the above-mentioned specific anion, and more preferably satisfies the above-mentioned condition (1), condition (2), or condition (4).

[0126] The tertiary amine compound preferably contains a compound represented by general formula (18) (hereinafter referred to as "specific tertiary amine compound"), and the quaternary ammonium ion preferably contains a compound represented by general formula (19) (hereinafter referred to as "specific quaternary ammonium ion").

[0127]

[0128] In the general formula (18) and the general formula (19), R ３１~R ３７ each independently represents an alkyl group having 1 to 15 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, or a hydroxyalkyl group having 1 to 6 carbon atoms. ３１ ~R ３７ are each independently preferably an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 7 carbon atoms, or an aryl group having 6 to 10 carbon atoms. The above-mentioned substituents and structures may have a heteroatom, and may be either unsubstituted or substituted.

[0129] The total content of the tertiary amine compound and the quaternary ammonium ion relative to the total solid content of the photosensitive composition is preferably 0.010 ppm by mass or more, more preferably 0.030 ppm by mass or more, even more preferably 0.050 ppm by mass or more, still more preferably 0.070 ppm by mass or more, and particularly preferably 0.10 ppm by mass or more, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, improving reliability of the light-emitting element, and improving luminance. On the other hand, the total content of the tertiary amine compound and the quaternary ammonium ion is preferably 30,000 ppm by mass or less, more preferably 25,000 ppm by mass or less, even more preferably 20,000 ppm by mass or less, and particularly preferably 15,000 ppm by mass or less, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, improving reliability of the light-emitting element, and improving luminance. Furthermore, it is preferably 12,000 ppm by mass or less, more preferably 10,000 ppm by mass or less, even more preferably 7,000 ppm by mass or less, even more preferably 5,000 ppm by mass or less, particularly preferably 3,000 ppm by mass or less, and most preferably 1,000 ppm by mass or less. Furthermore, from the viewpoint of improving the above-mentioned properties, it is preferably 500 ppm by mass or less, more preferably 300 ppm by mass or less, and even more preferably 100 ppm by mass or less. Furthermore, it is preferably 50 ppm by mass or less, more preferably 30 ppm by mass or less, even more preferably 10 ppm by mass or less, even more preferably 5 ppm by mass or less, particularly preferably 3 ppm by mass or less, and most preferably 1 ppm by mass or less.

[0130] Similarly, by incorporating a trace amount of the above-mentioned tertiary amine compound or the above-mentioned quaternary ammonium ion into the photosensitive composition, the effect of promoting dissolution in the developer and preventing residue adhesion in the openings is similarly significant, resulting in improved sensitivity during exposure and reduced residue after development. Furthermore, the stabilization of polar groups possessed by the resin in the photosensitive composition and the control of the polarization structure and charge balance in the photosensitive composition significantly improve storage stability. Furthermore, the control of the polarization structure and charge balance in the cured product is believed to suppress metal migration and aggregation, thereby improving the reliability of the light-emitting device. Additionally, the control of conductivity through surface modification of the wiring surface is believed to improve luminance.

[0131] <Methanol and Ethanol Contents> From the viewpoints of improving sensitivity during exposure, suppressing residues after development, improving storage stability, and improving luminance, the photosensitive composition of the present invention further contains methanol and / or ethanol, and satisfies the following condition (7): (7) The total content of methanol and ethanol in the photosensitive composition is 0.0010 to 30,000 ppm by mass.

[0132] From the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and improving luminance, the total content of methanol and ethanol in the photosensitive composition is preferably 0.010 ppm by mass or more, more preferably 0.030 ppm by mass or more, even more preferably 0.050 ppm by mass or more, still more preferably 0.070 ppm by mass or more, and particularly preferably 0.10 ppm by mass or more. On the other hand, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and improving luminance, the total content of methanol and ethanol is preferably 25,000 ppm by mass or less, more preferably 20,000 ppm by mass or less, and even more preferably 15,000 ppm by mass or less. Furthermore, it is preferably 12,000 ppm by mass or less, more preferably 10,000 ppm by mass or less, even more preferably 7,000 ppm by mass or less, even more preferably 5,000 ppm by mass or less, particularly preferably 3,000 ppm by mass or less, and most preferably 1,000 ppm by mass or less. Furthermore, from the viewpoint of improving the above-mentioned properties, it is preferably 500 ppm by mass or less, more preferably 300 ppm by mass or less, and even more preferably 100 ppm by mass or less. Furthermore, it is preferably 50 ppm by mass or less, more preferably 30 ppm by mass or less, even more preferably 10 ppm by mass or less, even more preferably 5 ppm by mass or less, particularly preferably 3 ppm by mass or less, and most preferably 1 ppm by mass or less.

[0133] By adding a small amount of the above-mentioned methanol or ethanol to the photosensitive composition, the hydrophilicity of the compound promotes dissolution in the developer, resulting in significant effects of improving sensitivity during exposure and suppressing residues after development. Furthermore, the compound modifies the surface of the substrate, preventing residues from adhering to openings, thereby significantly suppressing residues after development.

[0134] Furthermore, intentionally incorporating a trace amount of the above-mentioned compound is believed to stabilize the polar groups of the resin in the photosensitive composition through interactions mediated by hydrogen bonds via the hydroxy groups in the compound. In particular, when a polysiloxane is incorporated into the photosensitive composition, this is suitable for stabilizing the silanol groups in the polysiloxane. Additionally, the hydroxy groups in the compound are believed to control the polarization structure and charge balance in the photosensitive composition. As a result, the effect of improving storage stability is significantly improved. Furthermore, when a pattern of the photosensitive composition is formed on wiring such as metal, the above-mentioned compound in the photosensitive composition is believed to surface-modify the wiring surface that becomes the opening or the wiring surface that contacts the pattern. Furthermore, the hydroxy groups in the compound contained in the cured product are believed to capture trace amounts of metal impurities and ionic impurities in the cured product, and these impurities migrate to the wiring surface, thereby acting as carriers in the wiring. As a result, the conductivity of the wiring such as metal is controlled, enabling low-voltage operation and improving luminance.

[0135] <Content of First Specific Compound (Alcohol Compound, Ester Compound, and Ether Compound)> From the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and improving luminance, the photosensitive composition of the present invention preferably further contains one or more compounds selected from the group consisting of 1-methoxy-2-propanol, 1-ethoxy-2-propanol, methyl acetate, ethyl acetate, allyl methyl ether, allyl ethyl ether, isoallyl methyl ether, and isoallyl ethyl ether (hereinafter referred to as "first specific compounds") and satisfies the following condition (8): (8) the total content of 1-methoxy-2-propanol, 1-ethoxy-2-propanol, methyl acetate, ethyl acetate, allyl methyl ether, allyl ethyl ether, isoallyl methyl ether, and isoallyl ethyl ether in the photosensitive composition is 0.0010 to 30,000 ppm by mass.

[0136] The total content of the first specific compounds in the photosensitive composition is preferably 0.010 ppm by mass or more, more preferably 0.030 ppm by mass or more, even more preferably 0.050 ppm by mass or more, still more preferably 0.070 ppm by mass or more, and particularly preferably 0.10 ppm by mass or more, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and improving luminance. On the other hand, the total content of the first specific compounds is preferably 25,000 ppm by mass or less, more preferably 20,000 ppm by mass or less, and even more preferably 15,000 ppm by mass or less, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and improving luminance. Furthermore, it is preferably 12,000 ppm by mass or less, more preferably 10,000 ppm by mass or less, even more preferably 7,000 ppm by mass or less, even more preferably 5,000 ppm by mass or less, particularly preferably 3,000 ppm by mass or less, and most preferably 1,000 ppm by mass or less. Furthermore, from the viewpoint of improving the above-mentioned properties, it is preferably 500 ppm by mass or less, more preferably 300 ppm by mass or less, and even more preferably 100 ppm by mass or less. Furthermore, it is preferably 50 ppm by mass or less, more preferably 30 ppm by mass or less, even more preferably 10 ppm by mass or less, even more preferably 5 ppm by mass or less, particularly preferably 3 ppm by mass or less, and most preferably 1 ppm by mass or less.

[0137] Similarly, by incorporating a trace amount of the first specific compound into the photosensitive composition, the effect of promoting dissolution in the developer and preventing residue adhesion at the openings is achieved, resulting in significant improvements in sensitivity during exposure and suppression of residue after development. Furthermore, the effect of stabilizing the polar groups of the resin in the photosensitive composition and controlling the polarization structure and charge balance in the photosensitive composition is significant, resulting in significant improvements in storage stability. Furthermore, it is estimated that the luminance is improved by surface modification of the wiring surface and control of conductivity by the migration of metal impurities and ionic impurities to the wiring surface.

[0138] <Content of Second Specific Compound (Alcohol Compound, Ester Compound, and Ether Compound)> From the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and improving luminance, the photosensitive composition of the present invention preferably further contains one or more compounds selected from the group consisting of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, 2-methoxy-1-propyl acetate, 2-ethoxy-1-propyl acetate, methallyl methyl ether, and methallyl ethyl ether (hereinafter referred to as "second specific compound") and satisfies the following condition (9): (9) The total content of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, 2-methoxy-1-propyl acetate, 2-ethoxy-1-propyl acetate, methallyl methyl ether, and methallyl ethyl ether in the photosensitive composition is 0.0010 to 1,000 ppm by mass.

[0139] The total content of the second specific compounds in the photosensitive composition is preferably 0.010 mass ppm or more, more preferably 0.030 mass ppm or more, even more preferably 0.050 mass ppm or more, even more preferably 0.070 mass ppm or more, and particularly preferably 0.10 mass ppm or more, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and improving luminance. On the other hand, the total content of the second specific compounds is preferably 500 mass ppm or less, more preferably 300 mass ppm or less, and even more preferably 100 mass ppm or less, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and improving luminance. Furthermore, it is preferably 50 mass ppm or less, more preferably 30 mass ppm or less, even more preferably 10 mass ppm or less, even more preferably 5 mass ppm or less, particularly preferably 3 mass ppm or less, and most preferably 1 mass ppm or less.

[0140] By incorporating a small amount of the above-mentioned second specific compound into the photosensitive composition, the effects of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and improving luminance are significant, similar to those of the first specific compound.

[0141] <Specific Ketone Compound> From the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and improving luminance, the photosensitive composition of the present invention preferably further contains 4-methyl-3-penten-2-one and / or 4-methyl-4-penten-2-one (hereinafter referred to as "specific ketone compound") and satisfies the following condition (10): (10) The total content of 4-methyl-3-penten-2-one and 4-methyl-4-penten-2-one in the photosensitive composition is 0.010 to 10.0 mass%.

[0142] The total content of the specific ketone compounds in the photosensitive composition is preferably 0.030% by mass or more, more preferably 0.050% by mass or more, even more preferably 0.070% by mass or more, and particularly preferably 0.10% by mass or more, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and improving luminance. On the other hand, the total content of the specific ketone compounds is preferably 7.0% by mass or less, more preferably 5.0% by mass or less, even more preferably 3.0% by mass or less, even more preferably 2.5% by mass or less, particularly preferably 2.2% by mass or less, and most preferably 2.0% by mass or less, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and improving luminance. Furthermore, it is preferably 1.7% by mass or less, more preferably 1.5% by mass or less, even more preferably 1.2% by mass or less, even more preferably 1.0% by mass or less, particularly preferably 0.70% by mass or less, and most preferably 0.50% by mass or less.

[0143] By incorporating a trace amount of the above-mentioned specific ketone compound into the photosensitive composition, the effects of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and improving luminance can be significantly achieved, similar to the first specific compound.

[0144] <Specific Heterocyclic Compound> From the viewpoints of improving sensitivity during exposure, suppressing residues after development, improving storage stability, and improving luminance, the photosensitive composition of the present invention preferably further contains one or more compounds selected from the group consisting of N-methylpyrrolidone, N-ethylpyrrolidone, 1,4-dioxane, and tetrahydrofuran (hereinafter referred to as "specific heterocyclic compounds") and satisfies the following condition (11): (11) The total content of N-methylpyrrolidone, N-ethylpyrrolidone, 1,4-dioxane, and tetrahydrofuran in the photosensitive composition is 0.0010 to 1,000 ppm by mass.

[0145] The total content of the specific heterocyclic compounds in the photosensitive composition is preferably 0.010 mass ppm or more, more preferably 0.030 mass ppm or more, even more preferably 0.050 mass ppm or more, even more preferably 0.070 mass ppm or more, and particularly preferably 0.10 mass ppm or more, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and improving luminance. On the other hand, the total content of the second specific compounds is preferably 500 mass ppm or less, more preferably 300 mass ppm or less, and even more preferably 100 mass ppm or less, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and improving luminance. Furthermore, it is preferably 50 mass ppm or less, more preferably 30 mass ppm or less, even more preferably 10 mass ppm or less, even more preferably 5 mass ppm or less, particularly preferably 3 mass ppm or less, and most preferably 1 mass ppm or less.

[0146] By incorporating a trace amount of the above-described specific heterocyclic compound into the photosensitive composition, the effects of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and improving luminance are significant, similar to those of the first specific compound.

[0147] <Hydrogen Ion Exponent of Diluted Solution> When the photosensitive composition of the present invention is diluted with water to prepare a diluted solution and the solids concentration of the diluted solution is 1 / 100 of the solids concentration of the photosensitive composition, the hydrogen ion exponent of the diluted solution is preferably 5.5 or more, more preferably 5.7 or more, even more preferably 6.0 or more, even more preferably 6.2 or more, and particularly preferably 6.5 or more, from the viewpoints of improving the sensitivity during exposure, suppressing the residue after development, and improving the storage stability. On the other hand, the hydrogen ion exponent of the diluted solution is preferably 7.0 or less, more preferably 6.9 or less, and even more preferably 6.8 or less, from the viewpoints of improving the sensitivity during exposure, suppressing the residue after development, and improving the storage stability. When the photosensitive composition of the present invention contains the resin (A1x-1), and the photosensitive composition is diluted with water to prepare a diluted solution having a solids concentration of 1 / 100 of the solids concentration of the photosensitive composition, the hydrogen ion exponent of the diluted solution is preferably 5.5 or more, more preferably 5.7 or more, even more preferably 6.0 or more, even more preferably 6.2 or more, and particularly preferably 6.5 or more, from the viewpoint of the aforementioned effects of the invention. On the other hand, the hydrogen ion exponent of the diluted solution is preferably 7.0 or less, more preferably 6.9 or less, and even more preferably 6.8 or less, from the viewpoint of the aforementioned effects of the invention.

[0148] The hydrogen ion exponent of a diluted solution of a photosensitive composition can be measured using a commercially available pH meter. First, a diluted solution is prepared by diluting the photosensitive composition with water so that the solids concentration of the diluted solution is 1 / 100 of the solids concentration of the photosensitive composition. Next, the prepared diluted solution is stirred for 10 minutes or more so that the components in the photosensitive composition reach distribution equilibrium. After stirring, the hydrogen ion exponent of the diluted solution is measured using a pH meter. If the diluted solution has separated into an organic layer and an aqueous layer after stirring, the hydrogen ion exponent of the aqueous layer is measured.

[0149] <Photosensitive Film of the Present Invention> The photosensitive film of the present invention is a semi-cured (B-stage) film formed from the photosensitive composition of the present invention. The semi-cured state refers to a film in which a crosslinked structure is not formed or a crosslinked structure is formed by partial reaction, but the film retains fluidity, or refers to this state. For example, the semi-cured state refers to a state in which the coating film is applied to a substrate or the like, and then the coating film is dried under reduced pressure to remove the solvent, or the coating film is dried by heating at 40 to 150°C, and is soluble in an alkaline solution or an organic solvent. The photosensitive film refers to a film that has positive or negative photosensitivity and can form a free-standing film as a single film. "Formable as a free-standing film as a single film" refers to a film that can be formed without a support, with a width of 1.5 cm or more, a length of 5.0 cm or more, and a thickness of 5.0 μm or more. The photosensitive film is preferably a laminate disposed on a support. The support is preferably a flexible substrate, but may also be a rigid substrate.

[0150] <Cured Product of the Photosensitive Composition of the Present Invention> The cured product of the present invention is obtained by curing the photosensitive composition of the present invention. Curing refers to the formation of a crosslinked structure by a reaction and the loss of fluidity of the film, or the state in which this occurs. The reaction may be by heating, by irradiation with energy rays, or the like, but is not particularly limited; however, reaction by heating is preferred. The state in which a crosslinked structure is formed by heating and the loss of fluidity of the film is called thermal curing. Heating conditions include, for example, heating at 150 to 500°C for 5 to 300 minutes. The cured product of the present invention may also be obtained by curing the photosensitive film of the present invention.

[0151] The optical density at the wavelength of visible light per 1 μm of film thickness of the cured product of the present invention is preferably 0.20 or more, more preferably 0.50 or more, and even more preferably 1.0 or more, from the viewpoint of suppressing external light reflection and improving the reliability of elements. On the other hand, from the viewpoint of improving sensitivity during exposure and improving the reliability of elements, the optical density is preferably 3.0 or less, more preferably 2.0 or less, and even more preferably 1.5 or less. The optical density is preferably the optical density of a cured product obtained by heating and curing the composition. When the optical density is within the above range, incident external light can be blocked, thereby significantly suppressing the effect of suppressing external light reflection. Furthermore, photodegradation of the cured product itself and layers inside it is suppressed, thereby significantly improving the reliability of elements.

[0152] <Elements and Articles Comprising Cured Product> The elements of the present invention comprise the cured product of the present invention. Furthermore, the articles of the present invention comprise the cured product of the present invention. Examples of articles include electronic components, electronic devices, mobile objects, buildings, and windows. Examples of electronic components include semiconductor devices, antennas, display devices, metal-clad laminates, wiring boards, semiconductor packages, active components including semiconductor devices, and passive components. The photosensitive composition of the present invention is preferably used to form electronic components. Examples of semiconductor devices include semiconductor devices having a fan-out wafer-level package structure, a fan-out panel-level package structure, or an antenna-in-package structure. Examples of antennas include microstrip line antennas or strip line antennas. Examples of display devices include organic electroluminescence (EL) displays, quantum dot displays, micro LED displays, mini LED displays, and liquid crystal displays. Examples of metal-clad laminates include printed circuit boards.

[0153] The electronic component of the present invention comprises the cured product of the present invention. The display device of the present invention also comprises the cured product of the present invention. A display device comprising the cured product of the present invention exhibits high luminance. Therefore, the photosensitive composition of the present invention is preferably used to form a pixel dividing layer, a TFT planarization layer, a TFT protective layer, a TFT interlayer insulating layer, or a gate insulating layer in an organic EL display, a quantum dot display, or a micro LED display. The photosensitive composition of the present invention is also preferably used to form a partition layer or a planarization layer in a micro LED display or a mini LED display. The partition layer is preferably formed between adjacent light-emitting elements, and the planarization layer is preferably formed so as to cover at least a portion of the light-emitting element. The light-emitting element is preferably a semiconductor chip. That is, the photosensitive composition of the present invention is particularly preferably used to form a partition layer formed between adjacent light-emitting elements or a planarization layer formed so as to cover at least a portion of the light-emitting element.

[0154] <Hollow Structure> The hollow structure of the present invention comprises the cured product of the present invention. The electronic component of the present invention preferably has the hollow structure of the present invention. The hollow structure of the present invention has a hollow structure support material and a hollow structure roofing material. The photosensitive film of the present invention is suitable for forming a hollow structure. Examples of electronic components having a hollow structure include MEMS (Micro Electro Mechanical Systems).

[0155] <Display Device> The display device of the present invention will be described below. However, the present invention is not limited to the following embodiments, and various modifications are possible as long as the object of the invention can be achieved and the gist of the invention is not deviated from.

[0156] The display device of the present invention has the configuration of

[15] above. By adopting the above configuration, the display device of the present invention can provide a display device with excellent luminance. This is presumably because, by intentionally incorporating a trace amount of the above-mentioned methanol or ethanol in the partition layer and / or planarizing layer, the hydroxyl groups in the compound contained in the cured product capture trace amounts of metal impurities and ionic impurities in the cured product. These impurities are thought to migrate to the wiring surface and act as carriers in the wiring. As a result, the conductivity of metal wiring or the like is controlled, enabling low-voltage operation, which is thought to contribute to the effect of high luminance.

[0157] <Resins and Compounds in the Partition Wall Layer and Planarizing Layer> The display device of the present invention includes a partition wall layer and / or a planarizing layer. The partition wall layer and planarizing layer in the display device of the present invention are preferably cured products of photosensitive compositions, and more preferably contain a resin. The resin in the partition wall layer and planarizing layer preferably contains a weakly acidic group-containing resin (XA1) and / or a weakly acidic group-free resin (XA2). The weakly acidic group-containing resin (XA1) in the partition wall layer and planarizing layer is preferably the above-mentioned weakly acidic group-containing resin (A1) or a resin having a structure derived from such a resin. The weakly acidic group-free resin (XA2) is preferably the above-mentioned weakly acidic group-free resin (A2) or a resin having a structure derived from such a resin. Examples and preferred descriptions of the resin in the partition wall layer and planarizing layer are the same as the examples and preferred descriptions of the above-mentioned binder resin (A). The resin in the partition wall layer and the planarizing layer may be either the binder resin (A) in the composition or a resin having a structure derived from the binder resin.

[0158] <Methanol and Ethanol Contents in the Partition Wall Layer and the Planarizing Layer> In the display device of the present invention, the partition wall layer and / or the planarizing layer contain methanol and / or ethanol. From the viewpoint of improving luminance, the display device of the present invention preferably further satisfies the following conditions (X1a) and / or (X1b): (X1a) The total content of methanol and ethanol in the partition wall layer is 0.0010 to 30,000 ppm by mass; (X1b) The total content of methanol and ethanol in the planarizing layer is 0.0010 to 30,000 ppm by mass.

[0159] The display device of the present invention is preferably a micro LED display or a mini LED display. Since the area of ​​the redistribution layer is larger than the area of ​​the light-emitting element, which is a semiconductor chip, in a planar view, the display device of the present invention has a fan-out wafer-level package structure or a fan-out panel-level package structure. The substrate, the redistribution layer, the interlayer insulating layer of the redistribution layer, the light-emitting element, the semiconductor chip, the partition layer, and the planarization layer may be made of known materials.

[0160] The display device of the present invention will be described with reference to the drawings. FIG. 1 is a schematic cross-sectional view of a micro LED display having a partition layer and a planarization layer. The display device 1a includes a plurality of light-emitting elements 2 and a plurality of partition layers 15 on an opposing substrate 5. A planarization layer 21 is provided on the light-emitting elements 2, and an interlayer insulating layer 3 is provided on the planarization layer 21. The light-emitting elements 2 are preferably semiconductor chips. "On the light-emitting elements 2" does not only refer to the surface of the light-emitting elements 2, but may also refer to a support substrate or the upper side of the light-emitting elements 2. In the embodiment shown in FIG. 1, the partition layer 15 is provided between adjacent light-emitting elements 2, the planarization layer 21 is formed to cover the light-emitting elements 2, and multiple interlayer insulating layers 3 are stacked on the planarization layer 21. However, the interlayer insulating layer 3 may be a single layer.

[0161] The light-emitting element 2 has a pair of electrode terminals 6 on the surface opposite to the surface in contact with the counter substrate 5, and each electrode terminal 6 is electrically connected to a metal wiring 4 extending through the planarization layer 21 and the interlayer insulating layer 3. Note that the multiple metal wirings 4 are configured to maintain electrical insulation because, when covered by the planarization layer 21 or the interlayer insulating layer 3, these layers function as insulating films. The metal wiring is configured to maintain electrical insulation when the portions of the metal wiring that require electrical insulation are covered with a cured product obtained by curing a resin-containing composition. Furthermore, the light-emitting element 2 is electrically connected to a driving element 8 provided on a light-emitting element driving substrate 7 disposed opposite the counter substrate 5 via the metal wiring 4 and metal wiring 4c, thereby enabling control of the light emission of the light-emitting element 2. The light-emitting element driving substrate 7 is electrically connected to the metal wiring 4 via solder bumps 10. Furthermore, a barrier metal 9 is provided to prevent diffusion of metals such as the metal wiring 4. Note that the metal wiring 4c may be electrically connected to the driving element 8 by penetrating the light-emitting element driving substrate 7. In the display device 1a, the side of the light-emitting element 2 that contacts the opposing substrate 5 (the lower side in FIG. 1) is the light extraction side. The micro LED display in FIG. 1 is preferably manufactured using a chip-first (RDL (Redistribution layer)-last) structure in which the light-emitting element 2, which is a semiconductor chip, is placed on a support substrate or the like, and then metal wiring 4 and an interlayer insulating layer 3 are formed. Thereafter, a light-emitting element drive substrate is preferably bonded, and then the support substrate and the like are peeled off, and then the opposing substrate 5 is attached.

[0162] Figure 2 is a schematic cross-sectional view of another type of micro LED display having a partition layer and a planarizing layer. In the display device 1b, the side of the light-emitting element 2 that contacts the counter substrate 5 (the upper side in Figure 2) is the light extraction side. The micro LED display in Figure 2 is preferably manufactured using an RDL-first (chip-last) structure in which metal wiring 4 and an interlayer insulating layer 3 are formed on a support substrate or the like, and then the light-emitting element 2, which is a semiconductor chip, is arranged. Thereafter, the support substrate and the like are peeled off, and then the counter substrate 5 is attached, and then the light-emitting element drive substrate 7 is preferably joined.

[0163] The light-emitting element 2 is preferably a PN junction diode in which a P-type semiconductor and an N-type semiconductor are bonded. The light-emitting element 2 preferably has a side length of 5 to 700 μm, more preferably 5 to 100 μm. The interlayer insulating layer 3, the partition layer 15, and the planarizing layer 21 are preferably cured products of patterned photosensitive compositions. A configuration in which the thickness of the planarizing layer 21 is greater than the thickness of the partition layer 15 is also preferred. A configuration in which the planarizing layer 21 covers a portion of the surface of the partition layer 15 opposite the surface that contacts the opposing substrate 5 is also preferred, and a configuration in which the planarizing layer 21 covers the entire surface of the partition layer 15 opposite the surface that contacts the opposing substrate 5 is more preferred. From the viewpoint of improving mechanical properties, the interlayer insulating layer 3 more preferably contains the above-mentioned polyimide-based resin. By containing the above-mentioned polyimide-based resin, warping of the wafer or substrate is suppressed, resulting in significant effects of improving the accuracy and yield of the exposure process and the wafer or substrate transport process. From the viewpoint of improving the luminance of emitted light, the partition wall layer 15 and the planarizing layer 21 are preferably the cured product of the present invention. From the viewpoint of improving the reliability of the light-emitting element and the luminance of emitted light, the partition wall layer 15 preferably contains the above-mentioned (G) inorganic particles. From the viewpoint of improving the reliability of the light-emitting element and the suppression of external light reflection, the partition wall layer 15 preferably contains the above-mentioned (D) colorant. The meanings of the remaining symbols in Figure 2 are as in Figure 1.

[0164] <Method for producing a cured product> The method for producing a cured product of the present invention includes: (1) a step of forming a coating film of the photosensitive composition of the present invention on a substrate; (2) a step of irradiating the coating film of the photosensitive composition with actinic rays through a photomask; (3) a step of developing using a developer to form a pattern of the photosensitive composition; and (4) a step of heating the pattern to obtain a cured pattern of the photosensitive composition. Note that in these steps, the methods described in paragraphs

[0453] to

[0481] of WO 2019 / 087985 may also be applied. The step of forming a coating film preferably involves applying a coating and then pre-baking to form a film. The step of obtaining a cured pattern preferably involves heating the pattern to thermally cure it.

[0165] The present invention will be described in more detail below with reference to Examples, Reference Examples, and Comparative Examples, but the present invention is not limited to these examples. For compounds used in the following explanations or tables that use abbreviations, the names corresponding to the abbreviations are listed in Table 1-2.

[0166]

[0167] <Synthesis Examples of Each Resin> The compositions of the resins obtained in Synthesis Examples 1 to 27 as (A) binder resin are summarized in Tables 1-3 to 1-5. Each resin was synthesized by a known method based on a method described in a known literature, with the monomer compounds to be used as monomers and the copolymerization ratios appropriately changed. The copolymerization ratios of the monomers are as shown in Tables 1-3 to 1-5.

[0168] The hydroxyl group-containing diamine (HA) having the following structure used in Synthesis Example 16 was synthesized by a known method based on the synthesis method described in Synthesis Example 1 in paragraphs

[0374] to

[0376] of WO 2016 / 056451. The resin obtained in Synthesis Example 16 using the hydroxyl group-containing diamine (HA) having the following structure is a polyimide precursor having an amic acid ester structural unit, an amic acid structural unit, and an imide ring-closed structure.

[0169]

[0170] In Synthesis Examples 16 and 17, the amic acid structural units in the resin were reacted with DFA as an esterifying agent to convert the structure into amic acid ester structural units having a methyl group.

[0171] In Synthesis Example 23, GMA having an epoxy group was reacted with the carboxy group derived from MAA in the resin, and all of the epoxy groups of GMA were subjected to ring-opening addition.

[0172] In Synthesis Example 26, DHBA having a carboxy group was reacted with the epoxy groups derived from GMA in the resin, and all of the epoxy groups of GMA were subjected to ring-opening addition.

[0173] In Synthesis Example 27, GMA having an epoxy group was reacted with the phenolic hydroxyl group derived from HPMA in the resin, and all of the epoxy groups of GMA were subjected to ring-opening addition.

[0174]

[0175]

[0176]

[0177] The structural units and structures of the resins obtained in each Synthesis Example, as well as the resins used in each Example, Reference Example, and Comparative Example, are summarized in Table 2-1. The fluorine content in the resin structure of polysiloxane (PS-5), polyimide (PI-1), polyimide precursor (PIP-1), polybenzoxazole (PB-1), polybenzoxazole precursor (PBP-1), and polyamideimide (PAI-1) exceeded 10,000 ppm by mass. The fluorine content in the resin structure of polysiloxanes (PS-1) to (PS-4), (PS-6) to (PS-11), polyimides (PI-2) to (PI-4), polyimide precursor (PIP-2), and other Synthesis Examples was 0 ppm by mass.

[0178]

[0179] <Preparation Examples of Each Pigment Dispersion> The compositions of the pigment dispersions obtained in Preparation Examples Bk-1 to Bk-3 are summarized in Table 2-2. In Preparation Examples Bk-1 to Bk-3, each pigment dispersion was prepared by the following method. Table 2-2 also lists and describes the (D) colorant and (E) dispersant used in each Example, Reference Example, and Comparative Example.

[0180] Preparation Examples Bk-1 to Bk-3, Preparation of Pigment Dispersions (Bk-1) to (Bk-3) Based on the method described in paragraphs

[0138] to

[0140] of International Publication No. 2022 / 196261 and Preparation Example 1, a colorant described in Table 2-2 and ADP, a polyalkyleneamine-polyoxyalkylene ether dispersant, were used as the dispersant, and a wet media dispersion treatment was carried out using a circulation system so that the average primary particle diameter of the pigment was the value described in Table 2-2. The mixture was then filtered through a 0.80 μmφ filter to obtain pigment dispersions (Bk-1) to (Bk-3) with a solids concentration of 15% by mass and a colorant / dispersant ratio of 100 / 35 (by mass). The average primary particle diameter of the pigment in the obtained pigment dispersion is shown in Table 2-2. The average primary particle diameter of the pigment in the cured film, the crystallite size of the pigment in the pigment dispersion, and the crystallite size of the pigment in the cured film are also shown in Table 2-2.

[0181]

[0182] <Synthesis Examples of Silica Particle Dispersions> Synthesis Example 28 Synthesis of Silica Particle (SP-1) Dispersion Based on the method described in paragraphs

[0132] to

[0134] and Synthesis Example 3 of WO 2022 / 196261, a dispersion of silica particles (SP-1) was obtained using MEK-ST-40 as the silica particle dispersion, KBM-503 as a surface modifier, and MOP as a polymerization inhibitor. The inorganic silica particles (SP-1) have methacryloyl groups as functional groups on the particle surface, a primary particle size distribution range of 10 to 16 nm, an average primary particle size of 12 nm, an aspect ratio range of 1.0 to 1.1, an average aspect ratio of 1.1, and a sodium content of 100 ppm by mass.

[0183] Evaluation Methods for Each Example, Reference Example, and Comparative Example The evaluation methods for each Example, Reference Example, and Comparative Example are described below. A glass substrate (manufactured by Geomatec Co., Ltd.; hereinafter referred to as "ITO / Ag substrate") was prepared by sputtering a 100 nm film of APC (silver / palladium / copper = 98.07 / 0.87 / 1.06 (mass ratio)) on glass, and then sputtering a 10 nm film of ITO on top of the APC layer. This glass substrate was subjected to UV-O3 cleaning for 100 seconds using a tabletop optical surface treatment device (PL16-110; manufactured by Sen Special Light Sources Co., Ltd.). Tempax glass substrates (manufactured by AGC Technoglass Co., Ltd.) and other substrates were used without pretreatment.

[0184] The film thickness was measured using a surface roughness and contour shape measuring instrument (SURFCOM1400D; manufactured by Tokyo Seimitsu Co., Ltd.) at a measurement magnification of 10,000 times, a measurement length of 1.0 mm, and a measurement speed of 0.30 mm / s.

[0185] (1) Weight-average molecular weight of resins For the above polyimides (PI-1) to (PI-4), polyimide precursors (PIP-1) and (PIP-2), polybenzoxazole (PB-1), polybenzoxazole precursor (PBP-1), and polyamideimide (PAI-1), a 0.10 mass% N-methyl-2-pyrrolidone solution of each resin was prepared. Using a GPC analyzer (Waters 2690; manufactured by Waters), the weight-average molecular weight in terms of polystyrene was measured using N-methyl-2-pyrrolidone in which lithium chloride and phosphoric acid were dissolved at 0.050 mol / L as the fluidized bed. For other resins, the weight average molecular weight in terms of polystyrene was measured at around room temperature using a GPC analyzer (HLC-8220; manufactured by Tosoh Corporation) and tetrahydrofuran or N-methyl-2-pyrrolidone as the fluidized bed in accordance with JIS K7252-3 (2008).

[0186] (2) Contents of chlorine, bromine, and fluorine in resins, compositions, or cured films The contents of chlorine, bromine, and fluorine in resins, compositions, or cured films were measured by combustion ion chromatography under the following measurement conditions. Each of the above resins was separated by GPC fractionation before use. Even when the resins were composed of resins with different structural units, they were also separated by GPC fractionation before use. Regarding the resins in the composition, whether they contained a single resin or resins with different structural units, the composition was extracted with dichloromethane, ultracentrifuged, and then separated from the dichloromethane-insoluble matter by GPC fractionation before use. The resin, composition, or cured film was combusted and decomposed in the combustion tube of an analyzer. The generated gas was absorbed in an absorption liquid, and a portion of the absorption liquid was analyzed by ion chromatography. The absence of an element content indicates that the element was not detected. The content of each element relative to the total solids of the composition was calculated using the measured value and the following formula: (Content of chlorine element and bromine element relative to the total solid content of the composition) = (Content of chlorine element and bromine element in the composition) × 100 / (Solid content concentration of the composition [mass %])

[0187] <Combustion and absorption conditions> System: AQF-2100H, GA-210 (manufactured by Mitsubishi Chemical Corporation) Electric furnace temperature: Inlet 900°C, Outlet 1000°C Gas: Ar / O ２ 200mL / min, O ２ 400 mL / min Absorption liquid: H ２ O ２ 0.1 mass% Absorption amount: 5 mL

[0188] <Conditions for Ion Chromatography and Anion Analysis> System: ICS1600 (manufactured by DIONEX) Mobile phase: 2.7 mmol / L Na ２ CO ３ , 0.3 mmol / L NaHCO ３ Flow rate: 1.50 mL / min Detector: electrical conductivity detector Injection volume: 100 μL.

[0189] (3) Content of Anions and Cations in the Composition or Cured Film The contents of chloride ions, bromide ions, fluoride ions, specific anions, and quaternary ammonium ions in the composition or cured film were measured by ion chromatography under the following measurement conditions. The composition or cured film was added to ultrapure water and shaken at room temperature to extract ion components. The extract was treated with a solid-phase extraction cartridge, and then the cation and anion components were analyzed by ion chromatography. When anion components could not be measured using the ion chromatography analysis condition 1 below, they were measured using the ion chromatography analysis condition 2 below. If the ion content is not listed, it means that the ion was not detected. The content relative to the total solid content of the composition was calculated from the measured value and the following formula: (Content of anions or cations relative to the total solid content of the composition) = (Content of anions or cations in the composition) × 100 / (Solid content concentration of the composition [mass %])

[0190] <Ion Chromatography Analysis Condition 1 (Anion Components)> Apparatus: IC-2010 (manufactured by Tosoh Corporation) Separation column: 4.6 mmφ×100 mm, TSKgel Super IC-Anion HS Eluent: sodium bicarbonate Column temperature: 40° C. Detector: electrical conductivity meter Sample injection volume: 250 μL

[0191] <Ion Chromatography Analysis Condition 2 (Anion Components)> Apparatus: IC-2010 (manufactured by Tosoh Corporation) Separation column: 4.6 mmφ×100 mm, TSKgel Super IC-Anion HS Eluent: sodium carbonate / sodium bicarbonate Column temperature: 40° C. Detector: electrical conductivity meter Sample injection volume: 250 μL

[0192] <Ion Chromatography Analysis Condition 3 (Cationic Components)> Apparatus: INTEGRION (manufactured by Thermo Fisher Scientific) Separation column: 2 mmφ×250 mm, IonPac CS19-4 μm Eluent: methanesulfonic acid Detector: electrical conductivity meter Sample injection amount: 100 μL.

[0193] (4) Content of specific compounds in the composition or cured film The contents of specific phosphorus compounds, tertiary amine compounds, methanol, ethanol, first specific compound, second specific compound, specific ketone compounds, and specific heterocyclic compounds in the composition or cured film were measured by gas chromatography mass spectrometry and liquid chromatography mass spectrometry using calibration curves based on standard substances. The content relative to the total solid content of the composition was calculated from the obtained measured values ​​and the following formula: (Content of specific compounds relative to the total solid content of the composition) = (Content of specific compounds in the composition) × 100 / (Solid content concentration of the composition [mass %]).

[0194] (5) Water Content in Composition The water content in the composition was measured by volumetric titration in accordance with JIS K0113 (2005) using a Karl Fischer moisture meter (MKS-520; manufactured by Kyoto Electronics Manufacturing Co., Ltd.) and a Karl Fischer reagent as a titration reagent.

[0195] (6) Sensitivity The resolution pattern of the prepared developed film was observed using an FPD / LSI inspection microscope (OPTIPHOT-300; manufactured by Nikon Corporation). When a composition having positive photosensitivity was used, the optimum exposure dose (value measured with an i-line illuminometer) at which a space pattern corresponding to the openings in a 20 μm line-and-space pattern could be formed with a dimensional width of 20 μm was determined as an index of sensitivity. On the other hand, when a composition having negative photosensitivity was used, the exposure dose (value measured with an i-line illuminometer) at which a space pattern corresponding to the openings in a 20 μm line-and-space pattern could be formed with a dimensional width of 18 μm was used as an index of sensitivity. The sensitivity was determined as follows, and a sensitivity of 90 mJ / cm was obtained. ２ The following grades were evaluated as passing: A+, A, B+, B, C+, and C. A+: Sensitivity is 30 mJ / cm ２ A: Sensitivity is 30 mJ / cm or less ２ and more than 40 mJ / cm ２ Below B+: Sensitivity is 40 mJ / cm ２ and more than 50 mJ / cm ２ B: Sensitivity is 50 mJ / cm or less ２ and more than 60 mJ / cm ２ Below C+: Sensitivity is 60 mJ / cm２ and more than 75 mJ / cm ２ C: Sensitivity is 75 mJ / cm or less ２ and more than 90 mJ / cm ２ D: Sensitivity is 90 mJ / cm or less ２ and more than 150 mJ / cm ２ E: Sensitivity is 150 mJ / cm or less ２ Exceeded.

[0196] (7) Development Residues Using an FPD / LSI inspection microscope (OPTIPHOT-300; manufactured by Nikon Corporation), the resolution pattern of the prepared developed film was observed. As an index of development residues, the presence or absence of residues in a 20 μm line and space pattern was observed, and the area occupied by the residues in the openings was calculated. The evaluation was carried out as follows, and samples with an area of ​​residues of 20% or less were rated as passing, with grades A+, A, B+, B, C+, and C. A+: No residue A: The area where residue is present is 3% or less B+: The area where residue is present is more than 3% but not more than 6% B: The area where residue is present is more than 6% but not more than 10% C+: The area where residue is present is more than 10% but not more than 15% C: The area where residue is present is more than 15% but not more than 20% D: The area where residue is present is more than 20% but not more than 50% E: The area where residue is present is more than 50% but not more than 100%.

[0197] (8) Light-Shielding Property (Optical Density Value (hereinafter, "OD Value")) A cured film of the composition was prepared on a Tempax glass substrate (manufactured by AGC Technoglass Co., Ltd.) by the method described in Example 1 below. The incident light intensity (I ) at three points on the surface of the prepared cured film was measured using a transmission densitometer (X-Rite 361T(V); manufactured by X-Rite Co., Ltd.). ０ The optical density (OD) per 1 μm of film thickness was calculated as an index of light-shielding ability using the following formula, and the average value of the OD values ​​at three points on the surface was calculated. OD value=log １０ (I ０ / I).

[0198] (9) Reliability of Light-Emitting Device An organic EL display manufactured by the method described in Example 1 below was subjected to a current of 10 mA / cm ２The device was driven with a direct current to emit light, and the device was observed for light emission defects such as non-emitting areas and uneven brightness. As a durability test, the device was heated to 80°C with the light extraction side facing up, and the wavelength was 365 nm and the illuminance was 0.6 mW / cm. ２ After 500 hours, the organic EL display was irradiated with light of 10 mA / cm ２ The light-emitting devices were driven by DC current and the light-emitting characteristics were observed for any changes. As an index of the reliability of the light-emitting device, the light-emitting area after the durability test was measured, with the light-emitting area before the durability test being taken as 100%. The evaluation was carried out as follows, and A+, A, B+, B, C+, and C, which indicate that the light-emitting area was 80% or more, were judged to be pass. A+: Light-emitting area is 100%. A: Light-emitting area is 97% or more but less than 100%. B+: Light-emitting area is 94% or more but less than 97%. B: Light-emitting area is 90% or more but less than 94%. C+: Light-emitting area is 85% or more but less than 90%. C: Light-emitting area is 80% or more but less than 85%. D: Light-emitting area is 60% or more but less than 80%. E: Light-emitting area is less than 60%.

[0199] (10) Emission Brightness The micro LED display fabricated by the method described in Example 1 below was allowed to emit light, and the light extraction efficiency was measured as an index of emission brightness using an external quantum efficiency measurement device (Hamamatsu Photonics; C9920). The light extraction efficiency was calculated as a relative value relative to the light extraction efficiency of the micro LED display described in Example 1, which was set to 1.00. The evaluation was performed as follows, and A+, A, B+, B, C+, and C, which had a relative value of 1.00 for the light extraction efficiency, were considered to be acceptable. A+: The relative value of the light extraction efficiency is 1.30 or more. A: The relative value of the light extraction efficiency is 1.20 or more and less than 1.30. B+: The relative value of the light extraction efficiency is 1.10 or more and less than 1.20. B: The relative value of the light extraction efficiency is 1.00 or more and less than 1.10. C+: The relative value of the light extraction efficiency is 0.95 or more and less than 1.00. C: The relative value of the light extraction efficiency is 0.90 or more and less than 0.95. D: The relative value of the light extraction efficiency is 0.70 or more and less than 0.90. E: The relative value of the light extraction efficiency is less than 0.70.

[0200] (11) Storage Stability Each composition prepared as described below was stored at 25°C for one week. After storage, a pre-baked film of each composition was formed on a 6-inch diameter Si wafer using the method described in Example 1 below. As an index of storage stability, the presence or absence of foreign matter on the pre-baked film and the number of foreign matter particles were visually observed. The evaluation was made as follows, and A+, A, B+, B, C+, and C, which indicate that the number of foreign matter particles was 20 or less, were considered to be acceptable. A+: No foreign matter A: The number of foreign matter particles was 3 or less B+: The number of foreign matter particles was more than 3 but not more than 6 B: The number of foreign matter particles was more than 6 but not more than 10 C+: The number of foreign matter particles was more than 10 but not more than 15 C: The number of foreign matter particles was more than 15 but not more than 20 D: The number of foreign matter particles was more than 20 but not more than 50 E: The number of foreign matter particles was more than 50.

[0201] <Compounds used in each example, reference example, and comparative example> The structures of the compounds used in each example, reference example, and comparative example are shown below.

[0202]

[0203]

[0204] Furthermore, compounds corresponding to compounds containing chlorine element, bromine element, chloride ion, or bromide ion (hereinafter referred to as "specific halogen compounds"); compounds containing specific anions; specific phosphorus compounds; tertiary amine compounds; compounds containing quaternary ammonium ions (hereinafter referred to as "quaternary cation compounds"); specific heterocyclic compounds; first specific compounds; second specific compounds; specific ketone compounds; and compounds containing fluorine element or fluoride ion (hereinafter referred to as "specific fluorine compounds") used in each of the Examples, Reference Examples, and Comparative Examples are collectively shown in Tables 2-3.

[0205]

[0206] <Preparation of Photosensitive Compositions> Compositions 1 to 120 were prepared according to the compositions listed in Tables 3-1 to 3-10. In Tables 3-1 to 3-10, the values ​​in parentheses indicate the solids content of each component in parts by mass. In the tables, the content of quaternary ammonium ions is reported as the content of quaternary cations. When a composition contained a pigment, a preparation not containing a pigment dispersion was first prepared, and then the pigment dispersion and the preparation were mixed to prepare the composition. A PGMEA / EL / GBL mixture (mass ratio: 50 / 40 / 10) was used as the solvent, and the composition was adjusted to a solids concentration of 30 mass%. The resulting composition solution was filtered through a 0.45 μmφ filter before use. Compositions S1 to S7 were also prepared according to the same method, according to the compositions listed in Table 2-4.

[0207]

[0208] Example 1 Composition 1 was applied to an ITO / Ag substrate using a spin coater (MS-A100; manufactured by Mikasa Corporation), and then prebaked for 120 seconds at 120°C using a buzzer hot plate (HPD-3000BZN; manufactured by AS ONE Corporation) to produce a prebaked film with a film thickness of approximately 1.8 μm. The prebaked film thus produced was spray-developed with a 2.38% by mass aqueous solution of TMAH or cyclopentanone using a compact photolithography developing device (AD-1200; manufactured by Takizawa Sangyo Co., Ltd.), and the time required for the prebaked film (unexposed areas) to completely dissolve (Breaking Point; hereinafter, "BP") was measured.

[0209] A prebaked film was prepared in the same manner, and the prepared prebaked film was subjected to patterning exposure using a double-sided alignment single-sided exposure device (Mask Aligner PEM-6M; manufactured by Union Optical Co., Ltd.) through a grayscale mask for sensitivity measurement (MDRM MODEL 4000-5-FS; manufactured by Opto-Line International Co., Ltd.) with the i-line (wavelength 365 nm), h-line (wavelength 405 nm), and g-line (wavelength 436 nm) of an ultra-high pressure mercury lamp. After exposure, the film was developed with a 2.38% by mass TMAH aqueous solution using a compact photolithography developing device (AD-1200; manufactured by Takizawa Sangyo Co., Ltd.) and rinsed with water for 30 seconds to prepare a developed film. The development time was 60 seconds, 90 seconds, or 120 seconds.

[0210] In addition, when a pattern could not be formed after development using a 2.38% by mass TMAH aqueous solution for a development time of 60 seconds, 90 seconds, or 120 seconds, a film exposed in the same manner as above was prepared. After exposure, the film was developed with cyclopentanone using a compact photolithography developing device (AD-1200; manufactured by Takizawa Sangyo Co., Ltd.) and rinsed with water for 30 seconds to prepare a developed film. Similarly, the development time was set to 60 seconds, 90 seconds, or 120 seconds. The developed patterns were observed for all films developed for 60, 90, and 120 seconds, and the optimal exposure dose (value measured with an i-line illuminometer) capable of forming a space pattern with a 20 μm width corresponding to the openings in a 20 μm line-and-space pattern was determined from these results. The optimal development time (60 seconds, 90 seconds, or 120 seconds) and the optimal exposure dose for that development time were determined. After exposure at the optimum exposure dose and development for the optimum development time, the pattern was thermally cured at 200°C for 60 minutes using a high-temperature inert gas oven (INH-9CD-S; manufactured by Koyo Thermo Systems Co., Ltd.) to produce a cured film with a film thickness of approximately 1.2 μm. The thermal curing conditions were as follows: in a nitrogen atmosphere with an oxygen concentration of 20 ppm by mass or less, the temperature was raised to 200°C at a heating rate of 3.5°C / min, heat treatment was carried out at 200°C for 60 minutes, and then cooling to 50°C.

[0211] The cured film was analyzed by methods such as nuclear magnetic resonance spectroscopy, infrared spectroscopy, gas chromatography-mass spectrometry, liquid chromatography-mass spectrometry, and time-of-flight secondary ion mass spectrometry to analyze the structural units of the resins contained in the cured film and the structures of the compounds contained in the cured film. The cured film of Composition 1 contains the following resins and compounds, and contains a resin having a structure derived from the resin contained in Composition 1 and a compound having a structure derived from the compound contained in Composition 1. (XA1) Resin: A resin having silanol groups and a siloxane structure in its structural units; a phenolic resin having a phenolic hydroxyl group in its structural units.

[0212] <Fabrication of Organic EL Display> Next, the fabrication method of the organic EL display will be described. A schematic diagram of the substrate used is shown in FIG. 3 . First, a 100 nm thick non-transparent conductive metal layer of APC (silver / palladium / copper = 98.07 / 0.87 / 1.06 (mass ratio)) was sputtered onto a 38 × 46 mm alkali-free glass substrate 47, and then patterned by etching to form an APC layer. Furthermore, a 10 nm thick amorphous ITO film was sputtered onto the APC layer as a transparent conductive oxide film layer, and then etched to form a reflective electrode as a first electrode portion 48. An auxiliary electrode portion 49 was also formed at the same time to extract the second electrode ((1) in FIG. 3 ).

[0213] The resulting substrate was ultrasonically cleaned using "Semicoclean" (registered trademark) 56 (manufactured by Furuuchi Chemical Co., Ltd.) for 10 minutes and then washed with ultrapure water. Composition 1 was then applied to the substrate using the method described above, prebaked, patterned through a photomask having a predetermined pattern, developed, and rinsed, and then heated for thermal curing. The development time was set to 60, 90, or 120 seconds, and the optimal development time (60, 90, or 120 seconds) and the optimal exposure dose for that development time were determined in advance. After exposure at the optimal exposure dose and development for the optimal development time, the pattern was thermally cured at 200°C for 60 minutes. The thermal curing conditions were as follows: in a nitrogen atmosphere with an oxygen concentration of 20 mass ppm or less, the temperature was raised to 200°C at a heating rate of 3.5°C / min, heat treatment at 200°C for 60 minutes, and then cooling to 50°C. Using the above method, a pixel dividing layer 50 was formed in the effective substrate area (FIG. 3 (2)). The pixel dividing layer 50 had rectangular openings, each 70 μm wide and 70 μm long, arranged at a pitch of 175 μm in the width direction and a pitch of 175 μm in the length direction, and each opening exposed the first electrode. These openings will ultimately become the light-emitting pixels of the organic EL display. The effective substrate area was 16 mm square, and the pixel dividing layer 50 was formed to a thickness of approximately 1.5 μm.

[0214] Next, an organic EL display was fabricated using the substrate on which the first electrode portion 48, the auxiliary electrode portion 49, and the pixel dividing layer portion 50 were formed. After nitrogen plasma treatment as a pretreatment, an organic EL layer portion 51 including a light-emitting layer was formed by vacuum deposition ((3) in FIG. 3). The degree of vacuum during deposition was 1×10 －３ The pressure was below 1 Pa, and the substrate was rotated relative to the evaporation source during evaporation. First, compound (HT-1) was evaporated to a thickness of 10 nm as a hole injection layer, and compound (HT-2) was evaporated to a thickness of 50 nm as a hole transport layer. Next, compound (GH-1) was evaporated as a host material to the light-emitting layer, and compound (GD-1) was evaporated as a dopant material to a thickness of 40 nm so that the doping concentration was 10% by volume. Thereafter, compound (ET-1) and compound (LiQ) were laminated to a thickness of 40 nm at a volume ratio of 1:1 as electron transport materials. The compounds used in the organic EL layer (compound (HT-1), compound (HT-2), compound (GH-1), compound (GD-1), compound (ET-1), and compound (LiQ)) were the same compounds as those described in paragraphs

[0599] to

[0600] of WO 2017 / 057281.

[0215] Next, a compound (LiQ) was vapor-deposited to a thickness of 2 nm, followed by vapor deposition of 10 nm of MgAg (magnesium / silver = 10 / 1 (volume ratio)) to form the second electrode portion 52, a transparent electrode ((4) in Figure 3). Thereafter, in a low-humidity nitrogen atmosphere, a cap-shaped glass plate was adhered using an epoxy resin adhesive to seal the substrate, and four 5 mm square top-emission organic EL displays were fabricated on one substrate. The film thickness referred to here is the value displayed on a quartz crystal oscillator film thickness monitor.

[0216] <Fabrication of Micro LED Display> An alkali-free glass substrate was used as a support substrate. A temporary adhesive containing polyimide was placed on the support substrate, and LEDs, which were light-emitting elements, were then placed on the support substrate. The LEDs had a thickness of 2 μm, a side length of 10 μm, and a second side length of 20 μm. Next, Composition S1 was applied to the support substrate and the LEDs using the method described above, prebaked, and then patterned using a photomask with a predetermined pattern, followed by development and rinsing to form a matrix pattern with multiple openings exposing the LEDs and their surroundings. The openings were rectangular, with one side length of 15 μm and the other side length of 25 μm. In the matrix pattern, the pattern dimension between openings with a side length of 15 μm was 5 μm, and the pattern dimension between openings with a side length of 25 μm was also 5 μm. The resulting composition was then heated and thermally cured to form a partition layer with a thickness of approximately 4 μm. The thermal curing conditions were as follows: in a nitrogen atmosphere with an oxygen concentration of 20 mass ppm or less, the temperature was raised to 200°C at a rate of 3.5°C / min, heat treatment was carried out at 200°C for 60 minutes, and then cooling to 50°C.

[0217] Next, Composition 1 was applied to the support substrate and the LEDs and prebaked using the method described above. The composition was then patterned using a photomask with a predetermined pattern, developed, and rinsed to form a plurality of opening patterns extending through the thickness direction up to the LEDs. The opening patterns were circular, with the smallest pattern having a bottom diameter of 2 μm. The resulting material was then heated and thermally cured to form a planarizing layer with a thickness of approximately 4 μm. The thermal curing conditions were as follows: the temperature was increased to 200°C at a rate of 3.5°C / min in a nitrogen atmosphere with an oxygen concentration of 20 ppm by mass or less, and the material was then heated at 200°C for 60 minutes, followed by cooling to 50°C.

[0218] Next, a titanium barrier metal was formed on the planarization layer and the partition layer by sputtering, and a copper seed layer was further formed on the barrier metal by sputtering. Next, a photoresist layer was formed, and copper metal wiring electrically connected to the LED was formed on the opening pattern portion of the planarization layer and on a portion of the surface of the planarization layer by plating. Thereafter, the photoresist layer, seed layer, and barrier metal were removed from areas where metal wiring was not to be formed. The thickness of the metal wiring formed on the portion of the surface of the planarization layer was 5 μm.

[0219] Next, a positive-type photosensitive composition containing a polyimide and a polybenzoxazole precursor was applied to the planarizing layer and the partition wall layer using the above-described method, prebaked, patterned, exposed through a photomask having a predetermined pattern, developed, and rinsed, followed by heating and thermal curing to form an interlayer insulating layer with a thickness of approximately 10 μm. The thermal curing conditions were a 30-minute heat treatment at 110°C in a nitrogen atmosphere with an oxygen concentration of 100 mass ppm or less, followed by a further 60-minute heat treatment at 230°C. Next, a titanium barrier metal was formed on the interlayer insulating layer by sputtering, and a copper seed layer was further formed on the barrier metal by sputtering. Next, a photoresist layer was formed, and copper metal wiring electrically connected to the LED was formed on the opening pattern of the interlayer insulating layer and on a portion of the surface of the interlayer insulating layer by plating. The photoresist layer, seed layer, and barrier metal were then removed from areas where no metal wiring was to be formed. The metal wiring formed on the portion of the surface of the interlayer insulating layer had a thickness of 5 μm. Thereafter, the formation of the interlayer insulating layer and the formation of the metal wiring were repeated twice to form three interlayer insulating layers, the total thickness of which was 30 μm.

[0220] Next, a barrier metal was sputtered onto the metal wiring in the opening pattern of the interlayer insulating layer, forming solder bumps. The device was then heated at 260°C for 1 minute to reflow the solder, and the device was electrically connected to a light-emitting element drive substrate containing a driver IC (drive element) via the solder bumps. The support substrate was then peeled off, and a counter substrate was attached using an adhesive layer or the like to fabricate a micro LED display equipped with multiple light-emitting elements (LEDs).

[0221] Examples 2 to 122 and Comparative Examples 1 to 6 The same operations and evaluations as in Example 1 were carried out using the compositions shown in Tables 3-1 to 3-10. In Examples 1 to 116 and Comparative Examples 1 to 6, each composition was used as a pixel-dividing layer-forming composition or a planarizing layer-forming composition, and composition S1 was used as a partition layer-forming composition. Meanwhile, in Examples 117 to 122, composition 1 was used as a pixel-dividing layer-forming composition or a planarizing layer-forming composition, and compositions S2 to S7 were used as partition layer-forming compositions. The evaluation results are summarized in Tables 3-1 to 3-10. In Examples 84, 90 to 94, 102, and 103, the fluorine element content of the pixel-dividing layer-forming composition relative to the total solids content exceeded 1,000 ppm by mass. The content of elemental fluorine relative to the total solid content of the composition for forming a pixel division layer was 0 ppm by mass in Examples 1 to 83, 85 to 89, 95 to 101, 104 to 106, 114 to 116, and Comparative Examples 1 to 6. The content of elemental fluorine relative to the total solid content of the composition for forming a partition layer in Compositions S1 to S7 was 0 ppm by mass. The content of elemental fluorine relative to the total solid content of the composition for forming a pixel division layer in Examples 107 to 113 was as shown in Table 3-7.

[0222] Table 3-6 lists the hydrogen ion exponents of the compositions prepared in Example 1 and Examples 81 to 89. In each example, when a positive-tone photosensitive composition was used, the development time was 60 seconds, 90 seconds, or 120 seconds. From these results, the optimal development time (60 seconds, 90 seconds, or 120 seconds) and the optimal exposure dose for that development time were determined. After exposure at the optimal exposure dose and development at the optimal development time, the pattern was thermally cured at 200°C for 60 minutes. The thermal curing conditions were as follows: in a nitrogen atmosphere with an oxygen concentration of 20 ppm by mass or less, the temperature was raised to 200°C at a heating rate of 3.5°C / min, heat treatment was performed at 200°C for 60 minutes, and then cooling to 50°C. On the other hand, when a negative-tone photosensitive composition was used, a photomask in which the light-transmitting and light-shielding portions were inverted was used, and the development time was 1.3 times the measured BP. After exposure at the optimum exposure dose and development, the pattern was thermally cured for 60 minutes at 220° C. The thermal curing conditions were as follows: in a nitrogen atmosphere with an oxygen concentration of 20 mass ppm or less, the temperature was raised to 220° C. at a temperature increase rate of 3.5° C. / min, heat treatment was carried out at 220° C. for 60 minutes, and then cooling to 50° C.

[0223]

[0224]

[0225]

[0226]

[0227]

[0228]

[0229]

[0230]

[0231]

[0232]

[0233] Comparative Examples 1 and 2 do not contain methanol or ethanol. Comparative Example 3 has a methanol content that does not satisfy the specific requirements of the present invention. Comparative Example 4 contains only alcohol compounds other than methanol and ethanol. Therefore, Comparative Examples 1 to 4 are inferior in various properties. Comparative Example 5 does not contain methanol or ethanol, and the chlorine element content and chloride ion content exceed 1,000 ppm by mass. Comparative Example 6 does not contain methanol or ethanol, and the content of a specific anion exceeds 30,000 ppm by mass (=3.0% by mass), and the content of a quaternary cation exceeds 50,000 ppm by mass (=5.0% by mass). Therefore, Comparative Examples 5 and 6 are inferior in various properties.

[0234] DESCRIPTION OF SYMBOLS 1a, 1b Display device 2 Light-emitting element 3 Interlayer insulating layer 4, 4c Metal wiring 5 Counter substrate 6 Electrode terminal 7 Light-emitting element drive substrate 8 Drive element 9 Barrier metal 10 Solder bump 15 Partition layer 21 Planarization layer 47 Alkali-free glass substrate 48 First electrode portion 49 Auxiliary electrode portion 50 Pixel dividing layer portion 51 Organic EL layer portion including light-emitting layer 52 Second electrode portion

Claims

1. A photosensitive composition comprising (A) a binder resin and (C) a photosensitizer, the (C) photosensitizer contains (C1) a naphthoquinone diazide compound, Further, the solvent contains methanol and / or ethanol, and also contains one or more selected from the group consisting of 1-methoxy-2-propanol, 1-ethoxy-2-propanol, methyl acetate, ethyl acetate, allyl methyl ether, allyl ethyl ether, isoallyl methyl ether, and isoallyl ethyl ether; The photosensitive composition satisfies the following conditions (7) and (8): (7) The total content of methanol and ethanol in the photosensitive composition is 0.0010 to 30,000 ppm by mass. (8) The total content of 1-methoxy-2-propanol, 1-ethoxy-2-propanol, methyl acetate, ethyl acetate, allyl methyl ether, allyl ethyl ether, isoallyl methyl ether, and isoallyl ethyl ether in the photosensitive composition is 0.0010 to 30,000 ppm by mass.

2. Further, the composition contains one or more selected from the group consisting of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, 2-methoxy-1-propyl acetate, 2-ethoxy-1-propyl acetate, methallyl methyl ether, and methallyl ethyl ether; The photosensitive composition according to claim 1 , which satisfies the following condition (9): (9) The total content of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, 2-methoxy-1-propyl acetate, 2-ethoxy-1-propyl acetate, methallyl methyl ether, and methallyl ethyl ether in the photosensitive composition is 0.0010 to 1,000 ppm by mass.

3. The photosensitive composition according to claim 1 , further comprising water and satisfying the following condition (3): (3) The content of water in the photosensitive composition is 0.010 to 3.0% by mass.

4. The electrolyte solution contains one or more ions selected from the group consisting of sulfate ions, sulfite ions, nitrate ions, nitrite ions, phosphate ions, phosphite ions, hypophosphite ions, formate ions, acetate ions, and oxalate ions, and satisfies the following condition (4): and / or The photosensitive composition according to any one of claims 1 to 3, which contains one or more compounds selected from the group consisting of phosphoric acid esters, phosphonic acids, phosphonic acid esters, phosphorous acid esters, phosphinic acids, and hypophosphites, and which satisfies the following condition (5): (4) The total content of sulfate ions, sulfite ions, nitrate ions, nitrite ions, phosphate ions, phosphite ions, hypophosphite ions, formate ions, acetate ions, and oxalate ions in the total solid content of the photosensitive composition is 0.0010 to 30,000 ppm by mass. (5) The total content of phosphoric acid ester, phosphonic acid, phosphonic acid ester, phosphorous acid ester, phosphinic acid, and hypophosphite ester in the total solid content of the photosensitive composition is 0.0010 to 30,000 ppm by mass.

5. The photosensitive composition according to any one of claims 1 to 3, further comprising a tertiary amine compound and / or a quaternary ammonium ion, and satisfying the following condition (6): (6) The total content of a tertiary amine compound and a quaternary ammonium ion in the total solid content of the photosensitive composition is 0.0010 to 50,000 ppm by mass.

6. The photosensitive composition according to any one of claims 1 to 3, wherein the binder resin (A) satisfies the following condition (P1a): (P1a) The content of fluorine element in the structure of the (A) binder resin is 10,000 mass ppm or less.

7. The photosensitive composition according to any one of claims 1 to 3, which satisfies the following condition (1a): (1a) The content of elemental fluorine in the total solid content of the photosensitive composition is 1,000 ppm by mass or less.

8. the binder resin (A) contains a weakly acidic group-containing resin (A1), The photosensitive composition according to any one of claims 1 to 3, wherein the weakly acidic group-containing resin (A1) has, as the weakly acidic group (WA), one or more types of groups selected from the group consisting of a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, a 1,1-bis(trifluoromethyl)methylol group, and a mercapto group.

9. 9. The photosensitive composition according to claim 8, wherein the (A1) weakly acidic group-containing resin comprises (A1x-1) resin: polysiloxane.

10. 10. The photosensitive composition according to claim 9, wherein the photosensitive composition is diluted with water to prepare a diluted solution, and when the solids concentration of the diluted solution is 1 / 100 times that of the solids concentration of the photosensitive composition, the hydrogen ion exponent of the diluted solution is 5.5 to 7.

0.

11. The photosensitive composition according to claim 9, wherein the (A1x-1) resin has a trifunctional organosilane unit represented by general formula (9) and a tetrafunctional organosilane unit represented by general formula (10). 【Chemistry 1】 (In the general formula (9) and the general formula (10), R ６１ represents a hydrogen atom or a monovalent organic group. １ ~* ３ each independently represents a bonding point in the resin.)

12. 4. The photosensitive composition according to claim 1, wherein the photosensitizer (C) further contains a photoacid generator (C3) and / or a photobase generator (C4).

13. A cured product obtained by curing the photosensitive composition according to any one of claims 1 to 3.

14. A display device comprising the cured product according to claim 13.

15. A method for producing a cured product, comprising the steps of: (1) forming a coating film of the photosensitive composition according to any one of claims 1 to 3 on a substrate; (2) irradiating the coating film of the photosensitive composition with actinic rays through a photomask; (3) developing the coating film with a developer to form a pattern of the photosensitive composition; and (4) heating the pattern to obtain a cured pattern of the photosensitive composition.

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