Multi-wire electric discharge machine, machining control device, machining condition generating device, electric discharge machining system, electric discharge machining method, and thin plate manufacturing method

Abstract

The multi-wire electric discharge machine includes a cutting wire section in which a wire electrode is wound around a plurality of guide rollers and arranged in parallel facing the workpiece, a drive section that adjusts the distance between the workpiece and the cutting wire section, a machining power supply that applies a pulse voltage between the workpiece and the cutting wire section, a machining control device (9) that controls the drive section and the machining power supply, and a machining condition generation device (30) that generates applicable machining conditions, which are machining conditions to be applied in the next machining, based on measurement results of the thickness for each machining position within the machining surface of a thin plate cut out by machining the workpiece with the cutting wire section. The machining condition generation device (30) generates applicable machining conditions by correcting basic machining conditions, which are basic machining conditions, based on the difference between the measurement results and a target value, which is a reference value for the thickness for each machining position of the thin plate, and the measurement results, and the machining control device (9) controls at least one of the drive section and the machining power supply using the applicable machining conditions during the next machining.

Description

[Technical field]

[0001] The present disclosure relates to a multi-wire electric discharge machine that cuts a workpiece into a plurality of thin plates using a plurality of wires, a machining control device, a machining condition generating device, an electric discharge machining system, an electric discharge machining method, and a thin plate manufacturing method. [Background technology]

[0002] A multi-wire electric discharge machine is a device that cuts out multiple thin plates from a cylindrical workpiece by applying a pulse voltage between multiple wires and the workpiece.

[0003] The multi-wire electric discharge machine described in Patent Document 1 increases the machining speed while avoiding wire breakage by outputting a command to the machining power supply to apply a pulse voltage in accordance with machining conditions that avoid wire electrode breakage when a value indicating the machining state exceeds a threshold value. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 6991414 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the technology in Patent Document 1 mentioned above has a problem in that, due to variations in the components of the multi-wire EDM machine or in the assembly of parts caused by the assembly worker, the error in the thickness of the machined thin plate from the reference value varies within the machined surface for each multi-wire EDM machine, even when the same machining conditions are applied to workpieces made of the same material.

[0006] The present disclosure has been made in consideration of the above, and has an object to provide a multi-wire electric discharge machine that can suppress variation in the error of the thickness of a machined thin plate from a reference value within the machined surface for each multi-wire electric discharge machine. [Means for solving the problem]

[0007] In order to solve the above problems and achieve the object, the multi-wire electric discharge machine of the present disclosure comprises a cutting wire section in which a wire electrode is wound around a plurality of guide rollers and arranged in parallel facing the workpiece, and a drive section that adjusts the distance between the workpiece and the cutting wire section. The multi-wire electric discharge machine of the present disclosure also comprises a machining power supply that applies a pulse voltage between the workpiece and the cutting wire section, and a machining control device that controls the drive section and the machining power supply. The multi-wire electric discharge machine of the present disclosure also comprises a cutting wire section that cuts the workpiece as a result of the cutting wire section cutting the workpiece. In the past The system includes a machining condition generating device that generates applied machining conditions, which are machining conditions to be applied in the next machining, based on the measurement results of the sheet thickness, which is the thickness at each machining position within the machining surface of the cut sheet. The machining condition generating device generates the applied machining conditions by correcting the basic machining conditions, which are the basic machining conditions, based on the difference between the measurement results and a target value, which is a reference value of the thickness at each machining position of the sheet. The machining control device controls at least one of the drive unit and the machining power supply using the applied machining conditions during the next machining. Effect of the Invention

[0008] The multi-wire electric discharge machine according to the present disclosure has the advantage of being able to suppress variation in the error of the thickness of a machined thin plate from a reference value within the machined surface for each multi-wire electric discharge machine. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram showing a configuration of a multi-wire electric discharge machine according to a first embodiment. [Diagram 2] FIG. 1 is a diagram showing a configuration of a processing condition generating device according to a first embodiment. [Diagram 3] FIG. 1 is a diagram for explaining a thin plate thickness collected by a machining result collection unit of the machining condition generation device according to the first embodiment; [Figure 4] FIG. 1 is a diagram showing a configuration of a processing condition generator according to a first embodiment. [Diagram 5]1 is a flowchart showing a procedure of processing executed by a multi-wire electric discharge machine according to a first embodiment. [Figure 6] FIG. 1 is a diagram showing another example of the configuration of a machining control device provided in a multi-wire electric discharge machine according to a first embodiment; [Figure 7] FIG. 1 is a diagram showing an example of a hardware configuration for implementing a machining condition generating device according to a first embodiment. [Figure 8] FIG. 1 is a diagram showing a configuration of an electric discharge machining system according to a second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A multi-wire electric discharge machine, a machining control device, a machining condition generating device, an electric discharge machining system, an electric discharge machining method, and a thin plate manufacturing method according to embodiments of the present disclosure will be described in detail below with reference to the drawings.

[0011] Embodiment 1 FIG. 1 is a diagram showing the configuration of a multi-wire electric discharge machine according to a first embodiment. In the following description, the vertical direction is defined as the Z-axis direction, and two axes in a horizontal plane that are perpendicular to each other are defined as the X-axis and the Y-axis. In other words, the X-axis, Y-axis, and Z-axis are three axes that are perpendicular to each other. Of the directions of each axis, the direction of the arrow is defined as the positive direction, and the direction opposite to the arrow is defined as the negative direction. The positive Z direction is defined as the vertically upward direction, and the negative Z direction is defined as the vertically downward direction.

[0012] The multi-wire electric discharge machine 1 is a device that uses electric discharge to cut a columnar workpiece 2 into multiple pieces (multiple thin plates). The multi-wire electric discharge machine 1 performs electric discharge machining of the workpiece 2 by running a wire electrode 6 in multiple revolutions and applying a pulse voltage between the workpiece 2 and each of multiple cutting wire portions 6a, which are portions of the wire electrode 6 that run in parallel to one another. The multi-wire electric discharge machine 1 manufactures multiple thin plates by simultaneously cutting out multiple thin plates from the workpiece 2. The multi-wire electric discharge machine 1 performs electric discharge machining while preventing the wire electrode 6 from being cut due to instability in the machining process or mechanical deterioration over time by controlling the voltage application by the machining power source 7.

[0013] The multi-wire electric discharge machine 1 includes a wire bobbin 4 that supplies the wire electrode 6, and a wire bobbin drive unit 17 that rotates and drives the wire bobbin 4. The multi-wire electric discharge machine 1 also includes a wire discharge roller 5 that discharges the wire electrode 6 to the outside of the multi-wire electric discharge machine 1, guide rollers 3a-3d for properly running the wire electrode 6, and a guide roller drive unit 18 that drives the guide roller 3a.

[0014] The guide rollers 3a to 3d are cylindrical and guide the wire electrode 6 between the wire bobbin 4 and the wire discharge roller 5.

[0015] The wire electrode 6 is wound around the guide rollers 3a to 3d several times with intervals between them. That is, the four cylindrical guide rollers 3a to 3d have central axes parallel to each other and are arranged at a distance from each other in the axial direction. In Fig. 1, the central axis of each of the guide rollers 3a to 3d is parallel to the Y axis. That is, Fig. 1 shows a case where the guide rollers 3a to 3d are arranged to extend in the Y axis direction.

[0016] Moreover, the four guide rollers 3a to 3d are arranged so that the central axis of each of the guide rollers 3a to 3d is at the vertex of a rectangle in a plane perpendicular to the axial direction (in the XZ plane in FIG. 1). That is, the plane perpendicular to the central axis of each of the four guide rollers 3a to 3d is the XZ plane. Specifically, among the four guide rollers 3a to 3d, the guide rollers 3a and 3b are provided at the highest position in the Z-axis direction, the guide roller 3c is provided below the guide roller 3b, and the guide roller 3d is provided below the guide roller 3a alongside the guide roller 3c. That is, the line connecting the guide rollers 3a and 3b and the line connecting the guide rollers 3c and 3d are parallel to the X-axis direction, and the line connecting the guide rollers 3b and 3c and the line connecting the guide rollers 3d and 3a are parallel to the Z-axis direction.

[0017] Further, on the outer periphery (side surface) of each of the four guide rollers 3a to 3d, a plurality of guide grooves for guiding the running of the wire electrode 6 are formed at specific intervals in the axial direction. That is, in each of the guide rollers 3a to 3d, the plurality of guide grooves are formed at regular intervals in the direction of the central axis. The wire electrode 6 unwound from the wire bobbin 4 is wound along the guide grooves in each of the guide rollers 3a to 3d. That is, the wire electrode 6 is guided by the guide grooves of each of the guide rollers 3a to 3d which rotate rightward (clockwise) when viewed from the minus Y direction in the illustrated example.

[0018] The wire electrode 6 goes around the guide rollers 3a to 3d multiple times and is then discharged by the wire discharge rollers 5. That is, the wire electrode 6 is wound between the four guide rollers 3a to 3d multiple times at specific intervals between the guide grooves, and is then discharged to the outside of the multi-wire electric discharge machine 1 by the wire discharge rollers 5.

[0019] Here, the portions of the wire electrode 6 stretched in parallel between the guide roller 3c and the guide roller 3d become the cutting wire portions 6a. That is, the cutting wire portions 6a are a plurality of cutting wires arranged in parallel facing the workpiece 2 by winding one wire electrode 6 around the plurality of guide rollers 3a to 3d. That is, each of the plurality of cutting wire portions 6a is a portion of the wire electrode 6 stretched between the guide rollers 3c and 3d, which are guide rollers. A plurality of cutting wire portions 6a parallel to each other are provided between the guide rollers 3c and 3d. The plurality of cutting wire portions 6a are portions of the wire electrode 6 parallel to each other between the guide rollers 3c and 3d. In the first embodiment, the second direction, which is the traveling direction of the wire electrode 6 in the plurality of cutting wire portions 6a, is the X-axis direction. The cutting wire portions 6a of the wire electrode 6 cut the workpiece 2. The workpiece 2 is columnar and arranged so that its axial direction is the Y-axis direction.

[0020] The multi-wire electric discharge machine 1 also includes an electric power supply 12 that contacts the wire electrode 6 and supplies a machining voltage to the wire electrode 6, and a drive unit 14 that drives a machining stage (not shown) on which the workpiece 2 can be placed, in the positive Z direction. The multi-wire electric discharge machine 1 machines the workpiece 2 by moving the machining stage on which the workpiece 2 is placed, in the positive Z direction. That is, the drive unit 14, which is a drive section, moves the machining stage in the Z-axis direction, which is a first direction. The first direction is the direction in which the workpiece 2 moves relative to the multiple cutting wires 6a, and is the proceeding direction of electric discharge machining on the workpiece 2.

[0021] The multi-wire electric discharge machine 1 also includes a machining power supply 7 that applies a machining pulse voltage (hereinafter referred to as machining pulse voltage) between each cutting wire portion 6a included in the wire electrode 6 and the workpiece 2 via a power supply 12. The machining power supply 7 applies the machining pulse voltage between each of the multiple cutting wire portions 6a and the workpiece 2. The multi-wire electric discharge machine 1 also includes a cable 11 that connects the machining power supply 7 and the workpiece 2. The machining power supply 7 includes a plurality of machining power supply units 8, each of which corresponds one-to-one with the cutting wire portion 6a.

[0022] The multi-wire electric discharge machine 1 also includes a machining control device 9 that controls the electric discharge machining, a machining state detection device 15 that detects the machining state of each cutting wire portion 6a, and a machining condition generation device 30 that outputs machining conditions to the machining control device 9.

[0023] 1, guide roller drive unit 18 rotates guide roller 3a. Furthermore, wire bobbin drive unit 17 rotates wire bobbin 4 so that the tension of wire electrode 6 is constant. Multi-wire electric discharge machine 1 controls the rotation of wire bobbin 4 by wire bobbin drive unit 17 and the rotation of guide roller 3a by guide roller drive unit 18 so that the traveling speed of wire electrode 6 becomes a desired speed.

[0024] The machining state detection device 15 detects the machining state of each cutting wire 6a. The machining state detection device 15 is installed on the wiring connecting the power supply 12 and the machining power source 7. The machining state detection device 15 detects the machining state of each cutting wire 6a by monitoring the gap voltage, the current, the number of discharges per unit time, the number of short circuits per unit time, and the machining pulse voltage, which is the output voltage of the machining power source 7, via the power supply 12. The gap voltage is a voltage applied between the gap, i.e., between the workpiece 2 and each cutting wire 6a. The machining state detection device 15 includes a plurality of machining state detection units 16 each corresponding to a cutting wire 6a. The machining state detection device 15 detects the machining state of each cutting wire 6a by each machining state detection unit 16.

[0025] The machining control device 9 controls at least one of the drive unit 14 and the machining power supply 7 based on the machining result (thickness at each machining position) of the workpiece 2. The machining control device 9 also generates a position command, i.e., a feed control command value, based on the machining state detected by the machining state detection device 15. The machining control device 9 outputs the position command to the drive unit 14. The drive unit 14 moves the machining stage in the Z-axis direction in accordance with the position command. As a result, the drive unit 14 changes the relative position between the workpiece 2 and each cutting wire portion 6a. In this way, the multi-wire electric discharge machine 1 adjusts the distance between the workpiece 2 and each cutting wire portion 6a by the drive unit 14.

[0026] Furthermore, the machining control device 9 outputs a voltage application command to each machining power supply unit 8 based on the machining state detected by the machining state detection device 15. Each machining power supply unit 8 applies a machining pulse voltage between the cutting wire portion 6a and the workpiece 2. The voltage application command includes each command value such as the amplitude of the voltage, the frequency of the machining pulse voltage, and the on-pulse time of the machining pulse voltage.

[0027] The machining control device 9 controls the distance between the workpiece 2 and each cutting wire portion 6a by outputting a position command, and generates an electric discharge between each cutting wire portion 6a and the workpiece 2 by outputting a voltage application command. In this way, the multi-wire electric discharge machine 1 cuts out a plurality of thin plates from the workpiece 2.

[0028] The machining condition generating device 30 has a machining condition generator 32, which will be described later. The machining condition generator 32, which is a machining condition generating section, is connected to the machining control device 9. The machining condition generator 32 compares the thickness of the thin plate relative to the position within the surface of the thin plate (within the machining surface) with the machining results acquired by the machining result collecting section 31, which will be described later, and generates machining conditions (target voltage, average machining current, etc.) to be applied to each machining position. The machining condition generating device 30 commands the generated machining conditions to the machining control device 9.

[0029] The workpiece 2 is an ingot (such as a semiconductor ingot) to be sliced ​​into a plurality of thin plates. The material of the workpiece 2 is, for example, a metal such as tungsten or molybdenum that serves as a sputtering target, or a ceramic such as polycrystalline silicon carbide that is used as a component of various structures. The workpiece 2 may be single crystal silicon, which is a material for semiconductor wafers, or a semiconductor material such as single crystal silicon carbide, single crystal gallium nitride, single crystal gallium oxide, or single crystal diamond. The workpiece 2 may also be a solar cell material such as single crystal silicon or polycrystalline silicon, which is a material for solar cell wafers. An example of the multi-wire electric discharge machine 1 is a device that manufactures a plurality of semiconductor wafers by cutting out a plurality of semiconductor wafers from an ingot. The shape of the workpiece 2 is not limited to a prismatic shape, but may also be a cylindrical shape.

[0030] Of the materials given as examples of the workpiece 2, metals have a sufficiently low resistivity that they can be used for electrical discharge machining. On the other hand, semiconductor materials and solar cell materials that can be used for electrical discharge machining have a sufficiently low resistivity of approximately 100 Ωcm or less, and preferably have a resistivity of 10 Ωcm or less.

[0031] Therefore, metal is suitable for the workpiece 2. Among materials such as semiconductor materials or solar cell materials, materials having a resistivity in the range from the same as that of metal to 100 Ωcm are suitable for the workpiece 2. Among materials such as semiconductor materials or solar cell materials, materials having a resistivity in the range from the same as that of metal to 10 Ωcm are even more suitable for the workpiece 2.

[0032] The multi-wire electric discharge machine 1 supplies machining fluid to the gap between the workpiece 2 and each cutting wire 6a. As with so-called single-type wire electric discharge machines, the multi-wire electric discharge machine 1 supplies machining fluid to the gap by spraying the machining fluid or by immersing the workpiece 2 in the machining fluid. The configuration for supplying the machining fluid is not shown in the figure.

[0033] The machining power source 7 includes a plurality of machining power supply units 8, each of which corresponds one-to-one to the cutting wire portion 6a. The machining power supply 7 generates a machining pulse voltage to be applied between the cutting wires in accordance with a voltage application command from the machining control device 9. The machining power supply 7 generates the machining pulse voltage, for example, by a switching power supply method. The machining power supply 7 applies the machining pulse voltage to each of the cutting wire portions 6a individually by the plurality of machining power supply units 8. The machining power supply 7 includes a ground electrode 10 provided across the plurality of machining power supply units 8. The ground line of each machining power supply unit 8 is connected to the ground electrode 10. The ground electrode 10 is connected to a workpiece jig (not shown) by a cable 11. The workpiece 2 is connected to the ground electrode 10 via the workpiece jig and the cable 11. The machining power supply 7 can appropriately reverse the polarity of the machining pulse voltage it generates as necessary.

[0034] The electron supply unit 12 is composed of a plurality of electron supply units 13 that are insulated from each other. Each of the plurality of electron supply units 13 corresponds to a power supply wire 6b in a one-to-one relationship. In the example shown in FIG. 1, the parallel portions (parallel stretched portions) of the wire electrode 6 between the guide roller 3b and the guide roller 3c are the plurality of power supply wires 6b. The power supply wires 6b are in slidable contact with each of the electron supply units 13. Each of the electron supply units 13 supplies power supplied from the machining power supply unit 8 to the power supply wire 6b. The electron supply unit 12 supplies power to each of the plurality of power supply wires 6b individually through the plurality of electron supply units 13. As a result, a machining pulse voltage is applied individually to each cutting wire 6a by each of the machining power supply units 8.

[0035] 2 is a diagram showing a configuration of the machining condition generating device according to the first embodiment. The machining condition generating device 30 has a machining result collecting unit 31, a machining condition generator 32, and a subtractor 33. In the machining condition generating device 30, the machining result collecting unit 31 is connected to the subtractor 33, and the subtractor 33 is connected to the machining condition generator 32. In addition, the machining condition generator 32 is connected to the machining control device 9.

[0036] The machining result collection unit 31 collects the thickness (thin plate thickness) of the thin plate machined by the cutting wire unit 6a at each machining position and outputs it to the subtractor 33. The thickness of the thin plate at each machining position is the thickness at each machining position in the machining direction (Z-axis direction).

[0037] Fig. 3 is a diagram for explaining the sheet thickness collected by the machining result collection unit of the machining condition generating device according to the first embodiment. In Fig. 3, guide rollers 3c and 3d are illustrated to show the relationship between the position where the thickness of the sheet 2X is measured and the arrangement positions of the guide rollers 3c and 3d. Fig. 3 shows the sheet 2X and the guide rollers 3c and 3d when viewed from the Y-axis direction. Here, a case will be described where the workpiece 2 is cylindrical and the sheet 2X is disk-shaped.

[0038] The thickness of the thin plate 2X cut out from the workpiece 2 is measured at various positions in the processing direction. In the first embodiment, the thickness is measured at a plurality of positions on a processing path that passes through the center of the thin plate 2X in a direction parallel to the Z-axis direction of the thin plate 2X when the thin plate 2X is processed.

[0039] For example, if the positions where the thickness is measured are Z1 to Zn (n is a natural number of 2 or more) and the measurement results of the sheet thickness are At1 to Atn, the measurement results of the sheet thickness for each processing position where the thickness is measured are expressed as the measurement results (Z1, At1), (Z2, At2), . . . , (Zn, Atn). Positions Z1 to Zn are Z1, Z2, . . . , Zn in order of increasing coordinate in the Z-axis direction.

[0040] The processing result collection unit 31 collects the measurement results (Z1, At1), (Z2, At2), . . . , (Zn, Atn) measured by a thickness measuring device (not shown), and outputs them to the subtractor 33.

[0041] The subtractor 33 receives the measurement result (machining result) of the sheet thickness for each machining position from the machining result collection unit 31. The subtractor 33 also receives the target value (reference value) of the sheet thickness for each machining position that is stored in advance in a storage device (not shown) of the multi-wire electric discharge machine 1 or the like. If the target values ​​of the sheet thickness are A1 to An, the target values ​​of the sheet thickness for each machining position at which the thickness is measured are indicated by the target values ​​(Z1, A1), (Z2, A2), . . . , (Zn, An). The subtractor 33 calculates the difference by subtracting the measurement result of the sheet thickness for each machining position from the target value of the sheet thickness for each machining position, and sends the thickness difference to the machining condition generator 32. The target values ​​of the sheet thickness A1 to An may be the same value. That is, A1=A2=, . . . , =An may be satisfied.

[0042] The machining condition generator 32 corrects, based on the difference in thickness, basic machining conditions that are stored in advance in a storage device or the like of the multi-wire electric discharge machine 1. If the basic machining conditions are machining conditions C1 to Cn, the machining conditions for each machining position where the thickness is measured are expressed as machining conditions (Z1, C1), (Z2, C2), . . . , (Zn, Cn).

[0043] The machining condition generator 32 corrects the basic machining conditions with a correction value according to the thickness difference. That is, the machining condition generator 32 compares the target values ​​(Z1, A1), (Z2, A2), . . . , (Zn, An) of the sheet metal thickness for each machining position with the measurement results (Z1, At1), (Z2, At2), . . . , (Zn, Atn) of the sheet metal thickness for each machining position, and corrects the basic machining conditions for each machining position based on the thickness difference that is the comparison result.

[0044] For example, when m is a natural number from 2 to n, the machining section from position Z(m-1) to position Zm is machined under the machining conditions of position Z(m-1). Therefore, the machining condition generator 32 corrects the basic machining conditions for each machining section. The machining section from position Z(m-1) to position Zm may be machined under intermediate values ​​between the machining conditions of position Z(m-1) and the machining conditions of position Zm. In the following, a case will be described in which the machining condition generator 32 corrects the basic machining conditions for each machining section.

[0045] For example, for the thin plate 2X, a first machining section from position Z1 to Z2, a second machining section from position Z2 to Z3, and a (n-1)th machining section from position Z(n-1) to Zn are set. The machining condition generator 32 corrects the basic machining conditions for each of the set machining sections.

[0046] The processing condition generator 32 generates applied processing conditions by correcting the basic processing conditions so that the thickness difference in the next processing will be small. The applied processing conditions are processing conditions to be used in the subsequent processing control. The processing condition generator 32 sends the applied processing conditions, which are the corrected processing conditions, to the processing control device 9. As a result, the processing control device 9 uses the applied processing conditions in the next processing.

[0047] The basic machining conditions and the applicable machining conditions include, for example, at least one of a target voltage, an average machining current, an open count, and an open voltage. The target voltage is an average value of a machining pulse voltage per unit time applied between the cutting wire 6a and the workpiece 2. The average machining current is an average value of a current per unit time flowing between the cutting wire 6a and the workpiece 2. The open count is the number of times per unit time that no discharge occurs during electric discharge machining. The open voltage is an average value of a voltage per unit time when open (when no discharge occurs).

[0048] Thus, in the first embodiment, the machining condition generator 32 generates applicable machining conditions according to the machining position (machining section) and outputs them to the machining control device 9. That is, the machining condition generator 32 generates applicable machining conditions such as a voltage application command corresponding to a target voltage for each machining section and outputs them to the machining control device 9. The machining result collection unit 31 may acquire data on the measurement results measured by a thickness measuring device or the like via an existing information communication device or the like, or may acquire measurement results manually input by an operator. The measurement results collected by the machining result collection unit 31 may be acquired by any method as long as the information is capable of identifying the thickness of the thin plate 2X for each machining position.

[0049] The machining control device 9 controls at least one of the drive unit 14 and the machining power source 7 based on the applicable machining conditions. The machining control device 9 controls at least one of the drive unit 14 and the machining power source 7 so as to achieve the target voltage, average machining current, open count, or open voltage specified by the applicable machining conditions.

[0050] 4 is a diagram showing the configuration of a machining condition generator according to the first embodiment. The machining condition generating device 30 equipped with the machining condition generator 32 handles the measurement results (At1, At2, . . . , Atn) of the sheet metal thickness for each machining position as one group of data. The machining condition generating device 30 also handles the target values ​​(A1, A2, . . . , An) of the sheet metal thickness for each machining position as one group of data.

[0051] The subtractor 33 calculates the difference e, which is the difference between the target value of the sheet metal thickness for each processing position (A1, A2, ..., An) and the measurement result of the sheet metal thickness for each processing position (At1, At2, ..., Atn), and sends it to the processing condition generator 32.

[0052] The machining condition generator 32 receives the difference e, which is the thickness difference, from the subtractor 33. The machining condition generator 32 generates the current machining condition correction amount u[i] using the difference e[i] input this time (i (i is a natural number) time) and the difference e[i-1] input the previous time ((i-1) time).

[0053] Specifically, the machining condition generator 32 generates the current machining condition correction amount u[i] using the following equation (1) in which the current difference e[i] and the previous difference e[i-1] are multiplied by coefficients K1 and K2.

[0054]

number

[0055] In addition, z shown in Fig. 4 -1 corresponds to the (i-1)th difference e[i-1]. The machining condition generator 32 generates the current applied machining condition to be output to the machining control device 9 by adding the machining condition correction amount u[i] to the basic machining condition.

[0056] By repeating machining by the multi-wire electric discharge machine 1 applying the applicable machining conditions generated by the above-mentioned machining condition generator 32, the thickness of the machined thin plate 2X at each machining position approaches the reference thickness (target value) of the thin plate 2X. This allows the multi-wire electric discharge machine 1 to reduce the variation in thickness of the thin plate 2X from the reference value.

[0057] When multiple multi-wire electric discharge machines 1 cut out the thin plate 2X, each multi-wire electric discharge machine 1 cuts out the thin plate 2X using common basic machining conditions. This ensures that the thickness of the thin plate 2X cut out by each multi-wire electric discharge machine 1 is the same, making it easier to grind and polish the thin plate 2X.

[0058] The machining condition generator 32, for example, acquires the thickness of the processed thin plate 2X for each machining position from the machining result collection unit 31 for each machining, and generates new applicable machining conditions. The thickness for each machining position may be collected for multiple thin plates 2X cut out in one machining. In this case, the machining result collection unit 31 collects the average value of the thicknesses of the multiple thin plates 2X as the thickness for each machining position of the thin plate 2X.

[0059] The machining condition generator 32 may obtain the thickness of the processed thin plate 2X at each machining position after each of multiple machining operations from the machining result collection unit 31, and generate new applicable machining conditions using the average thickness at each machining position. The number of times (generation frequency) that the machining condition generator 32 generates applicable machining conditions for the number of machining operations is not limited.

[0060] 5 is a flowchart showing a processing procedure of processing executed by the multi-wire electric discharge machine according to embodiment 1. The machining result collection unit 31 of the multi-wire electric discharge machine 1 collects the measurement results of the sheet thickness, which is the machining result, for each machining position (step S10).

[0061] The subtractor 33 calculates the error of the sheet thickness from the reference value for each processing position (step S20). Specifically, the subtractor 33 calculates the difference obtained by subtracting the processing result of the sheet thickness from the target value (reference) of the sheet thickness for each processing position as the error of the sheet thickness from the reference value.

[0062] The machining condition generator 32 corrects the basic machining conditions for each machining section (step S30). Specifically, the machining condition generator 32 calculates a machining condition correction amount for each machining section using the error of the thin plate thickness from the reference value. In addition, the machining condition generator 32 calculates the applicable machining conditions for each machining section by correcting the basic machining conditions with the machining condition correction amount for each machining section. The machining condition generator 32 outputs the applicable machining conditions for each machining section to the machining control device 9.

[0063] In the multi-wire electric discharge machine 1, the machining control device 9 controls at least one of the drive unit 14 and the machining power supply 7, to machine the workpiece 2 under the applicable machining conditions for each machining section (step S40). The thickness of the thin plate 2X obtained by machining the workpiece 2 is measured for each machining position using a thickness measuring device or the like. This thickness is sent to the machining result collection unit 31 as the measurement result of the thin plate thickness. The multi-wire electric discharge machine 1 repeats the process of calculating the applicable machining conditions based on the measurement result of the thin plate thickness, and the process of machining the workpiece 2 using the applicable machining conditions.

[0064] Incidentally, in the slicing process of the workpiece 2, reducing the machining variation of the sliced ​​thin plate 2X is important for reducing the load in the subsequent grinding and polishing processes and for improving the yield. If the error in the thickness of the machined thin plate 2X from the reference value varies within the surface for each multi-wire EDM due to the influence of variations in the parts of the multi-wire EDM or the assembly workers, then in order to reduce the variation, a skilled worker would need to adjust the machining conditions for each multi-wire EDM, which would require a great deal of experience and significant time.

[0065] On the other hand, in the multi-wire electric discharge machine 1 of the first embodiment, the error from the reference value in the thickness of the machined thin plate 2X does not vary within the surface, so there is no need for the operator to adjust the machining conditions.

[0066] Furthermore, if the error in the thickness of the processed thin plate 2X from the reference value varies across the surface, the amount of grinding and polishing of the thin plate 2X must be adjusted to absorb the processing variation of the thin plate 2X, which increases the load in the grinding and polishing processes.

[0067] On the other hand, in the multi-wire electric discharge machine 1 of the first embodiment, the error from the reference thickness of the machined thin plate 2X does not vary within the surface, so the load in the grinding and polishing processes can be kept small.

[0068] The machining condition generating device 30 may be disposed in the machining control device 9. Fig. 6 is a diagram showing another example of the configuration of the machining control device provided in the multi-wire electric discharge machine according to the first embodiment.

[0069] The machining control device 9A includes a machining condition generating device 30 and a control unit 35. The control unit 35 has the same functions as those included in the machining control device 9. The multi-wire electric discharge machine 1 executes the same processing when the machining condition generating device 30 is disposed inside the machining control device 9 as when the machining condition generating device 30 is disposed outside the machining control device 9.

[0070] Here, the hardware configuration of the machining condition generating device 30 and the machining control devices 9 and 9A will be described. Since the machining condition generating device 30 and the machining control devices 9 and 9A have similar hardware configurations, the hardware configuration of the machining condition generating device 30 will be described here.

[0071] 7 is a diagram showing an example of a hardware configuration for realizing the machining condition generating device according to the first embodiment. The machining condition generating device 30 can be realized by an input device 300, a processor 100, a memory 200, and an output device 400. An example of the processor 100 is a CPU (Central Processing Unit, also called a central processing unit, processing unit, arithmetic unit, microprocessor, microcomputer, or DSP (Digital Signal Processor)) or a system LSI (Large Scale Integration). An example of the memory 200 is a RAM (Random Access Memory) or a ROM (Read Only Memory).

[0072] The machining condition generating device 30 is realized by the processor 100 reading and executing a processing program executable by a computer for executing the operation of the machining condition generating device 30 stored in the memory 200. The processing program, which is a program for executing the operation of the machining condition generating device 30, can also be said to cause a computer to execute the procedure or method of the machining condition generating device 30.

[0073] The processing program executed by the machining condition generation device 30 has a modular structure including the functions of a machining result collection unit 31, a machining condition generator 32, and a subtractor 33, and the functions of the machining result collection unit 31, the machining condition generator 32, and the subtractor 33 are loaded onto the main memory device, and the functions of the machining result collection unit 31, the machining condition generator 32, and the subtractor 33 are generated on the main memory device.

[0074] The input device 300 receives measurement results (Z1, At1), (Z2, At2),..., (Zn, Atn) from the thickness measuring device and sends them to the processor 100. The memory 200 stores processing programs and the like. The memory 200 is also used as a temporary memory when the processor 100 executes various processes. The output device 400 outputs applicable processing conditions to the processing control device 9.

[0075] The processing program may be provided as a computer program product by being stored in a computer-readable storage medium in the form of an installable or executable file. The processing program may also be provided to the machining condition generating device 30 via a network such as the Internet. Note that the functions of the machining condition generating device 30 may be partially realized by dedicated hardware such as a dedicated circuit, and partially realized by software or firmware.

[0076] Thus, in the first embodiment, the machining condition generating device 30 generates the applicable machining conditions by correcting the basic machining conditions based on the difference between the target value, which is the reference value of the thickness for each machining position of the thin plate 2X, and the thickness measurement result. Then, during the next machining, the machining control device 9 uses the applicable machining conditions to control at least one of the drive unit 14, which is a drive section, and the machining power supply 7. This allows the multi-wire electric discharge machine 1 to suppress in-plane variation in the error from the reference value of the thickness of the machined thin plate 2X.

[0077] Furthermore, the machining condition generating device 30 calculates applicable machining conditions for the multi-wire electric discharge machine 1 based on the measurement results (Z1, At1), (Z2, At2), . . . , (Zn, Atn) of the thin plate 2X machined by the multi-wire electric discharge machine 1. This makes it possible to suppress in-plane variation for each multi-wire electric discharge machine 1 in the error from the reference value of the thickness of the thin plate 2X machined by each multi-wire electric discharge machine 1, even when there are multiple multi-wire electric discharge machines 1.

[0078] Embodiment 2 Next, a second embodiment will be described with reference to Fig. 8. In the second embodiment, applicable machining conditions are generated for a plurality of multi-wire electric discharge machines.

[0079] 8 is a diagram showing the configuration of an electric discharge machining system according to the second embodiment. The electric discharge machining system 50 includes a plurality of multi-wire electric discharge machines 1X1 to 1X N (N is a natural number of 2 or more) and a higher-level controller 40.

[0080] Multi-wire EDM machine 1X1~1X N Each of the multi-wire electric discharge machines 1X1 to 1X2 has the same components as the multi-wire electric discharge machine 1 described in FIG. N Each of the cutting machines includes a cutting wire portion 6a, guide rollers 3a to 3d, a drive unit 14, a processing power source 7, a processing control device 9, and the like.

[0081] In the second embodiment, the multi-wire electric discharge machine 1X1 is the first multi-wire electric discharge machine, and the multi-wire electric discharge machines 1X2 to 1X N The workpiece 2 to be machined by the multi-wire electric discharge machine 1X1 is the first workpiece, and the multi-wire electric discharge machines 1X2 to 1X N The workpiece 2 to be processed is the second workpiece.

[0082] The cutting wire section 6a, guide rollers 3a-3d, drive unit 14, machining power supply 7, and machining control device 9 of the multi-wire electric discharge machine 1X1 are a first cutting wire section, a first guide roller, a first drive unit, a first machining power supply, and a first machining control device, respectively.

[0083] Multi-wire EDM machine 1X2~1X N The cutting wire portion 6a, the guide rollers 3a to 3d, the drive unit 14, the machining power supply 7, and the machining control device 9 are a second cutting wire portion, a second guide roller, a second drive unit, a second machining power supply, and a second machining control device, respectively.

[0084] For example, there are cases where tens of thousands of semiconductor wafers are produced per month. However, since the size of a semiconductor ingot is limited, only tens to hundreds of semiconductor wafers can be cut from one ingot. For this reason, in order to process the target number of wafers, multiple multi-wire electric discharge machines 1X1-1X1 are used in the semiconductor wafer slicing process. N The monthly production volume is secured by processing semiconductor ingots with multiple multi-wire EDM machines 1X1~1X N Even when the above-mentioned thickness measurement is used, it is desirable to reduce the variation in thickness from the reference value at each processing position of the thin plate 2X.

[0085] In the second embodiment, the host controller 40 controls each of the multi-wire electric discharge machines 1X1 to 1X N By calculating the applicable machining conditions, multiple multi-wire EDM machines 1X1~1XN Even when using the above-mentioned method, the thickness variation from the reference value at each processing position of the thin plate 2X is reduced.

[0086] The upper controller 40 controls the multi-wire electric discharge machine 1X1 to 1X N The upper controller 40 is connected to the machining condition generating devices 302 to 30 N and a processing condition distribution unit 43.

[0087] Each processing condition generation device 302~30 N have the same functions as the machining condition generating device 30. That is, the machining condition generating devices 302 to 30 N Each of these has a machining result collection unit 31, a machining condition generator 32, and a subtractor 33.

[0088] Processing condition generation device 302~30 N are multi-wire EDM machines 1X1 to 1X N The multi-wire electric discharge machine 1X1 machines the workpiece 2 using the basic machining conditions. Therefore, the upper controller 40 does not include the machining condition generating device 301.

[0089] Processing condition generation device 302~30 N collects the sheet thickness for each machining position of the sheet 2X machined by the multi-wire electric discharge machine 1X1, and sets this sheet thickness as a target value for the sheet thickness.

[0090] In addition, the processing condition generating devices 302 to 30 N are multi-wire EDM machines 1X2~1X respectively. N The thickness of the thin plate processed by the multi-wire EDM machine 1X2~1X is collected for each processing position of the thin plate 2X. N That is, the processing condition generating device 30 calculates the processing conditions to be applied for each processing. M (M is a natural number between 2 and N) is a multi-wire EDM machine 1X M The thickness of the thin plate processed by the multi-wire EDM 1X is collected for each processing position of the thin plate 2X. M The machining condition generating device 30 calculates the applicable machining conditions to be used by theM The thickness of the thin plate 2X processed by the multi-wire electric discharge machine 1X1 at each machining position is set as the target value of the thin plate thickness, and the thickness of the thin plate 2X processed by the multi-wire electric discharge machine 1X1 is set as the target value of the thin plate thickness. M The thickness of the processed thin plate 2X at each processing position is measured as a result, and the applicable processing conditions are calculated.

[0091] Multi-wire EDM machine 1X M The thin plate 2X machined by the multi-wire electric discharge machine 1X1 is the first thin plate, and the thin plate 2X machined by the multi-wire electric discharge machine 1X1 is the second thin plate. M The measurement results of the thickness of the thin plate 2X machined by the multi-wire EDM machine 1X1 at each machining position are the first measurement results, and the measurement results of the thickness of the thin plate 2X machined by the multi-wire EDM machine 1X1 at each machining position are the second measurement results.

[0092] The processing condition distribution unit 43 is a processing condition generation device 30 M The applied machining conditions calculated by the multi-wire EDM 1X M The upper controller 40 includes one processing result collection unit 31, and transmits the processing result to each of the processing condition generation devices 302 to 30. N The multi-wire electric discharge machines 1X1 to 1X3 may be configured not to include the machining result collection unit 31. In this case, one machining result collection unit 31 is N The thickness of the thin plate 2X processed by each processing position is collected, and each processing condition generating device 302 to 30 N That is, the machining result collection unit 31 transmits the machining result to the multi-wire electric discharge machine 1X M The thickness of the thin plate 2X processed by the multi-wire electric discharge machine 1X is collected for each processing position. M Processing condition generating device 30 corresponding to M In addition, when the machining result collection unit 31 collects the sheet thickness for each machining position of the sheet 2X machined by the multi-wire electric discharge machine 1X1, the machining result collection unit 31 transmits the sheet thickness as a target value of the sheet thickness to the machining condition generation device 30. M Send to.

[0093] In this way, in the second embodiment, the processing condition generating devices 302 to 30 NThe target value (reference value) of the sheet thickness used by the machining condition generating device 302-303 is the sheet thickness for each machining position of the sheet 2X machined by the multi-wire electric discharge machine 1X1. In other words, when the measurement results of the sheet thickness for each machining position of the sheet 2X machined by the machining condition generating device 301 are the measurement results (Z1, At1), (Z2, At2), . . . , (Zn, Atn), the machining condition generating devices 302-303 N The measurement results (Z1, At1), (Z2, At2), ···, (Zn, Atn) are set as the target values ​​(Z1, A1), (Z2, A2), ···, (Zn, An).

[0094] This allows the multi-wire EDM 1X2~1X N The thickness of the thin plate 2X machined by the multi-wire electric discharge machine 1X1 at each machining position approaches the thickness of the thin plate 2X machined by the multi-wire electric discharge machine 1X1 at each machining position. N By applying the machining result of one of the multi-wire electric discharge machines 1X1 as the thickness of the reference thin plate 2X, the thickness of the multiple multi-wire electric discharge machines 1X1 to 1X N The machining result of the multi-wire electric discharge machine 1X1 is close to the machining result of the standard multi-wire electric discharge machine 1X1. N This can reduce the thickness variation from the standard value of the processed thin plate 2X.

[0095] In addition, the multi-wire electric discharge machine 1X1 may calculate the applicable machining conditions based on the preset target values ​​(Z1, A1), (Z2, A2), . . . , (Zn, An) in the same manner as the multi-wire electric discharge machine 1. In this case, the multi-wire electric discharge machines 1X1 to 1X N The machining results approach the target values ​​(Z1, A1), (Z2, A2), ···, (Zn, An).

[0096] Multiple multi-wire EDM machines 1X1~1X N However, even when cutting out a thin plate 2X, the multi-wire EDM machine 1X1~1X NThis reduces the thickness variation from the standard value of the thin plate 2X machined by the multi-wire EDM machine 1X1~1X N There is no need to adjust the machining conditions for each process. N Since the error in the thickness of the processed thin plate 2X from the reference value does not vary within the surface, the load in the grinding process and the polishing process can be kept small.

[0097] The machining condition generating device 30 may be disposed outside the upper controller 40. For example, the multi-wire electric discharge machines 1X2 to 1X N The machining result collection unit 31 and the machining condition generator 32 may be arranged in each of the multi-wire electric discharge machines 1X2 to 1X3. N A processing condition generator 32 may be disposed in each of the above.

[0098] In this way, according to the second embodiment, the plurality of multi-wire electric discharge machines 1X1 to 1X N Since the machining result of one of the multi-wire EDM machines 1X1 is used as the thickness of the reference thin plate 2X, multiple multi-wire EDM machines 1X1 to 1X N Even when cutting out the thin plate 2X, it is possible to suppress the error of the thickness of the processed thin plate 2X from the reference value from varying within the surface.

[0099] The configurations shown in the above embodiments are merely examples, and may be combined with other known technologies, or the embodiments may be combined with each other. Also, parts of the configurations may be omitted or modified without departing from the spirit of the invention. [Explanation of symbols]

[0100] 1,1X1~1X NMulti-wire electric discharge machine, 2 workpiece, 2X thin plate, 3a-3d guide rollers, 4 wire bobbin, 5 wire discharge roller, 6 wire electrode, 6a cutting wire section, 6b power supply wire section, 7 machining power source, 8 machining power supply unit, 9, 9A machining control device, 10 ground electrode, 11 cable, 12 power supply, 13 power supply unit, 14 drive unit, 15 machining state detection device, 16 machining state detection unit, 17 wire bobbin drive section, 18 guide roller drive section, 30, 301-30 N Machining condition generating device, 31 machining result collecting unit, 32 machining condition generator, 33 subtractor, 35 control unit, 40 upper controller, 43 machining condition distribution unit, 50 electric discharge machining system, 100 processor, 200 memory, 300 input device, 400 output device.

Claims

1. a cutting wire section in which a wire electrode is wound around a plurality of guide rollers and arranged in parallel to face a workpiece; a drive unit for adjusting a distance between the workpiece and the cutting wire; A machining power source that applies a pulse voltage between the workpiece and the cutting wire portion; A machining control device that controls the drive unit and the machining power source; a machining condition generating device that generates applied machining conditions that are to be applied to a next machining based on a measurement result of a sheet thickness that is a thickness at each machining position within a machining surface of a sheet cut out by machining the workpiece with the cutting wire portion; Equipped with the processing condition generation device generates the applied processing conditions by correcting basic processing conditions, which are basic processing conditions, based on a difference between a target value, which is a reference value of a thickness for each processing position of the thin plate, and the measurement result; The machining control device controls at least one of the drive unit and the machining power source using the applicable machining conditions during a next machining operation. A multi-wire electric discharge machine.

2. The target value is a measurement result of the thickness at each machining position of a thin plate machined by another multi-wire electric discharge machine of the same model.

2. The multi-wire electric discharge machine according to claim 1.

3. The basic machining conditions include at least one of a target voltage, which is an average value of a pulse voltage per unit time applied between the cutting wire and the workpiece, an average machining current, which is an average value of a current per unit time flowing between the cutting wire and the workpiece, an open count, which is the number of times per unit time that no discharge occurs during electric discharge machining, and an open voltage, which is an average value of a voltage per unit time when open, the machining condition generation device generates the application machining conditions by correcting at least one of the target voltage, the average machining current, the number of openings, and the opening voltage, which are included in the basic machining conditions; 3. The multi-wire electric discharge machine according to claim 1 or 2.

4. a drive unit that adjusts a distance between a cutting wire portion, which is arranged in parallel with a workpiece and has a wire electrode wound around a plurality of guide rollers, and which faces the workpiece, and a control unit that controls a machining power source that applies a pulse voltage between the workpiece and the cutting wire portion; a machining condition generating device that generates applied machining conditions that are machining conditions to be applied to a next machining based on a measurement result of a sheet thickness that is a thickness at each machining position within a machining surface of a sheet cut out by machining the workpiece with the cutting wire portion; the processing condition generation device generates the applied processing conditions by correcting basic processing conditions, which are basic processing conditions, based on a difference between a target value, which is a reference value of a thickness for each processing position of the thin plate, and the measurement result; The control unit controls at least one of the drive unit and the machining power source using the applicable machining conditions during a next machining operation. A processing control device comprising:

5. a processing result collection unit that collects measurement results of a sheet thickness, which is the thickness at each processing position within a processing surface of a sheet cut out by processing the workpiece with a cutting wire in which a wire electrode is wound around a plurality of guide rollers and arranged in parallel to face the workpiece; a machining condition generator that generates, based on the measurement result, application machining conditions that are to be applied to the next machining; Equipped with The processing condition generator generates the applied processing conditions by correcting basic processing conditions, which are basic processing conditions, based on a difference between a target value, which is a reference value of a thickness for each processing position of the thin plate, and the measurement result. A machining condition generating device comprising:

6. a first multi-wire electric discharge machine for machining a first workpiece; a second multi-wire electric discharge machine of the same model as the first multi-wire electric discharge machine for machining a second workpiece; a machining condition generating device that generates applicable machining conditions, which are machining conditions to be applied to a next machining by the second multi-wire electric discharge machine, based on a first measurement result of a thickness for each machining position within a machining surface of a first thin plate cut out by machining the second workpiece by the second multi-wire electric discharge machine; having The first multi-wire electric discharge machine includes: a first cutting wire portion including a first wire electrode wound around a plurality of first guide rollers and arranged in parallel to face the first workpiece; a first drive unit that adjusts a distance between the first workpiece and the first cutting wire; a first machining power source that applies a pulse voltage between the first workpiece and the first cutting wire portion; A first machining control device that controls the first driving unit and the first machining power source; Equipped with The second multi-wire electric discharge machine includes: a second cutting wire portion including a second wire electrode wound around a plurality of second guide rollers and arranged in parallel to face the second workpiece; a second drive unit that adjusts a distance between the second workpiece and the second cutting wire; a second machining power source that applies a pulse voltage between the second workpiece and the second cutting wire portion; A second machining control device that controls the second driving unit and the second machining power source; Equipped with the processing condition generation device generates the applied processing conditions by correcting basic processing conditions, which are basic processing conditions, based on a difference between a target value, which is a reference value of a thickness for each processing position of the first thin plate, and the first measurement result; the second machining control device controls at least one of the second drive unit and the second machining power source using the applied machining conditions during a next machining operation; the target value is a second measurement result of a thickness at each processing position within a processing surface of a second thin plate cut out by processing the first workpiece with the first cutting wire portion; 1. An electric discharge machining system comprising:

7. a host controller connected to the first multi-wire electric discharge machine and the second multi-wire electric discharge machine, The upper controller includes the machining condition generating device, the machining condition generating device collects second measurement results from the first multi-wire electric discharge machine and transmits the applied machining conditions to the second multi-wire electric discharge machine; 7. The electric discharge machining system according to claim 6.

8. a cutting wire section having a wire electrode wound around a plurality of guide rollers and arranged in parallel to face a workpiece, a drive section for adjusting the distance between the workpiece and the cutting wire section, a machining power source for applying a pulse voltage between the workpiece and the cutting wire section, a machining control device for controlling the drive section and the machining power source, and a machining condition generating device for generating applicable machining conditions, which are machining conditions to be applied in a next machining operation, based on a measurement result of a thin plate thickness, which is the thickness for each machining position within a machining surface of a thin plate cut out by machining the workpiece with the cutting wire section, the multi-wire electric discharge machine performs a machining condition generating step of generating the applicable machining conditions by correcting basic machining conditions, which are basic machining conditions, based on a difference between a target value, which is a reference value for the thickness for each machining position of the thin plate, and the measurement result; a control step of controlling at least one of the drive unit and the machining power source by the multi-wire electric discharge machine using the applicable machining conditions during a next machining operation; 13. An electric discharge machining method comprising:

9. a cutting wire section having a wire electrode wound around a plurality of guide rollers and arranged in parallel to face a workpiece, a drive section for adjusting the distance between the workpiece and the cutting wire section, a machining power source for applying a pulse voltage between the workpiece and the cutting wire section, a machining control device for controlling the drive section and the machining power source, and a machining condition generating device for generating applicable machining conditions, which are machining conditions to be applied in a next machining operation, based on a measurement result of a thin plate thickness, which is the thickness for each machining position within a machining surface of a thin plate cut out by machining the workpiece with the cutting wire section, the multi-wire electric discharge machine performs a machining condition generating step of generating the applicable machining conditions by correcting basic machining conditions, which are basic machining conditions, based on a difference between a target value, which is a reference value for the thickness for each machining position of the thin plate, and the measurement result; a control step of controlling at least one of the drive unit and the machining power source by the multi-wire electric discharge machine using the applicable machining conditions during a next machining operation; A method for manufacturing a thin plate comprising the steps of:

Images